Power supply device, gate driving device, and inverter device

Abstract

To provide a power supply device, a gate driving device, and an inverter device that suppress noise, including conduction noise and radiation noise, that is generated by a built-in transformer IC.SOLUTION: In an inverter device 100 that drives a motor 400, a power supply device 300 comprises: a built-in transformer IC 301; a power supply input line 311 connected to the built-in transformer IC 301; a decoupling capacitor 302 disposed on the power supply input line 311; a filter circuit 304 disposed upstream of the decoupling capacitor 302 on the power supply input line 311; and a Y-capacitor 303 disposed on the power supply input line 311 between the filter circuit 304 and the decoupling capacitor 302.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a power supply device, a gate drive device, and an inverter device.

Background Art

[0002] Conventionally, there has been an isolated power supply circuit as a power supply device that supplies power to, for example, a gate drive circuit that supplies a gate signal to an inverter. In recent years, due to the miniaturization of power supply devices, an IC incorporating an isolation transformer has begun to be used in power supply devices. For example, Patent Document 1 discloses an IC incorporating a transformer applicable to a power supply device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in order to miniaturize the transformer incorporated in the IC with a transformer, high-frequency switching in the range of several MHz to a dozen or so MHz is performed in the IC with a transformer, and suppression of noise including conduction noise and radiation noise is desired. Therefore, the present invention aims to suppress noise.

Means for Solving the Problems

[0005] One aspect of the power supply device according to the present disclosure includes an IC incorporating a transformer, a power supply input line connected to the IC incorporating the transformer, a decoupling capacitor provided on the power supply input line, a filter circuit provided on the power supply input line on the upstream side of the decoupling capacitor, and a Y capacitor provided on the power supply input line between the filter circuit and the decoupling capacitor.

[0006] Also, one aspect of the gate drive device according to the present disclosure includes the power supply device and a gate drive circuit that is supplied with power from the power supply device and drives the gate of a power module mounted with a power semiconductor that constitutes an inverter circuit to turn on and off. Also, one aspect of the inverter device according to the present disclosure includes the power supply device, an inverter circuit composed of a capacitor and a power module, and a gate drive circuit that is supplied with power from the power supply device and drives the gate of the power module to turn on and off.

Advantages of the Invention

[0007] According to the present disclosure, noise is suppressed.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Modes for Carrying Out the Invention

[0009] Hereinafter, embodiments of the power supply device, the gate drive device, and the inverter device of the present disclosure will be described in detail with reference to the accompanying drawings. However, in order to avoid making the following description unnecessarily redundant and to facilitate the understanding of those skilled in the art, a more detailed description than necessary may be omitted. For example, a detailed description of well-known matters or a redundant description of substantially the same configuration may be omitted. Also, elements described in the figures described above may be referred to as appropriate in the description of later figures.

[0010] (Structure of Inverter Device 100) FIG. 1 is a block configuration diagram schematically showing the configuration of the inverter device 100 according to the present embodiment. The inverter device 100 is connected to a high-voltage power supply 600 such as 400V or 800V, converts DC power from the high-voltage power supply 600 into AC power, supplies it to the motor 400, and drives the motor 400.

[0011] The inverter device 100 includes a capacitor 101, a power module 102, and a gate drive device 200. The capacitor 101 and the power module 102 constitute an inverter circuit. The capacitor 101 is a smoothing capacitor in the inverter circuit. The power module 102 is a module in which power semiconductors that constitute the inverter circuit and are responsible for switching are modularized.

[0012] The gate drive device 200 includes a gate drive circuit 201 and a power supply device 300. The gate drive circuit 201 turns on and off the gates of the power semiconductors mounted on the power module 102. The power supply device 300 supplies power to the gate drive circuit 201. The power supply device 300 includes a transformer-integrated IC (Integrated Circuit) 301, a decoupling capacitor 302, a Y capacitor 303, and a filter circuit 304. The power supply device 300 is connected to a low-voltage power supply 500 of, for example, 9V to 16V. And the power supply device 300 is connected to the transformer-integrated IC 301 and includes a power supply input line 311 that inputs power from the low-voltage power supply 500 to the transformer-integrated IC 301. The power supply input line 311 includes a 0V pattern 311a and a power pattern 311b.

