Substrate handling system

Abstract

To provide system methods and apparatuses for handling substrates.SOLUTION: A substrate handling system comprises: a substrate handling robot 14 for transferring a substrate among a plurality of substrate stations; and a lidar imaging system 26 comprising a lidar image acquisition module 27 located on the substrate handling robot. The lidar imaging system acquires at least one 3D image of a substrate and / or a substrate station and to determines one or more properties of the substrate and / or the substrate station, based on the at least one 3D image.SELECTED DRAWING: Figure 3a

Description

[Technical Field]

[0001] FIELD OF THE INVENTION This application relates generally to substrate processing, and more particularly to methods and apparatus for handling substrates. [Background technology]

[0002] An apparatus for processing semiconductor substrates such as silicon wafers typically includes a processing chamber where the substrates are processed, a substrate handling chamber where the substrates are moved before and after processing in the processing chamber, and one or more input / output chambers where the substrates are stored before and after moving through the handling chamber. A substrate handling robot is located within the handling chamber and configured to transfer substrates between multiple stations. Such stations may be within the handling chamber, the input / output chamber, the processing chamber, or other chambers. A typical station within a processing chamber is a substrate holder, such as a wafer boat or susceptor, that supports the substrates during processing. A station within the input / output chamber may include a cassette that holds multiple substrates. The input / output chamber may be a loading chamber or load port that contains a substrate cassette accessible by a transfer robot. The input / output chamber may also be a load lock chamber where the substrates can be atmospherically isolated and cleared of particles before moving into the handling chamber and ultimately into the processing chamber. Other stations, which may be within separate chambers or even within the substrate handling chamber, may include pre-processing stations (such as a wafer pre-cleaning station) and / or post-processing stations (such as a cooling station).

[0003] Substrate handling robots typically include an actuator, one or more interconnected arms, and an end effector attached to the arm. The actuator is configured to move the arm and the end effector. The end effector is adapted to pick up a substrate from a station, hold the substrate as the robot moves the end effector and substrate to another station, and place the substrate at another station. There are a variety of different types of end effectors, some of which may be multiple end effectors, such as dual end effectors, capable of supporting multiple substrates simultaneously.

[0004] In some tools, the apparatus includes multiple processing chambers, each typically adjacent to a substrate handling chamber. The processing chambers can process substrates simultaneously, thereby increasing the overall substrate throughput of the apparatus. The handling chamber may include multiple substrate handling robots to increase substrate handling capabilities. Summary of the Invention [Problem to be solved by the invention]

[0005] Substrates processed by the apparatus may be defective before or after processing due to, for example, damage during storage or loading of the substrate into the apparatus, damage during processing or transport by a substrate handling robot, etc. Processing damaged substrates is undesirable because this processing increases the running costs of the apparatus.

[0006] Correct placement of the substrate in a susceptor or boat carrier or other structure for supporting the substrate during processing is a critical factor in obtaining high-quality processed substrates. Misalignment or cross-slotting of the substrate can lead to inaccurate or substandard processing of the substrate. [Means for solving the problem]

[0007] According to a first embodiment of the present invention, there is provided a substrate handling system comprising: a substrate handling robot for transporting substrates between a plurality of substrate stations; and a lidar imaging system including a lidar image acquisition module located on the substrate handling robot, the lidar imaging system configured to acquire at least one 3D image of the substrate and / or the substrate station and to determine one or more characteristics of the substrate and / or the substrate station based on the at least one 3D image.

[0008] An advantage of embodiments of the present invention is that by acquiring and analyzing one or more three-dimensional images, characteristics of the substrate and / or substrate station can be determined that are difficult or impossible to obtain from two-dimensional images.An advantage of embodiments of the present invention is that by positioning the LIDAR image acquisition module on a substrate handling robot, the position of the LIDAR image acquisition module can be controlled, thereby allowing images to be acquired from various relative positions between the LIDAR image acquisition module and the substrate and / or substrate station.

[0009] The lidar imaging system may be configured to acquire at least one 3D image while the substrate handling robot is stationary.

[0010] The lidar imaging system may be configured to acquire at least one 3D image while the substrate handling robot is operating.

[0011] The lidar imaging system may be configured to acquire a first 3D image of a substrate and / or substrate station from a first relative position and a second 3D image of the same substrate and / or substrate station from a second relative position different from the first relative position, and to determine one or more characteristics of the same substrate and / or substrate station based on the first 3D image and the second 3D image.

[0012] The lidar imaging system may be configured to combine two or more 3D images of the same substrate and / or substrate station to create a composite image and determine one or more properties of the substrate and / or substrate station based on the composite image, which may allow a 3D image of an object to be constructed from multiple angles, providing more information than a single image from a single angle.

[0013] The substrate handling system may include a substrate handling robot control module configured to receive at least one characteristic determined based on the at least one 3D image from the LIDAR imaging system, and to adapt a behavior of the substrate transport robot based on the at least one characteristic.

[0014] The at least one 3D image may include at least a portion of the substrate, and the characteristic may include warpage of the substrate.

[0015] The at least one 3D image may include at least a portion of the substrate, and the characteristics may include a parameter indicative of damage to the substrate.

[0016] The at least one 3D image may include at least a portion of the substrate, and the characteristics may include a substrate identification code.

[0017] The at least one 3D image may include at least a portion of the substrate, and the properties may include a location of a center of the substrate.

[0018] The substrate station may be a boat. The at least one 3D image may include at least a portion of the boat, and the characteristics may include parameters indicative of a location of the substrate on the boat.

[0019] The at least one 3D image may include at least a portion of the boat, and the characteristics may include parameters indicative of cross-slots occurring in one or more substrates in the boat.

[0020] The at least one 3D image may include at least a portion of the boat, and the characteristics may include a parameter indicative of an orientation of the boat relative to a horizontal plane.

[0021] The at least one 3D image may include at least a portion of the boat, and the characteristics may include parameters indicative of damage to the boat.

[0022] The substrate station may be a cassette for storing wafers. The at least one 3D image may include at least a portion of a cassette for storing the substrates, and the characteristics may include parameters indicative of a position of the substrate in the cassette.

