Micro-cooler assemblies
The micro-cooler assembly with stepped microchannels and vapor gaps addresses the challenge of uniform cooling fluid distribution and vapor removal, improving heat management in small-scale electronic devices by using capillary action.
Patent Information
- Application Number
- JP2024216308
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-19
- Filing Date
- 2024-12-11
- Publication Date
- 2025-07-04
AI Technical Summary
Conventional micro-coolers struggle to provide uniform cooling fluid coverage across small-scale electronic devices, especially at higher temperatures and hot spots, leading to inefficiencies in heat management.
A micro-cooler assembly featuring a manifold with stepped microchannels and vapor gaps, combined with a cooling plate and wick region, utilizes capillary action to distribute cooling fluid uniformly and evaporate it into vapor for efficient heat transfer and vapor removal.
The assembly achieves uniform cooling fluid distribution and effective vapor exhaustion, enhancing heat management capabilities in small-scale electronic devices.
Smart Images
Figure 2025100952000001_ABST
Abstract
Description
Background Art
[0001] Cross - reference to related applications This application claims the benefit of U.S. Provisional Application No. 63 / 608,716, filed on December 11, 2023, the entire content of which is incorporated herein by reference.
[0002] Electronic assemblies such as microprocessors and power electronics chips can generate significant heat during operation, and this heat requires cooling to maintain the electronic assembly within its operating temperature range. Conventional cooling systems can include passing a cooling fluid across the electronic assembly to cool the electronic assembly and maintain it within its operating temperature range.
[0003] Micro - coolers can be used to cool electronic devices. In small - scale applications, it can be difficult to maintain sufficient cooling fluid coverage across the entire micro - cooler, especially at higher temperatures and / or heat fluxes of hot spots. Thus, there is a need for a micro - cooler that can provide sufficient cooling fluid coverage even at small scales for cooling electronic devices.
Summary of the Invention
[0004] Embodiments of the present disclosure are directed to a micro - cooler assembly for cooling an electronic device. The micro - cooler assembly described herein can include a manifold and a cooling plate disposed on top of the electronic device. A cooling fluid can be flowed through micro - channels formed in the micro - cooler via an operation of capillary action. Heat from the electronic device can evaporate the cooling fluid. The evaporated cooling fluid can pass through a vapor gap formed between the micro - channels. The cooling fluid can return to a liquid supply for re - cooling and re - use.
[0005] In one embodiment, the microcooler assembly includes at least one inlet for receiving a liquid, a plurality of fins, where each fin of the plurality of fins includes a microchannel, and a manifold having a plurality of vapor gaps combined with the plurality of fins. The width of the microchannel is stepped. The microcooler assembly further includes a cold plate including a surface and a wick region disposed on the surface. The manifold is connected to the surface of the cold plate. The at least one inlet is operable to provide the liquid near the wick region. The liquid is operable to be transported by capillary action through the microchannels of the plurality of fins into the wick region, and heating of the liquid changes the phase to vapor that exits the manifold through the plurality of vapor gaps.
[0006] In another embodiment, the microcooler array includes an array of manifolds and a cold plate. Each manifold includes a plurality of fins, where each fin of the plurality of fins includes a microchannel. Each manifold also includes a plurality of vapor gaps combined with the plurality of fins. The microcooler array also includes a central inlet for receiving a liquid disposed centrally within the array of manifolds. The cold plate includes an array of wick regions aligned perpendicular to the array of manifolds. The cold plate also includes an inlet distribution path located between individual wick regions of the array of wick regions. The inlet distribution path includes a plurality of microstructures. The array of manifolds is connected to the surface of the cold plate. The central inlet is operable to provide the liquid at a central location relative to the array of wick regions, and the liquid is operable to be transported by capillary action through the microchannels of the plurality of fins into the array of wick regions within the inlet distribution path. Heating of the liquid changes the phase to vapor that exits the array of manifolds through the plurality of vapor gaps.
[0007] In another embodiment, the microcooler array includes an array of manifolds and a cooling plate. Each manifold includes an inlet manifold, a plurality of fins, each fin of the plurality of fins including a microchannel and having a right-angled shape, a plurality of vapor gaps combined with the plurality of fins, and a plurality of inlets for receiving liquid disposed within the inlet manifold array of the manifold array. The cooling plate includes an array of wick regions aligned perpendicular to the manifold array. The plurality of inlets are operable to provide liquid to the array of wick regions. The liquid is operable to be transported by capillary action through the microchannels of the plurality of fins into the array of wick regions. Heating of the liquid changes the phase to vapor that exits the manifold array through the plurality of vapor gaps.
