Method for manufacturing light-emitting device and light-emitting device

Abstract

To provide a method for manufacturing a light-emitting device which has high luminance and is excellent in contrast.SOLUTION: A method for manufacturing a light-emitting device includes: preparing an intermediate body in which a plurality of light-emitting elements having first surfaces as light extraction surfaces, second surfaces opposite to the first surfaces and side faces connecting the first surfaces and the second surfaces are arranged on a substrate; sieving and imparting a powder composition containing a reflective member and silicone resin powder, from above the first surfaces of the plurality of light-emitting elements, and filling with the powder composition, portions between the side faces of the plurality of light-emitting elements on the substrate; and giving vibrations to the powder composition, then applying a pressure in the thickness direction of the substrate and compressing and molding the substrate and forming a first coating member.SELECTED DRAWING: Figure 1B

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a light-emitting device and a light-emitting device.

Background Art

[0002] In recent years, high-output light-emitting devices configured using light-emitting elements such as LEDs as light sources have been used, and methods for manufacturing light-emitting devices having various characteristics have been proposed. For example, a method of producing an optical assembly by depositing a solid silicone-containing hot melt composition in powder form on an optical surface of an optical element and forming an encapsulant that substantially covers the optical surface of the optical element from the silicone-containing hot melt composition is known (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a method for manufacturing a light-emitting device and a light-emitting device that are highly bright and excellent in contrast.

Means for Solving the Problems

[0005] A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes preparing an intermediate body in which a plurality of light-emitting elements having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface are arranged on a substrate; sprinkling and applying a powder composition including a reflective member and silicone resin powder from above the first surface of the plurality of light-emitting elements, and filling the powder composition between the side surfaces of the plurality of light-emitting elements on the substrate; and applying vibration to the powder composition and then applying pressure in the thickness direction of the substrate to perform compression molding to form a first coating member.

[0006] Further, a light-emitting device according to an embodiment of the present disclosure includes a substrate, a plurality of light-emitting elements placed on the substrate and having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface, and a first coating member provided on the substrate and between the side surfaces of the plurality of light-emitting elements. The first coating member includes a reflective member and silicone resin, the refractive index of the silicone resin is 1.45 or less, the density of the reflective member in the first coating member is 2.0 g / cm 3 or more, and the reflectance of the first coating member with respect to the light of the emission peak of the light-emitting element is 70% or more.

[0007] A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes preparing an intermediate body in which a plurality of light-emitting elements having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface are arranged on a substrate; filling a powder composition between the side surfaces of the plurality of light-emitting elements; applying vibration to the powder composition and then applying pressure in the thickness direction of the substrate to perform compression molding to form a first coating member.

Advantages of the Invention

[0008] According to an embodiment of the present disclosure, it is possible to provide a method for manufacturing a light-emitting device and a light-emitting device that have high brightness and excellent contrast.

Brief Description of the Drawings

[0009]

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Embodiments for Carrying Out the Invention

[0010] Hereinafter, a method for manufacturing a light-emitting device according to an embodiment of the present invention (hereinafter, sometimes referred to as "a method for manufacturing a light-emitting device according to an embodiment") and a light-emitting device (hereinafter, sometimes referred to as "a light-emitting device according to an embodiment") will be described with reference to the drawings. In the following description, terms indicating a specific direction or position (for example, "upper", "lower", and other terms including these terms) are used as necessary. However, the use of these terms is for facilitating the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of those terms. Also, parts or members denoted by the same reference numerals shown in a plurality of drawings indicate the same or equivalent parts or members.

[0011] In addition, the embodiments described below exemplify a light-emitting device and a method for manufacturing the light-emitting device for embodying the technical idea of the present invention, and do not limit the present invention thereto. Further, the dimensions, materials, shapes, relative arrangements, etc. of the parts or members described below are not intended to limit the scope of the present invention only thereto, but are intended to be exemplified, unless otherwise specified. In addition, the content described in one embodiment is also applicable to other embodiments and modifications. Further, the dimensions and positional relationships of the parts or members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid excessive complexity of the drawings, schematic diagrams omitting the illustration of some parts or members may be used, or end views showing only the cut surface as a cross-sectional view may be used.

[0012] 〔Light-emitting device〕 The light-emitting device 100 according to the embodiment includes a substrate 11, a plurality of light-emitting elements 12 placed on the substrate 11, having a first surface 12a serving as a light extraction surface, a second surface 12b on the opposite side of the first surface 12a, and a side surface 12c connecting the first surface 12a and the second surface 12b, and a first coating member 18 provided on the substrate 11 and between the side surfaces 12c of the plurality of light-emitting elements 12. The light-emitting device 100 according to the embodiment preferably further includes a wavelength conversion member 14, a light-transmitting member 15, a protective element 25, and a frame body 150, and may further include other members as needed.

[0013] Conventionally, in a light-emitting device, it has been proposed to provide a reflective member of a binder material containing a white pigment on the side surfaces of a plurality of light-emitting elements on a substrate. In order to obtain a light-emitting device with high brightness and excellent contrast, when the content of the white pigment in the binder material is increased, the fluidity of the binder material is lost, and it is difficult to spread the reflective member over the entire surface of the substrate. In particular, since it is required to narrow the gaps between the side surfaces of the plurality of light-emitting elements, it is difficult to apply the binder material without gaps between the side surfaces of the plurality of light-emitting elements. Further, when the reflective member is diluted with a solvent to give the binder material fluidity, voids and cracks are likely to occur in the reflective member due to the volume shrinkage during drying of the solvent.

[0014] In contrast, in the light-emitting device 100 according to the embodiment, the first coating member 18 includes a reflective member and a silicone resin, the refractive index of the silicone resin is 1.45 or less, and the density of the reflective member in the first coating member 18 is 2.0 g / cm 3 or more, and the reflectance of the first coating member 18 with respect to the light of the emission peak of the light-emitting element 12 is 70% or more, so that it has high brightness and excellent contrast. This can be preferably realized by the manufacturing method of the light-emitting device according to the embodiment.

[0015] <Light-emitting device according to the first embodiment> FIG. 1A is a schematic plan view showing an example of a light-emitting device according to the first embodiment. FIG. 1B is a cross-sectional view taken along line IB-IB of FIG. 1A.

[0016] As shown in FIGS. 1A and 1B, the light-emitting device 100 according to the first embodiment includes a substrate 11, a light-emitting element 12, a first coating member 18, a wavelength conversion member 14, a protection element 25, and a frame 150. Hereinafter, each component of the light-emitting device 100 will be described.

[0017] <Substrate> The substrate 11 is a member that supports the light-emitting element 12 and the like. The substrate 11 mounts, for example, a protection element 25 in addition to the light-emitting element 12, and has a wiring 11a that is electrically connected to the electrodes of the light-emitting element 12 in order to electrically connect the light-emitting device 100 to the outside.

[0018] The planar shape of the substrate 11 can be various shapes such as a circle, an ellipse, a polygon such as a quadrilateral and a hexagon, and a polygon with rounded corners. Among these, the planar shape of the substrate 11 is preferably rectangular. The dimensions of the substrate 11 can be appropriately adjusted according to the required performance such as the dimensions and number of the light-emitting elements 12 arranged thereon.

[0019] The planar shape of the wiring 11a can be appropriately set according to the dimensions, number, etc. of the light-emitting elements 12 arranged thereon.

[0020] As the main material of the substrate 11, an insulating material that is difficult for light from the light-emitting element 12 and external light to transmit is preferable. Examples of such materials include ceramics such as aluminum oxide and aluminum nitride, and resins such as phenol resin, epoxy resin, silicone resin, polyimide resin, BT resin, and polyphthalamide. When using a resin, inorganic fillers such as glass fiber, silicon oxide, titanium oxide, and aluminum oxide may be mixed into the resin as necessary. Thereby, improvement of mechanical strength, reduction of thermal expansion coefficient, and improvement of light reflectance can be achieved. The substrate 11 may be formed by forming an insulating material on the surface of a metal member.

[0021] The wiring 11a is formed in a predetermined pattern on the insulating material. Examples of the material of the wiring include metals such as Au, Ag, Cu, Fe, Ti, Pd, Ni, Cr, Pt, W, Al, or alloys containing these. The wiring can be formed by plating, vapor deposition, sputtering, or the like. For example, when Au is used for the joining member between the light-emitting element and the substrate described later, it is preferable to use Au on the outermost surface of the wiring 11a from the viewpoint of improving the joining property.

[0022] <Light-emitting element> The light-emitting element 12 has a first surface 12a that serves as a light extraction surface, a second surface 12b on the opposite side of the first surface 12a, and a side surface 12c that connects the first surface 12a and the second surface 12b. A plurality of light-emitting elements 12 are arranged on the upper surface of the substrate 11. In this case, the light-emitting elements 12 may be arranged in a row in the first direction or may be arranged in a matrix. Among these, it is preferable that the light-emitting elements 12 are arranged in a row in the first direction, and as shown in FIG. 1A, it is more preferable that they are arranged in a row in the first direction. Thereby, a light-emitting device 100 having a horizontally long light distribution pattern suitable for a vehicle headlight can be obtained. For example, when the planar shape of the substrate 11 is rectangular as described above, it is preferable that the plurality of light-emitting elements 12 are arranged in a row along the direction in which the long side extends, taking the long side extension direction as the first direction. The plurality of light-emitting elements 12 are preferably arranged in a row at equal intervals.

[0023] The planar shape of the first surface 12a that serves as the light extraction surface of the light-emitting element 12 or the second surface 12b on the side opposite to the first surface 12a can be various shapes such as a circle, an ellipse, a polygon such as a quadrilateral and a hexagon, and a polygon with rounded corners. Among these, the planar shape of the first surface 12a or the second surface 12b of the light-emitting element 12 is preferably a quadrilateral, and more preferably a rectangle. Thereby, when arranging a plurality of light-emitting elements 12 in the first direction, the distance between the side surfaces 12c of adjacent light-emitting elements 12 can be made constant, and the plurality of light-emitting elements 12 can be arranged in close proximity. And a horizontally long rectangular light-emitting surface can be formed in a plan view as a whole.

[0024] Note that, although a plurality of light-emitting elements 12 are the same in design, errors occur due to member tolerances and mounting tolerances during manufacturing. In this specification, when it is said that "distance", "width", "height", "length", and "area" are the same, such errors are included within an allowable range and do not necessarily have to be exactly the same.

[0025] The vertical and horizontal dimensions of the first surface 12a and the second surface 12b of the light-emitting element 12, and the dimension of the side surface 12c (the height of the light-emitting element 12) connecting the first surface 12a and the second surface 12b of the light-emitting element 12 can be arbitrarily set. Among these, in order to realize a higher-output light-emitting device, it is preferable to use a large-sized light-emitting element 12. In a plan view, the vertical and horizontal dimensions of the first surface 12a and the second surface 12b of the light-emitting element 12 are preferably 600 μm or more, and more preferably 1,000 μm or more. Also, from the viewpoints of the uniformity of light emission intensity and ease of mounting, the vertical and horizontal dimensions of the first surface 12a and the second surface 12b of the light-emitting element 12 are preferably 2,000 μm or less.

