Laminated type electronic component

Abstract

To prevent cracking or peeling inside a laminated type electronic component, and improve reliability.SOLUTION: A laminated type electronic component includes a body including a dielectric layer, and an internal electrode, and an external electrode arranged on the body, wherein the internal electrode includes oxidation parts which are arranged on both ends in a width direction and are oxidized, and a non-oxidation part which is arranged in the central part in the width direction of the internal electrode and is not oxidized, and when the average thickness of the non-oxidation part is represented by t1, and the average thickness of the oxidation part is represented by t2, t2<t1 can be satisfied.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount. As various electronic devices such as computers and mobile devices are miniaturized and have increased output, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] On the other hand, when increasing the number of layers for miniaturization and high capacitance of a multilayer ceramic capacitor, the step difference due to the difference in thickness between the internal electrode and the dielectric layer increases. Such a step difference may cause a sudden dimensional change between the region where the internal electrode is arranged and the region where it is not arranged, and thermal stress may be applied due to the difference in thermal expansion coefficient between the region of the internal electrode and the dielectric layer during the cooling process after firing. As a result, generation or delamination of cracks may occur at the end portions in the width direction of the internal electrode, which is considered one of the factors reducing the reliability of the multilayer ceramic capacitor.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] One of the various problems to be solved by the present invention is to prevent cracks or delamination inside a multilayer electronic component.

[0007] One of the various problems to be solved by the present invention is to improve the reliability of a multilayer electronic component.

[0008] However, the various problems to be solved by the present invention are not limited to the above-described content, and can be more easily understood in the process of describing specific embodiments of the present invention.

Means for Solving the Problems

[0009] A multilayer electronic component according to an embodiment of the present invention includes a main body including a dielectric layer and internal electrodes, and external electrodes disposed on the main body. The internal electrodes are disposed at both ends in the width direction, and include an oxidized portion that is an oxidized region, and a non-oxidized portion that is disposed at the center in the width direction of the internal electrode and is a non-oxidized region. When the average thickness of the non-oxidized portion is t1 and the average thickness of the oxidized portion is t2, t2 < t1 can be satisfied.

Advantages of the Invention

[0010] One of the various problems to be solved by the present invention is to prevent cracks or delamination inside a multilayer electronic component.

[0011] One of the various problems to be solved by the present invention is to improve the reliability of a multilayer electronic component.

[0012] However, the various and significant advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Modes for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of the elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0015] In the drawings, parts not relevant to the description are omitted in order to clearly describe the present invention. The sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited by the drawings. Also, components having the same functions within the scope of the same concept are described using the same reference numerals. Further, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0016] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0017] Multilayer electronic component FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention, FIG. 2 schematically shows an exploded perspective view showing the stacked structure of internal electrodes, FIG. 3 schematically shows a cross-sectional view taken along line I-I' of FIG. 1, FIG. 4 schematically shows a cross-sectional view taken along line II-II' of FIG. 1, and FIG. 5 schematically shows an enlarged view of the P region of FIG. 4.

[0018] Hereinafter, with reference to FIGS. 1 to 5, a stacked electronic component according to an embodiment of the present invention will be described in detail. However, as an example of the stacked electronic component, a multilayer ceramic capacitor will be described, but the present invention can also be applied to various electronic products using a dielectric composition, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0019] The multilayer electronic component 100 according to an embodiment of the present invention includes a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122, and external electrodes 131 and 132 disposed on the main body 110. The internal electrodes 121 and 122 include oxidized portions 121b and 122b that are disposed at both ends in the width direction and are oxidized regions, and non-oxidized portions 121a and 122a that are disposed at the central portion in the width direction of the internal electrodes and are non-oxidized regions. When the average thickness of the non-oxidized portions 121a and 122a is t1 and the average thickness of the oxidized portions 121b and 122b is t2, t2 < t1 can be satisfied.

[0020] The main body 110 can have the dielectric layer 111 and the internal electrodes 121 and 122 alternately laminated.

[0021] More specifically, the main body 110 can include a capacitance forming portion Ac that is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are alternately disposed so as to face each other with the dielectric layer 111 interposed therebetween to form a capacitance. Here, the first and second internal electrodes 121 and 122 of the capacitance forming portion Ac that forms the capacitance can mean the non-oxidized portions 121a and 122a described later, and the oxidized portions 121b and 122b can make no contribution to forming the capacitance.

[0022] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can have a hexahedral shape or a shape similar thereto. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron with straight lines, but can have a substantially hexahedral shape.

