3-pillar boat in load lock chamber and methods of making pillar boat in load locks for semiconductor processing systems

The three-pillar wafer boat design with inclined elements and triangular members addresses contamination and orientation issues in semiconductor processing, achieving an 80% reduction in particle generation and improved wafer storage.

JP2025105560APending Publication Date: 2025-07-10ASM IP HLDG BV
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2024228984
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-12-28
Filing Date
2024-12-25
Publication Date
2025-07-10

AI Technical Summary

Technical Problem

Conventional semiconductor processing systems generate substantial particle residue due to complete contact between wafers and semi-circular protruding elements, leading to contamination and increased likelihood of orientation errors during wafer storage in load lock chambers.

Method used

A wafer boat design featuring three pillars with inclined protruding elements and a triangular upper and bottom member configuration minimizes wafer contact points, reducing contamination and preventing orientation errors by using angled surfaces and distinct markings for proper assembly.

Benefits of technology

The three-pillar configuration significantly reduces particle generation by 80% compared to four-pillar designs, enhancing wafer storage integrity and reducing contamination risks.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 2025105560000001_ABST
    Figure 2025105560000001_ABST
Patent Text Reader

Abstract

To provide a wafer boat configured to support a plurality of wafers in a load lock chamber.SOLUTION: A wafer boat configured to support one or more wafers is provided. The wafer boat includes a first pillar, a second pillar, and a third pillar, each having a plurality of protrusion elements. Top surfaces of the first, second, and third pillars are coupled to a triangular top member, and bottom surfaces of the first, second, and third pillars are coupled to a triangular bottom member. The wafer boat defines a central axis that extends vertically and is parallel to the first, second, and third pillars. The protrusion elements extend towards the central axis to define a plurality of wafer slots, where each wafer slot is configured to support a wafer.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present disclosure generally relates to fabricating semiconductor devices. More particularly, the present disclosure relates to a wafer boat configured to support a plurality of wafers in a load lock chamber.

Background Art

[0002] A semiconductor processing system, such as a semiconductor processing system having a cluster type platform, generally includes a front end connected to a back end by a load lock. The front end generally interfaces the semiconductor processing system to an external environment and typically includes a front end robot for transporting substrates between the front end of the semiconductor processing system and the load lock. The back end typically includes a process module where substrate processing is achieved and a back end robot for transporting substrates between the load lock and the process module. The load lock generally couples the back end of the semiconductor processing system to the front end of the semiconductor processing system and is typically arranged to isolate the environment maintained in the back end of the semiconductor processing system from the environment maintained in the front end of the semiconductor processing system.

[0003] After the substrate processing is achieved in the process module, the substrate is transferred from the process module to the load lock by the back-end robot before being transferred to the front-end module. Thus, after substrate processing, the processed wafers are held in the load lock chamber to cool during the transfer from the back-end module to the front-end module. In a conventional system, these wafers are held horizontally in an apparatus that includes four pillars having semi-circular protruding elements that extend vertically from the pillars. These semi-circular protruding elements are generally flat and have a radius of 15 mm. Since these protruding elements are arranged vertically along the four pillars, the pillars can then be arranged in a manner that defines slots for holding the wafers, with each slot being defined by the respective protruding elements extending from each of the four pillars. Therefore, this conventional arrangement allows the wafers to be stacked on top of each other.

[0004] However, each time a wafer contacts an element of the apparatus, particles are generated. Complete contact between the wafer and each of the four protruding elements results in substantial particle residue. In this arrangement, the wafers are stacked vertically, and any particle residue on the upper wafer is deposited on the wafer below it, and so on. Further, in a conventional system, the upper and bottom members that support the four pillars to form the storage device in the load lock chamber are the same. Therefore, the likelihood of accidentally switching the orientation of the apparatus during installation in the load lock chamber increases.

[0005] Therefore, in the art, there is a need for an improved load lock arrangement, a semiconductor processing system having the load lock arrangement, a method of depositing a material layer, and a method of performing a load lock arrangement for a semiconductor processing system. The present disclosure provides a solution to this need. SUMMARY OF THE INVENTION

[0006] A wafer boat is provided. The wafer boat is configured to support one or more wafers. The wafer boat includes a first pillar having a first plurality of protruding elements, the first pillar being defined by a first inner surface, a first outer surface, a first upper surface, and a first bottom surface, and the first plurality of protruding elements extending from the first inner surface. The wafer boat further includes a second pillar having a second plurality of protruding elements, the second pillar being defined by a second inner surface, a second outer surface, a second upper surface, and a second bottom surface, and the second plurality of protruding elements extending from the second inner surface. The wafer boat also includes a third pillar having a third plurality of protruding elements, the third pillar being defined by a third inner surface, a third outer surface, a third upper surface, and a third bottom surface, and the third plurality of protruding elements extending from the third inner surface. The wafer boat further includes a triangular upper member having a first upper joint, a second upper joint, and a third upper joint, and a triangular upper plate is coupled to the first pillar, the second pillar, and the third pillar such that the first upper surface is coupled to the first upper joint, the second upper surface is coupled to the second upper joint, and the third upper surface is coupled to the third upper joint. The wafer boat also includes a triangular bottom member having a first bottom joint, a second bottom joint, and a third bottom joint, and a triangular bottom plate is coupled to the first pillar, the second pillar, and the third pillar such that the first bottom surface is coupled to the first bottom joint, the second bottom surface is coupled to the second bottom joint, and the third bottom surface is coupled to the third bottom joint. The triangular upper member and the triangular bottom member are parallel to each other. The wafer boat extends vertically and further defines a central axis parallel to the first pillar, the second pillar, and the third pillar, and the first plurality of protruding elements, the second plurality of protruding elements, and the third plurality of protruding elements extend toward the central axis to define a plurality of wafer slots, each wafer slot being configured to support a wafer.

