Multilayer electronic component

Abstract

To provide a multilayer electronic component that alleviates the phenomenon of stress concentration due to electrostriction at corners where electrode patterns of different polarities overlap in a stacking direction in an internal electrode structure using an intermediate floating electrode layer.SOLUTION: In a multilayer electronic component, an internal electrode layer 121 includes a first electrode pattern 11 and a second electrode pattern 12, and a floating electrode layer 122 includes a third electrode pattern 13 disposed to be spaced apart from an end face, and a fourth electrode pattern 14 and a fifth electrode pattern 15 which are disposed to be spaced apart from the third electrode pattern 13 but connected to the end face. Thus, the multilayer electronic component may allow an electric field formed in a first direction between the internal electrode layer and the floating electrode layer to also be formed in a second direction or a third direction to offset stress.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, mobile phones, on-board chargers (OBCs) for electric vehicles, and circuits such as DC-DC converters, and plays a role in charging or discharging electricity.

[0003] When a voltage is applied to a multilayer ceramic capacitor, stress is generated inside the multilayer ceramic capacitor due to the electrostriction phenomenon of the dielectric layer, which can cause a decrease in reliability including the BDV characteristics of the multilayer ceramic capacitor.

[0004] Conventionally, attempts have been made to introduce a floating electrode layer structure to mitigate the electrostriction phenomenon.

[0005] However, the internal electrode structure with a general floating electrode layer can achieve the effect of distributing the voltage overall to relieve stress concentration to some extent, but stress due to electrostriction may concentrate at the corners where electrode patterns of different polarities overlap in the stacking direction of the internal electrodes. As a result, even when a floating electrode layer is introduced, the BDV characteristics and reliability may deteriorate, and such a phenomenon may become more severe when operating a multilayer ceramic capacitor under high voltage.

[0006] Therefore, in the internal electrode structure with a floating electrode layer introduced, there is a need for a structural improvement that can alleviate the phenomenon in which stress due to electrostriction concentrates at the corners where electrode patterns of different polarities overlap in the stacking direction of the internal electrodes.

Summary of the Invention

Problems to be Solved by the Invention

[0007] The problem to be solved by the present invention is to alleviate the phenomenon in which stress due to electrostriction concentrates at the corners where electrode patterns of different polarities overlap in the stacking direction of the internal electrodes in the internal electrode structure with a floating electrode layer introduced.

[0008] However, the problem to be solved by the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0009] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, internal electrode layers and floating electrode layers that are alternately arranged in a first direction with the dielectric layer interposed therebetween, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a main body including the above, and external electrodes respectively arranged on the third surface and the fourth surface, the internal electrode layer includes a first electrode pattern connected to the third surface, and a second electrode pattern that is arranged at a distance from the first electrode pattern in the third direction and is connected to the fourth surface, and the floating electrode layer can include a third electrode pattern arranged at a distance from the third surface and the fourth surface, a fourth electrode pattern arranged at a distance from the third electrode pattern and connected to the third surface, and a fifth electrode pattern arranged at a distance from the third electrode pattern and connected to the fourth surface.

[0010] A multilayer electronic component according to still another embodiment of the present invention includes a dielectric layer, internal electrode layers and floating electrode layers alternately arranged in a first direction with the dielectric layer interposed therebetween, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a main body, and external electrodes respectively disposed on the third surface and the fourth surface. The internal electrode layer includes a first electrode pattern connected to the third surface, and a second electrode pattern spaced apart from the first electrode pattern in the third direction and connected to the fourth surface. The floating electrode layer includes a third electrode pattern disposed spaced apart from the third surface and the fourth surface. The first electrode pattern includes a first connection portion in contact with the external electrode on the third surface and a first main body portion extending from the first connection portion in the second direction and having a longer length in the second direction and a narrower width in the third direction than the first connection portion. The second electrode pattern can include a second connection portion in contact with the external electrode on the fourth surface and a second main body portion extending from the second connection portion in the second direction and having a longer length in the second direction and a narrower width in the third direction than the second connection portion.

Advantages of the Invention

[0011] One of the various advantages of the present invention is that in a multilayer electronic component including an internal electrode layer and a floating electrode layer, by adjusting the shapes of the electrode patterns included in the internal electrode layer and the floating electrode layer, the stress concentrated at the corners where the electrode patterns of different polarities overlap in the stacking direction of the internal electrodes is eliminated, and the reliability including the BDV characteristics of the multilayer electronic component is improved.

[0012] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of describing the specific embodiments of the present invention.

Brief Description of the Drawings

[0013]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0014] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of the elements in the drawings can be exaggerated for a clearer explanation, and the elements indicated by the same reference numerals in the drawings are the same elements.

[0015] In order to clearly describe the present invention in the drawings, parts not related to the description are omitted. The sizes and thicknesses of the respective components shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to what is shown in the drawings. For components having the same functions within the same scope of thought, the same reference numerals are used for description. Further, throughout the specification, when a certain part refers to a certain component as "including", this means that, unless otherwise stated to the contrary, other components are not excluded, but other components may further be included.

