Package for housing electronic component, multi-cavity wiring board, and electronic device

Abstract

To reduce the possibility of short circuit when the height of a package for housing an electronic component is reduced.SOLUTION: A package for housing an electronic component comprises an insulating substrate having a first surface 102, connection electrodes 114, an external connection conductor 108, and corner conductors 109. Each of the corner conductors is connected to the external connection conductor, is located in such a manner that the interval between a second surface 103 located on the opposite side of the first surface and the corner conductor increases from the external connection conductor up to a corner part, and has an opening 109A surrounding an intersection of a virtual line X connecting a point closest to the apex of the connection electrode located closest to the corner conductor and the apex, and the corner conductor.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present disclosure relates to an electronic component storage package for housing electronic components such as piezoelectric vibration elements, a multi-pin wiring board, and an electronic device.

Background Art

[0002] Prior art document 1 discloses an electronic component storage package. The electronic component storage package has a corner conductor that is positioned from an external connection conductor to a corner located between two side surfaces of an insulating substrate so that the distance from the second surface increases.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] One aspect of the present disclosure reduces the possibility of short circuit when the height of the electronic component storage package is reduced.

Means for Solving the Problems

[0005] A package for storing electronic components according to one aspect of the present disclosure includes an insulating substrate having a mounting area for mounting electronic components, a first surface opposite to the first surface, a plurality of side surfaces when the first surface is the upper surface, a corner formed by two of the side surfaces, and a top that is an intersection of the corner and the second surface, a plurality of connection electrodes located on the first surface, an external connection conductor located on the second surface, and a corner conductor connected to the external connection conductor and positioned such that the distance from the external connection conductor to the corner increases with respect to the second surface. The corner conductor has an opening surrounding an intersection of a virtual line connecting a point closest to the top in the connection electrode closest to the corner conductor and the top, and the corner conductor.

[0006] A multi-piece wiring board according to one aspect of the present disclosure has a plurality of wiring board areas serving as the above-described packages for storing electronic components arranged on a mother board.

[0007] An electronic device according to one aspect of the present disclosure includes the above-described package for storing electronic components and an electronic component mounted on the package for storing electronic components.

Advantages of the Invention

[0008] According to one aspect of the present disclosure, the possibility of short circuit when the package for storing electronic components is made low-profile can be reduced.

Brief Description of the Drawings

[0009]

Figure 1

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Embodiments for Carrying Out the Invention

[0010] 〔Embodiment 1〕 The electronic component storage package and the like according to the first embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. The drawings used in the following description are schematic. The dimensional ratios and the like of each part on the drawings do not necessarily match the actual ones.

[0011] The distinction between up and down in the following description is for convenience and does not limit the up and down when the electronic component storage package and the electronic device are actually used. In this specification, in the electronic component storage package, the surface on which the piezoelectric vibration element is mounted is defined as the upper surface. Also, in the drawings, the positive direction of the Z-axis is the upward direction. The X-axis direction is the major axis direction of the package, and the Y-axis is an axis that intersects perpendicularly to the X-axis and the Z-axis.

[0012] FIG. 1 is a top view of an exemplary electronic component storage package (hereinafter referred to as package 100) according to the present disclosure. FIG. 2 is a bottom view of package 100. FIG. 3 is a side perspective view of package 100 shown in FIG. 1. FIG. 4 is an enlarged partial view corresponding to region R1 in FIG. 3. FIG. 5 is a top perspective view showing the main part of package 100. FIG. 6 is a bottom perspective view of package 100. FIG. 7 is an enlarged partial view corresponding to region R2 in FIG. 5. FIG. 8 is a perspective view showing the main part of package 100 and shows the corner conductor 109 as viewed from the direction of the white arrow in FIG. 7. The package 100 of the present disclosure can be used, for example, as a wiring board for mounting electronic components such as piezoelectric vibration elements or semiconductor elements.

[0013] The package 100 of the present disclosure has an insulating substrate 101 and wiring conductors located on the surface and inside of the insulating substrate 101. The insulating substrate 101 has a first surface 102 (upper surface), a second surface 103 (lower surface), a first side surface 105A, and a second side surface 105B.

[0014] The first surface 102 has a mounting area 102A for mounting electronic components. The second surface 103 is a surface located on the opposite side of the first surface 102 and is a mounting surface on the module substrate. The first side surface 105A connects the first surface 102 and the second surface 103. More specifically, the first side surface 105A is a side surface that connects the long sides of the rectangular first surface 102 and the second surface 103. The second side surface 105B connects the first surface 102 and the second surface 103 and is a surface continuous with the first side surface 105A. More specifically, the second side surface 105B is a side surface that connects the short sides of the first surface 102 and the second surface 103. The first side surface 105A and the second side surface 105B may be collectively referred to as the side surface 105.

[0015] As shown in FIG. 7, the insulating substrate 101 has a corner portion 105C (ridge angle) formed by the first side surface 105A and the second side surface 105B, and a top portion 105D that is the intersection of the corner portion 105C and the second surface 103.

[0016] As shown in FIG. 4, the insulating substrate 101 may have a base portion 107 and a frame portion 106. The base portion 107 may be a flat insulator having the first surface 102 including the mounting area 102A and the second surface 103 located opposite to the first surface 102. The base portion 107 may have, for example, a rectangular shape in plan view. The two-dot chain line shown in FIG. 1 shows the outer edge of the piezoelectric vibration element, which is an example of an electronic component, as a virtual line when the piezoelectric vibration element is arranged in the package 100. The mounting area 102A of the package 100 may be an area that overlaps the piezoelectric vibration element when viewed in plan in the package 100. That is, it may be the area indicated by the two-dot chain line in FIG. 1. Alternatively, the mounting area 102A may be an area surrounded by a virtual line connecting alignment marks (not shown) used when arranging the piezoelectric vibration element. The mounting area 102A can be defined according to the size of the electronic component to be mounted.

