Deep ultraviolet light source inspection apparatus

Abstract

To achieve both promptness and stability for detecting light distribution of a deep ultraviolet light-emitting diode.SOLUTION: A deep ultraviolet light source inspection apparatus for inspecting deep ultraviolet emitted from a deep ultraviolet light source as test object is provided. The deep ultraviolet light source inspection apparatus comprises: a stage for mounting the deep ultraviolet light source; a translucent member provided opposite the deep ultraviolet light source on the stage, containing phosphor converting the deep ultraviolet emitted from the deep ultraviolet light source into light of a prescribed wavelength; and an imaging part including an image pickup device receiving via the translucent member the light obtained by converting the deep ultraviolet emitted from the deep ultraviolet light source. The translucent member is configured such that ratio of diffusion transmission light to full transmission light at a peak wavelength of light emitted by the phosphor is 50% or more and transmittance of straight-advancing component at a peak wavelength of light emitted from the phosphor by being irradiated with the deep ultraviolet is less than 5%.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a deep ultraviolet light source inspection device, and more particularly to a deep ultraviolet light source inspection device for inspecting the light distribution of a deep ultraviolet light emitting device capable of emitting deep ultraviolet light.

Background Art

[0002] Conventionally, a so-called deep ultraviolet light source that irradiates deep ultraviolet light onto a fluid flowing through a pipeline has been used to inactivate, disinfect, or sterilize pathogenic viruses, fungi, etc. in the fluid. In the present disclosure, viruses, fungi, etc. are collectively referred to as "viruses, etc.", and inactivating, disinfecting, or sterilizing viruses, etc. is simply referred to as "inactivation, etc.".

[0003] While deep ultraviolet light sources used for sterilization have become smaller and closer to point sources, such as deep ultraviolet light emitting diodes and small excimer lamps, the range to be irradiated has remained the same as before. Therefore, the need for light distribution inspection of deep ultraviolet light sources is increasing at the pre-shipment stage of products equipped with small deep ultraviolet light sources that enable appropriate irradiation.

[0004] For example, Patent Document 1 below discloses a light distribution characteristic measuring device including a hemispherical diffuser plate formed in a hemispherical shape so as to cover a light source and arranged such that the apex of the hemisphere coincides with the central axis of the light source, an imaging device that images the light transmitted through the hemispherical diffuser plate irradiated from the light source, a vertical light intensity extraction means for extracting the X-axis perpendicular light intensity and the Y-axis perpendicular light intensity, and a radiation intensity calculation means for converting the X-axis perpendicular light intensity and the Y-axis perpendicular light intensity into an X-axis cross-sectional radiation intensity and a Y-axis cross-sectional radiation intensity.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, since the light distribution characteristic measuring device shown in Patent Document 1 uses a hemispherical diffuser plate to photograph the light distribution with an imaging element, when this is applied to the light distribution inspection of a deep ultraviolet light source, very expensive optical components that transmit deep ultraviolet rays such as magnesium fluoride are required. Further, in the light distribution inspection, there is a problem that since deep ultraviolet light directly enters the imaging element, there is a risk of damaging the filter of the imaging element or the imaging element itself, and thus long-term stable inspection cannot be performed.

[0007] As described above, in the light distribution inspection of a deep ultraviolet light source, a method that achieves both the speed and stability of the inspection has not been sufficiently established. On the other hand, in recent years, a light distribution inspection technology that achieves both the speed and stability of inspection has been desired for the light distribution inspection of deep ultraviolet light-emitting diodes, whose market has been rapidly expanding.

[0008] Therefore, an object of the present invention is to provide a deep ultraviolet light source inspection device that achieves both the speed and stability of the light distribution inspection of a deep ultraviolet light-emitting diode.

Means for Solving the Problems

[0009] The present invention for solving the above problems is configured to include the following invention-specific matters or technical features.

