Production system

Abstract

To provide a production system capable of flexibly building a production line that selectively collects defective circuit boards.SOLUTION: A production system 1 includes: working units Mw (solder printing unit M2, component mounting units M5, M6) that perform works on a circuit board; and inspection units Mi (first inspection unit M3, second inspection unit M7) that perform inspection of the objects including the circuit board. The production system also includes circuit board supply and storage devices Ms (first circuit board supply and storage device M4, second circuit board supply and storage device M8), which are located downstream of the inspection units Mi and capable of storing and lifting and lowering multiple circuit boards.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a production system including a working device and an inspection device that perform operations on a substrate.

Background Art

[0002] As a production system that includes a production line having a working device such as a component mounting device and an inspection device and manufactures a mounted substrate in which components are mounted on a substrate, there is known one including a housing device that extracts and houses defective substrates from the middle of the production line based on the inspection results of the inspection device (for example, Patent Document 1).

[0003] The production line described in Patent Document 1 extracts defective substrates from the downstream side of the inspection device by a gate conveyor and houses them in a housing device arranged beside the production line. The housing device of Patent Document 1 raises and lowers the defective substrates received from the gate conveyor by a distribution device and houses them in any one of a plurality of housing parts arranged in the vertical direction.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the prior art including Patent Document 1, although defective substrates can be selectively housed, the installation area becomes large because the housing device is arranged beside the production line, and there is also a problem that in order to repair the housed defective substrates outside the production line, it is necessary to take out and convey the housed substrates one by one. There was room for further improvement in order to flexibly configure a production line that can house and repair defective substrates.

[0006] Therefore, an object of the present invention is to provide a production system capable of flexibly constructing a production line that can selectively accommodate defective substrates.

Means for Solving the Problems

[0007] The present invention includes a solder printing device that performs a solder printing operation of printing solder on a substrate or a component mounting device that performs a component mounting operation of mounting components on a substrate on which solder is printed, and an inspection device that inspects an inspection object including the substrate, and a storage device provided downstream of the inspection device, capable of accommodating a plurality of the substrates and capable of moving up and down, and a management device that manages at least the storage device. The production system is characterized in that the management device includes an acquisition unit that acquires an inspection result by the inspection device, and a transmission unit that creates a work command that defines an operation in the storage device based on the acquired inspection result and transmits the work command to the storage device. The storage device includes a reception unit that receives the work command, an elevating mechanism, and a control unit that controls the elevating mechanism. The control unit controls the elevating mechanism based on the received work command. The storage device includes a plurality of slots for accommodating the plurality of substrates. The inspection device determines whether the inspection object is good or bad, and the inspection result is the result of the good or bad determination. When the good or bad determination by the inspection device is defective, the control unit controls the elevating mechanism so that the substrate carried out from the inspection device is accommodated in an empty slot among the plurality of slots. When the good or bad determination by the inspection device is good, the storage device conveys the substrate downstream of the storage device without accommodating the substrate. The storage device includes a conveyance mechanism that moves up and down by the elevating mechanism. When the good or bad determination by the inspection device is good, the control unit controls the elevating mechanism so that the substrate conveyed from the inspection device is conveyed downstream of the storage device by the conveyance mechanism. The conveyance mechanism is provided above a magazine in which the plurality of slots are formed and moves up and down integrally with the magazine, and provides a production system.

Effects of the Invention

[0008] According to the present invention, a production line that can selectively accommodate defective substrates can be flexibly constructed.

Brief Description of the Drawings

[0009]

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Embodiments for Carrying Out the Invention

[0010] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of production systems, production lines, working devices, inspection devices, substrate supply and storage devices, management devices, confirmation devices, automated guided vehicles, etc. Hereinafter, corresponding elements in all the drawings are denoted by the same reference numerals, and duplicate explanations are omitted. In FIG. 2 and a part described later, as two axial directions orthogonal to each other in the horizontal plane, the X direction in the substrate conveyance direction (the left - right direction in FIG. 2(a)) and the Y direction orthogonal to the substrate conveyance direction (the up - down direction in FIG. 2(a)) are shown. In FIG. 2(b), the Z direction (the up - down direction in FIG. 2(b)) is shown as the height direction orthogonal to the horizontal plane.

[0011] First, referring to FIG. 1, the configuration of the production system 1 will be described. The production system 1 is configured to be managed by a management device 3 connected to a production line L via a communication network 2. The production line L includes, in order from the upstream (the left side in FIG. 1) in the substrate conveyance direction, a first substrate supply and storage device M1, a solder printing device M2, a first inspection device M3, a second substrate supply and storage device M4, component mounting devices M5 and M6, a second inspection device M7, a third substrate supply and storage device M8, a reflow device M9, and a fourth substrate supply and storage device M10.

[0012] Each device constituting the production line L has a substrate conveyance mechanism for conveying substrates, and performs operations for producing a mounted substrate with components mounted on the substrate while conveying the substrate from the upstream device to the downstream device. The first substrate supply and storage device M1 executes a substrate supply operation of taking out substrates from the slots of a magazine S having a plurality of slots and supplying them to the downstream solder printing device M2. The solder printing device M2 executes a solder printing operation of printing solder on the substrate carried in from the upstream through a screen mask mounted on the printing operation unit. The first inspection device M3 executes a printing inspection operation of acquiring an image of the solder (object to be inspected) printed on the substrate by an inspection camera and determining whether the printing state of the solder is good or bad.

[0013] In FIG. 1, the second substrate supply and storage device M4 stores the substrates with a defective solder printing state in the magazine S and conveys the substrates with a good solder printing state to the downstream component mounting device M5. The component mounting devices M5 and M6 execute a component mounting operation of mounting components on the substrate on which solder is printed by the mounting operation unit. Note that the production line L is not limited to a configuration with two component mounting devices M5 and M6, and may have one or three or more component mounting devices M5 and M6. The second inspection device M7 executes a mounting inspection operation of acquiring an image of the components (objects to be inspected) mounted on the substrate by an inspection camera and determining whether the mounting state of the components is good or bad.

[0014] The third substrate supply and storage device M8 stores the substrates with defective component mounting states in the magazine S, and conveys the substrates with good component mounting states to the downstream reflow device M9. The reflow device M9 performs a reflow operation of heating the substrate with components mounted thereon to melt the solder and then solidifying it. The fourth substrate supply and storage device M10 receives the substrates carried out from the upstream reflow device M9 and performs a substrate recovery operation of storing them in the magazine S.

[0015] In addition, between the reflow device M9 and the fourth substrate supply and storage device M10, the production line L may be provided with an inspection device that acquires an image of the components (objects to be inspected) soldered to the substrate by an inspection camera and determines whether the component mounting state is good or bad, and a substrate supply and storage device that stores the substrates with defective component mounting states in the magazine S and conveys the good substrates downstream. Hereinafter, when there is no need to make a particular distinction, the first substrate supply and storage device M1, the second substrate supply and storage device M4, the third substrate supply and storage device M8, and the fourth substrate supply and storage device M10 are referred to as "substrate supply and storage devices Ms", the solder printing device M2, the component mounting devices M5, M6, and the reflow device M9 are referred to as "working devices Mw", and the first inspection device M3 and the second inspection device M7 are referred to as "inspection devices Mi".

[0016] In FIG. 1, the production system 1 includes a confirmation device 4 arranged in a repair work area A provided away from the production line L. The confirmation device 4 is connected to the communication network 2 and has a function of acquiring and displaying the image and inspection results of the object to be inspected from the inspection device Mi, and a function of receiving a pass / fail determination and transmitting an unloading command or the like to the substrate supply and storage device Ms or the management device 3. In addition, the confirmation device 4 has a function of receiving the work history of the repair work performed on the defective substrate by the operator, and a function of transmitting the work history to the working device Mw or the management device 3.

