Substrate holding device and substrate cleaning method

Abstract

To provide a substrate holding device and a substrate cleaning method capable of effectively suppressing (reducing) intrusion of cutting chips and foreign matters on a surface on a substrate suction side and the inside of a device.SOLUTION: A substrate holding device holds a substrate on a table. The table includes a first frame body and a second frame body that support the substrate, and a base portion to which the first frame body and the second frame body are attached on a surface facing the substrate. The first frame body forms a negative pressure unit capable of sucking the substrate by generating negative pressure between the substrate and the base portion, and the second frame body forms a positive pressure unit for generating positive pressure around the negative pressure unit.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a substrate holding device and a substrate cleaning method.

Background Art

[0002] When manufacturing a substrate for mounting an arithmetic unit, as shown in FIG. 12, after forming a substrate 151 on which a plurality of circuit patterns are formed, the substrate 151 is cut and separated by a cutting and separating device to be fragmented, thereby obtaining a plurality of substrates 152 for mounting arithmetic units. In FIG. 12, 154 indicates a cutting line, and 155 indicates a substrate end material as waste.

[0003] By the way, when fragmenting a substrate, contaminants such as cutting chips are generated by cutting. When such contaminants are generated, there is a risk of adhering to a plurality of fragmented products. Therefore, conventionally, there is a device provided with a structure (cleaning means) for cleaning such contaminants (Patent Document 1).

[0004] The substrate cutting device shown in Patent Document 1 is provided with nozzles for supplying machining water to the cutting material and the rotating blade. As the nozzles, a cutting water supply nozzle, a cooling water supply nozzle, and a cleaning water supply nozzle are provided.

[0005] That is, the substrate cutting device adsorbs and supports a substrate on a cutting table (cutting stage), and in this state, cuts the substrate with a rotating blade to fragment the substrate to form substrate pieces. At the time of cutting, cutting water is sprayed from the cutting water supply nozzle toward the machining point where the rotating blade contacts the rotating blade, cooling water is sprayed from the cooling water supply nozzle toward the side surface of the rotating blade, and cleaning water is sprayed from the cleaning water supply nozzle toward the substrate.

[0006] By the way, when cutting the substrate in this way, as shown in FIGS. 10 and 11, the substrate 1 is placed and fixed on the table 2. As this table 2, for example, it has a base portion 3 and a plurality of rectangular frames 4 arranged on the base portion 3.

[0007] By setting the interior of the rectangular frame 4 to a negative pressure state via a negative pressure generating device (not shown), the interior becomes a negative pressure chamber 5. As a result, the substrate 1 can be adsorbed to the table 2. Generally, the cutting means for cutting the substrate 1 includes a disk-shaped cutter 6 as shown in Fig. 11, a driving motor (not shown) for rotationally driving the cutter, an injection mechanism (not shown) for injecting a cooling medium (e.g., cooling water) to the cutting site and its periphery, etc. In this case, when this cooling medium is injected, the substrate is cleaned, and cutting chips, foreign matters, etc. adhering to the substrate 1 can be removed.

[0008] Note that the cutter 6 of the cutting means, the driving motor (not shown), the nozzle (not shown) for injecting the cooling medium, etc. can be relatively moved in the three axial directions of XYZ with respect to the substrate by the moving means, and the table 2 can be rotated in the θ direction about its central part by a rotational driving mechanism (not shown).

[0009] Therefore, by moving in the three axial directions of XYZ or rotating the substrate 1 about its center by the moving means, the substrate 1 can be cut into small pieces 1a.

Prior Art Documents

Patent Documents

[0010]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0011] However, if the substrate cutting operation (action) is performed while holding the substrate 1 as shown in FIG. 11, when a medium (cleaning water) containing cutting chips penetrates to the back side (table side) of the substrate, the medium (cleaning water) containing cutting chips easily penetrates into the rectangular frame body 4 which is in a negative pressure state, and cutting chips adhere to the back side of the substrate corresponding to the inside of this rectangular frame body 4. Also, due to the suction force of the rectangular frame body 4, the cutting chips that have penetrated between the substrate 1 and the rectangular frame body 4 may be pressed against the substrate 1 and adhere to the substrate 1 side.