[0010] The present invention according to a certain aspect is a deep ultraviolet light source inspection device for inspecting deep ultraviolet light emitted from a deep ultraviolet light source to be inspected. The deep ultraviolet light source inspection device includes a stage for mounting the deep ultraviolet light source, a translucent member provided on the stage so as to face the deep ultraviolet light source and including a phosphor that converts the deep ultraviolet light emitted from the deep ultraviolet light source into light of a predetermined wavelength, and an imaging unit including an imaging element that receives the light emitted from the deep ultraviolet light source and converted from the deep ultraviolet light through the translucent member. The translucent member is configured such that the ratio of diffused transmitted light to total transmitted light at the peak wavelength of the light emitted by the phosphor is 50% or more, and the transmittance of the direct component at the peak wavelength of the light emitted by the phosphor due to irradiation with the deep ultraviolet light is less than 5%.

[0011] The device further includes an objective lens provided between the translucent member and the imaging unit.

[0012] The objective lens is made of optical glass having a transmittance of 1% / cm or less with respect to the deep ultraviolet light having a wavelength of 300 nm or less.

[0013] The peak wavelength of the light emitted by the phosphor of the translucent member is a wavelength longer than the peak wavelength of the deep ultraviolet light. Also, the transmittance of the translucent member is 2% or less.

[0014] The peak wavelength is in the range of 400 nm to 650 nm.

[0015] The deep ultraviolet light source is a deep ultraviolet light emitting diode chip capable of emitting the deep ultraviolet light.

[0016] The deep ultraviolet light source inspection device is configured to be connectable to an information processing device for image analysis based on an image signal output from the imaging unit.

[0017] Furthermore, the present invention according to another aspect is a translucent member used in a deep ultraviolet light source inspection apparatus for inspecting deep ultraviolet light emitted from a deep ultraviolet light source to be inspected. The translucent member includes a phosphor that converts the deep ultraviolet light emitted from the deep ultraviolet light source into light of a predetermined wavelength. Further, the translucent member is configured such that the ratio of diffused transmitted light to total transmitted light at the peak wavelength of the light emitted by the phosphor is 50% or more, and the transmittance of the direct component at the peak wavelength of the light emitted by the phosphor due to irradiation with the deep ultraviolet light is less than 5%.

[0018] In this specification and the like, the term "means" does not simply mean a physical means, but also includes cases where the function of the means is realized by software. Further, even if the function of one means is realized by two or more physical means, or the functions of two or more means are realized by one physical means, it is acceptable.

Advantages of the Invention

[0019] According to the present invention, it becomes possible to quickly and stably perform the light distribution inspection of the deep ultraviolet light emitting diode.

[0020] Other technical features, objects, effects, and advantages of the present invention will be clarified by the following embodiments described with reference to the attached drawings. The effects described in this specification are merely examples and are not limiting, and there may be other effects.

Brief Description of the Drawings

[0021]

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MODE FOR CARRYING OUT THE INVENTION

[0022] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiments described below are merely examples, and there is no intention to exclude various modifications and applications of technologies not explicitly described below. The present invention can be implemented with various modifications (for example, combining each embodiment) without departing from its gist. Also, in the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. The drawings are schematic and do not necessarily match the actual dimensions, ratios, etc. There may be parts where the dimensional relationships and ratios are different between the drawings.

[0023] FIG. 1 and FIG. 2 are diagrams showing an example of the appearance of a deep ultraviolet light source inspection apparatus according to an embodiment of the present invention. Further, FIG. 3 is a partial cross-sectional view of the deep ultraviolet light source inspection apparatus shown in FIG. 1. As shown in FIG. 1, the deep ultraviolet light source inspection apparatus 1 includes a substantially rectangular parallelepiped housing 10, an objective lens 20, and an imaging unit 30. The deep ultraviolet light source inspection apparatus 1 is configured to be connectable to an information processing device (not shown) for image analysis based on an image signal output from the imaging unit 30.

