Display device with excellent heating efficiency having fewer components

Abstract

To provide a liquid crystal display device including fewer components, in which the heating efficiency is improved.SOLUTION: A display device includes a first substrate 21 having a main surface that is sectioned into a display region AA and a non-display region NAA, a first terminal part 38, a second terminal part 35, and a third terminal part 36 provided in a first end part 21A, which is the non-display region, a flexible substrate attached to the first end part and connected to each of the first terminal part, the second terminal part, and the third terminal part, a first pixel disposed in the display region, a first pixel wire connected to the first terminal part and the first pixel, a first heating wire 28 connected to the second terminal part, and a second heating wire 29 connected to the third terminal part. The first heating wire extends from the second terminal part side toward a second end part 21B, which is the non-display region of the first substrate, with the display region held between the first heating wire and the first end part. The second heating wire extends from the third terminal part side toward the second end part, and its extension end part 29A is connected to an extension end part 28A of the first heating wire.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a display device. [Background technology]

[0002] A known example of a conventional display device is a liquid crystal display device described in Patent Document 1. The liquid crystal display device described in Patent Document 1 includes a display area and a non-display area surrounding the display area, a first base including a first substrate, a second base including a second substrate and including a plurality of gate lines, a plurality of data lines, and a plurality of sub-pixels arranged in the display area, a liquid crystal layer arranged between the first base and the second base, a first heating power terminal arranged in the non-display area and outputting a high voltage, a second heating power terminal arranged in the non-display area and outputting a low voltage, and at least one heating electrode arranged between the first substrate and the second substrate and used to heat the liquid crystal layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2020 / 0073168 Summary of the Invention [Problem to be solved by the invention]

[0004] In the liquid crystal display device described in Patent Document 1, the heating electrodes are arranged over a significant portion of the non-display area, so heat generated from the heating electrodes is also supplied to the liquid crystal layer in the non-display area. This results in a problem of inefficient heating of the liquid crystal layer in the display area. Another problem is the need for dedicated components to supply power to each heating power terminal.

[0005] The technology described in this specification was developed based on the above circumstances, and aims to improve heating efficiency and reduce the number of parts. [Means for solving the problem]

[0006] (1) A display device according to the technology described in this specification includes a first substrate having a main surface divided into a display area where an image is displayed and a non-display area where the image is not displayed, a first terminal provided at a first end portion of the first substrate which is the non-display area, a second terminal provided at the first end portion, a third terminal provided at the first end portion, a flexible substrate attached to the first end portion and connected to the first terminal portion, the second terminal portion, and the third terminal portion, respectively, a first pixel arranged in the display area, and a plurality of pixels arranged in the display area, The display device includes a first pixel wiring connected to the first terminal portion and the first pixel, a first heating wiring arranged in the display area and connected to the second terminal portion, and a second heating wiring arranged in the display area and connected to the third terminal portion, wherein the first heating wiring extends from the second terminal portion side toward a second end side which is in the non-display area of the first substrate and sandwiches the display area between the first end and the first heating wiring, and the second heating wiring extends from the third terminal portion side toward the second end side, and the extended end is connected to the extended end of the first heating wiring.

[0007] (2) In addition to (1), the display device may further include a fourth terminal portion provided at the first end portion and connected to the flexible substrate, and a third heating wiring disposed in the display area and connected to the fourth terminal portion, wherein the third heating wiring is disposed between the first heating wiring and the second heating wiring in the display area, and extends from the fourth terminal portion side toward the second end portion, and the extended end portion is connected to the extended end portion of the first heating wiring.

[0008] (3) In addition to the above (2), the display device may be arranged such that the first heating wire, the second heating wire, and the third heating wire are arranged in plural numbers.

[0009] (4) In addition to the above (2) or (3), the display device may be configured such that the second terminal and the fourth terminal are connected to a positive electrode of a DC power supply, and the third terminal is connected to a negative electrode of the DC power supply.

[0010] (5) In addition to any one of (2) to (4), the display device may be configured such that the first heating wiring, the second heating wiring, and the third heating wiring are arranged in multiple numbers, the display area is divided into a first area where multiple first heating wirings are arranged, a second area where multiple second heating wirings are arranged, and a third area where multiple third heating wirings are arranged, and the ratio of the number of the first heating wirings, the second heating wirings, and the third heating wirings installed is inversely correlated with the area ratio of the first area, the second area, and the third area.

[0011] (6) In addition to any one of (1) to (5), the display device may further include a second pixel arranged in the display area, a second pixel wiring arranged in the display area and connected to the second pixel, and a first insulating film interposed between the first heating wiring and the second heating wiring and the first pixel wiring and the second pixel wiring, wherein the first heating wiring is arranged to overlap the first pixel wiring via the first insulating film, and the second heating wiring is arranged to overlap the second pixel wiring via the first insulating film.

[0012] (7) In addition to (6), the display device may further include a third pixel arranged in the display area, a third pixel wiring arranged in the display area and connected to the third pixel, and a dummy wiring arranged to overlap the third pixel wiring via the first insulating film.

[0013] (8) In addition to (7), the display device may further include a first pixel electrode constituting the first pixel, a second pixel electrode constituting the second pixel, a third pixel electrode constituting the third pixel, and a common electrode arranged to overlap the first pixel electrode, the second pixel electrode, and the third pixel electrode with a gap therebetween, and the dummy wiring may be connected to the common electrode.

[0014] (9) Furthermore, in addition to any one of (1) to (8), the display device may be arranged such that the first heating wiring and the second heating wiring are arranged in plural, and the display device is provided with a first main wiring connected to the extended ends of the plural first heating wirings and the extended ends of the plural second heating wirings, a second main wiring connected to the plural first heating wirings and the second terminal portion, and a third main wiring connected to the plural second heating wirings and the third terminal portion.

[0015] (10) In addition to the above (9), the display device may be configured such that the first main wiring is disposed at the second end portion.

[0016] (11) In addition to the above (9), the display device may be configured such that the first main wiring is disposed in the display area.

[0017] (12) In addition to (11), the display device may further include a fourth pixel wiring arranged in the display area and intersecting the first pixel wiring, and a second insulating film interposed between the fourth pixel wiring and the first main wiring, and the first main wiring may be arranged to overlap the fourth pixel wiring via the second insulating film.

[0018] (13) In addition to any one of (9) to (12), the display device may be such that the first heating wiring and the second heating wiring each have a single-layer structure made of a single conductive film, and the first main wiring, the second main wiring, and the third main wiring each have a layered structure made of a plurality of stacked conductive films.

[0019] (14) In addition to any one of (9) to (13), the display device may be configured such that the first main wiring, the second main wiring, and the third main wiring are thicker than the first heating wiring and the second heating wiring.

[0020] (15) In addition to any one of (1) to (14), the display device may further include a second substrate arranged opposite the first substrate with a gap therebetween, and a liquid crystal layer sandwiched between the first substrate and the second substrate. [Effects of the Invention]

[0021] According to the technology described in this specification, it is possible to improve heating efficiency and reduce the number of parts. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a plan view of a liquid crystal panel, a flexible substrate, a control substrate, and the like that constitute a liquid crystal display device according to Embodiment 1. [Figure 2] 1 is a cross-sectional view of a liquid crystal panel, a flexible substrate, a control substrate, and the like according to Embodiment 1. [Figure 3] FIG. 1 is a circuit diagram showing the electrical configuration of an array substrate that constitutes a liquid crystal panel according to a first embodiment. [Figure 4] FIG. 1 is a plan view showing a configuration related to a heater function provided on an array substrate according to a first embodiment; [Figure 5] FIG. 1 is a plan view showing a specific planar configuration of a display area of an array substrate according to a first embodiment; [Figure 6] 6 is a cross-sectional view of the array substrate according to the first embodiment taken along line vi-vi in FIG. 5 . [Figure 7] FIG. 1 is a graph showing the relationship between the temperature near the liquid crystal panel detected by the temperature sensor according to the first embodiment and the elapsed time, and a graph showing the relationship between the voltage input from the positive electrode of the power supply IC to the first heating terminal and the third heating terminal and the elapsed time. [Figure 8] FIG. 10 is a plan view showing a configuration related to a heater function provided in a liquid crystal panel of Comparative Example 1 of Comparative Experiment 1 related to Embodiment 1. [Figure 9] FIG. 1 is a circuit diagram showing the wiring resistances of the main wiring and heating wiring in a liquid crystal panel of Comparative Example 1 in Comparative Experiment 1 according to Embodiment 1. [Figure 10]FIG. 1 is a circuit diagram showing the wiring resistance of each main wiring and each heating wiring in a liquid crystal panel of Example 1 of Comparative Experiment 1 according to Embodiment 1. [Figure 11] FIG. 10 is a plan view showing a configuration relating to a heater function provided on an array substrate according to a second embodiment; [Figure 12] FIG. 10 is a plan view showing a configuration relating to a heater function provided on an array substrate according to a third embodiment. [Figure 13] FIG. 10 is a plan view showing a configuration related to a heater function provided on an array substrate according to a fourth embodiment. [Figure 14] FIG. 10 is a plan view showing a specific planar configuration of a display area of an array substrate according to a fourth embodiment. [Figure 15] 14 in the array substrate according to the fourth embodiment. [Figure 16] FIG. 10 is a plan view showing a configuration relating to a heater function provided on an array substrate according to a fifth embodiment. [Figure 17] 10 is a cross-sectional view of the array substrate according to the fifth embodiment, taken along a line adjacent to a second main wiring; [Figure 18] 13 is a cross-sectional view of the array substrate according to the sixth embodiment, taken along a line adjacent to a second main wiring; [Figure 19] FIG. 13 is a plan view showing a configuration related to a heater function provided on an array substrate according to a seventh embodiment. [Figure 20] 13 is a cross-sectional view of the first heating wiring, the second heating wiring, and the vicinity of the dummy wiring in the display area of the array substrate according to the seventh embodiment. [Figure 21] FIG. 13 is a plan view showing a configuration related to a heater function provided on an array substrate according to an eighth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0023] <Embodiment 1> A first embodiment will be described with reference to Figs. 1 to 10. In this embodiment, a liquid crystal display device 10 used in an in-vehicle CMS (Camera Monitor System) will be illustrated. An in-vehicle CMS is a system that displays an image captured by a camera on a display (liquid crystal display device 10) as a replacement for the door mirrors and rearview mirrors that use mirror surfaces in an automobile. Note that X-axis, Y-axis, and Z-axis are shown in some of the drawings, and each axis is drawn so that it corresponds to the direction shown in each drawing. Also, the upper side of Figs. 2 and 6 is the front side, and the lower side of the drawings is the back side.