[0017] The frame portion 106 is located on the first surface 102 so as to surround the mounting area 102A. In a plan view, the outer edge of the frame portion 106 may overlap with the outer edge of the insulating substrate 101. By having the base portion 107 and the frame portion 106, the insulating substrate 101 has a cavity 104 whose inner wall is defined by the first surface 102 and the inner surface of the frame portion 106. The mounting area 102A may be located at the bottom of the cavity 104.

[0018] The planar size of the package 100 according to the present disclosure may be, for example, a long side of 1.2 mm or less and a short side of 1.0 mm or less, a long side of 1.0 mm or less and a short side of 0.8 mm or less, or a long side of 0.8 mm or less and a short side of 0.6 mm or less. The thickness of the package 100 according to the present disclosure may be, for example, 0.2 mm or less, 0.15 mm or less, or 0.1 mm or less. The height of the base portion 107 according to the present disclosure may be, for example, 0.1 mm or less, 0.075 mm or less, or 0.05 mm or less. The height of the frame portion 106 according to the present disclosure may be, for example, 0.1 mm or less, 0.75 mm or less, or 0.05 mm or less.

[0019] The base portion 107 and the frame portion 106 may be made of an insulating inorganic material. The insulating inorganic material includes, for example, ceramic materials such as aluminum oxide sintered bodies (alumina ceramics), aluminum nitride sintered bodies, mullite sintered bodies, or glass ceramic sintered bodies. The base portion 107 and the frame portion 106 may be integrally formed, or may be composed of a plurality of laminated insulating layers or one insulating layer.

[0020] As shown in FIGS. 1, 3, and 4, the wiring conductors included in the package 100 include connection electrodes 114, internal wirings 117, external connection conductors 108, corner conductors 109, and a frame-shaped metallization layer 113. The internal wiring 117 includes a wiring layer 117A and a through conductor 117B, which will be described later. In each of the attached drawings, the wiring conductors are hatched with dots.

[0021] The connection electrode 114 is an electrode that is electrically connected to the terminals of the electronic component mounted on the package 100. The connection electrodes 114 are paired, and at least a part of each connection electrode 114 is located within the mounting area 102A. As shown in the enlarged view of FIG. 4, the connection electrode 114 may include a metallized layer 114A as a wiring conductor and a plating layer 114B deposited on the metallized layer 114A. The plating layer 114B may be a layer containing nickel and / or gold. For example, nickel plating may be applied to the exposed surface of the metallized layer 114A, and gold plating may be applied on this nickel plating layer. Thereby, the possibility of oxidation corrosion on the surface of the wiring conductor can be reduced.

[0022] At least a part of the metallized layer 114A may be buried in the base 107. By having at least a part of the metallized layer 114A buried in the base 107, the bonding strength with the base 107 is improved and further thinning is possible. The upper surface of the metallized layer 114A may be flush with the first surface 102. The plating layer 114B is easy to form with high precision at a thin thickness. Since the upper surface of the metallized layer 114A is flush with the bottom surface of the first surface 102, the protrusion height of the connection electrode 114 from the bottom surface of the first surface 102 is determined only by the thickness of the plating layer 114B, so the height accuracy can be further improved and contribute to further thinning.

[0023] In FIG. 1, a pair of connection electrodes 114 are respectively located at two corner portions located at both ends of one short side of the rectangular mounting area 102A. If the electronic component 112 is a piezoelectric vibration element, usually its outer shape is rectangular in plan view, and a pair of electrodes (not shown) for connection are provided at the corner portions of its surface. Since the connection electrodes 114 are biasedly located at the corner portions of the mounting area 102A, such electrodes can be easily connected to the connection electrodes 114.

[0024] The number and arrangement of the connection electrodes 114 described above are those in the case where a piezoelectric vibration element is used as the electronic component. The number and arrangement of the connection electrodes 114 can be set according to the number and arrangement of the electrodes of the electronic component to be mounted and the number of the electronic components 112 to be mounted.

[0025] As shown in FIG. 6, the external connection conductor 108 includes a first external connection conductor 108A and a second external connection conductor 108B. As shown in FIG. 6, the first external connection conductor 108A and the second external connection conductor 108B are each located on the second surface 103. The first external connection conductor 108A is an electrode that is electrically connected to the connection electrode 114. The number of the connection electrodes 114 and the number of the first external connection conductors 108A may be the same, and each connection electrode 114 may be connected to a different first external connection conductor 108A. The second external connection conductor 108B is an electrode that is electrically connected to a lid 116 (see FIGS. 25 and 26) described later.

[0026] In a plan view, the external connection conductor 108 may be, for example, rectangular such as a square shape or a rectangular shape, and two adjacent sides may be located at positions overlapping two sides of the second surface 103. In a plan view, the external connection conductor 108 may be located at a position separated inward from the periphery of the second surface 103. The first external connection conductor 108A and the second external connection conductor 108B may each be located at a corner along the diagonal of the second surface 103. Alternatively, the first external connection conductor 108A and the second external connection conductor 108B may each be located at a corner along the short side direction of the package 100. The first external connection conductor 108A and the second external connection conductor 108B may extend from the second surface 103 of the base 107 to the side surface (including the corner between the side surfaces).

[0027] The external connection conductor 108 is made of a metal material such as tungsten, molybdenum, manganese, copper, gold, palladium, platinum, nickel, or cobalt. The external connection conductor 108 may be made of an alloy material containing any of these metal materials as a main component.

[0028] The frame-shaped metallized layer 113 is a conductor layer located on the upper surface of the frame portion 106. The frame-shaped metallized layer 113 is joined to a lid 116 (not shown) using a sealing material such as a gold-tin alloy (AuSn) or silver solder.

[0029] The exposed surfaces of the frame-shaped metallized layer 113 and the external connection conductor 108 may be covered with a plating layer of nickel and / or gold, similar to the connection electrode 114. By covering the frame-shaped metallized layer 113 with a plating layer, the connection between the frame-shaped metallized layer 113 and the lid 116, which is a metal conductor, can be made easy and strong. By covering the external connection conductor 108 with a plating layer, the connection between the electrode of the mounting substrate on which the electronic device 500 is mounted can be made easy and strong.

