Electronic component image inspection device, image inspection method, and image inspection program

Abstract

To provide an electronic component image inspection device, an image inspection method, and an image inspection program with which it is possible to suppress products to be of good quality from being determined as defective.SOLUTION: An image inspection device 100 for electronic components 1 comprises: position detection means 10 for detecting a product position PP on the basis of a product image P; image correction means 20 for generating a correction product image Pc in which the product image P is corrected on the basis of the product position PP; first inspection means 30 for executing first inspection T1 having a first inspection logic L1 on the basis of the correction product image Pc and outputting a first inspection result T1R; relief inspection means 40 for executing relief inspection Tk having relief inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R becomes a specific condition in the inspection logic L1, and outputting a relief inspection result TkR; and overall determination means 50 for performing overall determination for an electronic component 1 on the basis of the first inspection result T1R and the relief inspection result TkR.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an image inspection device, an image inspection method, and an image inspection program for electronic components. [Background technology]

[0002] Conventionally, there have been devices that perform visual inspections in which an inspection A is performed to photograph the product and detect the product position, followed by inspections B and C that are specialized for detecting various visual defects, and only if the product is judged to be non-defective in either inspection is there an overall judgment that the product is non-defective (for example, Patent Document 1 and Patent Document 2).

[0003] In conventional visual inspections, each inspection has its own unique image inspection standard, and the inspection standard is set so that products with specific types of visual defects are always judged as failing (NG). Furthermore, conventional image inspection standards could only set simple inspection standards that produce one inspection result for one inspection. However, there are defective products that do not differ much from good products in images. Even such defective products need to be rejected in visual inspection. However, each inspection has overly strict inspection standards, which can result in some products that should be good being mistakenly judged as defective. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6999150 [Patent Document 2] Patent No. 7298825 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention aims to provide an image inspection device, an image inspection method, and an image inspection program for electronic components that can prevent products that are intended to be non-defective from being determined to be defective. [Means for solving the problem]

[0006] (1) An image inspection device for electronic components according to one embodiment of the present invention includes a position detection means for detecting a product position based on a product image of an electronic component, an image correction means for generating a corrected product image by correcting the product image based on the product position, a first inspection means for performing a first inspection having a first inspection logic based on the corrected product image and outputting a first inspection result, a repair inspection means for performing a repair inspection having a repair inspection logic different from the first inspection logic when the first inspection result satisfies a specific condition in the first inspection logic and outputting a repair inspection result, and a comprehensive judgment means for making a comprehensive judgment on the electronic component based on the first inspection result and the repair inspection result. (2) In the above (1), the specific condition may be a case where the first inspection result is a failure when the first inspection logic is a pass / fail judgment. (3) In (1) or (2) above, the comprehensive judgment means may make a comprehensive judgment that the product is good if the first inspection result is pass or the repair inspection result is pass, and may make a comprehensive judgment that the product is defective if the first inspection result is fail and the repair inspection result is fail. (4) In the above (1) or (2), a second inspection means may be provided that executes a second inspection having a second inspection logic different from the first inspection logic and outputs a second inspection result, and the overall judgment means may make the overall judgment based on the first inspection result, the repair inspection result, and the second inspection result. (5) In (4) above, the comprehensive judgment means may make a comprehensive judgment that the product is good if the first inspection result is pass or if the remedial inspection result is pass and the second inspection result is pass, and may make a comprehensive judgment that the product is defective if the first inspection result is fail and the remedial inspection result is fail, or if the second inspection result is fail. (6) In the above (1) or (2), the first inspection may be an inspection to detect defects in the electronic components. (7) In the above (5), the second inspection may be an inspection for measuring the dimensions of the electronic component. (8) The image inspection method of an electronic component according to one aspect of the present invention includes a position detection step of detecting a product position based on a product image obtained by imaging the electronic component, an image correction step of generating a corrected product image by correcting the product image based on the product position, a first inspection step of performing a first inspection having a first inspection logic based on the corrected product image and outputting a first inspection result, a relief inspection step of performing a relief inspection having a relief inspection logic different from the first inspection logic when the first inspection result meets a specific condition in the first inspection logic and outputting a relief inspection result, and a comprehensive determination step of making a comprehensive determination on the electronic component based on the first inspection result and the relief inspection result. (9) The image inspection program of an electronic component according to one aspect of the present invention causes a computer to execute a position detection function of detecting a product position based on a product image obtained by imaging the electronic component, an image correction function of generating a corrected product image by correcting the product image based on the product position, a first inspection function of performing a first inspection having a first inspection logic based on the corrected product image and outputting a first inspection result, a relief inspection function of performing a relief inspection having a relief inspection logic different from the first inspection logic when the first inspection result meets a specific condition in the first inspection logic and outputting a relief inspection result, and a comprehensive determination function of making a comprehensive determination on the electronic component based on the first inspection result and the relief inspection result.

