Substrate information acquisition device and substrate processing device having the same
By using an asymmetric imaging setup to capture substrate information from the loading/unloading port side, the device mitigates reflection issues, ensuring accurate substrate gap determination and conveyance.
Patent Information
- Application Number
- JP2024006049
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-01-18
- Publication Date
- 2025-07-31
AI Technical Summary
Conventional substrate information acquisition devices struggle to accurately capture images due to the influence of reflected light on substrate surfaces, leading to inaccurate determination of substrate gaps and potential hindrance in substrate conveyance.
The device employs an imaging unit positioned to capture an asymmetric pattern from the loading/unloading port side, which minimizes the impact of reflected light by ensuring the pattern appears outside the substrate area or as an inverted reflection, allowing clear distinction between the substrate and background.
This configuration enables precise acquisition of substrate information by reducing the influence of surface reflections, thereby enhancing the accuracy of gap determination and substrate conveyance.
Smart Images

Figure 2025112026000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a substrate information acquisition device that acquires substrate information including the position of a substrate such as a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a substrate for liquid crystal display or an organic EL (Electroluminescence) display device, a glass substrate for a photomask, and a substrate for an optical disk, and a substrate processing device including the same.
Background Art
[0002] Conventionally, as this type of device, there is one including a robot arm, a substrate holding hand, a photographing unit, and a control unit (see, for example, Patent Document 1).
[0003] The substrate holding hand is attached to the tip of the robot arm. The substrate holding hand moves forward and backward to a carrier in which a plurality of substrates are stacked and stored at intervals by the expansion and contraction of the robot arm. The substrate holding hand moves forward and backward below the substrate to be transported. The photographing unit is attached to the substrate holding hand. The photographing unit photographs a plurality of substrates stored in the carrier. The control unit acquires substrate information including the position in the vertical direction in which the substrate is stored and the shape such as the warp of the substrate based on the image photographed by the photographing unit. Based on this substrate information, the control unit obtains the gap between the substrates stacked and stored in the carrier, and advances the substrate holding hand to the carrier according to the gap.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] However, in the case of the conventional example having such a configuration, there are the following problems. That is, there is a problem that the conventional apparatus cannot accurately acquire substrate information based on an image captured by the imaging unit due to the influence of reflected light or the like on the substrate surface. For example, when there is a warp deeper than the peripheral portion of the substrate located on the imaging unit side, the boundary between the substrate and the background cannot be accurately distinguished, so that the substrate information cannot be accurately acquired. Therefore, since the gap cannot be accurately determined, there is a risk of hindering the conveyance of the substrate.
[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate information acquisition apparatus capable of accurately acquiring substrate information by visualizing the boundary between a substrate and a background, and a substrate processing apparatus including the same.
Means for Solving the Problems
[0007] In order to achieve such an object, the present invention has the following configuration. That is, the invention according to claim 1 relates to a container capable of storing a plurality of substrates in a horizontal posture while being separated from each other, and capable of loading and unloading the substrates through a loading / unloading port formed on one side surface. In a substrate information acquisition apparatus for acquiring substrate information including the vertical position of the substrate stored in the container, it is arranged on the opposite side of the loading / unloading port with the substrate stored in the container sandwiched therebetween in a plan view, and when viewed from the loading / unloading port, it has an asymmetric pattern above and below with respect to the surface of the substrate, an imaging unit for imaging the pattern from the loading / unloading port side, and an information acquisition unit for acquiring the substrate information about the substrate stored in the container based on the image captured by the imaging unit.
[0008] [Function and Effect] According to the invention described in claim 1, the imaging unit captures an image of the pattern from the loading / unloading outlet side. The pattern is asymmetric vertically with respect to the plane of the substrate when viewed from the loading / unloading outlet. Therefore, when the substrate has no warpage or the like in its shape, the pattern is directly imaged in the area outside the substrate in the image. On the other hand, if the substrate has warpage or the like in its shape, the pattern may not be imaged in the image, or a pattern with the top and bottom reversed due to reflection of the pattern on the substrate surface may be imaged. Therefore, the image captured by the imaging unit is less likely to be affected by reflected light or the like on the substrate surface, and the boundary between the substrate and the background can be made apparent. As a result, substrate information can be accurately obtained based on the image captured by the imaging unit.
[0009] Further, in the present invention, it is preferable to further include a moving mechanism that moves the imaging unit in the direction in which the plurality of substrates are stacked (claim 2).
[0010] The moving mechanism can move the imaging unit for each substrate. Therefore, an image can be captured using the imaging center area with less distortion by the imaging unit. Therefore, the accuracy of the substrate information can be improved.
[0011] Further, in the present invention, it is preferable that the pattern is disposed outside the outer surface of the storage container that faces the loading / unloading outlet (claim 3).
[0012] The pattern can be disposed outside the storage container. Therefore, a commercially available storage container can be used as it is.
[0013] Further, in the present invention, it includes a light source that irradiates light from outside the storage container toward the outer surface, and a standing member that is disposed between the light source and the storage container and transmits the light of the light source, and it is preferable that the pattern is formed on the standing member (claim 4).
[0014] The light from the light source irradiates the standing member. Thereby, the pattern formed on the standing member is projected onto the outer surface of the storage container, and the pattern can be captured by the imaging unit from the loading / unloading outlet. This is useful when the storage container is formed of a material that transmits the light of the light source.
[0015] In addition, in the present invention, an image display unit is provided which is disposed outside the container, emits light, and displays an arbitrary image on the outer surface side, and the pattern is preferably displayed on the image display unit (Claim 5).
[0016] The image displayed on the image display unit is projected onto the outer surface of the container. Thereby, the pattern displayed on the image display unit is projected onto the outer surface of the container, and the pattern can be photographed by the photographing unit from the loading outlet. This is useful when the container is formed of a material that transmits the light of the light source. Furthermore, the pattern displayed on the image display unit can be easily changed. Therefore, according to the shape of the substrate, it can be easily changed to a pattern suitable for visualizing the boundary between the substrate and the background.
