Sensor module and electronic apparatus

Abstract

To provide a sensor module which can improve the effectiveness and the reliability of increasing the accuracy of detection data.SOLUTION: A sensor module 100 according to the embodiment includes: a substrate 21; a substrate 22; a connection unit 40 for electrically connecting the substrate 21 and the substrate 22 to each other; a sensor device 11a provided in the substrate 21, the sensor device detecting an angular rate around a Z-axis; a sensor device 11b provided in the substrate 21, the sensor device detecting the angular rate around the Z-axis and having a driving frequency different from that of the sensor device 11a; a sensor device 12a provided in the substrate 22, the sensor device detecting an angular rate around an X-axis; and a sensor device 12b provided in the substrate 22, the sensor device detecting the angular rate around the X-axis and having a driving frequency different from that of the sensor device 12a.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a sensor module and an electronic device.

Background Art

[0002] A sensor module that attempts to improve the accuracy of X-axis angular velocity data by mounting two X-axis angular velocity sensor devices on the side surface of the same substrate is described in Patent Document 1.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a sensor module including a plurality of sensor devices with respect to one detection axis, further improvement is desired for the effectiveness and reliability of accuracy improvement.

Means for Solving the Problems

[0005] A sensor module according to an aspect of the present application includes a first substrate, a second substrate, a connection portion that electrically connects the first substrate and the second substrate, a first sensor device provided on the first substrate that detects a physical quantity of a first axis, a second sensor device provided on the first substrate that detects the physical quantity of the first axis and has a drive frequency different from that of the first sensor device, a third sensor device provided on the second substrate that detects a physical quantity of a second axis, and a fourth sensor device provided on the second substrate that detects the physical quantity of the second axis and has a drive frequency different from that of the third sensor device.

[0006] The sensor module according to one aspect of the present application includes a first substrate, a second substrate, a third substrate, a first connection portion that electrically connects the first substrate and the second substrate, a second connection portion that electrically connects the first substrate and the third substrate, a first sensor device provided on the first substrate for detecting a physical quantity of a first axis, a second sensor device provided on the first substrate for detecting the physical quantity of the first axis and having a driving frequency different from that of the first sensor device, a third sensor device provided on the second substrate for detecting a physical quantity of a second axis, a fourth sensor device provided on the second substrate for detecting the physical quantity of the second axis and having a driving frequency different from that of the third sensor device, a fifth sensor device provided on the third substrate for detecting a physical quantity of a third axis, and a sixth sensor device provided on the third substrate for detecting the physical quantity of the third axis and having a driving frequency different from that of the fifth sensor device.

[0007] The electronic device according to one aspect of the present application includes the sensor module described above.

Brief Description of Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7A

Figure 7B

Figure 8

Figure 9

Figure 10

Mode for Carrying Out the Invention

[0009] In each drawing, for the purpose of making each component easy to view, the scale of the dimensions may be shown differently depending on the component. In each drawing, the X-axis, Y-axis, and Z-axis are orthogonal to each other. In the following description, the “X-axis direction” shall indicate the direction parallel to the X-axis, the “Y-axis direction” shall indicate the direction parallel to the Y-axis, and the “Z-axis direction” shall indicate the direction parallel to the Z-axis. In the following description, the “plus side” shall indicate the tip side in the arrow direction of each axis of XYZ, and the “minus side” shall indicate the end side in the arrow direction. In the following description, “plan view” shall mean viewing from the Z-axis direction with respect to the plane including the X-axis and Y-axis.

[0010] In the following description, the description of the upper surface of a certain configuration shall indicate the surface on the plus side in the Z-axis direction of the said configuration. For example, the “upper surface of the substrate” shall indicate the surface on the plus side in the Z-axis direction of the substrate. In the following description, the description of the lower surface of a certain configuration shall indicate the surface on the minus side in the Z-axis direction of the said configuration. In the following description, the description of the left side surface of a certain configuration shall indicate the surface on the minus side in the X-axis direction of the said configuration. In the following description, the description of the right side surface of a certain configuration shall indicate the surface on the plus side in the X-axis direction of the said configuration.

[0011] 1. Embodiment 1 FIGS. 1 to 8 show the sensor module 100 according to Embodiment 1. FIG. 1 is a perspective view showing a state where the sensor module 100 is fixed to a mounted surface 71 such as an automobile. FIG. 2 is a perspective view showing a state where the sensor module 100 in FIG. 1 is viewed from the side of the mounted surface 71. FIG. 3 is an exploded perspective view of the sensor module 100. FIG. 4 is a developed view of the substrate unit 20. FIG. 5 is a developed view of the substrate unit 20. FIG. 6 is a perspective view of the fixing frame 60. FIG. 7A is a cross-sectional view taken along line A-A in FIG. 4, showing an example of the sensor device 11e. FIG. 7B is a cross-sectional view taken along line A-A in FIG. 4, showing another example of the sensor device 11e. FIG. 8 is an explanatory view showing the internal configuration of the sensor device.

[0012] In this embodiment, the sensor module 100 is an inertial measurement unit (IMU) that detects the posture and behavior of a mounted device such as an automobile or a robot. Here, the mounted device can be referred to as a moving body. The behavior can be referred to as inertial momentum. Although mainly described by taking the case where the physical quantity detected by the sensor module 100 is angular velocity or acceleration as an example, the physical quantity is not limited to angular velocity or acceleration, and may be other physical quantities such as velocity, pressure, displacement, posture, angle, or gravity.

[0013] As shown in FIG. 1, the sensor module 100 has an outer case 50 with a substantially square planar shape and a rectangular parallelepiped three-dimensional shape. The size of the sensor module 100 is, for example, about 24 mm in the length of one side of the square and about 10 mm in thickness.

[0014] Inside the outer case 50, a substrate unit 20 on which a plurality of sensor devices are mounted is housed. The substrate unit 20 will be described later. Thread holes 52 are formed in the lower surface 58 of the outer case 50. By passing screws 70 through these two thread holes 52, the sensor module 100 is fixed to the mounted surface 71 of a mounted device such as an automobile and used.

[0015] As shown in FIG. 2, an inner case 30 is housed inside an upper surface 57 of an outer case 50. An opening 31 is formed in an upper surface 34 of the inner case 30. A plug-type connector 15 is disposed inside the opening 31.

[0016] The connector 15 has a plurality of pins. A socket-type connector (not shown) is connected to the connector 15 from a device to be attached. The sensor module 100 is supplied with power from a power circuit of the device to be attached via the connector 15, and transmits an electrical signal such as detection data to the device to be attached.

[0017] 1.1. Configuration of Sensor Module FIG. 3 is an exploded perspective view of the sensor module 100 shown in FIG. 2. As shown in FIG. 3, the sensor module 100 includes an outer case 50 and a sensor unit 10 housed in the outer case 50. The sensor unit 10 includes an inner case 30 and a substrate unit 20 housed in the inner case 30.

[0018] The outer case 50 is a pedestal formed by cutting aluminum into a box shape. The material is not limited to aluminum, and other metals such as zinc and stainless steel, resin, or a composite material of metal and resin may be used.

[0019] The outer case 50 is a box shape without a lid, and its inner side 53 is an internal space surrounded by a bottom surface 55 and side walls 54. The sensor unit 10 is housed in the internal space of the outer case 50 via a joining member. In the present embodiment, the outer case 50 and / or the inner case 30 is an example of a case.

