Coil component
The coil component design addresses miniaturization and thinning challenges by optimizing the separation distance between connecting portions, ensuring deformation prevention and inductance maintenance, thus enhancing manufacturing stability and performance.
Patent Information
- Application Number
- JP2024185979
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-12-19
- Filing Date
- 2024-10-22
- Publication Date
- 2025-07-01
AI Technical Summary
Conventional coil components face challenges in miniaturization and thinning while maintaining inductance characteristics and preventing deformation of the coil and support member.
A coil component design featuring a main body with a coil, a support member, and connecting portions arranged to maintain a specific ratio of separation distance to length, ensuring the coil and support member are not deformed during manufacturing, and maximizing magnetic material volume.
The design achieves a low-profile coil component that prevents deformation and maintains inductance characteristics by efficiently distributing stress and minimizing substrate warping and chipping defects.
Smart Images
Figure 2025097904000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a coil component, and more particularly to a coil component that can be thinned while preventing deformation of the coil and the support member.
Background Art
[0002] An inductor, which is one type of coil component, is a typical passive electronic component used in electronic devices in addition to resistors and capacitors. As electronic devices are gradually becoming more powerful and smaller, the number of electronic components used in electronic devices is increasing and they are being miniaturized.
[0003] Thus, there is a situation where thin-film inductors used in such electronic devices are also required to be miniaturized and thinned. Although the size of power inductors has been thinned, in order to achieve miniaturization of products without characteristic losses of chips such as inductance and Rdc, research and development on increasing the number of turns of the coil pattern (fine patterning), developing materials with high magnetic permeability, and increasing the pattern height are ongoing as issues.
Summary of the Invention
Problems to be Solved by the Invention
[0004] The present invention has been made in view of the above problems in the conventional coil components, and an object of the present invention is to provide a coil component that can be thinned (low-profile) while preventing deformation of the coil and the support member. Another object of the present invention is to provide a coil component that can prevent a decrease in inductance characteristics by maximizing the volume of the magnetic material in the component.
Means for Solving the Problems
[0005] The coil component according to the present invention made to achieve the above object includes a main body, a coil disposed in the main body, a support member disposed in the main body to support the coil, a pair of first connecting portions extending from the support member to one side surface of the main body, and a pair of second connecting portions extending from the support member to the other side surface facing the one side surface of the main body. When the length of the main body in the first direction is L and the distance between the pair of first connecting portions separated in the first direction is S, S / L satisfies 0.15 or more and 0.65 or less.
Effect of the Invention
[0006] According to the coil component of the present invention, when the length of the main body in the first direction is L and the distance between the pair of first connecting portions separated in the first direction is S, by satisfying a predetermined value of S / L, it is possible to achieve a low-profile while preventing deformation of the coil and the support member. In addition, it is possible to prevent a decrease in inductance characteristics by maximizing the volume of the magnetic material in the coil component.
Brief Description of the Drawings
[0007]
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Mode for Carrying Out the Invention
[0008] Next, a specific example of the embodiment for implementing the coil component according to the present invention will be described with reference to the drawings.
[0009] The terms used in this specification are merely for explaining specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "including" or "having" are used to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and it can be understood that the presence or addition possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof is not precluded in advance. Throughout the specification, "above" means located above or below the target part, and does not necessarily mean located above with reference to the gravitational direction.
[0010] Note that the term "coupling" is not meant to mean only the case where each component physically contacts directly in the contact relationship between components, but is used as a concept that includes the case where other components are interposed between components and each component contacts the other component. The size and thickness of each configuration shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to what is shown. In the drawings, the X direction is defined as the first direction or the length direction, the Y direction is defined as the second direction or the width direction, and the Z direction is defined as the third direction or the thickness direction.
[0011] Hereinafter, the coil component according to the embodiment of the present invention will be described in detail with reference to the drawings. In describing with reference to the accompanying drawings, the same or corresponding components are given the same drawing numbers, and duplicate descriptions thereof are omitted.
[0012] Various types of electronic components are used in electronic devices, and various types of coil components can be appropriately used between such electronic components for purposes such as noise removal. That is, in electronic devices, coil components are used in power inductors, high-frequency inductors, general beads, GHz beads, common mode filters, etc.