[0012] Further, even if the substrate 1 is held by such a substrate holding device and only the cleaning process is performed without performing the substrate cutting process in that state, similarly, the cleaning water containing foreign matter penetrates to the surface opposite to the surface being cleaned by the cleaning water, and foreign matter and the like adhere to the opposite surface side. In addition, as the cleaning means in this case, whether it is provided with an injection nozzle and injects a cleaning liquid from this injection nozzle, a two-fluid nozzle that injects not only the cleaning liquid but also air simultaneously, or a cleaning brush is used, the situation is the same.

[0013] Therefore, in view of the above problems, the present invention provides a substrate holding device and a substrate cleaning method that can effectively prevent the penetration of cutting chips and foreign matter into the surface on the substrate adsorption side and the inside of the device.

Means for Solving the Problems

[0014] The substrate holding device of the present invention is a substrate holding device that holds a substrate on a table, wherein the table has a first frame body and a second frame body that support the substrate, and a base portion to which the first frame body and the second frame body are attached on a surface facing the substrate. The first frame body forms a negative pressure portion that can generate a negative pressure between the substrate and the base portion to adsorb the substrate, and the second frame body forms a positive pressure portion that generates a positive pressure around the negative pressure portion.

[0015] According to the substrate holding device of the present invention, a positive pressure is applied between the frame body and the substrate over the entire outer circumference of the suction portion for adsorbing the substrate, and the penetration of a cleaning liquid or the like can be prevented from the positive pressure region to the inside (inner circumferential side).

Effects of the Invention

[0016] The present invention can suppress (reduce) the adhesion of foreign matter (such as cutting chips) to the surface on the substrate adsorption side, effectively suppress (reduce) the intrusion of foreign matter into the inside of the frame body, and suppress the contamination inside the device. In addition, it can suppress (reduce) the biting of foreign matter between the frame body and the substrate, suppress (reduce) the strong adhesion of foreign matter to the substrate, and also suppress the adhesion of foreign matter to the product.

Brief Description of the Drawings

[0017]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Embodiments for Carrying Out the Invention

[0018] Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 9.

[0019] FIG. 1 is a simplified block diagram showing the overall configuration of a substrate holding device according to the present invention. As shown in FIGS. 2 and 3, this device uses a substrate 11 on which a plurality of circuit patterns are formed for substrate cutting to fragment the substrate 11 into small pieces. By fragmenting the substrate 11, a substrate chip 11a which is a substrate for mounting an arithmetic unit is formed.

[0020] In this case, the substrate holding device includes a cutting means 23, a table rotation means 24, a moving means 25 for moving the cutting means 23, a negative pressure generating means 26, and a positive pressure generating means 27. Further, each of these means 23, 24, 25A, 26, 27 is controlled by a computer 28A.

[0021] Incidentally, the substrate 11 is supported by a table 10 as shown in FIGS. 2 and 3. The table 10 includes a base portion 18 and a plurality of rectangular first frame bodies 12 (hereinafter, may be simply referred to as frame bodies 12) arranged at a predetermined pitch on the base portion 18. The frame body 12 is composed of a pair of short side portions 12a and 12c facing each other at a predetermined interval and a pair of long side portions 12b and 12d facing each other at a predetermined interval, and a rectangular hole portion is provided inside. This hole portion is depressurized by the negative pressure generating means 26 to form a negative pressure portion (negative pressure chamber) 13. That is, by driving the negative pressure generating means 26, the negative pressure portion (negative pressure chamber) 13 becomes a negative pressure state. In this case, the base portion 18 is provided with a communication hole 14 communicating with the negative pressure portion 13, and a vacuum generator such as a vacuum pump or an ejector constituting the negative pressure generating means 26 is connected to the communication hole 14.

[0022] In addition, each frame body 12 is provided with a positive pressure portion 15 that surrounds the periphery of the negative pressure chamber 13 and is capable of generating a positive pressure in the space between the substrate 11 and the frame body 12.

