Processing device

Abstract

To provide a processing device which can prevent temporal deterioration of cooling efficiency of a spindle housing.SOLUTION: A processing device includes: a chuck table which holds a workpiece; processing means 6 including a processing tool which performs processing to the workpiece held by the chuck table; processing water supply means 8 which supplies processing water to an area in which the workpiece is processed with the processing tool; a processing chamber 10 which covers an area including the chuck table and the processing means 6; and a gas-liquid separation mechanism 12. The gas-liquid separation mechanism 12 includes: a tank 104 configured to store used processing water and including exhausting means 102; and a duct 106 which suctions mist filling the processing chamber 10 and communicates with the tank 104. The processing means 6 is formed with a cooling path 120, and a pipe 122 communicating with the cooling path 120 is immersed in the processing water stored in the tank 104.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a processing apparatus for performing predetermined processing such as cutting and grinding on a workpiece such as a wafer.

Background Art

[0002] A wafer on which a plurality of devices such as ICs and LSIs are partitioned by a dividing line and formed on the surface is ground on the back surface by a grinding apparatus, and then divided into individual device chips by a dicing apparatus. Each of the divided device chips is used in electrical devices such as mobile phones and personal computers.

[0003] The grinding apparatus generally includes a chuck table for holding a wafer, a grinding means rotatably mounting a grinding wheel having an annularly arranged grinding stone for grinding the wafer held on the chuck table, a grinding water supply means for supplying grinding water made of pure water to a region where the wafer held on the chuck table is ground with the grinding stone, and a processing chamber covering the processing region, and can grind the wafer to a desired thickness.

[0004] The dicing apparatus generally includes a chuck table for holding a wafer, a cutting means rotatably mounting a cutting blade for cutting the wafer held on the chuck table, a cutting water supply means for supplying cutting water made of pure water to a region where the wafer held on the chuck table is cut with the cutting blade, and a processing chamber covering the processing region, and can divide the wafer into individual device chips with high precision.

[0005] Since the processing chambers of the grinding apparatus and the dicing apparatus are filled with mist generated by the scattering of processing water (grinding water and cutting water), the applicant has proposed a processing apparatus that sucks the mist by a suction duct and separates the sucked mist into gas and liquid (see, for example, Patent Document 1).

[0006] In the processing apparatus disclosed in Patent Document 1, the ejection port of the suction duct is positioned above the liquid level of the water storage tank that stores the used processing water. Then, mist is ejected from the ejection port of the suction duct toward the liquid level of the water storage tank, and the mist is separated into gas and liquid in the water storage tank. Further, in the water storage tank, when the mist vaporizes, it takes away the heat of the processing water in the tank, thereby cooling the processing water. The cooled processing water is used as a refrigerant for cooling the spindle housing of the grinding means or the cutting means.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] However, the refrigerant sent to the spindle housing contains the used processing water. For this reason, there is a problem that the cooling efficiency of the spindle housing deteriorates over time due to the inside of the cooling path formed in the spindle housing being contaminated by the used processing water.

[0009] An object of the present invention is to provide a processing apparatus capable of preventing the cooling efficiency of the spindle housing from deteriorating over time.

Means for Solving the Problems

[0010] According to the present invention, the following processing apparatus for solving the above problems is provided. That is, "A processing apparatus, A chuck table for holding a workpiece, processing means having a processing tool for processing the workpiece held on the chuck table, processing water supply means for supplying processing water to an area where the workpiece is processed by the processing tool, a processing chamber covering an area including the chuck table and the processing means, and a gas-liquid separation mechanism. The gas-liquid separation mechanism includes a tank for storing used processing water and having an exhaust means, and a duct for sucking mist filling the processing chamber and communicating with the tank. A cooling path is formed in the processing means, and a pipe communicating with the cooling path is provided such that it is submerged in the processing water stored in the tank.

[0011] Preferably, the jet outlet of the duct is submerged in the processing water stored in the tank.

[0012] It is desirable that a filter for generating fine bubbles is disposed at the jet outlet.

[0013] A drain pan disposed in the processing chamber for receiving used processing water, and a drain disposed in the drain pan and draining to the tank are provided, and the drain is preferably in communication with the tank.

[0014] Processing water purification means for purifying the processing water stored in the tank is provided, and it is preferable to circulate the purified processing water to the processing water supply means.

