Production system, management device, and management method

The management device automatically associates mounting and inspection IDs based on coordinate proximity, simplifying management and enabling quick identification of inspection failure sources, addressing the complexity of mismatched IDs in production lines.

JP2025104833APending Publication Date: 2025-07-10JUKI CORP
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Patent Information

Application Number
JP2023222961
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-12-28
Publication Date
2025-07-10

AI Technical Summary

Technical Problem

The mismatch between mounting IDs in production programs and inspection IDs in inspection programs complicates the management of production lines, making it difficult to identify the source of inspection failures when the IDs do not match, leading to increased complexity in maintaining the production line.

Method used

A management device that associates mounting IDs with inspection IDs based on the proximity of their coordinates, allowing for automatic association and simplified management, even when the IDs do not initially match, and provides clear notifications for identifying the source of inspection failures.

Benefits of technology

Facilitates the management of mounting and inspection IDs by automatically associating them based on coordinate proximity, enabling quick identification of the source of inspection failures and reducing the complexity of managing production lines.

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Abstract

To make it easy to manage a loaded ID of a production program and an inspection ID of an inspection program.SOLUTION: A production system comprises: a production line that includes a mounting device for mounting a component on a board and an inspection device for inspecting the board using an inspection program; and a management device for managing the production line using a production program. The production program includes information on a loaded ID for each component having loaded coordinates of the component. The inspection program includes information on an inspection ID for each component having inspection coordinates of the component. When the loaded ID of the production program differs from the inspection ID of the inspection program, the management device associates the loaded ID with the inspection ID on the basis of closeness between the loaded coordinates of the loaded ID and the inspection coordinates of the inspection ID.SELECTED DRAWING: Figure 4
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Description

Technical Field

[0001] The technology disclosed in this specification relates to a production system, a management device, and a management method.

Background Art

[0002] In the technical field related to a production system for mounting substrates, a production line constructed by a plurality of mounting devices and inspection devices, as disclosed in Patent Document 1, is known. A mounting substrate is produced by mounting components on a substrate. The inspection device inspects a substrate on which components are mounted by the mounting device for misalignment of the components or the like.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Each of the mounting devices is controlled based on a production program. The inspection device is controlled based on an inspection program. The production program and the inspection program each include an ID for identifying a component as a mounting ID and an inspection ID, respectively. Here, for the same component, the mounting ID of the production program and the inspection ID of the inspection program may not match.

[0005] If the mounting ID and the inspection ID do not match, and when the inspection device outputs an inspection result of NG for the component indicated by any of the inspection IDs, it becomes impossible to know which component with which mounting ID and which mounting device mounted it. Therefore, conventionally, a program creator has created a program so that the mounting ID and the inspection ID match, or has performed an operation of examining the correspondence relationship between the mounting ID and the inspection ID after the program is created. Therefore, the management of the mounting ID of the production program and the inspection ID of the inspection program is complicated.

[0006] The technology disclosed in this specification aims to facilitate the management of the mounting ID of the production program and the inspection ID of the inspection program.

Means for Solving the Problem

[0007] This specification discloses a production system. The production system includes a production line including a mounting device for mounting components on a substrate and an inspection device for inspecting the substrate using an inspection program, and a management device for managing the production line using a production program. The production program includes information on the mounting ID for each component having the mounting coordinates of the component, the inspection program includes information on the inspection ID for each component having the inspection coordinates of the component, and when the mounting ID of the production program and the inspection ID of the inspection program are different, the management device associates the mounting ID and the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID.

[0008] This specification discloses a management device. The management device is a management device that manages a production line including a mounting device for mounting components on a substrate and an inspection device for inspecting the substrate using an inspection program, and includes a storage unit that stores a production program including information on mounting IDs for each component having mounting coordinates of the components, an information acquisition unit that acquires information on inspection IDs for each component having inspection coordinates of the components included in the inspection program, and a processing unit that associates the mounting ID and the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID when the mounting ID in the production program is different from the inspection ID in the inspection program.

[0009] This specification discloses a management method. The management method is a management method that manages a production line including a mounting device for mounting components on a substrate and an inspection device for inspecting the substrate using an inspection program, and includes a step of acquiring information on mounting IDs for each component having mounting coordinates of the components included in a production program, a step of acquiring information on inspection IDs for each component having inspection coordinates of the components included in the inspection program, and a step of associating the mounting ID and the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID when the mounting ID in the production program is different from the inspection ID in the inspection program.

Advantages of the Invention

[0010] According to the technology disclosed in this specification, it is possible to facilitate the management of the mounting ID of the production program and the inspection ID of the inspection program.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments according to the present disclosure will be described with reference to the drawings, but the present disclosure is not limited to the embodiments.

[0013] [Production System] FIG. 1 is a diagram showing a production system 1 according to an embodiment. The production system 1 according to the embodiment includes a production line 6 including a mounting device 3 and an inspection device 4, and a management device 5. In the example of FIG. 1, the production system 1 includes an inspection device 2, a mounting device 3, an inspection device 4, and a management device 5. The inspection device 2, the mounting device 3, and the inspection device 4 construct a production line 6 for electronic devices.

[0014] In production line 6, one or more mounting devices 3 are provided. When multiple mounting devices 3 are provided, the mounting devices 3 are arranged in series. In the example shown in FIG. 1, production line 6 includes three mounting devices 3 arranged in series. The mounting devices 3 include mounting device 3A, mounting device 3B, and mounting device 3C. The number of mounting devices 3 may be one, two, or four or more.

[0015] In the embodiment, the substrate P on which a plurality of components C are mounted by the mounting device 3 is appropriately referred to as the mounting substrate Pm. The substrate P is conveyed in the production line 6. By conveying the substrate P in the production line 6, the mounting substrate Pm is produced. In the embodiment, the leading device of the production line 6 is the inspection device 2. The trailing device of the production line 6 is the inspection device 4. After the substrate P is loaded into the inspection device 2, it is sequentially conveyed to each of the plurality of mounting devices 3 (3A, 3B, 3C). The plurality of mounting devices 3 (3A, 3B, 3C) sequentially mount the components C on the substrate P. The substrate P on which a plurality of components C are mounted in the mounting device 3 is unloaded from the inspection device 4.