[0017] In addition, in the present invention, the photographing unit is capable of detecting infrared light, and includes an infrared light source that irradiates light including infrared light from outside the container toward the outer surface, and a standing member that is disposed between the infrared light source and the container and transmits the infrared light of the infrared light source, and the pattern is preferably formed on the standing member (Claim 6).
[0018] The light from the infrared light source is irradiated onto the standing member. Thereby, the pattern formed on the standing member is projected onto the outer surface of the container, and the pattern can be photographed by the photographing unit from the loading outlet. This is useful when the container is formed of a material having a low visible light transmittance but a high infrared light transmittance. Also, it is suitable for acquiring substrate information of a substrate on which a film sensitive to ultraviolet rays is formed.
[0019] In addition, in the present invention, the photographing unit is capable of detecting infrared light, and includes a heating wire that irradiates light including infrared light from outside the container toward the outer surface, and the pattern is preferably formed by the arrangement of the heating wire (Claim 7).
[0020] Electrically energize the heating wire and irradiate the pattern of the heating wire onto the standing member. Thereby, the pattern formed on the standing member is projected onto the outer surface of the storage container, and the pattern can be photographed by the photographing unit from the loading outlet. This is useful when the storage container is formed of a material with a low visible light transmittance but a high infrared light transmittance. Also, it is suitable for acquiring substrate information of a substrate on which a film sensitive to ultraviolet rays is formed. Furthermore, since the heating wire also serves as a light source, thinning can be achieved.
[0021] Also, in the present invention, it is preferable that the pattern is disposed on the inner surface of the storage container facing the loading outlet (Claim 8).
[0022] Since the pattern is arranged on the inner surface of the storage container, it is not affected by the material of the storage container. Also, since the pattern is photographed without passing through the constituent members of the storage container, the pattern can be photographed with high contrast. Therefore, the accuracy of the substrate information can be improved. Also, there is no need to attach a new configuration to the mounting table on which the storage container is placed. As a result, a commercially available mounting table can be used, and the cost can be suppressed.
[0023] Also, in the present invention, it is preferable to include a projection unit that projects an image from the loading outlet side toward the inner surface, and the pattern is formed by the image of the projection unit (Claim 9).
[0024] The projection unit projects an image from the loading outlet side toward the inner surface to form a pattern. Therefore, there is no need to attach a new configuration to the mounting table on which the storage container is placed. As a result, a commercially available mounting table can be used, and the cost can be suppressed.
[0025] Also, in the present invention, it is preferable that the pattern is in a linear shape inclined from the vertical direction (Claim 10).
[0026] Since it is a simple pattern, it can be easily formed. Also, a pattern inverted on the substrate surface can be easily identified.
[0027] Further, in the present invention, it is preferable that the substrate information acquisition device according to any one of the above, a processing unit that performs a predetermined process on the substrate, a hand that holds the substrate, and for transporting the substrate to be processed by the processing unit, the hand is driven to advance and retreat with respect to the storage container, and a hand driving unit that drives the hand to move up and down in the vertical direction, and a control unit that operates the hand driving unit based on the substrate information acquired by the substrate information acquisition device are provided (Claim 11).
[0028] When transporting the substrate to the processing unit with the hand, the control unit operates the hand driving unit based on the substrate information acquired by the substrate information acquisition device. Therefore, the substrate can be transported appropriately.
Effects of the Invention
[0029] According to the substrate information acquisition device of the present invention, the imaging unit captures an image of the pattern from the carry-in / outlet side. The pattern is asymmetric in the vertical direction with respect to the surface of the substrate when viewed from the carry-in / outlet. Therefore, when the substrate has no warpage or the like in its shape, the pattern appears as it is in the area other than the substrate in the image. On the other hand, if the substrate has warpage or the like in its shape, the pattern does not appear in the image, or a pattern in which the pattern is reflected on the surface of the substrate and is inverted vertically appears. Therefore, the image by the imaging unit can be less affected by reflected light or the like on the substrate surface, and the boundary between the substrate and the background can be made prominent. As a result, substrate information can be accurately acquired based on the image captured by the imaging unit.
Brief Description of the Drawings
[0030]
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Mode for Carrying Out the Invention
[0031] The present invention will be described below by giving various examples.
Examples
[0032] Hereinafter, Example 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to Example 1. FIG. 2 is a view of the substrate processing apparatus of FIG. 1 as seen from the rear X.
[0033] <1. Overall Configuration>
[0034] The substrate processing apparatus 1 includes a loading / unloading block 3, an index block 5, and a processing block 7.
[0035] The substrate processing apparatus 1 processes a substrate W. The substrate W has, for example, a circular shape in plan view. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrate W. The substrate processing apparatus 1 processes the substrate W in a single-wafer type in the processing block 7. The single-wafer type processes one substrate W at a time in a horizontal posture.
[0036] In this specification, for convenience, the direction in which the loading / unloading block 3, the index block 5, and the processing block 7 are arranged in a row is referred to as the "front-rear direction X". The front-rear direction X is horizontal. Among the front-rear direction X, the direction from the processing block 7 toward the loading / unloading block 3 is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as "right". The direction opposite to the right is referred to as "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, for reference, front, rear, right, left, up, and down are appropriately shown.
[0037] <2. Loading / Unloading Block>
[0038] The loading / unloading block 3 includes a loading section 9 and an unloading section 11. The loading section 9 and the unloading section 11 are arranged in the width direction Y. A plurality of substrates W (for example, 25 substrates) are stacked and stored in a single carrier C in a horizontal posture at regular intervals. The carrier C storing the unprocessed substrate W is placed on the loading section 9. The loading section 9 includes, for example, two mounting tables 13 on which the carrier C is placed. The carrier C accommodates the substrates W one by one with the surfaces of the substrates W spaced apart from each other. The carrier C accommodates the substrates W, for example, with the surface of the substrate W facing upward. Examples of the carrier C include a FOUP (Front Opening Unify Pod). The FOUP is a sealed container. The carrier C may be an open container, regardless of the type. Among carriers C, there are those with a high visible light transmittance and those with a low visible light transmittance depending on the material. Among carriers C, there are those with a low visible light transmittance but a high infrared light transmittance depending on the material.