Advantages of the Invention

[0015] The processing apparatus of the present invention A chuck table for holding a workpiece, processing means having a processing tool for processing the workpiece held on the chuck table, processing water supply means for supplying processing water to an area where the workpiece is processed by the processing tool, a processing chamber covering an area including the chuck table and the processing means, and a gas-liquid separation mechanism. The gas-liquid separation mechanism includes a tank for storing used processing water and having an exhaust means, and a duct for sucking mist filling the processing chamber and communicating with the tank. A cooling path is formed in the processing means, and a pipe communicating with the cooling path is immersed in the processing water stored in the tank. Therefore, processing water is not used as a cooling medium for cooling the spindle housing, and it is possible to prevent deterioration over time of the cooling efficiency of the spindle housing.

Brief Description of the Drawings

[0016]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Embodiments for Carrying Out the Invention

[0017] Hereinafter, a preferred embodiment of the processing apparatus according to the present invention will be described with reference to the drawings.

[0018] (Processing apparatus: Dicing apparatus 2) FIG. 1 shows, as an example of the processing apparatus according to the present invention, a dicing apparatus 2 that performs cutting processing on a workpiece. However, the processing apparatus according to the present invention is not limited to the dicing apparatus 2, and may be a grinding apparatus that performs grinding processing on a workpiece, for example.

[0019] The dicing apparatus 2 includes a chuck table 4 that holds a plate-shaped workpiece such as a wafer W, a processing means 6 (see FIGS. 2 and 3) provided with a processing tool that processes the workpiece held by the chuck table 4, a processing water supply means 8 (see FIG. 3) that supplies processing water to a region where the workpiece is processed with the processing tool, a processing chamber 10 (see FIG. 1) that covers a region including the chuck table 4 and the processing means 6, and a gas-liquid separation mechanism 12 (see FIG. 5). The wafer W shown in FIG. 1 is attached to an adhesive tape T whose periphery is fixed to an annular frame F.

[0020] (Chuck table 4) Referring to FIG. 2, a circular suction chuck 14 is disposed at the upper end portion of the chuck table 4. The suction chuck 14 is formed of a porous member such as porous ceramics. Further, the suction chuck 14 is connected to a suction means (not shown). In the chuck table 4, a suction force is generated on the upper surface of the suction chuck 14 by the suction means, and the workpiece placed on the upper surface of the suction chuck 14 is suction-held. Further, a plurality of clamps 16 for fixing the annular frame F are arranged at intervals in the circumferential direction on the periphery of the chuck table 4.

[0021] As shown in FIG. 2, the chuck table 4 is rotatably mounted on the upper end of the column 18 and is rotated by a motor (not shown) built in the column 18. The lower end of the column 18 is fixed to the upper surface of the X-axis movable plate 20. The X-axis movable plate 20 is supported on the upper surface of the base 22 of the dicing apparatus 2 so as to be movable in the X-axis direction. The X-axis direction is the direction indicated by the arrow X in FIG. 2. Also, the Y-axis direction indicated by the arrow Y in FIG. 2 is a direction orthogonal to the X-axis direction, and the Z-axis direction indicated by the arrow Z in FIG. 2 is the vertical direction orthogonal to the X-axis direction and the Y-axis direction. The XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

[0022] Further, the chuck table 4 is fed in the X-axis direction for machining by the X-axis feed means 24. The X-axis feed means 24 includes a ball screw 26 connected to the X-axis movable plate 20 and extending in the X-axis direction, and a motor 28 for rotating the ball screw 26. The X-axis feed means 24 converts the rotational motion of the motor 28 into a linear motion by the ball screw 26 and transmits it to the X-axis movable plate 20, and moves the X-axis movable plate 20 in the X-axis direction along a pair of X-axis guide rails 22a provided on the base 22. Thereby, the chuck table 4 is fed in the X-axis direction for machining.

[0023] (First drain pan 30, first drain 32) Continuing the description with reference to FIG. 2, below the movable range of the chuck table 4 in the X-axis direction, there are provided a first drain pan 30 for receiving machining water and a first drain 32 disposed in the first drain pan 30. However, in FIG. 2, for the sake of convenience, the positions of the first drain pan 30 and the first drain 32 are shown with a shift in the X-axis direction. When the workpiece held on the chuck table 4 is subjected to cutting, machining water is supplied from the machining water supply means 8. If the machining water and cutting chips flow into the X-axis feed means 24, the X-axis feed means 24, which is a precision mechanical element, may be damaged. Therefore, a rectangular cover plate 34 is attached to the chuck table 4, and bellows covers 36 that are stretchable in the X-axis direction are provided on one side and the other side of the cover plate 34 in the X-axis direction. And the above-mentioned first drain pan 30 is installed at a position for receiving the machining water flowing down from the cover plate 34 and the bellows covers 36. The machining water received by the first drain pan 30 is discharged through the first drain 32.