[0023] The main body 110 can have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first to fourth surfaces 1, 2, 3, and 4 and face each other in a third direction.

[0024] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a Scanning Electron Microscope (SEM).

[0025] The raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3) - based materials can be used. For example, barium titanate - based materials, lead - composite perovskite - based materials, or strontium titanate - based materials can be used. The barium titanate - based materials can contain BaTiO3 - based ceramic particles. As examples of the ceramic particles, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0026] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to particles such as barium titanate (BaTiO3) according to the purpose of the present invention as the raw material for forming the dielectric layer 111.

[0027] The thickness td of the dielectric layer 111 does not need to be particularly limited.

[0028] However, in order to more easily achieve miniaturization and high - capacity of the multilayer electronic component, the thickness of the dielectric layer 111 can be 3.0 μm or less, preferably 2.0 μm or less, 1.0 μm or less, or 0.6 μm or less, and more preferably 0.4 μm or less.

[0029] Here, the thickness td of the dielectric layer 111 can mean the thickness td of the dielectric layer 111 disposed between the first and second internal electrodes 121 and 122. More specifically, it can mean the thickness td of the dielectric layer 111 disposed between the non-oxidized portions 121a and 122a of the first and second internal electrodes.

[0030] On the other hand, the thickness td of the dielectric layer 111 can mean the size of the dielectric layer 111 in the first direction. Also, the thickness td of the dielectric layer 111 can mean the average thickness td of the dielectric layer 111, and can mean the average size of the dielectric layer 111 in the first direction.

[0031] The average size of the dielectric layer 111 in the first direction can be measured by scanning an image of the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of the dielectric layer 111 in the first direction can mean the average value calculated by measuring the size in the first direction at 10 equally spaced points in the second direction for one dielectric layer 111 in the scanned image. The 10 equally spaced points can be specified by the capacitance forming portion Ac. Also, when such average value measurement is extended to 10 dielectric layers 111 and the average value is measured, the average size of the dielectric layer 111 in the first direction can be further generalized.

[0032] The internal electrodes 121 and 122 can be alternately laminated with the dielectric layer 111.

[0033] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be respectively exposed on the third and fourth surfaces 3 and 4 of the main body 110.

[0034] More specifically, the first internal electrode 121 is spaced apart from the fourth surface 4 and can be exposed through the third surface 3, and the second internal electrode 122 is spaced apart from the third surface 3 and can be exposed through the fourth surface 4. A first external electrode 131 is disposed on the third surface 3 of the main body 110 and connected to the first internal electrode 121, and a second external electrode 132 can be disposed on the fourth surface 4 of the main body 110 and connected to the second internal electrode 122.

[0035] That is, the first internal electrode 121 is not connected to the second external electrode 132 but can be connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but can be connected to the second external electrode 132. At this time, the first and second internal electrodes 121 and 122 can be electrically separated from each other by a dielectric layer 111 disposed in the middle.

[0036] On the other hand, the main body 110 can be formed by alternately laminating a first ceramic green sheet printed with the first internal electrode 121 and a second ceramic green sheet printed with the second internal electrode 122 and then firing them.

[0037] The materials for forming the internal electrodes 121 and 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0038] Also, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As the printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, etc. can be used, but the present invention is not limited thereto.

[0039] On the one hand, according to an embodiment of the present invention, the internal electrodes 121 and 122 are arranged at both ends in the width direction, including oxidized portions 121b and 122b that are oxidized regions, and non-oxidized portions 121a and 122a that are arranged at the central portion in the width direction of the internal electrodes 121 and 122 and are non-oxidized regions. When the average thickness of the non-oxidized portions 121a and 122a is t1 and the average thickness of the oxidized portions 121b and 122b is t2, t2 < t1 can be satisfied.

[0040] Generally, along with the trend of miniaturization of multilayer electronic components, thinning and multilayerization of dielectric layers and internal electrodes have been attempted by various methods. Recently, multilayer electronic components with a thinner dielectric layer thickness and an increased number of layers have been manufactured.

[0041] When the thickness of the dielectric layer becomes thinner while the number of layers increases, the flow rate of the dielectric material in the region where there is no internal electrode in the ceramic body during the crimping process, the longitudinal margin portion that is a capacitance non-forming portion existing in the interlayer, or the lateral margin portion of the capacitance forming portion may decrease, and the density may become low.

[0042] As a result, a large step may occur between the longitudinal or lateral margin portions of the capacitance forming portion, and defects such as vertical cracks may occur at the longitudinal or lateral ends of the internal electrode.