[0020] The sensor unit 10 is composed of an inner case 30 and a substrate unit 20. The inner case 30 is a member that holds the substrate unit 20 and has a shape that fits inside the inner side 53 of the outer case 50. The inner case 30 is, in a planar view, an octagon with the corners of the four vertices of a square chamfered, and an opening 31, which is a through-hole, and a recess 33 are formed on its upper surface.

[0021] The height of the side wall 32 of the inner case 30 is lower than the height of the side wall 54 of the outer case 50, and as shown in FIG. 2, the upper surface 34 of the inner case 30 is lower than the upper surface 57 of the outer case 50. Although not shown, guide pins and support surfaces for positioning the substrate unit 20 are formed inside the inner case 30. The substrate unit 20 is positioned by the guide pins and support surfaces and is fixed inside the inner case 30 by a joining member.

[0022] 1.2. Configuration of the Substrate Unit FIG. 4 is a plan view of the substrate unit 20 in a deployed state as viewed from the minus side in the Z-axis direction. FIG. 5 is a plan view of the substrate unit 20 in a deployed state as viewed from the plus side in the Z-axis direction. As shown in FIGS. 3 and 6, the substrate unit 20 is used in an assembled state. In the present embodiment, the substrate unit 20 is supported by a fixing frame 60 and assembled into a substantially rectangular parallelepiped shape.

[0023] As shown in FIGS. 4 and 5, in the present embodiment, the substrate unit 20 includes substrates 21, 22, 23, 24, 25, 26, flexible substrates 41, 42, 43, 44, 45, sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, 13f, an arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18.

[0024] The substrates 21, 22, 23, 24, 25, and 26 are rigid substrates called rigid boards, specifically, glass epoxy boards. The substrates 21, 22, 23, 24, 25, and 26 may be rigid boards such as composite boards or ceramic boards. The substrates 21, 22, 23, 24, 25, and 26 may have either a multilayer or a single-layer structure.

[0025] The flexible substrates 41, 42, 43, 44, and 45 are softer substrates than the substrates 21, 22, 23, 24, 25, and 26. The flexible substrates 41, 42, 43, 44, and 45 may be flexible wiring cables, wiring cords, or wires such as flat cables or flat cords. The flexible substrates 41, 42, 43, 44, and 45 may include connectors, solder, conductive adhesives, or crimp terminals, etc.

[0026] In this embodiment, the flexible substrate 41 is an example of a connection portion 40 and a first connection portion, the flexible substrate 42 is an example of a second connection portion, the flexible substrate 43 is an example of a third connection portion, and the flexible substrate 44 is an example of a fourth connection portion.

[0027] The flexible substrate 41 electrically connects the substrate 21 and the substrate 22. The flexible substrate 42 electrically connects the substrate 21 and the substrate 23. The flexible substrate 43 electrically connects the substrate 21 and the substrate 24. The flexible substrate 44 electrically connects the substrate 21 and the substrate 25. The flexible substrate 45 electrically connects the substrate 25 and the substrate 26. The substrate 26 is electrically connected to the substrate 21 via the flexible substrate 45, the substrate 25, and the flexible substrate 44.

[0028] The substrates 21, 22, 23, 24, 25, 26 and the flexible substrates 41, 42, 43, 44, 45 may be a rigid-flexible substrate having a plurality of rigid portions and a plurality of flexible portions. When a rigid-flexible substrate is adopted, each of the plurality of rigid portions corresponds to the substrates 21, 22, 23, 24, 25, 26 of the present embodiment, and each of the plurality of flexible portions corresponds to the flexible substrates 41, 42, 43, 44, 45 of the present embodiment.

[0029] The sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, 13f are angular velocity sensors respectively. Specifically, it is a vibrating gyro sensor that uses a crystal as a vibrator and detects the angular velocity from the Coriolis force applied to the vibrator. The vibrator is not limited to a crystal. For example, the vibrator may be a MEMS (Micro Electro Mechanical Systems) vibrator formed using a silicon substrate.

[0030] As shown in FIG. 4, the sensor devices 11a, 11b, 11c are mounted on the lower surface of the substrate 21. The sensor devices 11a, 11b, 11c are Z-axis angular velocity sensors that detect the angular velocity around the Z-axis respectively. The driving frequencies of the respective vibrators of the sensor devices 11a, 11b, 11c are different from each other. In the present embodiment, the driving frequency of the vibrator is an example of the driving frequency of the sensor device. The driving frequency of the vibrator will be described in detail in Section 1.4.3 described later.

[0031] The sensor devices 12a, 12b, 12c are mounted on the substrate 22. The sensor devices 12a, 12b, 12c are X-axis angular velocity sensors that detect the angular velocity around the X-axis respectively. The driving frequencies of the respective vibrators of the sensor devices 12a, 12b, 12c are different from each other.

[0032] Sensors 13a, 13b, and 13c are mounted on substrate 23. Sensors 13a, 13b, and 13c are Y-axis angular velocity sensors that detect the angular velocity around the Y-axis, respectively. The driving frequencies of the respective oscillators of sensors 13a, 13b, and 13c are different from each other.

[0033] Sensors 12d, 12e, and 12f are mounted on substrate 24. Sensors 12d, 12e, and 12f are X-axis angular velocity sensors that detect the angular velocity around the X-axis, respectively. The driving frequencies of the respective oscillators of sensors 12d, 12e, and 12f are different from each other.

[0034] Sensors 13d, 13e, and 13f are mounted on substrate 25. Sensors 13d, 13e, and 13f are Y-axis angular velocity sensors that detect the angular velocity around the Y-axis, respectively. The driving frequencies of the respective oscillators of sensors 13d, 13e, and 13f are different from each other.

[0035] Sensors 11d, 11e, and 11f are mounted on substrate 26. Sensors 11d, 11e, and 11f are Z-axis angular velocity sensors that detect the angular velocity around the Z-axis, respectively. The driving frequencies of the respective oscillators of sensors 11d, 11e, and 11f are different from each other.

[0036] In this embodiment, the sensor module 100 includes six X-axis angular velocity sensors, six Y-axis angular velocity sensors, and six Z-axis angular velocity sensors, respectively. Thus, according to the configuration in which six angular velocity sensors are provided for each of the X, Y, and Z axes, based on the angular velocity data from the six angular velocity sensors on each of the X, Y, and Z axes, the arithmetic circuit 14 calculates the average value, which is a statistic of the angular velocity data, etc., thereby realizing high-precision angular velocity data for each axis.

[0037] The number of angular velocity sensors for each axis is not limited to six. The number of angular velocity sensors for each axis may be two or more, but six angular velocity sensors for each axis can improve the accuracy of the angular velocity data for each axis more than two. The number of angular velocity sensors for each axis may be different. For example, the number of Z-axis angular velocity sensors may be 6, the number of X-axis angular velocity sensors may be 3, and the number of Y-axis angular velocity sensors may be 3.

[0038] In this embodiment, six X-axis angular velocity sensors, six Y-axis angular velocity sensors, and six Z-axis angular velocity sensors are each divided into three and mounted on two substrates respectively. Therefore, according to this embodiment, the limited space within the inner case 30 can be utilized efficiently to mount the angular velocity sensors for each axis, and miniaturization of the sensor module 100 can be easily achieved.