[0016] In the drawings, the first direction can be defined as the stacking direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0017] FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention and still another embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line I-I' of FIG. 1, FIG. 3 is a cross-sectional view taken along the line II-II' of FIG. 1, FIG. 4 is a cross-sectional view taken along the line III-III' of FIG. 1, (a) of FIG. 5 shows a region of an electrode pattern where electrostriction stress concentrates in a stacked electronic component according to a comparative example, (b) of FIG. 5 shows a region of an electrode pattern where electrostriction stress concentrates in a stacked electronic component according to an example, (a) of FIG. 6 schematically shows a plan view of an internal electrode layer according to an embodiment, (b) of FIG. 6 schematically shows a plan view of a floating electrode layer according to an embodiment, and FIG. 7 schematically shows an exploded perspective view of a main body according to an embodiment.

[0018] Hereinafter, with reference to FIGS. 1 to 7, a stacked electronic component 100 according to an embodiment of the present invention and still another embodiment of the present invention will be described in detail. Further, as an example of the stacked electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto, and it can also be applied to various stacked electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0019] Before describing the multilayer electronic component according to one embodiment of the present invention and the multilayer electronic component according to still another embodiment of the present invention, the configuration commonly included in the multilayer electronic component according to one embodiment of the present invention and the multilayer electronic component according to still another embodiment of the present invention will be described.

[0020] The multilayer electronic component 100 according to one embodiment of the present invention and the multilayer electronic component 100 according to still another embodiment of the present invention include a dielectric layer 111, internal electrode layers 121 and floating electrode layers 122 alternately arranged in a first direction with the dielectric layer interposed therebetween, a first surface and a second surface 1, 2 facing each other in the first direction, a third surface and a fourth surface 3, 4 facing each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface 5, 6 facing each other in a third direction and connected to the first surface to the fourth surface, and may include external electrodes 130, 140 respectively arranged on the third surface and the fourth surface.

[0021] The main body 110 may include a dielectric layer 111, internal electrode layers 121 and floating electrode layers 122 alternately arranged in a first direction with the dielectric layer interposed therebetween.

[0022] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron shape with straight lines, but can have a substantially hexahedron shape.

[0023] The main body 110 may include a first surface and a second surface 1, 2 facing each other in the first direction, a third surface and a fourth surface 3, 4 facing each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface 5, 6 facing each other in a third direction and connected to the first surface to the fourth surface.

[0024] In the present invention, the first direction can mean the direction in which the internal electrode layer 121 and the floating electrode layer 122 are arranged with the dielectric layer 111 interposed therebetween, that is, the stacking direction of the internal electrode layer 121, the floating electrode layer 122, and the dielectric layer 111. On the other hand, the second direction means the direction perpendicular to the first direction, and the third direction can mean the direction perpendicular to both the first direction and the second direction.

[0025] On the other hand, when a margin area where no electrode pattern is arranged overlaps on the dielectric layer 111, a step due to the thickness of the internal electrode layer may occur. As a result, the corner connecting the first surface and the third to fifth surfaces and / or the corner connecting the second surface and the third to fifth surfaces can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corner connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corner connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 can have a form shrunk toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, in order to prevent chipping defects or the like, by performing a separate process to round the corners connecting the respective surfaces of the main body 110, the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces can have a rounded form.

[0026] The dielectric layer 111 forming the main body 110 can be formed in a plurality, and the plurality of dielectric layers 111 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated so that it is difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not particularly limited and can be determined in consideration of the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0027] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder can be used as the ceramic powder. More specifically, the ceramic powder can be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0028] On the other hand, when using barium titanate (BaTiO3)-based powder as the raw material for forming the dielectric layer 111, the fired dielectric layer 111 can contain Ba and Ti.

[0029] The average thickness of the dielectric layer 111 is not particularly limited.

[0030] For the purpose of miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be 0.35 μm or less. For improving the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness of the dielectric layer 111 may be 20 μm or more.

[0031] The average thickness of the dielectric layer 111 can be measured by scanning an image of the cross-section (L-T cross-section) of the main body 110 in the third and first directions with a scanning electron microscope (SEM).

[0032] For example, the average thickness of the dielectric layer 111 can be measured by scanning the cross-section in the length and thickness directions (L-T) of the body 110 cut at the central portion in the width direction with a scanning electron microscope (SEM). From the image, for a total of five dielectric layers, including two upper layers and two lower layers, with one layer of the dielectric layer at the point where the central line in the length direction of the body and the central line in the thickness direction meet as a reference, after determining five points, two on the left and two on the right, at equal intervals around one reference point with the reference point as the center, the thickness at each point is measured and the average value is calculated.

