Laminated electronic component

The innovative design of the multilayer ceramic capacitor addresses protrusion and stress issues by aligning the base electrode edges with internal electrode edges and using inclined or shaped end faces, improving mounting accuracy and structural integrity.

JP2025103000APending Publication Date: 2025-07-08KYOCERA CORP
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Patent Information

Application Number
JP2025063459
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-02-06
Filing Date
2025-04-08
Publication Date
2025-07-08

AI Technical Summary

Technical Problem

Existing multilayer ceramic capacitors face issues with protrusions and stress concentration at the edges of the external electrodes, leading to alignment errors and increased cracking during mounting, due to sharp ridge line portions and uneven deposition of metal layers.

Method used

The design incorporates a base electrode positioned to avoid sharp edges by ensuring its edges align with the innermost position of the internal electrode edges, and the end face of the base electrode is inclined to reduce protrusion formation, combined with a concave or convex shape of the end face to further stabilize the electrode structure.

Benefits of technology

This configuration reduces the likelihood of protrusion formation, improves alignment accuracy, and enhances the structural integrity and reliability of the capacitor by minimizing stress concentration and uneven metal deposition.

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Abstract

To provide a laminated electronic component such as a laminated ceramic capacitor that reduces the risk of formation of a protrusion on an outer electrode.SOLUTION: A laminated electronic component 1 has an effective part 11 having dielectric layers 7 and internal electrodes 9 that are laminated alternately along a D3 direction. Covers 13 overlap the effective part from a +D3 side of the D3 direction. A base electrode 16 overlaps the cover form the +D3 side. The effective part has an end face facing the +D3 side out of a -D1 side and a +D1 side of a D1 direction crossing a lamination direction. The plurality of internal electrode each have an exposed edge part exposed from the end face, and are located at an area on the -D1 side of the faces on the +D3 side of the cover. A first end face of the base electrode on the -D1 side and a second end face of the cover on the -D1 side constitute a sloping surface. The sloping surface is a continuous surface inclining with respect to the D3 direction so as to incline toward +D1 as it approaches +D3 side.SELECTED DRAWING: Figure 3
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Description

Technical Field

[0001] The present disclosure relates to multilayer electronic components such as multilayer ceramic capacitors.

Background Art

[0002] As multilayer electronic components, for example, multilayer ceramic capacitors are known (for example, Patent Documents 1 and 2 below). A multilayer ceramic capacitor has, for example, a main body portion that directly functions as a capacitor, and external electrodes for mounting the capacitor on a circuit board or the like. The main body portion has dielectric layers and flat internal electrodes that are alternately laminated. The edges of the internal electrodes are exposed from the side surface (the surface along the lamination direction) of the main body portion. The external electrodes are, for example, composed of metal layers, cover the side surface of the main body portion, and cover the regions of the upper and lower surfaces of the main body portion that are close to the side surface.

[0003] Patent Document 1 discloses a capacitor in which the side surface of the main body portion is formed in a concave shape. Patent Document 2 provides a base electrode on the side surface, upper surface, and lower surface of the main body portion, deposits metal on the base electrode by plating, and thereby forms an external electrode.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

[0005] A stacked electronic component according to one aspect of the present disclosure includes an active portion, a first cover, and a first base electrode. The active portion has a dielectric layer and an internal electrode alternately stacked in a stacking direction. The first cover overlaps the active portion from the first side among the first side and the second side in the stacking direction. The first base electrode overlaps the first cover from the first side. The active portion has an end face facing the third side among the third side and the fourth side in a first direction intersecting the stacking direction. The plurality of internal electrodes includes two or more internal electrodes each having an exposed edge portion exposed from the end face. The first base electrode is located in a region on the third side of the first side surface of the first cover.

[0006] In one example, a first end face on the third side of the first base electrode and a second end face on the third side of the first cover form an inclined surface. The inclined surface is a continuous surface inclined with respect to the stacking direction so as to be located closer to the fourth side as it is closer to the first side over the entire thickness of the first base electrode and the entire thickness of the first cover.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings. Note that the drawings used in the following description are schematic. Therefore, for example, the dimensional ratios on the drawings do not necessarily match the actual ones. Also, the dimensional ratios may not match between the drawings. Specific shapes and / or dimensions may be exaggerated or details may be omitted. However, the above does not deny that the actual shape and / or dimensions may be as shown in the drawings, or the shape and / or dimensional features may be extracted from the drawings.

[0009] Regarding the aspects described relatively later, basically, only the differences from the aspects described relatively earlier will be described. For matters not particularly mentioned, they may be the same as the aspects described earlier or inferred from the aspects described earlier. For constituent elements corresponding to each other between different aspects, for convenience, even if there are differences, the same reference numerals may be used.

[0010] In the following description, when referring to "rectangle" (or rectangular shape), "square" (or square shape), and "rectangle" (or rectangular shape), the corners thereof may be chamfered by a curved surface or the like as long as the concept of the above shape holds. For example, the corner formed by two sides may be chamfered with a length of 1 / 5 or less, 1 / 10 or less, or 1 / 20 or less of the length of the shorter of the two sides. Of course, when viewed microscopically, the corners may be rounded due to manufacturing accuracy (error). The same applies to other polygons and the like.

[0011] When referring to the thicknesses of various layers, unless otherwise specified, it refers to the thickness of the portion with a constant thickness. For example, as will be described later, the base electrode may basically be a layer with a constant thickness, but may also be an aspect where it can be considered that the thickness changes at the ends. However, when it is said that the base electrode is thicker than the internal electrode, unless otherwise specified, such changes in the thickness at the ends are not taken into account.

[0012] (Overview of the Embodiment) FIG. 1 is a perspective view showing a capacitor 1 (an example of a multilayer electronic component) according to the first embodiment. For convenience, a rectangular coordinate system D1D2D3 is attached to FIG. 1 and other figures described later. The capacitor 1 may be used with either side being the upper or lower side. However, in the description of the embodiment, for convenience, the +D3 side is regarded as the upper side, and terms such as the upper surface and the lower surface may be used.

[0013] The capacitor 1 is, for example, a multilayer ceramic capacitor. The capacitor 1 has a substantially rectangular parallelepiped main body 3 and four external electrodes 5 located at the four corners of the main body 3 in a plan view (viewed in the D3 direction). The external electrodes 5 contribute to the electrical connection between the capacitor 1 and other electronic components (for example, a circuit board not shown).

[0014] FIG. 3 is a cross-sectional view taken along line III-III of FIG. 1. Note that FIG. 3 shows a D1D3 cross-section that cuts the external electrode 5 on the +D2 side. However, the D1D3 cross-section that cuts the external electrode 5 on the -D2 side, the D2D3 cross-section that cuts the external electrode 5 on the -D1 side, and the D2D3 cross-section that cuts the external electrode 5 on the +D1 side are basically the same. In the description of the embodiment, for convenience, without particular notice, based on the cross-section shown in FIG. 3, the terms D1, D2, and D3 may be used to describe the positional relationship between components.

[0015] The main body 3 has, for example, an effective portion 11, two covers 13 that respectively overlap the upper and lower surfaces of the effective portion 11, and a base layer 15 that overlaps the surfaces of the respective covers 13 on the side opposite to the effective portion 11. The effective portion 11 has a plurality of dielectric layers 7 and a plurality of internal electrodes 9 that overlap alternately. The plurality of internal electrodes 9 includes a plurality of first internal electrodes 9A and a plurality of second internal electrodes 9B. Each base layer 15 has four base electrodes 16 at positions corresponding to the positions of the four external electrodes 5, for example.

[0016] The active part 11 directly undertakes the function as a capacitor. The cover 13 contributes to, for example, protecting the main body part 3 and improving its strength. The base electrode 16 contributes to, for example, depositing the metal that becomes the external electrode 5 by electroplating and / or improving the adhesion of the external electrode 5 to the main body part 3.

[0017] Of the outer surface of the active part 11, the side surface facing the -D1 side is referred to as the end face 11c. The -D1 side can be one side (an example of the third side) in the direction (D1 direction) intersecting the stacking direction (D3 direction) of the dielectric layer 7 and the internal electrode 9. A part of the edge of the first internal electrode 9A (which may be referred to as the exposed edge 9c) is exposed from the end face 11c. The external electrode 5 on the -D1 side covers the end face 11c and is fixed to the exposed edge 9c. Thereby, the first internal electrode 9A and the external electrode 5 are electrically connected.

[0018] FIG. 4 is an enlarged view of region IV in FIG. 3. The end face 11c has, for example, a concave part 11d recessed toward the +D1 side. As a result, at least a part (two or more) of the exposed edges 9c of the plurality of first internal electrodes 9A have different positions in the D1 direction. Here, among the plurality of exposed edges 9c, the position of the one located on the most +D1 side (an example of the fourth side) is referred to as the innermost position P1. At this time, the edge on the -D1 side of the base electrode 16 (an example of the first base electrode) on the +D3 side (and -D1 side) is located at the same position as the innermost position P1 or on the +D1 side of the innermost position P1. The same applies to the base electrode 16 (an example of the second base electrode) on the -D3 side (and -D1 side).

[0019] In such a configuration, for example, as will be described in detail later, the probability of forming a protrusion 5z (see FIG. 7) on the external electrode 5 is reduced. As a result, for example, when mounting the capacitor 1 on a circuit board (not shown), the probability of alignment failure due to the protrusion 5z is reduced. Also, for example, when the suction nozzle that picks up the capacitor 1 is lowered toward the circuit board, the probability that the capacitor 1 receives an unintended force from the circuit board is reduced. Consequently, the probability of cracking in the external electrode 5 is reduced.

[0020] From this embodiment, it is also possible to extract features different from the positional relationship between the underlying electrode 16 and the innermost position P1 as described above. For example, in FIG. 4, the end face 16c (an example of the first end face) on the -D1 side (an example of the third side) of the underlying electrode 16 (an example of the first underlying electrode) on the +D3 side (an example of the first side) is inclined with respect to the D3 direction (an example of the stacking direction) in a direction where it is located more on the +D1 side (an example of the fourth side) as it is on the +D3 side. Such a feature may be extracted.

[0021] When the end face 16c of the underlying electrode 16 is inclined as described above, for example, as will be described in detail later, the probability of forming the protrusion 5z is reduced. That is, the same or similar effects as those of the effect due to the above-described positional relationship between the edge portion of the underlying electrode 16 and the innermost position P1 are achieved. Further, by combining the above positional relationship and the inclination of the end face 16c, the probability of forming the protrusion 5z is further reduced.

