Composition

Abstract

To provide a composition that exhibits excellent compatibility with and solubility in various solvents and resin components.SOLUTION: A composition comprises the compound represented by the formula in the figure, a specific squaric acid compound, and a specific polymethine compound. In the formula, R111 to R117 and R121 to R127 are each an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, or an alkylsulfonyl group.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] This specification discloses a composition and its uses.

Background Art

[0002] Absorbents, especially those capable of absorbing light in the infrared region, may be applied to various uses.

[0003] For example, in imaging devices using CCD (Charge-Coupled Device) or CMOS (complementary metal-oxide-semiconductor) image sensors, infrared sensors, etc., since they include silicon photodiodes having sensitivity to the near-infrared region, the absorbent may be used.

[0004] Although there are various ways to apply such absorbents, usually, a method using a coating solution obtained by mixing an absorbent dissolved in a solvent and a resin component is applied.

[0005] Therefore, it is necessary for the absorbent to exhibit excellent solubility or compatibility with both the solvent and the resin component.

[0006] When the solubility or compatibility of the absorbent with the solvent or the resin component decreases, the desired spectral characteristics may not be obtained for the absorption film to which the absorbent is applied, or the light characteristics may deteriorate due to phenomena such as precipitation of the absorbent in the absorption film.

[0007] However, it is a difficult problem to ensure an absorbent that simultaneously exhibits excellent solubility or compatibility with various types of solvents and resin components.

[0008] In addition, for example, when the absorption bandwidth is wide or when light characteristics that are difficult to obtain with other single absorbents are required, two or more types of absorbents must be applied. However, it is a difficult problem for all of the two or more types of absorbents to simultaneously exhibit excellent solubility or compatibility with various types of solvents and resin components. Summary of the Invention Problems to be Solved by the Invention

[0009] This specification discloses a composition and its uses. The composition may contain three or more types of absorbents and can exhibit excellent compatibility and solubility with various solvents and resin components.

[0010] The composition may be used to form a resin film that exhibits a wide absorption band in the infrared region, and such a resin film can function as an absorption film used in various applications including optical filters, solid-state imaging devices, and / or infrared sensors. Means for Solving the Problems

[0011] Among the physical properties mentioned in this specification, those for which the measurement temperature affects the results are, unless otherwise specified, the results measured at room temperature.

[0012] The term "room temperature" refers to the natural temperature without heating or cooling, for example, any temperature within the range of 10°C to 30°C, a temperature of about 23°C or about 25°C. Also, unless otherwise specified, the unit of temperature in this specification is degrees Celsius (°C).

[0013] Among the physical properties mentioned in this specification, those for which the measurement pressure affects the results are, unless otherwise specified, the results measured at normal pressure.

[0014] The term "normal pressure" refers to the natural pressure without pressurization or depressurization, and usually means a pressure of about 740 mmHg to 780 mmHg at the atmospheric pressure level.

[0015] When humidity affects the results among the physical properties mentioned in this specification, unless otherwise specified, the physical properties are those measured at the humidity under standard conditions.

[0016] The humidity under standard conditions means any humidity within the range of 40% to 60% in relative humidity, for example, a relative humidity of about 40% or 60%.

[0017] In this specification, unless otherwise specified, the terms transmittance or absorbance mean the actual transmittance (measured transmittance) or actual absorbance (measured absorbance) confirmed within a specific wavelength or a wavelength range of a predetermined region.

[0018] In this specification, unless otherwise specified, the terms transmittance or absorbance are the transmittance or absorbance based on an incident angle of 0 degrees.

[0019] In this specification, unless otherwise specified, the term average transmittance is the result obtained by calculating the arithmetic mean of the transmittances measured after measuring the transmittances at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength within a predetermined wavelength region. For example, the average transmittance within the wavelength range of 350 nm to 360 nm is the arithmetic mean of the transmittances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0020] In this specification, the term maximum transmittance is the maximum transmittance when measuring the transmittances at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength within a predetermined wavelength region. For example, the maximum transmittance within the wavelength range of 350 nm to 360 nm is the highest transmittance among the transmittances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0021] In this specification, the minimum transmittance of a term means the minimum transmittance when the transmittance at each wavelength is measured while increasing the wavelength by 1 nm from the shortest wavelength within a predetermined wavelength range. For example, the minimum transmittance within the wavelength range of 350 nm to 360 nm is the lowest transmittance among the transmittances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0022] The meanings of the average transmittance, maximum transmittance, and minimum transmittance are similarly applicable to the average absorbance, maximum absorbance, and minimum absorbance, respectively, except that the transmittance is changed to absorbance.

[0023] In this specification, the incident angle is an angle based on the normal line of the surface of the object to be evaluated. For example, the transmittance at an incident angle of 0 degrees of an optical filter means the transmittance for light incident in a direction substantially parallel to the normal line of the surface of the optical filter. Also, for example, an incident angle of 40 degrees is a value for incident light that forms a substantially 40-degree angle with the normal line in the clockwise or counterclockwise direction. Such a definition of the incident angle is similarly applicable to other characteristics such as transmittance.

[0024] This specification discloses a composition.

[0025] In this specification, the term "composition" means a mixture of two or more components.

[0026] In this specification, the term "absorbent composition" means a composition consisting of an absorbent, that is, a mixture of only two or more absorbents may be used. For example, the term "absorbent composition" means a mixture consisting of two or three or more absorbents having different chemical structures from each other.

[0027] In this specification, the term "absorbent" means a compound that exhibits a low transmittance at any specific wavelength with respect to other wavelengths.

[0028] As used herein, the term resin composition means a mixture containing a resin component and other components.

[0029] In one example, the absorbent composition may contain the compound of Chemical Formula 1, the compound of Chemical Formula 2, and the compound of Chemical Formula 3 below.

[0030] The compounds of Chemical Formulas 1 to 3 have different structures from each other.

[0031]

Chemical Formula

[0032] In Chemical Formula 1, R 111 ~R 117 and R 121 ~R 127 may each independently be hydrogen, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, or an alkylsulfonyl group.

[0033] In Chemical Formula 1, the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group may each independently be an alkyl group having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. Further, the alkyl group may be a linear, branched, or cyclic alkyl group.

[0034] Such an alkyl group may optionally be substituted with at least one substituent or may be an unsubstituted alkyl group.

[0035] In Chemical Formula 1, R 111 ~R 117 and R 121 ~R 127At least one of them may be an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group or an alkylsulfonyl group.

[0036] In a suitable example of Chemical Formula 1, R 111 and R 121 may each independently be an alkyloxy group, an alkylcarbonyl group, an alkyloxycarbonyl group or an alkylsulfonyl group.

[0037] In a suitable example of Chemical Formula 1, R 112 , R 122 , R 117 and R 127 may each independently be hydrogen or an alkyl group, or may be hydrogen.

[0038] In a suitable example of Chemical Formula 1, R 113 and R 123 may each independently be an alkyl group or an alkyloxy group.

[0039] In a suitable example of Chemical Formula 1, R 114 ~R 116 and R 124 ~R 126 may each independently be an alkyl group or an alkyloxy group, or may be an alkyl group.

[0040]

Chemical Formula

[0041] In Chemical Formula 2, R 211 ~R 213 and R 221 ~R 223 may each independently be hydrogen, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group or an alkylsulfonyl group.

[0042] In Chemical Formula 2, the details of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group are the same as those in Chemical Formula 1.

[0043] In Chemical Formula 2, R 211 ~R 213 and R 221 ~R 223 At least one of them may be an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, or an alkylsulfonyl group.

[0044] In Chemical Formula 2, A1, B1, A2, and B2 are each independently a benzene structure or do not exist. When the benzene structure is formed in the above, the benzene structure may be substituted or unsubstituted.

[0045] In a suitable example of Chemical Formula 2, R 211 and R 221 may each independently be an alkyl group, an alkyloxy group, or an alkyloxyalkyl group, for example, an alkyl group or an alkyloxyalkyl group.

[0046] In a suitable example of Chemical Formula 2, R 212 、R 213 、R 222 and R 223 may each independently be hydrogen or an alkyl group, or for example, an alkyl group.

[0047] In a suitable example of Chemical Formula 2, at least one of A1 and B1 may be a benzene structure. For example, either one of A1 and B1 may be a benzene structure and the other may not exist.

[0048] In a suitable example of Chemical Formula 2, at least one of A2 and B2 may be a benzene structure. For example, either one of A2 and B2 may be a benzene structure, and the other may not exist.

[0049]

Chemical Formula

[0050] In Chemical Formula 3, R3 may be hydrogen or a halogen. For example, it may be hydrogen, chlorine, fluorine, or iodine.

[0051] In Chemical Formula 3, R 311 , R 312 , R 321 and R 322 may each independently be hydrogen, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, an alkylsulfonyl group, or an aryl group.

[0052] In Chemical Formula 3, R 313 and R 314 may each independently be hydrogen, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, an alkylsulfonyl group, or an aryl group, or may be linked to each other to form a benzene structure.

[0053] In Chemical Formula 3, R 323 and R 324 may each independently be hydrogen, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, an alkylsulfonyl group, or an aryl group, or may be linked to each other to form a benzene structure.

[0054] In Chemical Formula 3, Z may be a heteroatom, i.e., an atom other than carbon and hydrogen, and may be, for example, an oxygen, nitrogen, or sulfur atom.