[0026] The light-emitting element 12 is arranged separately from the adjacent light-emitting elements 12. In this case, the distance between the light-emitting elements 12 is, for example, in the range of 0.1 times or more and 0.5 times or less of one side along the first direction of the light-emitting element 12. Specifically, when using a light-emitting element 12 that is substantially square in plan view with vertical and horizontal dimensions of about 1,000 μm for the first surface 12a and the second surface 12b of the light-emitting element 12, the distance between the adjacent light-emitting elements 12 is in the range of 100 μm to 500 μm.

[0027] It is preferable to use a light-emitting diode for the light-emitting element 12. The light-emitting element 12 can be selected with an arbitrary wavelength. For example, as the blue and green light-emitting elements 12, those using a nitride semiconductor (In x Al y Ga 1-x-y N, 0≦x, 0≦y, x + y≦1), ZnSe, GaP can be mentioned. Also, as the red light-emitting element 12, GaAlAs, AlInGaP, etc. can be used. Furthermore, as the light-emitting element 12, a semiconductor light-emitting element made of other materials can also be used. The composition, emission color, dimensions, number, etc. of the light-emitting element 12 to be used can be appropriately selected according to the purpose. When using a light-emitting device having a phosphor, it is preferable to use a light-emitting element 12 made of a nitride semiconductor capable of emitting a short wavelength that can efficiently excite the phosphor.

[0028] The light-emitting element 12 is formed, for example, by laminating semiconductor layers on a light-transmissive support substrate such as a sapphire substrate for growth, and the support substrate side is the first surface 12a of the light-emitting element 12 and serves as the main light-emitting surface (light extraction surface). The support substrate may be removed, for example, by polishing, laser lift-off, etc.

[0029] The light-emitting element 12 preferably has a first electrode and a second electrode, for example, on the same surface side, that is, on the second surface 12b opposite to the light-emitting surface. In the light-emitting element 12, the first electrode and the second electrode are arranged such that, for example, the first electrode is arranged at the central portion, and the second electrodes are arranged so as to sandwich the first electrode.

[0030] The light-emitting element 12 is placed on the substrate 11 with the second surface 12b on which the electrodes are formed facing the substrate 11 as the bottom surface. Specifically, the first electrode or the second electrode of the light-emitting element 12 is connected to the wiring 11a provided on the substrate 11 via a bonding member.

[0031] Examples of the bonding member include bumps made of, for example, Au, Ag, Cu, or alloys containing these, solders such as Sn-Bi based, Sn-Cu based, Sn-Ag based, and Au-Sn based, eutectic alloys such as alloys mainly composed of Au and Sn, alloys mainly composed of Au and Si, alloys mainly composed of Au and Ge, or conductive pastes such as Au, Ag, and Pd, anisotropic conductive materials such as ACP and ACF, brazing materials of low melting point metals, conductive adhesives combining these, and conductive composite adhesives. Among these, it is preferable to use bumps from the viewpoint of position accuracy. Also, from the viewpoints of bonding strength and heat dissipation, it is preferable that the first electrode and the second electrode are each connected to the substrate 11 via a plurality of bumps.

[0032] When the light-emitting element 12 is bonded to the wiring by a bonding member such as a bump, a gap corresponding to the thickness of the bonding member is formed between the light-emitting element 12 and the substrate 11. At this time, by disposing a first covering member containing a reflective member in this gap, the light traveling from the light-emitting element 12 toward the substrate 11 can be reflected, making it easier to extract the light to the outside.

[0033] The first surface 12a of the light-emitting element 12 may have polishing or grinding marks. This is due to the fact that in the manufacturing method of the light-emitting device according to the embodiment, the polishing or grinding (S105) described later has been performed. However, the polishing or grinding marks on the first surface 12a of the light-emitting device are very fine and do not affect the luminance or contrast of the light-emitting device 100.

[0034] <First Covering Member> The first covering member 18 is on the substrate 11 and is provided between the side surfaces 12c of the plurality of light-emitting elements 12. The first covering member 18 has a first surface on the side opposite to the surface in contact with the substrate 11 (which may be referred to as the "upper surface 18a of the first covering member 18" or "exposed surface"). The side surface of the first covering member 18 is in contact with the side surface 12c of the light-emitting element 12 or the side surface of the frame body 150. In the light-emitting device 100 according to the first embodiment, the upper surface 18a of the first covering member 18 and the first surface 12a of the light-emitting element 12 are flush.

[0035] The first covering member 18 includes a reflective member and a silicone resin. The first covering member 18 is formed, for example, by a powder composition including a reflective member and silicone resin powder on the substrate 11 and covering the side surfaces 12c of the plurality of light-emitting elements 12. That is, since the first covering member 18 covers the substrate 11, the side surfaces 12c of the plurality of light-emitting elements 12, and the side surface of the wavelength conversion member 14, the side surface of the first covering member is in contact with the side surface 12c of the light-emitting element 12. Therefore, the first covering member 18 covers the outer peripheral side surfaces of the plurality of light-emitting elements 12 and the outer peripheral side surfaces of the wavelength conversion member 14. Further, when the light-emitting device 100 has a light-transmissive member 15, the first covering member 18 further covers the outer peripheral side surface of the light-transmissive member 15, so that the side surface of the first covering member 18 is in contact with the side surface 12c of the light-transmissive member 15. When the light-emitting device 100 has a frame body 150, the first covering member 18 is provided in the frame body 150 on the substrate 11 and between the side surfaces 12c of the plurality of light-emitting elements 12 and between the side surfaces 12c of the plurality of light-emitting elements 12 and the side surface of the frame body 150, and the side surface of the first covering member 18 is in contact with the side surface 12c of the light-emitting element 12 and the side surface of the frame body 150.

[0036] Examples of the reflective member used for the first covering member 18 include titanium oxide, silica, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, zinc oxide, boron nitride, and the like. These may be used alone or in combination of two or more. Among these, it is preferable to use titanium oxide having a relatively high light reflectance and refractive index.

[0037] Examples of the silicone resin used for the first coating member 18 include straight silicone resins and modified silicone resins. Examples of the straight silicone resins include methyl silicone resins and methylphenyl silicone resins. Examples of the modified silicone resins include alkyd-modified silicone resins, polyether silicone resins, epoxy-modified silicone resins, acrylic-modified silicone resins, polyester-modified silicone resins, amino-modified silicone resins, and carboxy-modified silicone resins. These may be used alone or in combination of two or more.

[0038] The refractive index of the silicone resin used for the first coating member 18 is not particularly limited as long as it is 1.45 or less, but it is preferably 1.41 or more. The refractive index of the silicone resin can be measured by a prism coupler refractometer.

[0039] As described in the item (filling with the powder composition) to be described later, the silicone resin is in powder form when filling the powder composition between the side surfaces 12c of the plurality of light-emitting elements 12 on the substrate 11 in the manufacturing process of the light-emitting device. However, when heated, it melts, and when further heated, it cures to become a solid resin that is not in powder form. The silicone resin in the first coating member 18 in the light-emitting device 100 is a solid after curing. Since the heated and melted silicone resin has a high viscosity, the reflective member can be uniformly dispersed without sedimentation. Therefore, the first coating member 18 has a reflective member uniformly dispersed in the silicone resin.

[0040] The content of the reflective member in the first coating member 18 is not particularly limited, but the lower limit is preferably 50% by volume or more, more preferably 70% by volume or more. When the content of the reflective member in the first coating member 18 is 50% by volume or more, the reflectance of the light emitting device 100 is improved. Also, the upper limit of the content of the reflective member in the first coating member 18 is not particularly limited, but is preferably 85% by volume or less, more preferably 80% by volume or less. When the content of the reflective member in the first coating member 18 is 85% by volume or less, the reflective member is suitably filled between the side surfaces 12c of the plurality of light emitting elements 12. The lower limit and the upper limit of the content of the reflective member in the first coating member 18 can be appropriately combined, preferably 50% by volume or more and 85% by volume or less, more preferably 70% by volume or more and 80% by volume or less.

[0041] The content of the reflective member in the first coating member 18 can be measured by image analysis based on an electron micrograph.

[0042] The density of the reflective member in the first coating member 18 is 2.0 g / cm 3 or more, preferably 2.5 g / cm 3 or more. When the density of the reflective member in the first coating member 18 is 2.0 g / cm 3 or more, a light emitting device with high brightness and excellent contrast can be obtained. The density of the reflective member in the first coating member 18 can be measured by a water displacement type densitometer.

[0043] The reflectance of the first coating member 18 with respect to the light at the emission peak of the light emitting element 12 is 70% or more, preferably 50% or more. When the reflectance of the first coating member 18 with respect to the light at the emission peak of the light emitting element 12 is 70% or more, a light emitting device with high brightness and excellent contrast can be obtained. The reflectance of the first coating member 18 with respect to the light at the emission peak of the light emitting element 12 can be measured by a spectrophotometer.

[0044] The upper surface 18a of the first covering member 18 preferably has polishing or grinding marks. This is due to the fact that in the manufacturing method of the light-emitting device according to the embodiment, polishing or grinding (S105) described later has been performed. However, the polishing or grinding marks on the upper surface of the first covering member 18 are very fine and do not affect the luminance or contrast of the light-emitting device 100.

[0045] <Wavelength conversion member> The wavelength conversion member 14 is disposed so as to be in contact with the first surface 12a of the light-emitting element 12. The wavelength conversion member 14 absorbs at least a part of the light emitted from the first surface 12a of the light-emitting element 12 and emits light with the wavelength of the absorbed light converted. Note that the light-emitting device 100 according to the embodiment may not have the wavelength conversion member 14.

[0046] The wavelength conversion member 14 is preferably a plate-like member. Specifically, the wavelength conversion member 14 has, for example, a second surface (hereinafter sometimes referred to as the "lower surface of the wavelength conversion member 14") that is in contact with the first surface 12a of the light-emitting element 12 or on the side where the first surface 12a of the light-emitting element 12 is disposed, a first surface on the opposite side of the second surface of the wavelength conversion member 14 (hereinafter sometimes referred to as the "upper surface of the wavelength conversion member 14"), and a side surface (hereinafter sometimes referred to as the "side surface of the wavelength conversion member 14") that connects the first surface and the second surface of the wavelength conversion member 14. The upper surface of the wavelength conversion member 14 corresponds to the light extraction surface of the light-emitting device 100. The lower surface of the wavelength conversion member 14 is disposed so as to be in contact with the first surface 12a of the light-emitting element 12. The lower surface of the wavelength conversion member 14 and the first surface 12a of the light-emitting element 12 are preferably joined.

[0047] The upper surface and the lower surface of the wavelength conversion member 14 are preferably flat and more preferably parallel to each other. The side surface of the wavelength conversion member 14 may be a vertical surface perpendicular to the upper surface and / or the lower surface of the wavelength conversion member 14, or may have an inclined surface inclined with respect to the upper surface and / or the lower surface of the wavelength conversion member 14. Further, the wavelength conversion member 14 may have a step between the upper surface and the lower surface of the wavelength conversion member 14.

[0048] The lower surface of the wavelength conversion member 14 preferably has an area that is about 0.8 times or more and 1.5 times or less the area of the first surface 12a of the light emitting element 12. The outer edge of the lower surface of the wavelength conversion member 14 may coincide with the outer edge of the first surface 12a of the light emitting element 12, but is preferably located inside or outside the outer edge of the first surface 12a of the light emitting element 12. That is, in a plan view, it is preferable that either the outer edge of the first surface 12a of the light emitting element 12 or the outer edge of the lower surface of the wavelength conversion member 14 is included in the other.

