Adapter plate to attach turbo pumps to process modules

Abstract

To provide a system comprising a process module, a pump, and an adapter plate, the process module having an opening at a lower end and including a poppet valve above the opening to process a semiconductor substrate.SOLUTION: A pump 102 operates in conjunction with a poppet valve 110 to evacuate gas from a process module 100. An adapter plate 120 is arranged above the pump and below an opening at a lower end of the process module and includes an inner cavity coincident with the opening and an outer perimeter smaller than the lower end of the process module. The adapter plate includes a first set of bores arranged around the inner cavity and a second set of bores arranged along the outer perimeter. Bolts 122 fasten the pump to the adapter plate through the first set of bores. Bolts 124 fasten the adapter plate to the process module through the second set of bores.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of U.S. Provisional Patent Application No. 62 / 983,839, filed March 2, 2020. The entire disclosures of the above-referenced applications are incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates generally to semiconductor processing systems, and more particularly to a mounting plate for mounting turbo pumps to process modules of a substrate processing system. [Background technology]

[0003] The background description provided herein is intended to generally indicate the relevance of the present disclosure. To the extent described in this Background section, neither the works of the inventors named herein nor aspects of the description that may not otherwise be considered prior art at the time of submission are admitted, explicitly or implicitly, as prior art to the present disclosure.

[0004] A substrate processing system typically includes one or more processing chambers (also called processing modules) for performing deposition, etching, and other procedures on substrates, such as semiconductor wafers. During processing, a substrate is arranged on a substrate support, such as a pedestal, within the processing chamber of the substrate processing system. During deposition, a gas mixture containing one or more precursors is introduced into the processing chamber, and a plasma is struck to activate a chemical reaction. During etching, a gas mixture containing an etching gas is introduced into the processing chamber, and a plasma is struck to activate a chemical reaction. A computer-controlled robot typically transfers substrates from one processing chamber to another in a sequence for processing the substrates.

[0005] Many semiconductor processes are performed in a vacuum. A turbopump may be used to maintain the vacuum in the chamber. In some processes, a pendulum valve is arranged between the turbopump and the bottom opening to the chamber. The turbopump is mounted on the pendulum valve, which is mounted on the chamber. Summary of the Invention

[0006] The system includes a process module, a pump, and a mounting plate. The process module is configured to process semiconductor substrates. The process module has an opening at a lower end of the process module and includes a poppet valve arranged within the process module above the opening. The pump is configured to operate in conjunction with the poppet valve to exhaust gas from the process module. The mounting plate is arranged above the pump and below the opening at the lower end of the process module. The mounting plate includes an internal cavity that coincides with the opening and an outer periphery that is smaller than the lower end of the process module. The mounting plate includes a first set of holes arranged around the internal cavity and a second set of holes arranged along the outer periphery. A first fastener fastens the pump to the mounting plate through the first set of holes. A second fastener fastens the mounting plate to the process module through the second set of holes.

[0007] In other features, the system further comprises a plurality of notches arranged along an outer periphery of the mounting plate, the notches mating with corresponding alignment structures on the lower ends of the processing modules.

[0008] In another feature, the system further comprises an annular liner that aligns the opening at the lower end of the processing module and aligns the interior cavity of the mounting plate.

[0009] In another feature, the mounting plate further comprises a notch on an inner surface of the mounting plate, the notch extending from the upper surface of the mounting plate to a position above the lower surface of the mounting plate, and the notch extending radially outward from the inner surface a first distance.

[0010] In another feature, the notch is in fluid communication with an exhaust channel located above an opening in the lower end of the process module.

[0011] In another feature, the mounting plate further comprises a groove in the upper surface of the mounting plate and adjacent the interior cavity for an O-ring that forms a seal between the mounting plate and the processing module.

[0012] In other features, the interior cavity is circular and the outer perimeter is polygonal.

[0013] In other features, the interior cavity and the outer periphery are circular.