[0055] In Chemical Formula 3, the details of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group are the same as those in Chemical Formula 1.

[0056] In Chemical Formula 3, the aryl group is a monovalent residue derived from a compound having a structure in which one molecule of benzene or two or more benzenes are bonded or a derivative thereof. The range of the compound having a structure in which two or more benzenes are bonded includes structures in which two or more benzenes such as phenylbenzene or diphenylmethane are linked by a linker, structures in which two benzenes such as naphthalene are bonded while sharing two carbon atoms, and structures in which two benzenes such as spiro compounds are bonded while sharing one carbon atom, and may include one or more of these structures. The aryl group may be an aryl group having 6 to 30 carbon atoms, 6 to 24 carbon atoms, 6 to 18 carbon atoms, 6 to 12 carbon atoms, 6 to 10 carbon atoms, or 6 to 8 carbon atoms.

[0057] Such an aryl group may be substituted or may be in an unsubstituted state.

[0058] In a suitable example of Chemical Formula 3, R 311 , R 312 , R 321 and R 322 may each independently be hydrogen, an alkyl group, or an alkyloxy group.

[0059] In a suitable example of Chemical Formula 3, R 311 and R 312One of them is hydrogen, and the other may be an alkyl group or an alkyloxy group. At this time, the alkyl group of the alkyl group or the alkyloxy group may be a branched alkyl group.

[0060] In a suitable example of Chemical Formula 3, R 321 and R 322 One of them is hydrogen, and the other may be an alkyl group or an alkyloxy group. At this time, the alkyl group of the alkyl group or the alkyloxy group may be a branched alkyl group.

[0061] In Chemical Formula 3, R 313 and R 314 When they are not linked to each other to form a benzene structure, they may each independently be hydrogen, an alkyl group or an aryl group.

[0062] In Chemical Formula 3, R 323 and R 324 When they are not linked to each other to form a benzene structure, they may each independently be hydrogen, an alkyl group or an aryl group.

[0063] In Chemical Formula 3, R 313 and R 314 and R 323 and R 324 Any pair of them may be linked to each other to form a benzene structure.

[0064] For example, when 313 R and 314 and R 323 and R 324 all form a benzene structure, the compound of Chemical Formula 3 is represented by Chemical Formula 4.

[0065]

Chemical Formula

[0066] In Chemical Formula 4, R3, R 311 , R 312 , R 321 , R322 and Z are the same as R3, R in Chemical Formula 3 respectively, 311 , R 312 , R 321 , R 322 and Z.

[0067] In Chemical Formula 4, R 3131 ~R 3134 and R 3231 ~R 3234 may each independently be hydrogen, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group or an alkylsulfonyl group, for example, hydrogen, an alkyl group, an alkyloxy group or an alkyloxyalkyl group.

[0068] In Chemical Formula 4, the details of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group and the alkyl group of the alkylsulfonyl group are the same as those in the case of Chemical Formula 1.

[0069] In one example, the absorbent composition may contain the compound of Chemical Formula 1, the compound of Chemical Formula 2 and the compound of Chemical Formula 3.

[0070] In order to achieve desired optical properties and ensure appropriate solubility and compatibility with various solvents and resins, the mixing form of the compounds of Chemical Formulas 1 to 3 may be adjusted.

[0071] For example, in the mixing, the numbers of A to C below may be adjusted.

[0072] A is the total number of carbon atoms of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group and the alkyl group of the alkylsulfonyl group present in Chemical Formula 1.

[0073] B is the total number of carbon atoms of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group present in Chemical Formula 2.

[0074] C is the total number of carbon atoms of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group present in Chemical Formula 3.

[0075] That is, the above A is R in Chemical Formula 1 111 ~R 117 and R 121 ~R 127 and is the total sum of the number of carbon atoms of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group (two alkyl groups), the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group (two alkyl groups), and the alkyl group of the alkylsulfonyl group present respectively.

[0076] Also, the above B is R in Chemical Formula 2 211 ~R 213 and R 221 ~R 223The total number of carbon atoms of each of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group (two alkyl groups), the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group (two alkyl groups), and the alkyl group of the alkylsulfonyl group present at the position; and if in Chemical Formula 2, A1, B1, A2 and / or B2 is a benzene structure and the benzene structure is substituted with an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group or an alkylsulfonyl group, the number of carbon atoms of the alkyl group of the substituent is also included in the calculation of B.

[0077] Further, the C is R in Chemical Formula 3 311 ~R 314 and R 321 ~R 324 The total number of carbon atoms of each of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group (two alkyl groups), the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group (two alkyl groups), and the alkyl group of the alkylsulfonyl group present at the position; and if R in Chemical Formula 3 314 and R 313 and / or R 323 and R 324 form a benzene structure and the substituent of the benzene structure (for example, R in Chemical Formula 4 3131 ~R 3134 and R 3231 ~R 3234 ) is an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group or an alkylsulfonyl group, or R in Chemical Formula 3 311 ~R 314 and R 321 ~R 324Any one or more of them is an aryl group, and if the aryl group is an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, or an alkylsulfonyl group, the number of carbon atoms of the alkyl group of the substituent is also included in the calculation of C.

[0078] The lower limit of the total of A, B, and C may be about 30, 35, 40, 45, 50, 55, or 60, and the upper limit may be about 200, 180, 160, 140, 120, 100, 95, 90, 85, 80, 75, 70, 65, 60, 55, 50, 45, or 40. The total of A, B, and C may be within the range of equal to or exceeding any of the lower limits described above, or within the range of equal to or exceeding any of the lower limits described above but less than any of the upper limits described above.

[0079] Desired optical properties can be achieved through the absorbent composition within such a range, and appropriate solubility and compatibility with various solvents and resins can be ensured.

[0080] The standard deviation of A, B, and C may also be within a certain range. The standard deviation may be calculated as [{(A - V) 2 +(B - V) 2 +(C - V) 2} / 3] 0.5 The lower limit of the standard deviation may be about 0, 2, 4, 6, 8, 10, or 12, and the upper limit may be about 50, 45, 40, 35, 30, 25, 20, 15, 10, 8, 6, or 4. The standard deviation of A, B, and C may be within the range of equal to or exceeding any of the lower limits described above, or within the range of less than any of the upper limits described above, or within the range of equal to or exceeding any of the lower limits described above but less than any of the upper limits described above.

[0081] Within such a range, desired optical properties can be achieved through the absorbent composition, and appropriate solubility and compatibility with various solvents and resins can be ensured.

[0082] The lower limit of the average (arithmetic mean) of A, B, and C may be about 6, 8, 10, 12, 14, 16, 18, or 20, and the upper limit thereof may be about 35, 33, 31, 29, 27, 25, 23, 21, 19, 17, 15, or 12. The average (arithmetic mean) of A, B, and C is within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above.

[0083] Within such a range, desired optical properties can be achieved through the absorbent composition, and appropriate solubility and compatibility with various solvents and resins can be ensured.

[0084] The ratio A / B of A to B may be controlled. The lower limit of the ratio A / B may be about 0.1, 0.3, 0.5, 0.7, 0.9, 1, 1.5, 2, 2.5, or 2.8, and the upper limit thereof may be about 10, 9, 8, 7, 6, 5, 4, 3, 2, 1.5, or 1. The ratio A / B is within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above. Within such a range, desired optical properties can be achieved through the absorbent composition, and appropriate solubility and compatibility with various solvents and resins can be ensured.

[0085] In the above, the ratio B / C of B to C may be controlled. The lower limit of the ratio B / C may be about 0.1, 0.3, 0.5, 0.7, 0.9, 1, 1.2, 1.4, 1.6, 1.8 or 2, and the upper limit thereof may be about 10, 9, 8, 7, 6, 5, 4, 3, 2.5 or 2. The ratio B / C may be within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above. By the absorbent composition within such a range, desired optical properties can be achieved, and appropriate solubility and compatibility with various solvents and resins can be ensured.

[0086] In the above, the ratio A / C of A to C may be controlled. The lower limit of the ratio A / C may be about 0.5, 1, 1.5, 2, 2.5, 3, 3.5 or 4, and the upper limit thereof may be about 15, 13, 11, 9, 7, 5 or 3. The ratio A / C may be within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above. By the absorbent composition within such a range, desired optical properties can be achieved, and appropriate solubility and compatibility with various solvents and resins can be ensured.

[0087] In order to more efficiently ensure the desired effect, the structures of Chemical Formulas 1 to 3 may be controlled.

[0088] For example, in the above mixing, R of Chemical Formula 1 111 ~R 117 and R 121 ~R 127At least one of them may be an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group or an alkylsulfonyl group. For example, it may be an alkyloxycarbonyl group, an alkyloxyalkyl group, an alkyloxyalkylcarbonyl group or an alkylsulfonyl group. In a more suitable example, it may be an alkyloxycarbonyl group or an alkyloxyalkylcarbonyl group.

[0089] For example, in Chemical Formula 1, R 111 , R 113 , R 121 and R 123 At least one of them may be the alkyloxy group, the alkyloxyalkyl group, the alkylcarbonyl group, the alkyloxycarbonyl group, the alkyloxyalkylcarbonyl group or the alkylsulfonyl group. For example, it may be an alkyloxycarbonyl group, an alkyloxyalkyl group, an alkyloxyalkylcarbonyl group or an alkylsulfonyl group. In a more suitable example, it may be an alkyloxycarbonyl group or an alkyloxyalkylcarbonyl group.