[0043] In addition, peeling or cracking may occur after firing, resulting in a decrease in the reliability of the multilayer electronic component.

[0044] However, according to an embodiment of the present invention, by arranging oxidized portions 121b and 122b, which are oxidized regions, at both ends in the width direction of the internal electrodes 121 and 122, and arranging non-oxidized portions 121a and 122a, which are non-oxidized regions, at the central portion in the width direction of the internal electrodes 121 and 122 that form capacitance, it is possible to prevent defects such as vertical cracks from occurring at the ends in the width direction of the internal electrodes 121 and 122, or to prevent peeling or cracking from occurring after firing, thereby improving the reliability of the multilayer electronic component 100.

[0045] By disposing the oxide portions 121b and 122b in the margin portions in the width direction of the non-oxide portions 121a and 122a that are the capacitance forming portions Ac, a step, that is, a difference in thickness, between the capacitance forming portion Ac and the margin portion in the width direction can be minimized.

[0046] Thereby, the occurrence of vertical cracks and peeling can be reduced, and the reliability of the multilayer electronic component 100 can be further improved.

[0047] Further, by forming both end portions in the width direction of the internal electrodes 121 and 122 with the oxide portions 121b and 122b, due to the high interfacial bonding force between the oxide portions 121b and 122b that are in contact with the dielectric layer 111 which is an oxide after firing, the resistance to cracking defects can be increased, and the hardness of the side margin portions 114 and 115 which are the margins in the width direction of the capacitance forming portion Ac can be improved, thereby improving the mechanical characteristics of the multilayer electronic component 100.

[0048] In the present invention, the method of distinguishing between the non-oxide portions 121a and 122a and the oxide portions 121b and 122b can be, for example, as follows, but is not particularly limited thereto.

[0049] When the metal of the internal electrodes 121 and 122 is nickel (Ni), the oxide portions 121b and 122b can be darker in hue than the non-oxide portions 121a and 122a. More specifically, the non-oxide portions 121a and 122a can be white or off-white, and the oxide portions 121b and 122b can be black or gray.

[0050] Taking, for example, FIG. 6 which is an image obtained by observing internal electrodes in cross-sections of the main body in the first and third directions according to an embodiment of the present invention with a scanning electron microscope (SEM) as an example, the imaging conditions of the scanning electron microscope (SEM) are a magnification of 3.28k, a working distance (WD) of 7.2 mm, a brightness of 47.9%, and a contrast of 56.6%. When observed under the above conditions, the oxidized portions arranged at both ends in the width direction of the internal electrodes are observed in a relatively dark gray (black), and the non-oxidized portions arranged at the center in the width direction of the internal electrodes are observed in a relatively bright off-white (white).

[0051] As yet another method for distinguishing the non-oxidized portions 121a, 122a and the oxidized portions 121b, 122b, in the energy dispersive X-ray spectroscopy (EDS) mode of a scanning electron microscope (SEM), a transmission electron microscope (TEM), or a scanning transmission electron microscope (STEM), the oxygen content can be measured for differentiation.

[0052] More specifically, for example, the average atomic percentage (at%) of oxygen contained in the oxidized portions 121b, 122b can be higher than the average atomic percentage (at%) of oxygen contained in the non-oxidized portions 121a, 122a. Preferably, the O(at%) / Ni(at%) ratio based on the atomic percentage (at%) can be 1.1 or more and 1.5 or less, more preferably 1.17 or more and 1.48 or less, but is not particularly limited thereto.

[0053] In the internal electrodes 121 and 122, the method of forming the non-oxidized portions 121a and 122a and the oxidized portions 121b and 122b can be, for example, as follows, but is not particularly limited thereto. First, after forming a first internal electrode pattern having a width smaller than the width of the ceramic green sheet at the central portion in the width direction of the ceramic green sheet, a second internal electrode pattern having a width smaller than the width of the first internal electrode pattern is formed at the central portion in the width direction of the first internal electrode pattern. After laminating and pressure-bonding the ceramic green sheets on which the second internal electrode pattern is formed, a laminated bar provided with a cut laminated bar having a bar size is provided, and then firing is performed. When firing is performed, by performing firing until before the second internal electrode pattern is oxidized with reference to the width direction, both end portions in the width direction of the first internal electrode pattern disposed outside the width direction of the second internal electrode pattern can be oxidized. Thereby, both end portions in the width direction of the first internal electrode pattern can become the oxidized portions 121b and 122b, and the central portion in the width direction of the first internal electrode pattern and the second internal electrode pattern can become the non-oxidized portions 121a and 122a.