[0033] When a voltage is applied to the multilayer electronic component 100, due to the electrostriction phenomenon of the dielectric layer, deformations such as contraction and expansion may occur in the multilayer electronic component 100. Such an electrostriction phenomenon may become more intense when a high voltage is applied to the multilayer electronic component 100 or when BaTiO3 is used as the material of the dielectric layer.

[0034] On the other hand, when a voltage is applied to the multilayer electronic component 100, the multilayer electronic component 100 may expand in the first direction and contract in the second and third directions. And the stress caused by such deformation of the multilayer electronic component 100 concentrates at the boundary between the region where capacitance is formed and the region where capacitance is not formed, which may act as a cause for generating cracks in the multilayer electronic component 100.

[0035] Referring to FIG. 6(a), the internal electrode layer 121 can include a first electrode pattern 11 connected to the third surface 3 and a second electrode pattern 12 spaced apart from the first electrode pattern 11 in the third direction and connected to the fourth surface 4.

[0036] Referring to FIGS. 6(a) and 4, the first electrode pattern 11 and the second electrode pattern 12 can be arranged to be separated from each other by a distance W1 in the third direction. The distance W1 by which the first electrode pattern 11 and the second electrode pattern 12 are separated in the third direction is not particularly limited. However, when the ratio of the distance W1 by which the first electrode pattern 11 and the second electrode pattern 12 are separated in the third direction to the widths of the margin portions 114 and 115 exceeds 2.8 and is less than 1, the stress remaining in the main body 110 can be minimized. At this time, the widths of the margin portions 114 and 115 in FIG. 6(a) can mean the widths in the third direction of the regions between both ends in the third direction of the internal electrode layer 121 and the fifth surface and the sixth surface.

[0037] Referring to FIG. 6(b), the floating electrode layer 122 can include a third electrode pattern 13 that is arranged to be separated from the third surface 3 and the fourth surface 4.

[0038] Capacitances can be formed in the regions where the first electrode pattern 11 and the third electrode pattern 13 overlap in the first direction and in the regions where the second electrode pattern 12 and the third electrode pattern 13 overlap in the first direction. Specifically, referring to FIG. 3, the region where the first electrode pattern 11 and the third electrode pattern 13 overlap in the first direction can be called the first capacitance forming portion Ac1, and the region where the second electrode pattern 12 and the third electrode pattern 13 overlap in the first direction can be called the second capacitance forming portion Ac2. The first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 can be separated from each other in the third direction, and the region where the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 are separated in the third direction can include a region where no capacitance is formed. This can be the result of the capacitance forming portions being separated in the third direction due to the first electrode pattern 11 and the second electrode pattern 12 being arranged to be separated from each other in the third direction.

[0039] On the other hand, such a structure corresponds to a structure in which a plurality of capacitors are connected in series and then connected in parallel again as a whole. Therefore, the effect of distributing the voltage can be obtained, and thereby the electrostriction phenomenon of the multilayer electronic component can be alleviated.

[0040] Referring to FIG. 7, the main body 110 can be formed by repeatedly laminating an internal electrode layer and a floating electrode layer in a first direction with a dielectric layer 111 interposed therebetween. Cover portions 112 and 113 can be disposed on the upper and lower surfaces in the first direction of the region where the internal electrode layer and the floating electrode layer are repeatedly laminated in the first direction with the dielectric layer 111 interposed therebetween.

[0041] The materials for forming the first electrode pattern, the second electrode pattern, and the third electrode patterns 11, 12, and 13 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the first electrode pattern, the second electrode pattern, and the third electrode patterns 11, 12, and 13 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0042] The first electrode pattern, the second electrode pattern, and the third electrode patterns 11, 12, and 13 can be formed by printing a conductive paste on a ceramic green sheet, and as the printing method, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0043] The average thickness of the internal electrode layer is not particularly limited.

[0044] When aiming at miniaturization and high capacitance of the multilayer electronic component 100, the average thickness of the internal electrode layer may be 0.35 μm or less, and when aiming at improving the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness of the internal electrode layer may be 3 μm or more.

[0045] The method for measuring the average thickness of the internal electrode layer is not particularly limited. For example, the average thickness of the internal electrode layer is extracted from an image obtained by scanning the width and the cross-section in the thickness direction (W-T cross-section) cut at the central part in the length direction of the main body 110 with a scanning electron microscope (SEM). Among the internal electrode layers, for a total of five internal electrode layers, namely two upper layers and two lower layers, with reference to the internal electrode layer at the point where the center line in the length direction and the center line in the thickness direction of each capacitance forming part Ac1, Ac2 meet, after determining five points, namely two points on the left side and two points on the right side, at equal intervals with one reference point as the center, with reference to the point where the center line in the length direction and the center line in the thickness direction of each capacitance forming part Ac1, Ac2 meet, the thickness at each point is measured and the average value can be measured.

