Electronic circuit device and method for manufacturing electronic circuit device

Abstract

To provide an electronic circuit device that can facilitate mounting of a large-size on-substrate structure on a standing substrate, and can be easily reduced in size compared with a conventional electronic circuit device.SOLUTION: An electronic circuit device 1 comprises: a case; a first substrate 20; a plurality of first on-substrate structures that are mounted on the first substrate 20; a second substrate 30 that is a standing substrate; a plurality of second on-substrate structures that are mounted on the second substrate 30; and a sealing body 40. The electronic circuit device 1 further includes a holding member 50 that has holding parts 52 holding a structure to be held 32 being the second on-substrate structure and leg parts 54, and is fixed to the second substrate 30. At least part of a neighborhood structure 22 being the first on-substrate structure arranged closest to the structure to be held 32 is arranged in an area between the holding parts 52 and the first substrate 20. The structure to be held 32 and the holding parts 52 are fixed by fixing materials 60. A portion where the leg parts 54 and the first substrate 20 are in the most proximity to each other is sealed by the sealing body 40.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an electronic circuit device and a method for manufacturing the electronic circuit device.

Background Art

[0002] Conventionally, an electronic circuit device having a structure in which a second substrate is mounted in a standing state on a first substrate (so-called an electronic circuit device including a standing substrate) is known (see, for example, Patent Document 1). In such a conventional electronic circuit device, it has been difficult to mount a large substrate structure (typically an electronic component) on the second substrate (standing substrate). The reasons include deterioration of vibration resistance and insufficient insulation distance between the substrate structure mounted on the second substrate and the substrate structure mounted on the first substrate in the vicinity thereof. For this reason, in the conventional electronic circuit device, the large substrate structure has been mounted on the first substrate side.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the conventional electronic circuit device, since the large substrate structure is mounted on the first substrate side, effective utilization of volume and optimization of wiring cannot be achieved, and it is difficult to reduce the outer shape of the first substrate, and thus it is difficult to reduce the size of the entire electronic circuit device.

[0005] Therefore, the present invention has been made in view of the above problems, and since it is possible to facilitate the mounting of a large substrate structure on a second substrate, an object of the present invention is to provide an electronic circuit device that is easier to miniaturize compared to conventional electronic circuit devices by effectively utilizing the volume and optimizing the wiring. Another object of the present invention is to provide a method for manufacturing an electronic circuit device for manufacturing the electronic circuit device of the present invention.

Means for Solving the Problems

[0006] The electronic circuit device of the present invention includes a case having a bottom plate and side plates and having an opening in one direction, a first substrate disposed inside the case such that the back surface faces the bottom plate, a plurality of first substrate structures mounted on the first substrate, a second substrate mounted in a standing state on the first substrate, a plurality of second substrate structures mounted on the second substrate, and a sealing body filled inside the case and sealing at least a part of the first substrate and the plurality of first substrate structures. The electronic circuit device has a holding portion that holds at least one held structure that is at least one of the plurality of second substrate structures, and a leg portion that extends from the holding portion in the direction of the first substrate, and further includes a holding member fixed to the second substrate. The holding portion is disposed at least between the held structure and the first substrate, and at least a part of a neighboring structure disposed closest to the held structure among the plurality of first substrate structures is disposed in a region between the holding portion and the first substrate. The held structure and the holding portion are fixed by a fixing material, and a portion where the leg portion and the first substrate are closest to each other is sealed by the sealing body.

[0007] The manufacturing method of the electronic circuit device of the present invention is a manufacturing method of an electronic circuit device for manufacturing the electronic circuit device of the present invention, including a second substrate mounting step of mounting the plurality of second substrate upper structures including the held structure on the second substrate, a holding member fixing step of fixing the holding member to the second substrate, a first substrate mounting step of mounting the plurality of first substrate upper structures including the adjacent structure on the first substrate, and then mounting the second substrate so that at least a part of the adjacent structure is disposed in a region between the holding portion and the first substrate, an insertion step of inserting the first substrate and the second substrate into the case, and a sealing step of filling the inside of the case with the sealing body, sealing at least a part of the first substrate and the plurality of first substrate upper structures, and also sealing a location where the leg portion and the first substrate are closest to each other, further including a held structure fixing step of fixing the held structure and the holding portion with the fixing material after the holding member fixing step.

Advantages of the Invention

[0008] The electronic circuit device of the present invention has a holding portion that holds a held structure which is at least one of a plurality of second substrate upper structures, and a leg portion that extends in the direction of the first substrate from the holding portion, and includes a holding member fixed to the second substrate. Note that the held structure is not limited in terms of specific functions and sizes, but is assumed to be a substrate upper structure of a certain size. Further, in the electronic circuit device of the present invention, at least a part of the adjacent structure disposed closest to the held structure among the plurality of first substrate upper structures is disposed in a region between the holding portion and the first substrate, the held structure and the holding portion are fixed with a fixing material, and a location where the leg portion and the first substrate are closest to each other is sealed with a sealing body.

[0009] Therefore, according to the electronic circuit device of the present invention, since the holding member fixed to the second substrate is fixed to the structure to be held by the fixing material and the holding member is also fixed by the sealing body, it is possible to integrate the first substrate, the second substrate, and the structure to be held via the holding member. Therefore, according to the electronic circuit device of the present invention, it is possible to suppress the deterioration of vibration resistance by suppressing the vibration of the second substrate caused by mounting the structure to be held on the second substrate by the holding member.

[0010] Further, according to the electronic circuit device of the present invention, since the holding member is interposed between the structure to be held and the adjacent structure, it is possible to increase at least one of the surface distance and the spatial distance between the structure to be held and the adjacent structure to ensure the insulation distance.

[0011] As a result, the electronic circuit device of the present invention can facilitate the mounting of a large on-substrate structure on the second substrate, so that it is an electronic circuit device that is easily miniaturized compared to the conventional electronic circuit device by effective use of volume and optimization of wiring.

[0012] The manufacturing method of the electronic circuit device of the present invention is a method of manufacturing an electronic circuit device using the above-described holding member. Therefore, according to the manufacturing method of the electronic circuit device of the present invention, it is possible to facilitate the mounting of a large on-substrate structure on the second substrate, so that it is possible to manufacture the electronic circuit device of the present invention that is easily miniaturized compared to the conventional electronic circuit device by effective use of volume and optimization of wiring.

Brief Description of the Drawings

[0013]

Figure 1

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Embodiments for Carrying Out the Invention

[0014] Hereinafter, the electronic circuit device and the manufacturing method of the electronic circuit device of the present invention will be described based on the embodiments shown in the drawings. In each of the embodiments described below, for components having exactly the same function or substantially the same function, even if their shapes or the like are somewhat different, the same reference numerals are used in each embodiment, and the description already made may be omitted. Each of the embodiments described below does not limit the invention according to the claims. Also, not all of the elements and their combinations described in each embodiment are essential for the solution means of the present invention.

