Socket board, socket board assembly, device testing apparatus, and method for manufacturing socket board

Abstract

To provide a socket board capable of facilitating design.SOLUTION: A socket board 23 used for testing a DUT200 comprises: a first wiring board 30 including a plurality of pads 33 provided on a lower surface 312; a second wiring board 40 including a plurality of pads 42 provided on an upper surface 411; and an interposer 50 interposed between the lower surface 312 of the first wiring board 30 and the upper surface 411 of the second wiring board 40. The interposer 50 includes a plurality of particle dispersion portions 51 that are in contact with the pads 33 and the pads 42 to connect the pads 33 and the pads 42.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a socket board used for testing a DUT, a socket board assembly including the socket board, a device test apparatus, and a method for manufacturing the socket board.

Background Art

[0002] As an electronic component test apparatus for testing a DUT such as a semiconductor integrated circuit element, an apparatus including a DSA (Device Specific Adapter), a motherboard, and a test head is known (see, for example, Patent Document 1). The DSA includes a socket to which a DUT is pressed by a handler and a socket board on which the socket is mounted. The DSA is connected to the motherboard, and the motherboard is electrically connected to the test head.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The above-described DSA is designed according to the type of the DUT and is detachably mounted on the motherboard. When the type of the DUT is switched, it is replaced with a corresponding one for that type. That is, while the DSA corresponds to each individual type of the DUT, the motherboard is common to multiple types of DUTs. Further, the above-described socket board is composed of only one wiring board. Therefore, the design of the wiring board constituting the socket board needs to include both an individual design corresponding to each individual type of the DUT and a common design corresponding to the specifications of the motherboard. Thus, there is a problem that the design of the above-described socket board becomes complicated and the period required for the design of the socket board may become long.

[0005] The problem to be solved by the present invention is to provide a socket board capable of facilitating design, a socket board assembly and a device test apparatus including the socket board, and a manufacturing method of the socket board.

Means for Solving the Problem

[0006] [1]Aspect 1 of the present invention is a socket board used for testing a DUT, including a first wiring board provided with a plurality of first pads on a first main surface, a second wiring board provided with a plurality of second pads on a second main surface, and a relay member interposed between the first main surface of the first wiring board and the second main surface of the second wiring board, the relay member including a plurality of first contacts that contact the first pads and contact the second pads to connect the first pads and the second pads.

[0007] [2]Aspect 2 of the present invention is the socket board according to Aspect 1, wherein the socket board may include a spacer that defines a distance between the first wiring board and the second wiring board, and the spacer is in contact with the first main surface of the first wiring board and in contact with the second main surface of the second wiring board.

[0008] [3]Aspect 3 of the present invention is a socket board according to Aspect 2, wherein the first wiring board has a first region on the first main surface where the first pads are not arranged, the second wiring board has a second region on the second main surface where the second pads are not arranged, and the spacer is a socket board that is in contact with the first region and in contact with the second region.

[0009] [4]Aspect 4 of the present invention is a socket board according to Aspect 2 or 3, wherein the spacer may be a socket board having an opening through which the first contact passes.

[0010] [5]Aspect 5 of the present invention is a socket board according to any one of Aspects 2 to 4, wherein the spacer may be a socket board including one or more plates stacked between the first wiring board and the second wiring board.

[0011] [6]Aspect 6 of the present invention is a socket board according to Aspect 5, wherein the one or more plates may be a socket board including a holding plate for holding the relay member.

[0012] [7]Aspect 7 of the present invention is a socket board according to any one of Aspects 1 to 6, wherein the first contact is elastically deformable in the thickness direction of the socket board and is sandwiched between the first pad and the second pad in a state of elastic deformation.

[0013] [8]Aspect 8 of the present invention is a socket board according to any one of Aspects 1 to 7, wherein the relay member may be an interposer including the first contact made of an anisotropic conductive rubber that is electrically conductive in the thickness direction of the socket board.

[0014] [9]Aspect 9 of the present invention is a socket board according to any one of Aspects 1 to 8, wherein the first wiring board includes a plurality of third pads provided on a third main surface opposite to the first main surface, and a plurality of first conductive paths that individually connect the plurality of first pads and the plurality of third pads.

[0015]

[10] Aspect 10 of the present invention is a socket board according to Aspect 9, wherein the plurality of first pads and the plurality of third pads are individually connected via the plurality of first conductive paths such that one of the first pads corresponds to only one of the third pads.

[0016]

[11] Aspect 11 of the present invention is a socket board according to any one of Aspects 1 to 10, wherein the socket board includes a plurality of the first wiring boards and a plurality of the relay members, and the plurality of first wiring boards are individually stacked on a single second wiring board via the plurality of relay members.

[0017]

[12] Aspect 12 of the present invention is a socket board according to any one of Aspects 1 to 11, wherein the first wiring board has a third main surface opposite to the first main surface, and the third main surface is capable of mounting a socket against which the DUT is pressed during the test of the DUT.

[0018]

[13] Aspect 13 of the present invention is a socket board assembly used for testing a DUT, including a socket board according to any one of Aspects 1 to 12, and a socket mounted on the socket board against which the DUT is pressed during the test of the DUT.

[0019]

[14] Aspect 14 of the present invention is, in the socket board assembly of Aspect 13, wherein the first wiring board includes a plurality of third pads provided on a third main surface on which the socket is mounted, the socket includes a second contact that contacts a terminal of the DUT during testing of the DUT, and the second contact may be a socket board assembly that is in contact with the third pad.

