Film application device and film application method

Abstract

To provide a film application device and a film application method capable of smoothly winding a resin film around a flange of a container part.SOLUTION: A film application device 1 includes: a lower mold 52 having a recess 521, a placement surface 522, a step part 523, and a first vacuum flow path 524; and an upper mold 51 having a flange pressing member 511 that presses down a flange B2, a flame 512 provided on an outer periphery side of the flange pressing member 511, and a first compressed air flow path 513 formed between the flange pressing member 511 and the flame 512, in a state that the flange B2 and the step surface 523a are pressed by the flange pressing members 511 and 512, respectively, air in a sealed space S formed by a resin film C, an outer edge part B22 of the flange B2 and the lower mold 52 is sucked in through the first vacuum flow path 524, and compressed air from the first compressed air flow path 513 is applied above the resin film C.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present invention relates to a film sticking device and a film sticking method.

Background Art

[0002] Patent Document 1 discloses a film sticking device for sticking a resin film to a container part.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the film sticking device described in Patent Document 1, since the vacuum flow path opens to the mounting surface on which the flange is mounted, there is a problem that the resin film is not properly wound and the outer edge portion of the lower surface of the flange cannot be reliably covered.

[0005] The present invention has been made paying attention to this problem, and an object thereof is to provide a film sticking device and a film sticking method capable of satisfactorily winding a resin film around a flange of a container part.

Means for Solving the Problems

[0006] According to an aspect of the present invention, there is provided a film pasting device for pasting a resin film onto a container portion made of a fiber material, the film pasting device including: a lower mold having a recess in which a housing portion of the container portion is housed, a placement surface formed on an outer peripheral side of the recess on which a flange of the container portion is placed, a step portion formed on an outer peripheral side of the placement surface, and a first vacuum passage having one end opening to the step portion; an upper mold having a flange presser for pressing the flange via the resin film, a mold frame provided on an outer peripheral side of the flange presser for pressing the step portion via the resin film, and a first compressed air passage formed between the flange presser and the mold frame; wherein the step portion is provided at a position lower than the placement surface and has a step surface for sandwiching the resin film together with the mold frame, and in a state where the flange and the step surface are respectively pressed by the flange presser and the mold frame, the resin film positioned between the flange presser and the mold frame, an outer edge portion protruding from the placement surface of the flange to an outer peripheral side, and gas in a sealed space formed by the lower mold are sucked through the first vacuum passage communicating with the sealed space, and compressed air from the first compressed air passage is applied above the resin film positioned between the flange presser and the mold frame.

Advantages of the Invention

[0007] According to this aspect, the resin film can be satisfactorily wound around the flange of the container portion.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

BEST MODE FOR CARRYING OUT THE INVENTION

[0009] Hereinafter, a mode for carrying out the present invention (hereinafter, also referred to as the present embodiment) will be described with reference to the accompanying drawings. In this specification, the same reference numerals are given to the same elements throughout.

[0010] [Container] The container A according to the present embodiment will be described with reference to FIGS. 1 and 2.

[0011] FIG. 1 is a schematic explanatory view showing the container A according to the present embodiment. FIG. 2 is a perspective view showing the paper container part B constituting the container A.

[0012] As shown in FIGS. 1 and 2, the container A is, for example, a container for containing contents P such as food, and includes a paper container part B as a container part, a resin film C, and a top seal D.

[0013] The paper container part B is assembled by folding a single sheet of cardboard along perforations or ruled lines, and has a storage part B1 for storing the contents P and a flange B2 formed on the outer peripheral side of the storage part B1.

[0014] As shown in FIG. 1, the storage part B1 has a substantially octagonal bottom plate B11, a plurality (here, eight) of side plates B12 formed on the outer edge of the bottom plate B11 so as to be inclined with respect to the bottom plate B11, and a storage area B13 surrounded by the bottom plate B11 and the plurality of side plates B12. Here, the opening of the storage area B13 is referred to as an opening B14.

[0015] The flange B2 is composed of a plurality of bent portions B21 formed by bending each of the plurality of side plates B12 outward. The flange B2 is formed parallel to the bottom plate B11.

