Electronic circuit module

Abstract

To miniaturize an electronic circuit module.SOLUTION: An electronic circuit module includes at least one of an insulator, a capacitor, a coil, an inductor via, at least one of coupling lines having two conductors electromagnetically coupled to each other, a sealing resin covering a part of the insulator, and a conductive film which covers at least a part of the sealing resin and is grounded. At least a part of the capacitor, and at least one of the coil, the inductor via and the coupling lines are provided on at least one of the inside of the insulator and the surface of the insulator. The surface of the insulator has an upper surface and a lower surface facing opposite to each other. The conductive film comes in contact with at least the upper surface out of the surfaces of the insulator. At least a part of the capacitor, and at least one of the coil, the inductor via and the coupling lines are electrically connected to the conductive film through a contact region contacting the conductive film out of the surfaces of the insulator.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an electronic circuit module having elements.

Background Art

[0002] Conventionally, as this type of electronic circuit module, for example, the one described in Patent Document 1 is known. The package described in Patent Document 1 includes a substrate, electronic components, a sealing material, and a shield layer. Electronic components are mounted on the surface of the substrate. The electronic component has a lower surface facing the surface of the substrate and an upper surface on the opposite side of the lower surface. The sealing material is provided on the surface of the substrate so that the upper surface of the electronic component is exposed from the sealing material. A shield layer that is grounded and shields electromagnetic waves is formed on the upper surface of the electronic component.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the package described in Patent Document 1, when the electronic component has elements such as a capacitor or a coil, it is conceivable to provide electrodes and wiring conductors for grounding the elements on the electronic component. The electrode is disposed, for example, on the lower surface of the electronic component and is electrically connected to a ground connection pad formed on the surface of the substrate. The wiring conductor is disposed on the surface or inside of the electronic component and electrically connects the electrode and the element. At this time, the element is grounded via the wiring conductor and the electrode. On the other hand, the occupation of the surface and inside of the electronic component by these electrodes and wiring conductors hinders the miniaturization of the electronic component and the package.

[0005] Accordingly, an object of the present invention is to solve the above-mentioned problems and to miniaturize an electronic circuit module.

Means for Solving the Problems

[0006] In order to achieve the above object, an electronic circuit module according to the present invention includes: an insulator; at least one of a capacitor, a coil, an inductor via, and a coupling line having two conductors that are electromagnetically coupled to each other; a sealing resin that covers a part of the insulator; a conductive film that covers at least a part of the sealing resin and is grounded; and is provided with at least a part of the capacitor, the coil, the inductor via, and at least one of the coupling lines are provided on at least one of the inside and the surface of the insulator; the surface of the insulator has an upper surface and a lower surface facing each other; the conductive film is in contact with at least the upper surface of the surface of the insulator; at least a part of the capacitor, the coil, the inductor via, and at least one of the coupling lines are configured to be electrically connected to the conductive film through a contact region that contacts the conductive film on the surface of the insulator.

Effects of the Invention

[0007] According to the present invention, an electronic circuit module can be miniaturized.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

[0009] The electronic circuit module according to one aspect of the present invention includes an insulator, and At least one of a capacitor, a coil, an inductor, and a coupling line having two conductors that are electromagnetically coupled to each other, A sealing resin that covers a part of the insulator, A conductive film that covers at least a part of the sealing resin and is grounded, Comprising, At least one of at least a part of the capacitor, the coil, the inductor, and the coupling line is provided on at least one of the inside and the surface of the insulator, The surface of the insulator has an upper surface and a lower surface facing each other, The conductive film contacts at least the upper surface of the surface of the insulator, At least one of at least a part of the capacitor, the coil, the inductor, and the coupling line is configured to be electrically connected to the conductive film via a contact region that contacts the conductive film on the surface of the insulator.

[0010] According to this configuration, at least one of a capacitor, a coil, an inductor, and a coupling line can be grounded via a conductive film. Therefore, it is not necessary to provide an electrode for grounding at least one of a capacitor, a coil, an inductor, and a coupling line on the insulator. Also, it is not necessary to provide a wiring conductor for connecting at least one of a capacitor, a coil, an inductor, and a coupling line and the electrode on the insulator. Therefore, the insulator and the electronic circuit module can be miniaturized. Also, the number of electronic components that can be arranged in the electronic circuit module can be increased.

[0011] The electronic circuit module may include the capacitor. The capacitor may have an internal electrode provided inside the insulator and an external electrode provided outside the insulator. The external electrode may be a portion of the conductive film that faces the internal electrode.

[0012] In a conductor provided inside an insulator, distortion may occur during the formation of the insulator. When the conductor forms a capacitor, the distortion of the conductor changes the distance between two conductors facing each other in the capacitor. As a result, there may be variations in the capacitance of the capacitor among a plurality of electronic circuit modules. It is difficult to correct the distortion of the conductor provided inside the insulator after the formation of the insulator.

[0013] On the other hand, according to the above configuration, the external electrode is a portion of the conductive film that faces the internal electrode. The distortion of the conductive film can be reduced, for example, by previously grinding and smoothing the portion of the insulator surface where the conductive film is formed. That is, the distortion of the external electrode can be made smaller than the distortion of the conductor provided inside the insulator. Thereby, compared with the configuration in which both of the two conductors are provided inside the insulator, the change in the distance can be reduced. Therefore, variations in the capacitance of the capacitor among a plurality of electronic circuit modules can be reduced.

[0014] Also, according to the above configuration, compared with the configuration in which both of the two conductors are provided inside the insulator, the occupied portion of the capacitor in the insulator can be reduced. Therefore, the insulator and the electronic circuit module can be miniaturized. Also, the number of electronic components that can be arranged in the electronic circuit module can be increased.

[0015] A hole portion penetrating the conductive film may be formed in a part of the portion of the conductive film that faces the internal electrode.

[0016] The capacitance of the capacitor can be adjusted by changing the size of the conductor constituting the capacitor. However, since the internal electrode is provided inside the insulator, it is difficult to change the size of the internal electrode after the formation of the insulator. According to the above configuration, by forming hole portions of various sizes, the size of the external electrode can be changed. Thereby, even after the formation of the insulator, the capacitance of the capacitor can be adjusted without changing the size of the internal electrode.

[0017] The insulator may include a plurality of insulating layers laminated in the vertical direction and a via conductor that penetrates the layer farthest from the lower surface among the plurality of insulating layers along the vertical direction and is joined to the conductive film. The via conductor may be electrically connected to at least one of the capacitor, the coil, and the bonding line. The joint surface of the via conductor with the conductive film may be recessed toward the lower surface in the vertical direction.

[0018] The insulator may include a plurality of insulating layers laminated in the vertical direction and a via conductor that penetrates the layer farthest from the lower surface among the plurality of insulating layers along the vertical direction and is joined to the conductive film. The via conductor may form the inductor via. The joint surface of the via conductor with the conductive film may be recessed toward the lower surface in the vertical direction.

[0019] According to these configurations, the area of the joint surface of the via conductor with the conductive film is large because the joint surface is recessed along the vertical direction, as compared with a configuration in which the joint surface is flat. Therefore, the bonding strength between the via conductor and the conductive film and the reliability of the electrical connection can be improved as compared with that configuration. Accordingly, an electrical connection between at least one of the capacitor, the coil, the inductor via, and the bonding line and the conductive film can be performed more reliably.

