Electronic component

Abstract

To provide an electronic component configured to facilitate the conveyance of chip components.SOLUTION: An electronic component 1 includes an element body 2, an inner conductor, and a pair of external electrodes 10 and 20. The element body 2 has a first surface and at least one second surface. The inner conductor is in the element body 2. The pair of external electrodes 10 and 20 are provided in the first surface. In the electronic component 1, irregular parts 45, 55, and 65 are provided. The first surface and the second surface intersect with each other or face each other. The irregular parts 45, 55, and 65 have a groove extending in a direction along the first surface and includes a second surface.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to electronic components.

Background Art

[0002] An electronic component including a body, an internal conductor provided inside the body, and a pair of external electrodes is known (for example, Patent Document 1). For example, the pair of external electrodes is provided on the bottom surface of the body.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When manufacturing the above-described electronic component, a large number of chip components are automatically transported by a machine. In this case, a large number of chip components are aligned and held by vacuum suction and transported. In a configuration where the pair of external electrodes is provided on the bottom surface of the body, when an outer surface different from the bottom surface provided with the external electrodes is vacuum-sucked, the force adsorbed on the adsorption surface by vacuum suction increases. As a result, the frictional force caused by vacuum suction increases, and there is a risk that the transportation of the chip component stops due to the frictional force. Therefore, there is a risk that the production throughput decreases.

[0005] One aspect of the present invention aims to provide an electronic component configured to facilitate the transportation of chip components.

Means for Solving the Problems

[0006] An electronic component according to one aspect of the present invention includes a body, an internal conductor, and a pair of external electrodes. The body has a first surface and at least one second surface. The internal conductor is provided inside the body. The pair of external electrodes is provided on the first surface. In this electronic component, a concavo-convex portion is provided. The first surface and the second surface intersect or face each other. The concavo-convex portion forms a groove extending in a direction along the first surface and includes the second surface.

[0007] In this electronic component, a concavo-convex portion is provided, and the concavo-convex portion forms a groove extending in a direction along the first surface on which the pair of external electrodes is provided. In this case, even if the second surface side different from the first surface on which the external electrodes are provided is vacuum-sucked, the force adsorbed on the adsorption surface by the vacuum suction can be suppressed. Further, when the chip component forming the electronic component moves along the groove, the chip component can move smoothly with respect to the adsorption surface. As a result, the chip component can be easily transported.

[0008] In the above aspect, the length of the body in the first direction may be larger than the length of the body in the second direction and the length of the body in the third direction. The first direction is along the first surface and the second surface. The second direction is orthogonal to the first surface. The third direction is orthogonal to the first direction and the second direction. The groove may extend in the first direction. In this case, when the chip component forming the electronic component moves in the longitudinal direction of the body, the chip component can move more smoothly with respect to the adsorption surface. As a result, the chip component can be transported more easily.

[0009] In the above aspect, the first surface and the second surface may extend in a direction intersecting each other. In this case, when the chip component is transported, even if it is vacuum-sucked on the surface side adjacent to the pair of external electrodes, the chip component can be easily transported.

[0010] In one of the above aspects, the first surface and the second surface may face each other. In this case, even if the chip component is vacuum-sucked on the side opposite to the surface provided with the pair of external electrodes during the conveyance of the chip component, the chip component can be easily conveyed.

[0011] In one of the above aspects, the concavo-convex portion may include a first portion and a second portion. The first portion may be formed of a material different from that of the base body. The second portion may be formed by the base body. The first portion and the second portion may be alternately arranged in a direction intersecting the first surface. In this case, the groove extending in the direction along the first surface can be formed more easily and reliably by the concavo-convex portion.

[0012] In one of the above aspects, the first portion may be formed of a metal material. In this case, the strength can be ensured and it can be easily configured.

Advantages of the Invention

[0013] One aspect of the present invention provides an electronic component in which the conveyance of a chip component is easily configured.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Mode for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements are denoted by the same reference numerals, and redundant descriptions are omitted.

[0016] First, with reference to FIGS. 1 to 5, an overview of the electronic component in an example of the present embodiment will be described. FIG. 1 is a perspective view of the electronic component in the present embodiment. FIG. 2 is a perspective view showing the internal conductor of the electronic component. FIGS. 3 and 4 are side views showing the internal conductor of the electronic component. FIG. 5 is a plan view showing the internal conductor of the electronic component. The electronic component in the present embodiment is, for example, a multilayer electronic component. The electronic component 1 is, for example, a coil component. The electronic component in the present embodiment is not limited to a coil component, and may be, for example, a capacitor or the like. Hereinafter, the coil component will be described as an example of the electronic component 1. In the present embodiment, the "chip component" is an electronic component during manufacturing or before shipment.

[0017] The electronic component 1 includes a body 2, a pair of external electrodes 10 and 20, and an internal conductor 30. In the example shown in this embodiment, the electronic component 1 further includes guide portions 40, 50, and 60. The electronic component 1 has an outer surface 5. The outer surface 5 is formed by the body 2, the pair of external electrodes 10 and 20, and the guide portions 40, 50, and 60. The outer surface 5 includes at least one plane.

