Multilayer electronic component

Abstract

To prevent bending cracks that may occur when forming a dummy pattern and alleviate a step.SOLUTION: In a multilayer electronic component according to an embodiment of the present invention, a step of the multilayer electronic component may be alleviated by adjusting the shape of a reinforcing pattern included in a reinforcing portion disposed on at least one of one surface and the other surface of a capacitance formation portion in a first direction, and the occurrence of bending cracks may be suppressed. The multilayer electronic component according to an embodiment of the present invention includes a plurality of reinforcing patterns including a plurality of conductive patterns disposed in a grid shape. The plurality of conductive patterns may be disposed to be spaced apart from surfaces of a body opposing each other in a third direction, and at least a portion of the plurality of conductive patterns may be in contact with an external electrode at both ends of the reinforcing portion in a second direction.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one of multilayer electronic components, is a chip-shaped capacitor mounted on a printed circuit board of various electronic products such as video equipment such as a liquid crystal display (LCD) and a plasma display panel (PDP), a computer, a smartphone and a mobile phone, an on-board charger (OBC) of an electric vehicle, and a circuit such as a DC-DC converter, and serves to charge or discharge electricity.

[0003] Conventionally, as a solution for improving the bending strength of a multilayer ceramic capacitor, there has been an attempt to form a dummy pattern or the like on the upper and lower surfaces of a capacitance forming portion. However, since a general dummy pattern has a linear form at the end on the margin side in the width direction, it may be vulnerable to bending cracks. Further, when a dummy pattern is formed in a plurality of layers to sufficiently improve the strength, a step may occur due to the overlap in the stacking direction between the dummy patterns.

[0004] Thus, there is a need to improve the structure of the dummy pattern so as to prevent the occurrence of bending cracks and relieve the step.

Summary of the Invention

Problems to be Solved by the Invention

[0005] The problem to be solved by the present invention is to prevent bending cracks that may occur when forming a dummy pattern.

[0006] The problem to be solved by the present invention is to alleviate steps that may occur when forming a dummy pattern.

[0007] However, the problem to be solved by the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problem

[0008] A stacked electronic component according to an embodiment of the present invention includes a dielectric layer, first and second internal electrodes alternately arranged in a first direction with the dielectric layer therebetween, and when a region where the first and second internal electrodes overlap in the first direction is a capacitance forming portion, a main body including a reinforcing portion arranged on one or more surfaces of one surface and the other surface of the capacitance forming portion in the first direction, and external electrodes arranged on surfaces facing each other in a second direction perpendicular to the first direction of the main body. When a direction perpendicular to the first direction and the second direction is a third direction, the reinforcing portion includes a plurality of reinforcing patterns including a plurality of conductive patterns alternately arranged in the first direction and arranged in a lattice shape, the plurality of conductive patterns are arranged spaced apart from a surface of the main body facing the third direction, and at least a part of the plurality of conductive patterns can be in contact with the external electrodes at both ends of the reinforcing portion in the second direction.

[0009] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, first and second internal electrodes alternately arranged in a first direction with the dielectric layer therebetween, and when a region where the first and second internal electrodes overlap in the first direction is a capacitance forming portion, a main body including a reinforcing portion disposed on one surface and the other surface of the capacitance forming portion in the first direction, and external electrodes disposed on surfaces facing each other in a second direction perpendicular to the first direction of the main body. The reinforcing portion includes a first reinforcing pattern and a second reinforcing pattern that does not overlap with the first reinforcing pattern in the first direction. When a direction perpendicular to the first direction and the second direction is a third direction, the first reinforcing pattern includes a plurality of first-1 conductive patterns spaced apart from each other in the second direction and the third direction, and a plurality of first-2 conductive patterns disposed between spaces where the plurality of first-1 conductive patterns are spaced apart in the second direction, and the plurality of first-2 conductive patterns are spaced apart from each other in the second direction and the third direction. The second reinforcing pattern can include a plurality of second-1 conductive patterns spaced apart from each other in the second direction and the third direction, and a plurality of second-2 conductive patterns disposed between spaces where the plurality of second-1 conductive patterns are spaced apart in the second direction, and the plurality of second-2 conductive patterns are spaced apart from each other in the second direction and the third direction.

Effect of the Invention

[0010] One of the various effects of the present invention is to relax the step of the multilayer electronic component and suppress the occurrence of bending cracks by adjusting the shape of the reinforcing pattern included in the reinforcing portion disposed on one or more of the one surface and the other surface of the capacitance forming portion in the first direction.