[0015] [Embodiment 1] 1. Electronic circuit device 1 As shown in FIGS. 1 and 2, the electronic circuit device 1 according to Embodiment 1 includes a case 10, a first substrate 20, a plurality of structures on the first substrate, a second substrate 30, a plurality of structures on the second substrate, a sealing body 40, and a holding member 50. Further, in addition to the above components, the electronic circuit device 1 includes a case lid 18. The electronic circuit device 1 may include components other than those described above.

[0016] The case 10 has a bottom plate 12 and side plates 14, and is open in one direction. The material constituting the case 10 can be appropriately selected from the viewpoints of strength, heat dissipation, heat resistance, weight, etc. A case lid 18 is disposed at the opening of the case 10. Also, in the case 10, a small opening (not shown) for passing an external wiring 28 described later is formed in the side plate 14.

[0017] The first substrate 20 is disposed inside the case 10 such that its back surface faces the bottom plate 12. The "back surface" of the first substrate 20 refers to the surface on the side where the second substrate 30 is not mounted. As the first substrate 20, various substrates such as a metal substrate, a ceramic substrate, and a resin substrate can be used.

[0018] A plurality of first substrate upper structures are mounted on the first substrate 20. The electronic circuit device 1 includes, as a plurality of first substrate upper structures, a nearby structure 22, other first substrate upper structures 24, a connector 26, and an external wiring 28. The "substrate upper structure" in this specification refers to components and members mounted on the substrate. Substrate upper structures are typically electronic components and structural components, and include, for example, capacitors, semiconductor chips, coils, heat sinks, lead wires, jumper terminals, bus bars, and the like.

[0019] The nearby structure 22 is the one disposed closest to a to-be-held structure 32 (described later) among the plurality of first substrate upper structures. The phrase "disposed closest to the to-be-held structure" in this specification means being disposed at a position where the linear distance from the to-be-held structure is the shortest when ignoring the presence of the holding member. At least a part of the nearby structure 22 is disposed in the region between the holding portion 52 (described later) and the first substrate 20. Regarding the arrangement of the nearby structure 22, it can also be expressed as "when viewed in plan from the side where the nearby structure 22 of the first substrate 20 is mounted, at least a part of the nearby structure 22 is arranged so as to overlap with the holding portion 52 disposed between the to-be-held structure 32 and the first substrate 20".

[0020] The other first substrate upper structures 24 are arranged so as to enter the notch-shaped portion of the leg portion 54. The connector 26 is for electrically connecting the first substrate 20 and the second substrate 30, and is connected to the connection pins 34 mounted on the second substrate 30. The external wiring 28 is a wiring for electrically connecting the electronic circuit device 1 and other devices. Although illustration and detailed description are omitted, other first substrate upper structures may be mounted on the first substrate 20 in addition to the above.

[0021] The second substrate 30 is mounted in a state standing on the first substrate 20. In FIG. 2, the first substrate 20 and the second substrate 30 are arranged such that the surfaces for mounting the respective on-substrate structures are perpendicular to each other. This is an example, and the first substrate 20 and the second substrate 30 may be arranged such that the surfaces for mounting the respective on-substrate structures are not perpendicular to each other. The same applies to other embodiments described later. As the second substrate 30, various substrates such as a metal substrate, a ceramic substrate, and a resin substrate can be used.

[0022] A plurality of second on-substrate structures are mounted on the second substrate 30. The electronic circuit device 1 includes, as a plurality of second on-substrate structures, a structure to be held 32 and connection pins 34. The structure to be held 32 is at least one of the plurality of second on-substrate structures. Although the specific function and size of the structure to be held 32 are not limited, relatively large electronic components such as inductors and transformers are assumed. The connection pins 34 are components for electrically connecting the first substrate 20 and the second substrate 30. Although illustration and detailed description are omitted, other second on-substrate structures than those described above may be mounted on the second substrate 30.

[0023] The sealing body 40 is filled inside the case 10 and seals at least a part of the first substrate 20 and the plurality of first on-substrate structures. As the sealing body 40, various resins and the like can be used, which have fluidity at least during filling and are excellent in insulation and stability.

[0024] The holding member 50 has a holding portion 52 that holds the structure to be held 32 and a leg portion 54 that extends from the holding portion 52 in the direction of the first substrate 20, and is fixed to the second substrate 30. The holding portion 52 is disposed at least between the structure to be held 32 and the first substrate 20. The holding member 50 is preferably made of an insulating resin material. Since the holding portion 52 has the role of holding the structure to be held 32, it is a portion disposed around the structure to be held 32. Since the leg portion 54 has the role of fixing the holding member 50 to the first substrate 20 via the sealing body 40, it is a portion disposed on the first substrate 20 side of the holding portion 52.

[0025] The structure to be held 32 and the holding portion 52 are fixed by a fixing material 60. As the fixing material 60, various adhesives and fillers can be used.

[0026] The holding member 50 is fixed to the second substrate 30 by mechanical joining. "Mechanical joining" in this specification means fixing two components by engagement, friction, etc., and includes, for example, snap fit, press fit, and screwing. When the holding member 50 is made of a resin material, considering the labor and strength, the mechanical joining is preferably a snap fit. Also, the holding member 50 may be fixed to the second substrate 30 by adhesive joining. In this case, it is preferable to apply, fill, dispose, insert, etc. various adhesives and fillers so as to fill the gap between the holding member 50 and the second substrate 30 (particularly, the gap between the holding portion 52 disposed between the structure to be held 32 and the first substrate 20 and the second substrate 30). Note that, when fixing the holding member 50, mechanical joining and adhesive joining may be used in combination.

[0027] Here, when the second substrate 30 is viewed in a plan view from the side where the held structure 32 is disposed, the direction from the held structure 32 toward the first substrate 20 side is defined as the first direction D1, the direction opposite to the first direction D1 is defined as the second direction D2, one of the directions perpendicular to the first direction D1 is defined as the third direction D3, and the direction opposite to the third direction D3 is defined as the fourth direction D4 (see FIGS. 2(b) and 2(c)). In Embodiment 1, the viewpoint when "viewing the second substrate 30 in a plan view from the side where the held structure 32 is disposed" corresponds to the viewpoint when the electronic circuit device 1 is represented as a front view (see FIG. 2(c)).

[0028] Also, a direction that is perpendicular to any of the first direction D1 to the fourth direction D4 and from the second substrate 30 toward the side where the held structure 32 is disposed is defined as the fifth direction D5. Note that since the distinction between the third direction D3 and the fourth direction D4 is not important in the present invention, the third direction D3 and the fourth direction D4 may be opposite to those shown in FIGS. 2(b) and 2(c).

