Non-contact type data receiving and transmitting body

Abstract

To provide a non-contact type data receiving and transmitting body in which air bubbles are less likely to remain in an adhesion layer.SOLUTION: A non-contact type data receiving and transmitting body includes a plate-like base material 50, an IC chip 20, an antenna 30, and an adhesion layer 70. The adhesion layer 70 is formed of a curable adhesive. The adhesion layer 70 bonds the IC chip 20 to the base material 50. The antenna 30 has two wiring portions 57, 58 at least partially facing each other. Projections 59, 60 projecting toward each other are respectively formed on the two wiring portions 57, 58. The projections 59, 60 are each formed into a shape having two inclined sides that become close to each other with the increase of the projection height. The IC chip 20 is disposed across the two projections 59, 60.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a non-contact data transmitter.

Background Art

[0002] In recent years, RFID (Radio Frequency IDentification) has been used for the purpose of efficiently performing management such as distribution management, history management, and article management. A non-contact data transmitter using RFID includes, for example, an IC chip, an antenna connected to the IC chip, and a base material (see, for example, Patent Document 1). The IC chip is adhered to the base material by an adhesive (adhesive layer).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the non-contact data transmitter, when many bubbles are formed in the adhesive layer, the communication characteristics may be affected during long-term use.

[0005] One aspect of the present invention aims to provide a non-contact data transmitter in which bubbles hardly remain in the adhesive layer.

Means for Solving the Problems

[0006] One aspect of the present invention provides a non-contact data transmitter comprising a plate-shaped substrate, an IC chip provided on the substrate, an antenna provided on the substrate and electrically connected to the IC chip, and an adhesive layer formed of a curable adhesive for bonding the IC chip and the substrate. The antenna has at least a part with two facing wiring portions, and convex portions protruding in a direction approaching each other are respectively formed on the two wiring portions. The convex portion has a shape with two inclined sides approaching each other as the protruding height increases, and the IC chip is installed across the two convex portions.

[0007] The IC chip preferably includes two bump portions electrically connected to the respective convex portions, and the bump portion preferably has a convex portion that is convex in the same direction as the connected convex portion.

[0008] At least a part of the two wiring portions is preferably formed in parallel, and the two convex portions are preferably formed on the facing side edges of the wiring portions.

[0009] The distance between the two convex portions may be smaller than the distance between the two bump portions.

[0010] The antenna preferably includes two main line portions extending in different directions from each other, two radiation portions respectively connected to the two main line portions, and two impedance adjustment portions in which a portion including the base end is connected to the main line portion and the wiring portion is formed at the tip.

Advantages of the Invention

[0011] According to one aspect of the present invention, it is possible to provide a non-contact data transmitter in which air bubbles are less likely to remain in the adhesive layer.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

MODE FOR CARRYING OUT THE INVENTION

[0013] Hereinafter, with reference to the drawings, the non-contact data transmitter of the present embodiment will be specifically described.

[0014] [Non-contact data transmitter] FIG. 1 is a plan view showing a non-contact data transmitter according to the embodiment. FIGS. 2 and 3 are plan views showing a part of the non-contact data transmitter. FIG. 4 is a plan view showing the tip extension part. FIG. 5(A) is a plan view of the IC chip. FIG. 5(B) is a side view of the IC chip. FIG. 6 is a plan view showing a part of the non-contact data transmitter. FIG. 7 is a sectional view taken along the line I-I of FIG. 6.

[0015] As shown in FIG. 1, the non-contact data transmitter 10 includes an IC chip 20, an antenna 30, a base material 50, and an adhesive layer 70 (see FIG. 3).

[0016] The longitudinal direction (the left - right direction in FIG. 1) of the main surface 40a of the base material 50 is the X - direction. One direction of the X - direction (the right side in FIG. 1) is the +X side. The direction opposite to the +X side is the -X side. The short - hand direction of the main surface 40a of the base material 50 is the Y - direction. The Y - direction is perpendicular to the X - direction. One direction of the Y - direction (the upper side in FIG. 1) is the +Y side. The direction opposite to the +Y side is the -Y side. The Z - direction is perpendicular to the X - direction and the Y - direction. Looking from the Z - direction is called a plan view.

[0017] The antenna 30 has two main - line parts 31, 32, two impedance - adjusting parts 33, 34, and two radiation parts 35, 36. The antenna 30 is formed on the first main surface 50a of the base material 50.