[0020] Also, according to these configurations, since the joint surface of the via conductor is recessed toward the lower surface of the insulator, it is located below the upper surface of the insulator in the vertical direction. Thus, even when the conductive film is damaged by contact with another object, for example, contact with the nozzle of a mounting machine for mounting an electronic circuit module, the damage is less likely to reach the joint surface of the via conductor. Accordingly, it is possible to suppress poor grounding of the via conductor caused by the via conductor separating from the conductive film and poor grounding of a conductive portion grounded via the via conductor.

[0021] The surface of the insulator may have a side surface connecting the upper surface of the insulator and the lower surface of the insulator. The conductive film may include an upper surface conductive film that contacts the upper surface of the insulator and is grounded, and a side surface conductive film that contacts the side surface of the insulator and the upper surface conductive film. At least one of the capacitor, the coil, the inductor via, and the bonding line may be electrically connected to the side surface conductive film via the contact region among the side surfaces of the insulator.

[0022] According to this configuration, at least one of the capacitor, the coil, the inductor via, and the bonding line can be grounded via the side surface conductive film and the upper surface conductive film. Therefore, it is not necessary to provide an electrode and a wiring conductor for grounding at least one of the capacitor, the coil, the inductor via, and the bonding line on the insulator. Therefore, the insulator and the electronic circuit module can be miniaturized. In addition, the number of electronic components that can be arranged in the electronic circuit module can be increased.

[0023] The surface of the insulator may have a side surface connecting the upper surface of the insulator and the lower surface of the insulator. The conductive film may include an upper surface conductive film that contacts the upper surface of the insulator and is grounded, and a side surface conductive film that contacts the side surface of the insulator and the upper surface conductive film. The insulator may be at least partially provided inside the insulator and may have a reinforcing portion joined to the upper surface conductive film at an outer edge portion of the upper surface of the insulator. The main component of the upper surface conductive film and the main component of the reinforcing portion may be metal.

[0024] According to this configuration, the reinforcing portion is joined to the upper surface conductive film at the outer edge portion of the upper surface of the insulator. The bonding strength between the reinforcing portion mainly composed of metal and the upper surface conductive film is stronger than the bonding strength between the insulator and the upper surface conductive film. Therefore, compared with the configuration in which the reinforcing portion is not provided, it is possible to suppress the upper surface conductive film from peeling off from the upper surface of the insulator at the outer edge portion. As a result, the reliability of the electrical connection between the upper surface conductive film and the side surface conductive film can be improved. Therefore, the side surface conductive film can be more reliably grounded.

[0025] The surface of the insulator may have a side surface connecting the upper surface of the insulator and the lower surface of the insulator. The conductive film may include an upper surface conductive film that contacts the upper surface of the insulator and is grounded, and a side surface conductive film that contacts the side surface of the insulator and the upper surface conductive film. The main component of the side surface conductive film may be the same as the main component of the upper surface conductive film.

[0026] According to this configuration, since the main component of the side surface conductive film is the same as the main component of the upper surface conductive film, the bonding strength between the side surface conductive film and the upper surface conductive film and the reliability of the electrical connection can be improved as compared with a configuration in which the main component of the side surface conductive film is different from the main component of the upper surface conductive film. Therefore, the side surface conductive film can be more reliably grounded.

[0027] The electronic circuit module may be an LC filter including the capacitor and at least one of the coil and the inductor via.

[0028] The electronic circuit module may be a balun including the coupling line.

[0029] The electronic circuit module may be a coupler including the coupling line.

[0030] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the following embodiments do not limit the present invention. In the drawings, substantially the same members are denoted by the same reference numerals, and the description thereof will be omitted.

[0031] In this specification and the claims, "electrically connected" includes any of the following: current can flow between two or more components, two or more components are capacitively coupled, and two or more components are electromagnetically coupled.

[0032] "Main component" means the component having the largest weight or volume among the components constituting the component. When the component is composed of one type of component, the "main component" refers to the one type of component.

[0033] The terms "film" and "layer" do not limit whether the thickness of the film is greater than or less than that of the layer. That is, the thickness of the film may be greater than, less than, or equal to the thickness of the layer.

[0034] Terms indicating directions such as "above", "below", and "side" do not limit the usage state, etc. of the electronic circuit module according to the present invention.

[0035] <First Embodiment> With reference to FIGS. 1 to 4, an electronic circuit module according to a first embodiment of the present invention will be described. FIG. 1 is a plan view of the electronic circuit module according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II-II of the electronic circuit module of FIG. 1. FIG. 3 is an enlarged view of the Z3 region in FIG. 2. FIG. 4 is an equivalent circuit diagram of the electronic circuit module according to the first embodiment of the present invention.

[0036] The electronic circuit module 1 shown in FIG. 1 is an LC filter. As shown in FIG. 2, the electronic circuit module 1 includes a substrate 10, an insulator 20, a sealing resin 30, and a conductive film 40. The electronic circuit module 1 can be mounted and used on another substrate such as a motherboard.

[0037] As shown in FIG. 2, the substrate 10 has a lower surface 10a, an upper surface 10b opposite to the lower surface 10a, and a side surface 10c connecting the upper surface 10b and the lower surface 10a. The upper surface 10b of the substrate 10 corresponds to the "surface of the substrate" in the present invention. The substrate 10 is, for example, a printed circuit board or a ceramic multilayer substrate.

[0038] Mounting electrodes (not shown) are arranged on the lower surface 10a of the substrate 10. The mounting electrodes can be electrically connected to electrodes provided on another substrate such as a motherboard, for example, via solder bumps. Thereby, the electronic circuit module 1 can be mounted on another substrate.

[0039] On the upper surface 10b of the substrate 10, two substrate electrodes 11 are arranged. The number of the substrate electrodes 11 is not limited to two, and may be, for example, three or more according to the type and function of the electronic circuit module 1 and the like.

[0040] When the substrate 10 is formed of resin, the substrate electrodes 11 and the mounting electrodes are formed, for example, by etching. When the substrate 10 is formed of ceramic, the substrate electrodes 11 are formed, for example, by firing a conductive paste. The substrate electrodes 11 and the mounting electrodes are electrically connected to the circuit formed on the substrate 10.

[0041] The surface of the insulator 20 has a lower surface 20a facing the upper surface 10b of the substrate 10, an upper surface 20b on the opposite side of the lower surface 20a, and a side surface 20c connecting the lower surface 20a and the upper surface 20b. In the example shown in FIG. 2, the insulator 20 is a rectangular parallelepiped. The insulator 20 is made of, for example, ceramic or resin such as polyimide or liquid crystal polymer.

[0042] On the lower surface 20a of the insulator 20, two connection electrodes 51 are arranged. The connection electrodes 51 are electrically connected to the substrate electrodes 11, for example, via solder bumps 52.

[0043] On the side surface 20c of the insulator 20, a side surface conductive film 41 is formed. The side surface conductive film 41 and the upper surface conductive film 42 described later constitute the conductive film 40. As shown in FIG. 1, in the present embodiment, the side surface conductive film 41 is formed on the entire surfaces of the four side surfaces 20c of the insulator 20.

