Thermal-conductive sheet structure, and electronic equipment

Abstract

To provide a thermal-conductive sheet structure capable of suppressing deformation, dirt, and misalignment of the thermal conductive sheet.SOLUTION: A thermal-conductive sheet structure 1 includes: a thermal conductive sheet 2; a sheet-like sheet holding member 3 with at least a part of the thermal conductive sheet 2 bonded thereto, which is formed so as to at least partially surround the outer periphery of the thermal conductive sheet 2. The sheet holding member 3 has an alignment structure for aligning the sheet holding member 3 with other members other than the sheet holding member 3.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a heat conduction sheet structure and an electronic device, and more particularly, to a heat conduction sheet structure including a heat conduction sheet and an electronic device including the heat conduction sheet structure.

Background Art

[0002] Semiconductor components such as CPUs (Central Processing Units) and GPUs (Graphics Processing Units) used in electronic devices such as PCs and servers generate a large amount of heat during operation. Therefore, such heat-generating bodies are used by being attached to a heat radiator such as a heat sink in order to release the generated heat. In this case, in order to smoothly transfer heat from the heat-generating body to the heat radiator, as shown in FIG. 2 of Patent Document 1, a heat conduction sheet is sandwiched between the heat-generating body and the heat radiator as an interlayer thermal bonding material (Thermal Interface Material: TIM).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above conventional technology, when manufacturing an electronic device, it is necessary to handle the heat conduction sheet by touching it, which may cause deformation, dents, scratches, dirt, contamination, etc. of the heat conduction sheet, and the installation position of the heat conduction sheet may not be appropriate and may shift, thereby reducing the heat dissipation performance such as thermal conductivity.

[0005] An object of the present disclosure is to provide a heat conduction sheet structure and an electronic device capable of suppressing the occurrence of deformation, dirt, and positional deviation of the heat conduction sheet.

Means for Solving the Problem

[0006] A heat conduction sheet structure according to an aspect of the present disclosure includes a heat conduction sheet and a sheet-shaped sheet holding member that is joined to at least a part of the heat conduction sheet and is provided so as to surround at least a part of the outer peripheral portion of the heat conduction sheet. The sheet holding member has an alignment structure for aligning the sheet holding member with other members other than the sheet holding member.

[0007] An electronic device according to an aspect of the present disclosure includes a heat generating body, a heat radiating body, and a heat conduction sheet structure provided between the heat generating body and the heat radiating body. The heat conduction sheet structure includes a heat conduction sheet and a sheet-shaped sheet holding member that is joined to at least a part of the heat conduction sheet and is provided so as to surround at least a part of the outer peripheral portion of the heat conduction sheet. The sheet holding member has an alignment structure for aligning the sheet holding member with other members other than the sheet holding member.

Effect of the Invention

[0008] According to the present disclosure, it is possible to provide a heat conduction sheet structure and an electronic device that can suppress the occurrence of deformation, contamination, and misalignment of the heat conduction sheet.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Mode for Carrying Out the Invention

[0010] 1. Overview Hereinafter, an overview of the heat conduction sheet structure 1 and the electronic device 100 of the present embodiment will be described with reference to the drawings. The following embodiments are merely examples of various embodiments of the present disclosure. The following embodiments can be variously modified according to design and the like as long as the object of the present disclosure can be achieved. Note that each drawing described in the following embodiments is a schematic diagram, and the ratio of the size and thickness of each component in each drawing does not necessarily reflect the actual dimensional ratio.

[0011] Examples of the heat conduction sheet structure 1 of the present embodiment are shown in FIGS. 2A and 2B to FIGS. 5A and 5B.

[0012] The heat conduction sheet structure 1 of the present embodiment includes a heat conduction sheet 2 and a sheet holding member 3. The sheet holding member 3 is sheet-shaped, joined to at least a part of the heat conduction sheet 2, and provided so as to surround at least a part of the outer peripheral portion of the heat conduction sheet 2. The sheet holding member 3 has an alignment structure P for aligning the sheet holding member 3 with other members other than the sheet holding member 3 (hereinafter also referred to as "other member H").

[0013] Thus, the heat conduction sheet structure 1 includes a heat conduction sheet 2 and a sheet holding member 3 provided so as to surround the heat conduction sheet 2. With such a configuration, during the fabrication of the electronic device 100, the portion of the sheet holding member 3 of the heat conduction sheet structure 1 can be handled, and there is no need to touch the heat conduction sheet 2. Thereby, the occurrence of deformation, dirt, etc. of the heat conduction sheet 2 can be suppressed.

