Laminated type electronic component

Abstract

To provide a laminated type electronic component that is excellent in reliability and voltage resistance, which secures high capacity.SOLUTION: A laminated type electronic component includes a body including a dielectric layer, and an internal electrode alternately arranged with the dielectric layer, and an external electrode arranged on the body, wherein when the central part in the width direction of the dielectric layer is represented by a first region, and both ends in the width direction of the dielectric layer are represented by a second region, the dielectric constant of the first region is made higher than that of the second region. The laminated type electronic component can include a capacity formation part in which the dielectric layer and the internal electrode are alternately arranged in a first direction, cover parts arranged in the upper and lower parts in the first direction of the capacity formation part, and margin parts arranged on both sides in a third direction of the capacity formation part.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video equipment like liquid crystal display (LCD) devices and plasma display panel (PDP) devices, computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Due to the advantages of being small in size while ensuring high capacitance and being easy to mount, multilayer ceramic capacitors can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices are miniaturized and have increased output, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] In addition, with the increasing application to automotive electrical components and the like, high reliability in various environments is required.

[0005] A multilayer ceramic capacitor is generally manufactured through a process of laminating and pressing ceramic green sheets printed with internal electrodes, followed by cutting and sintering processes. A step is formed between the part where the internal electrode is printed and the part where the internal electrode is not printed, depending on the thickness of the internal electrode pattern, and the step becomes larger as the number of laminations increases.

[0006] In addition, voids are generated in the portions where the internal electrodes are not printed during the lamination stage, and in the pressing stage, a part of the ceramic green sheet and the internal electrodes moves into the voids, and the thicknesses of the dielectric layer and the internal electrodes in the region adjacent to the portion where the internal electrodes are not printed may become thinner. As a result, a high electric field may be applied to the end portions in the width direction with respect to the central portion in the width direction of the dielectric layer, leading to a decrease in reliability. Summary of the Invention Problems to be Solved by the Invention

[0007] One of the various objects of the present invention is to provide a laminated electronic component with excellent reliability.

[0008] One of the various objects of the present invention is to provide a laminated electronic component with excellent withstand voltage.

[0009] One of the various objects of the present invention is to ensure a high capacitance.

[0010] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention. Means for Solving the Problems

[0011] A laminated electronic component according to an embodiment of the present invention includes a main body including a dielectric layer and internal electrodes alternately arranged with the dielectric layer, and external electrodes arranged on the main body. When the central portion in the width direction of the dielectric layer is a first region and both end portions in the width direction of the dielectric layer are second regions, the first region may have a higher dielectric constant than the second region. Advantages of the Invention

[0012] As one of the various advantages of the present invention, by making the central portion in the width direction of the dielectric layer have a higher dielectric constant than the end portions in the width direction, the reliability of the laminated electronic component can be improved.

[0013] Among the various effects of the present invention, one effect is that the capacitance of the multilayer electronic component can be improved.

[0014] However, the diverse and meaningful advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

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Figure 7

Figure 8

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Figure 10

Modes for Carrying Out the Invention

[0016] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0017] In addition, for the purpose of clearly explaining the present invention in the drawings, parts not related to the explanation are omitted, and the sizes and thicknesses of the illustrated components are arbitrarily shown for the convenience of explanation. Therefore, the present invention is not necessarily limited by the illustration. Also, components with the same functions within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0018] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0019] Multilayer electronic component FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention, FIG. 2 schematically shows a cross-sectional view taken along the line I-I' of FIG. 1, FIG. 3 schematically shows a cross-sectional view taken along the line II-II' of FIG. 1, FIG. 4 schematically shows a perspective view of the main body of FIG. 1 disassembled, FIG. 5 schematically shows a cross-sectional view taken along the line III-III' of FIG. 1, and FIG. 6 shows the view excluding the internal electrodes in FIG. 5.

[0020] Hereinafter, with reference to FIGS. 1 to 6, a laminated electronic component 100 according to an embodiment of the present invention will be described in detail. Further, as an example of the laminated electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described. However, the present invention is not limited thereto, and can also be applied to various laminated electronic components using a ceramic material, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0021] The laminated electronic component 100 according to an embodiment of the present invention includes a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer, and external electrodes 131 and 132 arranged on the main body. When the central portion in the width direction of the dielectric layer is a first region 111c and both end portions in the width direction of the dielectric layer are second regions 111e1 and 111e2, the dielectric constant of the first region can be higher than that of the second region.