[0007] A method of manufacturing a wafer boat is provided. The method includes defining a central axis that extends vertically. The method further includes coupling a first pillar to a triangular upper member and a triangular bottom member by coupling a first upper surface of the first pillar to a first upper joint of the triangular upper member such that a first plurality of protruding elements extend from a first inner surface toward the central axis, and coupling a first bottom surface of the first pillar to a first bottom joint of the triangular bottom member. The method also includes coupling a second pillar to the triangular upper member and the triangular bottom member by coupling a second upper surface of the second pillar to a second upper joint of the triangular upper member such that a second plurality of protruding elements extend from a second inner surface toward the central axis, and coupling a second bottom surface of the second pillar to a second bottom joint of the triangular bottom member. Finally, the method includes coupling a third pillar to the triangular upper member and the triangular bottom member by coupling a third upper surface of the third pillar to a third upper joint of the triangular upper member such that a third plurality of protruding elements extend from a third inner surface toward the central axis, and coupling a third bottom surface of the third pillar to a third bottom joint of the triangular bottom member.

[0008] A load lock chamber is provided. The load lock chamber includes a wafer boat having a plurality of pillars. Each of the plurality of pillars includes a plurality of protruding elements, each protruding element including an upper protruding surface and a bottom protruding surface, the bottom protruding surface being perpendicular to the central axis, and the upper protruding surface being coupled to the bottom protruding surface at a protruding angle to form an inclined protruding element.

[0009] This "Summary of the Invention" is provided to introduce selected concepts in a simplified form. These concepts are described in more detail in the following "Detailed Description of the Invention" of the present disclosure. This "Summary of the Invention" is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

Brief Description of the Drawings

[0010] These and other features, aspects, and advantages of the invention disclosed in this specification will be described below with reference to the drawings of certain embodiments, which are intended to illustrate the invention and not to limit the invention.

[0011]

Figure 1

Figure 2A

Figure 2B

Figure 2C

Figure 2D

Figure 3A

Figure 3B

Figure 4

Figure 5A

Figure 5B

Figure 5C

Figure 6

[0012] Of course, the elements in the figures are illustrated for simplicity and clarity and are not necessarily drawn to scale. For example, the relative sizes of some of the elements in the figures may be exaggerated compared to other elements to assist in understanding the illustrated embodiments of the present disclosure.

Best Mode for Carrying Out the Invention

[0013] Reference will now be made to the drawings, wherein like reference numerals identify like structural features and aspects of the present disclosure. For purposes of illustration and not limitation, a diagram of a boat for holding wafers within a load lock arrangement of a semiconductor processing system according to the present disclosure is shown in FIG. 1 and is designated generally by reference numeral 100. Other examples or aspects of boat 100 are provided in FIGS. 2-6, as will be described. The systems and methods of the present disclosure may be in a semiconductor processing system used to fabricate semiconductor devices, e.g., a semiconductor processing system used to deposit material layers using chemical vapor deposition (CVD) and atomic layer deposition (ALD) methods during the fabrication of logic devices and memory devices, but the present disclosure is generally not limited to any semiconductor processing operation or the fabrication of any particular semiconductor device.

[0014] As used herein, the term "substrate" may refer to a single or plurality of any underlying materials, including single or plural of any underlying materials that may be modified or on which devices, circuits, or films may be formed. A "substrate" may be continuous or discontinuous, rigid or flexible, solid or porous, and combinations thereof. The substrate may be in any form such as powder, plate, or workpiece. A substrate in the form of a plate may include wafers of various shapes and sizes. The wafer may be 200 millimeters in diameter, 300 millimeters in diameter, or 450 millimeters in diameter. The substrate may be formed from one or more semiconductor materials including, by way of non-limiting example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0015] Referring to FIG. 1, a wafer boat 100 is shown. The wafer boat 100 may be configured to support a plurality of substrates. The wafer boat 100 is placed in a load lock chamber. In an exemplary embodiment, the material used to manufacture the wafer boat 100 includes a quartz material. In an exemplary embodiment, other materials having a desired quality may be used to manufacture the wafer boat 100. The wafer boat 100 further includes three pillars 200a, 200b, and 200c. In an exemplary embodiment, the pillars 200a, 200b, and 200c are substantially the same at all points. The wafer boat 100 further includes a triangular upper member 300 and a triangular bottom member 400 that support the pillars 200a, 200b, and 200c. In other words, as shown in FIG. 1, the triangular upper member 300 and the triangular bottom member 400 are spaced apart from each other by the vertical placement of the pillars 200a, 200b, and 200c parallel to the vertical axis 102.

