Film forming device, film forming method, and article manufacturing method

Abstract

To provide a technique advantageous for processing a substrate under a constant condition.SOLUTION: A film forming device comprises: a substrate stage that has a substrate holding unit for holding a substrate; a mold holding unit that holds a mold; a driving mechanism that brings the mold and a curable composition arranged on the substrate into contact with each other, and changes an interval between the substrate holding unit and the mold holding unit so as to separate the curable composition and the mold from each other; and a curing unit that cures the curable composition in a state where the mold and the curable composition on the substrate are in contact with each other. The substrate stage has a gas blowout unit that supplies a gas that inhibits curing of the curable composition to the substrate held by the substrate holding unit.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a film forming apparatus, a film forming method, and an article manufacturing method.

Background Art

[0002] A technique is known in which a curable composition on a substrate is brought into contact with a mold and the curable composition is cured to form a cured film of the curable composition. A film forming apparatus that uses a mold having a pattern and transfers the pattern to a curable composition may be called an imprint apparatus. A film forming apparatus that uses a mold having a flat surface to form a cured film having a flat surface may be called a planarization apparatus.

[0003] Patent Document 1 describes an imprint apparatus that supplies a gas (hereinafter referred to as a curing inhibition gas) that inhibits curing of a curable composition while irradiating the curable composition on a region of the surface of a substrate where a pattern is to be formed with light for curing, and supplies a gas that inhibits curing of the curable composition to the periphery of the region. A plurality of gas nozzles for blowing out the curing inhibition gas are arranged so as to surround a mold holding portion that holds a mold (die), and blow out the gas toward the substrate or the substrate holding portion.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a configuration in which a gas nozzle for blowing out a curing inhibition gas is disposed above a substrate or a substrate holding portion so as to surround a mold holding portion, each time the position of the substrate changes, the supply conditions of the curing inhibition gas to the substrate may change. Therefore, with such a configuration, it is difficult to process the substrate under constant conditions.

[0006] An object of the present invention is to provide a technique advantageous for processing a substrate under certain conditions.

Means for Solving the Problems

[0007] One aspect of the present invention relates to a film forming apparatus, the film forming apparatus including a substrate stage having a substrate holding portion for holding a substrate, a mold holding portion for holding a mold, and a drive mechanism for changing a distance between the substrate holding portion and the mold holding portion so as to bring the curable composition disposed on the substrate into contact with the mold or separate the curable composition from the mold, and a curing portion for curing the curable composition in a state where the curable composition on the substrate is in contact with the mold, the substrate stage having a gas blowing portion for supplying a gas that inhibits curing of the curable composition to the substrate held by the substrate holding portion.

Effects of the Invention

[0008] According to the present invention, a technique advantageous for processing a substrate under certain conditions is provided.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

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Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0011] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system in which the direction parallel to the surface of the substrate is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, Y-direction, and Z-direction, respectively, and the rotations around the X-axis, Y-axis, and Z-axis are θX, θY, and θZ, respectively. Control or drive with respect to the X-axis, Y-axis, and Z-axis means control or drive in the directions parallel to the X-axis, Y-axis, and Z-axis, respectively. Also, control or drive with respect to the θX-axis, θY-axis, and θZ-axis means control or drive regarding the rotation around the axis parallel to the X-axis, the rotation around the axis parallel to the Y-axis, and the rotation around the axis parallel to the Z-axis, respectively. Also, position is information that can be specified based on the coordinates of the X-axis, Y-axis, and Z-axis, and orientation is information that can be specified by the values of the θX-axis, θY-axis, and θZ-axis. Positioning means controlling the position and / or orientation. Alignment may include controlling the position and / or orientation of at least one of the substrate and the mold so that the alignment error (overlay error) between the shot area of the substrate and the molding area of the mold (the area in contact with the curable composition) is reduced. Also, alignment may include control for correcting or changing the shape of at least one of the shot area of the substrate and the molding area of the mold.

[0012] FIG. 1 is a diagram schematically showing the configuration of a film forming apparatus 100 according to the first embodiment. The film forming apparatus 100 forms a cured film of a curable composition 6 by bringing the curable composition 6 on a substrate 3 into contact with a mold 1 and curing the curable composition 6. The film forming apparatus 100 can be configured as an imprint apparatus that uses a mold 1 having a pattern and transfers the pattern to the curable composition 6. Hereinafter, an example in which the film forming apparatus 100 is configured as an imprint apparatus will be described. However, the film forming apparatus 100 may be configured as a planarizing apparatus that uses a mold 1 having a flat surface to mold the curable composition 6 using the flat surface and forms a cured film having a flat surface.

[0013] The curable composition 6 is a composition that cures by irradiation with light or by heating. Among these, the photocurable composition that cures by light contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, a polymer component, and the like. The curable composition 6 can be a monomer such as acrylate or methacrylate.

