Laminated type electronic component

Abstract

To provide a laminated type electronic component which is excellent in reliability, improves a contact property between an internal electrode and an external electrode, has low equivalent series resistance (ESR), and is excellent in capacity while being small-sized.SOLUTION: A laminated type electronic component includes: a body which includes a capacity formation part that includes a dielectric layer and an internal electrode alternately arranged with the dielectric layer in a first direction, cover parts arranged on both surfaces in the first direction of the capacity formation part, and side margin parts arranged on both surfaces in a third direction of the capacity formation part and the cover part; and external electrodes arranged on third and fourth surfaces, wherein in the cross sections in the first and third directions of the body, one or more IPs as points having opposite gradients of a tangent line to the outer surface of the body are arranged in one or more edge regions, and when the maximum thickness in the first direction of the body is represented by T, the maximum length in a second direction of the body is represented by L, and the maximum width in the third direction of the body is represented by W, W<T<L can be satisfied.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one of multilayer electronic components, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video devices such as liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Due to the advantages of being small in size while ensuring high capacitance and being easy to mount, multilayer ceramic capacitors can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices are miniaturized and have increased output, the demand for miniaturization and high capacitance of multilayer ceramic capacitors is increasing.

[0004] Generally, an MLCC has a structure where the width and thickness are the same. To achieve high capacitance, it is necessary to increase the number of layers by thinning the dielectric layer and the internal electrodes. However, due to technical limitations, it is not easy to achieve a high number of layers in a structure where the width and thickness of the chip are the same. Therefore, a high-profile ceramic capacitor (HPCC) product that increases the thickness of the chip to achieve a high number of layers has been developed.

[0005] An HPCC has a structure where the thickness T is thicker than the width W, and can increase the number of layers compared to a general MLCC having the same structure of width and thickness, and can easily achieve high capacitance.

[0006] Such an HPCC has an increased number of stacked layers compared to general MLCCs, and the contact between the internal electrodes and the external electrodes is one of the factors that significantly affect reliability.

Summary of the Invention

Problems to be Solved by the Invention

[0007] One of the various objects of the present invention is to provide a multilayer electronic component with excellent reliability.

[0008] One of the various objects of the present invention is to provide a multilayer electronic component with improved contact between the internal electrodes and the external electrodes.

[0009] One of the various objects of the present invention is to provide a multilayer electronic component with a low equivalent series resistance (ESR).

[0010] One of the various objects of the present invention is to provide a multilayer electronic component that is small in size yet excellent in capacitance.

[0011] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0012] A multilayer electronic component according to an embodiment of the present invention includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in a third direction, and includes a capacitance forming portion including a dielectric layer and internal electrodes alternately arranged with the dielectric layer in the first direction, cover portions arranged on both surfaces of the capacitance forming portion in the first direction, and side margin portions arranged on both surfaces of the capacitance forming portion and the cover portions in the third direction, and an external electrode arranged on the third and fourth surfaces. In cross-sections of the main body in the first and third directions of the main body, one or more IPs, which are points where the inclination of the tangent to the outer surface of the main body is reversed, are arranged in one or more edge regions. When the maximum thickness of the main body in the first direction is T, the maximum length of the main body in the second direction is L, and the maximum width of the main body in the third direction is W, W < T < L can be satisfied.

Advantages of the Invention

[0013] As one of the various effects of the present invention, the reliability of the multilayer electronic component can be improved.

[0014] As one of the various effects of the present invention, the contact property between the internal electrode and the external electrode can be improved.

[0015] As one of the various effects of the present invention, a multilayer electronic component with a low equivalent series resistance (ESR) can be provided.

[0016] As one of the various effects of the present invention, a multilayer electronic component that is small in size and excellent in capacitance can be provided.