[0016] Referring now to FIGS. 2a - 2d, pillar 200 is shown. FIG. 2a is a perspective view of pillar 200. Pillar 200 includes either pillar 200a, 200b, or 200c. As shown in FIG. 2a, pillar 200 includes a plurality of protruding elements 204 protruding from the inner surface 220 of pillar 200. In an exemplary embodiment, each pillar 200 includes at least 25 protruding elements (204 - 1 to 204 - 25). Each of the protruding elements 204 is aligned toward its own slot axis 104 (see FIG. 5c). Each slot axis 104 extends through a central point and intersects the vertical axis 102. By aligning the protruding elements 204 of each pillar 200 toward their own slot axis 104, the axes 104 are formed, and all of those axes extend through a central point that intersects the vertical axis 102 (see FIG. 5c). Thus, the protruding element 204a - 1 of the first pillar 200a, the protruding element 204b - 1 of the second pillar 200b, and the protruding element 204c - 1 of the third pillar 200c are aligned along axis 104 - 1 to form slot 214 - 1. Similarly, each of the protruding elements 204a - n, 204b - n, and 204c - n of pillars 200a, 200b, and 200c are aligned along their respective axes 104 - n to form slots 214 - n (see FIG. 1). Each slot 214 is configured to hold a single wafer 550.

[0017] Referring now to FIG. 2d, a cross-sectional view of the pillar 200 is shown. The pillar 200 of FIG. 2d may include any of the pillars 200a, 200b, or 200c. As shown in FIG. 2d, each protruding element 204 extends so as to be angled. Each protruding element 204 includes an upper surface 232, a side surface 222, and a bottom surface 226. In an exemplary embodiment, the bottom surface 226 extends perpendicularly from the inner surface 220 of the pillar 200, and the upper surface 232 extends at an obtuse angle from the inner surface 220 to form an inclined protruding element. The upper surface 232 and the bottom surface 226 are separated by the side surface 222. In an exemplary embodiment, the side surface 222 is 3 millimeters (mm). In an exemplary embodiment, the angle 224 formed by the upper surface 232 and the bottom surface 226 is 5 degrees. In an exemplary embodiment, the bottom surface 226 is 220 mm. That is, the protruding element 204 extends up to 220 mm. Further, in an exemplary embodiment, the distance 236 is defined as the space between the bottom surface of the first protruding element (such as 204-1) of the pillar 200 and the upper surface of the next protruding element (such as 204-2) of the pillar 200, and is 10 mm.

[0018] Referring briefly to FIGS. 2b and 2c, perspective views of the upper portion 250 of the pillar 200 and the bottom portion 260 of the pillar 200 are shown, respectively. As shown in FIG. 2a, the pillar 200 includes an upper surface 206 that couples to the upper member 300 of the boat 100. The upper surface 206 is substantially flat, enabling easy coupling with the upper member 300. The pillar 200 also includes an outer surface 210 on the opposite side of the inner surface 220. Therefore, the pillar 200 includes a substantially rectangular cross-section along the axis 102. The rectangular portion facilitates the process of manufacturing the pillar 200 of the boat 100. In an exemplary embodiment, the outer surface 210 may be further marked with a linear cut mark 212 closer to the upper surface 206 for marking the orientation. In an exemplary embodiment, the mark 212 may be a linear cut on the outer surface 210 parallel to the axis 102 with a length of 10 mm and a depth of 0.1 mm.

[0019] As further shown in FIG. 2c, the pillar 200 includes a bottom surface 208 that couples to the bottom member 400 of the boat 100. As shown in FIG. 2c, in an exemplary embodiment, the last protruding element 204-n is configured to couple directly to the bottom member 400. Accordingly, the bottom surface 208 of the pillar 200 overlaps the bottom surface 226 of the last protruding element 204-n. In contrast, the top surface 206 is distinguished from the top surface 232 of the first protruding element 204-1 (see FIG. 2b). Further, unlike the upper portion 250, the bottom portion 260 does not include the notch mark 212. Thus, the mark 212 defines the orientation in which the upper member 300 and the bottom member 400 are attached to the pillar to form the boat 100. Such marking prevents directional manufacturing errors during the manufacture of the boat 100. As such, during manufacture, errors in which the top surface 206 couples to the bottom member 400, and hence, the bottom surface 208 couples to the upper member 300, are significantly minimized.

[0020] Referring now to FIG. 3, the upper triangular member 300 is shown. The upper member 300 includes an upper surface 310 and a lower surface 312. The upper member 300 further includes a triangular portion 350 and a rectangular portion 360. As shown in FIG. 3, the first side portion 322 is in contact with the second side portion 326, which is further in contact with the third side portion 324 to form the triangular portion 350 of the upper member 300. In an exemplary embodiment, the triangular portion 350 further includes a triangular opening 304, as shown in FIG. 3. The triangular opening 304 results in the formation of three inner sides 352i, 354i, and 356i of the triangular portion 350. The intersection of the inner sides 352i and 354i may be sharp or rounded. Similarly, the intersection of the inner sides 352i and 356i may be sharp and rounded, and the intersection of the inner sides 354i and 356i may be sharp and rounded. Further, the side surfaces 352i and 354i form an acute angle 362c, the side surfaces 352i and 356i form an acute angle 362a, and the side surfaces 354i and 356i form an acute angle 362b. As a result, the triangular opening 304 forms an acute-angled triangular portion. In an exemplary embodiment, the angles 362a, 362b, and 362c are equal to form an equilateral triangular portion. In other embodiments, two of the angles 362a, 362b, and 362c may be equal to form an isosceles triangular portion.

