Mounting device

Abstract

To provide a mounting device which performs secure mounting while preventing contamination of an attachment tool when performing face-down mounting of a chip component on a substrate using a pre-coated underfill.SOLUTION: A mounting device comprises: a substrate stage on which a substrate is held; a mounting head which holds a chip component; elevation means which elevates the mounting head in a direction that is vertical to the substrate; imaging means which observes the chip component held by the mounting head; a temporary chip holding section capable of mutually delivering the chip component with the mounting head; and a control section which is connected with the imaging means and calculates a relative position of the chip component to an attachment tool forming a face of the mounting head on which the chip component is held.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a mounting device for mounting chip components on a substrate such as a wiring board.

Background Art

[0002] As an example of a device for mounting chip components such as semiconductor chips on a substrate such as a wiring board, FIG. 10 shows a schematic diagram of a mounting device 101. In the mounting device 101, a chip component held by an attachment tool 42 of a mounting head 4 is mounted at a predetermined position of a substrate held by a suction table 23.

[0003] Here, the mounting device 101 shown in FIG. 10 performs a so-called face-down mounting (also referred to as flip-chip mounting) in which the electrodes of the chip component and the electrodes of the substrate are opposed to each other and the two electrodes are joined. In face-down mounting, generally, at least one of the electrodes of the chip component and the electrodes of the substrate is melted to join the electrodes together.

[0004] In face-down mounting, although electrical connection can be obtained by joining the electrodes, the mechanical connection strength may be insufficient in some cases. For this reason, the gap between the chip component and the substrate is filled with resin (underfill). As a form thereof, a thermosetting resin is previously disposed on either the electrode surface of the chip component or the substrate (pre-coated underfill), and a method of curing the thermosetting resin in parallel with the joining of the electrodes by heating (for example, Patent Document 1) exists.

[0005] An example thereof is shown in FIG. 11. In FIG. 11(a), an insulating paste NCP containing a thermosetting resin (which may contain insulating inorganic fine particles) as a component is applied to a portion of the substrate S where the chip component C is to be mounted, and alignment of the substrate S and the chip component C is performed before the chip component C comes into contact with the insulating paste NCP on the substrate S. Further, the heat emitted from the heater unit 41 raises the temperature of the chip component C held by the attachment tool 42.

[0006] Therefore, if the temperature of the chip component C is equal to or higher than the softening temperature of the insulating paste NCP, by lowering the mounting head 4 as shown in Fig. 11(b), the electrodes of the chip component C and the substrate can be brought close to each other until they are in close contact, and by further heating, the electrodes are electrically joined together and the insulating paste NCP is cured to complete the mounting.

[0007] By the way, in Fig. 11, the surface of the attachment tool 42 that holds the chip component C is the same size as the chip component C. This is to prevent the surface of the attachment tool 42 that holds the chip component C from being contaminated and to sufficiently cure the insulating paste NCP.

[0008] That is, as shown in Fig. 12(a), when the surface of the attachment tool 42 that holds the chip component C is larger than the chip component C, the insulating paste NCP that has oozed out from around the chip component C adheres to the outer peripheral part of the attachment tool 42 (Fig. 12(b)) during the heat pressure bonding stage and gets contaminated.

[0009] Also, as shown in Fig. 13(a), when the surface of the attachment tool 42 that holds the chip component C is smaller than the chip component C, the state shown in Fig. 13(b) occurs, resulting in insufficient pressure and heating on the outer periphery of the chip component C, and there is a concern that the bonding between the electrodes near the outer periphery of the chip component C will be incomplete and the curing of the insulating paste NCP will also be insufficient.

[0010] Therefore, in face-down mounting using a pre-applied underfill such as the insulating paste NCP, it is desirable that the surface of the attachment tool 42 that holds the chip component C has the same shape and size as the chip component C.

Prior Art Documents

Patent Documents

[0011]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0012] In a configuration such as the mounting device 101 illustrated in FIG. 10, the chip component C supplied from a chip supply unit (not shown) is mounted on the chip slider 61 of the chip transfer means 6, moves to directly below the mounting head 4, and is delivered to the attachment tool 42.