[0011] However, the various and meaningful advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of describing the specific embodiments of the present invention.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to ordinary technicians. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0014] In addition, parts not related to the explanation are omitted in the drawings for clearly explaining the present invention, and the sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the illustration. Also, components having the same functions within the scope of the same idea can be described using the same reference numerals. Further, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0015] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0016] FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment. FIG. 2 is a cross-sectional view taken along line I-I' of FIG. 1. FIG. 3 is a cross-sectional view taken along line II-II' of FIG. 1. FIG. 4 shows a cross-section corresponding to the cross-section taken along line I-I' of FIG. 1 in a stacked electronic component according to an embodiment. FIG. 5 shows a cross-section corresponding to the cross-section taken along line II-II' of FIG. 1 in a stacked electronic component according to an embodiment. FIG. 6 is a plan view showing the shape of an internal electrode according to an embodiment. FIG. 7 is a plan view showing the shape of a reinforcing portion according to an embodiment. FIG. 8 is a plan view showing the shape of a first reinforcing portion according to an embodiment.

[0017] Hereinafter, with reference to FIGS. 1 to 5, FIGS. 7 and 8, the stacked electronic components 100, 100' according to an embodiment of the present invention will be described in detail. Also, as an example of the stacked electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto, and it can also be applied to various stacked electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0018] The stacked electronic components 100 and 100' according to an embodiment of the present invention include a dielectric layer 111, first and second internal electrodes 121 and 122 alternately arranged in a first direction with the dielectric layer therebetween. When a region where the first and second internal electrodes overlap in the first direction is defined as a capacitance forming portion RC, a main body 110 including a reinforcing portion RP disposed on one or more surfaces of the capacitance forming portion among one surface and the other surface in the first direction, and external electrodes 130 and 140 disposed on surfaces facing each other in a second direction perpendicular to the first direction of the main body. When a direction perpendicular to the first direction and the second direction is defined as a third direction, the reinforcing portion includes a plurality of reinforcing patterns 123 and 124 including a plurality of conductive patterns 123a, 123b, 124a, and 124b alternately arranged and arranged in a lattice shape in the first direction. The plurality of conductive patterns are disposed at a distance from a surface of the main body facing the third direction, and at least a part of the plurality of conductive patterns can be in contact with the external electrodes at both ends of the reinforcing portion in the second direction.

[0019] The multilayer electronic components 100 and 100' according to an embodiment of the present invention include a dielectric layer 111, and first and second internal electrodes 121 and 122 that are alternately arranged in a first direction with the dielectric layer interposed therebetween. When a region where the first and second internal electrodes overlap in the first direction is defined as a capacitance forming portion RC, the multilayer electronic components include a main body having a reinforcing portion RP disposed on one or more surfaces of the capacitance forming portion, among one surface and the other surface in the first direction, and external electrodes 130 and 140 disposed on surfaces facing each other in a second direction perpendicular to the first direction of the main body. The reinforcing portion includes a first reinforcing pattern 123 and a second reinforcing pattern 124 that does not overlap with the first reinforcing pattern in the first direction. When a direction perpendicular to the first direction and the second direction is defined as a third direction, the first reinforcing pattern includes a plurality of first-1 conductive patterns 123a that are spaced apart from each other in the second direction and the third direction, and a plurality of first-2 conductive patterns 123b that are disposed between spaces where the plurality of first-1 conductive patterns are spaced apart in the second direction and are spaced apart from each other in the second direction and the third direction. The second reinforcing pattern can include a plurality of second-1 conductive patterns 124a that are spaced apart from each other in the second direction and the third direction, and a plurality of second-2 conductive patterns 124b that are disposed between spaces where the plurality of second-1 conductive patterns are spaced apart in the second direction and are spaced apart from each other in the second direction and the third direction.

[0020] Hereinafter, each configuration of the multilayer electronic components 100 and 100' will be described in detail.

[0021] The main body 110 can include a dielectric layer 111 and first and second internal electrodes 121 and 122 that are alternately arranged in a first direction with the dielectric layer interposed therebetween.

[0022] There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can have a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect straight hexahedron shape, but can have a substantially hexahedron shape.

[0023] When the first direction is the direction in which the first and second internal electrodes 121 and 122 described later are laminated, the second direction is the direction perpendicular to the first direction, and the third direction is the direction perpendicular to the first and second directions, the main body 110 has first and second surfaces 1 and 2 facing each other in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in the second direction, and fifth and sixth surfaces 5 and 6 connected to the third and fourth surfaces 3 and 4 and facing each other in the third direction.

