Laser irradiation device

Abstract

To provide a laser irradiation device capable of accurately irradiating an irradiation object with laser light.SOLUTION: A laser irradiation device includes: a laser element; a light-receiving element; a moving mechanism; a rotation mechanism which rotates the laser element in such a way as to change the irradiation direction of laser beam; and a control unit which controls the laser element, the moving mechanism, and the rotation mechanism. The control unit performs: a first process of controlling the rotation mechanism thereby causing the laser element to face the light-receiving element; a second process, after the first process, of controlling the laser element to irradiate the light-receiving element with laser beam; a third process, after the second process, of controlling the rotation mechanism, thereby causing the laser element face the irradiation object; and a fourth process, after the third process, of controlling the laser element and the moving mechanism to change the relative position while irradiating the irradiation object with laser beam on the basis of the detection value of the light-receiving element.SELECTED DRAWING: Figure 9

Description

Technical Field

[0001] The present invention relates to a laser irradiation device.

Background Art

[0002] Processing devices that irradiate laser light to process an object to be processed and recording devices that perform recording such as printing on a recording object are known.

[0003] For example, Patent Document 1 describes a three-dimensional printer device including a printer head configured to have a light-emitting element array in which laser elements are arranged, a liquid tank that stores a photocurable liquid cured by light emitted from the printer head, and a stage portion to which a molded object formed by curing with light adheres.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a laser irradiation device that irradiates laser light as described above, for example, when laser irradiation is repeated, the characteristics of the laser element may deviate from the design values. When irradiating an irradiation object in a state where the characteristics of the laser element deviate from the design values, accurate irradiation cannot be performed.

Means for Solving the Problems

[0006] One aspect of the laser irradiation device according to the present invention is a laser element that irradiates laser light, a light-receiving element that receives the laser light from the laser element, a moving mechanism that changes the relative position between the laser element and the irradiation object, A rotation mechanism that rotates the laser element so that the irradiation direction of the laser light changes, A control unit that controls the laser element, the moving mechanism, and the rotation mechanism, and has, The control unit, A first process of controlling the rotation mechanism to oppose the laser element and the light receiving element, After the first process, a second process of controlling the laser element to irradiate the light receiving element with laser light, After the second process, a third process of controlling the rotation mechanism to oppose the laser element and the irradiation target, After the third process, a fourth process of controlling the laser element and the moving mechanism to change the relative position while irradiating the irradiation target with laser light based on the detection value of the light receiving element, is performed.

Brief Description of the Drawings

[0007]

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Embodiments for Carrying Out the Invention

[0008] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. Note that the embodiments described below do not unduly limit the content of the present invention described in the claims. Also, not all of the configurations described below are essential components of the present invention.

[0009] 1. First Embodiment 1.1. Laser Irradiation Device 1.1.1. Configuration First, the laser irradiation device according to the first embodiment will be described with reference to the drawings. FIG. 1 is a perspective view schematically showing a laser irradiation device 100 according to the first embodiment. FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1 schematically showing the laser irradiation device 100 according to the first embodiment. In FIGS. 1 and 2, the X-axis, Y-axis, and Z-axis are illustrated as three axes orthogonal to each other. The X-axis direction and the Y-axis direction are, for example, horizontal directions. The Z-axis direction is, for example, a vertical direction.

[0010] As shown in FIGS. 1 and 2, the laser irradiation device 100 includes a head 10, a moving mechanism 20, a first optical element 30, a calibration device 40, a second optical element 50, a stage 60, and a control unit 70. For convenience, in FIG. 1, the head 10 is illustrated in a simplified manner. The laser irradiation device 100 is, for example, a laser processing device. The laser irradiation device 100 is, for example, a metal 3D printer using the selective laser melting (SLM) method.

[0011] The head 10 is supported by a rail 22 of the moving mechanism 20. As shown in FIG. 2, the head 10 includes, for example, a first substrate 11, a laser element array 12, a rotation mechanism 15, and a support plate 19. Here, FIG. 3 is a bottom view schematically showing the head 10.

[0012] As shown in FIGS. 2 and 3, the first substrate 11 supports the laser element array 12. The material of the first substrate 11 is not particularly limited, but is, for example, a metal such as aluminum, iron, or copper.

[0013] The laser element array 12 is provided on the side opposite to the rotation mechanism 15 side of the first substrate 11. In the example shown in FIG. 3, the laser element array 12 has a shape extending in the Y-axis direction. The laser element array 12 includes, for example, a plurality of elements. The number of the laser element arrays 12 is not particularly limited. In the illustrated example, two laser element arrays 12 are provided. The two laser element arrays 12 are arranged in the X-axis direction.

[0014] The laser element array 12 has, for example, a second substrate 13 and a laser element 14. The second substrate 13 is provided on the side opposite to the rotation mechanism 15 side of the first substrate 11. The material of the second substrate 13 is not particularly limited, and examples thereof include aluminum oxide, aluminum nitride, and ceramics.

[0015] The laser element 14 is provided on the side opposite to the rotation mechanism 15 side of the second substrate 13. The laser element 14 irradiates laser light L. In the illustrated example, the shape of the laser element 14 is a circle. The laser element 14 is, for example, a Photonic Crystal Surface Emitting Laser (PCSEL) that utilizes the photonic crystal effect. The laser light L emitted from the laser element 14 that is a PCSEL has a narrow emission angle and high optical output.

[0016] A plurality of laser elements 14 are provided in one laser element array 12. In the illustrated example, the plurality of laser elements 14 are arranged in the Y-axis direction in one laser element array 12. In the laser element arrays 12 adjacent to each other in the X-axis direction, the laser elements 14 are displaced in the Y-axis direction. That is, the center of the laser element 14 of one of the laser element arrays 12 adjacent to each other in the X-axis direction and the center of the laser element 14 of the other laser element array 12 do not overlap when viewed from the X-axis direction. Thereby, the irradiation area of the laser light L emitted from the head 10 can be increased.