[0024] (Machining means 6) The machining means 6 of the present embodiment is configured as a cutting means for performing cutting on the workpiece held on the chuck table 4. As shown in FIG. 2, the machining means 6 includes a Y-axis movable body 38 supported on the upper surface of the base 22 so as to be movable in the Y-axis direction, and a Z-axis movable body 40 supported on the Y-axis movable body 38 so as to be movable in the Z-axis direction. A spindle housing 42 extending in the Y-axis direction is attached to the Z-axis movable body 40. As shown in FIG. 3, a spindle 44 extending in the Y-axis direction is rotatably supported in the spindle housing 42. An annular cutting blade 46 for cutting the workpiece is fixed to the tip of the spindle 44. The cutting blade 46 is covered by a blade cover 48, and the blade cover 48 is provided at the tip of the spindle housing 42. Also, as shown in FIG. 2, an imaging means 50 is disposed at a distance from the cutting blade 46 in the X-axis direction, and the imaging means 50 is supported by the spindle housing 42.

[0025] The Y-axis position of the cutting blade 46 is adjusted by the Y-axis feed means 52. As shown in Fig. 2, the Y-axis feed means 52 includes a ball screw 54 that is connected to the Y-axis movable body 38 and extends in the Y-axis direction, and a motor 56 that rotates the ball screw 54. The Y-axis feed means 52 converts the rotational motion of the motor 56 into a linear motion by the ball screw 54 and transmits it to the Y-axis movable body 38, and moves the Y-axis movable body 38 in the Y-axis direction along a pair of Y-axis guide rails 22b provided on the base 22. As a result, the cutting blade 46 is fed in the Y-axis direction, and the Y-axis position of the cutting blade 46 is adjusted.

[0026] Also, the Z-axis position of the cutting blade 46 is adjusted by the Z-axis feed means 58. The Z-axis feed means 58 includes a ball screw (not shown) that is connected to the Z-axis movable body 40 and extends in the Z-axis direction, and a motor 60 that rotates this ball screw. The Z-axis feed means 58 converts the rotational motion of the motor 60 into a linear motion by the ball screw and transmits it to the Z-axis movable body 40, and moves the Z-axis movable body 40 in the Z-axis direction along a pair of Z-axis guide rails 38a (only one side is shown) attached to the Y-axis movable body 38. As a result, the cutting blade 46 is fed in the Z-axis direction, and the Z-axis position of the cutting blade 46 is adjusted.

[0027] (Processing water supply means 8) As shown in Fig. 3, the processing water supply means 8 includes a pair of supply ports 62 provided on the upper part of the blade cover 48, and a pair of injection nozzles 64 (only one side is shown) provided on the lower part of the blade cover 48. Although not shown, the pair of supply ports 62 are connected to a water source via a pipeline such as a tube. Also, the pair of supply ports 62 are connected to the pair of injection nozzles 64 via a flow path (not shown) inside the blade cover 48. The pair of injection nozzles 64 are arranged at intervals in the Y-axis direction with the cutting blade 46 interposed therebetween. Also, a plurality of injection ports (not shown) are formed in the injection nozzles 64 at intervals in the X-axis direction. Then, the processing water supply means 8 injects the processing water (for example, pure water) supplied from the water source from the injection ports of the pair of injection nozzles 64 onto the cutting blade 46 and the workpiece.

[0028] (Processing chamber 10) As shown in FIG. 1, the processing chamber 10 covers an area where the chuck table 4, the processing means 6, etc. are installed. The ceiling and side walls partitioning the processing chamber 10 include a transparent cover 68 that is attached to the upper part of the dicing device 2 via a hinge 66 and can be opened and closed freely. Further, on the side walls (for example, the side wall indicated by reference numeral 70) partitioning the processing chamber 10 other than the transparent cover 68, a suction port 72 for sucking mist generated by the scattering of the processing water jetted from the processing water supply means 8 is formed.