[0024] The housing 10 includes, for example, a loading tray portion 11 configured to be slidably opened and closed. The loading tray portion 11 includes a stage 111, and is pulled out by pulling the gripping portion 112, and the stage 111 for placing the deep ultraviolet light emitting diode chip 12 as the deep ultraviolet light source to be inspected is exposed outside the housing 10 (see FIGS. 2 and 3). In the present disclosure, the deep ultraviolet light emitting diode chip 12 is placed on the stage 111 so that deep ultraviolet light is emitted upward. Further, a plate-shaped light-transmitting member 113 is detachably arranged on the stage 111 so as to face the deep ultraviolet light emitting diode chip 12.

[0025] The inner surface of the housing 10 is preferably made of a material having light absorbency. For example, the inner surface of the housing 10 is coated with a light-absorbing substance such as black anodizing, matte black paint, or carbon black. From the viewpoint of easy availability, the housing 10 is preferably made of aluminum or an aluminum alloy, and the inner surface is preferably subjected to black anodizing.

[0026] The light-transmitting member 113 is, for example, a plate glass made of quartz glass or the like containing a phosphor that emits light of a predetermined wavelength (for example, visible light) when irradiated with deep ultraviolet light. That is, the phosphor of the light-transmitting member 113 emits light having a peak wavelength longer than the peak wavelength of the deep ultraviolet light. Further, the phosphor is made of, for example, a powder of an oxide having a garnet structure containing a lanthanoid element. The fluorescent plate glass is an example of the light-transmitting member 113. Further, the light-transmitting member 113 has optical diffusibility. That is, the deep ultraviolet light emitted upward from the deep ultraviolet light-emitting diode chip 12 placed on the stage 111 enters from the lower surface of the light-transmitting member 113, is converted into visible light by the phosphor, and the converted visible light is diffusely reflected randomly by another phosphor and radiated upward from the upper surface. The visible light radiated upward forms a light distribution pattern approximating Lambertian light distribution at each arbitrary point of the imaging unit 30.

[0027] When the diffusibility of the light-transmitting member 113 is low, among the visible light converted from the deep ultraviolet light and diffusely radiated, the component of the light traveling straight increases, resulting in an image formed by the light in the circumferential direction or an image affected by the internal structure of the housing 10, thus forming a light distribution pattern different from the incident deep ultraviolet light. For this reason, the ratio of the diffusely transmitted light to the total transmitted light at the peak wavelength of the visible light emitted by the phosphor in the light-transmitting member 113 is preferably 50% or more, more preferably 70% or more, and even more preferably 90% or more. If the ratio of the diffusely transmitted light to the total transmitted light is 50% or more, it is considered possible to obtain an image substantially reflecting Lambertian light distribution in the imaging unit 30. On the other hand, if it is less than 50%, it is not preferable because it is affected by the shape of the deep ultraviolet light-emitting diode chip 12 and the shape of the light-transmitting member 113.

[0028] In addition, the transmittance of components other than the diffused transmitted light at the peak wavelength of visible light, that is, the component of the light traveling straight, is preferably as low as possible because it is reflected inside the housing 10 and becomes a noise component of the image reflecting the Lambertian light distribution obtained by the diffused transmitted light. In order to obtain an image with reduced noise in the peripheral portion in the Lambertian light distribution, for example, the transmittance of the straight-traveling component at the peak wavelength of light is preferably 5% or less, more preferably 2% or less, and even more preferably 1% or less.