[0018] The body 2 has end faces 2a and 2b, side faces 2c, 2d, 2e, 2f, side faces 2g, 2h. The pair of end faces 2a and 2b face each other in the X-axis direction. The side face 2c and the side face 2e face each other in the Y-axis direction. The side face 2d and the side face 2f face each other in the Y-axis direction. The side face 2c and the side face 2d are located on the same side of the electronic component 1. The side face 2c and the side face 2d are arranged in the Z-axis direction. The side face 2e and the side face 2f are located on the same side of the electronic component 1. The side face 2e and the side face 2f are arranged in the Z-axis direction.

[0019] The X-axis direction is along the side faces 2c, 2d, 2e, 2f, and the side faces 2g, 2h. The Z-axis direction is orthogonal to the side face 2h. The Y-axis direction is orthogonal to the X-axis direction and the Z-axis direction. The length of the body 2 in the X-axis direction is greater than the length of the body 2 in the Y-axis direction and the length of the body 2 in the Z-axis direction. That is, the body 2 has a column shape.

[0020] The pair of end faces 2a and 2b are connected to the side faces 2c, 2d, 2e, 2f, 2g, 2h. The side faces 2c, 2d, 2e, 2f, 2g, 2h and the pair of end faces 2a and 2b intersect with each other. The side face 2h is connected to both of the pair of end faces 2a and 2b. The side face 2g and the side face 2h face each other in the Z-axis direction.

[0021] In the example shown in this embodiment, each of the end faces 2a and 2b, the side faces 2c, 2d, 2e, 2f, and the side faces 2g, 2h is a plane. In the example shown in this embodiment, the side face 2h corresponds to the first face, and the side faces 2c, 2d, 2e, 2f, 2g correspond to at least one second face.

[0022] In an example shown in this embodiment, the base body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a shape of a rectangular parallelepiped with chamfered corners and edges, and a shape of a rectangular parallelepiped with rounded corners and edges. The base body 2 has a smaller length in the Z-axis direction than in the X-axis direction. The base body 2 has a smaller length in the Y-axis direction than in the Z-axis direction. The X-axis direction corresponds to the longitudinal direction, the Y-axis direction corresponds to the width direction, and the Z-axis direction corresponds to the height direction.

[0023] The base body 2 has, for example, insulation. The base body 2 is made of, for example, a magnetic material. The magnetic material includes, for example, at least one selected from a Ni-Cu-Zn-based ferrite material, a Ni-Cu-Zn-Mg-based ferrite material, and a Ni-Cu-based ferrite material. The magnetic material constituting the base body 2 may include an Fe alloy or the like. The base body 2 may be made of a non-magnetic material. The non-magnetic material includes, for example, at least one selected from a glass ceramic material and a dielectric material.

[0024] A pair of external electrodes 10 and 20 are arranged in the same plane. For example, the pair of external electrodes 10 and 20 are arranged on the same side surface 2h. The pair of external electrodes 10 and 20 are arranged, for example, at both ends of the side surface 2h of the base body 2 in the X-axis direction. The pair of external electrodes 10 and 20 are spaced apart from each other and arranged in the X-axis direction. Each external electrode 10 and 20 has, for example, a rectangular shape in plan view.

[0025] Each of the external electrodes 10 and 20 is formed by a known technique. For example, each of the external electrodes 10 and 20 is formed by sputtering. As a modification of this embodiment, each of the external electrodes 10 and 20 may be formed by plating. The plating process may be electroless plating or electrolytic plating. Electrolytic plating may be performed after electroless plating. As a modification of this embodiment, each of the external electrodes 10 and 20 includes, for example, a resin electrode. Each of the external electrodes 10 and 20 may consist only of a resin electrode, for example. As a modification of this embodiment, each of the external electrodes 10 and 20 may be formed by drying after an electrode paste is applied to the base body 2. The electrode paste is, for example, a silver paste. As a modification of this embodiment, each of the external electrodes 10 and 20 may be solder. Each of the external electrodes 10 and 20 may be formed by a combination of the various techniques described above. Further plating may be performed on the external electrodes 10 and 20 formed by the various techniques described above.

[0026] The internal conductor 30 is provided in the base body 2. The internal conductor 30 includes a coil CL and a pair of end portions 31 and 32. The coil CL forms a coil axis CA along, for example, the Z-axis direction. In other words, the coil axis CA of the coil CL extends in the Z-axis direction. The internal conductor 30 electrically connects the external electrode 10 and the external electrode 20 via the coil CL and the pair of end portions 31 and 32.

[0027] The pair of end portions 31, 32 are each connected to the coil CL. At least a part of the pair of end portions 31, 32 is exposed from the base body 2 on the side surface 2h, respectively. In the present disclosure, "connection" includes the meaning of being physically connected and the meaning of being physically separated but electrically connected. "Physically connected" includes the meaning of a state where separate members are in contact with each other and the meaning of a state of being integrated. "Electrically connected" means being electrically conductive. "Connected" means being integrated by the same material or different materials. In other words, "connected" means being continuously formed.