[0016] The resin film C is composed of, for example, a thermoplastic resin film such as polypropylene (PP). The resin film C is adhered (fused) and coated on the inner side of the paper container part B (specifically, the upper surface of the bottom plate B11 and the inner side surfaces of the plurality of side plates B12), the upper surface of the flange B2, the end surface continuous with the upper surface, and the outer edge of the lower surface continuous with the end surface. In this way, the outer edge part B22 of the flange B2 is wrapped by the resin film C. In other words, the resin film C has a wrapping part C1 that wraps the outer edge part B22 of the flange B2. Note that at least a state in which the resin film C enters inside the outer edge part B22 of the flange B2 is also a wrapping state.

[0017] The top seal D is composed of a thermoplastic resin seal such as polyethylene terephthalate (PET). When the content P is accommodated in the paper container part B, the top seal D seals the opening B14 of the accommodation part B1 so as to be in close contact with and cover the resin film C placed on the upper surface of the flange B2.

[0018] And since the winding part C1 of the resin film C winds in the outer edge part B22 of the flange B2, it is possible to suppress the resin film C from being peeled off from the outer edge part B22 when peeling the top seal D from the resin film C. Note that the film pasting device 1 (see FIG. 3) for winding the resin film C around the outer edge part B22 of the flange B2 of the paper container part B will be described later.

[0019] In the present embodiment, the container part is composed of the paper container part B, but it is not limited thereto. For example, it may be composed of a mold of a plant-derived material through which gas can pass. That is, the container part may be made of a fiber material.

[0020] [Film Pasting Device] Next, the film pasting device 1 according to the present embodiment will be described with reference to FIGS. 3 and 4.

[0021] FIG. 3 is a schematic plan view showing the configuration of the film pasting device 1 according to the present embodiment. FIG. 4 is a schematic side view showing the heater 3, the cooling frame 4, and the forming part 5 that constitute the film pasting device 1.

[0022] As shown in FIGS. 3 and 4, the film pasting device 1 according to the present embodiment is a device for pasting the resin film C to the paper container part B, and includes a conveying part 2, a heater 3 as a heating part, a cooling frame 4 as a receiving frame, a forming part 5, a receiving guide 6, and a blade part 7 (see FIG. 11).

[0023] Here, in the longitudinal direction of the film laminating apparatus 1 (hereinafter, also simply referred to as the longitudinal direction), the side where the resin film C is supplied is defined as the upstream side. Note that the pay - out roller 21, the heater 3, the molding part 5, the blade part 7, and the take - in roller 22 (to be described later) of the conveying part 2 are arranged from the upstream side toward the downstream side.

[0024] As shown in FIG. 3, the conveying part 2 has a pay - out roller 21 rotatably provided on the most upstream side and a take - in roller 22 rotatably provided on the most downstream side. By driving both the pay - out roller 21 and the take - in roller 22, the resin film C is conveyed along the conveying path L extending in the longitudinal direction. Such a conveying part 2 applies tension to the resin film C.

[0025] The heater 3 heats the resin film C to a temperature equal to or higher than its melting point. As shown in FIG. 4, the heater 3 is provided so as to extend along the longitudinal direction and be located above (directly above) the resin film C.

[0026] As shown in FIG. 4, the cooling frame 4 is a frame that suppresses the draw - down of the resin film C softened by heating with the heater 3. The cooling frame 4 is located directly below the resin film C and is provided so as to be vertically movable relative to the heater 3 by the drive of a drive source such as a motor or a cylinder. Note that the cooling frame 4 is cooled to an appropriate temperature by a water - cooling system (not shown).

[0027] As shown in FIG. 4, the molding part 5 has an upper mold 51 and a lower mold 52.

[0028] In the present embodiment, the upper mold 51 is provided so as not to be vertically movable, but it is not limited thereto, and for example, it may be provided so as to be vertically movable.

[0029] The upper mold 51 is provided directly above the lower mold 52. The upper mold 51 includes an annular (specifically, substantially rectangular annular) flange presser 511 facing the lower mold 52, an annular (specifically, substantially rectangular annular) mold frame 512 facing the lower mold 52 and located on the outer peripheral side of the flange presser 511, an annular (specifically, substantially rectangular annular) first compressed air flow path 513 formed between the flange presser 511 and the mold frame 512, and a second compressed air flow path 514 formed on the inner peripheral side of the flange presser 511 (see FIG. 9).

