Wiring circuit board

Abstract

To provide a wiring circuit board capable of performing shake correction on an inner frame by a smaller force.SOLUTION: A wiring circuit board 1 comprises: an outer frame 2; an inner frame 3 surrounded by the outer frame 2 with a distance secured from the outer frame 2; and a joint 4 for connecting the outer frame 2 and the inner frame 3. The outer frame 2 comprises an outer metal support layer 11, an outer base isolation layer 12 and an outer wiring layer 13 in order toward one side in the thickness direction. The inner frame 3 comprises an inner metal support layer 41, an inner base isolation layer 42 and an inner wiring layer 43 in order toward one side in the thickness direction. The inner metal support layer 41 includes at least one of a first region 41a having thickness that is thinner than the thickness of the outer metal support layer 11 and a second region 41b composed of a space existing within the inner metal support layer 41.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a wiring circuit board.

Background Art

[0002] Conventionally, a camera module includes a wiring circuit board for mounting an imaging element.

[0003] As such a wiring circuit board, for example, a wiring circuit board including an image sensor substrate (outer frame), a driving unit (inner frame) surrounded by the image sensor substrate, and a conductive pattern unit (joint) connecting them has been proposed (see, for example, Patent Document 1). In this wiring circuit board, the conductive pattern unit is formed of a metal material having an elastic force that can move by the force applied from the driving unit while serving as a wiring for transmitting an electrical signal.

[0004] When a camera module including such a wiring circuit board moves (vibrates), the image sensor substrate moves (vibrates). Then, in conjunction with the movement (vibration) of the image sensor substrate, the driving unit sways (vibrates). However, the conductive pattern unit can correct the above sway (hereinafter sometimes referred to as sway correction).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] On the other hand, depending on the use and purpose of the wiring circuit board, there is a demand for correcting the above sway with a smaller force.

[0007] The present invention provides a wiring circuit board capable of correcting shaking of an inner frame with a smaller force.

Means for Solving the Problems

[0008] The present invention [1] includes an outer frame, an inner frame surrounded by the outer frame and spaced apart from the outer frame, and a joint connecting the outer frame and the inner frame. The outer frame includes an outer metal support layer, an outer base insulating layer, and an outer wiring layer in this order toward one side in the thickness direction. The inner frame includes an inner metal support layer, an inner base insulating layer, and an inner wiring layer in this order toward one side in the thickness direction. The inner metal support layer has at least one of a first region having a thickness thinner than that of the outer metal support layer and a second region formed by a space existing within the inner metal support layer, and is a wiring circuit board.

[0009] In such a wiring circuit board, the inner metal support layer has at least one of a first region having a thickness thinner than that of the outer metal support layer and a second region formed by a space existing within the inner metal support layer. Therefore, the weight of the inner metal support layer can be reduced. As a result, the inner frame can be corrected for shaking with a smaller force.

[0010] The present invention [2] includes the wiring circuit board according to the above [1], wherein the inner metal support layer has a third region having the same thickness as or thinner than the outer metal support layer and thicker than the first region.

[0011] If the third region has the same thickness as the outer metal support layer, the strength of the inner frame can be improved. If the thickness of the third region is thinner than the outer metal support layer and thicker than the first region, weight reduction can be achieved.

[0012] The present invention [3] includes the wiring circuit board according to [2] above, wherein the inner base insulating layer is directly disposed on one side in the thickness direction of the inner metal support layer.

[0013] The present invention [4] includes the wiring circuit board according to [2] above, wherein the joint includes a joint insulating layer and a joint wiring layer.

[0014] According to such a configuration, while the inner frame is supported by the outer frame via the joint, the outer wiring layer in the outer frame and the inner wiring layer in the inner frame can be electrically connected via the joint wiring layer.

[0015] The present invention [5] includes the wiring circuit board according to [2] above, wherein in the inner metal support layer, the third region is disposed at the peripheral end of the inner frame.

[0016] According to such a configuration, strength can be ensured at the peripheral end of the inner frame. Therefore, the outer shape of the inner frame can be maintained.

[0017] The present invention [6] includes the wiring circuit board according to [5] above, wherein in the inner metal support layer, the second region is disposed inside the peripheral end.

[0018] According to such a configuration, the weight of the inner metal support layer can be reduced. Thereby, the inner frame can be shaken and corrected with a smaller force.

[0019] The present invention [7] includes the wiring circuit board according to [1] above, wherein only the first region is disposed in the inner metal support layer.

[0020] According to such a configuration, the thickness of the inner metal support layer can be made uniform, and the force on the inner frame can be made uniform. As a result, the inner frame can be shaken uniformly.

[0021] The present invention [8] includes the wiring circuit board according to [2] above, wherein in the inner metal support layer, the third regions are arranged linearly with a space therebetween.

[0022] According to such a configuration, the strength can be improved by the third regions arranged linearly with a space therebetween.

[0023] The present invention [9] includes the wiring circuit board according to [8] above, wherein in the inner metal support layer, the first region is arranged between the third regions adjacent to each other.

[0024] Since the first region is arranged between the third regions adjacent to each other, the strength can be improved.

[0025] The present invention

[10] includes the wiring circuit board according to [8] above, wherein in the inner metal support layer, the second region is arranged between the third regions adjacent to each other.

[0026] Since the second region is arranged between the third regions adjacent to each other, weight reduction can be achieved.

[0027] The present invention

[11] further includes via wirings penetrating the inner base insulating layer in the thickness direction, and the via wirings are in contact with the third regions, and includes the wiring circuit board according to

[10] above.

[0028] According to such a configuration, the via wirings can surely be in contact with the third regions instead of the second regions. Therefore, conduction can be achieved between the inner metal support layer through the via wirings.