[0022] Note that when the feature related to the inclination of the end face 16c is extracted as described above, the above-described positional relationship between the underlying electrode 16 and the innermost position P1 may or may not hold. Further, at least a part (two or more) of the plurality of exposed edge portions 9c may have different positions in the D1 direction from each other, or may be the same as each other.

[0023] The above is the outline of the embodiment. Specifically, the embodiment will be described generally in the following order. 1. Configuration of the capacitor according to the first embodiment (FIGS. 1 to 3) 1.1. Overall configuration 1.2. Effective part 1.3. Cover 1.4. Underlying electrode 1.4.1. Outline 1.4.2. Thickness 1.4.3. Material 1.5. External electrode 2. Configuration related to the end of the underlying electrode 2.1. Edge position of the underlying electrode 2.2. Example of the shape of the side surface of the main body portion (FIGS. 4 and 5) 2.3. Inclination of the end face of the lower electrode 3. Method for manufacturing a capacitor 4. Configuration of a capacitor according to another embodiment (FIG. 6) 5. Summary of the embodiments

[0024] (1. Configuration of the capacitor according to the first embodiment) (1.1. Overall configuration) The capacitor 1 shown in FIG. 1 is configured, for example, as a chip-type component to be surface-mounted. Specifically, for example, the capacitor 1 is arranged with the surface on the -D3 side or +D3 side facing a circuit board (not shown). Then, the four pads of the circuit board and the four external electrodes 5 are joined by a conductive joining material (e.g., solder, not shown) to be mounted on the circuit board.

[0025] The configuration (internal structure and outer shape) of the capacitor 1 is, for example, generally symmetric with respect to a symmetric plane (not shown) parallel to the D1D2 plane and passing through the center in the thickness direction (D3 direction) of the capacitor 1. Also, the configuration of the capacitor 1 is, for example, rotationally symmetric by 180° when viewed in the D3 direction. Of course, the capacitor 1 may not have such symmetry.

[0026] The shape of the main body 3 is, for example, generally a thin rectangular parallelepiped shape. This rectangular parallelepiped may be a square (in the illustrated example) or a rectangle (excluding squares; the same applies hereinafter) in plan view. In the description of the embodiment, for convenience, the description may be based on a square without particular notice.

[0027] The specific dimensions of the main body 3 (or the capacitor 1) are arbitrary. To give an example of the dimensions when the capacitor 1 is relatively small, in the main body 3 (or the capacitor 1), the lengths in the D1 direction and the D2 direction may each be 0.030 mm or more and 0.200 mm or less. When the length in the D1 direction is L and the length in the D2 direction is W, L / W may be 0.5 or more and 2.0 or less. The thickness in the D3 direction may be 0.030 mm or more and 0.200 mm or less. When the surface of the main body 3 is not planar, for example, the maximum value of various dimensions may satisfy the above range (hereinafter, the same applies to the various dimensions of other components as long as there is no contradiction, etc.).

[0028] In addition, although the examples of the dimensions of each component described later may not be specifically stated, they are for the case when the capacitor 1 is relatively small. Therefore, dimensions larger (or smaller) than the exemplified dimensions may be adopted.

[0029] A plurality of components of the same type (for example, 5, 7, 9, 13, 15, 16, 17, 19 or 20, etc.) may be provided with the same (or corresponding) shape, size, material, position, etc. basically (for example, excluding relatively small differences, hereinafter the same) as long as there is no specific instruction and no contradiction, etc. Therefore, as long as there is no specific instruction and no contradiction, etc., the description of one component may be regarded as common to a plurality of components of the same type.

[0030] One layered (film-like) component (for example, 5, 7, 9, 15, 17 or 19, etc.) may be entirely composed of one kind of material. However, it may also be composed of layers having different materials stacked on each other.

[0031] (1.2. Effective part) The shape of the active part 11 shown in FIG. 3 is, for example, generally a thin rectangular parallelepiped shape. Its planar shape is basically the same as the planar shape of the main body part 3. The specific thickness of the active part 11 is arbitrary. For example, the thickness of the active part 11 may be 30% or more, 40% or more, or 50% or more with respect to the thickness of the main body part 3, and may also be 90% or less, 80% or less, or 70% or less. The above lower limit and upper limit may be combined with any of them. Note that the thickness of the main body part 3 is, for example, the thickness from the upper surface of the underlying electrode 16 on the upper surface side to the lower surface of the underlying electrode 16 on the lower surface side. The thickness of the active part 11 is, for example, the thickness from the upper surface of the uppermost internal electrode 9 to the lower surface of the lowermost internal electrode 9.

[0032] The dielectric layer 7 is basically a layered structure having a constant thickness (at least between the internal electrodes 9). The thickness of the dielectric layer 7 may be appropriately set according to the characteristics required for the capacitor 1 and the like. Taking an example of a relatively thin thickness, the thickness between adjacent internal electrodes 9 (between the first internal electrode 9A and the second internal electrode 9B) may be 0.1 μm or more or 0.5 μm or more, and may also be 3.0 μm or less, 2.0 μm or less, or 1.0 μm or less. The above lower limit and upper limit may be combined with any of them. The shape and dimensions of the dielectric layer 7 in plan view are basically the same as the shape and dimensions of the active part 11 in plan view. The material of the dielectric layer is, for example, ceramics, and its specific type is also arbitrary. The number of layers of the dielectric layer 7 (internal electrodes 9) is arbitrary. Taking an example, it is 10 layers or more and 30 layers or less.

[0033] The internal electrode 9 is a layered structure with a certain thickness. The thickness of the internal electrode 9 is arbitrary. For example, it may be thinner, of the same degree, or thicker than the thickness of the region between the internal electrodes 9 in the dielectric layer 7. To give an example of a relatively thin thickness, the thickness of the internal electrode 9 may be 0.3 μm or more, or 0.5 μm or more, and may also be 3.0 μm or less, 2.0 μm or less, or 1.0 μm or less. The above lower limit and upper limit may be combined arbitrarily with each other. The material of the internal electrode 9 is, for example, a metal. The specific type of the metal is arbitrary. For example, all or the main component thereof (for example, a component of 60 mass% or more. The same shall apply hereinafter) is a base metal (for example, Ni and / or Cu).

[0034] FIG. 2 is an exploded perspective view of the capacitor 1. FIG. 2 is schematic for grasping the shape and relative position of the internal electrode 9 and the like. Therefore, in FIG. 2, the number of various layers shown is smaller compared to FIG. 3.

[0035] The internal electrode 9 has, for example, in plan view, a rectangular (square in the illustrated example) electrode body 9a and a pair of lead electrodes 9b extending from a pair of opposite corner portions of the electrode body 9a. The electrode body 9a is located inside the outer edge of the dielectric layer 7 and is not exposed from the side surface of the effective portion 11. The pair of lead electrodes 9b reach the outer edge of the dielectric layer 7 and are connected to a pair of external electrodes 5 located at a pair of opposite corner portions of the main body portion 3.

[0036] The first internal electrode 9A and the second internal electrode 9B face each other with the dielectric layer 7 interposed therebetween. The pair of lead electrodes 9b of the first internal electrode 9A and the pair of lead electrodes 9b of the second internal electrode 9B are located on different diagonals in plan perspective. And both are connected to a pair of different external electrodes 5.

[0037] The various dimensions of the electrode body 9a and the lead electrode 9b are arbitrary. For example, the length of the lead electrode 9b on one side of the dielectric layer 7 (that is, the length of the exposed edge portion 9c) is substantially the same as the length along the above one side of the external electrode 5.

[0038] (1.3. Cover) The cover 13 shown in FIG. 3 is, for example, a layer having a shape and dimensions that substantially overlap the effective portion 11 without excess or deficiency. The thickness of the cover 13 is substantially constant in each of the disposed region and the non-disposed region of the base electrode 16. The ratio of the thickness of the cover 13 to the thickness of the main body 3 may be substantially the reverse of the ratio of the thickness of the effective portion 11 to the thickness of the main body 3 (described above). For example, in an embodiment where the covers 13 are provided on both sides in the D3 direction, the thickness of one cover 13 may be, for example, 5% or more, 10% or more, or 15% or more with respect to the thickness of the main body 3, and may be 35% or less, 30% or less, or 25% or less. Any combination of the above lower limit and upper limit may be used. The thickness of the cover 13 is, for example, the thickness in a region that overlaps the internal electrode 9 and does not overlap the base electrode 16 (not crushed by the base electrode 16).

[0039] Each cover 13 has, for example, a plurality (two in the example of FIG. 3) of insulating layers 17 and at least one (one in the example of FIG. 3) dummy layer 19 located between the plurality of insulating layers 17. Each dummy layer 19 has, for example, four dummy electrodes 20 at positions corresponding to the positions of the four external electrodes 5. The dummy electrodes 20 contribute to, for example, the reinforcement of the cover 13 and / or the improvement of the connection strength between the main body 3 and the external electrodes 5, and also function as a base in an embodiment where the external electrodes 5 are formed by electroplating. Different from the illustrated example, the cover 13 may have only one or more insulating layers 17 (it may not have the dummy layer 19).

[0040] The insulating layer 17 and the dummy layer 19 overlap one by one alternately. In other words, the dummy layer 19 is provided at the boundary of all the insulating layers 17. Different from the illustrated example, the dummy layer 19 may be provided only at a part of a plurality of boundaries. For example, the dummy layer 19 may not be provided at one or more boundaries relatively close to the effective part 11, and may be provided only at one or more boundaries relatively far from the effective part 11. However, in such a case, two or more insulating layers 17 that are in close contact with each other without the intervention of the dummy layer 19 may be regarded as one insulating layer 17.

[0041] The insulating layer 17 is a layered structure having a substantially constant thickness except for a change in thickness caused by the difference in the presence or absence of overlap with the conductor layers (9, 15, and 19). The planar shape of the insulating layer 17 is, for example, basically the same as the planar shape of the dielectric layer 7. The material of the insulating layer 17 is arbitrary. For example, the material of the insulating layer 17 may be the same as or different from the material of the dielectric layer 7. Also, the material of the insulating layer 17 may be, for example, ceramics or a material other than ceramics.