[0030] The flange presser 511 presses the flange B2 via the resin film C (see FIG. 9).

[0031] The mold frame 512 is provided such that its tip protrudes below the tip of the flange presser 511. Also, the mold frame 512 presses the step surface 523a of the step portion 523 (described later) via the resin film C.

[0032] The first compressed air flow path 513 and the second compressed air flow path 514 communicate with each other in the upper mold 51.

[0033] The lower mold 52 is provided so as to be vertically movable relative to the upper mold 51 by the drive of a drive source different from the drive source that drives the cooling frame 4.

[0034] The lower mold 52 includes a concave portion 521 that faces the upper mold 51 and houses the housing portion B1 of the paper container portion B, an annular (specifically, substantially rectangular annular) placement surface 522 formed on the outer peripheral side of the concave portion 521 on which the flange B2 of the paper container portion B is placed, an annular step portion 523 formed on the outer peripheral side of the placement surface 522 adjacent to the placement surface 522, a plurality of first vacuum flow paths 524 formed such that one end opens to the step portion 523, and a plurality of second vacuum flow paths 525 formed such that one end opens to the concave portion 521 (see FIG. 9).

[0035] The concave portion 521 includes a bottom surface 521a on which the bottom plate B11 of the housing portion B1 is placed and a side surface 521b that is in close contact with the outer surface of the side plate B12.

[0036] The placement surface 522 is a flat surface that is continuous with the upper end of the side surface 521b of the concave portion 521 so as to be parallel to the bottom surface 521a. The placement surface 522 is formed directly below the flange retainer 511 so as to face the flange retainer 511. When the flange B2 is placed on the placement surface 522, the portion of the flange B2 that protrudes outward from the placement surface 522 is the outer edge portion B22 (see FIG. 9).

[0037] In the present embodiment, the step portion 523 is formed on the outer peripheral side of the placement surface 522 over the entire circumference, but is not limited thereto, and may be formed at the four corners of the annular (specifically, substantially rectangular annular) placement surface 522.

[0038] The step portion 523 has a step surface 523a provided at a position lower than the placement surface 522 so as to face the mold 512, and a connecting surface 523b formed so as to extend along the vertical direction and connecting the step surface 523a and the placement surface 522.

[0039] The height difference between the placement surface 522 and the step surface 523a is smaller than the height difference between the tip of the flange retainer 511 and the tip of the mold 512. Thereby, the flange retainer 511 can press the flange B2 through the resin film C, and the mold 512 can press the step surface 523a through the resin film C.

[0040] The first vacuum flow path 524 is formed in the lower mold 52 such that one end thereof opens to the stepped surface 523a and extends along the vertical direction. When the flange B2 is placed on the placement surface 522, the outer edge portion B22 of the flange B2 covers one end of the first vacuum flow path 524 in plan view so as to be separated from one end of the first vacuum flow path 524 (see FIG. 9). Specifically, the first vacuum flow path 524 is formed such that one end thereof is located on the inner peripheral side of the end surface of the outer edge portion B22. More specifically, the first vacuum flow path 524 is formed such that one end thereof contacts the connection surface 523b in plan view. A clearance of at least twice the thickness of the resin film C is formed between the outer edge portion B22 of the flange B2 and the stepped surface 523a. It is preferable that the clearance formed between the outer edge portion B22 of the flange B2 and the stepped surface 523a is at least three times the thickness of the resin film C.

[0041] In this embodiment, the plurality of first vacuum flow paths 524 open at the entire circumference of the annular stepped surface 523a with one end being spaced apart at a predetermined interval, but the present invention is not limited thereto. For example, the first vacuum flow paths 524 may open at a position corresponding to a tab for peeling the top seal D on the stepped surface 523a.

[0042] The plurality of second vacuum flow paths 525 are formed in the lower mold 52 such that one end thereof opens at a connection location connecting the bottom surface 521a and the side surface 521b and extends along the vertical direction. Specifically, the second vacuum flow path 525 is composed of holes or grooves (slits).