[0029] The holding portion 52 is disposed in the first direction D1, the third direction D3, and the fourth direction D4 with respect to the held structure 32, and is not disposed in the fifth direction D5 and the second direction D2. In the present specification, when it is said that "disposed in the nth direction", it is not necessary for the holding portion to cover the entire nth direction side of the held structure, and it is sufficient that the holding portion is disposed so as to cover a part of the nth direction side of the held structure. Also, in the present specification, when it is said that "not disposed in the nth direction", it is sufficient that there is no holding portion when directly viewed along the nth direction from the held structure, and a part of the holding portion disposed in a direction different from the nth direction is not prevented from extending to the nth direction side of the held structure.

[0030] At the tip of the leg portion 54 of the holding member 50, an uneven structure 56 is formed. Also, the location where the leg portion 54 and the first substrate 20 are closest to each other (including the uneven structure 56 at the tip of the leg portion 54) is sealed by the sealing body 40. Note that the leg portion 54 of the holding member 50 may or may not be in direct contact with the first substrate 20. When the leg portion 54 and the first substrate 20 are closest to each other and the leg portion 54 is in direct contact with the first substrate 20, it is the contact location between the leg portion 54 and the first substrate 20.

[0031] 2. Manufacturing Method of Electronic Circuit Device The manufacturing method of the electronic circuit device according to Embodiment 1 is a manufacturing method of an electronic circuit device for manufacturing the electronic circuit device 1 according to Embodiment 1. As shown in FIG. 3, the manufacturing method of the electronic circuit device according to Embodiment 1 includes a second substrate mounting step S10, a holding member fixing step S20, a structure to be held fixing step S30, a first substrate mounting step S40, an insertion step S50, and a sealing step S60. Note that the manufacturing method of the electronic circuit device according to Embodiment 1 may include steps other than those described above. Hereinafter, each step will be described.

[0032] The second substrate mounting step S10 is a step of mounting a plurality of second substrate upper structures including the structure to be held 32 on the second substrate 30 (see FIG. 4(a)). In the second substrate mounting step S10, in addition to the structure to be held 32, connection pins 34 are also mounted. Although illustration and detailed description are omitted, in the second substrate mounting step S10, other second substrate upper structures may be mounted on the second substrate 30.

[0033] FIG. 4(a) is a perspective view seen from the same direction as FIG. 2(b), but this is a measure for easy understanding of the display and does not limit the orientation of the components in the second substrate mounting step S10 (the orientation in which the second substrate mounting step S10 should be performed). Also in each of the steps described later, the orientation of the components in each step does not necessarily match the display in the drawing. This is the same in other embodiments described later.

[0034] The holding member fixing step S20 is a step of fixing the holding member 50 to the second substrate 30 (see Fig. 4(b)). In the holding member fixing step S20, as the holding member 50, when fixed to the second substrate 30, it has a holding portion 52 that is arranged in the first direction D1, the third direction D3, and the fourth direction D4 with respect to the structure 32 to be held, and is not arranged in the fifth direction D5 and the second direction D2. Also, in the holding member fixing step S20, as the holding member 50, one having a concavo-convex structure 56 formed at the tip of the leg portion 54 is used.

[0035] In the holding member fixing step S20, the holding member 50 is fixed to the second substrate 30 by mechanical joining. When the holding member 50 is made of a resin material, considering the labor and strength, the mechanical joining is preferably a snap fit. Also, in the holding member fixing step S20, the holding member 50 may be fixed to the second substrate 30 by adhesive bonding. In this case, it is preferable to apply, fill, arrange, insert, etc. various adhesives and fillers so as to fill the gap between the holding member 50 and the second substrate 30 (particularly, the gap between the holding portion 52 arranged between the structure 32 to be held and the first substrate 20 and the second substrate 30). Note that when fixing the holding member 50, mechanical joining and adhesive bonding may be used in combination.

[0036] The structure fixing step S30 is a step of fixing the structure 32 to be held and the holding portion 52 with a fixing material 60 (see Fig. 4(c)). The fixing material 60 can be applied, filled, arranged, inserted, etc. from the second direction D2 and the fifth direction D5 where the holding portion 52 is not arranged.

[0037] The first substrate mounting step S40 is a step of mounting a plurality of first substrate upper structures including the vicinity structure 22 on the first substrate 20, and then mounting the second substrate 30 so that at least a part of the vicinity structure 22 is disposed in the region between the holding portion 52 and the first substrate 20 (see Fig. 5(a)). In the first substrate mounting step S40, in addition to the vicinity structure 22, other first substrate upper structures 24, connectors 26, and external wirings 28 are also mounted. Although illustration and detailed description are omitted, in the first substrate mounting step S40, first substrate upper structures other than the above may be mounted on the first substrate 20. Further, the mounting of the plurality of first substrate upper structures and the mounting of the second substrate 30 do not necessarily have to be continuous, and all or part of the mounting of the plurality of first substrate upper structures may be performed at a timing earlier than the held structure fixing step S30.

[0038] After the first substrate mounting step S40 and until the sealing step S60 fills the sealing body 40, a jig (not shown) for fixing the second substrate 30 may be used as necessary.

[0039] The insertion step S50 is a step of inserting the first substrate 20 and the second substrate 30 into the case 10 (see Fig. 5(b)). In Fig. 5(b), the case 10 is shown by a broken line so that the internal first substrate 20, second substrate 30, etc. can be seen. The same applies to Fig. 6(a).

[0040] The sealing step S60 is a step of filling the sealing body 40 inside the case 10, sealing at least a part of the first substrate 20 and the plurality of first substrate upper structures, and also sealing the portion where the leg portion 54 and the first substrate 20 are closest to each other (see Fig. 6(a)). In the sealing step S60, a process (heating or the like) for curing the sealing body 40 may be performed after filling the sealing body 40.

[0041] After the sealing step S60 is performed, the case lid 18 is disposed at the opening of the case 10, and if necessary, the case lid 18 is fixed, whereby the electronic circuit device 1 according to the first embodiment can be manufactured (see Fig. 6(b)).

[0042] 3. Effects of the electronic circuit device 1 and the method of manufacturing the electronic circuit device according to Embodiment 1 The effects of the electronic circuit device 1 and the method of manufacturing the electronic circuit device according to Embodiment 1 will be described below.

[0043] The electronic circuit device 1 according to Embodiment 1 includes a holding portion 52 that holds a held structure 32 which is at least one of a plurality of second substrate upper structures, and a leg portion 54 that extends in the direction of the first substrate 20 from the holding portion 52, and includes a holding member 50 fixed to the second substrate 30. Further, in the electronic circuit device 1 according to Embodiment 1, at least a part of the neighboring structure 22 disposed closest to the held structure 32 among the plurality of first substrate upper structures is disposed in the region between the holding portion 52 and the first substrate 20, the held structure 32 and the holding portion 52 are fixed by a fixing material 60, and the portion where the leg portion 54 and the first substrate 20 are closest is sealed by a sealing body 40.