[0020]

[15] Aspect 15 of the present invention is, in the socket board assembly of Aspect 13 or 14, wherein the socket board assembly may be a socket board assembly including a fixing mechanism that fixes the first wiring board and the second wiring board with the relay member interposed therebetween between the first wiring board and the second wiring board.

[0021]

[16] Aspect 16 of the present invention is, in the socket board assembly of Aspect 15, wherein the socket board includes a spacer that defines a distance between the first wiring board and the second wiring board, and the fixing mechanism may be a socket board assembly that fixes the first wiring board and the second wiring board with the spacer interposed therebetween between the first wiring board and the second wiring board.

[0022]

[17] Aspect 17 of the present invention is, in the socket board assembly of Aspect 16, wherein the spacer includes one or more plates stacked between the first wiring board and the second wiring board, and the one or more plates may include a holding plate that holds the relay member, which is a socket board assembly.

[0023]

[18] Aspect 18 of the present invention is, in the socket board assembly of any one of Aspects 13 to 17, wherein the socket board assembly may be a socket board assembly including a frame on which the second wiring board is stacked, and a fixing member that fixes the first wiring board and the second wiring board to the frame.

[0024]

[19] Aspect 19 of the present invention is that in any one of the socket board assemblies of Aspects 13 to 18, the socket board assembly may be a socket board assembly that is detachably attached to a mounted body provided in a device test apparatus.

[0025]

[20] Aspect 20 of the present invention is that in any one of the socket board assemblies of Aspects 13 to 19, the socket board assembly may be a socket board assembly provided with a first connector mounted on a fourth main surface on the opposite side of the second main surface in the second wiring board.

[0026]

[21] Aspect 21 of the present invention is that in the socket board assembly of Aspect 20, the socket board assembly may be a socket board assembly provided with a second conductive path connecting the second pad and the first connector.

[0027]

[22] Aspect 22 of the present invention is that in the socket board assembly of Aspect 20 or 21, the plurality of first connectors may be a socket board assembly that can be fitted to a second connector provided in a mounted body provided in a device test apparatus.

[0028]

[23] Aspect 23 of the present invention is a device test apparatus for testing a DUT, which is a device test apparatus provided with a tester including any one of the socket board assemblies of Aspects 13 to 22.

[0029]

[24] Aspect 24 of the present invention is that in the device test apparatus of Aspect 23, the tester includes a tester main body that executes a test of the DUT and a relay device electrically connected to the tester main body, and the socket board assembly may be a device test apparatus that is detachably attached to the relay device.

[0030]

[25] Aspect 25 of the present invention is that in the device test apparatus of Aspect 24, the tester includes a test head electrically connected to the tester main body, and the relay device may be a motherboard mounted on the test head.

[0031]

[26] Aspect 26 of the present invention may be a device test apparatus according to any one of Aspects 23 to 25, wherein the device test apparatus includes a handling device that moves the DUT and presses the DUT against the socket.

[0032]

[27] Aspect 27 of the present invention is a method for manufacturing a socket board according to any one of Aspects 1 to 12, the method including: a first step of preparing the first wiring board, the second wiring board, and the relay member; and a second step of interposing the relay member between the first wiring board and the second wiring board.

[0033]

[28] In the method for manufacturing a socket board according to Aspect 27 of the present invention, the socket board includes a spacer that defines a distance between the first wiring board and the second wiring board, and the method for manufacturing the socket board includes: a third step of measuring a first thickness of the first wiring board; and a fourth step of selecting, from a group of plates composed of a plurality of plates, one or more plates that form the spacer based on the first thickness, and the second step may include interposing the one or more plates selected in the fourth step between the first wiring board and the second wiring board.

[0034]

[29] In the method for manufacturing a socket board according to Aspect 28 of the present invention, the third step may include measuring a second thickness of the second wiring board, and the fourth step may include selecting the one or more plates from the group of plates based on the first thickness and the second thickness.

[0035]

[30] Aspect 30 of the present invention is a method for manufacturing a socket board according to aspect 28 or 29, wherein the method for manufacturing the socket board includes a fifth step of preparing the group of plates including plates of different thicknesses, and the fourth step includes selecting the one or more plates for forming the spacer from the group of plates prepared in the fifth step. The method for manufacturing a socket board may be such that

Advantages of the Invention

[0036] According to the present invention, since the socket board includes the first wiring board and the second wiring board, individual designs corresponding to individual varieties of the DUT can be performed on the first wiring board, and a common design corresponding to the specifications of the motherboard can be performed on the second wiring board. Thus, the design of the socket board can be facilitated.

Brief Description of the Drawings

[0037]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0038] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0039] Fig. 1 is a schematic cross-sectional view showing the overall configuration of a device test apparatus 1 in the embodiment of the present invention, Fig. 2 is an exploded view showing a DSA 20 and a mother board 70 in the present embodiment, and is a view corresponding to part II of Fig. 1.

[0040] The device test apparatus 1 in the present embodiment is an apparatus for testing a device under test (hereinafter also simply referred to as "DUT") 200. Although not particularly limited, specific examples of the DUT 200 to be tested include, for example, memory devices, logic devices, or semiconductor devices such as SoC (System on chip). The device test apparatus 1 tests the electrical characteristics of this semiconductor device 200.

