Laminate film, and method for producing pattern member

Abstract

To provide a laminate film provided with a masking film, capable of preventing adhesion of a foreign matter derived from a tackiness agent when partly coating, plating, or etching an adherend using the masking film.SOLUTION: A laminate film of a masking film has a first plane, and a second plane positioned on an opposite side of the first plane, where the first plane comprises a first layer bonded to an adherend, and a second layer laminated on the first plane of the first layer and releasable from the first layer, the second layer is a layer removed after forming a pattern part necessary when partly coating, plating, or etching the adherend on the first layer before bonding the first layer to the adherend.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a laminated film and a pattern member.

Background Art

[0002] When partially coating, plating, etching, etc. a member, a masking film may be used. For example, a masking film subjected to punching or the like is attached to the member to mask non-coated portions, non-plated portions, non-etched portions, etc. of the member, and then coating, plating, etching, etc. are performed.

[0003] More specifically, when partially plating a connection terminal portion or the like of a flexible printed circuit board, it is used to mask a non-plated portion, and a multi-layer film composed of a layer (layer A) having a tensile elastic modulus of 1 to 250 kg / mm 2 and a layer (layer B) having a tensile elastic modulus of 200 to 700 kg / mm 2 is used as a support, and an adhesive layer is provided on the A layer side of the support. A protective film for plating mask characterized by this is known (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] When a mask pattern is formed by subjecting a conventional masking film to punching or the like, foreign matters (for example, foreign matters derived from an adhesive) generated during mask pattern formation such as during punching may adhere to the surface of the masking film. If foreign matters adhere to the surface of the masking film, there is a risk that the adherend to which the masking film is attached will be contaminated or the effect of the masking film will be reduced.

[0006] An object of the present disclosure is to provide a laminated film including a masking film and capable of suppressing adhesion of foreign matters derived from an adhesive when partially coating, plating, or etching an adherend using the masking film, and a method for manufacturing a pattern member capable of manufacturing a pattern member in which adhesion of foreign matters derived from the adhesive is suppressed when partially coating, plating, or etching the adherend.

Means for Solving the Problems

[0007] Specific means for achieving the above problems are as follows. <1> A first layer having a first surface and a second surface located on the side opposite to the first surface, the first surface being a layer to be attached to an adherend, The first layer is a masking film, A second layer laminated on the first surface of the first layer and peelable from the first layer, The second layer is a laminated film that is removed before attaching the first layer to the adherend after forming a pattern portion necessary for partially coating, plating, or etching the adherend on the first layer. <2> The laminated film according to <1>, wherein the tensile elastic modulus of the first layer is 1000 MPa to 4000 MPa. <3> The laminated film according to <1> or <2>, wherein the tensile elastic modulus of the second layer is 1000 MPa to 4000 MPa. <4> The laminated film according to any one of <1> to <3>, wherein the first layer includes a base material layer and an adhesive layer on the first surface side. <5> The laminated film according to <4>, wherein the thickness of the base material layer is 30 μm to 70 μm. <6> The laminated film according to <4> or <5>, wherein the thickness of the adhesive layer is 4 μm to 10 μm. <7> The laminated film according to any one of <1> to <6>, wherein the adhesive force of the first layer is 0.5 N / 25 mm or more. <8> The laminated film according to any one of <1> to <7>, wherein the peel force of the second layer is 1.0 N / 25 mm or more. <9> Form a pattern portion necessary when partially coating, plating, or etching the adherend on the first layer, and peel the second layer from the laminated film according to any one of <1> to <8>; Attach the first surface of the first layer on which the pattern portion is formed to the adherend; Form a pattern corresponding to the pattern portion on the adherend by coating, plating, or etching to obtain a patterned member having a pattern formed on the adherend. A method for manufacturing a patterned member.