[0013] Here, as shown in FIG. 11(a), it is desirable that the chip component C be delivered in a state where the surface of the attachment tool 42 that holds the chip component C is aligned with the position of the chip component C.

[0014] That is, if the surface of the attachment tool 42 that holds the chip component C is not aligned with the position of the chip component C (FIG. 14(a)), a part of the attachment tool 42 will be contaminated with the insulating paste NCP, while a portion where the hardening of the insulating paste NCP is insufficient will also occur, resulting in a mounting defect. For this reason, a control mechanism may be introduced such that the position where the chip component C is mounted on the chip slider 61 from the chip supply unit, the position of the chip slider 61 when delivering the chip component C, etc. are within a predetermined range.

[0015] However, even when such a control mechanism is introduced, due to sudden disturbances or the like, the positional deviation of the chip component C with respect to the surface of the attachment tool 42 that holds the chip component C may exceed the allowable range. When such a positional deviation exceeding the allowable range occurs, the surface that holds the chip component C is contaminated, and it becomes necessary to replace the attachment tool 42. However, this causes a time loss required for replacing the attachment tool 42 and also requires a large number of spare attachment tools 42, so the impact on the mounting cost cannot be ignored.

[0016] The present invention has been made in view of the above problems, and when face-down mounting a chip component on a substrate using a pre-applied underfill such as an insulating paste NCP, it provides a mounting apparatus that performs reliable mounting while preventing contamination of the attachment tool.

Means for Solving the Problems

[0017] In order to solve the above problems, the invention according to claim 1 is a mounting apparatus for mounting a chip component on a substrate, comprising a substrate stage for holding the substrate, a mounting head for holding the chip component, lifting means for lifting and lowering the mounting head in a direction perpendicular to the substrate, imaging means for observing the chip component held by the mounting head, a chip temporary holding part capable of mutually transferring the chip component with the mounting head, and a control unit connected to the imaging means for calculating the relative position of the chip component with respect to an attachment tool forming a surface for holding the chip component of the mounting head.

[0018] The invention according to claim 2 is the mounting apparatus according to claim 1, wherein the control unit calculates a positional deviation of the chip component with respect to a predetermined position of the attachment tool.

[0019] The invention according to claim 3 is the mounting apparatus according to claim 2, wherein at least one of the chip temporary holding part and the mounting head has a function of moving in the in-plane direction of the substrate and is connected to the control unit.

[0020] The invention according to claim 4 is the mounting apparatus according to claim 3, after the control unit calculates the positional deviation, the chip component is transferred from the mounting head to the chip temporary holding part, and at least one of the chip temporary holding part and the mounting head is moved so that the control unit corrects the positional deviation, and then the chip component is transferred from the chip temporary holding part to the mounting head.

[0021] The invention according to claim 5 is a mounting device according to any one of claims 1 to 4, wherein the mounting head is capable of rotational position adjustment about a rotation axis in a direction perpendicular to the substrate, and the chip temporary holding part is a mounting device capable of position adjustment in two axial directions intersecting in the plane of the substrate.

[0022] The invention according to claim 6 is a mounting device according to claim 5, wherein the substrate stage has a function of moving in the in-plane direction of the substrate, and the chip temporary holding part is a mounting device interlocked with the substrate stage.

Advantages of the Invention

[0023] According to the present invention, when a chip component is face-down mounted on a substrate using a pre-applied underfill such as an insulating paste NCP, the chip component can be reliably mounted on the substrate without the surface for holding the chip component of the attachment tool being contaminated, thereby making it possible to achieve both high quality and high productivity.

Brief Description of the Drawings

[0024]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Embodiments for Carrying Out the Invention

[0025] Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram of a mounting device 1 in an embodiment of the present invention.

[0026] The mounting device mounts chip components on a substrate such as a wiring board. The mounting device 1 in FIG. 1 is configured to perform face-down mounting in which the electrode surface of the chip component faces the electrode surface of the substrate. Also, an insulating paste NCP is disposed at the position on the substrate where the chip component is to be mounted before mounting the chip component C. Here, the insulating paste NCP contains a thermosetting insulating resin as a component, and may contain insulating inorganic fine particles.

