Insert module for electronic component and test tray comprising the same

Abstract

To provide an insert module for an electronic component, including: a pitch adjuster configured to allow an electronic component requiring a test to be seated thereon, and including one side electrically connected to connection pins of the electronic component and another side provided with electrical contact means at a second pitch wider than a first pitch of the connection pins; and a holder configured to be able to hold the seated electronic component.SOLUTION: The insert module for an electronic component and a test tray including the same are capable of accurate contact corresponding to a fine pitch of the electronic component, and can maintain precise contact during a test, thereby capable of improving the accuracy of the test.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an insert module for electronic components and a test tray including the same, and more particularly, to an insert module capable of testing electronic components having a fine pitch and a test tray including the same.

Background Art

[0002] HBM (High Bandwidth Memory) was developed mainly in response to the increasing demand for memory bandwidth generated by high-performance application programs such as computers and graphic processing units.

[0003] Existing GDDR (Graphics Double Data Rate) memory technology was widely used in high-performance graphics cards and systems, but has reached its limits due to the increasing bandwidth requirements. Therefore, memory manufacturers have been required to develop new technologies that can provide higher bandwidth and process data more efficiently.

[0004] To meet such requirements, HBM adopted an innovative design that forms a memory chip stack. HBM can achieve high bandwidth using vertically stacked memory chips, and can provide advantages of occupying less space and reducing power consumption. Such characteristics have become the background for HBM to attract attention as the importance of memory bandwidth and power efficiency becomes even greater in high-performance computing and graphic processing systems.

[0005] Such HBM needs to be tested in the die state before packaging. HBM dies are provided with far more contacts than existing memories, and many contacts are provided with a fine pitch in a limited area. However, conventional test handlers have a problem that it is difficult to make fine pitch contacts for testing HBM.

Prior Art Documents

Patent Document

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] An object of the present invention is to provide an insert module for an electronic component that can quickly and accurately perform a test on a semiconductor having a conventional fine pitch, and a test tray including the same.

Means for Solving the Problems

[0008] As a means for solving the above problems, there is provided an insert module for an electronic component, which is configured such that an electronic component that needs to be tested can be seated, one side is electrically connected to a connection pin of the electronic component, and the other side is provided with electrical contact means having a second interval wider than a first interval of the connection pins, and a fixing part configured to be able to fix the seated electronic component.

[0009] Here, the electronic component is a High Bandwidth Memory.

[0010] On the other hand, the pitch adjustment part is configured to be electrically connected to the connection pin at a plurality of points.

[0011] Furthermore, the first interval is 0.5 mm or less.

[0012] On the other hand, the second interval is configured to be 2 to 10 times the first interval.

[0013] In addition, the pitch adjustment part includes a plurality of first pins arranged at the first interval and a plurality of second pins arranged at the second interval.

[0014] On the one hand, the first pin is configured to have a width of 0.2 mm or less.

[0015] Also, the second pin is configured to have a diameter of 0.3 mm to 3 mm.

[0016] On the one hand, the pitch adjustment part further includes a pitch adjustment block provided between the first pin and the second pin, and the pitch adjustment block includes a plurality of conductors that electrically connect the first pin and the second pin respectively.

[0017] On the one hand, at least a part of the conductor is provided in an inclined manner.

[0018] On the one hand, the fixing part includes an upper block with a central hole formed so that an electronic component can pass through, and a lower block configured so that a pitch adjustment part can be provided at the center.

[0019] On the one hand, the fixing part further includes a latch link that further includes a latch, one side of which is rotatably connected to the upper block and the other side is rotatably connected to the lower block.

[0020] On the one hand, the latch link is configured to be pivoted upward when the upper block approaches the lower block.

[0021] Furthermore, the latch link includes a latch part, and the latch part includes a pressing part, one side of which is rotatably connected to the upper block and the other side is configured to be able to press the upper part of the electronic component.

[0022] On the one hand, it is further provided between the upper block and the lower block and further includes at least one elastic part that provides a restoring force so that the upper block can be returned to its original position.

