Laminated type electronic component

Abstract

To provide a laminated type electronic component which is excellent in electric characteristics.SOLUTION: A laminated type electronic component includes: a body 110 which includes a first surface and a second surface facing each other in a first direction, a third surface 3 and a fourth surface 4 which are connected to the first surface and the second surface and face each other in a second direction, and a fifth surface and a sixth surface which are connected to the first surface to the fourth surface and face each other in a third direction, and includes a dielectric layer 111 and internal electrodes 121 and 122 which are alternately arranged with the dielectric layer in a first direction, are exposed to the exposure surface of any one of the third surface and the fourth surface, and are separated from the fifth surface and the sixth surface; and external electrodes 131 and 132 which are arranged on the exposure surface and are connected to the internal electrodes, wherein when the thickness of the central part in the third direction of the internal electrodes and the width in a third direction when the exposure surface of the internal electrodes is measured are represented by T1 and W1, and the thickness of the central part in the third direction of the internal electrodes and the width in a third direction when the central part CP2 in the second direction of the body is measured are represented by T2 and W2, T1>T2 and 0.6≤W2 / W1≤0.9 are satisfied.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as smartphones, smartwatches, and wearable devices, and serves to charge or discharge electricity. Such an MLCC can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount.

[0003] Recently, miniaturization of MLCCs mounted on various electronic products has been demanded, and recently, MLCCs may be built into the substrate or mounted between an AP (Application Processor) and a printed circuit board. As a result, the market for ultra-thin and ultra-small MLCCs is expanding.

[0004] However, in the case of ultra-small MLCCs, the width and thickness of the internal electrodes also decrease together. When the width and thickness of the internal electrodes decrease, poor contact between the internal electrodes and the external electrodes is likely to occur, which may cause a decrease in the capacitance of the MLCC or capacitance dispersion. In order to solve such problems, it is necessary to design a new structure for the internal electrodes.

Summary of the Invention

Problems to be Solved by the Invention

[0005] One of the various objects of the present invention is to provide a multilayer electronic component having excellent electrical characteristics.

[0006] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of describing specific embodiments of the present invention.

Means for Solving the Problem

[0007] One embodiment of the present invention includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction. The dielectric layer and the dielectric layer are alternately arranged in the first direction, and an internal electrode exposed on one of the exposed surfaces of the third surface and the fourth surface and separated from the fifth surface and the sixth surface, and an external electrode arranged on the exposed surface and connected to the internal electrode. When the thickness and width in the third direction of the central portion of the internal electrode measured on the exposed surface are T1 and W1 respectively, and the thickness and width in the third direction of the central portion of the internal electrode measured at the central portion in the second direction of the main body are T2 and W2 respectively, a laminated electronic component satisfying T1>T2 and 0.6≦W2 / W1≦0.9 is provided.

Advantages of the Invention

[0008] As one of various advantages of the present invention, a laminated electronic component with excellent electrical characteristics can be provided.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

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Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0011] In addition, parts not related to the explanation are omitted in the drawings for clearly explaining the present invention, and the sizes and thicknesses of the illustrated configurations are arbitrarily shown for convenience of explanation. Therefore, the present invention is not necessarily limited by the illustration. Also, components having the same functions within the scope of the same idea are described using the same reference numerals. Further, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0012] In the drawings, the first direction can be defined as the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0013] Multilayer electronic component FIG. 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view schematically showing a cut cross-section along the line I-I' of FIG. 1, FIG. 3 is a cross-sectional view schematically showing a cut cross-section along the line II-II' of FIG. 1, FIG. 4 is a cross-sectional view schematically showing a cut cross-section along the line III-III' of FIG. 1, FIG. 5 is a cross-sectional view schematically showing a cut cross-section along the line IV-IV' of FIG. 2, FIG. 6 is a cross-sectional view schematically showing a cut cross-section along the line V-V' of FIG. 2, FIG. 7 is a drawing showing FIGS. 5 and 6 superimposed, FIGS. 8 and 9 are enlarged views schematically showing various examples of the K1 region of FIG. 2, and FIG. 10 is a plan view schematically showing a ceramic green sheet printed with an internal electrode pattern for manufacturing a multilayer electronic component according to an embodiment of the present invention.