Advantages of the Invention

[0007] According to the present invention, it is possible to provide an image inspection apparatus, an image inspection method, and an image inspection program for an electronic component that can suppress a product intended to be a good product from being determined as a defective product.

Brief Description of the Drawings

[0008] [Figure 1] It is an explanatory diagram for explaining the outline of an image inspection apparatus for an electronic component. [Figure 2] It is a diagram showing the flow of an image inspection method by an image inspection apparatus for an electronic component. DETAILED DESCRIPTION OF THE INVENTION

[0009] (Embodiment) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is an explanatory diagram illustrating an overview of an image inspection device 100 for an electronic component 1. Fig. 2 is a diagram showing the flow of an image inspection method using the image inspection device 100 for an electronic component 1. Note that, hereinafter, parts having common functions may be given the same reference numerals or symbols.

[0010] The image inspection device 100 for the electronic component 1 according to the embodiment is used to inspect the appearance of the electronic component 1.

[0011] The electronic component 1 is a product that is subject to inspection to determine whether it is a good product (OK) or a bad product (NG). The electronic component 1 is a component or element that constitutes an electronic device. The electronic component 1 is, for example, a resistor, a capacitor, an inductor, a transistor, a diode, an integrated circuit, etc. The electronic component 1 is used to control current or voltage in an electronic circuit, or to process and transfer information. The electronic component 1 is used in electronic devices such as mobile phones, computers, automobiles, and home appliances. The electronic component 1 has a three-dimensional shape such as a hexahedron.

[0012] The image inspection device 100 includes an imaging means C and a control means S. The image inspection device 100 performs an appearance inspection by, for example, imaging an electronic component 1, which is a workpiece that is placed on the top surface of a rotating, disc-shaped, transparent glass conveying table and is then sucked and conveyed, from six sides (front, back, top, bottom, left side, and right side) using the imaging means C, such as a camera, and determining whether the captured product image P is pass or fail using the control means S.

[0013] The imaging means C appropriately includes a front camera for imaging the front of the electronic component 1, a rear camera for imaging the back of the electronic component 1, a planar camera for imaging the plane of the electronic component 1, a bottom camera for imaging the bottom of the electronic component 1, a right-side camera for imaging the right side surface (the inner surface facing the rotation center of the transfer table) of the electronic component 1, and a left-side camera for imaging the left side surface (the outer surface facing away from the rotation center of the transfer table) of the electronic component 1. The imaging means C generates a product image P obtained by imaging the electronic component 1. The product image P is sent to the control means S.

[0014] The control means S is a computer system including a CPU, a memory (storage medium) such as a RAM, a ROM, and an auxiliary storage device, an external connection interface with an input / output device, a network interface, and a bus. The memory stores an image inspection program for causing the control means S (computer system) to execute the image inspection method according to the present embodiment.

[0015] The CPU is an arithmetic circuit that overall controls the control means S. The CPU reads a program stored in the ROM or the auxiliary storage device into the RAM. The CPU executes various processes in the program read into the RAM. The ROM stores a system program and the like used for the control of the control means S. The auxiliary storage device stores application programs and the like that execute various processes. The auxiliary storage device is, for example, an HDD, an SSD, or the like. The external connection interface is an interface for connecting various devices to the control means S. The external connection interface connects, for example, the imaging means C, a display, a keyboard, etc. to the control means S. The network interface functions to perform communication via a network based on the control of the CPU. The bus communicably connects between the above-described functional units constituting the control means S.

[0016] The image inspection apparatus 100 images the electronic component 1 by the imaging means C, and determines whether the electronic component 1 is acceptable or not (whether the electronic component 1 is a good product or a defective product) by the control means S based on the captured product image P.