[0017] However, the various and meaningful advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0019] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0020] In order to clearly describe the present invention in the drawings, parts not related to the description are omitted. The sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of description, and thus the present invention is not necessarily limited by the illustrations. Also, components with the same functions within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0021] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0022] Multilayer electronic component FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. FIG. 2 schematically shows a perspective view of a main body according to an embodiment of the present invention. FIG. 3 shows the main body of FIG. 2 excluding the side margin portion. FIG. 4 schematically shows a cross-sectional view taken along line I-I' of FIG. 1. FIG. 5 schematically shows a cross-sectional view taken along line II-II' of FIG. 1. FIG. 6 is an enlarged view of the K1 region of FIG. 5.

[0023] Hereinafter, with reference to FIGS. 1 to 6, a stacked electronic component 100 according to an embodiment of the present invention will be described in detail. Also, as an example of the stacked electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto, and it can also be applied to various stacked electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0024] A multilayer electronic component 100 according to an embodiment of the present invention includes first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing each other in a third direction. The multilayer electronic component 100 includes a capacitance forming portion Ac including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer in the first direction, cover portions 112 and 113 arranged on both surfaces of the capacitance forming portion in the first direction, and side margin portions 114 and 115 arranged on both surfaces of the capacitance forming portion and the cover portions in the third direction. The multilayer electronic component 100 further includes external electrodes 131 and 132 arranged on the third and fourth surfaces. In a cross section of the main body in the first and third directions, one or more IPs, which are points where the inclination of the tangent to the outer surface of the main body is opposite, are arranged in one or more edge regions. When the maximum thickness of the main body in the first direction is T, the maximum length of the main body in the second direction is L, and the maximum width of the main body in the third direction is W, W < T < L can be satisfied.

[0025] According to an embodiment of the present invention, one or more IPs, which are points where the inclination of the tangent to the outer surface of the main body is opposite, are arranged in one or more edge regions of the main body 110. When the maximum thickness of the main body in the first direction is T, the maximum length of the main body in the second direction is L, and the maximum width of the main body in the third direction is W, by satisfying W < T < L, the contact property between the internal electrode and the external electrode can be improved, and a high capacitance can be ensured.

[0026] Hereinafter, each component included in the multilayer electronic component 100 according to an embodiment of the present invention will be described.

[0027] In the main body 110, the dielectric layer 111 and the internal electrodes 121 and 122 can be alternately laminated.

[0028] There is no particular limitation on the specific shape of the main body 110. As shown in the drawings, the main body 110 can have a hexahedral shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 may not have a perfect hexahedral shape with straight lines.

[0029] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0030] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not particularly limited and can be determined in consideration of the size of the multilayer electronic component. For example, 400 or more dielectric layers can be stacked to form the main body.

[0031] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder, normal dielectric powder of a CaZrO3 substrate, etc. can be used as the ceramic powder. More specifically, as the barium titanate (BaTiO3)-based powder, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1) can be one or more of them, and the normal dielectric powder of the CaZrO3 substrate is (Ca 1-x Sr x )(Zr 1-y Tiy )O3 (where 0 < x < 1, 0 < y < 1) can be satisfied.

[0032] Therefore, the dielectric layer 111 can include one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0033] The main body 110 can include a capacitance forming portion Ac that is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are disposed to face each other with the dielectric layer 111 interposed therebetween, and cover portions 112 and 113 formed on the upper and lower portions of the capacitance forming portion Ac in the first direction.

[0034] Also, the capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0035] The cover portions 112 and 113 can be disposed on both sides of the capacitance forming portion Ac in the first direction.

[0036] The cover portions 112 and 113 can include a first cover portion 112 disposed on the upper portion of the capacitance forming portion Ac in the first direction and a second cover portion 113 disposed on the lower portion of the capacitance forming portion Ac in the first direction. The first cover portion 112 can be referred to as the upper cover portion, and the second cover portion 113 can be referred to as the lower cover portion.

[0037] The first cover portion 112 and the second cover portion 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0038] The first cover portion 112 and the second cover portion 113 do not include internal electrodes and can include the same material as the dielectric layer 111.

[0039] That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, can include a barium titanate (BaTiO3)-based ceramic material.