[0044] Therefore, according to the electronic circuit device 1 according to Embodiment 1, since the holding member 50 fixed to the second substrate 30 is fixed to the held structure 32 by the fixing material 60 and the holding member 50 is also fixed by the sealing body 40, it is possible to integrate the first substrate 20, the second substrate 30, and the held structure 32 via the holding member 50. Therefore, according to the electronic circuit device 1 according to Embodiment 1, it is possible to suppress deterioration of vibration resistance by suppressing vibration of the second substrate 30 caused by mounting the held structure 32 on the second substrate 30 by the holding member 50.

[0045] Further, according to the electronic circuit device 1 according to Embodiment 1, since the holding member 50 is interposed between the held structure 32 and the neighboring structure 22, it is possible to ensure an insulation distance by increasing at least one of the creepage distance and the space distance between the held structure 32 and the neighboring structure 22.

[0046] As a result, the electronic circuit device 1 according to Embodiment 1 can facilitate mounting of a large substrate upper structure on the second substrate 30, and thus is an electronic circuit device that is easily miniaturized compared to a conventional electronic circuit device by effective use of volume, optimization of wiring, etc.

[0047] Further, in the electronic circuit device 1 according to Embodiment 1, the holding portion 52 is arranged in the first direction D1, the third direction D3, and the fourth direction D4 with respect to the held structure 32, and is not arranged in the fifth direction D5 and the second direction D2. Therefore, according to the electronic circuit device 1 according to Embodiment 1, it is possible to apply the fixing material 60 from the second direction D2 and the fifth direction D5.

[0048] Further, according to the electronic circuit device 1 according to Embodiment 1, since the holding member 50 is fixed to the second substrate 30 by mechanical bonding, it is possible to relatively easily increase the positional accuracy of the holding member 50.

[0049] Further, according to the electronic circuit device 1 according to Embodiment 1, since the concavo-convex structure 56 is formed at the tip of the leg portion 54 in the holding member 50, it is possible to increase the contact area between the leg portion 54 and the sealing body 40 and increase the fixing force of the holding member 50 by the sealing body 40.

[0050] The manufacturing method of the electronic circuit device according to Embodiment 1 is a method of manufacturing the electronic circuit device 1 using the above-described holding member 50. Therefore, according to the manufacturing method of the electronic circuit device according to Embodiment 1, since it is possible to facilitate the mounting of the large substrate structure on the second substrate 30, it is possible to manufacture the electronic circuit device 1 according to Embodiment 1 which is easier to miniaturize compared with the conventional electronic circuit device by effective use of volume, optimization of wiring, etc.

[0051] Further, the manufacturing method of the electronic circuit device according to Embodiment 1 uses, as the holding member 50, a member having a holding portion 52 that is arranged in the first direction D1, the third direction D3, and the fourth direction D4 with respect to the held structure 32 and is not arranged in the fifth direction D5 and the second direction D2 when fixed to the second substrate 30. Therefore, according to the manufacturing method of the electronic circuit device according to Embodiment 1, it is possible to apply the fixing material 60 from the second direction D2 and the fifth direction D5.

[0052] Further, according to the method of manufacturing an electronic circuit device according to Embodiment 1, in the holding member fixing step S20, since the holding member 50 is fixed to the second substrate 30 by mechanical bonding, it is possible to relatively easily increase the positional accuracy of the holding member 50.

[0053] Further, according to the method of manufacturing an electronic circuit device according to Embodiment 1, as the holding member 50, one having an uneven structure 56 formed at the tip of the leg portion 54 is used. Therefore, the contact area between the leg portion 54 and the sealing body 40 can be increased, and the fixing force of the holding member 50 by the sealing body 40 can be increased.

[0054] [Embodiment 2] The electronic circuit device 2 according to Embodiment 2 basically has the same configuration as the electronic circuit device 1 according to Embodiment 1, but the shape of the holding member is different. As shown in FIGS. 7 and 8, the electronic circuit device 2 according to Embodiment 2 includes a holding member 50a having a holding portion 52a and leg portions 54.

[0055] Among the holding members 50a, the leg portions 54 have the same configuration as the leg portions 54 of the holding member 50 in Embodiment 1, and thus the description thereof is omitted. The holding portion 52a is arranged in the first direction D1, the second direction D2, the third direction D3, and the fourth direction D4 with respect to the structure to be held 32, and is not arranged in the fifth direction D5 (see FIG. 8).

[0056] The structure to be held 32 and the holding portion 52a are fixed by a fixing material 60a. The fixing material 60a is arranged inside the holding portion 52a arranged so as to surround the periphery of the structure to be held 32. As the fixing material 60a, various adhesives and fillers can be used in the same manner as the fixing material 60 in Embodiment 1, but various resins or the like having fluidity at least during filling can also be used.

[0057] The electronic circuit device 2 according to Embodiment 2 can be manufactured by the manufacturing method of the electronic circuit device according to Embodiment 2 described below. Note that the manufacturing method of the electronic circuit device according to Embodiment 2 is basically the same as the manufacturing method of the electronic circuit device according to Embodiment 1 except for using the holding member 50a and the fixing material 60a, and thus the description will be omitted as necessary.

[0058] As shown in FIG. 9, the manufacturing method of the electronic circuit device according to Embodiment 2 includes a second substrate mounting step S10a, a holding member fixing step S20a, a structure to be held fixing step S30a, a first substrate mounting step S40a, an insertion step S50a, and a sealing step S60a. Note that the manufacturing method of the electronic circuit device according to Embodiment 2 may include steps other than those described above. Each step will be described below.

[0059] Since the second substrate mounting step S10a is the same as the second substrate mounting step S10 in Embodiment 1, illustration and description thereof are omitted.

[0060] The holding member fixing step S20a is basically the same as the holding member fixing step S20 in Embodiment 1, but is a step of fixing the holding member 50a to the second substrate 30 (see FIG. 10(a)). In the holding member fixing step S20a, as the holding member 50a, when fixed to the second substrate 30, the holding part 52a is arranged in the first direction D1, the second direction D2, the third direction D3, and the fourth direction D4 with respect to the structure to be held 32 and is not arranged in the fifth direction D5.

[0061] The structure to be held fixing step S30a is basically the same as the structure to be held fixing step S30 in Embodiment 1, but is a step of fixing the structure to be held 32 and the holding part 52a with the fixing material 60a (see FIG. 10(b)). The fixing material 60a can be applied, filled, arranged, inserted, etc. from the fifth direction D5 where the holding part 52a is not arranged. In particular, when the holding part 52a and the second substrate 30 are in close contact, the fixing material 60a made of various resins having fluidity can be filled into the region surrounded by the holding part 52a from the fifth direction D5.