[0014] The curable composition 6 is applied in a film shape on the substrate 3 by a spin coater or a slit coater. Alternatively, it may be applied on the substrate in a droplet shape or in an island shape or a film shape formed by connecting a plurality of droplets by a liquid ejection head. The viscosity of the imprint material (viscosity at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less. The film forming apparatus 100 may include a dispenser 9 that disposes the curable composition 6 on the substrate 3. The dispenser 9 can be configured to discharge the curable composition 6, for example, by an inkjet method using a piezoelectric element or a thermal inkjet method.

[0015] The control unit 7 controls the components of the film forming apparatus 100, such as the curing unit 5, the drive mechanisms 13 (substrate drive mechanism 11, mold drive mechanism 12), the dispenser 9, and the gas supply unit 20. From another perspective, the control unit 7 controls the operation of the film forming apparatus 100. The control unit 7 can be constituted by, for example, a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (abbreviation for Application Specific Integrated Circuit), or a general-purpose or dedicated computer in which a program is incorporated, or a combination of all or part of these.

[0016] The substrate 3 can be, for example, a silicon wafer, but is not limited thereto. The substrate 3 can be a substrate such as aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, silicon nitride, etc. A adhesion layer may be formed on the substrate 3 by surface treatment such as silane coupling treatment, silazane treatment, formation of an organic thin film, etc. The adhesion layer can improve the adhesion between the curable composition 6 and the substrate 3. Note that the substrate 3 can typically have a circular shape with a diameter of 300 mm, but is not limited thereto.

[0017] The mold 1 can be constituted by a material that can transmit curing energy, for example, a material having light transmissibility. The mold 1 can be constituted by, for example, glass, quartz, PMMA (Polymethyl methacrylate), or an optically transparent resin such as polycarbonate resin. Alternatively, the mold 1 can be constituted by a transparent metal vapor deposition film, a flexible film such as polydimethylsiloxane, a photocurable film, or a metal film. The mold 1 can have a molding region FR that contacts the curable composition 6 in order to mold the curable composition 6. The mold 1 can have, for example, a mesa, and the surface of the mesa can constitute the molding region FR.

[0018] The film forming apparatus 100 may include a substrate stage 4 having a substrate holding part 25 for holding a substrate 3 and a mold holding part 2 for holding a mold 1. The substrate holding part 25 and the mold holding part 2 may include, for example, a vacuum chuck, an electrostatic chuck, or a mechanical clamp. Further, the film forming apparatus 100 may include a drive mechanism 13 for changing the distance between the substrate holding part 25 and the mold holding part 2. The drive mechanism 13 may be configured to change the distance between the substrate holding part 25 and the mold holding part 2 so as to bring the curable composition 6 disposed on the substrate 3 into contact with the mold 1 or to separate the curable composition 6 (or a cured product or cured film thereof) from the mold 1. In another aspect, the drive mechanism 13 is configured to change or adjust the relative position between the substrate holding part 25 and the mold holding part 2 so as to change or adjust the relative position between the substrate 3 and the mold 1, for example.

[0019] The adjustment of the relative position by the drive mechanism 13 may include the alignment between the substrate 3 (shot region SR thereof) and the mold 1 (molding region FR thereof). The drive mechanism 13 may include a substrate drive mechanism 11 for driving the substrate stage 4 and a mold drive mechanism 12 for driving the mold holding part 2. The substrate drive mechanism 11 may be configured to drive the substrate 3, the substrate holding part 25, or the substrate stage 4 about a plurality of axes (for example, three axes of an X axis, a Y axis, and a θZ axis, preferably, six axes of an X axis, a Y axis, a Z axis, a θX axis, a θY axis, and a θZ axis). The mold drive mechanism 12 may be configured to drive the mold 1 or the mold holding part 2 about a plurality of axes (for example, three axes of a Z axis, a θX axis, and a θY axis, preferably, six axes of an X axis, a Y axis, a Z axis, a θX axis, a θY axis, and a θZ axis). The mold drive mechanism 12 may include, for example, a deformation mechanism for deforming the mold 1 by applying a force to the side surface of the mold 1.

[0020] The film forming apparatus 100 may include a curing unit 5 that cures the curable composition 6. The curing unit 5 can cure the curable composition 6 by applying curing energy to the curable composition 6 in a state where the curable composition 6 on the substrate 3 (in the shot region SR) is in contact with the mold 1 (in the molding region FR). The curing energy is, for example, an electromagnetic wave such as ultraviolet light. The curing unit 5 may include at least one of, for example, a high-pressure mercury lamp, various excimer lamps, an excimer laser, a light-emitting diode, and a laser diode as a curing energy source.

[0021] The substrate stage 4 may have a gas blowing unit 21 that supplies a curing-inhibiting gas to the substrate 3 held by the substrate holding unit 25. The curing-inhibiting gas is a gas that inhibits the curing of the curable composition 6 on the substrate 3. The gas blowing unit 21 may be arranged to supply the curing-inhibiting gas to the substrate 3, particularly near the edge of the substrate 3. The film forming apparatus 100 may include a gas supply unit 20 that supplies the curing-inhibiting gas to the gas blowing unit 21 so that the curing-inhibiting gas is supplied to the substrate 3. The curing-inhibiting gas is, for example, a gas containing oxygen and may be, for example, air. In a state where the curable composition 6 is filled in the space formed between the shot region (film forming region) SR of the substrate 3 and the molding region FR of the mold 1, the amount of oxygen in the space is negligible. The gas supply unit 20 may include an adjustment unit that adjusts the gas composition and flow rate of the curing-inhibiting gas.