[0041] As shown in Fig. 1, this device test apparatus 1 includes a tester 10 that executes a test on the DUT 200, and a handler 100 that handles the DUT 200 and presses the DUT 200 against the socket 21. The tester 10 includes a DSA 20, a mother board 70, a test head 80, and a main frame 90. The configuration of the tester 10 is not particularly limited as long as it includes a socket board 23 described later. The DSA 20 corresponds to an example of the "socket assembly" in the aspect of the present invention. Further, the mother board 70 corresponds to an example of the "mounted object" in the aspect of the present invention and also corresponds to an example of the "relay device" in the aspect of the present invention.

[0042] As shown in FIGS. 1 and 2, the DSA (Device Specific Adapter) 20 includes a socket 21 to which the DUT 200 is electrically connected during the test of the DUT 200. This DSA 20 is electrically connected to the test head 80 via the motherboard 70. This DSA 20 is detachably mounted on the motherboard 70. The DSA 20 is designed according to the type of the DUT 200 and is replaced with a corresponding one when the type of the DUT 200 is switched. Note that the number of DSA 20s mounted on the motherboard 70 is not particularly limited, and a plurality of DSA 20s may be mounted on the motherboard 70. The configuration of this DSA 20 will be described in detail later.

[0043] The motherboard 70 is a relay device that electrically connects the DSA 20 and the test head 80. This motherboard 70 includes a housing 71, a plurality of connectors 72, and a plurality of cables 73. The connector 72 is connected to one end (the upper end in FIG. 2) of the cable 73. This connector 72 is detachably fitted to a connector 24 (described later) of the DSA 20. This connector 72 is supported at the upper part of the housing 71 so as to correspond to the connector 24 of the DSA 20. When the DSA 20 is mounted on the motherboard 70, the connector 24 of the DSA 20 and the connector 72 of the motherboard 70 are fitted together.

[0044] As shown in FIG. 1, the test head 80 houses a test module (pin electronics card) 81 for testing the DUT 200 inside. This test module 81 is a wiring board on which electronic components such as test devices used for testing the DUT 200 are mounted. Specific examples of such test electronic components include, for example, a high-frequency circuit (e.g., an ASIC (Application Specific Integrated Circuit)) incorporating an LSI or the like for handling test signals, and a power supply circuit incorporating a switching regulator or the like for supplying test power to the DUT 200.

[0045] This test module 81 is electrically connected to the cable 73 via a connector (not shown) etc. connected to the other end of the cable 73 of the motherboard 70. This test module 81 tests the DUT 200 by transmitting and receiving test signals to and from the DUT 200 via the DSA 20 and the motherboard 70. The test head 80 is connected to the mainframe 90 via a cable 82.

[0046] The mainframe (tester body) 90 is, for example, a computer that executes a program, and communicates with each test module 81 in the test head 80 according to the program to control each test module 81. Each test module 81 generates a test signal in response to an instruction from the mainframe 90 and outputs the test signal to the DUT 200.

[0047] The handler 100, although not particularly shown, includes, for example, a transfer device, a pressing device, and a sorting device. The transfer device transfers the test tray containing the DUT 200 above the DSA 20. Then, the pressing device presses the DUT 200 housed in the test tray against the socket 21 of the DSA 20. The sorting device sorts the tested DUT 200 according to the test results while taking it out of the test tray.

[0048] Also, this handler 100 includes a chamber 101 as a temperature adjustment device that applies high-temperature or low-temperature thermal stress to the DUT 200. This chamber 101 is composed of a thermostatic bath capable of maintaining the temperature in the tank at a desired temperature. Therefore, this device test apparatus 1 can test the DUT 200 while applying thermal stress to the DUT 200, that is, it can perform a so-called high-temperature test and a low-temperature test.

[0049] The above-described DSA 20 has entered the chamber 101 through the opening 102 formed in the handler 100, and the socket 21 of the DSA 20 is disposed within the chamber 101. The DUT 200 is pressed against the socket 21 of the DSA 20 by the pressing device of the handler 100, whereby the DUT 200 and the socket 21 are electrically connected.

[0050] Note that the handler 100 may be of a type that includes a contact arm that sucks and holds the DUT 200 and moves it without using a test tray, and presses the DUT 200 with the contact arm. In this case, the handler 100 may include, as a temperature adjustment device, a heater or a heat sink provided at the tip of the contact arm instead of the chamber 101. Alternatively, the handler 100 may include, as a temperature adjustment device, a heater or a heat sink provided at the tip of the contact arm in addition to the chamber 101.

[0051] Next, the configuration of the above-described DSA 20 will be described in detail with reference to FIGS. 3 to 6. FIG. 3 is a cross-sectional view of the DSA 20 in the present embodiment, and is a cross-sectional view when the DSA is cut along line III-III of FIG. 2. FIG. 4 is an exploded cross-sectional view of the DSA 20 in the present embodiment. FIG. 5 is a bottom view of the first wiring board 30 in the present embodiment, and FIG. 6 is a plan view of the second wiring board 40 in the present embodiment. FIG. 7(a) is a cross-sectional view of the socket board in the present embodiment, and FIGS. 7(b) to 8(c) are cross-sectional views showing modified examples of the spacer in the present embodiment.

[0052] As shown in FIGS. 3 and 4, the DSA 20 includes a socket 21, a socket guide 22, a socket board 23, a connector 24, and a support frame 25.

[0053] Socket 21 is composed of an anisotropic conductive rubber sheet. Specifically, this socket 21 includes a plurality of particle dispersion portions 211 and an insulating portion 212 that holds the particle dispersion portions 211. This socket 21 is fixed to the socket board 23 by sandwiching the socket 21 between the socket guide 22 and the socket board 23. Note that the socket 21 may be fixed to the socket board 23 with bolts or the like.

