Paddle chamber with Anti-splashing baffles

Abstract

To provide improved systems and methods that can be used to produce high quality devices and structures while protecting both the substrate and plating baths.SOLUTION: Electroplating systems according to embodiments of the present technology may include a plating chamber configured to deposit metal material onto substrates positioned in the plating chamber. The plating chamber may include a rotor and a vessel. The electroplating systems may include at least one of baffle positioned in the plating chamber. The at least one baffle may define a plurality of slots. The at least one baffle may be configured to limit or prevent fluid from splashing the rotor or the plating chamber during operation of the plating chamber.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] Cross - Reference to Related Applications This application claims the benefit and priority of U.S. Patent Application No. 17 / 071,806, entitled "PADDLE CHAMBER WITH ANTI - SPLASHING BAFFLES", filed on October 15, 2020. This document is hereby incorporated by reference in its entirety into this specification.

[0002] Technical Field This technology relates to components and devices for semiconductor manufacturing. More particularly, this technology relates to processing chamber components and other semiconductor processing apparatuses.

Background Art

[0003] Integrated circuits are made possible by a process of forming complexly patterned layers of material on a substrate surface. After formation, etching, and other processing on the substrate, metal or other conductive materials are often deposited or formed to provide electrical connections between components. Since this metallization may be performed after many manufacturing operations, problems during metallization can result in costly substrates or wafers that are not useful.

[0004] Electroplating is performed in an electroplating chamber by immersing the device side of the wafer in an electrolyte bath and bringing the electrical contacts on the contact ring into contact with the conductive layer on the wafer surface. A current is passed through the electrolyte and the conductive layer. Metal ions in the electrolyte plate the wafer, forming a metal layer on the wafer. The electroplating operation may include several operations including liquid distribution that can cause loss, dilution, or other effects on the plating fluid during the process.

Summary of the Invention

Problems to be Solved by the Invention

[0005] Accordingly, there is a need for improved systems and methods that can be used for the purpose of manufacturing high-quality devices and structures while protecting both the substrate and the plating bath. These and other needs are addressed by the present technology.

Means for Solving the Problems

[0006] An electroplating system according to an embodiment of the present technology can include a plating chamber configured to deposit a metallic material on a substrate disposed within the plating chamber. The plating chamber can include a rotor and a tank. The electroplating system can include at least one baffle disposed within the plating chamber. The at least one baffle can define a plurality of slots. The at least one baffle can be configured to limit or prevent fluid from splashing onto the rotor or the plating chamber during operation of the plating chamber.

[0007] In some embodiments, this at least one baffle can be disposed above at least a portion of the fluid conduit at the top of the tank. This at least one baffle can include a mounting tab that defines at least one mounting hole. This mounting tab can extend inside at least one of a plurality of slots. This at least one mounting hole can be sized to receive a mounting screw. This at least one baffle can include a mounting tab that defines at least one mounting hole. This mounting tab can be disposed outside the plurality of slots. At least one mounting hole sized to receive a mounting screw. This at least one baffle can be disposed horizontally adjacent to a weir thief elecrode assembly and vertically adjacent to a rotor and a paddle. This paddle can be disposed on the weir thief elecrode assembly and can be configured to move in at least one direction. This at least one baffle can prevent the movement of the fluid in at least one direction by using a plurality of slots to impede the movement of the fluid. The height of this at least one baffle can be more than 15% or about 15% of the length of this at least one baffle. A mesh can be disposed in each of the plurality of slots.