[0016] Before the substrate P is loaded into the production line 6, cream solder is printed on the substrate P by a printer. The substrate P on which cream solder is printed is loaded into the inspection device 2. The illustration of the printer is omitted.

[0017] The inspection device 2 includes a solder paste inspection device (SPI) that inspects the printing state of the substrate P before the component C is mounted.

[0018] The mounting device 3 mounts the component C on the substrate P on which cream solder is printed.

[0019] The inspection device 4 includes a substrate appearance inspection device (AOI: Automated Optical Inspection) that inspects the state of the substrate P (mounted substrate Pm) after the component C is mounted. After the appearance inspection by the inspection device 4, the mounted substrate Pm is heated in a reflow oven. When the substrate P is heated in the reflow oven, the cream solder melts. When the melted cream solder cools and solidifies, the component C is soldered to the substrate P. Note that the illustration of the reflow oven is omitted.

[0020] The management device 5 includes a computer system. The management device 5 manages the production line 6. The management device 5 is communicably connected to each of the inspection device 2, the mounting device 3, and the inspection device 4 via the network NW.

[0021] The substrate P includes a printed wiring board (PWB: Printed Wiring Board). The component C includes an electronic component. The mounted substrate Pm includes a printed circuit board (PCB: Printed Circuit Board).

[0022] [Management Device] FIG. 2 is a block diagram showing the production system according to the embodiment. As shown in FIG. 2, the inspection device 2 includes a control device 20 and a detection device 21. The mounting device 3 includes a control device 30 and a mounting head 35. The inspection device 4 includes a control device 40 and a detection device 41.

[0023] The detection device 21 includes an imaging device that acquires an image of the substrate P. The detection device 21 has an optical system and an image sensor. The detection device 21 detects the printing state of the substrate P before the component C is mounted. The control device 20 performs an inspection of the solder printing state based on the image of the substrate P acquired by the detection device 21 and outputs the inspection result to the management device 5.

[0024] The mounting head 35 holds the component C supplied from the component supply device with a nozzle and mounts it on the substrate P. The mounting head 35 has a plurality of nozzles. The mounting head 35 is movable between a supply position where the component C is supplied from the component supply device and a mounting position where the substrate P is disposed. The mounting head 35 holds the component C supplied to the supply position with a nozzle, moves to the mounting position, and then mounts the component C on the substrate P disposed at the mounting position. The component supply device is, for example, a tape feeder.

[0025] The detection device 41 includes an imaging device that acquires an image of the substrate P. The detection device 41 has an optical system and an image sensor. The detection device 41 detects the component mounting state of the mounted substrate Pm after the component C is mounted. The control device 40 controls the inspection process using the inspection program 12 (see FIG. 4). The inspection program 12 refers to a computer program used for inspecting the mounted substrate Pm in the production line 6. The inspection program 12 includes information such as position coordinates, inspection locations, and inspection methods for each component C mounted on the mounted substrate Pm. The control device 40 inspects the mounting state of the component C based on the image of the mounted substrate Pm acquired by the detection device 41 and outputs the inspection result to the management device 5.

[0026] The management device 5 includes an information acquisition unit 51, a storage unit 52, a processing unit 53, a mounting control unit 55, and a notification control unit 56.

[0027] The information acquisition unit 51 acquires information on the inspection ID 70 (see FIG. 7) for each component C included in the inspection program 12. The inspection ID 70 has inspection coordinates 72 of the component C. The information acquisition unit 51 acquires the inspection ID 70 and the inspection coordinates 72 of the inspection ID from the control device 40 of the inspection device 4 via a network.

[0028] The storage unit 52 stores the production program 11 (see Fig. 4). The storage unit 52 stores in advance the production program 11 created by the program creator before production. The production program 11 refers to a computer program used for the production of the mounting substrate Pm on the production line 6. The production program 11 includes data such as the part name of the component C mounted on the substrate P by the production line 6, the mounting coordinates, and the information of the component C. The production program 11 includes information on the mounting ID 60 (see Fig. 6) for each component C. The mounting ID 60 has the mounting coordinates 62 of the component C. The management device 5 manages the production line 6 using the production program 11.

[0029] The processing unit 53 performs an association process between the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12. The processing unit 53 acquires the information of the mounting ID 60 and the mounting coordinates 62 from the storage unit 52. The processing unit 53 acquires the information of the inspection ID 70 and the inspection coordinates 72 from the information acquisition unit 51. The processing unit 53 performs an association between the mounting ID 60 and the inspection ID 70 for each component C based on the mounting coordinates 62 and the inspection coordinates 72. The association process will be described later.

[0030] The mounting control unit 55 causes the mounting device 3 to execute the production program 11. In the embodiment, for one substrate P, component mounting is sequentially performed by a plurality of (three) mounting devices 3. The mounting control unit 55 allocates the mounting operations defined in the production program 11 to the respective mounting devices 3 according to the split data 13 described later. Each mounting device 3 sequentially executes the allocated mounting operations on the same substrate P.

[0031] The notification control unit 56 notifies the user (production manager or on-site worker) by outputting various types of information to the output device 7. Examples of the output device 7 include display devices such as liquid crystal displays and organic EL displays, lamps, speakers, printers, etc., but the present disclosure is not limited thereto. The management device 5, for example, when the inspection result of the mounting NG is output by the inspection device 4, notifies the information corresponding to the inspection result through the notification control unit 56. The production manager or on-site worker who has received the notification can grasp the content of the notification through the output device 7.

[0032] [Computer System] FIG. 3 is a block diagram showing a computer system 1000 according to the embodiment. The above-described management device 5 includes the computer system 1000. The computer system 1000 includes a processor 1001 such as a CPU (Central Processing Unit), a main memory 1002 including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 1003, and an interface 1004 including an input / output circuit. The functions of the management device 5 are stored in the storage 1003 as a computer program. The storage unit 52 of the management device 5 is realized by the storage 1003. The processor 1001 reads the computer program from the storage 1003 and expands it in the main memory 1002, and executes various processes according to the computer program. The computer program causes the processor 1001 to function as the information acquisition unit 51, the processing unit 53, the mounting control unit 55, and the notification control unit 56. Note that the computer program may be distributed to the computer system 1000 via the network NW.