[0014] In another aspect, the first set of holes has a smaller diameter than the second set of holes.

[0015] In another aspect, the second set of holes has fewer holes than the first set of holes.

[0016] In another feature, at least one of the first set of holes and the second set of holes is threaded.

[0017] In another aspect, the first set of holes are arranged along a circle.

[0018] In other features, the first set of holes is arranged along a first circle having a first diameter, the second set of holes is arranged along a second circle having a second diameter greater than the first diameter, and the first and second circles are concentric.

[0019] In another aspect, the outer periphery is polygonal and the plurality of notches are arranged along a single edge of the outer periphery.

[0020] In other features, the outer periphery is polygonal and the plurality of notches are arranged along a plurality of edges of the outer periphery.

[0021] In still other features, the mounting plate has an upper surface, a lower surface, and an internal cavity. The upper surface of the mounting plate is removably attachable to a process module of a substrate processing system. The lower surface of the mounting plate faces the upper surface and is removably attachable to a pump of the substrate processing system. The internal cavity within the mounting plate extends from the upper surface to the lower surface. The outer surface of the mounting plate extends between the upper and lower surfaces and defines an outer periphery of the mounting plate. The inner surface of the mounting plate extends between the upper and lower surfaces and within the internal cavity. A first set of holes extends between the upper and lower surfaces. The first set of holes is arranged around the periphery of the internal cavity. The lower surface of the mounting plate is removably attachable to the pump by a first fastener passing through the first set of holes. A second set of holes extends between the upper and lower surfaces. The second set of holes is arranged along the outer periphery. The top surface of the mounting plate is removably attachable to the processing module by a second fastener that passes through a second set of holes.

[0022] In other features, the mounting plate further comprises a plurality of notches arranged along an outer periphery, the notches extending between the upper and lower surfaces.

[0023] In another feature, the mounting plate further comprises a notch in the inner surface, the notch extending vertically from the upper surface up to a first distance above the lower surface, and the notch extending radially outward from the inner surface a second distance.

[0024] In another feature, the mounting plate further comprises a groove in the upper surface and adjacent the interior cavity for an O-ring that forms a seal between the mounting plate and the processing module.

[0025] In other features, the interior cavity is circular and the outer perimeter is polygonal.

[0026] In other features, the interior cavity and the outer periphery are circular.

[0027] In another aspect, the first set of holes has a smaller diameter than the second set of holes.

[0028] In another aspect, the second set of holes has fewer holes than the first set of holes.

[0029] In another feature, at least one of the first set of holes and the second set of holes is threaded.

[0030] In another aspect, the first set of holes are arranged along a circle.

[0031] In other features, the first set of holes is arranged along a first circle having a first diameter, the second set of holes is arranged along a second circle having a second diameter greater than the first diameter, and the first and second circles are concentric.

[0032] In other features, the mounting plate further comprises a plurality of notches arranged along an outer periphery, the outer periphery being polygonal, and the plurality of notches arranged along a single edge of the outer periphery.

[0033] In other features, the mounting plate further comprises a plurality of notches arranged along an outer periphery, the outer periphery being polygonal, and the plurality of notches arranged along a plurality of edges of the outer periphery.

[0034] In other features, the system includes a mounting plate, first and second fasteners, a pump, and a processing module, wherein the pump is mounted to a lower surface of the mounting plate by the first fastener, and the upper surface of the mounting plate is mounted to a lower end of the processing module by the second fastener.

[0035] In other features, the lower end of the processing module has an outer periphery that is larger than the outer periphery of the mounting plate and has an opening that aligns with the internal cavity in the mounting plate. The system further includes an annular liner that aligns the opening and the internal cavity.

[0036] In other features, the mounting plate includes a notch on its inner surface, the notch extending from the upper surface to a position above the lower surface, the notch extending radially outward from the inner surface a first distance, and the notch in fluid communication with an exhaust channel located above an opening at a lower end of the processing module.