[0042] The thickness of the insulating layer 17 is arbitrary. For example, the thickness of the insulating layer 17 may be thicker (illustrated example), equal, or thinner than the thickness of the dielectric layer 7 (both are the thickness between the conductor layers or the thickness of the region not overlapping the conductor layer. In this paragraph, the same applies hereinafter). For example, the thickness of the insulating layer 17 may be set to be 2 times or more, 3 times or more, or 5 times or more the thickness of the dielectric layer 7, and may also be set to be 20 times or less, 10 times or less, or 5 times or less. The above lower limit and upper limit may be combined arbitrarily with each other. Also, for example, the thickness of the insulating layer 17 may be set to be 1.0 μm or more or 2.0 μm or more, and may also be set to be 10.0 μm or less or 5.0 μm or less. The above lower limit and upper limit may be combined arbitrarily with each other. Note that the insulating layer overlapping the uppermost internal electrode 9 may be regarded as the insulating layer 17 instead of the dielectric layer 7 regardless of its material and thickness. The same applies to the insulating layer overlapping the lowermost internal electrode 9.

[0043] The dummy electrode 20 is, for example, a layered structure having a substantially constant thickness. The material of the dummy electrode 20 is, for example, a metal. The specific type of the metal is arbitrary. For example, all or the main component thereof is a base metal (e.g., Ni and / or Cu). The material of the dummy electrode 20 may be the same as or different from the material of the internal electrode 9. In plan view, the position, shape, and dimensions of the dummy electrode 20 are arbitrary. In the examples of FIGS. 2 and 3, the position, shape, and dimensions of the dummy electrode 20 are, in a plane perspective view, substantially the same as those of the external electrode 5 without excess or deficiency (however, the external electrode 5 is slightly wider). The dummy electrode 20 is exposed, for example, on the side surface of the main body portion 3. This exposed portion is fixed to the external electrode 5.

[0044] The thickness of the dummy electrode 20 is arbitrary. For example, the thickness of the dummy electrode 20 may be greater than (in the illustrated example), equal to, or less than the thickness of the internal electrode 9. For example, the thickness of the dummy electrode 20 may be 1 times or more, 1.5 times or more, or 2 times or more the thickness of the internal electrode 9, and may also be 10 times or less, 5 times or less, or 2 times or less. Any combination of the above lower and upper limits may be used. Also, for example, the thickness of the dummy electrode 20 may be 0.3 μm or more, 0.5 μm or more, 1.0 μm or more, or 2.0 μm or more, and may also be 10.0 μm or less, 5.0 μm or less, 3.0 μm or less, or 2.0 μm or less. Any combination of the above lower and upper limits may be used. Also, the thickness of the dummy electrode 20 may be less than (in the illustrated example), equal to, or greater than the thickness of the insulating layer 17.

[0045] (1.4. Underlying electrode) (1.4.1. Overview) The underlying electrode 16 is, for example, basically a layered structure having a constant thickness. The material of the underlying electrode 16 is, for example, a metal. The specific type of the metal is arbitrary. For example, all or the main component thereof is a base metal (e.g., Ni and / or Cu). The material of the underlying electrode 16 may be the same as or different from the material of the internal electrode 9 and / or the dummy electrode 20. In plan view, the position, shape, and dimensions of the underlying electrode 16 are arbitrary. In the examples of FIGS. 2 and 3, the position, shape, and dimensions of the underlying electrode 16 are, in a plan perspective view, generally the same as those of the external electrode 5 without excess or deficiency (however, the external electrode 5 is slightly wider).

[0046] (1.4.2. Thickness) The thickness of the underlying electrode 16 is arbitrary. For example, the thickness of the underlying electrode 16 may be greater than, equal to, or less than the thickness of the internal electrode 9 and / or the dummy electrode 20 (in the illustrated example). For example, the thickness of the underlying electrode 16 may be 2 times or more, 3 times or more, or 5 times or more the thickness of the internal electrode 9 and / or the dummy electrode 20, and may be 20 times or less, 10 times or less, or 5 times or less. The above lower and upper limits may be combined arbitrarily. Also, for example, the thickness of the underlying electrode 16 may be 2.0 μm or more, 3.0 μm or more, or 5.0 μm or more, and may be 20.0 μm or less, 10.0 μm or less, or 5.0 μm or less. The above lower and upper limits may be combined arbitrarily. Also, the thickness of the underlying electrode 16 may be less than, equal to, or greater than the thickness of the insulating layer 17 (in the illustrated example).

[0047] Let the thickness from the -D3 side surface (lower surface) of the underlying electrode 16 on the +D3 side to the +D3 side surface (upper surface) of the underlying electrode 16 on the -D3 side be referred to as the first thickness. In the illustrated example, the first thickness is the total thickness of the effective portion 11 and the covers 13 on both sides thereof. The thickness of the underlying electrode 16 may be, for example, 0.03 times or more, 0.06 times or more, 0.09 times or more the first thickness, and may be 0.20 times or less, 0.17 times or less, or 0.14 times or less. The above lower and upper limits may be combined arbitrarily.

[0048] (1.4.3. Materials) The material of the base electrode 16 may be a metal as described above. In addition to the metal, it may also contain a ceramic material. By including a ceramic material in the base electrode 16, for example, the probability that the base electrode 16 is excessively worn by barrel polishing (described later) is reduced. On the other hand, since the base electrode 16 is not mainly for conduction, even if the electrical resistivity increases due to the ceramic material, the probability of inconvenience is low. Not only the base electrode 16 but also other conductive components (for example, the internal electrode 9 and / or the dummy electrode 20) may contain a ceramic material in addition to the metal.

[0049] In the aspect where the material of the insulating layer 17 of the cover 13 is a ceramic material, even if it is not intended that the material of the base electrode 16 contains a ceramic material, the ceramic material of the insulating layer 17 may diffuse into the base electrode 16. The aspect that the base electrode 16 contains a ceramic material shall not include that due to such diffusion. When the manufacturing process is grasped, it is clear whether the base electrode 16 contains a ceramic material without diffusion. In the finished product, for example, whether the base electrode 16 contains a ceramic material may be determined by whether a ceramic material is contained at a significant volume% or mass% (for example, refer to the lower limit value described later) at a position sufficiently far from the cover 13.

[0050] The specific type of the ceramic material contained in the base electrode 16 is arbitrary. For example, when the dielectric layer 7 of the effective part 11 and / or the insulating layer 17 of the cover 13 are ceramic materials, the ceramic material contained in the base electrode 16 may be the same as any one or both of these ceramic materials (all or the main component) or different. Examples of the ceramic material (all or the main component) include, for example, barium titanate (BaTiO3), titanium dioxide (TiO2), strontium titanate (SrTiO3), calcium titanate (CaTiO3), and calcium zirconate (CaZrO3).

[0051] The volume percentage and / or mass percentage of the ceramic material in the base electrode 16 (hereinafter sometimes referred to as "content ratio") is arbitrary. The content ratio of the ceramic material in the base electrode 16 may be, for example, larger than the content ratio of the ceramic material in the internal electrode 9 and / or the dummy electrode 20. In such a case, the latter content ratio may be 0, and the entire or main component of the former ceramic material and the latter ceramic material may be of the same type or different types. Different from the above, the former content ratio may be equal to or less than the latter content ratio.

[0052] Examples of the content ratio of the ceramic material in the base electrode 16 will be given. For example, the volume percentage may be 10% by volume or more, 20% by volume or more, or 30% by volume or more, and may be 80% by volume or less, 70% by volume or less, or 60% by volume or less. Any combination of the above lower limit and upper limit may be used. Also, the mass percentage may be 3% by mass or more, 5% by mass or more, 10% by mass or more, or 20% by mass or more, and may be 40% by mass or less, 30% by mass or less, or 20% by mass or less. Any combination of the above lower limit and upper limit may be used.

[0053] Incidentally, for the sake of caution, the volume percentage of the ceramic material is the ratio of the volume of the ceramic material to the unit volume of the target electrode (for example, the base electrode 16). Similarly, the mass percentage of the ceramic material is the ratio of the mass of the ceramic material to the unit mass of the target electrode (for example, the base electrode 16). The volume percentage and the mass percentage may be specified from the weighing when manufacturing the electrode material, or may be specified by analyzing the completed capacitor 1. In the latter case, for example, the volume percentage may be specified based on a cross-sectional image obtained at an appropriate magnification by SEM (Scanning Electron Microscope). The mass percentage may be specified based on an analysis using quantitative analysis by XRF (X-ray Fluorescence) or WDX (wavelength dispersive X-ray spectrometry), for example.

[0054] As described above, at the interface between electrodes (e.g., the base electrode 16) and the ceramic layer (e.g., the insulating layer 17) in contact with each other, the latter ceramic material can diffuse into the former material. Regarding such a situation, when specifying the content ratio from the finished product, for example, the content ratio in a region where no diffusion has occurred may be specified as the content ratio in the electrode. When the diffusion also affects the content ratio at a position away from the interface, the content ratio in the range of the central thickness when the thickness of the electrode is divided into three equal parts may be specified as the content ratio in the electrode. In the electrode, the ceramic material may be unevenly distributed, regardless of the influence of the above diffusion. When specifying the content ratio from the finished product, the content ratio may be specified in a wide area and / or a plurality of areas to such an extent that the influence of such uneven distribution can be ignored, and the average value thereof may be specified as the content ratio in the electrode.

[0055] (1.5. External electrode) The external electrode 5 is, for example, basically a layer having a constant thickness. The material of the external electrode 5 is, for example, a metal. The specific type of the metal is arbitrary. For example, all or the main component thereof is a base metal (e.g., Ni and / or Cu). Further, the external electrode 5 may be formed by laminating different materials as required. For example, the external electrode 5 may be formed by laminating Cu, Ni, and Sn from the side of the base electrode 16. The material of the external electrode 5 may be the same as or different from the material of the internal electrode 9, the material of the dummy electrode 20, and / or the material of the base electrode 16.

[0056] As shown in FIG. 1, for example, the external electrode 5 generally covers the four surfaces (upper surface, lower surface, and two side surfaces) of the main body 3 at the corner portion in the plan view of the main body 3. Thereby, the connection between one external electrode 5 and one lead-out electrode 9b is made on the two side surfaces of the main body 3, and it is possible to perform surface mounting on either the upper surface or the lower surface of the capacitor 1. The shape and dimensions of the portions on each surface of the external electrode 5 are arbitrary. Among the external electrodes 5, the planar shape of the portion located on the upper surface or the lower surface of the main body 3 is, for example, rectangular (square in the illustrated example). Also, the planar shape and dimensions of the portion of the external electrode 5 located on the side surface of the main body 3 are, for example, rectangular with the same lateral length as the portion located on the upper surface or the lower surface.