[0033] Note that the control device 20 of the inspection device 2, the control device 30 of the mounting device 3, and the control device 40 of the inspection device 4 are also realized with a hardware configuration similar to the computer system 1000 shown in FIG. 3. The control device 30 acquires, from the management device 5, division data 13 indicating the mounting work assigned to the own device among all the mounting operations specified in the production program 11. The control device 30 controls the component mounting work of the mounting device 3 based on the division data 13.

[0034] (Production Program and Inspection Program) FIG. 4 is an explanatory diagram for explaining the production program 11 and the inspection program 12 according to the embodiment. FIG. 5 is an explanatory diagram for explaining the flow of component mounting and inspection according to the production program 11 and the inspection program 12.

[0035] As shown in FIG. 4, the production program 11 and the inspection program 12 are created in advance based on the design data 10 of the electronic circuit board (mounting board Pm) to be produced. That is, the production program 11 and the inspection program 12 define the component mounting procedure and the inspection procedure for the same production object, respectively.

[0036] The production program 11 identifies the individual components C included in the design data 10 and defines the content of the mounting work for each individual component C. The content of the mounting work includes the mounting position (coordinates) and mounting angle of the component C on the board P. As described above, the management device 5 assigns and distributes the mounting work defined in the production program 11 to each of the mounting devices 3 constituting the production line 6. The management device 5 creates division data 13 to be assigned to each mounting device 3 from the production program 11. In the example of FIG. 4, the management device 5 creates division data 13A, 13B, and 13C for the three mounting devices 3A, 3B, and 3C, respectively. All the data of the mounting work of the component C defined in the production program 11 is included in any of the division data 13A, 13B, and 13C.

[0037] The divided data 13A includes data related to the mounting operations of the component group G1 among all the components C defined in the production program 11. In FIG. 4, the components C belonging to the component group G1 are indicated by circular marks. The divided data 13B includes data related to the mounting operations of the component group G2 among all the components C defined in the production program 11. In FIG. 4, the components C belonging to the component group G2 are indicated by rectangular marks. The divided data 13C includes data related to the mounting operations of the component group G3 among all the components C defined in the production program 11. In FIG. 4, the components C belonging to the component group G3 are indicated by triangular marks. In this example, the sum of the component group G1, the component group G2, and the component group G3 corresponds to all the components C defined in the production program 11.

[0038] As shown in FIG. 5, the mounting device 3A performs the mounting operations of the component group G1 on the unmounted substrate P according to the divided data 13A. The mounting device 3B performs the mounting operations of the component group G2 on the substrate P on which the component group G1 is mounted according to the divided data 13B. The mounting device 3C performs the mounting operations of the component group G3 on the substrate P on which the component groups G1 and G2 are mounted according to the divided data 13C. As a result, all the components C defined in the production program 11 are mounted on the substrate P.

[0039] As shown in FIG. 4, the inspection program 12 identifies the individual components C included in the design data 10 and defines the content of the inspection operations for the individual components C. The content of the inspection operations includes the inspection positions (coordinates) and inspection items of the components C on the substrate P. The inspection items include, for example, missing parts, misalignment (including position misalignment and angular misalignment), polarity correctness, front-back inversion, non-soldering, bridge formation, and solder amount appropriateness. The inspection program 12 is stored in the storage unit (storage 1003) of the control device 40 of the inspection device 4. The inspection program 12 defines the inspection procedures for the same components C as those defined in the production program 11. As shown in FIG. 5, the inspection device 4 performs inspections on each component C including the component groups G1, G2, and G3 on the mounted substrate Pm on which the component groups G1, G2, and G3 are mounted according to the inspection program 12.

[0040] The inspection device 4 determines, for each individual component C, whether the inspection is OK or NG. Mounting OK means that the component C to be inspected is within the allowable range for the inspection items defined by the inspection program 12. Inspection NG means that the component C to be inspected is outside the allowable range for the inspection items defined by the inspection program 12. The inspection device 4 transmits the inspection results according to the inspection program 12 to the management device 5. When the inspection results include Inspection NG, the management device 5 notifies the notification control unit 56 that the inspection is NG.

[0041] FIG. 6 is a diagram for explaining the data included in the production program 11. FIG. 7 is a diagram for explaining the data included in the inspection program 12.

[0042] As shown in FIG. 6, the production program 11 includes information on the mounting ID 60 for each component C. In the production program 11, each individual component C is identified by the mounting ID 60. FIG. 6 shows the data of the production program 11 in matrix form, and one row corresponds to one component C indicated by one mounting ID 60.

[0043] The mounting ID 60 is unique identification information assigned to each component C and is represented by, for example, a character string of a predetermined number of digits. One mounting ID 60 represents one component C. The mounting ID 60 has a component name 61, mounting coordinates 62 of the component C, and component dimensions 63. The component name 61 includes a name, part number, model number, etc. assigned to the component C identified by the mounting ID 60. The mounting coordinates 62 are coordinate information indicating the mounting position on the substrate P. The mounting coordinates 62 are represented by coordinate values from a reference point set on the substrate P in a coordinate system (referred to as the substrate coordinate system) set on the surface of the substrate P. The component dimensions 63 are information on the dimensions of the component C.

[0044] The production program 11 includes related ID information 64 indicating an inspection ID 70 associated with the mounting ID 60. The related ID information 64 is assigned separately for each mounting ID 60. Details of the related ID information 64 will be described later.

[0045] As shown in FIG. 7, the inspection program 12 includes information on the inspection ID 70 for each component C. In the inspection program 12, each individual component C is identified by the inspection ID 70. FIG. 7 shows the data of the inspection program 12 in a matrix format, and one row corresponds to one component C indicated by one inspection ID 70.

[0046] The inspection ID 70 is unique identification information for each part to be inspected. For example, it is represented by a character string of a predetermined number of digits. The parts to be inspected include all the components C mounted on the mounting substrate Pm. Therefore, the inspection ID 70 is assigned to each component C, and one inspection ID 70 represents one component C. The inspection ID 70 has a part name 71, inspection coordinates 72 of the component C, and detailed data 73. The part name 71 includes a name, part number, model number, etc. assigned to the component C identified by the inspection ID 70. The inspection coordinates 72 are coordinate information indicating the inspection position on the substrate P. The inspection coordinates 72 are represented by coordinate values from a reference point set on the substrate P in a coordinate system (referred to as the substrate coordinate system) set on the surface of the substrate P. The inspection coordinates 72 are the coordinates of the position where the component C identified by the inspection ID 70 is mounted. The detailed data 73 is a general term for detailed information on the inspection of the component C identified by the inspection ID 70. The detailed data 73 includes information such as which part of the component C is to be inspected and which inspection items are to be inspected.