[0008] Some embodiments of the present technology can include baffles configured to prevent fluid from splashing onto the rotor or into the plating chamber during operation of the plating chamber. These baffles can include a plurality of slots. These baffles can include at least one mounting tab for attaching the baffle to the plating chamber. In some embodiments, this baffle can be at least one baffle. This at least one baffle can be disposed above at least a portion of the fluid conduit of the fluid at the top of the tank. This tank can be contained within the plating chamber. Each slot of the plurality of slots can be characterized by a width of less than 25% or about 25% of the length of the at least one baffle. This mounting tab can define at least one mounting hole. This mounting tab can extend into at least one of the plurality of slots. This at least one mounting hole can be sized to receive a mounting screw. This mounting tab can define at least one mounting hole. This mounting tab can be disposed outside the plurality of slots. This at least one mounting hole can be sized to receive a mounting screw. The height of this at least one baffle can be greater than 15% or about 15% of the length of the at least one baffle. This mounting tab can be a flange disposed on the baffle for coupling the baffle to the plating chamber. A mesh can be disposed in each slot of the plurality of slots.

[0009] Some embodiments of the present technology can include an electroplating system. These systems can include a tank assembly for holding an electrolyte solution. These systems can include a wear-shelf electrode assembly within the tank assembly. This wear-shelf electrode assembly can include a plenum inside a weir frame. These systems can include a plurality of spaced-apertures extending through the weir frame and into the plenum. These systems can include a weir ring attached to the weir frame. These systems can include at least one baffle disposed within the tank assembly. This at least one baffle can define a plurality of slots. This at least one baffle can be configured to prevent fluid from splashing onto a rotor or a plating chamber during operation of the electroplating system.

[0010] In some embodiments, this at least one baffle can be disposed at least partially above a fluid conduit of the electrolyte solution at the top of the tank assembly. This at least one baffle can include a mounting tab defining at least one mounting hole. This mounting tab can extend into at least one of the plurality of slots. This at least one mounting hole can be configured to facilitate attaching the at least one baffle to the wear-shelf electrode assembly. This at least one baffle can include a mounting tab defining at least one mounting hole. This mounting tab can be disposed outside the plurality of slots. This at least one mounting hole can be sized to receive a mounting screw. The height of this at least one baffle can be greater than 15% or about 15% of the length of the at least one baffle. A mesh can be disposed in each of the plurality of slots.

[0011] Such techniques can provide numerous benefits over conventional systems and techniques. For example, embodiments of the present technology can reduce or eliminate splashing of the plating fluid within the plating chamber. This can shorten downtime for cleaning and can help maintain additive levels in the fluid. These and other embodiments will be described in more detail, along with their advantages and features, in connection with the following description and the accompanying figures.

[0012] A further understanding of the nature and advantages of the disclosed embodiments can be achieved by reference to the remainder of the specification and the drawings.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4A

Figure 4B

Figure 5A

Figure 5B

Figure 6

Figure 7

Figure 8

Best Mode for Carrying Out the Invention

[0014] Some of the above figures are included as schematic diagrams. It should be understood that the purpose of the figures is for illustration, and that the magnification of the figures should not be considered constant unless specifically stated otherwise. Further, as schematic diagrams, these figures are provided to aid understanding and may include exaggerated content for the purpose of explanation, rather than including all aspects or information compared to a realistic representation.

[0015] In these figures, similar parts and / or features may have the same reference number labels. Further, by tracking the reference labels with letters identifying similar parts and / or features, various parts of the same type can be identified. If only the first reference number label is used in this specification, the description is applicable to any one of the similar parts and / or features having the same first reference number label regardless of the subscript.

[0016] Microelectronic devices such as semiconductor devices can be manufactured on the surface or inside of a wafer or workpiece. A typical wafer plating process may include depositing a metal seed layer on the surface of the wafer by vapor deposition. To expose this seed layer, a photoresist is deposited and patterned. The wafer is then transferred into a bath or head of an electroplating system where a current is passed through the wafer through an electrolyte solution to attach a blanket layer or a patterned layer of a metal material or other conductive material onto the seed layer. Examples of conductive materials include gold, silver, copper, cobalt, tin, nickel, and alloys of these metals. In subsequent processing steps, parts, contacts, conductive lines, or combinations thereof are formed on the wafer.