[0014] Hereinafter, with reference to FIGS. 1 to 10, a multilayer electronic component 100 according to an embodiment of the present invention will be described in detail. Further, as an example of the multilayer electronic component, a multilayer ceramic capacitor will be described, but the present invention is not limited thereto, and it can also be applied to various multilayer electronic components, such as inductors, piezoelectric elements, varistors, or thermistors.

[0015] The size of the multilayer electronic component 100 is not particularly limited. However, as described above, the present invention is for improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132 of the ultra-small multilayer electronic component 100. The thickness To of the multilayer electronic component 100 in the first direction can be, for example, 150 μm or less, the length Lo of the multilayer electronic component 100 in the second direction can be, for example, 250 μm or less, and the width Wo of the multilayer electronic component 100 in the third direction can be, for example, 150 μm or less. The lower limit of the thickness To of the multilayer electronic component 100 in the first direction is not particularly limited, but can be, for example, 50 μm or more. The lower limit of the length Lo of the multilayer electronic component 100 in the second direction is not particularly limited, but can be, for example, 100 μm or more. The width Wo of the multilayer electronic component 100 in the third direction is not particularly limited, but can be, for example, 50 μm or more.

[0016] The multilayer electronic component 100 can include a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122, and external electrodes 131 and 132.

[0017] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 and the polishing of the edge portions during the firing process, the main body 110 is not in a hexahedron shape with perfect straight lines, but can have a substantially hexahedron shape.

[0018] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction and connected to the first surface 1 and the second surface 2, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction and connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4. The surface roughness of at least one of the first surface 1, the second surface 2, the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 of the main body 110 can be such that the arithmetic mean roughness (Ra) of the surface is 0.2 μm to 1 μm.

[0019] The main body 110 can include a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to the extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0020] The dielectric layer 111 can include, for example, a perovskite-type compound represented by ABO3 as a main component. The perovskite-type compound represented by ABO3 is, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti1-y Zr y )O3 (0 < y < 1), CaZrO3 or (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5) can be used.

[0021] The thickness of the dielectric layer 111 is not particularly limited. For example, the average thickness of the dielectric layer 111 measured at the central portion of the main body 110 in the second direction can be 0.1 μm to 0.6 μm, 0.1 μm to 0.5 μm, or 0.1 μm to 0.4 μm.

[0022] Here, the average thickness of the dielectric layer 111 means the average thickness of the dielectric layer 111 in the first direction. The average thickness of the dielectric layer 111 measured at the central portion of the main body 110 in the second direction can be measured by scanning the central portion in the second direction of the cross-section of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, after measuring the thickness of the dielectric layer 111 at 10 equally spaced points in the second direction from the central portion of the main body 110 in the second direction, the average thickness of the dielectric layer 111 can be measured by taking the average value. On the other hand, after performing such average value measurement for each of the 10 dielectric layers 111, the average thickness of the dielectric layer 111 can be further generalized by measuring the average value.

[0023] The internal electrodes 121 and 122 can include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities, can be arranged to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0024] The internal electrodes 121 and 122 are exposed on one of the exposed surfaces of the third surface and the fourth surface 3 and 4, and can be separated from the fifth surface and the sixth surface 5 and 6. That is, the first internal electrode 121 is exposed on the third surface and can be separated from the fifth surface and the sixth surface 5 and 6, and the second internal electrode 122 is exposed on the fourth surface and can be separated from the fifth surface and the sixth surface 5 and 6. Hereinafter, the third surface 3 where the end of the first internal electrode 121 is exposed can be defined as the first exposed surface, and the fourth surface 4 where the end of the second internal electrode 122 is exposed can be defined as the second exposed surface.

[0025] The metal contained in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably can contain Ni, but the present invention is not limited thereto.

[0026] The main body 110 includes a capacitance forming portion that is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are alternately arranged with each other with a dielectric layer 111 interposed therebetween, and a capacitance is formed, and a first cover portion 112 and a second cover portion 113 that are disposed on one side and the other side in the first direction of the capacitance forming portion, respectively. The cover portions 112 and 113 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress. The cover portions 112 and 113 can have a configuration similar to that of the dielectric layer 111 except that they do not include internal electrodes.

[0027] The external electrodes 131 and 132 are disposed on the exposed surfaces and can be connected to the internal electrodes 121 and 122. For example, the external electrode 131 includes a first external electrode 131 that is disposed on the third surface 3 and extends on a part of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6, and a second external electrode 132 that is disposed on the fourth surface 4 and extends on a part of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The first external electrode 131 can be connected to the first internal electrode 121 on the third surface 3, and the second external electrode 132 can be connected to the second internal electrode 122 on the fourth surface 4.

