Substrate transfer arm and device using the same

Abstract

To provide a substrate transfer arm and a device using the same.SOLUTION: A substrate transfer arm more concretely prevents a substrate from adhering thereto, and reduces a contaminant between the substrate transfer arm and the substrate during the movement of the substrate transfer arm. The substrate transfer arm may comprise: a main body unit; and a plurality of substrate attachment units coupled to the main body unit. Each of the substrate attachment units comprises: a stop unit; and a pad unit that is coupled to the main body unit. The pad unit is inclined toward a first direction to the main body unit.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a substrate transfer arm and an apparatus using the same, and more particularly, to a substrate transfer arm for preventing a substrate from adhering to the arm and reducing particles generated during movement of the substrate.

Background Art

[0002] A substrate transfer arm transfers a substrate from a substrate handling chamber of a substrate processing cluster tool to a reaction chamber, or vice versa, or the substrate transfer arm transfers a substrate between reaction chambers in a multi-reaction chamber, or the substrate transfer arm transfers a substrate from a substrate storage stage (e.g., a front opening unified pod (FOUP)) to a load lock chamber within a substrate transfer chamber (e.g., an equipment front end module (EFEM)), or vice versa.

[0003] FIG. 1A shows an existing substrate transfer arm, and FIG. 1B shows a cross-sectional view of the substrate transfer arm of FIG. 1A with a substrate placed thereon.

[0004] In FIG. 1A, the substrate transfer arm 100 may include a main body unit 101, a stop unit 102, a pad unit 103, and a clamp unit 104 that clamps the substrate 106 to assist in placing the substrate 106 on the substrate transfer arm 100.

[0005] In FIG. 1B, when the substrate 106 is placed on the substrate transfer arm 100, an edge of the substrate 106 may be placed on the inclined upper surface 105 of the pad unit 103. The edge of the substrate 106 may slide and be positioned on the upper surface 105 of the pad unit 103. The pad unit 103 may be formed of a plastic such as glassy carbon.

[0006] However, the method of placing the substrate 106 on the substrate transfer arm 100 according to FIG. 1B (i.e., the edge contact method) may generate contaminants such as particles due to friction between the edge of the substrate 106 and the upper surface 105 of the pad unit 103.

[0007] In the edge contact method, when the clamp unit 104 releases the clamp on the substrate 106, the substrate 106 can slide backward on the pad 103 unit. As a result, the substrate may deviate from the correct placement position on the substrate support (not shown).

[0008] FIG. 2A shows another existing substrate transfer arm, and FIG. 2B shows a cross-sectional view of the substrate transfer arm of FIG. 2A with a substrate placed thereon.

[0009] In FIG. 2B, when the substrate 106 is placed on the substrate transfer arm 100, the substrate 106 can be placed on the flat upper surface of the pad unit 107. The pad unit 107 may be made of a plastic such as glassy carbon and may be fixed to the main body unit 101. Since the upper surface of the pad unit 107 wears due to the friction between the lower surface of the substrate 106 and the upper surface of the pad unit 107, the substrate may not be slidable and rotatable.

[0010] In the method of placing the substrate 106 on the substrate transfer arm 100 according to FIG. 2B (i.e., the back contact method), the friction between the lower surface of the substrate 106 and the upper surface of the pad unit 107 may generate adhesion of the substrate and contaminants such as particles.

[0011] The substrate attached to the substrate transfer arm 100 by the back contact method may further deviate from the correct placement position on the substrate support when placed on the substrate support (not shown in this specification). SUMMARY OF THE INVENTION

[0012] The present disclosure discloses a substrate transfer arm, and more specifically, a substrate transfer arm for reducing contaminants between the substrate transfer arm and the substrate and preventing the substrate from adhering to the substrate transfer arm.

[0013] In one or more embodiments, the substrate transfer arm may include a main body unit and a plurality of substrate mounting units coupled to the main body unit. Each of the substrate mounting units may include a stop unit and a pad unit coupled to the main body unit, and the pad unit may be inclined with respect to the main body unit.

