Imaging element unit and imaging apparatus

Abstract

To provide an imaging element unit capable of efficiently radiating the driving heat of an imaging element, and an imaging apparatus.SOLUTION: The imaging element unit incorporated in the housing of the imaging apparatus includes: the imaging element which has an imaging surface for imaging a subject and a rear surface facing the imaging surface; a vibration-proof function which moves the imaging element in the surface direction of the imaging surface; and a first heat conduction member to which the driving heat of the imaging element is conducted from the rear surface and is deformed so as to follow the movement of the imaging element by the vibration-proof function. The first heat conduction member includes an outer layer part and at least one inner layer part which is connected to the outer layer part and arranged in a space surrounded by the outer layer part. Each of the outer layer part and the inner layer part has a deformable bent part.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The technology of the present disclosure relates to an imaging element unit and an imaging device. [Background technology]

[0002] Patent No. 5168047 describes a camera equipped with a heat dissipation structure for an image sensor mounted in an image stabilization unit, characterized in that a heat dissipation member is provided near the image stabilization unit, and a metal member located near the image sensor in the image stabilization unit and the heat dissipation member are connected by a thermally conductive flexible member, wherein the heat dissipation member is ring-shaped and surrounds the metal member, and has multiple extensions formed on its outer periphery, and these multiple extensions are fixed to the camera barrel or frame.

[0003] JP 2020-067632 A describes an imaging device that includes an imaging sensor, a sensor substrate on which the imaging sensor is mounted, and a metal holder having an outer shape larger than the imaging sensor, wherein the sensor substrate has an opening that exposes an exposed portion that is part of the main surface of the imaging sensor, and the metal holder is configured to directly abut against the exposed portion through the opening. Summary of the Invention

[0004] One embodiment of the technique of the present disclosure provides an imaging element unit and an imaging device that can more efficiently dissipate heat generated by driving the imaging element. [Means for solving the problem]

[0005] The imaging element unit of the present disclosure is an imaging element unit built into the housing of an imaging device, and includes an imaging element having an imaging surface that images a subject and a back surface opposite the imaging surface, an anti-shake function that moves the imaging element in the planar direction of the imaging surface, and a first heat conduction member to which drive heat of the imaging element is conducted from the back surface, the first heat conduction member being deformable to follow the movement of the imaging element due to the anti-shake function, the first heat conduction member having an outer layer portion and at least one inner layer portion connected to the outer layer portion and arranged in a space surrounded by the outer layer portion, and each of the outer layer portion and the inner layer portion having a bending portion that allows deformation.

[0006] The first heat conducting member is preferably formed by folding a single sheet-like material.

[0007] The outer layer portion and the inner layer portion are preferably composed of a first sheet portion, a second sheet portion facing the first sheet portion, and a connecting portion connecting the first sheet portion and the second sheet portion.

[0008] The bent portions of the outer layer portion and the inner layer portion preferably protrude outward.

[0009] The first heat conducting member preferably has a reinforcing layer in a portion other than the bent portion, and the portion having the reinforcing layer is thicker than the bent portion by the amount of the reinforcing layer.

[0010] It is preferable that the first thermally conductive member is connected to the imaging element via the second thermally conductive member and is connected to the housing via the third thermally conductive member, and that the second thermally conductive member and the third thermally conductive member are sandwiched between the outer layer and the inner layer.

[0011] It is preferable that the first heat conducting member is made of a graphite sheet, and the second and third heat conducting members are made of metal.

[0012] A fourth heat conducting member made of a graphite sheet is connected between the third heat conducting member and the housing, and the fourth heat conducting member is preferably thicker than the first heat conducting member.

[0013] It is preferable that the fifth heat conduction member is arranged in a position opposite to the side of the imaging element connecting the imaging surface and the back surface, and that the drive heat is conducted from the side, and that the fifth heat conduction member has a bending portion that deforms so as to be able to follow the movement of the imaging element due to the vibration-proof function.

[0014] The first heat conduction member and the fifth heat conduction member are composed of a first sheet portion, a second sheet portion opposite the first sheet portion, and a connecting portion that connects the first sheet portion and the second sheet portion and has a bent portion, and it is preferable that the angle formed by the bent portion of the fifth heat conduction member is acuter than the angle formed by the bent portion of the first heat conduction member.

[0015] The fifth heat conducting member is preferably formed of a graphite sheet.

[0016] An imaging device according to the present disclosure includes a housing and an imaging element unit according to any one of the above-described imaging elements built into the housing. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a diagram illustrating a digital camera. [Figure 2] FIG. 2 is an exploded front perspective view of the imaging element unit. [Figure 3] FIG. 2 is an exploded rear perspective view of the imaging element unit. [Figure 4] FIG. 2 is an exploded rear perspective view of a main part of the imaging element unit. [Figure 5] FIG. 2 is a perspective view of a first heat conducting member, a second heat conducting member, and a third heat conducting member. [Figure 6] FIG. 2 is a plan view of a first heat conducting member, a second heat conducting member, and a third heat conducting member. [Figure 7] FIG. 2 is a cross-sectional view of a main part of an imaging element unit. [Figure 8] 10 is a perspective view of a third heat conducting member, a fourth heat conducting member, and a connecting member. FIG. [Figure 9] FIG. 3 is a simplified plan view of a first heat conducting member. [Figure 10]4A and 4B are diagrams illustrating the first heat conducting member before and after being bent. [Figure 11] 10A and 10B are diagrams illustrating deformation of a first heat conducting member. [Figure 12] 10A and 10B are diagrams illustrating deformation of a first heat conducting member. [Figure 13] FIG. 2 is a diagram illustrating a conduction path of heat generated when driving an imaging element. [Figure 14] FIG. 10 is a diagram showing a first heat conducting member having a triple structure. [Figure 15] FIG. 10 is a diagram showing an octagonal first heat conducting member. [Figure 16] FIG. 10 is a diagram showing a first heat conduction member in which the corners of the connection portions of the outer layer portion and the inner layer portion are recessed inward. [Figure 17] FIG. 10 is a diagram showing an imaging element unit having a fifth heat conduction member. [Figure 18] FIG. 10 is a diagram showing an imaging element unit having a fifth heat conduction member. [Figure 19] FIG. 10 is a simplified plan view of a fifth heat conduction member. [Figure 20] 10 is a diagram showing an example in which a second thermal conductive member is connected to a central region of the rear surface of a circuit board that does not have an opening. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an example of an embodiment of the technology of the present disclosure will be described with reference to the drawings.