[0022] FIG. 4 is a schematic perspective view illustrating the configuration of the gas blowing unit 21. In FIG. 4, the relative positions of the substrate 3 and the mold 1 when forming a cured film in a partial field among a plurality of shot regions of the substrate 3 are illustrated. The partial field is a shot region defined by the edge of the substrate 3. It can also be said that the partial field is a shot region whose outer shape is defined by an arc along the edge of the substrate 3.

[0023] As illustrated in FIG. 4, the gas ejection unit 21 can be arranged to surround the periphery of the substrate 3 held by the substrate holding unit 25. The gas ejection unit 21 can include a plurality of gas ejection openings 22. The plurality of gas ejection openings 22 can be arranged at equal intervals on a circle concentric with the center of the substrate 3 held by the substrate holding unit 25. The gas supply unit 20 may supply the curing inhibition gas only to at least one gas ejection opening 22 arranged around the shot region SR (partial field) where the cured film is to be formed, according to the position of the shot region SR.

[0024] Alternatively, the plurality of gas ejection openings 22 can be divided into a plurality of groups, and the gas supply unit 20 may supply the curing inhibition gas to the group corresponding to the position of the shot region SR where the cured film is to be formed. Alternatively, a valve can be provided for each group, and the valve can be controlled so that the curing inhibition gas is ejected only from the group corresponding to the position of the shot region SR where the cured film is to be formed. All or part of the configuration of the gas supply unit 20 may be arranged on the substrate stage 4.

[0025] As illustrated in FIG. 5, the gas ejection unit 21 may include a gas ejection opening 23 having a ring shape. The center of the ring shape can coincide with the center of the substrate 3 held by the substrate holding unit 25.

[0026] The distance between the gas ejection unit 21 and the edge of the substrate 3 can be within the range of 1 mm to 30 mm, preferably within the range of 1 mm to 15 mm.

[0027] Providing the gas blowing portion 21 on the substrate stage 4 is advantageous for processing the substrate under certain conditions. By providing the gas blowing portion 21 on the substrate stage 4, for example, regardless of the position of the substrate stage 4, a curing inhibition gas can be supplied to the substrate 3, particularly in the vicinity of the edge of the substrate 3, under certain conditions. Further, by arranging the gas blowing portion 21 so as to surround the periphery of the substrate 3 held by the substrate holding portion 25, a curing inhibition gas can be supplied to any partial field or shot region in the vicinity of the edge of the substrate 3 under certain conditions. Also, providing the gas blowing portion 21 on the substrate stage 4 is advantageous for reducing the consumption amount of the curing inhibition gas.

[0028] FIG. 2 illustrates a film forming method performed by the film forming apparatus 100 of the first embodiment. This film forming method is controlled by the control unit 7. In step S101, the uncured curable composition 6 is disposed in the shot region SR of the substrate 3 by the dispenser 9. Note that the substrate 3 may be supplied to the film forming apparatus 100 after the curable composition 6 is applied on the substrate 3. In this case, step S101 is unnecessary.

[0029] In step S102, the drive mechanism 13 is controlled so that the molding region FR of the mold 1 contacts the curable composition 6 on the shot region SR of the substrate 3. In step S103, the drive mechanism 13 is controlled so that alignment is made between the shot region SR of the substrate 3 and the molding region FR of the mold 1. This alignment can be executed while observing the relative positions of the alignment marks of the substrate 3 and the mold 1 using an alignment scope (not shown). Alternatively, this alignment may be executed while observing the outer shape of the substrate 3 and the outer shape of the mold 1 by a sensor (not shown).

[0030] In step S104, while supplying a curing inhibition gas from the gas blowing unit 21, energy for curing is applied to the curable composition 6 from the curing unit 5, so that the curable composition 6 above the shot region SR is cured, and a cured film made of the cured product of the curable composition 6 is formed. In step S105, the drive mechanism 13 is controlled so that the mold 1 is separated from the cured film on the shot region SR of the substrate 3.

[0031] FIG. 3 schematically shows a state of forming a cured film of the curable composition 6 on a partial field PF which is a shot region SR defined by the edge of the substrate 3. Since the peripheral portion of the substrate 3 has a beveling portion, the distance between the substrate 3 and the molding region FR of the mold 1 increases as approaching the edge of the substrate 3 from the center of the substrate 3. Therefore, when forming a cured film of the curable composition 6 on the partial field PF, a recess CCV may be formed in the outer portion of the curable composition 6. Thus, when curing the recess CCV in the outer portion of the curable composition 6, residues of the cured product of the curable composition 6 may remain in the molding region FR of the mold 1 when separating the mold 1 from the cured film of the curable composition 6. Also, such residues may remain on the pattern provided in the molding region FR of the mold 1. The residues remaining in the molding region FR of the mold 1 may cause defects when forming a cured film on the next shot region SR.