[0014] In one or more embodiments, the pad unit of the substrate transfer arm may be inclined with respect to the main body by about 5° to about 30°.

[0015] In one or more embodiments, the pad unit may be inclined in a first direction perpendicular to the moving direction of the substrate transfer arm.

[0016] In one or more embodiments, the pad unit may be inclined in a second direction perpendicular to the moving direction of the substrate transfer arm, which is different from the first direction.

[0017] In one or more embodiments, the pad unit may include a rotatable unit, a support unit for supporting the rotatable unit, and a fixing unit for fixing the rotatable unit to the support unit. The support unit may be inclined with respect to the main body unit.

[0018] In one or more embodiments, the rotatable unit may include a roller.

[0019] In one or more embodiments, the edge of the roller may have a round shape.

[0020] In one or more embodiments, the rotatable unit may be formed of at least celazol, FFPM (perfluoroelastomer), ceramic, glass carbon, or a mixture thereof.

[0021] In one or more embodiments, the stop unit may include a first portion and a second portion, and the inside of the second portion may be inclined more with respect to the main body than the inside of the first portion.

[0022] In one or more embodiments, the horizontal cross-sectional width of the lower surface of the first portion may be wider than the horizontal cross-sectional width of the upper surface of the second portion.

[0023] In one or more embodiments, the stop unit may further include a point where the first portion and the second portion intersect, and may be disposed at the height of the pad unit or may be lower than the pad unit.

[0024] In one or more embodiments, the substrate transfer arm may further include a clamp unit for clamping the substrate.

Brief Description of the Drawings

[0025]

Figure 1A

Figure 1B

Figure 2A

Figure 2B

Figure 3

Figure 4

Figure 5

Figure 6A

Figure 6B

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

[0026] Certain specific embodiments and examples are disclosed below, but it will be understood by those skilled in the art that the invention extends beyond the specifically disclosed embodiments and / or uses of the invention, as well as their obvious modifications and equivalents. Therefore, it is intended that the scope of the disclosed invention should not be limited by the specifically disclosed embodiments described below.

[0027] As used herein, the term "substrate" may refer to any single or plurality of underlying materials, which may be modified or on which devices, circuits, or films may be formed. "Substrate" may be continuous or discontinuous, rigid or flexible, solid or porous, and combinations thereof. The substrate may be in any form such as powder, plate, or workpiece. Substrates in the form of plates may include wafers of various shapes and sizes. The substrate may be made of semiconductor materials including, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0028] The continuous substrate may extend beyond the boundaries of the process chamber in which the deposition process occurs. In some processes, the continuous substrate may move through the process chamber, whereby the process continues until it reaches the end of the substrate. The continuous substrate may be supplied from a continuous substrate supply system in any suitable form to enable the manufacture and output of the continuous substrate.

[0029] The examples presented in this specification do not mean the actual form of any particular material, structure, or device, but are merely idealized representations used to describe embodiments of the present disclosure.

[0030] The specific implementations shown and described are examples of the invention and its best mode, and are not intended to limit the scope of aspects and implementations in any way. In fact, for the sake of brevity, conventional manufacturing, related, preparation, and other functional aspects of the system may not be described in detail. Further, the connection lines shown in the various figures are intended to represent exemplary functional relationships and / or physical connections between the various elements. Many alternative or additional functional relationships, or physical connections, may exist in the actual system and / or may not exist in some embodiments.

[0031] It should be understood that the configurations and / or endeavors described herein are essentially exemplary, and these specific embodiments or examples should not be considered to have a limiting meaning because numerous modifications are possible. The specific routines or methods described herein may represent one or more of any number of processing strategies. Therefore, the various operations illustrated may be performed in the order illustrated, in other orders, or may be omitted in some cases.

[0032] The subject matter of the present disclosure includes not only all novel and non-obvious combinations and sub-combinations of the various processes, systems, and configurations, as well as other features, functions, operations, and / or characteristics disclosed herein, but also all equivalents thereof.