[0017] In detail, as shown in FIG. 2, the image inspection device 100 (specifically, the control means S of the image inspection device 100) of the electronic component 1 according to the embodiment includes a position detection means 10 that detects a product position PP based on a product image P of the electronic component 1, an image correction means 20 that generates a corrected product image Pc by correcting the product image P based on the product position PP, a first inspection means 30 that performs a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc and outputs a first inspection result T1R, a repair inspection means 40 that performs a repair inspection Tk having a repair inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R satisfies a specific condition in the first inspection logic L1 and outputs a repair inspection result TkR, and a comprehensive judgment means 50 that makes a comprehensive judgment on the electronic component 1 based on the first inspection result T1R and the repair inspection result TkR. As a result, even if an electronic component 1 that should be judged as good (OK) is judged as a failure by the first inspection means 30 (hereinafter, this phenomenon may be referred to as overkill), if it is judged as good by the repair inspection means 40, it will be judged as good by the overall judgment means 50. Therefore, the image inspection device 100 for electronic components 1 can prevent products that should be good from being judged as defective.

[0018] The image inspection device 100 may be equipped with an inspection logic correction means. The inspection logic correction means is provided in the information transmission path between the position detection means 10 or the image correction means 20 and the first inspection means 30. The inspection logic correction means corrects parameters of the first inspection logic L1, the second inspection logic L2, the third inspection logic L3, or the repair inspection logic Lk based on the product image P or the corrected product image Pc. The inspection logic (parameters) may be generated, for example, by artificial intelligence that learns based on the relationship between the information of the product image P or the corrected product image Pc and the inspection results. This allows the inspection logic to be changed according to the information of the product image P or the corrected product image Pc, thereby ensuring accurate inspection results (pass / fail judgments) for each inspection means.

[0019] The image inspection apparatus 100 may optionally include a preliminary inspection means for performing a preliminary inspection before the first inspection T1 by the first inspection means 30.

[0020] The position detection means 10 detects the product position PP. The position detection means 10 detects the product position PP, which is defined, for example, by two-dimensional coordinates set on the top surface of the conveying table with the rotation axis of the conveying table as the reference, and the distance and direction (angle) with the rotation axis of the conveying table as the reference. The position detection means 10 may also detect the product position PP as two-dimensional coordinates with one corner of a rectangular area that can be imaged by the imaging means C as the reference. Information on the product position PP detected by the position detection means 10 is used to correct the product image P by the image correction means 20.

[0021] The image correcting means 20 generates a corrected product image Pc by correcting the product image P based on the product position PP. For example, if the front surface of the electronic component 1 is not perpendicular to the direction of the front camera, the image correcting means 20 corrects the product image P based on the product position PP to generate a corrected product image Pc equivalent to an image of the front surface of the electronic component 1 when the front surface of the electronic component 1 is perpendicular to the direction of the front camera. The corrected product image Pc generated by the image correcting means 20 is used in the first inspection T1 performed by the first inspection means 30.

[0022] The first inspection means 30 executes a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc and outputs a first inspection result T1R. The corrected product image Pc is provided from the image correction means 20. The first inspection logic L1 is logic for making a pass / fail judgment in the first inspection T1. The first inspection logic L1 is logic for determining whether the corrected product image Pc is a fail if a predefined defect is found in the corrected product image Pc, and a pass if no defect is found. The first inspection logic L1 may be, for example, a function that determines whether the product is pass or fail based on a threshold value set for a parameter for evaluating the defect. The function may be a model (algorithm) generated by artificial intelligence that has trained using samples of pass and fail product images as training data.

[0023] Thus, the first inspection T1 is an inspection for detecting defects in the electronic component 1. Here, the defects include dimensional defects (including cases where the dimensions are outside the tolerance range or the set standard), foreign matter inclusion, so-called chips where a part such as a corner is chipped, and defects in general appearance inspections including breakage where the appearance is completely damaged. That is, the concept of defects includes such contents called defects in general appearance inspections. Thus, since the first inspection T1 is an inspection for detecting defects in the electronic component 1, the electronic component 1 that would originally be a defective product can be surely determined as a defective product.

