Light-emitting device

Abstract

To provide a light-emitting device and an optical member which are excellent in adhesion between a translucent member and a silicone resin member.SOLUTION: The light-emitting device includes: a light-emitting element; a translucent member arranged on an upper surface of the light-emitting element and containing oxygen atoms; a silicone resin member which covers the translucent member so as to expose at least a part of the upper surface of the translucent member; and a silane coupling agent as an intermediate layer arranged between the translucent member and the silicone resin member.SELECTED DRAWING: Figure 1C

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device and an optical member.

Background Art

[0002] A light-emitting device including a light-emitting element and a translucent member such as a wavelength conversion member, with a white resin such as a silicone resin disposed around the translucent member, is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a light-emitting device and an optical member having excellent adhesion between a translucent member and a silicone resin member.

Means for Solving the Problems

[0005] The present disclosure includes the following configuration. A light-emitting element, A translucent member disposed on the upper surface of the light-emitting element and containing oxygen atoms, A silicone resin member that covers the translucent member such that at least a part of the upper surface of the translucent member is exposed, A silane coupling agent as an intermediate layer disposed between the translucent member and the silicone resin member, And a light-emitting device comprising the same.

Effects of the Invention

[0006] According to an embodiment of the present disclosure, a light-emitting device and an optical member having excellent adhesion between a translucent member and a silicone resin member can be provided.

Brief Description of the Drawings

[0007]

Figure 1A

Figure 1B

Figure 1C

Figure 2A

Figure 2B

Figure 3A

Figure 3B

Figure 4

Figure 5

Figure 6A

Figure 6B

Figure 6C

Figure 6D

Figure 6E

Figure 6F

Mode for Carrying Out the Invention

[0008] Embodiments will be described below with reference to the drawings. However, the forms shown below are examples of a light-emitting device and an optical device for embodying the technical idea of the present embodiment, and are not limited thereto. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention only thereto, but are merely examples, unless otherwise specified. Note that the sizes and positional relationships of the members shown in each drawing may be exaggerated or simplified for clarity of explanation. In addition, in order to avoid excessive complexity of the drawings, illustration of some elements may be omitted, or an end view showing only the cut surface as a cross-sectional view may be used.

[0009] Figs. 1A to 5 are diagrams schematically showing a light-emitting device according to an embodiment. Figs. 6A to 6F are diagrams schematically showing an optical member according to an embodiment.

[0010] The light-emitting device 100 includes a light-emitting element 10, a light-transmissive member 20, a silicone resin member 30, and an intermediate layer 40. The light-transmissive member 20 is disposed on the upper surface of the light-emitting element 10. The light-transmissive member 20 contains oxygen atoms. The silicone resin member 30 covers the light-transmissive member 20 such that at least a part of the upper surface of the light-transmissive member 20 is exposed. The intermediate layer 40 is disposed between the light-transmissive member 20 and the silicone resin member 30.

[0011] As the intermediate layer 40, a silane coupling agent can be used. The adhesion between the intermediate layer 40 and the light-transmissive member 20 can be improved by the chemical bonding between silicon (Si) in the silane coupling agent and oxygen (O) in the light-transmissive member 20. Here, for the oxygen used in the chemical bonding, in addition to the oxygen in the light-transmissive member 20, oxygen contained in the air may also be used.

[0012] In addition, the adhesion between the intermediate layer 40 and the silicone resin member 30 can be improved by the chemical bonding between the hydrolyzable alkoxy group of the silane coupling agent and the silanol group in the silicone resin member. Examples of the hydrolyzable alkoxy group include methoxy type, ethoxy type, dimethoxy type, and trimethoxy type.

[0013] As the intermediate layer 40, an oxide such as an oxide film or oxide particles can be used. The adhesion principle between the light-transmitting member 20 and the intermediate layer 40 differs depending on the formation method of the intermediate layer 40. For example, when forming an oxide film or oxide particles by atomic layer deposition (ALD method), an oxygen atom of a hydroxyl group on the surface of the light-transmitting member 20 and the oxygen of the oxide film or oxide particles form a chemical bond of metal atoms. Also, when forming an oxide film or oxide particles by sputtering method, a high voltage is applied to a target containing an oxide and the light-transmitting member 20, and the ionized inert gas (such as Ar) in the chamber is struck against the target at high speed, and the oxide particles generated by the sputtering phenomenon are attached to the light-transmitting member 20. Thereby, the adhesion between the intermediate layer 40 and the light-transmitting member 20 can be improved.

[0014] Also, the hydroxyl group generated on the surface of the oxide and the hydrogen in the silicone resin member 30 form a hydrogen bond, and the adhesion between the intermediate layer 40 and the silicone resin member 30 can be improved. As the oxide, at least one selected from aluminum oxide (Al2O3), silicon oxide (SiO2), and indium tin oxide (ITO) can be used.