Brief Description of the Drawings
[0008] To easily identify the description of any particular element or act, the most significant digit or digits in the reference number refer to the figure number in which the element is first introduced.
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DETAILED DESCRIPTION OF THE INVENTION
[0010] Embodiments of the present disclosure are directed to a microcooler assembly for cooling an electronic device. The microcooler assembly described herein may include a manifold and a cooling plate disposed on top of the electronic device. A cooling fluid may be flowed through microchannels formed in the microcooler via capillary action. Heat from the electronic device may evaporate the cooling fluid. The evaporated cooling fluid may pass through a vapor gap formed between the microchannels. The cooling fluid may return to a liquid supply for recooling and reuse.
[0011] Conventional microcooler assemblies may not provide uniform fluid distribution across the entire electronic device, especially in small-scale applications and / or when the electronic device is localizing hot spots. Embodiments may be able to distribute the cooling fluid more uniformly across the entire electronic device while effectively exhausting vapor as compared to conventional microcooler assemblies.
[0012] Referring now to FIG. 1, an exemplary microcooler assembly 102 is shown in an exploded view. The microcooler assembly 102 includes a manifold 104 connected to the front face 116 of a cold plate 114. The manifold 104 can be connected to the cold plate 114 by any known or undeveloped method, such as an adhesive or other bonding interface, around the microcooler assembly. The front face 116 of the cold plate 114 includes a wick region 120 that is perpendicularly aligned with a heat generating component 128 at the back face 118 of the cold plate 114 (see FIG. 2). The wick region is made of a porous material such as metal inverse opal (MIO) (e.g., copper inverse opal (CIO) structure, nickel inverse opal (NIO) structure, or the like). As described in more detail below, the wick region 120 is operable to receive liquid by capillary force. Both the cold plate 114 and the manifold 104 can be fabricated from silicon, polydimethylsiloxane (PDMS), or any other suitable substrate or material.
[0013] The manifold 104 has one or more inlets 106 operable to introduce liquid onto the front face 116 of the cold plate 114. In the illustrated embodiment, the manifold 104 has two inlets 106, although more or fewer inlets 106 can be provided. The exemplary shape of the inlet 106 is cylindrical, although the embodiment is not limited thereto. The inlet 106 can be configured as a connector operable to receive a fluid line that fluidly connects the inlet 106 to a liquid reservoir (not shown).
[0014] The manifold also includes a plurality of vapor gaps 108 that are combined between the plurality of fins 134. The vapor gaps 108 of the illustrated embodiment are configured as slots within the material of the manifold 104, although the vapor gaps 108 can take other shapes. Any number of vapor gaps 108 can be utilized depending on the application. As described in more detail below, the vapor gaps 108 are provided to remove vapor generated by heating of a liquid introduced into the wick region 120 of the cold plate 114 by the heat generating component 128, which can be an electronic device such as a power electronics device or a microchip.
[0015] Referring now to FIG. 2, a bottom exploded view of the microcooler assembly 102 shown in FIG. 1 is shown. In a non-limiting example, the surface of the back side 118 of the cold plate 114 includes various electrodes such as a first electrode 130 and a second electrode 132 that can serve various purposes such as voltage supply, output, control signaling, and the like. A heat generating component 128, such as a power electronics device (e.g., an electronic switching device) or a microchip (e.g., a microprocessor), is connected to the back side 118 of the cold plate 114 such that it is below the wick region 120 at the front side 116. Heat created by the heat generating component 128 is transferred through the silicon material of the cold plate 114 into the wick region 120.
[0016] The lower surface 112 of the manifold 104 includes one or more inlet regions 124 fluidly connected to one or more inlets 106. In the illustrated embodiment, there are two inlet regions 124 for two inlets 106. The inlet regions 124 are configured as recesses in the lower surface 112 of the manifold 104 such that a gap exists when the lower surface 112 of the manifold 104 is connected to the front surface 116 of the cooling plate 114. The liquid introduced into the inlet regions 124 is then carried by capillary action toward the vapor gap 108 and thus toward the heat transfer wick region 120. In some embodiments, a micropillar array 126 is provided within the inlet regions 124 to further optimize the flow, facilitate the capillary action of carrying the fluid toward the heat transfer wick region 120, and provide additional surface area for heat transfer.