[0017] The production system 1 is equipped with a plurality of automated guided vehicles V that transport the magazine S between the production line L, the repair work area A, and a preparation area (not shown). The automated guided vehicle V exchanges the magazine S with the substrate supply and storage device Ms. For example, the automated guided vehicle V transports the magazine S containing the substrate before work from the preparation area to the first substrate supply and storage device M1. Also, the automated guided vehicle V receives the magazine S containing the mounted substrate after work from the fourth substrate supply and storage device M10 and transports it to the preparation area.

[0018] In addition, the automated guided vehicle V receives the magazine S containing the defective substrate from the second substrate supply and storage device M4 or the third substrate supply and storage device M8 and transports it to the repair work area A. Also, the automated guided vehicle V transports the magazine S containing the repaired substrate from the repair work area A to the first substrate supply and storage device M1, the second substrate supply and storage device M4, or the third substrate supply and storage device M8. The automated guided vehicle V travels while detecting the tape installed on the floor or estimating its own position by a laser range scanner, a camera, etc. based on a command transmitted from the management device 3 or the like, and executes operations such as transporting and exchanging the magazine S.

[0019] Next, with reference to FIGS. 2(a) and 2(b), the configuration of the substrate supply and storage device Ms will be described. The substrate supply and storage device Ms includes a loading mechanism 10, a conveying mechanism 11, an unloading mechanism 12, a lifting mechanism 13, a magazine holding mechanism 14, a substrate transfer mechanism 15, an identification information acquisition unit 16, a supply storage unit 20, and a supply control unit 21. The loading mechanism 10, the conveying mechanism 11, and the unloading mechanism 12 are arranged side by side in the substrate conveying direction (X direction), and each includes a pair of conveyors that support the ends of the substrates facing each other in the direction orthogonal to the substrate conveying direction (Y direction) and convey the substrates from upstream to downstream.

[0020] The loading mechanism 10 arranged upstream receives the substrate from the upstream device and loads it into the substrate supply and storage device Ms, and delivers it to the conveying mechanism 11 arranged in the center. The conveying mechanism 11 conveys the substrate received from the loading mechanism 10 and delivers it to the unloading mechanism 12 arranged downstream. The unloading mechanism 12 conveys the substrate received from the conveying mechanism 11 and unloads it to the downstream device.

[0021] In FIG. 2, the transfer mechanism 11 moves up and down in the vertical (Z) direction by the lifting mechanism 13 (arrow b2 in FIG. 4(a), arrow b8 in FIG. 5(c)). When the transfer mechanism 11 receives a substrate from the loading mechanism 10 or delivers the substrate to the unloading mechanism 12, the lifting mechanism 13 positions the conveyor of the transfer mechanism 11 at the substrate transfer height position where it coincides with the conveyors of the loading mechanism 10 and the unloading mechanism 12 (the state in FIG. 3). In this way, the transfer mechanism 11 moves up and down by the lifting mechanism 13 and conveys the substrate received from the upstream to the downstream.

[0022] Below the transfer mechanism 11, a magazine holding mechanism 14 for detachably holding the magazine S is arranged. A plurality of slots SL for accommodating substrates are formed in the magazine S in the vertical (Z) direction. When the lifting mechanism 13 moves the transfer mechanism 11 up and down with the magazine holding mechanism 14 holding the magazine S, the magazine S held by the magazine holding mechanism 14 also moves up and down in accordance with the transfer mechanism 11. In this way, the magazine holding mechanism 14 moves up and down by the lifting mechanism 13 and detachably holds the magazine S. With the magazine holding mechanism 14 holding the magazine S, the magazine S is arranged below the transfer mechanism 11.

[0023] In FIG. 2, below the magazine holding mechanism 14, a magazine insertion port 22 that opens to the front surface (lower side in FIG. 2(a)) of the substrate supply and storage device Ms is formed. The magazine S is attached to and detached from the magazine holding mechanism 14 through the magazine insertion port 22. The substrate transfer mechanism 15 is arranged between a pair of conveyors of the loading mechanism 10 in a plan view. The substrate transfer mechanism 15 includes a pusher 17 that extends in the X direction and has a contact portion 17a that contacts the upstream end of the substrate at the downstream end, a pusher moving mechanism 18 that moves the pusher 17 in and out in the X direction, and a pusher lifting mechanism 19 that moves the pusher moving mechanism 18 up and down in the vertical direction.

[0024] When the loading mechanism 10 loads a substrate, the pusher lifting mechanism 19 positions itself at a standby height position where the contact portion 17a does not interfere with the substrate being conveyed (the states shown in FIGS. 4(a) and 6(a)). Also, when the pusher 17 moves the substrate downstream, the pusher lifting mechanism 19 positions itself at a substrate transfer height position where the contact portion 17a contacts the upstream end of the substrate (the states shown in FIGS. 4(b) and 6(b)).

[0025] In FIG. 2, the identification information acquisition unit 16 is configured to include a camera that reads an identification mark attached to a substrate and is disposed above the unloading mechanism 12. The identification information acquisition unit 16 acquires identification information associated with the substrate based on the identification mark read by the camera. That is, the identification information acquisition unit 16 reads the identification mark attached to the substrate and acquires the identification information associated with the substrate. The acquired identification information is transmitted to the working device Mw, the inspection device Mi, other substrate supply and storage devices Ms, the management device 3, and the confirmation device 4 via the communication network 2.

[0026] The supply control unit 21 (control unit) controls the loading mechanism 10, the conveying mechanism 11, the unloading mechanism 12, the lifting mechanism 13, the magazine holding mechanism 14, the substrate transfer mechanism 15 (pusher moving mechanism 18, pusher lifting mechanism 19), and the identification information acquisition unit 16 based on various information stored in the supply storage unit 20 and commands transmitted from the management device 3.

[0027] Referring to FIG. 3 here, the substrate passing process in which the substrate supply and storage device Ms unloads the substrate downstream without storing it will be described. The substrate passing process is executed with the elevating mechanism 13 positioning the conveying mechanism 11 at the substrate conveying height position. In FIG. 3(a), the supply control unit 21 operates the conveyor of the loading mechanism 10 to load the substrate B from the upstream device (arrow a1). In FIG. 3(b), next, the supply control unit 21 operates the conveyor of the conveying mechanism 11 to transfer the substrate B from the loading mechanism 10 to the conveying mechanism 11 and convey the substrate B downstream by the conveying mechanism 11 (arrow a2). In FIG. 3(c), next, the supply control unit 21 operates the conveyor of the unloading mechanism 12 to transfer the substrate B from the conveying mechanism 11 to the unloading mechanism 12 and unload the substrate B to the downstream device (arrow a3).

[0028] Next, referring to FIGS. 4 and 5, the substrate storage process in which the substrate supply and storage device Ms stores the substrate B in the magazine S will be described. In FIG. 4(a), first, the supply control unit 21 operates the conveyor of the loading mechanism 10 to load the substrate B from the upstream device (arrow b1). Also, the supply control unit 21 operates the elevating mechanism 13 to raise the magazine S to the substrate storage height position where the substrate B conveyed from the loading mechanism 10 can be stored in the empty slot SL (arrow b2). In FIG. 4(b), the downstream end of the substrate B conveyed by the loading mechanism 10 enters the empty slot SL and moves to a position where the upstream end does not interfere with the pusher 17 (arrow b3).

[0029] Next, the supply control unit 21 operates the pusher elevating mechanism 19 of the substrate transfer mechanism 15 to raise the pusher moving mechanism 18 positioned at the standby height position to the substrate transfer height position where the contact portion 17a of the pusher 17 can contact the upstream end of the substrate B (arrow b4). In FIG. 4(c), next, the supply control unit 21 operates the pusher moving mechanism 18 of the substrate transfer mechanism 15 to move the pusher 17 downstream and push the upstream end of the substrate B by the contact portion 17a to move the substrate B to the storage position in the slot SL (arrow b5).

[0030] In FIG. 5(a), next, the supply control unit 21 operates the pusher movement mechanism 18 to move the pusher 17 upstream to retract the contact portion 17a from within the slot SL (arrow b6). In FIG. 5(b), next, the supply control unit 21 operates the pusher lifting mechanism 19 to lower the pusher movement mechanism 18 to the standby height position (arrow b7). Further, the supply control unit 21 operates the lifting mechanism 13 to lower the transport mechanism 11 and the magazine S to the substrate transport height position (arrow b8).