[0039] The unloading section 11 is disposed on the opposite side of the loading section 9 across the central portion in the width direction Y in the substrate processing apparatus 1. The unloading section 11 is arranged to the left of the loading section 9 in the Y direction. The unloading section 11 stores the processed substrate W in the carrier C and discharges the entire carrier C. The unloading section 11 that functions in this way includes, like the loading section 9, for example, two mounting tables 13 for placing the carrier C. The loading section 9 and the unloading section 11 are also referred to as load ports.
[0040] <3. Indexable Block>
[0041] The indexable block 5 is arranged adjacent to the rear X of the loading / unloading block 3 in the substrate processing apparatus 1. The indexable block 5 includes an index robot IR and a delivery unit 15.
[0042] The index robot IR is configured to be rotatable about a rotation axis parallel to the vertical direction Z. The index robot IR is configured to be movable in the width direction Y. The index robot IR includes a first hand 19 and a second hand 21. In FIG. 1, only one hand is shown for the sake of illustration. The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are independently configured to be retractable in the front-rear direction X. The index robot IR moves in the width direction Y and rotates around the vertical direction Z, and advances and retreats the first hand 19 and the second hand 21 to transfer the substrate W to and from each cassette C. Similarly, the index robot IR transfers the substrate W to and from the delivery unit 15. The direction in which the first hand 19 and the second hand 21 move when transferring the substrate W to and from the carrier C is defined as the retraction / extension direction FD.
[0043] The delivery unit 15 is arranged at the boundary of the indexable block 5 with the processing block 7. The delivery unit 15 is arranged, for example, at the central portion in the width direction Y. As shown in FIG. 2, the delivery unit 15 is formed long in the vertical direction Z.
[0044] The delivery unit 15 includes a first inversion unit 23, a path unit 25, a path unit 27, and a second inversion unit 29 from the lower side to the upper side in the vertical direction Z.
[0045] The first inversion unit 23 inverts the top and bottom of the substrate W received from the indexable block 5. The first inversion unit 23 inverts the horizontal posture of the substrate W. The second inversion unit 29 performs the reverse operation. That is, the second inversion unit 29 inverts the top and bottom of the substrate W received from the processing block 7.
[0046] The reversing directions of the above-described first reversing unit 23 and second reversing unit 29 may be opposite to each other. That is, the first reversing unit 23 converts the posture of the substrate W so that the surface faces upward. The second reversing unit 29 converts the posture of the substrate W so that the back surface faces upward.
[0047] The path portions 25 and 27 are used to transfer the substrate W between the index block 5 and the processing block 7. The path portion 25 is used, for example, to convey the substrate W from the processing block 7 to the index block 5. The path portion 27 is used, for example, to convey the substrate W from the index block 5 to the processing block 7. Note that the conveyance directions of the substrate W in the path portions 25 and 27 may be opposite to each other.
[0048] <4. Processing block>
[0049] The processing block 7 performs, for example, a cleaning process on the substrate W. The cleaning process is, for example, a process using a brush in addition to a processing liquid. As shown in FIG. 1, the processing block 7 is divided, for example, into a first row R1, a second row R2, and a third row R3 in the width direction Y. Specifically, the first row R1 is arranged on the left side Y. The second row R2 is arranged at the center of the width direction Y. In other words, the second row R2 is arranged to the right of the first row R1 in the Y direction. The third row R3 is arranged to the right of the second row R2 in the Y direction.
[0050] <4-1. First row>
[0051] The first row R1 of the processing block 7 includes a plurality of processing units 31. The first row R1 includes, for example, four processing units 31. The four processing units 31 of the first row R1 are stacked and arranged in the vertical direction Z. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit performs a cleaning process on the substrate W. Examples of the cleaning unit include a surface cleaning unit that cleans the surface of the substrate W and a back surface cleaning unit that cleans the back surface of the substrate W.
[0052] <Column 2 of 4-2>
[0053] The second column R2 of processing block 7 is provided with a center robot CR. The center robot CR is configured to be rotatable about a rotation axis parallel to the vertical direction Z. The center robot CR is configured to be movable up and down in the vertical direction Z. The center robot CR includes, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are each independently configured to be movable back and forth in the front-rear direction X and the width direction Y.
[0054] <Column 3 of 4-3>
[0055] The third column R3 of processing block 7 has the same configuration as the first column R1. That is, the third column R3 includes a plurality of processing units 31. The third column R3 includes, for example, four processing units 31. The four processing units 31 of the third column R3 are stacked and arranged in the vertical direction Z. Each processing unit 31 of the first column R1 and each processing unit 31 of the third column R3 are arranged to face each other in the width direction Y. Thereby, the center robot CR can access the opposing processing units 31 of the first column R1 and the third column R3 at the same height in the vertical direction Z.
[0056] The processing block 7 is configured as described above. Here, an operation example of the center robot CR will be briefly described. The center robot CR receives the substrate W from, for example, the first inversion unit 23. The center robot CR transports the substrate W to one of the processing units 31 of the first column R1 and the third column R3 to cause the substrate W to be processed. The center robot CR receives the substrate W that has been processed by one of the processing units 31 of the first column R1 and the third column R3. The center robot CR transports the substrate W to the second inversion unit 29.
[0057] <Placement table>
[0058] As shown in FIG. 1, the loading and unloading block 3 includes a mounting table 13 and a lid opening and closing mechanism 41.
[0059] The mounting table 13 has a carrier C placed thereon. The carrier C has a loading outlet CT. The loading outlet CT is formed on one side surface of the carrier C. The carrier C is provided with a lid (not shown). The lid is detachably configured at the loading outlet CT of the carrier C. The lid seals the inside of the carrier C. When the lid is attached to the carrier C, the atmosphere inside the carrier C is blocked from the outside.
[0060] The lid opening and closing mechanism 41 removes the lid from the carrier C or attaches the lid to the carrier C. The lid opening and closing mechanism 41 can fully open the loading outlet CT of the carrier C by descending while holding the lid.