[0023] Also, the pressing part further includes a heat pad provided at the end in contact with the electronic component.

[0024] Additionally, it includes a board configured such that the lower part can be electrically connected to a tester, an insert module configured such that electronic components can be mounted and fixed during testing, and a base frame configured such that a plurality of insert modules can be arranged. The insert module is configured such that electronic components can be seated, one side is electrically connected to the connection pins of the electronic components, the other side is provided with a pitch adjustment part having electrical contact means with a second interval wider than the first interval of the connection pins, and a fixing part configured such that the seated electronic components can be fixed. A test tray for electronic components is provided.

[0025] Here, the sub-trays are composed of a plurality and arranged on the board.

[0026] On the other hand, the sub-tray is configured to be detachable from the board.

Advantages of the Invention

[0027] The insert module for electronic components and the test tray including the same according to the present invention can achieve accurate contact corresponding to the fine pitch of the electronic components and can precisely maintain the contact during testing, so that the accuracy of the test can be improved.

[0028] Also, during testing, damage to the die before packaging can be prevented.

[0029] Furthermore, since additional alignment of the electronic components immediately before testing is not required, rapid testing and classification are possible.

Brief Description of the Drawings

[0030]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6a

Figure 6b

Figure 7

Figure 8a

Figure 8b

Figure 8c

Figure 8d

Figure 8e

Figure 8f

Figure 8g

Figure 8h

Mode for Carrying Out the Invention

[0031] Hereinafter, with reference to the accompanying drawings, an insert module for electronic components according to an embodiment of the present invention and a test tray including the same will be described in detail. In the description of the following embodiments, the names of the respective components can be called by other names in the art. However, if there is functional similarity and identity, even if a modified embodiment is adopted, it can be regarded as an equivalent configuration. In addition, the reference numerals added to the respective components are described for convenience of explanation. However, the illustrated content on the drawings with these reference numerals does not limit the respective components within the scope of the drawings. Similarly, even if an embodiment in which the configuration on the drawings is partially modified is adopted, if there is functional similarity and identity, it can be regarded as an equivalent configuration. In addition, in view of the general technical level of those skilled in the art, when a component that should be naturally included is recognized, the description thereof will be omitted.

[0032] Hereinafter, with reference to FIGS. 1 to 2, a test tray for electronic components including an insert module for electronic components according to an embodiment of the present disclosure will be described.

[0033] FIG. 1 is a perspective view of a test tray for electronic components according to an embodiment of the present disclosure, and FIG. 2 is an exploded perspective view of a sub-tray in an embodiment of the present disclosure.

[0034] Referring to FIGS. 1 and 2, a test handler for electronic components according to an embodiment of the present disclosure is configured to be transferred with a plurality of electronic components loaded on an insert module 100. Further, it is configured to be able to execute a test with electronic components loaded on the insert module 100. The test can be executed with equipment called a so-called "handler" that executes a performance test under specific temperature conditions and classifies by grade.

[0035] A test tray 1 for electronic components according to an embodiment of the present disclosure includes an insert module 100 and a board 13.

[0036] The insert module 100 is configured to be arranged on the board 13. The insert module can be coupled to the board at positions determined by the frame. The board is provided for electrical connection between the insert module and an external test head. The board is configured to include a predetermined circuit. As an example, when the test tray is transferred to the test site and operates in relation to the tester, the lower side of the board can be electrically contacted with the interposer of the external test head.

[0037] As an example, the insert module can be provided on the sub-tray 10 provided in plurality on the test tray 1. The sub-tray 10 is composed of a plurality and is configured to be detachable from the board.

[0038] In this case, the sub-tray is configured to be detachable from the upper side of the board. That is, if necessary, tests can be executed with one or more sub-trays 10 coupled to the board. Also, if necessary, the test tray 1 can wait at a separate location and only the sub-tray 10 can be transferred to a position where electronic components are loaded or unloaded. The sub-tray 10 can be coupled to the board after the electronic components for the test are loaded, or separated from the board to unload the electronic components for which the test has been completed and transferred separately from the board. At this time, for the coupling and release between the sub-tray 10 and the board, well-known selective fastening elements can be applied.