[0017] The rotation mechanism 15 supports the first substrate 11. Here, FIG. 4 is a cross-sectional view schematically showing the laser irradiation device 100. As shown in FIGS. 2 and 4, the rotation mechanism 15 rotates the first substrate 11 so that the irradiation direction of the laser beam L from the laser element 14 changes. As a result, the laser element 14 is rotated. In the example shown in FIG. 2, the laser beam L irradiates the object 2 to be irradiated. In the example shown in FIG. 4, the laser beam L irradiates the light receiving element 42 of the calibration device 40.

[0018] As shown in FIGS. 2 and 4, the rotation mechanism 15 has, for example, a disk member 16, a shaft member 17, and a support beam 18.

[0019] The disk member 16 supports the first substrate 11. The disk member 16 is a disk-shaped member. The disk member 16 is connected to the shaft member 17.

[0020] The shaft member 17 rotates about the rotation axis R. In the illustrated example, the rotation axis R is parallel to the Y-axis. The shaft member 17 is connected to a motor (not shown). The motor is controlled by the control unit 70. The shaft member 17 rotates by driving of the motor. As the shaft member 17 rotates, the disk member 16 rotates. As a result, the laser element 14 is rotated. In the illustrated example, the rotation mechanism 15 rotates the laser element 14 around the rotation axis R along the Y-axis direction.

[0021] The support beam 18 rotatably supports the disk member 16 and the shaft member 17. In the illustrated example, the support beam 18 extends in the -Z-axis direction from the support plate 19.

[0022] The support plate 19 supports the rotation mechanism 15. Specifically, the support plate 19 supports the support beam 18. The support plate 19 is supported by the rail 22 of the moving mechanism 20.

[0023] The moving mechanism 20 has, for example, a rail 22 and a motor (not shown). The rail 22 supports the head 10. The moving mechanism 20 changes the relative position between the head 10 and the stage 60 by a motor (not shown). That is, the moving mechanism 20 changes the relative position between the laser element 14 and the irradiation object 2. The motor is controlled by the control unit 70. In the illustrated example, the moving mechanism 20 moves the head 10 in the +X-axis direction. The rail 22 has, for example, a shape extending in the X-axis direction. The moving mechanism 20 moves the head 10 along the rail 22. The moving mechanism 20 may further have an encoder (not shown). The moving mechanism 20 does not move the stage 60.

[0024] As shown in FIG. 4, laser light L emitted from the laser element 14 is incident on the first optical element 30. The first optical element 30 is provided between the head 10 and the calibration device 40. Although not shown, the first optical element 30 may be supported by the rail 22. Here, FIG. 5 is a cross-sectional view taken along line V-V of FIG. 1 schematically showing the laser irradiation device 100. For convenience, in FIG. 5 and FIGS. 6 to 8 described later, the head 10 is shown in a simplified manner.

[0025] The first optical element 30 is provided between the head 10 and the light receiving element 42. The first optical element 30 is a diffusing element that diffuses the laser light L from the laser element 14 as shown in FIG. 5. As the first optical element 30, for example, a glass diffusing plate is used. The first optical element 30 causes the laser light L from adjacent laser elements 14 in the Y-axis direction to be incident on the light receiving element 42 without being superimposed.

[0026] Note that, as shown in FIG. 6, the first optical element 30 may cause the laser light L emitted from adjacent laser elements 14 in the Y-axis direction to be incident on the light receiving element 42 in a superimposed state.

[0027] In addition, the first optical element 30 is not limited to a glass diffusion plate as long as it can diffuse the laser beam L. As shown in FIG. 7, the first optical element 30 may be a lens array. In this case, it is preferable that the focal point of the lens constituting the first optical element 30 is not located on the light receiving element 42. Thereby, the possibility of damaging the light receiving element 42 by the laser beam L can be reduced. A plurality of lenses constituting the first optical element 30 are provided, for example, corresponding to the number of laser elements 14.

[0028] As shown in FIG. 4, the alignment device 40 is supported by the rail 22. The alignment device 40 has, for example, a light receiving element 42 and an element support portion 44.

[0029] The laser beam L emitted from the first optical element 30 is incident on the light receiving element 42. The laser beam L from the laser element 14 is incident on the light receiving element 42 via the first optical element 30. The light receiving element 42 receives the laser beam L from the laser element 14. The light receiving element 42 receives the laser beam L and detects the intensity of the received laser beam L. The detection value of the light receiving element 42 is transmitted to the control unit 70. The light receiving element 42 has, for example, a photodiode. The light receiving element 42 is, for example, a laser power meter or a laser energy meter. There is.

[0030] Note that the light receiving element 42 may be an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor. In this case, the light receiving element 42 can detect the two-dimensional intensity distribution emitted from the plurality of laser elements 14.

[0031] The element support portion 44 sandwiches the light receiving element 42. The element support portion 44 houses the light receiving element 42. The element support portion 44 is connected to the rail 22.

[0032] As shown in FIG. 2, the second optical element 50 receives the laser beam L emitted from the laser element 14. The second optical element 50 is provided between the head 10 and the object 2 to be irradiated. Here, FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 1 schematically showing the laser irradiation apparatus 100.

[0033] As shown in FIG. 8, the second optical element 50, for example, condenses the laser beam L from the laser element 14. The second optical element 50 is, for example, a lens array. The focal points of the lenses constituting the second optical element 50 are preferably located on the object 2 to be irradiated. Thereby, the irradiation time of the object 2 to be irradiated can be shortened. A plurality of lenses constituting the second optical element 50 are provided, for example, corresponding to the number of laser elements 14.

[0034] The object 2 to be irradiated is supplied and placed on the stage 60. The object 2 to be irradiated is provided between the head 10 and the stage 60. The object 2 to be irradiated is, for example, an object to be processed by the laser beam L from the laser element 14. The object 2 to be irradiated is, for example, metal powder that can be melted by the laser beam L. The object 2 to be irradiated is supplied by a feeder (not shown).