[0039] When there are three angular velocity sensors for each axis, they may be divided into one and two and mounted on two substrates respectively. Similarly, when there are four angular velocity sensors for each axis, they may be divided into two and mounted on two substrates respectively. Similarly, when there are five angular velocity sensors for each axis, they may be divided into two and three and mounted on two substrates respectively, or divided into one and four and mounted on two substrates respectively. Similarly, when there are seven or more angular velocity sensors for each axis, they may be divided and mounted as well. It is not limited to two substrates, and the angular velocity sensors for each axis may be divided and mounted on three or more substrates.

[0040] In this embodiment, the three Z-axis angular velocity sensors mounted on one substrate each have different driving frequencies. Therefore, it is suppressed that the three Z-axis angular velocity sensors mounted on one substrate interfere with each other mechanically and / or electrically. Thus, the effectiveness of improving the accuracy of the angular velocity data around the Z-axis can be enhanced. Similarly, when there are two or four or more Z-axis angular velocity sensors mounted on one substrate, the plurality of Z-axis angular velocity sensors mounted on one substrate only need to have different driving frequencies. The same applies to the case of three X-axis angular velocity sensors mounted on one substrate and three Y-axis angular velocity sensors mounted on one substrate.

[0041] In this embodiment, the drive frequencies of the sensor devices 11a on the substrate 21 and the sensor devices 11d on the substrate 26 are the same, for example, 49.6 kHz. The drive frequencies of the sensor devices 11b on the substrate 21 and the sensor devices 11e on the substrate 26 are the same, for example, 51.1 kHz. The drive frequencies of the sensor devices 11c on the substrate 21 and the sensor devices 11f on the substrate 26 are the same, for example, 53.6 kHz.

[0042] Therefore, it is not necessary to prepare six Z-axis angular velocity sensors having different drive frequencies for the sensor module 100 of this embodiment. Therefore, the sensor module 100 of this embodiment can reduce the costs required to prepare six Z-axis angular velocity sensors having different drive frequencies, for example, costs in manufacturing, ordering, inventory, or assembly, etc., and can improve the industrial utility value.

[0043] As shown in FIG. 5, an arithmetic circuit 14, a connector 15, a memory 16, a power supply circuit 17, and a temperature sensor 18 are mounted on the upper surface of the substrate 21. Other electronic components may be mounted on the upper surface of the substrate 21.

[0044] The arithmetic circuit 14 is a primary controller for the sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, 13f. The arithmetic circuit 14 is an integrated circuit device and can be realized by a processor such as an MPU (Micro Processor Unit) or a CPU (central processing unit).

[0045] The arithmetic circuit 14 includes a digital interface. The digital interface is a circuit that performs digital interface processing based on a communication standard such as SPI or I2C.

[0046] The arithmetic circuit 14 receives the detection data output from the sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, 13f, performs various processes, and transmits the processed detection data to the outside via the connector 15. In the present embodiment, the arithmetic circuit 14 is an example of a processing unit.

[0047] The various processes performed by the arithmetic circuit 14 include a process of obtaining the average value of the detection data of the angular velocity around each Z axis from the sensor devices 11a, 11b, 11c, 11d, 11e, 11f, a process of obtaining the average value of the detection data of the angular velocity around each X axis from the sensor devices 12a, 12b, 12c, 12d, 12e, 12f, a process of obtaining the average value of the detection data of the angular velocity around each Y axis from the sensor devices 13a, 13b, 13c, 13d, 13e, 13f, a process of performing temperature correction, zero point correction, etc. on the obtained average values, a sensitivity adjustment process, a filter process, and a process of outputting the processed data from the connector 15.

[0048] The connector 15 is a plug-type connector and includes two rows of connection terminals arranged at equal pitches in the Y-axis direction. In the present embodiment, the connector 15 has 20 connection terminals with 10 pins in one row, but the number of terminals may be appropriately changed according to the design specifications.

[0049] The memory 16 stores programs for executing various processes performed by the arithmetic circuit 14, programs for incorporating the processed detection data into packet data, and data necessary for the execution of the programs, such as table data used for temperature correction processing.

[0050] The power supply circuit 17 is supplied with power from the worn device and supplies the necessary power to each sensor device, the arithmetic circuit 14, etc. The temperature sensor 18 outputs temperature information used for temperature correction processing to the arithmetic circuit 14.

[0051] 1.3. Regarding the fixed frame FIG. 6 is a perspective view of the fixed frame 60, showing the fixed frame 60 with the substrate unit 20 attached. In FIG. 6, the substrate 21 is omitted for the sake of explanation. The fixed frame 60 has an octagonal cylindrical shape in plan view, and openings 68 are provided in portions where the substrates 21, 22, 23, 24, 25, 26 are attached, respectively. The openings 68 function as escape routes for the sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, 13f.

[0052] The substrates 21, 22, 23, 24, 25, 26 are attached to the fixed frame 60 such that each sensor device to be mounted is on the inside. Therefore, since each sensor device to be mounted does not protrude outside, the size of the substrate unit 20 can be reduced, and miniaturization of the sensor module 100 can be realized.

[0053] The fixed frame 60 is formed of, for example, resin. The elastic modulus of the fixed frame 60 is preferably smaller than that of the substrates 21, 22, 23, 24, 25, 26 and larger than that of the flexible substrates 41, 42, 43, 44, 45. By making the elastic modulus of the fixed frame 60 smaller than that of the substrates 21, 22, 23, 24, 25, 26, mechanical or electrical interference caused by operating the sensor devices 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, 13f simultaneously can be suppressed.

[0054] By making the elastic modulus of the fixed frame 60 larger than that of the flexible substrates 41, 42, 43, 44, 45, the substrates 21, 22, 23, 24, 25, 26 can be fixed at desired positions corresponding to the detection axes of the respective sensor devices to be mounted, and displacement from the desired positions can be suppressed.

[0055] On the upper surface 61 of the fixed frame 60, a substrate 21 (not shown in the figure) is fixed, and on the lower surface 66, a substrate 26 is fixed. In other words, the substrate 21 on which the sensor devices 11a, 11b, and 11c for detecting the angular velocity around the Z axis are mounted and the substrate 26 on which the sensor devices 11d, 11e, and 11f are mounted are arranged to face each other.

[0056] On the side surface 62 of the fixed frame 60, a substrate 22 is fixed, and on the side surface 64, a substrate 24 is fixed. In other words, the substrate 22 on which the sensor devices 12a, 12b, and 12c for detecting the angular velocity around the X axis are mounted and the substrate 24 on which the sensor devices 12d, 12e, and 12f are mounted are arranged to face each other.

[0057] On the side surface 63 of the fixed frame 60, a substrate 23 is fixed, and on the side surface 65, a substrate 25 is fixed. In other words, the substrate 23 on which the sensor devices 13a, 13b, and 13c for detecting the angular velocity around the Y axis are mounted and the substrate 25 on which the sensor devices 13d, 13e, and 13f are mounted are arranged to face each other.

[0058] In this embodiment, the substrate unit 20 is fixed to the fixed frame 60 during assembly, but the substrate unit 20 is not limited to the form using the fixed frame 60. For example, the substrate unit 20 may be directly fixed to the inner case 30 without using the fixed frame 60.