[0018] The two main - line parts 31, 32 extend in a direction away from each other along the longitudinal direction (X - direction) of the base material 50. The two main - line parts 31, 32 are at positions symmetric with respect to the center in the longitudinal direction of the base material 50. The proximal ends of the main - line parts 31, 32 are electrically connected to each other.

[0019] The distal ends (the ends opposite to the proximal ends) of the two main - line parts 31, 32 are respectively connected to the radiation parts 35, 36. The main - line part 31 and the radiation part 35 form a radiation element 37. The main - line part 32 and the radiation part 36 form a radiation element 38.

[0020] The radiation parts 35, 36 have meander parts 39, 40, antenna end parts 41, 42, and turning - back parts 43, 44, 45, 46. The proximal end of the meander part 39 is connected to the distal end of the main - line part 31. The proximal end of the meander part 40 is connected to the distal end of the main - line part 32.

[0021] The lengths and the number of turns of the meander parts 39, 40 are appropriately adjusted according to the target communication distance of the antenna 30. In the non - contact data transmitter 10 of the present embodiment, the number of turns of the meander parts 39, 40 is 1.25 turns.

[0022] The antenna end 41 is connected to the tip (the end opposite to the base end) of the meander portion 39. The antenna end 42 is connected to the tip (the end opposite to the base end) of the meander portion 40. The shapes of the antenna ends 41 and 42 are not particularly limited, but are preferably rectangular (such as square or rectangular) in a plan view. By making the shapes of the antenna ends 41 and 42 rectangular, the directivity of the antenna 30 can be broadened.

[0023] The folding portions 43 and 44 each extend toward the main line portion 31 side starting from both ends in the width direction (Y direction) of the antenna end 41. The folding portions 43 and 44 extend parallel to the main line portion 31. The folding portions 45 and 46 each extend toward the main line portion 32 side starting from both ends in the width direction (Y direction) of the antenna end 42. The folding portions 45 and 46 extend parallel to the main line portion 32.

[0024] The folding portions 43, 44, 45, and 46 are formed to adjust the peak of the frequency of the radio wave received by the antenna 30. By providing the folding portions 43, 44, 45, and 46, the peak of the frequency of the radio wave received by the antenna 30 can be shifted to the high-frequency side. The lengths of the folding portions 43, 44, 45, and 46 are appropriately adjusted according to the peak of the frequency of the radio wave received by the target antenna 30.

[0025] The meander portion 39 is formed within the region partitioned by the folding portions 43 and 44 and the antenna end 41. The meander portion 40 is formed within the region partitioned by the folding portions 45 and 46 and the antenna end 42. Therefore, deterioration of the radiation efficiency of the antenna 30 can be suppressed. Accordingly, a decrease in the communication distance can be suppressed. By forming the meander portions 39 and 40 within the aforementioned regions, the antenna 30 can be miniaturized.

[0026] The length of the antenna 30 (dimension in the X direction) corresponds to, for example, a half wavelength of a frequency (300 MHz to 30 GHz) such as the extremely high frequency band (UHF) or the microwave band that can be used for a non-contact IC module such as a non-contact IC card. The length of the radiating elements 37, 38 (dimension in the X direction) corresponds to, for example, a quarter wavelength.

[0027] As shown in FIG. 2, the impedance adjusting units 33, 34 are provided to match the impedance between the IC chip 20 and the antenna 30. The impedance adjusting units 33, 34 supply the high-frequency power received by the antenna 30 from an information reading / writing device (reader / writer) to the IC chip 20.

[0028] The impedance adjusting units 33, 34 include two first extending portions 51, 52, two reversing portions 53, 54, two second extending portions 55, 56, two tip extending portions 57, 58, and two convex portions 59, 60. The two impedance adjusting units 33, 34 are located at positions symmetric with respect to the center in the longitudinal direction of the base material 50. The two impedance adjusting units 33, 34 are each formed in a loop shape (for example, a U shape).

[0029] The portions including the base ends of the first extending portions 51, 52 are respectively connected to the main line portions 31, 32. The two first extending portions 51, 52 extend in a direction away from each other along the longitudinal direction (X direction) of the base material 50.

[0030] The two reversing portions 53, 54 connect the tips of the first extending portions 51, 52 and the base ends of the second extending portions 55, 56 respectively. The two reversing portions 53, 54 extend from the tips of the first extending portions 51, 52 (ends opposite to the base ends) in the width direction (Y direction) of the base material 50. The reversing portions 53, 54 may have a curved shape that bulges in a direction away from each other.