[0029] The dicing device 2 further includes a vertically movable cassette table 76 on which a cassette 74 containing a plurality of workpieces such as a wafer W is placed, a loading / unloading means 80 for pulling out the workpiece before cutting from the cassette 74, carrying it to the temporary placement table 78, and loading the cut workpiece positioned on the temporary placement table 78 into the cassette 74, a first transfer means 82 for transferring the workpiece before cutting carried out from the cassette 74 to the temporary placement table 78 to the chuck table 4, a cleaning means 84 for cleaning the cut workpiece, and a second transfer means 86 for transferring the cut workpiece from the chuck table 4 to the cleaning means 84.

[0030] (Cleaning means 84) Referring to FIG. 4, the cleaning means 84 includes a spinner table 88 for holding the workpiece, a cleaning water nozzle 90 for jetting cleaning water (for example, pure water) onto the workpiece held by the spinner table 88, and an air nozzle 92 for jetting drying air onto the workpiece held by the spinner table 88.

[0031] (Spinner table 88) At the upper end of the spinner table 88, a circular suction chuck 94 is arranged. The suction chuck 94 is formed of a porous member such as porous ceramics. Further, the suction chuck 94 is connected to a suction means (not shown). And in the spinner table 88, a suction force is generated on the upper surface of the suction chuck 94 by the suction means, and the workpiece placed on the upper surface of the suction chuck 94 is suction-held.

[0032] Below the central part of the spinner table 88, a rotary shaft 96a of a motor 96 for rotating the spinner table 88 is connected. The motor 96 rotates the spinner table 88 about the vertical axis. Further, on the outer peripheral surface of the motor 96, a lifting means 97 which can be composed of an actuator such as an air cylinder is mounted. The lifting means 97 raises and lowers the spinner table 88 between the ascending position (the position shown in FIG. 4) where the workpiece is attached and detached and the descending position where the workpiece is washed.

[0033] (Washing water nozzle 90) After the spinner table 88 holding the workpiece is positioned at the descending position by the lifting means 97, the washing water nozzle 90 sprays the washing water toward the workpiece from the injection port 90a to wash the workpiece. When washing the workpiece, the washing water nozzle 90 is rotated by a motor (not shown), and the injection port 90a is positioned above the central part of the workpiece. In addition, a suction port (not shown) for sucking the mist generated by the scattering of the washing water sprayed from the washing water nozzle 90 may be formed on the side wall partitioning the processing chamber 10 in the vicinity of the washing means 84.

[0034] (Air nozzle 92) After the workpiece held by the spinner table 88 is washed, the air nozzle 92 sprays drying air toward the workpiece from the injection port 92a to dry the workpiece. When drying the workpiece, the air nozzle 92 is rotated by a motor (not shown), and the injection port 92a is positioned above the central part of the workpiece.

[0035] (Second drain pan 98, second drain 100) The cleaning means 84 further includes a second drain pan 98 for receiving the cleaning water (used processing water) used for cleaning the workpiece, and a second drain 100 disposed in the second drain pan 98. The second drain pan 98 surrounds the spinner table 88. The cleaning water (processing water) received in the second drain pan 98 is discharged through the second drain 100.

[0036] (Gas-liquid separation mechanism 12) The gas-liquid separation mechanism 12 will be described with reference to FIG. 5. The gas-liquid separation mechanism 12 includes a tank 104 that stores used processing water and is provided with an exhaust means 102, and a duct 106 that sucks the mist filling the processing chamber 10 and communicates with the tank 104.

[0037] (Exhaust means 102) The exhaust means 102 includes a fan 108 disposed at the upper part of the tank 104 and a motor (not shown) for rotating the fan 108. Since the dicing device 2 is generally installed in a clean room, a filter 110 for filtering cutting chips and the like is provided so that fine cutting chips and the like contained in the used processing water are not discharged by the exhaust means 102.

[0038] (Tank 104) The tank 104 communicates with the first and second drains 32 and 100. Therefore, used processing water is sent to the tank 104 from the first and second drain pans 30 and 98 through the first and second drains 32 and 100.