[0044] As shown in FIG. 2, a part of the insulator 20 is covered by a sealing resin 30 arranged on the upper surface 10b of the substrate 10. In the present embodiment, the sealing resin 30 covers a portion of the lower surface 20a of the insulator 20 excluding the connection electrodes 51. The sealing resin 30 covers the side surface 20c of the insulator 20 via the side surface conductive film 41. On the other hand, the sealing resin 30 is not arranged on the upper surface 20b of the insulator 20.

[0045] The encapsulating resin 30 has an upper surface 30a on the side opposite to the contact surface with respect to the upper surface 10b of the substrate 10, and a side surface 30b connecting the contact surface and the upper surface 30a. The encapsulating resin 30 is composed of, for example, an epoxy resin. The encapsulating resin 30 may contain fillers such as silica and alumina, for example.

[0046] An upper surface conductive film 42 that is grounded is formed on the upper surface 20b of the insulator 20. That is, the upper surface conductive film 42 is in contact with the upper surface 20b of the insulator 20. A side surface conductive film 41 is joined to the upper surface conductive film 42. As a result, the side surface conductive film 41 and the upper surface conductive film 42 constitute a grounded conductive film 40. The upper surface conductive film 42 also covers at least a part of the encapsulating resin 30. In the present embodiment, the upper surface conductive film 42 covers the upper surface 20b of the insulator 20, the upper surface 30a and the side surface 30b of the encapsulating resin 30, and the side surface 10c of the substrate 10.

[0047] The upper surface conductive film 42 is grounded, for example, by being electrically connected to an electrode (not shown) provided on at least one of the lower surface 10a, the upper surface 10b, and the side surface 10c of the substrate 10 and grounded. Note that the grounding method of the upper surface conductive film 42 is not limited to this.

[0048] As shown in FIGS. 1 and 2, a hole 43 is formed in a portion of the upper surface conductive film 42 that faces the internal conductor 64 in the vertical direction. As shown in FIG. 2, the hole 43 reaches the upper surface 20b of the insulator 20. The hole 43 is formed, for example, by trimming a part of the upper surface conductive film 42 using an ultraviolet (UV) laser.

[0049] The region of the surface of the insulator 20 that contacts the conductive film 40 constitutes the contact region of the surface of the insulator 20. In the present embodiment, the contact region is the region of the upper surface 20b of the insulator 20 excluding the hole 43 and the entire side surface 20c.

[0050] The conductive film 40, that is, the side conductive film 41 and the top conductive film 42, for example, have a metal as the main component. In this embodiment, the main component of the side conductive film 41 is the same as that of the top conductive film 42. The grounded side conductive film 41 can also shield electromagnetic waves.

[0051] The conductive film 40 is formed by coating such as sputtering, vapor deposition, spraying, etc. The conductive film 40 may have a multilayer structure having, for example, three layers of an adhesion layer, a conductive layer, and a protective layer. The adhesion film contacts the insulator 20 or the encapsulating resin 30 and enhances the adhesion between the insulator 20 or the encapsulating resin 30 and the conductive layer. The adhesion layer is composed of, for example, titanium, chromium, stainless steel, etc. The conductive film is composed of, for example, copper, silver, aluminum, etc. The protective film protects the conductive film from corrosion, damage, etc. The protective layer is composed of, for example, titanium, chromium, stainless steel, etc.

[0052] Next, the configuration of the insulator 20 will be described. In the example shown in FIG. 2, the insulator 20 has seven insulating layers 21 to 27 laminated in the vertical direction, which is the thickness direction of the substrate 10. The insulating layer 21 is closest to the substrate 10, that is, is arranged at the bottom among the insulating layers 21 to 27. The downward-facing surface of the surface of the insulating layer 21 constitutes the lower surface 20a of the insulator 20. The insulating layer 27 is farthest from the substrate 10, that is, is arranged at the top among the insulating layers 21 to 27. The upward-facing surface of the surface of the insulating layer 27 constitutes the upper surface 20b of the insulator 20. The insulating layers 22 to 26 are laminated between the insulating layer 21 and the insulating layer 27.

[0053] The insulating layers 21 to 27 are formed, for example, by laminating and firing sheets having sinterable ceramic powder. Note that the insulator 20 does not necessarily have a laminated structure.

[0054] The insulator 20 has internal conductors 61 to 64 and via conductors 71 to 73. The internal conductors 61 to 64 are arranged between the insulating layers 21 to 27. The via conductors 71 to 73 penetrate at least one of the insulating layers 21 to 27 along the vertical direction. The internal conductors 61 to 64 and the via conductors 71 to 73 are formed, for example, by firing a conductive paste arranged between the insulating layers 21 to 27 or between them. The main components of the internal conductors 61 to 64 and the via conductors 71 to 73 are metals such as copper, for example.

[0055] In the example shown in FIG. 2, two internal conductors 61 are arranged between the insulating layer 22 and the insulating layer 23. Two internal conductors 62 are arranged between the insulating layer 23 and the insulating layer 24. Two internal conductors 63 are arranged between the insulating layer 24 and the insulating layer 25. An internal conductor 64 is formed between the insulating layer 26 and the insulating layer 27.

[0056] The internal conductor 61 and the internal conductor 62 are connected by a via conductor 71 that penetrates the insulating layer 23. The internal conductor 62 and the internal conductor 63 are connected by a via conductor 71 that penetrates the insulating layer 24. The internal conductors 61 to 63 and the via conductor 71 connecting them respectively form a coil 101. As shown in FIG. 1, the coil 101 is spiral. Note that the shape of the coil 101 is not limited to the above, and may be a spiral shape, a toroidal shape, a meander shape, or the like.

[0057] As shown in FIG. 2, one end of each coil 101 is electrically connected to one of the two connection electrodes 51 via a via conductor 72 that penetrates the two insulating layers 21 and 22. The other end of each coil 101 is electrically connected to the internal conductor 64 via a via conductor 72 that penetrates the two insulating layers 25 and 26.

[0058] The internal conductor 64 faces the upper surface conductive film 42 in the vertical direction with the insulating layer 27 therebetween. The internal conductor 64 corresponds to the "internal electrode" in the present invention. Among the upper surface conductive film 42, the portion facing the internal conductor 64 in the vertical direction constitutes the external electrode 44. The internal conductor 64 and the external electrode 44 form a capacitor 102 by capacitive coupling. That is, the internal conductor 64 that forms part of the capacitor 102 is electrically connected to the upper surface conductive film 42 through the contact region of the upper surface 20b of the insulator 20. Further, the coil 101 is electrically connected to the upper surface conductive film 42 through the via conductor 72, the internal conductor 64, and the contact region of the upper surface 20b of the insulator 20.

[0059] The internal conductor 64 has an upper surface 64a facing the upper surface conductive film 42 with the insulating layer 27 therebetween. The external electrode 44 has a lower surface 44a facing the internal conductor 64 with the insulating layer 27 therebetween. In the example shown in FIG. 2, the distortion of the lower surface 44a of the external electrode 44 is smaller than the distortion of the upper surface 64a of the internal conductor 64. That is, the flatness of the lower surface 44a of the external electrode 44 is smaller than the flatness of the upper surface 64a of the internal conductor 64. Here, the "flatness" refers to the magnitude of the deviation from a geometrically correct circle of the surface to be measured (i.e., the lower surface 44a or the upper surface 64a). The flatness may be shown, for example, as the interval between two geometrically parallel planes when the surface to be measured is sandwiched between the two geometrically parallel planes and the interval is minimized, as defined in JIS B 0621-1984.