[0043] The first vacuum flow path 524 and the second vacuum flow path 525 communicate with each other in the lower mold 52. Thereby, both suction from the first vacuum flow path 524 and suction from the second vacuum flow path 525 can be performed simultaneously.

[0044] In this embodiment, both the plurality of first vacuum flow paths 524 and the plurality of second vacuum flow paths 525 are formed in the lower mold 52, but the present invention is not limited thereto. For example, the plurality of second vacuum flow paths 525 may not be formed, and only the plurality of first vacuum flow paths 524 may be formed.

[0045] The receiving guide 6 is provided on the downstream side of the lower mold 52. The paper container part B and the resin film located on the outer peripheral side of the paper container part B are placed on the receiving guide 6 (see FIG. 11).

[0046] The blade part 7 is a cutting part that cuts the resin film C placed on the receiving guide 6 so as to be located on the outer peripheral side of the paper container part B. The blade part 7 is provided directly above the receiving guide 6 so as to be vertically movable relative to the receiving guide 6 by driving a driving source such as a motor (see FIG. 11).

[0047] [Film sticking method by film sticking device] Next, a film sticking method according to the present embodiment will be described with reference to FIGS. 5 to 11.

[0048] FIG. 5 is a schematic side view showing the states of the heater 3, the cooling frame 4, and the molding part 5 in step 1 of the film sticking method. FIG. 6 is a schematic side view showing the states of the heater 3, the cooling frame 4, and the molding part 5 in step 2 of the film sticking method. FIG. 7 is a schematic side view showing the states of the heater 3, the cooling frame 4, and the molding part 5 in step 3 of the film sticking method. FIG. 8 is a schematic side view showing the states of the heater 3, the cooling frame 4, and the molding part 5 in step 4 of the film sticking method. FIG. 9 is an enlarged cross-sectional view of a part M in FIG. 8. FIG. 10 is an enlarged cross-sectional view of a part (corresponding to part M in FIG. 7) of the molding part 5 in step 5 of the film sticking method. FIG. 11 is a schematic cross-sectional view showing the states of the receiving guide 6 and the blade part 7 of the film sticking device 1 in step 6 of the film sticking method.

[0049] The film sticking method performed by the film sticking device 1 includes steps 1 to 6.

[0050] First, as shown in FIG. 5, in step 1, the resin film C conveyed by the conveyance path L is heated by the heater 3 to a temperature equal to or higher than the melting point. As a result, the entire resin film C is uniformly heated to a temperature equal to or higher than the melting point.

[0051] Then, the heated and softened resin film C is supported by the cooling frame 4 that has moved to the support position (i.e., the uppermost position), thereby suppressing the drawdown of the resin film C. At the same time, the lower mold 52 moves to the closed position (i.e., the uppermost position) to close the molding part 5.

[0052] Next, as shown in FIG. 6, in step 2, the cooling frame 4 is lowered from the support position to the retracted position (i.e., the lowermost position) by driving of the drive source, so that the heated and softened resin film C can be separated from the cooling frame 4. Thereby, when the resin film C is conveyed in step 3 described later, it is possible to avoid contact between the resin film C and the cooling frame 4. At the same time, the lower mold 52 moves to the open position (the lowermost position) to open the molding part 5.

[0053] Next, as shown in FIG. 7, in step 3, the heated and softened resin film C is conveyed by the conveying part 2 that is driven between the upper mold 51 and the lower mold 52 of the opened molding part 5. At the same time, the paper container part B to which the resin film C is attached by the molding part 5 is placed on the receiving guide 6. Also, at the same time, the paper container part B to which the resin film C has not yet been attached is placed in the recess 521 of the lower mold 52. In this state, the flange B2 of the paper container part B is in a state of being placed on the placement surface 522.

[0054] Next, as shown in FIG. 8, in step 4, the lower mold 52 is raised from the open position to the closed position by driving of the drive source, so that the heated and softened resin film C is lifted by the lower mold 52. At the same time, the cooling frame 4 rises from the retracted position to the support position.