[0027] The mounting device 1 shown in FIG. 1 has a substrate stage 2 provided on a base 200. The substrate stage 2 has a function of holding a substrate and controlling movement in the in-plane direction of the substrate. The elevating means 3 is fixed above the substrate stage 2 by a gantry frame (not shown) provided on the base 200, and a mounting head 4 is connected to the vertical drive shaft of the elevating means 3. Further, the mounting head 4 is provided with a chip transfer means 6 for transferring the chip component C and an upper and lower two-field camera 5 for acquiring respective position information when aligning the chip component C and the substrate.

[0028] The above components are common to the mounting device 101 shown in FIG. 10, but the mounting device 1 further includes an imaging means 7 and a chip temporary holding portion 8. Hereinafter, each part constituting the mounting device 1 in FIG. 1 will be described.

[0029] First, the substrate stage 2 includes a suction table 23 that sucks and holds the substrate disposed on the surface, a Y-direction adjustment unit 22 that can linearly move the suction table 23 in the Y direction, and an X-direction adjustment unit 21 that can linearly move the Y-direction adjustment unit 22 in the X direction and is provided on the base 200.

[0030] The Y-direction adjustment unit 22 mounts the suction table 23 on a movable part disposed on a slide rail, and the movable part is moved and position-controlled by a Y-direction servo 221. Further, the X-direction adjustment unit 21 mounts the Y-direction adjustment unit 22 on a movable part disposed on a slide rail, and the movable part is moved and position-controlled by an X-direction servo 211. Here, the X-direction servo 211 and the Y-direction servo 221 are servo motors.

[0031] The elevating means 3 is fixed to a gantry frame (not shown), the vertical drive shaft is provided in a direction perpendicular to the suction table 23, and the mounting head 4 is connected to the vertical drive shaft. The elevating means 3 has a function of driving the mounting head 4 up and down and applying a pressing force according to the setting. Further, in the mounting device 1, since the elevating means 3 is supported from two directions and is linearly connected to the mounting head 4, it is difficult for a lateral force to be applied to the mounting head 4 during pressing.

[0032] The mounting head 4 holds the chip component C and crimps it in a state parallel to the substrate (held on the adsorption table 23 of the substrate stage 2). The mounting head 4 includes a heater unit 41, an attachment tool 42, and a tool position adjustment unit 43 as its components. The heater unit 41 has a heat generation function and heats the chip component C via the attachment tool 42. Further, the heater unit 41 has a function of adsorbing and holding the attachment tool 42 using a decompression flow path. The attachment tool 42 adsorbs and holds the chip component C and is exchanged according to the shape of the chip component C. The tool position adjustment unit 43 finely adjusts the positions of the heater unit 41 and the attachment tool 42 in the direction within the vertical plane of the vertical drive shaft of the elevating means 3.

[0033] The tool position adjustment unit 43 includes an X-direction adjustment unit 431, a Y-direction adjustment unit 432, and a rotation-direction adjustment unit 433 as its components. In the embodiment shown in FIG. 1, the rotation-direction adjustment unit 433 adjusts the rotation direction of the (heater unit 41 and) attachment tool 42, the Y-direction adjustment unit 432 adjusts the Y-direction position of the rotation-direction adjustment unit 433, and the X-direction adjustment unit 431 adjusts the X-direction position of the Y-direction adjustment unit 432. However, the present invention is not limited to this configuration, and it is sufficient if the X-direction position, Y-direction position, and rotation angle of the attachment tool 42 can be adjusted. Here, if the X-direction adjustment unit 21 and the Y-direction adjustment unit 22 of the substrate stage 2 satisfy the desired alignment accuracy, the X-direction adjustment unit 431 and the Y-direction adjustment unit 432 of the tool position adjustment unit 43 are not essential components in this embodiment.