[0024] The first inspection T1 preferably is an inspection for detecting stains or foreign matter on the body of the electronic component 1 among the defects of the electronic component 1. More preferably, the first inspection T1 is an inspection for detecting stains on the body of the electronic component 1. The body refers to the part other than the electrode part when the electronic component 1 is divided into the electrode part and the other part. It has been found that in the inspection of stains or foreign matter on the body, overkill, which determines an originally good electronic component 1 as unqualified, is likely to occur compared with other inspections such as dimensional inspections in defect inspections. Therefore, by setting the first inspection T1 as an inspection for detecting stains or foreign matter on the body where such overkill is likely to occur, the electronic component 1 in which stains or foreign matter on the body are detected is first made unqualified on the safe side in the first inspection T1, and in the relief inspection Tk that follows in series after the first inspection T1, a determination of pass or fail regarding the stains or foreign matter on the body can be made precisely.

[0025] The relief inspection means 40 executes a relief inspection Tk having a relief inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R becomes a specific condition in the first inspection logic L1 and outputs a relief inspection result TkR.

[0026] Specifically, the specific condition is the case where the first inspection result T1R is unqualified when the first inspection logic L1 is a pass / fail determination. Thereby, even when the first inspection result T1R is unqualified, an electronic component 1 that would originally be a good product can be relieved and determined as qualified in the relief inspection Tk by the relief inspection means 40.

[0027] The repair inspection logic Lk is logic for making a pass / fail judgment in the repair inspection Tk. Unlike the first inspection logic L1, the repair inspection logic Lk is set specifically for inspecting a corrected product image Pc whose first inspection result T1R has met a specific condition (determined as fail) in the first inspection logic L1. The repair inspection logic Lk is logic that fails a corrected product image Pc whose first inspection result T1R has met a specific condition (determined as fail) in the first inspection logic L1 if a predefined defect different from the defect defined in the first inspection logic L1 is found, and passes the corrected product image Pc if no defect is found. The defect defined in the first inspection logic L1 and the defect defined in the repair inspection logic Lk may be the same type, but the pass / fail judgment criteria of the first inspection logic L1 and the repair inspection logic Lk may be different. As such, the image inspection device 100 is equipped with the repair inspection means 40. Therefore, even if the electronic component 1 being inspected is determined to be non-defective in the first inspection T1, it can be determined to be pass in the repair inspection Tk.

[0028] The comprehensive judgment means 50 makes a comprehensive judgment on the electronic component 1 based on the first inspection result T1R and the repair inspection result TkR. Specifically, the comprehensive judgment means 50 makes a comprehensive judgment as a non-defective product when the first inspection result T1R is pass or when the repair inspection result TkR is pass, and makes a comprehensive judgment as a defective product when the first inspection result T1R is fail and the repair inspection result TkR is fail. In other words, the comprehensive judgment means 50 makes a comprehensive judgment as pass when the first inspection result T1R is pass, makes a comprehensive judgment as pass when the first inspection result T1R is fail and the repair inspection result TkR is pass, and makes a comprehensive judgment as fail when the first inspection result T1R is fail and the repair inspection result TkR is fail. As a result, even if the first inspection result T1R is fail, the comprehensive judgment is not immediately made as fail, and even if the first inspection result T1R is fail, the comprehensive judgment is made as pass when the repair inspection result TkR is pass. Therefore, the image inspection device 100 can prevent products that should be considered non-defective from being determined to be defective.

[0029] The image inspection apparatus 100 may include a second inspection means 60 that executes a second inspection T2 having a second inspection logic L2 different from the first inspection logic L1 and outputs a second inspection result T2R. Thereby, since the second inspection T2 can be executed in parallel with the first inspection T1 from a different perspective with respect to the electronic component 1, even when the electronic component 1 that would originally be a defective product passes the first inspection T1, if it fails the second inspection T2, it can be comprehensively determined as a defective product. Therefore, it is possible to suppress the situation where a product that should originally be a defective product is determined to be a non-defective product, and the inspection accuracy of the image inspection apparatus 100 can be improved.

[0030] The comprehensive determination means 50 performs a comprehensive determination based on the first inspection result T1R, the relief inspection result TkR, and the second inspection result T2R. Thereby, even when the electronic component 1 that would originally be a defective product passes the first inspection T1, if it fails the second inspection T2, it can be comprehensively determined as a defective product. Therefore, it is possible to suppress the situation where a product that should originally be a non-defective product is determined to be a defective product, and it is possible to suppress the situation where a product that should originally be a defective product is determined to be a non-defective product, and the inspection accuracy of the image inspection apparatus 100 can be improved.