[0022] A multilayer ceramic capacitor is generally manufactured through a process of laminating and pressing ceramic green sheets printed with internal electrodes, followed by cutting and sintering processes. A step is formed between the portion where the internal electrode is printed and the portion where the internal electrode is not printed due to the thickness of the internal electrode pattern, and the step becomes larger as the number of laminations increases.

[0023] In addition, voids are generated in the portion where the internal electrode is not printed during the lamination stage, and a part of the ceramic green sheet and the internal electrode move into the voids during the pressing stage, resulting in a reduction in the thickness of the dielectric layer and the internal electrode in the region adjacent to the portion where the internal electrode is not printed. As a result, a high electric field may be applied to the end portion in the width direction with respect to the central portion in the width direction of the dielectric layer, leading to a decrease in reliability. Specifically, dielectric breakdown may occur at a low voltage at the end portion in the width direction with respect to the central portion in the width direction of the dielectric layer, and the lifespan may be shortened during a highly accelerated life test (HALT).

[0024] According to one embodiment of the present invention, by making the central portion in the width direction of the dielectric layer have a higher dielectric constant than the end portions in the width direction, it is possible to easily ensure a high capacitance while improving the reliability. That is, the first region 111c of the dielectric layer has a high dielectric constant to ensure a high capacitance, while the second regions 111e1 and 111e2 of the dielectric layer have a relatively low dielectric constant compared to the first region, thereby improving the breakdown voltage at the end portions in the width direction of the dielectric layer and improving the reliability.

[0025] Hereinafter, each component included in the multilayer electronic component 100 according to one embodiment of the present invention will be described.

[0026] The main body 110 can have a dielectric layer 111 and internal electrodes 121 and 122 laminated alternately.

[0027] There is no particular limitation on the specific shape of the main body 110, but as shown in the figure, the main body 110 can have a hexahedral shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedral shape with straight lines, but can have a substantially hexahedral shape.

[0028] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction and connected to the first and second surfaces 1 and 2, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction and connected to the third and fourth surfaces 3 and 4. The first surface 1 can be a mounting surface arranged to face the substrate when mounted on the substrate.

[0029] When the margin regions where the internal electrodes 121 and 122 are not disposed overlap on the dielectric layer 111, a step due to the thickness of the internal electrodes 121 and 122 is generated, and the corner connecting the first surface and the third to fifth surfaces and / or the corner connecting the second surface and the third to fifth surfaces can have a form shrunk toward the center side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corner connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corner connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 can have a form shrunk toward the center side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, in order to prevent chipping defects or the like, the edges connecting the respective surfaces of the main body 110 are separately processed and rounded, so that the corner connecting the first surface and the third to sixth surfaces and / or the corner connecting the second surface and the third to sixth surfaces can have a rounded form.

[0030] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so as to be difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not particularly limited and can be determined in consideration of the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0031] The main body 110 includes a capacitance forming portion Ac in which a capacitance is formed, including a first internal electrode 121 and a second internal electrode 122 that are disposed inside the main body 110 and are disposed to face each other with the dielectric layer 111 interposed therebetween, and cover portions 112 and 113 formed at the upper and lower portions in the first direction of the capacitance forming portion Ac.

[0032] Further, the capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0033] The cover parts 112 and 113 can include an upper cover part 112 disposed at the upper part of the capacitance forming part Ac in the first direction and a lower cover part 113 disposed at the lower part of the capacitance forming part Ac in the first direction.

[0034] The upper cover part 112 and the lower cover part 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac respectively, and can basically play a role in preventing damage to the internal electrode due to physical or chemical stress.

[0035] The upper cover part 112 and the lower cover part 113 do not include an internal electrode and can include the same material as the dielectric layer 111.

[0036] That is, the upper cover part 112 and the lower cover part 113 can include a ceramic material, for example, can include a barium titanate (BaTiO3)-based ceramic material.

[0037] On the other hand, the thickness of the cover parts 112 and 113 does not need to be particularly limited. For example, the average thickness tc of the cover parts 112 and 113 can be 200 μm or less.

[0038] The average thickness tc of the cover parts 112 and 113 can mean the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover parts 112 and 113 measured at five equally spaced points at the upper or lower part of the capacitance forming part Ac.