[0019] [First embodiment] As an example, as shown in FIG. 1, a digital camera 2 includes a camera body 10. A lens mount 11 is provided on the front of the camera body 10. The lens mount 11 has a circular imaging opening 12. An interchangeable imaging lens (not shown) is detachably attached to the lens mount 11. The digital camera 2 is an example of an "imaging device" according to the technology of the present disclosure. The camera body 10 is also an example of a "housing" according to the technology of the present disclosure.

[0020] The camera body 10 has a built-in imaging element unit 15. The imaging element unit 15 is equipped with a rectangular plate-shaped imaging element 16. The imaging element 16 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The imaging element 16 has a rectangular imaging surface 17 that captures an image of a subject. The imaging surface 17 receives subject light that represents the subject. As is well known, the imaging surface 17 has a two-dimensional array of pixels that photoelectrically convert the received subject light and output electrical signals. The entire imaging surface 17 is exposed to the outside through the imaging opening 12.

[0021] A CPU (Central Processing Unit) 18 is connected to the imaging element unit 15. The CPU 18 controls the operation of the imaging element unit 15. Although not shown, the CPU 18 is connected to memories such as a ROM (Read Only Memory) and / or a RAM (Random Access Memory) via a bus line. The CPU 18, memory, and bus line constitute a computer.

[0022] The image sensor unit 15 has an anti-shake function. The anti-shake function is a function for suppressing positional deviation caused by vibrations applied to the camera body 10, that is, relative positional deviation between the subject light incident on the imaging surface 17 and the digital camera 2. Vibrations applied to the camera body 10 include hand shake caused by the user holding the camera body 10 to photograph a subject.

[0023] Under the control of the CPU 18, the image sensor 16 is moved by the anti-shake function in a direction that cancels out the positional shift by an amount that cancels out the positional shift. More specifically, the image sensor 16 is moved by the anti-shake function in the X-axis direction, which is parallel to the side 19 of the imaging surface 17 of the image sensor 16, and / or in the Y-axis direction, which is parallel to the side 20 that is perpendicular to the side 19, i.e., intersects the side 19 at a 90° angle. The X-axis direction and the Y-axis direction are examples of the "surface direction" according to the technology of the present disclosure. Note that, in this specification, the terms "perpendicular" and "90°" include not only the meanings of perfectly perpendicular and 90°, but also the meanings of approximately perpendicular and approximately 90°, which include tolerances that are allowable in design and manufacturing. Also, in this specification, the term "parallel" includes not only the meaning of perfectly parallel, but also the meaning of approximately parallel, which includes tolerances that are allowable in design and manufacturing. Hereinafter, the side of the side 19 will be referred to as "bottom," and the side opposite the side 19 in the Y-axis direction will be referred to as "top." Moreover, the side of side 20 is referred to as the "left" side, and the side opposite side 20 in the X-axis direction is referred to as the "right" side.

[0024] Here, in this specification, "positional deviation" refers to a phenomenon that occurs when the optical axis OA fluctuates relative to the subject due to vibration. "Optical axis OA" refers to the optical axis of subject light that enters the imaging surface 17 through the imaging lens. Fluctuation of the optical axis OA means that the optical axis OA is tilted due to the positional deviation with respect to a reference axis (for example, the optical axis OA before the positional deviation occurs). Note that in this specification, "countering the positional deviation" not only means eliminating the positional deviation, but also includes the meaning of reducing the positional deviation.

[0025] 2 and 3, the image sensor unit 15 includes a fixed member 30, a movable member 31, and a yoke 32. The fixed member 30 is disposed on the rear side of the camera body 10, and the yoke 32 is disposed on the front side of the camera body 10. The fixed member 30 is fixed to the camera body 10. The fixed member 30 and the yoke 32 are fixed with a gap between them in the Z-axis direction, which is perpendicular to the X-axis and Y-axis. The movable member 31 is disposed between the fixed member 30 and the yoke 32 via three balls 35, 36, and 37 of the same size. The balls 35 to 37 enable the movable member 31 to move in the X-axis direction and the Y-axis direction (rotate around the Z-axis) relative to the fixed member 30 and the yoke 32. The Z-axis is parallel to the optical axis OA before any misalignment occurs.

[0026] The fixed member 30 holds magnets 40, 41, and 42. Magnets 40 to 42 are attached to the front of the fixed member 30 facing the movable member 31. Each of the magnets 40 to 42 is a pair of a flat magnet with its north pole facing the movable member 31 and a flat magnet with its south pole facing the movable member 31. Magnet 40 is arranged in the center of the lower part of the fixed member 30 with its long side aligned along the X-axis direction. Magnets 41 and 42 are aligned along the Y-axis direction. Magnet 41 is arranged in the upper left corner of the fixed member 30 with its long side aligned along the Y-axis direction. Magnet 42 is arranged in the lower left corner of the fixed member 30 with its long side aligned along the Y-axis direction.

[0027] In addition to magnets 40 to 42, plates 45, 46, and 47 are attached to the front surface of fixing member 30. Plate 45 is located at the lower right corner of fixing member 30, above magnet 40. Plate 46 is located on the left side of fixing member 30, between magnets 41 and 42. Plate 47 is located at the upper right corner of fixing member 30. Plate 45 supports ball 35 so that it can roll, plate 46 supports ball 36 so that it can roll, and plate 47 supports ball 37 so that it can roll.

[0028] The fixed member 30 is formed with square-shaped restriction openings 50 and 51 that restrict the movement range of the movable member 31 in the XY plane. The restriction openings 50 and 51 have approximately the same size when viewed in a plan view from the Z-axis direction. The restriction opening 50 is formed in the lower left corner of the fixed member 30, between the magnet 42 and the plate 45. The restriction opening 51 is formed in the upper right corner of the fixed member 30, immediately to the left of the plate 47. In other words, the restriction openings 50 and 51 are arranged in approximately diagonal positions on the fixed member 30.

[0029] The fixing member 30 is provided with female screws 55, 56, 57, and 58 via spacers. The female screw 55 is provided in the lower right corner of the fixing member 30. The female screw 56 is provided in the upper left corner of the fixing member 30. The female screw 57 is provided in the lower left corner of the fixing member 30. The female screw 58 is provided in the upper right corner of the fixing member 30.

[0030] A relatively large rectangular access opening 59 is formed in the center of the fixed member 30. The access opening 59 is provided to allow access to the rear surface of the movable member 31 from the rear surface of the fixed member 30.

