Electronic component inspection device and electronic component inspection method

Abstract

To provide an electronic component inspection device and an electronic component inspection method.SOLUTION: An electronic component inspection device is used for inspecting an electronic component and comprises a carrier frame, a heating module, and an inspection module. The carrier frame is used for mounting the electronic component, and the heating module includes a first heating source and a second heating source. The first heating source is disposed on one side of the carrier frame and irradiates one surface of the electronic component. The second heating source is disposed on the other side of the carrier frame and irradiates the other surface of the electronic component. The inspection module includes a moving mechanism and an inspection probe attached to the moving mechanism. The moving mechanism is disposed corresponding to the carrier frame and drives the inspection probe to inspect the electronic component.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an inspection apparatus used for inspecting electronic components, and more particularly, to an electronic component inspection apparatus and an electronic component inspection method.

Background Art

[0002] Electronic components such as printed circuit boards (PCBs), wafers, liquid crystal panels, and IC-mounted substrates are products that require heating and electrical inspections. Usually, they have circuits and a plurality of circuit nodes arranged in the circuits, a plurality of electronic elements are electrically connected to the plurality of circuit nodes, and the electronic elements are electrically controlled by the circuits. The above-mentioned electronic components are widely used in various electronic products.

[0003] Among such electronic components, for example, in a printed circuit board, due to insufficient thickness of a metal layer, cracks or peeling of the metal layer, or other factors, when the circuit node is heated, it may not conduct normally or a contact failure phenomenon may occur. Therefore, the manufacturer has to inspect the circuit nodes of the printed circuit board at the time of shipment.

[0004] However, in the conventional inspection of circuit nodes, since a heating method that contacts the printed circuit board with ceramics is used, only the portion in contact due to the ceramic heater structure of the printed circuit board is heated, and other portions not in contact with the ceramic heater structure are not heated. Therefore, problems such as non-uniform heating and inaccurate yield occur in the inspection process of the printed circuit board.

[0005] In view of this, the inventor of the present invention has made intensive studies on the above-mentioned defects of the prior art and combined the application of theory, and as a result of striving to solve the above problems, it has become the improvement goal of the inventor.

Summary of the Invention

Problems to be Solved by the Invention

[0006] An object of the present invention is to provide an electronic component inspection apparatus and an electronic component inspection method that realize uniform heating of an electronic component by heating the electronic component using a heating module, and improve inspection accuracy and yield.

Means for Solving the Problems

[0007] In order to achieve the above object, the present invention provides, in an embodiment, an electronic component inspection apparatus and an electronic component inspection method, which are used for inspecting an electronic component. The electronic component inspection apparatus according to the present invention includes a carrier frame for mounting the electronic component, a first heating source disposed on one side of the carrier frame and irradiating a corresponding one surface of the electronic component, and a second heating source disposed on the other side of the carrier frame and irradiating a corresponding other surface of the electronic component. The heating module includes a moving mechanism disposed corresponding to the carrier frame, and an inspection probe attached to the moving mechanism. The moving mechanism includes at least one inspection module that drives the inspection probe to inspect the electronic component.

[0008] The electronic component inspection method according to the present invention includes the steps of providing the electronic component inspection apparatus and the electronic component, wherein the electronic component inspection apparatus further includes a parallel movement mechanism, the carrier frame is attached to the parallel movement mechanism and moves following the parallel movement mechanism, and the electronic component is divided into a first region and a second region (step A); moving the first region of the electronic component to a position corresponding to the heating module by the parallel movement mechanism and the carrier frame (step B); heating the first region of the electronic component to a preset temperature by the first heating source and the second heating source of the heating module (step C); driving the inspection probe by the movement mechanism to electrically inspect the first region of the electronic component that has reached the preset temperature (step D); separating the first region of the electrically inspected electronic component from the heating module by the parallel movement mechanism and the carrier frame, and further moving the second region of the electronic component to a position corresponding to the heating module (step E); heating the second region of the electronic component to a preset temperature by the first heating source and the second heating source of the heating module (step F); and driving the inspection probe by the movement mechanism to electrically inspect the second region of the electronic component that has reached the preset temperature (step G).

Effect of the Invention

[0009] From the above, the electronic component inspection apparatus according to the present invention adopts a heating method in which the heating module irradiates the electronic component over a wide range, compared with the conventional heating method of contacting the electronic component with ceramics. The first heating source is arranged above the carrier frame and irradiates the upper surface of the electronic component over a wide range, and the second heating source is arranged below the carrier frame and irradiates the lower surface of the electronic component over a wide range. Thus, the heating module can make the electronic component receive heat uniformly, and further improve the inspection yield. As a result, the electronic component inspection apparatus has the effect of uniformly heating the electronic component and improving the inspection accuracy and yield.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

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Figure 8

Mode for Carrying Out the Invention

[0011] A detailed description and technical content of the present invention will be described below with reference to the drawings. However, the drawings are for illustrative purposes only and are not intended to limit the present invention.