[0029] The present invention

[12] includes the wiring circuit board according to any one of [1] to

[11] above, wherein the inner metal support layer is made of a plating layer.

[0030] According to such a configuration, weight reduction can be achieved.

Advantages of the Invention

[0031] The wiring circuit board of the present invention can correct the shaking of the inner frame with a smaller force.

Brief Description of the Drawings

[0032]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

BEST MODE FOR CARRYING OUT THE INVENTION

[0033] The inner metal support layer of the wiring circuit board of the present invention has at least one of a first region having a thickness thinner than that of the outer metal support layer and a second region formed by a space existing in the inner metal support layer. Further, the inner metal support layer can also have a third region having the same thickness as the outer metal support layer or a thickness thicker than that of the first region.

[0034] Hereinafter, a first embodiment in which the inner metal support layer has only the first region, a second embodiment in which the inner metal support layer has a third region disposed at the peripheral end portion of the inner frame and a second region disposed more inward than the peripheral end portion, a third embodiment in which the inner metal support layer has a third region disposed at the peripheral end portion of the inner frame and a first region disposed more inward than the peripheral end portion, a fourth embodiment in which the inner metal support layer has a third region linearly arranged at intervals from each other and a second region disposed between the adjacent third regions in the inner metal support layer, and a fifth embodiment in which the inner metal support layer has a third region linearly arranged at intervals from each other and a first region disposed between the adjacent third regions in the inner metal support layer will be described in detail.

[0035] 1. First Embodiment <Wiring Circuit Board> With reference to FIGS. 1 and 2, a first embodiment of the wiring circuit board of the present invention will be described.

[0036] As shown in FIG. 1, the wiring circuit board 1 has a sheet shape. As shown in FIG. 2, the wiring circuit board 1 has a thickness. As shown in FIG. 1, the wiring circuit board 1 extends in the plane direction.

[0037] The plane direction is orthogonal to the thickness direction. The wiring circuit board 1 includes an outer frame 2, an inner frame 3, and a joint 4.

[0038] <Outer frame 2> The outer frame 2 has a substantially rectangular frame shape. The outer frame 2 has four side portions 23A, 23B, 23C, and 23D. The four side portions 23A, 23B, 23C, and 23D are arranged in order counterclockwise in plan view. The side portion 23A and the side portion 23C face each other. The side portion 23B connects one end portion of the side portion 23A and one end portion of the side portion 23C. The side portion 23D connects the other end portion of the side portion 23A and the other end portion of the side portion 23C. The side portion 23B and the side portion 23D face each other.

[0039] As shown in FIG. 2, the outer frame 2 includes an outer metal support layer 11, an outer base insulating layer 12, an outer wiring layer 13, and an outer cover insulating layer 14 in this order toward one side in the thickness direction.

[0040] <Outer metal support layer 11> The outer metal support layer 11 extends in the plane direction. The outer metal support layer 11 forms the outer shape of the outer frame 2. The outer metal support layer 11 has a substantially rectangular frame shape. The outer metal support layer 11 forms the other surface of the outer frame 2 in the thickness direction.

[0041] The outer metal support layer 11 includes a metal support plate 110 and a plating layer 61 in this order toward one side in the thickness direction. Specifically, the outer metal support layer 11 includes a metal support plate 110 and a plating layer 61 directly disposed on one surface of the metal support plate 110 in the thickness direction in this order toward one side in the thickness direction.

[0042] The material of the metal support plate 110 is, for example, a rigid material.

[0043] Examples of the rigid material include stainless steel, Alloy 42, aluminum, copper-beryllium, phosphor bronze, copper, silver, nickel, chromium, titanium, tantalum, platinum, gold, and copper alloys. From the viewpoint of ensuring the strength of the outer frame 2 and the inner frame 3, stainless steel and copper alloys are preferably used as the rigid material.

[0044] The thickness of the metal support plate 110 in the outer metal support layer 11 is, for example, 30 μm to 10,000 μm, preferably 100 μm to 1,000 μm.

[0045] The material of the plating layer 61 is the same as that of the metal support plate 110. Preferably, copper is used as the material of the plating layer 61.

[0046] The thickness of the plating layer 61 in the outer metal support layer 11 is, for example, 0.5 μm to 50 μm, preferably 1 μm to 30 μm.

[0047] The thickness of the outer metal support layer 11 (the sum of the thickness of the metal support plate 110 and the thickness of the plating layer 61) is, for example, 30.5 μm to 10,050 μm, preferably 101 μm to 1,030 μm.

[0048] <Outer base insulating layer 12> The outer base insulating layer 12 is disposed on the entire surface of one side of the outer metal support layer 11 in the thickness direction. In other words, the outer metal support layer 11 is disposed on the entire surface of the other side of the outer base insulating layer 12 in the thickness direction. The outer base insulating layer 12 is in contact with one side of the outer metal support layer 11.

[0049] Examples of the material of the outer base insulating layer 12 include resins. Examples of the resin include polyimide resins.

[0050] The thickness of the outer base insulating layer 12 is, for example, 1 μm to 20 μm, preferably 5 μm to 15 μm.

[0051] <Outer wiring layer 13> The outer wiring layer 13 is disposed on one surface of the outer base insulating layer 12 in the thickness direction. The outer wiring layer 13 contacts one surface of the outer base insulating layer 12. The outer wiring layer 13 includes a plurality of frame terminals 131 and a plurality of frame wirings (not shown) electrically connected to the frame terminals 131.