[0061] <6. Control System>
[0062] Here, the control system of the substrate processing apparatus 1 will be described. The substrate processing apparatus 1 is comprehensively controlled by a control unit CU. The control unit CU includes a CPU, a memory, and the like. The control unit CU operates according to a program stored in advance. The control unit CU controls the attachment and detachment operation of the lid by the lid opening and closing mechanism 41 and the lifting operation of the lid opening and closing mechanism 41. The control unit CU controls the index robot IR. Specifically, the control unit CU controls the movement of the first hand 19 and the second hand 21 in the forward and backward direction FD, the movement of the first hand 19 and the second hand 21 in the vertical direction Z, and the rotation of the index robot IR around the vertical direction Z in the index robot IR. The control unit CU controls the processing of the substrate W in the processing unit 31. The control unit CU controls the center robot CR.
[0063] <7. Index Robot and Mounting Table>
[0064] Next, with reference to FIG. 3, the details of the index robot IR and the mounting table 13 will be described. FIG. 3 is a side view showing the main part of the first embodiment.
[0065] Here, the first hand 19 of the index robot IR will be described as an example, but the second hand 21 has the same configuration. In addition, in FIG. 3, a state in which the lid is removed from the carrier C is shown, and a plurality of grooves that abut and support both end sides in the frontward X and width direction Y of the substrate W are omitted and drawn.
[0066] The index robot IR has the hand drive unit 43 perform the elevating operation, turning operation, and advancing / retreating operation in the advancing / retreating direction FD of the first hand 19. The index robot IR includes a position output unit 45. The position output unit 45 outputs position information such as height position information in the vertical direction Z, front-back position information in the front-back direction X, and left-right position information in the width direction Y to the control unit CU. The control unit CU operates the hand drive unit 43 based on the position information from the position output unit 45. Thereby, the first hand 19 is controlled by the control unit CU.
[0067] The first hand 19 is provided with a camera 47 at the base end portion (rearward in the front-back direction X). The camera 47 has sensitivity to visible light. The camera 47 has, for example, a predetermined field of view. The predetermined field of view includes, for example, the substrate W in a state where a single substrate W is viewed directly from the carry-in / carry-out port CT, and includes at least the vertical regions above and below by the storage pitch of the substrate W in the carrier C. That is, when viewing the substrate W facing a single substrate W in the advancing / retreating direction FD, it includes the substrate W and at least the region of the substrate W arranged adjacent to that substrate W. The camera 47 has a photographing region in the ZY plane composed of the vertical direction Z and the width direction Y. Among the fields of view, it is preferable that the width direction Y reaches at least inside the grooves on both end sides in the width direction Y. Further, the camera 47 is preferably object-side telecentric. Thereby, distortion of the photographed substrate W can be suppressed, and the accuracy of the substrate information can be improved.
[0068] The camera 47 is connected to the information acquisition unit 49. The information acquisition unit 49 is connected to the control unit CU. The position output unit 45 is connected to the information acquisition unit 49. The information acquisition unit 49 controls the shooting conditions and shooting timing of the camera 47. The information acquisition unit 49 acquires substrate information including the position of the substrate W in the vertical direction Z based on the image output from the camera 47. Details of how to acquire the substrate information will be described later.
[0069] The mounting table 13 is provided with a pattern 51 and a light source 53. The pattern 51 and the light source 53 are erected on the mounting table 13. The light source 53 irradiates light toward the rear in the front-rear direction X. The light irradiated by the light source 53 includes visible light. The pattern 51 and the light source 53 are arranged in front of the carrier C in the front-rear direction X. The pattern 51 is arranged between the outer surface on the front side in the front-rear direction X of the carrier C and the light source 53. The pattern 51 is arranged outside the outer surface facing the loading / unloading port CT of the carrier C in the front-rear direction X. In plan view, the pattern 51 is arranged on the opposite side of the loading / unloading port CT with the substrate W stored in the carrier C interposed therebetween. The pattern 51 and the light source 53 are arranged at positions on the mounting table 13 where they do not interfere with the carrier C. The pattern 51 and the light source 53 are arranged slightly spaced apart in the front-rear direction X.
[0070] As will be described later, the light source 53 may be turned on only when the control unit CU takes an image FG and turned off when not taking an image, thereby achieving power saving.
[0071] Here, refer to FIGS. 4 and 5. FIG. 4 is a plan view showing the main part of the first embodiment. FIG. 5 is a diagram showing the details of the pattern.
[0072] Pattern 51 includes a member body 55 and a pattern body 57. The member body 55 is composed of a member that transmits the light of the light source 53. The pattern body 57 is provided behind the member body 55 in the front-rear direction X. The pattern body 57 is composed of a member with a low transmittance for the light of the light source 53. In other words, the pattern body 57 shields the light of the light source 53.
[0073] The pattern body 57 has a linear shape with a predetermined width. The pattern body 57 is inclined with respect to the vertical direction Z. The pattern body 57 is inclined downward to the left with respect to the vertical direction Z. The pattern body 57 is continuous without interruption in the inclined direction. The inclination angle of the pattern body 57 is, for example, 45°. A plurality of pattern bodies 57 are formed. Each of the plurality of pattern bodies 57 is arranged at an interval. The interval between each pattern body 57 is, for example, a constant interval. The pattern body 57 is asymmetric above and below with respect to the outer peripheral surface extending in the width direction Y of the substrate W as shown by the two-dot chain line in FIG. 5 when the substrate W is viewed horizontally from the carry-in / carry-out port CT.
[0074] The camera 47 attached to the hand 19 has a shooting center C1. The shooting center C1 is the center of the lens (not shown) of the camera 47 and the center of the image output by the camera 47. The camera 47 is preferably attached to the hand 19 such that the shooting center C1 and the center cp of the substrate W coincide in the width direction Y in a plan view. This is because the image obtained through the optical system has less distortion near the center. When obtaining the interval in the vertical direction Z between substrates W with deformations such as warping based on substrate information, the center cp of the substrate W becomes more important. The camera 47 is set with an angle of view in a plan view so as to include both end edges in the width direction Y. In FIG. 4, the angle of view is shown by a two-dot chain line extending in the front-rear direction X from the camera 47.