[0034] The top and bottom two-field camera 5 acquires the position information of the chip recognition mark provided on the chip component C by the camera facing upward, and acquires the position information of the board recognition mark provided on the board S by the camera facing downward, and is used for aligning the chip component C and the board S. Note that it is not limited to the top and bottom two-field camera in which two cameras are integrated as long as the position information of the chip recognition mark provided on the chip component C and the position information of the board recognition mark provided on the board S can be acquired. For example, if the position information of the chip recognition mark is acquired by the imaging means 7 having a field of view on the upper side, and an imaging means having a field of view on the lower side is separately provided to acquire the position information of the board recognition mark provided on the board S, it is not necessary to use the top and bottom two-field camera.

[0035] The chip transfer means 6 is composed of a transfer rail 60 and a chip slider 61, and the chip slider 61 holds the chip component C supplied from a chip supply unit (not shown) and slides it to below the attachment tool 42 for transfer.

[0036] Here, the chip supply unit (not shown) arranges the chip component C at a fixed position on the chip slider 61. The chip component C arranged on the chip slider 61 may recognize the arrangement position by the imaging means. Also, the position of the chip slider 61 may be controlled so as to deliver the chip component C aiming at within a predetermined range of the attachment tool 42. Note that after the attachment tool 42 holds the chip component C, the chip slider 61 moves to the retracted position.

[0037] The imaging means 7 is used to obtain the positional relationship between the attachment tool 42 (the surface holding the chip part C of the attachment tool 42) and the chip component C in a state where the attachment tool 42 holds the chip component C. In the mounting apparatus 1, it is arranged to observe the lower surface (the surface holding the chip component C) of the attachment tool 42 of the attachment tool 42 from below.

[0038] The chip temporary holding unit 8 holds the chip component C transferred from the attachment tool 42 when the chip component C is held in a state where the positional deviation with respect to the surface (of the attachment tool 42 that holds the chip component C) exceeds the allowable range, and has a function of sucking and holding the electrode surface side of the chip component C.

[0039] In the mounting apparatus 1, the imaging means 7 and the chip temporary holding unit 8 are fixed to the chip position adjustment table 230 connected to the end of the suction table 23, but are not limited thereto, and may be in a form that can be positionally adjusted in the in-plane direction (XY direction) of the chip component C (as long as it does not interfere with the suction table 23).

[0040] As shown in the block diagram of FIG. 2, the mounting apparatus 1 includes a substrate stage 2, lifting means 3, a mounting head 4, upper and lower two-field cameras 5, a chip transfer means 6, an imaging means 7, and a control unit 10 connected to the chip temporary holding unit 8.

[0041] Substantially, the control unit 10 has a CPU and a storage device as main components, and intervenes an interface with each device as necessary. Further, the control unit 10 can perform calculations using the acquired data and output according to the calculation results by incorporating a program.

[0042] The control unit 10 is connected to the substrate stage 2, controls the operations of the X-direction servo 211 and the Y-direction servo 221, and controls the in-plane movement of the suction table 23. Further, the control unit 10 controls the suction table 23 to control the suction and release of the substrate S.

[0043] The control unit 10 is connected to the lifting means 3, controls the vertical position (Z direction) of the mounting head 4, and has a function of controlling the pressing force when pressing the chip component C against the substrate S.

[0044] The control unit 10 is connected to the mounting head 4 and has functions of controlling the adsorption and holding and release of the chip component C by the attachment tool 42, the heating temperature of the heater unit 41, and the positions of the heater unit 41 and the attachment tool 42 within the XY plane.

[0045] The control unit 10 is connected to the upper and lower two-field cameras 5 and has functions of controlling the driving in the horizontal (within the XY plane) direction and the vertical direction (Z direction), and controlling the imaging operation to obtain image data. Furthermore, the control unit 10 has an image processing function and has a function of calculating the position information of the substrate recognition mark and / or the chip recognition mark in the images obtained by the cameras facing up and down respectively.

[0046] The control unit 10 is connected to the chip transfer means 6 and has a function of controlling the position of the chip slider 61 that moves along the transfer rail 60. Also, it desirably has a function of controlling the holding or release of the chip component by the chip slider 61.