Advantages of the Invention

[0008] According to one aspect of the present disclosure, there is provided a laminated film including a masking film, capable of suppressing the adhesion of foreign substances derived from an adhesive when partially coating, plating, or etching an adherend using the masking film, and a method for manufacturing a patterned member capable of manufacturing a patterned member in which the adhesion of foreign substances derived from an adhesive is suppressed when partially coating, plating, or etching an adherend.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values and their ranges, which do not limit the present invention. The configurations described in each embodiment may be combined as appropriate.

[0011] In the present disclosure, in the numerical range indicated using "~", the numerical values described before and after "~" are included as the minimum value and the maximum value, respectively. In the numerical ranges described stepwise in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of the numerical range of other stepwise descriptions. Further, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples. In the present disclosure, the "second layer peelable from the first layer" means that the second layer can be peeled off while the first layer remains intact and maintains its shape.

[0012] [Laminated Film] The laminated film of the present disclosure has a first surface and a second surface located on the side opposite to the first surface, and includes a first layer whose first surface is attached to an adherend, and a second layer laminated on the first surface of the first layer and peelable from the first layer. The first layer is a masking film, and the second layer is a layer that is removed before attaching the first layer to the adherend after forming a pattern portion necessary for partially coating, plating, or etching the adherend on the first layer.

[0013] As the laminated film, there is also a configuration including a first layer that is a masking film and has a first surface and a second surface located on the side opposite to the first surface, a second layer peelable from the first layer provided on the first surface, and a third layer peelable from the first layer provided on the second surface. In this case, when punching or the like is performed on the laminated film in the direction in which the second layer, the first layer, and the third layer are laminated, it is possible to suppress foreign matter generated during mask pattern formation, such as during punching, from adhering to the surface of the masking film (for example, the first surface and the second surface of the first layer). Thereby, for example, when the masking film after mask pattern formation is attached to the adherend after peeling off the third layer, it is possible to suppress the adherend from being contaminated. Further, it is possible to suppress a reduction in the masking effect due to foreign matter adhering to the masking film.

[0014] On the other hand, in a laminated film in which a second layer, a first layer, and a third layer are laminated, the second layer and the first layer, and the third layer and the second layer are respectively attached by an adhesive layer. When the above-described punching process or the like is performed on this laminated film, a mask pattern is formed on the first layer by peeling the third layer or the second layer together with the punched portion. At this time, there is a possibility that the adhesive of the adhesive layer exposed at the punched portion of the laminated film may protrude into the mask pattern portion. For example, when punching is performed on the first layer and the third layer from the third layer side, the adhesive layer between the first layer and the third layer is exposed at the punched portion, and there is a possibility that the adhesive of the adhesive layer may protrude into the mask pattern portion. If the adhesive protrudes into the mask pattern portion, foreign matter derived from the adhesive may adhere to the adherend when painting, plating, or etching.

[0015] The laminated film of the present disclosure includes a first layer attached to an adherend and a second layer separable from the first layer. The first layer is a masking film, and the second layer is a layer that is removed before attaching the first layer to the adherend after forming a pattern portion necessary for partially painting, plating, or etching the adherend on the first layer. By punching the laminated film of the present disclosure from the first layer side and peeling the second layer, a pattern portion necessary for partially painting, plating, or etching the adherend is formed on the first layer. Further, in the laminated film of the present disclosure, since the third layer is not provided, the adhesive does not protrude from the adhesive layer between the first layer and the third layer at the punched portion. Therefore, adhesion of foreign matter derived from the adhesive to the adherend during painting, plating, or etching is suppressed. By using the laminated film of the present disclosure, a pattern member with suppressed adhesion of foreign matter can be manufactured.

[0016] The laminated film may be a laminated film in which a pattern portion is formed at least on the first layer by punching or the like, or a laminated film in which pattern portions are formed on the first layer and the second layer respectively by punching or the like. Further, the laminated film may be a laminated film in which the first layer is punched and the second layer is half-cut. When the second layer is half-cut, the punched portion of the first layer may also be peeled off when the second layer is peeled off from the laminated film. The laminated film may be a film wound by a roll member or the like.