[0017] Referring now to FIG. 3, a close-up cutaway isometric view of the exemplary microcooler assembly 102 of FIG. 1 is provided. As described above, the vapor gap 108 through the manifold 104 is defined by combining fins 134. The fins 134 have a period P that can be constant or stepped.
[0018] Each fin 134 has a microchannel 136 that is exposed to the inlet region 124 to receive the liquid 122 as indicated by the horizontal arrow. The microchannel 136 draws the liquid toward the wick region 120 by capillary forces that carry it by capillary action. The liquid 122 is then distributed substantially uniformly along the wick region 120 where the liquid 122 is heated by the heat 192 generated by the heat generating component and converted to vapor 138. Excess liquid travels laterally along the cooling plate 114 and can then exit through a drain passage (not shown) configured as a hole in the cooling plate 114.
[0019] FIG. 4 shows a close-up isometric view of an individual fin 134. The cooling fluid is carried by capillary action through the microchannel 136 and then drawn down across the wick region 120 by capillary forces.
[0020] As a non-limiting example, the microcooler assembly 102 is designed to cool the footprint area of a 0.5 cm × 0.5 cm microprocessor designed for efficient liquid delivery and vapor extraction to achieve complete vapor-liquid phase separation or an outlet vapor quality of about 1. The wick region 120 can be configured as a 25 μm thick MIO structure having a footprint area of 0.5 cm × 0.5 cm. The width W of the microchannel 136 ch and the width W of the fin wall wall can be 100 μm. The height h of the microchannel 136 ch can be 300 μm. It should be understood that these dimensions are provided for illustrative purposes only and that other dimensions may be utilized depending on the application.
[0021] FIG. 5 shows a microcooler assembly 140 similar to that of FIGS. 1 and 2, except that the microcooler assembly 140 includes four inlets 106 instead of two. The vapor gap 108 and the fins 134 can be configured in the same manner as described and shown with respect to FIGS. 1-4. For example, additional inlets can be provided when the size of the footprint of the heat generating component is larger.
[0022] In some embodiments, the width W of the microchannel 136 in the fin 134 ch can be stepped to provide optimal liquid distribution in the wick region. Referring to FIG. 6, the width W of the microchannel 136 ch decreases in the direction A indicated by the array. In other words, the width W of the microchannel 136 ch can be smaller near the edge of the wick region 120 compared to the center of the wick region 120, or vice versa. The width W of the microchannel 136 chThe step provides a wider microchannel 136 near the inlet 106 of the microcooler assembly 102 and thus provides optimal distribution of the liquid across the wick region 120. Although specific stepwise directions are shown above, any stepwise direction found to improve the capillary action conveyance of the fluid by capillary forces may be utilized.
[0023] Furthermore, the size of the vapor gap 108 (i.e., the width between the fins 134) may also be stepwise. The steps may be provided in any direction to improve vapor removal.
[0024] Here, an exemplary non-limiting method of manufacturing the cooling plate 114 is described. Referring to FIG. 7A, a silicon substrate 144 having two SiO2 layers 142 is provided. The SiO2 layers 142 may be grown on both sides of the silicon substrate 144 by any known or undeveloped method or otherwise provided. A photoresist mask (not shown) is provided on one of the SiO2 layers 142. The exposed SiO2 layer 142 is then etched, for example, by a reactive ion plasma etcher. The remaining photoresist mask is removed, for example, by using acetone. A second layer of photoresist is then provided on the same side of the substrate (e.g., by spin coating) to form a pin fin array pattern over the same etching area.
[0025] Referring to FIG. 7B, the silicon surface exposed through the photoresist is etched to a certain depth (e.g., 3 μm) using an etching process (e.g., deep reactive ion etching (DRIE)) to create a thin silicon pin fin array 148. This pin fin array 148 provides support for a latex bead template that prevents the latex bead template from delaminating from the silicon surface during subsequent electroless plating for the MIO layer. The photoresist residue is removed by immersing the wafer in a solution such as a piranha solution.