[0040] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness tc of the cover portions 112 and 113 can be 20 μm or less. Also, when the size of the multilayer electronic component 100 is 0402 (length: 0.4 mm, width: 0.2 mm), the thickness tc of the cover portions 112 and 113 can be 18 μm or less.

[0041] The average thickness tc of the cover portions 112 and 113 can mean the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions 112 and 113 measured at five equally spaced points above or below the capacitance forming portion Ac.

[0042] The side margin portions 114 and 115 can be disposed on both sides in the third direction of the capacitance forming portion Ac and the cover portions 112 and 113.

[0043] The side margin portions 114 and 115 can include a first side margin portion 114 disposed on one side in the third direction of the capacitance forming portion Ac and the cover portions 112 and 113, and a second side margin portion 115 disposed on the other side in the third direction.

[0044] A ceramic green sheet and a ceramic green sheet printed with an internal electrode pattern are laminated to form a laminate that becomes a capacitance forming portion Ac and cover portions 112 and 113 after a sintering process. After that, one or more ceramic green sheets can be laminated in the third direction on both sides of the laminate in the third direction to form side margin portions 114 and 115.

[0045] The side margin portions 114 and 115 can basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0046] On the other hand, the width of the side margin portions 114 and 115 does not particularly need to be limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width Wm of the side margin portions 114 and 115 can be 17 μm or less.

[0047] The average width Wm of the side margin portions 114 and 115 can mean the average size in the third direction of the region where the internal electrodes 121 and 122 are separated from the fifth surface and the average size in the third direction of the region where the internal electrodes 121 and 122 are separated from the sixth surface, and can be a value obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five points having equal intervals in the first direction on the side surface of the capacitance forming portion Ac.

[0048] Therefore, in one embodiment, the average size in the third direction of the region where the internal electrodes 121 and 122 are separated from the fifth and sixth surfaces can be 17 μm or less, respectively.

[0049] The internal electrodes 121 and 122 can include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0050] The first internal electrode 121 is separated from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 is disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 can be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0051] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3.

[0052] Also, the first and second internal electrodes 121, 122 can be disposed separated from the fifth and sixth surfaces of the main body 110. Both ends of the first and second internal electrodes 121, 122 in the third direction can contact the side margin portions 114, 115.

[0053] The conductive metal included in the internal electrodes 121, 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0054] The average thickness td of the dielectric layer 111 does not need to be particularly limited, but can be, for example, 0.1 μm to 10 μm. The average thickness te of the internal electrodes 121, 122 does not need to be particularly limited, but can be, for example, 0.05 μm to 3.0 μm. Also, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121, 122 can be arbitrarily set according to desired characteristics and applications. For example, in order to achieve miniaturization and high capacitance, in the case of small IT electronic components, the average thickness td of the dielectric layer 111 can be 0.45 μm or less, and the average thickness te of the internal electrodes 121, 122 can be 0.45 μm or less.

[0055] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 respectively represent the sizes of the dielectric layer 111 and the internal electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, for the average thickness td of the dielectric layer 111, the thickness can be measured at a number of points on one dielectric layer 111, for example, 30 points at equal intervals in the second direction, and the average value can be measured. Also, for the average thickness te of the internal electrodes 121 and 122, the thickness can be measured at a number of points on one internal electrode 121 or 122, for example, 30 points at equal intervals in the second direction, and the average value can be measured. The above 30 points at equal intervals can be specified in the capacitance forming portion Ac. On the other hand, after performing such average value measurements for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively and then measuring the average value, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0056] The external electrodes 131 and 132 can be arranged on the third surface 3 and the fourth surface 4 of the main body 110.

[0057] The external electrodes 131 and 132 can include first and second external electrodes 131 and 132 respectively arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to the first and second internal electrodes 121 and 122 respectively.

[0058] Referring to FIG. 1, the external electrodes 131 and 132 can be arranged to cover both end faces in the second direction of the side margin portions 114 and 115.