[0028] The pair of end portions 31, 32 are spaced apart from each other. The pair of end portions 31, 32 are each connected to different external electrodes 10, 20, respectively. Each end portion 31, 32 forms a pair of tips of the coil CL. The pair of end portions 31, 32 are exposed from the base body 2 on the same side surface 2h. For example, the end portion 31 is connected to the external electrode 10 on the side surface 2h, and the end portion 32 is connected to the external electrode 20 on the side surface 2h.

[0029] The coil CL includes a plurality of coil conductor layers 35 and a plurality of vias 37, 39. The coil conductor layers 35 and the plurality of vias 37, 39 correspond to internal conductor layers. The plurality of coil conductor layers 35 are stacked in the Z-axis direction and are electrically connected to each other. For example, the coil CL is formed in a spiral shape by the plurality of coil conductor layers 35 and the plurality of vias 37, 39. The end portion 31 and the end portion 32 are each connected to the outermost layer in the Z-axis direction among the plurality of coil conductor layers 35. The end portion 31 is connected to the coil conductor layer 35 closest to the side surface 2h among the plurality of coil conductor layers 35. The end portion 32 is connected to the coil conductor layer 35 closest to the side surface 2g among the plurality of coil conductor layers 35.

[0030] The plurality of vias 37 and the plurality of vias 39 are arranged at rotationally symmetric positions with respect to each other when viewed from the Z-axis direction. Each of the plurality of vias 37, 39 extends in the Z-axis direction. The plurality of vias 37 are arranged so as to overlap each other in the Z-axis direction. The plurality of vias 39 are arranged so as to overlap each other in the Z-axis direction.

[0031] The coil CL, the plurality of vias 37, 39, and the pair of end portions 31, 32 are made of a conductive material. The conductive material contains, for example, at least one selected from Ag and Pd.

[0032] The guide portion 40 includes a long guide 41 and a guide 42. As shown in FIG. 6(a), the guide 41 and the guide 42 are separated from each other and face each other in the Y-axis direction. The guide 41 and the guide 42 each extend in the X-axis direction along the side surface 2g.

[0033] The guide 41 and the guide 42 protrude in the Z-axis direction from the side surface 2g. In each of the guide 41 and the guide 42, the portion protruding in the Z-axis direction from the side surface 2g extends in the X-axis direction along the side surface 2g. The length of each of the guide 41 and the guide 42 in the X-axis direction is smaller than the length of the element body 2 in the X-axis direction and larger than the lengths of the element body 2 in the Y-axis direction and the Z-axis direction. The guides 41, 42 are formed of a material different from that of the element body 2. The guide 41 and the guide 42 are formed of, for example, a metal material.

[0034] The electronic component 1 is provided with uneven portions 45. The uneven portions 45 are formed by the guide 41, the guide 42, and the side surface 2g of the base body 2, and extend in the X-axis direction along the side surface 2g. The uneven portions 45 include the side surface 2g. The uneven portions 45 form a groove V1. The groove V1 is formed by the guide 41, the guide 42, and the side surface 2g of the base body 2. The groove V1 extends in the X-axis direction along the side surface 2g between the guide 41 and the guide 42. The side surface 2g forms the bottom surface of the groove V1. The uneven portions 45 include a first portion and a second portion formed of a material different from that of the first portion. The guide 41 and the guide 42 correspond to the first portion, and the side surface 2g of the base body 2 corresponds to the second portion. In the uneven portions 45, the first portion and the second portion are alternately arranged in the Y-axis direction.

[0035] The guide portion 50 includes a long guide 51, a guide 52, and a guide 53. The guide 51, the guide 52, and the guide 53 face each other in the Z-axis direction. The guide 51, the guide 52, and the guide 53 each extend in the X-axis direction along the side surface 2e and the side surface 2f. The guide 51 and the guide 52 protrude from the side surface 2e in the Y-axis direction. In each of the guide 51 and the guide 52, the portion protruding from the side surface 2e in the Y-axis direction extends in the X-axis direction along the side surface 2e. The guide 52 and the guide 53 protrude from the side surface 2f in the Y-axis direction. In each of the guide 52 and the guide 53, the portion protruding from the side surface 2f in the Y-axis direction extends in the X-axis direction along the side surface 2f.

[0036] The length of each of the guides 51, 52, and 53 in the X-axis direction is greater than the length of the body 2 in the X-axis direction, Y-axis direction, and Z-axis direction. The guide 51 includes a protruding portion 51a that protrudes in the X-axis direction from the end faces 2a and 2b. The guide 52 includes a protruding portion 52a that protrudes in the X-axis direction from the end faces 2a and 2b. The guide 53 includes a protruding portion 53a that protrudes in the X-axis direction from the end faces 2a and 2b. The guides 51, 52, and 53 are formed of a material different from that of the body 2. The guides 51, 52, and 53 are formed of, for example, a metal material.