[0090] For example, in the above mixing, R 211 ~R 213 and R 221 ~R 223 are each independently hydrogen, an alkyl group, an alkyloxy group or an alkyloxyalkyl group, and at least one of them may be an alkyl group, an alkyloxy group or an alkyloxyalkyl group. Also, in a suitable example, R 211 ~R 213 and R 221 ~R 223 in Chemical Formula 2 may each independently be hydrogen, an alkyl group or an alkyloxyalkyl group, and for example, may be an alkyl group or an alkyloxyalkyl group.

[0091] In a suitable example, either or both of A1 and B1 in Chemical Formula 2 may form a benzene structure, and either or both of A2 and B2 may form a benzene structure.

[0092] In a suitable example, either one of A1 and B1 in Chemical Formula 2 may form a benzene structure and the other may not be present, and either one of A2 and B2 may form a benzene structure and the other may not be present.

[0093] For example, in the mixing, Z in Chemical Formula 3 may be oxygen.

[0094] For example, R in Chemical Formula 3 in the mixing 311 , R 312 , R 321 and R 322 are each independently hydrogen, an alkyl group or an aryl group, provided that at least one of R 311 , R 312 , R 321 and R 323 may be an alkyl group, and this alkyl group may be a branched alkyl group.

[0095] For example, in Chemical Formula 3, at least one of R 311 , R 312 , R 321 and R 322 may be a branched alkyl group.

[0096] Also, in Chemical Formula 3, the pair of R 313 and R 314 and / or the pair of R 323 and R 324 may be linked to each other to form a benzene structure. For example, the compound of Chemical Formula 3 may have the structure of Chemical Formula 4.

[0097] By including the three compounds in such a form, an absorbent composition exhibiting desired properties can be provided.

[0098] There is no particular limitation on the ratio among the three compounds in the absorbent composition. That is, the ratio among the compounds may be adjusted in consideration of the desired optical properties.

[0099] For example, the lower limit of the ratio of the compound of Chemical Formula 1 in the absorbent composition may be about 5 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%, 30 wt%, 35 wt% or 40 wt%, and the upper limit thereof may be about 80 wt%, 75 wt%, 70 wt%, 65 wt%, 60 wt%, 55 wt%, 50 wt% or 45 wt%. The ratio may be within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above. Such a ratio may be changed in consideration of the desired effect.

[0100] For example, in the absorbent composition, the lower limit of the ratio of the compound of Chemical Formula 2 with respect to 100 parts by weight of the compound of Chemical Formula 1 may be about 10 parts by weight, 30 parts by weight, 50 parts by weight or 70 parts by weight, and the upper limit thereof may be about 200 parts by weight, 180 parts by weight, 160 parts by weight, 140 parts by weight, 120 parts by weight, 100 parts by weight or 80 parts by weight. The ratio may be within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above. Such a ratio may be changed in consideration of the desired effect.

[0101] For example, in the absorbent composition, the lower limit of the ratio of the compound of Chemical Formula 3 to 100 parts by weight of the compound of Chemical Formula 1 may be about 10 parts by weight, 30 parts by weight, 50 parts by weight, or 70 parts by weight, and the upper limit may be about 200 parts by weight, 180 parts by weight, 160 parts by weight, 140 parts by weight, 120 parts by weight, 100 parts by weight, or 80 parts by weight. The ratio may be within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above. Such a ratio may be changed in consideration of the desired effect.

[0102] To obtain the desired effect, the ratio of the compounds of Chemical Formulas 1 to 3 to the total absorbent contained in the absorbent composition may be adjusted if necessary. For example, the lower limit of the total weight ratio of the compounds of Chemical Formulas 1 to 3 based on the weight of all absorbent components contained in the absorbent composition may be about 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt%, or 95 wt%, and the upper limit may be about 100 wt%, 95 wt%, 90 wt%, or 85 wt%. The ratio may be within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above. Such a ratio may be changed in consideration of the desired effect.

[0103] The absorbent composition may further contain other absorbents necessary in addition to the compounds of Chemical Formulas 1 to 3 described above.

[0104] In addition, the absorbent composition may contain an anion as one component of the absorbent. Such an anion may be, for example, the counter ion of the compound of Chemical Formula 3. Examples of the anion include known anions generated during the synthesis process of the absorbent, such as halogen ions, hexafluoroantimonate ions (SbF6 - ), perchlorate ions, thiocyanate ions (SCN - ), hexafluorophosphate ions (PF6 - ), phosphate ions, bis(trifluoromethanesulfonyl)imide ions (Bis trifluoromethanesulfonyl imide ion), tetrakis(pentafluorophenyl)borate ions (Tetrakispentafluorophenyl borate ion), tetrakis(3,5-bis(trifluoromethyl)phenyl)borate ions (Ttetrakis 3,5-bis trifluoromethyl phenyl borate ion), tetrafluoroborate ions (BF4 - ), trifluoromethylcarboxylic acid ions (Trifluoro methylcarboxylic acid ion), alkylsulfonic acid ions (Alkylsulfonic acid ion), benzenesulfonic acid ions (Benzenesulfonic acid ion), toluenesulfonic acid ions (Toluenesulfonic acid ion), benzenecarboxylic acid ions (Benzenecarboxylic acid ion), alkylcarboxylic acid ions (Alkylcarboxylic acid ion), periodic acid (Periodic acid ion), hydrofluoroborate ions (Hydrofluoroborate ion) and / or tetraphenylborate ions (Tetraphenylboric acid ion), etc., but is not limited thereto.

[0105] This specification further discloses a resin composition. The resin composition may contain components different from the resin component, and at this time, the other component may be the absorbent composition described above.

[0106] For example, the resin component functions as a binder. There is no particular limitation on the type of resin component applied in this case, and known resin components used to form an absorption film, for example, a near-infrared absorption film, may be applied. The absorbent composition can exhibit appropriate compatibility or solubility with the various known resin components.

[0107] Examples of the resin component include at least one of cyclic olefin (COP, Cycloolefin)-based resins, polyester resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyetherimide resins, polyamideimide resins, acrylic resins, polycarbonate resins, polyethylene naphthalate resins, or silicone resins, and other various organic resins or organic-inorganic hybrid resins, but are not limited thereto.

[0108] When the resin component is applied, its ratio is not particularly limited either. For example, the lower limit of the ratio of the resin component in the resin composition may be about 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt%, or 95 wt%, and the upper limit may be about 100 wt%, 95 wt%, 90 wt%, or 85 wt%. The ratio may be within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above. Such a ratio may be changed in consideration of the desired effect.

[0109] In the resin composition, the lower limit of the ratio of the absorbent composition to 100 parts by weight of the resin component may be about 0.5 part by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, 4.5 parts by weight, 5 parts by weight, 5.5 parts by weight, 6 parts by weight, 6.5 parts by weight or 7 parts by weight, and the upper limit thereof may be about 50 parts by weight, 45 parts by weight, 40 parts by weight, 35 parts by weight, 30 parts by weight, 25 parts by weight, 20 parts by weight, 15 parts by weight or 10 parts by weight. The ratio may be within the range of equal to or more than any of the lower limits described above or exceeding the lower limits, or within the range of equal to or less than any of the upper limits described above or less than the upper limits, or within the range of equal to or more than any of the lower limits described above or exceeding the lower limits while being equal to or less than any of the upper limits described above or less than the upper limits. Such a ratio may be changed in consideration of the desired effect.

[0110] For example, the resin composition may further contain a solvent in which the absorbent composition and / or the resin component is dispersed. There is no particular limitation on the type of the solvent applied in this case, and known solvents used for forming an absorption film, for example, a near-infrared absorption film, may be applied. The absorbent component can exhibit appropriate compatibility or solubility with the various known solvents.

[0111] Examples of the solvent include, but are not limited to, cyclohexanone, toluene, methyl ethyl ketone, methyl isobutyl ketone, chlorobenzene or xylene.

[0112] When a solvent is applied, there is no particular limitation on its ratio, and the ratio may be adjusted within a range in which appropriate dispersion of the resin component and / or the absorbent composition is possible.

[0113] The resin composition may further contain other necessary components in addition to the components described above.

[0114] This specification further relates to the use of the absorbent composition and / or the resin composition. For example, this specification discloses a resin film (absorbent film) containing the resin component and the absorbent composition.

[0115] The specific details of the resin component and the absorbent composition forming the resin film are as described above.

[0116] For example, the lower limit of the proportion of the resin component in the resin film may be about 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, 85 wt%, 90 wt% or 95 wt%, and the upper limit may be about 100 wt%, 95 wt%, 90 wt% or 85 wt%. The proportion may be within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above. Such a proportion may be changed in consideration of the desired effect.

[0117] The lower limit of the proportion of the absorbent composition relative to 100 parts by weight of the resin component in the resin film may be about 0.5 part by weight, 1 part by weight, 1.5 parts by weight, 2 parts by weight, 2.5 parts by weight, 3 parts by weight, 3.5 parts by weight, 4 parts by weight, 4.5 parts by weight, 5 parts by weight, 5.5 parts by weight, 6 parts by weight, 6.5 parts by weight or 7 parts by weight, and the upper limit may be about 50 parts by weight, 45 parts by weight, 40 parts by weight, 35 parts by weight, 30 parts by weight, 25 parts by weight, 20 parts by weight, 15 parts by weight or 10 parts by weight. The proportion may be within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above, or within the range above or exceeding any of the lower limits described above while being below or less than any of the upper limits described above. Such a proportion may be changed in consideration of the desired effect.