[0035] As shown in FIG. 8, the stage 60 has, for example, a stage base 62, an elevator mechanism 64, and a housing 66 that houses the stage base 62 and the elevator mechanism 64.

[0036] The object 2 to be irradiated is supplied onto the stage base 62. The head 10 irradiates the object 2 to be irradiated on the stage base 62 with the laser beam L, and forms a melted portion 2a and a non-melted portion 2b in the object 2 to be irradiated. The melted portion 2a is melted by the irradiation of the laser beam L and then cooled and solidified. The non-melted portion 2b is not irradiated with the laser beam L. Therefore, the non-melted portion 2b remains as metal powder without being solidified.

[0037] The elevator mechanism 64 supports the stage base 62. In the illustrated example, the elevator mechanism 64 moves the stage base 62 in the -Z axis direction. As the stage base 62 moves, the object to be irradiated 2 is moved. After the stage base 62 is moved in the -Z axis direction, the feeder supplies the second-layer object to be irradiated 2 again. The second-layer object to be irradiated 2 is supplied onto the first-layer object to be irradiated 2. Then, the head 10 irradiates the second-layer object to be irradiated 2 with the laser beam L.

[0038] As described above, by repeating a series of steps including the supply of the object to be irradiated 2 by the feeder, the irradiation of the laser beam L by the head 10, and the movement of the stage base 62 by the elevator mechanism 64, a laminate composed of a plurality of layers of the object to be irradiated 2 can be formed. Then, by removing the non-molten portion 2b of the laminate with a removing device (not shown), a three-dimensional object with a predetermined shape is formed. Examples of the removing device include an air blow and a brush.

[0039] The control unit 70 is configured by, for example, a computer having a processor, a main storage device, and an input / output interface for inputting / outputting signals to / from the outside. The control unit 70 exhibits various functions when the processor executes a program read into the main storage device. Specifically, the control unit 70 controls the laser element 14, the rotation mechanism 15, the movement mechanism 20, and the elevator mechanism 64. Note that the control unit 70 may be configured by a combination of a plurality of circuits instead of a computer.

[0040] 1.1.2. Operation Next, the operation of the laser irradiation device 100 according to the first embodiment will be described with reference to the drawings. Specifically, the processing of the control unit 70 of the laser irradiation device 100 according to the first embodiment will be described with reference to the drawings. FIG. 9 is a flowchart for explaining the processing of the control unit 70.

[0041] The user operates an operation unit (not shown), for example, to output a processing start signal for starting processing to the control unit 70. The operation unit is constituted by, for example, a mouse, a keyboard, a touch panel, or the like. When receiving the processing start signal, the control unit 70 starts processing.

[0042] First, as shown in FIG. 9, the control unit 70 performs data acquisition processing for acquiring shaping data for shaping a three-dimensional shaped object (step S1).

[0043] The shaping data includes information regarding, for example, the material of the metal powder constituting the irradiation object 2, the number of layers of the irradiation object 2, the moving speed of the head 10, the on / off states of the plurality of laser elements 14, and the like.

[0044] The shaping data is created, for example, by causing slicer software installed in a computer connected to the laser irradiation device 100 to read shape data. The shape data is data representing the target shape of a three-dimensional shaped object created using three-dimensional CAD (Computer Aided Design) software, three-dimensional CG (Computer Graphics) software, or the like. As the shape data, for example, data in the STL (Standard Triangulated Language) format, AMF (Additive Manufacturing File Format), or the like is used. The slicer software divides the target shape of the three-dimensional shaped object into layers of a predetermined thickness and creates shaping data for each layer. The shaping data is represented by G-codes, M-codes, or the like. The control unit 70 acquires the shaping data from a computer connected to the laser irradiation device 100 or a recording medium such as a USB (Universal Serial Bus) memory.

[0045] Next, the control unit 70 controls the rotation mechanism 15 to perform first rotation processing for opposing the laser element 14 and the light receiving element 42 as shown in FIG. 4 (step S2).

[0046] Specifically, the control unit 70 drives a motor (not shown) to rotate the shaft member 17, and makes the laser element 14 and the light receiving element 42 face each other. In the illustrated example, the laser element 14 faces the light receiving element 42 via the first optical element 30.

[0047] Next, the control unit 70 performs a calibration process of controlling the laser element 14 to irradiate the light receiving element 42 with the laser light L (step S3). In the illustrated example, the laser element 14 irradiates the laser in the -X axis direction.

[0048] Then, the control unit 70 determines the injection current to the laser element 14 in the processing based on the detected value of the light receiving element 42. For example, when the detected value of the light receiving element 42 is smaller than the reference value, the control unit 70 determines to make the injection current to the laser element 14 in the processing described later larger than the injection current to the laser element 14 in the calibration process. In this way the control unit 70 feeds back the detected value of the light receiving element 42 to the processing. The calibration process is a process for calibrating the light output of the laser light L in the processing. The reference value is stored in a storage unit (not shown), for example.

[0049] Next, the control unit 70 performs a second rotation process of controlling the rotation mechanism 15 to make the laser element 14 and the irradiation object 2 face each other as shown in FIG. 2 (step S4).

[0050] Specifically, the control unit 70 drives a motor (not shown) to rotate the shaft member 17, and makes the laser element 14 and the irradiation object 2 face each other. In the illustrated example, the laser element 14 faces the irradiation object 2 via the second optical element 50.

[0051] Next, the control unit 70 controls the laser element 14 and the moving mechanism 20, and performs a processing of changing the relative position between the laser element 14 and the irradiation object 2 while irradiating the irradiation object 2 with the laser light L based on the detected value of the light receiving element 42 (step S5). In the illustrated example, the laser element 14 irradiates the laser light L in the -Z axis direction.