[0017] (First layer) The laminated film of the present disclosure is a masking film and includes a first layer having a first surface and a second surface located on the side opposite to the first surface. The first surface is the surface to be attached to the adherend. The first surface and the second surface may each be a main surface of the first layer. The main surface of the first layer refers to a pair of surfaces having the largest area among the surfaces of the first layer.

[0018] The tensile elastic modulus of the first layer is preferably 1000 MPa to 4000 MPa, more preferably 2000 MPa to 4000 MPa, and even more preferably 3000 MPa to 4000 MPa from the viewpoint of ensuring the strength of the first layer and suppressing deformation, wrinkle generation, etc. during peeling of the second layer. In the present disclosure, the tensile elastic modulus of each layer is a value measured at 25 °C based on JIS K 7161 (2014).

[0019] The material of the first layer is not particularly limited, and examples thereof include polymer materials such as polyethylene, polypropylene, polystyrene, polyethylene terephthalate, and polybutylene terephthalate. Among them, polyethylene terephthalate, polybutylene terephthalate, etc. are preferable.

[0020] The thickness of the first layer is preferably 20 μm to 80 μm, more preferably 35 μm to 70 μm, and even more preferably 40 μm to 60 μm. When the thickness of the first layer is 20 μm or more, the shape tends to be suitably maintained when other layers are peeled off. When the thickness of the first layer is 80 μm or less, pooling of liquid at the edge of the pattern portion during coating, reduction in coating film thickness accuracy, reduction in plating quality due to air bubble pooling during plating, and seepage of the treatment liquid from the edge portion of the pattern portion due to insufficient follow-up to the unevenness of the adherend surface are suppressed. Furthermore, when the thickness of the first layer is 35 μm or more, shape deformation of the punched portion is less likely to occur when the punched portion is formed in the first layer, and the positional accuracy of the punched portion is excellent when the first layer is attached to the adherend. The thickness of each layer is determined, for example, as the arithmetic mean value of the thicknesses at any three locations observed and measured by observing the cross-section of each layer using a laser microscope.

[0021] The first layer may be provided with an adhesive layer on the first surface side to be attached to the adherend, and may have a configuration including, for example, a base material layer and an adhesive layer.

[0022] When the first layer includes a base material layer and an adhesive layer, examples of the material of the base material layer include the same materials as those of the first layer described above. The thickness of the base material layer is preferably 20 μm to 70 μm, more preferably 30 μm to 70 μm, and even more preferably 35 μm to 60 μm. The thickness of the adhesive layer is preferably 1 μm to 20 μm, more preferably 4 μm to 10 μm, and even more preferably 4 μm to 5.5 μm. When the thickness of the base material layer is 30 μm or more, shape deformation of the punched portion is less likely to occur when the punched portion is formed in the first layer, and the positional accuracy of the punched portion is excellent when the first layer is attached to the adherend. When the thickness of the adhesive layer is 4 μm to 5.5 μm, the first layer has excellent adhesion to the adherend, and when the adherend is plated, seepage at the edge of the plating and roughness of the plated surface are less likely to occur.

[0023] Examples of the adhesive used for the adhesive layer include commonly used acrylic adhesives, natural rubber adhesives, synthetic rubber adhesives, silicone adhesives, and mixed adhesives thereof. The adhesive layer may contain components other than the adhesive, and may contain a crosslinking agent, an adhesion promoter, etc.

[0024] Examples of the method for forming the adhesive layer include, for example, a method in which an adhesive composition having an adjusted viscosity by dissolving an adhesive in an organic solvent is applied to a base material layer, and then the applied adhesive composition is dried. Other methods include a method of applying a molten adhesive to a base material layer, a method of applying an adhesive dispersed in water to a base material layer, etc.

[0025] (Second layer) The laminated film of the present disclosure includes a second layer that is peelable from the first layer provided on the first surface. The second layer is a layer that is removed after forming a pattern portion necessary for partially coating, plating, or etching the adherend on the first layer and before attaching the first layer to the adherend.