[0028] The types and forms of the external electrodes 131 and 132 are not particularly limited and can have a multilayer structure. For example, the external electrodes 131 and 132 can include a base electrode layer 131a, 132a in contact with the internal electrodes 121, 122 and a plating layer 131b, 132b disposed on the base electrode layer 131a, 132a.

[0029] The base electrode layers 131a and 132a can be sintered electrode layers containing metal and glass. The metals contained in the base electrode layers 131a and 132a can include, but are not limited to, Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or alloys containing these. The glass contained in the base electrode layers 131a and 132a can include one or more oxides of Ba, Ca, Zn, Al, B, and Si, but the present invention is not limited thereto.

[0030] On the other hand, the base electrode layers 131a and 132a can be composed only of sintered electrode layers containing metal and glass, but the present invention is not limited thereto, and the base electrode layers 131a and 132a can have a multilayer structure. For example, the base electrode layers 131a and 132a can include a base plating layer in contact with the internal electrodes 121 and 122 and a sintered electrode layer disposed on the base plating layer.

[0031] The base plating layer can be disposed only on a part of the exposed surface, and the sintered electrode layer can extend on a part of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, 6 of the exposed surface. The base plating layer can play a role in improving the contact between the internal electrodes 121, 122 and the external electrodes 131, 132. The base plating layer can be disposed at the ends of the internal electrodes 121, 122 and can be discontinuously disposed on the exposed surface. The base plating layer can contain one or more of Ni, Cu, and Pd.

[0032] The plating layers 131b and 132b can improve the mounting characteristics. The plating layers 131b and 132b can include, for example, Ni, Sn, Pd, and / or an alloy containing these, and can also be formed from a plurality of layers. The plating layers 131b and 132b can be, for example, a Ni plating layer or a Sn plating layer, or can be in a form where a Ni plating layer and a Sn plating layer are sequentially formed. Also, the plating layers 131b and 132b can include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0033] In the drawings, a structure in which the stacked electronic component 100 has two external electrodes 131 and 132 is described, but it is not limited thereto, and the number, shape, etc. of the external electrodes 131 and 132 can vary according to the form of the internal electrodes 121 and 122 and other purposes.

[0034] Referring to FIGS. 3 and 4, when the thickness and width in the third direction of the central portions of the internal electrodes 121 and 122 measured on the above-described exposed surface are T1 and W1, respectively, and the thickness and width in the third direction of the central portions of the internal electrodes 121 and 122 measured at the central portion in the second direction of the main body 110 are T2 and W2, respectively, T1>T2 and W1>W2 can be satisfied.

[0035] For example, the thickness of the central portion in the third direction of the first internal electrode 121 measured on the first exposed surface is thicker than the thickness of the central portion in the third direction of the first internal electrode 121 measured at the central portion in the second direction of the main body 110, and the width in the third direction of the first internal electrode 121 measured on the first exposed surface can be wider than the width in the third direction of the first internal electrode 121 measured at the central portion in the second direction of the main body 110.

[0036] For example, the thickness of the central portion in the third direction of the second internal electrode 122 measured on the second exposed surface is thicker than the thickness of the central portion in the third direction of the second internal electrode 122 measured at the central portion in the second direction of the main body 110, and the width in the third direction of the second internal electrode 122 measured on the second exposed surface can be wider than the width in the third direction of the second internal electrode 122 measured at the central portion in the second direction of the main body 110.

[0037] Since the internal electrodes 121 and 122 are thicker in the first direction and wider in the third direction on the exposed surface than the central portion of the main body 110 in the second direction, the contact area between the internal electrodes 121 and 122 and the external electrodes 131 and 132 can be increased. As a result, the electrical characteristics of the multilayer electronic component 100, such as suppressing the capacitance dispersion of the multilayer electronic component 100, can be improved.

[0038] On the other hand, in order to increase the contact area between the internal electrodes 121 and 122 and the external electrodes 131 and 132, if the thickness of the internal electrodes 121 and 122 in the first direction is increased as a whole, the capacitance of the ultra-small multilayer electronic component 100 may be excessively reduced. If the width of the internal electrodes 121 and 122 in the third direction is increased as a whole, cracks may occur in the main body 110, or the moisture resistance reliability of the multilayer electronic component 100 may be reduced. Therefore, it can be preferably satisfied that T1 > T2 and W1 > W2.