[0055] Then, as shown in FIG. 9, in the state where the lower mold 52 has moved to the closed position, the resin film C is sandwiched between the flange retainer 511 and the flange B2 of the paper container part B, and the resin film C is sandwiched between the mold frame 512 and the step surface 523a. In other words, in this state, the flange B2 is pressed by the flange retainer 511 via the resin film C, and the step surface 523a is pressed by the mold frame 512 via the resin film C.

[0056] Then, due to the height difference between the placement surface 522 and the step surface 523a, the resin film C located between the flange retainer 511 and the mold frame 512 (i.e., the lower end part of the first compressed air flow path 513) is inclined downward toward the outer peripheral side of the molding part 5.

[0057] And in this state, a sealed space S is formed by the resin film C located between the flange retainer 511 and the mold frame 512, the outer edge part B22 of the flange B2, and the lower mold 52 (specifically, the step surface 523a and the connection surface 523b of the step part 523). Thus, by utilizing the lowering of the mold frame 512 accompanying the lowering of the upper mold 51, the sealed space S formed by the resin film C, the outer edge part B22, and the lower mold 52 located between the flange retainer 511 and the mold frame 512 can be easily formed.

[0058] Next, as shown in FIG. 10, in step 5, the molding part 5 performs a molding process.

[0059] Specifically, the molding part 5 sucks the air as the gas in the sealed space S through the first vacuum flow path 524, so as to coat the resin film C heated to surround the sealed space S and wind it around the outer edge part B22 of the flange B2 (specifically, the upper surface, end surface, and lower surface of the outer edge part B22).

[0060] By sucking the air in the sealed space S, it is possible to better entrain the resin film C onto the flange B2 of the paper container part B (specifically, the lower surface of the outer edge part B22 of the flange B2) compared to suction in a structure where the sealed space S is not formed. As a result, the reliability of the entrainment part C1 that entrains the outer edge part B22 of the flange B2 can be improved.

[0061] Also, as described above, since the outer edge part B22 covers one end of the first vacuum flow path 524, it is possible to better entrain the resin film C onto the flange B2 of the paper container part B (specifically, the lower surface of the outer edge part B22 of the flange B2) compared to a structure where the outer edge part B22 does not cover one end of the first vacuum flow path 524. As a result, the reliability of the entrainment part C1 that entrains the outer edge part B22 of the flange B2 can be improved.

[0062] Furthermore, as described above, since the first vacuum flow path 524 is formed such that one end is located on the inner peripheral side of the end surface of the outer edge part B22, it is possible to better entrain the resin film C onto the flange B2 of the paper container part B (specifically, the lower surface of the outer edge part B22 of the flange B2) compared to a structure where one end of the first vacuum flow path 524 is not located on the inner peripheral side of the end surface of the outer edge part B22. As a result, the reliability of the entrainment part C1 that entrains the outer edge part B22 of the flange B2 can be improved.

[0063] At the same time, the molding part 5 applies the compressed air from the first compressed air flow path 513 above the resin film C surrounding the sealed space S, so as to cover and entrain the heated resin film C surrounding the sealed space S onto the outer edge part B22 of the flange B2 (specifically, the upper surface, end surface, and lower surface of the outer edge part B22). Note that the resin film C may be covered on the outer edge part B22 so as to enter inside the outer edge part B22.

[0064] By applying compressed air above the resin film C positioned between the flange presser 511 and the mold 512, the resin film C can be more favorably wound around the flange B2 of the paper container portion B (specifically, the lower surface of the outer edge portion B22 of the flange B2) compared to a structure where compressed air is not applied above the resin film C positioned between the flange presser 511 and the mold 512. As a result, the reliability of the winding portion C1 that winds around the outer edge portion B22 of the flange B2 can be further improved.

[0065] As shown in FIG. 10, the resin film C is folded back by suction from the first vacuum flow path 524 and compressed air from the first compressed air flow path 513, and is covered so as to be in close contact with the lower surface of the outer edge portion B22 and the step surface 523a.