[0033] FIG. 3 shows a substrate transfer arm 200 according to an embodiment of the present disclosure.

[0034] In FIG. 3, the substrate transfer arm 200 may include a main body unit 201 and a plurality of substrate mounting units 202. Each of the substrate mounting units 202 may include a stop unit 203 and a pad unit 204. The substrate 206 may be placed on the pad unit 204. The stop unit 203 may assist in alignment and prevent the substrate 206 from sliding forward when placed on the pad unit 204. The substrate transfer arm 200 may further include a clamp unit 205 for clamping the substrate 206. The clamp unit may assist in placing the substrate 206 on the substrate transfer arm 200.

[0035] FIG. 4 shows a cross-sectional view of the pad unit 204.

[0036] In FIG. 4, the pad unit 204 may include a rotatable unit 220, a support unit 210, and a fixing unit 230. More specifically, the rotatable unit 220 may be configured to rotate. The support unit 210 may support the rotatable unit 220. The fixing unit 230 may fix the rotatable unit 220 to the support unit 210.

[0037] In an embodiment of the present disclosure, the rotatable unit 220 may be a roller and may rotate. The diameter D of the roller 220 may be about 0.8 cm to about 1.0 cm. The surface roughness of the roller 220 may be about Ra0.4 to about Ra3.2. The edge of the roller 220 may be round so that the roller 220 may have a curvature C of about Φ8 to about Φ10 at the edge.

[0038] The rotatable unit 220 may include at least one of cellazol, FFPM (perfluoroelastomer), ceramic, glass carbon, or a mixture thereof.

[0039] FIG. 5 shows a cross-sectional view of the pad unit 204 inclined with respect to the main body unit 201 according to an embodiment of the present disclosure.

[0040] In FIG. 5, the support unit 210 can be designed to be inclined with respect to the main body unit 201, and the rotatable unit 220 supported by the support unit 210 can accordingly be inclined with respect to the main body unit 201. In an embodiment of the present disclosure, the pad unit 204 can be inclined at about 5° to about 30° (θ1) with respect to the main body unit 201.

[0041] FIG. 6A shows another embodiment of the pad unit 204. In FIG. 6A, the support unit 210 can be designed to be vertically coupled to the main body unit 201. Also, the rotatable unit 220 can be designed to be inclined with respect to the main body unit 201.

[0042] FIG. 6B shows another embodiment of the pad unit 204. In FIG. 6B, the rotatable unit 220 can be coupled to the main body unit 201 without a support unit and can be designed to be inclined with respect to the main body unit 201.

[0043] FIG. 7 shows a cross-sectional view of the substrate transfer arm 200 along the cross-section line A-A′ of FIG. 3.

[0044] In FIG. 7, the pad unit 204 can be inclined in a first direction F with respect to the main body unit 201 of the substrate transfer arm 200. As shown in FIG. 7, the lower surface of the substrate 206 can contact the edge portion of the rotatable unit 220 of the pad unit 204 as shown in FIG. 3.

[0045] The edge portion of the rotatable unit 220 can have a round shape as shown in FIG. 4. As a result, the friction between the lower surface of the substrate 206 and the edge portion of the rotatable unit 220 can be reduced accordingly. Therefore, the present disclosure can provide a technical advantage of preventing the substrate from adhering to the rotatable unit 220.

[0046] In the present disclosure, the rotatable unit 220 may not be fixed. As a result, as shown in FIGS. 2A and 2B, the friction between the lower surface of the substrate 206 and the rotatable unit 220 can be reduced as compared with existing substrate transfer arms. Thereby, contaminants (i.e., particles) can be reduced accordingly.

[0047] FIG. 8 shows a first direction F perpendicular to the moving direction E of the substrate transfer arm 200.

[0048] As shown in FIG. 7, the pad unit 204 can be inclined in the first direction F. The first direction F can be perpendicular to the moving direction E of the substrate transfer arm 200. The moving direction E can be the direction in which the substrate transfer arm 200 moves to place the attached substrate 206 on a substrate support (not shown here) or to take it out from the substrate support.