[0029] Also, the higher the light transmittance of the light-transmitting member 113, the better. That is, in order to obtain sufficient diffused transmitted light in the imaging unit 30 and achieve a good S / N, the transmittance at the peak wavelength of the light emitted by the phosphor in the light-transmitting member 113 is preferably 10% or more, more preferably 30% or more, and even more preferably 50% or more. When the light absorption degree of the material of the light-transmitting member 113 itself is high, the transmittance may be less than 10%, and the amount of phosphor irradiated with deep ultraviolet light may change due to the optical path length that changes depending on the incident angle. Also, although it is ideal that all the deep ultraviolet light incident on the light-transmitting member 113 is converted into visible light by the phosphor, a certain proportion of the deep ultraviolet light remains radiated as it is depending on the conversion probability or its characteristics by the phosphor. Considering that the transmittance of the window material (such as quartz glass) of the deep ultraviolet light source is inspected with an accuracy of ±2% or less, the stray light existence rate of the deep ultraviolet light passing through the light-transmitting member 113 as it is needs to be ±2% or less. From this, the transmittance of the deep ultraviolet light of the light-transmitting member 113 is preferably 2% or less, more preferably 1% or less, and even more preferably 0.5% or less in order to detect abnormalities of the light-transmitting member 113 with sufficient accuracy.

[0030] FIG. 4 is a diagram for explaining an example of a method for measuring the transmittance of the linear component of light transmitted through the light-transmitting member 113. The transmittance of the linear component of light transmitted through the light-transmitting member 113 can be measured using an ultraviolet spectrophotometer. As shown in the figure, for example, a sample S appropriately cut out from the light-transmitting member 113 is arranged via a detector slit 402 so as to face a detector 401 of an ultraviolet spectrophotometer (Shimadzu UV-2450). Further, an incident light slit 403 is arranged so that the linear component of light is incident on the sample S substantially perpendicularly. Thereby, only the linear component of the light incident on the sample S from the incident light slit 403 and transmitted through the sample S is incident on the detector 401, enabling the measurement of the transmittance of the sample S.

[0031] FIG. 5 is a diagram for explaining an example of a method for measuring the transmittance of light (total transmitted light) including a diffused component transmitted through the light-transmitting member 113. Similarly, the transmittance of the total transmitted light transmitted through the light-transmitting member 113 can be measured using an ultraviolet spectrophotometer. As shown in the figure, for example, it is connected to an integrating sphere unit 502 (Shimadzu MPC-22200) connected to a detector 501 of an ultraviolet spectrophotometer (Shimadzu UV-2450). The inner surface of the integrating sphere unit 502 is coated so that the incident light is diffusely reflected. A sample S appropriately cut out from the light-transmitting member 113 is connected to the integrating sphere unit 502. Further, an incident light slit 503 is arranged so that the linear component of light is incident on the sample S substantially perpendicularly. Thereby, only the linear component of the light incident on the sample S from the incident light slit 503 and transmitted through the sample S is incident on the integrating sphere unit 502. Then, the light incident on the integrating sphere unit 502 is repeatedly diffused and reflected inside and averaged before being incident on the detector 501. Thereby, based on the light-receiving area of the detector 501 and the inner area of the integrating sphere unit 502, it becomes possible to measure the transmittance of the total transmitted light including diffused light.

[0032] FIG. 6 is a diagram for explaining an example of a method for measuring the transmittance of deep ultraviolet light transmitted through a translucent member. When measuring deep ultraviolet light, it is necessary to distinguish whether the light transmitted through the sample S is the light emitted by the phosphor or the deep ultraviolet light itself. However, with the measurement methods shown in FIGS. 4 and 5 described above, they cannot be distinguished. Therefore, in measuring the transmittance of deep ultraviolet light, a photodiode (UV sensor) that does not respond to the wavelength of the light emitted by the phosphor when deep ultraviolet light having a predetermined wavelength emitted from the deep ultraviolet light emitting diode chip 12 passes through the translucent member 113 is used as the detector 601, enabling the measurement of the transmittance of deep ultraviolet light.

[0033] Returning to FIGS. 1 to 3, the objective lens 20 provided between the translucent member 113 and the imaging unit 30 is preferably made of optical glass such as crown glass. Here, as shown in FIGS. 7(a) and (b), in the case of crown glass such as BK7 (borosilicate crown glass), the transmittance of deep ultraviolet light with a wavelength shorter than 280 nm is extremely low. Therefore, such crown glass can further attenuate the deep ultraviolet light slightly leaking or stray from the translucent member 113, protecting the imaging device and various optical filters from the deep ultraviolet light. Also, the crown glass is effective because it can absorb even a small amount of deep ultraviolet light diffusely reflected from the inner surface of the housing 10 that becomes stray light during measurement. From this, the objective lens 20 preferably consists of optical glass having a transmittance of 2% / cm or less for deep ultraviolet light having a wavelength of 280 nm or less.