[0039] The sub-tray 10 can include a first base frame 11 and a second base frame 12 in which spaces are formed in a predetermined pattern. The first base frame 11 and the second base frame 12 are coupled in the vertical direction and are configured such that a predetermined number of insert modules can be coupled. Electronic components can be mounted on each of the insert modules 100. The mounted electronic components can be in electrical contact with the insert modules 100. Each of the insert modules 100 can be electrically connected to a board 13. That is, the electronic components can be electrically connected to a tester via the insert modules 100 and the board 13.

[0040] However, the configuration of the sub-tray described above can be selectively applied. As an example, the sub-tray can be omitted, and the first base frame and the second base frame can be deformed so that a plurality of insert modules can be in direct contact with the board.

[0041] Also, the sub-tray itself can be deformed to be used as a test tray.

[0042] In this case, the fastening elements for releasing the connection between the sub-tray 10 and the board can also be omitted. That is, the test tray is configured to include insert modules, a frame, and a board.

[0043] The insert module 100 is configured to securely fix the position of the electronic components during the transfer or testing of the test tray 1. At this time, when the electronic components are fixed to the insert module 100, the contact terminals of the electronic components can be respectively connected to the electrical contact means of the insert module 100.

[0044] On the one hand, in the present disclosure, an "electronic component" is composed of a so-called "Fine pitch" in which contact terminals are precisely arranged. In the present disclosure, the electronic component is a memory semiconductor. In particular, in the present disclosure, the electronic component is a high bandwidth memory with contact terminals having a Fine pitch.

[0045] Hereinafter, with reference to FIGS. 3 to 8h, the insert module 100 according to another embodiment of the present disclosure and its operation will be described.

[0046] FIG. 3 is a perspective view of an insert module 100 for an electronic component according to another embodiment of the present disclosure, and FIG. 4 is an exploded perspective view of the insert module 100 for an electronic component according to another embodiment of the present disclosure.

[0047] Referring to FIGS. 3 and 4, the insert module 100 for an electronic component according to another embodiment of the present disclosure is configured to be able to load and selectively fix each electronic component.

[0048] When the contact terminals of the electronic component are finely arranged, it can become an excessive burden for alignment when contacting the tester. Also, the handler tests the electronic components simultaneously for efficient operation. At this time, when precisely aligning and connecting a large number of electronic components to the tester at the same time, a lot of time is required, increasing the complexity of the equipment.

[0049] In the present disclosure, the insert module 100 can be provided with connection means extended to a pitch larger than the pitch of the contact terminals of the loaded electronic component. In the present disclosure, the insert module 100 is arranged at a wider interval in a state where the electronic component is fixed, and by providing strong connection means, the connection to the tester can be facilitated.

[0050] In the present disclosure, the insert module 100 can include a fixing part 300 and a pitch adjusting part 200.

[0051] The fixing part 300 and the pitch adjustment part 200 are configured to be vertically coupled. The fixing part 300 and the pitch adjustment part 200 are coupled to each other to form a socket. One electronic component can be loaded into the socket. The fixing part 300 can include a hole opened vertically at the central part, and the electronic component can be loaded or unloaded through the hole. Also, the pitch adjustment part 200 can be provided below the hole.

[0052] The fixing part 300 can include an upper block 310, a lower block 320, a latch link 330, and an elastic part 340. The upper block 310 and the lower block 320 can be coupled to reciprocate vertically by a predetermined length.

[0053] The pivot angle of the latch link 330 is configured to be adjustable according to the distance between the upper block 310 and the lower block 320. The latch link 330 is configured symmetrically, and each end is configured to press the upper part of the device loaded in the socket.