[0059] 1.4. About the sensor device 1.4.1. Packaging FIGS. 7A and 7B are cross-sectional views for explaining the packaging of the sensor device 11e. In this embodiment, the sensor device 11e in FIG. 7A is a physical quantity sensor for detecting the angular velocity having the Z axis as the detection axis. The sensor device 11e in FIG. 7B is a composite physical quantity sensor for detecting the angular velocity having the Z axis as the detection axis and the acceleration having the Z axis as the detection axis.

[0060] As shown in FIGS. 7A and 7B, the sensor device 11e includes a package 7, a sensor element 3 and a circuit element 4 housed in the package 7, or sensor elements 3a, 3b and a circuit element 4. Although not shown, the sensor devices 11a, 11b, 11c, 11d, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, 13f also have the same configuration as the sensor device 11e.

[0061] The package 7 has a base 5 provided with a recess opening upward on the upper surface, and a lid 6 joined to the upper surface of the base 5 via a joining member so as to close the opening of the recess. An internal space S is formed inside the package 7 by the recess.

[0062] The package 7 is, for example, a ceramic package. The base 5 is made of ceramics such as alumina, and the lid 6 is made of ceramics such as alumina or a metal material such as kovar.

[0063] The sensor device 11e in FIG. 7A houses the sensor element 3 and the circuit element 4 in the internal space S. The sensor element 3 is an angular velocity sensor that detects the angular velocity around the Z axis, and includes a vibrator 1 and a support substrate 2. The vibrator 1 is a crystal oscillator. The circuit element 4 includes a detection circuit and the like described later.

[0064] The internal space S is airtight and is in a reduced pressure state, preferably a state closer to a vacuum state. Thereby, the vibration characteristics of the vibrator 1 are improved. However, the atmosphere of the internal space S is not particularly limited.

[0065] In the internal space S, the vibrator 1, the support substrate 2, and the circuit element 4 are arranged so as to overlap each other in plan view. Such a configuration can suppress the spread of the planar area in the direction along the X axis and / or the Y axis of the package 7, which is advantageous for miniaturization.

[0066] A plurality of internal terminals 8a and 8b are provided in the recess of the base 5, and a plurality of external terminals 8c are provided on the lower surface of the base 5. These internal terminals 8a and 8b and the external terminals 8c are electrically connected to wirings (not shown) formed in the base 5 and the substrate 26. The internal terminal 8a is electrically connected to the sensor element 3 via a conductive bonding member, and the internal terminal 8b is electrically connected to the circuit element 4 via a bonding wire 9.

[0067] The sensor device 11e in FIG. 7B houses the sensor elements 3a and 3b and the circuit element 4 in the internal space S. The sensor element 3a is an angular velocity sensor that detects the angular velocity around the Z axis. Similar to the sensor element 3, it includes a vibrator that bends and vibrates, and detects the angular velocity using the Coriolis force.

[0068] The sensor element 3b is an acceleration sensor that detects the acceleration in the Z-axis direction. The sensor element 3b includes a crystal oscillator, and detects the acceleration using the change in the oscillation frequency of the crystal oscillator. The sensor element 3b may be configured to include a silicon MEMS having comb-shaped fixed electrodes and movable electrodes, and detect the acceleration using the change in the capacitance formed therebetween. The circuit element 4 includes a detection circuit and the like, which will be described later.

[0069] In the form shown in FIG. 7B, the sensor device 11e includes an angular velocity sensor that detects the angular velocity around the Z axis and an acceleration sensor that detects the acceleration in the Z-axis direction. However, the sensor device 11e is not limited to this configuration. For example, in addition to the sensor elements 3a and 3b, the sensor device 11e may include an angular velocity sensor element that detects the angular velocity around the X axis and / or an angular velocity sensor element that detects the angular velocity around the Y axis. For example, in addition to the sensor elements 3a and 3b, the sensor device 11e may include an acceleration sensor element that detects the acceleration in the X-axis direction and / or an acceleration sensor element that detects the acceleration in the Y-axis direction. For example, the sensor element 3a may be a three-axis angular velocity sensor that detects the angular velocity around each of the X, Y, and Z axes. For example, the sensor element 3b may be a three-axis acceleration sensor that detects the acceleration in each of the X, Y, and Z axis directions. For example, the sensor element 3b may be an angular velocity sensor that detects the angular velocity around the Y axis and / or the X axis, or a three-axis angular velocity sensor that detects the angular velocity around each of the X, Y, and Z axes. For example, the sensor element 3a may be a three-axis angular velocity sensor that detects the angular velocity around each of the X, Y, and Z axes, and the sensor element 3b may be a three-axis acceleration sensor that detects the acceleration in each of the X, Y, and Z axis directions. In other words, the sensor device 11e may be a three-axis angular velocity sensor, a three-axis acceleration sensor, or a 6DoF (Six degrees of freedom) sensor.

[0070] When a ceramic package is used for the package 7, the package 7 can be regarded as a rigid substrate. In this case, the sensor elements 3, 3a, 3b can be regarded as the sensor device 11e. When a ceramic package is used for the package 7, the package 7 may be configured to be directly mounted on the flexible substrate 45 without passing through the substrate 26.

[0071] 1.4.2. Configuration of Sensor Element and Circuit Element FIG. 8 shows a detailed configuration example of the sensor element 3 and the circuit element 4 of the sensor device 11e shown in FIG. 7A. The sensor devices 11a, 11b, 11c, 11d, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, 13f also have a similar configuration.

[0072] The sensor device 11e includes a sensor element 3 and a circuit element 4. The sensor element 3 includes a vibrator 1, and the circuit element 4 includes a drive circuit 81 and a detection circuit 82.

[0073] The drive circuit 81 includes an amplifier circuit that inputs the feedback signal DG from the vibrator 1 and amplifies the signal, an AGC (Automatic Gain Control) circuit that performs automatic gain control, and an output circuit that outputs the drive signal DS to the vibrator 1. The AGC circuit automatically adjusts the gain variably so that the amplitude of the feedback signal DG from the vibrator 1 becomes constant. The output circuit outputs, for example, a rectangular-wave drive signal DS to the vibrator 1.

[0074] The detection circuit 82 can include an amplifier circuit, a synchronous detection circuit, an A / D conversion circuit, etc. The amplifier circuit inputs the detection signals S1 and S2 from the vibrator 1 and performs charge-voltage conversion and signal amplification of the differential detection signals S1 and S2. The synchronous detection circuit performs synchronous detection for extracting a desired wave using the synchronous signal from the drive circuit 81. The A / D conversion circuit converts the analog detection signals S1 and S2 after synchronous detection into digital detection data D1 and outputs it to the arithmetic circuit 14. In the present embodiment, the detection data D1 is an example of the detection signal.

[0075] The arithmetic circuit 14 performs various processes such as temperature correction, zero-point correction, sensitivity adjustment, and filter processing on the detection data D1, and outputs the processed detection data D2 to the outside via the connector 15.

[0076] In the present embodiment, the vibrator 1 is a vibrator having a double-T structure. As the vibrator 1, a tuning fork type or H type vibrator may be used. The vibrator 1 has drive arms 98a, 98b, 98c, 98d, detection arms 99a, 99b, a base 91, and connecting arms 92a, 92b.

[0077] The base 91 has a rectangular shape, and the detection arm 99a, the detection arm 99b, the connecting arm 92a, and the connecting arm 92b are provided on each side of the base 91. At the tip of the connecting arm 92a, the drive arms 98a and 98b are provided. At the tip of the connecting arm 92b, the drive arms 98c and 98d are provided.