[0030] As shown in FIG. 3, the internal wiring 117 is wiring located inside the insulating substrate 101 (base portion 107) and connecting the connection electrode 114 and the first external connection conductor 108A. The internal wiring 117 may include a wiring layer 117A and a through-conductor 117B. The wiring layer 117A is a conductor extending in a direction along the first surface 102 and the second surface 103 within the insulating substrate 101 (base portion 107) (extending in a direction parallel to the XY plane). The through-conductor 117B is a conductor extending in a direction perpendicular to the first surface 102 and the second surface 103 within the insulating substrate 101 (base portion 107) (extending in the Z-axis direction).

[0031] Although not shown, the package 100 may have in-frame wiring as the internal wiring 117. The in-frame wiring is wiring connecting the frame-shaped metallized layer 113 and the second external connection conductor 108B. The in-frame wiring is located from inside the frame portion 106 to inside the base portion 107, and one end is connected to the frame-shaped metallized layer 113 on the frame portion 106. The other end of the in-frame wiring is connected to the second external connection conductor 108B via a through-conductor extending in the vertical direction of the base portion 107. With this configuration, by connecting the second external connection conductor 108B to the ground potential, the lid 116 connected to the frame-shaped metallized layer 113 can function as a shield against electromagnetic noise.

[0032] The corner conductor 109 is a conductor positioned from the external connection conductor 108 toward the corner portion 105C. The corner conductor 109 has an increasingly larger distance from the external connection conductor 108 and the second surface 103 from the external connection conductor 108 to the corner portion 105C. Also, as shown in FIGS. 3 to 8, the corner conductor 109 is a curved plate-like conductor and may form an arch that is concave with respect to the top portion 105D. The corner conductor 109 may be convexly curved toward the first surface 102 side. The corner conductor 109 may have, for example, a fan shape with the center positioned at the corner portion 105C and the top portion 105D in a plan view as shown in FIG. 1. Further, the curved portion of the fan shape may be a partial arc. A partial arc means a shape that forms a part of a circle. Also, a circle is not limited to a circle in a strict sense and includes those in which the arc portion of the circle is not a complete arc.

[0033] The corner conductor 109 is exposed on the first side surface 105A and the second side surface 105B as shown in FIGS. 5 to 7, for example. The portion of the corner conductor 109 exposed on the side surface 105 is referred to as the exposed portion 109B. The exposed portion 109B may be connected to the external connection conductor 108 or separated from the external connection conductor 108 in a side view as shown in FIGS. 3 and 4.

[0034] When the exposed portion 109B is connected to the external connection conductor 108, it becomes possible to connect the exposed portion 109B and the external electrical circuit when connecting the external connection conductor 108 to the external electrical circuit of the module substrate using a conductive bonding material such as solder. Therefore, the electrical connection reliability between the package 100 and the module substrate can be improved. Also, since the insulator 110 can be sandwiched between the external connection conductor 108 and the corner conductor 109 from the inside of the insulating substrate 101 to the side surface 105, the possibility of chipping, cracking, etc. occurring at the corner portions of the insulating substrate 101 can be effectively reduced.

[0035] The corner conductor 109 is made of a metal material such as tungsten, molybdenum, manganese, copper, gold, palladium, platinum, nickel, or cobalt. The corner conductor 109 may be made of an alloy material containing any of these metal materials as a main component.

[0036] In the insulating substrate 101, a portion sandwiched between the external connection conductor 108 and the corner conductor 109 and located at the corner portion on the second surface 103 side of the insulating substrate 101 is referred to as an insulator 110. That is, the insulating substrate 101 includes the insulator 110.

[0037] The insulator 110 is sandwiched and protected between the external connection conductor 108 and the corner conductor 109. Since the external connection conductor 108 and the corner conductor 109 are made of a metal material or an alloy material, they are more likely to absorb stress than the insulating substrate 101 made of a ceramic material. Therefore, it is difficult for the insulator 110 sandwiched between the external connection conductor 108 and the corner conductor 109 to have chips, cracks, etc. Also, even if chips, cracks, etc. occur in the insulator 110, the chips, cracks, etc. generated in the insulator 110 are likely to remain within the range sandwiched between the external connection conductor 108 and the corner conductor 109. Therefore, the package 100 can effectively reduce the possibility of chips, cracks, etc. occurring at the corner portions of the insulating substrate 101.

[0038] The material of the insulator 110 may be substantially the same as the ceramic material used for the portion of the insulating substrate 101 other than the insulator 110. Here, the same material means a material that becomes the same ceramic component after firing. For simplicity, the portion of the insulating substrate 101 other than the insulator 110 is referred to as the outer-insulator portion.

[0039] Here, the virtual line X shown by the two-dot chain line in FIGS. 4 and 7 is a line connecting the point closest to the top 105D in the connection electrode 114 located closest to the corner conductor 109 and the top 105D. As shown in FIGS. 4, 7, etc., the corner conductor 109 has an opening 109A surrounding the intersection of the virtual line X and the corner conductor 109. The shape of the opening 109A may be circular or elliptical as shown in FIGS. 1, 7, and 8. In the case of an elliptical shape, it may be vertically long or horizontally long. When the opening 109A is circular or elliptical, since there are no corners, the possibility of cracks originating from the corners of the opening can be reduced. Also, when printing the metallization that becomes the corner conductor 109 having the opening 109A in the insulating layer by screen printing, the possibility of deformation of the opening shape due to bleeding during printing, etc., can be reduced.

[0040] The shape of the opening 109A is not limited to circular or elliptical, and may be polygonal. Alternatively, the shape of the opening 109A may be a notch shape as shown in FIGS. 18 or 19. Depending on the manufacturing method, the metallization paste that becomes the corner conductor 109 may include a process involving deformation. Since the corner conductor 109 having the opening 109A with a notch shape is prone to deformation, the shape stability is improved.