[0013] FIG. 1 is a perspective view showing a schematic configuration of a coil component according to an embodiment of the present invention, FIG. 2 is a plan view showing a schematic configuration of a coil component according to an embodiment of the present invention, FIG. 3 is the same as the plan view of FIG. 2, and is a drawing showing only different reference numerals, FIG. 4 is a cross-sectional view taken along line I-I' of FIG. 1, and FIG. 5 is a cross-sectional view taken along line II-II' of FIG. 1.
[0014] Referring to FIGS. 1 to 5, a coil component 1000 according to an embodiment of the present invention includes a main body 100, a support member 210, connecting portions (221, 222), a coil 300, and external electrodes (400, 500), and further includes an insulating film IF. The main body 100 forms the appearance of the coil component 1000 according to the present embodiment, and embeds the support member 210 and the coil 300 therein. The main body 100 is generally formed in a hexahedron shape.
[0015] Based on FIGS. 1 to 5, the main body 100 includes a first surface 101 and a second surface 102 facing each other in a first direction (X direction), a third surface 103 and a fourth surface 104 facing each other in a second direction (Y direction), and a fifth surface 105 and a sixth surface 106 facing each other in a third direction (Z direction). Each of the first to fourth surfaces (101, 102, 103, 104) of the main body 100 corresponds to a side surface of the main body 100 connecting the fifth surface 105 and the sixth surface 106 of the main body 100.
[0016] The main body 100 is exemplarily formed such that the coil component 1000 according to the present embodiment in which the external electrodes (400, 500) described later are formed has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. As another example, the main body 100 is such that the coil component 1000 according to the present embodiment has a length of 2.0 mm, a width of 1.6 mm, and a thickness of 0.55 mm, or has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.55 mm, or can be formed to have a length of 1.2 mm, a width of 1.0 mm, and a thickness of 0.55 mm. On the other hand, as will be described later, the thinner the coil component 1000 is, the more the heat and pressure applied to the support member 210 and the coil 300 in the forming process of the main body 100 may increase. Thus, it can also be applied to the case of the coil component in which the first and second connecting portions (221, 222) applied to the present embodiment are formed to be below the above-described thickness. Therefore, the scope of the present invention is not limited to the thickness of the above-described exemplary coil component, and extends to the case where it is formed with a thickness less than that.
[0017] The length of the coil component 1000 in the first direction (X direction) described above is based on an optical microscope or an SEM (Scanning Electron Microscope) photograph of the cross-section in the first direction (X direction) - third direction (Z direction) at the central portion of the coil component 1000 in the second direction (Y direction). It can mean connecting the two outermost boundary lines facing each other in the first direction (X direction) of the coil component 1000 shown in the cross-sectional photograph, and taking the maximum value among the dimensions of each of the plurality of line segments parallel to the first direction (X direction). Or, it can mean connecting the two outermost boundary lines facing each other in the first direction (X direction) of the coil component 1000 shown in the cross-sectional photograph, and taking the minimum value among the dimensions of each of the plurality of line segments parallel to the first direction (X direction). Or, it can mean connecting the two outermost boundary lines facing each other in the first direction (X direction) of the coil component 1000 shown in the cross-sectional photograph, and taking the arithmetic mean value of at least five or more among the dimensions of each of the plurality of line segments parallel to the first direction (X direction). In particular, at least five or more dimensions shall include maximum and minimum values. Here, a plurality of line segments parallel to the first direction (X direction) are equally spaced from each other in the third direction (Z direction), but the scope of the present invention is not limited thereto.
[0018] The length of the coil component 1000 in the second direction (Y direction) described above is based on an optical microscope or SEM (Scanning Electron Microscope) photograph of the cross-section in the first direction (X direction) - second direction (Y direction) at the central part of the coil component 1000 in the third direction (Z direction). By connecting two outermost boundary lines facing each other in the second direction (Y direction) of the coil component 1000 shown in the cross-sectional photograph respectively, it may mean the maximum value among the dimensions of each of the plurality of line segments parallel to the second direction (Y direction). Or, by connecting two outermost boundary lines facing each other in the second direction (Y direction) of the coil component 1000 shown in the cross-sectional photograph respectively, it may mean the minimum value among the dimensions of each of the plurality of line segments parallel to the second direction (Y direction). Or, by connecting two outermost boundary lines facing each other in the second direction (Y direction) of the coil component 1000 shown in the cross-sectional photograph respectively, it may mean at least five or more arithmetic mean values among the dimensions of each of the plurality of line segments parallel to the second direction (Y direction). In particular, at least five or more dimensions shall include maximum and minimum values. Here, a plurality of line segments parallel to the second direction (Y direction) are equally spaced from each other in the first direction (X direction), but the scope of the present invention is not limited thereto.