[0031] The movable member 31 holds the imaging element 16, and also holds the coil 60, the coil 61, and the coil 62. The imaging element 16 is disposed in the center of the movable member 31. The coil 60 is disposed in the center of the lower part of the movable member 31, facing the magnet 40 in the Z-axis direction. The coil 61 is disposed in the upper left corner of the movable member 31, facing the magnet 41 in the Z-axis direction. The coil 62 is disposed in the lower left corner of the movable member 31, facing the magnet 42 in the Z-axis direction. The coil 60 is disposed with its long side aligned along the X-axis direction. The coils 61 and 62 are aligned along the Y-axis direction. The coils 61 and 62 are each disposed with its long side aligned along the Y-axis direction.

[0032] A magnet 65 is held by the yoke 32. Furthermore, a magnetic body 66 is attached to the coil 61, and a magnetic body 67 is attached to the coil 62. The magnet 65 is, for example, a neodymium magnet. The magnetic bodies 66 and 67 are, for example, thin iron plates. The magnet 65 is arranged so as to cover the coil 60, increasing the driving force of the coil 60. The magnetic bodies 66 and 67 are arranged along the Y-axis direction. The magnetic body 66 is arranged on the upper end side of the coil 61, and the magnetic body 67 is arranged on the lower end side of the coil 62.

[0033] As described above, coil 60 is disposed in a position facing magnet 40 in the Z-axis direction, and magnet 65 is also disposed in a position facing magnet 40 in the Z-axis direction. Therefore, magnet 65 is attracted to magnet 40 while being fixed to yoke 32.

[0034] Similarly, since coil 61 is disposed in a position facing magnet 41 in the Z-axis direction as described above, magnetic body 66 is also disposed in a position facing magnet 41 in the Z-axis direction. Therefore, magnetic body 66 is attracted to magnet 41. Furthermore, since coil 62 is disposed in a position facing magnet 42 in the Z-axis direction as described above, magnetic body 67 is also disposed in a position facing magnet 42 in the Z-axis direction. Therefore, magnetic body 67 is attracted to magnet 42.

[0035] Recesses 70, 71, and 72 are formed on the back surface of the movable member 31 facing the fixed member 30. The recess 70 is located in the lower right corner of the movable member 31, facing the plate 45 in the Z-axis direction. The recess 71 is located between the coils 61 and 62 on the left side of the movable member 31, facing the plate 46 in the Z-axis direction. The recess 72 is located in the upper right corner of the movable member 31, facing the plate 47 in the Z-axis direction. The recess 70 accommodates the ball 35 in a rollable manner, the recess 71 accommodates the ball 36 in a rollable manner, and the recess 72 accommodates the ball 37 in a rollable manner. When viewed from above in the Z-axis direction, the size of the recesses 70 to 72 is slightly larger than the diameter of the balls 35 to 37. The depth of the recesses 70 to 72 in the Z-axis direction is slightly smaller than the diameter of the balls 35 to 37.

[0036] A cylindrical protrusion 80 protruding toward the fixed member 30 is provided on the rear surface of the movable member 31 at a position opposing the restricting opening 50 in the Z-axis direction. Furthermore, a cylindrical protrusion 81 protruding toward the fixed member 30 is provided on the rear surface of the movable member 31 at a position opposing the restricting opening 51 in the Z-axis direction. The protrusion 80 is inserted into the restricting opening 50. Furthermore, the protrusion 81 is inserted into the restricting opening 51. Therefore, the protrusions 80 and 81 act as restricting pins that restrict movement of the movable member 31 in the XY plane.

[0037] The yoke 32 is made of a magnetic material such as a thin iron plate and is roughly C-shaped. The yoke 32 forms a magnetic circuit between the magnets 40-42 and increases the magnetic flux that the coils 60-62 receive.

[0038] Male screws 85, 86, 87, and 88 are attached to yoke 32. Male screws 85 to 88 are fastened to female screws 55 to 58 of fixed member 30. As a result, fixed member 30 and yoke 32 are fixed, and movable member 31 is held movably between fixed member 30 and yoke 32.

[0039] The imaging element unit 15 includes a pair of voice coil motors (VCMs). The pair of VCMs is a first VCM and a second VCM. The first VCM includes a pair of a magnet 40 and a coil 60, and a yoke 32, and generates power to move the movable member 31 in the Y-axis direction. On the other hand, the second VCM includes a pair of a magnet 41 and a coil 61, a pair of a magnet 42 and a coil 62, and a yoke 32, and generates power to move the movable member 31 in the X-axis direction. More specifically, the first VCM generates power to move the movable member 31 in the Y-axis direction by the magnetic force of the magnet 40 and a current flowing through the coil 60. On the other hand, the second VCM generates power to move the movable member 31 in the X-axis direction by the magnetic force of the magnet 41 and a current flowing through the coil 61, and by the magnetic force of the magnet 42 and a current flowing through the coil 62.

[0040] Although not shown, the movable member 31 is provided with a Hall element that detects the position of the movable member 31 and a temperature sensor that measures the temperature around the Hall element. The CPU 18 calculates the difference between the position of the movable member 31 detected by the Hall element and the target position of the movable member 31 for correcting positional deviation, and performs feedback control to drive the VCM to eliminate the difference. If the difference is large, the power generated by the VCM becomes relatively large, and conversely, if the difference is small, the power generated by the VCM becomes relatively small. The CPU 18 also uses the temperature measured by the temperature sensor to correct the temperature drift of the Hall element.

[0041] As also shown in FIG. 4 , a rectangular circuit board 90 having approximately the same size as the imaging element 16 is attached to a back surface 89 of the imaging element 16 facing the imaging surface 17. The circuit board 90 is formed of a resin such as epoxy. A rectangular opening 91 is formed in the circuit board 90. The opening 91 is formed in the center of the circuit board 90 and exposes a central region 92 on the back surface 89 of the imaging element 16. The central region 92 is an area of a predetermined size that is centered on a center point C on the back surface 89 of the imaging element 16 and surrounds the center point C. Identification information 98 of the imaging element 16 is written in the central region 92. The opening 91 is formed to allow the identification information 98 to be visually recognized. The identification information 98 is, for example, a two-dimensional barcode for accessing an internet page containing a management number or management information.

[0042] Electrical circuits such as a control circuit, a drive circuit, and a power supply circuit for the image sensor 16 are mounted on the circuit board 90. Connectors 93 and 94 are provided at the lower end of the back surface of the circuit board 90. In addition, a connector 95 is provided at the left end of the back surface of the circuit board 90.