[0034] The imaging unit 30 includes an imaging device (not shown) that can receive the light (visible light) emitted from the translucent member 113 with sufficient sensitivity. The imaging device is selected to have a sufficient angle of view to observe the range of the inspection target. Generally, an imaging device capable of receiving visible light has stable operating characteristics and is inexpensive compared to one capable of receiving deep ultraviolet light. The imaging unit 30 outputs an image signal obtained by imaging to an information processing device (not shown) for image analysis.

Example

[0035] (Translucent members of the examples and comparative examples) <Examples 1 to 4> The translucent member 113 was produced by forming a plate-like shape from a glass powder and a powder of an oxide having a garnet structure containing a lanthanoid element serving as a phosphor and sintering them. The phosphor contained in the translucent member 113 is selected so as to have a wavelength longer than 400 nm, which is sufficiently separated from the deep ultraviolet light from the deep ultraviolet light source to be inspected, in order to facilitate separation from the deep ultraviolet light. This time, a phosphor that emits light having a peak wavelength of 540 to 560 nm was used, but the present invention is not limited thereto. Note that, considering that it becomes difficult to separate from infrared light when the wavelength of the light emitted by the phosphor becomes too long, and considering the lower limit value of the sensitivity performance of the image sensor, etc., it is preferable that the phosphor emits light having a peak wavelength shorter than 650 nm.

[0036] <Comparative Example 1> The translucent member of Comparative Example 1 is a fluorescent glass plate having a property of transmitting visible light produced by diffusing a lanthanoid element in optical glass.

[0037] <Comparative Example 2> The translucent member of Comparative Example 2 is a plate of smooth and transparent synthetic quartz glass with both sides optically polished.

[0038] <Comparative Example 3> The translucent member of Comparative Example 3 is a frosted glass plate made of synthetic quartz glass with one of the front and back sides roughened by sandblasting.

[0039] When measuring the transmittance (Tl) of the linear component of light, Shimadzu UV-2450 was used for the spectroscope. When measuring the total transmittance (Ta) including diffused light, a device obtained by connecting an integrating sphere unit MPC-2200 to Shimadzu UV-2450 was used.

[0040] The ratio (Td) of the diffused transmitted light to the total transmitted light was calculated from Ta and Tl by the following formula 1. Td = (Ta - Tl) / Ta … Formula 1

[0041] In the measurement of the transmittance of deep ultraviolet light, as the deep ultraviolet light source, the deep ultraviolet light emitting diode chip of Crystal-IS's "Klaran WD" with a peak wavelength of 261 nm was used, and as the detector, the photodiode of Kyoto Semiconductor Co., Ltd.'s "KPDU27HQ2" was used.

[0042] Since the deep ultraviolet light source inspection device 1 according to the present invention is used for inspecting a deep ultraviolet light source for use in inactivation of viruses and the like, the peak wavelength of the deep ultraviolet light emitting diode chip 12 as the deep ultraviolet light source is preferably shorter than 350 nm, and more preferably in the range of 200 to 300 nm. Further, the photodiode as the detector preferably has a sensitivity of 1% or less with respect to wavelengths longer than 400 nm, and more preferably has a sensitivity of 1% or less in the range of 350 to 650 nm.

[0043] The deep ultraviolet light source inspection device 1 includes a housing 10 made of a 5000 series aluminum alloy and subjected to black anodizing treatment, and is configured by incorporating an imaging unit 30 (Matsuden C130-B) and an objective lens 20 (H514-MP2) into such a housing 10.