[0060] Two via conductors 73 penetrate the insulating layer 27 and are joined to the upper surface conductive film 42. The via conductor 73 corresponds to the "reinforcing portion" in the present invention. As shown in FIG. 1, the via conductor 73 is provided at the outer edge of the upper surface 20b of the insulator 20. The main component of the via conductor 73 may be the same as the main component of the upper surface conductive film 42. Note that the number of via conductors 73 may be one or three or more.

[0061] In the example shown in FIG. 2, the via conductor 73 is not connected to other conductors inside the insulator 20. However, the via conductor 73 may be connected to other conductors at its lower end, for example, to electrically connect the other conductor and the upper surface conductive film 42.

[0062] An example of a method for forming the electronic circuit module 1 will be described. First, an insulator 20 formed with a side surface conductive film 41 is prepared. At this time, the thickness of the insulator 20 in the vertical direction is made thicker than the thickness of the insulator 20 in the vertical direction when the electronic circuit module 1 is completed. Next, the thick insulator 20 as described above is disposed on the upper surface 10b of the substrate 10 via the connection electrode 51, the solder bump 52, and the substrate electrode 11. Next, a sealing resin 30 is disposed on the upper surface 10b of the substrate 10. At this time, the sealing resin 30 may temporarily cover the upper surface 20b of the insulator 20.

[0063] Next, the insulator 20 is ground or polished downward together with the sealing resin 30. The grinding or polishing may be performed by methods such as surface grinding, plunge grinding, creep feed grinding, chemical mechanical polishing, etc. Even when the upper surface 20b of the insulator 20 is covered by the sealing resin 30 due to grinding or polishing, the upper surface 20b can be exposed.

[0064] Here, the removal amount by grinding or polishing in the case where the insulator 20 is made of ceramic and the side surface conductive film 41 and the via conductor 73 are made of metal will be described. Since the resin of the sealing resin 30 is softer than the ceramic, more of the sealing resin 30 is removed than the insulator 20. Since the metal of the side surface conductive film 41 and the via conductor 73 is softer than the ceramic and the resin, more of the side surface conductive film 41 and the via conductor 73 are removed than the insulator 20 and the sealing resin 30.

[0065] As a result, even when both the insulator 20 and the encapsulating resin 30 are ground or polished downward, irregularities occur on the upper surface 20b of the insulator 20 and the upper surface 30a of the encapsulating resin 30. For example, as shown in FIG. 3, the bonding surface 41a of the side conductive film 41 has a concave shape that is recessed downward. At this time, the bottom of the concave shape of the bonding surface 41a is located below at least one of the upper surface 20b of the insulator 20 and the upper surface 30a of the encapsulating resin 30. Further, the upper surface 30a of the encapsulating resin 30 is located below the upper surface 20b of the insulator 20. Also, the bonding surface 73a of the via conductor 73 to the upper conductive film 42 has a concave shape that is recessed downward. Even when the insulator 20, the side conductive film 41, and the via conductor 73 are made of materials other than the above, the above-described shape and position can be realized by locally adjusting the removal amount by grinding or polishing.

[0066] Finally, the upper conductive film 42 is formed on the upper surface 20b of the insulator 20, the upper surface 30a and the side surface 30b of the encapsulating resin 30, and the side surface 10c of the substrate 10.

[0067] With the above-described configuration, the electronic circuit module 1 has the circuit shown in FIG. 4. That is, the two connection electrodes 51 are electrically connected via two coils 101 connected in series. A grounded capacitor 102 is connected between the two coils 101. The electronic circuit module 1 having such a circuit functions as an LC filter in which a signal is input from one connection electrode 51 and a signal is output from the other connection electrode 51.

[0068] According to the electronic circuit module 1 according to the first embodiment, the capacitor 102 can be grounded via the conductive film 40. Therefore, it is not necessary to provide an electrode for grounding the capacitor 102 on the insulator 20. Also, it is not necessary to provide a wiring conductor for connecting the capacitor 102 and the electrode on the insulator 20. Therefore, the insulator 20 and the electronic circuit module 1 can be miniaturized. Also, the number of electronic components that can be arranged in the electronic circuit module 1 can be increased.

[0069] When a conductor provided inside an insulator is formed, distortion may occur in the insulator. When the conductor is distorted and forms a capacitor, the distance between two conductors facing each other in the capacitor changes. As a result, the capacitance of the capacitor may vary among a plurality of electronic circuit modules. It is difficult to correct the distortion of the conductor provided inside the insulator after the insulator is formed.

[0070] On the other hand, according to the electronic circuit module 1, the external electrode 44 is a portion of the upper conductive film 42 that faces the internal conductor 64. The distortion of the upper conductive film 42 can be reduced, for example, by previously grinding and smoothing the upper surface 20b of the insulator 20. That is, the distortion of the external electrode 44 can be made smaller than the distortion of the internal conductor 64 provided inside the insulator 20. Thereby, compared with the configuration in which both of the two conductors constituting the capacitor are provided inside the insulator 20, the change in the distance can be reduced. Therefore, the variation in the capacitance of the capacitor 102 among a plurality of electronic circuit modules 1 can be reduced.

[0071] Also, according to the electronic circuit module 1, compared with the configuration in which both of the two conductors constituting the capacitor are provided inside the insulator 20, the occupied portion of the capacitor 102 in the insulator 20 can be made smaller. Therefore, the insulator 20 and the electronic circuit module 1 can be miniaturized. In addition, the number of electronic components that can be arranged in the electronic circuit module 1 can be increased.

[0072] The capacitance of the capacitor 102 can be adjusted by changing the size of the conductor constituting the capacitor. However, since the internal conductor 64 is provided inside the insulator 20, it is difficult to change the size of the internal conductor 64 after the insulator 20 is formed. According to the electronic circuit module 1, the size of the external electrode 44 can be changed by forming holes 43 of various sizes. Thereby, even after the insulator 20 is formed, the capacitance of the capacitor 102 can be adjusted without changing the size of the internal conductor 64.

[0073] Also, according to the electronic circuit module 1, the via conductor 73 is joined to the top conductive film 42 at the outer edge of the upper surface 20b of the insulator 20. The joining strength between the via conductor 73 mainly composed of metal and the top conductive film 42 is stronger than the joining strength between the insulator 20 and the top conductive film 42. Therefore, compared with the configuration in which the via conductor 73 is not provided, it is possible to suppress the top conductive film 42 from peeling off from the upper surface 20b of the insulator 20 at the outer edge of the upper surface 20b of the insulator 20. Thereby, the reliability of the electrical connection between the top conductive film 42 and the side conductive film 41 can be improved. Therefore, the side conductive film 41 can be more reliably grounded.

[0074] Also, according to the electronic circuit module 1, since the main component of the side conductive film 41 is the same as the main component of the top conductive film 42, compared with the configuration in which the main component of the side conductive film 41 is different from the main component of the top conductive film 42, the joining strength between the side conductive film 41 and the top conductive film 42 and the reliability of the electrical connection can be improved. Therefore, the side conductive film 41 can be more reliably grounded.