[0017] In some applications, it may be important for the plated metal film or metal layer to have a uniform thickness across the wafer or workpiece. Some electroplating systems use a current thief. A current thief is an electrode having the same polarity as the wafer. The current thief can be placed on or within the current thief electrode assembly and can operate by drawing current from the edge of the wafer. This can help keep the plating thickness at the edge of the wafer more uniform than the plating thickness on other parts of the wafer. The current thief can be a physical electrode near the edge of the wafer. Alternatively, the current thief can be a virtual current thief, in which case the physical electrode is placed away from the wafer. In this design, current from this remote physical electrode is flowed through the electrolyte to a location near the wafer. The electroplating process in wafer-level packaging applications and other applications is diverse, and the process and wafer pattern vary. Often, significant plating non-uniformity occurs along the edge of the wafer pattern. The non-uniformity can be caused by irregularities in the electric field due to pattern variations or by non-uniformities in mass transfer near the edge of the wafer.

[0018] Some electroplating processing apparatuses can use paddles or stirrers to agitate the electrolyte or fluid within the electroplating system and increase the mass transfer of metal ions in the electrolyte onto the wafer. This increased mass transfer can further improve plating uniformity. However, agitation of the electrolyte or fluid can sometimes lead to splashing onto parts of the electroplating system, such as the rotor or chamber of the electroplating system. The oscillatory motion of the paddle can create waves or wavelike motion in the fluid, and this fluid wave or wavelike motion can cause splashing when waves flowing in opposite directions come into contact. This splashing can have undesirable effects, including additional cleaning operations and acid contact on some chamber components that can cause damage over time. To correct or otherwise prevent these problems, the present technology can include one or more baffles within the electroplating system. These baffles can prevent fluid splashing by impeding the movement of the electrolyte or fluid.

[0019] In the remainder of the present disclosure, a specific plating process that utilizes the disclosed technology is identified as if by rote, but it will be readily understood that the systems and methods of the present disclosure are equally applicable to other metals and chamber configurations. Thus, the technology should not be considered limited to use only with these specific plating processes or chambers. In the present technology, one possible system and chamber that can include components according to embodiments of the present technology are discussed, and then additional variations and adaptations to this system according to embodiments of the present technology are described.

[0020] Figure 1 is a schematic diagram of an electroplating system 20 according to some embodiments of the present technology. The electroplating system 20 can include a head 30 that can be disposed above a tank assembly 36, which can be a chamber discussed further below. The electroplating system 20 can be a stand-alone unit, or can be one of a set of plating systems arranged as an array within an enclosure, in which case a wafer or workpiece is loaded into and unloaded from the processing apparatus by one or more robots. The head 30 can be supported on a lift or lift / rotation unit 34. The lift / rotation unit 34 is configured to lift the head 30, or turn the head 30 over, or both, in order to load and unload a wafer into and out of a rotor 32 within the head 30, and is further configured to lower the head 30 for processing to engage the head 30 with the tank assembly 36. The rotor 32 can include a contact ring that can make electrical contact with a wafer held within the rotor 32 during processing. Electrical control and power cables 40 that extend from the system to a facility connection or to a connection within a multi-processor automated system can be communicatively coupled to the lift / rotation unit 34 and internal head components. A rinse assembly 28 having a stepped drain ring can be disposed above the tank frame 50.

[0021] Figure 2 is a schematic view of the tank assembly 36 of an electroplating chamber according to some embodiments of the present technology. A wear - sheet electrode assembly 52 can be disposed near the tank frame 50 or the top of the tank, and a paddle 54 can be disposed at a position lower than the height of the segmented wear - sheet electrode assembly 52 within the tank assembly 36. The paddle 54 can be moved by a paddle actuator 56 that can be disposed on the tank mounting plate 38. A set of drain rings can be included within the rinse assembly, and this set of drain rings can be connected to a drainage and vacuum facility by one or more drain fittings 42 and suction fittings 44. A number of latches that can be placed on the lower cup or the base plate of the anode assembly can engage a latch ring 92 on the tank frame 50 or the tank mounting plate 38, and this latch ring 92 can enable the rapid installation and removal of the anode assembly.