[0013] Note that a plurality of sets of the transformer-integrated IC 301, the decoupling capacitor 302, and the Y capacitor 303 are provided according to the output phase number of the power module 102, but only one set is shown as a representative in FIG. 1. The built-in transformer IC 301, the decoupling capacitor 302, the Y capacitor 303, and the filter circuit 304 are arranged in this order on the power input line 311. That is, the decoupling capacitor 302 is arranged on the power input line 311. The filter circuit 304 is arranged on the power input line 311 on the upstream side of the decoupling capacitor 302. And the Y capacitor 303 is arranged on the power input line 311 between the filter circuit 304 and the decoupling capacitor 302.

[0014] Also, the power supply device 300 includes a substrate 310 on which the built-in transformer IC 301, the decoupling capacitor 302, and the Y capacitor 303 are mounted. The built-in transformer IC 301 supplies the power obtained from the power input line 311 to the gate drive circuit 201. The built-in transformer IC 301 includes an isolated power supply circuit in which the input side and the output side are isolated by a built-in transformer. For miniaturization of the built-in transformer, in the built-in transformer IC 301, switching is performed at a high frequency such as several MHz to ten-odd MHz (Mega Hertz), and for example, suppression of radiation noise and conduction noise is required.

[0015] The decoupling capacitor 302, the Y capacitor 303, and the filter circuit 304 are provided for noise suppression. The decoupling capacitor 302 is a capacitor provided between the 0V pattern 311a and the power pattern 311b of the power input line 311, and keeps the voltage of the power input line 311 constant in DC.

[0016] The filter circuit 304 removes the noise mixed in the power input line 311. The Y capacitor 303 is provided between the decoupling capacitor 302 and the filter circuit 304. The Y capacitor 303 has capacitors on the 0V pattern 311a side and the power supply pattern 311b side, the illustration of which is omitted. Then, the Y capacitor 303 connects each of the 0V pattern 311a and the power supply pattern 311b to the ground-connected metal member 350 via each capacitor. The Y capacitor 303 is connected to the ground-connected metal member 350 via the conductor pattern 312 formed on the substrate 310 and the metal terminal 313 connecting from the conductor pattern 312 to the metal member 350. Therefore, the Y capacitor 303 is connected to the ground with a lower impedance compared to the case of passing through members other than the metal terminal 313.

[0017] By arranging the transformer-integrated IC 301, the decoupling capacitor 302, the Y capacitor 303, and the filter circuit 304 in this order on the power input line 311, a synergistic effect between the filter circuit 304 and the Y capacitor 303 is obtained. As a result, the noise generated by the transformer-integrated IC 301 is suppressed.

[0018] Also, since the transformer-integrated IC 301, the decoupling capacitor 302, and the Y capacitor 303 are arranged on the same substrate 310, the distance between the Y capacitor 303 and the transformer-integrated IC 301 is short, and the noise suppression effect is high. Also, the noise suppression effect is enhanced by the low-impedance connection through the conductor pattern 312 and the metal terminal 313. The cross-sectional area of the metal terminal 313 is preferably 2 2 mm or more. A metal terminal 313 having a cross-sectional area of 2 2 mm or more has a low impedance and thus a high noise suppression effect.

[0019] Also, it is desirable that the width of the conductor pattern 312 be 1 mm or more. That is, it is desirable that the Y capacitor 303 be connected to the ground-connected metal member 350 via the conductor pattern 312 formed on the substrate 310 on which the Y capacitor 303 is disposed and having a width of 1 mm or more. Since the Y capacitor 303 is connected to the ground with a lower impedance compared to the case of passing through the conductor pattern 312 having a width of less than 1 mm, the noise suppression effect is high.