[0012] Referring to FIGS. 1 to 8, the present invention provides an electronic component inspection apparatus and an electronic component inspection method, which are used for inspecting the electronic component 100. The electronic component inspection apparatus 10 mainly includes a carrier frame 1, a heating module 2, and one or more inspection modules 3.

[0013] As shown in FIGS. 1 to 6, the carrier frame 1 is used for mounting the electronic component 100, and a transmission region where two opposing surfaces of the electronic component 100 are exposed is provided inside the carrier frame 1.

[0014] As shown in FIGS. 1 to 6, the heating module 2 includes a first heating source 21 and a second heating source 22. The first heating source 21 is disposed on one side of the carrier frame 1 and irradiates a corresponding surface of the electronic component 100. The second heating source 22 is disposed on the other side of the carrier frame 1 and irradiates a corresponding surface of the other side of the electronic component 100. The first heating source 21 and the second heating source 22 are disposed opposite to each other.

[0015] In addition, the first heating source 21 and the second heating source 22 each have a halogen heater lamp 23. The halogen heater lamp 23 is preferably a gold halogen heater lamp. The gold halogen heater lamp can instantaneously rise to a high temperature of 500 ° C or higher, has a high infrared radiation efficiency, a strong power, a fast heating speed, can be controlled at 1650K (Kelvin temperature scale) by a special cold coating lamp, protects the eyes, does not feel dazzling even when directly viewed, has a main radiation wavelength of 0.8 to 1.4 microns, can be adjusted in output by a controller, and has features such as low price and long life.

[0016] As shown in FIGS. 1 to 3, the inspection module 3 includes a moving mechanism 31 and an inspection probe 32 attached to the moving mechanism 31. The moving mechanism 31 is disposed corresponding to the carrier frame 1 and drives the inspection probe 32 to inspect whether the circuit nodes of the electronic component 100 are conducting normally or whether there is a phenomenon of poor contact.

[0017] Specifically, the moving mechanism 31 includes a translational drive group 311, a lifting drive group 312 attached to the translational drive group 311, and a fixed seat 313 attached to the lifting drive group 312. The inspection probe 32 is fixed to the fixed seat 313. The fixed seat 313 moves up and down relative to the electronic component 100 via the lifting drive group 312, and the lifting drive group 312 moves horizontally left and right relative to the electronic component 100 via the translational drive group 311.

[0018] Here, the number of inspection modules 3 according to this embodiment is four, but it is not limited thereto. Among the four inspection modules 3, two inspection modules 3 are arranged on the left and right on one side of the carrier frame 1, and the remaining two inspection modules 3 are arranged on the left and right on the other side of the carrier frame 1, and the four inspection probes 32 are adapted to detect the left and right sides of the upper surface and the left and right sides of the lower surface of the electronic component 100.

[0019] As shown in FIGS. 1 to 6, the electronic component inspection apparatus 10 according to the present invention further includes a translation mechanism 4. The carrier frame 1 is attached to the translation mechanism 4 and can move left and right in parallel with respect to the first heating source 21 and the second heating source 22 following the translation mechanism 4.

[0020] Note that the translation drive group 311, the lifting drive group 312, and the translation mechanism 4 are not limited to those disclosed in the drawings of this embodiment, and may be general linear slide rails, motor-driven push rods, or the like.

[0021] As shown in FIGS. 1 to 6, the electronic component inspection apparatus 10 according to the present invention is used in a state of heating the electronic component 100 using the heating module 2. The first heating source 21 is arranged above the carrier frame 1 and irradiates a wide range corresponding to the upper surface of the electronic component 100. The second heating source 22 is arranged below the carrier frame 1 and can irradiate a wide range corresponding to the lower surface of the electronic component 100.

[0022] Thereby, compared with the conventional heating method in which a ceramic contacts an electronic component, the electronic component inspection apparatus 10 according to the present invention adopts a heating method in which the heating module 2 irradiates the electronic component 100 over a wide range, so that the electronic component 100 can receive heat uniformly and the inspection yield can be further improved. As a result, the electronic component inspection apparatus 10 can uniformly heat the electronic component 100 and improve the inspection accuracy and yield.

[0023] In addition, since the first heating source 21 and the second heating source 22 each have a halogen heater lamp 23, the heating module 2 has the advantages of instantaneously rising temperature, high heating speed, high infrared radiation efficiency, low price, and long service life.

[0024] Referring to FIG. 1, the electronic component inspection method according to the present invention will be described as follows. The electronic component inspection method according to the present invention includes the following steps A to G.

[0025] As shown in FIGS. 1, 4 to 5, and 7, in step A, an electronic component inspection apparatus 10 and an electronic component 100 are provided. The electronic component inspection apparatus 10 further includes a parallel movement mechanism 4. The carrier frame 1 is attached to the parallel movement mechanism 4 and moves following the parallel movement mechanism 4. The electronic component 100 is divided into a first region 101 and a second region 102.

[0026] As shown in FIGS. 1, 4 to 5, and 7, in step B, the first region 101 of the electronic component 100 is moved to a position corresponding to the heating module 2 by the parallel movement mechanism 4 and the carrier frame 1.