[0024] As shown in Fig. 1, a liquid crystal display device 10 includes at least a horizontally elongated rectangular liquid crystal panel (display device, display panel) 11 capable of displaying images, and a backlight device (illumination device) that is an external light source that irradiates the liquid crystal panel 11 with light to be used for display. The backlight device is disposed on the rear side (back surface) of the liquid crystal panel 11 and includes a light source (e.g., an LED) that emits white light and optical components that convert the light from the light source into planar light by applying an optical effect to the light. The central portion of the screen (main surface) of the liquid crystal panel 11 is a display area AA where an image is displayed. In contrast, the outer peripheral portion of the screen of the liquid crystal panel 11 that is frame-shaped and surrounds the display area AA is a non-display area NAA where no image is displayed.

[0025] As shown in Fig. 1, a circuit section (peripheral circuit section, gate circuit section) 12 is provided in the non-display area NAA of the liquid crystal panel 11. A pair of circuit sections 12 are arranged so as to sandwich the display area AA from both sides in the X-axis direction. The circuit section 12 is provided in a strip-shaped range extending along the Y-axis direction. The circuit section 12 is for supplying scanning signals to gate wiring 26 (described later), and is provided monolithically on an array substrate 21 (described later). The circuit section 12 is a GDM (Gate Driver Monolithic) circuit. The circuit section 12 includes a shift register circuit that outputs scanning signals at predetermined timing, a buffer circuit that amplifies the scanning signals, and the like.

[0026] The liquid crystal panel 11 will be described in detail with reference to FIG. 1 and FIG. 2. As shown in FIGS. 1 and 2, the liquid crystal panel 11 is formed by bonding a pair of substrates 20 and 21 together. The front side (front surface) of the pair of substrates 20 and 21 is a counter substrate (second substrate) 20, and the back side (rear surface) is an array substrate (first substrate) 21. The counter substrate 20 and the array substrate 21 are each formed by laminating various films on the inner surface of glass substrates (substrate portions) 20GS and 21GS. A liquid crystal layer (medium layer) 22 containing liquid crystal molecules, which are a substance whose optical properties change when an electric field is applied, is disposed between the pair of substrates 20 and 21. A seal portion 23 that seals the liquid crystal layer 22 is disposed between the outer peripheral edges of the pair of substrates 20 and 21. The seal portion 23 is formed in a rectangular frame shape (endless ring) so as to surround the liquid crystal layer 22. A polarizing plate 13 is attached to the outer surface of each of the substrates 20 and 21.

[0027] As shown in FIGS. 1 and 2, the counter substrate 20 has a shorter short side dimension than the array substrate 21. The counter substrate 20 is bonded to the array substrate 21 so that one end of the counter substrate 20 in the short side direction (Y-axis direction) is aligned with the array substrate 21. Therefore, the array substrate 21 has a first end portion 21A at the other end of the short side direction that protrudes laterally from the counter substrate 20 and is exposed. This first end portion 21A is one side of the frame-shaped non-display area NAA that extends along the X-axis direction, and a flexible substrate 14 for supplying various signals is mounted on the first end portion 21A. The array substrate 21 also has a second end portion 21B at one end of the short side direction. This second end portion 21B is one side of the frame-shaped non-display area NAA that extends along the X-axis direction, and is positioned so that the display area AA is sandwiched between the second end portion 21B and the first end portion 21A in the Y-axis direction.

[0028] The flexible substrate 14 is configured by forming multiple wiring patterns on a base material made of an insulating and flexible synthetic resin material (e.g., polyimide resin, etc.). As shown in FIGS. 1 and 2, a driver 15 is mounted on the flexible substrate 14 using COF (Chip On Film) technology. The driver 15 is an LSI chip with an internal drive circuit. The driver 15 processes various signals transmitted by the flexible substrate 14. The driver 15 supplies various signals (e.g., image signals, etc.) to wiring in the display area AA (e.g., source wiring 27, etc., described below). One end of the flexible substrate 14 is connected to a first end 21A of the array substrate 21, and the other end is connected to the control substrate 16. The flexible substrate 14 is connected to a central portion of the first end 21A in the X-axis direction. The control substrate 16 is configured by mounting multiple circuit components on a rigid substrate made of synthetic resin (e.g., paper phenol or glass epoxy resin, etc.). The multiple circuit components include a power supply IC (Integrated Circuit) 16A, which is a DC power supply for outputting power, a timing controller 16B that generates various signals to be supplied to the driver 15, and a level shifter IC 16C that controls (steps down and up) voltage levels. The control board 16 has a connector portion to which the flexible board 14 and the like are connected. The control board 16 is arranged so that it overlaps the back side of the backlight device by bending the flexible board 14 in a folded shape. A temperature sensor 17 is connected to the control board 16. The temperature sensor 17 is arranged in proximity to or in contact with the liquid crystal panel 11, and is capable of detecting the temperature near the liquid crystal panel 11.

[0029] Next, the configuration of the display area AA of the array substrate 21 will be described with reference to FIG. 3. As shown in FIG. 3, at least TFTs (switching elements, transistors) 24 and pixel electrodes 25 are provided on the inner surface of the display area AA of the array substrate 21. The TFTs 24 and pixel electrodes 25, together with color filters (described later), constitute pixels PX, which are display units. Multiple TFTs 24 and multiple pixel electrodes 25 are arranged in a matrix (rows and columns) at intervals along the X-axis and Y-axis directions. Gate wiring (fourth pixel wiring, scanning wiring) 26 and source wiring (first pixel wiring to third pixel wiring, image wiring, signal wiring) 27, which intersect with each other at right angles, are arranged around the TFTs 24 and pixel electrodes 25. The gate wiring 26 extends along the X-axis direction, and multiple wirings are arranged at intervals along the Y-axis direction. The source wiring 27 extends along the Y-axis direction (first direction), and multiple wirings are arranged at intervals along the X-axis direction (second direction intersecting the first direction). The TFT 24 has a gate electrode 24A connected to the gate line 26, a source electrode 24B connected to the source line 27, a drain electrode 24C connected to the pixel electrode 25, and a semiconductor portion 24D connected to the source electrode 24B and the drain electrode 24C. The TFT 24 is driven based on a scanning signal supplied from the circuit unit 12 to the gate electrode 24A via the gate line 26. Then, a potential related to an image signal supplied from the driver 15 to the source electrode 24B via the source line 27 is supplied to the drain electrode 24C via the semiconductor portion 24D. As a result, the pixel electrode 25 is charged to the potential related to the image signal. The pixel electrode 25 is disposed in a region surrounded by the gate line 26 and the source line 27, and has a planar shape that is, for example, approximately rectangular.

[0030] In addition, a plurality of color filters are provided in the display area AA of the counter substrate 20 at positions facing each pixel electrode 25 on the array substrate 21 side. The color filters are formed by repeatedly arranging three colors, R (red), G (green), and B (blue), in a predetermined order, and together with the TFTs 24 and the pixel electrodes 25, form pixels PX of each color (red pixel, green pixel, and blue pixel). Three pixels PX, i.e., red pixel, green pixel, and blue pixel, form a display pixel capable of displaying a predetermined color gradation. In addition, a light-shielding portion (black matrix) is formed between each color filter to prevent color mixture. Note that an alignment film for aligning liquid crystal molecules contained in the liquid crystal layer 22 is provided on the innermost surfaces of the counter substrate 20 and the array substrate 21, respectively.

[0031] Because the liquid crystal display device 10 according to this embodiment is used in an in-vehicle CMS, there is a strong concern that the response speed of the liquid crystal panel 11 may decrease due to an increase in the viscosity of the liquid crystal layer 22 in a low-temperature environment. Therefore, the liquid crystal panel 11 according to this embodiment is provided with a heater function to improve the response speed at low temperatures, and the structure for realizing the heater function is in-cell. The structure related to the heater function will be described with reference to FIG. 4 and other figures. As shown in FIG. 4, the array substrate 21 is provided with a plurality of heating wires 28-30, a plurality of main wires 31-34, and a plurality of heating terminal portions 35-37. Note that in FIG. 4, the heating wires 28-30 and the main wires 31-34 are shown shaded. All of the heating wires 28-30 are arranged in the display area AA. More specifically, the plurality of heating wires 28-30 extend along the Y-axis direction from the first end 21A side to the second end 21B side of the array substrate 21, crossing the display area AA, with one end and the other end in the length direction being arranged in the first end 21A and the second end 21B, which are the non-display area NAA. The plurality of heating wires 28-30 are arranged side by side at intervals in the X-axis direction.

[0032] As shown in FIG. 4, the heating wires 28-30 include a plurality of first heating wires 28 arranged on the left side of the display area AA in the X-axis direction, a plurality of second heating wires 29 arranged on the center side of the display area AA in the X-axis direction, and a plurality of third heating wires 30 arranged on the right side of the display area AA in the X-axis direction. The display area AA is divided into a first area A1 in which the plurality of first heating wires 28 are arranged, a second area A2 in which the plurality of second heating wires 29 are arranged, and a third area A3 in which the plurality of third heating wires 30 are arranged. The first area A1 and the third area A3 have equal area ratios. The number of the plurality of first heating wires 28 arranged in the first area A1 is equal to the number of the plurality of third heating wires 30 arranged in the third area A3. The second area A2 has a higher area ratio than both the first area A1 and the third area A3. The number of the second heating wires 29 arranged in the second area A2 is greater than the number of the first heating wires 28 and the number of the third heating wires 30.