[0041] When the package 100 has a low-profile size as described in the above size range, the distance between the corner conductor 109 and the connection electrode 114 becomes short, increasing the likelihood of a short circuit between the two conductors. As shown in FIGS. 3 and 4, the connection electrode 114 is electrically connected to the first external connection conductor 108A via the internal wiring 117. On the other hand, the corner conductor 109 close to the connection electrode 114 is connected to the second external connection conductor 108B. Since these two conduction paths have different potentials, it is necessary to avoid a short circuit. By having the opening 109A at a position where the distance from the connection electrode 114 is close, even when the package 100 is made low-profile, the possibility of a short circuit between the connection electrode 114 and the corner conductor 109 can be reduced. Also, the possibility of a decrease in insulation due to the short distance between the connection electrode 114 and the corner conductor 109 can be reduced. Furthermore, when the opening 109A is in a horizontally long elliptical shape, the possibility of the corner conductor 109 being exposed inside the cavity 104 can be further reduced. Thereby, the possibility of a short circuit between the connection electrode 114 and the corner conductor 109 having different potentials due to the bonding material when mounting the electronic component can be reduced.

[0042] Furthermore, the opening 109A may be located overlapping the outer edge of the cavity 104 in a plan view. In other words, the opening 109A may be located directly below the corner between the inner wall and the bottom surface of the cavity 104. Also, it may be located overlapping the corner of the cavity 104 in a side view. The corner between the inner wall surface and the bottom surface of the cavity 104 is a corner convex with respect to the corner conductor 109 and is close to the corner conductor 109. By the opening 109A being located overlapping the outer edge of the cavity 104, it comes to be located in a portion close to the corner, and the possibility of the corner conductor 109 being exposed inside the cavity 104 can be reduced. Thereby, the possibility of a short circuit between the connection electrode and the corner conductor due to the bonding material connecting the electronic component and the connection electrode 114 can be reduced.

[0043] Also, in the opening 109A, the insulator outer portion and the insulator 110 can be joined. The joining in the opening 109A is a joining between ceramics. Since the joining between ceramics has higher strength than the joining between the ceramic and the corner conductor 109, the strength of the package 100 can be improved as compared with the case where the opening 109A is not provided.

[0044] The corner conductor 109 located away from the connection electrode 114 may also have the opening 109A. By having the opening 109A not only in the corner conductor 109 close to the connection electrode 114 but also in the corner conductor 109 located away, the strength can be further improved. In this case, in the state of the multi-piece wiring board described later, each opening 109A may be arranged to be rotationally symmetric about the top 105D in a plan view. Thereby, the possibility of cracking during division can be reduced without variation in strength. Also, the possibility of deformation during manufacturing can be reduced.

[0045] FIG. 9 is a perspective view showing another embodiment of the corner conductor 109. The exposed portion 109B of the corner conductor 109 may be separated from the external connection conductor 108 on the first side surface 105A and the second side surface 105B as shown in FIG. 9, for example. The external connection conductor 108 is connected to an external electric circuit of the module substrate using a conductive bonding material such as solder. Since the exposed portion 109B is separated from the external connection conductor 108, even if a plating layer is deposited on the exposed portion 109B, the conductive bonding material is less likely to spread wetly from the external connection conductor 108 along the exposed portion 109B and crawl upward toward the first surface 102. Therefore, the possibility that the conductive bonding material shorts to a conductive member such as the frame-shaped metallized layer 113 and the lid 116 located on the frame portion 106 can be reduced. As a result, the reliability of the electrical connection of the package 100 can be improved.

[0046] Furthermore, when the package 100 is formed by cutting a mother substrate described later along a dividing groove, the side surface 105 has an inclined surface 122 corresponding to the groove in the mother substrate and a fracture surface 121. Specifically, the central portion of the side surface 105 in the thickness direction is the fracture surface 121, and the inclined surface 122 is located on the first surface 102 side and the second surface 103 side with respect to the fracture surface 121. When the plating layer is formed in the state of the mother substrate, the inclined surface 122 has the plating layer, and the package 100 where the fracture surface 121 does not have the plating layer is obtained. At the boundary portion between the inclined surface 122 and the fracture surface 121 at the corner portion 105C, recessed portions 125 as shown in FIGS. 9 and 10 can be formed by laser irradiation when forming the dividing groove. The recessed portion 125 will be described in detail in the description of the mother substrate.

[0047] The exposed portion 109B of the corner conductor 109 shown in FIG. 9 may be exposed only on the fracture surface 121. Thereby, it can be made such that the plating layer is not deposited on the exposed portion 109B. In this case, since there is no portion wettable by the conductive bonding material between the first surface 102 and the second surface 103, a short circuit between the conductive bonding material and conductive members such as the frame-shaped metallized layer 113 and the lid body 116 can be effectively reduced.

[0048] Also, as shown in FIG. 9, the opening 109A of the corner conductor 109 may have a shape that temporarily widens from the first surface 102 side to the second surface 103 side. In other words, the opening 109A may have a flaring shape or a triangular shape. The three-directional corners including the corner between the two inner surfaces and the corners between the bottom surface and each of the two inner surfaces in the cavity 104 protrude toward the corner conductor 109 and are close to the corner conductor 109. Since the opening 109A has a flaring shape and thus has a shape that widens in the extending direction of these corners, it is difficult to be exposed from these corners. Thereby, even when the package 100 has a low profile, the possibility that the corner conductor 109 is exposed inside the cavity 104 can be further reduced. Thereby, the possibility that the connection electrode 114 having a different potential and the corner conductor 109 are short-circuited by the bonding material when mounting the electronic component can be reduced.

[0049] FIG. 10 is a perspective view showing another embodiment of the corner conductor 109. As shown in FIG. 10, the corner conductor 109 may have a first portion 109D and a second portion 109E. The first portion 109D has a partial annular shape centered at the corner 105C in a plan view. The first portion 109D includes an exposed portion 109B. The second portion 109E extends inward from the outer peripheral portion of the first portion 109D toward the insulating substrate 101. The second portion 109E has an opening 109A and is connected to the external connection conductor 108. The second portion 109E may have a shape such as a partial annular shape, a rectangular shape, etc. in a plan view, or other shapes.