[0047] In this way, in the production program 11, each component C is identified by the mounting ID 60. In the inspection program 12, each component C is identified by the inspection ID 70. For management purposes, it is desirable that the mounting ID 60 and the inspection ID 70 representing the same component C are the same character string. However, the mounting ID 60 and the inspection ID 70 do not necessarily match. When the mounting ID 60 and the inspection ID 70 representing the same component C do not match, for example, it is likely to occur when the manufacturer of the mounting device 3 and the manufacturer of the inspection device 4 are different, or when the production program 11 and the inspection program 12 are created at different times. When the manufacturer of the mounting device 3 and the manufacturer of the inspection device 4 are different, due to differences in the program specifications, it may not be possible to assign the same ID. When the mounting ID 60 and the inspection ID 70 representing the same component C do not match, for example, when an inspection NG is output from the inspection device 4 for any inspection ID 70, it becomes impossible to determine from the ID which mounting ID 60 the component C represented by the inspection ID 70 corresponds to.

[0048] Since the inspection NG may be caused by some abnormality in the production line 6, the cause is identified and the abnormal cause is eliminated by maintenance by the operator. Among the abnormal causes, when the mounting ID 60 and the inspection ID 70 representing the same component C do not match, it becomes complicated to identify the cause because the mounting device 3 on which the component C that has become an inspection NG from the inspection ID 70 cannot be immediately identified.

[0049] Therefore, in the embodiment, when the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12 are different, the management device 5 performs the association of the mounting ID 60 and the inspection ID 70 in advance before the start of the mounting operation. Specifically, the management device 5 acquires, from the inspection device 4, the information of the inspection ID 70 included in the inspection program 12 by the information acquisition unit 51. Then, as shown in FIG. 6, the management device 5 performs the association by assigning the related ID information 64 indicating the inspection ID 70 that is likely to represent the same component C to each mounting ID 60 of the production program 11. The related ID information 64 includes one or more inspection IDs 70.

[0050] Accordingly, when the inspection apparatus 4 outputs an inspection NG for any inspection ID 70 during production, the management apparatus 5 identifies the mounting ID 60 associated with the inspection ID 70 for which the inspection NG has been output. That is, the management apparatus 5 extracts, from among the respective mounting IDs 60 of the production program 11, the mounting ID 60 to which the associated ID information 64 including the inspection ID 70 for which the inspection NG has been output is assigned. Thereby, even when the mounting ID 60 and the inspection ID 70 representing the same component C do not match, the mounting ID 60 corresponding to the component C for which the inspection NG has occurred can be identified. From the identified mounting ID 60, it is possible to identify which divided data 13 the component C for which the inspection NG has occurred is included in, that is, by which mounting apparatus 3 it has been mounted.

[0051] (Detailed description of the association) Next, the details of the association between the mounting ID 60 and the inspection ID 70 will be described. In the embodiment, the management apparatus 5 associates the mounting ID 60 and the inspection ID 70 based on the proximity between the mounting coordinates 62 of the mounting ID 60 and the inspection coordinates 72 of the inspection ID 70. The association process is performed by the processing unit 53 of the management apparatus 5.

[0052] FIG. 8 is a schematic diagram showing a specific example for explaining the association between the mounting ID 60 and the inspection ID 70. FIG. 9 is a diagram for explaining the determination method of the association between the mounting ID 60 and the inspection ID 70.

[0053] FIG. 8 schematically shows the arrangement of the components C on the substrate P (mounting substrate Pm). In FIG. 8, four components C, namely, components C1, C2, C3, and C4 are shown. Let the mounting IDs 60 of components C1, C2, C3, and C4 be mounting ID 601, mounting ID 602, mounting ID 603, and mounting ID 604, respectively. Let the inspection IDs 70 of components C1, C2, C3, and C4 be inspection ID 701, inspection ID 702, inspection ID 703, and inspection ID 704, respectively.

[0054] FIG. 9 shows the mounting coordinates 62 of the mounting ID 60 and the inspection coordinates 72 of the inspection ID 70 shown in FIG. 8. In FIG. 9, the mounting coordinates 62 of the mounting ID 601 are denoted as mounting coordinates 621. The inspection coordinates 72 of the inspection IDs 701, 702, 703, and 704 are denoted as inspection coordinates 721, inspection coordinates 722, inspection coordinates 723, and inspection coordinates 724, respectively.

[0055] The mounting coordinates 62 of the mounting ID 60 and the inspection coordinates 72 of the inspection ID 70 for the same component C indicate the positions of the same component C on the same substrate P, respectively. Therefore, ideally, there should be one mounting ID 60 having mounting coordinates 62 with the same coordinate value for the inspection coordinates 72 of one inspection ID 70. For example, focusing on component C1, the mounting coordinates 621 of the mounting ID 601 and the inspection coordinates 721 of the inspection ID 701 should be the same. However, as shown in FIG. 9, strictly speaking, the mounting coordinates 621 and the inspection coordinates 721 may be different for the same component C1.

[0056] For example, assume that the mounting coordinates 621 are set to the coordinates corresponding to the geometric center of the component C1 according to the specifications of the production program 11. On the other hand, assume that the inspection coordinates 721 are set to the coordinates corresponding to the position of a specific corner of the component C1 according to the specifications of the inspection program 12. The mounting coordinates 621 and the inspection coordinates 721 indicate the position of the same component C1, but the coordinate values are different. In such a case, even if searching for a pair of the mounting ID 60 and the inspection ID 70 having the same coordinate value, such a pair cannot be found.