[0021] As further shown in FIG. 3, the outer side 352x is parallel to the inner side 352i and perpendicular to the upper surface 310 and the lower surface 312. The outer side 352x contacts the upper surface 310, the upper surface 310 contacts the inner side 352i, the inner side 352i contacts the lower surface 312, and finally the lower surface 312 contacts the outer side 352x. Thus, the outer side 352x, the upper surface 310, the lower surface 312, and the inner side 352i together form the first side portion 322. Similarly, the outer side 354x is parallel to the inner side 354i and perpendicular to the upper surface 310 and the lower surface 312. The outer side 354x contacts the upper surface 310, the upper surface 310 contacts the inner side 354i, the inner side 354i contacts the lower surface 312, and finally the lower surface 312 contacts the outer side 354x. Thus, the outer side 354x, the upper surface 310, the lower surface 312, and the inner side 354i together form the third side portion 324. Finally, the outer side 356x is parallel to the inner side 356i and perpendicular to the upper surface 310 and the lower surface 312. The outer side 356x contacts the upper surface 310, the upper surface 310 contacts the inner side 356i, the inner side 356i contacts the lower surface 312, and finally the lower surface 312 contacts the outer side 356x. Thus, the outer side 356x, the upper surface 310, the lower surface 312, and the inner side 356i together form at least a part of the second side portion 326.

[0022] In an exemplary embodiment, the third side portion 326 is further divided into three small portions. FIG. 3b shows a top view of the upper triangular member 300. The first small portion includes an outer side 356x, an upper surface 310, a lower surface 312, and an inner side 356i. Further, the second small portion 380a includes at least a portion of the outer side 352x that contacts the side surface 382a, and the side surface 382a contacts the side surface 384a (see FIG. 3B). The side surface 384a is substantially parallel to the side surface 352x. Further, the side surface 382a is aligned perpendicular to its corresponding axis 104a. Therefore, at least a portion of the outer side 352x, the side surface 382a, the side surface 384a, the upper surface 310, and the bottom surface 312 together form the small portion 380a. As shown in FIG. 3b, the small portion 380a is aligned perpendicular to the axis 104a. Similarly, the third small portion 380b includes at least a portion of the outer side 354x that contacts the side surface 382b, and the side surface 382b contacts the side surface 384b (see FIG. 3b). The side surface 384b is substantially parallel to the side surface 354x. Further, the side surface 382b is aligned perpendicular to its corresponding axis 104b. Therefore, at least a portion of the outer side 354x, the side surface 382b, the side surface 384b, the upper surface 310, and the bottom surface 312 together form the small portion 380b. As shown in FIG. 3B, the small portion 380b is aligned perpendicular to the axis 104b. The small portions 380a and 380b are spaced apart from each other only by 356x. As shown in FIG. 3b, the side surface 384a contacts the side surface 356x such that the intersection forms an obtuse angle. Similarly, the side surface 384b contacts the side surface 356x such that the intersection forms an obtuse angle.

[0023] The upper triangular member 300 further includes a rectangular portion 360. The rectangular portion 360 includes side surfaces 334, 328, and 332. The rectangular portion 360 further includes an upper surface 310 and a lower surface 312. The side surfaces 334 and 332 are parallel to each other and perpendicular to the side surface 328. The side surfaces 334 and 332 are aligned parallel to the axis 104c, and the side surface 328 is aligned on an axis perpendicular to the axis 104c. As shown in FIG. 3A, the side surfaces 328, 332, and 334 are in contact with the upper surface 310 and the lower surface 312 to form the rectangular portion 360. Thus, in the exemplary embodiment, the rectangular portion 360 is adjacent to the triangular portion 350 to form the upper triangular member 300, including a single upper surface 310, a single lower surface 312, side surfaces 352x, 354x, 356x, 328, 332, 334, 352i, 354i, 356i, 382a, 382b, 384a, and 384b. Further, in the exemplary embodiment, the upper triangular member 300 includes a single cavity 302 (e.g., a hole). The cavity 302 is formed on the axis 102. Thus, the axis 102 passes through the cavity 302. In the exemplary embodiment, the cavity 302 is formed at the center of the upper triangular member 300.

[0024] Referring now to FIG. 4, a vertical view of the triangular bottom member 400 is shown. As shown in FIG. 4, the triangular bottom member 400 is substantially the same as the triangular member 300. However, unlike the upper member 300, the bottom member 400 includes a plurality of cavities. Similar to the cavity 302, the cavity 402 is formed on the shaft 102. Therefore, the cavity 402 is aligned with the cavity 302, and the shaft 102 passes through the cavity 402. In an exemplary embodiment, the bottom member 400 includes two cavities 446 and 444 on both sides of the cavity 402, which are substantially the same size as the cavity 402. Further, the bottom member 400 may include a cavity 442 such that the cavity 442 is aligned with the pillar 200c after the formation of the boat 100 (see FIG. 1). The bottom member 400 may also include a cavity 448 facing the cavity 442. The cavities 402, 442, 444, 446, and 448 are all positioned along the axis 104c (see FIG. 5c). The cavities 444 and 446 positioned on both sides of the cavity 402 may be utilized by a lower mounting plate attached to the load lock chamber. Since the cavities 444 and 446 are not included in the upper member 300, the upper member 300 is distinguished from the bottom member 400, and the inverted installation of the boat 100 is prevented.

[0025] The bottom member 400 is substantially the same as the upper member 300 in all other respects. Similar to the upper member 300, the bottom member 400 includes a triangular portion 450 and a rectangular portion 460. As shown in FIG. 4, the first side portion 422 is in contact with the second side portion 426, which is further in contact with the third side portion 424 to form the triangular portion 450 of the bottom member 400. In an exemplary embodiment, the triangular portion 450 further includes a triangular opening 404, as shown in FIG. 4. The triangular opening 404 is similar in size and shape to the triangular opening 304.