[0039] According to an embodiment of the present invention, 0.6 ≦ W2 / W1 ≦ 0.9 can be satisfied. When W2 / W1 satisfies the above conditions, the reliability of the multilayer electronic component 100 can be ensured while improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132.

[0040] If W1 is too large and W2 / W1 is less than 0.6, the moisture resistance reliability of the multilayer electronic component 100 may be reduced, or cracks may occur in the main body 110. If W2 is too small and W2 / W1 is less than 0.6, the capacitance of the multilayer electronic component 100 may be reduced. If W1 is too small and W2 / W1 exceeds 0.9, the effect of improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132 of the present invention is slight. If W2 is too large and W2 / W1 exceeds 0.9, the moisture resistance reliability of the multilayer electronic component 100 may be reduced, or cracks may occur in the main body 110.

[0041] On the one hand, W1 is not particularly limited. However, when the width of the main body 110 in the third direction is Wb, the ratio of W1 to Wb (W1 / Wb) can be 0.2 or more and 0.8 or less. When the above W1 / Wb is less than 0.2, the effect of improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132 of the present invention is slight. When the above W1 / Wb exceeds 0.8, the moisture resistance reliability of the multilayer electronic component 100 may decrease, or cracks may occur in the main body 110.

[0042] According to an embodiment of the present invention, 0.5 ≦ T2 / T1 < 1 can be satisfied. When T2 / T1 satisfies the above conditions, the reliability of the multilayer electronic component 100 can be ensured while improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132.

[0043] When T1 is too large and T2 / T1 is less than 0.5, delamination of the internal electrodes 121 and 122 may occur, or cracks may occur in the main body 110, resulting in a possible decrease in the moisture resistance reliability of the multilayer electronic component 100. When T2 is too small and T2 / T1 is less than 0.5, the characteristics of the breakdown voltage may decrease. On the other hand, the upper limit of T2 / T1 is not particularly limited, and T2 / T1 can be less than 1.

[0044] On the one hand, the above T1 is not particularly limited, but for example, it can be 0.2 μm or more and 2.0 μm or less.

[0045] The above T1 and W1 can be measured by an image obtained by observing the exposed surface with a scanning electron microscope (SEM) after polishing the laminated electronic component 100 in the second direction up to the exposed surface to expose the exposed surface (for example, the cross section shown in FIG. 3). However, in this specification, measuring the above T1 and W1 on the exposed surface means that those having ordinary knowledge can measure the above T1 and W1 in the vicinity of the exposed surface to such an extent that it can be understood that the measurement is made on the exposed surface. Therefore, considering the error of the polishing process for measurement, the above T1 and W1 can not only be accurately measured on the exposed surface, but also be measured on the cross sections in the first direction and the third direction of the main body 110 where the distance in the second direction from the exposed surface is within 5 μm. On the other hand, the above T1 can be measured at the center CP3 in the third direction of the main body 110.

[0046] The above T2 and W2 can be measured by an image obtained by observing the exposed cross section with a scanning electron microscope (SEM) after polishing the laminated electronic component 100 in the second direction up to the central portion in the second direction of the main body 110 to expose the central portion in the second direction of the main body 110 (for example, the cross section shown in FIG. 4). On the other hand, the above T2 and W2 can not only be measured at the center CP2 in the second direction of the main body 110, but also be measured on the cross sections in the first direction and the third direction where the distance in the second direction from the center CP2 in the second direction of the main body 110 is within 5 μm in consideration of the error of the polishing process for measurement. On the other hand, the above T2 can be measured at the center CP3 in the third direction of the main body 110.

[0047] When the thickness of the side ends of the internal electrodes 121 and 122 in the third direction measured on the exposed surface is T1', T1 > T1' can be satisfied. In one embodiment, the thicknesses of the internal electrodes 121 and 122 measured on the exposed surface can have a form that decreases from the central portion of the internal electrodes 121 and 122 in the third direction toward the side ends of the internal electrodes 121 and 122 in the third direction. That is, the thickness of the first internal electrode 121 measured on the first exposed surface has a form that decreases from the central portion of the first internal electrode 121 in the third direction toward the side end of the first internal electrode 121 in the third direction, and the thickness of the second internal electrode 122 measured on the second exposed surface has a form that decreases from the central portion of the second internal electrode 122 in the third direction toward the side end of the second internal electrode 122 in the third direction.