[0031] Specifically, the second inspection T2 is preferably an inspection for measuring the dimensions of the electronic component 1. It has been found that an inspection for measuring dimensions is less likely to cause overkill in which an electronic component 1 that would originally be a non-defective product is determined to be a non-conforming product, compared to other inspections such as inspections for dirt or foreign matter on the body in defect inspections. Therefore, it is preferable to independently and concurrently perform the second inspection T2 for measuring the dimensions of the electronic component 1, which is an inspection less likely to cause such overkill, in parallel with the first inspection T1 while holding the relief inspection Tk.

[0032] The image inspection device 100 may be equipped with a second repair inspection means, similar to the repair inspection means 40, that executes a second repair inspection Tk2 having a second repair inspection logic Lk2 different from the second inspection logic L2 when the second inspection result T2R satisfies a specific condition in the second inspection logic L2, and outputs a second repair inspection result TkR2. That is, the second inspection T2 may be omitted, similar to the repair inspection Tk for the first inspection T1. This further prevents products that should be considered good from being determined to be defective.

[0033] The image inspection device 100 may include a third inspection means 70 that performs a third inspection T3 having a third inspection logic L3 that is different from the first inspection logic L1 of the first inspection T1 and the second inspection logic L2 of the second inspection T2. The third inspection means 70 is provided in parallel and independent of the first inspection means 30 and the second inspection means 60. This allows the electronic component 1 to be inspected from more perspectives, thereby improving the accuracy of inspecting defective products.

[0034] The technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

[0035] In addition, the components in the above-described embodiments may be replaced with known components as appropriate without departing from the spirit of the present invention. Furthermore, the above-described modifications may be combined as appropriate without departing from the spirit of the present invention.

[0036] As described above, the image inspection device 100 for an electronic component 1 according to the embodiment includes a position detection means 10 for detecting a product position PP based on a product image P obtained by capturing an image of the electronic component 1, an image correction means 20 for generating a corrected product image Pc by correcting the product image P based on the product position PP, a first inspection means 30 for executing a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc and outputting a first inspection result T1R, a repair inspection means 40 for executing a repair inspection Tk having a repair inspection logic Lk different from the first inspection logic L1 when the first inspection result T1R satisfies a specific condition in the first inspection logic L1 and outputting a repair inspection result TkR, and a comprehensive judgment means 50 for making a comprehensive judgment on the electronic component 1 based on the first inspection result T1R and the repair inspection result TkR. As a result, even if an electronic component 1 that should be judged as good (OK) is judged as a failure by the first inspection means 30 (hereinafter, this phenomenon may be referred to as overkill), if it is judged as good by the repair inspection means 40, it will be judged as good by the overall judgment means 50. Therefore, the image inspection device 100 for electronic components 1 can prevent products that should be good from being judged as defective.

[0037] The image inspection method according to the embodiment includes a product position detection step of detecting a product position PP based on a product image P obtained by capturing an electronic component 1, an image correction step of generating a corrected product image Pc by correcting the product image P based on the product position PP, a first inspection step of executing a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc to output a first inspection result T1R, a repair inspection step of executing a repair inspection Tk having a repair inspection logic Lk different from the first inspection logic L1 if the first inspection result T1R satisfies a specific condition in the first inspection logic L1 to output a repair inspection result TkR, and a comprehensive judgment step of making an overall judgment on the electronic component 1 based on the first inspection result T1R and the repair inspection result TkR. As a result, even if an electronic component 1 that should have been judged as good (OK) is judged as a failure by the first inspection means 30 (hereinafter, this event may also be referred to as overkill), if it is judged as good in the repair inspection step, it will be judged as good in the comprehensive judgment step. Therefore, according to the image inspection method for the electronic component 1, it is possible to prevent a product that is intended to be a non-defective product from being determined to be a defective product.