[0037] The electronic component 1 is provided with uneven portions 55. The uneven portions 55 are formed by the guides 51, 52, and 53 and the side faces 2e and 2f of the body 2, and extend in the X-axis direction along the side faces 2e and 2f. The uneven portions 55 include the side faces 2e and 2f. The uneven portions 55 form grooves V2 and V3. The groove V2 is formed by the guide 51, the guide 52, and the side face 2e of the body 2. The groove V2 extends in the X-axis direction along the side face 2e between the guide 51 and the guide 52. The groove V3 is formed by the guide 52, the guide 53, and the side face 2f of the body 2. The groove V3 extends in the X-axis direction along the side face 2f between the guide 52 and the guide 53. The side face 2e forms the bottom surface of the groove V2. The side face 2f forms the bottom surface of the groove V3. The guide 52 is disposed between the side face 2e and the side face 2f. The uneven portions 55 include a first portion and a second portion formed of a material different from that of the first portion. The guides 51, 52, and 53 correspond to the first portion, and the side faces 2e and 2f of the body 2 correspond to the second portion. In the uneven portions 55, the first portion and the second portion are alternately arranged in a direction intersecting the side face 2h.

[0038] The guide portion 60 includes a long guide 61, a guide 62, and a guide 63. The guides 61, 62, and 63 extend in the X-axis direction along the side surface 2c and the side surface 2d, respectively. The guides 61 and 62 protrude in the Y-axis direction from the side surface 2c. In each of the guides 61 and 62, the portion protruding in the Y-axis direction from the side surface 2c extends in the X-axis direction along the side surface 2c. The guides 62 and 63 protrude in the Y-axis direction from the side surface 2d. In each of the guides 62 and 63, the portion protruding in the Y-axis direction from the side surface 2d extends in the X-axis direction along the side surface 2d.

[0039] The guides 61, 62, and 63 face each other in the Z-axis direction. The length of each of the guides 61, 62, and 63 in the X-axis direction is greater than the length of the base body 2 in the X-axis direction, Y-axis direction, and Z-axis direction. The guide 61 includes a protruding portion 61a protruding in the X-axis direction from the end surfaces 2a and 2b. The guide 62 includes a protruding portion 62a protruding in the X-axis direction from the end surfaces 2a and 2b. The guide 63 includes a protruding portion 63a protruding in the X-axis direction from the end surfaces 2a and 2b. The guides 61, 62, and 63 are formed of a material different from that of the base body 2. The guides 61, 62, and 63 are formed of, for example, a metal material.

[0040] The electronic component 1 is provided with uneven portions 65. The uneven portions 65 are formed by the guides 61, 62, 63 and the side surfaces 2c, 2d of the base body 2, and extend in the X-axis direction along the side surfaces 2c, 2d. The uneven portions 65 include the side surfaces 2c, 2d. The uneven portions 65 form grooves V4, V5. The groove V4 is formed by the guide 61, the guide 62, and the side surface 2c of the base body 2. The groove V4 extends in the X-axis direction along the side surface 2c between the guide 61 and the guide 62. The groove V5 is formed by the guide 62, the guide 63, and the side surface 2d of the base body 2. The groove V5 extends in the X-axis direction along the side surface 2d between the guide 62 and the guide 63. The side surface 2c forms the bottom surface of the groove V4. The side surface 2d forms the bottom surface of the groove V5. The guide 62 is disposed between the side surface 2c and the side surface 2d. The uneven portions 65 include a first portion and a second portion formed of a material different from that of the first portion. The guides 61, 62, and 63 correspond to the first portion, and the side surfaces 2c, 2d of the base body 2 correspond to the second portion. In the uneven portions 65, the first portion and the second portion are alternately arranged in a direction intersecting the side surface 2h.

[0041] FIG. 6(b) shows an electronic component 1A as a modification of the present embodiment. This modification is generally similar or the same as the electronic component 1 in the above-described embodiment. The differences between the above-described embodiment and the modification will be mainly described. The electronic component 1A includes a pair of guides 41A and a pair of guides 42A instead of the guides 41 and 42. The guides 41A and 42A are spaced apart from each other and face each other in the Y-axis direction. The pair of guides 41A are spaced apart from each other and arranged in the X-axis direction. The pair of guides 41B are spaced apart from each other and arranged in the X-axis direction. Each of the guides 41A and each of the guides 42A extend in the X-axis direction along the side surface 2g, respectively.

[0042] A pair of guides 41A and a pair of guides 42A protrude in the Z-axis direction from the side surface 2g. In each guide 41A and each guide 42, the portion protruding in the Z-axis direction from the side surface 2g extends in the X-axis direction along the side surface 2g. Each guide 41A and each guide 42A are formed of, for example, metal.

[0043] The electronic component 1A is provided with uneven portions 45A. A pair of uneven portions 45A are formed by the guides 41A, the guides 42A, and the side surface 2g of the base body 2, and extend in the Z-axis direction along the side surface 2h. The uneven portion 45A forms a groove V10. The groove V10 is formed by a pair of guides 41A, a pair of guides 42A, and the side surface 2g of the base body 2. The groove V10 extends in the Z-axis direction along the side surface 2g between the pair of guides 41A and the pair of guides 42A. The side surface 2e of the electronic component 1A forms the bottom surface of the groove V10.