[0052] <Frame terminal 131> The plurality of frame terminals 131 are provided corresponding to each of the four side portions 23A, 23B, 23C, and 23D. The plurality of frame terminals 131 corresponding to the side portion 23A are spaced apart from each other along the side portion 23A. Also, the plurality of frame terminals 131 corresponding to each of the side portions 23B, 23C, and 23D have the same configuration as the plurality of frame terminals 131 corresponding to the side portion 23A. In each side portion (side portions 23A, 23B, 23C, 23D), the frame terminals 131 and frame wirings (not shown) disposed inside in the direction along each side portion constitute signal terminals and signal frame wirings, and the frame terminals 131 and frame wirings (not shown) disposed outside in the direction along each side portion constitute ground terminals and ground frame wirings. Also, the ground frame wiring is connected to a via wiring (not shown).

[0053] Examples of the material of the outer wiring layer 13 include a conductor. Preferably, copper is used as the conductor.

[0054] The thickness of the outer wiring layer 13 is, for example, 1 μm to 50 μm, preferably 5 μm to 35 μm.

[0055] <Outer cover insulating layer 14> As shown in FIG. 2, in the outer frame 2, the outer cover insulating layer 14 is disposed on one surface of the outer wiring layer 13 in the thickness direction. Specifically, the outer cover insulating layer 14 covers the frame wiring which is a part of the outer wiring layer 13. The outer cover insulating layer 14 exposes the frame terminal 131 which is the remaining part of the outer wiring layer 13.

[0056] Examples of the material of the outer cover insulating layer 14 include resins, and preferably polyimide resins.

[0057] The thickness of the outer cover insulating layer 14 is, for example, 1 μm to 20 μm, preferably 5 μm to 15 μm.

[0058] <Dimensions of the outer frame 2> The outer dimensions of the outer frame 2 are not limited. As shown in FIG. 1, each of the distance between the side portion 23A and the side portion 23C and the distance between the side portion 23B and the side portion 23D is, for example, 5 mm to 50 mm, preferably 8 mm to 30 mm.

[0059] The length of each of the side portions 23A, 23B, 23C, and 23D is, for example, 5 mm to 50 mm, preferably 8 mm to 30 mm.

[0060] The width of the outer frame 2 is, for example, 0.1 mm to 50 mm, preferably 0.3 mm to 30 mm. The width of the outer frame 2 is the length between the inner periphery and the outer periphery.

[0061] <Inner frame 3> As shown in FIG. 1, the inner frame 3 is surrounded by the outer frame 2. The inner frame 3 is spaced apart from the outer frame 2. The inner frame 3 has a substantially rectangular frame shape. The inner frame 3 includes four side portions 33A, 33B, 33C, and 33D.

[0062] The four side portions 33A, 33B, 33C, and 33D are arranged in order counterclockwise in a plan view.

[0063] The side portions 33A and 33C face each other. The side portion 33B connects one end portion of the side portion 33A and one end portion of the side portion 33C. The side portion 33D connects the other end portion of the side portion 33A and the other end portion of the side portion 33C. The side portions 33B and 33D face each other.

[0064] Also, each of the side portions 33A, 33B, 33C, and 33D of the inner frame 3 faces each of the side portions 23A, 23B, 23C, and 23D of the outer frame 2.

[0065] As shown in FIG. 2, the inner frame 3 includes an inner metal support layer 41, an inner base insulating layer 42, and an inner wiring layer 43 in this order toward one side in the thickness direction.

[0066] <Inner metal support layer 41> The inner metal support layer 41 extends in the plane direction. The inner metal support layer 41 forms the outer shape of the inner frame 3. The inner metal support layer 41 has a substantially rectangular frame shape. The inner metal support layer 41 forms the other surface of the inner frame 3 in the thickness direction.

[0067] The inner metal support layer 41 includes a metal support plate 110 and a plating layer 61 in this order toward one side in the thickness direction. Specifically, the inner metal support layer 41 includes a metal support plate 110 and a plating layer 61 directly disposed on one surface of the metal support plate 110 in the thickness direction in this order toward one side in the thickness direction.

[0068] The materials of the metal support plate 110 and the plating layer 61 in the inner metal support layer 41 are the same as the materials of the metal support plate 110 and the plating layer 61 in the outer metal support layer 11.

[0069] The inner metal support layer 41 has only a first region 41a having a thickness thinner than the thickness of the outer metal support layer 11. In other words, the thickness of the inner metal support layer 41 is thinner than the thickness of the outer metal support layer 11. As shown in a modification example described later, the thickness of the inner metal support layer 41 may be the same as the thickness of the outer metal support layer 11. In this case, the inner metal support layer 41 has a second region composed of a space existing within the layer.

[0070] Specifically, the thickness of the metal support plate 110 in the inner metal support layer 41 is thinner than the thickness of the metal support plate 110 in the outer metal support layer 11.

[0071] Specifically, the thickness of the metal support plate 110 in the inner metal support layer 41 is, for example, 25 μm to 9995 μm, preferably 95 μm to 995 μm.

[0072] The ratio of the thickness of the inner metal support layer 41 to the thickness of the outer metal support layer 11 is, for example, less than 1, preferably 0.5 or less, and also, for example, 0.01 or more.

[0073] The thickness of the plating layer 61 in the inner metal support layer 41 and the thickness of the plating layer 61 in the outer metal support layer 11 may be the same or different.

[0074] The thickness of the inner metal support layer 41 (the sum of the thickness of the metal support plate 110 and the thickness of the plating layer 61) is, for example, 25.5 μm to 10045 μm, preferably 96 μm to 1025 μm.