[0023] That is, the table 10 includes a plurality of second frames 16 (hereinafter, may be simply referred to as frame 16) of rectangular frames surrounding the periphery of the frame body 12. The frame 16 consists of short sides 16a, 16c facing the short sides 12a, 12c at a predetermined interval of the frame, and long sides 16b, 16d facing the long side 12b at a predetermined interval. The short side 16a and the long sides 16b, the long side 16b and the short side 16c, the short side 16c and the long side 16d, and the long side 16d and the short side 16a of the frame 16 are continuously connected to form a rectangular frame 16 respectively.

[0024] And a positive pressure portion 15 is provided between the outside of the frame body 12 and the inside of the frame 16. The positive pressure portion 15 is provided with a communication hole 17 communicating with the base portion 18, and a positive pressure generating means 27 composed of a compressor (not shown) etc. is connected to this communication hole 17.

[0025] By the way, since the base portion 18 requires rigidity, it is made of metal. However, since the upper surface of the frame body 12 is in direct contact with the substrate 1, it is made of resin or rubber. However, when the negative pressure chamber 13 is in a negative pressure state and the substrate 1 is adsorbed to this frame body 12, each side portion 12a, 12b, 12c, 12d of the frame body 12 requires rigidity against buckling deformation and compression deformation. For this reason, for example, it is composed of a rubber material with a rubber hardness of about 70 to 90. The rubber hardness conforms to JIS-K6253 and is the hardness measured by a durometer type A in an environment of 23°C.

[0026] As shown in FIG. 4, the cutting means 23 includes a disk-shaped cutter 19, a motor (not shown) that rotates the cutter 19 around its axis, and an injection mechanism 20 that injects a cooling medium (for example, cooling water). The injection mechanism 20 has a cooling injection nozzle 21 disposed in the vicinity of the cutter 19 that rotates and drives, and sprays the cooling medium from a cooling medium supply source (not shown) through the cooling injection nozzle 21 to the cutter 19 and the cutting site of the substrate 11 by the cutter 19 and its periphery. In FIG. 4, the case where the cutter 19 rotates counterclockwise as shown by the arrow A is shown. In this case, the cooling medium is sprayed so as to flow as shown by the arrow B.

[0027] In this case, the substrate cutting unit including the substrate 11, the cutter 19, the motor, the injection nozzle 21, etc. can relatively move in the X-axis direction, Y-axis direction, and Z-axis direction that are orthogonal to each other by the moving means 25. Here, the X-axis direction and the Y-axis direction are horizontal directions that are orthogonal to each other, and the Z-axis direction is the vertical direction. As the moving means 25, an X, Y, Z-axis stage, a robot arm that operates in the X, Y, Z-axis directions, etc. can be used.

[0028] Further, the table 10 rotates in the vertical direction around its center by the table rotation means 24. Note that the table rotation means 24 is composed of, for example, a driving motor (such as a servo motor) and a driving force transmission mechanism that transmits the rotational driving force of this driving motor to the table 10. As the driving force transmission mechanism, it can be composed of a gear mechanism, a belt mechanism, etc. A direct drive mechanism that directly transmits the rotational driving force of the driving motor to the table 10 may also be used.

[0029] By the way, the computer that controls each of the means 23, 24, 25A, 26, 27 basically includes an input means having an input function, an output means having an output function, a storage means having a storage function, an arithmetic means having an arithmetic function, and a control means having a control function. The input function is for reading information from the outside into the computer, and the read data and programs are converted into signals in a format suitable for the computer system. The output function is for displaying the calculation results, stored data, etc. to the outside. The storage means stores and saves programs, data, processing results, etc. The arithmetic function processes data by calculating and comparing according to the instructions of the program. The control function decodes the instructions of the program and issues instructions to each means, and this control function oversees all the means of the computer. As the input means, there are a keyboard, a mouse, a tablet, a microphone, a joystick, a scanner, a capture board, etc. Also, as the output means, there are a monitor, a speaker, a printer, etc. As the storage means, there are a memory, a hard disk, a CD·CD-R, an FD·MO, etc. As the arithmetic means, there is a CPU, etc., and as the control means, there are a CPU, a motherboard, etc.