[0059] In this embodiment, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described, but the number, shape, etc. of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0060] On the one hand, the external electrodes 131 and 132 can be formed using any material as long as it has electrical conductivity such as metal, etc., and a specific material can be determined in consideration of electrical characteristics, structural stability, etc., and it can further have a multilayer structure.

[0061] For example, the external electrodes 131 and 132 can include an electrode layer disposed on the main body 110 and a plating layer formed on the electrode layer.

[0062] To give a more specific example of the electrode layer, the electrode layer can be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and a resin.

[0063] Also, the electrode layer can be in a form where a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the electrode layer can be formed by a method of transferring a sheet containing a conductive metal onto the main body, or can be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0064] As the conductive metal contained in the electrode layer, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0065] The plating layer plays a role in improving mounting characteristics. The type of the plating layer is not particularly limited, and it can be a plating layer containing one or more of Ni, Sn, Pd, and their alloys, and can be formed of multiple layers.

[0066] More specific examples for the plating layer are as follows. The plating layer can be a Ni plating layer or a Sn plating layer, and can be in a form where a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or can be in a form where a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Also, the plating layer can include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0067] In the cross-sections of the main body 110 in the first and third directions, one or more IPs, which are points where the inclination of the tangent to the outer surface of the main body is opposite, can be arranged in one or more edge regions. Thereby, the joining property of the external electrodes 131 and 132 to the main body can be improved, and the contact property between the internal electrodes 121 and 122 and the external electrodes 131 and 132 can be improved. As the contact property between the internal electrodes 121 and 122 and the external electrodes 131 and 132 is improved, the equivalent series resistance (ESR) can be reduced.

[0068] On the other hand, among the four edge regions in the cross-sections of the main body 110 in the first and third directions, although one edge region will be described, the four edge regions are in a symmetric relationship, including the case where an IP is arranged in at least any one of the four edge regions.

[0069] In one embodiment, the edge region can include a curved shape as shown in FIG. 5.

[0070] Referring to FIG. 6, which is an enlarged view of the K1 region in FIG. 5, in one embodiment, when a straight line L1 is drawn from one end of the internal electrode arranged at the uppermost part in the first direction to the upper part in the first direction, the point of contact with the outer surface of the main body is P1, and when a straight line L2 is drawn from one end of the internal electrode arranged at the uppermost part in the first direction to the third direction, the point of contact with the outer surface of the main body is P2, the IP can be arranged between P1 and P2.

[0071] In one embodiment, as shown in FIG. 6, only one IP can be arranged between P1 and P2. However, it is not limited thereto, and two or more IPs can also be arranged between P1 and P2.

[0072] On the other hand, two or more IPs can be arranged in at least one of the edge regions of the edge region.

[0073] Referring to FIG. 7, which is a drawing corresponding to FIG. 6 according to another embodiment, when a straight line L1 is drawn from one end in the third direction of the internal electrode arranged at the uppermost part in the first direction to the upper part in the first direction, the point of contact with the outer surface of the main body is P1, and when a straight line L2 is drawn from one end in the third direction of the internal electrode arranged at the uppermost part in the first direction in the third direction, when the point of contact with the outer surface of the main body is P2, when the region within half (Wm / 2) of the average width Wm of the side margin portion in the third direction at P1 is R1, and the region within half (tc / 2) of the average thickness tc of the cover portion in the first direction at P2 is R2, IP1 which is the IP arranged in R1 and IP2 which is the IP arranged in R2 can be included. That is, R1 can mean the region between the point separated by Wm / 2 on one side in the third direction at P1 and the point separated by Wm / 2 on the other side in the third direction at P1, and the size of R1 in the third direction can be the same as the size Wm of the side margin portion in the third direction. Similarly, R2 can mean the region between the point separated by tc / 2 on one side in the first direction at P2 and the point separated by tc / 2 on the other side in the first direction at P2, and the size of R2 in the first direction can be the same as the size tc of the cover portion in the first direction.