[0050] In the package 100 shown in FIG. 10, the corner conductor 109 is not exposed at the corner 105C, and the area of the exposed portion 109B is reduced. Further, since the exposed portion 109B is located at the fracture surface 121, the exposed portion 109B without a plating layer can be formed. In this case, since there is no portion wettable by the conductive bonding material between the first surface 102 and the second surface 103, a short circuit between the conductive bonding material and conductive members such as the frame-shaped metallized layer 113 and the lid 116 can be effectively reduced. Thus, according to the package 100 shown in FIG. 10, the electrical connection reliability between the package 100 and the module substrate can be improved. Also, the distance between the second portion 109E and the side surface 105 may gradually increase from above to below. Thereby, when forming the dividing groove of the mother substrate, the possibility of the conductor being exposed can be reduced. Further, the corner conductor 109 shown in FIG. 10 has an open top overlapping the corner 105C. Thereby, even when a recess 125 is formed at the corner 105C, the risk of the corner conductor 109 being exposed in the recess 125 can be reduced.

[0051] Furthermore, the outer edge shape in the plan view of the second portion 109E of the corner conductor 109 shown in FIG. 10 is a partial arc with its center located at the corner 105C. In other words, the second portion 109E has a substantially fan-shaped configuration. The second portion 109E may have a curved shape that is convex toward the first surface 102 side. And the opening 109A has a shape that temporarily widens from the first surface 102 side to the first surface 103 side. In other words, the shape of the opening 109A is a flaring shape. Since the second portion 109E is substantially fan-shaped, by making the opening 109A also have a flaring shape along this shape, an extremely narrow portion cannot be formed. Thereby, it is possible to reduce the possibility that the strength of the corner conductor 109 is reduced or the shape maintenance becomes difficult due to the opening 109A. Furthermore, it is possible to reduce the possibility that the electrical resistance increases due to the formation of a narrow portion in the corner conductor 109. Also, with this shape, it is possible to further reduce the possibility of being exposed inside the cavity 104, and it is possible to reduce the possibility that the connection electrode 114 having a different potential and the corner conductor 109 are short-circuited by the bonding material when mounting the electronic component.

[0052] Also, as shown in FIG. 10, the peripheral edge shape of the opening 109A may be rounded. The shape of the opening 109A shown in FIG. 10 is a shape in which the corners of a triangle are rounded in plan view. Since the shape of the opening is rounded, when the substrate is fired (during manufacturing) and heated during use, it becomes difficult for stress due to the difference in shrinkage between the ceramic and the metal due to heating to concentrate locally, and it is possible to reduce the possibility of cracks occurring starting from the corners of the opening.

[0053] FIG. 11 is a side perspective view showing another embodiment of the corner conductor 109. The corner conductor 109 shown in FIGS. 3 and 4 is located within the base portion 107, but a part of the corner conductor 109 may be located within the frame portion 106 as shown in the figures indicated by reference numerals 1101 and 1102 in FIG. 11. Also, as shown in the figure indicated by reference numeral 1101 in FIG. 11, the corner conductor 109 may have a curved shape that is partially convex toward the top portion 105D.

[0054] In the aspect where a part of the corner conductor 109 is located within the frame portion 106 in this way, the distance from the second surface 103 of the corner conductor 109 at the corner portion 105C becomes large. Thereby, while maintaining the connection between adjacent corner conductors 109 in the multi-wiring substrate (mother substrate 200), the dividing groove on the second surface 103 can be made deeper, and the dividability of the mother substrate 200 becomes good. When the dividing grooves are provided on the upper and lower surfaces of the mother substrate 200, at the corner portion 105C of the package 100, the corner conductor 109 may be located at the central portion in the thickness direction of the package 100. Thereby, since the upper and lower dividing grooves can be made equally deep, the dividability becomes better.

[0055] FIG. 12 is a top view showing another embodiment of the package 100. As shown in FIG. 12, the connection electrodes 114 may be located at opposite corners along the diagonal of the package 100 (or the base portion 107). In other words, the two connection electrodes 114 may be located at the diagonals on the first surface 102 of the rectangular base portion 107 in a top view. With this configuration, the bias of the members in the package 100 is reduced.

[0056] FIG. 13 is a perspective view showing another embodiment of the package 100. As shown in FIG. 13, the package 100 has a recess 102B that opens to the first surface 102, and the connection electrodes 114 may be located on the bottom surface of the recess 102B. The two recesses 102B in the package 100 may be located at opposite corners along the diagonal of the package 100 (or the base portion 107).

[0057] In the aspect where the connection electrodes 114 are located on the bottom surface of the recess 102B in this way, since the mounting position of the electronic component can be lowered, a lower profile is possible, but the distance between the connection electrodes 114 and the corner conductor 109 becomes closer. Since the corner conductor 109 has the opening 109A, even in the package 100 as shown in FIG. 13, the possibility of a short circuit between the connection electrodes 114 and the corner conductor 109 can be reduced.

[0058] FIG. 14 is a top view of a multi-piece wiring board (mother board 200) in which a plurality of wiring board regions 100A, each of which becomes an individual package 100, are arranged. FIG. 15 is a cross-sectional view taken along the line XV-XV in FIG. 14. FIGS. 16 to 19 are perspective views showing main parts of a multi-piece wiring board for manufacturing another embodiment of the package 100. For ease of understanding, FIG. 16 shows only the connection electrodes 114 in one package 100 portion, while FIGS. 17 to 19 omit the illustration of the connection electrodes 114.

[0059] The package 100 may be manufactured, for example, by manufacturing the mother board 200 and dividing the mother board 200 into individual pieces. The mother board 200 is configured by laminating a flat first insulating layer having a plurality of regions each serving as a base portion 107 and a second insulating layer having a plurality of regions each serving as a frame portion 106. The second insulating layer has an opening serving as a cavity 104 in each of the plurality of regions that become the frame portions 106. Hereinafter, the first insulating layer is also referred to as the frame portion 106, and the second insulating layer is also referred to as the base portion 107.