[0031] The two second extending portions 55, 56 extend from the tips of the reversing portions 53, 54 in a direction approaching each other along the longitudinal direction (X direction) of the base material 50. The tips of the two second extending portions 55, 56 face each other.

[0032] As shown in FIGS. 2 and 3, the two tip extending portions 57 and 58 respectively protrude from the tips of the second extending portions 55 and 56. The tip extending portion 57 extends in a direction approaching the tip of the second extending portion 56 (-X side). The tip extending portion 58 protrudes in a direction approaching the tip of the second extending portion 55 (+X side). The tip extending portions 57 and 58 are examples of "wiring portions".

[0033] Among the two tip extending portions 57 and 58, at least the length portion including the tip is formed in parallel. The two tip extending portions 57 and 58 are formed apart from each other in the width direction (Y direction) of the base material 50. The length portions including the tips of the two tip extending portions 57 and 58 face each other in the width direction of the base material 50. The inner edges 57a and 58a (side edges) of the tip extending portions 57 and 58 face each other in the width direction of the base material 50. The tip extending portions 57 and 58 may be formed in parallel over the entire length. The tip extending portions 57 and 58 may be formed in parallel only for a part including the tip.

[0034] As shown in FIG. 6, the distance G3 between the tip extending portion 57 and the tip extending portion 58 may be smaller than the length (dimension in the Y direction) L1 of the IC chip 20. The distance G3 may be, for example, 80% or more and 100% or less with respect to the length L1.

[0035] As shown in FIG. 4, the convex portions 59 and 60 (the first convex portion 59 and the second convex portion 60) are respectively formed on the inner edges 57a and 58a of the tip extending portions 57 and 58. The convex portions 59 and 60 protrude in a direction approaching each other. The first convex portion 59 protrudes in a direction approaching the second convex portion 60 (+Y side) from the inner edge 57a of the tip extending portion 57. The second convex portion 60 protrudes in a direction approaching the first convex portion 59 (-Y side) from the inner edge 58a of the tip extending portion 58.

[0036] The first convex portion 59 is shaped such that its width (dimension in the X direction) gradually narrows in the protruding direction. The first convex portion 59 has two inclined sides 59a, 59a that approach each other as the protruding height increases. The first convex portion 59 is formed in an inverted V shape having the inclined sides 59a, 59a. That is, the first convex portion 59 is formed in a triangular shape having two inclined sides 59a, 59a. The first convex portion 59 is, for example, a triangular shape (isosceles triangular shape) in which the lengths of the two inclined sides 59a, 59a are equal. One inclined side 59a (the left inclined side 59a in FIG. 4) increases in protruding height as it goes in the +X direction. The other inclined side 59a (the right inclined side 59a in FIG. 4) increases in protruding height as it goes in the -X direction. The inclination angle of the inclined side 59a with respect to the X direction is, for example, 20° or more and 50° or less.

[0037] The second convex portion 60 is shaped such that its width (dimension in the X direction) gradually narrows in the protruding direction. The second convex portion 60 has two inclined sides 60a, 60a that approach each other as the protruding height increases. The second convex portion 60 is formed in an inverted V shape having the inclined sides 60a, 60a. That is, the second convex portion 60 is formed in a triangular shape having two inclined sides 60a, 60a. The second convex portion 60 is, for example, a triangular shape (isosceles triangular shape) in which the lengths of the two inclined sides 60a, 60a are equal. One inclined side 60a (the left inclined side 60a in FIG. 4) increases in protruding height as it goes in the +X direction. The other inclined side 60a (the right inclined side 60a in FIG. 4) increases in protruding height as it goes in the -X direction. The inclination angle of the inclined side 60a with respect to the X direction is, for example, 20° or more and 50° or less. The second convex portion 60 may have the same shape as the first convex portion 59.

[0038] The inclined side may be linear. The inclined side may be a curved shape (curved convex or curved concave). The curved shape may be an arc shape, an elliptical arc shape, a quadratic curve shape, etc. The inclined side may be a shape combining a curved convex portion and a curved concave portion.

[0039] As shown in FIG. 1, the antenna 30 can be formed of a conductive ink such as a polymer-based conductive ink, a silver ink composition, etc. The antenna 30 may be formed of, for example, a metal thin film formed by metal foil, plating, etc.; a metal thin film formed by metal vapor deposition, etc.; or a metal plate, etc.