[0039] Also, margin parts 114 and 115 can be disposed on the side surface of the capacitance forming part Ac.

[0040] The margin parts 114 and 115 can include a first margin part 114 disposed on the fifth surface 5 of the main body 110 and a second margin part 115 disposed on the sixth surface 6. That is, the margin parts 114 and 115 can be disposed on both end surfaces in the width direction of the ceramic main body 110.

[0041] As shown in FIG. 3, the margin portions 114 and 115 can mean the regions between the interfaces of both ends of the first and second internal electrodes 121 and 122 and the main body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0042] The margin portions 114 and 115 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0043] The margin portions 114 and 115 can be formed by applying a conductive paste to form internal electrodes, except where the margin portions are formed on the ceramic green sheet.

[0044] On the other hand, the widths of the margin portions 114 and 115 do not particularly need to be limited. For example, the average width of the margin portions 114 and 115 can be 200 μm or less.

[0045] The average width of the margin portions 114 and 115 can mean the average magnitude (MW1) in the third direction of the region where the internal electrode is separated from the fifth surface and the average magnitude (MW2) in the third direction of the region where the internal electrode is separated from the sixth surface, and can be a value obtained by averaging the magnitudes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0046] Therefore, in one embodiment, the average magnitudes MW1 and MW2 in the third direction of the regions where the internal electrodes 121 and 122 are separated from the fifth and sixth surfaces can be 200 μm or less, respectively.

[0047] When the central portion in the width direction of the dielectric layer 111 is defined as the first region 111c, and both end portions in the width direction of the dielectric layer are defined as the second regions 111e1 and 111e2, the dielectric constant of the first region can be higher than that of the second region. The first region 111c of the dielectric layer ensures a high capacitance by increasing the dielectric constant, while the second regions 111e1 and 111e2 of the dielectric layer have a relatively low dielectric constant compared to the first region, thereby improving the breakdown voltage at the end portions in the width direction of the dielectric layer and improving the reliability. The second regions 111e1 and 111e2 can include a second-1 region 111e1 disposed at one end portion in the width direction of the dielectric layer and a second-2 region 111e2 disposed at the other end portion in the width direction of the dielectric layer.

[0048] In one embodiment, the first region 111c can be arranged to connect the third surface and the fourth surface in the second direction, and the second regions 111e1 and 111e2 can be arranged to connect the third surface and the fourth surface in the second direction.

[0049] Referring to FIG. 2, by arranging the first region 111c to connect the third surface and the fourth surface in the second direction, in the cross-sections in the first and second directions obtained by cutting the main body 110 at the center in the third direction, only the first region 111c among the first and second regions can be observed. Also, in the cross-sections in the first and second directions obtained by cutting at any point in the third direction where the second regions 111e1 and 111e2 are arranged, only the second regions 111e1 and 111e2 among the first and second regions can be observed.

[0050] In one embodiment, at least a part of the second regions 111e1 and 111e2 can be arranged to overlap the internal electrodes 121 and 122 in the first direction. Since an electric field is mainly applied to the portions of the second regions 111e1 and 111e2 that overlap the internal electrodes 121 and 122 in the first direction, the effect of improving the breakdown voltage by the second regions 111e1 and 111e2 can be further improved.

[0051] In one embodiment, the second regions 111e1 and 111e2 can be arranged in the margin portions 114 and 115 and the capacitance forming portion Ac. Since an electric field is mainly applied to the portions of the second regions 111e1 and 111e2 arranged in the capacitance forming portion Ac, the effect of improving the breakdown voltage by the second regions 111e1 and 111e2 can be further improved.

[0052] In one embodiment, when the regions of the second regions 111e1 and 111e2 arranged in the capacitance forming portion Ac are defined as the second a regions 111e1a and 111e2a, and the regions of the second regions 111e1 and 111e2 arranged in the margin portions 114 and 115 are defined as the second b regions 111e1b and 111e2b, the second a regions 111e1a and 111e2a can have a higher dielectric constant than the second b regions 111e1b and 111e2b.

[0053] FIG. 7 is a graph showing the change in the dielectric constant according to the position in the width direction. Specifically, it is a graph showing the change in the dielectric constant along the W0 line shown in FIGS. 3 and 5.