[0026] Next, in FIG. 7C, further etching of the exposed silicon surface is performed to a certain depth (e.g., 25 μm) to ensure that the top surface of the MIO layer is aligned with the silicon wafer surface.
[0027] Next, as shown in FIG. 7D, the adhesive layer 150 is coated on the exposed surface of the wafer. As a non-limiting example, the adhesive layer 150 can be a thin gold layer (e.g., 100 nm) on a thin titanium layer (e.g., 10 nm) sputtered on the surface of the wafer including the silicon pin fin array 148 so as to form a conformal electrode layer.
[0028] In FIG. 7E, the MIO layer is electroplated to form the wick region 120 structure. Any known or undeveloped method for forming the MIO layer can be used. For example, a sacrificial layer in the form of a bead solution (e.g., a sulfuric acid latex bead solution) is coated on the pin fin array 148 and left to evaporate completely. When the solution evaporates, the beads form an anchoring layer, which is then sintered in an oven (e.g., at 107° C. for 1 hour). The sintered bead layer functions as a sacrificial layer for electroplating a metal such as copper or nickel. Following electroplating, the sacrificial layer is dissolved in a solvent (e.g., a tetrahydrofuran solvent), resulting in a permeable porous MIO layer.
[0029] Here, an exemplary non-limiting method for manufacturing the manifold 104 is described. Referring to FIG. 8A, the process begins with a photoresist 154 being coated on the silicon surface 152 for one surface. The photoresist 154 is used to form the vapor gap 108 and the fins 134.
[0030] As shown in FIG. 8B, the silicon substrate 152 is etched to a certain depth (e.g., 300 μm) to partially form the microchannels 136 within the vapor gap 108 and the fins 134. The etching can be performed, for example, by DRIE. Next, any remaining photoresist 154 is removed by immersing the wafer in a solution such as a piranha solution.
[0031] Another photoresist 154 pattern is coated on the back side of the wafer as shown in FIG. 8C. The photoresist 154 is patterned to completely form the vapor gap 108 through the silicon substrate 152.
[0032] The etching process (e.g., DRIE) is performed until the vapor gap 108 extends completely through the silicon substrate 152 as shown in FIG. 8D.
[0033] Then, any remaining photoresist is removed by immersing the wafer in a solution such as a piranha solution. The result is shown in FIG. 8E. The inlet 106 can be separate polymer parts, and the separate polymer parts are inserted into or placed on holes (not shown) of the manifold 104 and joined using an adhesive such as epoxy.
[0034] The designs described herein can be tiled together to form a microcooler array 162 for use in cooling an electronic device array 156 as shown in FIG. 9. The tiled microcooler array 162 includes an array of microcooler assemblies 158 defined by an array of manifolds 104 located on the cooling plate 114, and the cooling plate 114 is further located on an electronic device array 156 having a plurality of heat generating components. The cooling plate 114 can be, for example, a single cooling plate 114 or an array of individual cooling plates 114.
[0035] As described above, the manifold 104 has fins 134 and a vapor gap 108. Further, a wick region 120 is provided on the cooling plate 164 below each manifold 104. In the illustrated embodiment, an inlet 106 may be provided centrally for each of the manifolds 104 (not shown). Thus, a single inlet 106 supplies liquid to each manifold 104 and thus to each wick region 120 of the cooling plate 114 located below each manifold 104. Further, a drain path 160 is provided between adjacent manifolds to provide an area for excess liquid to flow.
[0036] FIG. 10 shows a microcooler array 162 with the manifold layer removed to show the features of the cooling plate 114. The cooling plate 164 includes an array of wick regions 120 aligned with the array of manifolds 104 shown in FIG. 9. An inlet delivery path 166 is provided between adjacent wick regions 120. The inlet 106 is operable to provide liquid at a central location of the inlet delivery path 166. The inlet delivery path 166 has a sloping function to route the liquid 122 uniformly to each wick region 120. For example, the inlet delivery path 166 includes a microstructure (e.g., a pillar or similar microfin) 190 that is the optimal size, shape, and location for uniformly delivering the liquid to the wick regions 120. As a non-limiting example, the microstructure 190 may be smaller near the inlet 106 and larger further away from the inlet 106. Thus, the microstructure 190 has a sloping function to provide a uniform liquid flow through the inlet delivery path 166. Thus, when the liquid reaches the cooling plate 164, the liquid flows within the inlet delivery path 166 to the edge of the wick region 120, where the liquid then enters the microchannels 136 of the fins 134 and is distributed over the wick region 120 as described above. While a particular stepwise direction for the microstructure 190 is shown above, any stepwise direction found to improve the conveyance of the fluid by capillary action due to capillary forces may be utilized.