[0118] The resin film may be an absorption film capable of absorbing light within a predetermined wavelength range. In one example, the resin film may be an infrared absorption film or a near-infrared absorption film.

[0119] Such a resin film can exhibit absorption characteristics, for example, in at least a part of the wavelength range within the range of about 600 nm to 900 nm.

[0120] For example, through the application of the above-described absorbent composition, the resin film may have a relatively wide bandwidth within the wavelength range of 600 nm to 900 nm and may have absorption characteristics for longer wavelengths.

[0121] Due to such characteristics, the absorption film can be applied to various devices such as optical filters and infrared sensors to prevent the shift phenomenon due to the incident angle. Also, when a dielectric film is applied to the optical filter, infrared sensor, etc., the reflection characteristics of the dielectric film can be adjusted to prevent defects such as so-called petal flare, and the number of layers of the dielectric film can be reduced, thereby ensuring positive advantages.

[0122] Therefore, in one example, the absorption film can exhibit an absorption band with a bandwidth of 60 nm or more within the wavelength range of 600 nm to 900 nm. In the above, the absorption band means a region showing a transmittance of about 70% or less in the transmittance curve of the absorption film.

[0123] The bandwidth means the difference between the longest wavelength showing a transmittance of 20% and the shortest wavelength showing a transmittance of 20% in the wavelength range of 600 nm to 900 nm of the transmittance curve of the absorption film. In this case, the lower limit of the bandwidth may be about 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, 150 nm or 155 nm, and the upper limit thereof may be about 1,000 nm, 950 nm, 900 nm, 850 nm, 800 nm, 750 nm, 700 nm, 650 nm, 600 nm, 550 nm, 500 nm, 450 nm, 400 nm, 350 nm, 300 nm, 250 nm, 200 nm, 190 nm, 180 nm, 170 nm, 160 nm, 150 nm, 140 nm, 130 nm, 120 nm, 110 nm or 100 nm. The bandwidth may be within the range equal to or exceeding any of the lower limits described above, or while being equal to or exceeding any of the lower limits described above, it may be within the range less than or below any of the upper limits described above.

[0124] As another bandwidth, the difference between the longest wavelength showing a transmittance of 50% and the shortest wavelength showing a transmittance of 50% within the wavelength range of 600 nm to 900 nm of the transmittance curve of the absorption film may also be adjusted. In this case, the lower limit of the bandwidth may be about 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, 150 nm, 155 nm, 160 nm, 165 nm, 170 nm, 175 nm, 180 nm, 185 nm, 190 nm or 195 nm, and the upper limit thereof may be about 1,000 nm, 950 nm, 900 nm, 850 nm, 800 nm, 750 nm, 700 nm, 650 nm, 600 nm, 550 nm, 500 nm, 450 nm, 400 nm, 350 nm, 300 nm, 250 nm, 200 nm, 190 nm, 180 nm, 170 nm, 160 nm, 150 nm, 140 nm, 130 nm, 120 nm, 110 nm or 100 nm. The bandwidth may be within the range above or exceeding any of the lower limits described above, or within the range below or less than any of the upper limits described above while being above or exceeding any of the lower limits described above.

[0125] Also, the T50% Cut on wavelength of the absorption film may be within a predetermined range. The lower limit of the T50% Cut on wavelength may be about 600 nm, 610 nm, 620 nm, 630 nm, 640 nm or 650 nm, and the upper limit thereof may be about 800 nm, 790 nm, 780 nm, 770 nm, 760 nm or 750 nm. The T50% Cut on wavelength may be within the range above or exceeding any of the lower limits described above and below or less than any of the upper limits described above. The T50% Cut on wavelength means the shortest wavelength showing a transmittance of 50% in the wavelength range of 600 nm to 900 nm of the transmittance curve of the absorption film.

[0126] The T50% cut-off wavelength of the absorption film may be within a predetermined range. The T50% cut-off wavelength may be a longer wavelength than the T50% cut-on wavelength. The lower limit of the T50% cut-off wavelength may be about 700 nm, 720 nm, 740 nm, 760 nm, 780 nm or 800 nm, and the upper limit thereof may be about 900 nm, 880 nm, 860 nm, 840 nm, 820 nm, 810 nm or 800 nm in other examples. The T50% cut-off wavelength may be within a range that is equal to or greater than any one of the lower limits described above and equal to or less than any one of the upper limits described above. The T50% cut-off wavelength means the longest wavelength that exhibits a transmittance of 50% in the wavelength range of 600 nm to 900 nm of the transmittance curve of the absorption film.

[0127] Through the absorption characteristics, the absorption film is applied to devices such as various optical filters and infrared sensors, and desired characteristics are efficiently achieved.

[0128] The absorption film may be formed by a known method as long as the absorbent composition is applied. For example, the absorbent composition or resin composition may be coated in an appropriate manner, and a curing or drying process may be performed as necessary to form the absorption film.

[0129] There is no particular limitation on the thickness of the absorption film, and the thickness may be adjusted in consideration of desired characteristics. In one example, the absorption film may have a thickness of about 0.1 μm to 20 μm.

[0130] This specification further discloses an optical filter. The optical filter may include a substrate layer and the absorption film formed on one or both sides of the substrate layer. FIG. 1 shows a case where the absorption film 200 is formed on one side of the substrate layer 100 as an example of the optical filter.

[0131] Such an optical filter can exhibit excellent performance by including the absorption film described above. For example, the optical filter can embody a visible light transmission band with a high transmittance while efficiently and accurately blocking unnecessary infrared light.

[0132] There is no particular limitation on the type of the transparent substrate applied to the optical filter, and a known transparent substrate for an optical filter may be used.

[0133] In one example, the base material layer may be a so-called infrared absorption substrate. An infrared absorption substrate is a substrate that exhibits absorption characteristics in at least a part of the infrared region. So-called Blue Glass, which exhibits the above characteristics including copper, is a typical example of the infrared absorption substrate. Such an infrared absorption substrate is useful for constructing an optical filter that blocks light in the infrared region, but is disadvantageous in terms of ensuring a high transmittance in the visible light region due to the absorption characteristics and is also disadvantageous in terms of durability. By selecting the infrared absorption substrate and combining it with a specific absorption film, an optical filter can be provided that efficiently blocks desired light while showing high transmittance characteristics in the visible light region and having excellent durability.

[0134] As the infrared absorption substrate, a substrate showing an average transmittance of 75% or more in the range of 425 nm to 560 nm may be used. In other examples, the average transmittance may be in the range of 77% or more, 79% or more, 81% or more, 83% or more, 85% or more, 87% or more, or 89% or more and / or in the range of 98% or less, 96% or less, 94% or less, 92% or less, or 90% or less.

[0135] As the infrared absorption substrate, a substrate showing a maximum transmittance of 80% or more in the range of 425 nm to 560 nm may be used. In other examples, the maximum transmittance may be in the range of 82% or more, 84% or more, 86% or more, 88% or more, or 90% or more and / or in the range of 100% or less, 98% or less, 96% or less, 94% or less, 92% or less, or 90% or less.

[0136] As the infrared absorption substrate, a substrate having an average transmittance of 75% or more in the range of 350 nm to 390 nm may be used. In other examples, the average transmittance may be in the range of 77% or more, 79% or more, 81% or more, or 83% or more and / or in the range of 98% or less, 96% or less, 94% or less, 92% or less, 90% or less, 88% or less, 86% or less, or 84% or less.

[0137] As the infrared absorption substrate, a substrate having a maximum transmittance of 80% or more in the range of 350 nm to 390 nm may be used. In other examples, the maximum transmittance may be in the range of 82% or more, 84% or more, 86% or more, or 87% or more and / or in the range of 100% or less, 98% or less, 96% or less, 94% or less, 92% or less, 90% or less, or 88% or less.

[0138] As the infrared absorption substrate, a substrate having a transmittance at a wavelength of 700 nm in the range of 10% to 45% may be used. In other examples, the transmittance may be about 43% or less, 41% or less, 39% or less, 37% or less, 35% or less, 33% or less, 31% or less, or 29% or less, or may be about 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more, 26% or more, or 28% or more.

[0139] As the infrared absorption substrate, a substrate having an average transmittance in the range of 5% to 30% in the range of 700 nm to 800 nm may be used. In other examples, the average transmittance may be in the range of 7% or more, 9% or more, 11% or more, 13% or more, 15% or more, 15.5% or more, 16% or more, or 16.5% or more and / or in the range of 28% or less, 26% or less, 24% or less, 22% or less, 20% or less, 18% or less, or 17% or less.

[0140] As the infrared absorption substrate, a substrate showing a maximum transmittance in the range of 10% to 45% within the range of 700 nm to 800 nm may be used. In other examples, the maximum transmittance may be in the range of 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more, 26% or more or 28% or more and / or in the range of 43% or less, 41% or less, 39% or less, 37% or less, 35% or less, 33% or less, 31% or less or 29% or less.