[0078] At the tips of the drive arms 98a, 98b, 98c, 98d and the detection arms 99a, 99b, weight portions for frequency adjustment are provided. Assuming that the Z-axis direction is the thickness direction of the vibrator 1, the vibrator 1 detects the angular velocity around the Z-axis.

[0079] Drive electrodes 93 are formed on the upper and lower surfaces of the drive arms 98a, 98b. Drive electrodes 94 are formed on the right and left side surfaces of the drive arms 98a, 98b. Drive electrodes 94 are formed on the upper and lower surfaces of the drive arms 98c, 98d. Drive electrodes 93 are formed on the right and left side surfaces of the drive arms 98c, 98d.

[0080] The drive electrodes 93, 94 are electrically connected to the drive circuit 81. The drive circuit 81 supplies a drive signal DS to the drive electrode 93 and receives a feedback signal DG from the drive electrode 94.

[0081] Detection electrodes 95 are formed on the upper and lower surfaces of the detection arm 99a. Ground electrodes 97 are formed on the right and left side surfaces of the detection arm 99a. Detection electrodes 96 are formed on the upper and lower surfaces of the detection arm 99b. Ground electrodes 97 are formed on the right and left side surfaces of the detection arm 99b. The detection electrodes 95, 96 are electrically connected to the detection circuit 82. The detection circuit 82 receives detection signals S1, S2 from the detection electrodes 95, 96.

[0082] 1.4.3. Operations of the Sensor Element and Circuit Element The sensor element 3 and the circuit element 4 operate as follows. When a drive signal DS is applied from the drive circuit 81 to the drive electrode 93, the drive arms 98a, 98b, 98c, 98d perform bending vibrations as shown by the arrow C1 due to the inverse piezoelectric effect. Specifically, the tips of the drive arm 98a and the drive arm 98c approach and separate from each other repeatedly, and the tips of the drive arm 98b and the drive arm 98d also approach and separate from each other repeatedly.

[0083] In other words, the drive arms 98a, 98b, 98c, and 98d repeat the vibration postures indicated by the solid-line arrow C1 and the vibration postures indicated by the dotted-line arrow C1 at a predetermined frequency. The predetermined frequency is, for example, 49.6 kHz.

[0084] In the present embodiment, the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d is an example of the drive frequency of the sensor device 11e. The frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d may be defined by the frequency of the drive signal DS. This is because the frequency of the drive signal DS has a correlation with the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d. Similarly, the drive frequency of the sensor device 11e may be defined by another signal that has a correlation with the frequency of the bending vibration of the drive arms 98a, 98b, 98c, and 98d.

[0085] The bending vibrations of the drive arm 98a and the drive arm 98b and the bending vibrations of the drive arm 98c and the drive arm 98d are vibrations that are line-symmetric with respect to the Y axis passing through the center-of-gravity position of the base 91. Therefore, due to the bending vibrations of the drive arms 98a, 98b, 98c, and 98d, the base 91, the connecting arm 92a, the connecting arm 92b, the detection arm 99a, and the detection arm 99b hardly vibrate.

[0086] In this state, when an angular velocity about the Z axis is applied to the vibrator 1, the drive arms 98a, 98b, 98c, and 98d vibrate as shown by the arrow C2 due to the Coriolis force. In other words, the Coriolis force in the direction of the arrow C2, which is orthogonal to the direction of the arrow C1 and the direction of the Z axis, acts on the drive arms 98a, 98b, 98c, and 98d, thereby generating a vibration component in the direction of the arrow C2.

[0087] This vibration in the direction of the arrow C2 is transmitted to the base 91 via the connecting arm 92a and the connecting arm 92b, and thereby the detection arm 99a and the detection arm 99b bend and vibrate in the direction of the arrow C3. Charge signals generated by the piezoelectric effect due to the bending vibration of the detection arms 99a and 99b are input into the detection circuit 82 as detection signals S1 and S2, and the angular velocity around the Z axis is detected.

[0088] As described above, the sensor module 100 of the present embodiment has the following effects. The sensor module 100 of the present embodiment includes a substrate 21 as a first substrate, a substrate 22 as a second substrate, a connection portion 40 that electrically connects the substrate 21 and the substrate 22, a sensor device 11a provided on the substrate 21 as a first sensor device that detects the angular velocity around the Z axis as a physical quantity of the first axis, a sensor device 11b provided on the substrate 21 that detects the angular velocity around the Z axis and has a drive frequency different from that of the sensor device 11a as a second sensor device, a sensor device 12a provided on the substrate 22 as a third sensor device that detects the angular velocity around the X axis as a physical quantity of the second axis, and a sensor device 12b provided on the substrate 22 that detects the angular velocity around the X axis and has a drive frequency different from that of the sensor device 12a as a fourth sensor device.

[0089] Thus, the sensor module 100 of the present embodiment has a substrate 21 on which the sensor devices 11a and 11b for detecting the angular velocity around the Z axis are mounted, and a substrate 22 on which the sensor devices 12a and 12b for detecting the angular velocity around the X axis are mounted and which is connected to the substrate 21 via the connection portion 40. The drive frequency of the sensor device 11a is different from the drive frequency of the sensor device 11b, and the drive frequency of the sensor device 12a is different from the drive frequency of the sensor device 12b.

[0090] Therefore, in the sensor module 100 of the present embodiment, the two angular velocity sensors around the Z axis mounted on the substrate 21 are suppressed from mechanically and / or electrically interfering with each other, and the two angular velocity sensors around the X axis mounted on the substrate 22 are suppressed from mechanically and / or electrically interfering with each other. Further, the two angular velocity sensors around the Z axis mounted on the substrate 21 and the two angular velocity sensors around the X axis mounted on the substrate 22 are suppressed from mechanically and / or electrically interfering with each other.

[0091] Therefore, the sensor module 100 of the present embodiment can improve the effectiveness of high-precision angular velocity data for each axis in a configuration including a plurality of angular velocity sensors around the Z axis and a plurality of angular velocity sensors around the X axis, respectively. In other words, in the sensor module 100 of the present embodiment, by changing the combination of two or more angular velocity sensors mounted on the substrate 21 and two or more angular velocity sensors mounted on the substrate 22 to the X axis and the Y axis, the Y axis and the Z axis, and the Z axis and the X axis, the effectiveness of high-precision multi-axis angular velocity sensors can be improved. Further, in the sensor module 100 of the present embodiment, by replacing the angular velocity sensor with an acceleration sensor, the sensor module 100 of the present embodiment can also improve the effectiveness of high-precision multi-axis acceleration sensors.

[0092] In the sensor module 100 of the present embodiment, the connection portion 40 includes a flexible substrate 41. Thus, in the sensor module 100 of the present embodiment, the substrate 21 and the substrate 22 are electrically connected via the flexible substrate 41. The flexible substrate 41 is a flexible substrate. Therefore, the sensor module 100 of the present embodiment can suppress mechanical or electrical interference between the substrate 21 and the substrate 22. Therefore, the sensor module 100 of the present embodiment can improve the effectiveness and reliability of high-precision detection data.