[0054] The latch link 330 can include a latch part 331 and a link 335. The latch part 331 is configured to include a connecting part 332 and a pressing part 333. The connecting part 332 is configured to be coupled to the upper block 310 with a first connecting pin 336 on one side of the latch link 330. The pressing part 333 is configured to press the upper part of the electronic component on the other side of the latch link 330. A heat pad 334 can be provided on the pressing part 333 so as to minimize the influence of heat when pressing the upper stage part of the electronic component. At this time, the heat conditions applied during the test of the electronic component can be, for example, from -100 degrees Celsius to 200 degrees Celsius. However, it is not limited to this, and in some cases, the test can be performed under temperature conditions outside the above-mentioned range.

[0055] One side of the link 335 can be coupled to the lower block 320 by a connecting pin. The other side of the link 335 can be rotatably coupled to the middle portion of the latch link 330 by a second connecting pin 337.

[0056] On the other hand, the operation of the latch link 330 can be geometrically determined in advance. In the present disclosure, when the upper block 310 descends to the position closest to the lower block 320, the fixed portion 300 of the latch portion 331 is configured to be rotatable upward by 90 degrees or more.

[0057] In contrast, when an external force is removed and the upper block 310 returns to a position far from the lower block 320, the latch link 330 pressurizes the upper stage of the electronic component while the angle is adjusted in the opposite 90-degree direction.

[0058] On the other hand, the pressing portions 333 provided on the pair of latch links 330 can be formed with recesses at the portions facing each other in the closed position. The recessed structure of the pressing portion 333 is for preventing interference with the PNP device when the PNP device closes the socket with the electronic component precisely aligned in the socket. The recessed structure is configured to have a size that does not contact the PNP device even when the latch portion 331 pivots.

[0059] The elastic portion 340 is configured to provide a restoring force to the latch. The elastic portion 340 is provided at a plurality of points between the upper block 310 and the lower block 320 and provides a restoring force upward with respect to the upper block 310.

[0060] The pitch adjustment unit 200 is configured to be able to expand the electrical contact position with the electronic component fixed.

[0061] The pitch adjustment unit 200 includes a first pin 210, a pitch extension block, and a second pin fixing block 230. The pitch extension block includes a conductor 221, and the second pin fixing block 230 includes a second pin 231. The first pin 210, the conductor 221, and the second pin 231 can be electrically connected. When the second pin 231 is electrically connected to an external tester, the electronic component loaded on the socket can also be electrically connected. On the other hand, when the positions and arrangements of the contact terminals of the electronic component change, the configurations of the first pin 210, the conductor 221, and the second pin 231 of the pitch adjustment unit 200 can change.

[0062] The first pin 210 can be arranged to have a contact cross-sectional area suitable for the fine pitch of the electronic component. As an example, the first pin 210 is configured in a plate form. However, this is only an example, and it can be implemented in various configurations that can achieve fine pitch.

[0063] However, although an example in which the pitch adjustment unit is configured by blocks has been described, it can be implemented in a thin structure in which the minimum distance between the electrical contact means for contacting the tester can be extended. As an example, the pitch adjustment unit can be configured in a thin structure such as a multilayer circuit or a glass substrate. The thinness of the pitch adjustment unit means that the length of the physical electrical connection between the HBM memory and the tester can be shortened. When the length of the physical electrical connection is shortened, the substantial response time can be shortened. Such a tendency can increase as the operating frequency increases.

[0064] FIG. 5 is a cross-sectional view of the pitch adjustment unit 200 in the insert module 100 for an electronic component according to another embodiment of the present disclosure. FIG. 6a shows an enlarged view of part I in FIG. 5, and FIG. 6b shows an enlarged view of part II in FIG. 5.

[0065] Referring to FIGS. 5, 6a, and 6b, the first pins 210 can be arranged on a plane so as to be in contact with the contact terminals of the electronic component respectively. At this time, the number of the first pins 210 can be provided corresponding to the number of the contact terminals of the electronic component. Also, the first pins 210 can be arranged in the same manner as the contact terminals arranged on the electronic component. That is, the pitch of the first pins 210 can be configured in the same manner as the pitch of the electronic component. In other words, the upper portions of the contact terminals of the electronic component and the first pins can be formed in the same pattern. However, although the configuration in which the first pins 210 are arranged at the first pitch (P1) has been described, this is merely an example, and when the contact terminals of the electronic component are connected at various pitches, they can be arranged at various pitches accordingly.