[0054] Each particle dispersion portion 211 is formed by dispersing conductive particles in an insulator. This particle dispersion portion 211 has conductivity only in the thickness direction of the particle dispersion portion 211 (the pressing direction of the DUT 200 against the socket 21) (the Z direction in the figure). Specifically, in this particle dispersion portion 211, adjacent conductive particles in the thickness direction are in contact with each other, enabling conduction only in the thickness direction. The plurality of particle dispersion portions 211 are arranged to correspond to the terminals 201 of the DUT 200. When the DUT 200 is pressed against the socket 21 by the handler 100 during the test of the DUT 200, this particle dispersion portion 211 conducts in the thickness direction, and the DUT 200 and the socket 21 are electrically connected. This particle dispersion portion 211 corresponds to an example of the "second contact" in the aspect of the present invention.

[0055] The insulating portion 212 is composed only of an insulator and has a sheet-like shape. The plurality of particle dispersion portions 211 are arranged to correspond to the terminals 201 of the DUT 200. The insulating portion 212 holds the plurality of particle dispersion portions 211 arranged to correspond to the terminals 201 of the DUT 200.

[0056] Specific examples of the conductive particles of the particle dispersion portion 211 include, for example, iron, copper, zinc, chromium, nickel, silver, aluminum, or alloys thereof. Specific examples of the insulators of the particle dispersion portion 211 and the insulating portion 212 include, for example, insulating materials having elasticity such as silicone rubber, urethane rubber, and natural rubber.

[0057] Note that the socket 21 is not limited to the above-described anisotropic conductive rubber sheet. As a contact that contacts the terminal 201 of the DUT 200, for example, a pogo pin, a vertical probe pin, a cantilever-type probe pin, a bump provided on a membrane, or a contactor manufactured using MEMS technology may be used as the socket 21.

[0058] The socket guide 22 is a member for positioning the DUT 200 with respect to the socket 21. For example, when the pressing device of the handler 100 approaches the socket 21 with the DUT 200 housed in the test tray, the guide pins provided in the pressing device are inserted into the guide holes of the test tray and the socket guide 22, respectively, so that the DUT 200 is positioned with respect to the socket 21. This socket guide 22 is made of, for example, stainless steel or the like, and is fixed to the support frame 25 by bolts or the like inserted into the through holes of the socket board 23.

[0059] The socket board 23 includes a plurality (two in this embodiment) of first wiring boards 30, a second wiring board 40, a plurality (two in this embodiment) of interposers 50, and a plurality (two in this embodiment) of spacers 60. The interposer 50 corresponds to an example of the "relay member" in the aspect of the present invention.

[0060] The first wiring board 30 is a part corresponding to each individual variety of the DUT, while the second wiring board 40 is a part corresponding to the specifications of the mother board common to multiple varieties of DUTs. That is, the first wiring board 30 is a variety-corresponding part that varies according to the variety of the DUT, and the second wiring board 40 is a common part common to different varieties of DUTs.

[0061] The first wiring board 30 is a rigid wiring board on which the above-described socket 21 and socket guide 22 are mounted on its upper surface 311. In FIGS. 3 and 4, only one socket 21 is mounted on a single first wiring board 30, but a plurality of sockets 21 may be mounted on a single first wiring board 30. This first wiring board 30 includes an insulating substrate 31, a plurality of pads 32, a plurality of pads 33, and a plurality of conductive paths 34.

[0062] The insulating substrate 31 is made of a material having electrical insulation properties such as glass epoxy resin, for example. The plurality of pads 32 are provided on the upper surface 311 of the insulating substrate 31 so as to correspond to the arrangement of the plurality of particle dispersion portions 211 of the socket 21. On the other hand, the plurality of pads 33 are provided on the lower surface 312 of the insulating substrate 31 so as to correspond to the arrangement of the plurality of particle dispersion portions 511 (described later) of the interposer 50. The pitch between the lower pads 33 is wider than the pitch between the upper pads 32.

[0063] The plurality of conductive paths 34 electrically connect the upper pads 32 and the lower pads 33. This conductive path 34 is composed of a wiring pattern formed on the insulating substrate 31, through holes, and the like. The above-described pads 32, 33, and conductive path 34 are made of a conductive material, and specifically, are made of a metal material such as copper.

[0064] In this embodiment, the plurality of pads 32 and the plurality of pads 33 are individually connected via a plurality of conductive paths 34 such that one pad 32 corresponds to only one pad 33. Specifically, one pad 32 among the plurality of pads 32 is connected to only one pad 33 among the plurality of pads 33 respectively. In other words, one upper pad 32 is not connected to the plurality of lower pads 33, one lower pad 33 is not connected to the plurality of upper pads 32, and the conductive path 34 does not branch either. That is, the connection relationship between the pads 32 and 33 via the conductive path 34 is a "one-to-one" relationship in which one pad 32 and one pad 33 are connected. Thus, in this embodiment, since the circuit configuration of the first wiring board 30 corresponding to each variety of the DUT is simplified, the design of the first wiring board 30 can be facilitated.

[0065] The lower pads 33 of this first wiring board 30 correspond to an example of the "first pad" in the aspect of the present invention, and the upper pads 32 correspond to an example of the "third pad" in the aspect of the present invention. Also, the lower surface 312 of the insulating substrate 31 corresponds to an example of the "first main surface" in the aspect of the present invention, and the upper surface 311 of the insulating substrate 31 corresponds to an example of the "third main surface" in the aspect of the present invention. Further, the conductive path 34 corresponds to an example of the "first conductive path" in the aspect of the present invention.