[0049] The thickness of the wavelength conversion member 14 can be, for example, in the range of 50 μm or more and 300 μm or less. The wavelength conversion member 14 may be formed by sintering, bonding, or adhering phosphor particles, or may be formed by dispersing a phosphor in a resin, ceramics, or the like and solidifying it, or may be formed by fixing phosphor particles on the surface of a translucent plate material such as a glass plate or a ceramic plate by screen printing, discharging, or the like.

[0050] Examples of the wavelength conversion member 14 include phosphors. As the phosphor, those known in the art can be used, and those that can be excited by the light emitted from the light emitting element 12 are preferably used. For example, as a phosphor that emits green light, yttrium aluminum garnet-based phosphors (for example, Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (for example, Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (for example, Tb3(Al,Ga)5O 12:(Ce) - based phosphors, silicate - based phosphors (e.g., (Ba,Sr)2SiO4:Eu), chlorosilicate - based phosphors (e.g., Ca8Mg(SiO4)4C l2 :Eu), β - sialon - based phosphors (e.g., Si 6-z Al z O z N 8-z :Eu(0 < z < 4.2)), SGS - based phosphors (e.g., SrGa2S4:Eu), etc. Examples of yellow - emitting phosphors include α - sialon - based phosphors (e.g., M z (Si,Al) 12 (O,N) 16 (where 0 < z ≤ 2 and M is a lanthanide element other than Li, Mg, Ca, Y, or La and Ce), etc. In addition, among the above green - emitting phosphors, there are also yellow - emitting phosphors.

[0051] Also, for example, yttrium aluminum garnet - based phosphors can shift the emission peak wavelength to the longer - wavelength side by substituting a part of Y with Gd, enabling yellow emission. Among them, there are also fluorescent substances capable of orange emission. Examples of red - emitting phosphors include nitrogen - containing calcium aluminosilicate (CASN or SCASN) - based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), BSESN - based phosphors (e.g., (Ba,Sr,Ca)2Si5N8:Eu), etc. In addition, manganese - activated fluoride - based phosphors (phosphors represented by the general formula (I) A2[M 1-a Mn a F6] (where in the above general formula (I), A is at least one selected from the group consisting of K, Li, Na, Rb, Cs, and NH4, M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a satisfies 0 < a < 0.2)) are included. A representative example of this manganese - activated fluoride - based phosphor is a phosphor of manganese - activated potassium fluorosilicate (e.g., K2SiF6:Mn).

[0052] By combining these phosphors with a blue light-emitting element or an ultraviolet light-emitting element, a light-emitting device having a desired emission color (for example, a white light-emitting device) can be manufactured.

[0053] <Protective element> As shown in FIG. 1A, the protective element 25 is placed on the upper surface of the substrate 11, separated from the light-emitting element 12 in the first direction. The distance between the light-emitting element 12 and the protective element 25 is, for example, in the range of 0.1 times or more and 0.5 times or less of one side along the second direction perpendicular to the first direction of the light-emitting element 12. Further, the protective element 25 is preferably arranged at substantially the center of the row of a plurality of light-emitting elements 12 arranged in the first direction in the first direction. Note that the light-emitting device 100 according to the first embodiment may not have the protective element 25.

[0054] Examples of the protective element 25 include a capacitor, a varistor, a Zener diode, and a bridge diode.

[0055] As shown in FIG. 1A, the protective element 25 is preferably arranged such that the side surface of the protective element 25 faces the side surface 12c of the light-emitting element 12. Thereby, the distance between the side surface of the opposing protective element 25 and the side surface 12c of the light-emitting element 12 can be made constant, and they can be arranged in proximity.

[0056] The planar shape of the protective element 25 is, for example, substantially rectangular. The dimensions of the length, width, and height of the protective element can be arbitrarily set. Among these, from the viewpoint of miniaturization of the light-emitting device, in a plan view, the length and width dimensions of the protective element are preferably smaller than the length and width dimensions of the light-emitting element 12. Also, the height of the protective element is preferably lower than the combined height of the light-emitting element and the light-transmissive member.

[0057] <Frame body> The frame body 150 is a member that is disposed on the substrate 11, surrounds a plurality of light-emitting elements 12, and supports the first covering member 18. The light-emitting device 100 according to the embodiment may not have the frame body 150, but it is preferable to have the frame body 150 in terms of filling the entire light-emitting device 100 with the first covering member 18.

[0058] As shown in FIGS. 1A and 1B, the frame body 150 is disposed on the substrate 11 so as to surround a plurality of light-emitting elements 12, and preferably surrounds a plurality of light-emitting elements 12 to which the wavelength conversion member 14 is joined, and the protection element 25, and is disposed on the substrate 11 separated from these wavelength conversion members 14, light-emitting elements 12, and protection elements 25. As shown in FIG. 1A, the frame body 150 shows a substantially rectangular annular structure in plan view. In this case, the rectangular shape may be a rounded rectangular shape, and at least a part of the connecting portion may have a so-called round shape.

[0059] Examples of the material of the frame body 150 include metals, alloys, ceramics, resins, and the like. Examples of the metal include Fe, Cu, Ni, Al, Ag, Au, Al, Pt, Ti, W, Pd, and the like. Examples of the alloy include an alloy containing at least two selected from the group consisting of Fe, Cu, Ni, Al, Ag, Au, Al, Pt, Ti, W, and Pd.

[0060] Examples of the resin as the material of the frame body 150 include insulating resins. As the insulating resin, either a thermosetting resin or a thermoplastic resin may be used. Specific examples of the resin include epoxy resin, silicone resin, modified epoxy resin, modified silicone resin, polyester resin, polyimide resin, modified polyimide resin, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, and the like. These may be used alone or in combination of two or more. Among these, it is preferable to use a thermosetting resin such as an epoxy resin or a silicone resin, which is excellent in heat resistance and light resistance. Further, the resin of the frame body 150 may be a translucent resin.

[0061] The frame body 150 may have a metal, an alloy, or a ceramic embedded in a resin-formed frame body, or a part of the frame body 150 may be formed of resin and another part may be formed of a metal, an alloy, or a ceramic.

[0062] Also, the material of the frame body 150 may be a mixture containing a resin and a light-reflective substance. As the light-reflective substance, it is preferable to use a member that is difficult to absorb light from the light-emitting element 12 and has a large refractive index difference with respect to the resin. Such light-reflective substances include, for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, yttrium oxide, yttria-stabilized zirconia, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, and the like. These light-reflective substances can be contained in the resin in a range of 5% by mass to 90% by mass. The viscosity of the mixed material of the resin and the light-reflective substance forming the frame body 150 is not particularly limited, but is preferably 200 Pa·s or more and 800 Pa·s or less, and more preferably 350 Pa·s or more and 450 Pa·s or less.

[0063] Also, the material of the frame body 150 may be a mixture containing a resin and a light-absorbing substance such as carbon black or graphite.

[0064] The light-emitting device according to the above first embodiment can be preferably manufactured by the manufacturing method of the light-emitting device according to the first embodiment described later.

[0065] <Light-Emitting Device According to the Second Embodiment> FIG. 2A is a schematic plan view showing an example of a light-emitting device according to the second embodiment. FIG. 2B is a cross-sectional view taken along line IIB-IIB of FIG. 2A.

[0066] As shown in FIGS. 2A and 2B, the light-emitting device 100A according to the second embodiment includes a substrate 11, a light-emitting element 12, a first coating member 18, a wavelength conversion member 14, a light-transmissive member 15, a protection element 25, and a frame body 150.

[0067] The light-emitting device 100A according to the second embodiment is the same as the light-emitting device 100 according to the first embodiment, except that the wavelength conversion member 14 is disposed above the first surface 12a of the light-emitting element 12 and that it has the translucent member 15. Hereinafter, the wavelength conversion member 14 and the translucent member 15 of the light-emitting device 100A will be described.

[0068] <Wavelength conversion member> The wavelength conversion member 14 is the same as the wavelength conversion member of the light-emitting device 100 according to the first embodiment, except that it is disposed above the first surface 12a of the light-emitting element 12.

[0069] That the wavelength conversion member 14 is disposed above the first surface 12a of the light-emitting element 12 means that another member such as an adhesive material may be disposed between the first surface 12a of the light-emitting element 12 and the lower surface of the wavelength conversion member 14. In other words, the lower surface of the wavelength conversion member 14 is disposed above the first surface 12a of the light-emitting element 12 so as to face the first surface 12a of the light-emitting element 12. Examples of the other member include a translucent member 15 such as an adhesive material, a glass plate, and a ceramic plate.

[0070] When one light-emitting element 12 is disposed for one wavelength conversion member 14, it is preferable that the lower surface of the wavelength conversion member 14 has the same area as the upper surface area of the translucent member 15, but the area may be about 0.8 times or more and 1.5 times or less. When two or more light-emitting elements 12 are disposed for one wavelength conversion member 14, the translucent member 15 may be disposed so as to cover the entire lower surface of the wavelength conversion member 14. The outer edge of the lower surface of the wavelength conversion member 14 preferably coincides with the outer edge of the upper surface of the translucent member 15, but may be located inside or outside the outer edge of the upper surface of the translucent member 15. That is, in plan view, it is preferable that either one of the outer edge of the upper surface of the translucent member 15 and the outer edge of the lower surface of the wavelength conversion member 14 is included in the other.

[0071] <Translucent member> The light-transmitting member 15 is a member that transmits the light emitted from the light-emitting element 12 and emits it to the outside. Examples of the light-transmitting member 15 include those that transmit 60% or more of the light (for example, light in the range of 320 nm or more and 850 nm or less) from the light-emitting element 12, and those that transmit 70% or more of the light are preferred. The light-transmitting member 15 preferably joins the lower surface of the wavelength conversion member 14 and the first surface 12a of the light-emitting element 12. Note that the light-emitting device 100 according to the first embodiment may not have the light-transmitting member 15.

[0072] Specifically, when the light-transmitting member 15 is a glass plate or a ceramic plate, for example, the first surface of the light-transmitting member 15 that joins the first surface 12a of the light-emitting element 12 (hereinafter sometimes referred to as the "lower surface of the light-transmitting member 15"), the opposite side of the first surface of the light-transmitting member 15, and the first surface that joins the lower surface of the wavelength conversion member 14 (hereinafter sometimes referred to as the "upper surface of the light-transmitting member 15"), and a side surface (hereinafter sometimes referred to as the "side surface of the light-transmitting member 15") that connects the first surface of the light-transmitting member 15 and the second surface of the light-transmitting member. The upper surface and the lower surface of the light-transmitting member 15 are preferably flat and more preferably parallel to each other. The side surface of the light-transmitting member 15 may be a vertical surface perpendicular to the upper surface and / or the lower surface of the light-transmitting member 15, or may have an inclined surface inclined with respect to the upper surface and / or the lower surface of the light-transmitting member 15. Further, the light-transmitting member 15 may have a step between the upper surface and the lower surface.

[0073] When the light-transmitting member 15 is an adhesive material, the light-transmitting member 15 may be disposed on the first surface 12a and the side surface of the light-emitting element 12, and the surface of the light-transmitting member 15 may have irregularities. For example, the light-transmitting member 15 may be disposed so as to climb up the side surface of the light-emitting element 12.