[0075] <Inner base insulating layer 42> The inner base insulating layer 42 is disposed on the entire surface of one side of the inner metal support layer 41 in the thickness direction. In other words, the inner metal support layer 41 is disposed on the entire surface of the other side of the inner base insulating layer 42 in the thickness direction. The inner base insulating layer 42 contacts one side of the inner metal support layer 41. That is, the inner base insulating layer 42 is directly disposed on one side of the inner metal support layer 41. When the inner base insulating layer 42 is directly disposed on one side of the inner metal support layer 41, the sensitivity to shaking of the inner frame 3 is improved, so that the inner frame 3 can be shaken and corrected with a smaller force. Each of the material and thickness of the inner base insulating layer 42 is the same as each of the material and thickness of the outer base insulating layer 12.

[0076] <Inner wiring layer 43> The inner wiring layer 43 is disposed on one side of the inner base insulating layer 42 in the thickness direction. The inner wiring layer 43 contacts one side of the inner base insulating layer 42. The inner wiring layer 43 includes a plurality of terminals 133 and a plurality of wirings (not shown) electrically connected to the plurality of terminals 133.

[0077] <Terminal 133> The plurality of terminals 133 are provided corresponding to each of the four side portions 33A, 33B, 33C, and 33D. Specifically, the plurality of terminals 133 corresponding to the side portion 33B are spaced apart from each other in the direction along the side portion 33B. Also, the plurality of frame terminals 133 corresponding to each of the side portions 33A, 33C, and 33D have the same configuration as the plurality of frame terminals 133 corresponding to the side portion 33B. Note that, in each side portion (side portions 33A, 33B, 33C, and 33D), the terminals 133 and wirings (not shown) disposed inside in the direction along each side portion constitute signal terminals and signal wirings, and the terminals 133 and wirings (not shown) disposed outside in the direction along each side portion constitute ground terminals and ground wirings. Also, the ground wiring is connected to a via wiring 60 (see FIG. 3E).

[0078] <Dimensions of the inner frame 3> The outer dimensions of the inner frame 3 are not limited as long as they are smaller than the outer dimensions of the outer frame 2. As shown in FIG. 1, the intervals between the side portions 33A and 33C and between the side portions 33B and 33D are, for example, 3 mm to 50 mm, preferably 5 mm to 30 mm.

[0079] The length of each of the side portions 33A, 33B, 33C, and 33D is, for example, 3 mm to 50 mm, preferably 5 mm to 30 mm.

[0080] The width of the inner frame 3 is, for example, 0.3 mm to 30 mm, preferably 0.5 mm to 20 mm. The width of the inner frame 3 is the length between the outer peripheral edge 30 and the inner peripheral edge 39.

[0081] <Joint 4> As shown in FIG. 1, the joint 4 is disposed between the outer frame 2 and the inner frame 3. The joint 4 connects the outer frame 2 and the inner frame 3. A plurality of joints 4 are provided corresponding to the plurality of side portions 33 in the inner frame 3. Each of the plurality of joints 4A, 4B, 4C, and 4D corresponds to each of the plurality of side portions 33B, 33C, 33D, and 33A in the inner frame 3. Specifically, the joint 4A connects the side portion 23A in the outer frame 2 and the side portion 33B in the inner frame 3. The joint 4B connects the side portion 23B in the outer frame 2 and the side portion 33C in the inner frame 3. The joint 4C connects the side portion 23C in the outer frame 2 and the side portion 33D in the inner frame 3. The joint 4D connects the side portion 23D in the outer frame 2 and the side portion 33A in the inner frame 3.

[0082] Hereinafter, the details of the joint 4A will be described. The joints 4B, 4C, and 4D have the same configuration as the joint 4A, and their details will be omitted.

[0083] <Shape of Joint 4A> As shown in FIG. 1, the joint 4A has a curved shape in plan view. Preferably, the joint 4A does not have a linear shape and / or a bent shape, and has only a curved shape.

[0084] The joint 4A includes a joint insulating layer, a joint wiring layer, and a joint cover insulating layer. Also, the joint 4A does not include a metal support layer (metal support plate 110 and plating layer 61). If the joint 4A does not include a metal support layer (metal support plate 110 and plating layer 61), the joint 4A can be lightened, and the inner frame 3 can be shaken and corrected with a smaller force.

[0085] <Joint insulating layer 52> In the joint 4A, the joint insulating layer 52 forms the other surface of the joint 4A in the thickness direction. The joint insulating layer 52 is exposed toward the other side in the thickness direction.

[0086] Each of the material and thickness of the joint insulating layer 52 is the same as each of the material and thickness of the outer base insulating layer 12.

[0087] <Joint wiring layer 53> The joint wiring layer 53 includes a joint wiring (not shown). The joint wiring electrically connects the frame wiring (not shown) in the outer wiring layer 13 and the wiring (not shown) in the inner wiring layer 43.

[0088] <Joint cover insulating layer 54> As shown in FIG. 1, the joint cover insulating layer 54 is disposed on one surface of the joint wiring layer 53 in the thickness direction. The joint cover insulating layer 54 covers the joint wiring (not shown) of the joint wiring layer 53.

[0089] <Manufacturing method of the wiring circuit board 1> With reference to FIGS. 3A to 3F, the manufacturing method of the wiring circuit board 1 and the mounting of the imaging device 5 will be described. Note that in FIGS. 3A to 3F, the joint 4 is omitted.

[0090] The manufacturing method of the wiring circuit board 1 includes a first step of disposing a plating layer 61 on one surface in the thickness direction of the metal support plate 110, a second step of disposing a base insulating layer (outer base insulating layer 12, inner base insulating layer 42, and joint base insulating layer (not shown)) on one surface in the thickness direction of the plating layer 61, a third step of disposing a wiring layer (outer wiring layer 13, inner wiring layer 43, and joint wiring layer (not shown)) on one surface in the thickness direction of the base insulating layer and forming via wirings 60, a fourth step of disposing a cover insulating layer (outer cover insulating layer 14 and joint cover insulating layer (not shown)) on one surface in the thickness direction of the wiring layer, and a fifth step of performing contour machining and thickness adjustment on the metal support plate 110.