[0031] In this way, the supply control unit 21 (control unit) controls the lifting mechanism 13 so that the substrate B received from upstream is accommodated in an empty slot SL among the plurality of slots SL provided in the magazine S. That is, the lifting mechanism 13 relatively raises and lowers the height position of the magazine S with respect to the substrate transfer mechanism 15. Then, the substrate transfer mechanism 15 transfers the substrate B received from upstream to any one of the plurality of slots SL provided in the magazine S.

[0032] Next, with reference to FIGS. 6 and 7, a substrate unloading process in which the substrate supply and storage device Ms unloads the substrate B1 stored in the magazine S to a downstream device will be described. In FIG. 6(a), a plurality (here, three) of slots SL in the magazine S each accommodate a substrate B including the substrate B1. In FIG. 6(b), first, the supply control unit 21 operates the lifting mechanism 13 to raise the magazine S to a height position at which the stored substrate B1 is sent out downstream (arrow c1). Further, the supply control unit 21 operates the pusher lifting mechanism 19 of the substrate transfer mechanism 15 to raise the pusher movement mechanism 18 to the same height position as the substrate transfer height position at which the contact portion 17a of the pusher 17 can contact the upstream end of the substrate B1 (arrow c2).

[0033] In FIG. 6(c), next, the supply control unit 21 operates the pusher moving mechanism 18 of the substrate transfer mechanism 15 to move the pusher 17 downstream and push the upstream end of the substrate B1 in the slot SL by the contact portion 17a, and moves the substrate B1 until at least the downstream end transfers onto the carry-out mechanism 12 (arrow c3). In FIG. 7(a), next, the supply control unit 21 operates the conveyor of the carry-out mechanism 12 to convey the substrate B1 pushed out from the slot SL downstream (arrow c4). Further, the supply control unit 21 operates the pusher moving mechanism 18 to move the pusher 17 upstream and retract the contact portion 17a from within the slot SL (arrow c5).

[0034] In FIG. 7(b), the substrate B1 that has transferred onto the carry-out mechanism 12 is carried out to the downstream device (arrow c6). Further, the supply control unit 21 operates the pusher lifting mechanism 19 to lower the pusher moving mechanism 18 to the standby height position (arrow c7). Further, the supply control unit 21 operates the lifting mechanism 13 to lower the transfer mechanism 11 and the magazine S to the substrate transfer height position (arrow c8).

[0035] In this way, the supply control unit 21 (control unit) controls the lifting mechanism 13 so that the substrate B1 can be sent out from the slot SL in which the substrate B1 to be carried out is accommodated among the plurality of slots SL provided in the magazine S. Further, the substrate transfer mechanism 15 is a substrate discharging mechanism that pushes out the substrate B1 accommodated in the slot SL downstream.

[0036] Note that in the above-described substrate supply and storage device Ms, the substrate transfer mechanism 15 also serves as a substrate discharging mechanism, but the substrate supply and storage device Ms may be configured to include a substrate discharging mechanism in addition to the substrate transfer mechanism 15. For example, the substrate discharging mechanism may be disposed between a pair of conveyors of the carry-out mechanism 12 in plan view and configured to pull out the substrate B1 from the slot SL. The magazine S is disposed at a position where the direction in which the substrate transfer mechanism 15 transfers the substrate B1 received from the upstream to the slot SL and the direction in which the substrate discharging mechanism discharges the substrate B1 accommodated in the slot SL downstream coincide.

[0037] Next, with reference to FIGS. 8 to 10, the magazine transfer process in which the magazine S transported by the automated guided vehicle V is transferred to the substrate supply and storage device Ms will be described. In FIGS. 8(a) and 10, the automated guided vehicle V includes a transport storage unit 30, a transport control unit 31, a traveling mechanism 32, a magazine placement mechanism 33, and a transport wireless communication unit 34. The transport wireless communication unit 34 is a wireless communication device that transmits and receives various information and commands to and from the management device 3.

[0038] The transport control unit 31 controls the traveling mechanism 32 and the magazine placement mechanism 33 based on various information stored in the transport storage unit 30, which is a storage device, and commands transmitted from the management device 3. The traveling mechanism 32 includes a motor that drives the wheels, and travels the automated guided vehicle V and stops it at a predetermined position. The magazine placement mechanism 33 is disposed above the automated guided vehicle V and has a function of holding or releasing the placed magazine S.

[0039] FIGS. 8 and 9 show the process of transferring an empty magazine S in which the substrate B is not accommodated in the slot SL transported by the automated guided vehicle V to the substrate supply and storage device Ms. The substrate supply and storage device Ms shown in FIGS. 8 and 9 shows the configuration as viewed from the A-A position in FIG. 2(b). In FIG. 8(a), the empty magazine S placed on the automated guided vehicle V is held by the magazine placement mechanism 33. The transport control unit 31 controls the traveling mechanism 32 to approach the automated guided vehicle V from the front of the substrate supply and storage device Ms (arrow d1), enter the magazine insertion port 22, and stop at the magazine transfer position below the magazine holding mechanism 14 (arrow d2 in FIG. 8(b)).

[0040] In FIG. 8(c), when the automated guided vehicle V holding the magazine S stops at the magazine transfer position, the supply control unit 21 operates the elevating mechanism 13 to lower the magazine holding mechanism 14 from the substrate transfer height position (arrow d3), and operates the magazine holding mechanism 14 to hold the upper part of the magazine S held by the automated guided vehicle V. When the magazine holding mechanism 14 holds the magazine S, the transport control unit 31 operates the magazine placement mechanism 33 to release the held magazine S.

[0041] In Fig. 9(a), when the automated guided vehicle V releases the magazine S, the supply control unit 21 operates the lifting mechanism 13 to raise the magazine holding mechanism 14 to the substrate transfer height position (arrow d4). Thereby, the magazine S is transferred from the automated guided vehicle V to the substrate supply and storage device Ms. In Fig. 9(b), when the transfer of the magazine S is completed, the transfer control unit 31 controls the traveling mechanism 32 to move the automated guided vehicle V out of the substrate supply and storage device Ms from the magazine insertion port 22 (arrow d5).

[0042] Figs. 8 and 9 show the magazine transfer process of transferring the magazine S from the automated guided vehicle V to the substrate supply and storage device Ms. However, the magazine receiving process in which the automated guided vehicle V receives the magazine S from the substrate supply and storage device Ms is performed in the reverse procedure of the above-described magazine transfer process. That is, the automated guided vehicle V not holding the magazine S moves to the magazine transfer position in the substrate supply and storage device Ms, and the lifting mechanism 13 lowers the magazine holding mechanism 14 that holds the magazine S and places it on the magazine mounting mechanism 33 of the automated guided vehicle V.

[0043] Next, when the magazine mounting mechanism 33 holds the magazine S and the magazine holding mechanism 14 releases the magazine S, the lifting mechanism 13 raises the magazine holding mechanism 14 to the substrate transfer height position, and the automated guided vehicle V that has received the magazine S moves out of the substrate supply and storage device Ms. In this way, the magazine S is transported by the automated guided vehicle V, and the magazine S is transferred between the substrate supply and storage device Ms and the automated guided vehicle V. The lifting mechanism 13 and the magazine holding mechanism 14 of the substrate supply and storage device Ms constitute a magazine transfer mechanism for transferring the magazine S to and from the automated guided vehicle V.

[0044] In Fig. 10, the adjustment of the timing of the process in which the transfer control unit 31 of the automated guided vehicle V and the supply control unit 21 of the substrate supply and storage device Ms are interlocked in the magazine transfer process and the magazine receiving process is performed via the management device 3. That is, between the automated guided vehicle V and the management device 3, information is wirelessly transmitted and received by the transfer wireless communication unit 34 of the automated guided vehicle V and the management wireless communication unit 67 provided in the management device 3.