[0075] <Second Embodiment> With reference to FIGS. 5 to 9, the electronic circuit module according to the second embodiment of the present invention will be described. FIG. 5 is a plan view of the electronic circuit module according to the second embodiment of the present invention. FIG. 6 is a cross-sectional view taken along line VI-VI of the electronic circuit module of FIG. 5. FIG. 7 is an enlarged view of the Z7 region in FIG. 6. FIG. 8 is a cross-sectional view taken along line VIII-VIII of the electronic circuit module of FIG. 5. FIG. 9 is an equivalent circuit diagram of the electronic circuit module according to the second embodiment of the present invention. In the following description of the second embodiment, the description of the same configuration as in the first embodiment will be omitted.

[0076] Between the electronic circuit module 1 according to the first embodiment and the electronic circuit module 1A according to the second embodiment, the configuration of the insulator 20 is different. For example, the insulator 20 has via conductors 74A and 74B (see FIGS. 5 and 6). Also, the internal conductor 66 is connected to the side conductive film 41 (see FIG. 8).

[0077] In the electronic circuit module 1A according to the second embodiment, as shown in FIG. 5, the upper surface conductive film 42 is formed over the entire upper surface 20b of the insulator 20. That is, the hole portion 43 is not formed. In the electronic circuit module 1A, the side surface conductive films 41 are formed only on two of the four side surfaces 20c of the insulator 20 that face each other (the two side surfaces 20c extending in the left - right direction of the paper surface in FIG. 5).

[0078] As shown in FIG. 6, the insulator 20 has two internal conductors 65A, 65B, one internal conductor 66, two via conductors 72, and two via conductors 74A, 74B. The via conductors 74A, 74B correspond to the "inductor vias" in the present invention. That is, each of the via conductors 74A, 74B constitutes an inductor 104.

[0079] The two internal conductors 65A, 65B are disposed between the insulating layer 23 and the insulating layer 24. Each of the internal conductors 65A, 65B is electrically connected to the connection electrode 51 via a via conductor 72 that penetrates the three - layer insulating layers 21 - 23. The lower end of the via conductor 74A that penetrates the four - layer insulating layers 24 - 27 is connected to the internal conductor 65A. The lower end of the via conductor 74B that penetrates the four - layer insulating layers 24 - 27 is connected to the internal conductor 65B.

[0080] The upper ends of the via conductors 74A, 74B are connected to the upper surface conductive film 42. That is, the via conductors 74A, 74B are electrically connected to the upper surface conductive film 42 through the contact region on the upper surface 20b of the insulator 20. The bonding surface 74a of the via conductors 74A, 74B with respect to the upper surface conductive film 42 has a concave shape (not shown in FIG. 6) that is recessed downward, similar to the bonding surface 73a of the via conductor 73 (see FIG. 3).

[0081] One internal conductor 66 is disposed between the insulating layer 22 and the insulating layer 23. The internal conductor 66 faces two internal conductors 65A and 65B through the insulating layer 23 in the vertical direction. The internal conductor 65A and the internal conductor 66 are capacitively coupled to form a capacitor 103A. Also, the internal conductor 65B and the internal conductor 66 are capacitively coupled to form a capacitor 103B.

[0082] As shown in FIG. 8, the internal conductor 66 is connected to each of the side conductive films 41 formed on the two side surfaces 20c of the insulator 20. Thus, the internal conductor 66 is grounded through the side conductive film 41 and the top conductive film 42. That is, each of the capacitors 103A and 103B is electrically connected to the side conductive film 41 through the contact region on the side surface 20c of the insulator 20.

[0083] As shown in FIG. 7, the upper surface 30a of the encapsulating resin 30 may be located below the upper surface 20b of the insulator 20.

[0084] With the above-described configuration, the electronic circuit module 1A has the circuit shown in FIG. 9. That is, one connection electrode 51 is electrically connected to the other connection electrode 51 through two inductors 104 connected in series. The two inductors 104 are inductively coupled. The portion between the two inductors 104 is grounded. Two capacitors 103A and 103B are connected in parallel to each inductor 104. The electronic circuit module 1A having the above-described circuit functions as an LC filter in which a signal is input from one connection electrode 51 and a signal is output from the other connection electrode 51.

[0085] According to the electronic circuit module 1A according to the second embodiment, since the area of the bonding surface 74a of the via conductors 74A and 74B is recessed along the vertical direction, the area of the bonding surface 74a is larger than that in the configuration where the bonding surface 74a is flat. Therefore, compared with the said configuration, the bonding strength between the via conductors 74A and 74B and the top conductive film 42 and the reliability of the electrical connection can be improved. Therefore, the electrical connection between the via conductors 74A and 74B and the top conductive film 42 can be made more reliable.

[0086] Also, according to the electronic circuit module 1A, since the joint surfaces 74a of the via conductors 74A and 74B are recessed toward the lower surface 20a of the insulator 20, they are located below the upper surface 20b of the insulator 20 in the vertical direction. Thus, even when the upper surface conductive film 42 is damaged by contact with other objects, for example, contact with the nozzle of the mounting machine on which the electronic circuit module 1A is mounted, the damage is less likely to reach the joint surfaces 74a of the via conductors 74A and 74B. Therefore, it is possible to suppress the poor grounding of the via conductors 74A and 74B due to the separation of the via conductors 74A and 74B from the upper surface conductive film 42. Also, when there is a conductive portion grounded via the via conductors 74A and 74B, it is possible to suppress the poor grounding of the conductive portion.

[0087] Also, according to the electronic circuit module 1A, the capacitors 103A and 103B can be grounded via the side surface conductive film 41 and the upper surface conductive film 42. Therefore, it is not necessary to provide electrodes and wiring conductors for grounding the capacitors 103A and 103B on the insulator 20. Thus, the insulator 20 and the electronic circuit module 1A can be miniaturized. Also, the number of electronic components that can be arranged in the electronic circuit module 1A can be increased.

[0088] <Modification of the Second Embodiment> With reference to FIG. 10, a modification of the electronic circuit module according to the second embodiment of the present invention will be described. FIG. 10 is a cross-sectional view taken along line VI-VI of FIG. 5 of a modification of the electronic circuit module according to the second embodiment of the present invention.

[0089] In the electronic circuit module 1B shown in FIG. 10, three substrate electrodes 11 are arranged on the upper surface 10b of the substrate 10. One of the three substrate electrodes 11 is grounded. On the lower surface 20a of the insulator 20, in addition to the two connection electrodes 51, a ground electrode 53 is arranged. The ground electrode 53 is electrically connected to a substrate electrode 11 grounded via, for example, a solder bump 52.

[0090] Unlike the electronic circuit module 1A according to the second embodiment, in the electronic circuit module 1B, the internal conductor 66 is not connected to the side conductive film 41 (not shown in FIG. 10). On the other hand, the internal conductor 66 is grounded by being electrically connected to the ground electrode 53 via the via conductor 72 penetrating the two insulating layers 21 and 22.