[0093] The sensor module 100 of the present embodiment further includes an arithmetic circuit 14 provided on the substrate 21 and serving as a processing unit that processes detection data D1 as a first detection signal of the sensor device 11a, detection data D1 as a second detection signal of the sensor device 11b, detection data D1 as a third detection signal of the sensor device 12a, and detection data D1 as a fourth detection signal of the sensor device 12b.

[0094] Therefore, in the sensor module 100 of the present embodiment, the arithmetic circuit 14 processes each detection data D1 detected by each sensor device based on a configuration that ensures the effectiveness of high-precision. Thus, the sensor module 100 of the present embodiment can obtain highly accurate and reliable detection data D2.

[0095] The sensor module 100 of the present embodiment further includes a connector 15 provided on the substrate 21 and electrically connected to the arithmetic circuit 14. Therefore, the sensor module 100 of the present embodiment can output the highly accurate and reliable detection data D2 processed by the arithmetic circuit 14 to the outside via the connector 15 based on a configuration that ensures the effectiveness of high-precision.

[0096] The sensor module 100 of the present embodiment further includes a fixing frame 60 as a fixing unit for fixing the substrate 21 and the substrate 22. In this way, the substrate 21 and the substrate 22 are each fixed to the fixing frame 60. Therefore, the sensor module 100 of the present embodiment can easily and surely fix the substrate 21 and the substrate 22. Thus, the sensor module 100 of the present embodiment can improve the effectiveness and reliability of high-precision detection data.

[0097] The sensor module 100 of the present embodiment further includes an inner case 30 and / or an outer case 50 as a case for housing the connection part 40 between the substrate 21 and the substrate 22. Thus, since the substrate 21, the substrate 22, and the connection portion 40 are housed in the inner case 30 and / or the outer case 50, the influence from the outside can be blocked, and the effectiveness and reliability of improving the accuracy of the detection data can be improved.

[0098] The sensor module 100 of the present embodiment includes a substrate 21 as a first substrate, a substrate 22 as a second substrate, a substrate 23 as a third substrate, a flexible substrate 41 as a first connection portion for electrically connecting the substrate 21 and the substrate 22, a flexible substrate 42 as a second connection portion for electrically connecting the substrate 21 and the substrate 23, a sensor device 11a as a first sensor device provided on the substrate 21 for detecting an angular velocity around the Z axis as a physical quantity of the first axis, a sensor device 11b as a second sensor device provided on the substrate 21 for detecting an angular velocity around the Z axis and having a drive frequency different from that of the sensor device 11a, a sensor device 12a as a third sensor device provided on the substrate 22 for detecting an angular velocity around the X axis as a physical quantity of the second axis, a sensor device 12b as a fourth sensor device provided on the substrate 22 for detecting an angular velocity around the X axis and having a drive frequency different from that of the sensor device 12a, a sensor device 13a as a fifth sensor device provided on the substrate 23 for detecting an angular velocity around the Y axis as a physical quantity of the third axis, and a sensor device 13b as a sixth sensor device provided on the substrate 23 for detecting an angular velocity around the Y axis and having a drive frequency different from that of the sensor device 13a.

[0099] As described above, the sensor module 100 of the present embodiment includes a substrate 21 on which sensor devices 11a and 11b for detecting the angular velocity around the Z axis are mounted, and a substrate 22 on which sensor devices 12a and 12b for detecting the angular velocity around the X axis are mounted and which is connected to the substrate 21 via a flexible substrate 41, and a substrate 23 on which sensor devices 13a and 13b for detecting the angular velocity around the Y axis are mounted and which is connected to the substrate 21 via a flexible substrate 42. The drive frequency of the sensor device 11a is different from the drive frequency of the sensor device 11b, the drive frequency of the sensor device 12a is different from the drive frequency of the sensor device 12b, and the drive frequency of the sensor device 13a is different from the drive frequency of the sensor device 13b.

[0100] Therefore, in the sensor module 100 of the present embodiment, the two angular velocity sensors around the Z axis mounted on the substrate 21 are suppressed from mechanically and / or electrically interfering with each other, the two angular velocity sensors around the X axis mounted on the substrate 22 are suppressed from mechanically and / or electrically interfering with each other, and the two angular velocity sensors around the Y axis mounted on the substrate 23 are suppressed from mechanically and / or electrically interfering with each other. Further, the two angular velocity sensors around the Z axis mounted on the substrate 21, the two angular velocity sensors around the X axis mounted on the substrate 22, and the two angular velocity sensors around the Y axis mounted on the substrate 23 are suppressed from mechanically and / or electrically interfering with each other.

[0101] Thus, the sensor module 100 of the present embodiment can improve the effectiveness of high-precision angular velocity data for each axis in a configuration where a plurality of angular velocity sensors for each axis are provided. In other words, the sensor module 100 of the present embodiment can improve the effectiveness of high-precision multi-axis angular velocity sensors. Further, in the sensor module 100 of the present embodiment, by replacing the angular velocity sensor with an acceleration sensor, the sensor module 100 of the present embodiment can also improve the effectiveness of high-precision multi-axis acceleration sensors.

[0102] The sensor module 100 of this embodiment further includes a substrate 24 as a fourth substrate, a substrate 25 as a fifth substrate, a substrate 26 as a sixth substrate, a flexible substrate 43 as a third connection part for electrically connecting the substrate 21 and the substrate 24, a flexible substrate 44 as a fourth connection part for electrically connecting the substrate 21 and the substrate 25, a flexible substrate 45 as a fifth connection part for electrically connecting the substrate 25 and the substrate 26, a sensor device 12d as a seventh sensor device provided on the substrate 24 for detecting the angular velocity around the X axis, a sensor device 12e as an eighth sensor device provided on the substrate 24 for detecting the angular velocity around the X axis and having a driving frequency different from that of the sensor device 12d, a sensor device 13d as a ninth sensor device provided on the substrate 25 for detecting the angular velocity around the Y axis, a sensor device 13e as a tenth sensor device provided on the substrate 25 for detecting the angular velocity around the Y axis and having a driving frequency different from that of the sensor device 13d, a sensor device 11d as an eleventh sensor device provided on the substrate 26 for detecting the angular velocity around the Z axis, and a sensor device 11e as a twelfth sensor device provided on the substrate 26 for detecting the angular velocity around the Z axis and having a driving frequency different from that of the sensor device 11d.

[0103] Thus, the sensor module 100 of this embodiment further includes a substrate 24 on which the sensor devices 12d and 12e for detecting the angular velocity around the X axis are mounted and which is connected to the substrate 21 via the flexible substrate 43, a substrate 25 on which the sensor devices 13d and 13e for detecting the angular velocity around the Y axis are mounted and which is connected to the substrate 21 via the flexible substrate 44, and a substrate 26 on which the sensor devices 11d and 11e for detecting the angular velocity around the Z axis are mounted and which is connected to the substrate 25 via the flexible substrate 45. The driving frequency of the sensor device 11d is different from that of the sensor device 11e, the driving frequency of the sensor device 12d is different from that of the sensor device 12e, and the driving frequency of the sensor device 13d is different from that of the sensor device 13e.