[0023] The at least one 3D image may include at least a portion of a cassette for storing substrates, the cassette having a door, and the characteristics may include a parameter indicative of whether the door is open or closed.

[0024] The at least one 3D image may include at least a portion of a cassette for storing substrates, and the characteristics may include parameters indicative of cross-slotting occurring in one or more substrates in the cassette.

[0025] According to a second aspect of the present invention, there is provided a method of operating a substrate handling system comprising a substrate handling robot and a LIDAR imaging system including a LIDAR image acquisition module located on the substrate handling robot, the method being executable by a control module for controlling the LIDAR imaging system, the control module comprising a processor and instructions that, when executed by the processor, cause the control module to perform a method comprising: causing the LIDAR image acquisition module to acquire at least one 3D image of the substrate and / or substrate station; and determining one or more characteristics of the substrate and / or substrate station based on the at least one 3D image.

[0026] The control module may be or may include a control module for controlling a substrate handling robot, and the instructions stored in the memory, when executed by the processor, may cause the control module to perform a method including: controlling the substrate handling robot to adopt a first robot position such that the LIDAR image acquisition module has a first position relative to the substrate and / or substrate station; causing the LIDAR image acquisition module to acquire at least one first 3D image of the substrate and / or substrate station; controlling the substrate handling robot to adopt a second robot position such that the LIDAR image acquisition module has a second position relative to the same substrate and / or substrate station; causing the LIDAR image acquisition module to acquire at least one second 3D image of the substrate and / or substrate station; and determining one or more characteristics of the substrate and / or substrate station based on the at least one first 3D image and the at least one second 3D image.

[0027] This summary is provided to introduce some concepts in a simplified form that are described in more detail below in the detailed description of exemplary embodiments of this disclosure. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0028] Certain embodiments of the invention will now be described, by way of example, with reference to the accompanying drawings, in which: [Brief explanation of the drawings]

[0029] [Figure 1] FIG. 1 is a schematic top view of an example of a furnace in which embodiments of the present invention may be incorporated. [Figure 2a] FIG. 2a is a schematic perspective view of a substrate handling robot that may be included in an embodiment of the present invention. [Figure 2b]FIG. 2b is a schematic perspective view of a substrate handling robot supporting a wafer that may be included in an embodiment of the present invention. [Figure 3a] 1 is a schematic perspective view of a substrate handling robot supporting LIDAR image acquisition modules at various locations, in accordance with an embodiment of the present invention. [Figure 3b] 1 is a schematic perspective view of a substrate handling robot supporting LIDAR image acquisition modules at various locations, in accordance with an embodiment of the present invention. [Figure 3c] 1 is a schematic perspective view of a substrate handling robot supporting LIDAR image acquisition modules at various locations, in accordance with an embodiment of the present invention. [Figure 3d] 1 is a schematic perspective view of a substrate handling robot supporting LIDAR image acquisition modules at various locations, in accordance with an embodiment of the present invention. [Figure 3e] 1 is a schematic perspective view of a substrate handling robot supporting LIDAR image acquisition modules at various locations, in accordance with an embodiment of the present invention. [Figure 3f] 1 is a schematic perspective view of a substrate handling robot supporting LIDAR image acquisition modules at various locations, in accordance with an embodiment of the present invention. [Figure 3g] 1 is a schematic perspective view of a substrate handling robot supporting LIDAR image acquisition modules at various locations, in accordance with an embodiment of the present invention. [Figure 4] FIG. 4 is a flowchart of a method according to an embodiment of the present invention. [Figure 5] FIG. 5 is a flow chart of a modified version of the method shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0030] It will be understood that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of the illustrated embodiments of the present disclosure.

[0031] While certain specific embodiments and examples are disclosed below, it will be understood by those skilled in the art that the scope of the invention extends beyond the specifically disclosed embodiments and / or uses of the invention, and obvious variations and equivalents thereof. It is therefore not intended that the scope of the disclosed invention should be limited by the specific disclosed embodiments described below.

[0032] As used in this disclosure, the term "substrate" can refer to any single or multiple underlying materials, such as any single or multiple underlying materials that may be modified or upon which a device, circuit, or film may be formed. A "substrate" can be continuous or discontinuous, rigid or flexible, solid or porous, and combinations thereof. A substrate can be in any form, such as a powder, a plate, or a workpiece. Substrates in the form of a plate can include wafers of various shapes and sizes. Substrates can be made of semiconductor materials, including, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0033] The continuous substrate may extend beyond the boundaries of the process chamber in which the deposition process occurs. In some processes, the continuous substrate may move through the process chamber, allowing the process to continue until the end of the substrate is reached. The continuous substrate may be supplied from a continuous substrate supply system to enable the production and output of the continuous substrate in any suitable form.

[0034] The illustrations presented herein are not meant to be actual representations of any particular materials, structures, or devices, but merely idealized representations used to describe embodiments of the present disclosure.

[0035] The specific implementations shown and described are illustrative of the present invention and its best mode and are in no way intended to limit the scope of aspects and implementations. Also, for the sake of brevity, conventional manufacturing, association, preparation, and other functional aspects of the systems may not be described in detail. Furthermore, connecting lines shown in the various figures are intended to represent example functional relationships and / or physical couplings between the various elements. Many alternative or additional functional relationships or physical connections may be present in an actual system and / or may not be present in some embodiments.

[0036] It will be understood that the configurations and / or approaches described in this disclosure are exemplary in nature, and that these specific embodiments or examples are not to be construed in a limiting sense, as numerous variations are possible. The specific routines or methods described herein may represent one or more of any number of processing strategies. As such, various illustrated operations may be performed in the order illustrated, in other orders, or omitted in some cases.

[0037] The subject matter of the present disclosure includes all novel and non-obvious combinations and subcombinations of the various processes, systems, and configurations, and other features, functions, operations and / or properties disclosed herein, as well as all equivalents thereof.

[0038] 1, there is shown a schematic top view of a substrate processing apparatus or furnace 1 that may include a substrate handling system according to an embodiment of the present invention. The furnace 1 includes a housing 2 having a front wall 4 and a rear wall 6.