[0039] (Duct 106) The duct 106 communicates the suction port 72 of the processing chamber 10 and the tank 104. The jet outlet 106a of the duct 106 is submerged in the processing water stored in the tank 104. Further, the duct 106 is provided with a pumping means 112 for sucking the mist in the processing chamber 10 and sending it to the tank 104. When the pumping means 112 operates, the mist in the processing chamber 10 is sucked from the suction port 72 and guided to the tank 104 by the duct 106. Then, the mist guided to the tank 104 becomes bubbles, mixes with the processing water in the tank 104, and in addition to increasing the contact area between the processing water and the bubbles, is stirred, so that a large amount of mist is taken into the processing water. Therefore, in the tank 104, the mist is efficiently separated into gas and liquid.

[0040] Further, it is preferable that a filter 114 for generating fine bubbles is disposed at the jet outlet 106a of the duct 106. Thereby, when the mist guided by the duct 106 becomes bubbles and mixes with the processing water in the tank 104, the contact area between the mist bubbles and the processing water further increases, so that the gas-liquid separation property is further improved.

[0041] Note that the duct 106 may communicate the suction port provided in the vicinity of the cleaning means 84 and the tank 104. In this case, due to the operation of the pumping means 112, the mist generated in the cleaning means 84 is guided to the tank 104.

[0042] (Processing water purification means 116) The gas-liquid separation mechanism 12 of the present embodiment includes a processing water purification means 116 for purifying the processing water stored in the tank 104. Although not shown, the processing water purification means 116 may include, for example, a filter for filtering the used processing water stored in the tank 104 to generate clean water, an ultraviolet irradiator for destroying the organic substances mixed in the clean water generated by the filter, an ion exchange resin for generating pure water from the clean water in which the organic substances have been destroyed by the ultraviolet irradiator, and a temperature controller for adjusting the temperature of the pure water generated by the ion exchange resin.

[0043] The processed water purified by the processed water purification means 116 circulates through the processed water supply means 8, the washing water nozzle 90, and the tank 104. As shown in FIG. 5, a first pump 118 is provided between the processed water purification means 116 and the tank 104. By the first pump 118, the processed water in the tank 104 is sent to the processed water supply means 8 and the washing water nozzle 90 of the washing means 84 via the processed water purification means 116. Then, the processed water sprayed from the processed water supply means 8 and the washing water nozzle 90 is received by the first and second drain pans 30, 98, and returned to the tank 104 via the first and second drains 32, 100.

[0044] (Cooling path 120 of the processing means 6) As shown in FIG. 5, a cooling path 120 is provided in the spindle housing 42 of the processing means 6 of the present embodiment. A pipe 122 communicates with the cooling path 120, and a part of this pipe 122 is submerged in the processed water stored in the tank 104. The submerged portion 122a of the pipe 122 (the portion submerged in the processed water in the tank 104) is formed of a material having a high thermal conductivity (for example, a metal material such as copper). Therefore, heat exchange can be performed between the cooling medium in the submerged portion 122a and the processed water in the tank 104. The submerged portion 122a is preferably formed in a coil shape or the like, whereby a large heat transfer area can be ensured with a small installation area. Note that no opening is provided in the submerged portion 122a, and the processed water in the tank 104 does not enter the pipe 122.

[0045] A second pump 124 is provided in the pipe 122. Then, the cooling medium sent toward the cooling path 120 by the second pump 124 takes heat from the spindle housing 42 that generates heat during cutting, and cools the spindle housing 42. The cooling medium that has taken heat from the spindle housing 42 is cooled by the processed water in the tank 104 in the submerged portion 122a of the pipe 122.

[0046] Thus, in this embodiment, since used processing water is not used as a cooling medium for cooling the spindle housing 42, the cooling path 120 of the spindle housing 42 is not contaminated by the used processing water. Therefore, it is possible to prevent the deterioration of the cooling efficiency of the spindle housing 42 over time.

[0047] Next, a cutting method for cutting a wafer W as a workpiece using the dicing apparatus 2 described above will be explained. Although not shown, the surface of the wafer W is partitioned into a plurality of rectangular regions by grid-like planned dividing lines, and it is assumed that devices such as ICs and LSIs are formed in each rectangular region. Here, a method of cutting along the grid-like planned dividing lines will be explained.

[0048] (Holding step) In this embodiment, first, a holding step is performed in which the wafer W is transported from the cassette 74 to the chuck table 4 and the wafer W is held on the chuck table 4.