[0015] The light-emitting device 100 can further include a bonding member 70 that bonds the light-emitting element 10 and the light-transmitting member 20, as in the light-emitting device 100A shown in FIG. 1C. Also, as shown in the light-emitting device 100A, a substrate 60 on which the light-emitting element 10 is placed can be further included. The substrate 60 and the light-emitting element 10 are bonded by a conductive bonding member (not shown).

[0016] FIG. 6A is a perspective view schematically showing an optical member 80 according to an embodiment. The optical member 80 is a member that can form a part of the light-emitting device 100. The optical member 80 includes a translucent member 20, a silicone resin member 30, and an intermediate layer 40. The translucent member 20 contains oxygen atoms. The silicone resin member 30 covers the translucent member 20 such that at least a part of the upper surface of the translucent member 20 is exposed. The intermediate layer 40 is disposed between the translucent member 20 and the silicone resin member 30. The intermediate layer 40 is a member capable of improving the adhesion between the translucent member 20 and the silicone resin member 30, and the details are the same as those of the light-emitting device 100 and thus are omitted.

[0017] Hereinafter, each configuration of the light-emitting device and the optical member will be described in detail with reference to the drawings.

[0018] (Light-emitting element) The light-emitting device 100 includes one or more light-emitting elements 10. As the light-emitting element 10, for example, a semiconductor light-emitting element such as a light-emitting diode can be used. The light-emitting element 10 includes a semiconductor laminate 11 and a pair of positive and negative electrodes 12. The semiconductor laminate 11 includes, for example, an element substrate such as sapphire and a semiconductor layer formed thereon. Alternatively, the semiconductor laminate 11 can be composed of only a semiconductor layer without an element substrate. The shape of the light-emitting element 10 in a top view can be a polygon such as a triangle, a quadrilateral, or a hexagon. The size of the light-emitting element 10 can be, for example, 100 μm or more and 3000 μm or less on one side in a top view. Specifically, it can be a square with one side of about 600 μm, about 1000 μm, about 1400 μm, about 1700 μm, etc. Further, the light-emitting element 10 may be a rectangle having a long side and a short side in a top view. For example, it can have a size of 1100 μm × 200 μm. When a plurality of light-emitting elements 10 are provided, the size, emission wavelength, composition, etc. of each light-emitting element 10 may be the same, or some or all of them may be different. Also, all of the plurality of light-emitting elements 10 can be connected in series or in parallel, or can be connected such that series and parallel connections are mixed.

[0019] The semiconductor laminate 11 includes an n-type semiconductor layer, a p-type semiconductor layer, and a light-emitting layer sandwiched therebetween. Such a semiconductor laminate including a light-emitting layer may contain, for example, In x Al y Ga 1-x-y N (0 ≤ x, 0 ≤ y, x + y ≤ 1).

[0020] The semiconductor laminate 11 may have a structure including one or more light-emitting layers between the n-type semiconductor layer and the p-type semiconductor layer, or may have a structure in which a structure including the n-type semiconductor layer, the light-emitting layer, and the p-type semiconductor layer in this order is repeated a plurality of times. When the semiconductor laminate 11 includes a plurality of light-emitting layers, it may include light-emitting layers having different emission peak wavelengths, or may include light-emitting layers having the same emission peak wavelength. Note that the same emission peak wavelength includes cases where there is a variation of about several nm. The combination of emission peak wavelengths between a plurality of light-emitting layers can be appropriately selected. For example, when the semiconductor laminate includes two light-emitting layers, the light-emitting layers can be selected in combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light.

[0021] The light-emitting element 10 includes a pair of positive and negative electrodes 12 on the lower surface of the semiconductor laminate 11. As the electrode 12, an electrically conductive material can be used, and for example, it can be made of gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel, or an alloy thereof. The electrode 12 can include an ohmic electrode in contact with the lower surface of the semiconductor laminate 11 and a pad electrode connected to the ohmic electrode and connected to the outside. The thickness of the electrode can be, for example, 10 μm or more and 50 μm or less.

[0022] (Light-transmissive member) The light-transmissive member 20 contains oxygen atoms. The light-transmissive member 20 is a light-transmissive member arranged to cover the upper surface of the semiconductor laminate 11 of the light-emitting element 10. The light emitted from the light-emitting element 10 is emitted to the outside through the light-transmissive member 20. In the light-emitting device 100 shown in FIG. 1C, the upper surface 20U of the light-transmissive member 20 includes a first upper surface 20U1 and a second upper surface 20U2 located below the first upper surface 20U1. The lower surface 20D on the side opposite to the upper surface 20U of the light-transmissive member 20 faces the upper surface of the light-emitting element 10 directly or via the bonding member 70. Further, a side surface 20S is provided between the upper surface 20U and the lower surface 20D of the light-transmissive member 20. In the example shown in FIG. 1C, a first side surface 20S1 is provided between the first upper surface 20U1 and the second upper surface 20U2, and a second side surface 20S2 is provided between the second upper surface 20U2 and the lower surface 20D.