[0043] One end of a flexible substrate 96 is connected to the connectors 93 and 94. The other end of the flexible substrate 96 is drawn out to the back side of the fixed member 30 through the access opening 59 (see FIG. 7). The other end of the flexible substrate 96 is connected to the CPU 18, a power supply circuit (not shown) that supplies power from a battery, and the like. One end of a flexible substrate 97 (see FIG. 1) is connected to the connector 95. The other end of the flexible substrate 97 wraps around to the front of the movable member 31 and is connected to the image sensor 16. In summary, the other end of the flexible substrate 97 is connected to the image sensor 16, and one end of the flexible substrate 97 is connected to the connector 95. One end of the flexible substrate 96 is connected to the connectors 93 and 94, and the CPU 18 and the like are connected to the other end of the flexible substrate 96. Therefore, the image sensor 16, the circuit board 90, the CPU 18, and the like are connected via the flexible substrate 97, the connector 95, the connectors 93 and 94, and the flexible substrate 96.

[0044] The imaging element unit 15 further includes a first heat conducting member 100, a second heat conducting member 101, and a third heat conducting member 102 to which the heat generated by driving the imaging element 16 is conducted.

[0045] A second thermal conduction member 101 and a third thermal conduction member 102 are connected to the first thermal conduction member 100. Drive heat is conducted from the second thermal conduction member 101 to the first thermal conduction member 100. The first thermal conduction member 100 also conducts the drive heat to the third thermal conduction member 102. The second thermal conduction member 101 is connected to a central region 92 of the back surface 89 of the image sensor 16 exposed by the opening 91. Drive heat is conducted from the central region 92 to the second thermal conduction member 101.

[0046] First heat conduction member 100 and second heat conduction member 101 are fixed with an adhesive. A female screw 68 is formed in fixing member 30. An insertion hole 103 is formed in first heat conduction member 100. A male screw 104 is attached to third heat conduction member 102. Male screw 104 is passed through insertion hole 103 in first heat conduction member 100 and fastened to female screw 68 of fixing member 30. In this way, first heat conduction member 100 and third heat conduction member 102 are fixed.

[0047] First heat conduction member 100 is formed of a graphite sheet. The graphite sheet is configured by pouching a graphite sheet body with a resin film such as a PET (Polyethylene Terephthalate) film. The thickness of the graphite sheet body is, for example, 70 μm, and the thickness of the resin film is, for example, 5 μm.

[0048] Second heat conduction member 101 and third heat conduction member 102 are metal plates, for example, copper plates. Therefore, second heat conduction member 101 and third heat conduction member 102 have higher rigidity than first heat conduction member 100, which is made of a graphite sheet. In other words, first heat conduction member 100 has higher elasticity than second heat conduction member 101 and third heat conduction member 102.

[0049] 5 and 6, first heat conduction member 100 has a double structure including outer layer portion 110 and inner layer portion 111. Inner layer portion 111 is connected to outer layer portion 110 via connecting portion 112 (see also FIG. 9, etc.) and is disposed in a space surrounded by outer layer portion 110. An attachment portion 113 having insertion hole 103 formed therein is provided at the top of outer layer portion 110.

[0050] Both the outer layer portion 110 and the inner layer portion 111 are hexagonal. The outer layer portion 110 is composed of a first sheet portion 115, a second sheet portion 116 that has the same length as the first sheet portion 115 and faces the first sheet portion 115, and a pair of V-shaped connecting portions 117 that connect the first sheet portion 115 and the second sheet portion 116. Similarly, the inner layer portion 111 is composed of a first sheet portion 118, a second sheet portion 119 that has the same length as the first sheet portion 118 and faces the first sheet portion 118, and a pair of V-shaped connecting portions 120 that connect the first sheet portion 118 and the second sheet portion 119. The first sheet portion 115 and the second sheet portion 116, as well as the first sheet portion 118 and the second sheet portion 119, are planar.

[0051] The second thermally conductive member 101 has a first piece 125 and a second piece 126. The first piece 125 is parallel to the imaging surface 17 and back surface 89 of the imaging element 16 and faces the back surface 89 of the imaging element 16. The first piece 125 is connected to a central region 92 of the back surface 89. The second piece 126 is bent 90° from the first piece 125 and extends in a normal direction to the imaging surface 17 and back surface 89 of the imaging element 16. The normal direction to the imaging surface 17 and back surface 89 of the imaging element 16 is the Z-axis direction (the direction of the optical axis OA before misalignment occurs). The second piece 126 has approximately the same size as the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111.

[0052] The second thermally conductive member 101 is connected to the first thermally conductive member 100 through the second piece 126. More specifically, the second piece 126 is inserted into the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111, and is held in a sandwiched state between the first sheet portion 115 and the first sheet portion 118. Double-sided tape is affixed to the portions of the first sheet portion 115 and the first sheet portion 118 that contact the second piece 126. The adhesive of this double-sided tape secures the first sheet portion 115, the first sheet portion 118, and the second piece 126, and therefore the first thermally conductive member 100 and the second thermally conductive member 101.

[0053] The third thermally conductive member 102 has a first piece 127 and a second piece 128. Like the first piece 125 of the second thermally conductive member 101, the first piece 127 is parallel to the imaging surface 17 and back surface 89 of the imaging element 16 and has a wing shape that is long in the X-axis direction. Like the second piece 126 of the second thermally conductive member 101, the second piece 128 is bent 90 degrees from the first piece 127 and extends in the normal direction to the imaging surface 17 and back surface 89 of the imaging element 16.

[0054] The third thermally conductive member 102 is connected to the first thermally conductive member 100 through the second piece 128. More specifically, the second piece 128 is inserted into the space between the second sheet portion 116 of the outer layer portion 110 and the second sheet portion 119 of the inner layer portion 111, and is held in a sandwiched state between the second sheet portion 116 and the second sheet portion 119. The second piece 128 is provided with a claw 129 that can be hooked onto the edge of the second sheet portion 119.

[0055] Thickness TH2 of second heat conduction member 101 is thicker than thickness TH1 of first heat conduction member 100. Thickness TH1 of first heat conduction member 100 is, for example, 80 μm, and thickness of second heat conduction member 101 is, for example, 1 mm. Although not shown, thickness of third heat conduction member 102 is also thicker than thickness TH1 of first heat conduction member 100, for example, 1 mm.