[0019] The length of the coil component 1000 in the third direction (Z direction) described above means the maximum value among the dimensions of each of a plurality of line segments parallel to the third direction (Z direction) by connecting two outermost boundary lines facing each other in the third direction (Z direction) of the coil component 1000 shown in the cross-sectional photograph, based on an optical microscope or SEM (Scanning Electron Microscope) photograph of the cross-section in the first direction (X direction) - third direction (Z direction) at the central part of the coil component 1000 in the second direction (Y direction). Or, it may mean the minimum value among the dimensions of each of a plurality of line segments parallel to the third direction (Z direction) by connecting two outermost boundary lines facing each other in the third direction (Z direction) of the coil component 1000 shown in the cross-sectional photograph. Or, it may mean the arithmetic mean value of at least five or more among the dimensions of each of a plurality of line segments parallel to the third direction (Z direction) by connecting two outermost boundary lines facing each other in the third direction (Z direction) of the coil component 1000 shown in the cross-sectional photograph. In particular, at least five or more dimensions should include the maximum value and the minimum value. Here, a plurality of line segments parallel to the third direction (Z direction) are equally spaced from each other in the first direction (X direction), but the scope of the present invention is not limited thereto.
[0020] On the other hand, the length of each of the first to third directions of the coil component 1000 can be measured by a micrometer measurement method. The micrometer measurement method sets the zero point with a Gage R&R (Repeatability and Reproducibility) micrometer, inserts the coil component 1000 according to this embodiment between the tips of the micrometer, and measures by turning the measurement lever of the micrometer. On the one hand, when measuring the length of the coil component 1000 by the micrometer measurement method, the length of the coil component 1000 may mean the value measured once, or may mean the arithmetic mean of the values measured multiple times.
[0021] The main body 100 contains a magnetic substance and a resin. Specifically, the main body 100 is formed by laminating one or more magnetic composite sheets including a resin and a magnetic substance dispersed in the resin. However, the main body 100 can also have other structures than the structure in which the magnetic substance is dispersed in the resin. For example, the main body 100 can also be made of a magnetic substance such as ferrite. The magnetic substance is magnetic powder, for example, ferrite or metal magnetic powder.
[0022] The ferrite powder can be, for example, at least one or more of spinel-type ferrites such as Mg-Zn system, Mn-Zn system, Mn-Mg system, Cu-Zn system, Mg-Mn-Sr system, Ni-Zn system, hexagonal ferrites such as Ba-Zn system, Ba-Mg system, Ba-Ni system, Ba-Co system, Ba-Ni-Co system, garnet-type ferrites such as Y system, and Li-type ferrites.
[0023] The metal magnetic powder can contain any one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic powder can be at least one or more of pure iron powder, Fe-Si-based alloy powder, Fe-Si-Al-based alloy powder, Fe-Ni-based alloy powder, Fe-Ni-Mo-based alloy powder, Fe-Ni-Mo-Cu-based alloy powder, Fe-Co-based alloy powder, Fe-Ni-Co-based alloy powder, Fe-Cr-based alloy powder, Fe-Cr-Si-based alloy powder, Fe-Si-Cu-Nb-based alloy powder, Fe-Ni-Cr-based alloy powder, and Fe-Cr-Al-based alloy powder.
[0024] The metal magnetic powder is amorphous or crystalline. For example, the metal magnetic powder is an Fe-Si-B-Cr-based amorphous alloy powder, but it is not necessarily limited to this. The ferrite and the metal magnetic powder each have an average diameter of about 0.1 μm to 30 μm, but are not limited thereto.
[0025] The main body 100 contains two or more types of magnetic powder dispersed in a resin. Here, different types of magnetic powder mean that the magnetic powder dispersed in the resin is distinguishable from each other by any one of the average diameter, composition, crystallinity, and shape. As an example, the main body 100 contains two or more magnetic powders having different average diameters.
[0026] The resin may contain epoxy, polyimide, liquid crystal polymer, etc. alone or in combination, but is not limited thereto.