[0141] As the infrared absorption substrate, a substrate showing an average transmittance in the range of 3% to 20% within the range of 800 nm to 1000 nm may be used. In other examples, the average transmittance may be further adjusted in the range of 5% or more, 7% or more, 9% or more or 11% or more and / or in the range of 18% or less, 16% or less, 14% or less or 12% or less.

[0142] As the infrared absorption substrate, a substrate showing a maximum transmittance in the range of 5% to 30% within the range of 800 nm to 1000 nm may be used. In other examples, the maximum transmittance may be in the range of 7% or more, 9% or more, 11% or more, 13% or more or 15% or more and / or in the range of 28% or less, 26% or less, 24% or less, 22% or less, 20% or less, 18% or less or 16% or less.

[0143] As the infrared absorption substrate, a substrate showing an average transmittance in the range of 10% to 50% within the range of 1000 nm to 1200 nm may be applied. In other examples, the average transmittance may be further adjusted in the range of 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more or 25% or more and / or in the range of 48% or less, 46% or less, 44% or less, 42% or less, 40% or less, 38% or less, 36% or less, 34% or less, 32% or less, 30% or less, 28% or less or 26% or less.

[0144] As the infrared absorption substrate, it may have a transmission band showing a maximum transmittance in the range of 10% to 70% within the range of 1000 nm to 1200 nm. In other examples, the maximum transmittance may be in the range of 12% or more, 14% or more, 16% or more, 18% or more, 20% or more, 22% or more, 24% or more, 26% or more, 28% or more, 30% or more, 32% or more, 34% or more, or 36% or more and / or in the range of 68% or less, 66% or less, 64% or less, 62% or less, 60% or less, 58% or less, 56% or less, 54% or less, 52% or less, 50% or less, 48% or less, 46% or less, 44% or less, 42% or less, 40% or less, 38% or less, or 37% or less.

[0145] The infrared absorption substrate with the above characteristics may form a desired optical filter in combination with the absorption film.

[0146] As such a substrate, a substrate known as so-called infrared absorption glass may be used. Such glass is an absorption type glass manufactured by adding CuO or the like to phosphate fluoride glass, phosphate glass, or the like. Therefore, in one example, as the infrared absorption substrate, a CuO-containing phosphate fluoride glass substrate or a CuO-containing phosphate glass substrate may be used. The phosphate glass includes K phosphate glass in which a part of the glass skeleton is composed of SiO2. Such absorption type glass is well-known. For example, glass disclosed in Korean Registered Patent No. 10-2056613 or other commercially available absorption type glass (for example, commercially available products of Hoya, Schott, PTOT, etc.) may be used.

[0147] Such an infrared absorption substrate contains copper. A substrate with the copper content in the range of 1 wt% to 7 wt% may be used. In other examples, the copper content may be about 1.5 wt% or more, 2 wt% or more, 2.5 wt% or more, 2.6 wt% or more, 2.7 wt% or more, or 2.8 wt% or more, and may be about 6.5 wt% or less, 6 wt% or less, 5.5 wt% or less, 5 wt% or less, 4.5 wt% or less, 4 wt% or less, 3.5 wt% or less, 3 wt% or less, or 2.9 wt% or less. A substrate having such a copper content is likely to exhibit the above-described optical properties and can form an optical filter with desired properties in combination with the absorption film.

[0148] The copper content can be confirmed using a wavelength dispersive X-ray fluorescence spectrometry (WD XRF) apparatus. When the specimen (substrate layer) is irradiated with X-rays using the apparatus, characteristic secondary X-rays are generated from the individual elements of the specimen, and the apparatus detects the secondary X-rays according to the wavelength of each element. The intensity of the secondary X-rays is proportional to the content of the element. Therefore, quantitative analysis may be performed through the intensity of the secondary X-rays measured according to the wavelength of each element.

[0149] The thickness of the infrared absorption substrate may be adjusted, for example, within the range of about 0.03 mm to 5 mm, but is not limited thereto.

[0150] The optical filter may further include other known components necessary for the substrate layer and the absorption film.

[0151] For example, the optical filter may further include a dielectric film. The dielectric film may further include, for example, a so-called dielectric film on one or both sides of the substrate layer.

[0152] Figures 2 and 3 are illustrations of an optical filter with a dielectric film 300 added, showing the case where the dielectric film 300 is formed on one or both sides of a laminated structure including a substrate layer 100 and an absorption film 200.

[0153] Such a dielectric film is a film formed by repeatedly laminating a low refractive index dielectric material and a high refractive index dielectric material, and is used to form a so-called IR reflection layer and an AR (Anti-reflection) layer. A dielectric film for forming such a known IR reflection layer or AR layer may be applied.

[0154] Therefore, the dielectric film may have a multilayer structure including at least two sub-layers having different refractive indices from each other, or may include a multilayer structure in which the two sub-layers are repeatedly laminated.

[0155] The materials for forming the dielectric film, that is, the types of materials for forming each sub-layer are not particularly limited, and known materials may be applied. Usually, for the production of the low refractive index sub-layer, fluorides such as SiO2 or Na5Al3Fl4, Na3AlF6 or MgF2 are applied, and for the production of the high refractive index sub-layer, amorphous silicon, TiO2, Ta2O5, Nb2O5, ZnS or ZnSe etc. may be applied, but the applicable materials are not limited to the above.

[0156] The method for forming the dielectric film as described above is not particularly limited. For example, a known vapor deposition method may be applied for formation. In the art, a method of controlling the reflection or transmission characteristics of the dielectric film by considering the vapor deposition thickness and the number of layers of the sub-layer is known, and the dielectric film may be formed by such a known method.

[0157] In one example, the dielectric film included in the optical filter has a shortest wavelength showing a reflectance of 50% within a wavelength range of 600 nm to 900 nm that is 710 nm or more, or the wavelength may not exist. Also, when the wavelength does not exist, the maximum reflectance of the dielectric film within the wavelength range of 600 nm to 900 nm is less than 50%. When it exists, the shortest wavelength showing the 50% reflectance is, in other examples, 715 nm or more, 720 nm or more, 725 nm or more, 730 nm or more, 735 nm or more, 740 nm or more, 745 nm or more, 750 nm or more, or about 900 nm or less, 850 nm or less, 800 nm or less, 790 nm or less, 780 nm or less, 770 nm or less, or 760 nm or less. The shortest wavelength showing the 50% reflectance may be within the range of any of the lower limits and upper limits described above, and at this time, the upper limit may be 900 nm.

[0158] By controlling the reflection characteristics of the dielectric film as described above, a so-called petal flare phenomenon can be prevented. The petal flare phenomenon means a phenomenon in which a red line or the like that is not observed with the naked eye when photographing a light emitter or the like appears in the photograph, and the red line often has a shape like a petal with respect to the light emitter and is called petal flare. As the sensitivity of the sensor included in the imaging device increases and the transmittance of an optical filter or the like is increased to obtain a clearer photograph, the occurrence frequency of the petal flare has increased.

[0159] One of the causes of the petal flare phenomenon is considered to be the repeated reflection of near-infrared light within the imaging device equipped with the optical filter. Usually, among the dielectric films formed on the optical filter, especially the so-called IR film is formed to block the light in the near-infrared region by reflection. Therefore, the shortest wavelength at which the dielectric film exhibits a reflectance of 50% is formed near the visible light, which is usually less than 710 nm. However, the reflection of near-infrared light within the imaging device is accelerated by such a dielectric film, thereby causing the petal flare phenomenon. However, when the shortest wavelength at which the dielectric film exhibits a reflectance of 50% is adjusted to 710 nm or more, the infrared light blocking efficiency of the optical filter decreases.

[0160] However, even when the shortest wavelength at which the dielectric film exhibits a reflectance of 50% is adjusted to 710 nm or more through the application of the absorption film, infrared light can be effectively blocked, and furthermore, the petal flare phenomenon can also be prevented. On the other hand, the design method itself for adjusting the reflection characteristics of the dielectric film is known.

[0161] The optical filter may further include an absorption film (hereinafter, ultraviolet absorption film) that exhibits absorption characteristics with respect to ultraviolet rays as an absorption film distinguishable from the absorption film. However, such an absorption film is not an essential component. For example, an ultraviolet absorber described later may be introduced into one absorption film together with the compounds of Chemical Formulas 1 and 2.

[0162] In one example, the ultraviolet absorption film may be designed to exhibit an absorption maximum in the wavelength range of about 300 nm to 390 nm.

[0163] The ultraviolet absorption film may contain only an ultraviolet absorber, or may contain two or more ultraviolet absorbers as necessary.

[0164] For example, as the ultraviolet absorber, a known absorber showing an absorption maximum in the wavelength range of about 300 nm to 390 nm may be applied. Examples thereof include ABS 407 of Exiton; UV381A, UV381B, UV382A, UV386A, VIS404A of QCR Solutions Corp; ADA1225, ADA3209, ADA3216, ADA3217, ADA3218, ADA3230, ADA5205, ADA3217, ADA2055, ADA6798, ADA3102, ADA3204, ADA3210, ADA2041, ADA3201, ADA3202, ADA3215, ADA3219, ADA3225, ADA3232, ADA4160, ADA5278, ADA5762, ADA6826, ADA7226, ADA4634, ADA3213, ADA3227, ADA5922, ADA5950, ADA6752, ADA7130, ADA8212, ADA2984, ADA2999, ADA3220, ADA3228, ADA3235, ADA3240, ADA3211, ADA3221, ADA5220, ADA7158 of H.W.Sands; DLS 381B, DLS 381C, DLS 382A, DLS 386A, DLS 404A, DLS 405A, DLS 405C, DLS 403A of CRYSTALYN, etc., but it is not limited thereto.