[0032] Therefore, when forming a cured film of the curable composition 6 on the partial field FR of the substrate 3, a curing inhibition gas is blown out from the gas blowing unit 21 to supply the curing inhibition gas to the substrate 3 (near the edge thereof). Thereby, the problem that residues of the cured product may be formed by curing the recess CCV is solved. Note that the curing inhibition gas may also be blown out from the gas blowing unit 21 when forming a cured film of the curable composition 6 on the full field (rectangular shot region SR) of the substrate 3. Also, the curing inhibition gas may be blown out from the gas blowing unit 21 even when forming a cured film at once over the entire region of the surface of the substrate 3 where the cured film is to be formed.

[0033] The gas blowing unit 21 may be configured to selectively blow out a curing inhibition gas or a filling promotion gas. The filling promotion gas is a gas that is more soluble and diffusible in the curable composition 6 than air and promotes the filling of the curable composition 6 into the space formed between the substrate 3 and the mold 1. As the filling promotion gas, for example, a gas containing at least one of, for example, helium gas, nitrogen gas, and a condensable gas (e.g., pentafluoropropane (PFP)) can be used. The gas supply unit 20 can supply the filling promotion gas to the gas blowing unit 21 so that the filling promotion gas is blown out from the gas blowing unit 21 before the mold 1 is brought into contact with the curable composition 6 on the substrate 3. Further, the gas supply unit 20 can operate so that the blowing of the filling promotion gas from the gas blowing unit 21 ends before the curable composition 6 is cured, and then the blowing of the curing inhibition gas from the gas blowing unit 21 is started.

[0034] Hereinafter, a second embodiment will be described. Matters not mentioned as the second embodiment may follow the first embodiment. FIG. 6 is a diagram schematically showing the configuration of a film forming apparatus 100 according to the second embodiment. The film forming apparatus 100 according to the second embodiment may have a configuration in which a second gas blowing unit 8 is added to the configuration of the film forming apparatus 100 according to the first embodiment. The second gas blowing unit 8 may be arranged to face the substrate stage 4.

[0035] In the first example, the second gas blowing unit 8 is configured to blow out a curing inhibition gas that inhibits the curing of the curable composition 6. In the second example, the second gas blowing unit 8 is configured to selectively blow out a curing inhibition gas or a filling promotion gas. The second gas blowing unit 8 can be controlled to blow out a filling promotion gas before bringing the mold 1 into contact with the curable composition 6 on the substrate 3. The second gas blowing unit 8 can terminate the blowing out of the filling promotion gas before curing the curable composition 6, and then start blowing out the curing inhibition gas. The gas blowing unit 21 provided on the substrate stage 4 can start blowing out the curing inhibition gas after the blowing out of the filling promotion gas by the second gas blowing unit 8 arranged to face the substrate stage 4 has ended. In the third example, the second gas blowing unit 8 is configured to blow out only the filling promotion gas. In this case, the second gas blowing unit 8 can be controlled to start blowing out the filling promotion gas before bringing the mold 1 into contact with the curable composition 6 on the substrate 3, and to terminate the blowing out of the filling promotion gas before the curing part 5 starts curing the curable composition 6.

[0036] FIG. 7 illustrates a film forming method performed by the film forming apparatus 100 of the second embodiment. This film forming method is controlled by the control unit 7. Here, an example in which the second gas blowing unit 8 is configured to blow out a filling promotion gas as in the third example above will be described.

[0037] In step S701, the dispenser 9 disposes the uncured curable composition 6 in the shot region SR of the substrate 3. Note that the substrate 3 may be supplied to the film forming apparatus 100 after the curable composition 6 has been applied onto the substrate 3. In this case, step S701 is unnecessary. In step S702, the blowing out of the filling promotion gas from the second gas blowing unit 8 is started. Thereby, the supply of the filling promotion gas to the space between the substrate 3 and the mold 1 is started.

[0038] In step S703, the drive mechanism 13 is controlled such that the molding region FR of the mold 1 contacts the curable composition 6 above the shot region SR of the substrate 3 with a filling - promoting gas existing in the space between the substrate 3 and the mold 1. In step S704, the drive mechanism 13 is controlled such that alignment is made between the shot region SR of the substrate 3 and the molding region FR of the mold 1. This alignment can be performed while observing the relative positions of the alignment marks on the substrate 3 and the alignment marks on the mold 1 using an alignment scope (not shown). Alternatively, this alignment may be performed while observing the outer shape of the substrate 3 and the outer shape of the mold 1 by a sensor (not shown).

[0039] In step S705, the blowing of the filling - promoting gas from the second gas blowing portion 8 is stopped. The blowing of the filling - promoting gas from the second gas blowing portion 8 may be stopped before the start of the alignment in step S704 or during the execution of the alignment in step S704.