[0037] Areas of applicability of the present disclosure will become more apparent from the detailed description, claims, and drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

[0038] The present disclosure will become more fully understood from the detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0039] [Figure 1] FIG. 1 is a cross-sectional view of the lower portion of a process module with internal poppet valves and turbo pumps (internal components omitted) mounted directly to the process module.

[0040] [Figure 2] 1 is a cross-sectional view of a lower portion of a process module with an internal poppet valve and turbo pump (internal components omitted) mounted on a mounting plate and the mounting plate mounted to the process module in accordance with the present disclosure.

[0041] [Figure 3] FIG. 1 is a perspective view of an example mounting plate according to the present disclosure.

[0042] [Figure 4] FIG. 2 is a bottom view of a turbo pump, mounting plate, and processing module according to the present disclosure.

[0043] [Figure 5]4 is a cross-sectional view of the lower portion of a process module including a poppet valve and liner, with a turbo pump (internal components omitted) mounted to the bottom of the process module using the mounting plate of FIG. 3 in accordance with the present disclosure.

[0044] [Figure 6] 1 is a cross-sectional view of a portion of a process module showing a partial notch on the mounting plate that communicates with an exhaust channel of the process module according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0045] In the drawings, reference numbers may be reused to identify similar and / or identical elements.

[0046] Turbo pumps are used to evacuate process gases from process modules (PMs). Turbo pumps rotate at high speeds (e.g., 28,000 RPM) and have high rotational inertia. Turbo pumps can fail when debris from the process module becomes trapped in the turbo pump rotor. When a turbo pump fails, the high rotational inertia of the turbo pump can bend the bolts that attach the turbo pump to the process module. As a result, the bolts cannot be easily removed. Depending on the severity of the turbo pump failure, the bottom of the process module may also be damaged.

[0047] In substrate processing systems that use pendulum valves, the bolts between the turbo pump and the pendulum valve may bend when a failure occurs, however, the turbo pump and pendulum valve can still be removed using the bolts that are typically between the pendulum valve and the process module.

[0048] In other substrate processing systems that use poppet valves, the turbo pump is mounted directly to the bottom of the process module, and the poppet valve is nested between the turbo pump and the process module. When the turbo pump fails in these substrate processing systems, it is difficult to remove the turbo pump from the process module.

[0049] To protect the process module and improve the maintainability of the turbo pump, a mounting plate according to the present disclosure is arranged between the turbo pump and the bottom of the process module. The turbo pump is mounted to the mounting plate, which is mounted to the process module. When the turbo pump fails, the bolts attaching the turbo pump to the mounting plate may bend, but the bolts attaching the mounting plate to the bottom of the process module do not bend. Accordingly, the mounting plate protects the bottom of the process module from damage resulting from a turbo pump failure. Furthermore, the mounting plate is easy to remove from the process module. Accordingly, after a failure, the turbo pump can be repaired by first removing the mounting plate from the process module and then removing the turbo pump from the mounting plate. After repair, the turbo pump can be coupled to the bottom of the process module using the same mounting plate, or a different mounting plate if damage occurs to the mounting plate.

[0050] Additionally, the present disclosure provides an annular liner that aligns an opening at the bottom of a process module through which a turbopump exhausts process gases from the process module. When a turbopump fails, chunks or pieces of metal debris from a broken rotor can damage a portion of the chamber wall near the opening at the bottom of the process module. In the event of a turbopump failure, the annular liner protects the chamber wall near the opening at the bottom of the process module by preventing debris from impacting the chamber wall near the opening at the bottom of the process module. These and other features of the present disclosure are described in detail below.

[0051] 1 shows a turbo pump 102 directly connected to a process module 100. All figures omit internal components of the turbo pump 102, such as the stator, rotor, etc. A poppet valve 110 is nested between the process module 100 and the turbo pump 102. The poppet valve 110 includes a plate that is moved by an actuator 112 to redirect gas flow between the process module 100 and the turbo pump 102. The poppet valve 110 is opened to allow the turbo pump 102 to control pressure and / or exhaust process gases from the process module 100.