[0075] <8. Image>
[0076] Here, refer to FIG. 6. FIG. 6 is a schematic diagram showing an example of the pattern when viewed from the camera side.
[0077] In Fig. 6, it is the state of viewing the pattern 51 from the carry-in / outlet CT side through three substrates W. Among the three substrates W, the substrate W1 has no deformation such as warping. The substrate W2 has an upward convex warp (so-called umbrella-shaped deformation). The substrate W3 has a downward convex warp (so-called bowl-shaped deformation).
[0078] When viewed horizontally from the carry-in / outlet CT through these substrates W1 to W3, only the outer peripheral surface of the substrate W1 without deformation can be seen as a shadow. The upper and lower surfaces of the substrate W1 without warp cannot be seen. Therefore, the pattern main body 57 can be seen as it is at the upper and lower parts of the outer peripheral surface of the substrate W1. That is, only the pattern main body 57 inclined downward to the left can be seen above and below the outer peripheral surface of the substrate W1. In addition, in the substrate W displaced from the imaging center C1, even if there is no deformation in the substrate W itself, it will be imaged obliquely. Therefore, the pattern main body 57 is inverted.
[0079] For the substrate W2 with an upward convex deformation, its outer peripheral surface can be seen as a shadow. Further, for the substrate W2 with an upward convex deformation, an inverted image 61 that is upside down with respect to the pattern main body 57 can be seen above the shadow of the outer peripheral surface. That is, for the substrate W2 with an upward convex deformation, the inverted image 61 can be seen on the upper surface of the shadow of the outer peripheral surface. The inverted image 61 is inclined downward to the right, opposite to the pattern main body 57. The pattern main body 57 located in the convex portion of the substrate W2 (the pattern main body 57 located in front of the convex portion of the substrate W2) cannot be seen from the carry-in / outlet CT side. However, the pattern main body 57 located above the convex portion of the substrate W2 can be seen reflected by the convex portion. Therefore, the pattern main body 57 can be seen as the inverted image 61 in the convex portion of the substrate W2.
[0080] The substrate W3 with a downward convex deformation has an outer peripheral surface that appears as a shadow. Further, the substrate W3 with a downward convex deformation has an inverted image 61 visible under the shadow of the outer peripheral surface. That is, in the substrate W3 with a downward convex deformation, the inverted image 61 is visible on the lower surface of the shadow of the outer peripheral surface. The inverted image 61 is inclined downward to the right, contrary to the pattern body 57. The pattern body 57 located in the convex portion of the substrate W3 is not visible from the carry-out outlet CT side. However, the pattern body 57 located below the convex portion of the substrate W3 is visible as reflected by the convex portion. Therefore, in the convex portion of the substrate W3, the pattern body 57 appears as the inverted image 61.
[0081] When the camera 47 is centered on the substrate W2 at the imaging center C1, it captures the image FG shown by the two-dot chain line. As described above for the field of view, the image FG includes, for example, a state where a single substrate W is viewed directly from the carry-out outlet CT, includes the substrate W, and includes upper and lower regions in the vertical direction Z by at least the storage pitch of the substrate W in the carrier C. However, in FIG. 6, the two-dot chain line indicating the image FG is drawn in a slightly smaller area for easy recognition. The information acquisition unit 49 receives the image FG from the camera 47. The information acquisition unit 49 receives height position information from the position output unit 45. The information acquisition unit 49 acquires substrate information such as the shape of the warp of a single substrate W and the interval of the substrate W in the vertical direction Z based on the substrate W, the pattern body 57, and the inverted image 61 in the image FG.
[0082] <9. Acquisition of Substrate Information>
[0083] The acquisition of substrate information is performed prior to processing a plurality of substrates W stored in the carrier C. That is, as shown in FIG. 3, after the lid (not shown) is removed from the carrier C, the index robot IR is moved in the vertical direction Z while acquiring substrate information. Specifically, the control unit CU, for example, captures the uppermost substrate W at the imaging center C1 and then moves downward in the vertical direction Z by the storage pitch of the substrate W in the carrier C in the vertical direction Z to capture the image FG for each substrate W. Thereafter, the information acquisition unit 49 acquires substrate information based on the image FG and the height position information from the position output unit 45.
[0084] The substrate information acquired by the information acquisition unit 49 is used by the control unit CU. Specifically, the control unit CU operates the index robot IR to sequentially unload each substrate W from the carrier C. At this time, the control unit CU adjusts the height when the first hand 19 (second hand 21) of the index robot IR enters the carrier C based on the substrate information. For example, when unloading the substrate W1 in FIG. 6, since the substrate W2 below it is warped convexly upward, the entry height of the first hand 19 (second hand 21) is made higher than the normal height based on the substrate information.
[0085] According to this embodiment, the camera 47 photographs the pattern 51 from the carry-in exit CT side. The pattern 51 is asymmetric in the vertical direction with respect to the surface of the substrate W when viewed from the carry-in exit CT. Therefore, when there is no warp or the like in the shape of the substrate W, the pattern appears as it is in the area other than the substrate W in the image FG. On the other hand, if there is a warp or the like in the shape of the substrate W, the pattern 51 does not appear in the image FG, or the pattern 51 is reflected on the surface of the substrate W and an inverted image 61 appears. Therefore, the image FG by the camera 47 can be made less susceptible to the influence of reflected light or the like on the substrate W surface, and the boundary between the substrate W and the background can be made prominent. As a result, the information acquisition unit 49 can accurately acquire the substrate information based on the image FG photographed by the camera 47.
[0086] Note that the correspondence between the above-described Example 1 and the present invention is as follows.
[0087] The carrier C corresponds to the "container" in the present invention. The camera 47 corresponds to the "imaging unit" in the present invention. The index robot IR corresponds to the "moving mechanism" in the present invention. The member main body 55 corresponds to the "standing member" in the present invention. The camera 47, the information acquisition unit 49, and the pattern 51 correspond to the "substrate information acquisition device" in the present invention.
[0088] The present invention is not limited to the above-described embodiment, and can be implemented with the following modifications.