[0048] Here, the fact that the thicknesses of the internal electrodes 121 and 122 have a form that decreases from the central portion of the internal electrodes 121 and 122 in the third direction toward the side ends of the internal electrodes 121 and 122 in the third direction means that the thicknesses of the internal electrodes 121 and 122 in some sections are constant, or even if the thicknesses of the internal electrodes 121 and 122 increase from the central portion of the internal electrodes 121 and 122 in the third direction toward the side ends of the internal electrodes 121 and 122 in the third direction in some sections, it can be meant that the thicknesses of the internal electrodes 121 and 122 have a tendency to decrease overall from the central portion of the internal electrodes 121 and 122 in the third direction toward the side ends of the internal electrodes 121 and 122 in the third direction.

[0049] Also, referring to FIG. 2, the internal electrodes 121 and 122 can have a form that the thickness decreases from the exposed surface toward the inside of the main body 110. That is, the first internal electrode 121 can have a form that the thickness decreases from the first exposed surface toward the inside of the main body 110, and the second internal electrode 122 can have a form that the thickness decreases from the second exposed surface toward the inside of the main body 110.

[0050] Here, the fact that the thicknesses of the internal electrodes 121 and 122 have a form in which they decrease as they go from the exposed surface into the interior of the main body 110 means that even if the thicknesses of the internal electrodes 121 and 122 are constant in some sections, or the thicknesses of the internal electrodes 121 and 122 increase as they go from the exposed surface into the interior of the main body 110 in some sections, the thicknesses of the internal electrodes 121 and 122 as a whole tend to decrease as they go from the exposed surface into the interior of the main body 110.

[0051] Referring to FIGS. 5 to 7, the internal electrodes 121 and 122 can include main portions 121a and 122a disposed at the central portion of the main body 110 in the second direction, and lead portions 121b and 122b extending from the main portions 121a and 122a to the exposed surface.

[0052] The first internal electrode 121 can include a first main portion 121a disposed at the central portion of the main body 110 in the second direction, and a first lead portion 121b extending from the first main portion 121a to the first exposed surface.

[0053] The second internal electrode 122 can include a second main portion 122a disposed at the central portion of the main body 110 in the second direction, and a second lead portion 122b extending from the second main portion 122a to the second exposed surface. A part of the first main portion 121a can overlap with the second lead portion 122b in the first direction, and a part of the second main portion 122a can overlap with the first lead portion 121b in the first direction, but the present invention is not limited thereto.

[0054] The lead portions 121b and 122b can be wider in the third direction than the main portions 121a and 122a, and the width in the third direction can gradually increase as they go from the main portions 121a and 122a to the exposed surface. A part of the first main portion 121a can overlap with the second lead portion 122b in the first direction, and a part of the second main portion 122a can overlap with the first lead portion 121b in the first direction, but the present invention is not limited thereto.

[0055] In the cross-sections of the main body 110 in the second and third directions, the side ends SE1 and SE2 of the lead portion in the third direction can have a curvature. In one embodiment, in the cross-sections of the main body 110 in the second and third directions, the radius of curvature of the side ends SE1 and SE2 of the lead portion in the third direction can be 50 μm to 90 μm. On the other hand, in the cross-sections of the main body 110 in the second and third directions, the side ends of the main portions 121a and 122a in the third direction can be substantially straight, but the present invention is not limited thereto. The boundary between the main portions 121a and 122a and the lead portions 121b and 122b can be defined as the point where the inclination of the side ends of the internal electrodes 121 and 122 in the third direction changes discontinuously.

[0056] In the cross-sections of the main body 110 in the second and third directions, the edges EG1 and EG2 where the second-direction ends of the internal electrodes 121 and 122 separated from the exposed surface and the side ends of the internal electrodes 121 and 122 in the third direction are in contact can have a curvature. Thereby, the withstand voltage characteristics of the multilayer electronic component 100 can be improved. The radius of curvature of the edges EG1 and EG2 can be smaller than the radius of curvature of the side ends SE1 and SE2 of the lead portion in the third direction.

[0057] In one embodiment, in the cross-sections of the main body 110 in the second and third directions, the radius of curvature of the edges EG1 and EG2 can be 10 μm to 20 μm. If the radius of curvature of the edges EG1 and EG2 is less than 10 μm, current may concentrate on the edges EG1 and EG2 and the withstand voltage characteristics of the multilayer electronic component 100 may deteriorate. If the radius of curvature of the edges EG1 and EG2 exceeds 20 μm, the capacitance of the multilayer electronic component 100 may decrease.