[0024] When a margin area where the internal electrodes 121 and 122 are not arranged overlaps on the dielectric layer 111, a step due to the thickness of the internal electrodes 121 and 122 occurs, and the corner connecting the first surface and the third to fifth surfaces and / or the corner connecting the second surface and the third to fifth surfaces can have a shape that contracts toward the central side of the main body 110 in the first direction when viewed with reference to the first surface or the second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corner connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corner connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 can have a form that contracts toward the central side of the main body 110 in the first direction when viewed with reference to the first surface or the second surface. Alternatively, in order to prevent chipping defects or the like, the edges connecting the respective surfaces of the main body 110 are rounded by performing a separate process, and the corner connecting the first surface and the third to sixth surfaces and / or the corner connecting the second surface and the third to sixth surfaces can have a rounded shape.

[0025] On the other hand, in order to suppress the step due to the internal electrodes 121 and 122, after cutting so that the internal electrodes are exposed on the fifth and sixth surfaces 5 and 6 of the main body after lamination, when a single dielectric layer or two or more dielectric layers are laminated on both side surfaces of the capacitor forming part RC in the third direction (width direction) to form the margin parts 114 and 115, the portions connecting the first surface and the fifth and sixth surfaces and the portions connecting the second surface and the fifth and sixth surfaces can not have a contracted form.

[0026] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers does not particularly need to be limited and can be determined in consideration of the size of the multilayer electronic component. For example, the body can be formed by stacking 400 or more dielectric layers.

[0027] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder can be used as the ceramic powder. More specifically, the ceramic powder can be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 ≦ x ≦ 1), Ba(Ti 1-y Ca y )O3 (0 ≦ y ≦ 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 ≦ x ≦ 1, 0 ≦ y ≦ 1), and Ba(Ti 1-y Zr y )O3 (0 ≦ y ≦ 1).

[0028] According to the present invention, even when the thicknesses of the plurality of dielectric layers 111 are thin, it is possible to prevent the reduction of the lifetime under high-temperature load, and when the thickness of the dielectric layer is thick, the lifetime under high-temperature load can be further improved. Therefore, the average thickness of the dielectric layer 111 does not need to be particularly limited, and the average thickness of the dielectric layer 111 can be arbitrarily set according to desired characteristics and applications. For a specific example, the average thickness of the dielectric layer 111 can be 300 nm or more and 10 μm or less. Also, the average thickness of at least one or more of the plurality of dielectric layers 111 can be 300 nm or more and 10 μm or less.

[0029] Here, the average thickness of the dielectric layer 111 can mean the average size in the first direction of the dielectric layer 111 disposed between the internal electrodes 121 and 122. The average thickness of the dielectric layer 111 can be measured by scanning the cross-sections in the first direction and the second direction of the main body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the thickness can be measured at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, and the average value can be measured. The 30 points at the above equal intervals can be specified by a capacitance forming portion RC described later. Also, when such average value measurement is extended to 10 dielectric layers 111 to measure the average value, the average thickness of the dielectric layer 111 can be further generalized.

[0030] The internal electrodes 121 and 122 can be alternately arranged with the dielectric layer 111 in the first direction.

[0031] The internal electrodes 121 and 122 can include the first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be respectively connected to the third and fourth surfaces 3 and 4 of the main body 110. Specifically, one end of the first internal electrode 121 can be connected to the third surface, and one end of the second internal electrode 122 can be connected to the fourth surface. That is, in one embodiment, the internal electrodes 121 and 122 can be in contact with the third surface 3 or the fourth surface 4.

[0032] As shown in FIG. 6, the first internal electrode 121 can be connected to the third surface 3 and separated from the fourth surface 4, and the second internal electrode 122 can be connected to the fourth surface 4 and separated from the third surface 3. Thereby, the first internal electrode 121 is not connected to the second external electrode 140 but can be connected to the first external electrode 130, and the second internal electrode 122 is not connected to the first external electrode 130 but can be connected to the second external electrode 140.

[0033] The materials for forming the internal electrodes 121 and 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0034] Also, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. As the printing method of the above conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0035] The average thickness of the internal electrodes 121 and 122 is not particularly limited and can be arbitrarily set according to desired characteristics and applications. For a specific example, the average thickness of the internal electrodes 121 and 122 can be 300 nm or more and 10 μm or less. Also, the average thickness of at least one or more of the plurality of internal electrodes 121 and 122 can be 300 nm or more and 10 μm or less.

[0036] The average thickness of the internal electrodes 121 and 122 can be measured by extracting the internal electrode layers from an image scanned by a scanning electron microscope (SEM) of the length and the cross-section in the thickness direction (L-T) cut at the central portion in the width direction of the main body 110, and measuring the thickness at five points, two on the left and two on the right at equal intervals centered on one reference point, with respect to a total of five internal electrode layers, two layers above and two layers below, based on one layer of the internal electrode layer at the point where the central line in the length direction of the main body and the central line in the thickness direction meet, with the point where the central line in the length direction of the main body and the central line in the thickness direction meet as the reference.