[0014] The "alignment structure" of the sheet holding member 3 is a structure for aligning the sheet holding member 3 with another member H, and examples thereof include structures such as through holes and cutouts. The other member H is a member other than the sheet holding member 3 of the heat conduction sheet structure 1 in the electronic device 100 to be fabricated, and examples thereof include a heating element 10, a heat sink 20, a circuit board 30, and other spacer members 50 and the like.

[0015] By using the alignment structure P of this sheet holding member 3, during the fabrication of the electronic device 100, for example, by passing a rod-shaped jig or the like through the alignment structure P such as a through hole and a structure such as a hole in another member H and temporarily fixing it, the heat conduction sheet 2 in the electronic device 100 can be arranged at an appropriate position, and the occurrence of misalignment of the heat conduction sheet 2 can be suppressed. Also, during the fabrication of the electronic device 100, by tightening through the alignment structure P and a structure such as a screw hole in another member H with a screw 40 or the like, the occurrence of misalignment of the heat conduction sheet 2 in the electronic device 100 can be suppressed, and the heat conduction sheet 2 can be compressed.

[0016] An example of the electronic device 100 of this embodiment is shown in FIG. 1.

[0017] The electronic device 100 of the present embodiment includes a heating element 10, a heat sink 20, and a heat conduction sheet structure 1 provided between the heating element 10 and the heat sink 20. The heat conduction sheet structure 1 includes the heating element 10 and a sheet-shaped sheet holding member 3 that is joined to at least a part of the heat conduction sheet 2 and is provided so as to surround at least a part of the outer peripheral portion of the heat conduction sheet 2. The sheet holding member 3 has an alignment structure P for aligning the sheet holding member 3 with another member H other than the sheet holding member 3.

[0018] Since the electronic device 100 uses the heat conduction sheet structure 1 described above, it can be manufactured without touching the heat conduction sheet 2, and the heat conduction sheet 2 can be arranged at an accurate position using the alignment structure P. As a result, the electronic device 100 can suppress the occurrence of deformation, dirt, and misalignment of the heat conduction sheet, and as a result, can suppress a decrease in performance such as thermal conductivity caused by deformation, dirt, and misalignment of the heat conduction sheet 2.

[0019] 2. Details <Heat Conduction Sheet Structure> [Embodiment] Hereinafter, embodiments of the heat conduction sheet structure 1 will be described in detail. The heat conduction sheet structure 1 of the present embodiment includes a heat conduction sheet 2 and a sheet holding member 3. The sheet holding member 3 has an alignment structure P. Hereinafter, each component of the heat conduction sheet structure 1 will be described.

[0020] (Heat Conduction Sheet) The heat conduction sheet 2 is a member for transferring heat from the heating element 10 to the heat sink 20.

[0021] The shape of the heat conduction sheet 2 in plan view is usually a quadrilateral such as a rectangle or a square, but is not limited thereto, and the corners may be rounded. The plan view dimensions of the heat conduction sheet 2 are such that the length of one side is, for example, 0.5 cm or more and 20 cm or less.

[0022] The thickness of the heat conduction sheet 2 is, for example, 10 μm or more and 1000 μm or less, preferably 50 μm or more and 500 μm or less. The "thickness" of the heat conduction sheet means the average thickness, which means the arithmetic mean value of the thicknesses measured at a plurality of points (for example, any 10 points) on the heat conduction sheet 2.

[0023] Examples of the material of the heat conduction sheet 2 include metals such as copper, aluminum, and indium, ceramics such as aluminum nitride, alumina, and silicon nitride, and graphite.

[0024] Preferably, at least a part of the heat conduction sheet 2 is composed of a porous body. The "porous body" means a solid having pores (voids) inside. The "void" means a part where the material constituting the heat conduction sheet does not exist in the heat conduction sheet 2. The pores in the porous body may be through-holes or isolated holes, and may or may not be connected to the surface of the heat conduction sheet 2, but are preferably through-holes connected to the surface. The porosity of the heat conduction sheet 2 is preferably 30% by volume or more and 95% by volume or less, more preferably 50% by volume or more and 90% by volume or less. The "porosity" (% by volume) is a value calculated by [1 - (apparent specific gravity of the heat conduction sheet / true specific gravity of the material constituting the heat conduction sheet)] × 100. The apparent specific gravity of the heat conduction sheet can be calculated from the volume and mass obtained from the outer dimensions of the heat conduction sheet. Preferably, 50% by mass or more of the heat conduction sheet 2 is a porous body, more preferably 90% by mass or more is a porous body, and even 100% by mass may be composed of a porous body.