[0066] The second wiring board 40 is a rigid wiring board on which the first wiring board 30 is stacked via the interposer 50 and the spacer 60. This second wiring board 40 includes an insulating substrate 41, a plurality of pads 42, and a plurality of conductive paths 44. In this embodiment, two first wiring boards 30 are stacked on a single second wiring board 40 (the same second wiring board 40) via two interposers 50 and two spacers 60 respectively. That is, each first wiring board 30 is individually stacked on the second wiring board 40 via one interposer 50 and one spacer 60. Thereby, the total thickness t of the socket board 23 a (see Fig. 7(a)) with respect to the thickness t of the second wiring board 40 c(See FIG. 7(a)) The influence of variations can be reduced.

[0067] Note that the number of the first wiring boards 30 stacked on a single second wiring board 40 is not particularly limited as described above. Also, the number of the interposers 50 stacked on a single second wiring board 40 is not particularly limited as described above, and can be set according to, for example, the number of the first wiring boards 30. Similarly, the number of the spacers 60 stacked on a single second wiring board 40 is not particularly limited as described above, and can be set according to, for example, the number of the interposers 50.

[0068] The insulating substrate 41 is made of a material having electrical insulation properties such as glass epoxy resin, for example. The pads 42 are provided on the upper surface 411 of the insulating substrate 41 so as to correspond to the arrangement of a plurality of particle dispersion portions 511 (described later) of the interposer 50. On the other hand, a plurality of connectors 24 are mounted on the lower surface 412 of the insulating substrate 41 of the second wiring board 40. As described above, a connector 72 connected to one end (the upper end in FIG. 2) of the cable 73 of the motherboard 70 is fitted to each connector 24. The connector 24 corresponds to an example of the "first connector" in the embodiment of the present invention, and the connector 72 corresponds to an example of the "second connector" in the embodiment of the present invention.

[0069] The plurality of conductive paths 44 electrically connect the pads 42 and the connectors 24. The conductive paths 44 are composed of a wiring pattern formed on the insulating substrate 41, through holes, and the like. The pads 42 and the conductive paths 44 described above are made of a conductive material, and specifically, are made of a metal material such as copper.

[0070] In this embodiment, the second wiring board 40 has a complex circuit configuration having branchings of the conductive paths 44, daisy chain connections, and the like. The second wiring board 40 constitutes a common circuit corresponding to the specifications of the motherboard common to different varieties of DUTs.

[0071] The pad 42 of this second wiring board 40 corresponds to an example of the "second pad" in the embodiments of the present invention. Also, the upper surface 411 of the insulating substrate 41 corresponds to an example of the "second main surface" in the embodiments of the present invention, and the lower surface 412 of the insulating substrate 41 corresponds to an example of the "fourth main surface" in the embodiments of the present invention. Further, the conductive path 44 corresponds to an example of the "second conductive path" in the embodiments of the present invention.

[0072] The interposer 50 is composed of an anisotropic conductive rubber sheet. Specifically, this interposer 50 includes a plurality of particle dispersion portions 51 and an insulating portion 52 that holds the particle dispersion portions 51.

[0073] Each particle dispersion portion 51 is formed by dispersing conductive particles in an insulator. This particle dispersion portion 51 has conductivity only in the thickness direction (the Z direction in the figure) of the particle dispersion portion 51. Specifically, in this particle dispersion portion 51, adjacent conductive particles in the thickness direction are in contact with each other, enabling conduction only in the thickness direction. This particle dispersion portion 51 corresponds to an example of the "first contact" in the embodiments of the present invention.

[0074] The insulating portion 52 is composed only of an insulator and has a sheet-like shape. The plurality of particle dispersion portions 51 described above are arranged so as to correspond to the pads 33 and 42 of the first and second wiring boards 30 and 40. The insulating portion 52 holds the particle dispersion portions 51 arranged so as to correspond to the pads 33 and 42 of the first and second wiring boards 30 and 40.

[0075] Specific examples of the conductive particles of the particle dispersion portion 51 can be the same as those exemplified as specific examples of the conductive particles of the particle dispersion portion 211 described above. Also, specific examples of the insulators of the particle dispersion portion 51 and the insulating portion 52 can be the same as those exemplified as specific examples of the insulators of the particle dispersion portion 211 and the insulating portion 212 described above.

[0076] This interposer 50 is interposed between the first wiring board 30 and the second wiring board 40. The interposer 50 is stacked on the second wiring board 40, and the first wiring board 30 is stacked on the interposer 50. Specifically, this interposer 50 is interposed between the lower surface 312 of the first wiring board 30 and the upper surface 411 of the second wiring board 40 such that a plurality of particle dispersion portions 51 are in contact with the pads 33 and 42 of the first and second wiring boards 30 and 40, respectively. Each particle dispersion portion 51 is sandwiched between the pads 33 and 42 in a compressed state in the thickness direction (Z direction in the figure) of the socket board 23, and the pads 33 and 42 are electrically connected by conduction in the thickness direction of the particle dispersion portion 51.

[0077] This interposer 50 is held by a holding plate 62 (described later) of the socket board 23. Specifically, the inner peripheral portion of the holding plate 62 is embedded in the outer peripheral portion of the insulating portion 52, so that the interposer 50 is held by the holding plate 62, and the interposer 50 and the holding plate 62 are integrated. As will be described later, since this holding plate 62 is fixed to the support frame 25 by bolts 26 together with the wiring boards 30 and 40 and the adjustment plate 61, by holding the interposer 50 with the holding plate 62, the interposer 50 can be positioned with high accuracy and firmly fixed.