[0040] As shown in FIG. 3, the IC chip 20 is not particularly limited as long as it can write and read information in a non-contact state via the antenna 30. Examples of the IC chip 20 include a non-contact IC tag, a non-contact IC label, a non-contact IC card, etc. The IC chip 20 is mounted on the first main surface 50a of the base material 50.

[0041] The IC chip 20 is, for example, rectangular in plan view, having two sides along the Y direction and two sides along the X direction. The IC chip 20 is, for example, rectangular with the dimension in the Y direction being larger than the dimension in the X direction.

[0042] The IC chip 20 is installed straddling the two convex portions 59, 60. Specifically, the IC chip 20 is installed straddling at least a part of the first convex portion 59 and at least a part of the second convex portion 60 in plan view. The IC chip 20 includes at least the top portions of the first convex portion 59 and the second convex portion 60 in plan view.

[0043] As shown in FIGS. 5(A) and 5(B), the IC chip 20 includes a base material 27 and two bump portions 21, 22. The base material 27 is rectangular in plan view. The base material 27 is, for example, rectangular with the longitudinal direction along the Y direction.

[0044] The bump portions 21, 22 (the first bump portion 21 and the second bump portion 22) are formed on the surface of the base material 27 facing the base material 50 (-Z side surface). The bump portions 21, 22 are formed apart from each other in the longitudinal direction (Y direction) of the base material 27.

[0045] The first bump portion 21 is electrically connected to the first convex portion 59. At least a part of the first bump portion 21 overlaps the first convex portion 59 in a plan view. The second bump portion 22 is electrically connected to the second convex portion 60. At least a part of the second bump portion 22 overlaps the second convex portion 60 in a plan view. By connecting the bump portions 21 and 22 to the convex portions 59 and 60 respectively, the IC chip 20 is electrically connected to the antenna 30 (see FIG. 6).

[0046] As shown in FIG. 5(A), the first bump portion 21 has a first convex portion 23 and a first base portion 25. The first bump portion 21 has a hexagonal shape combining a trapezoid (the first convex portion 23) and a rectangle (the first base portion 25). The first base portion 25 has a rectangular shape. The first convex portion 23 is connected to one of the four sides of the first base portion 25. The first convex portion 23 protrudes in a direction approaching the second bump portion 22 from the first base portion 25 (+Y side).

[0047] The first convex portion 23 has a shape in which the width (dimension in the X direction) gradually becomes narrower in a direction approaching each other. The first convex portion 23 has two inclined sides 23a, 23a approaching each other as the protruding height increases. Specifically, the first convex portion 23 has a trapezoidal shape having two inclined sides 23a, 23a and one tip side 23b. The tip side 23b connects the tips of the inclined sides 23a, 23a. The tip side 23b is orthogonal to the arrangement direction (Y direction) of the bump portions 21, 22.

[0048] The second bump portion 22 has a second convex portion 24 and a second base portion 26. The second bump portion 22 has a hexagonal shape combining a trapezoid (the second convex portion 24) and a rectangle (the second base portion 26). The second base portion 26 has a rectangular shape. The second convex portion 24 is connected to one of the four sides of the second base portion 26. The second convex portion 24 protrudes in a direction approaching the first bump portion 21 from the second base portion 26 (-Y side).

[0049] The second convex portion 24 is shaped such that its width (dimension in the X direction) gradually narrows in a direction approaching each other. The second convex portion 24 has two inclined sides 24a, 24a that approach each other as the protruding height increases. Specifically, the second convex portion 24 is trapezoidal in shape with two inclined sides 24a, 24a and one tip side 24b. The tip side 24b connects the tips of the inclined sides 24a, 24a. The tip side 24b is orthogonal to the arrangement direction (Y direction) of the bump portions 21, 22.

[0050] The first convex portion 23 and the second convex portion 24 protrude in a direction approaching each other. The first convex portion 23 and the second convex portion 24 face each other in the Y direction.

[0051] As shown in FIG. 6, the first convex portion 23 is formed to be convex in the same direction as the first convex portion 59. At least a part of the first convex portion 23 overlaps with the first convex portion 59 in plan view. For example, the portion including the tip side 23b of the first convex portion 23 overlaps with the first convex portion 59 in plan view.