[0039] The furnace 1 may include a cassette module 3 having a storage device, such as a cassette storage carousel 5, for storing multiple wafer cassettes C, each containing multiple substrates. The cassette storage carousel 5 may include multiple platform stages for supporting the cassettes. The platform stages may be connected to a central shaft that is rotatably mounted about a vertical axis. Each platform stage is configured to accommodate multiple cassettes C. A drive assembly is operably connected to the central shaft for rotating the central shaft with the multiple platform stages about the vertical axis.

[0040] The cassette module 3 may have a cassette handler 7 having a cassette handler arm 8 configured to transport cassettes C between the cassette storage carousel 5, a cassette entry / exit port 9 adjacent the front wall 4 of the housing 2 of the furnace 1, and / or a load port 10. The cassette handler 7 may include a lifting mechanism to reach cassettes at different heights. Each platform stage for storing cassettes may have a cutout therein sized and shaped to allow the cassette handler arm 8 to pass vertically therethrough and to allow the platform stage to support a cassette C thereon.

[0041] An interior wall 11 may be provided separating the cassette module 3 from the processing module 12. The interior wall 11 may have a closable substrate access opening 13 adjacent to the load port 10 which may also be constructed and arranged to open the cassette C. The load port 10 may be provided with a cassette turntable for rotating the cassette C and / or for pressing the cassette C against the closable substrate access opening 13.

[0042] The processing module 12 may include a substrate handling robot 14 provided with a substrate handling arm 15 for transferring substrates from a cassette C positioned on the load port 10 through a closable substrate access opening 13 to a substrate rack or boat, and vice versa. The furnace may include a substrate handling chamber 16 in which the substrate handling robot 14 is housed.

[0043] The housing 2 may have first and second side walls 17 that extend the entire length of the furnace 1. Maintenance of the furnace 1 may be performed from the rear 6 or front 4 of the furnace so that there is no need for a door on the side wall 16.

[0044] By constructing sidewalls 17 without doors, multiple furnaces 1 may be positioned side by side within a semiconductor fabrication facility. The sidewalls of adjacent furnaces may then be positioned in close proximity or horizontally in contact with one another. Advantageously, multiple furnaces may form a wall with the front side 4 of the furnace 1 interfacing with a cassette transfer device in the very clean environment of a so-called "clean room" that has very strict requirements for particles. The back side 6 of the furnace 1 may interfacing with a narrow maintenance aisle that may have less strict particle requirements than the front side 4.

[0045] The furnace 1 may be provided with a first reactor and a second reactor 18 for processing multiple substrates. The use of two reactors may increase the productivity of the furnace 1. The substrate processing system in top view may be configured substantially in a U-shape. The first reactor and the second reactor 18 may be configured and arranged in legs. A maintenance area 19 may be configured and arranged between the legs of the U-shape.

[0046] A substrate handling robot 14 according to an embodiment of the present invention is shown in more detail in Figures 2a and 2b. The robot 14 includes an end effector 20 configured to pick up a wafer 21, support the wafer 21 during a wafer transfer process, and then deliver the wafer 21 to a destination station. The destination station may be, for example, a substrate rack or boat, a cassette, a susceptor, etc. In some embodiments, the end effector 20 may be a dual end effector or multiple end effectors capable of transferring multiple substrates simultaneously.

[0047] The robot 14 also includes arms 22 and 23. The arm 22 has one end rotatably coupled to the end effector 20 and the other end rotatably coupled to the end of the arm 23. The arm 23 has an opposite end rotatably coupled to an elevator 24 configured to vertically translate the arms 22, 23 and the end effector 20. The elevator 24 may be configured to rotate about a vertical axis to facilitate rotation of the arms 22, 23 and the end effector 20. The translation and / or rotation may be achieved by providing the elevator 24 as a support 30 supported at a base 31, allowing the support 30 to translate vertically relative to the base 31 and rotate relative to the base 31. While the exemplary embodiment shown in FIG. 2 has two rotatably coupled arms, it will be understood that a substrate handling robot 14 according to embodiments of the present invention may have three or more rotatably coupled arms.

[0048] The substrate handling robot 14 is included in a substrate handling system 25. The substrate handling system 25 includes the substrate handling robot 14 and a LIDAR imaging system 26. The LIDAR imaging system 26 includes a LIDAR image acquisition module 27 disposed on the substrate handling robot 14. The LIDAR image acquisition module 27 may be disposed, for example, on the elevator 24, on one of the arms 22 and 23, or on the end effector 20. In embodiments in which the substrate handling robot 14 includes two or more rotatably connected arms, the LIDAR imaging system may be disposed on any of those arms. By "on the elevator" or "on the arm," it is meant that the LIDAR image acquisition module 27 may be disposed on any surface of the referenced element. As an example, with reference to FIG. 3a, in one embodiment, the LIDAR image acquisition module 27 may be located on the upper surface of the elevator 24, with the understanding that other locations for the LIDAR image acquisition module 27 on the substrate handling robot 14 are possible. With reference to FIG. 3b, in one embodiment, the LIDAR image acquisition module 27 may be located on the lower surface of the arm 22. Referring to Figure 3c, in one embodiment, the LIDAR image acquisition module 27 may be located on the underside of the arm 23. Referring to Figure 3d, in one embodiment, the LIDAR image acquisition module 27 may be located on the upper side of the arm 22. Referring to Figure 3e, in one embodiment, the LIDAR image acquisition module 27 may be located on the upper side of the arm 23. By positioning the LIDAR image acquisition module 27 on the elevator 24, the vertical position of the LIDAR image acquisition module 27 can be changed by moving the elevator vertically. By positioning the LIDAR image acquisition module 27 on the arms 22, 23, the vertical position of the LIDAR image acquisition module 27 can be changed by moving the elevator vertically, and the position of the LIDAR image acquisition module 27 in the horizontal plane can be changed by rotating the arms 22, 23.Positioning the LIDAR image acquisition module 27 on an arm 22 directly connected to the end effector may provide greater control over the position of the LIDAR image acquisition module 27 in the horizontal plane compared to positioning the LIDAR image acquisition module 27 on an arm 23 directly connected to the elevator 24.