[0104] Therefore, in the sensor module 100 of the present embodiment, further, two angular velocity sensors around the X-axis mounted on the substrate 24 are suppressed from mechanically and / or electrically interfering with each other, and two angular velocity sensors around the Y-axis mounted on the substrate 25 are suppressed from mechanically and / or electrically interfering with each other, and two angular velocity sensors around the Z-axis mounted on the substrate 26 are suppressed from mechanically and / or electrically interfering with each other. In addition, two angular velocity sensors around the Z-axis mounted on the substrate 21, two angular velocity sensors around the X-axis mounted on the substrate 22, two angular velocity sensors around the Y-axis mounted on the substrate 23, two angular velocity sensors around the X-axis mounted on the substrate 24, two angular velocity sensors around the Y-axis mounted on the substrate 25, and two angular velocity sensors around the Z-axis mounted on the substrate 26 are suppressed from mechanically and / or electrically interfering with each other.

[0105] Thus, the sensor module 100 of the present embodiment can improve the effectiveness of high-precision of the angular velocity data around each axis in a configuration including a plurality of angular velocity sensors around each axis. In other words, the sensor module 100 of the present embodiment can improve the effectiveness of high-precision of multi-axis angular velocity sensors. Furthermore, the sensor module 100 of the present embodiment divides and mounts a plurality of X-axis angular velocity sensors, Y-axis angular velocity sensors, and Z-axis angular velocity sensors, respectively, on two substrates. Therefore, the sensor module 100 of the present embodiment can be miniaturized, which is advantageous for miniaturization of the sensor module 100. Furthermore, in the sensor module 100 of the present embodiment, by replacing the angular velocity sensor with an acceleration sensor, the sensor module 100 of the present embodiment can also improve the effectiveness of high-precision of multi-axis acceleration sensors.

[0106] The sensor module 100 of this embodiment further includes a sensor device 11c provided on the substrate 21 for detecting the angular velocity around the Z axis, which serves as a 13th sensor device having a driving frequency different from those of the sensor devices 11a and 11b; a sensor device 12c provided on the substrate 22 for detecting the angular velocity around the X axis, which serves as a 14th sensor device having a driving frequency different from those of the sensor devices 12a and 12b; and a sensor device 13c provided on the substrate 23 for detecting the angular velocity around the Y axis, which serves as a 15th sensor device having a driving frequency different from those of the sensor devices 13a and 13b. Further, the sensor module 100 of this embodiment further includes a sensor device 12f provided on the substrate 24 for detecting the angular velocity around the X axis, which serves as a 16th sensor device having a driving frequency different from those of the sensor devices 12d and 12e; a sensor device 13f provided on the substrate 25 for detecting the angular velocity around the Y axis, which serves as a 17th sensor device having a driving frequency different from those of the sensor devices 13d and 13e; and a sensor device 11f provided on the substrate 26 for detecting the angular velocity around the Z axis, which serves as an 18th sensor device having a driving frequency different from those of the sensor devices 11d and 11e.

[0107] Thus, the sensor module 100 of this embodiment is provided on the substrate 21, detects the angular velocity around the Z axis, and includes sensor devices 11a, 11b, and 11c having different driving frequencies respectively; is provided on the substrate 22, detects the angular velocity around the X axis, and includes sensor devices 12a, 12b, and 12c having different driving frequencies respectively; and is provided on the substrate 23, detects the angular velocity around the Y axis, and includes sensor devices 13a, 13b, and 13c having different driving frequencies respectively. Further, the sensor module 100 of this embodiment is provided on the substrate 24, detects the angular velocity around the X axis, and includes sensor devices 12d, 12e, and 12f having different driving frequencies respectively; is provided on the substrate 25, detects the angular velocity around the Y axis, and includes sensor devices 13d, 13e, and 13f having different driving frequencies respectively; and is provided on the substrate 26, detects the angular velocity around the Z axis, and includes sensor devices 11d, 11e, and 11f having different driving frequencies respectively.

[0108] Therefore, in the configuration where the sensor module 100 of this embodiment includes a plurality of angular velocity sensors around each axis, the effectiveness of improving the accuracy of the angular velocity data around each axis can be enhanced. In other words, the sensor module 100 of this embodiment can improve the effectiveness of improving the accuracy of multi-axis angular velocity sensors. Furthermore, in the sensor module 100 of this embodiment, by replacing the angular velocity sensor with an acceleration sensor, the sensor module 100 of this embodiment can also improve the effectiveness of improving the accuracy of multi-axis acceleration sensors.

[0109] In the sensor module 100 of this embodiment, the driving frequency of the sensor device 11a is the same as the driving frequency of the sensor device 11d, the driving frequency of the sensor device 12a is the same as the driving frequency of the sensor device 12d, and the driving frequency of the sensor device 13a is the same as the driving frequency of the sensor device 13d.

[0110] Therefore, it is not necessary to prepare a plurality of angular velocity sensors on the same axis, each having a different driving frequency, for the sensor module 100 of the present embodiment. Therefore, the sensor module 100 of the present embodiment can reduce the costs required to prepare a plurality of angular velocity sensors on the same axis, each having a different driving frequency, for example, costs in manufacturing, ordering, inventory, or assembly, etc., and can improve the industrial utility value.

[0111] 2. Embodiment 2 In Embodiment 2, an electronic device including the sensor module 100 will be described. Hereinafter, as examples of electronic devices, examples of portable devices such as smartphones and examples of moving bodies such as automobiles will be described.

[0112] 2.1. Overview of Portable Devices FIG. 9 is a perspective view of a portable device as an electronic device according to Embodiment 2, and is a diagram showing the configuration of a smartphone 110 as an example of a portable device.

[0113] The smartphone 110 is equipped with the sensor module 100. The detection data D2 of the sensor module 100 is received by the control unit 111. The control unit 111 can recognize the posture and behavior of the smartphone 110 from the received detection signal, change the display image displayed on the display unit, sound a warning sound or an effect sound, or drive a vibration motor to vibrate the main body.

[0114] The sensor module 100 may be mounted on a mobile device other than the smartphone 110. For example, the sensor module 100 may be mounted on a mobile device such as a smartwatch, a portable pedometer, an HMD (Head Mounted Display), a mobile PC (Personal Computer), a tablet PC, a camera, a PDA (Personal Digital Assistants). Accordingly, the mobile device can recognize the posture and behavior of the mobile device based on the detection data D2 of the sensor module 100, change the display image, emit a warning sound or a sound effect, drive a vibration motor to vibrate the main body, and so on.

[0115] Thus, in this embodiment, a mobile device such as the smartphone 110 mounts the sensor module 100. Therefore, according to this embodiment, the reliability of the mobile device provided with the sensor module 100 can be improved.

[0116] 2.2. Overview of the moving body FIG. 10 is a perspective view of a moving body as an electronic device according to Embodiment 2, and is a diagram showing the configuration of an automobile 130 as an example of the moving body.

[0117] The automobile 130 mounts the sensor module 100. The sensor module 100 detects the posture of the vehicle body 131 and transmits the detection data D2 to the vehicle body posture control device 132. The detection data D2 includes an angular velocity signal and an acceleration signal. When receiving the detection data D2 of the sensor module 100, the vehicle body posture control device 132 that controls the posture of the vehicle body 131 detects the posture of the vehicle body 131 based on the signal, and controls the hardness and softness of the suspension or controls the brakes of the individual wheels 133 according to the detection result.

[0118] The detection data D2 of the sensor module 100 may also be utilized in other ECUs (Electronic Control Units) such as keyless entry, immobilizer, car navigation system, car air conditioner, antilock brake system (ABS), airbag, TPMS (Tire Pressure Monitoring System), engine control, control devices for inertial navigation in autonomous driving, and battery monitors for hybrid vehicles and electric vehicles.