[0057] Therefore, the processing unit 53 of the management device 5 associates the inspection ID 70 having the inspection coordinates 72 closest to the mounting coordinates 62 of the mounting ID 60 of interest with the mounting ID 60 of interest. In the embodiment, the processing unit 53 can associate not only the closest inspection coordinates 72 but also the inspection ID 70 having the inspection coordinates 72 around the mounting coordinates 62 with the mounting ID 60 of interest.

[0058] Specifically, the processing unit 53 sets a determination range DR centered on the mounting coordinates 62 of the mounting ID 60 of interest. The processing unit 53 associates an inspection ID 70 having inspection coordinates 72 included within the determination range DR with the mounting ID 60 of interest.

[0059] In the example of FIG. 9, the determination range DR centered on the mounting coordinates 621 of the mounting ID 601 is indicated by a two-dot chain line. In the embodiment, the management device 5 sets the determination range DR according to the component dimension 63. That is, the processing unit 53 sets the radius of the determination range DR according to the component dimension 63. The processing unit 53 sets, as the radius of the determination range DR, a range obtained by adding a predetermined margin to the component dimension 63 of the mounting ID 601 of interest (see FIG. 6). The processing unit 53 widens the determination range DR as the component dimension 63 is larger and narrows the determination range DR as the component dimension 63 is smaller, according to the component dimension 63.

[0060] When there are a plurality of inspection coordinates 72 within the determination range DR centered on the mounting coordinates 62, the management device 5 associates, as a first candidate K1, the inspection ID 70 having the inspection coordinate 72 closest to the mounting coordinates 62 with the mounting ID 60. The management device 5 associates, as a second candidate K2, inspection IDs 70 other than the first candidate K1 having inspection coordinates 72 within the determination range DR. When there are a plurality of inspection IDs 70 other than the first candidate K1, the management device 5 associates the plurality of inspection IDs 70 as the second candidate K2. When only one inspection coordinate 72 is included within the determination range DR, the management device 5 associates the inspection ID 70 having that inspection coordinate 72 with the mounting ID 60 as the first candidate K1.

[0061] In the example of FIG. 9, inspection coordinates 721, inspection coordinates 723, and inspection coordinates 724 are included within a determination range DR centered on the mounting coordinates 621 of mounting ID 601. The inspection coordinate 722 is outside the determination range DR. The positional relationship of each coordinate is such that, with respect to the mounting coordinate 621, the inspection coordinates 721, 724, and 723 are close in that order. That is, the respective distances L between the mounting coordinate 621 and the inspection coordinates 721, 724, and 723 are small in the order of the inspection coordinates 721, 724, and 723. Therefore, in the example of FIG. 9, the processing unit 53 associates the inspection ID 701 having the inspection coordinate 721 with the mounting ID 601 as the first candidate K1. Thereby, the mounting ID 601 and the inspection ID 701 representing the same component C1 are correctly associated. The processing unit 53 further associates the inspection ID 703 having the inspection coordinate 723 and the inspection ID 704 having the inspection coordinate 724 with the mounting ID 601 as the second candidate K2. The processing unit 53 does not associate the inspection ID 702 having the inspection coordinate 722 with the mounting ID 601.

[0062] Incidentally, when there are a plurality of inspection IDs 70 having the inspection coordinate 72 closest to the mounting coordinate 62, any one of the inspection IDs 70 may be associated as the first candidate K1. As the selection criterion in that case, for example, other information possessed by the mounting ID 60 and the inspection ID 70 may be used, or the inspection ID 70 to be the first candidate K1 may be selected based on a user input operation.

[0063] In addition, when there are multiple second candidates K2 within the determination range DR, the management device 5 assigns numbers to the multiple second candidates K2 in ascending order of proximity to the mounting ID 60 (and the mounting coordinates 62) of the first candidate K1. In the example of FIG. 9, inspection ID 701 is associated with mounting ID 601 as the first candidate K1, and inspection ID 703 and inspection ID 704 are associated with mounting ID 601 as the second candidates K2. Then, by comparing the respective distances L from the mounting coordinates 621 of mounting ID 601 to the inspection coordinates 723 of inspection ID 703 and the inspection coordinates 724 of inspection ID 704, it can be seen that inspection ID 704 is closer than inspection ID 703. Therefore, the management device 5 associates inspection ID 704 with mounting ID 601 as the first second candidate K2 and associates inspection ID 703 with mounting ID 601 as the second second candidate K2.

[0064] As a result of performing the association determination in this way, as shown in FIG. 6, the processing unit 53 assigns, as related ID information 64, the information of one inspection ID 70 that becomes the first candidate K1 and the information of one or more inspection IDs 70 that become the second candidates K2 to the mounting ID 60 in the production program 11. Thereby, the mounting ID 60 is associated with each inspection ID 70 that becomes the first candidate K1 and the second candidate K2.

[0065] By performing the association in advance, as shown in FIG. 5, when the inspection device 4 outputs an inspection NG for any inspection ID 70 during the operation of the production line 6, the management device 5 acquires the mounting ID 60 with which the inspection ID 70 is associated as the first candidate K1 or the second candidate K2 from the production program 11.

[0066] When the inspection device 4 outputs an inspection NG for the inspection ID 70, the management device 5 notifies the mounting ID 60 associated with the inspection ID 70 for which the inspection NG has occurred. The management device 5 performs the notification by outputting information to the output device 7 by the notification control unit 56.

[0067] In the embodiment, when the inspection device 4 outputs an inspection NG for the inspection ID 70, the management device 5 distinguishes and notifies the mounting ID 60 associated with the inspection ID 70 that has become an inspection NG as the first candidate K1 and the mounting ID 60 associated with the inspection ID 70 that has become an inspection NG as the second candidate K2. The management device 5, by the notification control unit 56, notifies one mounting ID 60 associated with the inspection ID 70 that has become an inspection NG as the first candidate K1, clearly indicating that it is the first candidate K1. The management device 5, by the notification control unit 56, notifies one or more mounting IDs 60 associated with the inspection ID 70 that has become an inspection NG as the second candidate K2, clearly indicating that it is the second candidate K2. For the mounting ID 60 associated with the inspection ID 70 that has become an inspection NG as the second candidate K2, the management device 5 notifies the mounting ID 60 together with the number assigned in ascending order to the mounting ID 60. For example, assume that the inspection ID 703 shown in FIG. 9 has become an inspection NG. The inspection ID 703 is the second candidate K2 of the second position of the mounting ID 601. Therefore, the management device 5 notifies the mounting ID 601 together with the number "2" to clearly indicate that it is the second candidate K2 that is farther than the inspection ID 704. Note that the inspection ID 703 is the first candidate K1 of the mounting ID 603 as shown in FIG. 8. Therefore, when the inspection ID 703 becomes an inspection NG, the management device 5 clearly indicates that the mounting ID 603 is the first candidate K1.