[0054] Referring to FIG. 7, the dielectric constant in the second - 1 region 111e1 can gradually increase as it moves toward the first region 111c side, and the rate of increase in the dielectric constant can also increase. The rate of increase in the dielectric constant can be maximized at the boundary between the second - 1 region 111e1 and the first region 111c. The rate of increase in the dielectric constant in the first region 111c can decrease as it moves from the second - 1 region 111e1 side to the second - 2 region 111e2 side, and after having the maximum dielectric constant at the central portion of the first region 111c, the dielectric constant can gradually decrease as it moves toward the second - 2 region 111e2 side. The rate of decrease in the dielectric constant can be maximized at the boundary between the first region 111c and the second - 2 region 111e2. The dielectric constant in the second - 2 region 111e2 can gradually decrease as it moves away from the first region 111c, and the rate of decrease in the dielectric constant can also decrease.

[0055] Therefore, the dielectric constant of the first region 111c can gradually decrease as it approaches the second regions 111e1 and 111e2.

[0056] Further, the dielectric constants of the second regions 111e1 and 111e2 can gradually decrease as they are farther from the first region 111c.

[0057] At this time, the average dielectric constant of the first region 111c can be 1.05 times or more and 1.6 times or less the average dielectric constants of the second regions 111e1 and 111e2. Thereby, the capacitance improvement effect and the breakdown voltage improvement effect can be further improved.

[0058] When the average dielectric constant of the first region 111c is less than 1.05 times the average dielectric constants of the second regions 111e1 and 111e2, the capacitance improvement effect and / or the breakdown voltage improvement effect may be insufficient. When it exceeds 1.6 times, the difference in shrinkage rate during firing between the first region and the second region becomes large, and there is a risk of a decrease in the connectivity of the internal electrodes, generation of cracks, etc.

[0059] The numerical values of the average dielectric constant of the first region 111c and the average dielectric constants of the second regions 111e1 and 111e2 do not need to be particularly limited. For example, the average dielectric constant of the first region 111c can be 2400 to 3800, and the average dielectric constants of the second regions 111e1 and 111e2 can be 2300 to 3700.

[0060] On the other hand, for a clear explanation of the first region 111c and the second regions 111e1 and 111e2, hatching is shown in the first region 111c in FIGS. 1 to 6, and the additives of the slurry forming the first region 111c and the slurries forming the second regions 111e1 and 111e2 can be adjusted so that they can be visually distinguished.

[0061] However, it may be difficult to visually distinguish between the first region 111c and the second regions 111e1 and 111e2.

[0062] In one embodiment, the dielectric layer can have the maximum rate of change of dielectric constant at the point where the first region 111c is in contact with the second regions 111e1 and 111e2. Thereby, even when it is difficult to visually distinguish the first region 111c from the second regions 111e1 and 111e2, the first region 111c can be distinguished from the second regions 111e1 and 111e2. That is, the point where the absolute value of the slope with respect to the dielectric constant graph in FIG. 7 becomes the maximum can be set as the boundary between the first region 111c and the second regions 111e1 and 111e2.

[0063] Further, in the second regions 111e1 and 111e2, the rate of decrease of the dielectric constant may decrease as the distance from the first region 111c increases.

[0064] Also, in the first region 111c, the rate of increase of the dielectric constant may decrease as the distance from the second regions 111e1 and 111e2 increases.

[0065] The method for measuring the dielectric constant according to the position in the width direction of the dielectric layer 111 is not particularly limited. For example, the dielectric constant according to the position in the width direction of the dielectric layer 111 can be obtained by dividing the multilayer electronic component 100 in the width direction by a certain unit length and measuring the dielectric constant for each unit length.

[0066] Also, when the dielectric constant in the width direction is realized differently by adjusting the additive concentration, the cross-sections of the multilayer electronic component 100 in the first and third directions are analyzed by LA-ICP (Laser Ablation-Inductively Coupled Plasma) to measure the concentration distribution of the additive, and thus the change in the dielectric constant can be indirectly confirmed.

[0067] Also, when the dielectric constant is realized differently by adjusting the dielectric crystal grain size according to the position in the width direction, the cross-sections of the multilayer electronic component 100 in the first and third directions are scanned by SEM to compare the crystal grain sizes according to the position in the width direction, and thus the change in the dielectric constant can be indirectly confirmed.