[0054] In other words, the oxidized portions 121b and 122b and the non-oxidized portions 121a and 122a can be arranged so as to be in contact with each other.

[0055] By arranging the oxidized portions 121b and 122b and the non-oxidized portions 121a and 122a so as to be in contact with each other, the bonding force between the capacitance forming portion Ac and the side margin portions 114 and 115 can be excellent, and the interfacial bonding force between the oxidized portions 121b and 122b and the dielectric material of the side margin portions 114 and 115 can be further improved.

[0056] On the other hand, as described above, by forming the first internal electrode pattern and the second internal electrode pattern, the non-oxidized portions 121a and 122a can have a thickness greater than the thickness of the oxidized portions 121b and 122b in the region where the oxidized portions 121b and 122b and the non-oxidized portions 121a and 122a are in contact with each other.

[0057] In the regions where the oxidation portions 121b and 122b and the non-oxidation portions 121a and 122a are in contact with each other, the thicknesses of the non-oxidation portions 121a and 122a are greater than the thicknesses of the oxidation portions 121b and 122b, whereby the bonding strength between the capacitance forming portion Ac and the side margin portions 114 and 115 can be excellent.

[0058] In the regions where the oxidation portions 121b and 122b and the non-oxidation portions 121a and 122a are in contact with each other, when the thicknesses of the non-oxidation portions 121a and 122a are less than or equal to the thicknesses of the oxidation portions 121b and 122b, there is a risk that sufficient oxidation of the oxidation portions 121b and 122b may not proceed.

[0059] As described above, when forming the first internal electrode pattern and the second internal electrode pattern, if the average thickness of the non-oxidation portions 121a and 122a is t1 and the average thickness of the oxidation portions 121b and 122b is t2, t2 < t1 can be satisfied.

[0060] Since the average thickness t1 of the non-oxidation portions 121a and 122a is higher than the average thickness t2 of the oxidation portions 121b and 122b (t2 < t1), the step between the capacitance forming portion Ac and the side margin portions 114 and 115 can be minimized, the bonding strength can be improved, and crack and peeling defects can be prevented.

[0061] On the other hand, when the average thickness t1 of the non-oxidation portions 121a and 122a is less than or equal to the average thickness t2 of the oxidation portions 121b and 122b (t1 ≦ t2), sufficient oxidation of the oxidation portions 121b and 122b may not proceed, and the interfacial bonding strength between the oxidation portions 121b and 122b and the side margin portions 114 and 115 may not be sufficiently strengthened, and there is a risk of cracks and peeling occurring.

[0062] A method for measuring the average thickness t1 of the non-oxidized portions 121a and 122a and the average thickness t2 of the oxidized portions 121b and 122b is, for example, when observing the cross-sections in the first and third directions at the center of the main body 110 in the second direction with a scanning electron microscope (SEM), the average value calculated by measuring the size in the first direction at five equally spaced points in the third direction for one of the non-oxidized portions 121a and 122a can be taken as the average thickness t1 of the non-oxidized portions 121a and 122a, and the average value calculated by measuring the size in the first direction at three equally spaced points in the third direction for one of the oxidized portions 121b and 122b arranged at both ends in the width direction of the non-oxidized portions 121a and 122a can be taken as the average thickness t2 of the oxidized portions 121b and 122b.

[0063] More specifically, the average thickness t1 of the non-oxidized portions 121a and 122a and the average thickness t2 of the oxidized portions 121b and 122b can satisfy 0.05 ≦ t2 / t1 ≦ 0.65, and preferably can satisfy 0.20 ≦ t2 / t1 ≦ 0.62.

[0064] When the average thickness t1 of the non-oxidized portions 121a and 122a and the average thickness t2 of the oxidized portions 121b and 122b satisfy 0.05 ≦ t2 / t1 ≦ 0.65, the step between the capacitance forming portion Ac and the side margin portions 114 and 115 can be minimized, the bonding force can be improved, and crack and peeling defects can be prevented.

[0065] On the other hand, when t2 / t1 is less than 0.05, it becomes difficult to minimize the step between the capacitance forming portion Ac and the side margin portions 114 and 115, the bonding force is not improved, and there is a risk of crack and peeling defects. When t2 / t1 exceeds 0.65, sufficient oxidation of the oxidized portions 121b and 122b may not occur, and the interfacial bonding force between the oxidized portions 121b and 122b and the side margin portions 114 and 115 may not be sufficiently strengthened, and there is a risk of crack and peeling.