[0023] In the example shown in FIG. 1B, the silicone resin member 30 disposed on the second upper surface 20U2 of the translucent member 20 and the first upper surface 20U1 have the same area and the same shape. That is, since the second upper surface U2 of the translucent member 20 and the silicone resin member 30 have the same area and the same size, the first upper surface 20U1 and the second upper surface 20U2 have the same area and the same shape. In a top view, the upper surface 20U of the translucent member 20 is generally square, and the first upper surface 20U1 and the second upper surface 20U2 are each rectangular. The first upper surface 20U1 is exposed to the outside. Therefore, it can be a high-brightness light-emitting region capable of emitting high-brightness light. The second upper surface 20U2 is covered with the silicone resin member 30. Therefore, a part of the light emitted from the second upper surface 20U2 can be reflected and guided to the first upper surface 20U1 side and emitted from the first upper surface 20U1. That is, the upper surface of the silicone resin member 30 disposed above the second upper surface 20U2 can be a low-brightness light-emitting region capable of emitting light with a lower brightness than the light emitted from the first upper surface 20U1. The area of the second upper surface 20U2 is preferably, for example, 35% or more and 95% or less of the total area of the upper surface 20U of the translucent member 20. The brightness of the low-brightness light-emitting region can be, for example, 5% or more and 80% or less of the brightness of the high-brightness light-emitting region. By having such a high-brightness light-emitting region and a low-brightness light-emitting region, for example, when the light-emitting device 100 is used for an in-vehicle headlight, it is possible to have a high-brightness region in a desired region of the irradiation region. That is, since a desired light distribution can be obtained without using a complicated optical design such as a reflector or a lens, the headlight can be miniaturized, and the designability of the headlight can be further enhanced.

[0024] Note that the first upper surface 20U1 and the second upper surface 20U2 of the light-transmissive member 20 may have different areas and may also have different shapes. Further, the height of the second upper surface 20U2 of the light-transmissive member 20 (the height from the lower surface 20D of the light-transmissive member 20) can be 20% or more and 90% or less of the height of the first upper surface 20U1 (the height from the lower surface 20D of the light-transmissive member 20). Thereby, even if the second upper surface 20U2 is covered with the silicone resin member 30, light can be emitted to the outside through the silicone resin member 30 having low luminance.

[0025] The first side surface 20S1 and the second upper surface 20U2 may be planes that are continuously connected perpendicular to each other. The first side surface 20S1 and / or the second upper surface 20U2 may have an inclined surface or a curved surface and may be continuously connected through this inclined surface or curved surface. In the light-transmissive member 20 shown in FIG. 1C etc., the second upper surface 20U2 has a curved surface between it and the first side surface 20S1. Thereby, it becomes easier to propagate the light on the second upper surface 20U2 side to the first upper surface 20U1 side in a top view, and it becomes easier to make the luminance on the first upper surface 20U1 side higher. This curved surface is a concave surface that is recessed toward the light-transmissive member 20 side. The radius of curvature of the curved surface is, for example, 5 μm or more and 35 μm or less.

[0026] The side surface 20S (the first side surface 20S1) continuous with the first upper surface 20U1 is preferably a surface perpendicular to the first upper surface 20U1 at the portion continuous with the first upper surface 20U1. Thereby, the luminance difference between the light-emitting region on the upper surface of the light-emitting device 100 and the region surrounding the light-emitting region can be clarified.

[0027] In the light-emitting device 100B shown in FIGS. 2A and 2B, in the top view, the first upper surface 20U1 is located at the center of the translucent member 20, and the second upper surface 20U2 is located around the first upper surface 20U1. In the top view, the size of the first upper surface 20U1 can be 50% or more and 100% or less of the area of the upper surface of the light-emitting element 10. Further, the height of the second upper surface 20U2 of the translucent member 20 (the height from the lower surface 20D of the translucent member 20) can be 5% or more and 40% or less of the height of the first upper surface 20U1 (the height from the lower surface 20D of the translucent member 20). Thereby, it is shielded by the silicone resin member 30 disposed on the second upper surface 20U2, and the silicone resin member 30 does not contribute as a light-emitting surface. That is, only the first upper surface 20U1 can be used as the light-emitting surface. Note that the second upper surface 20U2 does not necessarily have to be located on all of the outer periphery of the first upper surface 20U1. For example, when the translucent member 20 is rectangular in the top view, it can be shaped such that the second upper surface 20U2 is located on the long side of the first upper surface 20U1 and there is no second upper surface 20U2 on the short side.