[0046] Referring to FIGS. 2 to 4, the main body 110 can include cover parts 112 and 113 disposed above and below the first capacitance forming part Ac1 and the second capacitance forming part Ac2 in the first direction.

[0047] The cover parts 112 and 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the first capacitance forming part Ac1 and the second capacitance forming part Ac2, respectively, and can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0048] The cover parts 112 and 113 do not include internal electrodes and can include a dielectric layer 111 and a dielectric material. That is, the cover parts 112 and 113 can include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0049] On the one hand, the thickness of the cover parts 112 and 113 does not need to be particularly limited. For example, the average thickness of the cover parts 112 and 113 may be 10 to 300 μm. The average thickness of the cover parts 112 and 113 can mean the size in the first direction, and can be the value obtained by averaging the sizes in the first direction of the cover parts 112 and 113 measured at five equally spaced points above or below the first capacitance forming part RA1, the second capacitance forming part RA2, and the non-capacitance forming part RC.

[0050] Margin parts 114 and 115 can be arranged on the side surfaces of the first capacitance forming part Ac1 and the second capacitance forming part Ac2.

[0051] Referring to FIG. 4, the margin parts 114 and 115 can be arranged on both end surfaces in the width direction of the ceramic body 110.

[0052] As shown in FIGS. 3 to 5, the margin parts 114 and 115 can mean the regions between the interfaces of both ends in the third direction of the internal electrode layer 121 or the floating electrode layer 122 and the main body 110 in the cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0053] The margin parts 114 and 115 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0054] The margin parts 114 and 115 may be formed by applying a conductive paste to form the first to third electrode patterns except for the locations where the margin parts are formed on the ceramic green sheet.

[0055] Also, in order to suppress steps, after laminating the dielectric layer 111, the internal electrode layer 121, and the floating electrode layer 122, after cutting so that the internal electrode layer 121 and the floating electrode layer 122 are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers may be laminated in the third direction (width direction) to form the margin parts 114 and 115.

[0056] On the other hand, the widths of the margin portions 114 and 115 do not need to be particularly limited. For example, the widths of the margin portions 114 and 115 may be 5 to 300 μm.

[0057] The average widths of the margin portions 114 and 115 can mean the average size in the third direction of the region where the internal electrode is separated from the fifth surface and the average size in the third direction of the region where the internal electrode is separated from the sixth surface, and can be the value obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surfaces of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2.

[0058] The external electrodes 130 and 140 can be arranged on the third surface 3 and the fourth surface 4 of the main body 110.

[0059] The external electrodes 130 and 140 can be respectively arranged on the third and fourth surfaces 3 and 4 of the main body 110 and include first and second external electrodes 130 and 140 respectively connected to the first and second electrode patterns 121 and 122. Specifically, the first external electrode 130 can be arranged on the third surface 3 and connected to the first electrode pattern 11, and the second external electrode 140 can be arranged on the fourth surface 4 and connected to the second electrode pattern 12.

[0060] In this embodiment, the structure in which the multilayer electronic component 100 has two external electrodes 130 and 140 is described, but the number, shape, etc. of the external electrodes 130 and 140 can be changed according to the form of the internal electrode layer and other purposes.

[0061] On the other hand, the external electrodes 130 and 140 may be formed of any material as long as it has electrical conductivity, such as metal, and a specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may further have a multilayer structure.

[0062] For example, the external electrodes 130 and 140 can include an electrode layer arranged on the main body 110 and a plating layer formed on the electrode layer.

[0063] To give a more specific example of the electrode layer, the electrode layer may be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and a resin.

[0064] Also, the electrode layer may be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Further, the electrode layer may be formed by a method of transferring a sheet containing a conductive metal onto the main body, or may be formed by a method of transferring a sheet containing a conductive metal onto the fired electrode. Also, the electrode layer may be formed of a plating layer, or may be a layer formed using a vapor deposition method such as sputtering or ALD (Atomic layer deposition).

[0065] As the conductive metal contained in the electrode layer, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0066] The plating layer plays a role in improving the mounting characteristics. The type of the plating layer is not particularly limited, and it may be a plating layer containing one or more of Ni, Sn, Pd, and their alloys, or may be formed of a plurality of layers.

[0067] To give a more specific example of the plating layer, the plating layer may be a Ni plating layer or a Sn plating layer, or may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or may be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Also, the plating layer may contain a plurality of Ni plating layers and / or a plurality of Sn plating layers. Also, the plating layer may be in a form in which a Ni plating layer and a Pd plating layer are sequentially formed on the electrode layer.

[0068] The size of the multilayer electronic component 100 does not need to be particularly limited. According to the present invention, since it is advantageous for miniaturization and high capacity, it can also be applied to the size of IT products with a small size, and since high reliability can be ensured in various environments, it can also be applied to the size of automotive electrical components that require high reliability.