[0091] (The first step) In the first step, as shown in FIG. 3A, a plating layer 61 is disposed on one surface in the thickness direction of the metal support plate 110.

[0092] The metal support plate 110 is a metal plate for forming an outer metal support layer 11 and an inner metal support layer 41.

[0093] To dispose the plating layer 61 on one surface in the thickness direction of the metal support plate 110, plating treatment is performed on one surface in the thickness direction of the metal support plate 110 by a known method.

[0094] (The second step) In the second step, as shown in FIG. 3B, a base insulating layer (outer base insulating layer 12, inner base insulating layer 42, and joint base insulating layer (not shown)) is disposed on one surface in the thickness direction of the plating layer 61.

[0095] Specifically, resin is applied to one surface of the plating layer 61, and a base insulating layer having patterns corresponding to the outer frame 2, the inner frame 3, and the joint 4 is formed by photolithography.

[0096] At this time, via holes 70 are formed near the peripheral edge portion of the inner base insulating layer 42.

[0097] (Step 3) In Step 3, as shown in FIG. 3C, a wiring layer is disposed on one side in the thickness direction of the base insulating layer. Specifically, by a conductor pattern formation method, a wiring layer (outer wiring layer 13, inner wiring layer 43, and joint wiring layer (not shown)) is formed. Examples of the conductor pattern formation method include an additive method and a subtractive method, and preferably, the additive method is used.

[0098] Thereby, a wiring layer is disposed on one side in the thickness direction of the base insulating layer.

[0099] Also, in Step 3, via wirings 60 are formed. The via wirings 60 can be formed by filling the via holes 70 with the material of the plating layer 61. That is, such a wiring circuit board 1 includes via wirings 60 that penetrate the inner base insulating layer 42 in the thickness direction.

[0100] (Step 4) In Step 4, as shown in FIG. 3D, a cover insulating layer (outer cover insulating layer 14 and joint cover insulating layer (not shown)) is disposed on one side in the thickness direction of the wiring layer. Specifically, a resin is applied to one side of the wiring layer, and a cover insulating layer having a pattern corresponding to the outer frame 2 and the joint 4 is formed by photolithography.

[0101] (Step 5) In Step 5, as shown in FIG. 3E, the metal support plate 110 is subjected to outer shape processing and thickness adjustment.

[0102] Examples of the method for outer shape processing and thickness adjustment include etching, punching, and laser. As the outer shape processing, preferably, from the viewpoint of productivity, etching is used.

[0103] By machining the outer shape of the metal support plate 110, the metal support plate 110 and the plating layer 61 between the outer frame 2 and the inner frame 3 are removed. That is, the joint 4 does not include the metal support layer (the metal support plate 110 and the plating layer 61).

[0104] Also, the metal support plate 110 corresponding to the inner frame 3 is machined in terms of outer shape and thickness to form the inner metal support layer 41.

[0105] Specifically, a part of the metal support plate 110 corresponding to the inner metal support layer 41 is adjusted in thickness so that the thickness of the inner metal support layer 41 is thinner than the thickness of the outer metal support layer 11. And the remaining part of the metal support plate 110 corresponding to the inner metal support layer 41 constitutes the first region 41a.

[0106] Also, the metal support plate 110 corresponding to the outer metal support layer 11 directly becomes the outer metal support layer 11 without thickness adjustment.

[0107] Thus, the wiring circuit board 1 is manufactured.

[0108] Next, the process of mounting the imaging element 5 on the wiring circuit board 1 will be described in detail.

[0109] In this process, as shown in FIG. 3F, the imaging element 5 is mounted on the inner frame 3. The electrodes 51 of the imaging element 5 and a plurality of terminals 133 in the inner frame 3 are electrically connected.

[0110] At the same time, the external substrate 6 is mounted on the outer frame 2. The electrodes 62 of the external substrate 6 and a plurality of frame terminals 131 in the outer frame 2 are electrically connected.

[0111] Next, the second to fifth embodiments will be described in detail. In the following second to fifth embodiments, members and steps similar to those in the above-described first embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted. In addition, each modification can achieve the same effects as those of the first embodiment unless otherwise specified. Furthermore, the first to fifth embodiments can be combined as appropriate.

[0112] 2. Second Embodiment In the second embodiment, as shown in FIG. 4A, the inner metal support layer 41 has a third region 41c disposed at the peripheral end portion of the inner frame 3 and a second region 41b disposed inside the peripheral end portion. That is, as shown in FIG. 4B, the inner metal support layer 41 has a square shape in plan view.

[0113] The thickness of the third region 41c is the same as that of the outer metal support layer 11.

[0114] The second region 41b consists of a space existing within the inner metal support layer 41. In other words, the inner metal support layer 41 is not disposed in the second region 41b.

[0115] In the inner metal support layer 41, the area ratio of the third region 41c is, for example, 1% to 99%, preferably 10% to 50%.

[0116] Also, in the inner metal support layer 41, the area ratio of the second region 41b is, for example, 1% to 99%, preferably 50% to 90%.

[0117] In the width direction of each side portion (side portions 33A, 33B, 33C, 33D (see FIG. 1)) of the inner frame 3, the ratio of the width length of the second region 41b to the width length of the third region 41c is, for example, 0.1 to 0.99, preferably 0.5 to 0.99.

[0118] Also, in the second embodiment, the via wiring 60 is in contact with the third region 41c. That is, the via wiring 60 is in contact with the third region 41c, not the second region 41b.

[0119] In the second embodiment, in the fifth step, the thickness of the inner metal support layer 41 is adjusted so that the inner metal support layer 41 has the second region 41b and the third region 41c.