[0037] FIG. 11 shows another microcooler array 176 that is similar to the microcooler array 162 of FIG. 10, except that there is an additional lateral supply zone 180 provided around the cooling plate 178. The lateral supply zone 180 can be configured as an additional inlet for providing liquid from the manifold layer, or the lateral supply zone 180 can be a region on the cooling plate 178 that receives excess liquid flowing from the wick region 120 that does not change phase to vapor. In some embodiments, the lateral supply zone 180 can also receive liquid from a lateral inlet (not shown).
[0038] Referring now to FIG. 12, another exemplary tiled microcooler array 182 is shown. The microcooler array 182 includes an upper inlet manifold 184 for providing liquid, an intermediate liquid supply manifold layer 194, and a cooling plate 178 having a tiled wick region 120. In this embodiment, the inlets 106 are provided on each side of each individual manifold 196. The inlet manifold 184 surrounds each individual manifold 196. Each individual manifold 196 has four inlets 106 surrounding it. Liquid travels within the inlet manifold 184 and then flows downward through the inlets 106 into the intermediate liquid supply manifold layer 194.
[0039] The liquid supply manifold layer 194 includes an array of right-angle fins 186 that define an array of right-angle vapor gaps 188. Each right-angle fin 186 includes microchannels 136 (not visible in FIG. 12) as shown in FIG. 3. As shown by FIG. 12, each manifold 196 has four groups of right-angle fins 186. Liquid 122 flows from the inlet 106 and then into the microchannels 136 of the right-angle fins 186. In some embodiments, the width of the right-angle microchannels 136 of the right-angle fins 186 is stepped as shown in FIG. 12. The microchannels 136 distribute the liquid throughout the wick region 120 through a capillary action conveyance operation. The liquid is then heated and turned into vapor, and then the vapor exits through the right-angle vapor gaps 188. Excess liquid that is not turned into vapor can exit through one or more drain channels (not shown). Further, the width of the vapor gaps 188 can also be stepped to optimize vapor removal.
[0040] Here, it should be understood that the embodiments are directed to a capillary-assisted microcooler assembly that combines a silicon cooling plate having a porous wick structure and a three-dimensional silicon microchannel manifold. Microfabrication techniques are used to fabricate the silicon-based microchannel manifold and the cooling plate. The microporous wick region has the same area as the heat-generating component to be cooled.
[0041] It may be noted that one or more of the following claims utilize the terms "where", "wherein", or "in which" as transitional phrases. For the purpose of defining the present technology, these terms are introduced into the claims as open-ended transitional phrases used to introduce a description of a series of features of a structure and should be interpreted in the same manner as the more commonly used open-ended preamble term "comprising".
[0042] Any two quantitative values assigned to a property can constitute a range of that property, and it should be understood that all combinations of ranges formed from all the quantitative values shown for a given property are contemplated in the present disclosure.
[0043] Although the subject matter of the present disclosure has been described in detail by reference to specific embodiments, it should be noted that various details described herein, even if a particular element may be shown in each of the accompanying drawings of this specification, should not be considered as implying that such details relate to elements that are essential components of the various embodiments described in the present disclosure. Rather, the appended claims should be considered as the sole representation of the scope of the present disclosure and the corresponding scope of the various embodiments described in the present disclosure. Furthermore, it will be apparent that modifications and variations are possible without departing from the appended claims.