[0044] Next, with reference to FIGS. 7 to 11, the electronic component 1B in the modification of the present embodiment will be described. FIG. 7 is a perspective view of the electronic component in the modification of the present embodiment. FIG. 8 is a perspective view showing the internal conductor of the electronic component. FIGS. 9 and 10 are side views showing the internal conductor of the electronic component. FIG. 11 is a plan view showing the internal conductor of the electronic component. This modification is generally similar or the same as the electronic component 1 in the above-described embodiment. The electronic component 1B of this modification differs from the above-described embodiment in that the outer shape is different from that of the electronic component 1. Hereinafter, the differences between the above-described embodiment and the modification will be mainly described.

[0045] The electronic component 1B includes a base body 2, a pair of external electrodes 10 and 20, an internal conductor 30, and covers 71, 72, 73, and 74. The electronic component 1B has an outer surface 5B. The outer surface 5B is formed by the base body 2, a pair of external electrodes 10 and 20, and covers 71, 72, 73, and 74. The covers 71, 72, 73, and 74 are formed of a material different from that of the base body 2. The covers 71, 72, 73, and 74 are formed of, for example, a metal material. The outer surface 5 includes at least one plane.

[0046] The body 2 of the electronic component 1B includes rib portions 80, 90, and 100. The body 2 of the electronic component 1B has end faces 2a, 2b, side faces 2c, 2d, 2e, 2f, side faces 2g, 2h, rib faces 2i, 2j, rib faces 2k, 2m, 2n, and rib faces 2p, 2q, 2r. The pair of end faces 2a, 2b face each other in the X-axis direction. The side face 2c and the side face 2e face each other in the Y-axis direction. The side face 2d and the side face 2f face each other in the Y-axis direction. The side face 2c and the side face 2d are located on the same side of the electronic component 1. The side face 2c and the side face 2d are arranged in the Z-axis direction. The side face 2e and the side face 2f are located on the same side of the electronic component 1. The side face 2e and the side face 2f are arranged in the Z-axis direction.

[0047] The X-axis direction is along the side faces 2c, 2d, 2e, 2f, the side faces 2g, 2h, the rib faces 2i, 2j, the rib faces 2k, 2m, 2n, and the rib faces 2p, 2q, 2r. The Z-axis direction is orthogonal to the side face 2h. The Y-axis direction is orthogonal to the X-axis direction and the Z-axis direction. The length of the body 2 in the X-axis direction is greater than the length of the body 2 in the Y-axis direction and the length of the body 2 in the Z-axis direction. That is, the body 2 has a columnar shape.

[0048] The pair of end faces 2a, 2b are connected to the side faces 2c, 2d, 2e, 2f, 2g, 2h. The side faces 2c, 2d, 2e, 2f, 2g, 2h and the pair of end faces 2a, 2b intersect each other. The side face 2h is connected to both of the pair of end faces 2a, 2b. The side face 2g and the side face 2h face each other in the Z-axis direction.

[0049] In the example shown in this embodiment, each of the end faces 2a, 2b, the side faces 2c, 2d, 2e, 2f, and the side faces 2g, 2h is a plane. In the example shown in this embodiment, the side face 2h corresponds to the first face, and the side faces 2c, 2d, 2e, 2f, 2g correspond to at least one second face.

[0050] The rib portion 80 includes ribs 81 and 82. The ribs 81 and 82 are spaced apart from each other and face each other in the Y-axis direction. The ribs 81 and 82 each extend in the X-axis direction along the side surface 2g. The ribs 81 and 82 protrude from the side surface 2g in the Z-axis direction. In each of the ribs 81 and 82, the portion protruding from the side surface 2g in the Z-axis direction extends in the X-axis direction along the side surface 2g. The length of each of the ribs 81 and 82 in the X-axis direction is greater than the length of the main body 2 in the Y-axis and Z-axis directions.

[0051] The ribs 81, 82 are formed by the main body 2. The rib 81 has a rib surface 2i. The rib 82 has a rib surface 2j. When viewed from the Z-axis direction, the rib surface 2i, the side surface 2g, and the rib surface 2j are arranged in the Y-axis direction.

[0052] The electronic component 1 is provided with uneven portions 85. The uneven portions 85 are formed by the rib 81, the rib 82, and the side surface 2g of the main body 2, and extend in the X-axis direction along the side surface 2g. The uneven portions 85 include the side surface 2g, the rib surface 2i, and the rib surface 2j.

[0053] The uneven portions 85 form grooves V21. The grooves V21 are formed by the rib 81, the rib 82, and the side surface 2g of the main body 2. The grooves V21 extend in the X-axis direction along the side surface 2g between the ribs 81 and 82. The side surface 2g forms the bottom surface of the grooves V21. The uneven portions 85 include a first portion and a second portion formed of a material different from that of the first portion. The rib surface 2i of the rib 81 and the rib surface 2j of the rib 82 correspond to the first portion, and the side surface 2g of the main body 2 corresponds to the second portion. In the uneven portions 85, the first portion and the second portion are alternately arranged in the Y-axis direction.