[0022] The paddle 54 can be configured to reciprocate horizontally to facilitate the deposition of metal products on a substrate disposed within the electroplating system 20. Due to the oscillatory motion of this paddle 54, the fluid contained within the tank assembly 36 may form waves or cause a wavy motion. However, this motion may cause the waves to contact each other, thereby causing the plating fluid to be carried upward, and thereby causing the fluid to splash onto components of the electroplating system 20 such as the rotor 32 or the head 30. By incorporating baffles according to embodiments of the present technology at positions where splashing may occur, those baffles can limit or prevent fluid loss from the chamber.

[0023] Figure 3 is a schematic partial top view of an electroplating chamber 300, such as an electroplating chamber 300 with the rotor and head removed, according to some embodiments of the present technology. The chamber 300 can be a chamber similar to the tank assembly 36 of FIG. 1 or FIG. 2, can include any of the components, features, or characteristics discussed above, and may show additional features of an electroplating system according to embodiments of the present technology. As shown, the chamber can include a mounting plate 38, and a tank 50 can be seated within the mounting plate 38. As described above, a head having a rotor can extend into the tank to perform an electroplating operation.

[0024] A wear shield electrode assembly 52 can be coupled to this tank. The wear shield electrode assembly 52 can include several lugs that can be spaced around the assembly for connection to the tank frame. A paddle 54 can be disposed within the tank. The paddle 54 can be operated using a paddle actuator 56. The paddle actuator 56 can reciprocate the paddle to cause vibrations in the plating fluid during the plating operation. As shown, the connection between the wear shield electrode assembly 52 and the tank frame 50 can at least partially form a sealed area around the tank, and these areas can maintain the plating fluid within the electroplating chamber. However, as shown, in the areas around the two ends of the paddle actuator, the tank may be exposed radially outside the wear shield electrode assembly. During operation, the plating fluid flowing in waves due to the vibration of the paddle may cause interactions with other waves. This can cause the fluid to be ejected upward, and this fluid may splash out of the tank and onto any number of components, including the rotor disposed within the tank, the tank, the paddle actuator, and other aspects of the tank assembly.

[0025] In response to this, in some embodiments of the present technology, one or more baffles 302 can be incorporated at a position radially outside the wear-sleeve electrode assembly within the tank frame, and the one or more baffles 302 can be placed over the exposed inlet path of the tank. As shown, the chamber 300 includes three baffles 302A, 302B, and 302C, but it should be understood that a system according to an embodiment of the present technology can incorporate any number of baffles. As shown, the baffles 302 may not be symmetric and can include a number of shapes, dimensions, or configurations that can adapt to different aspects of the tank assembly. For example, the paddle actuator 56 can include a single coupling located at a first position around the tank assembly, while on the other hand, it can include a number of couplings located at a second position around the tank assembly, such as a second position opposite the first position. Although one and two connection positions are shown, it should be understood that embodiments of the present technology can include any number of connections. As shown, there may be a gap between the connections at the second position of the tank assembly, where those connections extend to the paddle near the lag of the wear-sleeve electrode assembly. Further, there may be a gap in the tank assembly on either side of the connection at the first position. In some embodiments, the baffles 302 can be included to adapt to each of these configurations.

[0026] In the first position, baffles 302, such as baffles 302A and 302B, can be disposed on either side of the actuator coupling, while in the second position, baffle 302C can be disposed between the two actuator couplings. Baffles 302A and 302B can each be coupled to the wear sleeve electrode assembly, for example, at the lug position. The apertures through the lugs of the baffle can accommodate lug connectors for indirectly coupling to the tank frame. Baffle 302C can be directly coupled to the tank frame between the two actuator couplings. During operation, chamber 300 may contain a fluid that facilitates processing within the electroplating system. Paddle 54 can reciprocate within this fluid, and this vibration creates waves or a wave-like motion within the fluid, and in conventional systems this fluid may splash out of the chamber. However, baffle 302 can impede this wave or wave-like motion of the fluid, thereby preventing the fluid from splashing out of the tank. Baffle 302 can be disposed radially adjacent to the wear sleeve electrode assembly 52 and vertically adjacent to the rotor 32 and head 30. Baffle 302 can be disposed vertically, and the height of the fluid can be the same as or lower than the height of baffle 302.

