Putty composition

Abstract

To provide a putty composition with low thermal conductivity having poor heat transfer.SOLUTION: A putty composition according to the present invention includes a binder and a filler, the filler containing a hollow material, and the thermal conductivity being 0.9 W / m K or less.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a putty composition. [Background technology]

[0002] In buildings such as houses, through-holes are often provided in walls separating the indoor and outdoor areas, through which pipes for air conditioning equipment are inserted. Putty compositions are used to seal gaps in these through-holes (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5187992 [Patent Document 2] Patent No. 6896022 Summary of the Invention [Problem to be solved by the invention]

[0004] The pipes inserted into the through-holes include those for refrigerants in air conditioning equipment. In summer when the outside air temperature is high, heat from the outside air is transferred to the indoor part of the pipe through the putty composition blocking the gaps in the through-holes, causing a problem of condensation.

[0005] Therefore, an object of the present invention is to provide a putty composition that is low in thermal conductivity and does not easily transmit heat. [Means for solving the problem]

[0006] In order to achieve the above object, the putty composition of the present invention comprises: a binder and a filler, the filler comprises a hollow material; The thermal conductivity is 0.9 W / m·K or less. [Effects of the Invention]

[0007] The putty composition of the present invention contains a hollow material, and therefore has a low thermal conductivity of 0.9 W / m·K or less. DETAILED DESCRIPTION OF THE INVENTION

[0008] The putty composition of the present invention contains a binder and a filler. The putty composition may consist of only the binder and the filler, or may further contain other components (for example, an auxiliary agent, etc.).

[0009] Various binders can be used, and examples thereof include resin binders such as liquid polybutene, liquid polybutadiene, liquid styrene butadiene rubber, liquid chloroprene rubber, and liquid isoprene rubber; and plasticizers such as benzoate ester compounds, epoxy compounds, phosphate ester compounds, chlorinated paraffin compounds, adipic acid compounds, and phthalate ester compounds.

[0010] The amount of the binder in the total amount of the putty composition is not particularly limited, but is, for example, 15% by mass to 75% by mass. One type of binder may be used alone, or two or more types may be used in combination.

[0011] The filler includes a hollow material, such as resin balloons, fly ash balloons, shirasu balloons, glass balloons, ceramic balloons, and perlite. Among these, resin balloons are preferred in terms of true specific gravity, pressure resistance, cost, and the like.

[0012] The resin balloons are hollow particles having a spherical resin shell. The resin constituting the shell of the resin balloon is not particularly limited, and examples thereof include acrylonitrile resin, phenolic resin, and vinylidene chloride resin.

[0013] The resin balloons have an average particle size of, for example, 10 μm to 150 μm, or 50 μm to 80 μm. The average particle size is the particle size at which the cumulative volume reaches 50% when particle size distribution is measured by laser diffraction using, for example, an SALD-2000 manufactured by Shimadzu Corporation. The resin balloons have a true specific gravity of, for example, 0.02 to 0.07. The resin balloons may be used as they are, or may be compounded with inorganic powder to have a true specific gravity of about 0.1 to 0.3, taking into consideration ease of handling, etc.

[0014] The resin balloons may be homemade or commercially available, such as EMC40 manufactured by Nippon Phillite Co., Ltd., Phenoset Microsphere BJO-930 manufactured by Malayan Adhesives & Chemicals, and Matsumoto Microsphere (registered trademark) manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd.

[0015] The amount of the hollow material in the total amount of the putty composition is not particularly limited, but is, for example, 1% by mass to 20% by mass. One type of hollow material may be used alone, or two or more types may be used in combination.

[0016] As the filler other than the hollow material, various materials can be used depending on various purposes, such as imparting flame retardancy, increasing the volume (bulk), suppressing bleeding, and preventing sagging.

[0017] Examples of the filler used for the purpose of imparting flame retardancy include aluminum hydroxide. Examples of the filler used for the purpose of increasing the weight (bulk) include calcium carbonate. Examples of the filler used for the purpose of suppressing bleeding and preventing sagging include white carbon (finely powdered silica).

[0018] The amount of the filler other than the hollow material in the total amount of the putty composition is not particularly limited, but is, for example, 5% by mass to 80% by mass. One type of the filler other than the hollow material may be used alone, or two or more types may be used in combination.

[0019] Examples of the auxiliary agent include zinc stearate, which is used for the purpose of suppressing bleeding, etc. The amount of the auxiliary agent in the total amount of the putty composition is not particularly limited, but is, for example, 2% by mass to 10% by mass.

[0020] The putty composition can be prepared, for example, by uniformly kneading the binder, the filler, and, if necessary, other additive components by a conventionally known method, and, if necessary, each component may be heated and melted before, after, or simultaneously with the kneading. For preparing the putty composition, a conventionally known device such as a kneader mixer or a Banbury mixer may be used.

[0021] The putty composition can be widely used in various fields, such as for sealing gaps in through-holes through which pipes of air conditioning equipment are inserted. By including the hollow material, the putty composition has a low thermal conductivity of 0.9 W / m·K or less. Therefore, when used to seal gaps in through-holes, the putty composition can prevent heat from being transferred from the outside air to the room, even in the summer when the outside temperature is high, thereby suppressing condensation on the indoor portion of the pipe. The thermal conductivity of the putty composition may be, for example, 0.7 W / m·K or less, or 0.2 W / m·K or less. The thermal conductivity can be measured by a probe method using, for example, a QTM-500 (manufactured by Kyoto Electronics Manufacturing Co., Ltd.). [Example]

[0022] Putty compositions of Examples 1 to 3 and Comparative Example 1 were prepared with the compositions shown in Table 1. The thermal conductivity and density of the putty compositions of Examples 1 to 3 and Comparative Example 1 were measured by the probe method using a QTM-500 manufactured by Kyoto Electronics Manufacturing Co., Ltd., and are shown in Table 1.

[0023] [Table 1]

[0024] As shown in Table 1, Comparative Example 1, which did not contain a hollow material, had a thermal conductivity of 0.99 W / m K. In contrast, Examples 1 to 3, which contained resin balloons as a hollow material, had low thermal conductivities of 0.9 W / m K or less.

[0025] Although the present invention has been described above with reference to the embodiments and examples, the present invention is not limited to the above-described embodiments and examples. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.

Claims

1. a binder and a filler, the filler comprises a hollow material; A putty composition having a thermal conductivity of 0.9 W / m·K or less.

2. The putty composition according to claim 1 , wherein the hollow material comprises a resin balloon.

3. 3. The putty composition according to claim 1, wherein the thermal conductivity is 0.2 W / m·K or less.

Images