[0028] As described above, the translucent member 20 including the first upper surface 20U1 and the second upper surface 20U2 can make the silicone resin member 30 disposed on the second upper surface 20U2 a low-luminance light-emitting region or a light-shielding region by adjusting the height of the second upper surface 20U2 or the reflectance (transmittance) of the silicone resin member 30 or the like.

[0029] In the light-emitting device 100E shown in FIG. 5, the upper surface 20U of the translucent member 20 has no second upper surface and has only the first upper surface 20U1. In the example shown in FIG. 5, the translucent member 20 has the same area and shape as the light-emitting element 10 in the top view. However, the present invention is not limited to this, and the translucent member 20 can have a different shape and a different size from the light-emitting element 10 in the top view.

[0030] As the translucent member 20, a resin member, an inorganic member, glass, or a combination thereof can be used. The translucent member 20 preferably has a transmittance of 60% or more, more preferably 70% or more, and still more preferably 80% or more for light having a peak wavelength of the light emitted from the light-emitting element 10.

[0031] The light-transmitting member 20 contains oxygen atoms. As the resin member, thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, and phenolic resin, and thermoplastic resins such as polycarbonate resin, acrylic resin, methylpentene resin, and polynorbornene resin can be used. In particular, a silicone resin excellent in light resistance and heat resistance is suitable. As the inorganic member of the light-transmitting member 20, silicon oxide, aluminum oxide, etc. can be used. As the glass, non-alkali glass, soda glass, soda-lime glass, borosilicate glass, aluminosilicate glass, quartz glass, low-alkali borosilicate glass, etc. can be used. Note that the light-transmitting member 20 may not contain oxygen.

[0032] The light-transmitting member 20 may be only these light-transmitting members, or may be a member containing a phosphor that is excited by light from the light-emitting element and converts it into light of a different wavelength, a light-scattering agent, etc. with these light-transmitting members as the base material. By including a phosphor, a light-emitting device capable of white light emission can be obtained.

[0033] As the phosphor, yttrium aluminum garnet-based phosphors, lutetium aluminum garnet-based phosphors, terbium aluminum garnet-based phosphors, CCA-based phosphors, SAE-based phosphors, chlorosilicate-based phosphors, silicate-based phosphors, oxynitride-based phosphors such as β-sialon-based phosphors or α-sialon-based phosphors, LSN-based phosphors, BSESN-based phosphors, SLA-based phosphors, nitride-based phosphors such as CASN-based phosphors or SCASN-based phosphors, KSF-based phosphors, KSAF-based phosphors or MGF-based phosphors, etc., quantum dots having a perovskite structure, II-VI group quantum dots, III-V group quantum dots, or quantum dots having a chalcopyrite structure can be used.

[0034] As the light scattering agent, for example, particles such as titanium oxide, silicon oxide, aluminum oxide, zinc oxide, magnesium oxide, zirconium oxide, yttrium oxide, calcium fluoride, magnesium fluoride, niobium pentoxide, barium titanate, tantalum pentoxide, barium sulfate, or glass can be used.

[0035] The translucent member 20 can be joined to the light emitting element 10 using a translucent joining member 70. Further, the light emitting element 10 and the translucent member 20 can be directly joined by a direct joining method or the like without using a joining member.

[0036] (Silicone resin member) The silicone resin member 30 has light reflectivity. Or, the silicone resin member 30 has light reflectivity and light transmissivity. The silicone resin member 30 covers a part of the surface of the translucent member 20 via an intermediate layer 40 described later. In the examples shown in FIGS. 1C and 2B, the silicone resin member 30 covers the second upper surface 20U2 and the first side surface 20S1 of the translucent member 20 via the intermediate layer 40.

[0037] In the light emitting device 100C shown in FIG. 3B, the silicone resin member 30 covers the light emitting element 10 and the substrate 60 in addition to a part of the surface of the translucent member 20. The silicone resin member 30 of the light emitting device 100B is disposed in contact with the light emitting element 10 and the substrate 60. Also in the light emitting device 100D shown in FIG. 4, the silicone resin member 30 covers the light emitting element 10 and the substrate 60 in addition to a part of the surface of the translucent member 20. In the light emitting device 100D, an intermediate layer 40 is disposed between the light emitting element 10 and the substrate 60 and the silicone resin member 30.

[0038] The silicone resin member 30 contains a silicone resin and particles of a light-reflective substance. Examples of the silicone resin include silicone resin and modified silicone resin. Further, as the silicone resin, a condensation-type silicone or an addition-type silicone can be used. In particular, a condensation-type silicone having good heat resistance and light resistance is preferable. Examples of the light-reflective substance include titanium oxide, silicon oxide, zirconium oxide, magnesium oxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, and combinations thereof. Among them, titanium oxide is preferable because it is relatively stable against moisture and the like and has a high refractive index.