[0066] On the other hand, the average thickness t1 of the non-oxidized portions 121a and 122a does not particularly need to be limited.

[0067] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the upper limit value of the average thickness t1 of the non-oxidized portions 121a and 122a can be 2.0 μm or less, preferably 1.0 μm or less, or 0.6 μm or less, more preferably 0.4 μm or less, and the lower limit value can be 0.3 μm or more.

[0068] Note that the average thickness t2 of the non-oxidized portions 121b and 122b does not need to be particularly limited.

[0069] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component and improve the bonding force between the capacitance forming portion Ac and the side margin portions 114 and 115, the upper limit value of the average thickness t2 of the oxidized portions 121b and 122b can be 1.0 μm or less, and the lower limit value can be 0.2 μm or more.

[0070] On the other hand, the main body 110 can include cover portions 112 and 113 disposed on both end surfaces in the first direction of the capacitance forming portion Ac.

[0071] Specifically, it can include a first cover portion 112 disposed on one surface in the first direction of the capacitance forming portion Ac and a second cover portion 113 disposed on the other surface in the first direction of the capacitance forming portion Ac. More specifically, it can include an upper cover portion 112 disposed on the upper part in the first direction of the capacitance forming portion Ac and a lower cover portion 113 disposed on the lower part in the first direction of the capacitance forming portion Ac.

[0072] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer 111 or two or more dielectric layers 111 in the first direction on the upper and lower surfaces of the capacitance forming portion Ac, and can basically play a role in preventing damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0073] The upper cover portion 112 and the lower cover portion 113 do not include the internal electrodes 121 and 122 and can include the same material as the dielectric layer 111. That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0074] On the other hand, the thickness tc of the cover portions 112 and 113 does not need to be particularly limited.

[0075] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness tc of the cover portions 112 and 113 can be 100 μm or less, preferably 30 μm or less, and more preferably 20 μm or less in the case of a super-small product.

[0076] Here, the thickness tc of the cover portions 112 and 113 can mean the size of the cover portions 112 and 113 in the first direction. Also, the thickness tc of the cover portions 112 and 113 can mean the average thickness tc of the cover portions 112 and 113 and can mean the average size of the cover portions 112 and 113 in the first direction.

[0077] The average size of the cover portions 112 and 113 in the first direction can be measured by scanning an image of the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, it can be an average value calculated by measuring the size in the first direction at 10 equally spaced points in the second direction in an image obtained by scanning one cover portion.

[0078] Note that the average size of the cover portion in the first direction measured by the above-described method can have substantially the same size as the average size of the cover portion in the first direction in the cross-sections of the main body 110 in the first and third directions.

[0079] On the other hand, with reference to the third direction, the regions between the non-oxidized portions 121a and 122a and the main body 110 can be the side margin portions 114 and 115.

[0080] More specifically, the side margin portions 114 and 115 can include a first side margin portion 114 which is a region from one end portion of the non-oxidized portions 121a and 122a in the third direction to the surface in the width direction of the main body 110 adjacent thereto, and a second side margin portion 115 which is a region from the other end portion of the non-oxidized portions 121a and 122a in the third direction to the surface in the width direction of the main body 110 adjacent thereto.

[0081] That is, the side margin portions 114 and 115 can include a first side margin portion 114 which is a region from the left end portion of the non-oxidized portions 121a and 122a in the third direction to the fifth surface 5 of the main body 110, and a second side margin portion 115 which is a region from the right end portion of the non-oxidized portions 121a and 122a in the third direction to the sixth surface 6 of the main body 110.

[0082] That is, the side margin portions 114 and 115 can be disposed on both end-surfaces in the third direction of the capacitance forming portion Ac.

[0083] As shown in the figure, the side margin portions 114 and 115 can mean the regions between the boundary surfaces of the main body 110 and both end portions of the non-oxidized portions 121a and 122a in the third direction, based on the cross-sections of the main body 110 in the first and third directions.

[0084] The side margin portions 114 and 115 can basically play a role in preventing damage to the non-oxidized portions 121a and 122a due to physical or chemical stress.

[0085] The side margin portions 114 and 115 can mean the regions where the conductive paste for the internal electrodes is applied on the ceramic green sheet to form the non-oxidized portions 121a and 122a, and where the non-oxidized portions 121a and 122a are not formed.