[0060] When the frame portion 106 and the base portion 107 of the mother board 200 are made of an aluminum oxide sintered body, the mother board 200 can be manufactured as follows.

[0061] First, appropriate organic binders, solvents, plasticizers, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to prepare a slurry. By forming this slurry into a sheet using a sheet forming method such as the doctor blade method or the roll calender method, a plurality of ceramic green sheets are prepared.

[0062] Next, an opening to be the cavity 104 is formed in the ceramic green sheet for the frame portion 106 by punching or the like, and a metallizing paste to be the frame-shaped metallized layer 113, the wiring layer 117A, etc. is positioned at a predetermined location. The metallizing paste to be the through conductor 117B can be filled into a through hole formed at a predetermined position of the ceramic green sheet by punching or the like. Further, a metallizing paste to be the connection electrode 114, a part of the external connection conductor 108 (the portion inside the corner conductor 109), the corner conductor 109 having the opening 109A, and the internal wiring 117, etc. is positioned at a predetermined location on the ceramic green sheet to be the base portion 107.

[0063] Next, after positioning a ceramic paste to be the insulator 110 so as to cover the upper surface of the metallizing paste to be the corner conductor 109, a metallizing paste to be the remaining part of the external connection conductor 108 (the portion overlapping the corner conductor 109) is positioned on the ceramic paste. Then, the ceramic green sheet in which the metallizing paste and the ceramic paste are provided at predetermined locations may be subjected to a pressing process. Alternatively, a ceramic paste to be the insulator 110 may be provided on the metallizing paste to be the corner conductor 109, a metallizing paste to be the external connection conductor 108 may be provided on the ceramic paste, and then a pressing process may be performed. By laminating the ceramic green sheet for the frame portion 106 and the ceramic green sheet for the base portion 107 processed in this way and firing the obtained laminate at, for example, 1200°C to 1600°C, the mother substrate 200 can be produced.

[0064] The coating shape of the ceramic paste that becomes the insulator 110 may be, for example, a fan shape that is 1 / 4 of a circle (circular in the mother substrate 200), and it may be coated so that its thickness is the largest at the corner 105C of the insulating substrate 101. As a result, in the pressing process, the corner conductor 109 is likely to be convexly curved toward the corner 105C of the insulating substrate 101 from the external connection conductor 108 on the first surface 102 side. As a result, the corner conductor 109 can be provided such that the distance from the second surface 103 gradually increases in the thickness direction of the insulating substrate 101. That is, the portion where the insulator 110 is provided thick before pressing will push the metallization paste that becomes the corner conductor 109 deeper into the ceramic green sheet that becomes the insulating substrate 101 during pressing.

[0065] The manufacturing method of the mother substrate 200 is a method of laminating a ceramic green sheet that becomes a frame-shaped frame portion 106 and a ceramic green sheet that becomes a flat base portion 107, but it is not limited to this method. For example, it may be pressed with a pressing jig having a protruding portion (convex portion) and a recessed portion so that the concave cavity 104 is located on the surface of the ceramic green sheet that becomes the insulating substrate 101, on which the metallization paste and the ceramic paste are applied. At that time, the position of the pressing jig is determined so as to press the portion that becomes the bottom of the cavity 104. As a result, the portion where the ceramic green sheet is pushed by the protruding portion of the pressing jig becomes the cavity 104, and the portion where the ceramic green sheet is pushed by the recessed portion of the pressing jig becomes a frame portion (frame portion 106) that surrounds the mounting region 102A. Also, on the second surface 103 side of the ceramic green sheet, the metallization paste that becomes the external connection conductor 108 and the ceramic paste that becomes the insulator 110 are pushed by the jig, and the metallization paste that becomes the corner conductor 109 is curved toward the first surface 102 side. As a result of the metallization paste that becomes the external connection conductor 108 being pushed by the jig, the external connection conductor 108 and the second surface 103 of the insulating substrate 101 are on the same plane.

[0066] As the ceramic green sheet, metallization paste, and binder added to the ceramic paste to be used, those that soften at the temperature when pressed by a mold can be used. When using such a binder, when pressing a ceramic green sheet or the like with a pressing jig, molding such as planarization of the exposed surface of the frame portion and the external connection conductor 108 and the second surface 103 of the insulating substrate 101 can be performed well.

[0067] Since the width and depth of the recessed portion of the pressing jig are constant, the width and height of the frame portion after the pressing process can also be made constant. Thereby, the dimensional accuracy of the frame portion after the pressing process can be improved. By firing a molded body in which a base portion 107 provided with an external connection conductor 108 or the like and a frame portion 106 provided with a frame-shaped metallized layer 113 or the like are integrated, a mother substrate 200 in which a plurality of wiring substrate regions 100A that become the package 100 are arranged can be produced. By firing a molded body in which a base portion 107 provided with an external connection conductor 108 or the like and a frame portion 106 provided with a frame-shaped metallized layer 113 or the like are integrated, a mother substrate 200 in which a plurality of wiring substrate regions 100A that become the package 100 are arranged can be produced.

[0068] The package 100 is manufactured by dividing a multi-piece wiring substrate (mother substrate 200). The mother substrate 200 has a plurality of wiring substrate regions 100A arranged vertically and horizontally (X direction, Y direction) on the substrate surface. The mother substrate 200 has a dividing groove (hereinafter simply referred to as groove 123) at the boundary between two adjacent wiring substrate regions 100A on the upper surface and the second surface 103 of the frame portion 106. By breaking the mother substrate 200 along the dividing groove, individual packages 100 can be obtained. The groove 123 can be formed by partially cutting the mother substrate 200 before firing or the mother substrate 200 after firing using a laser or a cutter blade.

[0069] The inner surface of the groove 123 in FIG. 15 becomes the inclined surface 122 shown in FIGS. 9 and 10. When the mother substrate 200 is divided into individual pieces, a fracture surface 121 shown in FIGS. 9 and 10 is formed in the portion between the groove 123 on the upper surface and the groove 123 on the lower surface in FIG. 15.