[0066] At the same time, as shown in FIG. 10, the molding portion 5 sucks the air as a gas positioned between the housing portion B1 and the resin film C through the second vacuum flow path 525, so as to cover the heated and softened resin film C in close contact with the inner surface of the housing portion B1. The air positioned between the housing portion B1 and the resin film C is sucked into the second vacuum flow path 525 through the perforations or the portion where the side plates B12 overlap each other.

[0067] In this way, since the suction from the first vacuum flow path 524 and the suction from the second vacuum flow path 525 are performed simultaneously, the winding process of winding the resin film C around the outer edge portion B22 of the flange B2 and the covering process of covering the resin film C on the housing portion B1 can be performed simultaneously. As a result, the efficiency of the film sticking method by the film sticking device 1 can be improved.

[0068] At the same time, the molding portion 5 applies compressed air from the second compressed air flow path 514 above the resin film C positioned on the inner peripheral side of the flange presser 511, so as to cover the heated and softened resin film C in close contact with the inner surface of the housing portion B1.

[0069] As a result, since the compressed air from the first compressed air flow path 513 and the compressed air from the second compressed air flow path 514 are carried out simultaneously, the winding process of winding the resin film C around the outer edge portion B22 of the flange B2 and the covering process of covering the resin film C on the accommodating portion B1 can be carried out simultaneously. As a result, the efficiency of the film sticking method by the film sticking device 1 can be improved.

[0070] In addition, compared with the covering of the resin film C on the accommodating portion B1 only by the suction of the second vacuum flow path 525, the reliability of the covering of the resin film C on the accommodating portion B1 can be improved.

[0071] Note that the heating process by process 1 (specifically, the heating of the resin film C used in the next molding process) and the molding process by process 5 are carried out simultaneously. As a result, compared with a structure in which the heating process by process 1 and the molding process by process 5 are carried out in different time zones, the operation of the film sticking device 1 can be simplified and speeded up.

[0072] Next, as shown in FIG. 11, in process 6, the blade portion 7 can complete the paper container portion B with the resin film by cutting the resin film C placed on the receiving guide 6 so as to be located on the outer peripheral side of the paper container portion B. Specifically, by moving the blade portion 7 downward so that the tip of the blade portion 7 comes into contact with the receiving guide 6, the surplus resin film C can be cut.

[0073] [Function and Effect] Next, the function and effect according to the present embodiment will be described.

[0074] The film pasting device 1 according to this embodiment pastes a resin film C onto a paper container part B (a container part made of a fibrous material). The film pasting device 1 includes a recess 521 in which an accommodation part B1 of the paper container part B (container part) is accommodated, a placement surface 522 formed on the outer peripheral side of the recess 521 on which a flange B2 of the paper container part B (container part) is placed, a step part 523 formed on the outer peripheral side of the placement surface 522, and a first vacuum flow path 524 having one end opening to the step part 523. The film pasting device 1 also includes an upper mold 51 having a flange presser 511 that presses the flange B2 via the resin film C, a mold frame 512 provided on the outer peripheral side of the flange presser 511 that presses the step part 523 via the resin film C, and a first compressed air flow path 513 formed between the flange presser 511 and the mold frame 512. The step part 523 is provided at a position lower than the placement surface 522 and has a step surface 523a that sandwiches the resin film C together with the mold frame 512. When the flange B2 and the step surface 523a are respectively pressed by the flange presser 511 and the mold frame 512, the air in the sealed space S formed by the resin film C located between the flange presser 511 and the mold frame 512, the outer edge part B22 protruding from the placement surface 522 of the flange B2 to the outer peripheral side, and the lower mold 52 is sucked through the first vacuum flow path 524 communicating with the sealed space S, and the compressed air from the first compressed air flow path 513 is applied above the resin film C located between the flange presser 511 and the mold frame 512.

[0075] The film pasting method according to this embodiment is implemented by the film pasting device 1 and includes a step 4 of pressing the flange B2 by the flange presser 511 and pressing the step surface 523a by the mold frame 512, and a step 5 of sucking the air in the sealed space S through the first vacuum flow path 524 and applying the compressed air from the first compressed air flow path 513 above the resin film C located between the flange presser 511 and the mold frame 512.