[0037] Referring to FIGS. 2 and 4, the main body 110 can include a capacitance forming portion RC which is a region where the first and second internal electrodes 121 and 122 overlap in the first direction. Further, the capacitance forming portion RC is a portion contributing to the formation of the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0038] Referring to FIGS. 3 and 5, the region between the cross-section in the second direction of the capacitance forming portion RC in the main body 110 and the surface facing the second direction of the main body 110 can be defined as a length-margin portion. The length-margin portion can be a region including any one of the internal electrodes 121 and 122.

[0039] Referring to FIGS. 2 to 5, a reinforcing portion RP can be disposed on one or more of the one surface and the other surface in the first direction of the capacitance forming portion RC. The reinforcing portion RP can be a region included in the cover portions 112 and 113 which are regions of the main body 110 disposed on the one surface and the other surface in the first direction of the capacitance forming portion Ac, and can include reinforcing patterns 123 and 124.

[0040] In the reinforcing portion RP, the reinforcing patterns 123 and 124 can be alternately arranged in the first direction, and a dielectric layer 111 can be arranged between the reinforcing patterns 123 and 124. That is, the reinforcing patterns 123 and 124 can be alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. The specific structures of the reinforcing patterns 123 and 124 will be described later.

[0041] The cover portions 112 and 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the first direction on the upper surface or the lower surface of the capacitance forming portion RC, and a reinforcing portion RP can be formed inside the cover portions 112 and 113 according to an embodiment of the present invention. That is, the cover portions 112 and 113 do not include the internal electrodes 121 and 122 and can include the reinforcing portion RP.

[0042] On the other hand, the thickness of the cover portions 112 and 113 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness of the cover portions 112 and 113 can be 15 μm or less.

[0043] The average thickness of the cover portions 112 and 113 can mean the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover portions 112 and 113 measured at five equally spaced points above or below the capacitance forming portion RC.

[0044] Referring to FIGS. 3 and 5, margin portions 114 and 115 can be arranged on one surface and the other surface in the third direction of the capacitance forming portion RC.

[0045] The margin portions 114 and 115 can include a first margin portion 114 arranged on the fifth surface 5 of the main body 110 and a second margin portion 115 arranged on the sixth surface 6. That is, the margin portions 114 and 115 can be arranged on both end faces in the width direction of the ceramic main body 110.

[0046] As shown in FIG. 5, the margin portions 114 and 115 can mean the regions between the boundaries of the main body 110 and both ends of the first and second internal electrodes 121 and 122 in a cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0047] The margin portions 114 and 115 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0048] The margin portions 114 and 115 can be formed by applying a conductive paste to form internal electrodes, except where the margin portions are formed on the ceramic green sheet.

[0049] Also, in order to suppress the step difference caused by the internal electrodes 121 and 122, after cutting so that the internal electrodes are exposed on the fifth and sixth surfaces 5 and 6 of the main body after lamination, a single dielectric layer or two or more dielectric layers are laminated on both side surfaces of the capacitance forming portion RC in the third direction (width direction) to form the margin portions 114 and 115.

[0050] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. For example, the width of the margin portions 114 and 115 can be 5 to 300 μm. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 can be 15 μm or less.

[0051] The average width of the margin portions 114 and 115 can mean the average size in the third direction of the region where the internal electrodes are separated from the fifth surface and the average size in the third direction of the region where the internal electrodes are separated from the sixth surface, and can be the value obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surfaces of the capacitance forming portion RC.

[0052] Therefore, in one embodiment, the average size in the third direction of the regions where the internal electrodes 121 and 122 are separated from the fifth and sixth surfaces can each be 15 μm or less.

[0053] The external electrodes 130 and 140 can be disposed on the main body 110. Specifically, the external electrodes 130 and 140 can be disposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively, and include first and second external electrodes 130 and 140 respectively connected to the first and second internal electrodes 121 and 122.

[0054] In this embodiment, the structure in which the multilayer electronic component 100 has two external electrodes 130 and 140 is described. However, the number, shape, etc. of the external electrodes 130 and 140 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0055] On the other hand, the external electrodes 130 and 140 can be formed using any material as long as it has electrical conductivity such as metal. A specific material can be determined in consideration of electrical characteristics, structural stability, etc., and can further have a multilayer structure.

[0056] For example, the external electrodes 130 and 140 can include an electrode layer disposed on the main body 110 and a plating layer formed on the electrode layer.

[0057] To give a more specific example of the electrode layer, the electrode layer can be a fired electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and a resin.