[0027] The main body 100 includes a core 110 that penetrates a coil 300 described later. The core 110 is formed by filling the through-hole of the coil 300 with a magnetic composite sheet, but is not limited thereto. The length L of the main body 100 along the first direction is larger than the length W along the second direction of the main body.
[0028] The support member 210 is embedded in the main body 100. The support member 210 is configured to support the coil 300 described later. The thickness of the support member 210 is 40 μm or less. Specifically, the thickness of the support member 210 can be 15 μm or more and 40 μm or less, but is not necessarily limited thereto.
[0029] The support member 210 is formed of an insulating material containing a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or an insulating material impregnated with a reinforcing material such as glass fiber or an inorganic filler in such an insulating resin. For example, the support member 210 can be formed of an insulating material such as prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) film, PID (Photo Imagable Dielectric) film, etc., but is not limited thereto.
[0030] As the inorganic filler, at least one or more selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, clay, mica powder, aluminum hydroxide (AlOH3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) are used.
[0031] When the support member 210 is formed of an insulating material containing a reinforcing material, the support member 210 can provide better rigidity. When the support member 210 is formed of an insulating material that does not contain glass fiber, the support member 210 is advantageous in reducing the thickness of the entire coil 300. When the support member 210 is formed of an insulating material containing a photosensitive insulating resin, the number of steps for forming the coil 300 is reduced, which is advantageous for reducing production costs, and fine vias can be formed.
[0032] The support member 210 is a member that supports the first and second coil patterns (311, 312) and the first and second lead portions (331, 332) of the coil 300, and is formed in a form corresponding to the shapes of the first and second coil patterns (311, 312) and the first and second lead portions (331, 332). That is, the outer line of the support member 210 is formed to correspond to the outer line of the coil 300. The support member 210 is spaced apart from both side surfaces (103, 104) facing each other in the second direction (Y direction) of the main body 100. This is contrary to the fact that the connecting portions (221, 222) extend to the third and fourth surfaces (103, 104) of the main body. That is, compared with a conventional coil component (comparative example) described later, even if the support member 210 is not extended to the third and fourth surfaces (103, 104), the rigidity of the coil component can be sufficiently ensured through the connecting portions (221, 222).
[0033] The support member 210 extends to both side surfaces (101, 102) facing each other in the first direction (X direction) of the main body 100 along the first and second lead-out portions (331, 332). When the length along the second direction (Y direction) of the side surface of the holding member 210 extending to both side surfaces (101, 102) of the main body is E, and the length along the second direction of the main body 100 is W, E / W is 1 / 2 or less. The length W along the second direction (Y direction) of the main body 100 is measured by estimating the method of measuring the length of the coil component 1000 described above. Similarly, the length E along the second direction (Y direction) of the side surface of the support member 210 extending to both side surfaces (101, 102) of the main body can also be measured by estimating the above method.
[0034] The main body 100 of the coil component is formed by laminating and pressure-bonding magnetic composite sheets on both surfaces of the support member 210 on which the coil is formed. At this time, the pressure and temperature applied to the support member and the coil may increase, and the deformability of the support member 210 and the coil 300 may increase (hereinafter referred to as "substrate deflection"). In particular, such a substrate deflection phenomenon may frequently occur when the thickness of the support member 210 is thinned to 40 μm or less as described above. In the case of this embodiment, as described later, by forming each of the first and second connecting portions (221, 222) into a pair spaced apart from each other by a length S in the first direction (X direction) of the main body, the stress applied to the coil 300 and the support member 210 during the formation of the main body 100 can be reduced.
[0035] Hereinafter, with reference to FIGS. 2 and 3, the shape of the connecting portions (221, 222) will be described in detail. The coil component 1000 according to the present embodiment includes a pair of first connecting portions 221 extending from the support member 210 to one side surface of the main body 100 and a pair of second connecting portions 222 extending from the support member 210 to the other side surface of the main body 100. Specifically, the pair of first connecting portions 221 and the pair of second connecting portions 222 extend to both side surfaces facing each other in the second direction of the main body, respectively. Referring to FIG. 2, the pair of first connecting portions 221 extend to the third surface 103 of the main body 100, and the pair of second connecting portions 222 extend to the fourth surface 104.
[0036] The first and second connecting portions (221, 222) connect adjacent unit coils to each other during the lamination of the magnetic composite sheets to prevent deformation of each unit coil. After the first and second connecting portions (221, 222) are formed in a form that connects the respective unit support members 210 that support adjacent unit coils to each other, they are separated through a process of individualizing the unit coils, and are respectively exposed on the third and fourth surfaces (103, 104) of the main body 100 of each unit coil component 1000.