[0076] According to these configurations, by sucking the air in the sealed space S, the resin film C can be better wound around the flange B2 of the paper container part B (specifically, the lower surface of the outer edge part B22 of the flange B2) compared to suction in a structure where the sealed space S is not formed. As a result, the reliability of the winding part C1 that winds around the outer edge part B22 of the flange B2 can be improved.

[0077] Also, by utilizing the lowering of the mold frame 512 as the upper mold 51 descends, the sealed space S formed by the resin film C, the outer edge part B22, and the lower mold 52 located between the flange presser 511 and the mold frame 512 can be easily formed.

[0078] Also, by applying compressed air above the resin film C located between the flange presser 511 and the mold frame 512, the resin film C can be wound around the flange B2 of the paper container part B (specifically, the lower surface of the outer edge part B22 of the flange B2) better than in a structure where compressed air is not applied above the resin film C located between the flange presser 511 and the mold frame 512. As a result, the reliability of the winding part C1 that winds around the outer edge part B22 of the flange B2 can be further improved.

[0079] Also, in this embodiment, one end of the first vacuum passage 524 opens to the stepped surface 523a, and the outer edge part B22 covers one end of the first vacuum passage 524 in plan view.

[0080] According to this configuration, the resin film C can be better wound around the flange B2 of the paper container part B (specifically, the lower surface of the outer edge part B22 of the flange B2) compared to a structure where the outer edge part B22 does not cover one end of the first vacuum passage 524. As a result, the reliability of the winding part C1 that winds around the outer edge part B22 of the flange B2 can be improved.

[0081] In addition, in the present embodiment, the film laminating apparatus 1 further includes a conveying unit 2 that conveys the resin film C from the upstream side to the downstream side of the conveying path L, and a heater 3 (heating unit) that is provided upstream of the upper mold 51 and heats the resin film C. The heater 3 (heating unit) is provided above the resin film C.

[0082] According to this configuration, since the entire resin film C conveyed by the conveying unit 2 is uniformly heated to a temperature equal to or higher than the melting point, it is possible to easily form a resin film C suitable for the compressed air from the first compressed air flow path 513.

[0083] In addition, in the present embodiment, the film laminating apparatus 1 further includes a cooling frame 4 (receiving frame) provided upstream of the lower mold 52 so as to be located below the resin film C. The cooling frame 4 (receiving frame) is provided so as to be vertically movable.

[0084] According to this configuration, the resin film C that has been heated and softened can be supported by the cooling frame 4 that has moved to the support position (i.e., the uppermost position), thereby suppressing the drawdown of the resin film C.

[0085] In addition, in the present embodiment, the upper mold 51 further has a second compressed air flow path 514 located on the inner peripheral side of the flange retainer 511, and applies the compressed air from the first compressed air flow path 513 above the resin film C located between the flange retainer 511 and the mold frame 512, and applies the compressed air from the second compressed air flow path 514 above the resin film C located on the inner peripheral side of the flange retainer 511.

[0086] According to this configuration, it is possible to simultaneously perform the winding-in step of winding the resin film C around the outer edge portion B22 of the flange B2 and the covering step of covering the resin film C on the housing portion B1. As a result, the efficiency of the film laminating method by the film laminating apparatus 1 can be improved.

[0087] In addition, in the present embodiment, the lower mold 52 further has a second vacuum flow path 525 with one end opening to the concave portion 521, sucks the gas (air) in the sealed space S through the first vacuum flow path 524, and sucks the gas (air) located between the resin film C and the accommodating portion B1 through the second vacuum flow path 525.

[0088] According to this configuration, the winding step of winding the resin film C around the outer edge portion B22 of the flange B2 and the coating step of coating the resin film C on the accommodating portion B1 can be performed simultaneously. As a result, the efficiency of the film sticking method by the film sticking device 1 can be improved.

[0089] [Modification Example] Next, a modification example of the first vacuum flow path 524 will be described with reference to FIGS. 12 and 13. In the modification example, the points that coincide with the above-described embodiment will be omitted, and mainly the points that are different from the above-described embodiment will be described.

[0090] FIG. 12 is a cross-sectional view showing a first modification example of the first vacuum flow path 524. FIG. 13 is a cross-sectional view showing a second modification example of the first vacuum flow path 524.