[0020] Also, the connection line including the conductor pattern 312 and the metal terminal 313 from the Y capacitor 303 to the metal member 350 is electrically separated from the 0V pattern 311a of the power input line 311. This electrical separation makes the noise suppression effect remarkable.

[0021] Hereinafter, specific examples of the metal member 350 and the metal terminal 313 will be described. FIG. 2 is a diagram showing a first specific example of the metal member 350 and the metal terminal 313. FIG. 2 shows a substrate 310 on which a Y capacitor 303 (not shown) is mounted and another substrate 320. The other substrate 320 is, for example, a control substrate or the like. And in FIG. 2, a metal shielding plate 351 is shown as an example of the metal member 350. The shielding plate 351 electromagnetically shields the substrate 310 on which the Y capacitor 303 is mounted and the other substrate 320. Examples of the shielding plate 351 include those made of metal such as aluminum, or those made of resin with copper plating or a conductive paint applied to the surface.

[0022] Also, in FIG. 2, as an example of the metal terminal 313, a metal terminal 313a having a columnar shape protruding from the substrate 310 to the shielding plate 351 is shown. The columnar metal terminal 313a has a size of a radius of 1 mm or more as an example, and realizes a low impedance due to a large cross-sectional area. Also, with a columnar shape, a metal terminal 313a with a large cross-sectional area can be easily obtained.

[0023] The metal terminal 313a is linearly connected from each conductor pattern 312 connected to a plurality of Y capacitors 303 provided on the substrate 310 to the nearest position of the shielding plate 351, realizing a low-impedance connection. Since the shielding plate 351 often exists near the substrate 310, the connection distance from the Y capacitor 303 to the shielding plate 351 is short, and a low-impedance connection is easily obtained.

[0024] FIG. 3 is a diagram showing a second specific example of the metal member 350 and the metal terminal 313. FIG. 3 shows a substrate 310 on which Y capacitors 303 (not shown) are mounted and a power module 102 that holds the substrate 310. And, FIG. 3 shows a metal casing 352 as an example of the metal member 350. The casing 352 houses and protects the substrate 310 and the power module 102 inside. Examples of the casing 352 include those made of metal such as aluminum, or those made of resin coated with copper plating or a conductive paint on the surface.

[0025] Also, FIG. 3 shows a metal terminal 313b having a plate-like shape bridging from the substrate 310 to the casing 352 as an example of the metal terminal 313. The plate-like metal terminal 313b has a size with a width of 2 mm or more as an example, and realizes a low impedance due to a large cross-sectional area. Also, since it has a plate-like shape, a metal terminal 313b with a large cross-sectional area can be easily obtained.

[0026] By bridging the metal terminal 313b from the substrate 310 to the vicinity of the casing 352, the connection from the Y capacitor 303 to the casing 352 is made short, and a low-impedance connection is realized. Since the casing 352 houses the substrate 310, the connection distance from the Y capacitor 303 is often short, and a low-impedance connection is easily obtained.

[0027] FIG. 4 is a diagram showing a third specific example of the metal member 350 and the metal terminal 313. FIG. 4 also shows a substrate 310 on which a Y capacitor 303 (not shown) is mounted, and a power module 102 that holds the substrate 310. FIG. 4 shows, as an example of the metal member 350, a metal cooler 353. The cooler 353 is, for example, a heat sink for cooling the power module 102 disposed outside the substrate 310. Examples of the cooler 353 include those made of metal such as aluminum, or those made of resin with a copper plating or a conductive paint applied to the surface. Although not shown, the cooler 353 and the housing 352 are electrically connected by, for example, metal screws or the like.