[0025] From the viewpoint of being composed of a porous body, the heat conduction sheet 2 is preferably made of a graphite sheet. By using a graphite sheet as the heat conduction sheet 2, the heat dissipation performance of the electronic device 100 can be further improved.

[0026] As the heat conduction sheet 2, one having a notch such as a T-shape in plan view can be used at the outer peripheral portion (see FIGS. 5A and 5B). Thereby, the heat conduction sheet 2 and the sheet holding member 3 can be joined more firmly, and the detachment of the heat conduction sheet 2 can be more suppressed.

[0027] (Sheet holding member) The sheet holding member 3 is provided so as to surround at least a part of the outer peripheral portion of the heat conduction sheet 2. The sheet holding member 3 may surround the entire outer peripheral portion of the heat conduction sheet 2 or may surround a part of the outer peripheral portion.

[0028] The sheet holding member 3 is sheet-shaped. The dimensions of the sheet holding member 3 in plan view can be appropriately selected according to the dimensions of the heat conduction sheet 2. The thickness of the sheet holding member 3 is, for example, 50 μm or more and 600 μm or less, and preferably 100 μm or more and 300 μm or less. The "thickness" of the sheet holding member means the average thickness, and means the arithmetic average value of the thicknesses measured at a plurality of points (for example, any 10 points) in the sheet holding member 3.

[0029] The material of the sheet holding member 3 is not particularly limited, but a resin is preferable, and a polyester resin such as polyethylene terephthalate (PET) is more preferable.

[0030] From the viewpoint of strength, the sheet holding member 3 preferably has a frame shape such as a rectangular shape, but may have other shapes such as a U-shape, for example.

[0031] The sheet holding member 3 has an alignment structure P. Examples of the alignment structure P include through holes, notches, and uneven shapes formed on the surface of the sheet holding member 3. The "through hole" means a hole that penetrates both surfaces of the sheet holding member 3. The "notch" means a region where there is no material constituting the sheet holding member 3, which is formed by cutting a part of the outer peripheral portion of the sheet holding member 3. Among these, a through hole or a notch is preferable, and a through hole is more preferable. In this case, the alignment accuracy of the heat conduction sheet 2 can be further improved. Examples of the shape of the through hole include circular shapes such as a perfect circle shape and an elliptical shape, and polygonal shapes such as a square shape, a triangular shape, and a star shape. Among these, from the viewpoint of being able to fix the sheet holding member 3 with a screw 40 or the like, a circular shape is preferable, and a perfect circle shape is more preferable. Examples of the shape of the notch include a U shape and a four - semi - circle shape. The dimensions of the alignment structure P can be appropriately selected according to the dimensions of the screw 40 or the like.

[0032] From the viewpoint of alignment accuracy, the number of the alignment structures P is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more. The upper limit of the number of the alignment structures P is not particularly limited, but for example, it is 20 or less.

[0033] From the viewpoint of alignment accuracy, the position of the alignment structure P in the sheet holding member 3 is preferably on the outer peripheral portion of the sheet holding member 3, and more preferably at the corner portion of the sheet holding member 3.

[0034] Examples of the bonding method between the sheet holding member 3 and the heat conduction sheet 2 include a method of forming an adhesive layer 3b with an adhesive such as double - sided tape, and a method of sandwiching the heat conduction sheet 2 between thermoplastic resin layers 3c such as a heat - laminate film and bonding the heat conduction sheet 2 by heating and pressurizing.

[0035] In the heat conduction sheet structure 1, it is preferable that the heat conduction sheet 2 has two sides facing each other, and at least a part of the two sides of the heat conduction sheet 2 is joined to the sheet holding member 3 (see FIGS. 2A and 2B, FIGS. 4A and 4B, and FIGS. 5A and 5B). In this way, by joining the heat conduction sheet 2 on two sides, warping of the heat conduction sheet 2 can be suppressed.

[0036] Also, in the heat conduction sheet structure 1, it is also preferable that the entire outer peripheral portion of the heat conduction sheet 2 is joined to the sheet holding member 3 (see FIGS. 3A and 3B). In this way, by joining the heat conduction sheet 2 over the entire outer peripheral portion, the heat conduction sheet 2 can be held more firmly.