[0049] FIG. 9 shows a cross-sectional view of another embodiment of the substrate transfer arm 200 along the cross-section line A-A' of FIG. 3.

[0050] In FIG. 9, the pad unit 204 can be inclined in a second direction F' different from the first direction F with respect to the main body unit 201 of the substrate transfer arm 200. As shown in FIG. 9, the lower surface of the substrate 206 can contact the edge portion of the rotatable unit 220 of the pad unit 204 as shown as C in FIG. 3.

[0051] Therefore, the present disclosure can provide a technical advantage that the contact surface between the lower surface of the substrate 206 and the rotatable unit 220 can be minimized and contaminants (i.e., particles) can be reduced. The present disclosure can also provide another technical advantage that the substrate can be prevented from adhering to the rotatable unit 220.

[0052] In the present disclosure, the rotatable unit 220 may not be fixed. As a result, as shown in FIGS. 2A and 2B, the friction between the lower surface of the substrate 206 and the rotatable unit 220 can be reduced compared to an existing substrate transfer arm in which the pad unit can be fixed to the main body unit. Thereby, contaminants (i.e., particles) can be reduced accordingly.

[0053] FIG. 10 shows a second direction F' perpendicular to the moving direction E of the substrate transfer arm 200.

[0054] As shown in FIG. 9, the pad unit 204 can be inclined in the second direction F'. The second direction F' can be perpendicular to the moving direction E of the substrate transfer arm 200. The moving direction E can be the direction in which the substrate transfer arm 200 moves to place the substrate 206 mounted on the substrate transfer arm 200 on a substrate support (not shown here) or to take it out from the substrate support.

[0055] FIG. 11 shows a cross-sectional view of an embodiment of the stop unit 203 coupled to the main body unit 201 of the substrate transfer arm 200 along the cross-section line B-B' of FIG. 3.

[0056] In FIG. 11, the stop unit 203 can include a first portion P1 and a second portion P2. The first portion P1 can have a height T1, and the second portion P2 can have a height T2.

[0057] The inside of the second portion P2 can be inclined more with respect to the main body unit 201 than the inside of the first portion P1 (i.e., θ2 < θ3). Therefore, when the substrate 206 slides forward on the pad unit 204, the stop unit 203 can stop the substrate 206 from sliding on the stop unit 203 more effectively on the second portion P2 than on the first portion P1. In other words, the stop unit 203 can stop the substrate 206 more effectively on the second portion P2 than on the first portion P1 and draw it into the correct position on the substrate transfer arm 200.

[0058] For this purpose, the point where the first part P1 and the second part P2 can intersect (i.e., point X in FIG. 11) can be arranged at the same height as the lower surface of the substrate 206 when placed on the pad unit 204. Or, point X can be arranged lower than the lower surface of the substrate 206 when placed on the pad unit 204. That is, the height T1 of position X can be arranged to be equal to or less than the height T3 of the pad unit 204 (i.e., T1≦T3).

[0059] In other words, point X can be defined as the point where the inclination angle θ2 of the first part P1 can change to the inclination angle θ3 of the second part P2, and the first part P1 and the second part P2 can intersect at point X. Point X can be arranged at the upper surface of the pad unit 204 or at a height below it.

[0060] In the stop unit 203, the horizontal cross-sectional width W1 of the lower surface of the first part P1 may be wider than the horizontal cross-sectional width W2 of the upper surface of the second part P2.

[0061] In the substrate transfer arm 200, the upper surface of the stop unit 203 may be higher than the upper surface of the pad unit 204 (i.e., (T1 + T2)>T3) in order to prevent the substrate 206 from coming off the substrate transfer arm 200.

[0062] FIG. 12 shows a cross-sectional view of another embodiment of the stop unit 203 coupled to the main body unit 201 of the substrate transfer arm 200 along the cross-section line B-B' of FIG. 3.

[0063] In FIG. 12, the stop unit 203 may include a first part P1' and a second part P2'. The first part P1' may have a height T1', and the second part P2' may have a height T2'.