[0039] The concentration of the light-reflective substance is preferably, for example, 60% by mass or more and 70% by mass or less. The reflectance of the silicone resin member 30 at the emission peak wavelength of the light emitted from the light-emitting element 10 is preferably, for example, 1% or more and 95% or less.

[0040] The total light transmittance of the silicone resin member 30 is preferably, for example, 1% or more and 35% or less. The total light transmittance is the ratio of the amount of light transmitted through the object to the amount of light incident on the object. For example, the total light transmittance refers to the total light transmittance measured in accordance with Japanese Industrial Standard JIS K 7375:2008.

[0041] The upper surface of the silicone resin member 30 can be located in the same plane as the upper surface 20U (first upper surface 20U1) of the light-transmissive member 20 or at a position lower than that. Thereby, for example, when the light-emitting device 100 is used in an in-vehicle headlight, it becomes easier to adjust the focal position and the like of an optical system such as a reflector or a lens.

[0042] (Intermediate layer) The intermediate layer 40 is disposed between the light-transmissive member 20 and the silicone resin member 30, and can improve the adhesion between them. Hereinafter, a modified example of the intermediate layer 40 will be described with reference to the optical member 80 shown in FIGS. 6A to 6F. These are also applicable to the light-emitting device 100.

[0043] As shown in FIGS. 1C, 2B, 3B, 4, 5, and 6A, the intermediate layer 40A can have the same thickness throughout. Thereby, the adhesion can be improved. Also, it can be the intermediate layer 40B with partially different thicknesses. For example, when the light-transmissive member 20 has the second upper surface 20U2 and the first side surface 20S1, as shown in FIG. 6B, the thickness of the intermediate layer 40B on the second upper surface 20U2 can be made thicker than the thickness of the intermediate layer 40B on the first side surface 20S1. Thereby, the time for forming the intermediate layer 40B can be shortened.

[0044] As shown in FIGS. 1C, 2B, 3B, 4, 5, and 6A etc., the intermediate layer 40A can be composed of one layer. Thereby, the time for forming the intermediate layer 40 can be shortened. Also, as shown in FIG. 6C, it can be the intermediate layer 40C having a structure in which two or more layers are laminated. Thereby, compared with the case of being composed of one layer, the adhesion can be further improved.

[0045] As shown in FIGS. 1C, 2B, 3B, 4, 5, and 6A etc., the intermediate layer 40A can be disposed throughout between the light-transmissive member 20 and the silicone resin member 30. Thereby, the adhesion can be improved. Alternatively, as shown in FIG. 6D, it can be the intermediate layer 40D disposed partially between the light-transmissive member 20 and the silicone resin member 30. In other words, the intermediate layer 40D can be disposed so that a part of the light-transmissive member 20 and the silicone resin member 30 are in contact. Thereby, the time for forming the intermediate layer 40D can be shortened.

[0046] As shown in FIGS. 1C, 2B, 3B, 4, 5, and 6A, the surface of the intermediate layer 40A can be a flat surface. Thereby, since total reflection of light at the 40A surface is efficiently performed compared to a rough surface, the amount of light transmitted to the silicone resin member 30 can be reduced. Thereby, in the light-emitting device shown in FIG. 1C etc., the boundary between the high-brightness light-emitting region and the low-brightness light-emitting region can be made clear. Also, in the light-emitting device shown in FIG. 2B etc., the boundary between the light-emitting region and the non-light-emitting region around it can be made clear. Also, as shown in FIG. 6E, the intermediate layer 40E having a rough surface can be used. Thereby, the adhesion can be further improved. In this case, the surface roughness Sa of the surface of the intermediate layer 40E can be, for example, 0.7 μm or more and 0.8 μm or less.

[0047] As described above, the intermediate layer 4 can be in various forms. Also, the position where the intermediate layer 40 is disposed may be not only between the translucent member 20 and the silicone resin member 30 but also at other positions.

[0048] As shown in FIGS. 1C, 2B, 3B, 4, and 6A etc., the intermediate layer 40A can be disposed so that the upper surface 20U (first upper surface 20U1) of the translucent member 20 is exposed. Thereby, variations in the thickness of the intermediate layer 40A that may occur when the intermediate layer 40A is disposed on the first upper surface 20U1 of the translucent member 20 can be eliminated. Also, as shown in FIGS. 5 and 6F, the intermediate layer 40 may be disposed on the upper surface 20U (first upper surface 20U1) of the translucent member 20. Thereby, for example, the oxide film used as the intermediate layer 40 can function as an antireflection layer.