[0091] In the present embodiment, the first vacuum flow path 524 is formed such that one end opens to the stepped surface 523a, but it is not limited thereto. For example, as shown in FIG. 12, it may be formed such that one end opens to the connection surface 523b, or as shown in FIG. 13, it may be formed such that both branched ends open to both the stepped surface 523a and the connection surface 523b.

[0092] As shown in Fig. 13, when both branched ends of the first vacuum flow path 524 are open to both the stepped surface 523a and the connection surface 523b, the resin film C can be brought into closer contact with the connection surface 523b and the lower surface of the outer edge portion B22 of the flange B2 by suction through the first vacuum flow path 524. Therefore, the resin film C can be more favorably wound around the flange B2 of the paper container portion B (specifically, the lower surface of the outer edge portion B22 of the flange B2). As a result, the reliability of the winding portion C1 that winds around the outer edge portion B22 of the flange B2 can be further improved.

[0093] As described above, the present embodiment has been explained. However, the above-described embodiment merely shows a part of the application examples of the present invention, and is not intended to limit the technical scope of the present invention to the specific configurations of the above-described embodiment.

Explanation of Reference Numerals

[0094] 1 Film sticking device 51 Upper mold 52 Lower mold 511 Flange presser 512 Mold frame 513 First compressed air flow path 521 Recess 522 Placing surface 523 Step portion 524 First vacuum flow path 523a Stepped surface B Paper container portion (container portion) C Resin film S Sealed space B1 Accommodating portion B2 Flange B22 Outer edge portion

Claims

1. A film pasting device for pasting a resin film onto a container part made of a fiber material, comprising a lower mold having a recess in which the accommodating part of the container part is accommodated, a mounting surface formed on the outer peripheral side of the recess on which the flange of the container part is placed, a step part formed on the outer peripheral side of the mounting surface, and a first vacuum flow path having one end opening to the step part; an upper mold comprising a flange presser for pressing the flange through the resin film, a mold frame provided on the outer peripheral side of the flange presser for pressing the step part through the resin film, and a first compressed air flow path formed between the flange presser and the mold frame; the step part is provided at a position lower than the mounting surface and has a step surface for sandwiching the resin film together with the mold frame, with the flange and the step surface being respectively pressed by the flange presser and the mold frame, the gas in the resin film located between the flange presser and the mold frame, the outer edge part protruding from the mounting surface of the flange to the outer peripheral side, and the sealed space formed by the lower mold is sucked through the first vacuum flow path communicating with the sealed space, and compressed air from the first compressed air flow path is applied above the resin film located between the flange presser and the mold frame; A film pasting device.

2. one end of the first vacuum flow path opens to the step surface, in a plan view, the outer edge part covers one end of the first vacuum flow path, The film pasting device according to claim 1.

3. further comprising a conveying part for conveying the resin film from the upstream side of the conveying path to the downstream side of the conveying path, and a heating part provided on the upstream side of the upper mold for heating the resin film, The film pasting device according to claim 1, further comprising: the heating part is provided above the resin film. The film pasting device according to claim 1.

4. Further comprising a receiving frame provided on the upstream side of the lower mold so as to be located below the resin film, The receiving frame is provided so as to be movable up and down. The film sticking device according to claim 3.

5. The upper mold further has a second compressed air flow path located on the inner peripheral side of the flange presser, Compressed air from the first compressed air flow path is applied above the resin film located between the flange presser and the mold frame, and compressed air from the second compressed air flow path is applied above the resin film located on the inner peripheral side of the flange presser. The film sticking device according to claim 1.

6. The lower mold further has a second vacuum flow path with one end opening into the recess, The gas in the sealed space is sucked through the first vacuum flow path, and the gas located between the resin film and the accommodating portion is sucked through the second vacuum flow path. The film sticking device according to claim 1.

7. A film sticking method implemented by the film sticking device according to any one of claims 1 to 6, A step of pressing the flange with the flange presser and pressing the step surface with the mold frame, A step of sucking the gas in the sealed space through the first vacuum flow path and applying compressed air from the first compressed air flow path above the resin film located between the flange presser and the mold frame. Film sticking method.

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