[0064] In FIG. 12, the inner sides of the first part P1' and the second part P2' of the substrate stop unit 203 may be provided with curved surfaces.

[0065] The inner side of the second portion P2' can be inclined more with respect to the main body unit 201 than the inner side of the first portion P1' (i.e., θ2' < θ3'). Therefore, when the substrate 206 moves forward on the pad unit 204, the stop unit 203 can more effectively prevent the substrate 206 from sliding upward on the stop unit 203 on the second portion P2' than on the first portion P1'. In other words, the stop unit 203 can more effectively stop the substrate 206 and draw it into the correct position on the substrate transfer arm 200 on the second portion P2' than on the first portion P1'.

[0066] For this purpose, the point where the first portion P1' and the second portion P2' intersect (i.e., point X' in FIG. 11) can be arranged at the same height as the lower surface of the substrate 206 when placed on the pad unit 204. Or, point X' can be arranged lower than the lower surface of the substrate 206 when placed on the pad unit 204. That is, the first height T1' of position X' can be arranged to be equal to or lower than the height T3' of the pad unit 204 (i.e., T1' ≤ T3').

[0067] In other words, point X' in FIG. 12 can be defined as the point where the tangent angle of the curved surface can change to the tangent angle θ3', and the first portion P1' and the second portion P2' can intersect at point X'. Point X' can be arranged at the height of the upper surface of the pad unit 204 or at a lower height.

[0068] In the stop unit 203, the horizontal cross-sectional width W1' of the lower surface of the first portion P1' may be wider than the horizontal cross-sectional width W2' of the upper surface of the second portion P2'.

[0069] In the substrate transfer arm 200, the upper surface of the stop unit 203 may be higher than the upper surface of the pad unit 204 (i.e., (T1' + T2') > T3') to prevent the substrate 206 from coming off the substrate transfer arm 200.

[0070] As shown in FIGS. 11 and 12, the inclined or curved surface inside the stop unit 203 can more effectively prevent the substrate 206 from sliding upward on the stop unit 203 and can assist the substrate 206 to be placed at the correct position on the substrate transfer arm 200.

[0071] FIG. 13 shows the configuration of a substrate processing cluster tool.

[0072] In FIG. 13, the substrate processing cluster tool 300 may include a substrate handling chamber 301, a reaction chamber 302, a load lock chamber 303, a transfer chamber 304, and a substrate storage stage 305.

[0073] The substrate handling chamber 301 may include a substrate handling device 307 (a back-end robot). The substrate handling device 307 may include a first substrate transfer arm 308 according to the present disclosure. The substrate handling device 307 may transfer a substrate from the load lock chamber 303 to the reaction chamber 302 via gate valves 311 and 312, or vice versa.

[0074] The first substrate transfer arm 308 may be configured according to the present disclosure. That is, the pad unit and the stop unit of the present disclosure may be provided on the substrate transfer arm.

[0075] The transfer chamber 304 may include a substrate transfer device 309 (a front-end robot). The substrate transfer device 309 may include a second substrate transfer arm 310. The second substrate transfer arm 310 may be configured according to the present disclosure. That is, the pad unit and the stop unit of the present disclosure may be provided on the substrate transfer arm. The substrate transfer device 309 may transfer a substrate from the substrate storage stage 305 to the load lock chamber 303, or vice versa. The transfer chamber 304 may be an equipment front-end module (EFEM), and the substrate storage stage 305 may be a front opening unified pod (FOUP).

[0076] The load lock chamber 303 can be disposed between the substrate handling chamber 301 and the transfer chamber 304. In the load lock chamber 303, the substrate can be aligned or cooled after being processed in the reaction chamber 302.

[0077] The reaction chamber 302 may be provided with a reactor 306. In one embodiment, the reaction chamber 302 may be provided with a plurality of reactors 306.

[0078] The substrate may be transferred from the transfer chamber 304 to the load lock chamber 303 via the gate valve 313, or vice versa. The substrate handling chamber 301 and the reaction chamber 302 may be maintained at a low pressure by a vacuum pump (not shown here).