[0028] Also shown in FIG. 4, as an example of the metal terminal 313, is a metal terminal 313c protruding from the substrate 310 to the cooler 353. The metal terminal 313c shown in FIG. 4 also has a cross-sectional area of 2 mm 2 or more, and low impedance is realized. By connecting the metal terminal 313c linearly from the substrate 310 to the cooler 353, the connection from the Y capacitor 303 to the cooler 353 is made over a short distance, and a low-impedance connection is realized. Since the cooler 353 of the power module 102 is often located in the vicinity of the substrate 310 on which the Y capacitor 303 is mounted, the connection distance from the Y capacitor 303 to the cooler 353 is short, and a low-impedance connection is easily obtained.

[0029] Note that the combination of the specific example of the metal member 350 and the specific example of the metal terminal 313 is not limited to the combination described above, and any combination is possible. Also, when it is possible to connect a plurality of the shielding plate 351, the housing 352, and the cooler 353 by the metal terminal 313, it is preferable that the one with the shortest connection distance to the Y capacitor 303 among the shielding plate 351, the housing 352, and the cooler 353 be used as the metal member 350. Thereby, a low-impedance connection is made from the Y capacitor 303 to the metal member 350, and the noise suppression effect is high.

[0030] From another perspective, when there are multiple candidates for the grounded metal member 350, it is preferable to use, as the metal member 350, a member having a shorter connection distance to the Y capacitor 303 compared to other grounded members. Thereby, the connection from the Y capacitor 303 to the metal member 350 is made with low impedance, and the noise suppression effect is high.

[0031] Here, as an example of the usage method in the power supply device, gate drive device, and inverter device of the present disclosure, driving of a motor is given. However, the usage method of the power supply device, gate drive device, and inverter device of the present disclosure is not limited to the above, and it can be used widely in lighting, solar power generation, etc.

[0032] It should be considered that the above-described embodiments are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims rather than the above-described embodiments, and it is intended that all modifications within the meaning and scope equivalent to the claims are included. Note that the present technology can be configured as follows.

[0033] (1) An IC with a built-in transformer, A power input line connected to the IC with a built-in transformer, A decoupling capacitor provided on the power input line, A filter circuit provided on the power input line, upstream of the decoupling capacitor, A Y capacitor provided on the power input line between the filter circuit and the decoupling capacitor, A power supply device comprising the same.

[0034] (2) The power supply device according to (1), wherein the IC with a built-in transformer, the Y capacitor, and the decoupling capacitor are provided on the same substrate.

[0035] (3) The Y capacitor is connected to the metal member connected to the ground via a conductor pattern with a width of 1 mm or more formed on the substrate on which the Y capacitor is disposed in the power supply device according to (1) or (2).

[0036] (4) The Y capacitor is connected to the metal member connected to the ground via a conductor pattern formed on the substrate on which the Y capacitor is disposed and a metal terminal connecting the conductor pattern to the metal member in the power supply device according to any one of (1) to (3).

[0037] (5) The metal terminal has a cross-sectional area of 2 mm 2 or more in the power supply device according to (4). (6) The metal terminal has a cylindrical or plate-like shape in the power supply device according to (4) or (5).

[0038] (7) The metal terminal has a cylindrical shape with a radius of 1 mm or more or a plate-like shape with a width of 2 mm or more in the power supply device according to any one of (4) to (6).

[0039] (8) The metal member is a metal shielding plate that electromagnetically shields the substrate on which the Y capacitor is disposed and another substrate, a metal housing that houses the substrate on which the Y capacitor is disposed, or a metal cooler for cooling a semiconductor element disposed outside the substrate on which the Y capacitor is disposed, or a resin shielding plate, housing, or cooler having copper plating or a conductive paint applied to its surface in the power supply device according to any one of (4) to (7).

[0040] (9) The metal member is the one with the shortest connection distance to the Y capacitor among the shielding plate, the housing, and the cooler in the power supply device according to (8).