[0027] Figures 4A - 4B show schematic perspective views of a baffle 400, which may show a detailed view of the baffle 302C discussed above. As shown, the baffle 400 may show a baffle with a different number of slots 402 formed therein. By including additional slots, additional breaks for the electroplating fluid can be provided, but it is understood that any number of slots can be formed to create a barrier to fluid flow higher than the height of the baffle. The baffle 400 can be configured to prevent splashing in the tank of the electroplating system by impeding the movement of the fluid in the tank during the processing operation of the electroplating system. The baffle can be placed in the tank at the same height as the height of the fluid in the tank, or at a height at least slightly higher or at least slightly lower than the established constant or variable height of the plating fluid, e.g., the established constant or variable height of the plating fluid during operation.

[0028] As shown, the baffle 400 can define a set of slots, and these slots can be disposed at any distance along the baffle. For example, the slots can be formed at a distance less than 5 cm or about 5 cm, less than 4 cm or about 4 cm, less than 3 cm or about 3 cm, less than 2 cm or about 2 cm, less than 2 cm or about 2 cm, or less than that along the length of the baffle. The baffle shown in FIG. 4A includes 10 slots, and the baffle in FIG. 4B includes 14 slots, but these baffles can have the same or similar overall size. As shown, these slots can remain open, but in some examples, a mesh can be included in the set of slots to further reduce or eliminate splashing within the electroplating system. These baffles can be characterized by a height greater than 10% or about 10% of the length of the baffle, greater than 15% or about 15% of the length, greater than 20% or about 20% of the length, or more. These baffles can be constructed from materials suitable for use within an electroplating system, and such materials can include polymeric materials or other materials that can be made insulating and inert in the plating bath. For example, in some embodiments, these baffles can be made of polytetrafluoroethylene, polyetheretherketone, or other ceramic or polymeric materials that can be made stable in the plating bath, or alternatively, these baffles can include polytetrafluoroethylene, polyetheretherketone, or other ceramic or polymeric materials that can be made stable in the plating bath.

[0029] As shown in FIG. 4, the baffle 400 can include one or more mounting tabs 404 disposed within the slot. The mounting tabs 404 can be sized to receive mounting screws, tabs, bolts, or other coupling items for attaching the baffle to the tank of the electroplating system. Further, the mounting tabs 404 can be press-fitted or connected to slots formed in the tank frame or other connection mechanisms for coupling this component. As shown, the first long side can be relatively straight, while the opposite side can feature an arcuate contour to accommodate the rounded contour of the wear shield electrode assembly within the system.

[0030] Figures 5A - 5B show schematic perspective views of baffle 500 according to some embodiments of the present technology, and may show detailed views of baffles such as baffles 302A and 302B discussed above. Baffle 500 can include any feature or characteristic of any of the previously described baffles. As shown, these baffles may also show baffles with different numbers of slots 502 formed therein. For example, these baffles can be characterized by a shape that adapts to the contour of the radially outer trough of the wear - sheath electrode assembly described above. These baffles can include any number of slots, such as fewer slots 502A or more slots 502B. As shown, these slots can be maintained open, but in some examples, a mesh can be included in a set of slots to further reduce or eliminate splashing within the electroplating system. Further, baffle 500 can include mounting tabs 504 disposed laterally outward from the slots, and can be defined with apertures for receiving bolts or other coupling mechanisms for seating the baffle against the wear - sheath electrode assembly lag as described above. Unlike baffle 400, baffle 500 can be disposed on both sides of the actuator coupling as discussed above. Thus, these baffles can be limited to a single coupling location, which can be on the lag of the wear - sheath electrode assembly. Thus, in some embodiments, baffle 500 can be defined with a rim or flange 506 extending from the outer wall of the baffle, and this rim or flange 506 can enable the end of the baffle opposite the mounting tab to be seated against the trough assembly, thereby restricting or preventing movement during operation. For example, flange 506 can extend from the radially inner wall and the radially outer wall of the baffle, as shown, and can extend along any length of the baffle.