[0068] In one embodiment, when the average width in the third direction of the first region 111c is Wc and the average width in the third direction of the internal electrodes 121 and 122 is Wi, 0.3 ≦ Wc / Wi ≦ 0.9 can be satisfied. Thereby, the capacitance improvement effect and the breakdown voltage improvement effect can be further improved.

[0069] When Wc / Wi is less than 0.3, the capacitance improvement effect may be insufficient, and when it exceeds 0.9, the breakdown voltage improvement effect may be insufficient.

[0070] In one embodiment, the cover portions 112 and 113 can include the dielectric layer 111. That is, the cover portions 112 and 113 can be formed using the same ceramic green sheet as the ceramic green sheet for forming the dielectric layer 111 included in the capacitance forming portion Ac and the margin portions 114 and 115.

[0071] Thereby, the first region of the dielectric layer included in the cover portions 112 and 113 can be arranged to connect the third surface and the fourth surface in the second direction, and the second region of the dielectric layer included in the cover portion can be arranged to connect the third surface and the fourth surface in the second direction.

[0072] However, it is not limited thereto, and the cover portion can be formed using a ceramic green sheet different from the ceramic green sheet for forming the dielectric layer 111 included in the capacitance forming portion Ac and the margin portions 114 and 115.

[0073] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder can be used as the ceramic powder. More specifically, as the ceramic powder, barium titanate (BaTiO3)-based powder, normal dielectric powder of a CaZrO3 substrate, etc. can be used. More specifically, as the barium titanate (BaTiO3)-based powder, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1) can be one or more of them, and the normal dielectric powder of the CaZrO3 substrate can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0074] Therefore, the dielectric layer 111 is BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y)It can contain one or more of O3 (0 < x < 1, 0 < y < 1). In one embodiment, the dielectric layer 111 can contain (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1) as a main component.

[0075] On the other hand, the method for controlling the dielectric constant according to the position in the width direction of the dielectric layer 111 does not need to be particularly limited. For example, it can be controlled by varying the components, additive concentrations, etc. according to the position in the width direction of the ceramic green sheet, or by adjusting firing conditions and the like.

[0076] Referring to FIG. 8, which is a drawing for explaining a method for manufacturing a ceramic green sheet for manufacturing a multilayer electronic component according to an embodiment of the present invention, after separately preparing the slurry 11c for forming the first region and the slurry 11e for forming the second region, the slurry 11c for forming the first region and the slurry 11e for forming the second region are simultaneously applied via a plurality of nozzles 21 and 22 onto a carrier film, and pressure-bonded and dried via a roller 23 to manufacture the ceramic green sheet 11. At this time, the slurry 11c for forming the first region can be applied via the first nozzle 22, and the slurry 11e for forming the second region can be applied via the second nozzle 21.

[0077] After that, as shown in FIG. 9, a ceramic green sheet on which an internal electrode pattern 120 is formed on the ceramic green sheet 11 to form a capacitance forming portion Ac can be provided.

[0078] After that, the ceramic green sheets are laminated and pressure-bonded to obtain a laminate 10', and then the portion that becomes the margin portion can be cut into a unit chip size along the cutting lines C1 and C2. After that, the cut laminate is sintered to obtain a main body, and then an external electrode is formed to manufacture the multilayer electronic component 100.

[0079] The internal electrodes 121 and 122 can include the first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0080] The first internal electrode 121 is separated from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 is separated from the third surface 3 and can be exposed through the fourth surface 4. A first external electrode 131 is disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 can be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0081] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Further, the first and second internal electrodes 121 and 122 can be disposed separated from the fifth and sixth surfaces of the main body 110.

[0082] The conductive metal contained in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0083] The average thickness td of the dielectric layer 111 does not particularly need to be limited, but for example, it can be 0.1 μm to 10 μm. The average thickness te of the internal electrodes 121 and 122 does not particularly need to be limited, but for example, it can be 0.05 μm to 3.0 μm. Also, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be arbitrarily set according to desired characteristics and applications. For example, in the case of an electronic component for small IT for achieving miniaturization and high capacitance, the average thickness td of the dielectric layer 111 can be 0.4 μm or less, and the average thickness te of the internal electrodes 121 and 122 can be 0.4 μm or less.