[0030] Next, a substrate cutting method using the substrate holding device configured as described above will be described. The substrate 11 is placed on the table 10. By setting the negative pressure chamber 13 to a negative pressure state, the substrate 11 is adsorbed to the table 10. Also, the positive pressure portion 15 is set to a positive pressure state. That is, air is blown from the positive pressure portion 15 onto the substrate 11.

[0031] However, if the force that lifts the substrate 11 of the positive pressure portion 15 is greater than the force that sucks the substrate of the negative pressure chamber 13, the table 10 cannot be adsorbed. Therefore, by making the substrate suction force of the negative pressure chamber 13 greater than the substrate lifting force of the positive pressure portion, the substrate 11 on the table 10 can be adsorbed.

[0032] In this state, the substrate 11 is cut by the cutting means 23. In this case, the substrate 11 is cut into small pieces 11a by a combination of the relative drive of the substrate cutting portion composed of the cutter 19, the motor, the injection nozzle 21, etc. in the XYZ-axis directions to the substrate and the rotation of the table 10 around the vertical axis. At the time of this cutting, cooling water is sprayed from the cooling injection nozzle 21 of the injection mechanism onto the cutter 19 and the cutting site of the substrate 11 by the cutter 19 and its periphery. For this reason, the substrate 11 and the cutter 19 are cooled, and the cutting chips and the like on the substrate 11 can be washed.

[0033] By the way, the substrate 11 is adsorbed to the table 10 according to the present invention, and it is an adsorption portion for adsorbing the substrate 11. A positive pressure chamber 15 is formed around the negative pressure chamber 13, and a positive pressure can be applied between the frame body 12 and the substrate 11. For this reason, the intrusion of cleaning liquid and the like can be suppressed from the positive pressure chamber 15 to the inside (inner peripheral side).

[0034] Therefore, in the substrate holding device according to the present invention, the adhesion of foreign matter (such as cutting chips) to the surface on the substrate adsorption side can be suppressed, and the intrusion of foreign matter into the inside of the frame body 12 can also be effectively suppressed, so that the contamination inside the device can be suppressed. Also, the biting of foreign matter between the frame body 12 and the substrate 11 can be effectively prevented, the strong adhesion of foreign matter to the substrate 11 can be suppressed, and a clean product with suppressed foreign matter adhesion can be supplied.

[0035] Since the cutting position is between adjacent frame bodies, even if the substrate 11 is cut and fragmented, it is possible to prevent the intrusion of a cleaning liquid (this cleaning liquid and cooling water contain cutting chips) or the like on the surface side where the substrate 11 contacts the frame body 12.

[0036] In the above embodiment, the substrate 11 is cut by a cutting means 23, and the cutting means 23 includes a disk-shaped cutter 19 provided with a blade portion on the outer peripheral side, a drive source for rotating the cutter around its axis, a medium injection mechanism 20 for injecting a cooling medium to the cutting site and its periphery, and a moving means 25 for relatively moving at least the cutter and the medium injection nozzle 21 of the medium injection mechanism 20 along the XYZθ four-axis directions with respect to the substrate 11.

[0037] Therefore, during the cutting of the substrate 11 by the cutter 19, it is possible to cool the cutter 19 and the substrate 11 and clean the back side of the substrate 11 opposite to the table. The cleaning means 29 will clean the surface to be cleaned of the substrate 11 by spraying a cleaning liquid onto the surface to be cleaned of the substrate 11. Therefore, in this case, the surface to be cleaned is the surface on the back side of the substrate 11 opposite to the table.

[0038] Next, FIG. 5 shows a structure in which the cleaning means 29 is provided without providing the cutting means 23. That is, in the substrate holding device shown in FIG. 1, the cutting means 23 is replaced with the cleaning means 29. In FIG. 5, the same components as those in the substrate holding device shown in FIG. 1 are denoted by the same reference numerals as those in FIG. 1, and their descriptions are omitted. Therefore, the substrate holding device shown in FIG. 5 also has the table 10 shown in FIGS. 2 and 3.