[0033] As shown in FIG. 4, the multiple main wirings 31-34 are all arranged in the non-display area NAA. The multiple main wirings 31-34 all extend along the X-axis direction and intersect with the multiple heating wirings 28-30. The multiple main wirings 31-34 include a first main wiring 31 connected to the extended ends (extended tips) 28A-30A of the multiple heating wirings 28-30, which are the ends on the second end 21B side; a second main wiring 32 connected to the ends (extended base ends) 28B of the multiple first heating wirings 28 on the first end 21A side (lower side in FIG. 4); a third main wiring 33 connected to the ends (extended base ends) 29B of the multiple second heating wirings 29 on the first end 21A side; and a fourth main wiring 34 connected to the ends (extended base ends) 30B of the multiple third heating wirings 30 on the first end 21A side. The first main wiring 31 is arranged at the second end 21B of the array substrate 21. The first main wiring 31 extends over the entire length of the display area AA in the X-axis direction and is connected to all of the plurality of first heating wirings 28, second heating wirings 29, and third heating wirings 30. It can be said that the extending end 28A of the first heating wiring 28, the extending end 28A of the second heating wiring 29, and the extending end 28A of the third heating wiring 30 are connected to each other via the first main wiring 31. The second main wiring 32, the third main wiring 33, and the fourth main wiring 34 are all arranged at the first end 21A of the array substrate 21. The second main wiring 32, the third main wiring 33, and the fourth main wiring 34 are all arranged at the first end 21A closer to the display area AA than the flexible substrate 14 and are not overlapped with the flexible substrate 14. The second main wiring 32 extends over the entire length of the first region A1 of the display area AA in the X-axis direction and is connected to all of the first main wirings 31. The third trunk wiring 33 extends over the entire length of the second region A2 of the display area AA in the X-axis direction and is connected to all of the second trunk wiring 32. The fourth trunk wiring 34 extends over the entire length of the third region A3 of the display area AA in the X-axis direction and is connected to all of the third trunk wiring 33.

[0034] 4, the plurality of heating terminal portions 35-37 are all provided at the first end portion 21A of the array substrate 21. More specifically, the plurality of heating terminal portions 35-37 are all arranged at positions in the first end portion 21A that overlap the flexible substrate 14, and are connected to the plurality of terminal portions provided on the flexible substrate 14 via an anisotropic conductive film (ACF). In other words, the plurality of heating terminal portions 35-37 are all arranged farther from the display area AA than the second main wiring 32, the third main wiring 33, and the fourth main wiring 34.

[0035] As shown in FIG. 4, the multiple heating terminals 35-37 include a first heating terminal (second terminal) 35 connected to the second main wiring 32, a second heating terminal (third terminal) 36 connected to the third main wiring 33, and a third heating terminal (fourth terminal) 37 connected to the fourth main wiring 34. One first heating terminal 35 is arranged near the end position of the first region A1 on the second region A2 side (right side in FIG. 4) in the X-axis direction. The first heating terminal 35 is connected to the end of the first heating wiring 28 on the first end 21A side via the second main wiring 32. Two second heating terminals 36 are arranged near both ends of the second region A2 in the X-axis direction. The two second heating terminals 36 are connected to the end of the second heating wiring 29 on the first end 21A side via the third main wiring 33. The third heating terminal 37 is disposed near the end position of the third region A3 on the second region A2 side (left side in FIG. 4) in the X-axis direction. The third heating terminal 37 is connected to the end of the third heating wiring 30 on the first end 21A side via the fourth main wiring 34. The first heating terminal 35 and the third heating terminal 37 are each connected to a positive terminal connected to the positive electrode of the power supply IC (DC power supply) 16A among the terminals provided on the flexible substrate 14. The two second heating terminals 36 are each connected to a negative terminal connected to the negative electrode of the power supply IC 16A among the terminals provided on the flexible substrate 14.

[0036] As shown in FIG. 4, the first end 21A of the array substrate 21 is provided with a plurality of display terminals (first terminals) 38 in addition to a plurality of heating terminals 35 to 37. The plurality of display terminals 38 are connected to a plurality of source wirings 27 arranged in the display area AA. The first end 21A of the array substrate 21 is provided with a plurality of lead-out wirings (not shown) for connecting the plurality of display terminals 38 to the plurality of source wirings 27. Like the plurality of heating terminals 35 to 37, the plurality of display terminals 38 are arranged in positions in the first end 21A that overlap the flexible substrate 14, and are connected to a plurality of terminals provided on the flexible substrate 14 via an anisotropic conductive film. The plurality of display terminals 38 are arranged side by side at intervals in the X-axis direction, at positions sandwiched between two second heating terminals 36 at least in the X-axis direction. The multiple display terminal portions 38 may include one arranged at the end side in the X-axis direction (left side in Figure 4) relative to the first heating terminal portion 35 and one arranged at the end side in the X-axis direction (right side in Figure 4) relative to the third heating terminal portion 37.

[0037] Next, a specific planar configuration of the display area AA of the array substrate 21 will be described with reference to FIG. 5. FIG. 5 illustrates the planar configuration of the display area AA near the boundary between the first area A1 and the second area A2. As shown in FIG. 5, the pixel electrodes 25 are bent along their longitudinal direction. The pixel electrodes 25 are provided with a plurality of bent slits 25A extending along their longitudinal direction. The source wiring 27 extends generally along the Y-axis direction and is repeatedly bent along the planar shapes of the pixel electrodes 25 aligned along the Y-axis direction. In the first area A1, a first heating wiring 28 is disposed so as to overlap the source wiring 27 in a planar view. In the second area A2, a second heating wiring 29 is disposed so as to overlap the source wiring 27 in a planar view. In FIG. 5, the first heating wiring 28 and the second heating wiring 29 are illustrated as hatched. Although not shown in the drawings, in the third region A3, the third heating wiring 30 is arranged so as to overlap the source wiring 27 in a plan view. Like the overlapping source wiring 27, each of the heating wirings 28 to 30 extends substantially along the Y-axis direction and has a planar shape that is repeatedly bent so as to follow the planar shapes of the plurality of pixel electrodes 25 aligned along the Y-axis direction.

[0038] Here, various films laminated on the inner surface side of the array substrate 21 will be described with reference to Fig. 6. Fig. 6 shows a cross-sectional configuration of the array substrate 21 near the center of the pixel electrode 25. As shown in Fig. 6, on the glass substrate (substrate) 21GS of the array substrate 21, at least a base coat film 39, a semiconductor film, a gate insulating film 40, a first metal film (conductive film, first conductive film), a first interlayer insulating film 41, a second metal film (conductive film, second conductive film), a first planarization film (first insulating film) 42, a third metal film (conductive film, third conductive film), a second planarization film 43, a first transparent electrode film, a second interlayer insulating film 44, a second transparent electrode film, and an alignment film (not shown) are laminated on the glass substrate (substrate) 21GS of the array substrate 21 in this order from the lower layer side (glass substrate 21GS side).

[0039] The first metal film, the second metal film, and the third metal film are each conductive, being a single layer film made of one type of metal material, or a laminated film or alloy made of different types of metal materials. The first metal film constitutes the gate wiring 26, the gate electrode 24A of the TFT 24, etc. The second metal film constitutes the source wiring 27, the source electrode 24B, and the drain electrode 24C of the TFT 24, etc. The third metal film constitutes the heating wirings 28-30 and the main wirings 31-34, etc. The semiconductor film is made of a crystalline polysilicon semiconductor material (semiconductor material) produced by a known method such as laser crystallization. The polysilicon semiconductor material of the semiconductor film has higher electron mobility than amorphous silicon semiconductor material or oxide semiconductor material. The semiconductor film constitutes the semiconductor portion 24D of the TFT 24, etc. The first transparent electrode film and the second transparent electrode film are made of a transparent electrode material (e.g., ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide)). The first transparent electrode film constitutes a common electrode 45, which will be described later, etc. The second transparent electrode film constitutes a pixel electrode 25, etc. Each of the terminals 35 to 38 includes at least one or more of the first metal film, the second metal film, and the third metal film, and may additionally include one or two of the first transparent electrode film and the second transparent electrode film. That is, each of the terminals 35 to 38 may have a single-layer structure made of any of the metal films, a laminated structure made of multiple metal films, or even a laminated structure made of any of the metal films and any of the transparent electrode films.

[0040] The base coat film 39, the gate insulating film 40, the first interlayer insulating film 41, and the second interlayer insulating film 44 are all made of a type of inorganic material (inorganic resin material), such as SiO2 (silicon oxide, silicon oxide) or SiN x(silicon nitride) or the like. The first planarization film 42 and the second planarization film 43 are made of an organic material such as PMMA (acrylic resin). The thickness of each of the first planarization film 42 and the second planarization film 43 is much greater than the thickness of each of the base coat film 39, the gate insulating film 40, the first interlayer insulating film 41, and the second interlayer insulating film 44. The first planarization film 42 and the second planarization film 43 planarize the inner surface of the array substrate 21 (the surface on the liquid crystal layer 22 side). The base coat film 39 is located below the semiconductor film. The gate insulating film 40 is interposed between the semiconductor film and the first metal film. The first interlayer insulating film 41 is interposed between the first metal film and the second metal film. The first planarization film 42 is interposed between the second metal film and the third metal film. The second planarization film 43 is interposed between the third metal film and the first transparent electrode film. The second interlayer insulating film 44 is interposed between the first transparent electrode film and the second transparent electrode film.

[0041] 5 and 6, of the multiple source wirings 27, the source wiring 27 arranged in the first region A1 of the display area AA is referred to as a "first source wiring (first pixel wiring) 27α," and the source wiring 27 arranged in the second region A2 of the display area AA is referred to as a "second source wiring (second pixel wiring) 27β." Furthermore, of the multiple pixels PX, the pixel PX arranged in the first region A1 of the display area AA is referred to as a "first pixel PX1," and the pixel PX arranged in the second region A2 of the display area AA is referred to as a "second pixel PX2." The first pixel PX1 is connected to the first source wiring 27α, and the second pixel PX2 is connected to the second source wiring 27β.

[0042] 6, the first heating wiring 28 disposed in the first region A1 of the display region AA of the array substrate 21 is made of a third metal film and is therefore arranged above the first source wiring 27α made of the second metal film with the first planarization film 42 interposed therebetween. Similarly, the second heating wiring 29 disposed in the second region A2 of the display region AA of the array substrate 21 is made of a third metal film and is therefore arranged above the second source wiring 27β made of the second metal film with the first planarization film 42 interposed therebetween. In this way, the first heating wiring 28 and the second heating wiring 29 are arranged above the first source wiring 27α and the second source wiring 27β, respectively, with the first planarization film 42 interposed therebetween, thereby preventing short circuits and maintaining a high aperture ratio for the first pixel PX1 and the second pixel PX2. Although not shown, the third heating wiring 30 arranged in the third region A3 of the display region AA of the array substrate 21 is made of a third metal film and is therefore superimposed on the upper layer with respect to the source wiring (fifth pixel wiring) 27 made of the second metal film, with the first planarization film 42 interposed therebetween. Also, although not shown, the main wirings 31-34 are made of the same third metal film as the heating wirings 28-30, and are therefore connected in a manner directly connected to the heating wirings 28-30 to be connected. Note that when the terminals 35-38 include the third metal film, they are connected in a manner directly connected to the main wirings 31-34 to be connected, but when the terminals 35-38 do not include the third metal film, they are connected to the main wirings 31-34 to be connected through contact holes formed in the first planarization film 42, the second planarization film 43, etc.