[0052] The O-ring is arranged in a groove 111 located in the interior upper portion of the bottom wall of the process module 100. The O-ring in the groove 111 surrounds an opening at the bottom of the process module 100. When the poppet valve 110 is closed, the plate of the poppet valve 110 presses firmly against the O-ring in the groove 111, thereby sealing the process module 100.

[0053] In this design, the turbo pump 102 is bolted directly to the bottom of the process module 100 with bolts 114. An O-ring is disposed in a groove 115 provided in the flange of the turbo pump 102 to seal the top of the turbo pump 102 against an opening in the bottom of the process module 100. When the turbo pump 102 fails while rotating, the bolts 114 can bend due to the relatively high rotational inertia of the turbo pump 102. The bolts 114 are difficult to access and remove. Furthermore, depending on the severity of the turbo pump 102 failure, the bending of the bolts 114 can further damage the bottom of the process module 100.

[0054] 2 shows a turbo pump 102 connected to a process module 100 by a mounting plate 120 in accordance with the present disclosure. A poppet valve 110 nests between the turbo pump 102 and the process module 100. When closed, the poppet valve 110 and an O-ring in groove 111 seal the process module 100. The turbo pump 102 is mounted to the bottom surface of the mounting plate 120 by bolts 122. An O-ring in groove 115 seals the top of the turbo pump 102 against the bottom surface of the mounting plate 120.

[0055] Mounting plate 120 (specifically, the top surface of mounting plate 120) is mounted directly to the bottom of processing module 100 by bolts 124. Bolts 124 may be larger in size (and therefore heavier and stronger to withstand shear forces) than bolts 122. Bolts 124 may be more numerous than bolts 122.

[0056] The O-ring is disposed in a groove 121 located on the upper surface of a mounting plate 120 that is mounted to the bottom wall of the process module 100. The groove 121 is adjacent to the inner diameter of the mounting plate 120 (or an internal cavity within the mounting plate 120) (as shown in FIG. 3). When the mounting plate is mounted to the bottom wall of the process module 100, the O-ring in the groove 121 passes through and surrounds an opening at the bottom of the process module 100, providing a seal between the mounting plate 120 and the opening at the bottom of the process module 100.

[0057] In this design, when the turbo pump 102 fails, the bolts 122 may bend due to the turbo pump 102's relatively high rotational inertia. However, the bolts 124 do not bend. Accordingly, when the turbo pump 102 fails, the mounting plate 120 is removed from the processing module 100 by removing the bolts 124. The turbo pump 102 can then be removed from the mounting plate 120 by removing the bolts 122. The turbo pump 102 can then be repaired. After repair, the turbo pump 102 can be mounted to the same mounting plate 120 or a different mounting plate 120 using new bolts 122. The mounting plate 120 with the turbo pump 102 can be mounted to the bottom of the processing module 100 by the bolts 124.

[0058] FIG. 3 shows the mounting plate 120 in further detail. While a particular geometry of the mounting plate 120 is shown and described below, other geometries can be used. For example, the mounting plate 120 includes an outer periphery 152 and an interior cavity 148 defining an inner diameter 150. The inner diameter 150 is slightly larger than or substantially equal to the diameter of the opening at the bottom of the processing module 100 (see FIG. 5). By way of example only, the outer periphery 152 (i.e., outer shape) of the mounting plate 120 is shown as an octagon. However, the outer periphery 152 of the mounting plate 120 can have different shapes for different processing modules and may be dictated by the arrangement of other components located on the bottom of the processing module 100. For example, in some applications, the outer periphery 152 of the mounting plate 120 can be a polygon (e.g., a pentagon, hexagon, heptagon, triangle, rectangle, square, etc.). In some applications, the outer perimeter 152 of the mounting plate 120 may be oval or circular as well. In some applications, the outer perimeter 152 of the mounting plate 120 may have an irregular shape.