[0078] Note that the interposer 50 is not limited to the above-described anisotropic conductive rubber sheet as long as it includes a contact that can be elastically deformed in the thickness direction (Z direction in the figure) of the socket board 23 as a contact for electrically connecting the pads 33 and 42 of the wiring boards 30 and 40. Although not particularly limited, as the contact, for example, a pogo pin, a vertical probe pin, a cantilever-type probe pin, or one provided with a contact made using MEMS technology may be used as the interposer 50.

[0079] The spacer 60 of this embodiment is interposed between the first wiring board 30 and the second wiring board 40. The upper surface 601 of this spacer 60 is in contact with the lower surface 312 of the first wiring board 30, and the lower surface 602 of the spacer 60 is in contact with the upper surface 411 of the second wiring board 40, defining the interval between the first wiring board 30 and the second wiring board 40.

[0080] As shown in FIGS. 3 to 6, the spacer 60 is in contact with the first region 312a of the first wiring board 30 and is also in contact with the second region 411a of the second wiring board 40. The interposer 50 is disposed in the opening 603 of the spacer 60, and the particle dispersion portion 51 of the interposer 50 passes through the opening 603 of the spacer 60. Note that the above-mentioned first region 312a is a region where no pad 33 is disposed on the lower surface 312 of the first wiring board 30. Also, the above-mentioned second region 411a is a region where no pad 42 is disposed on the upper surface 411 of the second wiring board 40.

[0081] This spacer 60 includes a plurality of plates 61 and 62. In this embodiment, this spacer 60 includes two adjustment plates 61 and one holding plate 62. The adjustment plate 61 is a frame-shaped member having an opening 611, which is a so-called shim plate. Also, the holding plate 62 is also a frame-shaped member having an opening 621. The adjustment plate 61 and the holding plate 62 are made of a metal material such as stainless steel, for example. The interposer 50 is positioned in the openings 611 and 621 of the adjustment plate 61 and the holding plate 62, and the particle dispersion portion 51 of the interposer 50 passes through the openings 611 and 621. As described above, the interposer 50 is held by the holding plate 62.

[0082] The thickness of the socket board 23 is a predetermined value t a The thickness of this spacer 60 is adjusted so as to be. For example, as shown in FIG. 7(a), when the thickness of the first wiring board 30 is t b1 In this case, two adjustment plates 61 having a thickness of t e1 And two adjustment plates 61 having a thickness of t fBy overlapping with one holding plate 62, the thickness of the spacer 60 is set to t d1 (t d1 =2×t e1 +t f ), and the thickness of the socket board 23 is set to t a (t a =t b1 +t d1 +t c ). Here, t c is the thickness of the second wiring board 40.

[0083] On the other hand, as shown in Fig. 7(b), when the thickness of the first wiring board 30 is t b1 thicker than the above t b2 (t b2 >t b1 ), by using an adjustment plate 61B with a thickness t e2 thinner than the above adjustment plate 61 (t e2 <t e1 ), the thickness of the spacer 60 is set to t d1 thinner than t d2 (t d2 =2×t e2 +t f <t d1 ), and the thickness of the socket board 23 is set to t a (t a =t b2 +t d2 +t c ). Here, the thickness t b2 of the above first wiring board 30 is, for example, the thickness of the first wiring board 30 at the upper limit of the tolerance.

[0084] On the other hand, as shown in Fig. 7(c), when the thickness of the first wiring board 30 is t b1 thinner than the above t b3 (t b3 <t b1 ), by using an adjustment plate 61C with a thickness t e3 thicker than the above adjustment plate 61 (t e3 >t e1 ), the thickness of the spacer 60 is set to t d1 thicker than t d3 (t d3 =2×te3 +t f >td 1) 、 set the thickness of the socket board 23 to t a (t a = t b3 +t d3 +t c ). Note that the thickness t b3 of the above-mentioned first wiring board 30 is, for example, the thickness of the first wiring board 30 at the lower limit of the tolerance. The interposer 50 has a thickness corresponding to the first wiring board 30 having this thinnest thickness t b3 , and it is possible to cope with the entire range of the thickness tolerance of the first wiring board 30 with only one type of interposer 50.

[0085] Here, when the device test apparatus includes a plurality of socket boards, in order to press all the DUTs against the sockets with the same pressing force, it is necessary to align the heights of the upper surfaces of the plurality of socket boards. For this reason, high accuracy (that is, narrow tolerance) is required for the thickness of the socket board, and the yield of the socket board may decrease. On the other hand, in the present embodiment, as described above, by adjusting the thickness of the spacer 60, the total thickness of the socket board 23 can be set to a predetermined value t a , so high accuracy is not required for the thickness of the first wiring board 30, and the yield of the first wiring board 30 can be improved.

[0086] Note that the number of plates constituting the spacer 60 is not particularly limited as described above. For example, as shown in FIG. 8(a), the spacer 60 may be composed of four adjustment plates 61B and one holding plate 62. Incidentally, this adjustment plate 61B is the same as the adjustment plate 61B shown in FIG. 7(b), and the thickness t e2 of this adjustment plate 61B is half of the thickness t e3 of the adjustment plate 61C shown in FIG. 7(c) (t e2 = 1 / 2 × t e3 ). Therefore, in the example shown in FIG. 8(a), the thickness t d4 of the spacer 60 is the same as the t d3 shown in FIG. 7(c) (t d4 = 4 × te2 +t f =t d3 )。By doing this, it is possible to achieve the commonization of the adjustment plates.