[0066] On the other hand, in the present disclosure, the first interval P1 between the first pins 210 can be 0.5 mm or less. In some cases, the first interval can be 0.2 mm or less. Also, the thickness of the first pins 210 can be 0.2 mm or less. Further, the width of the electrical contact portion of the first pins can be 0.05 mm or less. As an example, the first interval between the first pins corresponding to the pitch of the mass-produced HBM die can be selected from between 0.09 mm and 0.165 mm.

[0067] The second block can be provided with a plurality of second pins 231. The plurality of second pins 231 can be arranged at a second interval P2 wider than the first interval P1. The second pins 231 are configured to be electrically connected to the electrical contact means of the board. The second pins 231 can be provided to penetrate the second pin fixing block 230 in the vertical direction. The second pins 231 are configured such that reliable electrical contact can be made while minimizing damage even when repeatedly contacting an external board. On the other hand, the second interval P2 is configured to be 0.3 mm to 3 mm. At this time, the thickness of the second pins 231 is configured to be 0.1 mm to 3 mm.

[0068] On the one hand, the second interval P2 is configured to be extended from the first interval P1. As an example, the second interval can be enlarged within a range from 1.1 times to 20 times that of the first interval.

[0069] The second pin 231 is composed of, for example, a pogo pin. A pogo pin is formed with a space inside, and a pair of pins with one side open are joined to each other in the longitudinal direction. When an elastic body is provided inside the pogo pin and a compressive force is generated in the vertical direction, the overall length can be shortened accordingly. That is, the length can be adjusted according to an external force, and the electrical connection can be maintained even when the length changes. Therefore, even when the insert module 100 contacts the board roughly, the pogo pin can be stably maintained while minimizing the impact. Also, wear and the like can be prevented even with repeated use, and the best performance can be exhibited for a long time.

[0070] The pitch adjustment block 220 is configured to be able to adjust the pitch between the first pin 210 and the second pin fixing block 230. The pitch adjustment block 220 can be provided with a plurality of conductors 221. At least a part of the conductors 221 can be arranged in an inclined path within the pitch adjustment block 220. The upper stage of the conductor 221 can be exposed at the upper stage of the pitch adjustment block 220, and the lower stage can be exposed at the lower stage of the pitch adjustment block 220. The upper stage of the conductor 221 can be electrically contacted with the first pin 210. Also, the lower stage of the conductor 221 can be electrically contacted with the second pin 231 of the second pin fixing block 230.

[0071] The conductors 221 can be arranged three-dimensionally within the pitch adjustment block 220. The conductors 221 can be arranged at a wider pitch generally going downward within the pitch adjustment block 220.

[0072] On the one hand, in the above-described embodiment, an example in which the first pins are arranged at the first interval is illustrated. However, the minimum interval between adjacent first pins can be arranged at the first interval. Further, the first pins can be arranged at various intervals wider than the first interval, if necessary. At this time, the minimum interval between adjacent second pins is arranged at the second interval, and in this case as well, the second interval is configured to be larger than the first interval.

[0073] FIG. 7 shows the pitches of the first pins 210 and the second pins 231 in the insert module 100 for electronic components according to another embodiment of the present disclosure.

[0074] Referring to FIG. 7, the second pins 231 can be provided at an interval wider than that of the first pins 210. Therefore, when the electronic components are accurately loaded onto the insert module 100, high precision is not required for subsequent electrical contact. Such a configuration can also speed up the bonding process because the insert increases the margin for alignment error on the base frame.