[0058] Referring to FIGS. 5 to 7, the internal electrodes 121 and 122 can have a form in which the width in the third direction decreases as it goes from the exposed surface toward the inside of the main body 110. Here, the fact that the widths of the internal electrodes 121 and 122 in the third direction have a form that decreases as it goes from the exposed surface toward the inside of the main body 110 means that, in some sections, the widths of the internal electrodes 121 and 122 in the third direction are constant, or in some sections, even if the widths of the internal electrodes 121 and 122 in the third direction increase as it goes from the exposed surface toward the inside of the main body 110, the widths of the internal electrodes 121 and 122 in the third direction generally tend to decrease as it goes from the exposed surface toward the inside of the main body 110.

[0059] Referring to FIG. 9, in one embodiment, the internal electrode can protrude from the exposed surface. For example, the first internal electrode 121 can protrude from the first exposed surface. Although not shown, the second internal electrode 122 can protrude from the second exposed surface. When the internal electrodes 121 and 122 protrude from the exposed surface, the contact property between the internal electrodes 121 and 122 and the external electrodes 131 and 132 can be improved. The length Lp by which the first internal electrode 121 protrudes from the first exposed surface is not particularly limited, but can be, for example, 0.1 μm to 1.0 μm. If the length Lp by which the first internal electrode 121 protrudes from the first exposed surface is less than 0.1 μm, the effect of improving the contact property between the internal electrodes 121 and 122 and the external electrodes 131 and 132 may be slight, and if it exceeds 1.0 μm, the protruding length of the internal electrodes 121 and 122 is excessive and there is a risk of cracks occurring in the main body 110.

[0060] Hereinafter, with reference to FIG. 10, an example of a method for forming the laminated electronic component 100 according to an embodiment of the present invention will be described.

[0061] First, ceramic powder for forming the ceramic green sheets 211a and 211b is prepared. The ceramic powder is, for example, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-yCa y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), CaZrO3, or (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x ≤ 0.5, 0 < y ≤ 0.5). Next, after drying and pulverizing the prepared ceramic powder, an organic solvent such as ethanol and a binder such as polyvinyl butyral are mixed to produce a ceramic slurry. Then, the ceramic slurry is applied and dried on a carrier film to provide ceramic green sheets 211a and 211b.

[0062] Next, a conductive paste for an internal electrode containing a metal powder, a binder, an organic solvent, etc. is printed on the ceramic green sheets 211a and 211b at a predetermined thickness using a screen printing method or a gravure printing method or the like to form internal electrode patterns 221 and 222. More specifically, a plurality of first internal electrode patterns 221 are formed on the first ceramic green sheet 211a, and a plurality of second internal electrode patterns 222 are formed on the second ceramic green sheet 211b.

[0063] On one hand, the first internal electrode pattern 221 can include a first convex portion 221a, and a first extension portion 221b and a second extension portion 221c extending from the first convex portion 221a. The first convex portion 221a can be thicker than the first extension portion 221b and the second extension portion 221c and can have a wider width in the third direction. Also, the second internal electrode pattern 222 can include a second convex portion 222a, and a third extension portion 222b and a fourth extension portion 222c extending from the second convex portion 222a. The second convex portion 222a can be thicker than the third extension portion 222b and the fourth extension portion 222c and can have a wider width in the third direction. The convex portions 221a, 222a can form the lead portions 121b, 122b of the internal electrodes 121, 122 by firing, and the extension portions 221b, 221c, 222b, 222c can form the main portions 121a, 122a of the internal electrodes 121, 122 by firing.

[0064] The method of forming the convex portions 221a, 222a is not particularly limited. For example, when the internal electrode patterns 221, 222 are formed by the gravure printing method, the convex portions 221a, 222a can be formed by adjusting the pattern cells of the gravure roller or the size of the fine cells included in the pattern cells. For example, when the size of the fine cells corresponding to the convex portions 221a, 222a is reduced, the thickness of the convex portions 221a, 222a can be increased.