[0074] The thickness of the light-transmitting member 15 can be, for example, in the range of 5 μm or more and 300 μm or less, preferably 10 μm or more and 200 μm or less, and more preferably 15 μm or more and 100 μm or less.

[0075] The light-transmissive member 15 may be formed of any of, for example, inorganic materials such as glass, ceramics, and sapphire, and organic materials such as resins or hybrid resins containing one or more of silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, acrylic resins, phenolic resins, and fluororesins.

[0076] The light-transmissive member 15 may contain a light diffusing material. As the light diffusing material, any of those commonly used in the art such as titanium oxide, barium titanate, aluminum oxide, silicon oxide, zirconium oxide, aerosil, glass, glass fiber, or wollastonite fillers, and aluminum nitride may be used.

[0077] Further, the light-transmissive member 15 may contain a wavelength conversion member 14. Note that whether it is the light-transmissive member 15 or the wavelength conversion member 14, the name of the member with the larger total weight of the contained members shall be used. Examples of the light-transmissive member containing the wavelength conversion member 14 include a sintered body of a phosphor, a resin, glass, ceramics, or a material in which a phosphor is contained in other inorganic substances. Further, a resin layer containing a phosphor may be formed on the surface of a molded body such as resin, glass, or ceramics.

[0078] The light-emitting device according to the second embodiment described above can be preferably manufactured by the manufacturing method of the light-emitting device according to the first embodiment described later.

[0079] <Light-Emitting Device According to the Third Embodiment> FIG. 3A is a schematic plan view showing an example of the light-emitting device according to the third embodiment. FIG. 3B is a cross-sectional view taken along line IIIB-IIIB of FIG. 3A.

[0080] The light-emitting device 100B according to the third embodiment is the same as the light-emitting device 100 according to the first embodiment except that the shape of the upper surface 18a of the first covering member 18 is different. Hereinafter, the first covering member 18 of the light-emitting device 100B will be described.

[0081] <First Covering Member> The first covering member 18 is located on the substrate 11 and is provided between the side surfaces 12c of the plurality of light-emitting elements 12. As shown in FIG. 3B, the upper surface 18a of the first covering member 18 is higher in height than the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. The upper surface 18a of the first covering member 18 has a recess 19, and the bottom inside the recess 19 is the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. FIG. 3B shows an example in which the bottom inside the recess 19 is the upper surface 14a of the wavelength conversion member 14.

[0082] It is preferable that the bottom inside the recess 19 of the first covering member 18 has an area of about 0.9 times or more and 1 time or less the area of the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. The outer edge of the bottom inside the recess 19 of the first covering member 18 may coincide with the outer edge of the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14, or the outer edge of the bottom inside the recess 19 of the first covering member 18 may be located inside or outside the outer edge of the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. That is, in plan view, either one of the outer edge of the bottom inside the recess 19 of the first covering member 18 and the outer edge of the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14 may be included in the other.

[0083] The opening of the recess 19 of the first covering member 18 preferably has an area that is 0.9 times or more and 1 times or less the area of the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. The outer edge of the opening of the recess 19 of the first covering member 18 may coincide with the outer edge of the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. The outer edge of the opening of the recess 19 of the first covering member 18 may be located inside or outside the outer edge of the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. However, it is preferable that the outer edge of the opening of the recess 19 of the first covering member 18 is located inside the outer edge of the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. That is, in a plan view, it is preferable that the outer edge of the opening of the recess 19 of the first covering member 18 is included in the outer edge of the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. By adopting such a form, it is possible to reduce the spread of the light emitted from the light-emitting element 12 in a direction perpendicular to the thickness direction of the substrate 11 (the same direction as the surface direction of the first surface 12a of the light-emitting element 12), increase the light traveling straight in the thickness direction of the substrate 11 (the direction perpendicular to the first surface 12a of the light-emitting element 12), and obtain a light-emitting device with higher brightness and better contrast.

[0084] The light-emitting device according to the above-described third embodiment can be preferably manufactured by the manufacturing method of the light-emitting device according to the second embodiment or the manufacturing method of the light-emitting device according to the third embodiment, which will be described later.

[0085] 〔Manufacturing Method of Light-Emitting Device〕 The manufacturing method of the light-emitting device according to the embodiment includes preparing an intermediate body in which a plurality of light-emitting elements having a first surface serving as a light extraction surface, a second surface on the opposite side of the first surface, and side surfaces connecting the first surface and the second surface are arranged on a substrate, sprinkling and applying a powder composition containing a reflective member and silicone resin powder from above the first surface of the plurality of light-emitting elements, filling the powder composition on the substrate and between the side surfaces of the plurality of light-emitting elements, applying vibration to the powder composition, and then applying pressure in the thickness direction of the substrate to perform compression molding to form a first covering member, and further including other steps as necessary.

[0086] <Method for manufacturing a light-emitting device according to the first embodiment> FIG. 4 is a flowchart showing an example of a method for manufacturing a light-emitting device according to the first embodiment. The method for manufacturing a light-emitting device according to the first embodiment includes preparing an intermediate (S101), filling a powder composition (S103), and forming a first covering member (S104). In addition to the above steps, it is preferable to further include forming a frame on the substrate (S102) and polishing or grinding (S105). Hereinafter, an example of the method for manufacturing a light-emitting device according to the first embodiment will be described.

[0087] FIG. 5A is a cross-sectional view showing the preparation of an intermediate (S101) in the method for manufacturing a light-emitting device according to the first embodiment. FIG. 5B is a cross-sectional view showing the formation of a frame on the substrate in the method for manufacturing a light-emitting device according to the first embodiment. FIG. 5C is a cross-sectional view showing the filling of a powder composition in the method for manufacturing a light-emitting device according to the first embodiment. FIG. 5D is an enlarged cross-sectional view of the VD region in FIG. 5C. FIG. 5E is a cross-sectional view showing the formation of a first covering member in the method for manufacturing a light-emitting device according to the first embodiment. FIG. 5F is an enlarged cross-sectional view of the VF region in FIG. 5E. FIG. 5G is a cross-sectional view showing an example of compression molding of a powder composition in the formation of a first covering member in the method for manufacturing a light-emitting device according to the first embodiment. FIG. 5H is an enlarged cross-sectional view of the VH region in FIG. 5E.

[0088] (S101: Preparing an intermediate) As shown in FIG. 5A, in preparing an intermediate (S101), an intermediate 10 is prepared in which a plurality of light-emitting elements 12 having a first surface 12a that becomes a light extraction surface, a second surface 12b on the opposite side of the first surface 12a, and a side surface 12c connecting the first surface 12a and the second surface 12b are arranged on a substrate 11. In the method for manufacturing a light-emitting device according to the embodiment, "preparing" a member includes not only manufacturing the member, but also acquiring the member, such as purchasing the member or receiving the member by transfer.

[0089] The light-emitting element 12 is placed on the substrate 11 with the second surface 12b on which the electrodes are formed facing the substrate 11 as the lower surface. Specifically, the first electrode or the second electrode of the light-emitting element 12 is connected to the wiring 11a provided on the substrate 11 via a bonding member. As the bonding member, those described in the item <Light-emitting element> can be used.

[0090] In preparing the intermediate (S101), it may further include arranging the wavelength conversion member 14 so as to be in contact with the first surface 12a of the light-emitting element 12 or above the first surface 12a of the light-emitting element 12.

[0091] When arranging the wavelength conversion member 14 in contact with the first surface 12a of the light-emitting element 12 in preparing the intermediate (S101), as shown in FIG. 5A, the intermediate 10 includes the substrate 11, a plurality of light-emitting elements 12 arranged in the first direction on the upper surface of the substrate 11, and the wavelength conversion member 14 bonded to the first surface 12a which is the upper surface of each of the light-emitting elements 12.

[0092] When arranging the wavelength conversion member 14 in contact with the first surface 12a of the light-emitting element 12, the lower surface of the wavelength conversion member 14 and the first surface 12a of the light-emitting element 12 can be bonded using a translucent adhesive or the like as commonly used in the art. Also, the lower surface of the wavelength conversion member 14 and the first surface 12a of the light-emitting element 12 may be bonded using a direct bonding method such as pressure bonding, surface activation bonding, atomic diffusion bonding, or hydroxyl group bonding.

[0093] In preparing the intermediate (S101), when arranging the wavelength conversion member 14 above the first surface 12a of the light-emitting element 12, for example, a translucent member 15 is arranged between the light-emitting element 12 and the wavelength conversion member 14. Specifically, as shown in FIG. 2B, the intermediate 10 includes the substrate 11, a plurality of light-emitting elements 12 arranged in the first direction on the upper surface of the substrate 11, the translucent member 15 bonded to the first surface 12a which is the upper surface of each of the light-emitting elements 12, and the wavelength conversion member 14 bonded to the upper surface of each of the translucent members 15.

[0094] When the light-transmissive member 15 is arranged to be in contact with the lower surface of the wavelength conversion member 14, the upper surface of the light-transmissive member 15 and the lower surface of the wavelength conversion member 14 can be joined using a light-transmissive adhesive or the like, as commonly used in the art.

[0095] Further, in preparing the intermediate body (S101), it may further include arranging a protection element 25 that is spaced apart from and opposed to the light-emitting element 12 in a second direction orthogonal to the first direction and is arranged on the upper surface of the substrate 11.

[0096] (S102: Forming a frame on the substrate) As shown in FIG. 5B, it is preferable to form a frame (S102) on the substrate before forming the first coating member (S104). In forming a frame on the substrate (S102), a frame 150 surrounding the plurality of light-emitting elements 12 is formed on the substrate 11 before filling the powder composition. For example, when a plurality of light-emitting elements 12 are arranged in a row in the first direction on a rectangular substrate 11 in plan view, the frame 150 is preferably in a substantially rectangular frame shape surrounding the plurality of light-emitting elements 12. Forming a frame on the substrate (S102) may be performed before, after, or simultaneously with preparing the intermediate body (S101).

[0097] The frame 150 may be formed such that all sides have the same height and the same width, or some or all sides may be formed with different heights and / or different widths.

[0098] The height of the frame 150 from the upper surface of the substrate 11 is preferably higher than the first surface 12a of the light-emitting element 12, for example, as shown in FIG. 5B. Further, the height from the upper surface of the substrate 11 to the top of the frame 150 may be lower than the height from the upper surface of the substrate 11 to the upper surface of the wavelength conversion member 14, but is preferably higher than the height from the upper surface of the substrate 11 to the upper surface of the wavelength conversion member 14. For example, when the height from the upper surface of the substrate 11 to the upper surface of the wavelength conversion member 14 is 350 μm, the height of the frame 150 may be in the range of 150 μm or more and 400 μm or less. Thereby, in filling the powder composition (S103), the powder composition can be suitably applied between the first surfaces 12a of the plurality of light-emitting elements 12 and between the side surfaces 12c of the plurality of light-emitting elements 12.

[0099] The width of the frame 150 (that is, the length of the bottom side of the frame 150 in the direction orthogonal to the direction in which the frame 150 extends) only needs to have a strength that can stand on its own, and can be appropriately set according to its height, the material used, etc. The width of the frame 150 may be, for example, in the range of 200 μm or more and 600 μm or less.