[0026] The tensile elastic modulus of the second layer is preferably 1000 MPa to 4000 MPa, more preferably 2000 MPa to 4000 MPa, and even more preferably 3000 MPa to 4000 MPa. When the tensile elastic modulus of the second layer is 1000 MPa or more, it is suppressed that the second layer is too soft. Thereby, when punching or the like is performed, sagging (for example, a phenomenon in which the first layer is pulled by the second layer when punching, meaning rounding of the corners, etc.) at the punched end of the first layer is suppressed. By suppressing the occurrence of sagging, the first layer has excellent adhesion to the adherend, and when the adherend is plated, seepage at the edge of the plating and roughness of the plated surface are less likely to occur.

[0027] The material of the second layer is not particularly limited, and examples thereof include polymer materials such as polyethylene, polypropylene, polystyrene, polyethylene terephthalate, and polybutylene terephthalate. Among them, polyethylene terephthalate, polybutylene terephthalate, etc. are preferable. In the second layer, a release treatment may be performed on the surface facing the first surface of the first layer.

[0028] The thickness of the second layer is preferably 40 μm to 100 μm, and more preferably 40 μm to 75 μm.

[0029] The adhesive strength of the first layer is preferably 0.5 N / 25 mm or more, more preferably 0.7 N / 25 mm or more, and even more preferably 0.8 N / 25 mm or more. From the viewpoint of the ease of peeling after forming a pattern portion on the adherend, the adhesive strength of the first layer is preferably 2.0 N / 25 mm or less, more preferably 1.5 N / 25 mm or less. From the viewpoint of suppressing adhesive residue on the first layer after peeling the second layer, it is even more preferably 1.0 N / 25 mm or less. When the adhesive strength of the first layer is 0.7 N / 25 mm or more, the first layer has excellent adhesion to the adherend, and when plating treatment is performed on the adherend, infiltration at the edge portion of the plating and roughness of the plating surface are less likely to occur. In the present disclosure, the adhesive strength of the first layer means the maximum value of the peel strength when a laminate in which a first layer having a width of 25 mm is attached to an adherend (material: stainless steel plate) (for example, a laminate in which the surface on the adhesive layer side of the first layer having a width of 25 mm is attached to the adherend (material: stainless steel plate)) is prepared, and using a tensile tester, the adherend is pulled in a direction perpendicular to the interface with the first layer at a tensile speed of 200 mm / min and a temperature of 23 °C to peel between the adherend and the first layer.

[0030] The peel force of the second layer is preferably 0.5 N / 25 mm or more, more preferably 1.0 N / 25 mm or more, and even more preferably 1.5 N / 25 mm or more. The peel strength of the second layer is preferably 4.0 N / 25 mm or less, more preferably 3.5 N / 25 mm or less, and even more preferably 3.0 N / 25 mm or less. When the peel strength of the second layer is 1.0 N / 25 mm or more, the adhesion between the first layer and the second layer is excellent, and after forming the pattern portion on the first layer, the punched portion of the first layer can be easily removed. In the present disclosure, the peel strength of the second layer means the maximum value of the peel strength when a laminated film having a width of 25 mm is prepared, and using a tensile tester, the first layer is pulled in a direction of 180° with respect to the interface with the second layer under the conditions of a tensile speed of 200 mm / min and a temperature of 23°C to peel between the first layer and the second layer.

[0031] Each of the adhesive strength of the first layer and the peel strength of the second layer may be appropriately adjusted, for example, by providing an adhesive layer on the first layer and adjusting the composition of each adhesive layer, the thickness of the adhesive layer, etc. For the second layer, a release treatment may be performed on the surface facing the first surface of the first layer and adjusted as appropriate.