[0062] Note that the method for manufacturing the electronic circuit device according to Embodiment 2 includes the step S30a of fixing the structure to be held between the step S20a of fixing the holding member and the step S40a of mounting the first substrate.

[0063] Since the first substrate mounting step S40a, the insertion step S50a, and the sealing step S60a are substantially the same as the first substrate mounting step S40, the insertion step S50, and the sealing step S60 in Embodiment 1, the illustration and description thereof are omitted.

[0064] The electronic circuit device 2 according to Embodiment 2 has a different shape of the holding member from the electronic circuit device 1 according to Embodiment 1. The electronic circuit device 2 according to Embodiment 2 includes a holding portion 52a that holds the structure to be held 32, and a leg portion 54 that extends from the holding portion 52a in the direction of the first substrate 20, and includes a holding member 50a fixed to the second substrate 30. Further, in the electronic circuit device 2 according to Embodiment 2, at least a part of the nearby structure 22 is disposed in the region between the holding portion 52a and the first substrate 20, the structure to be held 32 and the holding portion 52a are fixed by a fixing material 60a, and the portion where the leg portion 54 and the first substrate 20 are closest to each other is sealed by a sealing body 40. Therefore, similar to the electronic circuit device 1 according to Embodiment 1, the electronic circuit device 2 according to Embodiment 2 can facilitate the mounting of a large substrate upper structure on the second substrate 30, and thus is an electronic circuit device that is likely to be miniaturized compared with the conventional electronic circuit device by effective utilization of volume, optimization of wiring, etc.

[0065] Further, in the electronic circuit device 2 according to Embodiment 2, the holding portion 52a is disposed in the first direction D1, the second direction D2, the third direction D3, and the fourth direction D4 with respect to the structure to be held 32, and is not disposed in the fifth direction D5. Therefore, according to the electronic circuit device 2 according to Embodiment 2, it is possible to increase the arrangement direction of the holding portion 52a fixed by the fixing material 60a together with the second substrate 30 and the structure to be held 32, thereby improving the vibration resistance.

[0066] The electronic circuit device 2 according to Embodiment 2 has basically the same configuration as the electronic circuit device 1 according to Embodiment 1, and thus has corresponding effects among the effects of the electronic circuit device 1 according to Embodiment 1.

[0067] The manufacturing method of the electronic circuit device according to Embodiment 2 is different from the manufacturing method of the electronic circuit device according to Embodiment 1 in that the holding member 50a and the fixing material 60a are used, but it is a method of manufacturing the electronic circuit device 2 using the above-described holding member 50a. Therefore, according to the manufacturing method of the electronic circuit device according to Embodiment 2, since it is possible to facilitate the mounting of the large substrate structure on the second substrate 30, it is possible to manufacture the electronic circuit device 2 according to Embodiment 2 that is easier to miniaturize compared to the conventional electronic circuit device by effective use of volume and optimization of wiring.

[0068] Also, the manufacturing method of the electronic circuit device according to Embodiment 2 uses, as the holding member 50a, a member having a holding portion 52a that is arranged in the first direction D1, the second direction D2, the third direction D3, and the fourth direction D4 and not arranged in the fifth direction D5 with respect to the held structure 32 when fixed to the second substrate 30, and includes the held structure fixing step S30a between the holding member fixing step S20a and the first substrate mounting step S40a. Therefore, according to the manufacturing method of the electronic circuit device according to Embodiment 2, it is possible to increase the arrangement direction of the holding portion 52a fixed with the fixing material 60a together with the second substrate 30 and the held structure 32, and improve the vibration resistance.

[0069] The manufacturing method of the electronic circuit device according to Embodiment 2 basically includes the same steps as the manufacturing method of the electronic circuit device according to Embodiment 1, and thus has corresponding effects among the effects of the manufacturing method of the electronic circuit device according to Embodiment 1.

[0070] [Embodiment 3] The electronic circuit device 3 according to Embodiment 3 basically has the same configuration as the electronic circuit device 1 according to Embodiment 1, but the shape of the holding member is different. The electronic circuit device 3 according to Embodiment 3 includes a holding member 50b having a holding portion 52b and a leg portion 54, as shown in FIGS. 11 and 12.

[0071] Since the leg portion 54 of the holding member 50b has the same configuration as the leg portion 54 of the holding member 50 in the first embodiment, the description thereof will be omitted. The holding portion 52b is arranged in the fifth direction D5, the first direction D1, the third direction D3, and the fourth direction D4 with respect to the held structure 32, and is not arranged in the second direction D2.

[0072] The held structure 32 and the holding portion 52b are fixed by a fixing member 60b. The fixing member 60b is arranged inside the holding portion 52b that is arranged so as to surround the periphery of the held structure 32 together with the second substrate 30 when viewed along the first direction D1. The fixing member 60b is the same as the sealing body 40.

[0073] The electronic circuit device 3 according to the third embodiment can be manufactured by the manufacturing method of the electronic circuit device according to the third embodiment described below. Note that the manufacturing method of the electronic circuit device according to the third embodiment is basically the same as the manufacturing method of the electronic circuit device according to the first embodiment except for using the holding member 50b and the fixing member 60b, and thus the description will be omitted as necessary.

[0074] As shown in FIG. 13, the manufacturing method of the electronic circuit device according to the third embodiment includes a second substrate mounting step S10b, a holding member fixing step S20b, a first substrate mounting step S40b, an insertion step S50b, a sealing step S60b, and a held structure fixing step S30b. Note that the manufacturing method of the electronic circuit device according to the third embodiment may include steps other than those described above. Hereinafter, each step will be described.

[0075] Since the second substrate mounting step S10b is the same as the second substrate mounting step S10 in the first embodiment, the illustration and description thereof will be omitted.

[0076] The holding member fixing step S20b is basically the same as the holding member fixing step S20 in Embodiment 1, but is a step of fixing the holding member 50b to the second substrate 30 (see Fig. 14(a)). In the holding member fixing step S20b, as the holding member 50b, when fixed to the second substrate 30, it is arranged in the fifth direction D5, the first direction D1, the third direction D3, and the fourth direction D4 with respect to the structure 32 to be held, and does not include a holding portion 52b arranged in the second direction D2.

[0077] In the manufacturing method of the electronic circuit device according to Embodiment 3, the first substrate mounting step S40b is performed after the holding member fixing step S20b. Since the first substrate mounting step S40b and the insertion step S50b are substantially the same as the first substrate mounting step S40 and the insertion step S50 in Embodiment 1, the illustration and description thereof are omitted.

[0078] The sealing step S60b is basically the same as the sealing step S60b in Embodiment 1, but is different in that the sealing body 40 is also used as the fixing material 60b and is substantially performed simultaneously with the structure to be held fixing step S30b (see Fig. 14(b)). In the sealing step S60b, when filling the inside of the case 10 with the sealing body 40 made of various resins having fluidity, a part of it is also filled into the holding portion 52b from the second direction D2 and used as the fixing material 60b.