[0026] The triangular opening 404 results in the formation of three inner sides 452i, 454i, and 456i of the triangular portion 450. The intersection of the inner sides 452i and 454i may be sharp or rounded. Similarly, the intersection of the inner sides 452i and 456i may be sharp and rounded, and the intersection of the inner sides 454i and 456i may be sharp and rounded. Further, the side surfaces 452i and 454i form an acute angle 462c, the side surfaces 452i and 456i form an acute angle 462a, and the side surfaces 454i and 456i form an acute angle 462b. As a result, the triangular opening 404 forms an acute-angled triangular portion. In an exemplary embodiment, the angles 462a, 462b, and 462c are equal to form an equilateral triangular portion. In other embodiments, two of the angles 462a, 462b, and 462c may be equal to form an isosceles triangular portion.

[0027] As further shown in FIG. 4, the outer side 452x is parallel to the inner side 452i and perpendicular to the upper surface 410 and the lower surface 412. The outer side 452x contacts the upper surface 410, the upper surface 410 contacts the inner side 452i, the inner side 452i contacts the lower surface 412, and finally the lower surface 412 contacts the outer side 452x. Thus, the outer side 452x, the upper surface 410, the lower surface 412, and the inner side 452i together form the first side portion 422. Similarly, the outer side 454x is parallel to the inner side 454i and perpendicular to the upper surface 410 and the lower surface 412. The outer side 454x contacts the upper surface 410, the upper surface 410 contacts the inner side 454i, the inner side 454i contacts the lower surface 412, and finally the lower surface 412 contacts the outer side 454x. Thus, the outer side 454x, the upper surface 410, the lower surface 412, and the inner side 454i together form the third side portion 424. Finally, the outer side 456x is parallel to the inner side 456i and perpendicular to the upper surface 410 and the lower surface 412. The outer side 456x contacts the upper surface 410, the upper surface 410 contacts the inner side 456i, the inner side 456i contacts the lower surface 412, and finally the lower surface 412 contacts the outer side 456x. Thus, the outer side 456x, the upper surface 410, the lower surface 412, and the inner side 456i together form at least a part of the second side portion 426.

[0028] In an exemplary embodiment, the third side portion 426 is divided into three small portions. The first small portion includes an outer side 456x, an upper surface 410, a lower surface 412, and an inner side 456i (see the top view of the bottom member 400 shown in FIG. 5C). Further, the second small portion 480a includes at least a portion of the outer side 452x that contacts the side surface 482a, and the side surface 482a contacts the side surface 484a (see FIG. 5C). The side surface 484a is substantially parallel to the side surface 452x. Further, the side surface 482a is aligned perpendicular to its corresponding axis 104a. Therefore, at least a portion of the outer side 452x, the side surface 482a, the side surface 484a, the upper surface 410, and the bottom surface 412 together form a small portion 480a that is aligned perpendicular to the axis 104a (see FIG. 5C). Similarly, the third small portion 480b includes at least a portion of the outer side 454x that contacts the side surface 482b, and the side surface 482b contacts the side surface 484b (see FIG. 5C). The side surface 484b is substantially parallel to the side surface 454x. Further, the side surface 482b is aligned perpendicular to its corresponding axis 104b. Therefore, at least a portion of the outer side 454x, the side surface 482b, the side surface 484b, the upper surface 410, and the bottom surface 412 together form a small portion 480b, and the small portion 480b is aligned perpendicular to the axis 104b (see FIG. 5C). The small portions 480a and 480b are spaced apart from each other only by 456x. The side surface 484a contacts the side surface 456x such that the intersection forms an obtuse angle. Similarly, the side surface 484b contacts the side surface 456x such that the intersection forms an obtuse angle (see FIG. 5C).

[0029] The triangular bottom member 400 further includes a rectangular portion 460. The rectangular portion 460 includes side surfaces 434, 428, and 432. The rectangular portion 460 further includes an upper surface 410 and a lower surface 412. Side surfaces 434 and 432 are parallel to each other and perpendicular to side surface 428. Side surfaces 434 and 432 are aligned parallel to axis 104c, and side surface 428 is aligned on an axis perpendicular to axis 104c. As shown in FIG. 4, side surfaces 428, 432, and 434 contact the upper surface 410 and the lower surface 412 to form the rectangular portion 460. Thus, in the exemplary embodiment, the rectangular portion 460 forms the triangular bottom member 400 adjacent to the triangular portion 450, including a single upper surface 410, a single lower surface 412, side surfaces 452x, 454x, 456x, 428, 432, 434, 452i, 454i, 456i, 482a, 482b, 484a, and 484b.

[0030] Referring again to FIG. 1, the upper member 300 and the bottom member 400 are separated by pillars 200a, 200b, and 200c to form the boat 100. As shown in FIG. 1, the upper member 300 and the bottom member 400 are arranged such that the opening 304 is vertically aligned with the opening 404 along an axis parallel to axis 102. As further shown in FIG. 1, the cavities 302 and 402 are also aligned along axis 102. The upper surface 206 of pillar 200a is attached to the lower surface 312 of member 300 at joint 312a. Similarly, the upper surface 206 of pillar 200b is attached to the lower surface 312 of member 300 at joint 312b, and the upper surface 206 of pillar 200c is attached to the lower surface 312 at joint 312c. The bottom surface 208 of pillar 200a is attached to the upper surface 410 of member 400 at joint 410a, the bottom surface 208 of pillar 200b is attached to the bottom surface 410 of member 400 at joint 410b, and the bottom surface 208 of pillar 200c is attached to the bottom surface 410 of member 400 at joint 410c.