[0057] The thickness of the external electrode 5 is arbitrary. For example, the thickness of the external electrode 5 may be made thicker than the thicknesses of the internal electrode 9, the dummy electrode 20, and the base electrode 16. For example, the thickness of the external electrode 5 may be 1.2 times or more, 2 times or more, or 3 times or more the thickness of the base electrode 16, and may also be 10 times or less, 5 times or less, or 3 times or less. The above lower limit and upper limit may be combined with any others. Also, for example, the thickness of the external electrode 5 may be 3 μm or more, 5 μm or more, or 10 μm or more, and may also be 30 μm or less, 20 μm or less, or 10 μm or less. The above lower limit and upper limit may be combined with any others.

[0058] (2. End portion of the base electrode) (2.1. Edge position of the base electrode) As described with reference to FIG. 4, the edge of the base electrode 16 on the -D1 side is located at the innermost position P1 or on the +D1 side of the innermost position P1 in the D1 direction (hereinafter, may be referred to as "requirement A" for convenience). In the example of FIG. 4, the end face 16c of the base electrode 16 is inclined. In other words, the positions of the edges on the -D1 side of the base electrode 16 are different between the upper surface and the lower surface. Thus, when the position of the edge on the -D1 side of the base electrode 16 differs depending on the position in the D3 direction, the position on the most -D1 side may be referred to as the position of the edge on the -D1 side of the base electrode 16. Note that the position of the edge of the central portion in the D3 direction of the end face 16c may be located most on the -D1 side (see FIG. 7 described later). When the positions of the edges on the -D1 side of the internal electrode 9 are different between the upper surface and the lower surface (when the position of the edge on the -D1 side of the internal electrode 9 differs depending on the position in the D3 direction), conversely, the position on the most +D1 side may be referred to. That is, the establishment of requirement A may be strictly determined.

[0059] Focus on one base electrode 16. The base electrode 16 and the internal electrode 9 (exposed edge 9c) have a length in the D2 direction. Therefore, there are innumerable cross-sections as shown in FIG. 4. Requirement A does not need to be established in all of those cross-sections. For example, requirement A may be established in 1 / 3 or more, 1 / 2 or more, or 2 / 3 or more of the length of the base electrode 16 in the D2 direction. Of course, requirement A may be established over the entire length of the base electrode 16 in the D2 direction.

[0060] Whether requirement A is established within the above-described length range may be determined based on images of a predetermined number (for example, 3, 5, or 10) of D1D3 cross-sections set at equal distances with respect to the length of the base electrode 16 in the D2 direction. When it is difficult to extract images of a plurality of cross-sections from one capacitor 1, images of a plurality of cross-sections may be extracted from a plurality of capacitors 1 of the same type. The cross-sectional images may be acquired at an appropriate magnification by, for example, SEM.

[0061] In the examples of FIGS. 1 to 3, the base electrodes 16 are located at the four corners of the upper and lower surfaces of the main body 3, and a total of eight base electrodes 16 are provided. Requirement A does not need to be satisfied by all of the plurality (eight) of base electrodes 16. Also, each base electrode 16 may satisfy Requirement A in each of the D1 direction and the D2 direction, but it is not necessary for Requirement A to be satisfied in both directions. Therefore, for example, Requirement A may be satisfied only in one direction for only one base electrode 16. Of course, Requirement A may be satisfied in all of the base electrodes 16 and in all directions (limited to those in which Requirement A can be satisfied).

[0062] It has been described that Requirement A does not need to be satisfied in all cross-sections and the like. This description may also be applied to the dimensions and the like described below. The same applies to Requirement B and Requirement C described later and the dimensions and the like described in connection with these. For example, in the above description, the term of Requirement A may be replaced with the term of Requirement B or Requirement C as long as there is no contradiction or the like.

[0063] When the rearmost position P1 (FIG. 4) is the same as the position in the D1 direction of the edge portion on the -D1 side of the base electrode 16, for example, there may be a difference of less than 0.5 μm. Also, the distance (in the D1 direction) between the two when the position in the D1 direction of the edge portion on the -D1 side of the base electrode 16 is located on the +D1 side of the rearmost position P1 is arbitrary. For example, the distance may be 0.5 μm or more, 1 μm or more, or 3 μm or more, and may also be 10 μm or less or 5 μm or less. The above lower limit and upper limit may be combined with any other.

[0064] The degree of difference in the positions in the D1 direction of the exposed edge portions 9c of the plurality of first internal electrodes 9A is arbitrary. For example, the difference between the position of the exposed edge portion 9c located on the most -D1 side (which may be referred to as the "outermost position P2") and the innermost position P1 may be 0.5 μm or more, 1 μm or more, 2 μm or more, or 3 μm or more, and may also be 10 μm or less or 5 μm or less. The above lower limit and upper limit may be combined with each other arbitrarily. Also, the above difference may be 0.05 times or more, 0.1 times or more, or 0.2 times or more with respect to the thickness of the effective portion 11, and may also be 1.0 times or less or 0.5 times or less. The above lower limit and upper limit may be combined with each other arbitrarily.

[0065] In an embodiment where requirement A is satisfied, the edge portion on the -D1 side (an example of the third side) of the base electrode 16 is located on the +D1 side (an example of the fourth side) of the outermost position P2 (hereinafter, may be referred to as "requirement B"). Different from the illustrated example, requirement B may be satisfied even if requirement A is not satisfied. The description related to requirement A may be applied to requirement B as long as there is no contradiction or the like. For the sake of caution, it is described that, for example, the position of the reference edge portion may be selected so that the satisfaction of requirement B becomes strict. Requirement B may be satisfied in 1 / 3 or more, 1 / 2 or more, 2 / 3 or more, or the whole of the length of the base electrode 16 in the D2 direction. Requirement B may be satisfied only in one direction for only one base electrode 16, or may be satisfied for all base electrodes 16 and in all directions.

[0066] The distance in the D1 direction between the outermost position P2 and the edge portion on the -D1 side of the base electrode 16 when requirement B is satisfied is arbitrary. Specific examples of the said distance when requirements A and B are satisfied may be obtained from combinations of specific examples of the distance in the D1 direction between the innermost position P1 and the edge portion on the -D1 side of the base electrode 16 (already described), and specific examples of the degree of difference in the positions in the D1 direction of the plurality of exposed edge portions 9c (already described).

[0067] Also, for example, regardless of whether or not requirement A is satisfied, the distance in the D1 direction between the outermost position P2 and the edge on the -D1 side of the base electrode 16 may be 0.5 μm or more, 1 μm or more, 3 μm or more, or 6 μm or more, and may also be 30 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. The above lower limit and upper limit may be combined with any other arbitrary ones so as not to cause contradictions. Also, for example, the above distance may be 0.01 times or more, 0.05 times or more, 0.10 times or more, or 0.30 times or more of the thickness of the main body portion 3, and may also be 1.5 times or less, 1.0 times or less, 0.50 times or less, 0.30 times or less, 0.20 times or less, or 0.10 times or less. The above lower limit and upper limit may be combined with any other arbitrary ones so as not to cause contradictions.

[0068] (2.2. Example of the shape of the side surface of the main body portion) In the example shown in FIG. 4, as described above, the end face 11c of the effective portion 11 has a concave portion 11d, and as a result, at least a part (two or more) of the plurality of first internal electrodes 9A have different positions in the D1 direction of the exposed edge portions 9c. More specifically, the side surface (including the end face 11c) of the main body portion 3 has a shape such that the ridge line portion with the upper and lower surfaces is chamfered by a curved surface. And a concave portion 11d is located between the upper and lower chamfered surfaces (between the convex portions from another perspective). Due to the above chamfered surfaces, the edges of the base electrode 16 have different positions in the D1 direction on the upper and lower surfaces (the end face 16c connecting the two is inclined), as described above.

[0069] The specific shapes and dimensions of the concave portion 11d and the chamfered surfaces are arbitrary. For example, the shapes of the upper and lower chamfered surfaces may be asymmetric, and the concave portion 11d may also be vertically asymmetric. That is, the side surface of the main body portion 3 may have an asymmetric shape in the vertical direction. In the illustrated example, in the side surface of the main body portion 3, the region on the +D3 side is located more on the -D1 side than the region on the -D3 side. Of course, the side surface of the main body portion 3 may be symmetric with respect to a symmetry axis parallel to the D1 direction passing through the center of the main body portion 3 in the vertical direction. The concave portion 11d may be entirely curved and concave in a cross-sectional view (illustrated example), or may include a linear portion in part or most of it.

[0070] Also, for example, the position in the D3 direction at the top of the portion bulging toward the -D1 side among the side surfaces of the main body portion 3 may be located at the boundary between the effective portion 11 and the cover 13, may be located on the cover 13, or may be located on the effective portion 11. Also, for example, the concave portion 11d may include the central portion in the D3 direction of the end face 11c. Also, for example, the innermost portion of the concave portion 11d may be located at the center in the D3 direction of the end face 11c, or may be deviated from the center. The concave portion 11d may extend, for example, over 1 / 2 or more or 2 / 3 or more of the length of the end face 11c in the D3 direction.

[0071] FIG. 5 is a cross-sectional view showing another example of the shape of the end face 11c (and the side surface of the main body portion 3) of the effective portion 11, and corresponds to FIG. 4.

[0072] In the example of FIG. 5, the end face 11c has a convex portion 11e bulging toward the -D1 side. As a result, at least a part (two or more) of the plurality of first internal electrodes 9A have different positions in the D1 direction of the exposed edge portions 9c. More specifically, the side surface of the main body portion 3 (including the end face 11c) has a shape such that the ridge line portion with its upper and lower surfaces is chamfered by a curved surface and exhibits a convex shape. Also, the portion between the upper and lower chamfered surfaces also exhibits a convex shape bulging toward the -D1 side. The end face 11c has the convex portion 11e because the upper and lower regions are located on the above-mentioned chamfered surfaces and / or the central region is located on the convex surface between the chamfered surfaces.

[0073] Unlike the illustrated example, the area between the upper and lower chamfered surfaces may be planar. And the end face 11c may have a convex portion 11e when the regions on both the upper and lower sides are located on the above-mentioned chamfered surfaces. (From another perspective, the top surface of the convex portion 11e may be planar.) The chamfered surfaces may be located above or below the end face 11c, and the convex portion 11e may be constituted only by the convex surface between the chamfered surfaces. The upper and lower chamfered surfaces and the convex surface therebetween may or may not be distinguishable from each other due to differences in their radii of curvature, etc. In the former case, the radius of curvature of the convex surface between the upper and lower chamfered surfaces may be larger (illustrated example) or smaller than the radius of curvature of the chamfered surfaces. In the latter case, a concave portion may be formed between the chamfered surface and the convex surface.