[0052] Specifically, based on the detection value of the light receiving element 42 and the shaping data, the control unit 70 drives the motor of the moving mechanism 20 while irradiating the laser element 14 with the laser beam L, and moves the laser element 14 in the +X-axis direction. Thereby, the irradiation object 2 can be processed. As shown in FIG. 8, a melted portion 2a and a non-melted portion 2b are formed on the irradiation object 2. The distance D1 between the laser element 14 and the light receiving element 42 in the detection process is, for example, larger than the distance D2 between the laser element 14 and the light receiving element 42 in the processing process. Note that the light receiving element 42 may be moved as the laser element 14 moves.

[0053] Next, as shown in FIG. 9, the control unit 70 performs a determination process of determining whether or not the formation of all layers of the irradiation object 2 is completed based on the shaping data (step S6).

[0054] If it is determined that the formation of all layers of the irradiation object 2 is not completed (''NO'' in step S6), the control unit 70 returns the process to step S2. The control unit 70 repeats steps S2 to S6 until it is determined in step S6 that the formation of all layers of the irradiation object 2 is completed.

[0055] Note that the control unit 70 may return the process to step S5. Then, the control unit 70 may repeat steps S5 and S6 until it is determined in step S6 that the formation of all layers of the irradiation object 2 is completed.

[0056] On the other hand, if the control unit 70 determines that the formation of all layers of the irradiation object 2 is completed (''YES'' in step S6), the control unit 70 performs a non-melted portion removal process of causing the removal device to remove the non-melted portion 2b of the laminate formed of the irradiation object 2 (step S7). Thereby, a three-dimensional shaped object is shaped. Then, the control unit 70 ends the process.

[0057] Note that the removal of the non-molten portion 2b may be manually performed by the user. In this case, the control unit 70 ends the process after determining that the formation of all the layers of the irradiation object 2 is completed.

[0058] Here, FIG. 10 is a graph showing the relationship between time and optical output in the laser element 14. In FIG. 10, A1, A2, and A3 show the relationships in the calibration process. B1 and B2 show the relationships in the processing process.

[0059] The control unit 70, for example, in the calibration process, as shown by A1 in FIG. 10, pulse-drives the laser element 14, and in the processing process, as shown by B1 in FIG. 10, CW (Continuous Wave)-drives the laser element 14. In the illustrated example, the optical output of the CW drive is constant.

[0060] The control unit 70, for example, in the calibration process, as shown by A1 in FIG. 10, pulse-drives the laser element 14, and in the processing process, as shown by B2 in FIG. 10, pulse-drives the laser element 14. In this case, the frequency of the pulse drive in the calibration process is higher than the frequency of the pulse drive in the processing process.

[0061] The control unit 70, for example, in the calibration process, as shown by A2 in FIG. 10, pulse-drives the laser element 14, and in the processing process, as shown by B2 in FIG. 10, pulse-drives the laser element 14. In this case, the duty ratio of the pulse drive in the calibration process is smaller than the duty ratio of the pulse drive in the processing process.

[0062] By driving the laser element 14 as described above, as shown in FIG. 11, the optical output in the calibration process becomes larger than the optical output in the processing process at a predetermined current value. This is because in the processing process, a larger current is supplied to the laser element 14 compared to the calibration process, and the I-L (injection current - optical output) characteristics roll off due to heat.

[0063] Note that FIG. 11 is a graph showing the relationship between the current supplied to the laser element 14 and the optical output. This is the same in FIG. 12 described later.

[0064] As shown in A3 of FIG. 10, the optical output of the laser element 14 in the calibration process may be smaller than the optical output of the laser element 14 in the processing process. In this case, as shown in FIG. 12, in the calibration process, since the current injected into the laser element 14 is small, the optical output in the high output region is not directly detected. Therefore, the control unit 70 determines the injection current to the laser element 14 in the processing process based on the optical output in the low output region of the calibration process.

[0065] Note that when a plurality of laser elements 14 are provided, the number of laser elements 14 into which current is injected in the calibration process may be smaller than the number of laser elements 14 into which current is injected in the processing process. Thereby, the possibility of damage to the light receiving element 42 by the laser beam L can be reduced.

[0066] 1.1.3. Operational Effects In the laser irradiation device 100, there are a laser element 14 that irradiates the laser beam L, a light receiving element 42 that receives the laser beam L from the laser element 14, a moving mechanism 20 that changes the relative position between the laser element 14 and the irradiation object 2, a rotating mechanism 15 that rotates the laser element 14 so that the irradiation direction of the laser beam L changes, and a control unit 70 that controls the laser element 14, the moving mechanism 20, and the rotating mechanism 15. The control unit 70 controls the rotating mechanism 15 to perform a first rotation process as a first process of opposing the laser element 14 and the light receiving element 42, and after the first rotation process, controls the laser element 14 to perform a calibration process as a second process of irradiating the light receiving element 42 with the laser beam L. After the calibration process, the control unit 70 controls the rotating mechanism 15 to perform a second rotation process as a third process of opposing the laser element 14 and the irradiation object 2. After the second rotation process, the control unit 70 controls the laser element 14 and the moving mechanism 20 to perform a processing process as a fourth process of changing the relative position while irradiating the irradiation object 2 with the laser beam L based on the detection value of the light receiving element 42.

[0067] Therefore, in the laser irradiation device 100, even if the characteristics of the laser element 14 deviate from the design values, the deviation can be detected by the calibration process and fed back to the processing. As a result, the irradiation object 2 can be accurately irradiated in the processing. For example, when a plurality of laser elements 1 4 are provided, uniform irradiation can be performed by the plurality of laser elements 14.

[0068] Furthermore, in the laser irradiation device 100, with the laser element 14 and the light receiving element 42 facing each other, the laser beam L is irradiated onto the light receiving element 42. Therefore, for example, compared to the case where the optical path of the laser beam L from the laser element to the irradiation object is changed by an optical path changing element such as a mirror or a beam splitter and the laser beam L is irradiated onto the light receiving element, damage to the optical path changing element by the laser beam L can be suppressed. If the optical path changing element is damaged, the laser beam L may not be able to be guided to the light receiving element. In particular, when the laser element is a PCSEL, since the emission angle is narrow, if an optical path changing element is used, the optical path changing element is likely to be damaged.