[0052] The second convex portion 24 is formed to be convex in the same direction as the second convex portion 60. At least a part of the second convex portion 24 overlaps with the second convex portion 60 in plan view. For example, the portion including the tip side 24b of the second convex portion 24 overlaps with the second convex portion 60 in plan view.

[0053] The interval G2 between the bump portions 21, 22 may be larger than the interval G1 between the convex portions 59, 60. That is, the interval G1 between the convex portions 59, 60 may be smaller than the interval G2 between the bump portions 21, 22. The interval G1 between the convex portions 59, 60 may be 60% or more and 80% or less with respect to the interval G2 between the bump portions 21, 22.

[0054] The side edges 20a, 20a of the IC chip 20 intersect the inclined sides 59a, 59a of the first convex portion 59 and the inclined sides 60a, 60a of the second convex portion 60 in plan view.

[0055] The IC chip 20 is preferably installed within the range where the convex portions 59 and 60 are formed with respect to the position in the X direction. That is, the IC chip 20 is installed so as to be within the formation range R1 of the convex portions 59 and 60 in the X direction. Thereby, since the area of the region between the IC chip 20 and the base material 50 can be reduced, air bubbles are less likely to remain in the adhesive layer 70.

[0056] As shown in FIG. 1, the base material 50 is formed in a rectangular plate shape. The base material 50 is rectangular in plan view. The base material 50 is formed of, for example, a resin base material, a paper base material, a ceramics base material, or the like. Examples of the material of the resin base material include polyester resins such as polyethylene terephthalate (PET), polyolefin resins, polyfluoroethylene-based resins, polyamide resins, vinyl polymers, acrylic resins, polystyrene, polycarbonate, and the like. The base material 50 may be formed of a fiber-reinforced resin. For example, a base material obtained by impregnating a glass fiber cloth with an epoxy resin and thermally curing it can be used.

[0057] As shown in FIG. 7, the adhesive layer 70 adheres the IC chip 20 and the base material 50. The adhesive layer 70 is formed of a curable (for example, liquid curable) adhesive. The adhesive layer 70 is formed of, for example, a thermosetting adhesive.

[0058] The adhesive layer 70 is preferably conductive. When the adhesive layer 70 is conductive, the conductivity between the bump portions 21 and 22 and the impedance adjusting portions 33 and 34 (specifically, the portions including the convex portions 59 and 60) becomes good. As the adhesive for forming the conductive adhesive layer 70, ACP (Anisotropic Conductive Paste) can be used. In addition, NCP (Non Conductive Resin Paste), which is a non-conductive adhesive, can also be used.

[0059] The adhesive layer 70 is formed at least in the gap between the IC chip 20 and the base material 50. The adhesive layer 70 is formed, for example, at least in part in a region overlapping the IC chip 20 in a plan view. The adhesive layer 70 may be formed not only in the region overlapping the IC chip 20 in a plan view but also extending outside the IC chip 20. At least a part of the adhesive layer 70 is formed in the region between the convex portions 59 and 60 in a plan view. The adhesive layer 70 is formed in contact with the inclined sides 59a and 59a of the first convex portion 59 and the inclined sides 60a and 60a of the second convex portion 60 in a plan view.

[0060] The adhesive layer 70 can be formed as follows. An uncured adhesive is supplied into the gap between the IC chip 20 and the base material 50. The adhesive flows and spreads in the gap between the IC chip 20 and the base material 50. By curing the adhesive by heating or the like, the adhesive layer 70 can be formed.

[0061] Bubbles may be formed in the adhesive supplied into the gap between the IC chip 20 and the base material 50 during heating or the like. The bubbles are formed, for example, by water vapor or the like. At least a part of the bubbles moves in the adhesive and is discharged outside from the side end of the IC chip 20. For example, the bubbles move laterally along the inclined sides 59a and 60a and are discharged.

[0062] [Effects Exhibited by the Non-Contact Data Transmitter According to the Embodiment] In the non-contact data transmitter 10 of the present embodiment, the IC chip 20 is installed straddling the two convex portions 59 and 60. The convex portions 59 and 60 have two inclined sides that approach each other as the protruding height increases. Therefore, in the side end (the end in the X direction) of the IC chip 20, the region between the convex portions 59 and 60 is widely open (see FIG. 6).

[0063] Although bubbles may be formed in the adhesive supplied into the gap between the IC chip 20 and the base material 50 when forming the adhesive layer 70, since the region between the convex portions 59 and 60 is widely open at the side end of the IC chip 20, the bubbles are easily discharged outside from the side end of the IC chip 20. Therefore, it is less likely for the bubbles to remain in the adhesive layer 70.