[0074] By arranging one or more IPs in R1 and R2 respectively, the bonding property of the external electrodes 131 and 132 to the main body can be further improved, and the contact property between the internal electrodes 121 and 122 and the external electrodes 131 and 132 can be further improved.

[0075] Similar to FIG. 7, IP1 can be arranged to overlap with the capacitance forming portion Ac in the first direction, and IP2 can be arranged to overlap with the capacitance forming portion Ac in the third direction.

[0076] However, it is not limited thereto. As shown in FIG. 8 corresponding to FIG. 6 according to still another embodiment, IP1 (IP1') can be arranged so as not to overlap with the capacitance forming portion Ac in the first direction, and IP2 (IP2') can be arranged so as not to overlap with the capacitance forming portion Ac in the third direction.

[0077] Also, in one embodiment, IP1 can be arranged to overlap with the capacitance forming portion Ac in the first direction, and IP2 can be arranged so as not to overlap with the capacitance forming portion Ac in the third direction.

[0078] Also, in one embodiment, IP1 can be arranged so as not to overlap with the capacitance forming portion Ac in the first direction, and IP2 can be arranged to overlap with the capacitance forming portion Ac in the third direction.

[0079] In one embodiment, one IP can be arranged on each of R1 and R2.

[0080] On the other hand, the method for forming the IP in the edge region does not need to be particularly limited. As a preferred example, the shrinkage rates of the cover portion and the side margin portion can be controlled to control the position and number of the IPs formed in the edge region. By controlling the shrinkage rates of the cover portion and the side margin portion, the sintering temperature, sintering time, etc. of the sintering process can be controlled, and the composition of the ceramic green sheet for forming the cover portion and the ceramic green sheet for the side margin portion can be controlled.

[0081] Referring to FIG. 2, when the maximum thickness of the main body 110 in the first direction is T, the maximum length of the main body 110 in the second direction is L, and the maximum width of the main body 110 in the third direction is W, W < T < L can be satisfied. By satisfying W < T, the number of layers can be increased to easily ensure a high capacitance.

[0082] Referring to FIG. 9 showing a substrate on which the stacked electronic component of FIG. 1 is mounted, the external electrodes 131 and 132 can be joined to a pair of electrode pads 210 and 220 disposed on the substrate 201 via solder 230 to mount the stacked electronic component on the substrate. Since there are fewer constraints on T than on W and L, even if the number of stacked layers is increased to increase T, a large capacity can be easily ensured without significant constraints.

[0083] In one embodiment, the above T and W can satisfy 1.1 < T / W < 1.8. By satisfying 1.1 < T / W, a large capacity can be more easily ensured, and by satisfying T / W < 1.8, the mounting reliability on the substrate can be stably ensured.

[0084] When T / W is 1.1 or less, the effect of ensuring a large capacity in the HPCC form can be insufficient, and when T / W is 1.8 or more, since the thickness is too thick with respect to the width of the main body, problems such as inclination may occur when mounting the stacked electronic component on the substrate.

[0085] The size of the stacked electronic component 100 does not particularly need to be limited.

[0086] However, the effect of improving the bondability of the external electrodes 131 and 132 according to the present invention with respect to the main body and improving the contact between the internal electrodes 121 and 122 and the external electrodes 131 and 132 can become more prominent as the size of the stacked electronic component 100 is smaller.

[0087] In particular, when the size of the stacked electronic component 100 is 0603 (length: 0.6 mm, width: 0.3 mm) or less, the effect of the present invention can become more prominent. When manufacturing errors and the like are considered, when the maximum length L in the second direction of the main body 110 is 0.69 mm or less and the maximum width W in the third direction of the main body 110 is 0.39 mm or less, the effect of the present invention can become more prominent. At this time, the maximum thickness T in the first direction of the main body 110 can be 0.55 mm or less.

[0088] To give a more specific example, when the multilayer electronic component 100 is of the 0603 size, when the maximum length L in the second direction of the main body 110 is 0.51 to 0.69 mm and the maximum width W in the third direction of the main body 110 is 0.21 to 0.39 mm, the effects according to the present invention can be made more remarkable. At this time, the maximum thickness T in the first direction of the main body 110 can be 0.45 to 0.55 mm.