[0045] Also, between the management device 3 and the substrate supply and storage device Ms, information is transmitted and received via the communication network 2 by the management communication unit 68 provided in the management device 3 and the supply communication unit 26 of the substrate supply and storage device Ms. Note that the substrate supply and storage device Ms may be provided with wireless communication means to directly transmit and receive information to and from the automated guided vehicle V without going through the management device 3, and adjust the timing in the magazine delivery process and the magazine receiving process.

[0046] As described above, the substrate supply and storage device Ms of the present embodiment includes a lifting mechanism 13, a control unit (supply control unit 21) that controls the lifting mechanism 13, a transport mechanism 11 that transports the substrate B received from the upstream to the downstream and moves up and down by the lifting mechanism 13, a magazine S having a plurality of slots SL, a substrate transfer mechanism 15 that transfers the substrate B received from the upstream to any one of the plurality of slots SL, and a substrate discharging mechanism (substrate transfer mechanism 15) that sends out the substrate B accommodated in the slot SL to the downstream. And the lifting mechanism 13 relatively raises and lowers the position of the magazine S with respect to the substrate transfer mechanism 15 and the substrate discharging mechanism. Thereby, the substrate supply and storage device Ms (storage device) can temporarily store a plurality of substrates B, and can perform a substrate passing process of carrying out the substrate B received from the upstream to the downstream without storing it in the magazine S.

[0047] Note that the first substrate supply and storage device M1, the second substrate supply and storage device M4, the third substrate supply and storage device M8, and the fourth substrate supply and storage device M10, which are the substrate supply and storage devices Ms, do not necessarily need to be provided with all the mechanisms described above. For example, the first substrate supply and storage device M1, which is a substrate loading device provided at the head of the production line L, does not necessarily need to be provided with the loading mechanism 10, the transport mechanism 11, and the substrate transfer mechanism 15. That is, the first substrate supply and storage device M1 (loading device) capable of loading a plurality of substrates B includes a lifting mechanism 13, a control unit (supply control unit 21) that controls the lifting mechanism 13, a magazine S having a plurality of slots SL, and a substrate discharging mechanism (substrate transfer mechanism 15) that sends out the substrate B accommodated in the slot SL to the downstream, and it is sufficient that the lifting mechanism 13 relatively raises and lowers the height position of the magazine S with respect to the substrate discharging mechanism.

[0048] In addition, the fourth substrate supply and storage device M10, which is a substrate recovery device provided at the end of the production line L, does not necessarily need to include a substrate discharging mechanism, a transport mechanism 11, and a discharging mechanism 12. That is, the fourth substrate supply and storage device M10 (recovery device) capable of recovering a plurality of substrates B includes a lifting mechanism 13, a control unit (supply control unit 21) for controlling the lifting mechanism 13, a magazine S having a plurality of slots SL, and a substrate transfer mechanism 15 for transferring the substrate B received from the upstream to the slot SL. It is sufficient that the lifting mechanism 13 relatively raises and lowers the height position of the magazine S with respect to the substrate transfer mechanism 15.

[0049] In addition, the second substrate supply and storage device M4 and the third substrate supply and storage device M8, which are storage devices provided in the middle of the production line L, do not necessarily need to include a substrate discharging mechanism when the function of reintroducing the substrate B stored in the magazine S downstream is unnecessary. That is, the storage device capable of storing a plurality of substrates B includes a lifting mechanism 13, a control unit (supply control unit 21) for controlling the lifting mechanism 13, a transport mechanism 11 for transporting the substrate B received from the upstream downstream and lifting and lowering with the lifting mechanism 13, a magazine S having a plurality of slots SL, and a substrate transfer mechanism 15 for transferring the substrate B received from the upstream to the slot SL. It is sufficient that the lifting mechanism 13 relatively raises and lowers the height position of the magazine S with respect to the substrate transfer mechanism 15.

[0050] In addition, the second substrate supply and storage device M4 and the third substrate supply and storage device M8, which are storage devices provided in the middle of the production line L, do not necessarily need to include a transport mechanism 11 when the function of substrate passing-through processing for discharging the substrate B received from the upstream downstream without storing it in the magazine S is unnecessary. That is, the storage device capable of temporarily storing substrates includes a lifting mechanism 13, a control unit (supply control unit 21) for controlling the lifting mechanism 13, a magazine S having a plurality of slots SL, a substrate transfer mechanism 15 for transferring the substrate B received from the upstream to the slot SL, and a substrate discharging mechanism (substrate transfer mechanism 15) for sending out the substrate B stored in the slot SL downstream. It is sufficient that the lifting mechanism 13 relatively raises and lowers the height position of the magazine S with respect to the substrate transfer mechanism 15 and the substrate discharging mechanism.

[0051] Next, referring to FIG. 10, the configuration of the control system of the production system 1 will be described. The production system 1 includes a production line L, an automated guided vehicle V, a management device 3, and a confirmation device 4. The production line L includes a substrate supply and storage device Ms (a first substrate supply and storage device M1, a second substrate supply and storage device M4, a third substrate supply and storage device M8, a fourth substrate supply and storage device M10), a work device Mw (a solder printing device M2, component mounting devices M5, M6), and inspection devices Mi (a first inspection device M3, a second inspection device M7).

[0052] In FIG. 10, each device (substrate supply and storage device Ms, work device Mw, inspection device Mi, management device 3, confirmation device 4) is provided with a communication device (a supply communication unit 26, a work communication unit 47, an inspection communication unit 59, a management communication unit 68, a confirmation communication unit 75), and transmits and receives data to and from other devices via a communication network 2. In addition, each device is provided with an input device (a supply reception unit 25, a work reception unit 46, an inspection reception unit 58, a management reception unit 66, a confirmation reception unit 74) such as a keyboard, a touch panel, or a mouse used when an operation command or data is input.

[0053] Further, each device is provided with a display device (a supply display unit 24, a work display unit 45, an inspection display unit 57, a management display unit 65, a confirmation display unit 73) such as a liquid crystal panel that displays various data stored in a storage device (a supply storage unit 20, a work storage unit 40, an inspection storage unit 50, a management storage unit 60, a confirmation storage unit 70) and various information such as a screen for operations by the input device.

[0054] In FIG. 10, the substrate supply and storage device Ms includes a loading mechanism 10, a transfer mechanism 11, an unloading mechanism 12, a lifting mechanism 13, a magazine holding mechanism 14, a substrate transfer mechanism 15, an identification information acquisition unit 16, a supply storage unit 20, a supply control unit 21, a supply reception unit 23, a supply display unit 24, a supply reception unit 25, and a supply communication unit 26. The work device Mw includes a work storage unit 40, a work control unit 41, a work transfer mechanism 42, a work unit 43, a work confirmation unit 44, a work display unit 45, a work reception unit 46, and a work communication unit 47.

[0055] The operation control unit 41 (control unit) controls the work transfer mechanism 42 based on various information stored in the work memory unit 40 and commands transmitted from the management device 3, to transfer the substrate B to the work unit 43, and controls the work unit 43 to execute production work. The operation control unit 41 of the solder printing device M2 controls the printing work unit (work unit 43) to execute a solder printing operation on the substrate B. The operation control units 41 of the component mounting devices M5 and M6 control the mounting work unit (work unit 43) to execute a component mounting operation on the substrate B on which solder has been printed.

[0056] In FIG. 10, the inspection device Mi includes an inspection memory unit 50, an inspection control unit 51, an inspection transfer mechanism 52, an inspection camera 53, an image acquisition unit 54, a pass / fail determination unit 55, an inspection transmission unit 56, an inspection display unit 57, an inspection reception unit 58, and an inspection communication unit 59. The inspection control unit 51 (control unit) controls the inspection transfer mechanism 52 to transfer the substrate B and controls the inspection camera 53 to image the inspection object based on various information stored in the inspection memory unit 50 and commands transmitted from the management device 3.