[0037] At the joint where the heat conduction sheet 2 and the sheet holding member 3 are joined, it is preferable that the heat conduction sheet 2 is sandwiched between the sheet holding members 3. Examples of such a structure include those in which the heat conduction sheet 2 is sandwiched between the thermoplastic resin layers 3c of the sheet holding member 3 (see FIGS. 3A and 3B, FIGS. 4A and 4B, and FIGS. 5A and 5B). In this case, the heat conduction sheet 2 can be held more firmly. Further, by using the thermoplastic resin layer 3c, it is possible to expect an effect of suppressing deterioration of the adhesive layer portion due to oil, solvent, etc. as compared with the method of forming the adhesive layer 3b with an adhesive such as double-sided tape.

[0038] The thickness of the sheet holding member 3 is preferably larger than the thickness of the heat conduction sheet 2. In this case, the handleability of the heat conduction sheet structure 1 can be further improved.

[0039] Also, the tensile elastic modulus of the sheet holding member 3 is preferably greater than that of the heat conduction sheet 2. In this case, by using a material that is harder than the heat conduction sheet 2 and has so-called stiffness for the sheet holding member 3, the handleability of the heat conduction sheet structure 1 can be further improved. The "tensile elastic modulus" (MPa) of a solid material is a value indicating the magnitude of rigidity among the mechanical properties of the material. The tensile elastic modulus of the sheet holding member 3 and the heat conduction sheet 2 can be obtained by a measurement method conforming to ASTM D638-14.

[0040] Next, the heat conduction sheet structure 1 of the first to fourth embodiments of the present disclosure will be described.

[0041] (First Embodiment) FIGS. 2A and 2B are views showing the heat conduction sheet structure 1 of the first embodiment. As shown in FIGS. 2A and 2B, in the heat conduction sheet structure 1 of the first embodiment, the heat conduction sheet 2 and the sheet holding member 3 are joined using double-sided tape in the vicinity of two opposing sides of the heat conduction sheet 2 that is square in plan view. That is, the sheet holding member 3 is composed of a PET film 3a having a frame shape or the like, and an adhesive layer 3b formed by double-sided tape in the vicinity of two opposing sides in this frame shape or the like. As a result, the heat conduction sheet 2 and the PET film 3a in the sheet holding member 3 are joined by the adhesive layer 3b of the double-sided tape at two sides of the heat conduction sheet.

[0042] The heat conduction sheet structure 1 of the first embodiment can be easily manufactured by suppressing the distortion of the heat conduction sheet 2 by joining it with double-sided tape at two sides of the heat conduction sheet 2.

[0043] (Second Embodiment) Figs. 3A and 3B are diagrams showing the heat conduction sheet structure 1 of the second embodiment. As shown in Figs. 3A and 3B, the heat conduction sheet structure 1 of the second embodiment includes a heat conduction sheet 2 and a sheet holding member 3 using a heat laminate film in which a thermoplastic resin layer 3c is laminated on a PET film 3a. They are joined by heating over the entire outer peripheral portion of the square heat conduction sheet 2 in plan view. That is, as the sheet holding member 3, a heat laminate film in which a PET film 3a, a thermoplastic resin layer 3c, a thermoplastic resin layer 3c, and a PET film 3a are laminated in this order is formed into a frame shape. By heating and using the joined portion, the heat conduction sheet 2 and the PET film 3a in the sheet holding member 3 are joined by being sandwiched between the thermoplastic resin layers 3c over the entire outer peripheral portion of the heat conduction sheet 2.

[0044] The heat conduction sheet structure 1 of the second embodiment can be manufactured by more firmly holding the heat conduction sheet 2 by sandwiching and joining it between the thermoplastic resin layers 3c over the entire outer peripheral portion of the heat conduction sheet 2. Further, by using the thermoplastic resin layer 3c, it is possible to expect an effect of suppressing the deterioration of the adhesive layer portion due to oil, solvent, etc., compared to the method of forming the adhesive layer 3b with an adhesive such as double-sided tape.