[0049] Referring to Figure 3f, the LIDAR image acquisition module 27 may be located on the top surface of the arm 22. This may allow for closer positioning to the end effector 20 to image the wafer held by the end effector 20 in greater detail. Referring to Figure 3g, the LIDAR image acquisition module 27 may be located on the top surface of the arm 23. Figures 3f and 3g show the substrate handling system 25 in a retracted position compared to the extended position shown in Figures 3a-3e.

[0050] The LIDAR image acquisition module 27 includes one or more light sources (e.g., lasers) for scanning the field of view and one or more photodetectors (e.g., photodetectors, photodiodes, CCDs, or other photodetectors) for detecting light emitted from the one or more light sources that is scattered and / or reflected by objects in the field of view. The light sources may be configured to emit continuous or pulsed light. The time between emission of the light and detection by the photodetectors is related to the distance between the LIDAR module 27 and the objects from which the emitted light is scattered and / or reflected.

[0051] Scanning the field of view can be achieved, for example, by changing the orientation of a mirror onto which light from a light source is incident, thereby deflecting the light's transmission direction. For example, a horizontal line scan can be performed by rotating a mirror about an axis in the vertical plane, or vice versa. By performing successive horizontal (or vertical) line scans at various vertical (or horizontal) deflections, the field of view can be mapped in three dimensions. A single three-dimensional image acquired by the LIDAR image acquisition module 27 contains depth information, which is not present in two-dimensional images.

[0052] The substrate handling system 25 may be configured to acquire at least one 3D image while the substrate handling robot 14 is operating. For example, the substrate handling system 25 may include a robot control module configured to control the movement of the substrate handling robot 14. The robot control module may be configured to control the substrate handling robot 14 to cause the substrate handling robot 14 to transfer a substrate from one substrate station to another, and the robot control module may be configured to send a signal to the lidar imaging system 26 to cause the lidar imaging system 26 to acquire one or more 3D images while the substrate handling robot 14 is transferring a substrate from one substrate station to another substrate station.

[0053] The substrate handling system 25 may be configured to acquire at least one 3D image while the substrate handling robot 14 is stationary. For example, the robot control module may be configured to control the substrate handling robot 14 to be stationary, and the robot control module may be configured to send a signal to the lidar imaging system 26 to cause the lidar imaging system 26 to acquire one or more 3D images while the substrate handling robot is stationary.

[0054] The substrate handling system 25 may be configured to acquire at least one 3D image of the substrate and / or substrate station while the LIDAR image acquisition module 27 has a first position relative to the substrate and / or substrate station, change the relative position of the LIDAR image acquisition module 27 with respect to the substrate and / or substrate station by controlling the substrate handling robot 14 so that the LIDAR image acquisition module 27 has a second position relative to the substrate and / or substrate station that is different from the first position, and acquire at least one 3D image while the LIDAR image acquisition module 27 has the second position relative to the substrate and / or substrate station. This may enable a series of images of an object to be acquired so that the object can be viewed in greater detail. In some embodiments, the 3D images may be combined to form a composite image of the same substrate and / or substrate station, which may provide a wider view from multiple angles. This may be useful, for example, to detect damage that is only visible from one angle and would be missed if only images were acquired from different angles. Of course, more than one image may be acquired and combined.

[0055] In some embodiments, the substrate handling system 25 may be configured to acquire a first 3D image of the substrate and / or substrate station, move the elevator of the substrate handling robot 14 vertically, and acquire a second 3D image of the substrate and / or substrate station. This may allow a series of 3D images of the same substrate and / or substrate station to be taken from different positions along the same vertical axis. In some embodiments, the substrate handling system may be configured to acquire a first 3D image of the substrate and / or substrate station, change position of the arm 22 and / or the arm 23, and acquire a second 3D image of the substrate and / or substrate station. This may allow a series of 3D images to be taken from different positions in the same horizontal plane. In some embodiments, the substrate handling system 25 may be configured to acquire a first 3D image of the substrate and / or substrate station, move the elevator of the substrate handling robot 14 vertically, change position of the arm 22 and / or the arm 23, and acquire a second 3D image of the substrate and / or substrate station. This may allow a series of 3D images to be taken from different horizontal and vertical positions. Thus, a composite image of the substrate and / or substrate station can be constructed by combining 3D images taken from different angles. One or more properties of the substrate and / or substrate station may be determined based on the composited 3D images using the methods described herein for the non-composite 3D images.

[0056] For example, in some embodiments, the substrate station may be a boat, and the substrate handling system 25 may be configured to acquire a series of 3D images of the boat, with the LIDAR image acquisition module 27 having a different position relative to the boat for each 3D image. This may provide a more comprehensive view of the boat compared to a single 3D image, allowing, for example, damage that may only be visible from one side of the boat to be identified. In the embodiments described herein, when referring to a 3D image, it will be understood that multiple 3D images may also be used.

[0057] In some embodiments, the lidar imaging system 26 may include a control module 28. The control module 28 may be configured to control the lidar image acquisition module 27, for example, to cause the lidar image acquisition module 27 to perform a scan event. The control module 28 may be configured to provide parameters for the scan event, such as, for example, a scan angle, a scan duration, and a scan speed, to the lidar image acquisition module 27. The lidar image acquisition module 27 may be configured to provide lidar image data to the control module 28 or to one or more other control and / or processing modules of the furnace system 1 for further processing. The control module 28 for the lidar image acquisition module and the substrate handling robot control module may be combined in a single control module for the substrate handling system. Of course, the location of the control module 28 shown in the figures does not necessarily indicate the relative physical locations of the control module 28 and the substrate handling robot 14. As used herein, when referring to a control module, such a control module may include a processor and a memory that stores instructions that, when executed by the processor, cause operations to be performed. For example, a control module for a LIDAR image acquisition module may store in memory instructions that, when executed by a processor, cause the LIDAR image acquisition module to perform one or more of the following operations: acquire a 3D image, transmit the acquired 3D image to another module, determine a property based on the 3D image, receive the 3D image, store the 3D image, etc. A control module for a substrate transport robot may store in memory instructions that, when executed by a processor, cause the substrate transport robot to change its orientation, pose, and / or position, pick up or place a substrate, remain stationary, etc.