[0056] As an example, as shown in FIG. 7, flexible substrate 96 drawn out through access opening 59 is disposed on the opposite side of first thermal conductive member 100 with second piece 126 of second thermal conductive member 101 sandwiched therebetween.

[0057] 8, fourth heat conducting member 135 is attached to third heat conducting member 102 with an adhesive. Similar to first heat conducting member 100, fourth heat conducting member 135 is formed of a graphite sheet. Thickness TH4 of fourth heat conducting member 135 is thicker than thickness TH1 of first heat conducting member 100 (see FIG. 6). Thickness TH4 of fourth heat conducting member 135 is, for example, 500 μm.

[0058] A connecting member 136 is further attached to fourth thermal conductive member 135 with an adhesive. Similar to second thermal conductive member 101 and third thermal conductive member 102, connecting member 136 is a metal plate, for example, a copper plate. Connecting member 136 is connected to a top plate 137 of camera body 10. Top plate 137 of camera body 10 is, for example, a magnesium plate or an aluminum plate.

[0059] As shown in FIG. 9 as an example, the outer layer portion 110 of the first thermal conductive member 100 is hexagonal as described above and has six corners 140, 141, 142, 143, 144, and 145. The inner layer portion 111 is also hexagonal and has six corners 146, 147, 148, 149, 150, and 151. The corners 140 to 145 and the corners 146 to 151 function as bending portions that enable deformation in response to the movement of the imaging element 16 due to the vibration isolation function. The corners 140 to 145 protrude outward. Similarly, the corners 146 to 151 also protrude outward. In other words, the first thermal conductive member 100 has a pantograph-like shape. Note that the first thermal conductive member 100 is simplified in FIG. 9 by omitting the attachment portion 113, for example. The same applies to Figures 11 and 12, etc.

[0060] 10, first thermal conduction member 100 is formed by folding the dashed line portion of a single sheet-like material 160. Specifically, first, the portion of connection portion 112 is folded so that the portion that will become outer layer portion 110 faces the portion that will become inner layer portion 111. Then, corners 146 to 151 are folded to form inner layer portion 111, and then corners 140 to 145 are folded to form outer layer portion 110. Finally, the portion that will become attachment portion 113 is folded to complete first thermal conduction member 100.

[0061] First thermal conduction member 100 has reinforcing layer 161. Reinforcing layer 161 is a resin film, for example, a 40 μm thick PET film. Reinforcing layer 161 is provided on two sides that constitute connecting portion 117 and connecting portion 120, but is not provided on corners 144, 145, 150, and 151 that function as bending portions. Naturally, the two sides that constitute connecting portion 117 and connecting portion 120 are thicker than corners 144, 145, 150, and 151 that function as bending portions due to reinforcing layer 161. The two sides that constitute connecting portion 117 and connecting portion 120 are an example of a "portion having a reinforcing layer" according to the technology of the present disclosure.

[0062] 11 and 12, as an example, first thermally conductive member 100 deforms to follow the movement of imaging element 16 due to the vibration isolation function. Fig. 11 shows how first thermally conductive member 100 deforms by expanding and contracting in the vertical direction in response to the movement of imaging element 16 along the Y axis direction due to the vibration isolation function. Fig. 12 shows how first thermally conductive member 100 deforms by tilting in the horizontal direction in response to the movement of imaging element 16 along the X axis direction due to the vibration isolation function.

[0063] Next, the operation of the above configuration will be described. When digital camera 2 is used to capture images that place a relatively large load on image sensor 16, such as capturing a video at 120 frames per second (4K / 120p) with a resolution equivalent to 4K, image sensor 16 generates considerable driving heat.

[0064] In the image sensor unit 15 of this example, the drive heat of the image sensor 16 follows a conduction path as shown in Fig. 13. That is, the drive heat of the image sensor 16 is first conducted from the rear surface 89 of the image sensor 16 to the second thermal conductive member 101 connected to the central region 92 of the rear surface 89. Next, the drive heat is conducted from the second thermal conductive member 101 to the first thermal conductive member 100 connected via the second piece 126 of the second thermal conductive member 101.

[0065] The drive heat conducted to first heat conduction member 100 is conducted to third heat conduction member 102 connected via second piece 128. The drive heat is further conducted from third heat conduction member 102 to fourth heat conduction member 135, and from fourth heat conduction member 135 to connecting member 136. The drive heat is then conducted via connecting member 136 to top plate 137 of camera body 10, and is dissipated to the outside via top plate 137.

[0066] In the imaging element unit 15, the movable member 31 is movable relative to the fixed member 30 and the yoke 32. The movable member 31 holds the imaging element 16. Therefore, the imaging element 16 moves as the movable member 31 moves. If a positional shift of the subject light incident on the imaging surface 17 occurs due to a user's hand shake or the like, the movable member 31, and therefore the imaging element 16, is moved under the control of the CPU 18 in a direction that cancels out the positional shift and by an amount that cancels out the positional shift. In response to the movement of the imaging element 16 due to this vibration isolation function, the first thermal conductive member 100 is deformed as shown in FIGS. 11 and 12 .

[0067] As described above, the image sensor unit 15 includes the image sensor 16 having the imaging surface 17 for capturing an image of a subject and the back surface 89 facing the imaging surface 17, the circuit board 90 attached to the back surface 89, and the first thermally conductive member 100 and the second thermally conductive member 101 through which drive heat of the image sensor 16 is conducted. The circuit board 90 has an opening 91 that exposes a central region 92 of the back surface 89 of the image sensor 16. The first thermally conductive member 100 is connected to the second thermally conductive member 101 and has higher elasticity than the second thermally conductive member 101. The second thermally conductive member 101 is connected to the back surface 89 via the opening 91. Because the second thermally conductive member 101, which is relatively rigid and resistant to deformation, is directly connected to the image sensor 16, the thermally conductive members are less likely to peel off from the image sensor 16 than when the first thermally conductive member 100, which is relatively elastic and resistant to deformation, is directly connected to the image sensor 16.

[0068] The imaging element unit 15 has an anti-vibration function that moves the imaging element 16 in the planar direction. As shown in Figures 11 and 12, the first thermal conductive member 100 deforms to follow the movement of the imaging element 16 due to the anti-vibration function. Therefore, the second thermal conductive member 101, which is relatively rigid and resistant to deformation, is directly connected to the imaging element 16, which makes it possible to more effectively prevent the thermal conductive member from peeling off.