[0091] Instead of the two via conductors 74A and 74B, the electronic circuit module 1B includes two coils 105A and 105B formed between the insulating layer 24 and the insulating layer 27. The configuration of the coils 105A and 105B is the same as that of the coil 101 in the electronic circuit module 1 according to the first embodiment. The internal conductors 61 constituting each of the coils 105A and 105B are electrically connected to the internal conductors 65A and 65B via the via conductor 72 penetrating the insulating layer 24.

[0092] The internal conductor 63 constituting the coil 105A is electrically connected to the upper surface conductive film 42 via the via conductor 72 penetrating the insulating layer 27. As a result, the coil 105A is electrically connected to the upper surface conductive film 42 via the contact region on the upper surface 20b of the insulator 20. The joint surface 72a of the via conductor 72 with respect to the upper surface conductive film 42 has a concave shape (not shown in FIG. 10) recessed downward, similar to the joint surface 73a of the via conductor 73 (see FIG. 3).

[0093] On the other hand, the internal conductor 63 constituting the coil 105B is connected to the side conductive film 41 (see FIG. 8) at the edge in a plan view (hereinafter simply referred to as "plan view") when viewed along the vertical direction of the insulating layer 26. As a result, the coil 105B is electrically connected to the side conductive film 41 via the contact region on the side surface 20c of the insulator 20.

[0094] <Third Embodiment> Referring to FIGS. 11 to 14, an electronic circuit module according to a third embodiment of the present invention will be described. FIG. 11 is an exploded perspective view of an insulator in the electronic circuit module according to the third embodiment of the present invention. In FIG. 11, the connection between internal conductors by via conductors is shown omitted by broken lines. Also, in FIG. 11, the side conductive film 41 and side conductors 54A to 54D described later are omitted. FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. 5 of the electronic circuit module according to the third embodiment of the present invention. FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG. 5 of the electronic circuit module according to the third embodiment of the present invention. FIG. 14 is an equivalent circuit diagram of the electronic circuit module according to the third embodiment of the present invention. In FIGS. 12 and 13, the encapsulating resin is omitted. In the following description of the third embodiment, the description of the same configuration as that of the first embodiment will be omitted.

[0095] The electronic circuit module 1C according to the third embodiment is balanced. As shown in FIG. 12, three substrate electrodes 11 are arranged on the upper surface 10b of the substrate 10. Three connection electrodes 51 are arranged on the lower surface 20a of the insulator 20. The three connection electrodes 51 include connection electrodes 51A to 51C. Each of the connection electrodes 51A to 51C is electrically connected to the substrate electrode 11 via, for example, a solder bump 52.

[0096] The insulator 20 has eight insulating layers 21 to 28 laminated in the vertical direction. The insulating layer 28 is the farthest from the substrate 10, that is, the uppermost among the insulating layers 21 to 28. The upward-facing surface of the surface of the insulating layer 28 constitutes the upper surface 20b of the insulator 20. The insulating layers 22 to 27 are laminated between the insulating layer 21 and the insulating layer 28.

[0097] As shown in FIGS. 12 and 13, three side conductive films 41 extending in the vertical direction are formed on the side surface 20c of the insulator 20. The side conductive film 41 is joined to the upper conductive film 42 at the upper end portion. The lower end portion of the side conductive film 41 reaches the boundary between the insulating layer 21 and the insulating layer 22 in the vertical direction.

[0098] Further, on the side surface 20c of the insulator 20, four side conductors 54A to 54D extending in the vertical direction are formed. The side conductors 54A to 54D are made of a metal such as copper, for example. The side conductors 54A to 54D are formed by, for example, the same formation method as that of the conductive film 40.

[0099] The side conductor 54A is connected to the connection electrode 51A at the lower end. The upper end of the side conductor 54A reaches the boundary between the insulating layer 23 and the insulating layer 24 in the vertical direction. The side conductor 54B is connected to the connection electrode 51B at the lower end. The upper end of the side conductor 54B reaches the boundary between the insulating layer 25 and the insulating layer 26 in the vertical direction. The side conductor 54C is connected to the connection electrode 51C at the lower end. The upper end of the side conductor 54C reaches the boundary between the insulating layer 27 and the insulating layer 28 in the vertical direction. The lower end of the side conductor 54D reaches the boundary between the insulating layer 22 and the insulating layer 23. The upper end of the side conductor 54D reaches the boundary between the insulating layer 26 and the insulating layer 27.

[0100] As shown in FIG. 11, the insulator 20 has an internal conductor 67A disposed between the insulating layer 21 and the insulating layer 22 and an internal conductor 67B disposed between the insulating layer 24 and the insulating layer 25. The internal conductors 67A and 67B are connected to three side conductive films 41 (see FIGS. 12 and 13) at the edges in the plan view of each of the insulating layer 21 and the insulating layer 24. That is, the internal conductors 67A and 67B are electrically connected to the three side conductive films 41 through the contact regions of the side surface 20c of the insulator 20. Thus, the internal conductors 67A and 67B are grounded through the three side conductive films 41 and the upper surface conductive film 42.

[0101] The insulator 20 further has spiral-shaped internal conductors 68A to 68D in a plan view. The internal conductor 68A disposed between the insulating layer 22 and the insulating layer 23 is connected to the side conductor 54D (see FIG. 12) at the edge of the insulating layer 22 in a plan view. The internal conductor 68B disposed between the insulating layer 23 and the insulating layer 24 is connected to the side conductor 54A (see FIG. 12) at the edge of the insulating layer 23 in a plan view. The internal conductor 68A and the internal conductor 68B are electromagnetically coupled via the insulating layer 23. The internal conductor 68A and the internal conductor 68B correspond to the "coupling line" in the present invention. The internal conductor 68B is electrically connected to the internal conductor 67B via a via conductor (not shown) penetrating the insulating layer 24. That is, the internal conductor 68B constituting the coupling line is electrically connected to the side conductive film 41 via the internal conductor 67B and the contact region of the side surface 20c of the insulator 20.

[0102] The internal conductor 68C disposed between the insulating layer 25 and the insulating layer 26 is electrically connected to the internal conductor 67B via a via conductor (not shown) penetrating the insulating layer 25. The internal conductor 68C is connected to the side conductor 54B (see FIG. 12) at the edge of the insulating layer 25 in a plan view.

[0103] The internal conductor 68D disposed between the insulating layer 26 and the insulating layer 27 is connected to the side conductor 54D (see FIG. 12) at the edge of the insulating layer 26 in a plan view and is electrically connected to the internal conductor 68A. The internal conductor 68C and the internal conductor 68D are electromagnetically coupled via the insulating layer 26. The internal conductor 68C and the internal conductor 68D correspond to the "coupling line" in the present invention. The internal conductor 67C constituting the coupling line is electrically connected to the side conductive film 41 via the internal conductor 67B and the contact region of the side surface 20c of the insulator 20.

[0104] The internal conductor 68D is electrically connected to an internal conductor 69 disposed between the insulating layer 27 and the insulating layer 28 via a via conductor (not shown) penetrating the insulating layer 27. The internal conductor 69 is connected to the side conductor 54C (see FIG. 13) at the edge of the insulating layer 28 in a plan view.