[0065] Thereafter, the ceramic green sheets 211a, 211b on which the internal electrode patterns 221, 222 are printed are peeled off from the carrier film. Next, the first ceramic green sheet 211a on which the first internal electrode pattern 221 is formed and the second ceramic green sheet 211b on which the second internal electrode pattern is formed are alternately laminated by a predetermined number of layers and then pressure-bonded to form a ceramic laminate. On the upper and lower portions of the ceramic laminate, ceramic green sheets on which no internal electrode pattern is formed can be laminated by a predetermined number of layers in order to form the cover portions 112, 113 after firing.

[0066] Thereafter, the ceramic laminate is cut along a plurality of first cutting lines C1 and a plurality of second cutting lines C2 so as to have a predetermined chip size. The convex portions 221a and 222a can be located on the first cutting line C1. Thereafter, the cut chips can be fired at a temperature of, for example, 1000 °C or higher and 1400 °C or lower to form the main body 110.

[0067] Thereafter, after dipping the main body 110 into a conductive paste containing metal powder, glass frit, binder, organic solvent, etc., the conductive paste is fired at a temperature of, for example, 500 °C to 900 °C to form the base electrode layers 131a and 132a.

[0068] When the base electrode layers 131a and 132a include an electroless plating layer and a sintered electrode layer disposed on the electroless plating layer, after forming the electroless plating layer on the main body 110 through an electroless plating method and / or an electroless plating method, the main body 110 on which the electroless plating layer is formed is dipped into the conductive paste and then fired to form the base electrode layers 131a and 132a.

[0069] Next, the laminated electronic component 100 can be manufactured by forming plating layers 131b and 132b using an electroless plating method and / or an electroless plating method. However, the manufacturing method described above is an example, and the manufacturing method of the laminated electronic component 100 is not limited to the manufacturing method described above.

[0070] (Experimental Example) Using the above method, a sample chip with a size of 0201 (Lo: approximately 2.0 mm, Wo: approximately 1.0 mm, To: approximately 1.0 mm) was fabricated. After that, the sample chip was polished so that the exposed surface was exposed to the outside, and the exposed surface (cross-sections in the first and third directions) was observed with a scanning electron microscope (SEM) to measure the above T1 and W1. The above T1 was measured in the middle of the sample chip body in the third direction. Next, after polishing the sample chip to the central part in the second direction of the body, the exposed cross-sections (cross-sections in the first and third directions) were observed with a scanning electron microscope (SEM) to measure the above T2 and W2. The above T2 was measured in the middle of the sample chip body in the third direction. On the other hand, in Table 1 below, W2 of each sample number was fixed at 50 μm and T2 at 1.0 μm, and only T1 and W1 were adjusted for each sample number, but T1 was adjusted to be larger than T2.

[0071] After that, evaluations of contact properties and the presence or absence of crack defects were carried out based on W2 / W1 and T2 / T1. Specifically, the contact properties were evaluated with a capacitance meter. Based on the target capacitance of 100 pF, when the capacitance was 90 pF or more, the contact properties were judged to be good (○), when the capacitance was 80 pF or more, the contact properties were judged to be normal (△), and when the capacitance was less than 80 pF, the contact properties were judged to be poor (×), and these were recorded in Table 1 below. Also, for the crack defect evaluation, for each sample number, among 100 sample chips, if even one sample chip with a crack occurred, it was judged to be defective (NG), and if none occurred, it was judged to be good (OK), and these were recorded in Table 1 below.

[0072]

Table 1

[0073] Referring to Table 1 above, for the remaining sample numbers except for sample numbers 1-1, 2-1, 3-1, and 4-1, the contact properties were good or normal. This is considered to be because for sample numbers 1-1, 2-1, 3-1, and 4-1, W2 / W1 was 0.95 and W1 was not sufficiently large compared to W2, so the improvement in contact properties between the internal electrode and the external electrode was not sufficient.

[0074] In the cases of Sample Nos. 1-6, 2-6, 3-6, and 4-6, the contact property was good or normal, but it was confirmed that crack defects occurred. This is considered to be because for Sample Nos. 1-6, 2-6, 3-6, and 4-6, W2 / W1 is 0.5, and W1 is too large relative to W2, resulting in crack defects.

[0075] In the cases of Sample Nos. 4-1 to 4-6, except for Sample No. 4-1, the contact property was good, but crack defects occurred in all of them. This is considered to be because for Sample Nos. 4-1 to 4-6, T2 / T1 is 0.4, and T1 is too large relative to T2, resulting in crack defects due to delamination of the internal electrode.