[0057] The inspection camera 53 of the first inspection device M3 images the solder printed on the substrate B which is the inspection object. The inspection camera 53 of the second inspection device M7 images the components mounted on the substrate B which is the inspection object. The image acquisition unit 54 acquires an image of the inspection object. The pass / fail determination unit 55 performs a pass / fail determination of the inspection object based on the image of the inspection object. In this way, the inspection device Mi inspects the inspection object including the substrate B and performs a pass / fail determination of the inspection object. The inspection transmission unit 56 transmits the inspection result including the image of the inspection object and the result of the pass / fail determination of the inspection object to the management device 3, the confirmation device 4, and the substrate supply and storage device Ms in association with the identification information of the inspected substrate B.

[0058] In FIG. 10, the management device 3 includes a management memory unit 60, a management acquisition unit 61, a work command creation unit 62, a management transmission unit 63, a management confirmation unit 64, a management display unit 65, a management reception unit 66, a management wireless communication unit 67, and a management communication unit 68. The confirmation device 4 includes a confirmation memory unit 70, a confirmation acquisition unit 71, a confirmation transmission unit 72, a confirmation display unit 73, a confirmation reception unit 74, and a confirmation communication unit 75.

[0059] Next, referring to FIG. 10, the housing process of defective substrates in the substrate supply and housing device Ms (housing device) will be described. The supply and reception unit 23 (acquisition unit) of the substrate supply and housing device Ms acquires the inspection results by the upstream inspection device Mi. For example, the supply and reception unit 23 of the second substrate supply and housing device M4 acquires the inspection results including the determination of the quality of the solder printing state printed on the substrate B by the solder printing device M2 from the upstream first inspection device M3. Also, the supply and reception unit 23 of the third substrate supply and housing device M8 acquires the inspection results including the determination of the quality of the mounting state of the components mounted on the substrate B by the component mounting devices M5 and M6 from the upstream second inspection device M7.

[0060] When the pass / fail determination is good, the supply control unit 21 controls the elevating mechanism 13 to position the transfer mechanism 11 at the substrate transfer height position, and controls the transfer mechanism 11 to execute a substrate passing process of transporting the good substrate B downstream without housing it in the magazine S (see FIG. 3). That is, when the pass / fail determination by the inspection device Mi is good, the supply control unit 21 (control unit) controls the elevating mechanism 13 so that the substrate B transported from the inspection device Mi is transported downstream of the substrate supply and housing device Ms (housing device) by the transfer mechanism 11.

[0061] When the pass / fail determination is bad, the supply control unit 21 controls the elevating mechanism 13 to position the magazine S at the substrate housing height position, and controls the loading mechanism 10 and the substrate transfer mechanism 15 to execute a substrate housing process of housing the defective substrate B in the empty slot SL (see FIGS. 4 and 5). That is, when the pass / fail determination by the inspection device Mi is bad, the supply control unit 21 (control unit) controls the elevating mechanism 13 so that the substrate B unloaded from the inspection device Mi is housed in the empty slot SL among the plurality of slots SL. In this way, the supply control unit 21 (control unit) controls the elevating mechanism 13 based on the acquired inspection results.

[0062] In FIG. 10, in the above-described embodiment, the supply control unit 21 of the substrate supply and storage device Ms determines whether to execute the substrate passing process or the substrate storage process based on the pass / fail determination of the inspection device Mi. However, the management device 3 may execute this determination. That is, the management acquisition unit 61 (acquisition unit) of the management device 3 acquires the inspection result by the inspection device Mi, and the work command creation unit 62 creates a work command that defines the work in the substrate supply and storage device Ms (storage device) based on the acquired inspection result. Specifically, when the pass / fail determination result included in the inspection result is good, the work command creation unit 62 creates a passing command to execute the substrate passing process, and when it is bad, it creates a storage command to execute the substrate storage process.

[0063] Next, the management transmission unit 63 (transmission unit) transmits the created work command to the substrate supply and storage device Ms arranged downstream of the inspection device Mi that has acquired the inspection result. Specifically, when the inspection device Mi is the first inspection device M3, the management transmission unit 63 transmits the work command to the second substrate supply and storage device M4, and when it is the second inspection device M7, it transmits the work command to the third substrate supply and storage device M8. The supply control unit 21 (control unit) of the substrate supply and storage device Ms controls the carry-in mechanism 10, the transfer mechanism 11, the carry-out mechanism 12, the lifting mechanism 13, and the substrate transfer mechanism 15 based on the work command (passing command, storage command) received by the supply reception unit 23 (reception unit) to execute the substrate passing process or the substrate storage process.

[0064] As described above, the production system 1 including the work device Mw that performs work on the substrate B and the inspection device Mi that inspects the inspection object including the substrate B includes a substrate supply and storage device Ms (storage device) that can accommodate and lift a plurality of substrates B provided downstream of the inspection device Mi. Thereby, a production line L that can selectively accommodate defective substrates B can be flexibly constructed. The magazine S in which the defective substrate B is accommodated is recovered from the substrate supply and storage device Ms by the automated guided vehicle V. The recovered magazine S is transported to the repair work area A by the automated guided vehicle V. Also, an empty magazine S is transported to the substrate supply and storage device Ms by the automated guided vehicle V (see FIGS. 8 and 9).

[0065] Next, with reference to FIG. 10, an inspection result confirmation process will be described in which an operator uses a confirmation device 4 arranged away from the production line L to confirm the inspection result by the inspection device Mi. The confirmation acquisition unit 71 (acquisition unit) of the confirmation device 4 acquires an inspection result including an image of the inspection object and a pass / fail determination result from the inspection device Mi. When the above-described defective substrate accommodation process in which the substrate supply and accommodation device Ms (accommodation device) accommodates the substrate B determined to be defective by the inspection device Mi in the magazine S is executed, the confirmation acquisition unit 71 acquires the inspection result related to the substrate B accommodated in the substrate supply and accommodation device Ms. That is, the confirmation acquisition unit 71 acquires only the inspection result related to the substrate B determined to be defective by the inspection device Mi.

[0066] The confirmation display unit 73 (display unit) displays the acquired inspection result. That is, the confirmation display unit 73 displays the identification information of the substrate B, the pass / fail determination result, the content of the defect (such as solder residue, solder bleeding, component misalignment, no component, etc.), an image of the defective part (image of the inspection object), and the like. The operator makes a pass / fail judgment by looking at the inspection result displayed on the confirmation display unit 73. The confirmation reception unit 74 (reception unit) receives the pass / fail judgment by the operator, that is, the visual pass / fail judgment of the inspection result displayed on the confirmation display unit 73 (display unit).

[0067] In FIG. 10, when the confirmation reception unit 74 receives that the substrate B is good by visual inspection, the confirmation transmission unit 72 transmits an unloading command to the substrate supply and accommodation device Ms that houses the substrate B to unload the substrate B downstream. That is, the confirmation transmission unit 72 (transmission unit) transmits an unloading command (unloading command) to unload the substrate B for which the confirmation reception unit 74 (reception unit) has received that the pass / fail judgment is good downstream of the substrate supply and accommodation device Ms (accommodation device).

[0068] The supply control unit 21 (control unit) of the substrate supply and accommodation device Ms controls the unloading mechanism 12, the lifting mechanism 13, and the substrate unloading mechanism (substrate transfer mechanism 15) based on the unloading command received by the supply reception unit 23 (reception unit) to execute an unloading process for unloading the corresponding substrate B from the magazine S to a downstream device (see FIGS. 6 and 7). Work on the unloaded substrate B is resumed by a downstream device.

[0069] In FIG. 10, the management acquisition unit 61 of the management device 3 acquires inspection results from the inspection device Mi and stores the inspection results in the management storage unit 60. The stored inspection results are used as reference information for quality control (traceability) of the mounting substrate and repair work of defective substrates.