[0040] In step S706, the blowing of the curing - inhibiting gas from the gas blowing portion 21 is started. Thereby, the supply of the curing - inhibiting gas to the vicinity of the edge of the substrate 3 is started. Note that step S706 may be executed only when the shot region for forming the cured film is a partial field. When step S706 is not executed, step S708 is not implemented either.

[0041] In step S707, with the curing - inhibiting gas being supplied from the gas blowing portion 21, by applying curing - energy to the curable composition 6 from the curing portion 5, the curable composition 6 above the shot region SR is cured, and a cured film made of the cured product of the curable composition 6 is formed. In step S708, the blowing of the curing - inhibiting gas from the gas blowing portion 21 is stopped. Note that when the curing - inhibiting gas is sufficiently supplied to the vicinity of the edge of the substrate 3 before the start of step S707, the blowing of the curing - inhibiting gas from the gas blowing portion 21 may be stopped before the start of step S707. In step S709, the drive mechanism 13 is controlled such that the mold 1 is separated from the cured film above the shot region SR of the substrate 3.

[0042] Hereinafter, a third embodiment will be described. Matters not referred to as the third embodiment may follow the first and second embodiments. FIG. 8 is a diagram schematically showing the configuration of the film forming apparatus 100 according to the third embodiment. The film forming apparatus 100 according to the third embodiment may have a configuration in which a third gas blowing unit 31 is added to the configuration of the film forming apparatus 100 according to the second embodiment. The third gas blowing unit 31 may be arranged to face the substrate stage 4. The third gas blowing unit 31 may be arranged between the second gas blowing unit 8 and the mold 1 held by the mold holding unit 2. Alternatively, the second gas blowing unit 8 may be arranged between the third gas blowing unit 31 and the mold 1 held by the mold holding unit 2. In the third embodiment, the second gas blowing unit 8 may be configured to blow out a filling promoting gas, and the third gas blowing unit 31 may be configured to blow out a curing inhibiting gas.

[0043] An example of the film forming method performed by the film forming apparatus 100 according to the third embodiment will be described with reference to FIG. 7. In step S701, the uncured curable composition 6 is placed in the shot region SR of the substrate 3 by the dispenser 9. Note that the substrate 3 may be supplied to the film forming apparatus 100 after the curable composition 6 is applied onto the substrate 3. In this case, step S701 is unnecessary. In step S702, the blowing of the filling promoting gas from the second gas blowing unit 8 is started. Thereby, the supply of the filling promoting gas to the space between the substrate 3 and the mold 1 is started.

[0044] In step S703, with the filling promoting gas present in the space between the substrate 3 and the mold 1, the drive mechanism 13 is controlled so that the molding region FR of the mold 1 contacts the curable composition 6 above the shot region SR of the substrate 3. In step S704, the drive mechanism 13 is controlled so that alignment is performed between the shot region SR of the substrate 3 and the molding region FR of the mold 1. This alignment may be performed while observing the relative positions of the alignment marks of the substrate 3 and the mold 1 using an alignment scope (not shown). Alternatively, this alignment may be performed while observing the outer shapes of the substrate 3 and the mold 1 using a sensor (not shown).

[0045] In step S705, the blowing of the filling promotion gas from the second gas blowing unit 8 is stopped. The blowing of the filling promotion gas from the second gas blowing unit 8 may be stopped before the start of alignment in step S704 or during the execution of alignment in step S704.

[0046] In step S706, the blowing of the curing inhibition gas from the gas blowing unit 21 and the third gas blowing unit 31 is started. Thereby, the supply of the curing promotion gas to the vicinity of the edge of the substrate 3 is started. The blowing of the curing inhibition gas from the gas blowing unit 21 and the third gas blowing unit 31 may be started simultaneously or at different timings from each other. Note that step S706 may be executed only when the shot region where the cured film is formed is a partial field. When step S706 is not executed, step S708 is not implemented either.

[0047] In step S707, with the curing inhibition gas being supplied to the edge region of the substrate 3, by applying energy for curing from the curing unit 5 to the curable composition 6, the curable composition 6 above the shot region SR is cured, and a cured film made of the cured product of the curable composition 6 is formed. In step S708, the blowing of the curing inhibition gas from the gas blowing unit 21 is stopped. Note that when the curing inhibition gas is sufficiently supplied to the vicinity of the edge of the substrate 3 before the start of step S707, the blowing of the curing inhibition gas from at least one of the gas blowing unit 21 and the third gas blowing unit 31 may be stopped before the start of step S707. In step S709, the drive mechanism 13 is controlled so that the mold 1 is separated from the cured film above the shot region SR of the substrate 3.

[0048] An imprint apparatus is an apparatus that forms a pattern of a cured product in which an uneven pattern of a mold is transferred by bringing an imprint material supplied onto a substrate into contact with the mold and applying energy for curing to the imprint material.