[0076] On the other hand, for Sample Nos. 1-2 to 1-5, 2-2 to 2-5, and 3-2 to 3-5, by satisfying 0.6 ≦ W2 / W1 ≦ 0.9 and 0.5 ≦ T2 / T1 < 1, it can be confirmed that the contact property is good and no crack defects occur.

[0077] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and this can also be said to belong to the scope of the present invention.

[0078] Also, the expression "one embodiment" does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, it does not exclude that the above-described one embodiment can be implemented in combination with the features of another one embodiment. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to another one embodiment as long as there is no explanation contrary to or conflicting with that matter in another one embodiment.

[0079] In the present disclosure, the meaning of being connected includes not only the case of direct connection but also the case of indirect connection via an adhesive layer or the like. Further, the meaning of being electrically connected includes both the case of physical connection and the case of non-connection. Furthermore, expressions such as first and second are used to distinguish one component from another component, and do not limit the order and / or importance of the corresponding components. In some cases, without departing from the scope of the claims, the first component can be named the second component, and similarly, the second component can be named the first component.

Explanation of Signs

[0080] 100 Multilayer electronic component 110 Body 111 Dielectric layer 112, 113 Cover part 121, 122 Internal electrodes 121a, 122a Main part 121b, 122b Lead part 131, 132 External electrodes 131a, 132a Underlying electrode layer 131b, 132b Plating layer 211a, 211b Ceramic green sheet 221, 222 Internal electrode patterns 221a, 222a Convex part 221b, 221c, 222b, 222c Extension part

Claims

1. A first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and facing each other in a third direction, a dielectric layer and the dielectric layer are alternately arranged in the first direction, and an internal electrode that is exposed on an exposed surface of either the third surface or the fourth surface and is spaced apart from the fifth surface and the sixth surface; an external electrode disposed on the exposed surface and connected to the internal electrode, wherein when the thickness and the width in the third direction of the central portion of the internal electrode measured on the exposed surface are T1 and W1, respectively, and the thickness and the width in the third direction of the central portion of the internal electrode measured at the central portion in the second direction of the main body are T2 and W2, respectively, a multilayer electronic component satisfying T1 > T2 and 0.6 ≦ W2 / W1 ≦ 0.

9.

2. The multilayer electronic component according to claim 1, wherein T1 and T2 satisfy 0.5 ≦ T2 / T1 < 1.

3. The internal electrode includes a main portion disposed at the central portion in the second direction of the main body and a lead portion extending from the main portion to the exposed surface, wherein the lead portion is wider in width in the third direction than the main portion, and the width in the third direction gradually increases from the main portion toward the exposed surface. The multilayer electronic component according to claim 1.

4. The multilayer electronic component according to claim 3, wherein in a cross section of the main body in the second direction and the third direction, a side end of the lead portion in the third direction has a curvature.

5. The multilayer electronic component according to claim 4, wherein in a cross section of the main body in the second direction and the third direction, a radius of curvature of a side end of the lead portion in the third direction is 50 μm to 90 μm.

6. The multilayer electronic component according to claim 1, wherein in a cross section of the main body in the second direction and the third direction, an edge where an end of the internal electrode in the second direction spaced apart from the exposed surface contacts a side end of the internal electrode in the third direction has a curvature.

7. The multilayer electronic component according to claim 6, wherein in a cross section of the main body in the second direction and the third direction, a radius of curvature of the edge is 10 μm to 20 μm.

8. The multilayer electronic component according to claim 1, wherein when the thickness of a side end of the internal electrode in the third direction measured on the exposed surface is T1', T1 > T1' is satisfied.

9. The multilayer electronic component according to claim 1, wherein the internal electrode has a form in which the thickness measured at the exposed surface decreases from the central portion of the internal electrode in the third direction toward the side end of the internal electrode in the third direction.

10. The multilayer electronic component according to claim 1, wherein the internal electrode has a form in which the width in the third direction decreases from the exposed surface toward the inside of the main body.

11. The multilayer electronic component according to claim 1, wherein the internal electrode has a form in which the thickness decreases from the exposed surface toward the inside of the main body.

12. The multilayer electronic component according to claim 1, wherein the internal electrode protrudes from the exposed surface.

13. The thickness of the multilayer electronic component in the first direction is 150 μm or less, the length of the multilayer electronic component in the second direction is 250 μm or less, and the width of the multilayer electronic component in the third direction is 150 μm or less. The multilayer electronic component according to any one of claims 1 to 12.

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