[0039] In this case, the cleaning means 29 uses, for example, a cleaning structure 30 having a cleaning roller 33 as shown in FIG. 6. The cleaning structure 30 includes a cleaning roller 33 having a rotating shaft 31 and a cylindrical sponge body 32 externally fitted to the rotating shaft 31. The sponge body 32 is made of a sponge-like resin having liquid-absorbing properties (for example, polyurethane or the like). The lower part of the sponge body 32 is immersed in the cleaning liquid, and the upper part of the sponge body 32 contacts the surface to be cleaned of the substrate 1 (the surface opposite to the table 10). Further, the rotating shaft 31 rotates around its axis by a driving mechanism (not shown), whereby the sponge body 32 rotates around its axis, and the cleaning liquid absorbed by the sponge body 32 after being immersed in the cleaning liquid is supplied to the surface to be cleaned of the substrate 11, thereby cleaning the surface to be cleaned of the substrate 11.

[0040] Further, as the structure 30 having the cleaning roller 33, it is preferable to adopt a configuration that can relatively move with respect to the substrate in the X-axis direction, Y-axis direction, Z-axis direction, and θ-axis direction that are orthogonal to each other by the moving means 25B. Since the moving means 25B in this case can be configured with the same structure as the moving means 25 shown in FIG. 1, the description of the moving means 25B will be omitted. Further, the cleaning structure 30 may be a cleaning brush structure having a cleaning brush or the like. Even in the case of this cleaning brush, it is preferable that the cleaning liquid is supplied and the cleaning brush holds the cleaning liquid. Note that each of the means 29, 25B, 24, 26, and 27 is controlled by the computer 28B.

[0041] FIG. 6 shows a case where the front surface of the substrate piece 11a (the surface opposite to the table 10 when the substrate 11 is cut as shown in FIG. 3) is cleaned. In this case, the surface to be cleaned may be the back surface of the substrate piece 11a.

[0042] Even when provided with such cleaning means 29, it is possible to suppress the adhesion of foreign substances (such as cutting chips) to the surface on the substrate adsorption side, effectively suppress the intrusion of foreign substances into the inside of the frame body, and thus suppress the contamination inside the apparatus. Further, it is possible to effectively suppress the jamming of foreign substances between the frame body and the substrate, suppress the strong adhesion of foreign substances to the substrate, and supply a clean product with the adhesion of foreign substances suppressed.

[0043] Incidentally, in the embodiment shown in the figure, the cleaning means 29 used a cleaning structure 30 having a cleaning roller, but it may have an injection nozzle for injecting a cleaning liquid. That is, when cleaning the substrate with the cleaning means 29 while the substrate is held by this substrate holding device, an existing cleaning means such as a cleaning liquid spraying mechanism or a cleaning roller can be used, and there is no need to separately provide a cleaning device dedicated to this substrate holding device, contributing to cost reduction.

[0044] Next, FIG. 7 is a simplified block diagram of a substrate cleaning device used in a substrate cleaning method. As shown in FIG. 8, the substrate cleaning method includes a cutting step S1 of cutting the substrate 11 at a cutting stage (not shown), a conveying step S2 of conveying the substrate pieces 11a cut in the cutting step S1 to a cleaning stage (not shown), and a cleaning step S3 of cleaning the substrate pieces 11a conveyed in the conveying step S2 at the cleaning stage.

[0045] Therefore, the cutting stage is provided with a device similar to the substrate cleaning device shown in FIG. 1. That is, it includes a cutting means 43, a table rotation means (table rotation means for cutting process) 44, a moving means 45 for moving the cutting means 43, a negative pressure generating means (negative pressure generating means for cutting process) 46, and a positive pressure generating means (positive pressure generating means for cutting process) 47. Note that the means 43, 44, 45, 46, and 47 have the same configuration as the respective means 23, 24, 25A, 26, and 27 of the substrate cleaning device shown in FIG. 1.