[0069] Referring to FIG. 5(a), the multilayer electronic component according to the comparative example includes an internal electrode layer including a first pattern 11' and a second pattern 12' that are separated in the second direction and not separated in the third direction, and a floating electrode layer 13'. On the other hand, in FIG. 5(a), the illustration of the dielectric layer disposed between the internal electrode layer and the floating electrode layer is omitted.

[0070] In the case of the multilayer electronic component according to the comparative example, stress may concentrate at the corners where the internal electrode patterns having different polarities overlap each other when a voltage is applied. The region where such stress concentrates is represented by P' in FIG. 5(a).

[0071] When a voltage is applied to the multilayer electronic component according to the comparative example, an electric field is formed in the first direction in the region where the first pattern 11' and the floating electrode layer overlap in the first direction, and an electric field is formed in the first direction in the region where the second pattern 12' and the floating electrode layer 13' overlap in the first direction. As a result, the stress concentration region P' in the multilayer electronic component can be concentrated and formed at the interface between the capacitance forming portion and the margin portion, and at the interface between the capacitance forming portion and the non-capacitance forming portion.

[0072] Referring to FIG. 5(b), the multilayer electronic component according to the embodiment includes an internal electrode layer including a first electrode pattern 11 and a second electrode pattern 12 that are separated and disposed in the third direction, and a floating electrode layer 122. On the other hand, in FIG. 5(b), the illustration of the dielectric layer disposed between the internal electrode layer and the floating electrode layer is omitted.

[0073] In Fig. 5(b), the stress concentration region is denoted by P. Referring to Fig. 5(b), it can be confirmed that the distribution of the stress concentration region P is different from the distribution of the stress concentration region P' in Fig. 5(a).

[0074] Such a difference in stress distribution is presumably due to the fact that the first and second electrode patterns 11', 12' of the internal electrode layer of the multilayer electronic component according to the comparative example are separated only in the second direction, while the first and second electrode patterns 11', 12' of the internal electrode layer of the multilayer electronic component according to the embodiment are separated and arranged in the third direction.

[0075] On the other hand, in the multilayer electronic component according to one embodiment of the present invention and the multilayer electronic component according to still another embodiment of the present invention, by also forming an electric field formed in the first direction between the internal electrode layer 121 and the floating electrode layer 122 in the second direction or the third direction, the stress acting on the stress concentration region P shown in Fig. 5(b) can be offset.

[0076] Specifically, referring to Fig. 6(b), the floating electrode layer 122 of the multilayer electronic component 100 according to one embodiment of the present invention includes a third electrode pattern 13 disposed apart from the third surface 3 and the fourth surface 4, a fourth electrode pattern 14 disposed apart from the third electrode pattern and connected to the third surface 3, and a fifth electrode pattern 15 disposed apart from the third electrode pattern 13 and connected to the fourth surface 4.

[0077] When the floating electrode layer 122 includes the third electrode pattern 13 disposed apart from the third surface 3 and the fourth surface 4, the fourth electrode pattern 14 disposed apart from the third electrode pattern and connected to the third surface 3, and the fifth electrode pattern 15 disposed apart from the third electrode pattern 13 and connected to the fourth surface 4, an electric field having a second-direction or third-direction component can be formed between the third electrode pattern 13 and the fourth electrode pattern 14 and between the third electrode pattern 13 and the fifth electrode pattern 15.

[0078] As a result, tensile stress concentrates only in the first direction, including only the third electrode pattern 13 in which the floating electrode layer 122 is disposed at a distance from the third surface 3 and the fourth surface 4. In contrast to the conventional case where compressive stress concentrates in the second and third directions, compressive stress can be generated in the first direction and tensile stress can be generated in the second and third directions. Therefore, the stress acting on the stress concentration region P shown in FIG. 5(b) can be offset, improving the reliability of the multilayer electronic component 100, including its BDV characteristics.

[0079] In one embodiment, the first electrode pattern 11 can be disposed at a distance from the fourth surface 4, and the second electrode pattern 12 can be disposed at a distance from the third surface 3. Therefore, the first electrode pattern 11 and the second electrode pattern 12 can have different polarities from each other.

[0080] In one embodiment, the first electrode pattern 11 and the second electrode pattern 12 can be disposed at a distance from the fifth surface 5 and the sixth surface 6, and the third electrode pattern 13, the fourth electrode pattern 14, and the fifth electrode pattern 15 can be disposed at a distance from the fifth surface 5 and the sixth surface 6. As a result, the internal electrode layer 121 and the floating electrode layer 122 can be prevented from being exposed outside the main body 110, improving the moisture resistance reliability of the multilayer electronic component 100.

[0081] In one embodiment, the first electrode pattern 11 includes a first connection portion 11b in contact with the external electrode 130, a first main body portion 11a extending in the second direction from the first connection portion 11b and having a longer length in the second direction and a narrower width in the third direction than the first connection portion 11b. The second electrode pattern 12 can include a second connection portion 12b in contact with the external electrode 140, a second main body portion 12a extending in the second direction from the second connection portion 12b and having a longer length in the second direction and a narrower width in the third direction than the second connection portion 12b.