[0087] Alternatively, as shown in FIG. 8(b), the spacer 60 may be composed of only one adjustment plate 61D. Also, as shown in the same figure, the spacer 60 may not include the holding plate 62. When the spacer 60 includes the holding plate 62, it is preferable that the spacer 60 includes a plurality of plates. Alternatively, as shown in FIG. 8(c), the spacer 60 may be composed of two adjustment plates 61E and 61F having different thicknesses. Although not particularly shown, the spacer 60 including the holding plate 62 may include a plurality of adjustment plates having different thicknesses from each other.

[0088] As shown in FIGS. 3 and 4, the support frame 25 is a frame-shaped member on which the second wiring board 40 is overlaid. The connector 24 mounted on the lower surface 412 of the second wiring board 40 is exposed downward from the opening 251 of the support frame 25. This support frame 25 corresponds to an example of the "frame" in the aspect of the present invention.

[0089] Also, the above-described socket board 23 is fixed to this support frame 25 by bolts 26. Specifically, through holes 313, 413, 612, and 622 are respectively formed in the wiring boards 30, 40 and the plates 61, 62, and a fixing hole 252 having a thread is formed in the support frame 25. Then, the bolts 26 inserted into the through holes 313, 413, 612, and 622 are screwed into the fixing hole 252, so that the wiring boards 30, 40, the interposer 50, and the spacer 60 are fixed. This bolt 26 corresponds to an example of the "fixing member" in the aspect of the present invention.

[0090] Note that instead of the support frame 25, the wiring boards 30 and 40, the interposer 50, and the spacer 60 may be fixed by screwing the bolt 26 into the nut disposed on the lower surface 412 side of the second wiring board 40. Alternatively, instead of the bolt 26, the wiring boards 30 and 40, the interposer 50, and the spacer 60 may be fixed by mechanical means such as a clamp.

[0091] Next, the manufacturing method of the socket board 23 and the DSA 20 described above will be described with reference to FIG. 9. FIG. 9 is a flowchart showing the manufacturing method of the socket board 23 and the DSA 20 in the present embodiment.

[0092] First, the socket board 23 is manufactured in step S10 of FIG. 9. Specifically, in step S11 of FIG. 9, the first wiring board 30, the second wiring board 40, and the interposer 50 are prepared. Next, in step S12 of FIG. 9, the thickness of the first wiring board 30 is measured using a micrometer or the like.

[0093] Next, in step S13 of FIG. 9, based on the measurement result (the thickness of the first wiring board 30) in step S12 above, one or more plates having a thickness such that the total thickness of the socket board 23 is t a are selected from the plate group PG.

[0094] This plate group PG includes a plurality of types of plates having different thicknesses. For example, the adjustment plates 61 and 61B to 61E described above are included. Further, although the holding plate 62 described above is actually integrated with the interposer 50, conceptually it is included in this plate group PG. All the plates included in this plate group PG are held by the manufacturer as inventory before the start of the manufacture of the socket board 23 and the DSA 20. That is, this plate group PG is prepared in advance before the start of the manufacture of the socket board 23 and the DSA 20.

[0095] For example, if the thickness of the first wiring board 30 is t b1In the case (the case of FIG. 7(a)), as the plates constituting the spacer 60, two adjustment plates 61 and one holding plate 62 are selected from the plate group PG. On the other hand, when the thickness of the first wiring board 30 is t b2 In the case (the case of FIG. 7(b)), as the plates constituting the spacer 60, two adjustment plates 61B and one holding plate 62 are selected from the plate group PG. Also, when the thickness of the first wiring board 30 is t b3 In the case (the case of FIG. 7(c)), as the plates constituting the spacer 60, two adjustment plates 61C and one holding plate 62 are selected from the plate group PG.

[0096] Note that in step S12 of FIG. 9, in addition to the thickness of the first wiring board 30, the thickness of the second wiring board 40 may be measured. In this case, in step S13 of FIG. 9, based on the thickness of the first wiring board 30 and the thickness of the second wiring board 40, one or more plates having a thickness such that the total thickness of the socket board 23 is t a are selected from the plate group PG.

[0097] Next, in step S14 of FIG. 9, with the interposer 50 and the spacer 60 sandwiched between the first and second wiring boards 30 and 40, the first and second wiring boards 30 and 40 are overlapped. Thereby, the socket board 23 is manufactured.

[0098] Next, in step S20 of FIG. 9, the above-described socket board 23 is fixed to the support frame 25. Specifically, the bolt 26 is inserted into the through holes 313, 413, 612, and 622 of the wiring boards 30, 40, and the spacer 60 and screwed into the fixing hole 252 of the support frame 25 to fix the socket board 23 to the support frame 25. Also, in this step S20, the connector 24 is mounted on the lower surface 412 of the second wiring board 40.

[0099] Next, in step S30 of FIG. 9, the socket 21 and the socket guide 22 are fixed to the support frame 25, and thus the DSA 20 is completed.

[0100] As described above, in this embodiment, since the socket board 23 includes the first wiring board 30 and the second wiring board 40, an individual design corresponding to each type of the DUT 200 can be performed on the first wiring board 30, and a common design corresponding to the specifications of the motherboard 70 can be performed on the second wiring board 40. Thus, the design of the socket board 23 can be facilitated.