[0086] On the other hand, in order to suppress the step caused by the internal electrodes 121 and 122, the side margin portions 114 and 115 can include oxidized portions 121b and 122b.

[0087] On the other hand, the width w1 of the first and second side margin portions 114 and 115 does not particularly need to be limited.

[0088] However, in order to more easily achieve miniaturization and high capacity of the stacked electronic component 100, the upper limit value of the width w1 of the first and second side margin portions 114 and 115 can be 150 μm or less, and the lower limit value can be 120 μm or more. In the case of ultra-small products, the upper limit value can be 30 μm or less, more preferably 20 μm or less, and the lower limit value can be 5 μm or more, more preferably 10 μm or more.

[0089] Here, the width w1 of the side margin portions 114 and 115 can mean the size in the third direction of each of the side margin portions 114 and 115. Also, the width w1 of the side margin portions 114 and 115 can mean the average width w1 of the side margin portions 114 and 115, and can mean the average size in the third direction of the side margin portions 114 and 115.

[0090] The average size in the third direction of the side margin portions 114 and 115 can be measured by scanning an image of the cross-section of the main body 110 in the first and third directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, in the image obtained by scanning one side margin portion, it can mean the average value calculated by measuring the size in the third direction at 10 equally spaced points in the first direction.

[0091] This can also be similarly applied to the method of measuring the average width w2 of the non-oxidized portions 121b and 122b described later.

[0092] On the other hand, in one embodiment of the present invention, the average width w1 from one end in the width direction of the non-oxidized portions 121a and 122a to the surface in the width direction of the adjacent main body 110 and the average width w2 of the oxidized portions 121b and 122b arranged at one end in the width direction of the internal electrode can satisfy w2 < w1.

[0093] Here, the average width w1 from one end in the width direction of the non-oxidized portions 121a and 122a to the surface in the width direction of the adjacent main body 110 can mean the average width w1 of one of the side margin portions 114 and 115, and the average width w2 of the oxidized portions 121b and 122b disposed at one end in the width direction of the internal electrodes can mean the average width w2 of one of the oxidized portions 121b and 122b.

[0094] Since the average width w1 of the side margin portions 114 and 115 is wider than the average width w2 of the oxidized portions 121b and 122b (w2 < w1), the oxidized portions 121b and 122b can be arranged spaced apart from the surface in the width direction of the main body 110, and the internal electrodes 121 and 122 cannot protrude outside the main body 110.

[0095] More specifically, the average width w1 from one end in the width direction of the non-oxidized portions 121a and 122a to the surface in the width direction of the adjacent main body 110 and the average width w2 of the oxidized portions 121b and 122b disposed at one end in the width direction of the internal electrodes can satisfy 0.3 ≦ w2 / w1 ≦ 0.6, and more preferably can satisfy 0.37 ≦ w2 / w1 ≦ 0.53.

[0096] When the average width w1 from one end in the width direction of the non-oxidized portions 121a and 122a to the surface in the width direction of the adjacent main body 110 and the average width w2 of the oxidized portions 121b and 122b disposed at one end in the width direction of the internal electrodes satisfy 0.3 ≦ w2 / w1 ≦ 0.6, the interfacial bonding force between the oxidized portions 121b and 122b and the side margin portions 114 and 115 is improved, and cracks and peeling can be prevented from occurring.

[0097] When the average width w1 from one end in the width direction of the non-oxidized portions 121a and 122a to the surface in the width direction of the adjacent main body 110 and the average width w2 of the oxidized portions 121b and 122b arranged at one end in the width direction of the internal electrode satisfy w2 / w1 < 0.3, the interfacial bonding force may not be sufficiently strengthened, and there may be a risk of cracks or peeling. When the average width w1 from one end in the width direction of the non-oxidized portions 121a and 122a to the surface in the width direction of the adjacent main body 110 and the average width w2 of the oxidized portions 121b and 122b arranged at one end in the width direction of the internal electrode satisfy 0.6 < w2 / w1, sufficient oxidation of the oxidized portions 121b and 122b does not proceed, and the interfacial bonding force between the oxidized portions 121b and 122b and the side margin portions 114 and 115 may not be sufficiently strengthened, and there may be a risk of cracks or peeling.

[0098] The average width w2 of the oxidized portions 121b and 122b is not particularly limited.

[0099] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the upper limit value of the average width w2 of the oxidized portions 121b and 122b can be 100 μm or less, preferably 80 μm or less, and the lower limit value can be 30 μm or more, preferably 40 μm or more.