[0100] The frame 150 can be formed, for example, using a device known in the art, for example, a discharge device (resin discharge device) capable of discharging a liquid resin continuously and at a constant discharge flow rate by air pressure or the like (see Japanese Patent Application Laid-Open No. 2009-182307). When using a discharge device, a frame 150 having a desired height and width can be formed by adjusting the moving speed and discharge flow rate of the needle of the discharge device.

[0101] (S103: Filling the powder composition) As shown in FIG. 5C, in filling the powder composition (S103), a powder composition 17 containing a reflective member and silicone resin powder is applied through a sieve 30 from above the first surface 12a of the plurality of light-emitting elements 12, and the powder composition 17 is filled on the substrate 11 and between the side surfaces 12c of the plurality of light-emitting elements 12. When the light-emitting device 100 has a frame 150, it is preferable to fill the powder composition 17 also between the side surface of the frame 150 on the side where the light-emitting element 12 is arranged and the side surface 12c of the light-emitting element 12.

[0102] Applying the powder composition 17 to the sieve 30 serves the purpose of removing the agglomeration of the powder composition 17 and evenly applying and filling the powder composition 17 between the side surfaces 12c of the plurality of light-emitting elements 12 on the substrate 11. Therefore, there are no particular restrictions on the dimensions (width and depth), shape, structure, and mesh size of the sieve 30, and it can be appropriately selected according to the dimensions of the light-emitting device 100, the particle size of the powder composition 17 used, and the like. The dimension (width) of the sieve 30 is preferably such that it can cover all of the plurality of light-emitting elements 12 in the light-emitting device 100, in that it is on the substrate 11 and the powder composition 17 can be evenly applied and filled between the side surfaces 12c of the plurality of light-emitting elements 12 in a single operation. Further, as the sieve 30, for example, when the powder composition 17 contains a reflective member having a particle size of 0.05 μm or more and 1 μm or less and a silicone resin powder having a particle size of 1 μm or more and 150 μm or less, a 100 m standard sieve (100 mesh) can be used. Also, there are no particular restrictions on the width, speed, and time for sieving the sieve 30. The sieving of the sieve 30 may be performed manually or using a known device (such as a sieving machine). Further, instead of the sieve 30 or together with the sieve 30, the powder composition 17 may be filled between the side surfaces 12c of the plurality of light-emitting elements 12 using a brush, squeegee, or the like.

[0103] In filling the powder composition (S103), the powder composition 17 only needs to be able to be filled between the side surfaces 12c of the plurality of light-emitting elements 12 on the substrate 11, but it is preferable to further apply the powder composition 17 on the first surfaces 12a of the plurality of light-emitting elements 12 and between the side surfaces 12c of the plurality of light-emitting elements 12. Thereby, in polishing or grinding (S105) described later, the upper surface 18a of the first coating member 18 and the first surface 12a of the light-emitting element 12 can be made flush.

[0104] Specifically, in the step of filling the powder composition (S103), as shown in FIG. 5D, the powder composition 17 filled between the side surfaces 12c of the plurality of light-emitting elements 12 may have voids (voids) due to the fluidity of the powder composition 17 or the structure of the light-emitting device 100 in gaps corresponding to the thickness of the joining member between the powder compositions 17, between the powder composition 17 and the side surface 12c of the light-emitting element 12, and between the second surface 12b of the light-emitting element 12 and the substrate 11. Although these voids are eliminated by forming the first covering member described later (S104), when the powder composition 17 is only provided on the substrate 11 and between the side surfaces 12c of the plurality of light-emitting elements 12 (the side surfaces 12c of the light-emitting elements 12), when forming the first covering member (S104), when the powder composition 17 is compression-molded, the powder composition 17 is compressed in the direction of the substrate 11, and the upper surface (exposed surface) of the powder composition 17 filled on the side surface 12c of the light-emitting element 12 may not be flush with the first surface 12a of the light-emitting element 12, and finally, the upper surface 18a of the first covering member 18 may become a concave portion between the side surfaces 12c of the plurality of light-emitting elements 12. On the other hand, in the step of filling the powder composition (S103), this can be prevented by providing the powder composition 17 so that the first surface 12a of the light-emitting element 12 is covered.

[0105] Further, when the silicone resin powder in the powder composition 17 is a condensation-type silicone resin powder, the volume may shrink due to condensation after curing. However, by providing the powder composition 17 on the first surfaces 12a of the plurality of light-emitting elements 12 and between the side surfaces 12c of the plurality of light-emitting elements 12, even if the condensation-type silicone resin powder shrinks, the upper surface 18a (exposed surface) of the first covering member 18 formed from the powder composition 17 filled on the side surface 12c of the light-emitting element 12 can be made flush with the first surface 12a of the light-emitting element 12.

[0106] <Powder composition> The powder composition 17 includes a reflective member and a silicone resin powder, and further includes other components as required.

[0107] The reflective member is as described in <the first coating member>. The particle size of the reflective member is not particularly limited as long as it can be filled between the side surfaces 12c of the plurality of light-emitting elements 12, but is preferably 0.05 μm or more and 1 μm or less. When the particle size of the reflective member is 1 μm or less, the gaps between the reflective members are reduced, and the contrast and brightness are improved. Further, from the viewpoint of efficiently scattering blue wavelength to yellow wavelength, the particle size of the reflective member is more preferably 0.15 μm or more and 0.35 μm or less. It is preferable to use a reflective member having a sharp particle size distribution, and it is more preferable to use a single particle size one in terms of being able to achieve close packing between the side surfaces 12c of the plurality of light-emitting elements 12. However, a reflective member having a broad particle size distribution having various particle sizes within the range of 0.05 μm or more and 1 μm or less may also be used.

[0108] The refractive index of the reflective member is not particularly limited, but the refractive index at a wavelength of 550 nm is preferably 2.52 or more and 2.72 or less. The larger the difference in refractive index between the silicone resin powder and the reflective member, the higher the contrast and brightness. The refractive index of the reflective member can be measured by the critical angle method using a spectrophotometer.

[0109] The silicone resin powder may be an addition-type silicone resin or a condensation-type silicone resin. The shape of the silicone resin powder is not particularly limited, and examples include crushed shape, spherical shape, etc. Among these, the spherical shape is preferable in terms of high fluidity.

[0110] The particle size of the silicone resin powder is not particularly limited as long as it can be filled between the side surfaces 12c of the plurality of light-emitting elements 12, but is preferably 1 μm or more and 150 μm or less. Further, as the silicone resin powder, a silicone resin powder having a broad particle size distribution having various particle sizes within the range of 1 μm or more and 150 μm or less may be used. By using a silicone resin powder having a broad particle size distribution, aggregation of the powder composition 17 is prevented, the fluidity is increased, and even when the space between the side surfaces of the plurality of light-emitting elements 12 is narrow, the powder composition 17 can enter without gaps.

[0111] The refractive index of the silicone resin powder is not particularly limited, but is preferably 1.36 or more and 1.43 or less. The greater the difference in refractive index between the silicone resin powder and the reflective member, the higher the contrast and brightness. The refractive index of the silicone resin powder can be measured by the critical angle method using a spectrophotometer.

[0112] The content of the reflective member in the powder composition 17 is not particularly limited, but is preferably 50% by volume or more, and more preferably 70% by volume or more. When the content of the reflective member in the powder composition 17 is 50% by volume or more, the reflectance of the light-emitting device 100 is improved. Also, the upper limit value of the content of the reflective member in the powder composition 17 is not particularly limited, but is preferably 85% by volume or less, and more preferably 80% by volume or less. When the content of the reflective member in the powder composition 17 is 85% by volume or less, the reflective member is suitably filled between the side surfaces 12c of the plurality of light-emitting elements 12. The lower limit value and the upper limit value of the content of the reflective member in the first coating member 18 can be appropriately combined, and are preferably 50% by volume or more and 85% by volume or less, and more preferably 70% by volume or more and 80% by volume or less.

[0113] (S104: Forming the first coating member) As shown in FIGS. 5E and 5G, in forming the first coating member (S104), after applying vibration v to the powder composition 17, pressure p is applied in the thickness direction of the substrate 11 and compression molding is performed to form the first coating member 18. In other words, in forming the first coating member (S104), in filling the powder composition (S103), after applying vibration v to the powder composition 17 provided on the substrate 11 and between the side surfaces 12c of the plurality of light-emitting elements 12, pressure p is applied in the thickness direction of the substrate 11 and compression molding is performed to form the first coating member 18.

[0114] In forming the first covering member (S104), by applying vibration v to the powder composition 17, as shown in FIG. 5F, the voids of the powder composition 17 in the gaps corresponding to the thickness of the bonding member between the powder compositions 17, between the powder composition 17 and the side surface 12c of the light-emitting element 12, and between the second surface 12b of the light-emitting element 12 and the substrate 11, which are generated by filling the powder composition (S103), can be reduced.

[0115] Further, after applying vibration v to the powder composition 17, by applying pressure p in the thickness direction of the substrate 11 to the powder composition 17 and compression molding, the voids in the gaps corresponding to the thickness of the bonding member between the powder compositions 17, between the powder composition 17 and the side surface 12c of the light-emitting element 12, and between the second surface 12b of the light-emitting element 12 and the substrate 11, which are generated by filling the powder composition (S103), can be further filled.

[0116] The method of applying vibration v to the powder composition 17 is not particularly limited, and examples include a method of applying vibration v from the lower surface of the substrate 11 (the surface opposite to the surface on which the light-emitting element 12 is disposed) to the intermediate body 10A of the light-emitting device to which the powder composition 17 is applied. The application of vibration v to the powder composition 17 may be performed manually or using a known device (for example, a vibration application device, etc.).

[0117] Also, the application of vibration v to the powder composition 17 in forming the first coating member (S104) may be performed simultaneously with filling the powder composition (S103). For example, vibration v may be applied to the powder composition 17 from above the first surface 12a of the plurality of light-emitting elements 12 while sprinkling and applying the powder composition 17, or from the lower surface of the substrate 11. Alternatively, the powder composition 17 may be disposed on the first surface 12a of the plurality of light-emitting elements 12, and vibration v may be applied to the powder composition 17 while filling the powder composition 17 between the side surfaces 12c of the plurality of light-emitting elements 12 using a brush, squeegee, or the like. As a method of simultaneously performing the formation of the first coating member (S104) and the application of vibration v to the powder composition 17, it may be performed manually or using a known device (for example, a vibrating sieve device, etc.). Thereby, filling the powder composition (S103) and forming the first coating member (S104) can be performed more efficiently, and it is possible to prevent a gap from being formed near the upper surface 18a of the first coating member 18 during compression molding.

[0118] There are no particular restrictions on the frequency, displacement, velocity, and acceleration of the vibration v applied to the powder composition 17. Also, there are no particular restrictions on the direction of the vibration v applied to the powder composition 17, and it may be in the thickness direction of the substrate 11 (the same direction as the thickness direction of the light-emitting element 12, the plane direction of the side surface 12c of the light-emitting element 12, the direction perpendicular to the plane directions of the first surface 12a and the second surface 12b of the light-emitting element 12), or in a direction perpendicular to the thickness direction of the substrate 11 (the direction perpendicular to the thickness direction of the light-emitting element 12, the direction perpendicular to the plane direction of the side surface 12c of the light-emitting element 12, the same direction as the plane directions of the first surface 12a and the second surface 12b of the light-emitting element 12, the direction of the arrow v in FIG. 5E). Among these, a direction perpendicular to the thickness direction of the substrate 11 is preferable.