[0068] FIG. 10 is a diagram for explaining the operation by the notification of the first candidate K1. FIG. 11 is a diagram for explaining the operation by the notification of the second candidate K2.

[0069] As shown in FIG. 10, assume that the inspection ID 70 for which the inspection has failed represents a certain component C1. The management device 5 notifies one mounting ID 60 associated with the inspection ID 70 for which the inspection has failed as the first candidate K1. Thereby, the operator on the production line 6 can identify the mounting device 3 on which the component C1 for which the inspection has failed was actually mounted from the mounting ID 60 of the first candidate K1. For example, when the mounting device 3B has mounted the component C1 (indicated by hatching), the operator can investigate whether there is any cause for the inspection failure in the mounting device 3B. If there is a cause in the mounting device 3B, the operator performs maintenance on the mounting device 3B or reviews the mounting conditions of the mounting device 3B (such as the speed of the mounting operation of the mounting head 35).

[0070] It is also conceivable that the cause of the inspection failure of the component C1 lies in the mounting operation of the component C mounted around the component C1. FIG. 11 shows an example in which, after the component C1 is mounted by the mounting device 3B, the component C3 is mounted around the component C1 by the mounting device 3C. Here, it is assumed that there is no abnormality in the mounting of the component C1 by the mounting device 3B. At the time when the component C1 is mounted by the mounting device 3B, the component C1 is mounted at the proper position in the proper state. Thereafter, when the component C3 is mounted by the mounting device 3C, for example, slight deflection or vibration may occur in the substrate P, and displacement of the component C1 may occur due to the influence of the displacement of the substrate P. As a result, at the time of inspection by the inspection device 4 after component mounting, an inspection failure is output for the inspection ID 70 representing the component C1. In such a case, since the cause lies in the mounting operation of the component C3 (indicated by hatching) by the mounting device 3C, the cause of the abnormality cannot be identified even if the mounting device 3B is investigated.

[0071] In the embodiment, the operator can identify the mounting device 3 on which the component C disposed near the component C with a failed inspection is mounted, from the mounting ID 60 of the second candidate K2. That is, in the case of FIG. 11, from the inspection ID 70 associated as the second candidate K2 with respect to the mounting ID 60 of the component C1, the mounting device 3C that mounts the component C3 can be identified. The operator can take measures such as reviewing the mounting conditions of the mounting device 3C (such as the speed of the mounting operation of the mounting head 35) or performing maintenance on the mounting device 3C, so that the displacement of the component C1 due to the influence of the mounting operation of the component C3 does not occur.

[0072] As described above, in the embodiment, by associating the first candidate K1, the mounting ID 60 of the component C with a failed inspection and the mounting device 3 on which the component C is mounted can be quickly identified. And by associating the second candidate K2, the mounting ID 60 of the peripheral component that may affect the component C with a failed inspection and the mounting device 3 on which the peripheral component is mounted can be quickly identified.

[0073] [Management Method] FIG. 12 is a flowchart showing a management method according to the embodiment. The management method according to the embodiment is a management method for managing a production line 6 including a mounting device 3 that mounts components C on a substrate P and an inspection device 4 that inspects the substrate P using an inspection program 12. The management method is implemented by a management device 5 according to the embodiment. In FIG. 12, it is assumed that a production program 11 is stored in advance in the storage unit 52 of the management device 5 and an inspection program 12 is stored in advance in the control device 40 (storage 1003) of the inspection device 4.

[0074] First, information on the inspection ID 70 for each component C having the inspection coordinates 72 of the component C included in the inspection program 12 is acquired (step S1). The information acquisition unit 51 of the management device 5 acquires, from the control device 40, information on each inspection ID 70 included in the inspection program 12 and the inspection coordinates 72 of the inspection ID 70 by communication via a network. The information acquisition unit 51 outputs the acquired information to the processing unit 53.

[0075] Obtain the information of the mounting ID 60 for each component C having the mounting coordinates 62 of component C included in the production program 11 (step S2). The processing unit 53 of the management device 5 reads the production program 11 from the storage unit 52, and obtains the information of each mounting ID 60 included in the production program 11 and the mounting coordinates 62 of that mounting ID 60. Note that either step S1 or step S2 may be executed first.

[0076] When the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12 are different, associate the mounting ID 60 and the inspection ID 70 based on the proximity between the mounting coordinates 62 of the mounting ID 60 and the inspection coordinates 72 of the inspection ID 70 (step S3). The processing unit 53 of the management device 5 sets a determination range DR centered on the mounting coordinates 62 for each mounting ID 60, and associates the inspection ID 70 whose inspection coordinates 72 are included within the determination range DR with that mounting ID 60. The processing unit 53 associates the inspection ID 70 having the inspection coordinates 72 closest to the mounting coordinates 62 within the determination range DR as the first candidate K1. The processing unit 53 associates the inspection ID 70 other than the first candidate K1 having the inspection coordinates 72 within the determination range DR as the second candidate K2. When there are multiple second candidates K2, the processing unit 53 assigns numbers to each second candidate K2 in the order of proximity to the mounting coordinates 62 of the mounting ID 60. The processing unit 53 associates the inspection ID 70 that becomes the first candidate K1 and the inspection ID 70 that becomes the second candidate K2 as the associated ID information 64 respectively, by adding them to the data of the mounting ID 60 of the production program 11, thereby performing the association. Note that when the mounting ID 60 and the inspection ID 70 match, the processing unit 53 treats both as IDs representing the same component C.

[0077] Through the above steps S1 to S3, the association between the mounting ID 60 and the inspection ID 70 is completed. Steps S1 to S3 are performed as preparatory work before the start of production by the production line 6.