[0120] 3. Third Embodiment In the third embodiment, as shown in FIG. 5A, the inner metal support layer 41 has a third region 41c disposed at the peripheral end portion of the inner frame 3 and a first region 41a disposed inside the peripheral end portion. That is, as shown in FIG. 5B, the inner metal support layer 41 has a concave shape in plan view.

[0121] The thickness of the third region 41c is the same as that of the outer metal support layer 11 or thinner than the outer metal support layer 11 and thicker than the first region 41a. Note that FIG. 5A shows a case where the thickness of the third region 41c is thinner than the outer metal support layer 11 and thicker than the first region 41a.

[0122] When the thickness of the third region 41c is thinner than the outer metal support layer 11 and thicker than the first region 41a, the ratio of the thickness of the third region 41c to the thickness of the outer metal support layer 11 is, for example, less than 1, preferably 0.5 or less, and, for example, 0.01 or more. Also, the ratio of the thickness of the first region 41a to the thickness of the third region 41c is, for example, less than 1, preferably 0.5 or less, and, for example, 0.01 or more.

[0123] The first region 41a is a region having a thickness thinner than the thickness of the outer metal support layer 11 and the thickness of the third region 41c.

[0124] In the inner metal support layer 41, the area ratio of the third region 41c is, for example, 1% to 99%, preferably 10% to 50%.

[0125] Also, in the inner metal support layer 41, the area ratio of the first region 41a is, for example, 1% to 99%, preferably 50% to 90%.

[0126] In the width direction of each side portion (side portions 33A, 33B, 33C, 33D (see FIG. 1)) of the inner frame 3, the ratio of the width of the first region 41a to the width of the third region 41c is, for example, 0.1 to 0.99, preferably 0.5 to 0.99.

[0127] In the third embodiment, in the fifth step, the thickness of the inner metal support layer 41 is adjusted so that the inner metal support layer 41 has the first region 41a and the third region 41c. 4. Fourth Embodiment In the fourth embodiment, as shown in FIG. 6A, the inner metal support layer 41 has a third region 41c that is linearly arranged at intervals from each other in the inner metal support layer 41, and a second region 41b that is arranged between the adjacent third regions 41c. That is, as shown in FIG. 6B, the inner metal support layer 41 has a stripe shape in plan view.

[0128] The thickness of the third region 41c is the same as that of the outer metal support layer 11.

[0129] The second region 41b consists of a space existing in the inner metal support layer 41. In other words, the inner metal support layer 41 is not arranged in the second region 41b.

[0130] In the inner metal support layer 41, the width of the third region 41c (the width of each side portion (side portions 33A, 33B, 33C, 33D (see FIG. 1)) of the inner frame 3) is, for example, 0.01 mm to 1 mm, preferably 0.03 mm to 1 mm.

[0131] Also, in the inner metal support layer 41, the width of the second region 41b (the width of each side portion (side portions 33A, 33B, 33C, 33D (see FIG. 1)) of the inner frame 3) is, for example, 0.01 mm to 1 mm, preferably 0.05 mm to 1 mm.

[0132] In the inner metal support layer 41, the distance (pitch) between the center point in the width direction of the third region 41c and the center point in the width direction of the second region 41b is, for example, 0.01 mm to 1 mm, preferably 0.05 mm to 1 mm.

[0133] In the inner metal support layer 41, the area ratio of the third region 41c is, for example, 1% to 99%, preferably 10% to 50%.

[0134] In the inner metal support layer 41, the area ratio of the second region 41b is, for example, 1% to 99%, preferably 50% to 90%.

[0135] In the width direction of each side portion (side portions 33A, 33B, 33C, 33D (see FIG. 1)) of the inner frame 3, the ratio of the width length of the second region 41b to the width length of the third region 41c is, for example, 0.1 to 0.99, preferably 0.5 to 0.99.

[0136] In the fourth embodiment, the via wiring 60 is in contact with the third region 41c. That is, the via wiring 60 is in contact with the third region 41c, not the second region 41b.

[0137] In the fourth embodiment, the thickness of the inner metal support layer 41 is adjusted in the fifth step so that the inner metal support layer 41 has the second region 41b and the third region 41c.

[0138] 5. Fifth Embodiment In the fifth embodiment, as shown in FIG. 7A, the inner metal support layer 41 has a third region 41c that is linearly arranged at intervals from each other in the inner metal support layer 41, and a first region 41b that is arranged between the third regions 41c adjacent to each other. That is, as shown in FIG. 7B, the inner metal support layer 41 has a comb shape in plan view.

[0139] The thickness of the third region 41c is the same as that of the outer metal support layer 11, or thinner than the outer metal support layer 11 and thicker than the first region 41a. Note that FIG. 7A shows a case where the thickness of the third region 41c is thinner than the outer metal support layer 11 and thicker than the first region 41a.

[0140] When the thickness of the third region 41c is thinner than the outer metal support layer 11 and thicker than the first region 41a, the ratio of the thickness of the third region 41c to the thickness of the outer metal support layer 11 is, for example, less than 1, preferably 0.5 or less, and, for example, 0.01 or more. Also, the ratio of the thickness of the first region 41a to the thickness of the third region 41c is, for example, less than 1, preferably 0.5 or less, and, for example, 0.01 or more.

[0141] The first region 41a is a region thinner than the thickness of the outer metal support layer 11 and the thickness of the third region 41c.

[0142] In the inner metal support layer 41, the width of the third region 41c (the width of each side portion (side portions 33A, 33B, 33C, 33D (see FIG. 1)) in the inner frame 3) is, for example, 0.01 mm to 1 mm, preferably 0.03 mm to 1 mm.