[0069] Furthermore, when the first thermal conductive member 100 is directly connected to the imaging element 16, it is necessary to increase the thickness TH1 of the first thermal conductive member 100 to improve conduction efficiency. If the thickness TH1 is large, the repulsive force of the first thermal conductive member 100 increases accordingly, making it difficult for the first thermal conductive member 100 to deform in response to the movement of the imaging element 16 due to the vibration isolation function. However, in this example, it is not necessary to increase the thickness TH1 of the first thermal conductive member 100 that much. Therefore, the first thermal conductive member 100 can deform in response to the movement of the imaging element 16 due to the vibration isolation function without much resistance, compared to when the first thermal conductive member 100 is directly connected to the imaging element 16.

[0070] As shown in FIG. 5 and other figures, second thermal conduction member 101 has a first piece 125 connected to central region 92 and facing back surface 89, and a second piece 126 bent from first piece 125. First thermal conduction member 100 is connected to second piece 126. Therefore, first thermal conduction member 100 deforms to follow the movement of second piece 126, rather than the movement of imaging element 16 itself. If first thermal conduction member 100 were to deform to follow the movement of imaging element 16 itself, it would be necessary for first thermal conduction member 100 to have a complex configuration. However, because first thermal conduction member 100 deforms to follow the movement of second piece 126, the configuration of first thermal conduction member 100 can be simplified.

[0071] Additionally, second piece 126 extends in the normal direction to imaging surface 17 and back surface 89. This allows for a simpler configuration of first thermal conductive member 100. Note that the angle at which second piece 126 is bent from first piece 125 may be less than 90° or greater than 90°.

[0072] The imaging element unit 15 includes a flexible substrate 96 attached to the circuit board 90. As shown in Fig. 7, the flexible substrate 96 is disposed on the opposite side of the first thermally conductive member 100, with the second piece 126 of the second thermally conductive member 101 sandwiched therebetween. This eliminates the risk of the flexible substrate 96 and the first thermally conductive member 100 coming into contact with each other, causing a disruption in the signals to and / or from the imaging element 16.

[0073] 6, thickness TH2 of second heat conducting member 101 is greater than thickness TH1 of first heat conducting member 100. Therefore, the heat conduction efficiency of second heat conducting member 101 can be improved.

[0074] The thermal conductivity of the graphite sheet forming first thermal conduction member 100 is 1600 W / m·K. On the other hand, the thermal conductivity of copper forming second thermal conduction member 101 is 390 W / m·K, which is lower than that of the graphite sheet. However, as described above, by making the thickness TH2 of second thermal conduction member 101 thicker than the thickness TH1 of first thermal conduction member 100, the lower thermal conductivity can be compensated for. This makes it possible to increase the thermal conduction efficiency of second thermal conduction member 101 compared to first thermal conduction member 100. If the thermal conductivity of second thermal conduction member 101 is higher than that of first thermal conduction member 100, drive heat can be smoothly conducted from second thermal conduction member 101 to first thermal conduction member 100.

[0075] Note that, by increasing thickness TH2 of second heat conduction member 101, the thermal conductivity of second heat conduction member 101 is made higher than that of first heat conduction member 100, but this is not limiting. Instead of or in addition to increasing thickness TH2 of second heat conduction member 101, second heat conduction member 101 may be made of a material having a higher thermal conductivity than first heat conduction member 100, thereby making the thermal conductivity of second heat conduction member 101 higher than that of first heat conduction member 100.

[0076] 4 and other drawings, opening 91 of circuit board 90 exposes central region 92 of rear surface 89 of imaging element 16. The central region 92 is the location on rear surface 89 of imaging element 16 where the drive heat of imaging element 16 is highest. Therefore, drive heat of imaging element 16 can be dissipated more effectively.

[0077] Furthermore, the central region 92 is a region in which identification information 98 of the image sensor 16 is written. Therefore, the opening 91 formed for visually recognizing the identification information 98 can be effectively used for dissipating heat generated by driving the image sensor 16.

[0078] 2, first thermal conductive member 100 is made of a graphite sheet, and second thermal conductive member 101 and third thermal conductive member 102 are made of metal. This allows first thermal conductive member 100 to have an appropriate degree of elasticity, while second thermal conductive member 101 and third thermal conductive member 102 can have an appropriate degree of rigidity.

[0079] As shown in FIG. 9 and other figures, the first thermally conductive member 100 includes an outer layer 110 and an inner layer 111 connected to the outer layer 110 and disposed in a space surrounded by the outer layer 110. The outer layer 110 and the inner layer 111 each have bent portions (corners 140-145 and corners 146-151) that allow deformation in response to the movement of the image sensor 16 due to vibration isolation. This allows for more efficient dissipation of heat generated by the image sensor 16 than would be possible with only the outer layer 110. As a result, shooting that places a relatively large load on the image sensor 16, such as shooting 4K / 120p video, can be performed for a longer period of time than conventional shooting. Furthermore, the dual-layer structure of the first thermally conductive member 100 allows for a reduction in the installation space required for the thermally conductive member.

[0080] 10, first thermal conduction member 100 is formed by folding a single sheet-like material 160. This makes it easier to form first thermal conduction member 100 than when outer layer portion 110 and inner layer portion 111 are formed from separate materials and then joined together.

[0081] 5 and other figures, first thermally conductive member 100 is made up of first sheet portions 115 and 118, second sheet portions 116 and 119 facing first sheet portions 115 and 118, connection portion 117 connecting first sheet portion 115 and second sheet portion 116, and connection portion 120 connecting first sheet portion 118 and second sheet portion 119. Therefore, first thermally conductive member 100 can smoothly deform in response to the movement of imaging element 16 due to its vibration isolation function.

[0082] 9 and other figures, outer layer portion 110 and inner layer portion 111 have corners 140-145 and corners 146-151 that function as bending portions and protrude outward. This allows a large space to be surrounded by outer layer portion 110, making it easier to form inner layer portion 111.

[0083] As shown in FIG. 10 , first thermal conduction member 100 has reinforcing layers 161 on two sides that define connecting portion 117 and connecting portion 120, except for corners 144, 145, 150, and 151, which function as bends. The two sides that define connecting portion 117 and connecting portion 120 are thicker than corners 140-145 and corners 146-151, which function as bends, due to the reinforcing layers 161. This prevents unintended deformation of the two sides that define connecting portion 117 and connecting portion 120. Furthermore, because reinforcing layers 161 are not provided on corners 140-145 and corners 146-151, which function as bends, first thermal conduction member 100 can deform without significant resistance in response to movement of imaging element 16 due to its vibration isolation function. Note that a reinforcing layer 161 may be provided on the first sheet portion 115 and the first sheet portion 118, and the second sheet portion 116 and the second sheet portion 119.