[0049] As the imprint material, a curable composition (sometimes also referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, radiation, heat, etc. are used. As the electromagnetic waves, for example, light such as infrared rays, visible light, and ultraviolet rays whose wavelength is selected from the range of 10 nm or more and 1 mm or less, or electromagnetic radiation such as X-rays and gamma rays may be used. Further, as the radiation, particle radiation such as an electron beam may be used.

[0050] The curable composition is a composition that cures by irradiation with light or radiation, or by heating. Among these, the photocurable composition that cures by light contains at least a polymerizable compound and a photoinitiator, and may contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group such as a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component.

[0051] The polymerizable compound is a compound that reacts with a polymerization factor (such as a radical) generated from a photoinitiator and forms a solid composed of a high molecular compound by a chain reaction (polymerization reaction). For example, a compound having one or more acryloyl groups or methacryloyl groups, that is, a (meth)acrylic compound. The photoinitiator is a compound that generates a polymerization factor upon receiving light, and is, for example, a radical generator such as an acylphosphine oxide compound.

[0052] The imprint material is applied in a film form on a substrate by a spin coater or a slit coater. Alternatively, it may be applied on the substrate in a droplet form, or in an island or film form formed by connecting a plurality of droplets by a liquid injection head. The viscosity of the imprint material (viscosity at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

[0053] The substrate is made of glass, ceramics, metal, semiconductor, resin, etc., and a member made of a material different from the substrate may be formed on its surface as needed. Specifically, the substrate is a silicon wafer, a compound semiconductor wafer, quartz glass, etc. Also, before applying the imprint material, an adhesion layer may be provided as needed to improve the adhesion between the imprint material and the substrate.

[0054] The pattern of the cured product formed using the film forming apparatus 100 is permanently used for at least a part of various articles, or temporarily used when manufacturing various articles. Articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, or molds, etc. Examples of electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, MRAM, and semiconductor elements such as LSI, CCD, image sensors, FPGA. Examples of optical elements include microlenses, light guides, waveguides, antireflection films, diffraction gratings, polarization elements, color filters, light emitting elements, displays, solar cells, etc. Examples of MEMS include DMD, microchannels, electromechanical conversion elements, etc. Examples of recording elements include optical discs such as CD and DVD, magnetic discs, magneto-optical discs, magnetic heads, etc. Examples of sensors include magnetic sensors, optical sensors, gyro sensors, etc. Examples of molds include molds for imprinting.

[0055] The pattern of the cured product is used as it is as at least a part of the constituent members of the above articles, or temporarily used as a resist mask. After etching or ion implantation, etc. are performed in the substrate processing step, the resist mask is removed.

[0056] Next, an article manufacturing method will be described in which a pattern is formed on a substrate by a film forming apparatus 100 configured as an imprint apparatus, the substrate on which the pattern is formed is processed, and an article is manufactured from the processed substrate. As shown in FIG. 9(a), a substrate 1z such as a silicon wafer having a workpiece 2z such as an insulator formed on its surface is prepared. Subsequently, an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state where a plurality of droplet-shaped imprint materials 3z are applied onto the substrate is shown.

[0057] As shown in FIG. 9(b), an imprint mold 4z is opposed with the side on which its concavo-convex pattern is formed facing the imprint material 3z on the substrate. As shown in FIG. 9(c), the substrate 1 on which the imprint material 3z is applied and the mold 4z are brought into contact with each other and pressure is applied. The imprint material 3z is filled into the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z as energy for curing in this state, the imprint material 3z cures.

[0058] As shown in FIG. 9(d), after the imprint material 3z is cured and the mold 4z and the substrate 1z are separated, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of this cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the convex portion of the mold corresponds to the concave portion of the cured product. That is, the concavo-convex pattern of the mold 4z is transferred to the imprint material 3z.

[0059] As shown in FIG. 9(e), when etching is performed using the pattern of the cured product as an etching mask, the portion of the surface of the workpiece 2z where the cured product is absent or remains thinly is removed to form grooves 5z. As shown in FIG. 9(f), when the pattern of the cured product is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured product is removed, but it may not be removed after processing and may be used, for example, as a film for interlayer insulation included in a semiconductor element or the like, that is, as a component of the article.

[0060] Next, another manufacturing method of an article will be described. As shown in Fig. 10(a), a substrate 1y such as quartz glass is prepared, and then an imprint material 3y is applied to the surface of the substrate 1y by an inkjet method or the like. If necessary, a layer of another material such as a metal or a metal compound may be provided on the surface of the substrate 1y.

[0061] As shown in Fig. 10(b), an imprint mold 4y is opposed with the side on which the concavo-convex pattern is formed facing the imprint material 3y on the substrate. As shown in Fig. 10(c), the substrate 1y to which the imprint material 3y is applied and the mold 4y are brought into contact with each other and pressure is applied. The imprint material 3y is filled in the gap between the mold 4y and the substrate 1y. When light is irradiated through the mold 4y in this state, the imprint material 3 hardens.