[0049] In the holding step, first, the wafer W before cutting is carried out from the cassette 74 to the temporary placement table 78 by the loading / unloading means 80. Next, the wafer W is transported from the temporary placement table 78 to the chuck table 4 positioned at the transfer position (the position shown in FIG. 1) by the first transfer means 82, and the wafer W is placed on the upper surface of the chuck table 4. Next, suction force is generated in the suction chuck 14 of the chuck table 4, and the wafer W is sucked and held on the chuck table 4. Further, the annular frame F supporting the wafer W via the adhesive tape T is fixed by a plurality of clamps 16.

[0050] (Cutting step) After the holding step is performed, a cutting step is performed in which the wafer W is subjected to cutting by the cutting blade 46 of the processing means 6.

[0051] In the cutting process, first, the planned dividing line of the wafer W is aligned in the X-axis direction. At this time, the wafer W is moved directly below the imaging means 50 by the X-axis feeding means 24, and the wafer W is imaged by the imaging means 50. Then, based on the image of the wafer W captured by the imaging means 50, the chuck table 4 is appropriately rotated to align the planned dividing line of the wafer W in the X-axis direction.

[0052] After aligning the planned dividing line of the wafer W in the X-axis direction, cutting is performed along the planned dividing line of the wafer W. At this time, the chuck table 4 is moved below the processing means 6 by the X-axis feeding means 24. Also, the cutting blade 46 is rotated in the direction indicated by the arrow R1 in FIG. 3. Then, the cutting blade 46 is lowered by the Z-axis feeding means 58, and the cutting edge of the cutting blade 46 is cut into the upper surface of the wafer W to a predetermined depth. While supplying machining water from the injection nozzle 64 of the machining water supply means 8 to the cutting blade 46 and the wafer W, the chuck table 4 is fed in the X-axis direction for cutting by the X-axis feeding means 24. In this way, cutting is performed along the planned dividing line of the wafer W. Also, while indexing and feeding the cutting blade 46 in the Y-axis direction by the Y-axis feeding means 52 by the interval in the Y-axis direction of the planned dividing line, cutting is repeated to perform cutting on all of the planned dividing lines aligned in the X-axis direction. After that, after rotating the chuck table 4 by 90 degrees, cutting and indexing and feeding are repeated to perform cutting on all of the planned dividing lines orthogonal to the previously cut planned dividing lines.

[0053] During the cutting process, as the spindle 44 rotates at high speed, the spindle housing 42 that supports the spindle 44 may generate heat and thermally expand. If the spindle housing 42 thermally expands, high-precision cutting cannot be performed. Therefore, during the cutting process, the second pump 124 is operated to circulate a cooling medium inside the cooling path 120 and the pipe 122. As a result, since the cooling medium supplied to the cooling path 120 takes heat from the spindle housing 42, the spindle housing 42 can be cooled. Further, the cooling medium that has taken heat from the spindle housing 42 is cooled by the processing water in the tank 104 at the submerged portion 122a of the pipe 122.

[0054] Also, during the cutting process, the processing water sprayed from the processing water supply means 8 scatters and a large amount of mist is generated. Therefore, during the cutting process, the pressure feeding means 112 of the gas-liquid separation mechanism 12 is operated to suck the mist from the suction port 72 provided near the processing means 6. The mist sucked from the suction port 72 is ejected from the ejection port 106a through the duct 106. As described above, since the ejection port 106a is submerged in the processing water in the tank 104, the mist guided by the duct 106 forms bubbles and mixes with the processing water in the tank 104, increasing the contact area with the processing water and being agitated, so that a large amount of mist is taken into the processing water. Therefore, in the tank 104, the mist is efficiently separated into gas and liquid. Also, during the cutting process, the processing water sprayed from the processing water supply means 8 flows down from the cover plate 34 and the bellows cover 36 and is then received by the first drain pan 30 and returned to the tank 104 through the first drain 32.

[0055] (Conveying process) After performing the cutting process, a conveying process is performed to convey the cut wafer W to the cleaning means 84.

[0056] In the transfer process, first, the chuck table 4 is positioned at the above-mentioned transfer position (the position shown in FIG. 1) by the X-axis feed means 24. Next, the suction force of the chuck table 4 is released, and the fixing of the annular frame F by the clamp 16 is released. Then, the cut wafer W is transferred from the chuck table 4 to the spinner table 88 of the cleaning means 84 by the second transfer means 86.

[0057] (Cleaning process) After the transfer process is performed, a cleaning process for cleaning the cut wafer W is performed.