[0031] As shown in FIG. 1, such an arrangement results in the formation of triangles for each of the slots 214 that support the wafer 550. Thus, the first wafer 550-1 can be supported by slots 214a-1, 214b-1, and 214c-2, the second wafer 550-2 can be supported by slots 214a-2, 214b-2, and 214c-2, and so on. In the exemplary embodiments provided herein, 25 wafers can be supported by the boat 100.

[0032] FIGS. 5A-5C show an exemplary wafer 550 supported by one or more protruding elements 204. FIG. 5A shows a side view of a portion of the pillar 200. As shown in FIG. 5B, the wafer 550 is placed on a small portion 228 of the upper protruding surface 232. In an exemplary embodiment, the portion 228 is 3.5 mm in length. Thus, the contact 552 between the wafer 550 and the protruding element 204 is minimal. Further, since the surface 232 is formed at an angle, the wafer 550 is not placed exactly flat on the upper surface 232. Thus, the contact 552 is further reduced. Thus, particulate residues that may result from contact between the wafer 550 and the boat 100 are significantly reduced.

[0033] FIG. 5C shows a top view of the wafer 550 supported by the boat 100. The wafer 550 is supported by the protruding elements 204a of the pillar 200a, the protruding elements 204b of the pillar 200b, and the protruding elements 204c of the pillar 200c. As shown in FIG. 5C, the protruding elements 204a, 204b, and 204c extend inwardly along the slot axis 104 (each axis 104 includes respective axes 104a, 104b, and 104c that intersect at the central axis 102). The wafer 550 is placed on portions 228a, 228b, and 228c of the protruding elements 204a, 204b, and 204c. As shown in FIG. 5C, the composite portion between the triangular portion (including pillars 200a and 200b) and the adjacent rectangular portion (including pillar 200c) provides stable support for the wafer 550 while minimizing contact between the wafer 550 and the pillars in each slot 214.

[0034] Advantageously, for a wafer storage rack having four pillars (e.g., a four-pillar arrangement), the inventors expected a 25 percent improvement in contamination reflected by a specific number resulting from a relatively small number of wafer contact points compared to a wafer rack having four pillars. Unexpectedly, experimental testing of the above-described wafer storage rack having three pillars showed approximately 80 percent less contamination compared to a wafer storage rack having four pillars. In this regard, the experimental testing showed that defects, e.g., defects associated with particles resulting from contact between wafer 550 and boat 100 in the above-described three-pillar configuration disclosed herein, are less than 20 percent of the particle generation in a wafer storage rack constructed to have four pillars.

[0035] Referring to FIG. 6, a method of manufacturing a boat, e.g., boat 100 (shown in FIG. 1), is shown. Method 600 includes defining a vertically extending central axis (such as axis 102) as shown in box 602. Method 600 further includes coupling a first pillar (such as pillar 200a) to a triangular upper member (such as member 300) and a triangular bottom member (such as member 400) such that a first plurality of protruding elements extend from a first inner surface (such as surface 220) toward the central axis, as shown in box 604. In an exemplary embodiment, the first pillar is coupled to the triangular upper member and the triangular bottom member by coupling a first upper surface (such as surface 206) of the first pillar to a first upper joint (such as joint location 312a) of the triangular upper member and coupling a first bottom surface of the first pillar to a first bottom joint (such as surface 412a) of the triangular bottom member.

[0036] Method 600 further includes coupling a second pillar (such as pillar 200b) to a triangular upper member (such as member 300) and a triangular bottom member (such as member 400) such that a second plurality of protruding elements extend from a second inner surface (such as surface 220) toward the central axis, as shown in box 606. In an exemplary embodiment, the second pillar is coupled to the triangular upper member and the triangular bottom member by coupling a second upper surface (such as surface 206) of the second pillar to a second upper joint (such as joint location 312b) of the triangular upper member and coupling a second bottom surface of the second pillar to a second bottom joint (such as surface 412b) of the triangular bottom member.

[0037] Method 600 further includes coupling a third pillar (such as pillar 200c) to a triangular upper member (such as member 300) and a triangular bottom member (such as member 400) such that a third plurality of protruding elements extend from a third inner surface (such as surface 220) toward a central axis. In an exemplary embodiment, the third pillar couples a third upper surface (such as surface 206) of the third pillar to a third upper joint (such as joint location 312c) of the triangular upper member and couples a third bottom surface of the third pillar to a third bottom joint (such as surface 412c) of the triangular bottom member, thereby coupling the triangular upper member and the triangular bottom member.

[0038] In an exemplary embodiment, each protruding element (such as protruding element 204) includes an upper protruding surface (such as upper surface 232) and a bottom protruding surface (such as bottom surface 226), the bottom protruding surface is perpendicular to the central axis, and the upper protruding surface is coupled to the bottom protruding surface at a protruding angle to form an inclined protruding element. In an exemplary embodiment, method 600 includes identifying a first upper surface by identifying a first linear cut mark on a first outer surface of a first pillar, identifying a second upper surface of a second pillar by identifying a second linear cut mark on a second outer surface of the second pillar, and identifying a third upper surface of a third pillar by identifying a third linear cut mark on a third outer surface of the third pillar.