[0064] Since the convex portions 59 and 60 are formed on the distal end extending portions 57 and 58, the area of the region between the distal end extending portions 57 and 58 (specifically, the region between the convex portion 59 and the convex portion 60) becomes small. Therefore, growth of bubbles in this region can be suppressed. Thus, it is difficult for the bubbles to remain in the adhesive layer 70.

[0065] When bubbles are formed in the adhesive layer and antennas, bumps, etc. are exposed inside the bubbles, there is a possibility that deterioration (such as corrosion) occurs in the exposed portions due to long-term use. When such deterioration occurs, it is conceivable that the electrical connectivity of the antennas, bumps, etc. decreases and the communication characteristics are affected. In the non-contact type data transmitter / receiver 10, since it is difficult for bubbles to remain in the adhesive layer 70, it is possible to suppress a decrease in communication characteristics caused by the bubbles.

[0066] Since the convex portions 59 and 60 are shaped to have two inclined sides (for example, triangular shape), the angles of the corners are larger than those of a rectangular convex portion. Therefore, since it is difficult for bubbles to be locked at the corners, it is difficult for the bubbles to remain in the adhesive layer 70.

[0067] The IC chip 20 includes two bump portions 21 and 22. The first bump portion 21 has a first convex portion 23 that protrudes in the same direction as the first convex portion 59. The second bump portion 22 has a second convex portion 24 that protrudes in the same direction as the second convex portion 60. Therefore, it is possible to secure the connection area between the convex portions 23 and 24 and the convex portions 59 and 60, and to widely open the region between the convex portions 59 and 60 at the side end of the IC chip 20.

[0068] At least a part of the two distal end extending portions 57 and 58 are formed in parallel. The two convex portions 59 and 60 are respectively formed on the inner edges 57a and 58a of the distal end extending portions 57 and 58. Therefore, it is possible to secure a sufficient width (dimension in the X direction) for the convex portions 59 and 60. Thus, the conductivity between the convex portions 59 and 60 and the IC chip 20 can be improved.

[0069] The distance G1 between the convex portions 59 and 60 may be smaller than the distance G2 between the bump portions 21 and 22. According to this configuration, compared with the case where the distance between the convex portions is larger than the distance between the bump portions, it becomes difficult to form a stepped portion where air bubbles are likely to be locked.

[0070] The antenna 30 includes an antenna 30 having main line portions 31 and 32, radiation portions 35 and 36, and impedance adjustment portions 33 and 34. Since the antenna 30 has the radiation portions 35 and 36, the radiation characteristics are good.

[0071] The shape of the convex portion formed on the tip extension portion may be any shape having two inclined sides. The convex portion may be, for example, the shape shown in FIGS. 8 and 9. FIG. 8 is a plan view showing convex portions 159 and 160 which are the first modification examples of the convex portion. As shown in FIG. 8, the convex portion 159 formed on the tip extension portion 57 has a trapezoidal shape having an upper side 159b and two inclined sides 159a and 159a. The upper side 159b is parallel to the X direction. The inclined sides 159a and 159a are respectively connected to both ends of the upper side 159b. The convex portion 160 formed on the tip extension portion 58 has a trapezoidal shape having an upper side 160b and two inclined sides 160a and 160a. The upper side 160b is parallel to the X direction. The inclined sides 160a and 160a are respectively connected to both ends of the upper side 160b. The convex portion 160 may have the same shape as the convex portion 159.

[0072] FIG. 9 is a plan view showing convex portions 259 and 260 which are the second modification examples of the convex portion. As shown in FIG. 9, the convex portion 259 formed on the tip extension portion 57 has a shape having a top side portion 259b and two inclined sides 259a and 259a. The top side portion 259b has a convexly curved shape (for example, an arc shape, an elliptical arc shape, a quadratic curve shape, etc.) that is convex in the protruding direction of the convex portion 259. The inclined sides 259a and 259a are respectively connected to both ends of the top side portion 259b. The convex portion 260 formed on the tip extension portion 58 has a shape having a top side portion 260b and two inclined sides 260a and 260a. The inclined sides 260a and 260a are respectively connected to both ends of the top side portion 260b. The convex portion 260 may have the same shape as the convex portion 259.

Embodiment

[0073] Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.