[0058] In the cleaning process, first, a suction force is generated in the suction chuck 94 of the spinner table 88, and the wafer W is sucked and held on the spinner table 88. At this time, the spinner table 88 is positioned at the raised position shown in FIG. 4, and the cleaning water nozzle 90 and the air nozzle 92 are positioned at the standby positions shown in FIG. 4.

[0059] Once the wafer W is sucked and held by the spinner table 88, cleaning water is sprayed toward the wafer W to clean the wafer W. At this time, first, the spinner table 88 is positioned at a predetermined lowered position by the elevating means 97. Next, the cleaning water nozzle 90 is rotated, and the injection port 90a is positioned above the central portion of the wafer W. Then, while rotating the spinner table 88 in the direction indicated by the arrow R2 in FIG. 4 at a predetermined rotational speed (for example, about 300 to 500 rpm), cleaning water is sprayed from the injection port 90a of the cleaning water nozzle 90 to clean the wafer W.

[0060] In the cleaning process, the cleaning water (processing water) sprayed from the cleaning water nozzle 90 scatters and mist is generated. Therefore, during the cleaning process, the pressure feeding means 112 of the gas-liquid separation mechanism 12 is operated to suck the mist from the suction port provided near the cleaning means 84. The mist sucked from this suction port is ejected from the ejection port 106a through the duct 106. Also, in the cleaning process, the cleaning water (processing water) sprayed from the cleaning water nozzle 90 is received by the second drain pan 98 and returned to the tank 104 through the second drain 100.

[0061] After washing the wafer W, dry air is jetted toward the wafer W to dry the wafer W. At this time, the cleaning water nozzle 90 is rotated to the standby position (the position shown in FIG. 4). Also, the air nozzle 92 is rotated and the jet port 92a is positioned above the center of the wafer W. Then, while rotating the spinner table 88 in the direction indicated by the arrow R2 in FIG. 4 at a predetermined rotational speed (for example, about 2000 to 3000 rpm), dry air is jetted from the jet port 92a of the air nozzle 92 to dry the wafer W.

[0062] After drying the wafer W, the wafer W is conveyed from the cleaning means 84 to the temporary placement table 78 by the first conveying means 82, and then the wafer W is carried into the cassette 74 from the temporary placement table 78 by the carry-in / carry-out means 80.

[0063] As described above, in the dicing apparatus 2 of the present embodiment, the cooling path 120 is formed in the spindle housing 42 of the processing means 6, and the pipe 122 communicating with the cooling path 120 is submerged in the processing water stored in the tank 104. Therefore, processing water is not used as the cooling medium for cooling the spindle housing 42, and the cooling path 120 of the spindle housing 42 is not contaminated by the used processing water. Accordingly, it is possible to prevent the cooling efficiency of the spindle housing 42 from deteriorating with time.

Explanation of Reference Numerals

[0064] 2: Dicing apparatus (processing apparatus) 4: Chuck table 6: Processing means 8: Processing water supply means 10: Processing chamber 12: Gas-liquid separation mechanism 30: First drain pan 32: First drain 98: Second drain pan 100: Second drain 102: Exhaust means 104: Tank 106: Duct 114: Duct filter 116: Process water purification means 120: Cooling path of processing means 122: Pipe

Claims

1. A processing apparatus comprising: a chuck table for holding a workpiece; processing means having a processing tool for processing the workpiece held on the chuck table; processing water supply means for supplying processing water to a region where the workpiece is processed by the processing tool; a processing chamber covering a region including the chuck table and the processing means; and a gas-liquid separation mechanism. The gas-liquid separation mechanism includes a tank for storing used processing water and having an exhaust means, and a duct for sucking mist filling the processing chamber and communicating with the tank. The processing means has a cooling path formed therein, and a pipe communicating with the cooling path is immersed in the processing water stored in the tank. The processing apparatus.

2. The processing apparatus according to claim 1, wherein the jet outlet of the duct is immersed in the processing water stored in the tank.

3. The processing apparatus according to claim 2, wherein a filter for generating fine bubbles is disposed at the jet outlet.

4. a drain pan disposed in the processing chamber for receiving used processing water; a drain disposed in the drain pan and draining to the tank; The processing apparatus according to claim 1, wherein the drain communicates with the tank.

5. The processing apparatus according to claim 1, further comprising processing water purification means for purifying the processing water stored in the tank, and circulating the purified processing water to the processing water supply means.

Images