[0039] In an exemplary embodiment, method 600 further includes identifying the triangular upper member as a member having a single cavity hole and identifying the triangular bottom member as a member having a plurality of cavity holes. In an exemplary embodiment of method 600, the triangular upper member further includes an upper rectangular portion (such as rectangular portion 360) and an upper triangular portion (such as triangular portion 350) that forms the triangular upper member adjacent thereto, so that the upper triangular portion further includes an upper triangular opening. In an exemplary embodiment of method 600, the triangular bottom member includes a bottom rectangular portion (such as rectangular portion 460) and a bottom triangular portion (such as triangular portion 450) that forms the triangular bottom member adjacent thereto, so that the bottom triangular portion further includes a bottom triangular opening. In an exemplary embodiment, method 600 further includes aligning the upper triangular opening and the bottom triangular opening parallel to each other such that an opening axis parallel to the central axis perpendicularly passes through the upper triangular opening and the bottom triangular opening.

[0040] Although the present disclosure has been provided in the context of certain specific embodiments and examples, those skilled in the art will understand that the present disclosure extends beyond the specifically described embodiments to other alternative embodiments, and / or the use of those embodiments, as well as obvious modifications and equivalents thereof. In addition, while some variations of the embodiments of the present disclosure are shown and described in detail, other modifications within the scope of the present disclosure will be readily apparent to those skilled in the art based on the present disclosure. Various combinations or partial combinations of the specific features and aspects of the embodiments may be made and are still intended to fall within the scope of the present disclosure. Of course, the various features and aspects of the disclosed embodiments can be combined with or replaced by each other to form various modes of the embodiments of the present disclosure. Therefore, it is intended that the scope of the present disclosure should not be limited by the specific embodiments described above.

[0041] The headings (if any) provided herein are for convenience only and do not necessarily affect the scope or meaning of the devices and methods disclosed herein.

Description of the Reference Numerals

[0042] 100 Wafer boat 102 Vertical axis 104 Slot axis 206 Upper surface 208 Bottom surface 210 Outer surface 212 Mark 214 Slot 220 Inner surface 222 Side surface 224 Angle 226 Bottom surface 232 Upper surface 250 Upper part 260 Bottom part 300 Triangular upper member 302 Cavity 304 Triangular opening 310 Upper surface 312 Bottom surface 322 First side part 326 Second side part 324 Third side part 328, 332, 334 Side surfaces 350 Triangular part 360 Rectangular part 400 Triangular bottom member 402 Cavity 404 Triangular opening 410 Upper surface 412 Bottom surface 422 First side part 426 Second side part 424 Third side part 428, 432, 434 Side surfaces 442 Cavity 444 Cavity 446 Cavity 448 Cavity 450 Triangular part 460 Rectangular part 550 Wafer

Claims

1. A wafer boat configured to support one or more wafers, the wafer boat comprising: A first pillar having a first plurality of protruding elements, the first pillar being defined by a first inner surface, a first outer surface, a first upper surface, and a first bottom surface, the first plurality of protruding elements extending from the first inner surface; a first pillar; A second pillar having a second plurality of protruding elements, the second pillar being defined by a second inner surface, a second outer surface, a second upper surface, and a second bottom surface, the second plurality of protruding elements extending from the second inner surface; a second pillar; A third pillar having a third plurality of protruding elements, the third pillar being defined by a third inner surface, a third outer surface, a third upper surface, and a third bottom surface, the third plurality of protruding elements extending from the third inner surface; a third pillar; A triangular upper member having a first upper joint, a second upper joint, and a third upper joint, the triangular upper member being coupled to the first pillar, the second pillar, and the third pillar such that the first upper surface is coupled to the first upper joint, the second upper surface is coupled to the second upper joint, and the third upper surface is coupled to the third upper joint; a triangular upper member; A triangular bottom member having a first bottom joint, a second bottom joint, and a third bottom joint, the triangular bottom member being coupled to the first pillar, the second pillar, and the third pillar such that the first bottom surface is coupled to the first bottom joint, the second bottom surface is coupled to the second bottom joint, and the third bottom surface is coupled to the third bottom joint; a triangular bottom member, wherein the triangular upper member and the triangular bottom member are parallel to each other, the wafer boat extends vertically, and further defines a central axis parallel to the first pillar, the second pillar, and the third pillar, and the first plurality of protruding elements, the second plurality of protruding elements, and the third plurality of protruding elements extend toward the central axis to define a plurality of wafer slots, each wafer slot being configured to support a wafer. A wafer boat.

2. Each protruding element has an upper protruding surface and a bottom protruding surface, the bottom protruding surface is perpendicular to the central axis, and the upper protruding surface is coupled to the bottom protruding surface at a certain protruding angle to form an inclined protruding element. The wafer boat according to claim 1.

3. The protruding angle is 5 degrees. The wafer boat according to claim 2.

4. Each protruding element further comprises a side protruding surface, such that the bottom protruding surface is coupled to the side protruding surface, the side protruding surface is coupled to the upper protruding surface, and is 3 millimeters. The wafer boat according to claim 2.

5. The bottom protruding surface is 20 millimeters. The wafer boat according to claim 2.

6. The upper protruding surface of each protruding element comprises a wafer portion, such that the wafer supported by the protruding element is limited to contact only within the wafer portion. The wafer boat according to claim 2.