[0165] The materials and configuration methods for forming such an ultraviolet absorption film are not particularly limited, and known materials and configuration methods may be applied.

[0166] Usually, the ultraviolet absorption film is formed using a material in which an ultraviolet absorber capable of showing a desired absorption maximum is blended with a transparent resin. At this time, as the transparent resin, the resin component applied to the absorber composition may be applied.

[0167] In addition to the above-described layers, various other necessary layers may be added to the optical filter as long as the desired effects are not impaired.

[0168] This specification further discloses an imaging device including the optical filter. At this time, the configuration method of the imaging device and the application method of the optical filter are not particularly limited, and known configurations and application methods may be applied.

[0169] In addition, the use of the optical filter is not limited to the imaging device, and it may be applied to various other applications that require near-infrared cut (for example, display devices such as PDP (Plasma Display Panel)).

[0170] This specification further discloses an infrared sensor including the absorption film. The configuration of the infrared sensor is not particularly limited as long as the absorption film is included. For example, the absorption film may be introduced into a known motion sensor, proximity sensor, or gesture sensor for configuration.

[0171] In addition, the uses of the absorbent composition, resin composition, or resin film (absorption film) are not limited to the optical filter, infrared sensor, and / or imaging device, and may be applied to various other applications that require infrared cut (for example, display devices such as PDP).

Advantages of the Invention

[0172] This specification discloses a composition and its uses. The composition may contain three or more absorbents and can exhibit excellent compatibility and solubility with various solvents and resin components. The composition may be used to form a resin film that exhibits a broad absorption band in the infrared region, and such a resin film can function as an absorption film used in various applications including optical filters, solid-state imaging devices, and / or infrared sensors.

Brief Description of the Drawings

[0173]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Mode for Carrying Out the Invention

[0174] Hereinafter, the composition and the like will be specifically described through examples, but the scope of the composition and the like is not limited by the following examples.

[0175] 1. Evaluation of Transmittance Spectrum The transmittance spectrum was measured using a spectrophotometer (PerkinElmer, Lambda 750 spectrophotometer) for a specimen obtained by cutting the measurement target (for example, an absorption film) so that the horizontal and vertical dimensions were 10 mm and 10 mm, respectively. The transmittance spectrum was measured by wavelength and incident angle according to the manual of the device. The specimen was placed on a straight line between the measurement beam of the spectrophotometer and the detector, and the transmittance spectrum was confirmed with the incident angle of the measurement beam set to 0 degrees. An incident angle of 0 degrees is a direction substantially parallel to the normal direction of the surface of the specimen. The average transmittance within a predetermined wavelength range in the transmittance spectrum is the result of obtaining the arithmetic mean of the transmittances measured at each wavelength while increasing the wavelength by 1 nm from the shortest wavelength in the wavelength range. The minimum transmittance is the minimum transmittance among the transmittances measured while increasing the wavelength by 1 nm, and the maximum transmittance is the maximum transmittance among the transmittances measured while increasing the wavelength by 1 nm. For example, the average transmittance within the wavelength range of 350 nm to 360 nm is the arithmetic mean of the transmittances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm. The maximum transmittance within the wavelength range of 350 nm to 360 nm is the highest transmittance among the transmittances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm, and the minimum transmittance within the wavelength range of 350 nm to 360 nm is the lowest transmittance among the transmittances measured at the wavelengths of 350 nm, 351 nm, 352 nm, 353 nm, 354 nm, 355 nm, 356 nm, 357 nm, 358 nm, 359 nm, and 360 nm.

[0176] 2. Mass spectrometry Mass spectrometry for the synthesized compound was performed using a liquid chromatograph / mass spectrometer (manufactured by Thermo Finnigan).

[0177] Synthesis Example 1. Production of Compound 1A In the following Reaction Formula 1, the compound of Chemical Formula 1A (Compound 1A) was synthesized by the following method.

[0178]

Chem.

[0179] In Reaction formula 1, 14.1 g of Compound 1A’, 2.62 g of Squaric acid, and 8.7 g of TEOF (tetraethyl orthoformate) were dissolved in 100 mL of a solvent (n-Butanol) and reacted at 95 °C for about 4 hours. After the reaction, it was cooled to room temperature (about 25 °C), then 300 mL of ethanol was added, and after stirring for 6 hours or more, the precipitated solid was passed through ethanol and filtered under reduced pressure to obtain the target product (Compound 1A of Chemical formula 1A) (7.4 g, 46%). The Mass spectrometry results for the synthesized target compound (Compound 1A of Chemical formula 1A) are as follows.

[0180] <Mass spectrometry results> LC-MS m / z 690.5

[0181] Synthesis example 2. Production of Compound 1B In the following Reaction formula 2, Compound 1B (Compound 1B of Chemical formula 1B) was synthesized through the same process except that 10.2 g of Compound 1B’ was used instead of Compound 1A’ in Reaction formula 1.

[0182]

Chem.

[0183] The Mass spectrometry results for the synthesized target compound (Compound 1B of Chemical formula 1B) are as follows.

[0184] <Mass spectrometry results> LC-MS m / z 859.1

[0185] Synthesis example 3. Production of Compound 1C In the following Reaction Scheme 3, the compound of Chemical Formula 1C (Compound 1C) was synthesized through a similar process except that Compound 1C' was used in an amount of 5.3 g instead of Compound 1A' in Reaction Scheme 1.

[0186]

Chemical Formula

[0187] The Mass spectrometry results for the synthesized target compound (Compound 1C of Chemical Formula 1C) are as follows.

[0188] <Mass spectrometry results> LC-MS m / z 771.0

[0189] Synthesis Example 4. Production of Compound 1D In the following Reaction Scheme 4, the compound of Chemical Formula 1D (Compound 1D) was synthesized through a similar process except that Compound 1D' was used in an amount of 10.8 g instead of Compound 1A' in Reaction Scheme 1.

[0190]

Chemical Formula

[0191] The Mass spectrometry results for the synthesized target compound (Compound 1D of Chemical Formula 1D) are as follows.

[0192] <Mass spectrometry results> LC-MS m / z 682.9

[0193] Synthesis Example 5. Production of Compound 1E In the following Reaction Scheme 5, the compound of Chemical Formula 1E (Compound 1E) was synthesized through a similar process except that Compound 1E' was used in an amount of 8.5 g instead of Compound 1A' in Reaction Scheme 1.

[0194]

Chemical Formula

[0195] The Mass spectrometry results for the synthesized target compound (Compound 1E in Chemical formula 1E) are as follows.

[0196] <Mass spectrometry results> LC-MS m / z 851.3

[0197] Synthesis Example 6. Production of Compound 1F In the following Reaction formula 6, the compound of Chemical formula 1F (Compound 1F) was synthesized through a similar process except that 6.4 g of Compound 1F' was used instead of Compound 1A' in Reaction formula 1.

[0198]

Chemical formula

[0199] The Mass spectrometry results for the synthesized target compound (Compound 1F in Chemical formula 1F) are as follows.

[0200] <Mass spectrometry results> LC-MS m / z 951.4

[0201] Synthesis Example 7. Production of Compound 1AA In the following Reaction formula 7, the compound of Chemical formula 1AA (Compound 1AA) was synthesized through a similar process except that 9.7 g of Compound 1AA' was used instead of Compound 1A' in Reaction formula 1.

[0202]

Chemical formula

[0203] The Mass spectrometry results for the synthesized target compound (Compound 1AA in Chemical formula 1AA) are as follows.

[0204] <Mass spectrometry result> LC-MS m / z 542.3

[0205] Synthesis Example 8. Preparation of Compound 2A In the following Reaction Scheme 8, the compound of Chemical Formula 2A (Compound 2A) was synthesized in the following manner.

[0206]

Chemical Formula

[0207] In Reaction Scheme 2, 10.1 g of Compound 2A', 2.2 g of squaric acid, and 7.8 g of TEOF (tetraethyl orthoformate) were dissolved in 100 mL of a solvent (n-butanol) and reacted at 95 °C for about 4 hours. After the reaction, the mixture was cooled to room temperature (about 25 °C), 300 mL of ethanol was added, and the mixture was stirred for 6 hours or more. The precipitated solid was passed through ethanol and filtered under reduced pressure to obtain the target product (Compound 2A of Chemical Formula 2A) (6.8 g, 58%). The mass spectrometry result for the synthesized target compound (Compound 2A of Chemical Formula 2A) is as follows.

[0208] <Mass spectrometry result> LC-MS m / z 612.2

[0209] Synthesis Example 9. Preparation of Compound 2B In the following Reaction Scheme 9, the compound of Chemical Formula 2B (Compound 2B) was synthesized through a similar process, except that 6.4 g of Compound 2B' was used instead of Compound 2A' in Reaction Scheme 8.

[0210]

Chemical Formula

[0211] The mass spectrometry result for the synthesized target compound (Compound 2B of Chemical Formula 2B) is as follows.

[0212] <Mass spectrometry result> LC-MS m / z 608.7

[0213] Synthesis Example 10. Preparation of Compound 2C In the following Reaction Scheme 10, Compound 2C of Chemical Formula 2C was synthesized through the same process, except that Compound 2C' was used in an amount of 7.8 g instead of Compound 2A' in Reaction Scheme 8.