[0044] Figure 8 shows a table showing the specifications of the light-transmitting members of the above Examples 1 to 4. As shown in the figure, here, as the specifications of the light-transmitting member 113, the concentration of the phosphor, the thickness of the light-transmitting member 113, the transmittance of deep ultraviolet light and visible light, and the ratio of diffused light to the total transmittance are shown.

[0045] FIG. 9 is a graph showing the analysis result of the image obtained by imaging the light emitted from the light transmissive member 113 of Example 3. This figure is a graph in which the intensity at the center position of the light emitting portion in the captured image (not shown) is normalized to 1, and the intensity of the light imaged in the horizontal direction of the image with this point as the center is plotted. Note that since the intensity of the light after normalization decreases according to the cosine law, in this figure, the plot is corrected by multiplying by cos 4θ. When the analysis result obtained in this way is compared with the result of standard measurement which is the measurement result by a goniometer according to JIS C 8105-5, a good agreement was seen. In particular, for the light distribution within ±45 degrees which is important for inactivation of the object surface etc., a very good agreement was seen.

[0046] FIG. 10 is a graph showing the analysis result of the image obtained by imaging the light emitted from the fluorescent glass plate of Comparative Example 1. Since the fluorescent glass of Comparative Example 1 has transparency to visible light, the glass end face and the square deep ultraviolet light emitting diode chip 12 were also imaged and appeared in the image (not shown), and the plot after correction had a large deviation from the standard measurement. Therefore, it was found that the fluorescent glass of Comparative Example 1 is not suitable for the light distribution of the deep ultraviolet light in the deep ultraviolet light source inspection apparatus 1.

[0047] As described below, Comparative Examples 2 and 3 show that the above analysis results are not caused simply by diffusive transmissivity and / or visible light transmissivity.

[0048] FIG. 11 is a graph showing the analysis result of the image obtained by imaging the light emitted from the smooth quartz glass plate of Comparative Example 2. That is, the smooth quartz glass plate of Comparative Example 2 is a smooth synthetic quartz glass which has the same visible light transparency as Comparative Example 1 but does not emit light by a phosphor. If the deep ultraviolet light passes through the glass plate as deep ultraviolet light without being converted to visible light by the phosphor, it will not be converted to a distribution reflecting the light distribution, so only the linear component of the deep ultraviolet light reaching the imaging unit 30 linearly is strongly detected, and the component of the light in the diffused direction is significantly attenuated before reaching the imaging unit 30, resulting in a plot that does not substantially reflect the light distribution of the deep ultraviolet light emitting diode chip 12.

[0049] FIG. 12 shows the analysis results of Comparative Example 3 using a synthetic quartz glass plate in the form of a sliglass that has the same diffusion transmissivity as in Example 3 but does not emit light due to a phosphor. The sliglass-shaped synthetic quartz glass plate can have its light distribution inspected for light from a visible light source. However, for deep ultraviolet light from a deep ultraviolet light source, even though the deep ultraviolet light can be diffused, it passes through the synthetic quartz glass plate as deep ultraviolet light without being converted into visible light. For this reason, in the deep ultraviolet light source inspection apparatus 1 using a lens made of crown glass or an imaging device made of Si-CMOS or Si-CCD, a distribution reflecting the light distribution cannot be obtained, and only the deep ultraviolet light that linearly reaches the imaging unit 30 is strongly detected. Also, since the wavelengths of the transmitted light forming the captured image and the light diffusely reflected from the inner surface of the housing 10 are the same, there is no sensitivity difference between the two at the imaging unit 30, and it can be seen that a distorted plot affected by the internal structure of the housing 10 results.

[0050] FIG. 13 shows a table summarizing the analysis results shown in FIGS. 8 to 11 above. As can be seen from the table, Comparative Examples 1 to 3 do not satisfy the compatibility conditions as the light-transmitting member 113 for inspecting the light distribution of the deep ultraviolet light-emitting diode chip 12 in the deep ultraviolet light source inspection apparatus 1. In this example, the analysis results shown in Example 3 are presented, but Examples 1, 2, and 4 also satisfy the compatibility conditions as the light-transmitting member 113 for inspecting the light distribution of the deep ultraviolet light-emitting diode chip 12 in the deep ultraviolet light source inspection apparatus 1.