[0069] Furthermore, in the laser irradiation device 100, since the orientation of the laser element 14 between the calibration process and the processing process can be switched by the rotation mechanism 15, the time required to shift from the calibration process to the processing process can be shortened. Furthermore, miniaturization can be achieved.

[0070] In the laser irradiation device 100, the rotation mechanism 15 rotates the laser element 14 around a rotation axis R along the +Y-axis direction as the first direction. In the calibration process, the laser element 14 irradiates the laser beam L in the -X-axis direction as the second direction intersecting the +Y-axis direction, and in the processing process, the laser element 14 irradiates the laser beam L in the -Z-axis direction as the third direction intersecting the +Y-axis direction and the -X-axis direction. Therefore, in the laser irradiation device 100, by rotating the laser element 14 around the rotation axis R, the irradiation direction of the laser beam L in the calibration process and the processing process can be changed.

[0071] In the laser irradiation device 100, the moving mechanism 20 moves the laser element 14 in the +X-axis direction, which is the opposite direction of the -X-axis direction. Therefore, in the laser irradiation device 100, the irradiation direction of the laser beam L from the laser element 14 in the calibration process and the moving direction of the laser element 14 in the processing process can be opposite to each other.

[0072] In the laser irradiation device 100, the irradiation object 2 is an object to be processed that is processed by the laser beam L from the laser element 14. Therefore, in the laser irradiation device 100, the irradiation object 2 can be processed with high accuracy.

[0073] The laser irradiation device 100 has a first optical element 30 as a diffusion element that diffuses the laser beam L from the laser element 14, and the laser beam L from the laser element 14 is incident on the light receiving element 42 through the first optical element 30. Therefore, in the laser irradiation device 100, the density of the laser beam L incident on the light receiving element 42 can be reduced. Thereby, the possibility of damaging the light receiving element 42 can be reduced.

[0074] In the laser irradiation device 100, the distance D1 between the laser element 14 and the light receiving element 42 in the calibration process is larger than the distance D2 between the laser element 14 and the irradiation object 2 in the processing process. Therefore, in the laser irradiation device 100, the intensity of the laser beam L incident on the light receiving element 42 can be reduced as compared with the case where the distance D1 is smaller than the distance D2. Thereby, the possibility of damaging the light receiving element 42 can be reduced.

[0075] In the laser irradiation device 100, the control unit 70 pulse-drives the laser element 14 in the calibration process and CW-drives the laser element 14 in the processing process. Therefore, in the laser irradiation device 100, the possibility of damaging the light receiving element 42 in the calibration process can be reduced.

[0076] In the laser irradiation device 100, the control unit 70 controls the laser The Z - element 14 is pulse - driven, and the frequency of the pulse drive in the calibration process is higher than the frequency of the pulse drive in the processing process. Therefore, in the laser irradiation device 100, the possibility of damage to the light - receiving element 42 in the calibration process can be reduced.

[0077] In the laser irradiation device 100, the control unit 70 pulse - drives the laser element 14 in the calibration process and the processing process, and the duty ratio of the pulse drive in the calibration process is smaller than the duty ratio of the pulse drive in the processing process. Therefore, in the laser irradiation device 100, the possibility of damage to the light - receiving element 42 in the calibration process can be reduced.

[0078] In the laser irradiation device 100, the optical output of the laser element 14 in the calibration process is smaller than the optical output of the laser element 14 in the processing process. Therefore, in the laser irradiation device 100, the possibility of damage to the light - receiving element 42 in the calibration process can be reduced.

[0079] In the laser irradiation device 100, the laser element 14 is a PCSEL. Therefore, in the laser irradiation device 100, the radiation angle of the laser beam L from the laser element 14 can be narrowed. Thereby, the irradiation time of the irradiation object 2 can be shortened.

[0080] 1.2. Modified examples of the laser irradiation device 1.2.1. The first modified example Next, the laser irradiation device according to the first modified example of the first embodiment will be described with reference to the drawings. FIG. 13 is a cross - sectional view schematically showing the laser irradiation device 110 according to the first modified example of the first embodiment. For the sake of convenience, in FIG. 13, the head 10 is shown in a simplified manner.

[0081] Hereinafter, in the laser irradiation device 110 according to the first modification of the first embodiment, members having the same functions as the constituent members of the laser irradiation device 100 according to the above-described first embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted. The same applies to the laser irradiation device according to the second modification of the first embodiment described later.

[0082] In the above-described laser irradiation device 100, as shown in FIG. 5, the first optical element 30 was a diffusing element that diffused the laser beam L from the laser element 14.

[0083] On the other hand, in the laser irradiation device 110, as shown in FIG. 13, the first optical element 30 is a light attenuation element that attenuates the laser beam L from the laser element 14. The first optical element 30 does not diffuse the laser beam L from the laser element 14. The light attenuation element is, for example, a light attenuation filter.

[0084] In the laser irradiation device 110, the first optical element 30 is a light attenuation element that attenuates the laser beam L from the laser element 14, and the laser beam L from the laser element 14 is incident on the light receiving element 42 via the first optical element 30. Therefore, in the laser irradiation device 110, the intensity of the laser beam L incident on the light receiving element 42 can be lowered. Thereby, the possibility of damaging the light receiving element 42 can be reduced.

[0085] 1.2.2. Second Modification Next, a laser irradiation device according to a second modification of the first embodiment will be described with reference to the drawings. FIG. 14 is a perspective view schematically showing a laser irradiation device 120 according to the second modification of the first embodiment. For convenience, in FIG. 14, the head 10 is shown in a simplified manner.

[0086] In the above-described laser irradiation device 100, as shown in FIG. 1, in the processing, the head 10 was moved in the +X-axis direction.

[0087] On the other hand, in the laser irradiation device 120, as shown in FIG. 14, the head 10 is fixed to the first fixing portion 122. The laser irradiation device 120 has, for example, a first fixing portion 122, a second fixing portion 124, and a base 126.