[0044] [Example 1] A manifold, At least one inlet for receiving a liquid, A plurality of fins, each fin of the plurality of fins comprising a microchannel, and A plurality of vapor gaps combined with the plurality of fins, one or more of the width of the microchannel and the width of the vapor gap being stepped, a manifold comprising a plurality of vapor gaps; and A cooling plate comprising a surface and a wick region disposed on the surface; and Comprising, The manifold is connected to the surface of the cooling plate, The at least one inlet is operable to provide the liquid near the wick region, The liquid is operable to be transported by capillary action through the microchannels of the plurality of fins into the wick region, Heating of the liquid turns the phase into vapor that exits the manifold through the plurality of vapor gaps, a microcooler assembly. 〔Example 2〕 The micro cooler assembly according to Example 1, wherein the cooling plate is made of silicon and the wick region is made of a metal inverse opal structure. 〔Example 3〕 The micro cooler assembly according to Example 1, wherein the manifold is made of silicon or polydimethylsiloxane. 〔Example 4〕 The micro cooler assembly according to Example 1, wherein the at least one inlet includes a first inlet and a second inlet positioned to provide the liquid on an opposite side of the wick region in the cooling plate. 〔Example 5〕 The micro cooler assembly according to Example 1, wherein the at least one inlet includes at least four inlets. 〔Example 6〕 The manifold further includes a bottom surface, the bottom surface includes at least one inlet region, the at least one inlet is fluidly connected to the at least one inlet region, The micro cooler assembly according to Example 1, wherein the at least one inlet region includes a micro pillar array. 〔Example 7〕 The micro cooler assembly according to Example 1, further comprising a heat generating component connected to a bottom surface of the cooling plate opposite the wick region, wherein heat generated by the heat generating component evaporates the liquid in the wick region. 〔Example 8〕 An array of manifolds, each manifold including a plurality of fins, each fin of the plurality of fins including a microchannel, and a plurality of vapor gaps combined with the plurality of fins, an array of manifolds including a central inlet for receiving liquid, disposed centrally within the array of manifolds, and a cooling plate, an array of wick regions aligned perpendicular to the array of manifolds, and A cooling plate including an inlet distribution path located between individual wick regions of the array of wick regions, the inlet distribution path including a plurality of microstructures, and comprising an array of manifolds connected to the surface of the cooling plate, a central inlet operable to provide the liquid at a central location with respect to the array of wick regions, the liquid being operable to be transported by capillary action within the inlet distribution path through the microchannels of the plurality of fins and into the array of wick regions, a microcooler array that changes the phase of the liquid to vapor that exits the array of manifolds through the plurality of vapor gaps. [Example 9] The microcooler array according to Example 8, wherein one or more of the widths of the microchannels of the plurality of fins and the widths of the plurality of vapor gaps are stepped. [Example 10] The microcooler array according to Example 8, wherein the plurality of microstructures within the inlet distribution path have an inclination function. [Example 11] The microcooler array according to Example 8, wherein the cooling plate is manufactured from silicon and the array of wick regions is manufactured from a metal inverse opal structure. [Example 12] The microcooler array according to Example 8, wherein the manifold is manufactured from silicon or polydimethylsiloxane. [Example 13] The microcooler array according to Example 8, further comprising an array of heat generating components connected to the bottom surface of the cooling plate opposite the array of wick regions, and heat generated by the array of heat generating components evaporates the liquid within the array of wick regions. [Example 14] The microcooler array according to Example 13, wherein the array of heat generating components comprises an array of microchips. [Example 15] An array of manifolds, each manifold comprising: an inlet manifold, a plurality of fins, each fin of the plurality of fins having a right-angled shape with a microchannel, a plurality of vapor gaps combined with the plurality of fins, and an array of manifolds comprising a plurality of inlets for receiving liquid, disposed within the array of inlet manifolds of the array of manifolds; a cooling plate comprising an array of wick regions aligned perpendicular to the array of manifolds; comprising: the plurality of inlets being operable to provide the liquid to the array of wick regions, the liquid being operable to be transported by capillary action through the microchannels of the plurality of fins into the array of wick regions, heating of the liquid causing a phase change to vapor that exits the array of manifolds through the plurality of vapor gaps, a microcooler array. [Example 16] The microcooler array according to Example 15, wherein one or more of the widths of the microchannels of the plurality of fins and the widths of the plurality of vapor gaps are stepped. [Example 17] The microcooler array according to Example 8, wherein the cooling plate is manufactured from silicon and the array of wick regions is manufactured from a metal inverse opal structure. [Example 18] The microcooler array according to Example 8, wherein the manifold is manufactured from silicon or polydimethylsiloxane. [Example 19] The microcooler array according to Example 8, further comprising an array of heat generating components connected to the bottom surface of the cooling plate opposite the array of wick regions, the heat generated by the array of heat generating components evaporating the liquid within the array of wick regions. [Example 20] The array of the heat generating components is the micro cooler array described in Example 19, comprising an array of microchips.