[0059] The outer periphery 152 of the mounting plate 120 includes a plurality of notches 154 to allow alignment of the mounting plate 120 with corresponding components located on the bottom of the process module 100 (see FIG. 4 ). In some instances, the notches 154 are asymmetrical and allow mounting in only one orientation. As a result, the notches 154 help ensure that the mounting plate 120 is properly mounted in a particular orientation relative to the surrounding components.

[0060] By way of example only, notch 154 is shown on one edge of outer periphery 152 of mounting plate 120. In some applications, additional notches can be located on other edges of outer periphery 152 of mounting plate 120. Furthermore, the size and shape of notch 154 can vary. For example, in some applications, notch 154 need not extend completely through the vertical thickness (i.e., height) of mounting plate 120. Rather, notch 154 can extend partially through the vertical thickness (i.e., height) of mounting plate 120 from the turbo pump side and / or the process module side.

[0061] Mounting plate 120 includes a first set of threaded holes 160 arranged proximate inner diameter 150 of mounting plate 120. For example, first set of threaded holes 160 are arranged proximate groove 121. In some examples, first set of threaded holes 160 are arranged within a first circle having a first diameter. First set of threaded holes 160 receive bolts 122 that fasten turbo pump 102 to mounting plate 120 (see FIGS. 2 and 4). In some examples, the number of holes in first set of threaded holes 160 is equal to the number of mounting holes on turbo pump 102.

[0062] Although not shown, a second (spare) set of threaded holes can be provided that is similar to, concentric with, and rotationally offset from the first set of threaded holes 160. The second (spare) set of threaded holes can serve as substitutes for the first set of threaded holes 160 in the event that one or more holes in the first set of threaded holes 160 are deformed or damaged when the turbopump 102 fails. In some embodiments, the first set of threaded holes 160 and the second (spare) set of threaded holes can be arranged in different configurations to accommodate different mounting geometries of different turbopumps.

[0063] The mounting plate 120 includes a second set of holes 162 arranged proximate the outer periphery 152 of the mounting plate 120. In some examples, the second set of holes 162 are arranged in a second circle having a second diameter larger than the first diameter. For example, the first and second circles may be concentric. Bolts 124 pass through the second set of holes 162 (see FIGS. 2 and 4 ) and fasten the mounting plate 120 to threaded holes in the bottom of the processing module 100.

[0064] The second set of holes 162 are positioned farther from the center of the mounting plate 120 than the first set of threaded holes 160. By way of example only, the second set of holes 162 are shown as being positioned at the intersections of the edges of the outer periphery 152. However, the second set of holes 162 can be positioned anywhere along the outer periphery 152. Furthermore, although the second set of holes 162 are shown as being symmetrically distributed along the edges of the outer periphery 152, the arrangement of the second set of holes 162 can be asymmetric along the edges of the outer periphery 152. In some embodiments, the second set of holes 162 can also be arranged in different configurations to accommodate different mounting geometries of different processing modules.

[0065] Accordingly, the mounting plate 120 generally includes an upper surface 140, a lower surface 142, an outer surface 144 extending between the upper and lower surfaces 140, 142 and defining an outer periphery 152, and an inner surface 146 extending between the upper and lower surfaces 140, 142 and defining an interior cavity 148 of the mounting plate 120. A first set of threaded holes 160 extend between the upper and lower surfaces 140, 142 and are arranged along a circle around the interior cavity 148. A second set of holes 162 extend between the upper and lower surfaces 140, 142 and are arranged along the outer periphery 152. Notches 154 are arranged along the outer periphery 152. The mounting plate 120 can be made from a metal or alloy having relatively high mechanical strength.

[0066] When used in a conductor etch process module for inert gas exhaust, mounting plate 120 (shown in FIG. 6 as mounting plate 123) includes two features that distinguish it from the mounting plate 120 described above and make it suitable for use in a dielectric etch process module: First, mounting plate 123 has an inner diameter that is larger than inner diameter 150 of mounting plate 120 used in a dielectric etch process module. Second, mounting plate 123 includes an additional partial notch 166. As described below with reference to FIG. 6, these features (i.e., the larger inner diameter and the additional partial notch 166), along with a shorter liner than the liner used in a dielectric etch process module, aid in exhausting inert gas in a conductor etch process module.