[0037] Unlike the support member 210 that directly supports the coil 300, the coil 300 is not disposed on the first and second connecting portions (221, 222). However, it is not necessarily limited to this. As an example, when the coil 300 is formed in a plating process, there is a possibility that the plating region may invade the connecting portions (221, 222). In such a case, although the first and second connecting portions (221, 222) are not configured to directly support the coil 300, at least a part of the coil 300 is in contact with at least one of the first connecting portion 221 and the second connecting portion 222.
[0038] In the case of the present embodiment, the pair of first connecting portions 221 are separated from each other by a length S in the first direction (X direction) of the main body. That is, as shown in FIGS. 1 to 3, a pair of first connecting portions 221 extend from the support member 210, and each cross section is exposed on the third surface 103 of the main body 100. Similarly, a pair of second connecting portions 222 are separated from each other by a length S in the first direction (X direction) of the main body. A pair of second connecting portions 222 extend from the support member 210, and each cross section is exposed on the fourth surface 104 of the main body 100.
[0039] The separation distance S between the pair of first connecting portions 221 corresponds to the separation distance S between the pair of second connecting portions 222. Thereby, a part of the magnetic composite sheet for forming the main body 100 can flow in the space between the pair of first and second connecting portions (221, 222), and deformation of the support member 210 can be minimized. Furthermore, deformation of the coil 300 disposed on the support member 210 can be minimized.
[0040] Referring to FIG. 3, the arrangement of the connecting portions (221, 222) will be described in detail. The first and second connecting portions (221, 222) are formed symmetrically with respect to each other. Here, being formed symmetrically is a concept including point symmetry and line symmetry.
[0041] When a plane passing through the center along the second direction of the main body 100 is defined as P1, a pair of first connecting portions 221 and a pair of second connecting portions 222 are formed symmetrically with respect to each other with reference to the P1 plane. When a plane passing through the center along the first direction of the main body 100 is defined as P2, a pair of first connecting portions 221 are formed symmetrically with respect to each other with reference to the P2 plane, and a pair of second connecting portions 222 are formed symmetrically with respect to each other with reference to the P2 plane.
[0042] The first connecting portion 221 disposed on the left side and the second connecting portion 222 disposed on the left side with reference to the direction of FIG. 3 are both located on a straight line parallel to the second direction (Y direction) of the main body 100. Similarly, the first connecting part 221 arranged on the right side and the second connecting part 222 arranged on the right side with reference to the direction of FIG. 3 are both located on different line segments parallel to the second direction (Y direction) of the main body 100. In both the former and latter cases, the stress applied to the support member 210 and the coil 300 during the formation of the main body 100 can be relatively evenly distributed in the second direction (Y direction) of the main body 100, minimizing the deformation of the coil 300.
[0043] When the length of the pair of first connecting parts 221 separated in the first direction (X direction) is S and the length of the main body 100 along the first direction (X direction) is L, S / L satisfies 0.15 or more and 0.65 or less.
[0044] Table 1 shown below is a table showing the substrate deflection, Ls change rate, and chipping defect rate when the length L of the main body 100 in the first direction (X direction) is kept constant at 2.0 mm and the length S of the pair of connecting parts separated is adjusted. No. 1 shows a conventional coil component (comparative example). FIG. 6 is a diagram showing a conventional coil component (comparative example). In the case of the conventional coil component, the support member 20 around the lead-out part has a structure extending to the side surfaces (13, 14) of the main body. That is, in order to ensure the rigidity of the coil component, the area of the support member 20 is increased.
[0045] On the other hand, in the experimental examples (No. 2 to No. 10), the support member 210 was not extended to the side surfaces (103, 104) of the main body, a pair of connecting parts (221, 222) were formed respectively, and the separation distance S between the connecting parts (221, 222) was adjusted. Chipping defect means a phenomenon in which the magnetic body main body falls off when the main body 100 is formed by laminating and crimping the magnetic body.