[0054] The rib portion 90 includes ribs 91, 92, and 93. Ribs 91, 92, and 93 face each other in the Z-axis direction. Ribs 91, 92, and 93 each extend in the X-axis direction along side surfaces 2e and 2f. Ribs 91 and 92 protrude in the Y-axis direction from side surface 2e. In each of ribs 91 and 92, the portion protruding in the Y-axis direction from side surface 2e extends in the X-axis direction along side surface 2e. Ribs 92 and 93 protrude in the Y-axis direction from side surface 2f. In each of ribs 92 and 93, the portion protruding in the Y-axis direction from side surface 2f extends in the X-axis direction along side surface 2f. The length of each of ribs 91, 92, and 93 in the X-axis direction is greater than the length of the main body 2 in the Y-axis and Z-axis directions.

[0055] Ribs 91, 92, and 93 are formed by the main body 2. Rib 91 has a rib surface 2k. Rib 92 has a rib surface 2m. Rib 93 has a rib surface 2nr. When viewed from the Y-axis direction, rib surfaces 2k, 2m, and 2n are arranged in the Z-axis direction.

[0056] The electronic component 1B is provided with uneven portions 95. The uneven portions 95 are formed by ribs 91, 92, and 93 and covers 71, 72, and extend in the X-axis direction along side surfaces 2e, 2f.

[0057] Cover 71 covers side surface 2e and extends in the X-axis direction while being sandwiched between ribs 91 and 92. Cover 71 has a cover outer surface 71a. The cover outer surface 71a has a concave shape curved toward side surface 2e in a cross-section in the YZ-axis direction. Ribs 91 and 92 protrude more in the Y-axis direction from side surface 2e than cover 71.

[0058] The cover 72 covers the side surface 2f and extends in the X-axis direction while being sandwiched between the rib 92 and the rib 93. The cover 72 has a cover outer surface 72a. The cover outer surface 72a presents a concave shape curved toward the side surface 2f in a cross-section in the YZ-axis direction. The rib 92 and the rib 93 protrude in the Y-axis direction from the side surface 2f more than the cover 72. The uneven portion 95 includes the rib surfaces 2k, 2m, 2n and the cover outer surfaces 71a, 72a.

[0059] The uneven portion 95 forms grooves V22 and V23. The groove V22 is formed by the rib 91, the rib 92, and the cover 71. The groove V22 extends in the X-axis direction along the side surface 2e between the rib 91 and the rib 92. The groove V23 is formed by the rib 92, the rib 93, and the cover 72. The groove V23 extends in the X-axis direction along the side surface 2f between the rib 92 and the rib 93.

[0060] The cover outer surface 71a forms the bottom surface of the groove V22. The cover outer surface 72a forms the bottom surface of the groove V23. The rib 92 is disposed between the cover outer surface 71a and the cover outer surface 72a. The uneven portion 95 includes a first portion and a second portion formed of a material different from the first portion. The cover 71 and the cover 72 correspond to the first portion, and the rib 91, the rib 92, and the rib 93 correspond to the second portion. In the uneven portion 95, the first portion and the second portion are alternately arranged in a direction intersecting the side surface 2h.

[0061] The rib portion 100 includes ribs 101, 102, and 103. Ribs 101, 102, and 103 face each other in the Z-axis direction. Ribs 101, 102, and 103 each extend in the X-axis direction along side surfaces 2c and 2d. Ribs 101 and 102 protrude in the Y-axis direction from side surface 2c. In each of ribs 101 and 102, the portion protruding in the Y-axis direction from side surface 2c extends in the X-axis direction along side surface 2c. Ribs 102 and 103 protrude in the Y-axis direction from side surface 2d. In each of ribs 102 and 103, the portion protruding in the Y-axis direction from side surface 2d extends in the X-axis direction along side surface 2d. The length of each of ribs 101, 102, and 103 in the X-axis direction is greater than the length of the main body 2 in the Y-axis and Z-axis directions.

[0062] Ribs 101, 102, and 103 are formed by the main body 2. Rib 101 has a rib surface 2p. Rib 102 has a rib surface 2q. Rib 103 has a rib surface 2r. When viewed from the Y-axis direction, rib surfaces 2p, 2q, and 2r are arranged in the Z-axis direction.

[0063] The electronic component 1B is provided with uneven portions 105. The uneven portions 105 are formed by ribs 101, 102, and 103 and covers 73, 74, and extend in the X-axis direction along side surfaces 2c, 2d.

[0064] Cover 73 covers side surface 2c and extends in the X-axis direction while being sandwiched between ribs 101 and 102. Cover 73 has a cover outer surface 73a. The cover outer surface 73a has a concave surface shape curved toward side surface 2c in a cross-section in the YZ-axis direction. Ribs 101 and 102 protrude more in the Y-axis direction from side surface 2c than cover 73.

[0065] Cover 74 covers side surface 2d and extends in the X-axis direction while being sandwiched between rib 102 and rib 103. Cover 74 has a cover outer surface 74a. Cover outer surface 74a presents a concave shape that curves toward side surface 2d in a cross-section in the YZ-axis direction. Rib 102 and rib 103 protrude in the Y-axis direction from side surface 2d more than cover 74. Concavo-convex portion 105 includes rib surfaces 2p, 2q, 2r and cover outer surfaces 73a, 74a.