[0214]

Chemical Formula

[0215] The Mass spectrometry result for the synthesized target compound (Compound 2C of Chemical Formula 2C) is as follows.

[0216] <Mass spectrometry result> LC-MS m / z 664.9

[0217] Synthesis Example 11. Preparation of Compound 2D In the following Reaction Scheme 11, Compound 2D of Chemical Formula 2D was synthesized through the same process, except that Compound 2D' was used in an amount of 9.2 g instead of Compound 2A' in Reaction Scheme 8.

[0218]

Chemical Formula

[0219] The Mass spectrometry result for the synthesized target compound (Compound 2D of Chemical Formula 2D) is as follows.

[0220] <Mass spectrometry result> LC-MS m / z 721.1

[0221] Synthesis Example 12. Preparation of Compound 2AA In the following Reaction Scheme 12, the compound of Chemical Formula 2AA (Compound 2AA) was synthesized through a similar process, except that 8.3 g of Compound 2AA’ was used instead of Compound 2A’ in Reaction Scheme 8.

[0222]

Chemical Formula

[0223] The Mass spectrometry results for the synthesized target compound (Compound 2AA of Chemical Formula 2AA) are as follows.

[0224] <Mass spectrometry results> LC-MS m / z 524.3

[0225] Synthesis Example 13. Production of Compound 3A In the following Reaction Scheme 13, the compound of Chemical Formula 3A (Compound 3A) was synthesized in the following manner.

[0226]

Chemical Formula

[0227] 1.0 g (1.86 mmol) of Compound 3A’ in Reaction Scheme 13 and 0.64 g (4.16 mmol) of LiTFSI (Lithium bis(trifluoromethane sulfonyl)imide) were dissolved in 20 mL of a solvent (dichloromethane), 20 mL of water was added, and the mixture was reacted at room temperature (25 °C) for about 2 hours. After the reaction, the dichloromethane layer and the aqueous layer were separated with an extractor, concentrated, 100 mL of ethanol was added, and then the mixture was filtered under reduced pressure to obtain the target compound (Compound 3A of Chemical Formula 3A) (1.0 g, 74.8%). The Mass spectrometry results for the synthesized target compound (Compound 3A of Chemical Formula 3A) are as follows.

[0228] <Mass spectrometry results> LC-MS(+) m / z 437.8, LC-MS(-) m / z 287.9

[0229] Synthesis Example 14. Production of Compound 3B In the following Reaction Scheme 14, Compound 3B (Compound 3B) was synthesized through the same process except that 1.4 g of Compound 3B' was used instead of Compound 3A' in Reaction Scheme 13.

[0230]

Chemical formula

[0231] The Mass spectrometry results for the synthesized target compound (Compound 3B of Chemical formula 3B) are as follows.

[0232] <Mass spectrometry results> LC-MS(+) m / z 465.7, LC-MS(-) m / z 287.9

[0233] Synthesis Example 15. Production of Compound 3C In the following Reaction Scheme 15, Compound 3C (Compound 3C) was synthesized through the same process except that 1.3 g of Compound 3C' was used instead of Compound 3A' in Reaction Scheme 13.

[0234]

Chemical formula

[0235] The Mass spectrometry results for the synthesized target compound (Compound 3C of Chemical formula 3C) are as follows.

[0236] <Mass spectrometry results> LC-MS(+) m / z 472.1, LC-MS(-) m / z 287.9

[0237] Synthesis Example 16. Production of Compound 3D In the following Reaction Scheme 16, the compound of Chemical Formula 3D (Compound 3D) was synthesized through a similar process except that 1.0 g of Compound 3D' was used instead of Compound 3A' in Reaction Scheme 13.

[0238]

Chemical Formula

[0239] The Mass spectrometry results for the synthesized target compound (Compound 3D of Chemical Formula 3D) are as follows.

[0240] <Mass spectrometry results> LC-MS(+) m / z 532.1, LC-MS(-) m / z 287.9

[0241] Synthesis Example 17. Production of Compound 4A In the following Reaction Scheme 17, the compound of Chemical Formula 4A (Compound 4A) was synthesized through a similar process except that 1.1 g of Compound 4A' was used instead of Compound 3A' in Reaction Scheme 13.

[0242]

Chemical Formula

[0243] The Mass spectrometry results for the synthesized target compound (Compound 4A of Chemical Formula 4A) are as follows.

[0244] <Mass spectrometry results> LC-MS(+) m / z 489.7, LC-MS(-) m / z 287.9

[0245] Synthesis Example 18. Production of Compound 4B In the following Reaction Scheme 18, the compound of Chemical Formula 4B (Compound 4B) was synthesized through a similar process except that 1.2 g of Compound 4B' was used instead of Compound 3A' in Reaction Scheme 13.

[0246]

Chem.

[0247] The Mass spectrometry results for the synthesized target compound (Compound 4B of Chemical formula 4B) are as follows.

[0248] <Mass spectrometry results> LC-MS(+) m / z 636.4, LC-MS(-) m / z 287.9

[0249] The solubility of each of the synthesized compounds was evaluated. The solubility was evaluated based on the solubility of each compound in a plurality of solvents (cyclohexanone, toluene, methyl isobutyl ketone (MIBK) or methyl ethyl ketone (MEK)) at room temperature (about 25°C), and judged according to the following criteria.

[0250] <Solubility judgment criteria> A: When the solubility is 1 mass% or more B: When the solubility is 0.5 mass% or more and less than 1 mass% C: When the solubility is 0.2 mass% or more and less than 0.5 mass% D: When the solubility is less than 0.2 mass%

[0251] The solubility evaluation results are summarized in Table 1 below.

[0252]

Table 1

[0253] Example 1. Compound 1A of Synthesis Example 1, Compound 2B of Synthesis Example 9, and Compound 4A of Synthesis Example 17 were mixed at a weight ratio of about 55:40:40 (1A:2B:4A) to produce an absorbent composition.

[0254] Example 2. The absorbent composition was produced by mixing Compound 1B of Synthesis Example 2, Compound 2A of Synthesis Example 8, and Compound 4B of Synthesis Example 18 at a weight ratio of about 55:40:40 (1B:2A:4B).

[0255] Example 3. The absorbent composition was produced by mixing Compound 1C of Synthesis Example 3, Compound 2C of Synthesis Example 10, and Compound 3D of Synthesis Example 16 at a weight ratio of about 55:40:40 (1C:2C:3D).

[0256] Example 4. The absorbent composition was produced by mixing Compound 1D of Synthesis Example 4, Compound 2B of Synthesis Example 9, and Compound 3C of Synthesis Example 15 at a weight ratio of about 55:40:40 (1D:2B:3C).

[0257] Example 5. The absorbent composition was produced by mixing Compound 1E of Synthesis Example 5, Compound 2D of Synthesis Example 11, and Compound 3B of Synthesis Example 14 at a weight ratio of about 55:40:40 (1E:2D:3B).

[0258] Example 6. The absorbent composition was produced by mixing Compound 1F of Synthesis Example 6, Compound 2A of Synthesis Example 8, and Compound 3A of Synthesis Example 13 at a weight ratio of about 55:40:40 (1F:2A:3A) in the mixture.

[0259] Comparative Example 1. The absorbent composition was produced by mixing Compound 1AA of Synthesis Example 7, Compound 2AA of Synthesis Example 12, and Compound 4A of Synthesis Example 17 at a weight ratio of about 55:40:40 (1AA:2AA:4A).

[0260] The solubility of each absorbent composition of the examples and comparative examples was evaluated. The solubility was evaluated according to the following criteria while injecting the resin composition produced by dispersing the absorbent composition in a mixture containing a resin component and a solvent through a syringe filter with a filter size of about 1 μm at room temperature (about 25°C).

[0261] <Solubility Judgment Criteria> A: When the absorbent composition passes well through the syringe filter without clogging during injection B: When the absorbent composition passes through the syringe filter during injection, but the passing rate is significantly slowed down due to clogging C: When the absorbent composition cannot pass through the syringe filter during injection

[0262] The above evaluation results were summarized and described in Table 2 below.

[0263] In Table 2 below, Condition 1 is the case where a mixture (resin component + solvent) for the production of the resin composition, an acrylic resin (PMMA (polymethylmethacry1ate)) of LG Chem, is dispersed in methyl isobutyl ketone (MIBK) at a concentration of about 15% by weight. Condition 2 is the case where a mixture (resin component + solvent), a silicone resin (Dow), is dispersed in cyclohexanone at a concentration of about 15% by weight. Condition 3 is the case where a mixture (resin component + solvent), a cyclic olefin resin (TOPAS), is dispersed in cyclohexanone at a concentration of about 15% by weight. During the production of each resin composition, the concentration of the absorbent composition in the resin composition was made to be about 1.2% by weight.

[0264]

Table 2

[0265] Example 7. An acrylic resin (PMMA (polymethylmethacry1ate)), the absorbent composition of Example 3, and a solvent (MIBK) were mixed at a weight ratio of 1.5:0.135:10 (resin: absorbent composition: solvent) and stirred for 12 hours or more to produce a resin composition. As a result of evaluating the solubility of this composition by the above method, the evaluation result was A (when injecting with a syringe filter, the absorbent composition passes well through the filter without clogging).