[0045] (Third Embodiment) Figs. 4A and 4B are diagrams showing the heat conduction sheet structure 1 of the third embodiment. As shown in Figs. 4A and 4B, the heat conduction sheet structure 1 of the third embodiment includes a heat conduction sheet 2 and a frame-shaped sheet holding member 3 using a heat laminate film in which a PET film 3a and a thermoplastic resin layer 3c are laminated. They are joined by heating in the vicinity of two opposite sides of the square heat conduction sheet 2 in plan view. That is, the heat conduction sheet 2 and the PET film 3a in the sheet holding member 3 are joined by being sandwiched between the thermoplastic resin layers 3c on two sides of the heat conduction sheet 2.

[0046] In the heat conduction sheet structure 1 of the third embodiment, at two sides of the heat conduction sheet 2, by being sandwiched and joined between the thermoplastic resin layers 3c, it is possible to produce while suppressing the distortion of the heat conduction sheet 2 and holding it more firmly. Further, by using the thermoplastic resin layer 3c, it is possible to expect an effect of suppressing the deterioration of the adhesive layer portion due to oil, solvent, etc., compared to the method of forming the adhesive layer 3b with an adhesive such as double-sided tape.

[0047] (Fourth Embodiment) FIGS. 5A and 5B are views showing the heat conduction sheet structure 1 of the fourth embodiment. As shown in FIGS. 5A and 5B, the heat conduction sheet structure 1 of the fourth embodiment, similar to the above-described third embodiment, in addition to the heat conduction sheet 2 and the sheet holding member 3 being joined by the thermoplastic resin layer 3c in the vicinity of two opposite sides of the heat conduction sheet 2 having a square shape in plan view, the heat conduction sheet 2 has four T-shaped notches in the vicinity of two opposite sides.

[0048] In the heat conduction sheet structure 1 of the fourth embodiment, at two sides of the heat conduction sheet 2, by being sandwiched and joined between the thermoplastic resin layers 3c and using a heat conduction sheet 2 having notches, while suppressing the distortion of the heat conduction sheet 2, due to the structure in which the heat conduction sheet 2 is difficult to come off, it can be produced while holding it more firmly.

[0049] <Electronic device> An example of the electronic device 100 of this embodiment is shown in FIG. 1.

[0050] The electronic device 100 includes a heating element 10, a heat radiator 20, and a heat conduction sheet structure 1 provided between the heating element 10 and the heat radiator 20. The heat conduction sheet structure 1 includes a heat conduction sheet 2 and a sheet-shaped sheet holding member 3 that is joined to at least a part of the heat conduction sheet 2 and is provided so as to surround at least a part of the outer peripheral portion of the heat conduction sheet 2. The sheet holding member 3 has an alignment structure P for aligning the sheet holding member 3 with another member H other than the sheet holding member 3.

[0051] Since the electronic device 100 uses the aforementioned heat conduction sheet structure 1, it can be manufactured without touching the heat conduction sheet 2, and the heat conduction sheet 2 can be accurately positioned using the alignment structure P. As a result, the electronic device 100 can suppress the occurrence of deformation, dirt, and misalignment of the heat conduction sheet, and consequently, can suppress a decrease in heat dissipation performance such as thermal conductivity caused by deformation, dirt, and misalignment of the heat conduction sheet 2.

[0052] In the electronic device 100 of FIG. 1, by inserting through the through holes which are the alignment structure P of the heat conduction sheet structure 1 and tightening the screws 40 inserted into the screw holes of the spacer 50, the heat conduction sheet structure 1 is arranged at an appropriate position in the electronic device 100, and the heat generating body 10 and the heat radiating body 20 are fastened, whereby the heat conduction sheet 2 is compressed. Hereinafter, each component of the electronic device 100 will be described.

[0053] (Heat Conduction Sheet Structure) The heat conduction sheet structure 1 has been described above.

[0054] (Heat Generating Body) The heat generating body 10 is a member that generates heat and is mounted on the circuit board 30. The heat generating body 10 is, for example, a semiconductor component. Examples of semiconductor components include, but are not limited to, transistors, CPUs, MPUs (microprocessing units), GPUs, driver ICs, memories, etc. The heat generating body 10 may be composed of, for example, a heat spreader and a chip portion fixed on the heat spreader. The heat spreader is a plate-like member made of metal or the like, and the chip portion is, for example, a semiconductor package. In this case, the chip portion is arranged on a portion excluding the outer edge portion of the heat spreader, and a plurality of screw holes or the like may be formed at positions corresponding to a plurality of screw holes or the like penetrating the heat spreader on the outer edge portion.