[0066] Concavo-convex portion 105 forms grooves V24, V25. Groove V24 is formed by rib 101, rib 102, and cover 73. Groove V25 extends in the X-axis direction along side surface 2c between rib 101 and rib 102. Groove V25 is formed by rib 102, rib 103, and cover 74. Groove V25 extends in the X-axis direction along side surface 2d between rib 102 and rib 103.

[0067] Cover outer surface 73a forms the bottom surface of groove V24. Cover outer surface 74a forms the bottom surface of groove V25. Rib 102 is disposed between cover outer surface 73a and cover outer surface 74a. Concavo-convex portion 105 includes a first portion and a second portion formed of a material different from that of the first portion. Cover 73 and cover 74 correspond to the first portion, and rib 101, rib 102, and rib 103 correspond to the second portion. In concavo-convex portion 105, the first portion and the second portion are alternately arranged in a direction intersecting side surface 2h.

[0068] Next, the operation and effects of electronic components 1, 1A, 1B in this embodiment and the modified example will be described.

[0069] FIG. 12(a) and FIG. 12(b) are conceptual diagrams showing a state in which a chip component of a comparative example is being transported by vacuum suction. The chip component 201 includes a body having side surfaces 202c, 202e, 202g, 202h and external electrodes 210. The external electrode 210 is provided on the side surface 202h. External electrodes are not provided on the side surfaces 202c, 202e, 202g, and they exhibit a planar shape. The suction surface 301 sucks an electronic component by vacuum suction for transportation.

[0070] In FIG. 12(a), the chip component 201 is being adsorbed onto the suction surface 301 in the direction α on the side surface 202h side where the external electrode 210 is provided. In this case, a gap is secured between the side surface 202h and the suction surface 301, and the force by which it is adsorbed onto the suction surface by vacuum suction becomes a value within an appropriate range. As a result, the chip component can be appropriately transported in the direction along the side surfaces 202c, 202e, 202g, 202h.

[0071] In FIG. 12(b), the chip component 201 is being adsorbed onto the suction surface 301 in the direction α on the side surface 202c. In this case, the side surface 202c is in close contact with the suction surface 301, and the force by which it is adsorbed onto the suction surface by vacuum suction increases. The frictional force due to vacuum suction increases, and there is a possibility that the transportation of the chip component may stop due to the frictional force.

[0072] In the electronic component 1, uneven portions 45, 55, 65 are provided, and the uneven portions 45, 55, 65 form grooves extending in the X-axis direction along the side surface 2h where a pair of external electrodes 10, 20 are provided. In this case, even if the surface side different from the side surface 2h where the external electrodes 10, 20 are provided is vacuum-sucked, the force by which it is adsorbed onto the suction surface by vacuum suction can be suppressed. Furthermore, when the chip component forming the electronic component 1 moves along the groove, the frictional force can be reduced. As a result, the chip component can be transported smoothly. The electronic component 1A and the electronic component 1B also have the same configuration and exhibit the same operational effects.

[0073] For example, in the example shown in FIG. 13, the chip component of the electronic component 1 is adsorbed on the adsorption surface 301 in the direction α on the side surfaces 2c and 2d. In this case, since the grooves V4 and V5 are formed by the guides 61, 62, and 63, a gap is secured between the side surfaces 2c and 2d and the adsorption surface 301, and the force adsorbed on the adsorption surface by vacuum adsorption becomes a value within an appropriate range. As a result, the chip component can be appropriately conveyed in the X-axis direction along the side surface 2h. Further, since the uneven portion 65 extends in the X-axis direction, when the chip component is conveyed in the X-axis direction, the chip component can smoothly move with respect to the adsorption surface. For example, when the chip component moves along the extending direction of the uneven portion 65, the change in the frictional force generated between the adsorption surface 301 and the electronic component during the conveyance of the chip component is suppressed. When adsorbed on the adsorption surface 301 in the direction α on the side surface 2g side, a gap is secured by the uneven portion 45, and when adsorbed on the adsorption surface 301 in the direction α on the side surfaces 2e and 2f side, a gap is secured by the uneven portion 55.

[0074] In the example shown in FIG. 14, the chip component of the electronic component 1B is adsorbed on the adsorption surface 301 in the direction α on the side surfaces 2c and 2d. In this case, since the grooves V24 and V25 are formed by the ribs 101, 102, 103 and the covers 73, 74, a gap is secured between the side surfaces 2c and 2d and the adsorption surface 301, and the force adsorbed on the adsorption surface by vacuum adsorption becomes a value within an appropriate range. As a result, the chip component can be appropriately conveyed in the X-axis direction along the side surface 2h. Further, since the uneven portion 105 extends in the X-axis direction, when the chip component is conveyed in the X-axis direction, the chip component can smoothly move with respect to the adsorption surface. For example, when the chip component moves along the extending direction of the uneven portion 105, the change in the frictional force generated between the adsorption surface 301 and the electronic component during the conveyance of the chip component is suppressed. When adsorbed on the adsorption surface 301 in the direction α on the side surface 2g side, a gap is secured by the uneven portion 85, and when adsorbed on the adsorption surface 301 in the direction α on the side surfaces 2e and 2f side, a gap is secured by the uneven portion 95.