[0074] [Example 1] A non-contact data transmitter 10 shown in FIG. 1 was fabricated. As shown in FIG. 6, the convex portions 59, 60 are isosceles triangular shapes. The distance G3 between the tip extension portions 57 and 58 is 0.35 mm. The protruding height H1 of the convex portions 59, 60 from the inner edges 57a, 58a is 0.14 mm. The distance G1 between the convex portions 59, 60 is 0.07 mm.

[0075] The length (dimension in the Y direction) L1 of the IC chip 20 is 0.397 mm. The width W1 (dimension in the X direction) of the IC chip 20 is 0.286 mm. The width W2 (dimension in the X direction) of the bump portions 21, 22 is 0.247 mm. The distance G2 between the bump portions 21, 22 is 0.105 mm.

[0076] [Comparative Example 1] A non-contact data transmitter similar to that of Example 1 was fabricated except that the convex portions 59, 60 were not formed on the tip extension portions 57, 58.

[0077] For the non-contact data transmitter of Example 1, the adhesive layer 70 was observed. FIG. 10 is a photograph showing the adhesive layer 70. For the non-contact data transmitter of Comparative Example 1, the adhesive layer 170 was observed. FIG. 11 is a photograph showing the adhesive layer 170.

[0078] As shown in FIG. 10, in Example 1, no bubbles were observed in the adhesive layer 70. As shown in FIG. 11, in Comparative Example 1, bubbles B were confirmed in the adhesive layer 170. Thus, in Example 1, it was difficult for bubbles to remain in the adhesive layer 70.

[0079] The embodiments of the present invention have been described above. However, each configuration and their combinations in the embodiments are merely examples, and additions, omissions, substitutions, and other modifications of the configuration are possible without departing from the spirit of the present invention. The antenna 30 in the non-contact data transmitter 10 shown in FIG. 1 has main line portions 31 and 32, impedance adjusting portions 33 and 34, and radiation portions 35 and 36, but the shape of the antenna is not particularly limited. The antenna may have a structure (for example, a bow-tie shape) having a first conductive portion and a second conductive portion extending in different directions from each other, for example.

[0080] The convex portions 59 and 60 shown in FIG. 3 are formed on the inner edges 57a and 58a of the tip extending portions 57 and 58 (wiring portions), but the shape of the wiring portion, the formation position of the convex portion, etc. are not limited thereto. The wiring portions may be formed such that their tips face each other. The convex portions may be formed at the edges of two wiring portions whose tips face each other. The adhesive constituting the adhesive layer 70 may be energy ray curable (for example, photo curable), thermoplastic, or the like.

Description of Reference Numerals

[0081] 10... Non-contact data transmitter, 20... IC chip, 21, 22... Bump portions, 23, 24... Convex portions, 30... Antenna, 31, 32... Main line portions, 33, 34... Impedance adjusting portions, 35, 36... Radiation portions, 50... Base material, 57, 58... Tip extending portions (wiring portions), 57a, 58a... Inner edges (side edges), 59, 60... Convex portions, 59a, 60a... Inclined sides, 70... Adhesive layer, G1... Distance between two convex portions, G2... Distance between two bump portions.

Claims

1. A plate-shaped base material, an IC chip provided on the base material, an antenna provided on the base material and electrically connected to the IC chip, an adhesive layer formed of a curable adhesive for adhering the IC chip and the base material, comprising: the antenna has at least a part with two wiring portions facing each other, on the two wiring portions, convex portions protruding in a direction approaching each other are respectively formed, the convex portion has a shape with two inclined sides approaching each other as the protruding height increases, the IC chip is installed straddling the two convex portions, a non-contact type data transmitter and receiver.

2. the IC chip includes two bump portions respectively electrically connected to the convex portions, the bump portion has a convex portion that protrudes in the same direction as the convex portion to which it is connected, the non-contact type data transmitter and receiver according to Claim 1.

3. at least a part of the two wiring portions are formed in parallel, the two convex portions are respectively formed on the opposite side edges of the wiring portions, the non-contact type data transmitter and receiver according to Claim 1.

4. the distance between the two convex portions is smaller than the distance between the two bump portions, the non-contact type data transmitter and receiver according to Claim 1.

5. the antenna includes two main line portions extending in different directions from each other, two radiation portions respectively connected to the two main line portions, two impedance adjustment portions in which a portion including the base end is connected to the main line portion and the wiring portion is formed at the tip, comprising: the non-contact type data transmitter and receiver according to any one of Claims 1 to 4.

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