[0088] The first fixing portion 122 is provided across the rail 22. The head 10 is not moved during the processing. The head 10 is separated from the moving mechanism 20 and is located above the moving mechanism 20.

[0089] The second fixing portion 124 is provided across the rail 22. The calibration device 40 is fixed to the second fixing portion 124. In the illustrated example, the light receiving element 42 is located in the +X-axis direction of the head 10.

[0090] The base 126 supports the rail 22 of the moving mechanism 20. The rail 22 is provided on the base 126. In the laser irradiation device 120, the stage 60 is provided on the rail 22. The control unit 70 controls the moving mechanism 20 to move the stage 60 in the +X-axis direction during the processing. As the stage 60 moves, the irradiation object 2 is moved in the +X-axis direction. Thereby, the relative position between the laser element 14 and the irradiation object 2 is changed.

[0091] 2. Second Embodiment 2.1. Laser Irradiation Device Next, the laser irradiation device according to the second embodiment will be described with reference to the drawings. FIG. 15 is a perspective view schematically showing a laser irradiation device 200 according to the second embodiment. FIG. 16 is a cross-sectional view taken along line XVI-XVI of FIG. 15 schematically showing the laser irradiation device 200 according to the second embodiment. For convenience, in FIGS. 15 and 16, the head 10 is shown in a simplified manner.

[0092] Hereinafter, in the laser irradiation device 200 according to the second embodiment, members having the same functions as the constituent members of the laser irradiation device 100 according to the first embodiment described above are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0093] In the above-described laser irradiation apparatus 100, as shown in FIGS. 1 and 8, the object to be irradiated 2 was an object to be processed by the laser light L from the laser element 14.

[0094] On the other hand, in the laser irradiation apparatus 200, as shown in FIGS. 15 and 16, the object to be irradiated 2 is an object to be recorded by the laser light L from the laser element 14. The laser irradiation apparatus 200 is a recording apparatus.

[0095] The laser irradiation apparatus 200 has, for example, a support bar 202. In the illustrated example, the support bar 202 has a shape extending in the X-axis direction. The head 10 and the calibration device 40 are supported by the support bar 202. The head 10 and the calibration device 40 are fixed to the support bar 202.

[0096] The moving mechanism 20 is separated from the head 10 and the calibration device 40. The moving mechanism 20 is located in the -Z-axis direction of the head 10 and the calibration device 40. The moving mechanism 20 has, for example, a conveyance unit 24 and a support unit 26.

[0097] The conveyance unit 24 conveys the object to be irradiated 2 toward the support unit 26. In the illustrated example, the conveyance unit 2 4 conveys the object to be irradiated 2 in the -X-axis direction. The object to be irradiated 2 is wound around the conveyance unit 24. The conveyance unit 24 is, for example, a roller that supplies the object to be irradiated 2 to the support unit 26. The shape of the object to be irradiated 2 is, for example, sheet-like.

[0098] The support unit 26 is provided, for example, in the -X-axis direction of the conveyance unit 24. The support unit 26 supports the object to be irradiated 2 conveyed from the conveyance unit 24 during recording on the object to be irradiated 2. The support unit 26 is, for example, a platen roller. In the illustrated example, the conveyance unit 24 and the support unit 26 rotate about the Y-axis. The rotation of the conveyance unit 24 and the support unit 26 is controlled by, for example, the control unit 70. By the rotation of the conveyance unit 24 and the support unit 26, the moving mechanism 20 moves the object to be irradiated 2 in the -X-axis direction.

[0099] In the recording process on the object 2 to be irradiated, the object 2 to be irradiated is positioned between the head 10 and the support portion 26. The object 2 to be irradiated has, for example, a recording sheet 4 and an ink ribbon 6 provided on the recording sheet 4. As shown in FIG. 16, the ink ribbon 6 has, for example, an ink layer 7 composed of a heat-fusible ink and a base 8 provided on the ink layer 7. The base 8 is, for example, transparent. When the laser beam L is irradiated from the head 10, the ink layer 7 of the irradiated portion is melted and transferred to the recording sheet 4. Thereby, recording such as printing can be performed on the recording sheet 4. The laser irradiation device 200 is, for example, a thermal transfer type thermal printer. For the sake of convenience of explanation, in FIG. 16, the recording sheet 4 and the ink ribbon 6 are separated from each other, but usually, the recording sheet 4 and the ink ribbon 6 are in contact with each other.

[0100] Here, FIG. 17 is a flowchart for explaining the processing of the control unit 70 of the laser irradiation device 200. The user operates, for example, an operation unit (not shown) to output a processing start signal for starting the processing to the control unit 70. When receiving the processing start signal, the control unit 70 starts the processing.

[0101] First, as shown in FIG. 17, the control unit 70 performs a data acquisition process of acquiring print data generated by the user (step S11).

[0102] Next, the control unit 70 performs a first rotation process (step S12). The first rotation process is basically the same as the first rotation process of the above-described laser irradiation device 100.

[0103] Next, the control unit 70 performs a calibration process (step S13). The calibration process is basically the same as the calibration process of the above-described laser irradiation device 100.

[0104] Next, the control unit 70 performs a second rotation process (step S14). The second rotation process is basically the same as the second rotation process of the above-described laser irradiation device 100.

[0105] Next, the control unit 70 controls the laser element 14 and the moving mechanism 20 to perform a recording process of changing the relative position between the laser element 14 and the irradiation object 2 while irradiating the irradiation object 2 with the laser light L based on the detection value of the light receiving element 42 (step S15).

[0106] Specifically, the control unit 70 drives the transport unit 24 of the moving mechanism 20 to move the irradiation object 2 in the -X axis direction while irradiating the laser element 14 with the laser light L based on the detection value of the light receiving element 42 and the print data. Thereby, recording can be performed on the irradiation object 2.

[0107] Then, the control unit 70 ends the process.