[0084] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 respectively mean the sizes of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thicknesses at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, and then measuring the average value. Also, the average thickness te of the internal electrodes 121 and 122 can be measured by measuring the thicknesses at a number of points of one internal electrode 121 or 122, for example, 30 points at equal intervals in the second direction, and then measuring the average value. The 30 points at equal intervals can be specified in the capacitance forming portion Ac. On the other hand, after performing such average value measurements for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively, and then measuring the average value, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0085] The external electrodes 131 and 132 can be arranged on the third surface 3 and the fourth surface 4 of the main body 110.

[0086] The external electrodes 131 and 132 can be arranged on the third and fourth surfaces 3 and 4 of the main body 110 respectively, and include first and second external electrodes 131 and 132 respectively connected to the first and second internal electrodes 121 and 122.

[0087] Referring to FIG. 1, the external electrodes 131 and 132 can be arranged to cover both end faces in the second direction of the side margin portions 114 and 115.

[0088] In this embodiment, the structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described. However, the number, shape, etc. of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0089] On the other hand, as long as the external electrodes 131 and 132 have electrical conductivity such as metal, they can be formed using any material, and specific materials can be determined in consideration of electrical characteristics, structural stability, etc., and they can further have a multilayer structure.

[0090] For example, the external electrodes 131 and 132 can include electrode layers 131a and 132a disposed on the main body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0091] To give a more specific example of the electrode layers 131a and 132a, the electrode layers 131a and 132a can be fired electrodes including conductive metal and glass, or resin-based electrodes including conductive metal and resin.

[0092] Also, the electrode layers 131a and 132a can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the electrode layers 131a and 132a can be formed by a method of transferring a sheet containing a conductive metal onto the main body, or can be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0093] As the conductive metal contained in the electrode layers 131a and 132a, a material excellent in electrical conductivity can be used, and it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0094] The plating layers 131b and 132b play a role in improving the mounting characteristics. The types of the plating layers 131b and 132b are not particularly limited, and they can be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and can be formed of a plurality of layers.

[0095] More specific examples of the plating layers 131b and 132b are as follows. The plating layers 131b and 132b can be Ni plating layers or Sn plating layers, and can be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layers 131a and 132a, and can be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Also, the plating layers 131b and 132b can include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0096] Method for manufacturing a multilayer electronic component FIG. 8 is a drawing for explaining a method of manufacturing a ceramic green sheet for manufacturing a multilayer electronic component according to an embodiment of the present invention, FIG. 9 shows a ceramic green sheet on which internal electrodes are printed, and FIG. 10 shows a cross section of a laminate obtained by laminating and pressing the ceramic green sheet of FIG. 9.

[0097] Hereinafter, with reference to FIGS. 8 to 10, a method of manufacturing a multilayer electronic component according to an embodiment of the present invention will be described. However, the multilayer electronic component according to the embodiment of the present invention described above is not limited by the following manufacturing method, and the contents overlapping with the above-described contents can be omitted in order to avoid redundant explanations.

[0098] Referring to FIG. 8, which is a drawing for explaining a method of manufacturing a ceramic green sheet for manufacturing a multilayer electronic component according to an embodiment of the present invention, after separately preparing a slurry 11c for forming a first region and a slurry 11e for forming a second region, the slurry 11c for forming a first region and the slurry 11e for forming a second region are simultaneously applied onto a carrier film via a plurality of nozzles 21 and 22, and are pressure-bonded and dried via a roller 23 to manufacture a ceramic green sheet 11. At this time, the slurry 11c for forming a first region can be applied via the first nozzle 22, and the slurry 11e for forming a second region can be applied via the second nozzle 21.

[0099] However, the present invention is not limited to using two types of slurries. Three or more types of slurries having different compositions can be simultaneously applied via different nozzles, and pressure-bonded and dried via a roller to manufacture a ceramic green sheet.

[0100] Thereafter, a ceramic green sheet provided with a capacitor forming portion Ac can be formed by forming an internal electrode pattern 120 on the ceramic green sheet 11 as shown in FIG. 9.

[0101] The method of forming the internal electrode pattern 120 is not particularly limited. As described above, an internal electrode conductive paste containing a conductive metal can be applied to form the internal electrode pattern 120. As the method of applying the internal electrode conductive paste, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0102] The internal electrode pattern 120 is configured to form internal electrodes 121 and 122 after a sintering process.