[0089] (1) In the first embodiment, the substrate processing apparatus 1 configured as shown in FIGS. 1 and 2 was taken as an example for explanation. However, the present invention is not limited to such a form. That is, the configuration of the index block 5 and the processing block 7 is not limited. For example, the index block 5 does not necessarily need to include the first hand 19 and the second hand 21, and it may include at least one hand.
[0090] (2) In the first embodiment, the substrate processing apparatus 1 incorporates the substrate information acquisition apparatus according to the present invention, which includes the camera 47, the information acquisition unit 49, and the pattern 51. However, the present invention is not limited to such an embodiment. That is, the substrate information acquisition apparatus including the camera 47, the information acquisition unit 49, and the pattern 51 may be configured separately. In this case, in the substrate information acquisition apparatus, the substrate information of each substrate W on the carrier C may be acquired, the substrate information may be transmitted to the substrate processing apparatus 1, and the substrate information may be used when the substrate W is unloaded from the carrier C.
[0091] (3) In the first embodiment, a configuration in which one camera 47 is provided on the first hand 19 (the second hand 21) was illustrated. However, the present invention is not limited to such a configuration.
[0092] Here, refer to FIG. 7. FIG. 7 is a plan view showing a modification of the first embodiment.
[0093] In this modification example, the first hand 19 is provided with the cameras 47L and 47R. The cameras 47L and 47R have the same angle of view respectively. Thus, components with the same specifications can be used and the cost can be reduced. However, cameras 47L and 47R with different angles of view may also be adopted. The camera 47R has an angle of view from a position beyond the right end portion in the width direction Y of the substrate W to the inside of the left end portion in the width direction Y. The camera 47L has an angle of view from a position beyond the left end portion in the width direction Y of the substrate W to the inside of the right end portion in the width direction Y. The information acquisition unit 49 acquires substrate information by, for example, synthesizing the images FG-R and FG-L captured by the cameras 47R and 47L. In the case of this configuration, the angle of view of each of the cameras 47R and 47L can be made narrower than in the above-described embodiment. Therefore, distortion of the images FG-R and FG-L can be suppressed, and improvement in the accuracy of the substrate information can be expected.
[0094] (4) In the first embodiment, the light source 53 and the pattern 51 are arranged at a distance in the front-rear direction X. However, in the present invention, the light source 53 and the pattern 51 may be arranged in close contact with each other. Also, the light source 53 and the pattern 51 may be limited to the size of only the imaging region of the camera 47. In this case, in conjunction with the movement of the camera 47, the light source 53 and the pattern 51 may be moved in a state of facing the camera 47.
Embodiment
[0095] Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 8 is a side view showing the main part of the second embodiment. Note that the same components as those in the above-described first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.
[0096] This embodiment includes an image display unit 71 on the mounting table 13. Nothing is arranged between the image display unit 71 and the outer surface of the carrier C.
[0097] The image display unit 71 can display any image. The image display unit 71 emits light. The image display unit 71 irradiates light toward the outer surface of the carrier C. The image display unit 71 is composed of, for example, a liquid crystal display device, an organic EL display device, or the like. The image display unit 71 causes the pattern main body 57 to be displayed as the pattern 51 by an image under the control of the control unit CU. Thereby, the pattern 51 of the image display unit 71 is projected onto the outer surface of the carrier C.
[0098] According to this embodiment, the pattern 51 displayed on the image display unit 71 can be easily changed. Therefore, in addition to the effects of the above-described Example 1, this embodiment can be easily changed to a pattern 51 suitable for visualizing the boundary between the substrate W and the background according to the shape of the substrate W. As a result, regardless of the form of deformation of the substrate W, the substrate information can be accurately acquired based on the captured image.
[0099] Note that the correspondence between the above-described Example 2 and the present invention is as follows.
[0100] The carrier C corresponds to the "container" in the present invention. The camera 47 corresponds to the "imaging unit" in the present invention. The indexer robot IR corresponds to the "moving mechanism" in the present invention. The camera 47, the information acquisition unit 49, the pattern 51, and the image display unit 71 correspond to the "substrate information acquisition device" in the present invention.
[0101] The present invention is not limited to the above-described embodiments, and can be implemented with modifications as in (1) to (3) in the above-described Example 1.
Example
[0102] Next, Example 3 of the present invention will be described with reference to the drawings. FIG. 9 is a side view showing the main part of Example 3. Note that the same components as those in the above-described Example 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0103] This embodiment includes a pattern 51A and a light source 53A on the outer surface of the carrier C. The first hand 19 includes a camera 47A.
[0104] The pattern 51A and the light source 53A are erected on the mounting table 13. The pattern 51A and the light source 53A are arranged in front in the front-rear direction X of the carrier C. The light source 53A irradiates infrared light. The light source 53A mainly irradiates infrared light. The light source 53A may include visible light in the irradiated light. The pattern 51A is such that the pattern main body 57A is opaque to infrared light. The member main body 55A is transparent to infrared light. In other words, the pattern main body 57A has a low transmittance of infrared light, and the member main body 55A has a high transmittance of infrared light. Note that the pattern main body 57A is the same as the above-described pattern main body 57 except for the characteristic of being opaque to infrared light. Also, the member main body 55A is the same as the above-described main body member 55 except for the characteristic of being transparent to infrared light.
[0105] The camera 47A can detect infrared light. The camera 47A has a high detection sensitivity for infrared light. The camera 47A captures the pattern main body 57A of the pattern 51A as an image FG.
[0106] This embodiment is useful when the carrier C is formed of a material having a low transmittance of visible light but a high transmittance of infrared light. It is also suitable for acquiring substrate information of a substrate W on which a film that is photosensitive to ultraviolet rays is formed.
[0107] The correspondence between the above-described Example 3 and the present invention is as follows.
[0108] Carrier C corresponds to the "container" in the present invention. Camera 47A corresponds to the "imaging unit" in the present invention. Indexer robot IR corresponds to the "moving mechanism" in the present invention. Member body 55A corresponds to the "standing member" in the present invention. Light source 53A corresponds to the "infrared light source" in the present invention. Camera 47A, information acquisition unit 49, pattern 51A, and light source 53A correspond to the "substrate information acquisition device" in the present invention. Pattern body 57A corresponds to the "pattern" in the present invention.