[0078] After steps S1 to S3, production by the production line 6 starts (step S4). The management device 5 causes the implementation control unit 55 to allocate the divided data 13 of the production program 11 to each implementation device 3 and start the implementation work. The inspection device 2 inspects the printed circuit board P. The implementation device 3A mounts the first component group G1 on the printed and inspected circuit board P according to the divided data 13A. The implementation device 3B mounts the second component group G2 on the circuit board P on which the first component group G1 has been mounted according to the divided data 13B. The implementation device 3C mounts the third component group G3 on the circuit board P on which the second component group G2 has been mounted according to the divided data 13C. The inspection device 4 performs an appearance inspection on the mounted circuit board Pm for the components C represented by each inspection ID 70 according to the inspection program 12. The inspection device 4 generates an inspection result of inspection OK or inspection NG for each of the inspection IDs 70 and transmits the generated inspection result to the management device 5.

[0079] The management device 5 determines whether or not inspection NG is included in the inspection result of the inspection device 4 (step S5).

[0080] When the management device 5 determines that inspection NG is not included (step S5: NO), it determines that the production of one circuit board P is completed, and controls the unloading of the circuit board P from the production line 6 (inspection device 4). Then, the management device 5 determines whether or not the production of the circuit board P is completed (step S6). When the production of all the circuit boards P scheduled for production is completed (step S6: YES), the management device 5 ends the production. When the production of all the circuit boards P scheduled for production is not completed (step S6: NO), the management device 5 continues the production and performs the determination process of step S5 on the inspection result of the next mounted circuit board Pm.

[0081] When the management device 5 determines that inspection NG is included in step S5 (step S5: YES), the notification control unit 56 performs notification regarding the mounting ID 60 associated with the inspection ID 70 for which inspection NG has occurred (step S7). At this time, the management device 5 can temporarily stop part or all of the production operation of the production line 6 by the mounting control unit 55. The management device 5 distinguishes and notifies the mounting ID 60 associated with the inspection ID 70 for which inspection NG has occurred as the first candidate K1 and the mounting ID 60 associated with the inspection ID 70 for which inspection NG has occurred as the second candidate K2. For the mounting ID 60 associated with the second candidate K2, the management device 5 also notifies the number of the second candidate K2 assigned in the order of proximity from the mounting ID 60 (mounting coordinates 62). Thereby, the operator takes measures for identifying the cause of inspection NG and eliminating the cause. After that, when the management device 5 receives an instruction to resume production from the operator, the process returns to step S4 and the production of the production line 6 is resumed.

[0082] [Effect] As described above, according to the embodiment, the production system 1 includes a production line 6 including a mounting device 3 that mounts components C on a substrate P and an inspection device 4 that inspects the substrate P using an inspection program 12, and a management device 5 that manages the production line 6 using a production program 11. The production program 11 includes information on mounting IDs 60 for each component C having mounting coordinates 62 of the component C, and the inspection program 12 includes information on inspection IDs 70 for each component C having inspection coordinates 72 of the component C. When the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12 are different, the management device 5 associates the mounting ID 60 and the inspection ID 70 based on the proximity between the mounting coordinates 62 of the mounting ID 60 and the inspection coordinates 72 of the inspection ID 70. Here, even when the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12 do not match, for the mounting ID 60 and the inspection ID 70 representing the same component C, the mounting coordinates 62 and the inspection coordinates 72 match or are approximate. Therefore, the mounting ID 60 and the inspection ID 70 representing the same component C can be associated. As a result, even if the program creator does not create the program so that one of the mounting ID 60 and the inspection ID 70 matches the other, the management device 5 can perform the association afterwards. Also, there is no need to perform an operation of checking the correspondence between the two after the program is created, and the management device 5 can perform automatic association. As a result, the management of the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12 can be facilitated.

[0083] Further, when the inspection device 4 outputs an inspection NG for the inspection ID 70, the management device 5 performs notification regarding the mounting ID 60 associated with the inspection ID 70 for which the inspection NG has occurred. Thereby, from the mounting ID 60 of the component C represented by the inspection ID 70 for which the inspection NG has occurred, the mounting device 3 on which the component C for which the inspection NG has occurred is mounted can be easily specified. As a result, the work of specifying the cause of the inspection NG can be facilitated.

[0084] In addition, when there are multiple inspection coordinates 72 within the determination range DR centered on the mounting coordinate 62, the management device 5 associates the inspection ID 70 having the inspection coordinate 72 closest to the mounting coordinate 62 as the first candidate K1, and associates inspection IDs 70 other than the first candidate K1 having inspection coordinates 72 within the determination range DR as the second candidate K2. Thereby, the mounting device 3 on which the component C for which inspection has failed can be easily identified by the inspection ID 70 of the first candidate K1. By the inspection ID 70 of the second candidate K2, the mounting device 3 on which peripheral components that may have affected the component C for which inspection has failed can be easily identified. Further, in the embodiment, when the inspection device 4 outputs an inspection failure for the inspection ID 70, the management device 5 separately notifies the mounting ID 60 associated with the inspection ID 70 for which inspection has failed as the first candidate K1 and the mounting ID 60 associated with the inspection ID 70 for which inspection has failed as the second candidate K2. Thereby, the operator can distinguish and grasp the first candidate K1 and the second candidate K2, so that the cause can be specified by setting priorities according to the likelihood of being the cause of the inspection failure throughout the production line 6. As a result, the management and cause specification at the time of occurrence of inspection failure become easier.

[0085] Further, in the embodiment, when there are multiple second candidates K2 within the determination range DR, the management device 5 assigns numbers to the multiple second candidates K2 in ascending order of proximity from the mounting ID 60 of the first candidate K1. Thereby, regarding the peripheral components (i.e., the second candidate K2) that may have affected a certain component C, the degree of the possibility of having an impact can be grasped by specifying the order of proximity. As a result, it becomes easier to identify the cause of the occurrence of inspection failure.

[0086] In addition, the production program 11 includes information on the component dimensions 63 of the component C specified by the mounting ID 60, and the management device 5 sets the determination range DR according to the component dimensions 63. Thereby, an appropriate determination range DR can be set so that the inspection IDs 70 that become the first candidate K1 and the second candidate K2 do not increase unnecessarily when small components C are crowded or when large components C are arranged side by side.