[0032] [Method for manufacturing a pattern member] Hereinafter, a method for manufacturing a pattern member of the present disclosure will be described. In the method for manufacturing a pattern member of the present disclosure, a pattern portion necessary when partially coating, plating, or etching the adherend is formed on the first layer, and the second layer is peeled from the above-described laminated film of the present disclosure; a step of attaching the first surface of the first layer on which the pattern portion is formed to the adherend; and a step of forming a pattern corresponding to the pattern portion on the adherend by coating, plating, or etching to obtain a pattern member having a pattern formed on the adherend. Thereby, a pattern member having a pattern corresponding to the pattern portion can be manufactured. Further, by using the laminated film of the present disclosure, a pattern member with suppressed foreign matter adhesion can be obtained.

[0033] In the manufacturing method of the present disclosure, punching or the like may be performed on the laminated film in the direction in which the first layer and the second layer are laminated. After the punching process, the second layer may be peeled off from the first layer. By performing the punching process from the first layer side, the second layer is half-cut, and when the second layer is peeled off from the laminated film, the punched portion of the first layer may also be peeled off. Through these processes, a first layer with a pattern portion necessary for partially coating, plating, or etching the adherend is obtained.

[0034] Next, the first surface of the first layer with the pattern portion formed thereon is attached to the adherend.

[0035] Specific examples of the material of the adherend include metal plates such as copper, aluminum, iron, stainless steel, and brass, metal bars, metal foils, etc.; resin plates and resin sheets such as polyethylene, polypropylene, polycarbonate, vinyl chloride, polyimide, epoxy resin, and phenolic resin; printed circuit boards, and the like.

[0036] Finally, a pattern corresponding to the pattern portion is formed on the adherend by coating, plating, or etching. After the pattern is formed, the first layer is peeled off from the pattern member to obtain a pattern member with the pattern formed thereon.

[0037] Hereinafter, with reference to FIGS. 1 and 2, the specific configuration of the laminated film of the present disclosure will be described. FIG. 1 is a schematic configuration diagram of the laminated film of the present disclosure, and FIG. 2 is a schematic diagram showing an example of the usage method of the laminated film of the present disclosure.

[0038] As shown in FIGS. 1 and 2(a), the laminated film 100 includes a first layer 1 and a second layer 2, which are masking films. An adhesive layer is provided on the first surface of the first layer 1, and the surface of the first layer 1 on the adhesive layer side is attached to the second layer 2.

[0039] In FIG. 2(b), punching is performed from the first layer 1 side, and the second layer 2 is half cut. As shown in FIG. 2(c), by peeling the half-cut second layer 12 from the first layer 11 having a punched portion, the punched portion 3 in the first layer 1 and the half-cut second layer 12 are peeled from the first layer 11. Thereby, the first layer 11 having a punched portion is obtained.

[0040] Next, as shown in FIG. 2(d), the adherend 4 is attached to the first surface of the first layer 11 having a punched portion.

[0041] For the laminate including the first layer 11 having a punched portion and the adherend 4, painting, plating, or etching is performed. After performing painting, plating, or etching, the first layer 11 having a punched portion is peeled from the laminate. Thereby, as shown in FIG. 2(e), for the adherend 4, a process of painting, plating, or etching is performed on the portion that faced the punched portion of the first layer 11, and a pattern member 5 having a processed portion 6 is obtained.

[0042] Hereinafter, with reference to FIG. 3, a laminated film to be a comparison target will be described. FIG. 3 is a schematic diagram showing an example of a usage method of the laminated film to be a comparison target.

[0043] As shown in FIG. 3(a), the laminated film 200 to be a comparison target includes a third layer 30, a first layer 10 which is a masking film, and a second layer 20 in this order. The first layer 10 includes an adhesive layer, and the surface of the first layer 10 on the adhesive layer side may be attached to the second layer 20. The third layer 30 includes an adhesive layer, and the surface of the third layer 30 on the adhesive layer side may be attached to the first layer 10.

[0044] In FIG. 3(b), after the third layer 30 side, the third layer 30 and the first layer 10 are punched, and the second layer 20 is half-cut, the second layer 20 is peeled from the first layer 10, whereby the punched portions 40, 50 in the first layer 10 and the third layer 30, and the half-cut second layer 120 are peeled from the laminated film 200. Thereby, a laminated film including the first layer 110 having a punched portion and the third layer 130 having a punched portion is obtained.