[0058] The control module 28 may include a processing module configured to receive and process the 3D image data received from the lidar acquisition module. The processing module 28 may be configured to determine one or more characteristics of the substrate and / or substrate station based on the 3D image data. In some embodiments, the processing module 28 may be configured to compare the one or more characteristics to one or more reference values, reference data, or reference images. Determining the one or more characteristics may include identifying the substrate or portion thereof and / or the substrate station or portion thereof using computer vision methods, such as object detection, object recognition, 3D reconstruction, 3D pose estimation, etc., based on the at least one 3D image. Determining the one or more characteristics may include generating a model, contour, outline, map, or other representation of the substrate and / or substrate station based on the at least one 3D image.

[0059] In some embodiments, control module 28, including the processing modules, may be configured to send data indicative of one or more characteristics of the substrate and / or substrate station, for example, to a central control module of furnace system 1 and / or a peripheral control module(s) of furnace system 1, for further evaluation, such as comparison with reference values, data, or images. The central control module may store the one or more characteristics in a memory, for example, a wafer database. In some embodiments, a control module of the furnace system, for example, control module 28 or the central control module or a peripheral control module (e.g., reactor control module, gas flow control module, etc.), may be configured to receive the data indicative of one or more characteristics of the substrate and / or substrate station and perform one or more further actions based on the data.

[0060] Determining one or more characteristics of the substrate based on the 3D image may include comparing the 3D image to a reference image. The reference image may be an image acquired by LIDAR image acquisition module 27 or an image received from an external source and stored in control module 28. For example, the substrate may be imaged using LIDAR image acquisition module 27 before and after processing in a reactor included in furnace 1, and the image taken after processing may be compared to the image taken before processing to, for example, determine whether damage to the substrate has occurred.

[0061] The one or more characteristics of the substrate and / or substrate station may include one or more characteristics of the substrate. During image acquisition, in some embodiments, the substrate may be located at the substrate station. In some embodiments, during image acquisition, the substrate may be supported by an end effector of the substrate transfer robot 14. In some embodiments, during image acquisition, the substrate may be simultaneously partially supported by a slot or other support in the substrate station and partially supported by the substrate transfer robot 14, for example, if the image is acquired during the process of transferring the substrate to / from the substrate station.

[0062] In some embodiments, the LIDAR image acquisition module 27 may be configured to acquire a 3D image including (a portion of) the substrate or wafer, and the LIDAR imaging system 26 may be configured to determine the amount of wafer bow based on the acquired 3D image. The amount of substrate or wafer bow may be provided to a user of the furnace 1, for example, displayed on a display screen of the furnace or stored in a memory unit of the furnace. Determining the amount of wafer bow may include, for example, identifying the wafer (e.g., using computer vision techniques) and determining the amount of bow based on the identified wafer shape and the outline of a reference wafer. Other bow determination methods may also be used based on the 3D image of the wafer. The wafer may be positioned at the substrate station, for example, in a boat, susceptor, or cassette, or may be supported by an end effector when the image is acquired.

[0063] In some embodiments, the LIDAR image acquisition module 27 may be configured to acquire a 3D image including (a portion of) the substrate or wafer, and the LIDAR imaging system 26 may be configured to determine the thickness of the wafer based on the acquired 3D image. The thickness of the substrate or wafer may be provided to a user of the furnace 1, for example, displayed on a display screen of the furnace or stored in a memory unit of the furnace. Determining the thickness of the wafer may include, for example, identifying the wafer (e.g., using computer vision techniques) and determining the thickness based on the identified wafer shape. The wafer may be located at a substrate station, for example, in a boat, susceptor, or cassette, or may be supported by an end effector when the image is acquired.

[0064] In some embodiments, the LIDAR imaging system 26 may be configured to determine the location of a notch in the wafer based on the acquired 3D image. The notch location information may be useful for properly orienting the wafer. The notch location information may be provided by the control module 28 to a control module for controlling a substrate handling robot. The control module for controlling the substrate handling robot may be configured to control movement of the substrate handling robot based on the notch location information, for example, to cause the substrate handling robot to rotate the substrate so that the notch has a particular orientation relative to the substrate station or end effector. Determining the notch location may include, for example, identifying the wafer in the 3D image, extracting a wafer contour of the wafer, comparing the wafer contour to a reference wafer contour, and determining the notch location as a location where the wafer contour deviates from the reference contour.

[0065] In some embodiments, the lidar imaging system 26 may be configured to determine a wafer identification code on the wafer based on the acquired 3D image. The wafer identification code may be provided to the control module of the furnace 1, for example, to be stored / updated in a database of the control module of the furnace module that associates the wafer identification code with the location / position of the wafer. The wafer identification code may be, for example, a text and / or numeric code or a barcode. Determining the wafer identification code may include, for example, performing a text recognition method on the 3D image. The text recognition may be limited to defined areas of the image where the wafer is known to be present, for example, by using computer vision techniques to identify the wafer in the 3D image and limiting the text search to that area of the image that contains the wafer.

[0066] In some embodiments, the lidar imaging system 26 may be configured to determine the location of the wafer's center point based on the acquired 3D image. Locating the wafer center can check whether the wafer is correctly positioned on the end effector. The substrate handling system 25 may be configured to cause the substrate handling robot 14 to adjust the wafer's position based on the wafer center point determined from the 3D image. Determining the center point may include, for example, identifying the wafer in the 3D image, extracting the wafer outline, and determining the center position using a geometric relationship. Determining the wafer center using the 3D image can enable determining the wafer center of a wafer having a non-circular or non-elliptical shape, which may not be compatible with standard wafer center finders that use a light beam interception method calibrated to circular wafers.