[0075] In the example shown in this embodiment, the length of the base body 2 in the X-axis direction is greater than the length of the base body 2 in the Y-axis direction and the length of the base body 2 in the Z-axis direction. The X-axis direction is along the side surfaces 2h and 2c, 2d, 2e, 2f, 2g. The Y-axis direction is orthogonal to the side surface 2h. The Z-axis direction is orthogonal to the X-axis direction and the Y-axis direction. The grooves V1, V2, V3, V4, V5 extend in the X-axis direction. In this case, when the chip component forming the electronic component 1 moves in the longitudinal direction of the base body, the frictional force can be reduced. As a result, the chip component can be conveyed more easily. The electronic components 1A, 1B in the modified examples also have the same configuration and exhibit the same operational effects.

[0076] In the example shown in this embodiment, the side surface 2h and the side surfaces 2c, 2d, 2e, 2f extend in directions intersecting with each other. In this case, even if vacuum suction is performed on the surface side adjacent to the pair of external electrodes 10, 20 during the conveyance of the chip component, the chip component can be easily conveyed. The electronic components 1A, 1B in the modified examples also have the same configuration and exhibit the same operational effects.

[0077] In the example shown in this embodiment, the side surface 2h and the side surface 2g face each other. In this case, even if vacuum suction is performed on the side opposite to the side surface 2h provided with the pair of external electrodes 10, 20 during the conveyance of the chip component, the chip component can be easily conveyed. The electronic components 1A, 1B in the modified examples also have the same configuration and exhibit the same operational effects.

[0078] In the example shown in this embodiment, the uneven portions 55, 65 include a first portion and a second portion. The first portion is formed of a material different from that of the base body 2. The second portion is formed by the base body 2. The first portion and the second portion are alternately arranged in a direction intersecting the side surface 2h. In this case, the grooves V2, V3, V4, V5 extending in the direction along the side surface 2h can be formed more easily and surely by the uneven portions 55, 65. The first portion is formed of a metal material. In this case, strength can be ensured and it can be easily configured. The electronic components 1A, 1B in the modified examples also have the same configuration and exhibit the same operational effects.

[0079] As described above, the embodiments and modifications of the present invention have been explained. However, the present invention is not necessarily limited to the above-described embodiments, and various changes are possible without departing from the gist thereof.

[0080] For example, the number of guides in the guide portions of the electronic components 1, 1A, and 1B is not limited to the above-described example. The configurations of the electronic components 1, 1A, and 1B may be combined as appropriate.

[0081] As understood from the description of the above-described embodiments, this specification includes the disclosure of the following aspects. (Appendix 1) A base body having a first surface and at least one second surface, An internal conductor provided in the base body, A pair of external electrodes provided on the first surface, and comprising The first surface and the second surface intersect with each other or face each other, An electronic component provided with a concavo-convex portion that forms a groove extending in a direction along the first surface and includes the second surface. (Appendix 2) The length of the base body in a first direction along the first surface and the second surface is greater than the length of the base body in a second direction orthogonal to the first surface, and the length of the base body in a third direction orthogonal to the first direction and the second direction, The groove extends in the first direction. The electronic component according to Appendix 1. (Appendix 3) The first surface and the second surface extend in a direction intersecting with each other. The electronic component according to Appendix 1 or Appendix 2. (Appendix 4) The first surface and the second surface face each other. The electronic component according to any one of Appendices 1 to 3. (Appendix 5) The concavo-convex portion includes a first portion formed of a material different from that of the base body and a second portion formed by the base body, The electronic component according to any one of Appendices 1 to 4, wherein the first part and the second part are alternately arranged in a direction intersecting the first surface. (Appendix 6) The electronic component according to Appendix 5, wherein the first part is formed of a metal material.

Explanation of Reference Signs

[0082] 1, 1A, 1B... Electronic component, 2... Main body, 10, 20... External electrode, 30... Internal conductor, 45, 45A, 55, 65, 85, 95, 105... Concavo-convex part, V1, V2, V3, V4, V5, V10, V21, V22, V23, V24, V25... Groove, α... Direction.

Claims

1. A base body having a first surface and at least one second surface, an internal conductor provided within the base body, and a pair of external electrodes provided on the first surface, wherein the first surface and the second surface intersect or face each other, and an electronic component provided with a concavo-convex portion that forms a groove extending in a direction along the first surface and includes the second surface.

2. The length of the base body in a first direction along the first surface and the second surface is greater than the length of the base body in a second direction orthogonal to the first surface and the length of the base body in a third direction orthogonal to the first direction and the second direction, and the groove extends in the first direction. The electronic component according to claim 1.

3. The first surface and the second surface extend in a direction intersecting each other. The electronic component according to claim 1.

4. The first surface and the second surface face each other. The electronic component according to claim 1.

5. The concavo-convex portion includes a first portion formed of a material different from that of the base body and a second portion formed by the base body, and the first portion and the second portion are alternately arranged in a direction intersecting the first surface. The electronic component according to any one of claims 1 to 4.

6. The first portion is formed of a metal material. The electronic component according to claim 5.

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