[0049] As shown in FIG. 4, the intermediate layer 40 may be disposed between the light-emitting element 10 and the silicone resin member 30, or between the light-emitting element 10 and a coating member 50 described later. Thereby, the adhesion between the side surface of the light-emitting element 10 and the silicone resin member 30 or the coating member 50 can also be improved. Note that the example shown in FIG. 4 shows all the intermediate layers 40 being continuous. However, depending on the material or formation method of the intermediate layer 40, the position where it is disposed can be variously selected, such as not being formed on the side surface but only on the surface facing upward.

[0050] As shown in FIG. 1C, when the light-emitting device 100 has a joining member 70 described later, the intermediate layer 40 may be disposed between the joining member 70 and the silicone resin member 30, or between the joining member 70 and the coating member 50. Thereby, the adhesion between the joining member 70 and the silicone resin member 30 or the coating member 50 can also be improved.

[0051] As shown in FIG. 1C, when the light-emitting device 100 has a substrate 60 described later, the intermediate layer 40 may be disposed between the substrate 60 and the silicone resin member 30, or between the substrate 60 and the coating member 50. Thereby, the adhesion between the substrate 60 and the silicone resin member 30 or the coating member 50 can also be improved.

[0052] A method for manufacturing the intermediate layer 40 will be described. In the case of the optical member 80, first, the intermediate layer 40 can be disposed on the surface of the translucent member 20. Then, the molten silicone resin member 30 is disposed on the intermediate layer 40. When the intermediate layer 40 is a silane coupling agent, since the silane coupling agent disposed on the surface of the translucent member 20 is gradually cured, it is necessary to dispose the silicone resin member 30 before the silane coupling agent is completely cured. For example, it is preferable to dispose the silicone resin member 30 within 90 minutes after disposing the silane coupling agent.

[0053] The intermediate layer 40 can be disposed on the surface of the pre-fragmented light-transmissive member 20. When using such a method, for example, as shown in FIG. 5, the intermediate layer 40 can be disposed on the upper surface 20U and the side surface 20S of the light-transmissive member 20. In addition, for the light-transmissive member 20 having the first upper surface 20U1 and the second upper surface 20U2 as shown in FIG. 6A etc., when using the pre-fragmented light-transmissive member 20, not only the first side surface 20S1 but also all side surfaces (including the second side surface 20S2 and the side surface including the side surface 20S continuous with the first upper surface 20U1) located on the outer periphery of the light-transmissive member 20 in a top view can also be provided with the intermediate layer 40. Thereby, the adhesion of the silicone resin member 30 or the coating member 50 over the entire side surface of the light-transmissive member can be improved.

[0054] Also, in the case of the light-transmissive member 20 having the first upper surface 20U1 and the second upper surface 20U2 as shown in FIG. 6A etc., the intermediate layer 40 can be disposed on the light-transmissive member 20 in a state before fragmentation. Specifically, first, a light-transmissive member 20 having the first upper surface 20U1 and the second upper surface 20U2 located at a position lower than the first upper surface 20U1 is prepared. At this point, the adjacent first upper surfaces 20U1 and the second upper surfaces 20U2 are continuous, and the first side surface 20S1 is exposed. Further, the side surfaces that will become the outer periphery of the light-transmissive member 20 after fragmentation are not formed at this point.

[0055] Next, the intermediate layer 40 is disposed on the second upper surface 20U2 and the first side surface 20S1. In this case, the intermediate layer 40 may also be disposed on the first upper surface 20U1. Then, the molten silicone resin member 30 is disposed on the intermediate layer 40 and cured. Next, by cutting the light-transmissive member 20 and the silicone resin member 30, the fragmented optical member 80 can be obtained.

[0056] The molten silicone resin member 30 can also be disposed on the first upper surface 20U1 of the light-transmissive member 20. In this case, a step of removing the silicone resin is provided so that the first upper surface 20U1 is exposed. Incidentally, in this step, a part of the first upper surface 20U1 may also be removed. In that case, the newly exposed surface is referred to as the first upper surface 20U1. The same applies to the upper surface 20U of the light-transmissive member 20 that does not have a second upper surface as shown in FIG. 5. Further, after the intermediate layer 40 is disposed on the upper surface 20U of the light-transmissive member 20, the silicone resin member 30 may be disposed so as to fill the intermediate layer 40. In that case, the silicone resin member 30 can be removed so as to expose the upper surface 20U of the light-transmissive member 20 by removing the intermediate layer 40. Alternatively, as shown in FIG. 5, the silicone resin member 30 may be removed so that the intermediate layer 40 disposed on the upper surface U of the light-transmissive member 20 is exposed.