[0027] As shown in FIGS. 1, 4 to 5, and 7, in step C, the first region 101 of the electronic component 100 is heated to a preset temperature by the first heating source 21 and the second heating source 22 of the heating module 2.

[0028] As shown in FIGS. 1, 4 to 5, and 7, in step D, the inspection probe 32 is driven by the movement mechanism 31, and the first region 101 of the electronic component 100 that has reached the preset temperature is electrically inspected.

[0029] As shown in FIGS. 1, 4, 6, and 8, in step E, the first region 101 of the electronically inspected electronic component 100 is separated from the heating module 2 by the parallel movement mechanism 4 and the carrier frame 1, and the second region 102 of the electronic component 100 is further moved to a position corresponding to the heating module 2.

[0030] As shown in FIGS. 1, 4, 6, and 8, in step F, the first heating source 21 and the second heating source 22 of the heating module 2 heat the second region 102 of the electronic component 100 to a preset temperature.

[0031] As shown in FIGS. 1, 4, 6, and 8, in step G, the inspection probe 32 is driven by the moving mechanism 31, and the second region 102 of the electronic component 100 that has reached the preset temperature is electrically inspected.

[0032] Here, as shown in FIGS. 5 and 6, the first region 101 may be located on the left side of the electronic component 100, and the second region 102 may be located in the center of the electronic component 100. Alternatively, as shown in FIGS. 7 and 8, the first region 101 may be located in the center of the electronic component 100, and the second region 102 may be located on the right side of the electronic component 100, but it is not limited to this embodiment.

[0033] To summarize the above, the electronic component inspection apparatus and the electronic component inspection method according to the present invention are not found in the same kind of products and have not been publicly used, and have industrial applicability, novelty, and progressiveness. They fully meet the patent application requirements and will be applied based on the Patent Law to protect the rights of the inventor.

Description of Reference Numerals

[0034] 100 Electronic component 101 First region 102 Second region 10 Electronic component inspection apparatus 1 Carrier frame 2 Heating module 21 First heating source 22 Second heating source 23 Halogen heater lamp 3 Inspection module 31 Moving mechanism 311 Parallel movement drive group 312 Lifting drive group 313 Fixed seat 32 Inspection probe 4 Parallel movement mechanism

Claims

1. An electronic component inspection apparatus for inspecting electronic components, comprising: a carrier frame for mounting the electronic components; a heating module disposed on one side of the carrier frame and including a first heating source that irradiates one surface of the electronic component, and a second heating source disposed on the other side of the carrier frame and irradiating the other surface of the electronic component; a moving mechanism disposed corresponding to the carrier frame, and inspection probes attached to the moving mechanism, the moving mechanism including at least one inspection module that drives the inspection probes to inspect the electronic components.

2. The electronic component inspection apparatus according to claim 1, wherein the first heating source and the second heating source each have a halogen heater lamp.

3. The electronic component inspection apparatus according to claim 2, wherein the halogen heater lamp is a gold halogen heater lamp.

4. The electronic component inspection apparatus according to claim 1, wherein the first heating source and the second heating source are disposed opposite to each other.

5. further including a translational mechanism; The electronic component inspection apparatus according to claim 4, wherein the carrier frame is attached to the translational mechanism and is translatable with respect to the first heating source and the second heating source following the translational mechanism.

6. The electronic component inspection apparatus according to claim 5, wherein the translational mechanism is a linear slide rail or a motor-driven push rod.

7. The moving mechanism includes a translational drive group, a lifting drive group attached to the translational drive group, and a fixed seat attached to the lifting drive group. The inspection probes are fixed to the fixed seat. The translational drive group and the lifting drive group are each a linear slide rail or a motor-driven push rod. The electronic component inspection apparatus according to claim 1.

8. The number of the at least one inspection module is four. Two of the inspection modules are disposed on the left and right sides of one side of the carrier frame, and the remaining two inspection modules are disposed on the left and right sides of the other side of the carrier frame. The electronic component inspection apparatus according to claim 1.

9. The electronic component inspection apparatus according to claim 1, wherein the carrier frame has a transmission region inside, and two opposite surfaces of the electronic component are exposed through the transmission region.

10. Providing the electronic component inspection device and the electronic component according to claim 1, wherein the electronic component inspection device further includes a translation mechanism, the carrier frame is attached to the translation mechanism and moves following the translation mechanism, and the electronic component is divided into a first region and a second region (step (A)); Moving the first region of the electronic component to a position corresponding to the heating module by the translation mechanism and the carrier frame (step (B)); Heating the first region of the electronic component to a preset temperature by the first heating source and the second heating source of the heating module (step (C)); Driving the inspection probe by the movement mechanism and electrically inspecting the first region of the electronic component that has reached the preset temperature (step (D)); Moving the first region of the electronically inspected electronic component away from the heating module by the translation mechanism and the carrier frame, and further moving the second region of the electronic component to a position corresponding to the heating module (step (E)); Heating the second region of the electronic component to a preset temperature by the first heating source and the second heating source of the heating module (step (F)); Driving the inspection probe by the movement mechanism and electrically inspecting the second region of the electronic component that has reached the preset temperature (step (G)). An electronic component inspection method comprising the steps of

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