[0067] 4 shows a bottom view of the turbo pump 102, mounting plate 120, and processing module 100. The top end of the turbo pump 102 includes a radial flange 170. The radial flange 170 includes circumferentially elongated holes 172 that vary in rotational alignment. The holes 172 align with a first set of threaded holes 160 in the mounting plate 120. Bolts 122 pass through the radial flange 170, the holes 172, and the first set of threaded holes 160 to fasten the turbo pump 102 to the mounting plate 120. Bolts 124 pass through a second set of holes 162 to fasten the mounting plate 120 into the bottom of the processing module 100. In this way, bolt 122 may deform when turbopump 102 fails and is difficult to access and remove, whereas bolt 124 does not deform when turbopump 102 fails and is easier to access and remove, thereby making turbopump 102 easier to repair.

[0068] 5 shows a cross-sectional view of the lower portion of process module 100. Turbo pump 102 is mounted to the bottom of process module 100 by mounting plate 120. Poppet valve 110 is shown in the closed position. Liner 180 lines the bottom opening of process module 100. Liner 180 is annular and includes flange 182. Flange 182 extends radially outward and rests in an annular recess 184 formed on the upper portion of the opening in process module 100. Liner 180 extends downward from flange 182, through the opening, past the bottom of process module 100, and to the top of turbo pump 102. Liner 180 extends to the point where turbo pump 102 is mounted to mounting plate 120. When the turbo pump 102 fails, the liner 180 prevents any debris from the turbo pump 102 from impacting the chamber wall 186 near the opening at the bottom of the process module 100. As a result, the liner 180 protects the chamber wall 186 near the opening at the bottom of the process module 100 from airborne debris when the turbo pump 102 fails.

[0069] The outer periphery of the liner 180 (excluding the flange 182) is slightly less than or substantially equal to the diameter of the opening at the bottom of the process module 100. The outer diameter of the liner 180 (excluding the flange 182) is slightly less than or substantially equal to the diameter of the opening at the bottom of the process module 100. The outer diameter of the liner 180 (excluding the flange 182) is slightly less than or substantially equal to the inner diameter 150 of the mounting plate 120. The inner diameter of the liner 180 is less than the diameter of the opening at the bottom of the process module 100. The inner diameter of the liner 180 is less than the inner diameter 150 of the mounting plate 120. The outer diameter of the flange 182 is greater than the diameter of the opening at the bottom of the process module 100. The outer diameter of the flange 182 is greater than the inner diameter 150 of the mounting plate 120. The liner 180 is removable. The inner diameter 150 of the mounting plate 120 and the length (or height) of the liner 180 shown in FIG. 5 are suitable for use in various etch process modules. Moreover, the inner diameter 150 of the mounting plate 120 may be suitable for use with different mounting geometries of different turbopumps, and similarly, the outer periphery 152 of the mounting plate 120 may be suitable for use with different mounting geometries of different process modules.

[0070] FIG. 6 shows a cross-sectional view of a portion of a process module 101 with an example mounting plate 123 suitable for use in a conductor etch process module. The mounting plate 123 includes a partial notch 166. In this example, the process module 101 performs a conductor etch process and includes a liner 181 and an exhaust channel 190 in the process module 101. The exhaust channel 190 is used for inert gas exhaust. The inner diameter of the mounting plate 123 is larger than the inner diameter 150 of the mounting plate 120 shown in FIG. 5. Additionally, the liner 181 is shorter (in height or length) than the liner 180 shown in FIG. 5 (the difference is shown as H). diff (shown as dotted lines).