[0070] Before dividing the mother substrate 200 into individual pieces, a plating layer may be deposited on the exposed surfaces of wiring conductors such as the corner conductor 109, the frame-shaped metallized layer 113, the connection electrode 114, and the external connection conductor 108. To deposit a plating layer on the wiring conductor, for example, an electroplating method can be used. When using the electroplating method, a supply conductor for supplying current during electroplating is arranged in a region of the mother substrate 200 other than the wiring substrate region 100A. Then, a connection conductor for connecting the supply conductor and the wiring substrate region 100A located at the outermost periphery of the mother substrate 200, and a connection conductor for connecting the respective wirings across adjacent wiring substrate regions 100A may be arranged.

[0071] Thereby, by supplying current to the supply conductor, current can be supplied to all of the wiring conductors in each wiring substrate region 100A, and a plating layer is deposited on the exposed wiring conductors in each wiring substrate region 100A.

[0072] In the mother substrate 200 for obtaining the package 100, the corner conductor 109 functions as the above-described connection conductor. In the mother substrate 200, the corner conductors 109 provided in adjacent wiring substrate regions 100A are connected to each other. The corner conductor 109 may be a narrow strip-shaped wiring conductor as long as it functions as a connection conductor. In the present embodiment, the corner conductor 109 has a substantially dome shape as shown in FIGS. 16 to 19 in order to protect the insulator 110 in cooperation with the external connection conductor 108.

[0073] In the examples shown in FIGS. 16 to 19, the corner conductor 109 is positioned such that the distance from the external connection conductor 108 gradually increases toward the corner portion 105C and does not extend to the corner portion 105C. Therefore, the shape of the corner conductor 109 in the mother substrate 200 is a dome shape with the top open that overlaps the respective corner portions 105C of the four insulating substrates 101, as shown in FIGS. 16 to 19, for example.

[0074] When forming the groove 123 by laser processing, the portion where the groove 123 in the X direction and the groove 123 in the Y direction intersect, that is, the portion corresponding to the corner portion 105C of the insulating substrate 101, is subjected to two laser irradiations when forming the groove 123 in the X direction and when forming the groove 123 in the Y direction. Therefore, a recessed portion 125 (see FIGS. 9 and 10) where the groove is deeper than other portions may be formed at the corner portion 105C of the insulating substrate 101. If the corner conductor 109 extends to the corner portion 105C, the corner conductor 109 may be exposed in the recessed portion 125 which is the bottom of the split groove 123 at the corner portion 105C.

[0075] Since the top overlapping the corner portion 105C is in a dome shape with an open top, even when the recessed portion 125 is formed at the corner portion 105C, the risk of the corner conductor 109 being exposed in the recessed portion 125 which is the bottom of the split groove 123 can be reduced. Also, when forming the groove 123 by laser processing, the risk of debris scattered from the corner conductor 109 due to the laser processing adhering to the recessed portion 125 can be reduced. As a result, the possibility that the plating layer adheres to the bottom of the groove 123 and causes a short circuit between the external connection conductor 108 and the frame-shaped metallized layer 113 with a conductive bonding material such as solder is reduced, and the splitting of the mother substrate 200 becomes easier. In the example shown in FIG. 18, the external connection conductor 108 does not overlap the periphery of the wiring board region 100A and is located at a position separated inward of the wiring board region 100A. In such a case, the risk of debris scattered from the external connection conductor 108 due to the laser processing adhering to the recessed portion 125 can be reduced, and as a result, the splitting of the mother substrate 200 becomes even easier.

[0076] FIG. 20 is a plan view of the mother substrate 200 for explaining another embodiment of the corner conductor 109. FIG. 20 shows a plurality of examples in which corner conductors 109 in different modes are arranged on the mother substrate 200. The corner conductor 109Y and the corner conductor 109Z shown in FIG. 20 are another embodiment of the corner conductor 109. FIG. 21 is a cross-sectional view taken along the line XXI-XXI of FIG. 20. FIG. 22 is a cross-sectional view taken along the line XXII-XXII of FIG. 20. FIG. 23 is a cross-sectional view taken along the line XXIII-XXIII of FIG. 20. FIG. 24 is a perspective view of the corner conductor 109Z.

[0077] The shape of the corner conductor 109Y is such that the combined shape of four adjacent corner conductors 109Y on the mother substrate 200 is an arch shape that is rectangular in plan view. The opening 109A of the corner conductor 109Y may be a notch. The shape of the corner conductor 109Z is such that the combined shape of four adjacent corner conductors 109Y on the mother substrate 200 is an arch shape that is square in plan view. Even with such shapes, the corner conductor 109 functions as a connection conductor for taking electrical conduction for plating.

[0078] The deposition of the plating layer before dividing the mother substrate 200 into individual pieces can also be performed by electroless plating. In this case, since the corner conductor 109 does not have to function as a connection conductor, the corner conductor 109 does not have to extend to the side surface 105, but a corner conductor 109 having the same shape as in the above-described embodiment may be used. If the corner conductor 109 extends to the side surface 105, it is advantageous in terms of protecting the insulator 110.

[0079] Also, a circular corner conductor 109 and a square corner conductor 109Z, in which the lengths from adjacent side surfaces (the side surfaces sandwiching the corner) and the lengths covering the insulator are of the same degree, are less likely to have stress concentration when the substrate is divided, and thus are advantageous from the viewpoint of protecting the insulator.

[0080] FIG. 25 is a side perspective view of the electronic device 500 according to the present disclosure. FIG. 26 is a side perspective view showing another example of the electronic device 500 according to the present disclosure. However, in FIG. 26, the lid body 116 is shown as a cross-sectional view cut along a plane parallel to the side surface. In FIGS. 25 and 26, the electronic device 500 is shown as being connected to the module substrate 400.