[0075] The insert module 100 for electronic components according to the present disclosure can be fixed and transferred in a non-packaged die state, so that damage can be prevented during the transfer of the test tray 1 or pressurization for testing. Further, when the pitch adjustment unit and the contact terminals of the electronic components are electrically connected in advance, the electrical connection is maintained until unloading. Therefore, since it is not necessary to repeat the connection, deformation or breakage of the contact terminals of the electronic components can be prevented.

[0076] Hereinafter, with reference to FIGS. 8A to 8H, the operation of the insert module 100 for electronic components and the test tray 1 according to an embodiment of the present disclosure will be described.

[0077] For the sake of convenience in explanation, the operation when the electronic component 1000 is loaded onto the insert module 100 will be described. However, this is merely an example, and during unloading, it can operate in the reverse manner. Also, only one side of one insert module 100 is shown, but this is just an example, and the hand can pick up a plurality of electronic components simultaneously and load them onto the insert module 100 respectively at the same time. Similarly, during unloading, a plurality of electronic components can be unloaded simultaneously.

[0078] Figures 8a, 8b, 8c, 8d, 8e, 8f, 8g, and 8h are usage state diagrams of the insert module 100 for electronic components according to an embodiment of the present disclosure.

[0079] Referring to Figure 8a, the test tray 1 is transferred to the loading position and temporarily fixed. At this time, the picker (or hand) 2000 can pick up the electronic component 1000 from a user tray (not shown) and transfer it to the upper part of the test tray 1. The picker 2000 can be provided with a suction part 2200 and a picker pusher 2100 for the electronic component 1000. The suction part 2200 is configured to be able to move up and down independently of the picker pusher 2100.

[0080] Referring to Figure 8b, the picker pusher 2100 descends and contacts the upper block 310 of the insert tray.

[0081] Referring to Figure 8c, while the picker pusher 2100 descends, it can press the upper block 310. At this time, while force is transmitted to the latch link 330, the pressurizing part 333 rotates upward.

[0082] Referring to FIG. 8d, when the picker pusher 2100 further presses the upper block 310, the latch link 330 is fully opened. On the other hand, the picker 2000 can be provided with a vision system. The picker 2000 can detect the relative position between the socket and the electronic component 1000 using the vision system, and can precisely align the horizontal position of the electronic component 1000.

[0083] Referring to FIG. 8e, when the position of the electronic component 1000 is aligned with the horizontal position of the first pin 210, the suction part 2200 descends to place the electronic component 1000 on the upper surface of the first pin 210.

[0084] Referring to FIG. 8f, with the suction part 2200 fixing the position while placing the electronic component 1000 on the upper surface of the first pin 210, the picker pusher 2100 is raised. As the picker pusher 2100 is raised, the latch link 330 is gradually closed.

[0085] Referring to FIG. 8g, when the picker pusher 2100 rises and moves away from the pressing part 333, the latch link 330 is fully closed and presses the upper surface of the electronic component 1000. At this time, even when the latch link 330 rotates from the opened position to the closed position, due to its sunken structure, it does not interfere with the suction part 2200.

[0086] Referring to FIG. 8h, the position of the electronic component 1000 is fixed to the socket by the latch link 330, and the loading operation of the electronic component 1000 is completed while the suction part 2200 and the picker pusher 2100 rise.

[0087] As described above, the electronic components loaded on the insert move to the tester with their positions aligned and the connecting pins electrically connected to the test tray. Also, while the state where the electronic components are electrically connected to the test tray is maintained, the test tray can be electrically connected to the tester.

[0088] When the test tray is electrically connected to the tester, electrical contact is made between the electrical contact means of the test tray and the tester, and since it does not require excessive precision, the contact can be made quickly.

[0089] As described above, the insert module for electronic components and the test tray including the same according to the present invention can make accurate contact corresponding to the fine pitch of the electronic components, and can use pins with an extended pitch for performing the test. Therefore, damage to the electronic components before packaging can be minimized. Also, since no additional alignment of the electronic components immediately before the test is required, a quick test is possible.