[0101] Here, since the second wiring board 40 has a complicated circuit configuration to correspond to the specifications of the motherboard 70, its design and manufacture may take a relatively long time. However, since this second wiring board 40 is a common part and there is only one type of the second wiring board 40, this second wiring board 40 can be stocked. Further, the interposer 50 can sufficiently absorb the entire range of tolerances of the first wiring board 30 by elastic deformation in the thickness direction of the socket board 23. Therefore, since there is also only one type of this interposer 50, this interposer 50 can be stocked.

[0102] On the other hand, since the first wiring board 30 is a type-corresponding part corresponding to each type of the DUT, it may be difficult to stock this first wiring board 30. In this embodiment, since the circuit configuration of this first wiring board 30 is simplified, the time required for the design and manufacture of the first wiring board 30 is shortened. Therefore, in this embodiment, it is possible to provide the DSA 20 with a short delivery time.

[0103] Further, in this embodiment, since the socket board 23 includes the two wiring boards 30 and 40 as described above, the distance between the two wiring boards 30 and 40 can be adjusted by the thickness of the spacer 60. Therefore, the total thickness of the socket board 23 can be set to the target value t a by the thickness of the spacer 60, so high accuracy is not required for the thickness of the first wiring board 30. For this reason, the yield of the first wiring board 30 can be improved, the time required for the design and manufacture of the first wiring board 30 can be further shortened, and the cost of the socket board 23 can be reduced.

[0104] Note that the embodiments described above are described to facilitate the understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

Explanation of Reference Numerals

[0105] 1... Device test apparatus 10... Tester 20... DSA 21... Socket 211... Particle dispersion part 212... Insulating part 23... Socket board 30... First wiring board 311... Upper surface 312... Lower surface 32, 33... Pad 34... Conductive path 40... Second wiring board 411... Upper surface 412... Lower surface 42... Pad 44... Conductive path 50... Interposer 51... Particle dispersion part 52... Insulating part 60... Spacer 61, 61B to 61E... Adjustment plate 62... Holding plate 24... Connector 25... Support frame 26... Bolt 70... Motherboard 72... Connector 80... Test head 90... Main frame 100... Handler 200... DUT

Claims

1. A socket board used for testing a DUT, comprising: a first wiring board provided with a plurality of first pads on a first main surface; a second wiring board provided with a plurality of second pads on a second main surface; a relay member interposed between the first main surface of the first wiring board and the second main surface of the second wiring board; The relay member is in contact with the first pad and in contact with the second pad, and the socket board includes a plurality of first contacts connecting the first pad and the second pad.

2. The socket board according to claim 1, wherein the socket board includes a spacer that defines a distance between the first wiring board and the second wiring board; the spacer is in contact with the first main surface of the first wiring board and in contact with the second main surface of the second wiring board.

3. The socket board according to claim 2, wherein the spacer includes one or more plates stacked between the first wiring board and the second wiring board.

4. The socket board according to claim 3, wherein the one or more plates include a holding plate that holds the relay member.

5. The socket board according to claim 1, wherein the first contact is elastically deformable in the thickness direction of the socket board and is sandwiched between the first pad and the second pad in an elastically deformed state.

6. The socket board according to claim 1, wherein the relay member is an interposer including the first contact made of an anisotropic conductive rubber that is conductive in the thickness direction of the socket board.

7. The socket board according to claim 1, wherein the first wiring board includes a plurality of third pads provided on a third main surface opposite to the first main surface; and a plurality of first conductive paths that individually connect the plurality of first pads and the plurality of third pads.

8. The socket board according to claim 1, wherein the socket board includes a plurality of the first wiring boards; and a plurality of the relay members; the plurality of first wiring boards are individually stacked on a single second wiring board via the plurality of relay members.

9. A socket board assembly used for testing a DUT, comprising: The socket board according to any one of claims 1 to 8, and a socket board assembly including a socket mounted on the socket board and pressed by the DUT during the test of the DUT.

10. The socket board assembly according to claim 9, wherein the first wiring board includes a plurality of third pads provided on a third main surface on which the socket is mounted, the socket includes a second contact that contacts a terminal of the DUT during the test of the DUT, and the second contact is in contact with the third pad, the socket board assembly.

11. The socket board assembly according to claim 9, wherein the socket board assembly includes a fixing mechanism for fixing the first wiring board and the second wiring board with the relay member interposed therebetween between the first wiring board and the second wiring board.

12. The socket board assembly according to claim 11, wherein the socket board includes a spacer that defines a distance between the first wiring board and the second wiring board, and the fixing mechanism fixes the first wiring board and the second wiring board with the spacer interposed therebetween between the first wiring board and the second wiring board, the socket board assembly.

13. The socket board assembly according to claim 9, wherein the socket board assembly is detachably mounted on a mounted body provided in a device test apparatus.

14. A device test apparatus for testing a DUT, the device test apparatus including a tester including the socket board assembly according to claim 9.

15. A method for manufacturing a socket board according to any one of claims 1 to 8, including a first step of preparing the first wiring board, the second wiring board, and the relay member, and a second step of interposing the relay member between the first wiring board and the second wiring board, the method for manufacturing a socket board.

16. The method for manufacturing a socket board according to claim 15, wherein the socket board includes a spacer that defines a distance between the first wiring board and the second wiring board, and the method for manufacturing the socket board includes a third step of measuring a first thickness of the first wiring board, and a fourth step of selecting one or more plates for forming the spacer from a group of plates based on the first thickness. The second step includes a method for manufacturing a socket board that involves interposing the one or more plates selected in the fourth step between the first wiring board and the second wiring board.

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