[0082] The first connection portion 11b and the second connection portion 12b can mean regions that are in contact with the external electrodes 130 and 140, respectively. On the other hand, the first connection portion 11b and the second connection portion 12b do not have to overlap with the third electrode pattern 13 in the first direction.

[0083] At least a part of the first main body portion 11a and at least a part of the second main body portion 12a can overlap with a part of the third electrode pattern 13 in the first direction, respectively, whereby a capacitance can be formed.

[0084] On the other hand, the first main body portion 11a extends from the first connection portion 11b in the second direction and is arranged such that the length in the second direction is longer than that of the first connection portion 11b, and the width in the third direction is narrower. The second main body portion 12a extends from the second connection portion 12b in the second direction and is arranged such that the length in the second direction is longer than that of the second connection portion 12b, and the width in the third direction is narrower. Therefore, an electric field in the second direction or the third direction component can be formed between the first main body portion 11a and the second connection portion 12b and between the second main body portion 12a and the first connection portion 11b.

[0085] As a result, compared with the conventional case where the internal electrode layer 121 includes a first electrode pattern that is separated in the second direction and connected to the third surface 3 and a second electrode pattern that is connected to the fourth surface, and the lengths and widths of the main body portion and the connection portion are substantially constant, the stress applied to the stress concentration region can be offset, so that the reliability including the BDV characteristics of the multilayer electronic component 100 can be improved.

[0086] On one hand, a third electrode pattern 13 in which a floating electrode layer 122 is disposed at a distance from a third surface 3 and a fourth surface 4, a fourth electrode pattern 14 disposed at a distance from the third electrode pattern and connected to the third surface 3, and a fifth electrode pattern 15 disposed at a distance from the third electrode pattern 13 and connected to the fourth surface 4 are included. A first connection portion 11b where a first electrode pattern 11 contacts an external electrode 130, and a first main body portion 11a that extends in a second direction from the first connection portion 11b and has a longer length in the second direction and a narrower width in a third direction than the first connection portion 11b are included. A second connection portion 12b where a second electrode pattern 12 contacts an external electrode 140, and a second main body portion 12a that extends in the second direction from the second connection portion 12b and has a longer length in the second direction and a narrower width in the third direction than the second connection portion 12b are included. In this case, since an effect of canceling stress can be obtained in each layer of the internal electrode layer 121 and the floating electrode layer 122, the effect of improving the reliability including the BDV characteristics of the stacked electronic component 100 according to the present invention can be further remarkable.

[0087] On one hand, the first main body part can be arranged at a distance from the second connection part in the second direction, and the second main body part can be arranged at a distance from the first connection part in the second direction. Thereby, the first electrode pattern and the second electrode pattern can also be arranged at a distance from each other in the second direction. At this time, when the distance in the second direction between the first main body part and the fourth surface is LM1, the distance in the second direction between the first main body part and the second connection part is L1, the distance in the second direction between the second main body part and the third surface is LM2, and the distance in the second direction between the second main body part and the first connection part is L2, if L1 / LM1 is less than 1 / 8 or L2 / LM2 is less than 1 / 8, there may be a short circuit between the first electrode pattern 11 and the second electrode pattern 12. If L1 / LM1 exceeds 1 / 3 or L2 / LM2 exceeds 1 / 3, the bonding force between the first connection part 11b and the second connection part 12b and the external electrodes 130 and 140 may become weak. Therefore, in one embodiment, L1 / LM1 can satisfy 1 / 8 or more and 1 / 3 or less, and L2 / LM2 can satisfy 1 / 8 or more and 1 / 3 or less. Thereby, it is possible to prevent a short circuit between the first electrode pattern 11 and the second electrode pattern 12 and ensure a sufficient bonding force between the connection parts 11b and 12b and the external electrodes 130 and 140.

[0088] The method for measuring each of the distance LM1 in the second direction between the first main body part and the fourth surface, the distance L1 in the second direction between the first main body part and the second connection part, the distance LM2 in the second direction between the second main body part and the third surface, and the distance L2 in the second direction between the second main body part and the first connection part is not particularly limited.

[0089] The above L1 and LM1 are average values measured by a scanning electron microscope (SEM) or an optical microscope (OP) or the like in the cross section in the first direction and the second direction polished to the 1 / 4 point in the third direction of the multilayer electronic component so that the first main body part 11a and the second connection part 12b are simultaneously exposed, based on the first main body part 11a arranged at the center in the first direction among the internal electrode layers arranged above in the first direction and the internal electrode layers arranged below in the first direction with two or more layers each.

[0090] In the cross-sections in the first and second directions polished up to the 3 / 4 point in the third direction of the multilayer electronic component so that the above L2 and LM2 expose the second main body portion 12a and the first connection portion 11b at the same time, based on the second main body portion 12a arranged at the center in the first direction, it can be the average value measured by a scanning electron microscope (SEM) or an optical microscope (OP) or the like from two or more internal electrode layers arranged above in the first direction and two or more internal electrode layers arranged below in the first direction.