[0067] In some embodiments, the lidar imaging system 26 may be configured to determine the damage state of the wafer based on the acquired 3D images, such as a classification as damaged or undamaged, or a parameter indicative of the degree of damage. The substrate handling system 25 may be configured to have the substrate handling robot 14 transport wafers classified as damaged based on the acquired 3D images to a substrate storage station, such as a cassette, instead of transporting the wafer to a substrate processing station, such as a boat. This may help avoid processing already damaged wafers. Wafer damage may include breakage, such as a missing section of the wafer. Determining wafer damage may include identifying the wafer in the 3D image, extracting the wafer contour, and comparing the wafer contour to an expected contour (e.g., circular or oval) to determine where the wafer deviates from the expected contour. Wafer damage may include, for example, scratches on the wafer's surface. Determining a wafer damage map includes identifying the wafer in the 3D image and identifying any irregularities on the wafer's surface, which may otherwise be expected to be smooth.

[0068] In some embodiments, the lidar imaging system 26 may be configured to determine the degree of alignment of the wafer relative to the substrate holder based on the acquired 3D image. For example, the wafer may be placed on a ring holder, the ring holder may be placed on a boat, and the degree of alignment of the wafer on the ring holder may be determined. The substrate handling system 25 may be configured to cause the substrate handling robot 14 to adjust the position of the wafer on the substrate holder according to the determined degree of alignment. Determining the degree of alignment may include identifying the ring holder and the wafer in the 3D image, determining the centers of both the ring holder and the wafer, and comparing the center positions.

[0069] In some embodiments, the substrate station may be a substrate holder. The 3D image may include at least a portion of the substrate holder, and the one or more characteristics may include one or more characteristics of the substrate holder. The substrate holder may be a boat for supporting a substrate during processing. The substrate holder may be a susceptor for supporting a substrate during processing. The substrate holder may be a cassette for storing substrates. Determining characteristics of the substrate holder based on at least one 3D image may include identifying the substrate holder in the image. Identifying the substrate holder may include identifying one or more features in the image known to be included in the substrate holder. For example, a boat may include several, e.g., three, vertically extending boat rods, top and bottom plates to which the boat rods are attached at their upper and lower ends, and a series of slots in the boat rods at regular vertical intervals for receiving wafers. Identifying the boat in the image may include identifying the boat rods, for example, by an image recognition or object detection process. Identifying the boat in the image may include identifying slots in the boat rods.

[0070] In some embodiments, the lidar imaging system 26 may be configured to determine the damage status of the boat based on the acquired 3D images, such as a damaged / undamaged classification or a classification of the degree of damage, and / or the location of the damage. If a damaged boat is used to support substrates during processing, damage may also occur to the substrates and / or the reactor. Therefore, it is advantageous to identify boat damage as early as possible. The substrate handling system 25 may be configured to transmit data indicating the boat damage status to a central control module of the furnace 1, which may be configured to stop processing operations of the furnace 1 and / or display a boat damage status message to a user in response to the boat damage status. Determining the damage status may include identifying the boat in the image, extracting the boat's outline, and comparing the outline with a reference outline to identify any deviations. The reference outline may be a straight line, for example, when determining whether damage has occurred to the boat rod. Determining the damage status may include identifying the boat in the image and identifying surface irregularities, such as scratches or cracks, on the boat.

[0071] In some embodiments, the lidar imaging system 26 may be configured to determine the position of the boat relative to the substrate handling robot based on the acquired 3D images. This may help optimize the movement of the substrate handling robot to accurately place wafers on the boat. Because the acquired images are three-dimensional, the distance between the lidar image acquisition module and objects in the images can be accurately determined. The substrate handling system 25 may be configured to cause the substrate handling robot 14 to transfer the substrate to a position on the boat, the position being determined according to the boat position acquired from the 3D images.

[0072] In some embodiments, the lidar imaging system 26 can be configured to determine boat level measurements based on the acquired 3D images. The boat may include boat supports for substrates, such as notches in the boat rod, protrusions attached to the boat rod, ring holder supports, ring holders, or other means for supporting substrates during processing. If the boat is not level, the placement / removal of substrates on such supports may be affected because slippage may occur during pickup / placement if the end effector and boat are not aligned in the same plane. The substrate handling system 25 may be configured to send data indicating the boat level status to the furnace 1 central control module, which may be configured to stop processing operations of the furnace 1 in response to a boat damage status and / or display a boat level status message to a user of the furnace 1. Determining the boat level may include, for example, identifying the boat as described above, identifying features that are expected to be level, such as the top or bottom plate or one or more slots, generating a line or plane that is collinear or coplanar with the feature, and comparing the line or plane to a horizontal line or plane to determine any deviations.

[0073] In some embodiments, the lidar imaging system 26 may be configured to determine the boat part number based on the acquired 3D image, for example, by taking a 3D image including the location where the boat part number is provided and performing a text recognition process on the 3D image to identify the part number. The substrate handling system 25 may be configured to transmit the boat part number to a central control module of the furnace 1, which may store and optionally display the boat part number to a user of the furnace 1.

[0074] In some embodiments, the lidar imaging system 26 may be configured to determine the position of one or more wafers or substrates in the boat based on the acquired 3D image. For example, the lidar imaging system 26 may acquire a 3D image of the boat, identify the boat in the image, identify a set of slots in the boat, and determine which slots or positions in the boat contain wafers. The substrate handling system 25 may be configured to cause the substrate handling robot 14 to only remove wafers from positions that contain wafers and / or only load wafers into positions that do not contain wafers. This may reduce the time required to load / unload the boat.

[0075] In some embodiments, the lidar imaging system 26 may be configured to acquire a 3D image of the boat and, based on the 3D image, determine whether any wafers in the boat have cross-slots, i.e., whether any wafers are supported by slots or notches that are not in the same horizontal plane. The substrate handling system 25 may be configured to have the substrate handling robot 14 remove any cross-slot wafers and replace them in the boat in their correct slotted positions. Determining whether a wafer has a cross-slot may include identifying the boat and slots described above, identifying the wafers in the boat, determining whether the wafer is horizontal, for example, by generating a line or plane that is collinear with the wafer (e.g., if the image is a side view relative to the plane of the wafer) or coplanar with the wafer, and comparing the line or plane to a reference horizontal line or plane. If the deviation between the line or plane of the wafer and the reference line or plane is greater than a predetermined value, the lidar imaging system 26 may classify the wafer as having a cross-slot.