[0045] Next, as shown in FIG. 3(c), an adherend 60 is attached to the second surface of the first layer 110 having a punched portion.

[0046] Then, by peeling the third layer 130 having a punched portion from the first layer 110 having a punched portion, as shown in FIG. 3(d), a laminate including the first layer 110 having a punched portion and the adherend 60 is obtained.

[0047] For the laminate including the first layer 110 having a punched portion and the adherend 60, painting, plating, or etching is performed. After performing painting, plating, or etching, the first layer 110 having a punched portion is peeled from the laminate. Thereby, as shown in FIG. 3(e), for the adherend 60, a processing portion 70 is formed by performing painting, plating, or etching on the portion facing the punched portion of the first layer 110, and a pattern member 160 having the processing portion 70 is obtained.

[0048] In the laminated film to be used as a comparison target, there is a possibility that the adhesive of the adhesive layer exposed at the punched portion may protrude into the mask pattern portion. Specifically, at the punched portion, the adhesive layer between the first layer 110 and the third layer 130 is exposed, and there is a possibility that the adhesive of the adhesive layer may protrude into the mask pattern portion. If the adhesive protrudes into the mask pattern portion, foreign matter derived from the adhesive may adhere to the adherend when painting, plating, or etching is performed.

[0049] On one hand, in the laminated film of the present disclosure, when partially coating, plating, or etching an adherend by punching the laminated film of the present disclosure from the first layer side and peeling the second layer, a pattern portion necessary for the above is formed on the first layer. Further, in the laminated film of the present disclosure, since the third layer is not provided, the adhesive does not ooze out from the adhesive layer between the first layer and the third layer at the punched portion. Therefore, the adhesion of foreign matter derived from the adhesive to the adherend during coating, plating, or etching is suppressed. By using the laminated film of the present disclosure, a pattern member with suppressed adhesion of foreign matter can be manufactured.

Example

[0050] Next, the present invention will be specifically described with reference to examples, but the scope of the present invention is not limited to these examples.

[0051] [Comparative Example 1] (Production of laminated film) A masking film (first layer) having a base material layer (material: polypropylene, PP) and an adhesive layer shown in Table 1 was produced, a second layer (material: polypropylene, PP) shown in Table 1 was prepared, and a third layer having a base material layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1 was produced. The adhesive layers of the masking film and the third layer were each produced by applying and drying an adhesive composition in which the following components were diluted to the base material layer. Next, the surface of the third layer where the adhesive layer was formed was attached to the surface side of the first layer where the adhesive layer was not formed under the conditions of 25°C and 0.40 MPa, and the second layer was attached to the surface side of the first layer where the adhesive layer was formed under the conditions of 25°C and 0.40 MPa, thereby producing a laminated film in which the third layer, the first layer, and the second layer were arranged in this order. In Comparative Example 1 and each of the following examples, an adhesive composition containing the following components was used for forming the adhesive layers of the first layer and the third layer, respectively. -Components of the adhesive composition used for forming the adhesive layer of the first layer- ·Acrylic adhesive: 100 parts by mass of HTR-280 (Nagase ChemteX Corporation) · Crosslinking agent: 5 parts by mass of Melan X66 (Resonac Co., Ltd.) · Tackifier: 25 parts by mass of YS Polyster U130 (Yasuhara Chemical Co., Ltd.) - Components of the pressure-sensitive adhesive composition used for forming the third pressure-sensitive adhesive layer · Acrylic pressure-sensitive adhesive: 100 parts by mass of AS-460 (Lion Specialty Chemicals Co., Ltd.) · Crosslinking agent: 6 parts by mass of Duranate TKA75E (Asahi Kasei Chemicals Corporation)

[0052] [Example 1] A masking film (first layer) having a base material layer (material: polyethylene terephthalate, PET) and a pressure-sensitive adhesive layer shown in Table 1 was produced, and a second layer (material: polypropylene, PP) shown in Table 1 was prepared. The pressure-sensitive adhesive layer of the masking film was produced by applying and drying a pressure-sensitive adhesive composition obtained by diluting the above-described components to the base material layer. A laminated film in which the second layer was attached to the surface side on which the pressure-sensitive adhesive layer of the first layer was formed under the conditions of 25°C and 0.40 MPa was produced, and the laminated film was arranged in the order of the first layer and the second layer.