[0089] Here, the maximum length L in the second direction of the main body 110 means the maximum size in the second direction of the main body 110, the maximum width W in the third direction of the main body 110 means the maximum size in the third direction of the main body 110, and the maximum thickness T in the first direction of the main body 110 can mean the maximum size in the first direction of the main body 110.

[0090] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and this can also be said to belong to the scope of the present invention.

[0091] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of another one embodiment. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to another one embodiment as long as there is no explanation contrary to or conflicting with that matter in another one embodiment.

[0092] The terms used in the present disclosure are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless the context clearly indicates otherwise.

Explanation of Reference Numerals

[0093] 100 Multilayer electronic component 110 Body 111 Dielectric layer 112, 113 Cover part 114, 115 Side margin part 121, 122 Internal electrode 131, 132 External electrode

Claims

1. including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and facing each other in a third direction, a main body including a dielectric layer, a capacitance forming portion including internal electrodes alternately arranged with the dielectric layer in the first direction, cover portions arranged on both surfaces of the capacitance forming portion in the first direction, and side margin portions arranged on both surfaces of the capacitance forming portion and the cover portions in the third direction, external electrodes arranged on the third and fourth surfaces, in a cross-section of the main body in the first and third directions, one or more IPs, which are points where the inclination of the tangent to the outer surface of the main body is opposite, are arranged in one or more edge regions, a multilayer electronic component, where when the maximum thickness of the main body in the first direction is T, the maximum length of the main body in the second direction is L, and the maximum width of the main body in the third direction is W, W < T < L is satisfied.

2. The multilayer electronic component according to claim 1, wherein the edge region includes a curved shape.

3. When a straight line is drawn from one end of the internal electrode arranged at the uppermost part in the first direction to the upper part in the first direction, the point where it contacts the outer surface of the main body is P1, and when a straight line is drawn from one end of the internal electrode arranged at the uppermost part in the first direction to the third direction, the point where it contacts the outer surface of the main body is P2, the multilayer electronic component according to claim 1, wherein the IP is arranged between P1 and P2.

4. The multilayer electronic component according to claim 3, wherein only one IP is arranged between P1 and P2.

5. The multilayer electronic component according to claim 3, wherein two or more IPs are arranged between P1 and P2.

6. The multilayer electronic component according to claim 1, wherein two or more IPs are arranged in at least one of the edge regions.

7. When a straight line is drawn from one end of the internal electrode arranged at the uppermost part in the first direction to the upper part in the first direction, the point where it contacts the outer surface of the main body is P1, and when a straight line is drawn from one end of the internal electrode arranged at the uppermost part in the first direction to the third direction, the point where it contacts the outer surface of the main body is P2, when a region within half of the average width of the side margin portion in the third direction at P1 is R1, and a region within half of the average thickness of the cover portion in the first direction at P2 is R2, The multilayer electronic component according to claim 1, comprising IP1 which is an IP arranged in R1 and IP2 which is an IP arranged in R2.

8. The multilayer electronic component according to claim 7, wherein IP1 is arranged so as to overlap the capacitance forming portion in the first direction, and IP2 is arranged so as to overlap the capacitance forming portion in the third direction.

9. The multilayer electronic component according to claim 7, wherein IP1 is arranged so as not to overlap the capacitance forming portion in the first direction, and IP2 is arranged so as not to overlap the capacitance forming portion in the third direction.

10. The multilayer electronic component according to claim 7, wherein only one of the IPs is arranged in each of R1 and R2.

11. The multilayer electronic component according to claim 1, wherein T and W satisfy 1.1 < T / W < 1.

8.

12. The multilayer electronic component according to claim 1, wherein L is 0.69 mm or less and W is 0.39 mm or less.

13. The multilayer electronic component according to claim 12, wherein T is 0.55 mm or less.

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