[0091] In one embodiment, the corners of the first and second main body portions may have a rounded shape, and the corners of the third electrode pattern may have a rounded shape. Thereby, the phenomenon that stress concentrates on a specific position of the electrode pattern can be alleviated. Therefore, the effect of improving the reliability including the BDV characteristics of the multilayer electronic component 100 according to one embodiment of the present invention can be further improved.

[0092] In one embodiment, the dielectric layer 111 may contain Ba and Ti. When the dielectric layer 111 is formed of a normal dielectric corresponding to EIA Class 1, even when a voltage is applied, the electrostriction phenomenon occurs slightly or hardly at all, whereas when the dielectric layer 111 is formed of a ferroelectric dielectric corresponding to EIA Class 2, for example, when the dielectric layer 111 contains Ba and Ti, deformation due to the electrostriction phenomenon may occur to a measurable extent, and such deformation may cause stress to occur inside the multilayer electronic component 100.

[0093] On the other hand, according to one embodiment of the present invention, even when the dielectric layer 111 contains Ba and Ti, the stress applied to the region where stress concentrates can be offset. That is, when the dielectric layer 111 contains Ba and Ti, the effect of improving the reliability including the BDV characteristics according to one embodiment of the present invention can be further improved.

[0094] Hereinafter, a multilayer electronic component 100 according to still another embodiment of the present invention will be described, but descriptions overlapping with those of the multilayer electronic component 100 according to the above-described embodiment of the present invention will be omitted.

[0095] Various examples of the multilayer electronic component according to an embodiment of the present invention can be similarly applied to the multilayer electronic component according to still another embodiment of the present invention described later.

[0096] The floating electrode layer 122 of the multilayer electronic component 100 according to still another embodiment of the present invention includes a third electrode pattern 13 disposed apart from the third surface 3 and the fourth surface 4. The first electrode pattern 11 includes a first connection portion 11b in contact with the external electrode 130, and a first main body portion 11a that extends in the second direction from the first connection portion 11b and has a longer length in the second direction and a narrower width in the third direction than the first connection portion 11b. The second electrode pattern 12 can include a second connection portion 12b in contact with the external electrode 140, and a second main body portion 12a that extends in the second direction from the second connection portion 12b and has a longer length in the second direction and a narrower width in the third direction than the second connection portion 12b.

[0097] The first connection portion 11b and the second connection portion 12b can mean regions in contact with the external electrodes 130 and 140, respectively. On the other hand, the first connection portion 11b and the second connection portion 12b do not have to overlap the third electrode pattern 13 in the first direction.

[0098] At least a part of the first main body portion 11a and at least a part of the second main body portion 12a can overlap a part of the third electrode pattern 13 in the first direction, thereby forming a capacitance.

[0099] On the one hand, the first main body portion 11a is arranged to extend in the second direction from the first connection portion 11b, and has a longer length in the second direction and a narrower width in the third direction than the first connection portion 11b. The second main body portion 12a is arranged to extend in the second direction from the second connection portion 12b, and has a longer length in the second direction and a narrower width in the third direction than the second connection portion 12b. Therefore, an electric field with a second direction or third direction component can be formed between the first main body portion 11a and the second connection portion 12b and between the second main body portion 12a and the first connection portion 11b.

[0100] As a result, the internal electrode layer 121 is separated in the second direction and includes a first electrode pattern connected to the third surface 3 and a second electrode pattern connected to the fourth surface. Compared with the conventional structure in which the lengths and widths of the main body portion and the connection portion are substantially constant, the stress applied to the stress concentration region can be offset. Therefore, the reliability such as the BDV characteristics of the multilayer electronic component 100 can be improved.

[0101] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the technical field without departing from the technical idea of the present invention described in the claims, and this can also be said to belong to the scope of the present invention.

[0102] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, it does not exclude that the above-mentioned one embodiment is realized in combination with the features of another one embodiment. For example, even if a matter described in a specific one embodiment is not described in another one embodiment, it can be understood and related to the description of another one embodiment as long as there is no description contrary to or conflicting with that matter in another one embodiment.

[0103] The terms used in this disclosure are merely used to describe an embodiment and are not intended to limit this disclosure. At this time, the singular expression includes plural expressions unless the context clearly indicates a different meaning.