[0046] Also, the cleaning stage is provided with a device similar to the substrate cleaning device shown in FIG. 5. That is, it includes a cleaning means 53, a table rotation means (table rotation means for cleaning process) 54, a moving means 55 for moving the cleaning means 53, a negative pressure generating means (negative pressure generating means for cleaning process) 56, and a positive pressure generating means (positive pressure generating means for cleaning process) 57. Note that the means 53, 54, 55, 56, and 57 have the same configuration as the respective means 29, 24, 25B, 26, and 27 of the substrate cleaning device shown in FIG. 5.

[0047] The conveying means 60 for conveying the substrate piece 11a from the cutting stage to the cleaning stage can be composed of a suction pad for sucking the substrate piece 1a and a moving means for moving the suction pad in the X-axis direction, Y-axis direction, and Z-axis direction that are perpendicular to each other. As the moving means, an XYZ arm or the like can be used. Note that the conveying means 60 only needs to be able to reciprocate and move up and down between the cutting stage and the cleaning stage on the back surface (the surface on the table side) of the substrate 1, so in the horizontal plane, movement in one axial direction may be sufficient.

[0048] By the way, in the cleaning process, when it is desired to clean the surface where the cooling water was sprayed and the opposite surface in the cutting process, it is preferable to invert the substrate piece 11a between the cutting stage and the cleaning stage. For this reason, it is preferable that the conveying means has an inversion mechanism. In this case, the moving means provided with the suction pad may be arranged on the cutting stage side and the cleaning stage side, respectively, and the inversion mechanism may be arranged between the respective moving means.

[0049] Therefore, if the substrate cleaning method is carried out using this substrate cleaning apparatus, in the substrate 11 cut in the cutting process S1, the adhesion of cutting chips is prevented on the frame body 12 side of the substrate 11, and in the cleaning process S3, the substrate 11 can be further cleaned. Moreover, there is no limitation on the surface to be cleaned, and it may be the surface adsorbed by the frame body 12 in the cutting process S1 or the surface opposite to the surface adsorbed by the frame body 12, and both surfaces of the substrate 11 can be stably cleaned. In this case, when one of the surfaces is being cleaned, the adhesion of cutting chips, dust, etc. to the other surface can be prevented.

[0050] Also, the cutting process S1 is performed at the cutting stage, the cleaning process S3 is performed at the cleaning stage, and since it includes a conveying process S2 for conveying a plurality of substrate pieces 11a after performing the cutting process S1 to the cleaning stage, the cutting process S1 and the cleaning process S3 can be performed at each stage, and a plurality of substrate pieces can be conveyed from the cleaning stage to the cleaning stage, thereby improving workability. Note that the cutting process S1 and the cleaning process S3 may be performed at the same stage.

[0051] Table 1 in the above embodiment showed a form in which one outer frame (frame body 16) surrounds one inner frame (frame body 12). However, as shown in FIG. 9, as the table 10, a form in which a plurality of frame bodies 12 are surrounded by one frame body 16 to form a positive pressure portion may be used. In this case, a plurality of tables 10 are arranged, the substrate 11 is disposed on the plurality of tables 10, and the substrate 11 between the adjacent tables 10, 10 is to be cut.

[0052] The present invention is not limited to the above embodiment and various modifications are possible. In each of the above embodiments, the table 10 sucked and held the substrate 1 from below, but the table 10 may suck and hold the substrate 11 from above. When the table 10 sucks and holds the substrate 11 from above, the substrate 11 is washed from below. Further, the hardness of the outer frame (frame body 16) may be made lower than that of the inner frame (frame body 12). In this case, the outer frame is more likely to be deformed than the inner frame, and air is more likely to be ejected from the outer frame, enhancing the effect of preventing contamination. Alternatively, the height of the outer frame may be made lower than that of the inner frame. In this case, air is more likely to be ejected from the outer frame, enhancing the effect of preventing contamination.