[0031] FIG. 6 is a schematic partial top view of the tank of the electroplating chamber 600 according to some embodiments of the present technology. As shown, the baffle 400 can be installed on top of the tank of the electroplating chamber 300. The baffle 400 can be attached to the tank by at least one mounting tab 602 having at least one mounting screw, bolt, or other fastener. In some embodiments, this at least one mounting tab 602 can be configured to attach the baffle 400 to the tank of the electroplating system, or can be configured to install the baffle 400 on the tank of the electroplating system by other means. The baffle 400 can be installed within the tank as shown, for example, seated against the back wall at a height higher than the fluid height of the plating fluid when contained in the tank, at a height lower than the fluid height of the plating fluid, or at a height substantially matching the fluid height of the plating fluid. In some embodiments further, the baffle 400 can be disposed radially outside the wear sheath electrode assembly 52, radially adjacent to the wear sheath electrode assembly 52, and vertically adjacent to both the rotor and the paddle of the electroplating system when in the operating position. For example, the baffle 400 can be disposed at a position higher than the paddle, while being disposed at a position lower than the position of the rotor.

[0032] FIG. 7 is a schematic partial perspective view of the tank of the electroplating chamber 700 according to some embodiments of the present technology. As shown, the baffle 500 can be installed on the tank of the electroplating chamber 300. The baffle 500 can be attached to the tank using at least one mounting screw, bolt or other fixture by at least one mounting tab 702 that can receive the bolts used with the lug of the wear sleeve electrode assembly 52. The baffle 500 can be installed in the tank as shown, for example, seated between the wear sleeve electrode assembly 52 and the drain passage defined within the tank frame. The baffle 500 can further be positioned at a height higher than the fluid height of the plating fluid when contained in the tank, at a height lower than the fluid height of the plating fluid, or at a height substantially coinciding with the fluid height of the plating fluid. In some further embodiments, the baffle 500 can be positioned radially outside the wear sleeve electrode assembly 52, adjacent to the wear sleeve electrode assembly 52 radially, and adjacent vertically to both the rotor and the paddle of the electroplating system when in the operating position.

[0033] For example, the baffle 400 can be positioned at a higher position than the paddle, while being positioned at a lower position than the position of the rotor. Further, the flange of the baffle described above can enable this baffle to seat on the rim of the wear sleeve electrode assembly 52 along the radially inner wall of the baffle. Further, this flange can also enable this baffle to seat on the rim of the tank frame along the radially outer wall of the baffle. This can enable the baffle to be substantially maintained in a predetermined position during operation when the system has a gap at the end of the baffle opposite the mounting tab. If there is no such gap, the mounting options within the system may be limited.

[0034] FIG. 8 shows a flowchart of a semiconductor processing process 800 according to some embodiments of the present technology, and may show an operating method of an electroplating system including the baffle described above. This process can be executed in various processing chambers including any of the chambers described above, and those chambers can include components according to embodiments of the present technology, such as any baffle, or other components discussed above. Process 800 can include some optional operations, and those operations may or may not be particularly relevant to some embodiments of the method according to the present technology.

[0035] The electroplating chamber can be any of the chambers described above and can include any number of baffles including any baffle configuration described above. In an optional operation 802, process 800 can include installing at least one baffle within the electroplating system. As described above, during operation, the paddle of the electroplating system can reciprocate in two or more directions within the tank of the electroplating chamber while the deposition process is being executed. To reduce or eliminate bounce, at least one baffle can be installed in the gap around the system, thereby forming a barrier against wave activity when waves or vortices extend upward and enter the slots of the baffle.