[0071] Partial notch 166 is so named because the bottommost portion of mounting plate 123 (on the turbopump 102 side) is not cut all the way through. That is, partial notch 166 does not extend all the way through lower surface 142 of mounting plate 123. Rather, partial notch 166 extends vertically downward along inner surface 146 from upper surface 140 to a short distance above lower surface 142, and then extends radially outward from inner surface 146 a relatively short distance. Accordingly, the height of partial notch 166, from upper surface 140 to a short distance above lower surface 142, is less than the vertical thickness or height of mounting plate 123. The depth or width of partial notch 166 (i.e., the distance the partial notch extends radially outward from inner surface 146) is much less than the height of partial notch 166. The partial notch 166 aligns with a notch 192 in the chamber wall 186 of the process module 101 .

[0072] The larger the inner diameter of the mounting plate 123, the shorter the liner 181 (compared to the corresponding parameters shown in FIG. 5), and the additional partial notch 166 in the mounting plate 123 allows for inert gas exhaust through the exhaust channel 190 during the conductor etch process performed by the processing module 101.

[0073] The foregoing description is merely exemplary in nature and is not intended to limit the disclosure, its application, and uses. The broad teachings of the present disclosure can be implemented in a variety of forms. Thus, while the present disclosure includes specific examples, the true scope of the disclosure should not be limited to those examples, as other modifications will become apparent upon study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Furthermore, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the present disclosure can be implemented within and / or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and substitution of one or more embodiments for another embodiment is within the scope of the present disclosure.

[0074] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Unless expressly described as "direct," when the above disclosure describes a relationship between a first element and a second element, the relationship can be a direct relationship where no other intervening elements exist between the first and second elements, or it can be an indirect relationship where one or more intervening elements (spatial or functional) exist between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean a logic using a non-exclusive logical OR (A OR B OR C, A or B or C), and not to mean "at least one of A, at least one of B, and at least one of C."

Claims

1. 1. A system comprising: a process module configured to process semiconductor substrates, the process module including an opening at a lower end of the process module and a poppet valve disposed within the process module above the opening; a pump configured to operate in conjunction with the poppet valve to exhaust gas from the process module; a mounting plate disposed above the pump and below the opening in the lower end of the treatment module, the mounting plate including an interior cavity coinciding with the opening and an outer periphery smaller than the lower end of the treatment module; a first set of holes arranged around the periphery of the internal cavity; a second set of holes arranged along the outer periphery; and a mounting plate including: first fasteners for fastening the pump to the mounting plate through the first set of holes; second fasteners for fastening the mounting plate to the processing module through the second set of holes; A system comprising:

2. 10. The system of claim 1, further comprising a plurality of notches arranged along the outer periphery of the mounting plate that mate with corresponding alignment structures on the bottom ends of the process modules.

3. 10. The system of claim 1, further comprising an annular liner aligning the opening in the lower end of the processing module and aligning the interior cavity of the mounting plate.

4. 10. The system of claim 1, wherein the mounting plate further comprises a notch on an inner surface thereof, the notch extending from an upper surface of the mounting plate to a location above a lower surface of the mounting plate and extending radially outward from the inner surface a first distance.

5. 5. The system of claim 4, wherein the notch is in fluid communication with an exhaust channel located above the opening in the lower end of the process module.

6. 10. The system of claim 1, wherein the mounting plate further comprises a groove in an upper surface of the mounting plate and adjacent the internal cavity for an O-ring that forms a seal between the mounting plate and the processing module.

7. 10. The system of claim 1, the internal cavity is circular; The system wherein the outer perimeter is a polygon.

8. 10. The system of claim 1, wherein the interior cavity and the outer periphery are circular.

9. 10. The system of claim 1, wherein the first set of holes has a smaller diameter than the second set of holes.

10. 10. The system of claim 1, wherein the second set of holes includes fewer holes than the first set of holes.

11. 10. The system of claim 1, wherein the holes in at least one of the first set of holes and the second set of holes are threaded.

12. 10. The system of claim 1, wherein the first set of holes is arranged along a circle.