[0079] The electronic circuit device 3 according to Embodiment 3 has a different shape of the holding member from the electronic circuit device 1 according to Embodiment 1. The electronic circuit device 3 according to Embodiment 3 includes a holding portion 52b that holds the structure 32 to be held, and a leg portion 54 that extends from the holding portion 52b in the direction of the first substrate 20, and includes a holding member 50b fixed to the second substrate 30. Further, in the electronic circuit device 3 according to Embodiment 3, at least a part of the nearby structure 22 is disposed in the region between the holding portion 52b and the first substrate 20, the structure 32 to be held and the holding portion 52b are fixed by a fixing material 60b, and the portion where the leg portion 54 and the first substrate 20 are closest to each other is sealed by a sealing body 40. Therefore, similar to the electronic circuit device 1 according to Embodiment 1, the electronic circuit device 3 according to Embodiment 3 can facilitate the mounting of a large on-substrate structure on the second substrate 30, and thus can be an electronic circuit device that is easily miniaturized compared with the conventional electronic circuit device by effective use of volume, optimization of wiring, etc.

[0080] Further, in the electronic circuit device 3 according to Embodiment 3, the holding portion 52b is disposed in the fifth direction D5, the first direction D1, the third direction D3, and the fourth direction D4 with respect to the structure 32 to be held, and is not disposed in the second direction D2. Therefore, according to the electronic circuit device 3 according to Embodiment 3, it is possible to increase the arrangement direction of the holding portion 52b fixed by the fixing material 60b together with the second substrate 30 and the structure 32 to be held, and improve the vibration resistance.

[0081] Further, in the electronic circuit device 3 according to Embodiment 3, since it includes the holding member 50b having the above-described holding portion 52b, the sealing body 40 and the fixing material 60b can be made common, and the sealing by the sealing body 40 and the fixing of the structure 32 to be held and the holding portion 52b by the fixing material 60b can be performed simultaneously.

[0082] Since the electronic circuit device 3 according to Embodiment 3 basically has the same configuration as the electronic circuit device 1 according to Embodiment 1, it has the corresponding effects among the effects that the electronic circuit device 1 according to Embodiment 1 has.

[0083] The manufacturing method of the electronic circuit device according to Embodiment 3 is different from the manufacturing method of the electronic circuit device according to Embodiment 1 in that the holding member 50b and the fixing material 60b are used, but it is a method of manufacturing the electronic circuit device 3 using the above-described holding member 50b. Therefore, according to the manufacturing method of the electronic circuit device according to Embodiment 3, since it is possible to facilitate the mounting of the large substrate structure on the second substrate 30, it is possible to manufacture the electronic circuit device 3 according to Embodiment 3 which is likely to be miniaturized compared with the conventional electronic circuit device by effective utilization of volume, optimization of wiring, etc.

[0084] Further, in the manufacturing method of the electronic circuit device according to Embodiment 3, as the holding member 50b, when fixed to the second substrate 30, it has a holding portion 52b arranged in the fifth direction D5, the first direction D1, the third direction D3, and the fourth direction D4 with respect to the held structure 32 as a reference, and not arranged in the second direction D2. Therefore, according to the manufacturing method of the electronic circuit device according to Embodiment 3, it is possible to increase the arrangement direction of the holding portion 52b fixed by the fixing material 60b together with the second substrate 30 and the held structure 32, and improve the vibration resistance.

[0085] Also, according to the manufacturing method of the electronic circuit device according to Embodiment 3, since the holding member 50b having the above-described holding portion 52b is used, by sharing the sealing body 40 and the fixing material 60b, the sealing step S60b and the held structure fixing step S30b can be carried out simultaneously, and the substantial number of steps can be reduced.

[0086] The manufacturing method of the electronic circuit device according to Embodiment 3 basically includes the same steps as the manufacturing method of the electronic circuit device according to Embodiment 1, and thus has the corresponding effects among the effects of the manufacturing method of the electronic circuit device according to Embodiment 1.

[0087] [Embodiment 4] The electronic circuit device 4 according to Embodiment 4 basically has the same configuration as the electronic circuit device 1 according to Embodiment 1, but the structure of the foot portion in the holding member is different. As shown in FIG. 15, the electronic circuit device 4 according to Embodiment 4 includes a holding member 50c having a holding portion 52 and a foot portion 54c.

[0088] Since the holding part 52 of the holding member 50c has the same configuration as the holding part 52 of the holding member 50 in Embodiment 1, the description thereof is omitted. The tip of the leg part 54c in the holding member 50c is fixed to the first substrate 20c by mechanical joining. In the electronic circuit device 4, at the location indicated by the symbol S in FIGS. 15(b) and 15(c), the tip of the leg part 54c is fixed to the first substrate 20c.

[0089] The first substrate 20c basically has the same configuration as the first substrate 20 in Embodiment 1, but a structure for mechanical joining with the leg part 54c (for example, a through hole at the location indicated by the symbol S2 in FIG. 17(a) described later) is formed. When the holding member 50c is made of a resin material, considering the labor and strength, the mechanical joining is preferably a snap fit.

[0090] The electronic circuit device 4 according to Embodiment 4 can be manufactured by the manufacturing method of the electronic circuit device according to Embodiment 4 described below. The manufacturing method of the electronic circuit device according to Embodiment 4 is basically the same as the manufacturing method of the electronic circuit device according to Embodiment 1 except for using the first substrate 20c and the holding member 50c, and thus the description is omitted as necessary.

[0091] As shown in FIG. 16, the manufacturing method of the electronic circuit device according to Embodiment 4 includes a second substrate mounting step S10c, a holding member fixing step S20c, a structure to be held fixing step S30c, a first substrate mounting step S40c, an insertion step S50c, and a sealing step S60c. The manufacturing method of the electronic circuit device according to Embodiment 4 may include steps other than those described above. Hereinafter, each step will be described.

[0092] The second substrate mounting step S10c, the holding member fixing step S20c, and the structure to be held fixing step S30c are the same as or basically the same as the second substrate mounting step S10, the holding member fixing step S20, and the structure to be held fixing step S30 in the first embodiment, and thus the illustration and description thereof are omitted. In the holding member fixing step S20c, a holding member 50c having a tip of a leg portion 54c that can be fixed to the first substrate 20c by mechanical joining is used.

[0093] The first substrate mounting step S40c is basically the same as the first substrate mounting step S40 in the first embodiment. However, in the first substrate mounting step S40c, the second substrate 30 is supported by mechanical joining of the first substrate 20c and the holding member 50c (see FIG. 17). A structure for mechanical joining (for example, a protrusion at a position indicated by reference numeral S1 in FIG. 17(a)) is formed at the tip of the leg portion 54c. Further, a structure for mechanical joining (for example, a through hole at a position indicated by reference numeral S2 in FIG. 17(a)) is also formed in the first substrate 20c.