[0043] As shown in FIG. 6, a common electrode 45 made of a first transparent electrode film is formed on the inner surface of the display area AA of the array substrate 21, overlapping all of the pixel electrodes 25. The common electrode 45 extends across almost the entire display area AA. The common electrode 45 made of the first transparent electrode film is disposed below (on the glass substrate 21GS side of) the pixel electrodes 25 made of the second transparent electrode film, with a gap equal to the thickness of the second interlayer insulating film 44. A common potential signal serving as a common potential (reference potential) is supplied to the common electrode 45. When the TFTs 24 are driven and the pixel electrodes 25 are charged to a potential based on the image signal transmitted to the source lines 27, a potential difference is generated between the pixel electrodes 25 and the common electrode 45. This generates a fringe electric field (oblique electric field) between the opening edge of the slit 25A in the pixel electrode 25 and the common electrode 45, which includes a component normal to the main surface of the array substrate 21 in addition to a component along the main surface of the array substrate 21. Therefore, by utilizing this fringe electric field, the alignment state of the liquid crystal molecules contained in the liquid crystal layer 22 can be controlled, and a predetermined display is produced based on the alignment state of the liquid crystal molecules. In other words, the liquid crystal panel 11 according to this embodiment operates in FFS (Fringe Field Switching) mode.

[0044] As shown in FIG. 1 , various signals (including image signals) for displaying images and power for performing heater functions are supplied from the control substrate 16 to the array substrate 21 of the liquid crystal panel 11 configured as described above via the flexible substrate 14. Specifically, a gate start pulse signal, a clock signal, etc. are supplied from the control substrate 16 to the circuit unit 12 provided on the array substrate 21 via the flexible substrate 14. The circuit unit 12 sequentially outputs scanning signals to a plurality of gate lines 26 based on the supplied gate start pulse signal, clock signal, etc. An image signal is supplied from the driver 15 via the flexible substrate 14 to a plurality of source lines 27 provided on the array substrate 21. The TFTs 24 are driven in synchronization with the supply of scanning signals to the gate lines 26, thereby charging the pixel electrodes 25 to a potential based on the image signal supplied to the source lines 27.

[0045] The first heating terminal 35 and the third heating terminal 37 provided on the array substrate 21 are connected to the positive electrode of the power supply IC 16A of the control substrate 16 via the flexible substrate 14, and the second heating terminal 36 is connected to the negative electrode of the power supply IC 16A of the control substrate 16 via the flexible substrate 14. This allows current to flow to the first heating wire 28 and the third heating wire 30 via the first heating terminal 35, the third heating terminal 37, the second main wire 32, and the third main wire 33, and also to the second heating wire 29 via the first main wire 31. As each of the heating wires 28-30 is energized, heat is generated from each of the heating wires 28-30 in accordance with its respective wiring resistance. The heat generated from each of the heating wires 28-30 is transferred to the liquid crystal layer 22, thereby heating the liquid crystal layer 22. Therefore, even in a low-temperature environment, the liquid crystal layer 22 is heated by the heat from the heating wires 28-30, thereby suitably reducing the viscosity of the liquid crystal layer 22, thereby improving the response speed of the liquid crystal panel 11 and the display quality of images. In particular, in this embodiment, the heating wires 28-30 are all arranged in the display area AA and extend from the first end 21A toward the second end 21B, thereby efficiently heating the display area AA of the array substrate 21. Furthermore, current flows from the first heating wire 28 arranged in the first area A1 and the third heating wire 30 arranged in the third area A3 to the second heating wire 29 arranged in the second area A2. The second heating wire 29 is arranged in the second area A2, which is sandwiched between the first area A1 (the first heating wire 28) and the third area A3 (the third heating wire 30) in the display area AA, thereby efficiently heating the central portion of the display area AA of the array substrate 21. As a result, the portion of the liquid crystal layer 22 that overlaps with the display area AA is efficiently heated, and the responsiveness of the liquid crystal panel 11 can be efficiently improved.Moreover, power can be supplied to the display terminal portion 38, the first heating terminal portion 35, the second heating terminal portion 36, and the third heating terminal portion 37 by the flexible substrate 14 attached to the first end portion 21A of the array substrate 21, eliminating the need for dedicated components for supplying power to the first heating terminal portion 35, the second heating terminal portion 36, and the third heating terminal portion 37. In this way, according to this embodiment, it is possible to improve heating efficiency and reduce the number of components.

[0046] In this embodiment, as shown in FIG. 1, the heater function is controlled by a timing controller 16B provided on the control board 16. Specifically, the timing controller 16B can turn on / off the power supply from the power supply IC 16A to the first heating terminal 35 and the third heating terminal 37 based on the temperature near the liquid crystal panel 11 detected by the temperature sensor 17. The timing controller 16B has a preset temperature of, for example, 25°C, which is the reference temperature for turning on / off the power supply from the power supply IC 16A to the first heating terminal 35 and the third heating terminal 37. The specific control of the heater function will be described with reference to FIG. 7. In FIG. 7, the upper graph shows the relationship between the temperature near the liquid crystal panel 11 detected by the temperature sensor 17 and elapsed time, and the lower graph shows the relationship between the voltage input from the positive terminal of the power supply IC 16A to the first heating terminal 35 and the third heating terminal 37 and elapsed time. In the upper graph of FIG. 7, the vertical axis represents temperature (°C) and the horizontal axis represents elapsed time (sec). In the graph at the bottom of FIG. 7, the vertical axis represents voltage (V) and the horizontal axis represents elapsed time (SEC).

[0047] When the liquid crystal display device 10 is powered on, the temperature sensor 17 starts detecting the temperature as shown in FIG. 7 (0 sec on the horizontal axis in FIG. 7). At this time, the temperature detected by the temperature sensor 17 is approximately -30°C, which is lower than 25°C. Therefore, the timing controller 16B turns on the power supply from the power supply IC 16A to the first heating terminal 35 and the third heating terminal 37. As a result, the voltage input from the positive electrode of the power supply IC 16A to the first heating terminal 35 and the third heating terminal 37 rises from 0V to approximately 24V. As the power supply from the power supply IC 16A is turned on, the liquid crystal layer 22 is heated by the heat emitted from the heating wires 28-30. The temperature around the liquid crystal panel 11 detected by the temperature sensor 17 rises over time and reaches the set temperature of 25°C after approximately 30 sec has elapsed. Accordingly, the timing controller 16B turns off the power supply from the power supply IC 16A to the first heating terminal 35 and the third heating terminal 37. This causes the voltage input from the positive terminal of the power supply IC 16A to the first heating terminal 35 and the third heating terminal 37 to drop from approximately 24V to 0V. When the power supply from the power supply IC 16A is turned off, heat is gradually stopped from being emitted from the heating wires 28-30. Therefore, the temperature around the liquid crystal panel 11 detected by the temperature sensor 17 stops rising after slightly exceeding 25°C and remains at that temperature. Thereafter, for example, when the car window is opened or the car air conditioner is turned off, the temperature around the liquid crystal panel 11 detected by the temperature sensor 17 gradually drops and eventually falls below the set temperature of 25°C. Accordingly, the timing controller 16B turns on the power supply from the power supply IC 16A to the first heating terminal 35 and the third heating terminal 37. As a result, the voltage input from the positive electrode of power supply IC 16A to first heating terminal 35 and third heating terminal 37 rises from 0 V to approximately 24 V. As power supply from power supply IC 16A is turned on, the liquid crystal layer 22 is heated by heat emitted from each of heating wires 28 to 30, and the temperature around liquid crystal panel 11 detected by temperature sensor 17 rises over time and eventually reaches the set temperature of 25°C.In response to this, the timing controller 16B turns off the power supply from the power supply IC 16A to the first heating terminal portion 35 and the third heating terminal portion 37.

[0048] The wiring resistance of each of the plurality of first heating wires 28, second heating wires 29, and third heating wires 30 according to this embodiment is set as follows: That is, the plurality of second heating wires 29 have a higher wiring resistance than the plurality of first heating wires 28 and third heating wires 30. Each of the heating wires 28-30 is made of a third metal film and has approximately the same line width and length. Therefore, the wiring resistance of each of the plurality of heating wires 28-30 is determined based on the arrangement density of each of the heating wires 28-30, which is calculated by dividing the number of the heating wires 28-30 by the area ratio of each of the areas A1-A3 to the display area AA. Specifically, in this embodiment, the installation density of the second heating wires 29, calculated by dividing the number of the second heating wires 29 by the area ratio of the second region A2, is lower than the installation density of the first heating wires 28, calculated by dividing the number of the first heating wires 28 by the area ratio of the first region A1, and the installation density of the third heating wires 30, calculated by dividing the number of the third heating wires 30 by the area ratio of the third region A3. In this way, the amount of heat generated by the second heating wires 29 can be made larger than the amount of heat generated by each of the first heating wires 28 and the third heating wires 30. This makes it possible to more efficiently heat the central portion of the display region AA on the array substrate 21.

[0049] Next, Comparative Experiment 1 was conducted to verify the superiority of the liquid crystal panel 11 according to the present embodiment. In Comparative Experiment 1, the liquid crystal panel 11 according to the present embodiment was designated Example 1, and a liquid crystal panel 1 having a different configuration related to the heater function from the present embodiment was designated Comparative Example 1. The configuration related to the heater function of the liquid crystal panel 1 of Comparative Example 1 will be described with reference to FIG. 8. As shown in FIG. 8, the liquid crystal panel 1 of Comparative Example 1 includes two heating terminals 2 connected to the positive electrode of a power supply IC, a main wiring 3 connected to the heating terminals 2, two heating terminals 4 connected to the negative electrode of the power supply IC, a main wiring 5 connected to the heating terminals 4, and a heating wiring 6 connected to the main wirings 3 and 5. Each of the two heating terminals 2 and 4 is located at a first end 1A, which is a portion of the non-display area NAA of the liquid crystal panel 1 extending along the X-axis direction. The two heating terminals 2 are located outward in the X-axis direction from the two heating terminals 4. The main wiring 3 is provided across the first end 1A, a second end 1B of the non-display area NAA of the liquid crystal panel 11, which sandwiches the display area AA between the first end 1A and the second end 1B, and two third end portions 1C that are portions of the non-display area NAA extending along the Y-axis direction. The main wiring 3 extends outward in the X-axis direction from each of the two heating terminal portions 2, extends toward the second end portion 1B along the Y-axis direction when it reaches the two third end portions 1C, and extends along the X-axis direction when it reaches the second end portion 1B. The main wiring 5 is disposed at the first end portion 1A, extends along the X-axis direction, and is connected to the two heating terminal portions 4. Multiple heating wirings 6 are disposed at positions spaced apart in the X-axis direction in the display area AA. Each of the multiple heating wirings 6 extends along the Y-axis direction, with one end connected to the main wiring 3 at the second end portion 1B and the other end connected to the main wiring 5 at the first end portion 1A. All of the heating wirings 6 are connected to each of the main wirings 3 and 5. The configuration relating to the heater function in the liquid crystal panel 11 of the first embodiment is as explained before this paragraph (see FIG. 4, etc.).