13. 10. The system of claim 1, the first set of holes is arranged along a first circle having a first diameter; the second set of holes is arranged along a second circle having a second diameter greater than the first diameter; The system wherein the first circle and the second circle are concentric.

14. 3. The system of claim 2, the outer perimeter is a polygon; The plurality of notches are arranged along a single edge of the outer periphery.

15. 3. The system of claim 2, the outer perimeter is a polygon; The plurality of notches are arranged along a plurality of edges of the outer periphery.

16. A mounting plate, an upper surface of the mounting plate removably mountable to a processing module of a substrate processing system; a lower surface of the mounting plate opposite the upper surface and removably attachable to a pump of the substrate processing system; an internal cavity in the mounting plate extending from the upper surface to the lower surface; an outer surface of the mounting plate extending between the upper surface and the lower surface and defining an outer periphery of the mounting plate; an inner surface of the mounting plate extending into the interior cavity between the upper and lower surfaces; a first set of holes arranged around the periphery of the internal cavity and extending between the upper surface and the lower surface, the lower surface of the mounting plate being removably attachable to the pump by first fasteners passing through the first set of holes; a second set of holes arranged along the outer periphery and extending between the upper and lower surfaces, the upper surface of the mounting plate having a second set of holes removably attachable to the processing module by second fasteners passing through the second set of holes; A mounting plate comprising:

17. 17. The mounting plate of claim 16, further comprising a plurality of notches arranged along the outer periphery extending between the upper and lower surfaces.

18. 17. The mounting plate of claim 16, further comprising a notch in the inner surface, the notch extending vertically above the lower surface from the upper surface up to a first distance and extending radially outward from the inner surface a second distance.

19. 17. The mounting plate of claim 16, further comprising an O-ring groove in the upper surface and adjacent the interior cavity to form a seal between the mounting plate and the process module.

20. 17. The mounting plate of claim 16, the internal cavity is circular; The outer periphery of the mounting plate is polygonal.

21. 17. The mounting plate of claim 16, wherein the interior cavity and the outer periphery are circular.

22. 17. The mounting plate of claim 16, wherein the first set of holes has a smaller diameter than the second set of holes.

23. 17. The mounting plate of claim 16, wherein the second set of holes includes fewer holes than the first set of holes.

24. 17. The mounting plate of claim 16, wherein the holes in at least one of the first set of holes and the second set of holes are threaded.

25. 17. The mounting plate of claim 16, wherein the first set of holes are arranged along a circle.

26. 17. The mounting plate of claim 16, the first set of holes is arranged along a first circle having a first diameter; the second set of holes is arranged along a second circle having a second diameter greater than the first diameter; The mounting plate wherein the first circle and the second circle are concentric.

27. 17. The mounting plate of claim 16, further comprising a plurality of notches arranged along the outer periphery; the outer perimeter is a polygon; The plurality of notches are arranged along a single edge of the outer periphery of the mounting plate.

28. 17. The mounting plate of claim 16, further comprising a plurality of notches arranged along the outer periphery; the outer perimeter is a polygon; The plurality of notches are arranged along a plurality of edges of the outer periphery of the mounting plate.

29. 1. A system comprising: a mounting plate according to claim 16; a first fastener and a second fastener; a pump mounted to the lower surface of the mounting plate by the first fastener; a processing module, wherein the upper surface of the mounting plate is mounted to a lower end of the processing module by the second fastener.

30. 30. The system of claim 29, wherein the lower end of the processing module has an outer periphery greater than an outer periphery of the mounting plate and has an opening that aligns with an internal cavity in the mounting plate, the system further comprising an annular liner that aligns the opening and the internal cavity.

31. 31. The system of claim 30, wherein the mounting plate includes a notch on an inner surface, the notch extending from the upper surface to a location above the lower surface and extending radially outward from the inner surface a first distance, the notch being in fluid communication with an exhaust channel located above the opening at the lower end of the processing module.

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