[0084] The first thermally conductive member 100 is connected to the image sensor 16 via the second thermally conductive member 101, and is connected to the camera body 10 via the third thermally conductive member 102. As shown in FIG. 5 and other figures, the second thermally conductive member 101 and the third thermally conductive member 102 are sandwiched between the outer layer 110 and the inner layer 111. This improves the efficiency of conduction of drive heat from the second thermally conductive member 101 to the first thermally conductive member 100, and from the first thermally conductive member 100 to the third thermally conductive member 102. This also improves the holding power of the first thermally conductive member 100 to hold the second thermally conductive member 101 and the third thermally conductive member 102. The third thermally conductive member 102 may form part of the camera body 10.

[0085] As shown in FIG. 8, a fourth thermal conductive member 135 formed of a graphite sheet is connected between third thermal conductive member 102 and top plate 137 of camera body 10. A thickness TH4 of fourth thermal conductive member 135 is thicker than a thickness TH1 of first thermal conductive member 100. Unlike first thermal conductive member 100, fourth thermal conductive member 135 does not deform to follow the movement of image sensor 16 due to its vibration isolation function. Therefore, unlike first thermal conductive member 100, it is not necessary to make thickness TH1 relatively thin to achieve smooth deformation at the expense of some of the efficiency of drive heat conduction, and sufficient conduction efficiency can be ensured by increasing thickness TH4.

[0086] The number of inner layer portions 111 is not limited to one. For example, a triple structure may be used, such as a first thermally conductive member 170 shown in FIG. 14, which has one outer layer portion 171 and two inner layer portions 172 and 173 arranged in a space surrounded by the outer layer portion 171. The shape of the first thermally conductive member is not limited to a hexagon. For example, a first thermally conductive member 180 shown in FIG. 15 may have an octagonal outer layer portion 181 and an octagonal inner layer portion 182. Furthermore, as shown in FIG. 16, a first thermally conductive member 190 may have corners 195 and 196 of a connecting portion 193 of an outer layer portion 191 and corners 197 and 198 of a connecting portion 194 of an inner layer portion 192 that are recessed inward. The first thermally conductive member 190 has a shape that resembles a combination of the letter "Σ" and its mirror image.

[0087] [Second embodiment] As an example, as shown in FIGS. 17 and 18 , an image sensor unit 200 according to the second embodiment includes a fifth thermally conductive member 201. The fifth thermally conductive member 201 is located opposite a side surface 202 of the image sensor 16 that connects the imaging surface 17 and the back surface 89, and is disposed within a space formed by a flexible substrate 97 that is connected to the image sensor 16 and wraps around the front surface of the movable member 31. Drive heat from the image sensor 16 is conducted from the side surface 202 to the fifth thermally conductive member 201. A sixth thermally conductive member 203 formed of a metal plate is also connected to the fifth thermally conductive member 201. The sixth thermally conductive member 203 is connected to a side panel or the like of the camera body 10. Drive heat from the fifth thermally conductive member 201 is conducted to the camera body 10 via the sixth thermally conductive member 203.

[0088] Fifth thermal conduction member 201 is formed of a graphite sheet, similar to first thermal conduction member 100, etc., and has high elasticity. Similar to first thermal conduction member 100, etc., fifth thermal conduction member 201 deforms to follow the movement of image sensor 16 due to its vibration isolation function. However, unlike first thermal conduction member 100, etc., fifth thermal conduction member 201 has a structure without an inner layer.

[0089] 19, fifth thermal conduction member 201 is hexagonal, similar to first thermal conduction member 100, having six corners: 205, 206, 207, 208, 209, and 210. Corners 205 to 210 function as bending portions that enable deformation in accordance with the movement of imaging element 16 due to the vibration isolation function. Similarly to first thermal conduction member 100, fifth thermal conduction member 201 is composed of first sheet portion 211, second sheet portion 212 that has the same length as first sheet portion 211 and faces first sheet portion 211, and a pair of V-shaped connecting portions 213 that connect first sheet portion 211 and second sheet portion 212. Angle θ5 of corners 209 and 210, which function as bending portions of connection portion 213, is acuter than angle θ1 (see Figure 9) of corners 144 and 145, and corners 150 and 151, which function as bending portions of connection portion 117 and connection portion 120 of first thermal conduction member 100.

[0090] As described above, the image sensor unit 200 of the second embodiment includes a fifth heat conduction member 201. The fifth heat conduction member 201 is disposed in a position facing a side surface 202 of the image sensor 16 that connects the imaging surface 17 and the back surface 89. Drive heat is conducted to the fifth heat conduction member 201 from the side surface 202. The fifth heat conduction member 201 deforms to follow the movement of the image sensor 16 due to the vibration isolation function. The fifth heat conduction member 201 has a bent portion that enables it to deform to follow the movement of the image sensor 16 due to the vibration isolation function. Therefore, drive heat can be dissipated more effectively without impeding the movement of the image sensor 16 due to the vibration isolation function.

[0091] Fifth heat conduction member 201 is composed of first sheet portion 211, second sheet portion 212 facing first sheet portion 211, and connection portion 213 connecting first sheet portion 211 and second sheet portion 212. Therefore, fifth heat conduction member 201 can smoothly deform in response to movement of imaging element 16 due to the vibration isolation function, while ensuring connection portions with sixth heat conduction member 203 and the like.

[0092] Furthermore, angle θ5 formed by the bent portion of connection portion 213 of fifth thermal conduction member 201 is acuter than angle θ1 formed by the bent portions of connection portions 117 and 120 of first thermal conduction member 100. This reduces the repulsive force of fifth thermal conduction member 201, allowing fifth thermal conduction member 201 to deform without significant resistance in response to the movement of image sensor 16 due to its vibration-damping function. Furthermore, since the distance between first sheet portion 211 and second sheet portion 212 is shorter, fifth thermal conduction member 201 is more compact than first thermal conduction member 100. This allows fifth thermal conduction member 201 to be disposed in a relatively narrow space, such as within the space formed by flexible substrate 97, at a position facing side surface 202 of image sensor 16.

[0093] Fifth heat conducting member 201 is made of a graphite sheet, which allows fifth heat conducting member 201 to have appropriate elasticity.