[0046]
Table 1
[0047] In the case of No. 1 (comparative example), when the thickness of the support member 20 of the coil component is formed to be 40 μm or less, it is difficult to disperse the stress applied to the coil and the support member, and substrate warping phenomenon occurs. Specifically, in the case of the comparative example, the coil 300 may be vulnerable to stress dispersion along the first direction (X direction). In particular, due to the structure of the coil component, the length in the first direction (X direction) is often larger than the length in the second direction (Y direction). Therefore, the comparative example may be relatively vulnerable to the substrate warping phenomenon. Also, in the case of the comparative example, since the distance between the support member and the YZ plane is too close, there is a risk of the magnetic material falling off during the manufacturing of the coil component, that is, there is a risk of Chipping defect.
[0048] In the case of No. 2, the distance between the connecting parts is too close, and the stress cannot be efficiently dispersed along the first direction (X direction), and there is a risk of Chipping defect. In the cases of No. 3 to No. 8, the substrate warping phenomenon is improved, and it can be confirmed that Ls is improved compared with the comparative example. This is because the connecting parts (221, 222) are arranged so as to avoid the region where the magnetic flux is concentrated, and the circulation of the magnetic flux can be made smooth. Also, if the distance S between a pair of connecting parts is too narrow, the risk of the magnetic body main body falling off (Chipping defect) increases. In the cases of No. 9 and No. 10, it can be confirmed that the distance between the connecting part and the YZ plane is too close, Ls decreases, and the Chipping defect rate increases again. Also, when the distance between the connecting parts increases, the rigidity of the substrate may decrease and substrate warping may occur.
[0049] Therefore, referring to Table 1 above, when S / L is maintained between 0.15 and 0.65, it can be seen that the structure can efficiently disperse the stress, and the substrate warping of the coil component can be prevented. Also, thereby, Chipping defect can be prevented and Ls can be improved.
[0050] The length L along the first direction (X direction) of the main body 100 is measured by estimating the method for measuring the length of the coil component 1000 described above. Furthermore, the length S by which a pair of connecting portions are separated in the first direction (X direction) can also be measured by estimating the method for measuring the length of the coil component 1000 described above. In particular, the length S by which a pair of connecting portions are separated does not mean the distance between the centers of the connecting portions, but rather the physically separated distance, that is, the distance from the adjacent surface between the connecting portions to the adjacent surface.
[0051] By doing so, the coil component 1000 according to the present embodiment can minimize the deformation of the support member 210 and the coil 300 that may occur in the manufacturing process by forming so as to separate a pair of connecting portions (221, 222).
[0052] The coil 300 is embedded in the main body 100 to exhibit the characteristics of the coil component. For example, when the coil component 1000 of the present embodiment is utilized as a power inductor, the coil 300 plays a role of stabilizing the power supply of the electronic device by storing an electric field in a magnetic field and maintaining the output voltage.
[0053] The coil 300 includes coil patterns (311, 312), lead portions (331, 332), and vias 320. Specifically, based on the directions of FIGS. 1, 4, and 5, the first coil pattern 311 and the first lead portion 331 are disposed on the lower surface of the support member 210 facing the sixth surface 106 of the main body 100, and the second coil pattern 312 and the second lead portion 332 are disposed on the upper surface of the support member 210. The via 320 penetrates the support member 210 and contacts the first coil pattern 311 and the second coil pattern 312, respectively. By doing so, the coil 300 functions as one coil that forms one or more turns around the core 110 as a whole.
[0054] Each of the first coil pattern 311 and the second coil pattern 312 has a planar spiral shape that forms at least one turn about the core 110. As an example, the first coil pattern 311 forms at least one turn about the core 110 on the lower surface of the support member 210. The first and second lead portions (331, 332) extend to the first surface 101 and the second surface 102 of the main body, respectively, and are connected to the first and second external electrodes (400, 500) described later.
[0055] The first and second lead portions (331, 332) have a structure in which a plurality of strips are combined. Referring to FIG. 2, the second lead portion 332 includes a plurality of strip-shaped conductors (3321, 3322). When the second lead portion 332 has a plurality of strip-shaped conductors (3321, 3322), it is possible to mitigate the over-plating phenomenon that may occur in the process of forming the second lead portion 332. As a result, it is possible to reduce the variation in plating thickness between the second coil pattern 312 and the second lead portion 332. The plurality of strip-shaped conductors (3321, 3322) are formed so as to be separated in the second direction (Y direction), and the main body 100 is filled between the separated spaces. As a result, the bonding force between the main body 100 and the second coil pattern 312 and the inductance characteristics are improved.