[0094] The insertion step S50c and the sealing step S60c are substantially the same as the insertion steps S50 and S60 in the first embodiment, and thus the illustration and description thereof are omitted.

[0095] The electronic circuit device 4 according to Embodiment 4 differs from the electronic circuit device 1 according to Embodiment 1 in the structure of the leg portion of the holding member. However, the electronic circuit device 4 according to Embodiment 4 has a holding portion 52 that holds the structure 32 to be held, and a leg portion 54c that extends from the holding portion 52 in the direction of the first substrate 20, and includes a holding member 50c fixed to the second substrate 30. Further, in the electronic circuit device 4 according to Embodiment 4, at least a part of the neighboring structure 22 is disposed in the region between the holding portion 52 and the first substrate 20, the structure 32 to be held and the holding portion 52 are fixed by a fixing material 60, and the portion where the leg portion 54 and the first substrate 20c are closest to each other is sealed by a sealing body 40. Therefore, similar to the electronic circuit device 1 according to Embodiment 1, the electronic circuit device 4 according to Embodiment 4 can facilitate the mounting of a large on-substrate structure on the second substrate 30, and thus can be made smaller than a conventional electronic circuit device by effectively using the volume and optimizing the wiring, etc.

[0096] Further, according to the electronic circuit device 4 according to Embodiment 4, since the tip of the leg portion 54c in the holding member 50c is fixed to the first substrate 20c by mechanical bonding, a direct fixing force can be obtained between the first substrate 20c and the holding member 50c, and the vibration resistance can be improved.

[0097] Since the electronic circuit device 4 according to Embodiment 4 basically has the same configuration as the electronic circuit device 1 according to Embodiment 1, it has the corresponding effects among the effects of the electronic circuit device 1 according to Embodiment 1.

[0098] The manufacturing method of the electronic circuit device according to Embodiment 4 is different from the manufacturing method of the electronic circuit device according to Embodiment 1 in that the first substrate 20c and the holding member 50c are used, but it is a method of manufacturing the electronic circuit device 4 using the above-described holding member 50c. Therefore, according to the manufacturing method of the electronic circuit device according to Embodiment 4, it is possible to facilitate the mounting of a large on-substrate structure on the second substrate 30, and thus it is possible to manufacture the electronic circuit device 4 according to Embodiment 4 that is easier to miniaturize than a conventional electronic circuit device by effectively using the volume and optimizing the wiring, etc.

[0099] Further, in the manufacturing method of the electronic circuit device according to Embodiment 4, as the holding member 50c, a member whose tip of the leg portion 54c can be fixed to the first substrate 20c by mechanical bonding is used. In the first substrate mounting step S40c, the second substrate 30 is supported by the mechanical bonding between the first substrate 20c and the holding member 50c. Therefore, according to the manufacturing method of the electronic circuit device according to Embodiment 4, a direct fixing force can be obtained between the first substrate 20c and the holding member 50c, and it is possible to improve the vibration resistance.

[0100] Also, according to the manufacturing method of the electronic circuit device according to Embodiment 4, in the first substrate mounting step S40c, since the second substrate 30 is supported by the mechanical bonding between the first substrate 20c and the holding member 50c, it is not necessary to use a jig for fixing the second substrate 30 until the sealing step S60c, and thus the process can be simplified.

[0101] Since the manufacturing method of the electronic circuit device according to Embodiment 4 basically includes the same steps as the manufacturing method of the electronic circuit device according to Embodiment 1, it has the corresponding effects among the effects of the manufacturing method of the electronic circuit device according to Embodiment 1.

[0102] As described above, the present invention has been described based on the above embodiments, but the present invention is not limited to the above embodiments. It can be implemented in various modes without departing from the gist thereof. For example, the following modifications are possible.

[0103] (1) The positions, sizes, etc. of the respective components described in the above embodiments are merely examples, and can be changed within a range that does not impair the effects of the present invention.

[0104] (2) In the above embodiments, the other first substrate superstructures 24 are arranged so as to enter the notch-shaped portions of the leg portions 54, 54c, but the present invention is not limited thereto. In the present invention, a notch-shaped portion may not be provided in the leg portion of the holding member, and the other first substrate superstructures may be arranged at other locations.

[0105] (3) In the above-described Embodiment 1, the step S30 of fixing the structure to be held was described as being carried out immediately after the step S20 of fixing the holding member. However, the present invention is not limited to this. The step of fixing the structure to be held may be included after the step of fixing the holding member.

[0106] (4) In the above-described Embodiment 3, the sealing body 40 and the fixing member 60b were made common, and the sealing step S60b and the step S30b of fixing the structure to be held were substantially carried out simultaneously. However, the present invention is not limited to this. Even in the configuration and method using the holding member 50b in Embodiment 3, the sealing body and the fixing member may be separate. Also, in this case, the sealing step and the step of fixing the structure to be held do not necessarily have to be carried out simultaneously.

[0107] (5) When using a holding member such as the holding member 50a in the above-described Embodiment 2, it is also possible to improve the heat dissipation by arranging a heat conduction member in the holding part arranged in the second direction (the opening side of the case) when viewed from the structure to be held and bringing the heat conduction member into contact with the case lid or the like.

[0108] (6) In each of the drawings for explaining the above-described embodiments, only a part of the nearby structure 22 is shown as being arranged in the region between the holding parts 52, 52a, 52b and the first substrate 20, 20c. However, the present invention is not limited to this. From the viewpoint of increasing the spatial distance between the structure to be held and the nearby structure, it is preferable that the entire nearby structure is arranged in the region between the holding part and the first substrate. Also, from the viewpoint of increasing the spatial distance between the structure to be held and the nearby structure, even when only a part of the nearby structure is arranged in the region between the holding part and the first substrate, the length of the holding part from the second substrate (the length in the fifth direction) is preferably sufficiently longer than the length of the structure to be held from the second substrate (the length in the fifth direction). By "sufficiently long" for the length of the holding part from the second substrate, it means a length such that the holding part always intervenes between the nearby structure and the structure to be held.