[0057] Further, the light-emitting device 100 can be formed without previously forming the optical member 80. In this case, for example, after the light-transmissive member 20 is disposed on the upper surface of the light-emitting element 10, the intermediate layer 40 is disposed on the surface of the light-transmissive member 20, and then the silicone resin member 30 is disposed. When such a method is used, as shown in FIG. 4, the intermediate layer 40 is also disposed on the surfaces of the light-emitting element 10 and the substrate 60 and the like. When the joining member 70 as shown in FIG. 1C is provided, the intermediate layer 40 is disposed so as to cover the surface of the joining member 70.

[0058] When a silane coupling agent is used as the intermediate layer 40, the thickness of the silane coupling agent can be 0.1 μm or more and 15 μm or less. The silane coupling agent can be disposed by a spray method, a potting method, a printing method, or the like.

[0059] When an oxide such as oxide particles or an oxide film is used as the intermediate layer 40, the thickness of the oxide can be 0.01 μm or more and 1 μm or less. The oxide can be disposed by a sputtering method, an atomic layer deposition method (ALD method), a vapor deposition method, a combustion chemical vapor deposition method, or the like. Further, after the oxide is disposed, a step of washing with warm water at 70° C. or higher and 120° C. or lower may be provided.

[0060] (Covering member) When the silicone resin member 30 does not cover the light-emitting element 10, as shown in FIG. 1C, a covering member 50 can be provided as a member that covers the light-emitting element 10. The covering member 50 is a light-reflective member. When the light-emitting device 100 includes the joining member 70 or the substrate 60, the covering member 50 can be arranged to cover these as well. As shown in FIG. 2B and the like, the covering member 50 may be a single covering member 50, or may be composed of two or more covering members 50. For example, as shown in FIG. 1C, a second covering member 52 that covers the light-emitting element 10 and a first covering member 51 that covers the second covering member 52, the light-transmissive member 20, and the silicone resin member 30 can be provided.

[0061] As the covering member 50, thermosetting resins such as silicone resin, silicone-modified resin, epoxy resin, and phenolic resin, and thermoplastic resins such as polycarbonate resin, acrylic resin, methylpentene resin, and polynorbornene resin can be used. Further, the covering member 50 may be composed of an inorganic material containing, for example, boron nitride or alkali metal silicate. In this case, it can further contain titanium oxide or zirconium oxide.

[0062] (Joining member) The joining member 70 is a member that joins the light-emitting element 10 and the light-transmissive member 20. The joining member 70 is disposed between the upper surface of the light-emitting element 10 and the lower surface 20D of the light-transmissive member 20. Further, as shown in FIG. 1C, the joining member 70 may cover the side surface of the light-emitting element 10. The joining member 70 can use a light-transmissive resin material. For example, a resin material mainly composed of a thermosetting resin such as silicone resin, silicone-modified resin, epoxy resin, or phenolic resin is preferable. The transmittance of the joining member 70 with respect to the light from the light-emitting element is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. When the light-emitting element 10 and the light-transmissive member 20 are joined by a direct bonding method, the joining member 70 can be omitted.

[0063] (Substrate) The light-emitting device 100 can include a substrate 60 on which a light-emitting element 10 is mounted. The substrate 60 includes a base material 61 and wiring 62 disposed on at least the upper surface of the base material 61. The electrode 12 of the light-emitting element 10 and the wiring 62 are electrically connected via a conductive bonding member such as solder or a bump. As shown in FIG. 2B and the like, the wiring 62 may be disposed not only on the upper surface of the base material 61 but also on the lower surface. In this case, the wiring 62 disposed on the upper surface and the wiring 62 disposed on the lower surface are electrically connected by a via or the like.

[0064] As the base material 61, materials known in the art can be used as the base material constituting the wiring board for supporting electronic components such as light-emitting elements. For example, insulating materials such as glass epoxy, resin, and ceramics, semiconductor materials such as silicon, and conductive materials such as copper can be mentioned. Among them, ceramics with high heat resistance and light resistance can be preferably used. Examples of ceramics include aluminum oxide, aluminum nitride, silicon nitride, LTCC, etc. Also, composite materials of these insulating materials, semiconductor materials, and conductive materials can be used. When a semiconductor material or a conductive material is used as the base material 61, the wiring 62 can be disposed on the upper surface of the base material 61 via an insulating layer. Examples of the material of the wiring 62 include metals such as Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, Pd, or alloys containing at least one of these.

Industrial Applicability

[0065] The light-emitting device according to the embodiment of the present disclosure can be preferably used for vehicle lighting such as headlights. In addition, the light-emitting device according to the embodiment of the present disclosure can be used for backlight sources of liquid crystal displays, various lighting fixtures, large displays, various display devices such as advertisements and wayfinding, and further, image reading devices such as digital video cameras, facsimiles, copy machines, scanners, and projector devices.