[0070] The confirmation transmission unit 72 of the confirmation device 4 also transmits an unloading command to the management device 3. When the management acquisition unit 61 (acquisition unit) of the management device 3 acquires the unloading command, it adds information indicating that the inspection result of the corresponding substrate B stored in the management storage unit 60 has been visually determined to be good. That is, information indicating that the inspection result of the substrate B determined to be defective by the automatic determination of the inspection device Mi has been determined to be non-defective by the visual inspection of the operator working at a location away from the production line L is stored.

[0071] In this way, the management device 3 includes a management storage unit 60 (storage unit) that stores the inspection results acquired from the inspection device Mi. When the confirmation reception unit 74 (reception unit) of the confirmation device 4 receives information indicating that the pass / fail determination is good, the management device 3 updates the inspection results related to the substrate B stored in the management storage unit 60. As a result, the information used for quality control and repair work is correctly updated.

[0072] In this way, a production system including a working device Mw that works on the substrate B and an inspection device Mi that inspects an inspection object including the substrate B includes a substrate supply and storage device Ms (storage device) that can temporarily store a plurality of substrates B provided on the downstream side of the inspection device Mi, a management device 3 that manages at least the substrate supply and storage device Ms, and a confirmation device 4 for confirming the inspection results by the inspection device Mi.

[0073] Then, the confirmation device 4 includes a confirmation acquisition unit 71 (acquisition unit) that acquires at least inspection results related to the substrate B accommodated in the substrate supply and storage device Ms, a confirmation display unit 73 (display unit) that displays the acquired inspection results, a confirmation reception unit 74 (reception unit) that accepts a visual pass / fail determination of the inspection results displayed on the confirmation display unit 73, and a confirmation transmission unit 72 that transmits a command to carry out the substrate B for which the confirmation reception unit 74 has accepted that the pass / fail determination is good to the downstream of the substrate supply and storage device Ms. Thereby, an operator can perform a visual determination from a location away from the production line L and easily resume the work on the substrate B that has been determined to be good.

[0074] Next, referring to FIG. 10, a reinsertion process of reinserting the substrate B that has been removed from the production line L as a defect and for which repair work has been performed into the production line L and a production work process for the repaired substrate B will be described. The substrate B determined to be defective by the inspection device Mi is accommodated in the magazine S by the substrate supply and storage device Ms (storage device), removed from the production line L, and transported to the repair work area A by the automated guided vehicle V.

[0075] In the repair work area A, the operator performs repair work such as removing solder, correcting component misalignment, and removing defective components on the defective substrate B, and inputs the details of the repair work and the like into the confirmation device 4 installed in the repair work area A. In this way, the confirmation storage unit 70 (storage unit) of the confirmation device 4 stores work history information including repair work history information regarding the history of repair work performed on the substrate B removed from the production line L in association with the identification information of the substrate B. Further, the confirmation transmission unit 72 (transmission unit) of the confirmation device 4 transmits the work history information to the management device 3, the substrate supply and storage device Ms, the work device Mw, and the inspection device Mi.

[0076] In FIG. 10, the substrate B that is reintroduced into the production line L after the repair work is stored in the magazine S and conveyed to the production line L by the automated guided vehicle V. The magazine S conveyed by the automated guided vehicle V is delivered to a substrate supply and storage device Ms (loading device) arranged upstream of a working device Mw or an inspection device Mi that performs production work on the reintroduced substrate B. In this way, the automated guided vehicle V receives the magazine S containing the substrate B extracted by the substrate supply and storage device Ms (storage device), or delivers the magazine S containing the substrate B to be reintroduced to the substrate supply and storage device Ms (loading device).

[0077] The substrate supply and storage device Ms (loading device) reintroduces the repaired substrate B stored in the magazine S into the production line L. Note that the position of the substrate supply and storage device Ms for reintroduction only needs to be upstream of the working device Mw, and it may be the first substrate supply and storage device M1 which is a substrate loading device provided at the head of the production line L. At the time of reintroduction, the identification information acquisition unit 16 of the substrate supply and storage device Ms reads the identification mark attached to the substrate and acquires the identification information associated with the substrate. The acquired identification information is transmitted to the management device 3, the downstream working device Mw, and the inspection device Mi.

[0078] In FIG. 10, the work confirmation unit 44 (confirmation unit) of the working device Mw that receives the reintroduced substrate B confirms whether the substrate B has been worked based on the identification information acquired by the identification information acquisition unit 16 and the work history information regarding the work history of the substrate B associated with the identification information transmitted from the confirmation device 4. In the case of a substrate B that has not been worked as required by the working device Mw, the work control unit 41 (control unit) controls the working unit 43 to execute the required work. In the case of a substrate B that has been worked, the work control unit 41 (control unit) of the working device Mw controls the work conveyance mechanism 42 to convey the substrate B downstream. That is, the working device Mw conveys the substrate B downstream without performing work on the substrate B confirmed to have been worked by the work confirmation unit 44.

[0079] In FIG. 10, in the above-described form, the work confirmation unit 44 of the working device Mw confirms the necessity of work on the substrate B that has been re-introduced, but this confirmation may also be executed by the management device 3. That is, the management confirmation unit 64 (confirmation unit) of the management device 3 confirms whether the substrate B re-introduced into the production line L and carried into the working device Mw has been worked on, based on the identification information and the work history information.

[0080] When the work has not been done, the work instruction creation unit 62 creates a work instruction to perform the necessary work, and when the work has been completed, creates a pass instruction to convey downstream without performing the work, and the management transmission unit 63 transmits the created instruction to the working device Mw. That is, the management device 3 transmits an instruction (pass instruction) to convey downstream without performing work on the substrate B that has been confirmed as having been worked on by the working device Mw to the substrate B.

[0081] Thus, the production system 1 including at least one working device Mw that performs work on the substrate B includes a housing device (substrate supply housing device Ms) that extracts the substrate B from the production line L including the working device Mw, an input device (substrate supply housing device Ms) that re-introduces the extracted substrate B into the production line L, an identification information acquisition unit 16 that reads the identification mark attached to the substrate B and acquires the identification information associated with the substrate, and a confirmation unit (work confirmation unit 44, management confirmation unit 64) that confirms whether the substrate B has been worked on based on the identification information acquired by the identification information acquisition unit 16 and the work history information regarding the work history of the substrate B associated with the identification information.

[0082] Then, the working device Mw conveys downstream without performing work on the substrate B that has been confirmed as having been worked on by the confirmation unit (work confirmation unit 44, management confirmation unit 64). As a result, a production line L capable of restarting the work on the re-introduced substrate B after repair work can be flexibly configured.

[0083] Next, a method for accommodating defective substrates by the substrate supply and storage device Ms included in the production system 1 will be described along the flow of FIG. 11. First, the supply and reception unit 23 (reception unit) of the substrate supply and storage device Ms acquires the inspection result of the substrate B carried in from the upstream inspection device Mi (ST1). Next, when the inspection result of the substrate B is defective (No in ST2), the supply control unit 21 causes the substrate storage process of storing the substrate B in the empty slot SL of the magazine S to be executed (ST3) (see FIGS. 4 and 5).

[0084] Also, when the inspection result of the substrate B is good (Yes in ST2), the supply control unit 21 causes the substrate passing process of transporting the substrate B downstream to be executed (ST4) (see FIG. 3). As a result, only the defective substrate B is stored in the magazine S. When the substrate storage process (ST3) or the substrate passing process (ST4) is completed, it returns to (ST1) and the inspection result of the next carried-in substrate B is acquired.

[0085] Next, a method for confirming the inspection result by the confirmation device 4 included in the production system 1 will be described along the flow of FIG. 12. First, the confirmation acquisition unit 71 (acquisition unit) of the confirmation device 4 acquires the inspection result including the image of the inspection object and the pass / fail determination result from the inspection device Mi (ST11). When the inspection result is good (Yes in ST12), since the target substrate B has already been carried out to the downstream device without being stored in the substrate supply and storage device Ms, nothing is done and it returns to (ST11). When the inspection result is defective (No in ST12), the confirmation display unit 73 (display unit) displays the inspection result (ST13).