[0053] [Example 2] A masking film (first layer) having a base material layer (material: polyethylene terephthalate, PET) and a pressure-sensitive adhesive layer shown in Table 1 was produced, and a second layer (material: polyethylene terephthalate, PET) shown in Table 1 was prepared. A laminated film arranged in the order of the first layer and the second layer was produced in the same manner as in Example 1.

[0054] [Example 3] A masking film (first layer) having a base material layer (material: polyethylene terephthalate, PET) and a pressure-sensitive adhesive layer shown in Table 1 was produced, and a second layer (material: polyethylene terephthalate, PET) shown in Table 1 was prepared. A laminated film arranged in the order of the first layer and the second layer was produced in the same manner as in Example 1. Note that it was the same as Example 2 except that the thickness of the pressure-sensitive adhesive layer of the first layer was changed from 6 μm to 5 μm.

[0055] [Example 4] A masking film (first layer) comprising a base material layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1 was produced, and a second layer (material: polyethylene terephthalate, PET) shown in Table 1 was prepared. A laminated film arranged in the order of the first layer and the second layer was produced in the same manner as in Example 1. Note that it is the same as in Example 3 except that the thickness of the base material layer of the first layer was changed from 50 μm to 38 μm.

[0056] [Example 5] A masking film (first layer) comprising a base material layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1 was produced, and a second layer (material: polyethylene terephthalate, PET) shown in Table 1 was prepared. A laminated film arranged in the order of the first layer and the second layer was produced in the same manner as in Example 1. Note that it is the same as in Example 4 except that the thickness of the adhesive layer of the first layer was changed from 5 μm to 6 μm.

[0057] [Example 6] A masking film (first layer) comprising a base material layer (material: polyethylene terephthalate, PET) and an adhesive layer shown in Table 1 was produced, and a second layer (material: polyethylene terephthalate, PET) shown in Table 1 was prepared. A laminated film arranged in the order of the first layer and the second layer was produced in the same manner as in Example 1. Note that it is the same as in Example 4 except that the thickness of the adhesive layer of the first layer was changed from 5 μm to 3 μm.

[0058] Regarding the laminated films produced in Comparative Example 1 and each example, the following characteristics were evaluated. The evaluation results are shown in Table 1.

[0059] [Position accuracy of the punched part during pasting] A punching portion with a length of 10 mm and a width of 10 mm and a pitch (center - to - center distance) between punching portions of 30 mm was formed in the laminated film (length: 10 m, width: 50 mm) obtained in Comparative Example 1 by punching from the third - layer side. Then, after applying tension to the laminated film, the second layer was peeled off, and after obtaining a laminated film after peeling having the third layer and the first layer, the surface on the adhesive layer side of the first layer was attached to an adherend (material: copper plate). On the other hand, in the laminated film (length: 10 m, width: 50 mm) obtained in each Example, a punching portion with a length of 10 mm and a width of 10 mm and a pitch (center - to - center distance) between punching portions of 30 mm was formed by punching from the masking film (first layer) side. Then, after applying tension to the laminated film, the second layer was peeled off, and the surface on the adhesive layer side of the first layer where the punching portion was formed was attached to an adherend (material: copper plate). The position of the punching portion after attaching the first layer to the adherend was confirmed and evaluated according to the following evaluation criteria. [Evaluation Criteria] A: No shape deformation of the punching portion was observed, and the first layer, which is the masking film, could be attached to the target location. B: Shape deformation of the punching portion was observed, or the attachment position deviated from the target location.