[0108] In the laser irradiation device 200, it is a recording object recorded by the laser light L from the laser element 14. Therefore, in the laser irradiation device 200, recording can be accurately performed on the irradiation object 2. In the laser irradiation device 200, it is a recording object recorded by the laser light L from the laser element 14. Therefore, in the laser irradiation device 200, recording can be accurately performed on the irradiation object 2.

[0109] 2.2. Modification Example of Laser Irradiation Device Next, the laser irradiation device according to the modification example of the second embodiment will be described with reference to the drawings. FIG. 18 is a perspective view schematically showing a laser irradiation device 210 according to the modification example of the second embodiment. FIG. 19 is a cross-sectional view taken along line XIX-XIX of FIG. 18 schematically showing the laser irradiation device 210 according to the modification example of the second embodiment.

[0110] Hereinafter, in the laser irradiation device 210 according to the modification example of the second embodiment, members having the same functions as the constituent members of the laser irradiation device 200 according to the above-described second embodiment are denoted by the same reference numerals, and detailed descriptions thereof are omitted.

[0111] The laser irradiation device 210 is different from the above-described laser irradiation device 200 in that it is a receipt printer. The laser irradiation device 210 is provided, for example, at the cash register of stores such as supermarkets, convenience stores, and restaurants. And in the laser irradiation device 210, according to the accounting performed at the cash register, the result of printing an image on the irradiation object 2 is issued as a receipt. The material of the irradiation object 2 is, for example, paper. Note that the material of the irradiation object 2 may be polyethylene (PE), polyethylene terephthalate (PET), or polypropylene (PP).

[0112] As shown in FIGS. 18 and 19, the laser irradiation device 210 has, for example, a housing portion 220 and a cutter 230.

[0113] The housing portion 220 houses the irradiation object 2 wound in a roll shape, the head 10, the moving mechanism 20, the calibration device 40, the support rod 202, and the cutter 230. As shown in FIG. 18, the housing portion 220 has an openable and closable cover 222. The cover 222 is in an open state when the lever 224 is pushed down by the user. The user can replenish or replace the irradiation object 2 wound in a roll shape with the cover 222 open. The cover 222 is provided with a discharge port 226 for discharging the irradiated object 2 after printing. Further, the housing portion 220 is provided with a power switch 228 for switching the power of the laser irradiation device 210 on and off.

[0114] The irradiation object 2 wound in a roll shape around the support shaft 27 is held by the holding portion 28. The head 10 records on the irradiation object 2 between the support portion 26. The support portion 26 is, for example, a platen roller and functions as a conveyance portion for conveying the irradiation object 2 by rotating it. In the example shown in FIG. 19, the head 10 is arranged to irradiate laser light in a direction inclined with respect to the Z-axis direction during the printing process. Note that the position of the head 10 is not particularly limited, and as shown in FIG. 20, it may be arranged to irradiate laser light in the Z-axis direction during the printing process.

[0115] The cutter 230 is provided at a position corresponding to the discharge port 226. The cutter 230 cuts the printed object to be irradiated 2. Thereby, a receipt is generated. The shape of the cutter 230 is not particularly limited as long as it can cut the object to be irradiated 2.

[0116] In addition, the use of the laser irradiation device according to the present invention is not particularly limited. For example, it may be a laser cleaner that removes rust or the like attached to a metal by laser light, or a laser annealing device that heats the surface of a metal or resin by laser light.

[0117] Also, the material of the object to be irradiated is not particularly limited, and may be, for example, a resin such as a photocurable resin, wood, glass, paper, leather, minerals, or the like.

[0118] The above-described embodiments and modifications are examples and are not necessarily limited thereto. For example, it is also possible to appropriately combine each embodiment and each modification.

[0119] The present invention includes configurations that are substantially the same as the configurations described in the embodiments, for example, configurations having the same functions, methods, and results, or configurations having the same objectives and effects. The present invention also includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. The present invention also includes configurations that exhibit the same operational effects as the configurations described in the embodiments or configurations that can achieve the same objectives. The present invention also includes configurations in which known techniques are added to the configurations described in the embodiments.

[0120] The following contents are derived from the above-described embodiments and modifications.

[0121] One aspect of the laser irradiation device is a laser element that irradiates laser light, a light receiving element that receives the laser light from the laser element, a moving mechanism that changes the relative position between the laser element and the object to be irradiated, A rotation mechanism for rotating the laser element so that the irradiation direction of the laser light changes, A control unit for controlling the laser element, the moving mechanism, and the rotation mechanism, and having The control unit Performs a first process of controlling the rotation mechanism to oppose the laser element and the light receiving element, After the first process, a second process of controlling the laser element to irradiate the light receiving element with laser light, After the second process, a third process of controlling the rotation mechanism to oppose the laser element and the irradiation object, After the third process, a fourth process of controlling the laser element and the moving mechanism to change the relative position while irradiating the irradiation object with laser light based on the detection value of the light receiving element, is performed.

[0122] According to this laser irradiation device, the irradiation object can be irradiated accurately.

[0123] In one aspect of the laser irradiation device, The rotation mechanism rotates the laser element around a rotation axis along a first direction, The laser element In the second process, irradiates laser light in a second direction intersecting the first direction, In the fourth process, laser light may be irradiated in a third direction intersecting the first direction and the second direction.

[0124] According to this laser irradiation device, by rotating the laser element around the rotation axis, the irradiation direction of the laser light L in the second process and the fourth process can be changed.

[0125] In one aspect of the laser irradiation device, The moving mechanism may move the laser element in the direction opposite to the second direction.

[0126] According to this laser irradiation device, the irradiation direction of the laser light from the laser element in the second process and the moving direction of the laser element in the fourth process are opposite to each other. This can be achieved.

[0127] In one aspect of the laser irradiation device, The object to be irradiated may be an object to be processed that is processed by the laser light from the laser element.

[0128] According to this laser irradiation device, the object to be irradiated can be processed with high precision.

[0129] In one aspect of the laser irradiation device, The object to be irradiated may be an object to be recorded that is recorded by the laser light from the laser element.