[0109] The present invention is not limited to the above embodiments, and can be variably implemented as in (1) to (4) in the above Example 1.
Example
[0110] Next, Example 4 of the present invention will be described with reference to the drawings. FIG. 10 is a side view showing the main part of Example 4. For the same configuration as that in the above-described Example 1, the same reference numerals are given and detailed description is omitted.
[0111] In this example, pattern 51B is provided on the outer surface of carrier C. The first hand 19 is provided with camera 47A.
[0112] Pattern 51B is provided with heating wire 73. Heating wire 73 constitutes a pattern body 57B inclined in the same manner as the pattern body 57 in the above-described Example 1. When energized, heating wire 73 generates heat and irradiates infrared light.
[0113] Camera 47A can detect infrared light. Camera 47A has high detection sensitivity for infrared light. Camera 47A captures the pattern body 57B of pattern 51B as image FG.
[0114] This embodiment is useful when the carrier C is formed of a material with a low visible light transmittance but a high infrared light transmittance. It is also suitable for acquiring substrate information of the substrate W on which a film that is photosensitive to ultraviolet rays is formed. Furthermore, since the heating wire 73 also serves as a light source, thinning can be achieved.
[0115] Incidentally, the correspondence between the above-described Example 4 and the present invention is as follows.
[0116] The carrier C corresponds to the "container" in the present invention. The camera 47A corresponds to the "imaging unit" in the present invention. The indexer robot IR corresponds to the "moving mechanism" in the present invention. The camera 47A, the information acquisition unit 49, the pattern 51B, and the heating wire 73 correspond to the "substrate information acquisition device" in the present invention. The heating wire 73 corresponds to the "pattern" in the present invention.
[0117] The present invention is not limited to the above-described embodiments, and can be implemented in a modified manner as in (1) to (3) in the above-described Example 1.
Example
[0118] Next, Example 5 of the present invention will be described with reference to the drawings. FIG. 11 is a side view showing the main part of Example 5. Note that the same components as those in the above-described Example 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0119] This embodiment includes a pattern 51C on the inner surface of the carrier C. The pattern 51C is erected along the inner surface facing the loading / unloading port CT of the carrier C in the front-rear direction X. The pattern 51C is attached before the substrate W is stored in the carrier C. The pattern 51C is disposed on the opposite side of the loading / unloading port CT with the substrate W stored in the carrier C interposed therebetween in a plan view. The pattern 51C includes a pattern main body 57C. The pattern main body 57C has the same configuration as the pattern main body 51 in the above-described Example 1. The pattern main body 57C is disposed behind the pattern 51 in the front-rear direction X.
[0120] The first hand 19 is provided with a camera 47. An irradiation light source 75 is disposed above the camera 47. The irradiation light source 75 irradiates light onto the pattern 51C. The irradiation light source 75 illuminates the pattern 51C with an illuminance at which the camera 47 can capture the pattern main body 57C as an image FG. The irradiation light source 75 is preferably operated by a control unit CU so as to irradiate in accordance with the imaging timing by the camera 47. Thereby, power saving can be achieved.
[0121] According to the present embodiment, since the pattern 51C is disposed on the inner surface of the carrier C, it is not affected by the material of the carrier C. Further, since the pattern 51C is imaged without passing through the carrier C, the pattern 51C can be imaged with high contrast. Therefore, the accuracy of the substrate information can be improved.
[0122] Incidentally, the correspondence between the above-described Example 5 and the present invention is as follows.
[0123] The carrier C corresponds to the "container" in the present invention. The camera 47 corresponds to the "imaging unit" in the present invention. The index robot IR corresponds to the "moving mechanism" in the present invention. The camera 47, the information acquisition unit 49, and the pattern 51C correspond to the "substrate information acquisition device" in the present invention. The pattern main body 57C corresponds to the "pattern" in the present invention.
[0124] The present invention is not limited to the above-described embodiment, and can be implemented in a modified manner as in (1) to (3) in the above-described Example 1.
Example
[0125] Next, Example 6 of the present invention will be described with reference to the drawings. FIG. 12 is a side view showing a main part of Example 6. FIG. 13 is a plan view showing a main part of Example 6. Note that the same components as those in the above-described Example 1 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0126] This embodiment includes a camera 47 and a projection unit 77 on a first hand 19. The camera 47 photographs the inner surface of the carrier C facing the loading / unloading port CT of the carrier C in the front-rear direction X. The center C1 of the camera 47 in the width direction Y does not coincide with the center cp of the substrate W. The camera 47 is located to the left of the center cp of the substrate W in the width direction Y. The projection unit 77 is located to the right of the center cp of the substrate W in the width direction Y.
[0127] The projection unit 77 projects an image. The projection unit 77 projects an image onto the inner surface of the carrier C. The projection unit 77 projects a pattern 51D as the image. The pattern 51D is projected at least into the upper and lower spaces of the substrate W that is the imaging target of the camera 47. The upper and lower spaces include the space between the lower surface of the substrate W disposed above the substrate W that is the imaging target and the upper surface of the substrate W disposed below the substrate W that is the imaging target. The pattern 51D includes a pattern main body (not shown) in the same manner as in the above-described Example 1.
[0128] Note that the correspondence between the above-described Example 6 and the present invention is as follows.
[0129] The carrier C corresponds to the "container" in the present invention. The camera 47 corresponds to the "imaging unit" in the present invention. The index robot IR corresponds to the "moving mechanism" in the present invention. The camera 47D, the information acquisition unit 49, and the projection unit 77 correspond to the "substrate information acquisition device" in the present invention.
[0130] The present invention is not limited to the above-described embodiment, and can be implemented in a modified manner as in (1) to (3) in the above-described Example 1.
[0131] The present invention is not limited to the above-described embodiment, and can be implemented in a modified manner as follows.