Explanation of Reference Numerals

[0109] 1, 2, 3, 4... electronic circuit device, 10... case, 12... bottom plate, 14... side plate, 20, 20c... first substrate, 22... nearby structure, 30... second substrate, 32... structure to be held, 40... sealing body, 50, 50a, 50b, 50c... holding members, 52, 52a, 52b... holding parts, 54, 54c... feet, 56... concavo-convex structure, 60, 60a, 60b... fixing materials, D1... first direction, D2... second direction, D3... third direction, D4... fourth direction, D5... fifth direction

Claims

1. A case having a bottom plate and side plates and having an opening in one direction, A first substrate disposed inside the case such that the back surface faces the bottom plate, A plurality of structures on the first substrate mounted on the first substrate, A second substrate mounted in a standing state on the first substrate, A plurality of structures on the second substrate mounted on the second substrate, An electronic circuit device comprising a sealing body filled inside the case and sealing at least a part of the first substrate and the plurality of structures on the first substrate, The electronic circuit device has a holding portion that holds at least one held structure among the plurality of structures on the second substrate, and a leg portion extending from the holding portion in the direction of the first substrate, and further includes a holding member fixed to the second substrate, The holding portion is disposed at least between the held structure and the first substrate, At least a part of a neighboring structure disposed closest to the held structure among the plurality of structures on the first substrate is disposed in a region between the holding portion and the first substrate, The held structure and the holding portion are fixed by a fixing material, An electronic circuit device, characterized in that a location where the leg portion and the first substrate are closest to each other is sealed by the sealing body.

2. When the second substrate is viewed in a plan view from the side where the held structure is disposed, a direction from the held structure toward the first substrate side is defined as a first direction, a direction opposite to the first direction is defined as a second direction, one of the directions perpendicular to the first direction is defined as a third direction, and a direction opposite to the third direction is defined as a fourth direction. The holding portion is disposed in the first direction, the third direction, and the fourth direction with respect to the held structure, and is perpendicular to any of the first direction to the fourth direction and is not disposed in a fifth direction from the second substrate toward the side where the held structure is disposed and the second direction. The electronic circuit device according to claim 1.

3. When the second substrate is viewed in a plan view from the side where the held structure is disposed, a direction from the held structure toward the first substrate side is defined as a first direction, a direction opposite to the first direction is defined as a second direction, one of the directions perpendicular to the first direction is defined as a third direction, and a direction opposite to the third direction is defined as a fourth direction. The holding portion is arranged in the first direction, the second direction, the third direction, and the fourth direction with respect to the held structure, and is perpendicular to any of the first direction to the fourth direction and is not arranged in the fifth direction from the second substrate toward the side where the held structure is arranged. The electronic circuit device according to claim 1.

4. When the second substrate is viewed in a plan view from the side where the held structure is arranged, the direction from the held structure toward the first substrate side is defined as the first direction, the direction opposite to the first direction is defined as the second direction, one of the directions perpendicular to the first direction is defined as the third direction, and the direction opposite to the third direction is defined as the fourth direction. The holding portion is arranged in the fifth direction, the first direction, the third direction, and the fourth direction with respect to the held structure, and is perpendicular to any of the first direction to the fourth direction and is not arranged in the second direction from the second substrate toward the side where the held structure is arranged. The electronic circuit device according to claim 1.

5. The holding member is fixed to the second substrate by mechanical bonding. The electronic circuit device according to claim 1.

6. An uneven structure is formed at the tip of the leg portion of the holding member. The electronic circuit device according to claim 1.

7. The tip of the leg portion of the holding member is fixed to the first substrate by mechanical bonding. The electronic circuit device according to claim 1.

8. A method for manufacturing an electronic circuit device for manufacturing the electronic circuit device according to claim 1, A second substrate mounting step of mounting the plurality of second substrate upper structures including the held structure on the second substrate, A holding member fixing step of fixing the holding member to the second substrate, A first substrate mounting step of mounting the plurality of first substrate upper structures including the adjacent structure on the first substrate, and then mounting the second substrate so that at least a part of the adjacent structure is arranged in the region between the holding portion and the first substrate, An insertion step of inserting the first substrate and the second substrate into the case, A sealing step of filling the inside of the case with the sealing body, sealing at least a part of the first substrate and the plurality of first substrate upper structures, and also sealing the portion where the leg portion and the first substrate are closest to each other. A method for manufacturing an electronic circuit device, further comprising a step of fixing the structure to be held and the holding portion with the fixing member after the step of fixing the holding member.

9. When the second substrate in the electronic circuit device is viewed in a plan view from the side where the structure to be held is disposed, a direction from the structure to be held toward the first substrate side is defined as a first direction, a direction opposite to the first direction is defined as a second direction, one of the directions perpendicular to the first direction is defined as a third direction, and a direction opposite to the third direction is defined as a fourth direction. When the holding member is fixed to the second substrate, the holding member is arranged in the first direction, the third direction, and the fourth direction with respect to the structure to be held, and is perpendicular to any of the first direction to the fourth direction, and is not arranged in the fifth direction from the second substrate toward the side where the structure to be held is disposed and the second direction. The method for manufacturing an electronic circuit device according to claim 8, characterized in that such a holding portion is used.

10. When the second substrate in the electronic circuit device is viewed in a plan view from the side where the structure to be held is disposed, a direction from the structure to be held toward the first substrate side is defined as a first direction, a direction opposite to the first direction is defined as a second direction, one of the directions perpendicular to the first direction is defined as a third direction, and a direction opposite to the third direction is defined as a fourth direction. When the holding member is fixed to the second substrate, the holding member is arranged in the first direction, the second direction, the third direction, and the fourth direction with respect to the structure to be held, and is perpendicular to any of the first direction to the fourth direction, and is not arranged in the fifth direction from the second substrate toward the side where the structure to be held is disposed. The method for manufacturing an electronic circuit device according to claim 8, characterized in that such a holding portion is used, The method for manufacturing an electronic circuit device includes the step of fixing the structure to be held between the step of fixing the holding member and the step of mounting the first substrate. The method for manufacturing an electronic circuit device according to claim 8, characterized in that this is the case.

11. When the second substrate in the electronic circuit device is viewed in a plan view from the side where the structure to be held is disposed, a direction from the structure to be held toward the first substrate side is defined as a first direction, a direction opposite to the first direction is defined as a second direction, one of the directions perpendicular to the first direction is defined as a third direction, and a direction opposite to the third direction is defined as a fourth direction. As the holding member, when fixed to the second substrate, with respect to any of the first direction to the fourth direction with reference to the structure to be held, it is perpendicular to the fifth direction, the first direction, the third direction, and the fourth direction that goes from the second substrate toward the side where the structure to be held is disposed, and does not include the holding part disposed in the second direction. The method for manufacturing an electronic circuit device according to claim 8, characterized in that such a holding member is used.

12. In the holding member fixing step, the method for manufacturing an electronic circuit device according to claim 8, characterized in that the holding member is fixed to the second substrate by mechanical bonding.

13. As the holding member, the method for manufacturing an electronic circuit device according to claim 8, characterized in that an uneven structure is formed at the tip of the leg portion.

14. As the holding member, the tip of the leg portion can be fixed to the first substrate by mechanical bonding, In the first substrate mounting step, the method for manufacturing an electronic circuit device according to claim 8, characterized in that the second substrate is supported by mechanical bonding between the first substrate and the holding member.

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