[0143] Also, in the inner metal support layer 41, the width of the first region 41a (the width of each side portion (side portions 33A, 33B, 33C, 33D (see FIG. 1)) in the inner frame 3) is, for example, 0.01 mm to 1 mm, preferably 0.05 mm to 1 mm.

[0144] Also, in the inner metal support layer 41, the distance (pitch) between the center point in the width direction of the third region 41c and the center point in the width direction of the first region 41a is, for example, 0.01 mm to 1 mm, preferably 0.05 mm to 1 mm.

[0145] In the inner metal support layer 41, the area ratio of the third region 41c is, for example, 1% to 99%, preferably 10% to 50%.

[0146] Further, in the inner metal support layer 41, the area ratio of the first region 41a is, for example, 1% to 99%, preferably 50% to 90%.

[0147] In the width direction of each side portion (side portions 33A, 33B, 33C, 33D (see FIG. 1)) of the inner frame 3, the ratio of the width length of the first region 41a to the width length of the third region 41c is, for example, 0.1 to 0.99, preferably 0.5 to 0.99.

[0148] In the fifth embodiment, in the fifth step, the thickness of the inner metal support layer 41 is adjusted so that the inner metal support layer 41 has the first region 41a and the third region 41c.

[0149] 6. Operational Effects In the first to fifth embodiments, the inner metal support layer 41 has at least one of a first region 41a having a thickness thinner than that of the outer metal support layer 11 and a second region 41b formed of a space existing in the inner metal support layer 41. Therefore, the inner frame 3 can be shaken and corrected with a smaller force.

[0150] Specifically, since the inner metal support layer 41 has at least one of the first region 41a and the second region 41b, the inner metal support layer 41 is lightened. Therefore, the inner frame 3 can be shaken and corrected with a smaller force.

[0151] In the second to fifth embodiments, the inner metal support layer 41 has a third region 41c having the same thickness as or thinner than the outer metal support layer 11 and thicker than the first region 41a.

[0152] If the third region 41c has the same thickness as the outer metal support layer 11, the strength of the inner frame 3 can be improved. If the thickness of the third region 41c is thinner than the outer metal support layer 11 and thicker than the first region 41a, weight reduction can be achieved.

[0153] In the first to fifth embodiments, the joint 4 includes a joint insulating layer 52, a joint wiring layer 53, and a joint cover insulating layer 54. According to such a configuration, via the joint 4, while the inner frame 3 is supported by the outer frame 2, the outer wiring layer 14 in the outer frame 2 and the inner wiring layer 43 in the inner frame 3 can be electrically connected via the joint wiring layer 53.

[0154] In the second embodiment, in the inner metal support layer 41, the third region 41c is disposed at the peripheral end portion of the inner frame 3. According to such a configuration, at the peripheral end portion of the inner frame 3, strength can be ensured. Therefore, the outer shape of the inner frame 3 can be maintained.

[0155] In the second embodiment, in the inner metal support layer 41, the second region 41b is disposed inside the peripheral end portion. According to such a configuration, the inner metal support layer 41 can be lightened. Thereby, the inner frame 3 can be shaken and corrected with a smaller force.

[0156] In the first embodiment, in the inner metal support layer 41, only the first region 41a is disposed. According to such a configuration, the thickness of the inner metal support layer 41 can be made uniform, and the force on the inner frame 3 can be made uniform. As a result, the inner frame 3 can be shaken uniformly.

[0157] In the fourth and fifth embodiments, in the inner metal support layer 41, the third regions 41c are arranged in a linear shape with a space therebetween. According to such a configuration, the strength can be improved by the third regions 41c arranged in a linear shape with a space therebetween.

[0158] In the fifth embodiment, in the inner metal support layer 41, the first region 41a is disposed between the third regions 41c adjacent to each other. According to such a configuration, since the first region 41a is disposed between the third regions 41c adjacent to each other, the strength can be improved.

[0159] In the fourth embodiment, in the inner metal support layer 41, the second region 41b is disposed between the third regions 41c adjacent to each other. According to such a configuration, since the second region 41b is disposed between the third regions 41c adjacent to each other, weight reduction can be achieved.

[0160] In the second and fourth embodiments, a via wiring 60 penetrating the inner base insulating layer 42 in the thickness direction is further provided, and the via wiring 60 is in contact with the third region 41c. According to such a configuration, the via wiring 60 can surely contact the third region 41c instead of the second region 41b. Therefore, electrical connection can be achieved between the inner metal support layer 41 through the via wiring 60.

[0161] 7. Modification In the following respective modifications, for the members and steps similar to those in the above-described first to fifth embodiments, the same reference numerals are given, and detailed descriptions thereof are omitted. Further, each modification can achieve the same effects as those in the first to fifth embodiments unless otherwise specified. Furthermore, the first to fifth embodiments and their modifications can be appropriately combined.

[0162] In the above description, in the fifth step, a part of the metal support plate 110 corresponding to the inner metal support layer 41 is machined to form the remaining part of the metal support plate 110 corresponding to the inner metal support layer 41, which constitutes the first region 41a. On the other hand, as shown in FIG. 8, all of the metal support plate 110 can also be removed. In such a case, the plating layer 61 constitutes the inner metal support layer 41. According to such a configuration, the inner metal support layer 41 can be lightened. Note that FIG. 8 illustrates the first embodiment as an example, but this modification is the same for the second to fifth embodiments.

[0163] Also, in the fifth step, the metal support plate 110 corresponding to the outer metal support layer 11 is used as the outer metal support layer 11 without performing outer shaping. However, as long as the inner metal support layer 41 has the first region 41a and / or the second region 41b, the metal support plate 110 and the plating layer 61 corresponding to the outer metal support layer 11 can be appropriately shaped.