[0036] A substrate can be fixed to the head or rotor of an electroplating system by a chuck and a processing operation can be executed in operation 804. This process can include an electroplating operation, in which the substrate can be electroplated with a metal, such as any of the metals described previously. The substrate can be one that includes any number of features. To form a flow or wave in the plating fluid placed in the tank, the paddle can be reciprocated by operating the paddle with a paddle actuator, whereby, as described above, the electroplating operation can be improved. The wave or flow may be formed on the surface of the plating fluid, which may cause vertical movement. When these waves contact additional waves, the fluid may flow upward at the gap of the system, and splashing may occur if the gap is open. However, if baffles are installed in the system, the waves can extend upward and enter slots formed in the baffles, and these slots can form a barrier to wave formation. Thereby, wave formation can be cut off, whereby splashing within the system is restricted or prevented.

[0037] In some embodiments, when wave formation or splashing is sufficiently restricted or prevented, this method can be completed, but in some embodiments, adjustments can be made to the baffles. For example, the process can include inspecting the electroplating system for splashing in an optional operation 806 and determining whether the splashing has been sufficiently eliminated in an optional operation 808. If plating fluid has been directed onto the rotor or other chamber components, the method can include adjusting the baffles in an optional operation 810. For example, this adjustment can include adding baffles or raising or lowering the baffles relative to the plating fluid to better contact the fluid or better interact with the moving fluid in the tank.

[0038] Next, this process can be repeated for any number of substrates until fluid control is achieved. After bounce-back or fluid loss has been sufficiently reduced or eliminated, production can continue with an optional operation 812, and any number of substrates can be processed. By utilizing baffles according to any embodiment of the present technology, improved control of fluid flow within the electroplating chamber can be achieved. These baffles can be adapted to any number of chamber configurations and can have a size or shape that can be adapted to any number of gaps within the system where plating fluid might otherwise flow out of the tank.

[0039] In the above description, for purposes of explanation, numerous details have been set forth in order to provide an understanding of various embodiments of the present technology. However, it will be apparent to those skilled in the art that some embodiments can be practiced without some of these details or with additional details.

[0040] Although several embodiments have been disclosed, those skilled in the art will recognize that various changes, alternative structures, and equivalents can be used without departing from the spirit of the embodiments. Further, in order to prevent unnecessarily obscuring the present technology, some well-known processes and elements have not been described. Accordingly, the above description should not be construed as limiting the scope of the present technology.

[0041] When a range of values is indicated, unless the context clearly indicates otherwise, each intermediate value between the upper and lower limits of that range is also to be understood as specifically disclosed down to the smallest fractional part of the unit of the lower limit. Also included are narrower ranges between the explicitly stated value or an intermediate value not stated within the explicitly stated range and another explicitly stated value or another intermediate value within that explicitly stated range. The upper and lower limits of those narrower ranges may independently be included in or excluded from the range, and each range where either or both of the limits are included in the narrower range, or each range where neither of the limits are included in the narrower range, is also included within the scope of the technology and is subject to the specifically excluded limits within the explicitly stated range. When the explicitly stated range includes one or both of the limits, ranges excluding one or both of the included limits are also included.

[0042] As used in this specification and the appended claims, the singular forms "a", "an" and "the" include plural referents unless the context clearly indicates otherwise. Thus, for example, reference to "an aperture" includes reference to such plural apertures, reference to "the baffle" includes reference to one or more baffles and one or more equivalents thereof known to those skilled in the art, and the like.

[0043] Furthermore, the terms "comprise(s)", "comprising", "contain(s)", "containing", "include(s)" and "including", when used in this specification and the following claims, are intended to specify the presence of the stated feature, integer, component or operation, but do not preclude the presence or addition of one or more other features, integers, components, operations, acts or groups.

Claims

1. A plating chamber configured to deposit a metal material on a substrate disposed within the plating chamber, the plating chamber comprising a rotor and a tank, the plating chamber, and At least one baffle disposed within the plating chamber, the at least one baffle defining a plurality of slots, the at least one baffle configured to prevent fluid from splashing onto the rotor or the plating chamber during operation of the plating chamber, at least one of the baffles and An electroplating system comprising.