[0086] When the operator visually confirms the inspection result and the confirmation reception unit 74 (reception unit) receives that the visual result is defective (No in ST14), since the target substrate B has already been stored in the substrate supply and storage device Ms, nothing is done and it returns to (ST11). When the confirmation reception unit 74 (reception unit) receives that the visual result is good (Yes in ST14), the confirmation transmission unit 72 (transmission unit) transmits an unloading command to the substrate supply and storage device Ms that temporarily stores the target substrate B (ST15), and returns to (ST11).

[0087] In the case where the target substrate B is waiting for a command in the loading mechanism 10 of the substrate supply and storage device Ms, when the inspection result is good (Yes in ST12), a passing command for executing the substrate passing process is transmitted, and when the visual inspection result is defective (No in ST14), a storage command for executing the substrate storage process is transmitted.

[0088] Next, along the flow of FIG. 13, a method for unloading good substrates in which the substrate B temporarily stored in the substrate supply and storage device Ms provided in the production system 1 is unloaded downstream will be described. When the supply and reception unit 23 (reception unit) of the substrate supply and storage device Ms receives the unloading command (ST15) transmitted from the confirmation device 4 by the above-described inspection result confirmation method (Yes in ST21), the supply control unit 21 causes the substrate unloading process for unloading the corresponding substrate B temporarily stored downstream to be executed (ST22) (see FIGS. 6 and 7). As a result, the operation of the substrate, which was determined to be defective by the automatic determination in the inspection device Mi but was determined to be a good product by visual inspection, is restarted.

[0089] Next, along the flow of FIG. 14, a method for the production operation in the working device Mw for the reloaded substrate after the repair work is performed on the substrate B extracted as defective from the production line L and then reloaded into the production line L will be described. Here, as an example, a component mounting method for the reloaded substrate by the component mounting devices M5 and M6, which are the working devices Mw, will be described. When the reloaded substrate is loaded into the component mounting devices M5 and M6 (ST31), the identification information of the reloaded substrate is acquired from the identification information acquisition unit 16 (ST32), and the work history information of the reloaded substrate is acquired from the confirmation device 4 (ST33).

[0090] Next, the operation confirmation unit 44 determines whether the target re-fed substrate has been processed by the component mounting devices M5 and M6 based on the identification information and the operation history information (ST34). If it has not been processed (No in ST34), the mounting operation unit (operation unit 43) performs the necessary component mounting operation on the re-fed substrate (ST35), and then it is carried out to the downstream device (ST36). If it has been processed (Yes in ST34), the re-fed substrate is carried out to the downstream device without performing the component mounting operation (ST36). When the re-fed substrate is carried out (ST36), it returns to (ST31) and the process for the next re-fed substrate carried in is executed. As a result, appropriate production operations according to the substrate B after the re-fed repair work are executed.

[0091] Next, with reference to FIGS. 15 and 16, the configuration of the substrate storage device Mt arranged on the production line L will be described. The substrate storage device Mt shown in FIG. 16(b) shows the configuration as viewed from the B-B position in FIG. 16(a). The production line L shown in FIG. 1 may be configured by replacing at least any one of the second substrate supply and storage device M4, the third substrate supply and storage device M8, and the fourth substrate supply and storage device M10 with the substrate storage device Mt.

[0092] The substrate storage device Mt includes a carry-in mechanism 80, a transfer mechanism 81, a carry-out mechanism 82, a rotation mechanism 84, a lifting mechanism 86, a substrate transfer mechanism 87, an identification information acquisition unit 90, a magazine transfer mechanism 92, a storage memory unit 93, a storage control unit 94, a storage reception unit 95, and a storage communication unit 96. Further, the substrate storage device Mt includes a storage display unit (not shown) similar to the supply display unit 24 of the substrate supply and storage device Ms, and a storage reception unit (not shown) similar to the supply reception unit 25.

[0093] The carry-in mechanism 80, the carry-out mechanism 82, the identification information acquisition unit 90, the storage memory unit 93, the storage reception unit 95, and the storage communication unit 96 included in the substrate storage device Mt are the same as the carry-in mechanism 10, the carry-out mechanism 12, the identification information acquisition unit 16, the supply memory unit 20, the supply reception unit 23, and the supply communication unit 26 included in the substrate supply and storage device Ms, and detailed description thereof is omitted.

[0094] In FIGS. 15 and 16, the transport mechanism 81 of the substrate storage device Mt is disposed above the transport mechanism holding member 83. The transport mechanism holding member 83 rotates in the horizontal plane about the Z axis by a rotation mechanism 84 disposed above the lifting member 85. The rotation mechanism 84 is controlled by the storage control unit 94. By operating the rotation mechanism 84, the transport mechanism 81 rotates between a transport direction (X direction) in which the pair of conveyors face the same direction as the loading mechanism 80 and the unloading mechanism 82 (FIG. 17(a)), and a storage direction (Y direction) orthogonal to the transport direction (FIG. 17(b)).

[0095] The lifting mechanism 86 is controlled by the storage control unit 94. By operating the lifting mechanism 86, the transport mechanism 81 and the rotation mechanism 84 move up and down (in the Z direction) integrally with the lifting member 85 (arrow e2 in FIG. 18(b)). When the transport mechanism 81 receives a substrate from the loading mechanism 80 or delivers a substrate to the unloading mechanism 82, the lifting mechanism 86 positions the conveyor of the transport mechanism 81 at a substrate transport height position where it coincides with the conveyors of the loading mechanism 80 and the unloading mechanism 82 (the state shown in FIGS. 15 and 16).

[0096] In FIGS. 15 and 16, a magazine placement portion 91 having a magazine transfer mechanism 92 at the upper part is disposed on the front surface of the substrate storage device Mt. The substrate transfer mechanism 87 is disposed above the lifting member 85 and at a position facing the magazine transfer mechanism 92 with the transport mechanism 81 interposed therebetween. The substrate transfer mechanism 87 includes a pusher 88 having a contact portion 88a that contacts the upstream end portion of the substrate at the end and extending in the storage direction (Y direction), and a pusher movement mechanism 89 that moves the pusher 88 in and out in the storage direction. The pusher movement mechanism 89 is disposed above the lifting member 85. A magazine S having a plurality of slots SL is placed on the magazine transfer mechanism 92 in a direction in which the direction of the slots SL is the storage direction.

[0097] The height position of the contact portion 88a of the pusher 88 is set to a height position where it contacts the upstream end of the substrate B placed on the transport mechanism 81 facing the accommodation direction, and the substrate B can be moved to the empty slot SL of the magazine S placed on the magazine transfer mechanism 92 (see Fig. 19(b)). By operating the lifting mechanism 86, the substrate transfer mechanism 87 moves up and down (in the Z direction) with the relative height position relationship between the contact portion 88a and the substrate B placed on the transport mechanism 81 remaining unchanged (see Fig. 18). That is, the lifting mechanism 86 relatively raises and lowers the position of the magazine S placed on the magazine transfer mechanism 92 of the magazine placement portion 91 with respect to the substrate transfer mechanism 87.

[0098] The magazine transfer mechanism 92 includes rollers, conveyors, etc. that move the magazine S in the accommodation direction (Y direction), and is controlled by the accommodation control unit 94. By operating the magazine transfer mechanism 92, the magazine S moves in the accommodation direction (arrow f2 in Fig. 20(b)).

[0099] Next, with reference to Figs. 17 to 19, the substrate accommodation process in which the substrate accommodation device Mt accommodates the substrate B in the magazine S will be described. In Fig. 17(a), the accommodation control unit 94 positions the transport mechanism 81 at the substrate transport height position, operates the conveyors of the loading mechanism 80 and the transport mechanism 81, and transports the substrate B carried in from the upstream device to the transport mechanism 81 (arrow e1, Fig. 18(a)). In Fig. 18(b), next, the accommodation control unit 94 operates the lifting mechanism 86 to raise the lifting member 85 and raise the transport mechanism 81 to the substrate transfer height position (arrow e2).