[0105] With the above configuration, the electronic circuit module 1C has the circuit shown in FIG. 14. That is, internal conductors 68A and 68D, which form parts of different coupling lines, are connected in series to the connection electrodes 51C. The internal conductor 68B that electromagnetically couples with the internal conductor 68A is electrically connected to the connection electrode 51A. The internal conductor 68C that electromagnetically couples with the internal conductor 68D is electrically connected to the connection electrode 51B. Each of the internal conductors 68B and 68C is grounded. The electronic circuit module 1C having such a circuit functions as a balun.

[0106] In the electronic circuit module 1C, at least one of the grounded upper surface conductive film 42 and the conductors (for example, internal conductors 68C, 68D, 69) provided inside the insulator 20 may form a stripline. In this case, as described above, the upper surface conductive film 42 can have less distortion than the conductors provided inside the insulator 20, so the variation in the impedance of the stripline can be reduced among a plurality of electronic circuit modules 1C.

[0107] <Fourth Embodiment> The electronic circuit module according to the fourth embodiment of the present invention will be described with reference to FIGS. 15 to 18. FIG. 15 is an exploded perspective view of a part of the insulator in the electronic circuit module according to the fourth embodiment of the present invention. In FIG. 15, the connection between the internal conductors by the via conductors is shown omitted by a broken line. Also, in FIG. 15, the side surface conductive film 41, the side surface conductors 54A to 54D, and the insulating layers 27 and 28 are omitted. FIG. 16 is a cross-sectional view corresponding to FIG. 12 of the electronic circuit module according to the fourth embodiment of the present invention. FIG. 17 is a cross-sectional view corresponding to FIG. 13 of the electronic circuit module according to the fourth embodiment of the present invention. FIG. 18 is an equivalent circuit diagram of the electronic circuit module according to the fourth embodiment of the present invention. In FIGS. 16 and 17, the encapsulating resin is omitted. In the following description of the fourth embodiment, the description of the same configuration as that of the third embodiment will be omitted.

[0108] The electronic circuit module 1D according to the fourth embodiment is a coupler. As shown in FIG. 15, four connection electrodes 51 are arranged on the lower surface 20a of the insulator 20. The four connection electrodes 51 include connection electrodes 51A to 51D. Each of the connection electrodes 51A to 51D is electrically connected to the substrate electrode 11 via, for example, solder bumps 52.

[0109] As shown in FIG. 17, on the side surface 20c of the insulator 20, a side surface conductive film 41 that is joined to the upper surface conductive film 42 and extends in the vertical direction is formed. In the present embodiment, the lower end portion of the side surface conductive film 41 reaches the boundary portion between the insulating layer 21 and the insulating layer 22 in the vertical direction.

[0110] As shown in FIGS. 16 and 17, on the side surface 20c of the insulator 20, side surface conductors 54A to 54D that extend in the vertical direction are formed. In the present embodiment, as shown in FIG. 16, the side surface conductor 54A is connected to the connection electrode 51A and reaches the boundary portion between the insulating layer 26 and the insulating layer 27. The side surface conductor 54B is connected to the connection electrode 51B and reaches the boundary portion between the insulating layer 26 and the insulating layer 27. As shown in FIG. 17, the side surface conductor 54C is connected to the connection electrode 51C and reaches the boundary portion between the insulating layer 22 and the insulating layer 23. The side surface conductor 54D is connected to the connection electrode 51D and reaches the boundary portion between the insulating layer 22 and the insulating layer 23.

[0111] As shown in FIG. 15, the insulator 20 has internal conductors 68A to 68C, 69A to 69D. The internal conductors 68A to 68C correspond to the "coupling lines" in the present invention. In the present embodiment, the internal conductors 69A and 69B are arranged between the insulating layer 26 and the insulating layer 27 (not shown). The internal conductor 69A is connected to the side surface conductor 54A (see FIG. 16) at the edge portion of the insulating layer 26 in plan view. The internal conductor 69B is connected to the side surface conductor 54B (see FIG. 16) at the edge portion of the insulating layer 26 in plan view.

[0112] The internal conductor 69A is electrically connected to the internal conductor 68A disposed between the insulating layer 24 and the insulating layer 25 via a via conductor (not shown) penetrating through the two-layer insulating layers 25 and 26. The internal conductor 69B is electrically connected to the internal conductor 68B disposed between the insulating layer 24 and the insulating layer 25 via a via conductor (not shown) penetrating through the two-layer insulating layers 25 and 26.

[0113] Each of the internal conductors 68A and 68B is electrically connected to the upper surface conductive film 42 (see, for example, FIG. 16) via a via conductor (not shown) penetrating through at least two-layer insulating layers 25 and 26. In the via conductor joined to the upper surface conductive film 42 and electrically connected to each of the internal conductors 68A and 68B, the joint surface with respect to the upper surface conductive film 42 may be a concave shape recessed downward.

[0114] As shown in FIG. 15, the internal conductors 69C and 69D are disposed between the insulating layer 22 and the insulating layer 23. The internal conductor 69C is connected to the side surface conductor 54C (see FIG. 17) at the edge in the plan view of the insulating layer 22. The internal conductor 69D is connected to the side surface conductor 54D (see FIG. 17) at the edge in the plan view of the insulating layer 22. Each of the internal conductors 69C and 69D is electrically connected to the internal conductor 68C disposed between the insulating layer 23 and the insulating layer 24 via a via conductor (not shown) penetrating through the insulating layer 23. The internal conductor 68C is electromagnetically coupled with each of the internal conductors 68A and 68B via the insulating layer 24.

[0115] With the above configuration, the electronic circuit module 1D has the circuit shown in FIG. 18. That is, an internal conductor 68C is connected between the connection electrode 51C and the connection electrode 51D. The internal conductor 68C is electromagnetically coupled with each of the internal conductor 68A connected to the connection electrode 51A and the internal conductor 68B connected to the connection electrode 51B. The internal conductor 68A and the internal conductor 68B are electrically connected via two inductors L1 and L2 connected in series. Capacitors C are connected between the internal conductor 68A and the inductor L1, between the inductor L1 and the inductor L2, and between the inductor L2 and the internal conductor 68B, respectively. Each capacitor C is electrically connected to the upper conductive film 42 and grounded. Note that the two inductors L1 and L2 and the three capacitors C are not shown, but may be formed, for example, by internal conductors disposed between the insulating layer 26 and the insulating layer 27 and between the insulating layer 27 and the insulating layer 28. The electronic circuit module 1D having such a circuit functions as a coupler.

[0116] In the electronic circuit module 1D, at least one of the grounded upper conductive film 42 and the conductor (for example, internal conductors 68A to 68C, 69A to 69D) provided inside the insulator 20 may form a stripline. In this case, as described above, the upper conductive film 42 can have less distortion than the conductor provided inside the insulator 20, so that the variation in the impedance of the stripline can be reduced among the plurality of electronic circuit modules 1D.

[0117] Note that the present invention is not limited to the above-described embodiment and can be implemented in various other modes. For example, in the above description, the electronic circuit modules 1, 1A to 1D are assumed to include the substrate 10, but the present invention is not limited thereto. When the electronic circuit modules 1, 1A to 1D do not include the substrate 10, the connection electrodes 51, 51A to 51C may be exposed from the sealing resin 30 and electrically connected to electrodes disposed on another substrate such as a mother board.

[0118] In addition to the insulator 20, various electronic components and the like may be mounted on the substrate 10.