[0050] The wiring resistances of the main wirings 3, 5 and heating wiring 6 in the liquid crystal panel 1 of Comparative Example 1 configured as described above are as shown in FIG. 9. That is, as shown in FIG. 9, the wiring resistance of the main wiring 3 is 10 Ω, the wiring resistance of the main wiring 5 is 4 Ω, and the wiring resistance of the multiple heating wirings 6 is 20 Ω. The voltage applied from the power supply IC to the heating terminals 2, 4 in the liquid crystal panel 1 of Comparative Example 1 is 24 V. Therefore, the current value of the components related to the heater function in the liquid crystal panel 1 of Comparative Example 1 is approximately 0.706 A, and the power consumption (heat generation power) is 16.94 W. The power consumption of the main wiring 3 is 4.98 W, the power consumption of the main wiring 5 is 1.99 W, and the power consumption of the multiple heating wirings 6 is 9.97 W.

[0051] On the other hand, the wiring resistances of the trunk wirings 32-34 and the heating wirings 28-30 in the liquid crystal panel 11 of Example 1 are as shown in FIG. 10. That is, as shown in FIG. 10, the wiring resistance of the second trunk wiring 32 and the fourth trunk wiring 34 is 1 Ω, the wiring resistance of the third trunk wiring 33 is 2 Ω, the wiring resistance of the plurality of first heating wirings 28 and the plurality of third heating wirings 30 is 7 Ω, and the wiring resistance of the plurality of second heating wirings 29 is 10 Ω. Note that, since the first trunk wiring 31 short-circuits all of the heating wirings 28-30, its wiring resistance is negligibly small. The voltage applied from the power supply IC 16A to the heating terminal portions 35-37 in the liquid crystal panel 11 of Example 1 is 24 V. Therefore, the current value of the heater function-related components in the liquid crystal panel 11 of Example 1 is approximately 1.2 A, and the power consumption (heat generation power) is 28.8 W. The power consumption of the second main wiring 32 and the fourth main wiring 34 is 1.44 W, the power consumption of the third main wiring 33 is 2.88 W, the power consumption of the multiple first heating wirings 28 and the multiple third heating wirings 30 is 10.08 W, and the power consumption of the multiple second heating wirings 29 is 14.4 W.

[0052] Comparing FIGS. 9 and 10, Comparative Example 1 has lower current values and power consumption for the heater function components than Example 1. Furthermore, in Comparative Example 1, the total power consumption of the main wirings 3 and 5 arranged in the non-display area NAA is 6.97 W, accounting for approximately 41% of the total power consumption. In other words, in Comparative Example 1, only approximately 59% of the total power consumption is consumed by heat generation in the heating wiring 6 in the display area AA. In contrast, Example 1 has higher current values and power consumption for the heater function components than Comparative Example 1. Furthermore, in Example 1, the total power consumption of the main wirings 32-34 arranged in the non-display area NAA is 4.32 W, accounting for only approximately 15% of the total power consumption. In other words, in Example 1, approximately 85% of the total power consumption is consumed by heat generation in the heating wirings 28-30 in the display area AA. As described above, compared to Comparative Example 1, Example 1 not only has a higher overall power consumption, but also has lower power consumption in the non-display area NAA and higher power consumption in the display area AA, which means that the liquid crystal layer 22 arranged in the display area AA can be heated more efficiently. Also, in Comparative Example 1, the main wiring 3 is arranged at the third end 1C, which tends to increase the frame width on both sides in the X-axis direction. In contrast, in Example 1, the main wirings 31 to 33 are arranged at the first end 21A and the second end 21B, which means that the frame width can be kept narrow on both sides in the X-axis direction.

[0053] As described above, the liquid crystal panel (display device) 11 of this embodiment includes the array substrate (first substrate) 21 having a main surface divided into a display area AA where an image is displayed and a non-display area NAA where an image is not displayed, the display terminal section (first terminal section) 38 provided in the first end section 21A which is the non-display area NAA of the array substrate 21, the first heating terminal section (second terminal section) 35 provided in the first end section 21A, the second heating terminal section (third terminal section) 36 provided in the first end section 21A, the flexible substrate 14 attached to the first end section 21A and connected to the display terminal section 38, the first heating terminal section 35, and the second heating terminal section 36, respectively, and the first pixel P arranged in the display area AA. X1, a first source wiring (first pixel wiring) 27α arranged in the display area AA and connected to the display terminal portion 38 and the first pixel PX1, a first heating wiring 28 arranged in the display area AA and connected to the first heating terminal portion 35, and a second heating wiring 29 arranged in the display area AA and connected to the second heating terminal portion 36, wherein the first heating wiring 28 extends from the first heating terminal portion 35 side toward the second end 21B side which is in the non-display area NAA of the array substrate 21 and sandwiches the display area AA between it and the first end 21A, and the second heating wiring 29 extends from the second heating terminal portion 36 side toward the second end 21B side, and its extended end 29A is connected to the extended end 28A of the first heating wiring 28.

[0054] When power is supplied to the display terminal 38, a signal is supplied to the first source wiring 27α, thereby charging the first pixel PX1. When power is supplied to the first heating terminal 35 and the second heating terminal 36, the first heating wiring 28 and the second heating wiring 29 are energized. The first heating wiring 28 and the second heating wiring 29 are arranged in the display area AA and extend from the first end 21A toward the second end 21B, thereby efficiently heating the display area AA of the array substrate 21. This improves the responsiveness of the liquid crystal panel 11 even when the outside temperature is low. Moreover, power can be supplied to the display terminal 38, the first heating terminal 35, and the second heating terminal 36 by the flexible substrate 14 attached to the first end 21A of the array substrate 21, eliminating the need for dedicated components for supplying power to the first heating terminal 35 and the second heating terminal 36.

[0055] The display panel also includes a third heating terminal (fourth terminal) 37 provided at the first end 21A and connected to the flexible substrate 14, and a third heating wire 30 arranged in the display area AA and connected to the third heating terminal 37. The third heating wire 30 is arranged in the display area AA with the second heating wire 29 sandwiched between it and the first heating wire 28, and extends from the third heating terminal 37 side toward the second end 21B side, with its extending end 30A connected to the extending end 28A of the first heating wire 28. For example, when the first heating terminal 35 and the third heating terminal 37 are connected to the positive terminal of a DC power supply and the second heating terminal 36 is connected to the negative terminal of the DC power supply, a current flows from the first heating wire 28 and the third heating wire 30 to the second heating wire 29. The second heating wiring 29 is arranged to be sandwiched between the first heating wiring 28 and the third heating wiring 30 in the display area AA, and therefore can efficiently heat the central portion of the display area AA on the array substrate 21.

[0056] Furthermore, a plurality of first heating wires 28, second heating wires 29, and third heating wires 30 are arranged. Heat generated from the plurality of first heating wires 28, second heating wires 29, and third heating wires 30 can heat the display area AA on the array substrate 21 more efficiently.

[0057] The positive electrode of the power supply IC 16A, which is a DC power supply, is connected to the first heating terminal 35 and the third heating terminal 37, and the negative electrode of the power supply IC 16A, which is a DC power supply, is connected to the second heating terminal 36. In this manner, current flows from the first heating wiring 28 and the third heating wiring 30 to the second heating wiring 29. The second heating wiring 29 is disposed between the first heating wiring 28 and the third heating wiring 30 in the display area AA, so that the central portion of the display area AA on the array substrate 21 can be efficiently heated.

[0058] The pixel PX1 also includes a second pixel PX2 disposed in the display area AA, a second source wiring (second pixel wiring) 27β disposed in the display area AA and connected to the second pixel PX2, and a first planarization film (first insulating film) 42 interposed between the first heating wiring 28 and the second heating wiring 29 and the first source wiring 27α and the second source wiring 27β, where the first heating wiring 28 overlaps the first source wiring 27α with the first planarization film 42 interposed therebetween, and the second heating wiring 29 overlaps the second source wiring 27β with the first planarization film 42 interposed therebetween. Because the first heating wiring 28 and the second heating wiring 29 overlap the first source wiring 27α and the second source wiring 27β with the first planarization film 42 interposed therebetween, it is possible to maintain a high aperture ratio of the first pixel PX1 and the second pixel PX2 while preventing short circuits.

[0059] Furthermore, a plurality of first heating wires 28 and a plurality of second heating wires 29 are arranged, and each wire includes a first main wire 31 connected to the extending ends 28A of the plurality of first heating wires 28 and the extending ends 29A of the plurality of second heating wires 29, a second main wire 32 connected to the plurality of first heating wires 28 and the first heating terminal 35, and a third main wire 33 connected to the plurality of second heating wires 29 and the second heating terminal 36. The extending ends 28A, 29A of each of the plurality of first heating wires 28 and the plurality of second heating wires 29 are bundled together by the first main wire 31. The plurality of first heating wires 28 are bundled together by the second main wire 32 and connected to the first heating terminal 35. The plurality of second heating wires 29 are bundled together by the third main wire 33 and connected to the second heating terminal 36. Since the wiring resistance of each of the main wires 31 to 33 can be easily reduced, the amount of heat generated in each of the heating wires 28, 29 can be increased.

[0060] Furthermore, the first main wiring 31 is arranged at the second end 21B. Since the first main wiring 31 is arranged at the second end 21B, which is the non-display area NAA, it is possible to prevent display defects caused by the first main wiring 31 from being visually recognized.

[0061] The display device also includes a counter substrate (second substrate) 20 disposed opposite the array substrate 21 with a gap therebetween, and a liquid crystal layer 22 sandwiched between the array substrate 21 and the counter substrate 20. The liquid crystal layer 22 sandwiched between the array substrate 21 and the counter substrate 20 is heated by the heating wires 28 and 29, thereby improving the response speed. The improved response speed of the liquid crystal layer 22 can improve the display quality.