[0119] In forming the first coating member (S104), after applying vibration v to the powder composition 17, as shown in FIG. 5G, pressure p is applied to the powder composition 17 in the thickness direction of the substrate 11 (direction p in FIG. 5G) for compression molding to form the first coating member 18.

[0120] As a method for applying pressure p to the powder composition 17 in the thickness direction of the substrate 11, there is no particular limitation, and it may be performed manually or using a known apparatus (for example, a compression molding apparatus, etc.). Note that the compression molding of the powder composition 17 is performed with the substrate 11 placed in the direction of gravity so that the filled powder composition 17 does not escape from between the side surfaces 12c of the plurality of light-emitting elements 12, and the first surface 12a of the light-emitting device is placed at a position opposite to the direction of gravity.

[0121] Regarding the pressing force and pressing time when compression molding the powder composition 17, there is no particular limitation as long as the pressing force does not break the light-emitting device 100 and each member, but the density of the reflective member in the first coating member 18 is 2.0 g / cm 3 It is preferable to compression mold the powder composition 17 so as to be 2.0 g / cm or more, more preferably at 0.02 MPa or more and 20 MPa or less, and press for 1 minute or more. By making the density of the reflective member in the first coating member 18 2.0 g / cm or more, it is possible to suitably obtain a light-emitting device with high luminance and excellent contrast. 3

[0122] When applying the powder composition 17 on the first surface 12a of the plurality of light-emitting elements 12 and between the side surfaces 12c of the plurality of light-emitting elements 12 in filling the powder composition (S103), in forming the first coating member (S104), the first coating member 18 is formed on the first surface 12a of the plurality of light-emitting elements 12 and between the side surfaces 12c of the plurality of light-emitting elements 12.

[0123] In forming the first covering member (S104), it is preferable to include heating the powder composition 17 to a temperature equal to or higher than the melting temperature of the silicone resin powder and equal to or lower than the curing temperature of the silicone resin powder, and curing at a temperature equal to or higher than the curing temperature of the silicone resin powder. Heating the powder composition 17 to a temperature equal to or higher than the melting temperature of the silicone resin powder and equal to or lower than the curing temperature of the silicone resin powder is preferably performed after or during the compression molding of the powder composition 17, and more preferably during the compression molding. Further, curing at a temperature equal to or higher than the curing temperature of the silicone resin powder is preferably performed after the compression molding, and more preferably after heating the powder composition 17 to a temperature equal to or higher than the melting temperature of the silicone resin powder and equal to or lower than the curing temperature of the silicone resin powder.

[0124] In forming the first covering member (S104), by heating the silicone resin powder to a temperature equal to or higher than the melting temperature of the silicone resin powder and equal to or lower than the curing temperature of the silicone resin powder, the silicone resin powder melts, and as shown in FIG. 5H, the melted silicone resin spreads into voids such as gaps corresponding to the thickness of the joining member between the powder compositions 17, between the powder composition 17 and the side surface 12c of the light-emitting element 12, and between the second surface 12b of the light-emitting element 12 and the substrate 11, and the voids can be eliminated. In particular, the melted silicone resin can efficiently fill the gaps between the reflective members.

[0125] Next, in forming the first covering member (S104), by heating the melted silicone resin to a temperature equal to or higher than the curing temperature of the silicone resin powder, the first covering member 18 in which the melted silicone resin is cured can be formed.

[0126] (S105: Polishing or grinding) After forming the first coating member (S104), it is preferable to polish or grind at least one of the upper surface 18a of the first coating member 18 and the first surface 12a of the light-emitting element 12 so that they are flush. In particular, when the powder composition 17 contains a condensation-type silicone resin or when applying the powder composition in the step of filling the powder composition (S103) between the first surfaces 12a of the plurality of light-emitting elements 12 and between the side surfaces 12c of the plurality of light-emitting elements 12, it is preferable to include polishing or grinding (S105). Thereby, the light-emitting device shown in FIG. 1B can be obtained.

[0127] In the step of filling the powder composition (S103), when the powder composition 17 is applied between the first surfaces 12a of the plurality of light-emitting elements 12 and between the side surfaces 12c of the plurality of light-emitting elements 12, by polishing or grinding (S105), the first coating member 18 disposed on the first surface 12a of the light-emitting element 12 can be removed to expose the first surface 12a of the light-emitting element 12, and the upper surface 18a of the first coating member 18 between the side surfaces 12c of the plurality of light-emitting elements 12 can be made flush with the first surface 12a of the light-emitting element 12, resulting in a light-emitting device with higher brightness and better contrast.

[0128] As a method of polishing or grinding at least one of the first coating member 18 and the first surface 12a of the light-emitting element 12, a known method can be used without particular limitation.

[0129] <Manufacturing method of a light-emitting device according to the second embodiment> FIG. 6 is a flowchart showing an example of a manufacturing method of a light-emitting device according to the second embodiment. The manufacturing method of the light-emitting device according to the second embodiment includes preparing an intermediate 10 (S201), filling a powder composition (S204), and forming a first coating member (S205). In addition to the above steps, it is preferable to further include forming a frame on a substrate (S202), forming a second coating member (S203), polishing or grinding (S206), and removing the second coating member (S207).

[0130] In the method for manufacturing a light-emitting device according to the second embodiment, preparing the intermediate body 10 (S201) is the same as preparing the intermediate body in the method for manufacturing a light-emitting device according to the first embodiment (S101). However, the other steps, forming the frame on the substrate (S202), forming the second coating member (S203), filling the powder composition (S204), forming the first coating member (S205), polishing or grinding (S206), and removing the second coating member (S207) are different from the method for manufacturing a light-emitting device according to the first embodiment. Hereinafter, an example of the method for manufacturing a light-emitting device according to the second embodiment will be described with reference to the differences from the method for manufacturing a light-emitting device according to the first embodiment.

[0131] FIG. 7A is a cross-sectional view showing an example of forming the second coating member in the method for manufacturing a light-emitting device according to the second embodiment. FIG. 7B is a cross-sectional view showing an example of filling the powder composition in the method for manufacturing a light-emitting device according to the second embodiment. FIG. 7C is a cross-sectional view showing an example of forming the first coating member in the method for manufacturing a light-emitting device according to the second embodiment. FIG. 7D is a cross-sectional view showing an example of polishing or grinding in the method for manufacturing a light-emitting device according to the second embodiment.

[0132] (S202: Forming a Frame on the Substrate) Forming the frame on the substrate (S202) can be performed in the same manner as forming the frame on the substrate (S102) in the method for manufacturing a light-emitting device according to the first embodiment. However, it is preferable to change the height from the upper surface of the substrate 11 to the top of the frame 150 as follows.

[0133] In forming the frame on the substrate (S202), the height of the frame 150 from the upper surface of the substrate 11 is preferably higher than the first surface 12a of the light-emitting element 12, for example, as shown in FIG. 7B. Also, the height from the upper surface of the substrate 11 to the top of the frame 150 may be lower than the height from the upper surface of the substrate 11 to the apex 40a of the convex portion of the second covering member 40, but is preferably the same as or higher than the height from the upper surface of the substrate 11 to the apex 40a of the convex portion of the second covering member 40. For example, when the height from the upper surface of the substrate 11 to the apex 40a of the convex portion of the second covering member 40 is 400 μm, the height of the frame 150 may be in the range of 200 μm or more and 450 μm or less. Thereby, in filling the powder composition (S204), the powder composition 17 can be suitably applied so as to cover the whole including the apex 40a of the convex portion of the second covering member 40.

[0134] (S203: Forming the second covering member) Forming the second covering member (S203) is to form the convex second covering member 40 on the first surface 12a of the plurality of light-emitting elements 12, as shown in FIG. 7A. Forming the second covering member (S203) is performed before filling the powder composition (S204). Forming the second covering member (S203) is preferably performed after preparing the intermediate body (S201). Forming the second covering member (S203) may be performed before or after forming the frame on the substrate (S202).

[0135] The convex shape means that in a cross-sectional view in the thickness direction of the light-emitting device 100, the surface in contact with the first surface 12a of the light-emitting element 12 is the bottom surface of the second covering member 40, and it has a convex shape on the side opposite to the surface in contact with the first surface 12a of the light-emitting element 12. The second covering member 40 is not particularly limited as long as it is convex, but a shape having a convex curved surface (sometimes referred to as a "dome shape") is preferable.

[0136] The second covering member 40 may be formed on the first surface 12a of all the light emitting elements 12 of the plurality of light emitting elements 12, or may be formed only on the first surface 12a of one or any number of two or more of all the light emitting elements 12 of the plurality of light emitting elements 12.

[0137] The planar shape of the second covering member 40 can be various shapes such as a circle, an ellipse, a polygon such as a quadrilateral and a hexagon, and a polygon with rounded corners. Among these, the planar shape of the second covering member 40 is preferably a quadrilateral, more preferably a rectangle, and still more preferably the same shape as the planar shape of the first surface 12a or the second surface 12b of the light emitting element 12.

[0138] The vertical and horizontal dimensions of the second covering member 40, and the dimension of the thickness of the second covering member 40 (the length from the contact surface of the second covering member 40 with the first surface 12a of the light emitting element 12 to the apex 40a of the convex portion of the second covering member 40) can be arbitrarily set. For example, in a plan view (top view), the vertical and horizontal dimensions of the second covering member 40 may be the same as the vertical and horizontal dimensions of the first surface 12a of the light emitting element 12 in the plan view of the first surface 12a of the light emitting element 12, at least one of the dimensions may be smaller, or at least one of the dimensions may be larger. However, the vertical and horizontal dimensions of the second covering member 40 are preferably 800 μm or more, and more preferably 1,000 μm or more. Also, from the viewpoints of the uniformity of the emission intensity and the reduction of light in the horizontal direction, the vertical and horizontal dimensions of the second covering member 40 are preferably 1,100 μm or less.

[0139] Examples of the material of the second coating member 40 include resins. As the resin as the material of the second coating member 40, either a thermosetting resin or a thermoplastic resin may be used. However, a thermoplastic resin is preferable in that it can be easily removed by heating in forming the first coating member (S205). Specific examples of the resin include epoxy resin, silicone resin, modified epoxy resin, modified silicone resin, polyester resin, polyimide resin, modified polyimide resin, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, and the like. These may be used alone or in combination of two or more. Among these, a Shore A hardness of 90 or less is preferable because it is easy to perform compression molding and easy to press the silicone resin in the first coating member 18.

[0140] As a method of forming the convex second coating member 40 on the first surface 12a of the plurality of light-emitting elements 12, for example, a method of forming the constituent resin material of the second coating member 40 by compression molding or injection molding so as to cover the first surface 12a of the light-emitting element 12 (hereinafter sometimes referred to as the "first method"), a method of optimizing the viscosity of the constituent resin material of the second coating member 40 and dropping or drawing it on the first surface 12a of the light-emitting element 12, and controlling the shape by the surface tension of the constituent resin material itself of the second coating member 40 (hereinafter sometimes referred to as the "second method") can be mentioned.

[0141] In the case of the second method, it is preferable in that the second coating member 40 can be formed by a simpler method without the need for a mold. Further, in the second method, as a method of adjusting the viscosity of the constituent resin material of the second coating member 40, in addition to adjustment by the viscosity inherent in the constituent resin material itself of the second coating member 40, the constituent resin material of the second coating member 40 can also be adjusted to a desired viscosity using a known solvent, a material similar to the reflective member used for the first coating member 18, a material similar to the phosphor of the wavelength conversion member 14, a colorant, and the like.