[0103] Thereafter, after laminating and pressure-bonding the ceramic green sheets to obtain a laminate 10', the portion that becomes the margin portion can be cut into a unit chip size along cutting lines C1 and C2. Thereafter, the cut laminate can be sintered to obtain a main body 110.

[0104] Next, external electrodes 131 and 132 can be formed on the main body 110 to manufacture the multilayer electronic component 100.

[0105] The method for forming the external electrodes 131 and 132 is not particularly limited, and a method of dipping into a paste containing a conductive metal and glass can be used, or it can also be formed by a method of transferring a sheet containing a conductive metal. Further, a paste containing a conductive metal and a resin can be used, or an external electrode can be formed using an Atomic Layer Deposition (ALD) method, a Molecular Layer Deposition (MLD) method, a Chemical Vapor Deposition (CVD) method, a Sputtering method, or the like.

[0106] Further, a plating process can be further performed so that the external electrodes include plating layers 131b and 132b.

[0107] As described above in detail regarding the embodiments of the present invention, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and this can also be said to belong to the scope of the present invention.

[0108] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the one embodiment presented above does not exclude being implemented in combination with the features of another one embodiment. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to another one embodiment as long as there is no explanation contrary to or conflicting with that matter in the other one embodiment.

[0109] The terms used in this disclosure are merely used to describe an embodiment and are not intended to limit this disclosure. At this time, singular expressions include plural expressions unless the context clearly indicates otherwise.

Explanation of Signs

[0110] 100 Multilayer electronic component 110 Body 111 Dielectric layer 111c First region 111e1, 111e2 Second region 112, 113 Cover part 114, 115 Margin part 121, 122 Internal electrode 131, 132 External electrode 131a, 132a Electrode layer 131b, 132b Plating layer

Claims

1. A main body including a dielectric layer and internal electrodes alternately arranged with the dielectric layer, and an external electrode disposed on the main body, wherein when a central portion in the width direction of the dielectric layer is a first region and both end portions in the width direction of the dielectric layer are second regions, the first region has a higher dielectric constant than the second region, a multilayer electronic component.

2. The main body includes first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, a capacitance forming portion in which the dielectric layer and the internal electrodes are alternately arranged in the first direction, cover portions disposed above and below the capacitance forming portion in the first direction, and margin portions disposed on both sides of the capacitance forming portion in the third direction, wherein the width direction is the third direction, the multilayer electronic component according to Claim 1.

3. The first region is arranged to connect the third surface and the fourth surface in the second direction, and the second region is arranged to connect the third surface and the fourth surface in the second direction, the multilayer electronic component according to Claim 2.

4. At least a part of the second region is arranged to overlap the internal electrode in the first direction, the multilayer electronic component according to Claim 2.

5. The second region is disposed in the margin portion and the capacitance forming portion, the multilayer electronic component according to Claim 2.

6. When a region disposed in the capacitance forming portion among the second regions is a second a region and a region disposed in the margin portion is a second b region, the second a region has a higher dielectric constant than the second b region, the multilayer electronic component according to Claim 2.

7. The dielectric constant of the first region gradually decreases as it approaches the second region, the multilayer electronic component according to Claim 2.

8. The dielectric constant of the second region gradually decreases as it moves away from the first region, the multilayer electronic component according to Claim 2.

9. The average dielectric constant of the first region is 1.05 times or more and 1.6 times or less the average dielectric constant of the second region, the multilayer electronic component according to Claim 2.

10. When the width of the first region in the third direction is Wc and the width of the internal electrode in the third direction is Wi, 0.3 ≤ Wc / Wi ≤ 0.9 is satisfied, the multilayer electronic component according to Claim 2.

11. The dielectric layer has the largest change in dielectric constant at the point where the first region and the second region are in contact, the multilayer electronic component according to Claim 2.

12. The laminated electronic component according to claim 11, wherein the reduction rate of the dielectric constant decreases as the second region is farther from the first region.

13. The laminated electronic component according to claim 11, wherein the increase rate of the dielectric constant decreases as the first region is farther from the second region.

14. The laminated electronic component according to claim 2, wherein the cover portion includes the dielectric layer.

15. The first region of the dielectric layer included in the cover portion is arranged to connect the third surface and the fourth surface in the second direction, and the second region of the dielectric layer included in the cover portion is arranged to connect the third surface and the fourth surface in the second direction. The laminated electronic component according to claim 11.

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