[0119] Also, in the above description, it was assumed that the sealing resin 30 is not disposed on the upper surface 20b of the insulator 20, but the present invention is not limited thereto. The sealing resin 30 may cover a part of the upper surface 20b as long as the upper surface conductive film 42 can contact at least a part of the upper surface 20b of the insulator 20.

[0120] Also, in the above description, it was assumed that the "reinforcing portion" in the present invention is the via conductor 73, but the present invention is not limited thereto. The reinforcing portion may be a member other than the via conductor as long as it mainly contains metal.

[0121] Also, in the above description, it was assumed that the joint surface 73a of the via conductor 73 and the joint surface 41a of the side surface conductive film 41 are concave, but the present invention is not limited thereto. For example, the joint surface 73a of the via conductor 73 and the joint surface 41a of the side surface conductive film 41 may be flat or substantially flat. The upper surface 30a of the sealing resin 30 may be at the same position as the upper surface 20b of the insulator 20 in the vertical direction, or may be at a position higher than the upper surface 20b of the insulator 20.

[0122] Also, in the first and second embodiments, the electronic circuit modules 1 and 1A may be, for example, a diplexer or a triplexer.

[0123] Also, in the above description, the via conductors 74A and 74B are joined to the upper surface conductive film 42, but the present invention is not limited thereto. For example, in a configuration where the via conductor 74A penetrates the three insulating layers 24 to 26, the via conductor 74A may be connected to an internal conductor disposed between the insulating layer 26 and the insulating layer 27. At this time, the internal conductor may be connected to the side surface conductive film 41 at the edge portion of the insulating layer 26 in plan view. In this case, the via conductor 74A is electrically connected to the side surface conductive film 41 through the contact region of the side surface 20c of the insulator 20.

[0124] Also, when the insulator 20 is formed by firing, via conductors (for example, the via conductor 73 shown in FIG. 2 and the via conductor 74 shown in FIG. 6) that penetrate the insulating layer constituting the upper surface 20b of the insulator 20 may have a material (for example, glass) contained in the insulator 20 as a common base. In this case, since the bonding strength between the insulator 20 and the via conductor is increased, it is possible to suppress the movement of the via conductor or its detachment from the insulator 20.

[0125] Also, the via conductor that penetrates the insulating layer constituting the upper surface 20b of the insulator 20 may have a tapered shape that becomes thinner toward the top. The upper end portion of the via conductor may be thinner than the portion below the upper end portion. A via conductor having such a shape is difficult to escape upward from the insulator 20.

[0126] Note that by appropriately combining any of the above-described various embodiments, the respective effects can be achieved.

[0127] The present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings. However, various modifications and variations will be apparent to those skilled in the art. Such modifications and variations are to be understood as being included therein as long as they do not depart from the scope of the present invention as defined by the appended claims.

Industrial Applicability

[0128] The electronic circuit module according to the present invention can be miniaturized and is useful for various electronic devices.

Explanation of Reference Numerals

[0129] 1, 1A to 1D Electronic circuit module 10 Substrate 10a Lower surface 10b Upper surface 20 Insulator 20a Lower surface 20b Upper surface 20c Side surface 21 to 28 Insulating layer 30 Sealing resin 40 Conductive film 41 Side conductive film 42 Top conductive film 43 Hole part 44 External electrode 64 Internal conductor (internal electrode) 68A~68D Internal conductor (bonding line) 72 Via conductor 72a Bonding surface 73 Via conductor (reinforcing part) 73a Bonding surface 74A,74B Via conductor (inductor via) 74a Bonding surface 101 Coil 102 Capacitor 103A,103B Capacitor 104 Inductor 105A,105B Coil

Claims

1. An insulator, at least one of a capacitor, a coil, an inductor via, and a coupling line having two conductors that are electromagnetically coupled to each other, a sealing resin that covers a part of the insulator, a conductive film that covers at least a part of the sealing resin and is grounded, comprising: At least one of at least a part of the capacitor, the coil, the inductor via, and the coupling line is provided on at least one of the inside and the surface of the insulator, The surface of the insulator has an upper surface and a lower surface facing each other, The conductive film contacts at least the upper surface of the surface of the insulator, At least one of at least a part of the capacitor, the coil, the inductor via, and the coupling line is electrically connected to the conductive film through a contact region that contacts the conductive film on the surface of the insulator, An electronic circuit module.

2. Comprising the capacitor, The capacitor, an internal electrode provided inside the insulator, an external electrode provided outside the insulator, having: The external electrode is a portion of the conductive film that faces the internal electrode, The electronic circuit module according to claim 1.

3. A hole that penetrates the conductive film is formed in a part of the portion of the conductive film that faces the internal electrode. The electronic circuit module according to claim 2.

4. The insulator, a plurality of insulating layers laminated in the vertical direction, a via conductor that penetrates the layer farthest from the lower surface among the plurality of insulating layers along the vertical direction and joins to the conductive film, having: The via conductor is electrically connected to at least one of the capacitor, the coil, and the coupling line, The joint surface of the via conductor with the conductive film is recessed toward the lower surface in the vertical direction. The electronic circuit module according to any one of claims 1 to 3.

5. The insulator, a plurality of insulating layers laminated in the vertical direction, a via conductor that penetrates the layer farthest from the lower surface among the plurality of insulating layers along the vertical direction and joins to the conductive film, having: The via conductor constitutes the inductor via, The joint surface of the via conductor with the conductive film is recessed toward the lower surface in the vertical direction. The electronic circuit module according to any one of claims 1 to 3.

6. The surface of the insulator has a side surface that connects the upper surface of the insulator and the lower surface of the insulator, ​ ​ The conductive film is an upper surface conductive film that contacts and is grounded to the upper surface of the insulator, a side surface conductive film that contacts the side surface of the insulator and the upper surface conductive film, and has at least one of the capacitor, the coil, the inductor via, and the coupling line is electrically connected to the side surface conductive film through the contact region of the side surface of the insulator. The electronic circuit module according to any one of claims 1 to 5.

7. The surface of the insulator has a side surface connecting the upper surface and the lower surface of the insulator, The conductive film is an upper surface conductive film that contacts and is grounded to the upper surface of the insulator, a side surface conductive film that contacts the side surface of the insulator and the upper surface conductive film, and has the insulator is at least partially provided inside the insulator and has a reinforcing portion joined to the upper surface conductive film at the outer edge of the upper surface of the insulator, The main component of the upper surface conductive film and the main component of the reinforcing portion are metals. The electronic circuit module according to any one of claims 1 to 6.

8. The surface of the insulator has a side surface connecting the upper surface and the lower surface of the insulator, The conductive film is an upper surface conductive film that contacts and is grounded to the upper surface of the insulator, a side surface conductive film that contacts the side surface of the insulator and the upper surface conductive film, and has the main component of the side surface conductive film is the same as the main component of the upper surface conductive film. The electronic circuit module according to any one of claims 1 to 7.

9. The electronic circuit module is an LC filter including the capacitor and at least one of the coil and the inductor via, and is the electronic circuit module according to any one of claims 1 to 8.

10. The electronic circuit module is a balun including the coupling line, and is the electronic circuit module according to any one of claims 1 to 8.

11. The electronic circuit module is a coupler including the coupling line, and is the electronic circuit module according to any one of claims 1 to 8.

Images