[0038] The image inspection program according to the embodiment is for causing a computer to execute the above-described image inspection method. That is, the image inspection program according to the embodiment causes the computer to execute a product position detection function for detecting a product position PP based on a product image P obtained by imaging an electronic component 1, an image correction function for generating a corrected product image Pc obtained by correcting the product image P based on the product position PP, a first inspection function for executing a first inspection T1 having a first inspection logic L1 based on the corrected product image Pc and outputting a first inspection result T1R, a relief inspection function for executing a relief inspection Tk having a relief inspection logic Lk different from the first inspection logic L1 and outputting a relief inspection result TkR when the first inspection result T1R satisfies a specific condition in the first inspection logic L1, and a comprehensive determination function for performing a comprehensive determination on the electronic component 1 based on the first inspection result T1R and the relief inspection result TkR. As a result, even if the electronic component 1 that should originally be determined as a good product (OK) is determined as a non-conforming product by the first inspection means 30 (hereinafter, this event may also be referred to as overkill), if it is determined as a good product in the relief inspection step, it is comprehensively determined as a good product in the comprehensive determination step. Therefore, according to the image inspection method of the electronic component 1, it is possible to suppress the product that is desired to be a good product from being determined as a defective product.

Explanation of Signs

[0039] 100 Image inspection apparatus 1 Electronic component 10 Position detection means 20 Image correction means 30 First inspection means 40 Relief inspection means 50 Comprehensive determination means 60 Second inspection means 70 Third inspection means C Imaging means S Control means L1 First inspection logic L2 Second inspection logic L3 Third inspection logic P Product image T1 First inspection T1R First inspection result T2 Second Inspection T2R Second Inspection Result T3 Third Inspection Tk Remedial Inspection TkR Remedial Inspection Result

Claims

1. Position detection means for detecting a product position based on a product image obtained by imaging an electronic component; Image correction means for generating a corrected product image by correcting the product image based on the product position; First inspection means for performing a first inspection having a first inspection logic based on the corrected product image and outputting a first inspection result; Salvage inspection means for performing a salvage inspection having a salvage inspection logic different from the first inspection logic and outputting a salvage inspection result when the first inspection result meets a specific condition in the first inspection logic; Comprehensive determination means for performing a comprehensive determination on the electronic component based on the first inspection result and the salvage inspection result; An image inspection apparatus for electronic components, comprising the above.

2. The specific condition is that the first inspection result is unqualified when the first inspection logic is a pass / fail determination. The image inspection apparatus for electronic components according to Claim 1.

3. The comprehensive determination means comprehensively determines that the product is a good product when the first inspection result is qualified or the salvage inspection result is qualified, and comprehensively determines that the product is a defective product when the first inspection result is unqualified and the salvage inspection result is unqualified. The image inspection apparatus for electronic components according to Claim 1 or Claim 2.

4. Comprising second inspection means for performing a second inspection having a second inspection logic different from the first inspection logic and outputting a second inspection result; The comprehensive determination means performs the comprehensive determination based on the first inspection result, the salvage inspection result, and the second inspection result. The image inspection apparatus for electronic components according to Claim 1 or Claim 2.

5. The comprehensive determination means comprehensively determines that the product is a good product when the first inspection result is qualified or the salvage inspection result is qualified, and the second inspection result is qualified, and comprehensively determines that the product is a defective product when the first inspection result is unqualified and the salvage inspection result is unqualified, or the second inspection result is unqualified. The image inspection apparatus for electronic components according to Claim 4.

6. The first inspection is an inspection for detecting defects of the electronic component. The image inspection apparatus for electronic components according to Claim 1 or Claim 2.

7. The second inspection is an inspection for measuring the dimensions of the electronic component. The image inspection apparatus for electronic components according to Claim 5.

8. A position detection step of detecting a product position based on a product image obtained by imaging an electronic component; An image correction step of generating a corrected product image by correcting the product image based on the product position; A first inspection step of performing a first inspection having first inspection logic based on the corrected product image and outputting a first inspection result; A relief inspection step of performing a relief inspection having relief inspection logic different from the first inspection logic when the first inspection result meets a specific condition in the first inspection logic and outputting a relief inspection result; A comprehensive determination step of performing a comprehensive determination on the electronic component based on the first inspection result and the relief inspection result; An image inspection method for an electronic component, comprising the above steps.

9. A computer is caused to execute: a position detection function of detecting a product position based on a product image obtained by imaging an electronic component; An image correction function of generating a corrected product image by correcting the product image based on the product position; A first inspection function of performing a first inspection having first inspection logic based on the corrected product image and outputting a first inspection result; A relief inspection function of performing a relief inspection having relief inspection logic different from the first inspection logic when the first inspection result meets a specific condition in the first inspection logic and outputting a relief inspection result; A comprehensive determination function of performing a comprehensive determination on the electronic component based on the first inspection result and the relief inspection result; An image inspection program for an electronic component.

Images