[0062] <Embodiment 2> A second embodiment will be described with reference to Fig. 11. In this second embodiment, the wiring resistance of each of the heating wires 128 to 130 is changed. Note that a redundant description of the structure, action, and effect similar to those of the first embodiment will be omitted.

[0063] 11, the first heating wiring 128, the second heating wiring 129, and the third heating wiring 130 according to this embodiment are configured to have equal wiring resistances. Specifically, in this embodiment, the area ratio of the first region A101, in which the multiple first heating wirings 128 are arranged, to the display region AA is approximately 25%, the area ratio of the third region A103, in which the multiple third heating wirings 130 are arranged, to the display region AA is approximately 25%, and the area ratio of the second region A102, in which the multiple second heating wirings 129 are arranged, to the display region AA is approximately 50%. In other words, the sum of the area ratios of the first region A101 and the third region A103 is equal to the area ratio of the second region A102. Accordingly, the sum of the numbers of the first heating wires 128 and the third heating wires 130 arranged in the first region A101 and the third region A103 is equal to the number of the second heating wires 129 arranged in the second region A102. Therefore, the installation density of the second heating wires 129 calculated by dividing the number of the second heating wires 129 by the area ratio of the second region A102 is equal to the installation density of the first heating wires 128 calculated by dividing the number of the first heating wires 128 by the area ratio of the first region A101, or the installation density of the third heating wires 130 calculated by dividing the number of the third heating wires 130 by the area ratio of the third region A103. Specifically, the second heating wires 129 are arranged so as to overlap with one source wire 27 for every eight source wires 27 (see FIG. 5 ) in the second region A102. In contrast, the first heating wiring 128 is arranged in the first region A101 so as to overlap with one source wiring 27 for every eight source wirings 27, and the third heating wiring 130 is arranged in the third region A103 so as to overlap with one source wiring 27 for every eight source wirings 27. In this way, heat is evenly applied to the first region A101, the second region A102, and the third region A103 by the configuration related to the heater function, so that the temperature distribution within the main surface of the array substrate 121 is made uniform.

[0064] <Embodiment 3> A third embodiment will be described with reference to Fig. 12. In this third embodiment, the wiring resistance of each of the heating wires 228 to 230 is changed from that of the second embodiment. Note that a redundant description of the structure, action, and effect similar to those of the second embodiment will be omitted.

[0065] 12, the area ratio of the first region A201 where the multiple first heating wires 228 are arranged to the display region AA is approximately 20%, the area ratio of the third region A203 where the multiple third heating wires 230 are arranged to the display region AA is approximately 20%, and the area ratio of the second region A202 where the multiple second heating wires 229 are arranged to the display region AA is approximately 60%. In other words, the ratio of the sum of the area ratios of the first region A201 and the third region A203 to the area ratio of the second region A202 is "4:6".

[0066] In contrast, the ratio of the sum of the numbers of the first heating wires 228 and the third heating wires 230 arranged in the first region A201 and the third region A203 to the number of the second heating wires 229 arranged in the second region A202 is 6:4. Specifically, the first heating wires 228 are arranged so as to overlap with one for every four source wires 27 (see FIG. 5) in the first region A201, and the third heating wires 230 are arranged so as to overlap with one for every four source wires 27 in the third region A203. In contrast, the second heating wires 229 are arranged so as to overlap with one for every nine source wires 27 in the second region A202. For example, if the total number of source wirings 27 is 3,840, the number of source wirings 27 in the first region A201 and the third region A203 is 768, so the number of first heating wirings 228 and third heating wirings 230 is 192. On the other hand, the number of source wirings 27 in the second region A202 is 2,304, so the number of second heating wirings 229 is 256. Accordingly, the ratio of the wiring resistance of each of the plurality of first heating wirings 228 and third heating wirings 230 to the wiring resistance of the plurality of second heating wirings 229 is 4:6. Furthermore, the ratio of the power consumption of each of the plurality of first heating wirings 228 and third heating wirings 230 to the power consumption of the plurality of second heating wirings 229 is 4:6.

[0067] As described above, the ratio of the number of first heating wires 228, second heating wires 229, and third heating wires 230 installed in this embodiment is inversely correlated with the area ratios of the first region A201, second region A202, and third region A203. The fewer the number of first heating wires 228, second heating wires 229, and third heating wires 230 installed, the higher the wiring resistance, which results in a tendency for the amount of heat generated to increase. On the other hand, the higher the area ratios of the first region A201, second region A202, and third region A203, the more heat is required for heating. Therefore, by having the ratio of the number of first heating wires 228, second heating wires 229, and third heating wires 230 installed inversely correlated with the area ratios of the first region A201, second region A202, and third region A203, the first region A201, second region A202, and third region A203 can be efficiently heated according to their respective area ratios.

[0068] As described above, in this embodiment, the first heating wires 228, the second heating wires 229, and the third heating wires 230 are arranged in multiples, and the display area AA is divided into a first area A201 where multiple first heating wires 228 are arranged, a second area A202 where multiple second heating wires 229 are arranged, and a third area A203 where multiple third heating wires 230 are arranged. The ratio of the number of first heating wires 228, second heating wires 229, and third heating wires 230 installed is inversely correlated with the area ratio of the first area A201, second area A202, and third area A203. The fewer the number of first heating wires 228, second heating wires 229, and third heating wires 230 installed, the higher the wiring resistance, which results in a tendency for the amount of heat generated to increase. On the other hand, the higher the area ratio of the first area A201, second area A202, and third area A203, the greater the amount of heat required for heating. Therefore, since the ratio of the number of the first heating wiring 228, the second heating wiring 229, and the third heating wiring 230 is inversely correlated with the area ratio in the first region A201, the second region A202, and the third region A203, the first region A201, the second region A202, and the third region A203 can be efficiently heated according to their respective area ratios.

[0069] <Embodiment 4> A fourth embodiment will be described with reference to Figs. 13 to 15. In this fourth embodiment, the configuration of the first main wiring 331 is changed from that of the first embodiment. Note that redundant descriptions of the structure, operation, and effects similar to those of the first embodiment will be omitted.

[0070] As shown in FIG. 13 , the first trunk wiring 331 according to this embodiment is arranged in the display area AA. The first trunk wiring 331 is arranged at an end of the display area AA adjacent to the second end 321B, extending along the X-axis direction and arranged in a row at intervals along the Y-axis direction. Because the first trunk wiring 331 is arranged in the display area AA in this manner, the display area AA can be heated using heat generated in the first trunk wiring 331. This allows the display area AA of the array substrate 321 to be heated more efficiently. Furthermore, since it is not necessary to arrange the first trunk wiring 331 at the second end 321A in the non-display area NAA of the array substrate 321, the width of the second end 321A can be narrowed, which is advantageous for narrowing the frame of the array substrate 321.

[0071] The detailed configuration of the first main wiring 331 will be described with reference to FIG. 14. FIG. 14 shows a planar configuration near the boundary between the first area A301 and the second area A302 of the display area AA. In FIG. 14, the first heating wiring 328, the second heating wiring 329, and the first main wiring 331, which are configured using a third metal film, are illustrated by a hatched pattern. As shown in FIG. 14, the first main wiring 331 is arranged to overlap the gate wiring (fourth pixel wiring) 326 that intersects with the source wiring 327 (including the first source wiring 327α). Like the overlapping gate wiring 326, the first main wiring 331 extends along the X-axis direction and is connected in a manner directly connected to the intersecting heating wirings 328 and 329. Note that the first main wiring 331 also intersects with and is connected in a manner directly connected to the third heating wiring 30 (see FIG. 13), which is not shown in FIG. 14.

[0072] 15, the first main wiring 331 made of the third metal film is disposed above the gate wiring 326, with a first interlayer insulating film (second insulating film) 341 and a first planarizing film (second insulating film) 342 interposed therebetween. In this way, the first interlayer insulating film 341 and the first planarizing film 342 are interposed between the overlapping first main wiring 331 and gate wiring 326, thereby preventing a short circuit between the first main wiring 331 and gate wiring 326. Furthermore, by disposing the first main wiring 331 so as to overlap the gate wiring 326, it is possible to maintain a high aperture ratio of each pixel PX and to make display defects caused by the first main wiring 331 less visible.

[0073] As described above, according to this embodiment, the first main wiring 331 is arranged in the display area AA. Since the display area AA can be heated by utilizing heat generated in the first main wiring 331, the display area AA on the array substrate 321 can be heated more efficiently.

[0074] The display region AA also includes a gate line (fourth pixel line) 326 that is arranged to intersect with the first source line 327α, and a first interlayer insulating film 341 and a first planarizing film 342 that are second insulating films interposed between the gate line 326 and the first main line 331. The first main line 331 is arranged to overlap the gate line 326 via the first interlayer insulating film 341 and the first planarizing film 342 that are second insulating films. Since the first main line 331 is arranged to overlap the gate line 326 via the first interlayer insulating film 341 and the first planarizing film 342 that are second insulating films, it is possible to prevent short circuits and make display defects caused by the first main line 331 less visible.

[0075] <Embodiment 5> A fifth embodiment will be described with reference to Fig. 16 or 17. In this fifth embodiment, the configuration of each of the main wirings 431 to 434 is changed from that of the first embodiment. Note that redundant explanations of the structure, operation, and effects similar to those of the first embodiment will be omitted.

[0076] As shown in FIG. 16, each of the main wirings 431-434 according to this embodiment has a laminated structure of multiple metal films. Specifically, each of the main wirings 431-434 has a double laminated structure formed by laminating a second metal film and a third metal film. In FIG. 16, a single-layer structure formed by the third metal film and a laminated structure formed by the second metal film and the third metal film are shown with different hatching. In contrast, each of the heating wirings 428-430 has a single-layer structure formed by the third metal film. If the lead-out wiring for connecting the source wiring 27 (see FIG. 6) formed by the second metal film and the display terminal unit 438 has a single-layer structure formed by the first metal film, for example, short-circuiting with the intersecting main wirings 432-434 can be prevented.