[0047] The control unit 10 is connected to the imaging means 7 and has a function of controlling the imaging operation to obtain image data. Furthermore, the control unit 10 has an image processing function and has a function of calculating the positional relationship of the (held) chip component with respect to the surface of the attachment tool 42 that holds the chip component C in the obtained image.

[0048] The control unit 10 is connected to the chip temporary holding unit 8 and has a function of controlling the holding or release of the chip component C.

[0049] The following describes the process of the mounting device 1 mounting the chip component C on the substrate S. The mounting process according to the present invention includes a chip transfer process from when the chip C supplied from the chip supply unit is delivered to the attachment tool 42, a tool holding state determination process for determining whether a chip component is held at a predetermined position of the attachment tool 42, an alignment process of aligning the chip mounting location of the substrate S directly below the attachment tool 42, and a mounting process of crimping the chip component C to the mounting location as the basis. When the determination result in the tool holding state determination process is NG, a chip position adjustment process for adjusting the position of the chip component C is included.

[0050] Note that since the mounting head 4 of the mounting device 1 is connected to the lifting means 3 in a fixed state (by a gantry frame not shown), it cannot move significantly. Also, since the imaging means 7 and the chip temporary holding part 8 are arranged on the outer peripheral part of the suction table 23, in order to oppose the imaging means 7 or the chip temporary holding part 8 to the attachment tool 42, the suction table 23 of the substrate stage 2 is moved as shown in FIG. 3. However, the present invention is effective also in addition to such an embodiment. It is also applicable to a configuration in which the mounting head moves on the suction table.

[0051] FIGS. 4 and 5 illustrate the operation of the mounting device 1 from the chip transfer process to the mounting process, showing the view from the Y direction.

[0052] FIGS. 4(a) and 4(b) relate to the chip transfer process. FIG. 4(a) shows a state where the chip slider 61 holding the chip component C moves along the transfer rail 60 and moves directly below the mounting head 4, and FIG. 4(b) shows a state where the mounting head 4 descends and delivers the chip component C from the chip slider 61 to the attachment tool 42.

[0053] FIG. 4(c) shows a state in which, in the tool holding state determination step, the imaging means 7 observes and images the lower surface of the attachment tool 42 and the chip component C. The image data captured by the imaging means 7 is sent to the control unit 10, and the control unit 10 calculates the positional relationship of the (held) chip component with respect to the surface of the attachment tool 42 that holds the chip component C, and determines whether or not the positional relationship is within the allowable range.

[0054] Here, if the positional relationship of the (held) chip component C with respect to the surface of the attachment tool 42 that holds the chip component C is within the allowable range, the process proceeds to the alignment step. FIG. 5(a) shows a state in which, in the alignment step, the control unit 10 operates the substrate stage 2 to move the suction table 23. Thereafter, the upper and lower two-field cameras 5 image the chip recognition mark provided on the chip component C and the substrate recognition mark provided on the substrate S, and both imaging data are sent to the control unit 10. The control unit 10 calculates the amount of positional deviation of the chip component C with respect to a predetermined position (the position where the chip component C is to be mounted) on the substrate S. If the amount of positional deviation exceeds the allowable range, alignment is performed. During alignment, the control unit 10 controls the substrate stage 2 or the tool position adjustment unit 43. Regarding the angle adjustment with the Z direction as the rotation center, the rotation direction adjustment unit 433 of the tool position adjustment unit 43 is controlled.

[0055] After the alignment process, as the mounting process, after the control unit 10 retracts the upper and lower two-field cameras 5, as shown in FIG. 5(b), the mounting head 4 is lowered and the heater unit 41 is heated to heat the chip component C while pressing it against the substrate S. Note that at the stage of lowering the mounting head 4 for thermocompression bonding, an insulating paste NCP is applied to a predetermined location on the substrate S. By thermocompression bonding, the electrodes of the chip component C and the substrate S are joined and the insulating paste NCP is cured, and the chip component C is firmly fixed to the substrate S. After the completion of the mounting process, the control unit 10 releases the suction of the chip component by the attachment tool 42 and raises the mounting head 4 as shown in FIG. 5(c). At this stage, the control unit 10 turns off the heater unit 41 and lowers the temperature of the attachment tool 42. After that, the control unit 10 raises the mounting head 4 to the state shown in FIG. 4(a), and then conveys the semiconductor chip C to be mounted next by the chip conveying means 6.