[0058] Also, the electrode layer can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the electrode layer can be formed by a method of transferring a sheet containing a conductive metal onto the main body, or can be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode. Also, the electrode layer can be formed of a plating layer, or can be a layer formed using a vapor deposition method such as sputtering or ALD (Atomic layer deposition).

[0059] As the conductive metal contained in the electrode layer, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0060] The plating layer plays a role in improving the mounting characteristics. The type of the plating layer is not particularly limited, and it can be a plating layer containing one or more of Ni, Sn, Pd, and their alloys, and can be formed from a plurality of layers.

[0061] More specific examples of the plating layer are as follows. The plating layer can be a Ni plating layer or a Sn plating layer, and can be in a form where a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or can be in a form where a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Also, the plating layer can include a plurality of Ni plating layers and / or a plurality of Sn plating layers. Further, the plating layer can be in a form where a Ni plating layer and a Pd plating layer are sequentially formed on the electrode layer.

[0062] Conventionally, as a solution for improving the bending strength of multilayer electronic components such as multilayer ceramic capacitors, there has been an attempt to form a dummy pattern or the like on the upper and lower surfaces of the capacitance forming portion. However, since the form of the end portion on the margin side in the width direction of a general dummy pattern is linear, it may be vulnerable to bending cracks. Also, when forming the dummy pattern in a plurality of layers to sufficiently improve the strength, a step may occur due to the overlap in the stacking direction between the dummy patterns.

[0063] Therefore, in the multilayer electronic components 100 and 100' according to an embodiment of the present invention, a reinforcing portion RP is disposed on one or more surfaces of one surface and the other surface of the capacitance forming portion Ac in the first direction. The reinforcing portion RP includes a plurality of reinforcing patterns 123 and 124 including a plurality of conductive patterns 123a, 123b, 124a, and 124b alternately arranged in the first direction and arranged in a lattice shape. The plurality of conductive patterns 123a, 123b, 124a, and 124b are arranged spaced apart from the surfaces 5 and 6 facing each other in the third direction of the main body 110. At least a part of the plurality of conductive patterns 123a, 123b, 124a, and 124b is in contact with the external electrodes 130 and 140 at both ends in the second direction of the reinforcing portion RP, thereby preventing bending cracks and relaxing steps of the multilayer electronic components 100 and 100'.

[0064] Specifically, since the reinforcing portion RP includes a plurality of reinforcing patterns 123 and 124 including a plurality of conductive patterns 123a, 123b, 124a, and 124b alternately arranged in the first direction and arranged in a lattice shape, unevenness can be formed at the ends in the third direction with respect to the conventional dummy pattern. Thereby, it is possible to suppress the occurrence of bending cracks at the ends in the third direction of the dummy pattern in the multilayer electronic component 100. Further, since the plurality of conductive patterns 123a, 123b, 124a, and 124b alternately arranged in the first direction are arranged in a lattice shape, it is possible to relax the step due to the overlap in the first direction of the plurality of reinforcing patterns 123 and 124.

[0065] Also, by arranging the plurality of conductive patterns spaced apart from the surfaces 5 and 6 facing each other in the third direction of the main body 110, moisture resistance reliability can be ensured. At least a part of the plurality of conductive patterns 123a, 123b, 124a, and 124b is in contact with the external electrodes 130 and 140 at both ends in the second direction of the reinforcing portion RP, thereby improving the bonding force between the external electrodes 130 and 140 and the main body 110.

[0066] The components of the plurality of conductive patterns 123a, 123b, 124a, and 124b are not particularly limited and can include the same components as the conductive metals included in the internal electrodes 121 and 122. For example, the plurality of conductive patterns 123a, 123b, 124a, and 124b can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0067] In one embodiment, the reinforcing portion RP can include a first reinforcing pattern 123 and a second reinforcing pattern 124 that does not overlap with the first reinforcing pattern 123 in the first direction. In this case, since the first reinforcing pattern 123 and the second reinforcing pattern 124 can be prevented from overlapping in the first direction, the effect of step relaxation according to the present invention can be further improved.

[0068] Referring to FIG. 7, the first reinforcing pattern 123 can include a first-1 conductive pattern 123a and a first-2 conductive pattern 124b, and the second reinforcing pattern 124 can include a second-1 conductive pattern 124a and a second-2 conductive pattern 124b. The first-1 conductive pattern 123a and the first-2 conductive pattern 124b can form a lattice pattern, and the second-1 conductive pattern 124a and the second-2 conductive pattern 124b can form a lattice pattern.