7. The wafer portion is 3.5 millimeters. The wafer boat according to claim 6.

8. The first outer surface includes a first linear cut mark, whereby the first linear cut mark is closer to the first upper surface than the first bottom surface, the second outer surface includes a second linear cut mark, whereby the second linear cut mark is closer to the second upper surface compared to the second bottom surface, and the third outer surface includes a third linear cut mark, whereby the third linear cut mark is closer to the third upper surface compared to the third bottom surface. The wafer boat according to claim 1.

9. The triangular upper member is defined by an upper triangular portion and an upper rectangular portion, the upper triangular portion includes the first upper joint portion and the second upper joint portion, and the upper rectangular portion includes the third upper joint portion. The triangular bottom member is defined by a bottom triangular portion and a bottom rectangular portion, the bottom triangular portion includes the first bottom joint portion and the second bottom joint portion, and the bottom rectangular portion includes the third bottom joint portion. The wafer boat according to claim 1.

10. The triangular upper member comprises a triangular upper opening, the triangular bottom member comprises a triangular bottom opening, and the triangular upper opening and the triangular bottom opening are vertically aligned along an axis parallel to the central axis. The wafer boat according to claim 9.

11. The upper triangular member is provided with an upper central cavity hole, the bottom triangular member is provided with a bottom central cavity hole, and the upper central cavity hole and the bottom central cavity hole are aligned along the central axis. The wafer boat according to claim 9.

12. The bottom triangular member of the wafer boat according to claim 11 is provided with a plurality of cavity holes.

13. The plurality of cavity holes include a first cavity hole formed in the third bottom joint portion, a second cavity hole formed between the bottom central cavity hole and the first cavity hole, a third cavity hole formed between the triangular bottom opening and the bottom central cavity hole, and a fourth cavity hole formed between the first bottom joint portion and the second bottom joint portion. The first cavity hole, the second cavity hole, the third cavity hole, the fourth cavity hole, and the bottom central cavity hole are aligned along the slot axis with respect to the third pillar. The wafer boat according to claim 12.

14. A method of manufacturing a wafer boat, comprising: defining a vertically extending central axis; coupling the first pillar to the upper triangular member and the bottom triangular member by coupling the first upper surface of the first pillar to the first upper joint portion of the upper triangular member and the first bottom surface of the first pillar to the first bottom joint portion of the bottom triangular member such that a first plurality of protruding elements extend from the first inner surface towards the central axis; coupling the second pillar to the upper triangular member and the bottom triangular member by coupling the second upper surface of the second pillar to the second upper joint portion of the upper triangular member and the second bottom surface of the second pillar to the second bottom joint portion of the bottom triangular member such that a second plurality of protruding elements extend from the second inner surface towards the central axis; coupling the third pillar to the upper triangular member and the bottom triangular member by coupling the third upper surface of the third pillar to the third upper joint portion of the upper triangular member and the third bottom surface of the third pillar to the third bottom joint portion of the bottom triangular member such that a third plurality of protruding elements extend from the third inner surface towards the central axis.

15. Each protruding element includes an upper protruding surface and a bottom protruding surface, the bottom protruding surface is perpendicular to the central axis, and the upper protruding surface is coupled to the bottom protruding surface at a certain protruding angle to form an inclined protruding element, according to the method of claim 14.

16. Coupling the first upper surface of the first pillar to the first upper joining portion of the triangular upper member further includes identifying the first upper surface of the first pillar by identifying a first linear cut mark on the first outer surface of the first pillar. Coupling the second upper surface of the second pillar to the second upper joining portion of the triangular upper member further includes identifying the second upper surface of the second pillar by identifying a second linear cut mark on the second outer surface of the second pillar. Coupling the third upper surface of the third pillar to the third upper joining portion of the triangular upper member further includes identifying the third upper surface of the third pillar by identifying a third linear cut mark on the third outer surface of the third pillar, according to the method of claim 14.

17. Coupling the first pillar to the triangular upper member and the triangular bottom member, coupling the second pillar to the triangular upper member and the triangular bottom member, and coupling the third pillar to the triangular upper member and the triangular bottom member further include identifying the triangular upper member as a member having a single cavity hole and identifying the triangular bottom member as the member having a plurality of cavity holes, according to the method of claim 14.

18. The triangular upper member includes an upper triangular portion that forms the triangular upper member adjacent to the upper rectangular portion, and the upper triangular portion further includes an upper triangular opening. The triangular bottom member includes a bottom triangular portion that forms the triangular bottom member adjacent to the bottom rectangular portion, and the bottom triangular portion further includes a bottom triangular opening. coupling the first pillar to the triangular upper member and the triangular bottom member, coupling the second pillar to the triangular upper member and the triangular bottom member, and coupling the third pillar to the triangular upper member and the triangular bottom member, further comprising aligning the upper triangular opening and the bottom triangular opening parallel to each other such that an opening axis parallel to the central axis perpendicularly passes through the upper triangular opening and the bottom triangular opening, the method of claim 14.

19. A load lock chamber, a wafer boat having a plurality of pillars, each of the plurality of pillars comprising a plurality of protruding elements, each protruding element comprising an upper protruding surface and a bottom protruding surface, the bottom protruding surface being perpendicular to a central axis, the upper protruding surface being coupled to the bottom protruding surface at a protruding angle to form an inclined protruding element, a load lock chamber comprising a wafer boat.

20. a triangular upper member coupled to each of the plurality of pillars, a triangular bottom member coupled to each of the plurality of pillars, the triangular upper member and the triangular bottom member being coupled parallel to each other, the load lock chamber of claim 19, further comprising a triangular bottom member.