[0056] Incidentally, in the above description, the form of mounting the chip component from the state where the insulating paste NCP is applied to the substrate S has been described. However, the present invention can be applied to all pre-applied underfills and is also effective for mounting using a chip component C with an insulating film NCF attached to the electrode surface.

[0057] In the above description, in the tool holding state determination process shown in FIG. 4(c), the positional relationship of the chip component C with respect to the surface of the attachment tool 42 that holds the chip component C is within the allowable range. However, if it is out of the allowable range, instead of the alignment process shown in FIG. 5(a), the process proceeds to the chip position adjustment process.

[0058] The chip position adjustment process is to adjust the position of the chip component C with respect to the surface of the attachment tool 42 that holds the chip component C so as to fall within a predetermined range. After once releasing the holding of the chip component C by the attachment tool 42, the relative position is adjusted to correct the positional deviation and then held again.

[0059] In the chip position adjustment process, as shown in FIG. 4(c), the control unit 10 acquires the relative positional relationship of the chip component C with respect to the surface holding the chip component C of the attachment tool 42 with the imaging means 7 disposed directly below the mounting head 4, and then drives the substrate stage 2 to perform position adjustment so that the chip temporary holding portion 8 is disposed directly below the mounting head 4 (FIG. 6).

[0060] Hereinafter, the chip position adjustment process will be described with reference to FIGS. 7 and 8, which are enlarged views of the vicinity of the mounting head 4.

[0061] FIG. 7(a) is a partially enlarged view of the state of FIG. 4(c), in which the imaging means 7 is observing the chip component C and the surface holding the chip component C of the attachment tool 42. The rotation center 43C is the rotation center of the rotation direction adjustment unit 433 in the tool position adjustment unit 43, and the chip center CC is the center position of the chip component C. Note that the attachment tool 42 is held by the heater unit 41 with its center position aligned with the rotation center 43C. Also, in the state of FIG. 7(a), the relative position information of the chip component C with respect to the surface holding the chip component C of the attachment tool 42 is calculated and stored by the control unit 10.

[0062] FIG. 7(b) shows a state in which the control unit 10 drives the substrate stage 2 to perform position adjustment so that the chip temporary holding portion 8 is disposed directly below the mounting head 4. In this state, it is desirable that the center of the chip temporary holding portion 8 is positioned in the vicinity directly below the chip center CC.

[0063] Thereafter, the control unit 10 lowers the mounting head 4 and transfers the chip component C from the attachment tool 42 to the chip temporary holding portion 8 as shown in FIG. 7(c). Note that the reason for adjusting the position so that the center of the chip temporary holding portion 8 is in the vicinity directly below the chip center CC at the stage of FIG. 7(b) is to ensure that the chip temporary holding portion 8 securely holds the chip component when transferring the chip component C to the chip temporary holding portion 8.

[0064] Once the chip component C is transferred to the chip temporary holding part 8, the control unit 10 releases the holding of the chip component C by the attachment tool 42, and then raises the mounting head 4 in the same state as shown in Fig. 7(b) (Fig. 7(d)).

[0065] In this state, the control unit 10 controls the substrate stage 2 or the tool position adjustment unit 43 so as to correct the positional deviation of the chip component C with respect to the surface of the attachment tool 42 that holds the chip component C calculated in Fig. 7(a). Regarding the angle adjustment with the Z direction as the rotation center, the rotation direction adjustment unit 433 of the tool position adjustment unit 43 is controlled.