[0060] [Adhesive Oozing] A punching portion with a length of 10 mm and a width of 10 mm and a pitch (center - to - center distance) between punching portions of 30 mm was formed in the laminated film (length: 10 m, width: 50 mm) obtained in Comparative Example 1 by punching from the third - layer side. Then, the second layer was peeled off, the surface on the third - layer side of the first layer was observed, and the adhesive oozing was evaluated according to the following criteria. On the other hand, in the laminated film (length: 10 m, width: 50 mm) obtained in each Example, a punching portion with a length of 10 mm and a width of 10 mm and a pitch (center - to - center distance) between punching portions of 30 mm was formed by punching from the masking film (first layer) side. Then, the second layer was peeled off, and the surface (second surface) opposite to the side where the second layer was disposed of the first layer was observed, and the adhesive oozing was evaluated according to the following criteria. A: At the punched part, no adhesive overflow was observed. B: At the punched part, adhesive overflow was observed.

[0061] [Measurement of peel strength and adhesive strength] A laminated film with a width of 25 mm was prepared. Using a tensile testing machine, under the conditions of a tensile speed of 200 mm / min and a temperature of 23 °C, the maximum value of the peel strength when the first layer was peeled from the second layer by pulling in a direction of 180° with respect to the interface between the first layer and the second layer was measured, and this value was taken as the peel force. Regarding the adhesive strength, a laminate obtained by attaching the surface on the adhesive layer side of the first layer to an adherend (material: stainless steel plate) at 23 °C and a linear pressure of 5880 N / m was used. Using a tensile testing machine, under the conditions of a tensile speed of 200 mm / min and a temperature of 23 °C, the maximum value of the peel strength when the adherend was peeled from the first layer by pulling in a direction of 90° with respect to the interface between the adherend and the first layer was measured, and this value was taken as the adhesive strength.

[0062] [Table 1]

[0063] In Examples 1 to 6, the positional accuracy of the punched part was excellent when attached to the adherend, and the overflow of the adhesive was suppressed. [Explanation of symbols]

[0064] 1, 10 First layer (masking film) 2, 20 Second layer 30 Third layer 4, 60 Adherend 5, 160 Pattern member 6, 70 Processing part 11, 110 First layer having a punched part 12, 120 Half-cut second layer 3, 40, 50 Punched parts 100, 200 Laminated film 130 Third layer having a punched part

Claims

1. A first layer having a first surface and a second surface located on the side opposite to the first surface, the first surface being attached to an adherend, and a second layer laminated on the first surface of the first layer and peelable from the first layer. The first layer is a masking film. The second layer is a laminated film that is removed before attaching the first layer to the adherend after forming a pattern portion necessary for partially coating, plating, or etching the adherend on the first layer.

2. The laminated film according to claim 1, wherein the tensile elastic modulus of the first layer is 1000 MPa to 4000 MPa.

3. The laminated film according to claim 1, wherein the tensile elastic modulus of the second layer is 1000 MPa to 4000 MPa.

4. The laminated film according to claim 1, wherein the first layer includes a base material layer and an adhesive layer on the first surface side.

5. The laminated film according to claim 4, wherein the thickness of the base material layer is 30 μm to 70 μm.

6. The laminated film according to claim 4, wherein the thickness of the adhesive layer is 4 μm to 10 μm.

7. The laminated film according to claim 1, wherein the adhesive force of the first layer is 0.5 N / 25 mm or more.

8. The laminated film according to claim 1, wherein the peel force of the second layer is 1.0 N / 25 mm or more.

9. A step of forming a pattern portion necessary for partially coating, plating, or etching the adherend on the first layer and peeling the second layer from the laminated film according to any one of claims 1 to 8; A step of attaching the first surface of the first layer on which the pattern portion is formed to the adherend; A step of forming a pattern corresponding to the pattern portion on the adherend by coating, plating, or etching to obtain a patterned member having a pattern formed on the adherend. A method for manufacturing a patterned member.

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