[0076] In some embodiments, the lidar imaging system 26 may be configured to acquire a 3D image of the boat after the substrates have been loaded onto the boat but before the wafers are processed, and to determine the depth of the wafer in the boat support (e.g., slot or notch) based on the 3D image. The substrate handling system 25 may be configured to cause the substrate handling robot 14 to reposition any wafers that have an incorrect depth in the boat support. Determining the depth of the wafer may include identifying the boat and one or more slots or notches in the boat as described above, identifying the center of the boat support and determining the center of the circle, e.g., by using the locations of the slots or notches as points on the circumference, identifying the center of the wafer in the slot, e.g., as described above, and comparing the location of the center of the boat support with the location of the center of the wafer. Determining the center of the boat support may be used in a process to properly seat the wafer in the boat support. For example, the substrate handling system may be configured to acquire a 3D image including a boat support, identify the boat and one or more slots or notches in the boat as described above, identify the center of the boat support, for example, by using the positions of the slots or notches as points on a circle and determining the center of the circle, acquire an image of a wafer held on an end effector of the substrate handling robot, identify the center of the wafer, for example, as described above, and position the wafer on the boat support so that the center of the wafer coincides with the center of the boat support.

[0077] In some embodiments, the lidar imaging system 26 may be configured to acquire a 3D image of the boat including the ring wafer support and determine a measure of ring deflection based on the 3D image. Determining the measure of ring deflection may include, for example, identifying the ring wafer support, determining or generating a surface profile of the ring wafer support, and comparing the surface profile to a horizontal plane to determine any deviation from the plane.

[0078] In some embodiments, the acquired 3D image may include at least a portion of the cassette, and the LIDAR imaging system 26 may be configured to determine characteristics of the cassette based on the 3D image. The cassette may include an openable door to provide access to the substrates. The cassette may include a series of slots or other supports for supporting the wafers in the cassette.

[0079] In some embodiments, the LIDAR imaging system 26 may be configured to acquire a 3D image of the cassette and determine the open / closed state of the cassette door based on the 3D image. The substrate handling system may be configured to cause the substrate handling robot 14 to pause a substrate transfer operation based on the open / closed state of the cassette door. This may help avoid a collision of the end effector with the cassette door if the cassette door is not opened when a substrate transfer operation to / from the cassette is initiated. The substrate handling system 25 may be configured to provide the open / closed state of the door to the control module of the furnace 1, which may be configured to store the open / closed state of the door and optionally display this state to a user of the furnace 1. Determining the open / closed state of the door may include, for example, using image recognition or object detection to identify the cassette in the image based on known characteristics of the cassette, such as the shape of the cassette, identify the open state of the cassette door, and determine whether the door is open or closed based on distance measurements from the 3D image data. When the door is closed, the light emitted by the LIDAR image acquisition module will be scattered at a shorter distance from the LIDAR image acquisition module compared to when the door is open, and the light will be scattered by elements within the cassette, such as the rear wall of the cassette, the substrate holder in the cassette, and the wafers in the cassette, which are located at a greater distance from the LIDAR image acquisition module.

[0080] In some embodiments, the LIDAR imaging system 26 may be configured to acquire 3D images of the cassette and determine the condition of the door seal of the door on the cassette. The substrate handling system may be configured to provide the door seal condition to the furnace 1 control module, which may be configured to store the door seal condition and optionally display this condition to a user of the furnace 1. The seal may be an inflatable seal that retracts into its housing when the door is open and is flat and shiny. Deviations from this condition may indicate damage to the seal. Determining the condition of the door seal may include identifying the seal in one or more 3D images. Identifying the seal may include first identifying the cassette and then identifying the seal based on a region of the image that includes the cassette. Determining the condition of the door seal may include determining a measure of the seal's flatness based on distance measurements to various points on the seal. Determining the condition of the door seal may include identifying irregularities, such as scratches, on the seal's surface.

[0081] In some embodiments, the lidar imaging system 26 may be configured to acquire a 3D image of the cassette and determine the location of one or more wafers in one or more storage locations in the cassette. For example, the lidar imaging system 26 may acquire a 3D image of the cassette, identify the cassette in the image, identify a set of slots in the cassette, and determine which slots or locations in the cassette contain wafers. The substrate handling system 25 may be configured to have the substrate handling robot 14 retrieve substrates only from those locations in the cassette that contain substrates, as determined from the 3D image. This may help save time on cassette retrieval by avoiding having the substrate handling robot 14 attempt to retrieve substrates from locations in the cassette that do not contain substrates. The substrate handling system may be configured to have the substrate handling robot 14 place substrates only in those locations in the cassette that do not currently contain substrates, as determined from the 3D image. This may help avoid damaging substrates when transferring them to the cassette by avoiding substrates directly overlapping each other.

[0082] In some embodiments, the LIDAR imaging system 26 may be configured to acquire a 3D image of the cassette and determine the position of the substrate in the cassette storage slot, e.g., how far within the storage slot the wafer is positioned. Determining the wafer depth or other measure of wafer position may include identifying the cassette and one or more slots or other storage locations in said cassette, identifying the center of the cassette slot or support, e.g., by using the slot or support locations as points on the circumference and determining the center of the circle, identifying the center of the wafer in the slot, and comparing the location of the center of the cassette support with the location of the center of the wafer.

[0083] The substrate handling system 25 may be configured to cause the substrate handling robot 14 to change the position of the substrate in the cassette slot based on the substrate position or relative position with respect to the cassette support, as determined from the 3D image, thereby avoiding damage to the substrate in the cassette that may be caused by closing the cassette door while the substrate is not fully inserted into the slot in the cassette, which may result in a collision with the door.

[0084] In some embodiments, the lidar imaging system 26 may be configured to acquire a 3D image of the cassette and, based on the 3D image, determine whether any wafers in the cassette are cross-slotted, i.e., whether any wafers are supported by slots or notches that are not in the same horizontal plane. Determining whether a wafer is cross-slotted may include identifying the cassette and slot or wafer support, identifying the wafer in the cassette, determining whether the wafer is horizontal, for example, by generating a line or plane that is collinear with the wafer (e.g., if the image is taken from a side view relative to the plane of the wafer) or coplanar with the wafer, and comparing the line or plane to a reference horizontal line or plane. If the deviation between the wafer's line or plane and the reference line or plane is greater than a predetermined value, the lidar imaging system 26 may classify the wafer as having a cross-slot. The substrate handling system 25 may be configured to have the substrate handling robot 14 remove any cross-slotted wafers and replace them in the cassette with their correct slotted positions.