Explanation of Reference Numerals

[0079] 100 Substrate transfer arm 101 Body unit 102 Stop unit 103 Pad unit 104 Clamp unit 105 Upper surface 106 Substrate 107 Pad unit 200 Substrate transfer arm 201 Body unit 202 Substrate mounting unit 203 Stop unit 203 Substrate stop unit 204 Pad unit 205 Clamp unit 206 Substrate 210 Support unit 220 Unit, roller 230 Fixing unit 300 Substrate processing cluster tool 301 Substrate handling chamber 302 Reaction chamber 303 Load lock chamber 304 Transfer chamber 305 Substrate storage stage 306 Reactor 307 Substrate handling device 308 First substrate transfer arm 309 Substrate transfer device 310 Second substrate transfer arm 311, 312, 313 Gate valves

Claims

1. A substrate transport arm for mounting a substrate, A main unit; a plurality of substrate mounting units coupled to the main unit, the plurality of substrate mounting units being configured to place the substrate thereon; A substrate transport arm, wherein each of the substrate mounting units comprises a stop unit and a pad unit coupled to the body unit, the pad unit being inclined relative to the body unit.

2. 2. The substrate transport arm according to claim 1, wherein the pad unit is inclined at an angle of about 5 degrees to about 30 degrees with respect to the main unit.

3. The substrate transport arm of claim 1 , wherein the pad unit is inclined toward a first direction.

4. The substrate transport arm of claim 3 , wherein the first direction is perpendicular to a direction of movement of the substrate transport arm.

5. The substrate transport arm according to claim 1 , wherein the pad unit is inclined toward a second direction different from the first direction.

6. The substrate transport arm of claim 5 , wherein the second direction is perpendicular to a direction of movement of the substrate transport arm.

7. The pad unit is A rotatable unit; a support unit for supporting the rotatable unit; a fixing unit for connecting the rotatable unit to the support unit; The substrate transport arm of claim 1 , wherein the rotatable unit is inclined relative to the main unit.

8. The substrate transport arm of claim 7 , wherein the rotatable unit comprises a roller.

9. The substrate transport arm of claim 8, wherein the rollers have a diameter of about 0.8 cm to about 1.0 cm.

10. The substrate transport arm of claim 8, wherein the roller has a surface roughness of about Ra 0.4 to about Ra 3.

2.

11. The substrate transport arm of claim 8 , wherein the edges of the rollers are rounded.

12. The substrate transport arm of claim 11, wherein the curvature of the edge of the roller is about Φ8 to about Φ10.

13. The substrate transport arm of claim 7 , wherein the rotatable unit comprises at least one of the following: cerazol, FFPM (perfluoroelastomer), ceramic, glassy carbon, or a mixture thereof.

14. The substrate transport arm of claim 1 , wherein an upper surface of the stop unit is higher than an upper surface of the pad unit.

15. The substrate transport arm of claim 1 , wherein the stopping unit comprises a first portion and a second portion.

16. The substrate transport arm according to claim 15 , wherein an inner side of the second portion is inclined more greatly with respect to the main unit than an inner side of the first portion.

17. The substrate transport arm of claim 16 , wherein the stop unit further comprises a point where the first portion and the second portion meet, and is located at a height at or below an upper surface of the pad unit.

18. The substrate transport arm of claim 15 , wherein the inside of the first portion and the inside of the second portion comprise curved surfaces.

19. The substrate transport arm of claim 1 , further comprising a clamp unit for clamping the substrate.

20. a substrate handling chamber, the substrate handling chamber comprising a substrate handling device; A reaction chamber; A load lock chamber; a transfer chamber comprising a substrate transfer device; and a substrate storage stage, the substrate transport device comprises a substrate transport arm, the substrate transport arm comprises a body unit, a pad unit, a stop unit and a clamp unit, the pad unit being inclined relative to the body unit; Substrate processing cluster tool.

Images