[0266] The absorbent composition was spin-coated on a transparent substrate (SCHOTT) with substantially no light absorption and reflection, and heat-treated at a temperature of about 130 °C for about 2 hours to form an absorption film with a thickness of about 3 μm.

[0267] Figure 4 is a diagram showing the results of evaluating the transmittance of the absorption film as described above. In the figure, the x-axis is the wavelength (nm), and the y-axis is the transmittance.

[0268] Example 8. A cyclic olefin resin (COP, Cycloolefin polymer), the absorbent composition of Example 5, and a solvent (Cyclohexanone) were mixed at a weight ratio of 1.5:0.135:10 (resin: absorbent composition: solvent), and stirred for 12 hours or more to produce a resin composition. As a result of evaluating the solubility of this composition by the above method, the evaluation result was A (the absorbent composition passed well through the syringe filter without clogging the filter during injection).

[0269] The absorbent composition was spin-coated on a transparent substrate (SCHOTT) with substantially no light absorption and reflection, and heat-treated at a temperature of about 130 °C for about 2 hours to form an absorption film with a thickness of about 3 μm.

[0270] Figure 5 is a diagram showing the results of evaluating the transmittance of the absorption film as described above. In the figure, the x-axis is the wavelength (nm), and the y-axis is the transmittance.

[0271] Example 9. A silicone resin, the absorbent composition of Example 6, and a solvent (Cyclohexanone) were mixed at a weight ratio of 1.5:0.135:10 (resin: absorbent composition: solvent), and stirred for 12 hours or more to produce a resin composition. As a result of evaluating the solubility of this composition by the above method, the evaluation result was A (the absorbent composition passed well through the syringe filter without clogging the filter during injection).

[0272] The absorbent composition was spin-coated on a transparent substrate (SCHOTT) with substantially no light absorption and reflection, and heat-treated at a temperature of about 130 °C for about 2 hours to form an absorption film with a thickness of about 3 μm.

[0273] Figure 6 is a diagram showing the results of evaluating the transmittance of the absorption film as described above. In the figure, the x-axis is the wavelength (nm), and the y-axis is the transmittance.

[0274] Comparative Example 2. A cyclic olefin resin (COP, Cycloolefin polymer) resin, the absorbent composition of Comparative Example 1, and a solvent (Cyclohexanone) were mixed at a weight ratio of 1.5:0.135:10 (resin: absorbent composition: solvent) and stirred for 12 hours or more to produce a resin composition. The solubility of this composition was evaluated by the above method, and the evaluation result was A (when injecting through a syringe filter, the absorbent composition passed well without clogging the filter).

[0275] The absorbent composition was spin-coated on a transparent substrate (SCHOTT) with substantially no light absorption and reflection, and heat-treated at a temperature of about 130 °C for about 2 hours to form an absorption film with a thickness of about 3 μm.

[0276] Figure 7 is a diagram showing the results of evaluating the transmittance of the absorption film as described above. In the figure, the x-axis is the wavelength (nm), and the y-axis is the transmittance.

[0277] For the absorption films of Examples 7 to 9 and Comparative Example 2, the absorption characteristics in the wavelength range of 600 nm to 900 nm were evaluated, and the results are summarized in Table 3 below.

[0278] In Table 3 below, T50% cut on is the shortest wavelength showing a transmittance of 50% in the wavelength range of 600 nm to 900 nm in the transmittance spectrum, and T50% cut off is the longest wavelength showing a transmittance of 50% in the wavelength range of 600 nm to 900 nm in the transmittance spectrum.

[0279] In Table 3 below, T20% cut on is the shortest wavelength showing a transmittance of 20% within the wavelength range of 600 nm to 900 nm in the transmittance spectrum, and T20% cut off is the longest wavelength showing a transmittance of 20% within the wavelength range of 600 nm to 900 nm in the transmittance spectrum.

[0280] In Table 3 below, T(MIN) is the minimum transmittance confirmed within the wavelength range of 600 nm to 900 nm, and T(AVG) is the average transmittance within the wavelength range of 600 nm to 900 nm.

[0281]

Table 3

Explanation of Symbols

[0282] 100 Substrate layer 200 Absorbing film 300 Dielectric film

Claims

1. The compound includes a compound represented by the following formula 1, a compound represented by the following formula 2, and a compound represented by the following formula 3. The sum of A, B, and C below is 30 or more, A composition, wherein the standard deviation of A, B, and C below is 15 or less. 【Chemistry 1】 Chemical 1 In Chemical Formula 1, R １１１ ~R １１７ and R １２１ ~R １２７ are each independently a hydrogen atom, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, or an alkylsulfonyl group, provided that at least one of them is an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, or an alkylsulfonyl group. 【Chemistry 2】 2 In Chemical Formula 2, R ２１１ ~R ２１３ and R ２２１ ~R ２２３ are each independently a hydrogen atom, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, or an alkylsulfonyl group, at least one of which is an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, or an alkylsulfonyl group; A １ , B １ , A ２ and B ２ are each independently a benzene structure or absent. 【Chemistry 3】 3 In Chemical Formula 3, R ３ is hydrogen or a halogen, R ３１１ , R ３１２ , R ３２１ and R ３２２ each independently represents a hydrogen atom, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, an alkylsulfonyl group, or an aryl group; R ３１３ and R ３１４ are each independently a hydrogen atom, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, an alkylsulfonyl group or an aryl group, or are linked together to form a benzene structure, R ３２３ and R ３２４ are each independently a hydrogen atom, an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, an alkylsulfonyl group or an aryl group, or are linked together to form a benzene structure, R ３１１ ~R ３１４ and R ３２１ ~R ３２４ at least one of which is or contains an alkyl group, an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, or an alkylsulfonyl group; Z is a heteroatom; A is the total number of carbon atoms of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group present in Chemical Formula 1; B is the total number of carbon atoms of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group present in the above formula 2. C is the total number of carbon atoms of the alkyl group, the alkyl group of the alkyloxy group, the alkyl group of the alkyloxyalkyl group, the alkyl group of the alkylcarbonyl group, the alkyl group of the alkyloxycarbonyl group, the alkyl group of the alkyloxyalkylcarbonyl group, and the alkyl group of the alkylsulfonyl group present in the above formula 3.

2. The composition of claim 1, wherein the average of A, B and C is in the range of 8 to 35.

3. 2. The composition according to claim 1, wherein a ratio of A to B, A / B, is within the range of 0.1 to 10, a ratio of B to C, B / C, is within the range of 0.1 to 10, and a ratio of A to C, A / C, is within the range of 0.5 to 15.

4. In Chemical Formula 1, R １１１ ~R １１７ and R １２１ ~R １２７ at least one of the groups is an alkyloxy group, an alkyloxyalkyl group, an alkylcarbonyl group, an alkyloxycarbonyl group, an alkyloxyalkylcarbonyl group, or an alkylsulfonyl group; In Chemical Formula 2, R ２１１ ~R ２１３ and R ２２１ ~R ２２３ are each independently a hydrogen atom, an alkyl group, an alkyloxy group, or an alkyloxyalkyl group, provided that at least one of them is an alkyl group, an alkyloxy group, or an alkyloxyalkyl group; In formula 3, Z is oxygen and R ３１１ , R ３１２ , R ３２１ and R ３２２ are each independently a hydrogen atom, an alkyl group, or an aryl group, and R ３１１ , R ３１２ , R ３２１ and R ３２３ The composition of claim 1 , wherein at least one of is an alkyl group.

5. A １ and B １ Either one of the above forms a benzene structure, and A ２ and B ２ The composition according to claim 4 , wherein either one of the following forms a benzene structure:

6. A １ and B １ The other of does not exist, and A ２ and B ２ The composition of claim 5 , wherein the other of

7. In Chemical Formula 3, R ３１３ and R ３１４ are linked together to form a benzene structure, and R ３２３ and R ３２４ The composition of claim 4 , wherein:

8. R ３１１ , R ３１２ , R ３２１ and R ３２３ The composition of claim 4 , wherein at least one of is a branched alkyl group.

9. A resin component, A composition comprising the composition according to any one of claims 1 to 8.

10. The composition of claim 9 further comprising a solvent.

11. A resin component, A resin film comprising the composition according to any one of claims 1 to 8.

12. The resin film according to claim 11, which exhibits an absorption band having a bandwidth of 60 nm or more within a wavelength range of 600 nm to 900 nm.

13. The resin film according to claim 12, wherein the T50% Cut on wavelength is in the range of 600 nm to 800 nm.

14. The resin film according to claim 12, wherein a T50% cut-off wavelength is within a range of 700 nm to 900 nm.

15. The resin film according to claim 11, wherein the resin component comprises at least one selected from the group consisting of cyclic olefin (COP)-based resins, polyester resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyparaphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyetherimide resins, polyamideimide resins, acrylic resins, polycarbonate resins, polyethylene naphthalate resins and silicone resins.

16. A base layer; An optical filter comprising the resin film according to claim 11 formed on one or both sides of the substrate layer.

17. 17. The optical filter according to claim 16, further comprising a dielectric film, the dielectric film having a shortest wavelength at which it exhibits 50% reflectance within a wavelength range of 600 nm to 900 nm that is 710 nm or longer or does not exist.

18. A solid-state imaging device comprising the optical filter according to claim 16.

19. An infrared sensor comprising the resin film according to claim 11.

Images