[0087] According to an embodiment, the management device 5 is a management device 5 that manages a production line 6 including a mounting device 3 that mounts components C on a substrate P and an inspection device 4 that inspects the substrate P using an inspection program 12. The management device 5 includes a storage unit 52 that stores a production program 11 including information on a mounting ID 60 for each component C having a mounting coordinate 62 of the component C, an information acquisition unit 51 that acquires information on an inspection ID 70 for each component C having an inspection coordinate 72 of the component C included in the inspection program 12, and a processing unit 53 that associates the mounting ID 60 with the inspection ID 70 based on the proximity between the mounting coordinate 62 of the mounting ID 60 and the inspection coordinate 72 of the inspection ID 70 when the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12 are different. Thereby, as described above, the management of the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12 can be facilitated.

[0088] According to an embodiment, a management method is a management method for managing a production line 6 including a mounting device 3 that mounts components C on a substrate P and an inspection device 4 that inspects the substrate P using an inspection program 12. The management method includes a step S2 of acquiring information on a mounting ID 60 for each component C having a mounting coordinate 62 of the component C included in a production program 11, a step S1 of acquiring information on an inspection ID 70 for each component C having an inspection coordinate 72 of the component C included in the inspection program 12, and a step S3 of associating the mounting ID 60 with the inspection ID 70 based on the proximity between the mounting coordinate 62 of the mounting ID 60 and the inspection coordinate 72 of the inspection ID 70 when the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12 are different. Thereby, as described above, the management of the mounting ID 60 of the production program 11 and the inspection ID 70 of the inspection program 12 can be facilitated.

[0089] [Other Embodiments] In the above embodiment, an example of associating a first candidate K1 and a second candidate K2 with the mounting ID 60 is shown, but only the first candidate K1 may be associated. In that case, it is not necessary to set the determination range DR. The management device 5 may associate the inspection ID 70 having the inspection coordinate 72 closest to the mounting coordinate 62 of the mounting ID 60 with the mounting ID 60.

[0090] In the above embodiment, an example was shown in which when the inspection device 4 outputs an inspection NG for the inspection ID 70, the management device 5 acquires the mounting ID 60 associated with the inspection ID 70 for which the inspection was NG. However, the inspection device 4 may perform a process of acquiring the mounting ID 60. In this case, the inspection device 4 may acquire the production program 11 from the management device 5, extract the mounting ID 60 associated with the inspection ID 70 for which the inspection was NG, and output it to the management device 5 or perform a notification process.

Explanation of Signs

[0091] 1…Production system, 2…Inspection device, 3, 3A, 3B, 3C…Mounting device, 4…Inspection device, 5…Management device, 6…Production line, 7…Output device, 10…Design data, 11…Production program, 12…Inspection program, 13, 13A, 13B, 13C…Divided data, 20…Control device, 21…Detection device, 30…Control device, 35…Mounting head, 40…Control device, 41…Detection device, 51…Information acquisition unit, 52…Memory unit, 53…Processing unit, 55…Mounting control unit, 56…Notification control unit, 60, 601, 602, 603, 604…Mounting ID, 61…Part name, 62, 621…Mounting coordinates, 63…Part dimensions, 64…Related ID information, 70, 701, 702, 703, 704…Inspection ID, 71…Part name, 72, 721, 722, 723, 724…Inspection coordinates, 73…Detailed data, 1000…Computer system, 1001…Processor, 1002…Main memory, 1003…Storage, 1004…Interface, C, C1, C2, C3, C4…Parts, DR…Determination range, G1, G2, G3…Part groups, K1…First candidate, K2…Second candidate, NW…Network, P…Substrate, Pm…Mounting substrate.

Claims

1. A production line including a mounting device for mounting components on a substrate and an inspection device for inspecting the substrate using an inspection program, and a management device for managing the production line using a production program, wherein the production program includes information on mounting IDs for each of the components having mounting coordinates of the components, the inspection program includes information on inspection IDs for each of the components having inspection coordinates of the components, when the mounting ID in the production program and the inspection ID in the inspection program are different, the management device associates the mounting ID and the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID, A production system.

2. When the inspection device outputs an inspection NG for the inspection ID, the management device gives a notification regarding the mounting ID associated with the inspection ID for which the inspection NG has occurred. The production system according to claim 1.

3. When there are a plurality of inspection coordinates within a determination range centered on the mounting coordinates, the management device associates the inspection ID having the inspection coordinate closest to the mounting coordinate as a first candidate, and associates the inspection IDs other than the first candidate having inspection coordinates within the determination range as second candidates. The production system according to claim 1.

4. When there are a plurality of second candidates within the determination range, the management device assigns numbers to the plurality of second candidates in ascending order of proximity from the mounting ID of the first candidate. The production system according to claim 3.

5. The production program includes information on the component dimensions of the components specified by the mounting ID, and the management device sets the determination range according to the component dimensions. The production system according to claim 3.

6. When the inspection device outputs an inspection NG for the inspection ID, the management device differentiates and notifies between the mounting ID associated with the inspection ID for which the inspection NG has occurred as the first candidate and the mounting ID associated with the inspection ID for which the inspection NG has occurred as the second candidate. The production system according to any one of claims 3 to 5.

7. A management device for managing a production line including a mounting device for mounting components on a substrate and an inspection device for inspecting the substrate using an inspection program, comprising a storage unit that stores a production program including information on mounting IDs for each of the components having mounting coordinates of the components, An information acquisition unit that acquires information on the inspection ID for each component having the inspection coordinates of the component included in the inspection program; A processing unit that associates the mounting ID and the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID when the mounting ID in the production program is different from the inspection ID in the inspection program; A management device comprising the above. [

8. ] A management method for managing a production line including a mounting device for mounting components on a substrate and an inspection device for inspecting the substrate using an inspection program, comprising: Obtaining information on the mounting ID for each component having the mounting coordinates of the component included in the production program; Obtaining information on the inspection ID for each component having the inspection coordinates of the component included in the inspection program; When the mounting ID in the production program is different from the inspection ID in the inspection program, associating the mounting ID and the inspection ID based on the proximity between the mounting coordinates of the mounting ID and the inspection coordinates of the inspection ID; A management method comprising the above.

Citation Information

Patent Citations

  • Management device

    JP2021141114A