[0100] Also, in one embodiment of the present invention, the oxidized portions 121b and 122b can be substantially non-bent.

[0101] The end portions in the width direction of the internal electrode may be bent due to steps during crimping as the number of layers increases, but the oxidized portions 121b and 122b arranged at the end portions in the width direction of the internal electrode of the present invention can be substantially non-bent.

[0102] Since the oxidized portions 121b and 122b are substantially non-bent, the interfacial bonding force between the internal electrodes 121 and 122 and the side margin portions 114 and 115 can be further improved.

[0103] Here, the meaning that the oxidized portions 121b and 122b are substantially not bent means that when observing the cross-sections in the first and third directions at the center in the second direction of the main body 110, the angle between the first extension line, which is the extension line from the center in the first direction to the third direction of the non-oxidized portions 121a and 122a, and the second extension line, which is the extension line from the center in the first direction to the third direction of the oxidized portions 121b and 122b, can be 10° or less, more preferably 5° or less, but is not particularly limited thereto.

[0104] In one embodiment of the present invention, a structure in which the ceramic electronic component 100 has two external electrodes 131 and 132 is described, but the number, shape, etc. of the external electrodes 131 and 132 can vary according to the form of the internal electrodes 121 and 122 and other purposes.

[0105] The external electrodes 131 and 132 are arranged on the main body 110 and can be connected to the internal electrodes 121 and 122.

[0106] More specifically, the external electrodes 131 and 132 can include first and second external electrodes 131 and 132 respectively arranged on the third and fourth surfaces 3 and 4 of the main body 110 and respectively connected to the first and second internal electrodes 121 and 122. That is, the first external electrode 131 can be arranged on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be arranged on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0107] Furthermore, the external electrodes 131 and 132 can extend and be arranged on a part of the first and second surfaces 1 and 2 of the main body 110, or can extend and be arranged on a part of the fifth and sixth surfaces 5 and 6 of the main body 110. That is, the first external electrode 131 can be arranged on a part of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the main body 110 and on the third surface 3 of the main body 110, and the second external electrode 132 can be arranged on a part of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the main body 110 and on the third surface 3 of the main body 110.

[0108] The external electrodes 131 and 132 can be formed of any material as long as it has electrical conductivity such as metal, and a specific material can be determined in consideration of electrical characteristics, structural stability, etc., and it can further have a multilayer structure.

[0109] For example, the external electrodes 131 and 132 can include electrode layers 131a and 132a disposed on the main body 110 and plating layers 131b and 132b disposed on the electrode layers 131a and 132a.

[0110] More specific examples of the electrode layers 131a and 132a are that the electrode layers 131a and 132a can be fired electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0111] Also, the electrode layers 131a and 132a can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body 110.

[0112] Also, the electrode layers 131a and 132a can be formed by a method of transferring a sheet containing a conductive metal onto the main body 110, or can be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0113] The conductive metal used for the electrode layers 131a and 132a is not particularly limited as long as it can be electrically connected to the internal electrodes 121 and 122 for capacitance formation. For example, it can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The electrode layers 131a and 132a can be formed by applying a conductive paste provided by adding glass frit to the conductive metal particles and then firing.

[0114] The plating layers 131b and 132b can play a role in improving mounting characteristics.

[0115] The type of plating layers 131b, 132b is not particularly limited, and may be a single layer plating layer 131b, 132b containing one or more of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and alloys thereof, or may be formed of multiple layers.

[0116] As a more specific example of the plating layers 131b, 132b, the plating layers 131b, 132b may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layers 131a, 132a, or in a form in which a Sn plating layer, a Ni plating layer and a Sn plating layer are sequentially formed. The plating layers 131b, 132b may also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0117] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0118] However, in order to simultaneously achieve miniaturization and high capacity, the thickness of the dielectric layers and internal electrodes must be reduced and the number of layers must be increased, so the effects of the present invention are more pronounced in multilayer electronic components 100 that are 1005 (length x width: 1.0 mm x 0.5 mm, length and width error range within ±5%) or smaller, or 0603 (length x width: 0.6 mm x 0.3 mm, length and width error range within ±5%) or smaller.

[0119] The present invention will be described in more detail below with reference to examples. However, these examples are intended to aid in the specific understanding of the present invention, and the scope of the present invention is not limited to these examples.