[0164] The inner metal support layer 41 may have, for example, a dot shape in plan view.

[0165] In the above description, the joint 4 does not include a metal support layer. On the other hand, in the fifth step, the metal support plate 110 corresponding to the joint 4 can also be left remaining. In such a case, the joint 4 includes a metal support layer.

[0166] In the above description, the inner frame 3 has a rectangular frame shape. However, as shown in FIG. 9, it may be rectangular (a rectangle without a hole inside). Note that FIG. 9 illustrates the first embodiment as an example, but this modification is the same for the second to fifth embodiments.

[0167] In the above description, in the outer wiring layer 13, a plurality of frame terminals 131 are provided corresponding to each of the four side portions 23A, 23B, 23C, and 23D. However, it is not limited to this, and as shown in FIG. 10, it may be provided on only one side portion. Note that in FIG. 10, the frame terminal 131 is provided only on the side portion 23D.

[0168] In such a case, the joint 4D connects the side portion 23D in the outer frame 2 and the side portion 33A in the inner frame 3 in the same manner as described above. And the joint wiring corresponding to the joint 4D electrically connects the frame wiring (not shown) in the outer wiring layer 13 corresponding to the side portion 23D and the frame wiring (not shown) in the inner wiring layer 43 corresponding to the side portion 33A.

[0169] On one hand, the joint 4A connects the side portion 23A in the outer frame 2 and the side portion 33B in the inner frame 3. And the joint wiring corresponding to the joint 4A is connected to the frame wiring of the outer frame 2 at the connection portion in the side portion 23A. And this frame wiring (not shown) is routed along the side portions 23A and 23D in sequence and is electrically connected to a plurality of frame terminals 131 in the side portion 23D.

[0170] Similarly, the joint 4B connects the side portion 23B in the outer frame 2 and the side portion 33C in the inner frame 3. The joint wiring corresponding to the joint 4B is connected to the frame wiring (not shown) of the outer frame 2 at the connection portion in the side portion 23B. And this frame wiring (not shown) is routed along the side portions 23B, 23C, and 23D in sequence and is electrically connected to a plurality of frame terminals 131 in the side portion 23D.

[0171] Also, the joint 4C connects the side portion 23C in the outer frame 2 and the side portion 33D in the inner frame 3. The joint wiring corresponding to the joint 4C is connected to the frame wiring (not shown) of the outer frame 2 at the connection portion in the side portion 23C. And this frame wiring (not shown) is routed along the side portions 23C and 23D in sequence and is electrically connected to a plurality of frame terminals 131 in the side portion 23D.

[0172] That is, the joint wiring layer corresponding to the joints 4B, 4C, and 4D connected to the side portions 23A, 23B, and 23C that do not have a plurality of frame terminals 131 and frame wiring (not shown) is connected to the frame wiring at the connection portion with the outer frame 2, is routed on the outer frame 2, is aggregated at the side portion 23D, and is electrically connected to a plurality of frame terminals 131. In such a case, it is superior in mountability compared to the case where a plurality of frame terminals 131 and frame wiring (not shown) are provided corresponding to each of the four side portions 23A, 23B, 23C, and 23D.

Explanation of Reference Numerals

[0173] 1 Wiring Circuit Board 2 Outer Frame 3 Inner Frame 4, 4A, 4B, 4C, 4D Joint 11 Outer Metal Support Layer 12 Outer Base Insulating Layer 13 Outer Wiring Layer 41 Inner Metal Support Layer 41a First Region 41b Second Region 41c Third Region 42 Inner Base Insulating Layer 43 Inner Wiring Layer 52 Joint Insulating Layer 53 Joint Wiring Layer 54 Joint Cover Insulating Layer 60 Via Wiring 61 Plating Layer

Claims

1. An outer frame, an inner frame surrounded by the outer frame and spaced apart from the outer frame, and a joint connecting the outer frame and the inner frame, wherein the outer frame includes an outer metal support layer, an outer base insulating layer, and an outer wiring layer in this order toward one side in the thickness direction, the inner frame includes an inner metal support layer, an inner base insulating layer, and an inner wiring layer in this order toward one side in the thickness direction, the inner metal support layer has at least one of a first region having a thickness thinner than that of the outer metal support layer and a second region formed by a space existing within the inner metal support layer, and is a wiring circuit board.

2. The wiring circuit board according to claim 1, wherein the inner metal support layer has a third region that is the same as or thinner than the outer metal support layer and has a thickness thicker than that of the first region.

3. The wiring circuit board according to claim 2, wherein the inner base insulating layer is directly disposed on one surface in the thickness direction of the inner metal support layer.

4. The wiring circuit board according to claim 2, wherein the joint includes a joint insulating layer and a joint wiring layer.

5. The wiring circuit board according to claim 2, wherein in the inner metal support layer, the third region is disposed at a peripheral end portion of the inner frame.

6. The wiring circuit board according to claim 5, wherein in the inner metal support layer, the second region is disposed inside the peripheral end portion.

7. The wiring circuit board according to claim 1, wherein only the first region is disposed in the inner metal support layer.

8. The wiring circuit board according to claim 2, wherein in the inner metal support layer, the third regions are linearly arranged at intervals from each other.

9. The wiring circuit board according to claim 8, wherein in the inner metal support layer, the first region is disposed between the third regions adjacent to each other.

10. The wiring circuit board according to claim 8, wherein in the inner metal support layer, the second region is disposed between the third regions adjacent to each other.

11. The wiring circuit board further includes via wirings penetrating the inner base insulating layer in the thickness direction, and the via wirings are in contact with the third region.

12. The wiring circuit board according to any one of claims 1 to 11, wherein the inner metal support layer is a plating layer.

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