[0062] As shown in Fig. 10(d), after the imprint material 3y is cured and then the mold 4y and the substrate 1y are separated, a pattern of the cured product of the imprint material 3y is formed on the substrate 1y. Thus, an article having a pattern of the cured product as a constituent member is obtained. Note that if the substrate 1y is etched using the pattern of the cured product as a mask in the state of Fig. 10(d), an article in which the concave and convex portions are inverted with respect to the mold 4y, for example, an imprint mold can also be obtained.

[0063] This specification and the accompanying drawings include the following disclosure. (Item 1) A substrate stage having a substrate holding portion for holding a substrate, A mold holding portion for holding a mold, A drive mechanism for changing the distance between the substrate holding portion and the mold holding portion so as to bring the curable composition disposed on the substrate into contact with the mold or separate the curable composition from the mold, A curing portion for curing the curable composition in a state where the curable composition on the substrate is in contact with the mold, and The substrate stage has a gas blowing portion for supplying a gas that inhibits curing of the curable composition to the substrate held by the substrate holding portion. A film forming apparatus characterized by the following. (Item 2) The gas blowing part is arranged so as to surround the periphery of the substrate held by the substrate holding part. The film forming apparatus according to Item 1, characterized by the above. (Item 3) The gas blowing part includes a plurality of gas outlets. The plurality of gas outlets are arranged at equal intervals on a circle concentric with the center of the substrate. The film forming apparatus according to Item 2, characterized by the above. (Item 4) The gas blowing part includes a gas outlet having a ring shape. The center of the ring shape coincides with the center of the substrate held by the substrate holding part. The film forming apparatus according to Item 2, characterized by the above. (Item 5) Further provided is a second gas blowing part that is arranged to face the substrate stage and blows out a curing inhibition gas that inhibits the curing of the curable composition. The film forming apparatus according to Item 1, characterized by the above. (Item 6) The second gas blowing part selectively blows out the curing inhibition gas or a filling promotion gas that promotes the filling of the curable composition into the space formed between the substrate and the mold. The film forming apparatus according to Item 5, characterized by the above. (Item 7) The second gas blowing part terminates the blowing of the filling promotion gas before curing the curable composition, and then starts blowing the curing inhibition gas. The film forming apparatus according to Item 6, characterized by the above. (Item 8) After the second gas blowing part finishes blowing the filling promotion gas, the gas blowing part starts blowing the gas that inhibits the curing of the curable composition. The film forming apparatus according to Item 7, characterized by the above. (Item 9) Further comprising a third gas blowing unit arranged to face the substrate stage, The third gas blowing unit blows out the filling promotion gas so that the filling promotion gas for promoting the filling of the curable composition is supplied to the space formed between the substrate and the mold. The film forming apparatus according to item 5, characterized in that. (Item 10) The third gas blowing unit is disposed between the second gas blowing unit and the mold held by the mold holding unit. The film forming apparatus according to item 9, characterized in that. (Item 11) The third gas blowing unit terminates the blowing of the filling promotion gas before curing the curable composition. After the blowing of the filling promotion gas by the third gas blowing unit is completed, the gas blowing unit starts supplying the gas that inhibits the curing of the curable composition. The film forming apparatus according to item 10, characterized in that. (Item 12) The distance between the gas blowing unit and the edge of the substrate is in the range of 1 mm to 30 mm. The film forming apparatus according to any one of items 1 to 11, characterized in that. (Item 13) The mold holding unit holds a mold having a pattern as the mold. A film on which the pattern is transferred is formed by curing the curable composition. The film forming apparatus according to any one of items 1 to 12, characterized in that. (Item 14) The mold holding unit holds a mold having a flat surface as the mold. A film having a flat surface is formed by curing the curable composition. The film forming apparatus according to any one of items 1 to 12, characterized in that. (Item 15) A contact step of bringing the curable composition disposed on the substrate held by the substrate holding unit into contact with the mold. A supply step of supplying a gas that inhibits curing of the curable composition to the substrate held by the substrate holding portion from the substrate holding portion; A curing step of curing the curable composition in a state where the curable composition on the substrate is in contact with the mold to form a film made of a cured product of the curable composition; A separation step of separating the film and the mold; A film forming method characterized by including the above. (Item 16) The method further includes a second supply step of supplying a filling promoting gas that promotes filling of the curable composition into a space formed between the substrate and the mold to the space, The contact step is performed in a state where the filling promoting gas is present in the space. The film forming method according to item 15, characterized by the above. (Item 17) The supply step is performed after the end of the second supply step. The film forming method according to item 16, characterized by the above. (Item 18) A film forming step of forming a film made of a cured product of a curable composition on a substrate by the film forming apparatus according to any one of items 1 to 14; A processing step of obtaining an article by processing the substrate that has undergone the film forming step; An article manufacturing method characterized by including the above. (Item 19) A film forming step of forming a film made of a cured product of a curable composition on a substrate by the film forming method according to any one of items 15 to 17; A processing step of obtaining an article by processing the substrate that has undergone the film forming step; An article manufacturing method characterized by including the above.