[0077] Of the main wirings 431 to 434, the cross-sectional configuration of the second main wiring 432 will be described with reference to FIG. 17. The cross-sectional configurations of the first main wiring 431, the third main wiring 433, and the fourth main wiring 434 are also the same as those in FIG. 17. As shown in FIG. 17, the second main wiring 432 has a second metal film portion (first conductive film portion) 432A made of a second metal film and a third metal film portion (second conductive film portion) 432B made of a third metal film. The second metal film portion 432A and the third metal film portion 432B are arranged to overlap with each other with a first planarization film 442 interposed therebetween. A contact hole CH1 for connecting the second metal film portion 432A and the third metal film portion 432B is opened and formed in the first planarization film 442 at a position where the first planarization film 442 overlaps with the second metal film portion 432A and the third metal film portion 432B. A plurality of contact holes CH1 are arranged side by side at intervals in the extension direction (X-axis direction) of the second main wiring 432. The thickness of the second main wiring 432 is the sum of the film thickness of the second metal film portion 432A (second metal film) and the film thickness of the third metal film portion 432B (third metal film). Similarly, the thickness of each of the first main wiring 431, the third main wiring 433, and the fourth main wiring 434 is the sum of the film thickness of the second metal film and the film thickness of the third metal film.

[0078] According to this embodiment, the heating wires 428-430 have a single-layer structure, and their thickness is smaller than that of the main wires 431-434, resulting in high wiring resistance. In contrast, the main wires 431-434 have a multi-layer structure, and their thickness is larger than that of the heating wires 428-430, resulting in reduced wiring resistance. This increases the amount of heat generated by the heating wires 428-430, allowing the display area AA on the array substrate 421 to be heated more efficiently.

[0079] As described above, according to this embodiment, the first heating wiring 428 and the second heating wiring 429 each have a single-layer structure made of a single metal film (conductive film), while the first main wiring 431, the second main wiring 432, and the third main wiring 433 each have a laminated structure made of multiple laminated metal films (conductive films). The single-layer structure of each of the heating wiring 428, 429 increases the wiring resistance, whereas the laminated structure of each of the main wirings 431-433 reduces the wiring resistance. This increases the amount of heat generated by each of the heating wiring 428, 429, allowing the display area AA on the array substrate 421 to be heated more efficiently.

[0080] Furthermore, the first main wiring 431, the second main wiring 432, and the third main wiring 433 are thicker than the first heating wiring 428 and the second heating wiring 429. Because the thickness of each of the main wirings 431 to 433 is thicker than the thickness of each of the heating wirings 428, 429, the wiring resistance of each of the main wirings 431 to 433 is lower and the wiring resistance of each of the heating wirings 428, 429 is higher. This increases the amount of heat generated by each of the heating wirings 428, 429, allowing the display area AA on the array substrate 421 to be heated more efficiently.

[0081] <Embodiment 6> A sixth embodiment will be described with reference to Fig. 18. In this sixth embodiment, the configurations of the array substrate 521 and the second main wiring 532 are changed from those of the fifth embodiment. Note that redundant explanations of the structure, actions, and effects similar to those of the fifth embodiment will be omitted.

[0082] As shown in FIG. 18 , the array substrate 521 according to this embodiment further includes a fourth metal film located above the second planarization film 543 and a third interlayer insulating film 46 located above the fourth metal film and below the first transparent electrode film. The second main wiring 532 according to this embodiment has a double layer structure formed by stacking a third metal film and a fourth metal film. While FIG. 18 shows only the cross-sectional configuration of the second main wiring 532, the other main wirings 31, 33, and 34 also have a layer structure formed by stacking a third metal film and a fourth metal film, similar to the second main wiring 532. The second main wiring 532 includes a third metal film portion 532B formed by the third metal film and a fourth metal film portion (third conductive film portion) 532C formed by the fourth metal film. The third metal film portion 532B and the fourth metal film portion 532C are arranged to overlap with each other with the second planarization film 543 interposed therebetween. Contact holes CH2 for connecting the third metal film portion 532B and the fourth metal film portion 532C are formed in the second planarization film 543 at positions overlapping the third metal film portion 532B and the fourth metal film portion 532C. A plurality of contact holes CH2 are arranged side by side at intervals in the extension direction (X-axis direction) of the second main wiring 532. Even with this configuration, the same functions and effects as those of the fifth embodiment can be obtained.

[0083] <Embodiment 7> Embodiment 7 will be described with reference to Fig. 19 or 20. In this embodiment 7, a dummy wiring 47 is added to the configuration described in the above-mentioned embodiment 1. Note that a redundant description of the structure, action, and effect similar to those of the above-mentioned embodiment 1 will be omitted.

[0084] As shown in FIG. 19, the array substrate 621 according to this embodiment is provided with dummy wirings 47. In FIG. 19, the heating wirings 628-630 and the main wirings 631-634 are shown with different hatching patterns from the dummy wirings 47. The dummy wirings 47, like the heating wirings 628-630, are made of a third metal film. The dummy wirings 47 are arranged so as to overlap with the source wirings 627 (see FIG. 20) that do not overlap with any of the heating wirings 628-630 among the multiple source wirings 627. Specifically, in order to adjust the wiring resistance of each, the heating wirings 628-630 are arranged so as to overlap with one of the multiple source wirings 627 in each of the regions A601-A603. Therefore, among the multiple source wirings 627, there are source wirings 627 on the upper layer that do not overlap with any of the heating wirings 628-630. Hereinafter, among the multiple source wirings 627, the source wiring 627 that does not overlap with any of the heating wirings 628 to 630 will be referred to as a "third source wiring (third pixel wiring) 627γ." Furthermore, among the multiple pixels PX, the pixel PX connected to the third source wiring 627γ will be referred to as a "third pixel PX3."

[0085] As shown in FIG. 20, the dummy wirings 47 are arranged to overlap the third source wiring 627γ via the first planarization film 642. FIG. 20 shows a planar configuration near the boundary between the first area A601 and the second area A602 of the display area AA. The number of dummy wirings 47 is equal to the number of third source wirings 627γ. That is, the dummy wirings 47 are arranged so as to overlap all of the third source wirings 627γ that do not overlap any of the heating wirings 628-630. The number of dummy wirings 47 is equal to the total number of source wirings 627 minus the total number of heating wirings 628-630. In this way, capacitance is generated between the first source wiring 627α and the first heating wiring 628, between the second source wiring 627β and the second heating wiring 629, and between the third source wiring 627γ and the dummy wiring 47. Therefore, compared to the case where the dummy wiring 47 is not provided, it is possible to reduce the difference that may occur between the load of the first source wiring 627α, the load of the second source wiring 627β, and the load of the third source wiring 627γ, thereby improving the display quality.

[0086] 20, the common electrode 645 is disposed so as to overlap the first pixel electrode 625α constituting the first pixel PX601, the second pixel electrode 625β constituting the second pixel PX602, and the third pixel electrode 625γ constituting the third pixel PX3, with the second interlayer insulating film 644 interposed therebetween. Therefore, an image is displayed in the display area AA by utilizing the electric field generated between the first pixel electrode 625α, the second pixel electrode 625β, and the third pixel electrode 625γ and the common electrode 645. The dummy wiring 47 is connected to the common electrode 645. This stabilizes the load on the third source wiring 627γ, which overlaps the dummy wiring 47.

[0087] As described above, this embodiment includes a third pixel PX3 arranged in the display area AA, a third source wiring (third pixel wiring) 627γ arranged in the display area AA and connected to the third pixel PX3, and a dummy wiring 47 arranged to overlap the third source wiring 627γ with the first planarization film 642 interposed therebetween. A capacitance occurs between the first source wiring 627α and the first heating wiring 628, a capacitance occurs between the second source wiring 627β and the second heating wiring 629, and a capacitance also occurs between the third source wiring 627γ and the dummy wiring 47. Therefore, compared to the case where the dummy wiring 47 is not provided, it is possible to reduce the difference that may occur between the loads of the first source wiring 627α, the second source wiring 627β, and the third source wiring 627γ. This improves display quality.

[0088] The pixel PX601 also includes a first pixel electrode 625α constituting the first pixel PX601, a second pixel electrode 625β constituting the second pixel PX602, a third pixel electrode 625γ constituting the third pixel PX3, and a common electrode 645 arranged to overlap the first pixel electrode 625α, the second pixel electrode 625β, and the third pixel electrode 625γ with a gap therebetween, and the dummy wiring 47 is connected to the common electrode 645. An image is displayed in the display area AA by utilizing an electric field generated between the first pixel electrode 625α, the second pixel electrode 625β, and the third pixel electrode 625γ and the common electrode 645. Connecting the dummy wiring 47 to the common electrode 645 stabilizes the load on the third source wiring 627γ.

[0089] <Embodiment 8> An eighth embodiment will be described with reference to Fig. 21. In this eighth embodiment, a temperature sensor 717 is changed from that of the first embodiment. Note that a redundant description of the structure, operation, and effects similar to those of the first embodiment will be omitted.

[0090] As shown in FIG. 21 , the array substrate 721 according to this embodiment is provided with a temperature sensor 717. Two temperature sensors 717 are arranged on the array substrate 721 at positions spaced apart in the X-axis direction. More specifically, the temperature sensor 717 includes a sensor wiring 48, most of which is provided in the display area AA of the array substrate 721, and two sensor terminal units 49 provided in a first end portion 721A, which is the non-display area NAA of the array substrate 721. Both ends of the sensor wiring 48 are connected to the two sensor terminal units 49. The sensor wiring 48 extends from one end connected to one of the sensor terminal units 49 toward the second end portion 721B along the Y-axis direction, crossing the display area AA, and then turns back near the second end portion 721B. The sensor wiring 48 extends from the turned-back portion toward the first end portion 721A along the Y-axis direction, crossing the display area AA, and the other end is connected to the other sensor terminal unit 49 at the first end portion 721A. The sensor wiring 48 constituting one of the two temperature sensors 717 is disposed between the first region A701 and the second region A702. The sensor wiring 48 constituting the other of the two temperature sensors 717 is disposed between the second region A702 and the third region A703. The sensor wiring 48 is made of a third metal film and is disposed above the source wiring 27 made of the second metal film with the first planarization film 42 interposed therebetween (see FIG. 6).

[0091] The two sensor terminals 49 constituting one of the two temperature sensors 717 are arranged to be sandwiched between the first heating terminal 735 and the second heating terminal 736. The two sensor terminals 49 constituting the other of the two temperature sensors 717 are arranged to be sandwiched between the second heating terminal 736 and the third heating terminal 737. As described above, each sensor terminal 49 is arranged at a position on the first end 721A that overlaps the flexible substrate 14 (see FIG. 1) and is connected to a terminal provided on the flexible substrate 14. The control substrate 16 is provided with a temperature detection unit, and the temperature detection unit is connected to each sensor terminal 49 via the flexible substrate 14 (see FIG. 1). The two sensor terminals 49 constituting the temperature sensor 717 include a positive sensor terminal 49 and a negative sensor terminal 49. The temperature detection unit detects the current supplied from the positive sensor terminal 49 to the sensor wiring 48 via the negative sensor terminal 49, thereby calculating the resistance value of the sensor wiring 48 and obtaining the temperature based on the change in the resistance value. Note that the sensor terminal 49 may have a single layer structure made of any metal film, a laminated structure made of multiple metal films, or even a laminated structure made of any metal film and any transparent electrode film.