[0066] The state in which the operation of correcting the positional deviation is performed is shown in Fig. 8(a). By lowering the mounting head 4 from this state, in the state where the attachment tool 42 is in close contact with the chip component C, the position of the chip component C coincides with respect to the surface of the attachment tool 42 that holds the chip component C (Fig. 8(b)). Therefore, after the control unit 10 transfers the chip component C from the chip temporary holding part 8 to the attachment tool 42, releases the holding of the chip component C by the chip temporary holding part 8, and then raises the mounting head 4. After raising the mounting head 4, the process proceeds to the alignment process as shown in Fig. 5(a).

[0067] Fig. 9 shows the change in the positional relationship between the attachment tool 42 and the chip component C in the chip position adjustment process as viewed from the Z direction. In Fig. 9, the shape of the chip component C is shown by a dotted line. The chip recognition first mark CA1 and the chip recognition second mark CA2 are chip recognition marks CA arranged at two positions on the diagonal line and are also used for alignment with the substrate S.

[0068] The shape of the attachment tool 42 is shown by a solid line. As depicted in Figs. 7 and 8, the attachment tool 42 has a two-stage shape. In Fig. 9, the outer solid line is the outer circumference, while the inner solid line indicates the surface that holds the chip component C. The tool center 42C is the center position of the attachment tool 42 and is aligned with the rotation center 43C as described above.

[0069] In the example shown in FIG. 9, a tool recognition mark 42A composed of a first tool recognition mark 42A1 and a second tool recognition mark 42A2 is disposed on the diagonal line outside the surface that holds the chip component C of the attachment tool 42. Therefore, alignment of the attachment tool 42 and the chip component C can be performed using the tool recognition mark 42A and the chip recognition mark AC. However, the method for aligning the attachment tool 42 and the chip component C is not limited to this, and it is also possible to perform alignment by image recognition of the surface of the attachment mark 42 that holds the chip component C and the shape of the chip component C.

[0070] Hereinafter, the chip position adjustment process will be described with reference to FIGS. 9(a) to 9(d). First, FIG. 9(a) shows a state in which the chip component C is misaligned with respect to the surface of the attachment tool 42 that holds the chip component C as shown in FIG. 7(a). This positional relationship does not change even at the stages of FIGS. 7(b) and 7(c). Also, at the stage of FIG. 7(d), if the mounting head 4 is rising vertically, even if the chip component C is separated from the attachment tool 42, there is no change in the misalignment shown in FIG. 9(a).

[0071] Thereafter, at the stage of FIG. 8(a), first, the movement of the chip position adjustment table 230 linked with the suction table 23 using the substrate stage 2, or the tool position adjustment unit 43, is adjusted so that the chip center CC and the rotation center 43C are aligned as shown in FIG. 9(b). Thereafter, by performing angle adjustment (with the Z direction as the rotation axis) using the rotation direction adjustment unit 433 of the tool position adjustment unit 43, the position of the surface of the attachment tool 42 that holds the chip component C and the chip component C is aligned as shown in FIG. 9(c).

[0072] With the mounting head 4 lowered in this state, if the chip component C is transferred from the chip temporary holding part 8 to the attachment tool 42 in the state of FIG. 8(b), the chip component C will be held in a state where it is properly positioned on the surface for holding the chip component C. After that, if the holding of the chip component C by the chip temporary holding part 8 is released, the mounting head 4 is raised, and the angle is restored to the original state (with the Z direction as the rotation axis) using the rotation direction adjustment part 433 of the tool position adjustment part 43, the state of FIG. 9(d) is obtained, and the alignment shown in FIG. 5(a) can be entered.

[0073] Incidentally, as a modification of the embodiment of the present invention, the chip holding part 8 may have a rotation direction adjustment function for performing angle adjustment with the Z direction as the rotation axis. If the chip holding part 8 has a rotation direction adjustment function, it is possible to change from the state of FIG. 9(b) to the state of FIG. 9(d) at the stage of FIG. 8(a).