[0081] As shown in, for example, FIG. 25, the electronic device 500 of the present disclosure includes the above-described package 100, a lid 116, and electronic components 112 mounted on the package 100. Thereby, even when the package 100 is made low-profile, an electronic device 500 can be provided that can reduce the possibility of short circuit between the connection electrodes 114 and the corner conductor 109. Further, since the corner conductor 109 has an opening, the insulating substrates positioned above and below the corner conductor 109 can be joined to each other with ceramic at the opening, so that the strength of the insulating substrate is improved. Furthermore, the corner conductor 109 reduces the possibility of chipping, cracking, etc. of the package 100 during handling. Thereby, an electronic device 500 with excellent dimensional accuracy and improved strength can be provided.

[0082] As in the example shown in FIG. 25, when the insulating substrate 101 of the package 100 has a frame portion 106, the lid 116 may be flat. As in the example shown in FIG. 26, when the insulating substrate of the package 100 is flat, the lid 116 is a box-shaped (hat-shaped) recess with respect to the first surface 102, and may house the electronic components 112 inside.

[0083] Examples of the electronic component 112 include a piezoelectric vibrator of a crystal vibration element such as a temperature compensated crystal oscillator (TCXO), and piezoelectric elements such as ceramic piezoelectric elements and surface acoustic wave elements, semiconductor elements, capacitive elements, and resistive elements. The connection between each electrode (not shown) of the electronic component 112 and the connection electrode 114 may be made via a bonding material 115 such as a conductive adhesive, as shown in FIGS. 25 and 26, for example.

[0084] 〔Summary〕 The package for housing electronic components according to Aspect 1 of the present disclosure includes an insulating substrate having a mounting area for mounting electronic components, a first surface located on the opposite side of the first surface, a plurality of side surfaces when the first surface is the upper surface, a corner formed by two of the side surfaces, and a top that is an intersection of the corner and the second surface, a plurality of connection electrodes located on the first surface, an external connection conductor located on the second surface, and a corner conductor connected to the external connection conductor and positioned so that the distance from the external connection conductor to the corner increases with respect to the second surface. The corner conductor has an opening surrounding an intersection of a virtual line connecting a point closest to the top in the connection electrode closest to the corner conductor and the top, and the corner conductor.

[0085] The package for housing electronic components according to Aspect 2 of the present disclosure is, in the above Aspect 1, the insulating substrate has a frame portion located on the first surface, and in a plan view, the opening is located overlapping an outer edge of a cavity defined by an inner wall of the frame portion and the first surface.

[0086] The package for housing electronic components according to Aspect 3 of the present disclosure is, in the above Aspect 1 or 2, the corner conductor has an outer edge shape in a plan view that is a partial arc with a center located at the corner and a curved shape that is convex on the first surface side, and the opening has a shape that temporarily widens from the first surface side to the second surface side.

[0087] The package for housing electronic components according to Aspect 4 of the present disclosure is, in the above Aspect 3, the peripheral shape of the opening has a rounded shape.

[0088] The package for housing electronic components according to Aspect 5 of the present disclosure is, in the above Aspect 1 or 2, the opening is circular or elliptical in shape.

[0089] The multi-piece wiring board according to Aspect 6 of the present disclosure has a plurality of wiring board areas each being a package for housing electronic components according to any one of the above Aspects 1 to 5 arranged on a mother board.

[0090] The electronic device according to Aspect 7 of the present disclosure includes the package for housing electronic components according to any one of Aspects 1 to 5 above, and electronic components mounted on the package for housing electronic components.

[0091] As described above, the invention according to the present disclosure has been described based on the drawings and examples. However, the invention according to the present disclosure is not limited to the above-described embodiments. That is, the invention according to the present disclosure can be variously modified within the scope shown in the present disclosure, and embodiments obtained by appropriately combining the technical means disclosed in different embodiments are also included in the technical scope of the invention according to the present disclosure. In other words, it should be noted that those skilled in the art can easily make various modifications or corrections based on the present disclosure. Also, it should be noted that these modifications or corrections are included in the scope of the present disclosure.

Description of Reference Numerals

[0092] 100 ··· Package 101 ··· Insulating Substrate 102 ··· First Surface 102A ··· Mounting Region 103 ··· Second Surface 104 ··· Cavity 105A ··· First Side Surface (Side Surface) 105B ··· Second Side Surface (Side Surface) 105C ··· Corner 105D ··· Top 106 ··· Frame Portion 107 ··· Base Portion 108 ··· External Connection Conductor 109, 109Y, 109Z ··· Corner Conductor 109A ··· Opening 109B ··· Exposed Portion 112 ··· Electronic Component 113 ··· Frame-shaped Metallized Layer 114 ··· Connection Electrode 116 ··· Cover 200 ··· Mother Substrate 100A ··· Wiring Substrate Region 500 ··· Electronic Device

Claims

1. An insulating substrate having a mounting area for mounting electronic components, a second surface located on the side opposite to the first surface, a plurality of side surfaces when the first surface is the upper surface, a corner formed by two of the side surfaces, and a top that is the intersection of the corner and the second surface; A plurality of connection electrodes located on the first surface; An external connection conductor located on the second surface; A corner conductor connected to the external connection conductor and positioned so that the distance from the external connection conductor to the corner increases in the direction away from the second surface; and The corner conductor has an opening surrounding the intersection of a virtual line connecting the top of the connection electrode closest to the corner conductor and the top, and the corner conductor, an electronic component storage package.

2. The insulating substrate has a frame portion located on the first surface, In a plan view, the opening Is located overlapping the outer edge of the cavity defined by the inner wall of the frame portion and the first surface, the electronic component storage package according to claim 1.

3. The corner conductor has an outer edge shape in a plan view that is a partial arc with the center located at the corner, and has a curved shape that is convex on the first surface side, The opening has a shape that temporarily widens from the first surface side to the second surface side, the electronic component storage package according to claim 1.

4. The peripheral shape of the opening is rounded, the electronic component storage package according to claim 3.

5. The opening is circular or elliptical, the electronic component storage package according to claim 1.

6. A multi-piece wiring board in which a plurality of wiring board areas each forming an electronic component storage package according to any one of claims 1 to 5 are arranged on a mother board.

7. An electronic device having the package for housing an electronic component according to any one of claims 1 to 5 and an electronic component mounted on the package for housing an electronic component.

Images