[0074] The specific shape, dimensions, etc. of the convex portion 11e (chamfered surface and / or the surface therebetween) are arbitrary. For example, the side surfaces of the main body portion 3 may be symmetric (illustrated example) or asymmetric in the up and down shape. Also, for example, the convex portion 11e may include the central portion of the end face 11c in the D3 direction. Also, for example, the top of the convex portion 11e may be located at the center of the end face 11c in the D3 direction or may be offset from the center. The convex portion 11e may extend, for example, over 1 / 2 or more or 2 / 3 or more of the length of the end face 11c in the D3 direction.

[0075] Regarding the specific dimensions of the depth of the concave portion 11d and the height of the convex portion 11e, for example, the description of the specific examples of the degree of difference in the position in the D1 direction of the exposed edge portion 9c of the internal electrode 9 described above may be incorporated.

[0076] (2.3. Inclination of the End Face of the Base Electrode) As described above, in FIG. 4 or FIG. 5, the end face 16c on the -D1 side of the base electrode 16 on the +D3 side is inclined with respect to the D3 direction in such a way that it is located more on the +D1 side toward the +D3 side (hereinafter sometimes referred to as "requirement C"). When referring to this, strictly speaking, the entire end face 16c (from the ridge line with the upper surface to the ridge line with the lower surface) does not necessarily have to be inclined in the D3 direction. For example, due to the -D1 side edge (corner) of the lower surface of the base electrode 16 on the +D3 side being rounded, the inclination in the above-mentioned direction may not occur in the vicinity of the edge. For example, if an inclined surface is formed over 60% or more (more than half) or 80% or more (most) of the thickness of the base electrode 16 (the thickness of the portion with a constant thickness), requirement C may be considered to be satisfied. Of course, the entire end face 16c may be inclined (excluding inevitable roundness, etc. in terms of manufacturing when viewed microscopically).

[0077] In the examples of FIGS. 4 and 5, at least a part (all in the illustrated example) of the end face of the cover 13 on the side of the base electrode 16 is inclined. The surface (lower surface or upper surface) of the base electrode 16 on the side of the cover 13, for example, does not overlap with such an inclined end face of the cover 13, and overlaps only with the surface (upper surface or lower surface) of the cover 13 on the side of the base electrode 16. And the base electrode 16 has an inclined end face 16c by becoming thinner toward the end portion side. In other words, the inclined surface of the end face 16c is not constituted by the end portion with a constant thickness of the base electrode 16 overlapping with the inclined end face of the cover 13 and inclining.

[0078] More specifically, for example, the position in the D1 direction of the edge of the surface of the base electrode 16 on the side of the cover 13 is the same as (the illustrated example) or located inside (on the +D1 side in FIGS. 4 and 5) with respect to the position in the D1 direction of the edge of the surface of the cover 13 on the side of the base electrode 16. Note that the above-mentioned "same" may have a relatively small difference. The difference may be, for example, 1 / 5 or less, 1 / 10 or less, or 1 / 20 or less of the length of the end face 16c in the D1 direction, and / or 5 μm or less, 2 μm or less, or 1 μm or less.

[0079] From another perspective, the inclined surface of the end face of the cover 13 and the end face 16c (inclined surface) of the base electrode 16 are smoothly connected. In other words, both of them together constitute the chamfered surface (described above) of the main body portion 3. Different from the illustrated example, for example, only the end face 16c of the base electrode 16 may constitute the chamfered surface of the main body portion 3.

[0080] As can be understood from the above description regarding the chamfered surface of the ridge line portion between the side surface and the upper surface (or lower surface) in the main body portion 3, the specific shape, dimensions, etc. of the end face 16c of the base electrode 16 are arbitrary. For example, in a cross-sectional view as shown in FIGS. 4 and 5, the end face 16c may be linearly shaped as a whole, may be bulged as a whole, or may be recessed as a whole. Also, the end face 16c may include only one or more linear portions, may include only one or more curved portions, or may include both. Further, the end face 16c may have a plurality of convex portions (corners) and / or a plurality of concave portions.

[0081] In a cross-sectional view as shown in FIGS. 4 and 5, let the inclination angle of the end face 16c with respect to the D1 direction (the upper surface and the lower surface from another perspective) be θ. The magnitude of the inclination angle θ is arbitrary. For example, the inclination angle θ may be greater than 3°, greater than 5° or greater than 10°, and may also be less than 80°, less than 45°, less than 30° or less than 20°. Any combination of the above upper and lower limits may be used.

[0082] As described above, the end face 16c is not limited to being linear in a cross-sectional view as shown in FIGS. 4 and 5. That is, the inclination angle (for example, the inclination angle of the tangent line) can vary according to the position within the end face 16c. Therefore, the inclination angle θ (the angle when simply referred to as the inclination angle of the end face 16c) here may be specified as follows.

[0083] In the description here, attention is paid to the base electrode 16 on the +D3 side in FIGS. 4 and 5. The intersection of the end face 16c and the -D3 side surface of the base electrode 16 is defined as the first position. In the base electrode 16, the thickness of the portion with a constant thickness (i.e., the portion away from the end face 16c) is defined as the reference thickness. In the end face 16c, the position where the height from the -D3 side surface of the base electrode 16 becomes 80% of the reference thickness is defined as the second position. Assume a straight line connecting the first position and the second position. The angle formed by this straight line and the D1 direction (the upper and lower surfaces of the base electrode 16) is defined as the inclination angle θ.

[0084] The reason for not defining the intersection of the end face 16c and the +D3 side surface of the base electrode 16 as the second position is as follows. The end face 16c may extend in a curved shape so as to approach parallel to the D1 direction more on the +D3 side and be smoothly connected to the +D3 side surface of the base electrode 16. In such a case, it is difficult to specify the above intersection, or the inclination angle θ when the above intersection is defined as the second position becomes too small compared to the inclination angles of most parts of the end face 16c. By defining the position at the height of 80% of the reference thickness as the second position, such inconveniences can be avoided. When there are fluctuations in the thickness of the base electrode 16 due to the surface roughness, etc. of the base electrode 16, the reference thickness may be the average thickness.

[0085] (3. Method for manufacturing a capacitor) The method for manufacturing the capacitor 1 may be various methods. For example, the general procedure thereof may be the same as a known procedure. An example is shown below.

[0086] First, a ceramic green sheet to become the dielectric layer 7 and the insulating layer 17 is produced. Next, a conductive paste to become the internal electrode 9, the dummy electrode 20, or the base electrode 16 is applied (e.g., printed) on the ceramic green sheet. Next, the ceramic green sheets are laminated to produce a laminate that becomes the main body portion 3. Note that the lamination of the laminate that becomes the effective portion 11 and the lamination of the portion that becomes the cover 13 for the laminate may be performed together or separately.

[0087] Up to the production of the above laminate, for example, it is carried out with the size of a mother substrate on which a large number of a plurality of main body parts 3 are taken. After the production of the laminate, the mother substrate including the laminate is fragmented (for example, cut) into a size corresponding generally to the size of the main body part 3. Next, the laminate having the size of the main body part 3 is fired. Thereafter, a metal film is formed on the main body part 3 to form the external electrode 5.

[0088] Debinding may be performed before firing. The firing may be carried out, for example, in a reducing atmosphere. A re-oxidation heat treatment may be performed after firing. Before and / or after firing, polishing (for example, barrel polishing) of the main body part 3 may be performed. In the polishing, for example, the ridge line part of the main body part 3 may be chamfered or the side surface of the main body part 3 may be polished.

[0089] The method of making the end face 11c of the effective part 11 non-planar (making the positions of the exposed edge parts 9c of the plurality of internal electrodes 9 in the D1 direction different from each other) is arbitrary. For example, by chamfering the ridge line of the main body part 3 by the above polishing (for example, barrel polishing), inclined surfaces may be formed on both the upper and lower sides of the end face 11c. Also, for example, by making the ratio of the thickness (or volume) of the conductive paste (internal electrode 9) in the effective part 11 larger than the ratio of the thickness (or volume) of the conductive paste (dummy electrode 20) in the cover 13, the effective part 11 is shrunk in the D1 direction more than the cover 13 during firing, and a concave part 11d may be formed on the end face 11c. Also, for example, by locally removing the side surface of the main body part 3 by a blasting treatment (for example, sand blasting treatment) or a treatment using a laser or the like, a concave part 11d or a convex part 11e may be formed.

[0090] It is also optional to position the edge of the underlying electrode 16 on the -D1 side (outer side) closer to the +D1 side (inner side) than the innermost position P1. For example, by chamfering the ridge line of the main body 3 through the above-mentioned polishing (e.g., barrel polishing), the edge of the underlying electrode 16 may be positioned inward. Also, for example, by making the underlying electrode 16 (conductive paste) relatively thick and causing the underlying electrode 16 to shrink in the D1 direction more than the effective portion 11 and the cover 13 during firing, the edge position of the underlying electrode 16 may be positioned inward. Further, for example, when applying the conductive paste that becomes the underlying electrode 16 to the ceramic green sheet that becomes the insulating layer 17, the edge of the underlying electrode 16 may be positioned inward in advance. Also, for example, by trimming the edge of the underlying electrode 16 before or after firing by means of a blasting process (e.g., sandblasting process) or a process using a laser, etc., the edge may be positioned inward.

[0091] The external electrode 5 may be formed by various methods. For example, metal may be deposited on the surface and the exposed edge 9c of the underlying electrode 16 by electroless plating and / or electroplating. Also, for example, a thin film forming method such as the dip method, the printing method, CVD (Chemical Vapor Deposition), or PVD (Physical Vapor Deposition) may be employed. As understood from the above, the underlying electrode 16 may or may not contribute to the deposition of metal.

[0092] (4. Configuration of Capacitor According to Another Embodiment) FIG. 6 is a perspective view of a capacitor 201 according to the second embodiment. FIGS. 3 to 5 according to the first embodiment may be referred to as cross-sectional views of the capacitor 201.

[0093] Generally speaking, the capacitor 201 is different from the capacitor 1 of the 4-terminal type in that it is of the 2-terminal type. Also in such a capacitor 201, as described with reference to FIGS. 3 to 5, the edge on the -D1 side of the underlying electrode 16 may be located at the innermost position P1 or may be located closer to the +D1 side than the innermost position P1.

[0094] The specific shape and dimensions of each part of the capacitor 201 may be different from those of the capacitor 1 according to the fact that it is a two-terminal type. Specifically, it is as follows.