[0142] The amount of the constituent resin material of the second covering member 40 is not particularly limited and can be appropriately selected according to the dimensions of the first surface 12a of the light-emitting element 12. In removing the second covering member (S207), it can be appropriately selected according to the desired depth of the recess 19 on the upper surface 18a of the first covering member 18 after removing the second covering member 40 and the like.

[0143] (S204: Filling the powder composition) Filling the powder composition (S204) can be performed in the same manner as filling the powder composition (S103) in the manufacturing method of the light-emitting device according to the first embodiment. However, as shown in FIG. 7B, applying the powder composition 17 on the first surface 12a of the plurality of light-emitting elements 12 and between the side surfaces 12c of the plurality of light-emitting elements 12 is changed to applying the powder composition 17 on all surfaces other than the surface of the second covering member 40 that contacts the light-emitting element 12 (including the apex 40a of the convex portion of the second covering member 40) and between the side surfaces 12c of the plurality of light-emitting elements 12, or applying the powder composition 17 on the first surface 12a of the plurality of light-emitting elements 12, on all surfaces other than the surface of the second covering member 40 that contacts the light-emitting element 12 (including the apex 40a of the convex portion of the second covering member 40), and between the side surfaces 12c of the plurality of light-emitting elements 12. This makes it possible to form the recess 19 on the upper surface 18a of the first covering member 18 in the subsequent polishing or grinding (S206).

[0144] (S205: Forming the first covering member) Forming the first covering member (S205) can be performed in the same manner as forming the first covering member (S104) in the manufacturing method of the light-emitting device according to the first embodiment. However, it is preferable to perform it so that the second covering member 40 is not exposed when vibration is applied to the powder composition 17. Also, when the second covering member 40 is exposed when vibration is applied to the powder composition 17, after applying vibration to the powder composition 17 once, the powder composition 17 can be filled again (S204). After covering the second covering member 40 with the powder composition 17, pressure can be applied to the powder composition 17 in the thickness direction of the substrate 11 and compression-molded to form the first covering member 18.

[0145] By forming the first coating member (S205), as shown in FIG. 7C, the powder composition 17 is cured and the first coating member 18 is formed.

[0146] (S206: Polishing or grinding) Polishing or grinding (S206) is performed after forming the first coating member 18 (S205) on at least a part of the upper surface 18a of the first coating member 18 and a surface other than the surface in contact with the light-emitting element 12 in the second coating member 40.

[0147] In polishing or grinding (S206), in filling the powder composition (S204), since the powder composition was applied on the apex 40a of the convex portion of the second coating member 40 and between the side surfaces 12c of the plurality of light-emitting elements 12, the first coating member 18 disposed on the apex 40a of the convex portion of the second coating member 40 is polished or ground in forming the first coating member (S205). At the same time, the depth of polishing or grinding is appropriately adjusted to polish or grind at least a part of the surface other than the surface in contact with the light-emitting element 12 in the second coating member 40. Thereby, the first coating member 18 disposed on the apex 40a of the convex portion of the second coating member 40 can be removed and the second coating member 40 can be exposed. In polishing or grinding (S206), by polishing or grinding the second coating member 40 itself, the convex shape of the second coating member 40 changes. For example, in a cross-sectional view of the light-emitting device 100, it is preferable to change the convex shape of the second coating member 40 from a dome shape to a quadrangle (for example, a square, a rectangle, a trapezoid, etc.).

[0148] In polishing or grinding (S206), as shown in FIG. 7D, not all of the second coating member 40 is polished or ground, and polishing or grinding is performed up to a position where the second coating member 40 remains at a desired thickness (the length from the contact surface of the second coating member 40 with the first surface 12a of the light-emitting element 12 to the apex 40a of the convex portion of the second coating member 40).

[0149] In polishing or grinding (S206), the thickness of the second coating member 40 remaining after polishing or grinding is not particularly limited, but is preferably 10 μm or more and 120 μm or less.

[0150] As a method for polishing or grinding the first covering member 18 and the second covering member 40, a known method can be used without particular limitation.

[0151] (S207: Removing the second covering member) In removing the second covering member (S207), the second covering member 40 remaining after polishing or grinding (S206) is removed. As a result, a part (the region where the second covering member 40 was formed) of the upper surface 18a of the first covering member 18 shown in FIG. 3B becomes the recess 19, and the bottom surface inside the recess 19 becomes the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. In other words, the upper surface 18a of the first covering member 18 becomes a convex portion with respect to the first surface 12a of the light-emitting element 12 or the upper surface 14a of the wavelength conversion member 14. By adopting such a configuration, it is possible to reduce the spread of the light emitted from the light-emitting element 12 in the direction perpendicular to the thickness direction of the substrate 11 (the same direction as the surface direction of the first surface 12a of the light-emitting element 12), increase the light traveling straight in the thickness direction of the substrate 11 (the direction perpendicular to the first surface 12a of the light-emitting element 12), and obtain a light-emitting device with higher luminance and better contrast.

[0152] Note that the removal of the second covering member (S207) may be performed simultaneously with the polishing or grinding (S206), or may be performed as separate steps.

[0153] When the removal of the second covering member (S207) and the polishing or grinding (S206) are performed simultaneously, the second covering member 40 may be removed only by polishing or grinding when the thickness of the second covering member 40 remaining after polishing or grinding (the depth of the recess 19 in the upper surface 18a of the first covering member 18) reaches the desired thickness.

[0154] When removing the second covering member (S207) and polishing or grinding (S206) are performed as separate steps, after removing the second covering member (S207), the exposed second covering member 40 may be peeled off. When the second covering member 40 is a thermoplastic resin, it may be removed by heating the second covering member 40.

[0155] <Manufacturing method of a light-emitting device according to a third embodiment> FIG. 8 is a flowchart showing an example of a manufacturing method of a light-emitting device according to a third embodiment. The manufacturing method of the light-emitting device according to the third embodiment is a method of performing the manufacturing method of the light-emitting device according to the first embodiment and a part of the manufacturing method of the light-emitting device according to the second embodiment in two stages. Specifically, in the same manner as the manufacturing method of the light-emitting device according to the first embodiment, preparing an intermediate body (S101), forming a frame on a substrate (S102), filling a powder composition (S103), forming a first covering member (S104), and polishing or grinding (S105) are performed. Then, in the same manner as the manufacturing method of the light-emitting device according to the second embodiment, forming a second covering member (S203), filling a powder composition (S204), forming a first covering member (S205), polishing or grinding (S206), and removing the second covering member (S207) are performed on the first surface 12a of the light-emitting element 12.

[0156] Details of each step are as described in the manufacturing method of the light-emitting device according to the first embodiment and the manufacturing method of the light-emitting device according to the second embodiment.

Examples

[0157] Hereinafter, the present invention will be specifically described with reference to examples and comparative examples, but the present invention is not limited to these examples and comparative examples at all.

[0158] (Example 1) In Example 1, the light-emitting device shown in FIGS. 1A and 1B was manufactured as follows.

[0159] <S101: Preparing an intermediate body> On a substrate 11 made of aluminum oxide ceramics, a wiring 11a made of Au was formed in a predetermined pattern. Separately, a nitride semiconductor (In x Al y Ga 1-x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) as a light-emitting element 12 having a first surface 12a serving as a light extraction surface, a second surface 12b on the opposite side of the first surface 12a, and a side surface 12c connecting the first surface 12a and the second surface 12b. A wavelength conversion member 14 made of a yttrium aluminum garnet-based phosphor (for example, Y3(Al,Ga)5O 12 :Ce) was bonded to the first surface 12a of the light-emitting diode. As the light-emitting element 12, a rectangular one having a shape of 1,000 μm in length and 1,000 μm in width and 200 μm in thickness in plan view was used. As the wavelength conversion member 14, a rectangular one having a shape of 1,200 μm in length and 1,200 μm in width and 150 μm in thickness in plan view was used. Next, an intermediate body in which four light-emitting elements 12 were arranged in a row at equal intervals in the first direction with a pitch of 300 μm via bumps on the wiring 11a of the substrate 11 was prepared. At this time, the first electrode or the second electrode of the light-emitting element 12 was connected to the wiring 11a provided on the substrate 11 via a bonding member.

[0160] <S102: Forming a frame on the substrate> As shown in FIG. 5B, a frame 150 having a height of 400 μm made of an epoxy resin was formed on the wiring 11a of the substrate 11. The frame 150 had a substantially rectangular frame shape surrounding a plurality of light-emitting elements 12 in plan view.

[0161] <S103: Filling the powder composition> A powder composition 17 was prepared, which contained 75% by mass of titanium oxide (a mixture with a particle size of 0.05 μm or more and 1 μm or less) as a reflective member, and 25% by mass of spherical methyl silicone resin (a mixture with a particle size of 1 μm or more and 150 μm or less, refractive index: 1.41) as a silicone resin powder. Next, as shown in FIG. 5C, the powder composition 17 was applied from above the first surface 12a of the plurality of light-emitting elements 12 through a sieve 30, and was filled between the side surfaces 12c of the light-emitting elements 12 on the substrate 11 and between the side surfaces on the side where the light-emitting elements 12 of the frame body 150 are arranged and the side surfaces 12c of the light-emitting elements 12. At this time, the powder composition 17 was filled until it covered the wavelength conversion member 14.

[0162] <S104: Forming the first coating member> As shown in FIGS. 5E and 5G, after applying vibration v to the powder composition 17, pressure p (10 MPa) was applied in the thickness direction of the substrate 11 for 5 minutes for compression molding to form the first coating member 18.

[0163] <S105: Polishing or grinding> Next, the first coating member 18 was ground so that the upper surface 18a of the first coating member 18 and the first surface 12a of the light-emitting element 12 were flush, and the light-emitting device of Example 1 was obtained.

[0164] (Comparative Example 1) In filling the powder composition of Example 1 (S103), a light-emitting device of Comparative Example 1 was obtained in the same manner as in Example 1, except that the powder composition 17 was not applied through the sieve 30, and the powder composition 17 was scooped up with a spatula and placed on the substrate 11.

[0165] (Comparative Example 2) In forming the first coating member of Example 1 (S104), a light-emitting device of Comparative Example 2 was obtained in the same manner as in Example 1, except that vibration v was not applied to the powder composition 17.

[0166] (Comparative Example 3) In the formation of the first coating member of Example 1 (S104), a light-emitting device of Comparative Example 3 was obtained in the same manner as in Example 1, except that pressure p was not applied to the powder composition 17.