[0069] Specifically, in one embodiment, the first reinforcing pattern 123 can include a plurality of first-1 conductive patterns 123a spaced apart from each other in the second and third directions and a plurality of first-1 conductive patterns 123a disposed between spaces spaced apart in the second direction, and can include a plurality of first-2 conductive patterns 123b spaced apart from each other in the second and third directions. The second reinforcing pattern 124 can include a plurality of second-1 conductive patterns 124a spaced apart from each other in the second and third directions and a plurality of second-1 conductive patterns 124a disposed between spaces spaced apart in the second direction, and can include a plurality of second-2 conductive patterns 124b spaced apart from each other in the second and third directions.

[0070] On one hand, as described above, the lattice patterns of the first first conductive pattern 123a and the first second conductive pattern 123b and the lattice patterns of the second first conductive pattern 124a and the second second conductive pattern 124b can be formed so that the first reinforcing pattern 123 and the second reinforcing pattern 124 do not overlap in the first direction. Specifically, the first first conductive pattern 123a can be arranged so as not to overlap with the second first conductive pattern 124a and the second second conductive pattern 124b in the first direction, and the first second conductive pattern 123b can be arranged so as not to overlap with the second first conductive pattern 124a and the second second conductive pattern 124b in the first direction.

[0071] In one embodiment, the first first conductive pattern 123a and the first second conductive pattern 123b can be arranged so as to be offset in the third direction, and the second first conductive pattern 124a and the second second conductive pattern 124b can be arranged so as to be offset in the third direction. At this time, the offset distance in the third direction can be the same as or larger than the average width in the third direction of the conductive patterns 123a, 123b, 124a, 124b. As a result, unevenness is formed at the ends of the reinforcing patterns 123 and 124 in the third direction, so that the occurrence of bending cracks in the stacked electronic components 100 and 100' can be suppressed.

[0072] Referring to FIGS. 6 and 8, when the regions arranged on one surface and the other surface in the second direction of the capacitance forming portion RC in the main body are taken as the length-margin portions, the average length in the second direction of the length-margin portions is LM, the average length in the second direction of the first first conductive pattern 123a and the first second conductive pattern 123b is D1, the average width in the third direction of the first first conductive pattern 123a and the first second conductive pattern 123b is D2, the length by which the first first conductive pattern 123a and the first second conductive pattern 123b closest to the first first conductive pattern are separated in the second direction is D3, the length by which the first first conductive pattern 123a and the first second conductive pattern 123b closest to the first first conductive pattern are separated in the third direction is D4, the maximum width in the third direction of the main body 110 is W, and the maximum width in the third direction of the first reinforcing pattern 123 is D5.

[0073] In FIG. 8, the features of the first reinforcement pattern 123, the first-1 conductive pattern 123a, and the first-2 conductive pattern 123b are described, but this can be similarly applied to the second reinforcement pattern 124, the second-1 conductive pattern 124a, and the second-2 conductive pattern 124b.

[0074] In one embodiment, D1 and LM can satisfy 0.35LM ≤ D1 ≤ 0.95LM.

[0075] When D1 is less than 0.35LM, the length of the reinforcement pattern 123 connected to the external electrode becomes short, and the effect of preventing the occurrence of bending cracks may be somewhat insufficient. On the other hand, when D1 exceeds 0.95LM, if distortion occurs due to the pressure and temperature conditions in the lamination process of the reinforcement pattern 123, the conductive pattern 123a in contact with the third surface 3 or the fourth surface 4 can overlap the capacitance forming portion RC in the first direction.

[0076] Therefore, in one embodiment, by making D1 and LM satisfy 0.35LM ≤ D1 ≤ 0.95LM, a sufficient effect of preventing the occurrence of bending cracks can be ensured, and the phenomenon that the conductive pattern 123a in contact with the third surface 3 or the fourth surface 4 overlaps the capacitance forming portion RC in the first direction can be prevented.

[0077] In one embodiment, D1 and D2 can satisfy 0.35D1 ≤ D2 ≤ D1.

[0078] When D2 is less than 0.35D1, the length of the conductive pattern in the third direction becomes short, and the effect of improving the bending strength due to printing interruption or bleeding may be insufficient. When D2 exceeds D1, it becomes difficult for the conductive patterns 123a and 123b to be uniformly distributed in the reinforcement pattern 123, and the effect of improving the bending strength of the laminated electronic components 100 and 100' may be insufficient.

[0079] Therefore, in one embodiment, by uniformly forming the conductive patterns 123a and 123b throughout the reinforcing pattern 123 such that D1 and D2 satisfy 0.35D1 ≤ D2 ≤ D1, the bending strength of the stacked electronic components 100 and 100' can be improved.

[0080] In one embodiment, D3 can satisfy 0.5 μm ≤ D3 ≤ 80 μm.