[0041] (10) The power supply device according to any one of (4) to (9), wherein the connection distance between the metal member and the Y capacitor is shorter than that of other members connected to the ground.

[0042] (11) The power supply device according to any one of (4) to (10), wherein the connection line from the Y capacitor to the metal member is electrically separated from the 0V pattern of the power supply line.

[0043] (12) A power supply device according to any one of (1) to (11), and A gate drive circuit that is supplied with power from the power supply device and drives the gate of a power semiconductor mounted on a power module constituting an inverter circuit to turn on and off. A gate drive device comprising the same.

[0044] (13) A power supply device according to any one of (1) to (11), and An inverter circuit comprising a capacitor and a power module, A gate drive circuit that is supplied with power from the power supply device and drives the gate of the power module to turn on and off. An inverter device comprising the same.

Explanation of Signs

[0045] 100: Inverter device 101: Capacitor 102: Power module 200: Gate drive device 201: Gate drive circuit 300: Power supply device 301: Transformer-integrated IC 302: Decoupling capacitor 303: Y capacitor 304: Filter circuit 310: Substrate 311: Power supply input line 311a: 0V pattern 311b: Power pattern 312: Conductor pattern 313, 313a, 313b, 313c: Metal terminals 320: Other substrate 350: Metal member 351: Shielding plate 352: Housing 353: Cooler 400: Motor 500: Low-voltage power supply 600: High-voltage power supply

Claims

1. A power supply device comprising: a transformer-integrated IC; a power input line connected to the transformer-integrated IC; a decoupling capacitor provided on the power input line; a filter circuit provided on the power input line upstream of the decoupling capacitor; a Y capacitor provided on the power input line between the filter circuit and the decoupling capacitor.

2. The power supply device according to claim 1, wherein the transformer-integrated IC, the Y capacitor, and the decoupling capacitor are provided on the same substrate.

3. The power supply device according to claim 1, wherein the Y capacitor is connected to a ground-connected metal member via a conductor pattern having a width of 1 mm or more formed on the substrate on which the Y capacitor is provided.

4. The power supply device according to claim 1, wherein the Y capacitor is connected to a ground-connected metal member via a conductor pattern formed on the substrate on which the Y capacitor is provided and a metal terminal connecting the conductor pattern to the metal member.

5. The metal terminal has a cross-sectional area of 2 mm ２ The power supply device according to claim 4, wherein the cross-sectional area is 2 mm or more.

6. The power supply device according to claim 4, wherein the metal terminal has a cylindrical or plate-like shape.

7. The power supply device according to claim 4, wherein the metal terminal has a cylindrical shape with a radius of 1 mm or more or a plate-like shape with a width of 2 mm or more.

8. The power supply device according to claim 4, wherein the metal member is a metal shielding plate that electromagnetically shields the substrate on which the Y capacitor is provided and another substrate, a metal housing that houses the substrate on which the Y capacitor is provided, or a metal cooler for cooling a semiconductor element provided outside the substrate on which the Y capacitor is provided, or a resin shielding plate, housing, or cooler having copper plating or a conductive paint applied to its surface.

9. The power supply device according to claim 8, wherein the metal member has a short connection distance to the Y capacitor among the shielding plate, the housing, and the cooler.

10. The power supply device according to claim 4, wherein the metal member has a shorter connection distance to the Y capacitor compared to other ground-connected members.

11. The power supply device according to claim 4, wherein the connection line from the Y capacitor to the metal member is electrically separated from the 0V pattern of the power line.

12. The power supply device according to any one of claims 1 to 11, a gate drive circuit that is supplied with power from the power supply device and turns on and off the gate of a power module mounted with a power semiconductor constituting an inverter circuit; A gate drive device comprising:

13. The power supply device according to any one of claims 1 to 11, an inverter circuit composed of a capacitor and a power module, a gate drive circuit that is supplied with power from the power supply device and turns on and off the gate of the power module; An inverter device comprising:

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