Explanation of Reference Numerals

[0090] 1 Test tray for electronic components 10 Sub-tray 11 First base frame 12 Second base frame 13 Substrate 100 Insert module 200 Pitch adjustment section 210 First pin P1 First pitch 220 Pitch adjustment block 221 Conductor 230 Second pin fixing block 231 Second pin P2 Second pitch 300 Fixing section 310 Upper block 320 Lower block 340 Elastic section 330 Latch link 331 Latch section 332 Connecting section 333 Pressing section 334 Heat pad 335 Link 336 First connecting pin 337 Second connecting pin 1000 Electronic component 2000 Picker 2100 Picker Pusher 2200 Suction Part

Claims

1. a pitch adjusting part configured to seat an electronic component requiring testing, the pitch adjusting part having one side electrically connected to a connecting pin of the electronic component and the other side provided with electrical contact means having a second interval wider than a first interval of the connecting pin; and A fixing portion configured to fix the seated electronic component.

2. 2. The electronic component insert module of claim 1, wherein the electronic component is a high bandwidth memory.

3. The electronic component insert module according to claim 2 , wherein the pitch adjusting portion is configured to be electrically connected to the connecting pin at a plurality of points.

4. 4. The electronic component insert module according to claim 3, wherein the first gap is 0.5 mm or less.

5. 5. The electronic component insert module according to claim 4, wherein the second interval is configured to be two to ten times larger than the first interval.

6. The pitch adjustment unit is a plurality of first pins arranged at the first intervals; and 4. The electronic component insert module according to claim 3, further comprising: a plurality of second pins arranged at said second intervals.

7. 7. The electronic component insert module according to claim 6, wherein the first pin has a width of 0.2 mm or less.

8. 7. The electronic component insert module according to claim 6, wherein the second pins have a diameter of 0.3 mm to 3 mm.

9. The pitch adjustment unit further includes a pitch adjustment block provided between the first pin and the second pin, 7. The electronic component insert module according to claim 6, wherein the pitch adjustment block includes a plurality of conductors electrically connecting the first pins and the second pins, respectively.

10. The electronic component insert module according to claim 9 , wherein the conductor is at least partially inclined.

11. The fixing portion is an upper block having a center hole through which the electronic component can pass; 7. The electronic component insert module according to claim 6, further comprising a lower block configured to have the pitch adjustment portion at its center.

12. The fixing portion is The electronic component insert module of claim 11 , further comprising a latch link, one side of which is rotatably connected to the upper block and the other side of which is rotatably connected to the lower block.

13. 13. The electronic component insert module of claim 12, wherein the latch link is configured to pivot upward when the upper block approaches the lower block.

14. The latch link includes a latch portion, The electronic component insert module according to claim 13 , wherein the latch portion includes a pressing portion configured such that one side of the latch portion is rotatably connected to the upper block and the other side of the latch portion is capable of applying pressure to the upper portion of the electronic component.

15. The electronic component insert module according to claim 14 , further comprising at least one elastic portion provided between the upper block and the lower block for providing a restoring force to enable the upper block to return to its original position.

16. The electronic component insert module according to claim 13 , wherein the pressure unit further comprises a thermal pad provided on an end portion that contacts the electronic component.

17. a board configured such that a lower portion can be electrically connected to a tester; an insert module configured to allow an electronic component to be loaded and secured during testing; and a base frame configured to allow a plurality of the insert modules to be arranged; The insert module includes: a pitch adjusting part configured to seat the electronic component, one side of which is electrically connected to the connecting pin of the electronic component and the other side of which is provided with electrical contact means having a second interval wider than the first interval of the connecting pin; and A test tray for electronic devices comprising: a fixing portion configured to fix the seated electronic device.

18. 20. The electronic device test tray according to claim 17, further comprising a sub-tray, the lower portion of which is configured to be electrically connected to the board and configured to allow a plurality of the insert modules to be arranged thereon.

19. 20. The electronic device test tray according to claim 18, wherein the sub-tray is configured to be detachable from the board.

20. 18. The electronic component test tray of claim 17, wherein the electronic components are High Bandwidth Memory (HBM).

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