[0053] By the way, when the substrate 11 is cut by the cutter 19, as shown in FIG. 3, a hollow portion 70 is formed between the substrate 11 and the base portion 18. For this reason, cutting chips may enter the hollow portion 70. If cutting chips enter, there is a risk that the cutting chips adhere to the substrate piece 11a of the substrate 11. Therefore, the hollow portion 70 may be set to a positive pressure state by a communication hole (not shown) and a positive pressure generating means so that cutting chips are less likely to enter the hollow portion 70. Conversely, a configuration may be adopted in which the hollow portion 70 is set to a negative pressure state by a communication hole (not shown) and a negative pressure generating means, and the cutting chips that have entered are discharged to the outside.

[0054] When cleaning the cutting stage or the cleaning stage, regardless of the negative pressure chamber, the positive pressure portion, and the hollow portion, the communication holes communicating therewith can each be set to either positive pressure or negative pressure.

[0055] As the cleaning liquid, pure water, tap water, or even a cleaning liquid that can be used for substrate cleaning can be used. When cutting the substrate 1 to form the substrate piece 11a, the number, size, etc. of the substrate pieces 1a formed from one substrate 1 can also be arbitrarily set. As the shape of the substrate piece 11a, it may be square or rectangular when viewed planarly. Also, the number, size, wall thickness, etc. of the frame body 12 on the table 10 can be arbitrarily set according to the size of the cut piece 11a, etc.

Explanation of symbols

[0056] S1 Cutting process S2 Conveying process S3 Cleaning process 11 Substrate 11a Substrate piece 12 First frame body 13 Negative pressure chamber 15 Positive pressure part 16 Second frame body 20 Cutter 21 Cooling injection nozzle 23 Cutting means 25 Moving means 29 Cleaning means 30 Cleaning structure 30 Conveying means 45 Moving means 53 Cleaning means 55 Moving means

Claims

1. A substrate holding device for holding a substrate on a table, wherein the table has a first frame and a second frame for supporting the substrate, and a base portion having the first frame and the second frame attached to a surface facing the substrate, the first frame forms a negative pressure portion capable of generating a negative pressure between the substrate and the base portion to adsorb the substrate, and the second frame forms a positive pressure portion for generating a positive pressure around the negative pressure portion, a substrate holding device characterized by this.

2. The substrate holding device according to claim 1, characterized in that one second frame surrounds one first frame.

3. The substrate holding device according to claim 1, characterized in that one second frame surrounds a plurality of first frames.

4. With a plurality of first frames and second frames arranged at a predetermined pitch, in a state where the substrate is held, the substrate is cut and fragmented, and the cutting location is between adjacent first frames, a substrate holding device characterized by this according to claim 1.

5. The substrate is cut by a cutting means, the cutting means includes a disk-shaped cutter provided with a blade portion on the outer peripheral side, a drive source for rotating this cutter around its axis, a medium injection mechanism for injecting a cooling medium to the cutting site and its periphery, and a moving means for moving at least the cutter and the medium injection port of the medium injection mechanism along the XYZθ3-axis directions, a substrate holding device characterized by this according to claim 4.

6. The substrate holding device according to claim 1, characterized in that the substrate is cleaned by a cleaning means in a state where the substrate is held.

7. The substrate holding device according to claim 6, characterized in that the cleaning means is constituted by a cleaning liquid spraying mechanism for spraying a cleaning liquid onto the surface of the substrate to be cleaned.

8. The cleaning means has a cleaning structure having at least one of a cleaning roller and a cleaning brush, and the substrate holding device according to claim 6, wherein a cleaning liquid is supplied from the cleaning structure to the surface of the substrate to be cleaned.

9. A substrate cleaning method comprising a cutting step of using the substrate holding device according to claim 1 as a holding device for cutting, and a cleaning step of using the substrate holding device according to claim 1 as a holding device for cleaning, In the cutting step, the substrate is cut into small pieces while being held by the holding device for cutting, and in the cleaning step, a plurality of substrate pieces cut in the cutting step are cleaned while being held by the holding device for cleaning.

10. The cutting step is performed at a cutting stage, the cleaning step is performed at a cleaning stage, and the substrate cleaning method according to claim 9, further comprising a conveying step of conveying a plurality of substrate pieces after the cutting step to the cleaning stage.

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