[0120] (Example) The first first internal electrode pattern was printed on the first ceramic green sheet, and the second first internal electrode pattern was printed on the first first internal electrode pattern to form the first internal electrode. The first second internal electrode pattern was printed on the second ceramic green sheet, and the second second internal electrode pattern was printed on the first second internal electrode pattern to form the second internal electrode. After that, the first and second internal electrodes were repeatedly laminated and fired to fabricate a sample.

[0121] At this time, the firing was controlled so that the ends of the internal electrodes were oxidized. The region where both ends in the width direction of the internal electrode were oxidized was defined as the oxidized portion, and the region not oxidized at the central portion in the width direction of the internal electrode was defined as the non-oxidized portion.

[0122] In [Table 1], t1 represents the average thickness of the non-oxidized portion, t2 represents the average thickness of the oxidized portion. The ratio of t2 / t1 was calculated and described. The units of t1 and t2 are μm.

[0123] And in [Table 2], w1 represents the average width of the side margin portion, w2 represents the average width of the oxidized portion. The ratio of w2 / w1 was calculated and described. The units of w1 and w2 are μm.

[0124]

Table 1

[0125] When observing the cross sections in the first and third directions at the center in the second direction of Samples 1 to 12, no samples with cracks or delamination were found.

[0126] From this, it can be seen that when 0.20 ≦ t2 / t1 ≦ 0.62 is satisfied, the bonding force between the capacitance forming portion and the side margin portion is improved, and the strength characteristics are enhanced.

[0127]

Table 2

[0128] When observing the cross-sections in the first and third directions at the center in the second direction of Samples 13 to 22, no samples with cracks or delamination were found.

[0129] From this, it can be understood that when 0.37 ≦ t2 / t1 ≦ 0.53 is satisfied, the bonding force between the capacitance forming portion and the side margin portion is improved, and the strength characteristics are enhanced.

[0130] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and it can be said that these also belong to the scope of the present invention.

[0131] In addition, the expression "one embodiment" used in this specification does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being realized in combination with the features of another one embodiment. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to another one embodiment as long as there is no explanation contrary to or conflicting with that matter in another one embodiment.

[0132] The terms used in this specification are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless the context clearly indicates otherwise.

Description of Reference Numerals

[0133] 100 Multilayer electronic component 110 Body 111 Dielectric layer 112, 113 Cover portion 114, 115 Side margin portion 121 and 122 internal electrodes 121a and 122a non-oxidized portions 121b and 122b oxidized portions 131 and 132 external electrodes

Claims

1. A main body including a dielectric layer and internal electrodes, and an external electrode disposed on the main body, and including: The internal electrodes include oxidation portions which are disposed at both end portions in the width direction and are oxidized regions, and a non-oxidation portion which is disposed at the central portion in the width direction of the internal electrodes and is a non-oxidized region, When the average thickness of the non-oxidation portion is t1 and the average thickness of the oxidation portion is t2, a multilayer electronic component satisfying t2 < t1.

2. The multilayer electronic component according to claim 1, wherein the oxidation portion and the non-oxidation portion are disposed so as to be in contact with each other.

3. The multilayer electronic component according to claim 2, wherein in a region where the oxidation portion and the non-oxidation portion are in contact with each other, the thickness of the non-oxidation portion is larger than the thickness of the oxidation portion.

4. The multilayer electronic component according to claim 1, wherein t1 and t2 satisfy 0.05 ≦ t2 / t1 ≦ 0.

65.

5. The multilayer electronic component according to claim 1, wherein t1 is 2.0 μm or less.

6. The multilayer electronic component according to claim 1, wherein t2 is 1.0 μm or less.

7. When the average width from one end portion in the width direction of the non-oxidation portion to the width-direction surface of the adjacent main body is w1, and the average width of the oxidation portion disposed at one end portion in the width direction of the internal electrodes is w2, The multilayer electronic component according to claim 1, satisfying w2 < w1.

8. The multilayer electronic component according to claim 7, wherein w1 and w2 satisfy 0.3 ≦ w2 / w1 ≦ 0.

6.

9. The multilayer electronic component according to claim 7, wherein w1 is 150 μm or less.

10. The multilayer electronic component according to claim 7, wherein w2 is 40 μm or more and 80 μm or less.

11. The multilayer electronic component according to claim 1, wherein the oxidation portion is disposed at a distance from the width-direction surface of the main body.

12. The multilayer electronic component according to claim 1, wherein the oxidation portion is substantially not bent.

13. The multilayer electronic component according to claim 1, wherein the length of the multilayer electronic component is 0.6 mm or less, and the width of the multilayer electronic component is 0.3 mm or less.

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