[0081] When D3 is less than 0.5 μm, it may be difficult to form the conductive patterns 123a and 123b so as to be separated in the second direction according to the printing resolution of the reinforcing pattern 123. When D3 exceeds 80 μm, the separation distance between the conductive patterns 123a and 123b may be excessive, and the area of the conductive patterns 123a and 123b may decrease, whereby the effect of improving the bending strength of the stacked electronic components 100 and 100' may be somewhat insufficient.

[0082] Therefore, in one embodiment, by preventing the overlap of the conductive patterns 123a and 123b in the second direction such that D3 satisfies 0.5 μm ≤ D3 ≤ 80 μm and ensuring a sufficient area of the conductive patterns 123a and 123b, the step of the stacked electronic components 100 and 100' can be alleviated, and a decrease in bending strength can be prevented.

[0083] Similarly, in one embodiment, D4 can satisfy 0.05 μm ≤ D4 ≤ 80 μm, whereby the step of the stacked electronic components 100 and 100' can be alleviated, and a decrease in bending strength can be prevented.

[0084] On the other hand, in order to improve the bending strength of the stacked electronic components 100 and 100' and alleviate the step, the maximum width of the reinforcing pattern 123 in the third direction can be the same as or larger than the maximum width of the capacitance forming portion Ac in the third direction. However, considering the error in the cutting process of the stacked electronic components 100 and 100', the upper limit value of the maximum width of the reinforcing pattern 123 in the third direction can be determined. For example, in one embodiment, D5 and W can satisfy 0.4W ≤ D5 ≤ 0.97W.

[0085] The method for measuring the above LM, D1, D2, D3, D4, D5, and W is not particularly limited.

[0086] For the sake of convenience of explanation, LM is shown in FIG. 6 which is a plan view seen from the first direction. However, LM can be measured by the length in the second direction in which the first internal electrode 121 is separated from the fourth surface or the length in which the second internal electrode 122 is separated from the third surface in the cross-sections in the first direction and the second direction polished to the central part in the third direction of the multilayer electronic components 100 and 100'. Further, LM can be further generalized by taking the average value of the lengths in the second direction measured in the region where the length-margin part is equally divided into three parts in the first direction.

[0087] D1, D2, D3, D4, D5, and W can be measured in the cross-sections in the second direction and the third direction in which the multilayer electronic components 100 and 100' are polished in the first direction to expose the reinforcing pattern 123.

[0088] Specifically, D1 can be the average value of the lengths in the second direction measured by any five or more conductive patterns 123a, 123b, 124a, 124b, and D2 can be the average value of the widths in the third direction measured by any five or more conductive patterns 123a, 123b, 124a, 124b.

[0089] Also, D3 and D4 can be measured by the length in which any conductive pattern and the conductive pattern adjacent to any conductive pattern are separated in the second direction or the third direction, and can be the average value of the values measured for five or more arbitrary conductive patterns.

[0090] Also, D5 can mean the width in the third direction between both end portions located on the outermost side in the third direction in the reinforcing pattern 123, and W can mean the width in the third direction between both end portions located on the outermost side in the third direction of the main body 110.

[0091] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art, and this can also be said to belong to the scope of the present invention.

[0092] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of another one embodiment. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to the other one embodiment as long as there is no explanation contrary to or conflicting with that matter in the other one embodiment.

[0093] The terms used in the present disclosure are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless the context clearly indicates otherwise.

Explanation of Reference Numerals

[0094] 100, 100' Multilayer Electronic Component 110 Body 111 Dielectric Layer 121, 122 Internal Electrodes 130, 140 External Electrodes 123, 124 Reinforcement Patterns 123a, 123b, 124a, 124b Conductive Patterns

Claims

1. A main body including a dielectric layer, first and second internal electrodes alternately arranged in a first direction with the dielectric layer therebetween, and a reinforcing portion disposed on one or more surfaces of the capacitance forming portion, which is a region where the first and second internal electrodes overlap in the first direction; External electrodes disposed on surfaces of the main body facing each other in a second direction perpendicular to the first direction, When a direction perpendicular to the first and second directions is defined as a third direction, the reinforcing portion includes a plurality of reinforcing patterns including a plurality of conductive patterns alternately arranged in the first direction and arranged in a lattice pattern, The plurality of conductive patterns are arranged spaced apart from the surfaces of the main body facing each other in the third direction, and at least a part of the plurality of conductive patterns is in contact with the external electrodes at both ends of the reinforcing portion in the second direction. A multilayer electronic component.

2. In the main body, when a region disposed on one surface and the other surface of the capacitance forming portion in the second direction is defined as a length - margin portion, and the average length of the length - margin portion in the second direction is LM and the average length of the conductive pattern in the second direction is D1, The multilayer electronic component according to claim 1, satisfying 0.35LM ≤ D1 ≤ 0.95LM.