[0056] At least one of the coil patterns (311, 312), the first and second lead portions (331, 332), and the via 320 includes one or more conductive layers. As an example, when the second coil pattern 312, the second lead portion 332, and the via 320 are formed by plating on the other surface side of the support member 210, the second coil pattern 312, the second lead portion 332, and the via 320 each include a seed layer such as an electroless plating layer and an electrolytic plating layer. Here, the electrolytic plating layer can have a single-layer structure or a multi-layer structure. The electrolytic plating layer with a multilayer structure can be formed in a conformal film structure where one electrolytic plating layer covers another electrolytic plating layer, or can be formed in a shape where another electrolytic plating layer is laminated only on one side of one electrolytic plating layer. The seed layer of the second coil pattern 312, the seed layer of the second lead-out portion 332, and the seed layer of the via 320 may be integrally formed and may not have a boundary formed therebetween, but are not limited thereto. The electrolytic plating layer of the second coil pattern 312, the electrolytic plating layer of the second lead-out portion 332, and the electrolytic plating layer of the via 320 may be integrally formed and may not have a boundary formed therebetween, but are not limited thereto.
[0057] As another example, based on the directions of FIGS. 1, 4, and 5, after separately forming the first coil pattern 311 and the first lead-out portion 331 disposed on the lower surface of the support member 210 and the second coil pattern 312 and the second lead-out portion 332 disposed on the upper surface side of the support member 210, and then laminating them on the support member 210 all at once to form the coil 300, the via 320 includes a low melting point metal layer having a melting point lower than that of the high melting point metal layer. Here, the low melting point metal layer is formed of a solder containing lead (Pb) and / or tin (Sn). At least a part of the low melting point metal layer is melted by the pressure and temperature during the batch lamination. For example, an intermetallic compound layer (IMC layer) is formed at the boundary between the low melting point metal layer and the second coil pattern 312.
[0058] Based on the third direction (Z direction) in FIGS. 4 and 5, the coil patterns (311, 312) and the lead-out portions (331, 332) protrude from the lower surface and the upper surface of the support member 210, respectively. As another example, the first coil pattern 311 and the first lead portion 331 are formed to protrude from the lower surface of the support member 210, and the second coil pattern 312 and the second lead portion 332 are embedded in the upper surface of the support member 210, such that the upper surfaces of the second coil pattern 312 and the second lead portion 332 are exposed on the upper surface of the support member 210. In this case, recesses are formed in the upper surfaces of the second coil pattern 312 and / or the second lead portion 332, and the upper surfaces of the second coil pattern 312 and / or the second lead portion 332 and the upper surface of the support member 210 are not located on the same plane. As another example, the second coil pattern 312 and the second lead portion 332 are formed to protrude from the upper surface of the support member 210, and the first coil pattern 311 and the first lead portion 331 are embedded in the lower surface of the support member 210, such that the lower surfaces of the first coil pattern 311 and the first lead portion 331 are exposed on the lower surface of the support member 210. In this case, recesses are formed in the lower surfaces of the first coil pattern 311 and / or the first lead portion 331, and the lower surfaces of the first coil pattern 311 and / or the first lead portion 331 and the lower surface of the support member 210 are not located on the same plane.
[0059] Each of the coil patterns (311, 312), the lead portions (331, 332), and the via 320 can be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof, but is not limited thereto.
[0060] The external electrodes (400, 500) are disposed on the surface of the main body 100 and are respectively connected to the first and second lead portions (331, 332). In the case of this embodiment, the first and second lead portions (331, 332) extend to the first and second surfaces (101, 102) of the main body 100, respectively. Therefore, the first external electrode 400 is disposed on the first surface 101 and is in contact connection with the first lead-out portion 331 extending to the first surface 101 of the main body 100, and the second external electrode 500 is disposed on the second surface 102 and is in contact connection with the second lead-out portion 332 extending to the second surface 103 of the main body 100.
[0061] The external electrodes 400 and 500 can be formed in a single-layer or multi-layer structure. As an example, the first external electrode 400 can be composed of a first layer containing copper, a second layer disposed on the first layer and containing nickel (Ni), and a third layer disposed on the second layer and containing tin (Sn). Here, the first to third layers can be formed by plating respectively, but are not limited thereto. As another example, the first external electrode 400 can include a resin electrode containing conductive powder and resin, and a plating layer formed by plating on the resin electrode. The external electrodes (400, 500) can be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof, but are not limited thereto.