[0119] The sensor module 100 may be mounted on a moving body other than the automobile 130. Other moving bodies are, for example, bipedal robots, trains, radio-controlled airplanes, radio-controlled helicopters, drones, agricultural machinery, and construction machinery. The moving body equipped with the sensor module 100 can utilize the detection data D2 of the sensor module 100 for attitude control and position measurement of the moving body.

[0120] Thus, in this embodiment, a moving body such as the automobile 130 is equipped with the sensor module 100. Therefore, according to this embodiment, the reliability of the moving body equipped with the sensor module 100 can be improved.

[0121] As described above, the preferred embodiments have been explained, but the present invention is not limited to the above-described embodiments. The configuration of each part of the present invention can be replaced with any configuration that exhibits the same functions as those of the above-described embodiments, and any configuration can be added.

Explanation of Reference Numerals

[0122] 1…Vibrator, 2…Support substrate, 3…Sensor element, 3a, 3b…Sensor elements, 4…Circuit element, 5…Base, 6…Lid, 7…Package, 8a…Internal terminal, 8b…Internal terminal, 8c…External terminal, 9…Bonding wire, 10…Sensor unit, 11a, 11b, 11c, 11d, 11e, 11f, 12a, 12b, 12c, 12d, 12e, 12f, 13a, 13b, 13c, 13d, 13e, 13f…Sensor devices, 14…Arithmetic circuit, 15…Connector, 16…Memory, 17…Power supply circuit, 18…Temperature sensor, 20…Substrate unit, 21, 22, 23, 24, 25, 26…Substrates, 30…Inner case, 31…Opening, 32…Side wall, 33…Recess, 34…Upper surface, 40…Connection part, 41, 42, 43, 44, 45…Flexible substrates, 50…Outer case, 52…Screw hole, 53…Inner side, 54…Side wall, 55…Bottom surface, 57…Upper surface, 58…Lower surface, 60…Fixing frame, 61…Upper surface, 62, 63, 64, 65…Side surfaces, 66…Lower surface, 68…Opening, 70…Screw, 71…Mounting surface, 81…Drive circuit, 82…Detection circuit, 91…Base part, 92a, 92b…Linking arms, 93, 94…Drive electrodes, 95, 96…Detection electrodes, 97…Ground electrode, 98a, 98b, 98c, 98d…Drive arms, 99a, 99b…Detection arms, 100…Sensor module, 110…Smartphone, 111…Control unit, 130…Automobile, 131…Vehicle body, 132…Vehicle body attitude control device, 133…Wheel, C1, C2, C3…Arrows, D1, D2…Detection data, S1, S2…Detection signals.

Claims

1. a first substrate, a second substrate, a connection part that electrically connects the first substrate and the second substrate, a first sensor device provided on the first substrate for detecting a physical quantity of a first axis, a second sensor device provided on the first substrate for detecting the physical quantity of the first axis and having a driving frequency different from that of the first sensor device, a third sensor device provided on the second substrate for detecting a physical quantity of a second axis, and a fourth sensor device provided on the second substrate for detecting the physical quantity of the second axis and having a driving frequency different from that of the third sensor device, a sensor module.

2. The connection part includes a flexible substrate, The sensor module according to claim 1.

3. A processing unit provided on the first substrate for processing a first detection signal of the first sensor device, a second detection signal of the second sensor device, a third detection signal of the third sensor device, and a fourth detection signal of the fourth sensor device, The sensor module according to claim 1.

4. A connector provided on the first substrate and electrically connected to the processing unit, The sensor module according to claim 3.

5. A fixing part for fixing the first substrate and the second substrate, The sensor module according to claim 1.

6. A case for housing the first substrate, the second substrate, and the connection part, The sensor module according to claim 1.

7. A fifth sensor device provided on the first substrate, detecting a physical quantity of the first axis, and having a driving frequency different from that of the first sensor device and the second sensor device; A sixth sensor device provided on the second substrate, detecting a physical quantity of the second axis, and having a driving frequency different from that of the third sensor device and the fourth sensor device; The sensor module according to claim 1.

8. A first substrate; A second substrate; A third substrate; A first connection portion electrically connecting the first substrate and the second substrate; A second connection portion electrically connecting the first substrate and the third substrate; A first sensor device provided on the first substrate, detecting a physical quantity of the first axis; A second sensor device provided on the first substrate, detecting a physical quantity of the first axis, and having a driving frequency different from that of the first sensor device; A third sensor device provided on the second substrate, detecting a physical quantity of the second axis; A fourth sensor device provided on the second substrate, detecting a physical quantity of the second axis, and having a driving frequency different from that of the third sensor device; A fifth sensor device provided on the third substrate, detecting a physical quantity of the third axis; A sixth sensor device provided on the third substrate, detecting a physical quantity of the third axis, and having a driving frequency different from that of the fifth sensor device; A sensor module.

9. A fourth substrate; A fifth substrate; A sixth substrate; A third connection portion electrically connecting the first substrate and the fourth substrate; A fourth connection portion electrically connecting the first substrate and the fifth substrate; A fifth connection portion electrically connecting the fifth substrate and the sixth substrate; A seventh sensor device provided on the fourth substrate for detecting a physical quantity of the second axis; An eighth sensor device provided on the fourth substrate for detecting a physical quantity of the second axis and having a driving frequency different from that of the seventh sensor device; A ninth sensor device provided on the fifth substrate for detecting a physical quantity of the third axis; A tenth sensor device provided on the fifth substrate for detecting a physical quantity of the third axis and having a driving frequency different from that of the ninth sensor device; An eleventh sensor device provided on the sixth substrate for detecting a physical quantity of the first axis; An twelfth sensor device provided on the sixth substrate for detecting a physical quantity of the first axis and having a driving frequency different from that of the eleventh sensor device, The sensor module according to claim 8.

10. A thirteenth sensor device provided on the first substrate for detecting a physical quantity of the first axis and having a driving frequency different from that of the first sensor device and the second sensor device; A fourteenth sensor device provided on the second substrate for detecting a physical quantity of the second axis and having a driving frequency different from that of the third sensor device and the fourth sensor device; A fifteenth sensor device provided on the third substrate for detecting a physical quantity of the third axis and having a driving frequency different from that of the fifth sensor device and the sixth sensor device, The sensor module according to claim 9.

11. A sixteenth sensor device provided on the fourth substrate for detecting a physical quantity of the second axis and having a driving frequency different from that of the seventh sensor device and the eighth sensor device; A seventeenth sensor device provided on the fifth substrate for detecting a physical quantity of the third axis and having a driving frequency different from that of the ninth sensor device and the tenth sensor device; Provided on the sixth substrate, detecting the physical quantity of the first axis, and comprising an eighteenth sensor device having a driving frequency different from that of the eleventh sensor device and the twelfth sensor device. The sensor module according to claim 10.

12. The driving frequency of the first sensor device and the driving frequency of the eleventh sensor device are the same. The driving frequency of the third sensor device and the driving frequency of the seventh sensor device are the same. The driving frequency of the fifth sensor device and the driving frequency of the ninth sensor device are the same. The sensor module according to claim 9.

13. An electronic device comprising the sensor module according to claims 1 to 12.

Images