[0167] - Evaluation of luminance with the upper surface 14a of the wavelength conversion member 14 as the light-emitting area - The luminance with the upper surface 14a of the wavelength conversion member 14 as the light-emitting area in the light-emitting devices of Example 1 and Comparative Examples 1 to 3 was measured using a color luminance meter (Pro Metric). Based on the following evaluation criteria, the luminance was evaluated from the measurement values. The results are shown in Table 1 below. [Evaluation criteria for luminance] A: Luminance is 90 cd / mm 2 or more B: Luminance is 85 cd / mm 2 or more and less than 90 cd / mm 2 C: Luminance is less than 85 cd / mm 2

[0168] - Evaluation of the ratio of the luminance of the upper surface 14a of the adjacent wavelength conversion member 14 that is turned off to the luminance of the upper surface 14a of the wavelength conversion member 14 with the upper surface 14a as the light-emitting area - The ratio (contrast) of the luminance of the upper surface 14a of the adjacent wavelength conversion member 14 that is turned off to the luminance of the upper surface 14a of the wavelength conversion member 14 with the upper surface 14a as the light-emitting area in the light-emitting devices of Example 1 and Comparative Examples 1 to 3 was measured using a color luminance meter (Pro Metric). Based on the following evaluation criteria, the contrast was evaluated from the measurement values. The results are shown in Table 1 below. [Evaluation criteria for contrast] A: Contrast is 125 to 1% or more B: Contrast is 110 to 1% or more and less than 125 to 1% C: Contrast is less than 110 to 1%

[0169]

Table 1

[0170] ​​As described above, the present invention has been described based on specific embodiments, but these are merely presented as examples, and the present invention is not limited by the above embodiments. The above embodiments can be implemented in various other forms, and various combinations, omissions, replacements, additions, changes, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and its equivalent scope.

[0171] In addition to the above embodiments, the following supplementary notes are further disclosed. (Supplementary Note 1) Preparing an intermediate body in which a plurality of light-emitting elements having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface are arranged on a substrate; Sprinkling and applying a powder composition containing a reflective member and silicone resin powder from above the first surface of the plurality of light-emitting elements, being on the substrate, and filling the powder composition between the side surfaces of the plurality of light-emitting elements; After applying vibration to the powder composition, applying pressure in the thickness direction of the substrate and compression molding to form a first coating member, which is a method for manufacturing a light-emitting device. (Supplementary Note 2) In preparing the intermediate body, further including arranging a wavelength conversion member in contact with the first surface of the light-emitting element or above the first surface of the light-emitting element, which is the method for manufacturing a light-emitting device according to Supplementary Note 1. (Supplementary Note 3) Before filling the powder composition, further including forming a frame surrounding the plurality of light-emitting elements on the substrate, which is the method for manufacturing a light-emitting device according to Supplementary Note 1 or 2. (Supplementary Note 4) Before filling the powder composition, further including forming a convex second coating member on the first surface of the plurality of light-emitting elements, which is the method for manufacturing a light-emitting device according to any one of Supplementary Notes 1 to 3. (Supplementary Note 5) In filling the powder composition, the method for manufacturing a light-emitting device according to any one of Appendices 1 to 4, including applying the powder composition onto the first surface of the plurality of light-emitting elements. (Appendix 6) In filling the powder composition, the content of the reflective member in the powder composition is 70% by volume or more, and the method for manufacturing a light-emitting device according to any one of Appendices 1 to 5. (Appendix 7) In filling the powder composition, the particle size of the reflective member is 0.05 μm or more and 1 μm or less, and the particle size of the silicone resin powder is 1 μm or more and 150 μm or less, and the method for manufacturing a light-emitting device according to any one of Appendices 1 to 6. (Appendix 8) In forming the first coating member, heating the powder composition to a temperature equal to or higher than the dissolution temperature of the silicone resin powder and lower than the curing temperature of the silicone resin powder; and curing at a temperature equal to or higher than the curing temperature of the silicone resin powder, and the method for manufacturing a light-emitting device according to any one of Appendices 1 to 7. (Appendix 9) In forming the first coating member, compression-molding the powder composition so that the density of the reflective member in the first coating member is 2.0 g / cm 3 or more, and the method for manufacturing a light-emitting device according to any one of Appendices 1 to 8. (Appendix 10) After forming the first coating member, further polishing or grinding at least one of the upper surface of the first coating member and the first surface of the light-emitting element so that the upper surface of the first coating member and the first surface of the light-emitting element are flush, and the method for manufacturing a light-emitting device according to any one of Appendices 1 to 9. (Appendix 11) After forming the first coating member, polishing or grinding the upper surface of the first coating member and at least a part of the surface of the second coating member other than the surface in contact with the light-emitting element; The method for manufacturing a light-emitting device according to any one of Appendices 4 to 10, further comprising removing the second covering member. (Appendix 12) A substrate, A plurality of light-emitting elements placed on the substrate, having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, A first covering member provided on the substrate and between the side surfaces of the plurality of light-emitting elements, The first covering member includes a reflective member and a silicone resin, The refractive index of the silicone resin is 1.45 or less, The density of the reflective member in the first covering member is 2.0 g / cm 3 or more, and The reflectivity of the first covering member with respect to the light at the emission peak of the light-emitting element is 70% or more. A light-emitting device. (Appendix 13) The upper surface of the first covering member has polishing or grinding marks. The light-emitting device according to Appendix 12. (Appendix 14) The light-emitting device further includes a wavelength conversion member on the first surface of the light-emitting element or above the first surface of the light-emitting element. The light-emitting device according to Appendix 12 or 13. (Appendix 15) The light-emitting device further includes a frame surrounding the plurality of light-emitting elements, The first covering member is provided on the substrate and between the side surfaces of the plurality of light-emitting elements and between the side surfaces of the plurality of light-emitting elements and the side surface of the frame. The light-emitting device according to any one of Appendices 12 to 14. (Appendix 16) The upper surface of the first covering member and the first surface of the light-emitting element are flush. The light-emitting device according to any one of Appendices 12 to 15. (Appendix 17) The upper surface of the first covering member is higher than the first surface of the light-emitting element or the upper surface of the wavelength conversion member, In a cross-sectional view, the upper surface of the first coating member has a concave portion, and the bottom of the inside of the concave portion is the first surface of the light-emitting element or the upper surface of the wavelength conversion member. The light-emitting device according to any one of Appendices 14 to 16. (Appendix 18) Preparing an intermediate body in which a plurality of light-emitting elements having a first surface serving as a light extraction surface, a second surface on the opposite side of the first surface, and side surfaces connecting the first surface and the second surface are arranged on a substrate; Filling a powder composition between the side surfaces of the plurality of light-emitting elements; After applying vibration to the powder composition, applying pressure in the thickness direction of the substrate and compression molding to form a first coating member; A method for manufacturing a light-emitting device, including:

Explanation of Signs

[0172] 10, 10A... Intermediate body 11... Substrate 11a... Wiring 12... Light-emitting element 12a... First surface of the light-emitting element 12b... Second surface of the light-emitting element 12c... Side surface of the light-emitting element 14... Wavelength conversion member 14a... Upper surface of the wavelength conversion member 15... Translucent member 17... Powder composition 18... First coating member 18a... Upper surface of the first coating member 19... Concave portion 25... Protection element 40... Second coating member 40a... Vertex of the convex portion of the second coating member 100, 100A, 100B... Light-emitting device 150... Frame

Claims

1. Preparing an intermediate body in which a plurality of light-emitting elements having a first surface serving as a light extraction surface, a second surface on the opposite side of the first surface, and side surfaces connecting the first surface and the second surface are arranged on a substrate; Sprinkling and applying a powder composition containing a reflective member and silicone resin powder from above the first surface of the plurality of light-emitting elements, and filling the powder composition between the side surfaces of the plurality of light-emitting elements on the substrate; After applying vibration to the powder composition, applying pressure in the thickness direction of the substrate and compression molding to form a first coating member; A method for manufacturing a light-emitting device, including the above steps.

2. The method for manufacturing a light-emitting device according to claim 1, further including arranging a wavelength conversion member in contact with the first surface of the light-emitting element or above the first surface of the light-emitting element when preparing the intermediate body.

3. The method for manufacturing a light-emitting device according to claim 1, further including forming a frame surrounding the plurality of light-emitting elements on the substrate before filling the powder composition.

4. The method for manufacturing a light-emitting device according to claim 1, further including forming a convex second coating member on the first surface of the plurality of light-emitting elements before filling the powder composition.

5. The method for manufacturing a light-emitting device according to claim 1, including applying the powder composition on the first surface of the plurality of light-emitting elements when filling the powder composition.

6. The method for manufacturing a light-emitting device according to claim 1, wherein the content of the reflective member in the powder composition is 70% by volume or more.

7. The method for manufacturing a light-emitting device according to claim 1, wherein the particle size of the reflective member is 0.05 μm or more and 1 μm or less, and the particle size of the silicone resin powder is 1 μm or more and 150 μm or less.

8. When forming the first coating member, heating the powder composition to a temperature equal to or higher than the melting temperature of the silicone resin powder and equal to or lower than the curing temperature of the silicone resin powder; Curing at a temperature equal to or higher than the curing temperature of the silicone resin powder. The method for manufacturing a light-emitting device according to claim 1 includes the above steps.

9. In forming the first covering member, the method for manufacturing a light-emitting device according to claim 1 includes compression molding the powder composition such that the density of the reflective member in the first covering member is 2.0 g / cm ３ or more.

10. After forming the first covering member, at least one of the upper surface of the first covering member and the first surface of the light-emitting element is polished or ground so that the upper surface of the first covering member and the first surface of the light-emitting element are flush with each other. The method for manufacturing a light-emitting device according to claim 1 further includes this step.

11. After forming the first covering member, at least a part of the upper surface of the first covering member and at least a part of the surface of the second covering member other than the surface in contact with the light-emitting element are polished or ground. Removing the second covering member. The method for manufacturing a light-emitting device according to claim 4 further includes these steps.

12. A substrate. A plurality of light-emitting elements placed on the substrate, having a first surface serving as a light extraction surface, a second surface on the opposite side of the first surface, and a side surface connecting the first surface and the second surface. A first covering member provided on the substrate and between the side surfaces of the plurality of light-emitting elements. Having The first covering member includes a reflective member and a silicone resin. The refractive index of the silicone resin is 1.45 or less. The density of the reflective member in the first covering member is 2.0 g / cm ３ or more, and A light-emitting device in which the reflectance of the first covering member with respect to the light at the emission peak of the light-emitting element is 70% or more.

13. The light-emitting device according to claim 12, wherein the upper surface of the first covering member has polishing or grinding marks.

14. The light-emitting device according to claim 12, further having a wavelength conversion member on the first surface of the light-emitting element or above the first surface of the light-emitting element.

15. The light-emitting device further has a frame surrounding the plurality of light-emitting elements. The light-emitting device according to claim 12, wherein the first covering member is provided on the substrate and between the side surfaces of the plurality of light-emitting elements and between the side surfaces of the plurality of light-emitting elements and the side surface of the frame.

16. The light-emitting device according to claim 12, wherein the upper surface of the first covering member and the first surface of the light-emitting element are flush with each other.

17. The upper surface of the first covering member is higher than the first surface of the light-emitting element or the upper surface of the wavelength conversion member. In a cross-sectional view, the upper surface of the first covering member has a concave portion, and the bottom of the concave portion is the first surface of the light-emitting element or the upper surface of the wavelength conversion member. The light-emitting device according to claim 14.

18. Preparing an intermediate body in which a plurality of light-emitting elements having a first surface serving as a light extraction surface, a second surface on the opposite side of the first surface, and a side surface connecting the first surface and the second surface are arranged on a substrate. Filling a powder composition between the side surfaces of the plurality of light-emitting elements; After applying vibration to the powder composition, applying pressure in the thickness direction of the substrate and compression molding to form a first coating member; A method for manufacturing a light-emitting device, including the above steps.

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