2. The electroplating system according to claim 1, wherein the at least one baffle is disposed above at least a portion of the top of the tank and above the fluid conduit of the fluid.

3. The electroplating system according to claim 1, wherein the at least one baffle further comprises a mounting tab defining at least one mounting hole, the mounting tab extending into at least one of the plurality of slots, the at least one mounting hole being sized to receive a mounting screw.

4. The electroplating system according to claim 1, wherein the at least one baffle further comprises a mounting tab defining at least one mounting hole, the mounting tab being disposed outside the plurality of slots, the at least one mounting hole being sized to receive a mounting screw.

5. The at least one baffle is disposed horizontally adjacent to the wear shield electrode assembly and vertically adjacent to the rotor and the paddle, the paddle being disposed on the wear shield electrode assembly and configured to move in at least one direction, the at least one baffle preventing movement of the fluid in at least one direction by using the plurality of slots to impede the movement of the fluid. The electroplating system according to claim 1.

6. The electroplating system according to claim 1, wherein the height of the at least one baffle is greater than 15% or about 15% of the length of the at least one baffle.

7. The electroplating system according to claim 1, wherein a mesh is disposed in each of the plurality of slots.

8. A baffle configured to prevent fluid from splashing onto the rotor or the plating chamber during operation of the plating chamber, a plurality of slots, and at least one mounting tab for mounting the baffle to the plating chamber The baffle comprising.

9. The baffle is at least one baffle, the at least one baffle is disposed at least partially above a fluid conduit of the fluid at the top of the tank, the tank is contained within the plating chamber, and each slot of the plurality of slots has a width of less than 25% or about 25% of the length of the at least one baffle. The baffle according to claim 8, characterized in that.

10. The mounting tab defines at least one mounting hole, the mounting tab extends into at least one of the plurality of slots, and the at least one mounting hole has a size capable of receiving a mounting screw. The baffle according to claim 9.

11. The mounting tab defines at least one mounting hole, the mounting tab is disposed outside the plurality of slots, and the at least one mounting hole has a size capable of receiving a mounting screw. The baffle according to claim 9.

12. The height of the at least one baffle is greater than 15% or about 15% of the length of the at least one baffle. The baffle according to claim 9.

13. The mounting tab is a flange disposed on the baffle for coupling the baffle to the plating chamber. The baffle according to claim 8.

14. A mesh is disposed in each slot of the plurality of slots. The baffle according to claim 8.

15. An electroplating system, a tank assembly for holding an electrolyte, a wear sheet electrode assembly within the tank assembly and including a plenum inside a wear frame, a plurality of spaced-apart openings extending through the wear frame and into the plenum, a wear ring attached to the wear frame, At least one baffle disposed within the tank assembly, the at least one baffle defining a plurality of slots, the at least one baffle configured to prevent fluid from splashing onto the rotor or the plating chamber during operation of the electroplating system, the at least one baffle and An electroplating system comprising.

16. The electroplating system according to claim 15, wherein the at least one baffle is disposed at least partially above the fluid conduit of the electrolyte solution at the top of the tank assembly.

17. The electroplating system according to claim 15, wherein the at least one baffle further comprises a mounting tab defining at least one mounting hole, the mounting tab extending into at least one of the plurality of slots, and the at least one mounting hole configured to facilitate attaching the at least one baffle to the wear sheath electrode assembly.

18. The electroplating system according to claim 15, wherein the at least one baffle further comprises a mounting tab defining at least one mounting hole, the mounting tab being disposed outside the plurality of slots, and the at least one mounting hole having a size capable of receiving a mounting screw.

19. The electroplating system according to claim 15, wherein the height of the at least one baffle is more than 15% or about 15% of the length of the at least one baffle.

20. The electroplating system according to claim 15, wherein a mesh is disposed in each of the plurality of slots.

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