[0095] The shape of the main body 203 (or the capacitor 201) is, for example, generally a rectangular parallelepiped. This rectangular parallelepiped may have, for example, a height (length in the D3 direction) equal to the width (length in the D2 direction) (illustrated example), or may be smaller. The length (in the D1 direction) of the rectangular parallelepiped is, for example, larger than the width. The dimensions of the main body 203 are arbitrary. As long as the length in the D1 direction is longer than the length in the D2 direction, the specific examples of the dimensions of the main body 3 of the first embodiment may be applied to the dimensions of the main body 203. The external electrodes 5 are generally in a layer-like form covering the longitudinal end portions of the main body 203 over five faces of the rectangular parallelepiped.

[0096] The planar shape of the internal electrode 9 is, for example, generally a rectangle having four sides parallel to the four sides of the rectangle of the main body 203 (dielectric layer 7). Of the four sides of the internal electrode 9, two long sides and one short side are, for example, located inside the side surface of the main body 203 (not exposed). The remaining one short side is exposed from the side surface on the +D1 side or -D1 side of the main body 203 to form an exposed edge portion 9c. The region of the internal electrode 9 that overlaps with other internal electrodes 9 in a planar perspective is the electrode main body 9a. The portion extending from the electrode main body 9a to the external electrode 5 is the lead-out electrode 9b.

[0097] Each dummy layer 19 has, for example, two dummy electrodes 20 at both longitudinal ends of the main body 203. The planar shape of the dummy electrode 20 is, for example, a rectangular shape extending over the entire width (length in the D2 direction) of the main body 203, and is, for example, exposed from the side surface on the +D1 side or -D1 side of the main body 203, and is also exposed from the side surfaces on the +D2 side and -D2 side. The description of the configuration of the dummy layer 19 (dummy electrode 20) in a plan view may be applied to the configuration of the underlayer 15 (underlayer electrode 16) in a plan view.

[0098] Although not particularly shown, other examples of the configuration of the capacitor will be given.

[0099] The capacitor may have an outer packaging resin covering the entire structure illustrated in FIG. 1 or FIG. 6, and lead wires connected to the external electrodes 5 and extending from the outer packaging resin. From another perspective, the capacitor may not be a surface mount type but a through-hole mount type. In such an embodiment, one external electrode 5 may only cover one side surface.

[0100] The two types of internal electrodes 9 connected to different external electrodes 5 may be alternately laminated two by two instead of one by one. In this case, for example, the thickness of the dielectric layer 7 between the internal electrodes 9 connected to the same external electrode 5 and facing each other may be made thinner than the thickness of the dielectric layer 7 between the internal electrodes 9 connected to different external electrodes 5 and facing each other. As can be understood from this, the plurality of dielectric layers 7 do not have to have the same shape and size as each other.

[0101] Also, the two types of internal electrodes 9 connected to different external electrodes 5 do not have to face each other. For example, the two types of internal electrodes 9 connected to different external electrodes 5 are provided in the same layer, and internal electrodes 9 facing the two types of internal electrodes 9 are provided, so that a circuit in which two parallel plate capacitors are connected in series may be configured. Also, a circuit in which three or more parallel plate capacitors are connected in series may be configured.

[0102] In the example of FIG. 6, among the edge portions of the internal electrode 9, the portions other than the exposed edge portion 9c (referred to as "non-exposed edge portions" in this paragraph) are not exposed from the side surface of the main body portion 203. This non-exposed edge portion is covered by a portion of the dielectric layer 7 and the insulating layer 17 that extends outward from the non-exposed edge portion. However, the non-exposed edge portion may be covered by overlapping another dielectric layer on the side surface of the laminate composed of the dielectric layer 7 and the insulating layer 17 so as not to be exposed. From another perspective, the entire main body portion 203 does not have to be a laminated structure.

[0103] (5. Summary of the Embodiment) In the following description, for convenience, the reference numerals of the first embodiment are used. However, the matters described below are the same for other embodiments as long as there is no contradiction or the like.

[0104] The multilayer electronic component (capacitor 1) has an effective portion 11, a first cover (for example, the cover 13 on the +D3 side), and a first base electrode (for example, the base electrode 16 on the +D3 side). The effective portion 11 has dielectric layers 7 and internal electrodes 9 alternately laminated in the lamination direction (D3 direction). The cover 13 on the +D3 side overlaps the effective portion 11 from the +D3 side among the first side (for example, the +D3 side) and the second side (for example, the -D3 side) in the D3 direction. The base electrode 16 on the +D3 side overlaps the cover 13 on the +D3 side from the +D3 side. The effective portion 11 has an end face 11c facing the -D1 side among the third side (for example, the -D1 side) and the fourth side (+D1 side) in the first direction (for example, the D1 direction) intersecting the D3 direction. The plurality of internal electrodes 9 includes two or more internal electrodes (for example, the first internal electrode 9A) each having an exposed edge portion 9c exposed from the end face 11c. At least a part (two or more) of the plurality of exposed edge portions 9c have different positions in the D1 direction. The base electrode 16 on the +D3 side is located in a region on the -D1 side (from the center) of the +D3 side surface of the cover 13 on the +D3 side (that is, the -D1 side edge of the base electrode 16 described below is not the edge on the D1 direction center side of the base electrode 16 located in the +D1 side region of the cover 13). Let the position of the one located most on the +D1 side among the plurality of exposed edge portions 9c be referred to as the innermost position P1. At this time, the -D1 side edge of the base electrode 16 on the +D3 side is located at the same position as the innermost position P1 or on the +D1 side of the innermost position P1 (the above-mentioned "requirement A" is satisfied).

[0105] Therefore, for example, as described in the outline of the embodiment, the probability of forming the protrusion 5z on the external electrode 5 is reduced. Specifically, for example, it is as follows.

[0106] FIG. 7 is a cross-sectional view showing a capacitor according to a comparative example, corresponding to FIGS. 4 and 5. Unlike the capacitor 1 according to the embodiment, the edge portion of the base electrode 16 on the -D1 side is located on the -D1 side with respect to the innermost position P1. That is, requirement A is not satisfied.

[0107] Note that, in the capacitor according to the comparative example, the dummy electrode 20 is not provided, and the cover 13 is constituted only by the insulating layer 17. Also, the cover 13 and the base electrode 16 are relatively thinner compared to FIGS. 4 and 5. Since the cover 13 is thin, the thickness of the entire main body portion 3 is also thin. As a result, chamfering is difficult to be performed by barrel polishing. Also, since the dummy electrode 20 is not provided and the base electrode 16 is thin, the force applied to the insulating layer 17 due to the shrinkage of the conductive paste during firing is small. For the above reasons, it is difficult to satisfy requirement A.

[0108] When requirement A is not satisfied, the edge portion of the base electrode 16 on the -D1 side is likely to form the sharp ridge line portion of the main body portion 3. As a result, the metal serving as the external electrode 5 adheres not only to the +D3 side and the -D1 side but also to the -D3 side with respect to the edge portion of the base electrode 16. Further, when electrolytic plating is used, the amount of metal deposition increases due to electric field concentration. Due to such circumstances, the external electrode 5 is likely to become thick. As a result, the protrusion 5z is likely to be formed. The protrusion 5z protrudes, for example, laterally (the -D1 side in FIG. 7) and / or upward or downward with respect to the other portion of the external electrode 5.

[0109] If the protruding portion 5z protrudes laterally, for example, depending on the specific method of alignment, the probability of an alignment error increases. Also, if the protruding portion 5z protrudes upward or downward, for example, when the suction nozzle picking up the capacitor 1 is lowered toward a circuit board (not shown), due to the protruding portion 5z, the probability that the external electrode 5 receives an unintended force from the circuit board (or the bonding material therebetween) increases. And / or, the reaction force received by the external electrode 5 from the circuit board via the bonding material (e.g., solder) becomes relatively large at the protruding portion 5z. As a result, for example, the probability of cracks occurring near the protruding portion 5z increases.

[0110] However, in the capacitor 1 according to the embodiment, since the requirement A is satisfied, the probability of forming the protruding portion 5z is reduced, and thus the probability of the above-mentioned inconveniences occurring is reduced.

[0111] In the above, the effects related to the external electrode 5 were exemplified, but other effects are also exhibited. For example, when the requirement A is satisfied, the probability that the edge portion on the -D1 side of the base electrode 16 constitutes the sharp ridge line portion of the main body portion 3 is reduced, so the probability that stress concentrates on the edge portion on the -D1 side of the base electrode 16 is reduced, and thus the strength of the main body portion 3 is improved. Also, for example, the force applied in the D3 direction to the edge portion on the -D1 side of the base electrode 16 will be supported by all the internal electrodes 9 (and the dielectric layer 7). From this perspective as well, the strength of the main body portion 3 is improved.

[0112] The capacitor 1 may further include a second cover (e.g., the cover 13 on the -D3 side) and a second base electrode (e.g., the base electrode 16 on the -D3 side). The cover 13 on the -D3 side may overlap the effective portion 11 from the second side (-D3 side). The base electrode 16 on the -D3 side may overlap the cover 13 on the -D3 side from the second side (-D3 side). The thickness from the surface on the first side (+D3 side) of the base electrode 16 on the +D3 side to the surface on the -D3 side of the base electrode 16 on the -D3 side (the thickness of the main body portion 3) may be 0.2 mm or less.

[0113] In this case, for example, since the main body portion 3 is relatively thin, it becomes difficult to chamfer the ridge line portion of the main body portion 3 by barrel polishing. As a result, the ridge line portion of the main body portion 3 is likely to have a sharp shape. Consequently, the probability that the protrusion 5z is formed on the external electrode 5 or stress concentration occurs at the ridge line portion of the main body portion 3 increases. That is, the demand for the effect according to requirement A is high. In other words, requirement A is useful.

[0114] The total thickness of the cover 13 on the +D3 side and the base electrode 16 on the +D3 side may be 10% or more of the thickness from the +D3 side surface of the base electrode 16 on the +D3 side to the -D3 side surface of the base electrode 16 on the -D3 side (the thickness of the main body portion 3).

[0115] In this case, for example, since the thickness of the cover 13 is relatively thick, the thickness of the main body portion 3 can be made thicker compared to the thickness of the effective portion 11. As a result, for example, it becomes easier to chamfer the ridge line portion of the main body portion 3 by barrel polishing. Consequently, it becomes easier to satisfy requirement A.