3. When the average length of the conductive pattern in the second direction is D1 and the average width of the conductive pattern in the third direction is D2, The multilayer electronic component according to claim 1, satisfying 0.35D1 ≤ D2 ≤ D1.

4. When the length by which an arbitrary conductive pattern and a conductive pattern adjacent to the arbitrary conductive pattern are separated in the second direction is D3, The multilayer electronic component according to claim 1, satisfying 0.5 μm ≤ D3 ≤ 80 μm.

5. When the length by which an arbitrary conductive pattern and a conductive pattern adjacent to the arbitrary conductive pattern are separated in the third direction is D4, The multilayer electronic component according to claim 1, satisfying 0.05 μm ≤ D4 ≤ 80 μm.

6. When the maximum width of the main body in the third direction is W and the maximum width of the reinforcing pattern in the third direction is D5, The multilayer electronic component according to claim 1, satisfying 0.4W ≤ D5 ≤ 0.97W.

7. The multilayer electronic component according to claim 1, wherein the plurality of reinforcing patterns are alternately arranged with the dielectric layer therebetween.

8. When a dielectric layer, first and second internal electrodes alternately arranged in a first direction with the dielectric layer therebetween, and a region where the first and second internal electrodes overlap in the first direction are used as a capacitance forming portion, a main body including a reinforcing portion disposed on one or more surfaces of the capacitance forming portion among one surface and the other surface in the first direction; an external electrode disposed on surfaces facing each other in a second direction perpendicular to the first direction of the main body; The reinforcing portion includes a first reinforcing pattern and a second reinforcing pattern that does not overlap with the first reinforcing pattern in the first direction. When a direction perpendicular to the first direction and the second direction is defined as a third direction, The first reinforcing pattern includes a plurality of first-1 conductive patterns spaced apart from each other in the second direction and the third direction, and a plurality of first-2 conductive patterns disposed between spaces where the plurality of first-1 conductive patterns are spaced apart in the second direction, and the plurality of first-2 conductive patterns are spaced apart from each other in the second direction and the third direction. The second reinforcing pattern includes a plurality of second-1 conductive patterns spaced apart from each other in the second direction and the third direction, and a plurality of second-2 conductive patterns disposed between spaces where the plurality of second-1 conductive patterns are spaced apart in the second direction, and the plurality of second-2 conductive patterns are spaced apart from each other in the second direction and the third direction, a multilayer electronic component.

9. The first-1 conductive pattern and the first-2 conductive pattern are arranged so as to be offset in the third direction, and the second-1 conductive pattern and the second-2 conductive pattern are arranged so as to be offset in the third direction, the multilayer electronic component according to claim 8.

10. The first reinforcing pattern and the second reinforcing pattern are disposed at a distance from a surface of the main body facing in the third direction, and at least a part of the plurality of first-1 conductive patterns and at least a part of the plurality of second-1 conductive patterns are in contact with the external electrode at both ends of the reinforcing portion in the second direction, the multilayer electronic component according to claim 8.

11. In the main body, a region disposed on one surface and the other surface of the capacitance forming portion in the second direction is defined as a length-margin portion. When the average length of the length-margin portion in the second direction is LM, and the average length of the first-1 conductive pattern and the first-2 conductive pattern in the second direction is D1, The multilayer electronic component according to claim 8, satisfying 0.35LM ≤ D1 ≤ 0.95LM.

12. When the average length in the second direction of the first - 1 conductive pattern and the first - 2 conductive pattern is D1, and the average width in the third direction of the first - 1 conductive pattern and the first - 2 conductive pattern is D2, The multilayer electronic component according to claim 8, satisfying 0.35D1 ≤ D2 ≤ D1.

13. When the length by which the first - 1 conductive pattern and the first - 2 conductive pattern that is most adjacent to the first - 1 conductive pattern are separated in the second direction is D3, The multilayer electronic component according to claim 8, satisfying 0.5 μm ≤ D3 ≤ 80 μm.

14. When the length by which the first - 1 conductive pattern and the first - 2 conductive pattern that is most adjacent to the first - 1 conductive pattern are separated in the third direction is D4, The multilayer electronic component according to claim 8, satisfying 0.05 μm ≤ D4 ≤ 80 μm.

15. When the maximum width in the third direction of the main body is W, and the maximum width in the third direction of the first and second reinforcing patterns is D5, The multilayer electronic component according to claim 8, satisfying 0.4W ≤ D5 ≤ 0.97W.

16. The multilayer electronic component according to claim 8, wherein the first reinforcing pattern and the second reinforcing pattern are arranged with the dielectric layer therebetween.

Images