[0092] <Other embodiments> The technology disclosed in this specification is not limited to the embodiments described above and illustrated in the drawings, and the following embodiments, for example, are also included in the technical scope.

[0093] (1) The number of first heating terminal portions 35, 735 and the number of third heating terminal portions 37, 737 may be plural.

[0094] (2) The number of second heating terminal portions 36, 736 provided may be one or three or more.

[0095] (3) The set temperature, which is the reference for turning on / off the power supply from the power supply IC 16A in the timing controller 16B, can be changed to a value other than 25°C.

[0096] (4) As a modification of the second embodiment, the second heating wires 129 may be arranged so as to overlap with one source wire 27 for every seven or less or nine or more source wires 27 in the second area A102.

[0097] (5) As a modification of the third embodiment, the ratio of the sum of the area ratios of the first region A201 and the third region A203 to the area ratio of the second region A202 may be other than "4:6."

[0098] (6) As a modification of the fourth embodiment, the second to fourth main wirings 332 to 334 may all be positioned in the display area AA and may be arranged to overlap the gate wiring 326.

[0099] (7) As a modification of the fifth embodiment, each of the main wirings 431 to 434 may have a laminated structure of a first metal film and a second metal film, or may have a laminated structure of a first metal film and a third metal film.

[0100] (8) As a modification of the sixth embodiment, each of the main wirings 531 to 534 may have a laminated structure of a first metal film and a fourth metal film, or may have a laminated structure of a second metal film and a fourth metal film.

[0101] (9) As a modification of the seventh embodiment, the number of dummy wirings 47 may be less than the number of third source wirings 627γ.

[0102] (10) As a modification of the seventh embodiment, the dummy wiring 47 may be disconnected from the common electrode 645. In this case, it is possible to connect the dummy wiring 47 to a common wiring or a common terminal portion for supplying a common potential.

[0103] (11) The driver 15 may be mounted by COG (Chip On Glass) on the first end 21A, 321A, 721A of the array substrate 21, 121, 321, 421, 521, 621, 721. In this case, the display terminal unit 38, 438 connected to the flexible substrate 14 is connected to the source wiring 27, 327, 627, etc. via the driver 15.

[0104] (12) It is also possible to omit the circuit unit 12. In that case, a gate driver having the same function as the circuit unit 12 may be attached to the array substrate 21, 121, 321, 421, 521, 621, 721. It is also possible to provide the circuit unit 12 on only one side of the array substrate 21, 121, 321, 421, 521, 621, 721.

[0105] (13) The common electrode 45, 645 may be the "upper electrode" that is the electrode located on the upper layer side of the pixel electrode 25 and the common electrode 45, 645, and the pixel electrode 25 may be the "lower electrode" that is the electrode located on the lower layer side. In this case, a slit is provided in the common electrode 45, 645 that is the "upper electrode."

[0106] (14) The material of the semiconductor film that constitutes the semiconductor portion 24D may be amorphous silicon, an oxide semiconductor material, or the like.

[0107] (15) The planar shape of the liquid crystal panel 11 may be a vertically long rectangle, a square, a circle, a semicircle, an oval, an ellipse, a trapezoid, or the like.

[0108] (16) The display mode of the liquid crystal panel 11 may be VA mode, IPS mode, or the like, in addition to FFS mode.

[0109] (17) The liquid crystal panel 11 may be a reflective or semi-transmissive type in addition to a transmissive type. If the liquid crystal panel 11 is a reflective type, the backlight device can be omitted.

[0110] (18) A display panel other than the liquid crystal panel 11 (such as an organic EL display panel) may be used.

[0111] (19) The heating wires 28 to 30, 128 to 130, 228 to 230, 328, 329, 428 to 430, 628 to 630 may be made of different metal films from the main wires 31 to 34, 331 to 334, 431 to 434, and 631. In this case, the thickness of the metal film constituting the main wires 31 to 34, 331 to 334, 431 to 434, and 631 can be made larger than the thickness of the metal film constituting the heating wires 28 to 30, 128 to 130, 228 to 230, 328, 329, 428 to 430, and 628 to 630. [Explanation of symbols]

[0112] 11...liquid crystal panel (display device), 14...flexible substrate, 16A...power supply IC (DC power supply), 20...opposing substrate (second substrate), 21, 121, 321, 421, 521, 621, 721...array substrate (first substrate), 21A, 321A, 721A...first end, 21B, 321B, 721B...second end, 22...liquid crystal layer, 27α, 327α, 627α...first source wiring (first pixel wiring), 27β, 627β...second Source wiring (second pixel wiring), 28,128,228,328,428,628...first heating wiring, 28A...extension end, 29,129,229,329,429,629...second heating wiring, 29A...extension end, 30,130,230,430,630...third heating wiring, 30A...extension end, 31,331,431,631...first main wiring, 32,332,432,532,632...second main wiring, 33,333,4 33,633...Third main wiring, 35,735...First heating terminal portion (second terminal portion), 36,736...Second heating terminal portion (third terminal portion), 37,737...Third heating terminal portion (fourth terminal portion), 38,438...Display terminal portion (first terminal portion), 42,442,642...First planarization film (first insulating film), 47...Dummy wiring, 326...Gate wiring (fourth pixel wiring), 341...First interlayer insulating film (second insulating film), 342...First planarization film Flattening film (second insulating film), 627γ...third source wiring (third pixel wiring), 645...common electrode, A1, A101, A201, A601, A701...first region, A2, A102, A202, A602, A702...second region, A3, A103, A203, A603, A703...third region, AA...display region, NAA...non-display region, PX1, PX601...first pixel, PX2, PX602...second pixel, PX3...third pixel

Claims

1. a first substrate having a main surface divided into a display area where an image is displayed and a non-display area where the image is not displayed; a first terminal portion provided at a first end portion of the first substrate, the first end portion being the non-display region; a second terminal portion provided at the first end portion; a third terminal portion provided at the first end portion; a flexible substrate attached to the first end portion and connected to the first terminal portion, the second terminal portion, and the third terminal portion, respectively; a first pixel arranged in the display area; a first pixel wiring arranged in the display region and connected to the first terminal portion and the first pixel; a first heating wiring arranged in the display area and connected to the second terminal portion; a second heating wire disposed in the display area and connected to the third terminal portion; the first heating wiring extends from the second terminal portion side toward a second end side in the non-display region of the first substrate, the second end side sandwiching the display region between the first end and the non-display region of the first substrate, The second heating wire extends from the third terminal portion side toward the second end portion side, and the extending end portion is connected to the extending end portion of the first heating wire.

2. a fourth terminal portion provided at the first end portion and connected to the flexible substrate; a third heating wire that is arranged in the display area and connected to the fourth terminal portion, The display device described in claim 1, wherein the third heating wiring is arranged in the display area with the second heating wiring sandwiched between it and the first heating wiring, and extends from the fourth terminal portion side toward the second end side, with the extended end connected to the extended end of the first heating wiring.

3. The display device according to claim 2 , wherein a plurality of the first heating wires, a plurality of the second heating wires, and a plurality of the third heating wires are arranged.

4. 4. The display device according to claim 2, wherein the second terminal and the fourth terminal are connected to a positive electrode of a DC power supply, and the third terminal is connected to a negative electrode of the DC power supply.

5. a plurality of the first heating wires, a plurality of the second heating wires, and a plurality of the third heating wires are arranged; the display area is divided into a first area in which a plurality of the first heating wires are arranged, a second area in which a plurality of the second heating wires are arranged, and a third area in which a plurality of the third heating wires are arranged, 4. The display device according to claim 2, wherein the ratio of the number of the first heating wiring, the second heating wiring, and the third heating wiring is inversely correlated with the area ratio of the first region, the second region, and the third region.

6. a second pixel disposed in the display area; a second pixel wiring arranged in the display region and connected to the second pixel; a first insulating film interposed between the first heating wiring and the second heating wiring and the first pixel wiring and the second pixel wiring; the first heating wiring is disposed so as to overlap the first pixel wiring with the first insulating film interposed therebetween; 4. The display device according to claim 1, wherein the second heating wiring is disposed so as to overlap the second pixel wiring with the first insulating film interposed therebetween.

7. a third pixel disposed in the display area; a third pixel wiring arranged in the display region and connected to the third pixel; The display device according to claim 6 , further comprising: a dummy wiring line arranged to overlap the third pixel wiring line with the first insulating film interposed therebetween.

8. a first pixel electrode constituting the first pixel; a second pixel electrode constituting the second pixel; a third pixel electrode constituting the third pixel; a common electrode disposed to overlap the first pixel electrode, the second pixel electrode, and the third pixel electrode with a gap therebetween; The display device according to claim 7 , wherein the dummy wiring is connected to the common electrode.

9. The first heating wiring and the second heating wiring are arranged in plural numbers, a first main wiring connected to the extending ends of the plurality of first heating wirings and the extending ends of the plurality of second heating wirings; a second main wiring connected to the plurality of first heating wirings and the second terminal portion; The display device according to claim 1 , further comprising: a third main wiring connected to a plurality of the second heating wirings and the third terminal portion.

10. The display device according to claim 9 , wherein the first main wiring is arranged at the second end portion.

11. The display device according to claim 9 , wherein the first main wiring is arranged in the display area.

12. a fourth pixel wiring arranged in the display area and intersecting the first pixel wiring; a second insulating film interposed between the fourth pixel wiring and the first main wiring; The display device according to claim 11 , wherein the first main wiring is disposed so as to overlap the fourth pixel wiring with the second insulating film interposed therebetween.

13. the first heating wiring and the second heating wiring each have a single-layer structure made of a single conductive film; 10. The display device according to claim 9, wherein the first main wiring, the second main wiring, and the third main wiring each have a laminated structure formed by laminating a plurality of conductive films.

14. The display device according to claim 9 , wherein the first main wiring, the second main wiring, and the third main wiring are thicker than the first heating wiring and the second heating wiring.

15. a second substrate disposed opposite the first substrate with a gap therebetween; The display device according to claim 1 , further comprising: a liquid crystal layer sandwiched between the first substrate and the second substrate.

Images