[0116] The thickness of the base electrode 16 on the +D3 side may be 1 / 2 or less of the thickness of the cover 13 on the +D3 side.

[0117] In this case, for example, since the thickness of the base electrode 16 is relatively thin, the size of the ridge line portion of the edge of the base electrode 16 also becomes relatively small. Consequently, the influence of the ridge line portion of the base electrode 16 on the formation of the external electrode 5 is reduced, and in combination with the effect according to requirement A, the probability that an unintended protrusion 5z is formed on the external electrode 5 is reduced.

[0118] As shown in FIG. 4, the end face 11c may have a concave portion 11d that is recessed toward the fourth side (+D1). At least a part of the plurality of exposed edge portions 9c may be located in the concave portion 11d so that their positions in the first direction (D1 direction) are different from each other.

[0119] In this case, for example, the ridge line portion of the main body portion 3 is likely to have a sharp shape due to the concave portion 11d. As a result, the probability that the protrusion 5z is formed or stress concentration occurs in the ridge line portion of the main body portion 3 becomes high. That is, the demand for the effect according to requirement A is high. In other words, requirement A is useful. Further, by having the concave portion 11d, the film formation area of the external electrode 5 can be increased without increasing the outer size, so that the reliability of the connection between the external electrode 5 and the internal electrode 9 can be improved.

[0120] As shown in FIG. 5, the end face 11c may have a convex portion 11e that bulges toward the third side (-D1 side). At least a part of the plurality of exposed edge portions 9c may have different positions in the first direction (D1 direction) by being located at the convex portion 11e.

[0121] In this case, for example, due to the combination of the convex portion 11e and requirement A, the surface from the end face 11c to the edge of the base electrode 16 via the side face of the cover 13 (the side face of the main body portion 3) is likely to have a smooth curved shape that bulges outward. As a result, a metal layer (for example, the external electrode 5) is likely to be formed on the side face of the main body portion 3. Consequently, the reliability of the connection between the external electrode 5 and the internal electrode 9 is improved.

[0122] The capacitor 1 may further have an external electrode 5 that overlaps the base electrode 16 on the +D3 side from the +D3 side and overlaps the end face 11c and contacts the exposed edge portion 9c.

[0123] In this case, for example, since the external electrode 5 is directly formed on the end face 11c without forming a base electrode on the end face 11c, the configuration and manufacturing process are simplified. The fact that no base electrode is provided on the end face 11c means that the side face of the main body portion 3 on the -D1 side shifts to the +D1 side (up to the position of the end face 11c) by the thickness of the base electrode. From another perspective, the edge portion of the base electrode 16 on the -D1 side approaches the side face of the main body portion 3 on the -D1 side. As a result, the ridge line portion of the main body portion 3 is likely to become sharp. That is, the demand for the effect according to requirement A is high. In other words, requirement A is useful. Note that an aspect of forming a base electrode on the end face 11c may also be included in the technology according to the present disclosure.

[0124] The cover 13 may include a plurality of insulating layers 17 laminated in the lamination direction (D3 direction) and dummy electrodes 20 positioned between the plurality of insulating layers 17.

[0125] According to Requirement A, for example, the base electrode 16 moves away from the side surface of the cover 13. As a result, for example, there is a possibility that the strength of the cover 13 decreases and / or the adhesion of the external electrode 5 to the side surface of the cover 13 decreases. However, the provision of the dummy electrodes 20 can compensate for such inconveniences.

[0126] Let the maximum length of the effective portion 11 in the first direction (D1 direction) be L. Let the maximum length of the effective portion 11 in the second direction (D2 direction) orthogonal to the lamination direction (D3 direction) and the D1 direction be W. At this time, each of L and W may be 0.030 mm or more and 0.200 mm or less. L / W may be 0.5 or more and 2.0 or less. Note that in the embodiment, L and W of the effective portion 11 are generally the same as L and W of the main body portion 3.

[0127] In this case, for example, since L and W are relatively small, it is difficult to chamfer the ridge line portion formed by the side surfaces of the main body portion 3 by barrel polishing. As a result, the corner portion where the ridge line portion formed by the side surfaces intersects with the ridge line portion formed by the upper surface (or lower surface) and the side surface is likely to have a sharp shape. As a result, the probability that the protrusion 5z is formed on the above corner portion or stress concentration occurs at the above corner portion increases. That is, the demand for the effect of Requirement A is high. In other words, Requirement A is useful.

[0128] From another perspective, the multilayer electronic component (capacitor 1) according to the embodiment has an effective portion 11, a first cover (for example, the cover 13 on the +D3 side), and a first base electrode (for example, the base electrode 16 on the +D3 side). The effective portion 11 has dielectric layers 7 and internal electrodes 9 that are alternately laminated in the lamination direction (D3 direction). The cover 13 on the +D3 side overlaps the effective portion 11 from the +D3 side among the first side (for example, the +D3 side) and the second side (for example, the -D3 side) in the D3 direction. The base electrode 16 on the +D3 side overlaps the cover 13 on the +D3 side from the +D3 side. The effective portion 11 has an end face 11c facing the -D1 side among the third side (for example, the -D1 side) and the fourth side (+D1 side) in the first direction (for example, the D1 direction) intersecting the D3 direction. The plurality of internal electrodes 9 includes two or more internal electrodes (for example, the first internal electrode 9A) each having an exposed edge portion 9c exposed from the end face 11c. The base electrode 16 on the +D3 side is located in a region on the -D1 side (from the center) of the +D3 side surface of the cover 13 on the +D3 side (that is, the -D1 side edge of the base electrode 16 described below is not the edge on the D1 direction center side of the base electrode 16 located in the +D1 side region of the cover 13). The -D1 side first end face (end face 16c) of the base electrode on the +D3 side is inclined in the D1 direction with the orientation of being located more on the +D1 side toward the +D3 side (the above-mentioned "requirement C" is satisfied).

[0129] Therefore, for example, as described in the overview of the embodiment, the probability of forming the protrusion 5z on the external electrode 5 is reduced. Specifically, for example, compared with the aspect where the end face 16c is parallel to the D3 direction or the aspect where it is inclined in the opposite direction to the embodiment with respect to the D3 direction, the ridge line portion of the main body portion 3 is less likely to become sharp. As a result, by the same or similar action as when requirement A is satisfied, the probability of forming the protrusion 5z is reduced. Further, since the ridge line portion of the main body portion 3 is less likely to become sharp, the formed plating thickness can be made uniform, and as a result, the external electrode 5 can be formed with a uniform thickness.

[0130] Further, for example, the fact that the end face 16c of the base electrode 16 on the +D3 side is inclined as described above means that when considered with reference to the intersection of the end face 16c and the upper surface of the base electrode 16 (the surface on the +D3 side), the lower surface of the base electrode 16 approaches the exposed edge portion 9c of the internal electrode 9 (and the edge portion of the dummy electrode 20). As a result, the plating layer deposited at the exposed edge portion 9c and the plating layer deposited at the base electrode 16 are likely to be connected. Thereby, for example, the necessity of providing an underlayer on the end face 16c is reduced (however, such an underlayer may be provided). Further, since the plating layer deposited at the exposed edge portion 9c is likely to grow up to the lower surface of the base electrode 16, the plating deposition time can also be shortened. On the other hand, compared with the aspect of thinning the entire base electrode 16, the strength of the base electrode 16 can be ensured.

[0131] The inclination angle θ of the first end face (end face 16c) with respect to the first direction (D1 direction) may be made smaller than 45°.

[0132] In this case, for example, since it can be said that the end face 16c is sufficiently inclined with respect to the D3 direction, the above-described effects are improved.

[0133] The inclination angle θ may be made larger than 5°.

[0134] In this case, for example, in the length range of the end face 16c in the D1 direction, an aspect in which a thin portion extends over a relatively long range in the D1 direction is avoided. As a result, for example, the effect of reinforcing the main body portion 3 by the base electrode 16 is improved.

[0135] The first base electrode (the base electrode 16 on the +D3 side) may be made thicker than the internal electrode 9.

[0136] In this case, for example, it becomes easier to incline the end face 16c. Specifically, in the length range of the end face 16c in the D1 direction, the smaller the inclination angle θ, the smaller the change in the thickness of the base electrode 16 with respect to the change in the position in the D1 direction. When the base electrode 16 is thin, it is difficult to realize such a minute change in the thickness of the base electrode 16. Since the base electrode 16 is thick, it becomes easy to realize an arbitrary inclination angle θ. Further, for example, since the base electrode 16 is thicker than the internal electrode 9, while increasing the density of the lamination of the plurality of internal electrodes 9 to increase the capacitance, the strength of the capacitor 1 can be improved by the base electrode 16.

[0137] The capacitor 1 may have a second cover (-D3 side cover 13) that overlaps the effective portion 11 from the second side (-D3 side). The thickness of the first base electrode (+D3 side base electrode 16) may be 0.06 times or more the thickness from the surface on the first side (+D3 side) of the first cover (+D3 side cover 13) to the surface on the -D3 side of the -D3 side cover 13.

[0138] In this case, for example, in the same manner as above, it becomes easier to realize an arbitrary inclination angle θ (particularly a small value). Further, for example, since the thickness of the base electrode 16 is relatively increased, it becomes easier to secure the thickness of the main body portion 3, and it becomes easier to chamfer the ridge line portion of the main body portion 3 by barrel polishing. As a result, it becomes easier to incline the end face 16c.

[0139] The base electrode 16 may contain a ceramic material.

[0140] In this case, for example, the strength of the base electrode 16 against polishing or the like is improved. As a result, for example, the probability that the base electrode 16 is excessively shaved when barrel polishing is performed is reduced. For example, if the strength of the base electrode 16 against polishing is low, the end portion of the base electrode 16 may be shaved over the entire thickness, and there is a possibility that an inclined surface is not formed on the end face 16c. The probability of such inconvenience can be reduced.

[0141] The volume percentage of the ceramic material in the base electrode 16 may be made larger than the volume percentage of the ceramic material in the internal electrode 9 (which may be 0 volume %).

[0142] In this case, for example, regarding the base electrode 16, while obtaining the above-described effects, regarding the internal electrode 9, the conductivity can be improved to improve the electrical characteristics of the capacitor 1.

[0143] At least a part of the plurality of exposed edge portions 9c may have different positions in the first direction (D3 direction). Let the position of the one located on the most third side (-D1 side) among the plurality of exposed edge portions 9c be referred to as the outermost position P2. At this time, the edge portion on the -D1 side of the base electrode 16 may be located on the fourth side (+D1 side) with respect to the outermost position P2 (the above-described requirement B may be satisfied).