[0074] By the way, if there is an inclination with respect to the vertical direction during the ascent from the state of FIG. 7(c) to the state of FIG. 7(d), a difference occurs in the positional relationship of FIG. 9(a). However, if the height of the mounting head 7 is the same in FIG. 7(a) and FIG. 7(d), the difference in the positional relationship is canceled, so it is desirable to make the height of the mounting head 4 in the state of FIG. 7(a) the same as that in FIG. 7(d) and FIG. 8(a).

[0075] As described above, according to the present invention, the chip component can be held without misalignment with respect to the surface for holding the chip component of the attachment tool. Therefore, if the surface for holding the chip component and the chip component of the attachment tool are the same size, the chip component can cover the entire surface for holding the chip component of the attachment tool and can be held without overhang. As a result, when face-down mounting the chip component on the substrate using pre-applied underfill, the chip component can be reliably mounted on the substrate without the surface for holding the chip component being contaminated. That is, high-quality mounting is possible, and since the replacement work associated with attachment tool contamination can be reduced, high productivity can also be maintained.

[0076] Note that in the mounting device 1 of the embodiment, the lifting means 3 to which the mounting head 4 is connected is fixed, and the suction table 23 of the substrate stage 2 is movable. However, the application scope of the present invention is not limited to this. That is, even in a device configuration where the suction table is fixed and the mounting head is movable in the XY directions, the present invention is effective against the problem of contamination of the attachment tool of the mounting head.

[0077] Furthermore, the application of the present invention is not limited to face-down mounting, and it is also effective for face-up mounting in which the electrodes of the chip component and the electrodes of the substrate face the same direction. That is, in face-up mounting, when mounting a chip component on a substrate, an adhesive is used when joining the opposite side of the electrode surface of the substrate and the electrode surface of the chip component. Therefore, there is a problem of countermeasures against contamination of the attachment tool, and the present invention is suitable for this problem.

Explanation of Reference Numerals

[0078] 1, 101 Mounting device 2 Substrate stage 3 Lifting means 4 Mounting head 5 Up-and-down dual-field camera 6 Chip transfer means 7 Imaging means 8 Chip temporary holding part 10 Control unit 21 X-direction adjustment part 22 Y-direction adjustment part 23 Suction table 41 Heater part 42 Attachment tool 42A(42A1, 42A2) Tool recognition mark 42C Tool center 43 Tool position adjustment part 43C Rotation center 60 Transfer rail 61 Chip slider 200 Base 230 Chip position adjustment table 431 X-direction adjustment part 432 Y-direction adjustment part 433 Rotation Direction Adjustment Part C Chip Component CA (CA1, CA2) Chip Recognition Mark CC Chip Center NCP Insulating Paste S Substrate

Claims

1. A mounting device for mounting chip components on a substrate, comprising: a substrate stage for holding the substrate; a mounting head for holding the chip component; lifting means for lifting and lowering the mounting head in a direction perpendicular to the substrate; imaging means for observing the chip component held by the mounting head; a chip temporary holding part capable of mutually transferring the chip component with the mounting head; a control unit connected to the imaging means and calculating the relative position of the chip component with respect to an attachment tool forming a surface for holding the chip component of the mounting head.

2. The mounting device according to claim 1, wherein the control unit calculates a misalignment of the chip component with respect to a predetermined position of the attachment tool.

3. The mounting device according to claim 2, wherein at least one of the chip temporary holding part and the mounting head has a function of moving in the in-plane direction of the substrate and is connected to the control unit.

4. The mounting device according to claim 3, after the control unit calculates the misalignment, transfer the chip component from the mounting head to the chip temporary holding part, move at least one of the chip temporary holding part and the mounting head so that the control unit corrects the misalignment, and then transfer the chip component from the chip temporary holding part to the mounting head.

5. The mounting device according to any one of claims 1 to 4, wherein the mounting head can be adjusted in rotational position about a rotation axis in a direction perpendicular to the substrate, and the chip temporary holding part can be adjusted in position in two axial directions intersecting in the plane of the substrate.

6. The mounting device according to claim 5, wherein the substrate stage has a function of moving in the in-plane direction of the substrate, and the chip temporary holding part is interlocked with the substrate stage.

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