[0064] The invention is not limited to the above embodiments, and various modifications and changes are possible within the scope of the gist of the invention.

Explanation of Signs

[0065] 1: Mold, 2: Mold holding part, 3: Substrate, 4: Substrate stage, 5: Curing part, 6: Curable composition, 7: Control part, 9: Dispenser, 13: Driving mechanism, 21: Gas blowing part, 25: Substrate holding part, 100: Film forming apparatus

Claims

1. a substrate stage having a substrate holding portion for holding a substrate; a mold holding portion for holding a mold; a drive mechanism for changing the distance between the substrate holding portion and the mold holding portion so as to bring the curable composition disposed on the substrate into contact with the mold or to separate the curable composition from the mold; a curing unit for curing the curable composition in a state where the curable composition on the substrate is in contact with the mold; and the substrate stage has a gas blowing portion for supplying a gas that inhibits curing of the curable composition to the substrate held by the substrate holding portion. A film forming apparatus characterized by the above.

2. The gas blowing portion is disposed so as to surround the periphery of the substrate held by the substrate holding portion. The film forming apparatus according to claim 1, characterized by the above.

3. The gas blowing portion includes a plurality of gas blowout ports. The plurality of gas blowout ports are arranged at equal intervals on a circle concentric with the center of the substrate. The film forming apparatus according to claim 2, characterized by the above.

4. The gas blowing portion includes a gas blowout port having a ring shape. The center of the ring shape coincides with the center of the substrate held by the substrate holding portion. The film forming apparatus according to claim 2, characterized by the above.

5. The film forming apparatus according to claim 1, further comprising a second gas blowing portion disposed so as to face the substrate stage and blowing out a curing inhibition gas that inhibits curing of the curable composition. The film forming apparatus according to claim 1, characterized by the above.

6. The second gas blowing portion selectively blows out the curing inhibition gas or a filling promotion gas that promotes filling of the curable composition into the space formed between the substrate and the mold. The film forming apparatus according to claim 5, characterized by the above.

7. The second gas blowing portion terminates blowing of the filling promotion gas before curing the curable composition, and then starts blowing of the curing inhibition gas. The film forming apparatus according to claim 6, characterized by the above.

8. The gas blowing portion starts blowing of the gas that inhibits curing of the curable composition after the second gas blowing portion finishes blowing of the filling promotion gas. The film forming apparatus according to claim 7, characterized by the above.

9. The film forming apparatus further comprises a third gas blowing portion disposed so as to face the substrate stage. The third gas blowing unit blows out a filling promotion gas that promotes filling of the curable composition into a space formed between the substrate and the mold. The film forming apparatus according to claim 5, characterized in that.

10. The third gas blowing unit is disposed between the second gas blowing unit and the mold held by the mold holding unit. The film forming apparatus according to claim 9, characterized in that.

11. The third gas blowing unit terminates blowing of the filling promotion gas before curing the curable composition. After the blowing of the filling promotion gas by the third gas blowing unit is completed, the gas blowing unit starts supplying the gas that inhibits curing of the curable composition. The film forming apparatus according to claim 10, characterized in that.

12. The distance between the gas blowing unit and the edge of the substrate is in the range of 1 mm to 30 mm. The film forming apparatus according to claim 1, characterized in that.

13. The mold holding unit holds, as the mold, a mold having a pattern. A film in which the pattern is transferred is formed by curing of the curable composition. The film forming apparatus according to any one of claims 1 to 12, characterized in that.

14. The mold holding unit holds, as the mold, a mold having a flat surface. A film having a flat surface is formed by curing of the curable composition. The film forming apparatus according to any one of claims 1 to 12, characterized in that.

15. A contact step of bringing the curable composition disposed on the substrate held by the substrate holding unit into contact with the mold. A supply step of supplying, from the substrate holding unit, a gas that inhibits curing of the curable composition to the substrate held by the substrate holding unit. A curing step of curing the curable composition in a state where the curable composition on the substrate is in contact with the mold to form a film made of a cured product of the curable composition. A separation step of separating the film and the mold. A film forming method, characterized by including.

16. The method further includes a second supply step of supplying a filling promotion gas that promotes filling of the curable composition into a space formed between the substrate and the mold to the space. The contact step is performed in a state where the filling promotion gas is present in the space. The film forming method according to claim 15, characterized in that.

17. The supply step is carried out after the completion of the second supply step, The film forming method according to claim 16, characterized in that.

18. A film forming step of forming a film made of a cured product of a curable composition on a substrate by the film forming apparatus according to any one of claims 1 to 12, A processing step of obtaining an article by processing the substrate that has undergone the film forming step, An article manufacturing method characterized by including.

19. A film forming step of forming a film made of a cured product of a curable composition on a substrate by the film forming method according to any one of claims 15 to 17, A processing step of obtaining an article by processing the substrate that has undergone the film forming step, An article manufacturing method characterized by including.

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