[0130] According to this laser irradiation device, the object to be irradiated can be recorded with high precision.

[0131] In one aspect of the laser irradiation device, It has a diffusion element that diffuses the laser light from the laser element, The laser light from the laser element may enter the light receiving element via the diffusion element.

[0132] According to this laser irradiation device, the possibility of damaging the light receiving element can be reduced.

[0133] In one aspect of the laser irradiation device, It has a light attenuation element that attenuates the laser light from the laser element, The laser light from the laser element may enter the light receiving element via the light attenuation element.

[0134] According to this laser irradiation device, the possibility of damaging the light receiving element can be reduced.

[0135] In one aspect of the laser irradiation device, The distance between the laser element and the light receiving element in the second process may be greater than the distance between the laser element and the object to be irradiated in the fourth process.

[0136] According to this laser irradiation device, the possibility of damaging the light receiving element can be reduced.

[0137] In one aspect of the laser irradiation device, The control unit may pulse-drive the laser element in the second process and CW-drive the laser element in the fourth process.

[0138] According to this laser irradiation device, the possibility of damaging the light receiving element can be reduced.

[0139] In one aspect of the laser irradiation device, The control unit pulse-drives the laser element in the second process and the fourth process, The frequency of the pulse drive in the second process may be higher than the frequency of the pulse drive in the fourth process.

[0140] According to this laser irradiation device, the possibility of damaging the light receiving element can be reduced.

[0141] In one aspect of the laser irradiation device, The control unit pulse-drives the laser element in the second process and the fourth process, The duty ratio of the pulse drive in the second process may be smaller than the duty ratio of the pulse drive in the fourth process.

[0142] According to this laser irradiation device, the possibility of damaging the light receiving element can be reduced.

[0143] In one aspect of the laser irradiation device, The optical output of the laser element in the second process may be smaller than the optical output of the laser element in the fourth process.

[0144] According to this laser irradiation device, the possibility of damage to the light receiving element can be reduced.

[0145] In one aspect of the laser irradiation device, The laser element may be a photonic crystal surface emitting laser.

[0146] According to this laser irradiation device, the emission angle of the laser light from the laser element can be narrowed.

Explanation of Signs

[0147] 2... Object to be irradiated, 2a... Melted part, 2b... Non-melted part, 4... Recording sheet, 6... Ink ribbon, 7... Ink layer, 8... Base, 10... Head, 11... First substrate, 12... Laser element array, 13... Second substrate, 14... Laser element, 15... Rotation mechanism, 16... Disk member, 17... Shaft member, 18... Support beam, 19... Support plate, 20... Movement mechanism, 22... Rail, 24... Conveying unit, 26... Support unit, 27... Support shaft, 28... Holding unit, 30... First optical element, 40... Calibration device, 42... Light receiving element, 44... Element support part, 50... Second optical element, 60... Stage, 62... Stage base, 64... Elevator mechanism, 66... Housing, 70... Control unit, 100, 110, 120... Laser irradiation device, 122... First fixing part, 124... Second fixing part, 126... Base, 202... Support rod, 200, 210... Laser irradiation device, 220... Accommodation part, 222... Cover, 224... Lever, 226... Outlet, 228... Power switch, 230... Cutter

Claims

1. A laser element that irradiates laser light, A light receiving element that receives the laser light from the laser element, A moving mechanism that changes the relative position between the laser element and the irradiation object, A rotating mechanism that rotates the laser element so that the irradiation direction of the laser light changes, A control unit that controls the laser element, the moving mechanism, and the rotating mechanism, having, The control unit, A first process of controlling the rotating mechanism to oppose the laser element and the light receiving element, After the first process, a second process of controlling the laser element to irradiate the light receiving element with laser light, After the second process, a third process of controlling the rotating mechanism to oppose the laser element and the irradiation object, After the third process, a fourth process of controlling the laser element and the moving mechanism to change the relative position while irradiating the irradiation object with laser light based on the detection value of the light receiving element, A laser irradiation device that performs.

2. In Claim 1, The rotating mechanism rotates the laser element around a rotation axis along a first direction, The laser element, In the second process, irradiate laser light in a second direction intersecting the first direction, In the fourth process, a laser irradiation device that irradiates laser light in a third direction intersecting the first direction and the second direction.

3. In Claim 2, The moving mechanism moves the laser element in the direction opposite to the second direction, a laser irradiation device.

4. In Claim 1, The irradiation object is a processing object to be processed by the laser light from the laser element, a laser irradiation device.

5. In Claim 1, The irradiation object is a recording object to be recorded by the laser light from the laser element, a laser irradiation device.

6. In Claim 1, Having a diffusion element that diffuses the laser light from the laser element, The laser light from the laser element is incident on the light receiving element via the diffusion element, a laser irradiation device.

7. In Claim 1, Having a light attenuation element that attenuates the laser light from the laser element, The laser light from the laser element is incident on the light receiving element via the light attenuation element, a laser irradiation device.

8. In Claim 1, A laser irradiation device, wherein the distance between the laser element and the light receiving element in the second process is greater than the distance between the laser element and the object to be irradiated in the fourth process.

9. In claim 1, the control unit pulse-drives the laser element in the second process and CW-drives the laser element in the fourth process, a laser irradiation device.

10. In claim 1, the control unit pulse-drives the laser element in the second process and the fourth process, wherein the frequency of the pulse drive in the second process is higher than the frequency of the pulse drive in the fourth process, a laser irradiation device.

11. In claim 1, the control unit pulse-drives the laser element in the second process and the fourth process, wherein the duty ratio of the pulse drive in the second process is smaller than the duty ratio of the pulse drive in the fourth process, a laser irradiation device.

12. In claim 1, the light output of the laser element in the second process is smaller than the light output of the laser element in the fourth process, a laser irradiation device.

13. In any one of claims 1 to 12, the laser element is a photonic crystal surface emitting laser, a laser irradiation device.

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