[0055] (Heat Radiating Body) The heat radiator 20 is a member to which the heat generated by the heating element 10 is transferred. Heat can be released from the heat radiator 20. The heat radiator 20 is, for example, a heat sink. When the heat radiator 20 is a plate-shaped heat sink, the heat radiator 20 may further include heat radiating fins. A plurality of screw holes or the like may be formed in the heat radiator 20 at positions corresponding to the plurality of screw holes or the like in the aforementioned heating element 10, respectively.

[0056] (Circuit board) The circuit board 30 is a board including a circuit on which members such as a CPU, MPU, GPU, driver IC, and memory, which are the heating element 10, are mounted. The electronic device 100 may have one circuit board or may have a plurality of circuit boards. The circuit board 30 may be a single-layer board or a multi-layer board.

[0057] (Other members) Examples of the other member H include, for example, in addition to the heating element 10, the heat radiator 20, and the circuit board 30, a spacer 50 or the like disposed on one or both sides of the circuit board 30.

[0058] Thus, in the electronic device 100, the sheet holding member 3 has a through hole or a notch as the alignment structure P, the screw 40 is passed through the through hole or the notch of the sheet holding member 3, and the heat conduction sheet 2 is preferably compressed by at least a part of the heat conduction sheet 2 by the heating element 10 and the heat radiator 20 being fastened by the screw 40. In this case, in the electronic device 100, the heat conduction sheet 2 is suppressed from being deformed, soiled, and displaced, and is moderately compressed. Thereby, the electronic device 100 can further improve the heat dissipation performance.

[0059] (Summary) As is clear from the above embodiments, the present disclosure includes the following aspects. Hereinafter, reference numerals are attached in parentheses only for the purpose of clarifying the correspondence with the embodiments.

[0060] The heat conduction sheet structure (1) according to the first aspect includes a heat conduction sheet (2) and a sheet-shaped sheet holding member (3) that is joined to at least a part of the heat conduction sheet (2) and is provided so as to surround at least a part of the outer peripheral portion of the heat conduction sheet (2). The sheet holding member (3) has an alignment structure (P) for aligning the sheet holding member (3) with another member (H) other than the sheet holding member (3).

[0061] According to the first aspect, it is possible to suppress the occurrence of deformation, dirt, and misalignment of the heat conduction sheet (2) in the heat conduction sheet structure (1).

[0062] In the heat conduction sheet structure (1) according to the second aspect, in the first aspect, the sheet holding member (3) has a through hole or a notch as the alignment structure (P).

[0063] According to the second aspect, it is possible to further improve the alignment accuracy of the heat conduction sheet (2) in the heat conduction sheet structure (1).

[0064] In the heat conduction sheet structure (1) according to the third aspect, in the first or second aspect, the sheet holding member (3) has a frame shape.

[0065] According to the third aspect, it is possible to further improve the strength of the heat conduction sheet structure (1).

[0066] In the heat conduction sheet structure (1) according to the fourth aspect, in any one of the first to third aspects, the heat conduction sheet (2) has two sides facing each other, and at least a part of the two sides of the heat conduction sheet (2) is joined to the sheet holding member (3).

[0067] According to the fourth aspect, in the heat conduction sheet structure (1), by joining the heat conduction sheet (2) on two sides, it is possible to suppress the distortion of the heat conduction sheet (2).

[0068] In the heat conduction sheet structure (1) according to the fifth aspect, in any one of the first to fourth aspects, the entire outer peripheral portion of the heat conduction sheet (2) and the sheet holding member (3) are joined together.

[0069] According to the fifth aspect, in the heat conduction sheet structure (1), by joining the heat conduction sheet (2) over the entire outer peripheral portion, it can be held more firmly than the heat conduction sheet (2).

[0070] In the heat conduction sheet structure (1) according to the sixth aspect, in any one of the first to fifth aspects, at the joint where the heat conduction sheet (2) and the sheet holding member (3) are joined, the heat conduction sheet (2) is sandwiched between the sheet holding members (3).

[0071] According to the sixth aspect, in the heat conduction sheet structure (1), it can be held more firmly than the heat conduction sheet (2).

[0072] In the heat conduction sheet structure (1) according to the seventh aspect, in any one of the first to sixth aspects, the thickness of the sheet holding member (3) is larger than the thickness of the heat conduction sheet (2).

[0073] According to the seventh aspect, the handleability of the heat conduction sheet structure (1) can be further improved.