[0051] The above-described embodiments are examples for explaining the present invention, and the present invention is not intended to be limited only to these embodiments. The present invention can be implemented in various forms without departing from its gist.

[0052] For example, in the method disclosed in this specification, steps, operations, or functions may be performed in parallel or in a different order, as long as the results do not conflict. The described steps, operations, and functions are provided as mere examples, and some of the steps, operations, and functions may be omitted, combined with each other to form one, or other steps, operations, or functions may be added, without departing from the gist of the invention.

[0053] In addition, although various embodiments are disclosed in this specification, specific features (technical matters) in one embodiment can be added to other embodiments while appropriately improving them, or replaced with specific features in other embodiments, and such forms are also included in the gist of the present invention.

Explanation of Reference Numerals

[0054] 1…Deep ultraviolet light source inspection device 10…Housing 11…Loading tray section 111…Stage 112…Gripping section 113…Light-transmitting member 12…Deep ultraviolet light-emitting diode chip 20…Objective lens 30…Imaging section 401,501,601…Detector 402…Detector slit 403,503…Incident light slit 502…Integrating sphere unit S…Sample

Claims

1. A deep ultraviolet light source inspection apparatus for inspecting deep ultraviolet light emitted from a deep ultraviolet light source to be inspected, comprising: a stage for mounting the deep ultraviolet light source; a translucent member provided on the stage so as to face the deep ultraviolet light source and containing a phosphor that converts the deep ultraviolet light emitted from the deep ultraviolet light source into light of a predetermined wavelength; an imaging unit including an imaging device that receives the light emitted from the deep ultraviolet light source and converted from the deep ultraviolet light through the translucent member; wherein the translucent member is configured such that a ratio of diffused transmitted light to total transmitted light at a peak wavelength of the light emitted by the phosphor is 50% or more, and a transmittance of a direct component at the peak wavelength of the light emitted by the phosphor due to irradiation with the deep ultraviolet light is less than 5%. Deep ultraviolet light source inspection apparatus.

2. Further comprising an objective lens provided between the translucent member and the imaging unit, The deep ultraviolet light source inspection apparatus according to claim 1.

3. The objective lens is made of optical glass having a transmittance of 2% / cm or less with respect to the deep ultraviolet light having a wavelength of 280 nm or less, The deep ultraviolet light source inspection apparatus according to claim 2.

4. The peak wavelength of the light emitted by the phosphor of the translucent member is longer than the peak wavelength of the deep ultraviolet light, and the transmittance of the translucent member is 2% or less. The deep ultraviolet light source inspection apparatus according to claim 1.

5. The peak wavelength is in the range of 400 nm to 650 nm, The deep ultraviolet light source inspection apparatus according to claim 4.

6. The deep ultraviolet light source is a deep ultraviolet light emitting diode chip capable of emitting the deep ultraviolet light, The deep ultraviolet light source inspection apparatus according to claim 1.

7. It is configured to be connectable to an information processing device for image analysis based on an image signal output from the imaging unit, The deep ultraviolet light source inspection apparatus according to claim 1.

8. A translucent member used in a deep ultraviolet light source inspection apparatus for inspecting deep ultraviolet light emitted from a deep ultraviolet light source to be inspected, comprising: a phosphor that converts the deep ultraviolet light emitted from the deep ultraviolet light source into light of a predetermined wavelength; a ratio of diffused transmitted light to total transmitted light at a peak wavelength of the light emitted by the phosphor is 50% or more; and is configured such that a transmittance of a direct component at the peak wavelength of the light emitted by the phosphor due to irradiation with the deep ultraviolet light is less than 5%. Translucent member.

Images