[0094] Similarly to first thermal conduction member 100, fifth thermal conduction member 201 may have a multi-layer structure. Furthermore, as in the example shown in Fig. 15, fifth thermal conduction member 201 may have an octagonal shape. Furthermore, as in the example shown in Fig. 16, fifth thermal conduction member 201 may have a structure in which the corners of the connection portions are recessed inward.

[0095] In the first embodiment described above, an example was shown in which an opening 91 exposing a central region 92 of a rear surface 89 of the imaging element 16 is formed in the circuit board 90, and the first piece 125 of the second thermally conductive member 101 is connected to the central region 92 through the opening 91, but this is not limiting. For example, as shown in Fig. 20, the second thermally conductive member 101 may be connected to a central region 222 of a rear surface 221 of a circuit board 220 that does not have an opening 91.

[0096] Although not shown, a circuit board that does not have openings 91 and second thermal conductive member 101 may be connected via a thermally conductive gel or the like.

[0097] Although the CPU 18 has been exemplified as a processor that controls the operation of the image sensor unit 15, this is not limiting. Instead of or in addition to the CPU 18, a programmable logic device (PLD), which is a processor whose circuit configuration can be changed after manufacture, such as an FPGA (Field Programmable Gate Array), and / or a dedicated electric circuit having a circuit configuration designed specifically for executing specific processing, such as an ASIC (Application Specific Integrated Circuit), may be used.

[0098] In the first embodiment, the plates 45-47 are provided on the fixed member 30 and the recesses 70-72 are provided on the movable member 31, but this is not limiting. The plates 45-47 may be provided on the movable member 31 and the recesses 70-72 may be provided on the fixed member 30. Furthermore, in the first embodiment, the magnets 40-42 are provided on the fixed member 30 and the coils 60-62 are provided on the movable member 31, but this is not limiting. The magnets 40-42 may be provided on the movable member 31 and the coils 60-62 may be provided on the fixed member 30.

[0099] The number of sets of balls 35 to 37, plates 45 to 47, and recesses 70 to 72 is not limited to three, but may be four or more.

[0100] The imaging element unit of the present disclosure can be applied to imaging devices other than the exemplified digital camera 2, such as smartphones, tablet terminals, or surveillance cameras.

[0101] The technology of the present disclosure can be appropriately combined with the various embodiments and / or various modified examples described above. Furthermore, it is needless to say that it is not limited to the above-described embodiments, and various configurations can be adopted as long as they do not deviate from the gist of the present disclosure.

[0102] The above-described description and illustrations are a detailed explanation of the parts related to the technology of the present disclosure and are merely an example of the technology of the present disclosure. For example, the above description of the configuration, functions, actions, and effects is an explanation of an example of the configuration, functions, actions, and effects of the parts related to the technology of the present disclosure. Therefore, it goes without saying that unnecessary parts may be deleted, new elements may be added, or replacements may be made to the above-described description and illustrations within the scope of the gist of the technology of the present disclosure. Furthermore, to avoid confusion and facilitate understanding of the parts related to the technology of the present disclosure, the above-described description and illustrations omit explanations of common technical knowledge that do not require particular explanation to enable the implementation of the technology of the present disclosure.

[0103] In this specification, "A and / or B" is synonymous with "at least one of A and B." In other words, "A and / or B" means that it may be only A, only B, or a combination of A and B. Furthermore, in this specification, the same concept as "A and / or B" is also applied when three or more things are expressed connected by "and / or."

[0104] All publications, patent applications, and technical standards mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent application, or technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. An imaging element unit built into a housing of an imaging device, an imaging element having an imaging surface for imaging a subject and a back surface opposite to the imaging surface; an anti-shake function for moving the image sensor in a planar direction of the image pickup surface; a first heat conduction member through which drive heat of the image pickup element is conducted from the rear surface, the first heat conduction member being deformable to follow movement of the image pickup element due to the vibration isolation function; Equipped with The first thermal conductive member is The outer layer and At least one inner layer portion connected to the outer layer portion and disposed in a space surrounded by the outer layer portion, Each of the outer layer portion and the inner layer portion has a bent portion that enables the deformation. Image sensor unit.

2. The imaging element unit according to claim 1 , wherein the first heat conducting member is formed by folding a single sheet-like material.

3. The outer layer portion and the inner layer portion are A first seat portion; a second sheet portion facing the first sheet portion; 3. The imaging element unit according to claim 1, further comprising a connecting portion that connects the first sheet portion and the second sheet portion.

4. The imaging element unit according to claim 1 , wherein the bent portions of the outer layer portion and the inner layer portion protrude outward.

5. the first heat conducting member has a reinforcing layer in a portion other than the bent portion, 5. The imaging element unit according to claim 1, wherein the portion having the reinforcing layer is thicker than the bent portion by an amount corresponding to the reinforcing layer.

6. the first thermally conductive member is connected to the imaging element via a second thermally conductive member and is connected to the housing via a third thermally conductive member; The imaging element unit according to claim 1 , wherein the second thermal conductive member and the third thermal conductive member are sandwiched between the outer layer portion and the inner layer portion.

7. the first heat conducting member is formed of a graphite sheet, The image pickup element unit according to claim 6 , wherein the second heat conducting member and the third heat conducting member are made of metal.

8. a fourth heat conducting member formed of a graphite sheet is connected between the third heat conducting member and the housing; The image sensor unit according to claim 7 , wherein the fourth thermal conductive member is thicker than the first thermal conductive member.

9. a fifth thermal conduction member that is disposed at a position facing a side surface of the image sensor connecting the image sensor surface and the back surface, and through which the drive heat is conducted from the side surface; The imaging element unit according to claim 1 , wherein the fifth heat conduction member has a bent portion that deforms to follow the movement of the imaging element due to the vibration isolation function.

10. The first thermal conductive member and the fifth thermal conductive member are A first seat portion; a second sheet portion facing the first sheet portion; a connecting portion that connects the first sheet portion and the second sheet portion and has a bent portion; The image sensor unit according to claim 9 , wherein an angle formed by the bent portion of the fifth thermal conductive member is more acute than an angle formed by the bent portion of the first thermal conductive member.

11. 11. The image pickup element unit according to claim 9, wherein the fifth heat conducting member is formed of a graphite sheet.

12. The housing and an imaging element unit according to any one of claims 1 to 11, which is built into the housing; An imaging device comprising:

Images