[0132] (1) In each of the above-described Examples 1 to 6, the substrate W is assumed to have a circular shape in a planar view, but the present invention is not limited to such a substrate W. For example, the substrate W may be rectangular in a planar view. In addition, the warpage of the substrate W has been described as being umbrella-shaped or bowl-shaped. However, the present invention is also applicable to acquiring substrate information for a substrate W that is three-dimensionally deformed due to other warpage such as a half-pipe shape.
[0133] (2) In each of the above-described embodiments 1 to 6, the movement mechanism is configured as the indexer robot IR. However, a configuration may be adopted in which a movement mechanism separate from the indexer robot IR is provided to move an image capturing unit such as the camera 47 in the vertical direction Z.
[0134] (3) In each of the above-described Examples 1 to 6, the camera 47 moves only in the vertical direction Z. However, the present invention is not limited to this configuration. In other words, if the camera 47 has a narrow angle of view and can only capture a portion of the center of the substrate W, the camera 47 may be moved in the width direction Y to capture multiple images of one substrate W, which are then combined to obtain a single image FG.
[0135] (4) In each of the above-described Examples 1 to 6, the pattern is inclined in the vertical direction Z and has a continuous linear shape with a predetermined width. However, the present invention is not limited to such a shape. That is, it may have a dotted, discontinuous linear shape. Furthermore, any pattern may be used as long as it has an asymmetrical shape above and below the surface of the substrate when viewed horizontally from the loading / unloading port CT side. Furthermore, the inclination angle of the pattern body 57 is not limited to 45°. Furthermore, the spacing between the pattern bodies 57 is not limited to a fixed spacing.
[0136] (5) In each of the above-described first to sixth embodiments, a camera 47 having a field of view in the vertical direction Z is used as the imaging unit. However, the present invention is not limited to this configuration. For example, a line sensor having a field of view only in the width direction Y may be used as the imaging unit. In this case, the line sensor may be moved in the vertical direction Z to acquire one image FG.
[0137] (6) In each of the above-described Examples 1 to 6, the camera 47 as the imaging unit was assumed to be object-side telecentric. However, the present invention is not limited to such a configuration. That is, the camera 47 may be object-side non-telecentric. However, distortion occurs in the image FG other than the imaging center. Therefore, it is preferable to acquire the substrate information using only the vicinity of the imaging center in the image FG. Further, for portions other than the imaging center of the image FG, conversion processing may be performed to acquire the substrate information.
Explanation of Reference Numerals
[0138] W... Substrate 1... Substrate processing apparatus 3... Loading / unloading block 5... Indexer block 7... Processing block X... Front-rear direction Y... Width direction Z... Vertical direction C... Carrier 13... Mounting table IR... Indexer robot 19... First hand 21... Second hand FD... Forward / backward direction 31... Processing unit CR... Center robot CT... Loading / unloading port 43... Hand drive unit 45... Position output unit 47... Camera 49... Information acquisition unit 51... Pattern 53... Light source 55... Member body 57... Pattern body C1... Imaging center cp... Center of substrate 61... Inverted image FG... Image
Claims
1. A substrate information acquisition device for acquiring substrate information including vertical positions of substrates stored in a container that can store a plurality of substrates in a horizontal position at a distance from each other and that can load and unload substrates through an inlet / outlet formed on one side of the container, comprising: a pattern that is arranged on the opposite side of the loading / unloading port across the substrate stored in the container in a plan view, and that is asymmetrical above and below the surface of the substrate as viewed from the loading / unloading port; an imaging unit that images the pattern from the loading / unloading port side; an information acquisition unit that acquires the substrate information about the substrates stored in the container based on the image captured by the imaging unit; A substrate information acquisition device comprising:
2. 2. The substrate information acquisition device according to claim 1, The substrate information acquisition device further comprises a movement mechanism that moves the photographing unit in the direction in which the plurality of substrates are stacked.
3. 2. The substrate information acquisition device according to claim 1, The substrate information acquisition device is characterized in that the pattern is arranged on the outside of the outer surface of the container that faces the loading / unloading port.
4. 4. The substrate information acquisition device according to claim 3, a light source that irradiates light from outside the container toward the outer surface; a standing member disposed between the light source and the container and transmitting light from the light source; Equipped with The substrate information acquisition device is characterized in that the pattern is formed on the standing member.
5. 4. The substrate information acquisition device according to claim 3, an image display unit that is disposed outside the container, emits light, and displays an arbitrary image on the outer surface side; The substrate information acquisition device is characterized in that the pattern is displayed on the image display unit.
6. 4. The substrate information acquisition device according to claim 3, the imaging unit is capable of detecting infrared light, an infrared light source that irradiates light including infrared light from the outside of the container toward the outer surface; a standing member disposed between the infrared light source and the container and transmitting infrared light from the infrared light source; Equipped with The substrate information acquisition device is characterized in that the pattern is formed on the standing member.
7. 4. The substrate information acquisition device according to claim 3, the imaging unit is capable of detecting infrared light, a heating wire that irradiates light including infrared light from the outside of the container toward the outer surface, The substrate information acquisition device is characterized in that the pattern is formed by the arrangement of the heating wires.
8. 2. The substrate information acquisition device according to claim 1, The substrate information acquisition device is characterized in that the pattern is disposed on an inner surface of the container opposite the loading / unloading port.
9. 2. The substrate information acquisition device according to claim 1, a projection unit that projects an image from the loading / unloading port side toward the inner surface, The substrate information acquisition device, wherein the pattern is formed by the image of the projection unit.
10. 2. The substrate information acquisition device according to claim 1, The substrate information acquisition device is characterized in that the pattern is a straight line inclined from the vertical direction.
11. A substrate information acquisition device according to any one of claims 1 to 10; a processing unit that performs a predetermined process on the substrate; a hand for holding the substrate; a hand driving unit that drives the hand toward and away from the container and also drives the hand up and down in a vertical direction in order to transport the substrate to be processed by the processing unit; a control unit that operates the hand driving unit based on the substrate information acquired by the substrate information acquisition device; A substrate processing apparatus comprising:
Citation Information
Patent Citations
Substrate transfer robot and control method therefor
JP2023030876A