[0066] The light-emitting device according to the embodiment of the present disclosure is, for example, as follows. [Item 1] A light-emitting element, A light-emitting device including a light-transmitting member disposed on the upper surface of the light-emitting element and containing oxygen atoms, a silicone resin member that covers the light-transmitting member such that at least a part of the upper surface of the light-transmitting member is exposed, and a silane coupling agent as an intermediate layer disposed between the light-transmitting member and the silicone resin member. A light-emitting device comprising the above components. [Item 2] The light-emitting device according to Item 1, wherein the silane coupling agent has a thickness of 0.1 μm or more and 15 μm or less. [Item 3] A light-emitting element, a light-transmitting member disposed on the upper surface of the light-emitting element and containing oxygen atoms, a silicone resin member that covers the light-transmitting member such that at least a part of the upper surface of the light-transmitting member is exposed, and an oxide film or oxide particles as an intermediate layer disposed between the light-transmitting member and the silicone resin member. A light-emitting device comprising the above components. [Item 4] The light-emitting device according to Item 3, wherein the oxide film or oxide particles contain at least one selected from aluminum oxide, silicon oxide, and indium tin oxide. [Item 5] The light-emitting device according to Item 3 or Item 4, wherein the oxide film has a thickness of 0.01 μm or more and 1 μm or less. [Item 6] A light-transmitting member containing oxygen atoms, a silicone resin member that covers at least a part of the surface of the light-transmitting member, and a silane coupling agent as an intermediate layer disposed between the light-transmitting member and the silicone resin member. An optical member comprising the above components. [Item 7] The optical member according to Item 6, wherein the silane coupling agent has a thickness of 0.1 μm or more and 15 μm or less. [Item 8] A light-transmitting member containing oxygen atoms, a silicone resin member that covers the light-transmitting member such that at least a part of the upper surface of the light-transmitting member is exposed, An oxide film or oxide particles as an intermediate layer disposed between the light-transmissive member and the silicone resin member, An optical member comprising the same. [Item 9] The optical member according to Item 8, wherein the oxide film or oxide particles contain at least one selected from aluminum oxide, silicon oxide, and indium tin oxide. [Item 10] The optical member according to Item 8 or Item 9, wherein the oxide film or oxide particles have a thickness of 0.01 μm or more and 1 μm or less.

Explanation of Reference Numerals

[0067] 100... Light-emitting device 10... Light-emitting element 11... Semiconductor laminate 12... Electrode 20... Light-transmissive member (20U... Upper surface, 20U1... First upper surface, 20U2... Second upper surface, 20D... Lower surface, 20S... Side surface, 20S1... First side surface, 20S2... Second side surface) 30... Silicone resin member 40... Intermediate layer 50... Coating member (51... First coating member, 52... Second coating member) 60... Substrate 61... Base material 62... Wiring 70... Bonding member 80... Optical member

Claims

1. A light-emitting element, a light-transmitting member disposed on the upper surface of the light-emitting element and containing oxygen atoms, a silicone resin member that covers the light-transmitting member such that at least a part of the upper surface of the light-transmitting member is exposed, and a silane coupling agent as an intermediate layer disposed between the light-transmitting member and the silicone resin member. A light-emitting device comprising the above.

2. The light-emitting device according to claim 1, wherein the silane coupling agent has a thickness of 0.1 μm or more and 15 μm or less.

3. A light-emitting element, a light-transmitting member disposed on the upper surface of the light-emitting element and containing oxygen atoms, a silicone resin member that covers the light-transmitting member such that at least a part of the upper surface of the light-transmitting member is exposed, and an oxide film or oxide particles as an intermediate layer disposed between the light-transmitting member and the silicone resin member. A light-emitting device comprising the above.

4. The light-emitting device according to claim 3, wherein the oxide film or oxide particles contain at least one selected from aluminum oxide, silicon oxide, and indium tin oxide.

5. The light-emitting device according to claim 4, wherein the oxide film has a thickness of 0.01 μm or more and 1 μm or less.

6. A light-transmitting member containing oxygen atoms, a silicone resin member that covers at least a part of the surface of the light-transmitting member, and a silane coupling agent as an intermediate layer disposed between the light-transmitting member and the silicone resin member. An optical member comprising the above.

7. The optical member according to claim 6, wherein the silane coupling agent has a thickness of 0.1 μm or more and 15 μm or less.

8. A light-transmitting member containing oxygen atoms, a silicone resin member that covers the light-transmitting member such that at least a part of the upper surface of the light-transmitting member is exposed, and an oxide film or oxide particles as an intermediate layer disposed between the light-transmitting member and the silicone resin member. An optical member comprising the above.

9. The optical member according to claim 8, wherein the oxide film or oxide particles contain at least one selected from aluminum oxide, silicon oxide, and indium tin oxide.

10. The optical member according to claim 9, wherein the oxide film or oxide particles have a thickness of 0.01 μm or more and 1 μm or less.

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