Claims
1. A manifold, comprising: At least one inlet for receiving a liquid; A plurality of fins, each fin of the plurality of fins comprising a microchannel; and A plurality of vapor gaps combined with the plurality of fins, wherein one or more of the width of the microchannel and the width of the vapor gap are stepped, the manifold comprising the plurality of vapor gaps; A cooling plate comprising a surface and a wick region disposed on the surface; Comprising; The manifold is connected to the surface of the cooling plate; The at least one inlet is operable to provide the liquid near the wick region; The liquid is operable to be transported by capillary action through the microchannels of the plurality of fins into the wick region; Heating of the liquid changes the phase to vapor exiting the manifold through the plurality of vapor gaps, a microcooler assembly.
2. The microcooler assembly according to claim 1, wherein the cooling plate is manufactured from silicon and the wick region is manufactured from a metal inverse opal structure.
3. The microcooler assembly according to claim 1, wherein the manifold is manufactured from silicon or polydimethylsiloxane.
4. The microcooler assembly according to claim 1, wherein the at least one inlet comprises a first inlet and a second inlet positioned to provide the liquid on an opposite side of the wick region in the cooling plate.
5. The microcooler assembly according to claim 1, wherein the at least one inlet comprises at least four inlets.
6. The manifold further comprises a bottom surface; The bottom surface comprises at least one inlet region; The at least one inlet is fluidly connected to the at least one inlet region; The microcooler assembly according to claim 1, wherein the at least one inlet region comprises a micro-pillar array.
7. The microcooler assembly according to claim 1, further comprising a heat generating component connected to the bottom surface of the cooling plate opposite the wick region, the heat generated by the heat generating component evaporating the liquid in the wick region.
8. An array of manifolds, each manifold comprising: A plurality of fins, each fin of the plurality of fins comprising a microchannel, a plurality of fins, and A plurality of vapor gaps combined with the plurality of fins, An array of manifolds having a central inlet for receiving liquid, disposed centrally within the array of manifolds, A cooling plate, An array of wick regions aligned perpendicular to the array of manifolds, and An inlet distribution path located between individual wick regions of the array of wick regions, the inlet distribution path comprising an inlet distribution path having a plurality of microstructures, Comprising, The array of manifolds is connected to the surface of the cooling plate, The central inlet is operable to provide the liquid at a central location with respect to the array of wick regions, The liquid is operable to be transported by capillary action within the inlet distribution path, through the microchannels of the plurality of fins, and into the array of wick regions, Heating of the liquid changes the phase to vapor that exits the array of manifolds through the plurality of vapor gaps, a microcooler array.
9. The microcooler array according to claim 8, wherein one or more of the width of the microchannels of the plurality of fins and the width of the plurality of vapor gaps are stepped.
10. The microcooler array according to claim 8, wherein the plurality of microstructures within the inlet distribution path have an inclination function.
11. The microcooler array according to claim 8, wherein the cooling plate is manufactured from silicon and the array of wick regions is manufactured from a metal inverse opal structure.
12. The microcooler array according to claim 8, wherein the manifold is manufactured from silicon or polydimethylsiloxane.
13. The microcooler array according to claim 8, further comprising an array of heat generating components connected to the bottom surface of the cooling plate opposite the array of wick regions, and heat generated by the array of heat generating components evaporates the liquid within the array of wick regions.
14. The microcooler array according to claim 13, wherein the array of heat generating components comprises an array of microchips.
15. An array of manifolds, each manifold comprising An inlet manifold, A plurality of fins, each fin of the plurality of fins having a right-angled shape with microchannels, a plurality of fins, A plurality of vapor gaps combined with the plurality of fins, and An array of manifolds having a plurality of inlets for receiving liquid, disposed within the array of inlet manifolds of the array of manifolds, A cooling plate comprising an array of wick regions aligned perpendicular to the array of manifolds, Comprising, The plurality of inlets being operable to provide the liquid to the array of wick regions, The liquid being operable to be transported by capillary action through the microchannels of the plurality of fins into the array of wick regions, The microcooler array that changes the phase of the liquid to vapor that exits the array of manifolds through the plurality of vapor gaps.