Explanation of Signs

[0104] 100: Multilayer electronic component 110: Body 111: Dielectric layer 121: Internal electrode layer 122: Floating electrode layer 11: First electrode pattern 12: Second electrode pattern 13: Third electrode pattern 14: Fourth electrode pattern 15: Fifth electrode pattern 130, 140: External electrode 112, 113: Cover part 114, 115: Margin part

Claims

1. A body including a dielectric layer, internal electrode layers and floating electrode layers alternately arranged in a first direction with the dielectric layer therebetween, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, and external electrodes respectively disposed on the third surface and the fourth surface. The internal electrode layer includes a first electrode pattern connected to the third surface, and a second electrode pattern disposed at a distance from the first electrode pattern in the third direction and connected to the fourth surface. The floating electrode layer includes a third electrode pattern disposed at a distance from the third surface and the fourth surface, a fourth electrode pattern disposed at a distance from the third electrode pattern and connected to the third surface, and a fifth electrode pattern disposed at a distance from the third electrode pattern and connected to the fourth surface, which is a multilayer electronic component.

2. The multilayer electronic component according to Claim 1, wherein the first electrode pattern is disposed at a distance from the fourth surface, and the second electrode pattern is disposed at a distance from the third surface.

3. The first electrode pattern and the second electrode pattern are disposed at a distance from the fifth surface and the sixth surface. The multilayer electronic component according to Claim 1, wherein the third electrode pattern, the fourth electrode pattern and the fifth electrode pattern are disposed at a distance from the fifth surface and the sixth surface.

4. The first electrode pattern includes a first connection portion in contact with the external electrode on the third surface, and a first main body portion extending from the first connection portion in the second direction and having a longer length in the second direction and a narrower width in the third direction than the first connection portion. The second electrode pattern includes a second connection portion in contact with the external electrode on the fourth surface, and a second main body portion extending from the second connection portion in the second direction and having a longer length in the second direction and a narrower width in the third direction than the second connection portion, which is the multilayer electronic component according to Claim 1.

5. The first main body portion is disposed at a distance from the second connection portion in the second direction, and the second main body portion is disposed at a distance from the first connection portion in the second direction. The distance in the second direction between the first main body portion and the fourth surface is LM1, and the distance in the second direction between the first main body portion and the second connection portion is L1. When the distance in the second direction between the second main body portion and the third surface is LM2, and the distance in the second direction between the second main body portion and the first connection portion is L2, The laminated electronic component according to claim 4, wherein L1 / LM1 satisfies 1 / 8 or more and 1 / 3 or less, and L2 / LM2 satisfies 1 / 8 or more and 1 / 3 or less.

6. The corners of the first and second main body portions have a rounded shape, The laminated electronic component according to claim 4, wherein the corners of the third electrode pattern have a rounded shape.

7. The laminated electronic component according to claim 1, wherein the dielectric layer contains Ba and Ti.

8. The laminated electronic component according to claim 1, wherein the average thickness of the dielectric layer is 20 μm or more.

9. Including a dielectric layer, internal electrode layers and floating electrode layers alternately arranged in the first direction with the dielectric layer interposed therebetween, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in the second direction, a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in the third direction, a main body, External electrodes respectively disposed on the third surface and the fourth surface, The internal electrode layer includes a first electrode pattern connected to the third surface, and a second electrode pattern disposed at a distance from the first electrode pattern in the third direction and connected to the fourth surface. The floating electrode layer includes a third electrode pattern disposed at a distance from the third surface and the fourth surface. The first electrode pattern includes a first connection portion in contact with the external electrode on the third surface and a first main body portion extending from the first connection portion in the second direction and having a longer length in the second direction and a narrower width in the third direction than the first connection portion. The second electrode pattern includes a second connection portion in contact with the external electrode on the fourth surface and a second main body portion extending from the second connection portion in the second direction and having a longer length in the second direction and a narrower width in the third direction than the second connection portion, a laminated electronic component.

10. The laminated electronic component according to claim 9, wherein the first electrode pattern is disposed at a distance from the fourth surface, and the second electrode pattern is disposed at a distance from the third surface.

11. The first electrode pattern and the second electrode pattern are disposed at a distance from the fifth surface and the sixth surface, The laminated electronic component according to claim 9, wherein the third electrode pattern is disposed at a distance from the fifth surface and the sixth surface.

12. The first main body portion is arranged at a distance from the second connection portion in the second direction, and the second main body portion is arranged at a distance from the first connection portion in the second direction. Let the distance in the second direction between the first main body portion and the fourth surface be LM1, and the distance in the second direction between the first main body portion and the second connection portion be L1. When the distance in the second direction between the second main body portion and the third surface is LM2, and the distance in the second direction between the second main body portion and the first connection portion is L2. The laminated electronic component according to claim 9, wherein L1 / LM1 satisfies 1 / 8 or more and 1 / 3 or less, and L2 / LM2 satisfies 1 / 8 or more and 1 / 3 or less.

13. The corners of the first and second main body portions have a rounded shape. The laminated electronic component according to claim 9, wherein the corners of the third electrode pattern have a rounded shape.

14. The laminated electronic component according to claim 9, wherein the dielectric layer contains Ba and Ti.

15. The laminated electronic component according to claim 9, wherein the average thickness of the dielectric layer is 20 μm or more.

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