[0100] In Fig. 17(b), next, the accommodation control unit 94 operates the rotation mechanism 84 to rotate the transport mechanism 81 on which the substrate B is placed in the accommodation direction (arrow e3, Fig. 19(a)). In Fig. 19(b), next, the accommodation control unit 94 operates the pusher movement mechanism 89 to move the pusher 88 in the direction of the magazine S and push the upstream end of the substrate B by the contact portion 88a to move the substrate B to the accommodation position in the slot SL (arrow e4).

[0101] As described above, the substrate storage device Mt includes a lifting mechanism 86, a storage control unit 94 (control unit) that controls the lifting mechanism 86, a transfer mechanism 81 that conveys the substrate B received from the upstream to the downstream and moves up and down by the lifting mechanism 86, a magazine S having a plurality of slots SL, and a substrate transfer mechanism 87 that transfers the substrate B received from the upstream to any one of the plurality of slots SL of the magazine S, and is a storage device capable of storing a plurality of substrates B. The storage control unit 94 controls the lifting mechanism 86 so that the substrate B received from the upstream is stored in an empty slot SL among the plurality of slots SL of the magazine S. Then, the substrate transfer mechanism 87 transfers the substrate B received from the upstream to any one of the plurality of slots SL of the magazine S.

[0102] Note that the above-described substrate storage device Mt moves the transfer mechanism 81 and the substrate transfer mechanism 87 disposed above the lifting member 85 up and down by the lifting mechanism 86 to store the substrate B in the empty slot SL of the magazine S, but is not limited to this configuration. For example, the substrate storage device Mt may move the magazine S on which the magazine placement portion 91 is placed up and down, and store the substrate B in the empty slot SL by the transfer mechanism 81 and the substrate transfer mechanism 87 whose height positions are fixed.

[0103] The production system 1 including the working device Mw (soldering printing device M2, component mounting devices M5, M6) and the inspection device Mi (first inspection device M3, second inspection device M7) shown in FIG. 1 can use the substrate storage device Mt as a storage device capable of storing and lifting a plurality of substrates B provided downstream of the inspection device Mi. The storage receiving unit 95 (acquisition unit) of the substrate storage device Mt acquires the inspection result by the inspection device Mi, and the storage control unit 94 (control unit) controls the lifting mechanism 86, the rotation mechanism 84, and the substrate transfer mechanism 87 to store the defective substrate B in the empty slot SL based on the inspection result. Thereby, a production line L capable of selectively storing defective substrate B can be flexibly constructed.

[0104] Next, with reference to FIG. 20, a magazine receiving process in which the automated guided vehicle Vt receives the magazine S from the substrate storage device Mt (storage device) will be described. The automated guided vehicle Vt that exchanges the magazine S with the substrate storage device Mt is provided with a magazine moving mechanism 100 at the upper part, which is different from the automated guided vehicle V that is provided with a magazine placing mechanism 33 at the upper part and exchanges the magazine S with the substrate supply and storage device Ms. In addition, the transport storage unit, transport control unit, traveling mechanism, and transport wireless communication unit provided in the automated guided vehicle Vt are the same as those in the automated guided vehicle V, and detailed descriptions thereof are omitted.

[0105] In FIG. 20(a), when substrates B are stored in all the slots SL of the magazine S placed on the magazine placing portion 91 of the substrate storage device Mt, an empty automated guided vehicle Vt not carrying the magazine S approaches from the front of the substrate storage device Mt and moves to the front of the magazine placing portion 91 (arrow f1). In FIG. 20(b), next, the storage control unit 94 operates the magazine transfer mechanism 92, and the transport control unit operates the magazine moving mechanism 100 to move the magazine S placed on the magazine placing portion 91 to the automated guided vehicle Vt (arrow f2). When the magazine S moves to the automated guided vehicle Vt, the automated guided vehicle Vt transports the magazine S in which the substrates B are stored to a designated position (arrow f3).

[0106] The magazine delivery process of delivering the magazine S from the automated guided vehicle Vt to the substrate storage device Mt is performed in a procedure reverse to the above-described magazine receiving process. That is, the automated guided vehicle Vt carrying the magazine S moves to the front of the magazine placing portion 91, and the magazine S is moved from the automated guided vehicle Vt to the magazine placing portion 91 by the magazine moving mechanism 100 and the magazine transfer mechanism 92. Thus, the substrate storage device Mt (storage device) is provided with a magazine transfer mechanism 92 that exchanges the magazine S with the automated guided vehicle Vt. Then, the magazine S is transported by the automated guided vehicle Vt, and the magazine S is exchanged between the substrate storage device Mt and the automated guided vehicle Vt.

[0107] Thus, the substrate storage device Mt (storage device) includes a magazine transfer mechanism 92 that transfers the magazine S to and from an automated guided vehicle Vt that transports the magazine S. Note that the above-described substrate storage device Mt transfers the magazine S to and from the automated guided vehicle Vt stopped in front of the magazine placement unit 91, but is not limited to this configuration. For example, the magazine transfer mechanism 92 may move the magazine S in the transport direction (X direction), stop the automated guided vehicle Vt having a magazine movement mechanism 100 that also moves the magazine S in the transport direction, to the side of the magazine placement unit 91, and transfer the magazine S to and from it.

Industrial Applicability

[0108] The production system and storage device of the present invention have the effect of being able to flexibly construct a production line capable of selectively storing defective substrates, and are useful in the field of mounting components on substrates.

Explanation of Signs

[0109] 1 Production system 3 Management device 11, 81 Conveying mechanism 13, 86 Lifting mechanism 14 Magazine holding mechanism 15, 87 Substrate transfer mechanism 21 Supply control unit (control unit) 92 Magazine transfer mechanism 94 Storage control unit (control unit) 95 Storage receiving unit (acquisition unit) B, B1 Substrate M2 Solder printing device (working device) M5, M6 Component mounting device (working device) Mi Inspection device Ms Substrate supply and storage device (storage device) Mt Substrate storage device (storage device) Mw Working device S Magazine SL Slot V, Vt Automated guided vehicle

Claims

1. A production system comprising: a solder printing device that performs a solder printing operation to print solder on a board, or a component mounting device that performs a component mounting operation to mount components on a board on which solder has been printed; a storage device that is provided downstream of an inspection device that inspects inspection objects including the boards, and is capable of storing a plurality of the boards and is capable of lifting and lowering; and a management device that manages at least the storage device, The management device includes: an acquisition unit that acquires an inspection result by the inspection device; a transmission unit that creates a work command that specifies a work to be performed in the storage device based on the acquired inspection result and transmits the work command to the storage device; The storage device includes: A receiving unit that receives the work command; a lifting mechanism and a control unit that controls the lifting mechanism, The control unit controls the lifting mechanism based on the received work command, the receiving device includes a plurality of slots for receiving the plurality of substrates; The inspection device judges whether the object to be inspected is good or bad, The inspection result is a result of the pass / fail judgment, When the inspection device determines that the substrate is defective, the control unit controls the lifting mechanism so that the substrate is accommodated in an empty slot among the plurality of slots. When the inspection device determines that the substrate is good, the accommodation device does not accommodate the substrate, and transports the substrate downstream of the accommodation device; the storage device includes a transport mechanism that is lifted and lowered by the lift mechanism, When the quality determination by the inspection device is good, the control unit controls the lifting mechanism so that the substrate transported from the inspection device is transported downstream of the accommodation device by the transport mechanism; the transport mechanism is provided above the magazine in which the plurality of slots are formed, and moves up and down together with the magazine; Production system.

2. The accommodation device includes a substrate transfer mechanism that transfers the substrate removed from the inspection device to any one of the plurality of slots. The production system according to claim 1 .

3. The plurality of slots are formed in the magazine that is detachable from the storage device. The production system according to claim 1 or 2.

4. the magazine is transported by an automated guided vehicle, and the magazine is delivered between the storage device and the automated guided vehicle. The production system according to claim 3.

5. The storage device includes a magazine transfer mechanism that transfers the magazine between the storage device and the automatic guided vehicle. The production system according to claim 4.

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