[0144] In this case, for example, the probability of forming the protrusion 5z is reduced by the same or similar action as in the aspect where the above-described requirement A is satisfied. The above effect is improved by the combination of requirement B and the inclination of the end face 16c of the base electrode 16.

[0145] The technology according to the present disclosure is not limited to the above embodiments and may be implemented in various aspects.

[0146] For example, the multilayer electronic component is not limited to a capacitor. For example, in the multilayer electronic component, a part of the plurality of internal electrodes may be configured to form a capacitor, and the other part of the plurality of internal electrodes may be configured to form an inductor or a resistor. And the multilayer electronic component may form an appropriate circuit (for example, a resonance circuit) as a whole. Further, the cover, the base electrode, and the external electrode may be provided only on one of the upper surface and the lower surface of the effective portion.

[0147] The following concepts may be extracted from the present disclosure. (Concept 1) An effective portion having dielectric layers and internal electrodes laminated alternately in the lamination direction, A first cover that overlaps from the first side among the first side and the second side in the stacking direction with respect to the effective portion; A first base electrode that overlaps the first cover from the first side; and has The effective portion has an end face facing the third side among the third side and the fourth side in the first direction intersecting the stacking direction. The plurality of internal electrodes include two or more internal electrodes each having an exposed edge portion exposed from the end face. At least a part of the plurality of exposed edge portions have different positions in the first direction from each other. The first base electrode is located in a region of the third side on the first side surface of the first cover. When the position of the one located farthest on the fourth side among the plurality of exposed edge portions is referred to as the deepest position, the edge portion of the third side of the first base electrode is located at the same position as the deepest position or on the fourth side of the deepest position. A multilayer electronic component. (Concept 2) The first end face of the third side of the first base electrode is inclined with respect to the stacking direction in a direction where it is located on the fourth side as much as the first side. The multilayer electronic component according to Concept 1. (Concept 3) An effective portion having a dielectric layer and an internal electrode alternately stacked in the stacking direction; A first cover that overlaps from the first side among the first side and the second side in the stacking direction with respect to the effective portion; A first base electrode that overlaps the first cover from the first side; and has The effective portion has an end face facing the third side among the third side and the fourth side in the first direction intersecting the stacking direction. The plurality of internal electrodes include two or more internal electrodes each having an exposed edge portion exposed from the end face. The first base electrode is located in a region of the third side on the first side surface of the first cover. The first end face on the third side of the first base electrode is inclined with respect to the lamination direction in a direction where it is located closer to the fourth side as it is closer to the first side. Stacked electronic component. (Concept 4) A second cover overlapping the effective part from the second side, A second base electrode overlapping the second cover from the second side, and has The thickness from the surface on the first side of the first base electrode to the surface on the second side of the second base electrode is 0.2 mm or less. The stacked electronic component according to any one of Concepts 1 to 3. (Concept 5) A second cover overlapping the effective part from the second side, A second base electrode overlapping the second cover from the second side, and has The total thickness of the first cover and the first base electrode is 10% or more of the thickness from the surface on the first side of the first base electrode to the surface on the second side of the second base electrode. The stacked electronic component according to any one of Concepts 1 to 4. (Concept 6) The thickness of the first base electrode is 1 / 2 or less of the thickness of the first cover. The stacked electronic component according to any one of Concepts 1 to 5. (Concept 7) The end face has a concave portion recessed toward the fourth side, At least a part of the plurality of exposed edge portions are located in the concave portion, so that their positions in the first direction are different from each other. The stacked electronic component according to any one of Concepts 1 to 6. (Concept 8) The end face has a convex portion bulging toward the third side, At least a part of the plurality of exposed edge portions are located in the convex portion, so that their positions in the first direction are different from each other. The stacked electronic component according to any one of Concepts 1 to 7. (Concept 9) It further has an external electrode that overlaps the first base electrode from the first side and overlaps the end face and is in contact with the exposed edge portion. The multilayer electronic component according to any one of Concepts 1 to 8. (Concept 10) The first cover has a plurality of insulating layers laminated in the stacking direction, and a dummy electrode located between the plurality of insulating layers. The multilayer electronic component according to any one of Concepts 1 to 9. (Concept 11) When the maximum length of the effective portion in the first direction is L and the maximum length of the effective portion in the second direction orthogonal to the stacking direction and the first direction is W, each of L and W is 0.030 mm or more and 0.200 mm or less, and L / W is 0.5 or more and 2.0 or less. The multilayer electronic component according to any one of Concepts 1 to 10. (Concept 12) The inclination angle of the first end face with respect to the first direction is less than 45°. The multilayer electronic component according to any one of Concepts 2 and 3 and Concepts 4 to 11 that directly or indirectly cite at least one of 2 and 3. (Concept 13) The inclination angle is greater than 5°. The multilayer electronic component according to any one of Concepts 2 and 3 and Concepts 4 to 12 that directly or indirectly cite at least one of 2 and 3. (Concept 14) The first base electrode is thicker than the internal electrode. The multilayer electronic component according to any one of Concepts 1 to 13. (Concept 15) It has a second cover that overlaps the effective portion from the second side, and the thickness of the first base electrode is 0.06 times or more the thickness from the surface on the first side of the first cover to the surface on the second side of the second cover. The multilayer electronic component according to any one of Concepts 1 to 14. (Concept 16) The first underlying electrode contains a ceramic material. The multilayer electronic component according to any one of Concepts 1 to 15. (Concept 17) The volume percentage of the ceramic material in the first underlying electrode is greater than the volume percentage of the ceramic material in the internal electrode. The multilayer electronic component according to Concept 16. (Concept 18) At least a part of the plurality of exposed edge portions has different positions in the first direction. When the position of the one located on the most third side among the plurality of exposed edge portions is referred to as the outermost position, the edge portion on the third side of the first underlying electrode is located on the fourth side rather than the outermost position. The multilayer electronic component according to any one of Concepts 1 to 17.

Explanation of Reference Numerals

[0148] 1... Capacitor (multilayer electronic component), 7... Dielectric layer, 9... Internal electrode, 9c... Exposed edge portion (of the internal electrode), 11... Effective portion, 11c... End face (of the effective portion), 13... Cover (first cover or second cover), 16... Underlying electrode (first underlying electrode or second underlying electrode).

Claims

1. An active part having dielectric layers and internal electrodes alternately laminated in the lamination direction, A first cover overlapping from the first side of the first and second sides in the lamination direction with respect to the active part, A first base electrode overlapping the first cover from the first side, And having, The active part has an end face facing the third side among the third and fourth sides in the first direction intersecting the lamination direction, The plurality of internal electrodes include two or more internal electrodes each having an exposed edge portion exposed from the end face, The first base electrode is located in a region of the third side on the first side surface of the first cover, A first end face on the third side of the first base electrode and a second end face on the third side of the first cover constitute an inclined surface, The inclined surface is a continuous surface inclined with respect to the lamination direction in a direction where it is located closer to the fourth side as it is closer to the first side over the entire thickness of the first base electrode and the entire thickness of the first cover, A multilayer electronic component.

2. At least a part of the plurality of exposed edge portions have different positions from each other in the first direction The multilayer electronic component according to claim 1.

3. When the position of the one located farthest to the fourth side among the plurality of exposed edge portions is referred to as the innermost position, the edge portion on the third side of the first base electrode is at the same position as the innermost position or is located on the fourth side of the innermost position. The multilayer electronic component according to claim 1.

4. A second cover overlapping from the second side with respect to the active part, A second base electrode overlapping the second cover from the second side, And having, The thickness from the first side surface of the first base electrode to the second side surface of the second base electrode is 0.2 mm or less. The multilayer electronic component according to claim 1.

5. A second cover overlapping from the second side with respect to the active part, A second base electrode overlapping the second cover from the second side, And having, The total thickness of the first cover and the first base electrode is 10% or more of the thickness from the first side surface of the first base electrode to the second side surface of the second base electrode. The multilayer electronic component according to claim 1.

6. The thickness of the first base electrode is 1 / 2 or less of the thickness of the first cover. The multilayer electronic component according to claim 1.

7. The end face has a concave portion recessed toward the fourth side. At least a part of the plurality of exposed edge portions are located in the concave portion, so that their positions in the first direction are different from each other. The multilayer electronic component according to claim 1.

8. The end face has a convex portion that bulges toward the third side, At least a part of the plurality of exposed edge portions are located in the convex portion, so that their positions in the first direction are different from each other. The multilayer electronic component according to claim 1.

9. It further has an external electrode that overlaps the first underlying electrode from the first side and overlaps the end face and contacts the exposed edge portion. The multilayer electronic component according to claim 1.

10. The first cover has a plurality of insulating layers laminated in the stacking direction, and a dummy electrode located between the plurality of insulating layers. The multilayer electronic component according to claim 1.

11. When the maximum length of the effective portion in the first direction is L and the maximum length of the effective portion in the second direction orthogonal to the stacking direction and the first direction is W, each of L and W is 0.030 mm or more and 0.200 mm or less, and L / W is 0.5 or more and 2.0 or less. The multilayer electronic component according to claim 1.

12. The inclination angle of the first end face with respect to the first direction is less than 45°. The multilayer electronic component according to claim 1.

13. The inclination angle of the first end face with respect to the first direction is greater than 5°. The multilayer electronic component according to claim 1.

14. The first underlying electrode is thicker than the internal electrode. The multilayer electronic component according to claim 1.

15. It has a second cover that overlaps the effective portion from the second side, and the thickness of the first underlying electrode is 0.06 times or more the thickness from the surface on the first side of the first cover to the surface on the second side of the second cover. The multilayer electronic component according to claim 1.

16. The first underlying electrode contains a ceramic material. The multilayer electronic component according to claim 1.

17. The volume percentage of the ceramic material in the first underlying electrode is greater than the volume percentage of the ceramic material in the internal electrode. The multilayer electronic component according to claim 16.

18. At least a part of the plurality of exposed edge portions have different positions in the first direction, When the position of the one located farthest on the third side among the plurality of exposed edge portions is referred to as the outermost position, the edge portion on the third side of the first underlying electrode is located on the fourth side of the outermost position. The multilayer electronic component according to claim 1.

19. The inclined surface extends over a part of the first side of the thickness of the effective part while maintaining an inclined state with respect to the lamination direction in a direction where the first side is located closer to the fourth side. The multilayer electronic component according to claim 1.

20. The first end face is a polished surface. The multilayer electronic component according to claim 1.

Citation Information

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