[0074] In the heat conduction sheet structure (1) according to the eighth aspect, in any one of the first to seventh aspects, the tensile elastic modulus of the sheet holding member (3) is larger than the tensile elastic modulus of the heat conduction sheet (2).

[0075] According to the eighth aspect, the handleability of the heat conduction sheet structure (1) can be further improved.

[0076] In the heat conduction sheet structure (1) according to the ninth aspect, the heat conduction sheet (2) is made of a graphite sheet.

[0077] According to the ninth aspect, by using a graphite sheet as the heat conduction sheet (2), the heat dissipation performance of the electronic device (100) can be further improved.

[0078] The electronic device (100) according to the tenth aspect includes a heat generating body (10), a heat radiating body (20), and a heat conduction sheet structure (1) provided between the heat generating body (10) and the heat radiating body (20). The heat conduction sheet structure (1) includes a heat conduction sheet (2) and a sheet-shaped sheet holding member (3) that is joined to at least a part of the heat conduction sheet (2) and is provided so as to surround at least a part of the outer peripheral portion of the heat conduction sheet (2). The sheet holding member (3) has an alignment structure (P) for aligning the sheet holding member (3) with other members (H) other than the sheet holding member (3).

[0079] According to the tenth aspect, the electronic device (100) can be manufactured without touching the heat conduction sheet (2), and the heat conduction sheet (2) can be accurately positioned. Thereby, the electronic device (100) can suppress the occurrence of deformation, dirt, and misalignment of the heat conduction sheet (2).

[0080] In the electronic device (100) according to the eleventh aspect, in the tenth aspect, the sheet holding member (3) has a through hole or a notch as the alignment structure (P), and a screw (40) is passed through the through hole or the notch of the sheet holding member (3). The heat conduction sheet (2) is compressed by at least a part of the heat conduction sheet (2) by the heat generating body (10) and the heat radiating body (20) being fastened with the screw (40).

[0081] According to the eleventh aspect, the electronic device (100) can further improve the heat dissipation performance by appropriately compressing the heat conduction sheet (2).

Explanation of Reference Numerals

[0082] 1 Heat conduction sheet structure 2 Heat conduction sheet 3 Sheet holding member P-position alignment structure 10 Heating element 20 Heat sink 30 Circuit board 40 Screw 100 Electronic device

Claims

1. A heat conduction sheet, A sheet-shaped sheet holding member joined to at least a part of the heat conduction sheet and provided so as to surround at least a part of the outer peripheral portion of the heat conduction sheet, Comprising, The sheet holding member has an alignment structure for aligning the sheet holding member with other members other than the sheet holding member, Heat conduction sheet structure.

2. The sheet holding member has a through hole or a notch as the alignment structure, The heat conduction sheet structure according to claim 1.

3. The sheet holding member has a frame shape, The heat conduction sheet structure according to claim 1.

4. The heat conduction sheet has two sides facing each other, At least a part of the two sides of the heat conduction sheet and the sheet holding member are joined, The heat conduction sheet structure according to claim 1.

5. The entire outer peripheral portion of the heat conduction sheet and the sheet holding member are joined, The heat conduction sheet structure according to claim 1.

6. At the joint where the heat conduction sheet and the sheet holding member are joined, the heat conduction sheet is sandwiched between the sheet holding members, The heat conduction sheet structure according to claim 1.

7. The thickness of the sheet holding member is larger than the thickness of the heat conduction sheet, The heat conduction sheet structure according to claim 1.

8. The tensile elastic modulus of the sheet holding member is larger than the tensile elastic modulus of the heat conduction sheet, The heat conduction sheet structure according to claim 1.

9. The heat conduction sheet is made of a graphite sheet, The heat conduction sheet structure according to claim 1.

10. An electronic device comprising a heat generating body, a heat radiating body, and a heat conduction sheet structure provided between the heat generating body and the heat radiating body, The heat conduction sheet structure includes a heat conduction sheet and a sheet-shaped sheet holding member joined to at least a part of the heat conduction sheet and provided so as to surround at least a part of the outer peripheral portion of the heat conduction sheet, The sheet holding member has an alignment structure for aligning the sheet holding member with other members other than the sheet holding member, Electronic equipment.

11. The sheet holding member has a through hole or a notch as the alignment structure, A screw is passed through the through hole or the notch of the sheet holding member, The heat conduction sheet is compressed by at least a part of the heat conduction sheet by the heat generating body and the heat radiating body when the heat generating body and the heat radiating body are fastened by the screw. The electronic device according to claim 10.

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