[0062] The insulating film IF is formed on the support member 210 and the coil 300. Also, the insulating film IF is formed on the connecting portions (221, 222). The insulating film IF is for insulating the coil 300 from the main body 100 and can include a known insulating material such as parylene. Any of the insulating materials included in the insulating film IF can be used, and there is no particular limitation. The insulating film IF is formed by a method such as vapor deposition, but is not limited thereto, and can also be formed by laminating an insulating film on both sides of the support member 210 and the connecting portions (221, 222). In the former case, the insulating film IF is formed in the form of a conformal film along the surfaces of the support member 210, the connecting portions (221, 222), and the coil 300. On the one hand, in the present invention, the insulating film IF is of a selective configuration. In the operating voltage and operating current of the coil component 1000 according to the present embodiment, if the main body 100 can ensure a sufficient insulation resistance, the insulating film IF can be omitted.
[0063] Note that the present invention is not limited to the above-described embodiments. Various modifications can be made without departing from the technical scope of the present invention.
Explanation of Reference Numerals
[0064] 100 Main body 110 Core 210 Support member 221, 222 (First, second) connecting portions 300 Coil 311, 312 (First, second) coil patterns 320 Via 331, 332 (First, second) lead-out portions 400, 500 (First, second) external electrodes 1000 Coil component 3321, 3322 Strip-shaped conductors IF Insulating film
Claims
1. The main body, a coil disposed within the body; a support member disposed within the body to support the coil; a pair of first connecting portions extending from the support member to one side of the main body; a pair of second connecting portions extending from the support member to a side surface of the main body facing the other side surface of the main body; Let L be the length of the main body in the first direction, and S be the distance between the pair of first connecting portions in the first direction. A coil component, characterized in that S / L satisfies 0.15 or more and 0.65 or less.
2. The coil part according to claim 1 , wherein the pair of first connecting portions and the pair of second connecting portions extend from both side surfaces of the body facing each other in the second direction.
3. The coil component according to claim 1 , wherein a distance between the pair of first connecting portions corresponds to a distance between the pair of second connecting portions.
4. A plane passing through the center of the body in the second direction is defined as P １ When The pair of first connecting portions and the pair of second connecting portions are １ The coil component according to claim 1, wherein the coil components are formed symmetrically with respect to a plane.
5. A plane passing through the center of the body along the first direction is defined as P ２ When The pair of first connecting portions are ２ They are formed symmetrically with respect to the surface. The pair of second connecting portions are ２ The coil component according to claim 1, wherein the coil components are formed symmetrically with respect to a plane.
6. 2. The coil component according to claim 1, wherein the support member has a thickness of 40 [mu]m or less.
7. The coil device according to claim 1 , wherein the support members are spaced apart from both side surfaces of the body facing each other in the second direction.
8. The side surfaces of the support member extend to both sides of the body facing each other in a first direction, When the length of the side surface of the support member along the second direction is E and the length of the main body along the second direction is W, 2. The coil component according to claim 1, wherein E / W is 1 / 2 or less.
9. The coil includes first and second lead portions, The coil device according to claim 1 , wherein the first and second lead-out portions extend from both sides of the body facing each other in the first direction.
10. The coil component according to claim 9 , wherein the first and second lead portions each include a plurality of strip-shaped conductors.
11. The plurality of strip-shaped conductors are spaced apart in a second direction of the body, The coil component according to claim 10 , wherein a portion of the body is filled between the plurality of strip-shaped conductors.
12. The coil is a first coil pattern having a planar spiral shape disposed on one surface of the support member; a second coil pattern having a planar spiral shape and disposed on the other surface of the support member facing the one surface of the support member; The coil component according to claim 1 , further comprising: a via that penetrates the support member so as to connect the first coil pattern and the second coil pattern.
13. The coil part according to claim 1 , further comprising first and second external electrodes disposed on both sides of the body facing each other in the first direction and connected to both ends of the coil, respectively.
14. The coil component according to claim 1 , wherein the main body contains a resin and a magnetic powder.
15. The coil component according to claim 1 , wherein a length of the body along the first direction is greater than a length of the body along the second direction.
16. The coil component according to claim 1 , wherein at least a portion of the coil is in contact with at least one of the pair of first connecting portions and the pair of second connecting portions.