[0085] In some embodiments, the lidar imaging system 26 may be configured to acquire a 3D image of the cassette and determine the wafer size of the wafers in the cassette based on the 3D image. In some embodiments, the cassette may contain wafers of different sizes, such as one or more 200 mm wafers and one or more 300 mm wafers. It is important to identify which wafers have which size so that the wafers can be processed properly. For example, attempting to place a 300 mm wafer in a substrate holder designed for 200 mm wafers will damage the wafer. Determining the wafer size may include identifying the wafer in the 3D image, obtaining the wafer's outline or identifying one or more points on the wafer's periphery, and determining the wafer's size based on the identified points. For example, if the image is taken from a side-view position where most of the wafer's plane is not visible, determining the wafer's size may include identifying the two extremes of the wafer and determining their separation as the wafer's diameter.

[0086] It will be appreciated that determining the characteristics based on one or more 3D images may include determining the characteristics directly from the one or more 3D images, or may additionally or alternatively include determining the characteristics based on one or more post-processed 3D images, such as filtered images, cropped images, rotated images, or images combined with one or more other 3D images acquired by the LIDAR image acquisition module 27.

[0087] In some embodiments, the lidar imaging system 26 may include multiple lidar image acquisition modules 27, both of which are located on the substrate handling robot 14, but not necessarily on the same element of the substrate handling robot 14, such as an arm or elevator.

[0088] Referring to FIG. 4 , a method according to an embodiment of the present invention is presented. The method is for operating a substrate handling system 25 including a substrate handling robot 14 and a lidar imaging system including a lidar image acquisition module located on the substrate handling robot 14. The method is executable by a control module for controlling the lidar imaging system. The control module includes a processor and a memory storing instructions that, when executed by the processor, cause the control module to perform a method including the following steps: In step S101, the lidar image acquisition module is caused to acquire at least one 3D image of the substrate and / or substrate station. In step S102, one or more characteristics of the substrate and / or substrate station are determined based on the at least one 3D image.

[0089] In some embodiments, the control module may be or include a control module for controlling a substrate handling robot. The control module may include a processor and a memory storing instructions that, when executed by the processor, cause the control module to perform a method including the following steps: In step S201, the substrate handling robot is controlled to adopt a first robot position such that the LIDAR image acquisition module has a first position relative to the substrate and / or substrate station. In step S202, the LIDAR image acquisition module is caused to acquire at least one first 3D image. In step S203, the substrate handling robot is controlled to adopt a second robot position such that the LIDAR image acquisition module has a second position relative to the same substrate and / or substrate station. In step S204, the LIDAR image acquisition module is caused to acquire at least one second 3D image. In step S205, one or more characteristics of the substrate and / or substrate station are determined based on the at least one first 3D image and the at least one second 3D image.

[0090] Step S205 may be modified to include combining at least one first 3D image and at least one second 3D image to form a composite 3D image, and subsequently determining one or more characteristics of the substrate and / or substrate station based on the composite 3D image.

[0091] While illustrative embodiments of the invention have been described above, in part with reference to the accompanying drawings, it should be understood that the invention is not limited to these embodiments. Variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims.

[0092] Throughout this specification, a reference to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification do not necessarily refer to the same embodiment. Furthermore, it is noted that particular features, structures, or characteristics of one or more embodiments may be combined in any suitable manner to form new embodiments not expressly described. The subject matter of the present disclosure includes all novel and non-obvious combinations and subcombinations of the various processes, systems, and configurations, and other features, functions, operations, and / or characteristics disclosed herein, and any and all equivalents thereof. [Explanation of symbols]

[0093] 1 Furnace System 2. Housing 3 Cassette Module 4 Front wall, front side 5 Cassette Storage Carousel 6 Rear wall 6 Back side 7. Cassette Handler 8 Cassette Handler Arm 9 Cassette inlet / outlet port 10 Loading Port 11 Inner wall 12 Processing Module 13 Substrate access opening 14 Substrate transport robot 15 Arm 16 chambers, side walls 17 Side wall 18 Second Reactor 19 Maintenance area 20 End Effector 21 wafers 22 Arm 23 Arm 24 Elevator 25 systems 26 Lidar Imaging System 27 Lidar image acquisition module 28 Control Module 30 Support 31 Base

Claims

1. 1. A substrate handling system comprising: a substrate handling robot for transferring substrates between a plurality of substrate stations; a LIDAR imaging system including a LIDAR image acquisition module located on the substrate handling robot, the LIDAR imaging system configured to acquire at least one 3D image of a substrate and / or a substrate station and to determine one or more properties of the substrate and / or the substrate station based on the at least one 3D image; A substrate handling system comprising:

2. The substrate handling system of claim 1 , wherein the lidar imaging system is configured to acquire at least one 3D image while the substrate handling robot is stationary.

3. 3. The substrate handling system of claim 1 or 2, wherein the LIDAR imaging system is configured to acquire at least one 3D image while the substrate handling robot is operating.

4. 4. The substrate handling system of claim 1, wherein the LIDAR imaging system is configured to acquire a first 3D image of the substrate and / or substrate station from a first relative position and a second 3D image of the same substrate and / or substrate station from a second relative position different from the first relative position, and to determine one or more properties of the same substrate and / or substrate station based on the first 3D image and the second 3D image.

5. 5. The substrate handling system of claim 4, wherein the LIDAR imaging system is configured to combine at least the first 3D image and the second 3D image of the same substrate and / or substrate station to create a composite image, and to determine one or more characteristics of the substrate and / or substrate station based on the composite image.

6. 6. The substrate handling system of claim 1, comprising a substrate handling robot control module configured to receive at least one characteristic determined based on at least one 3D image from the LIDAR imaging system, and to adapt a behavior of the substrate transport robot based on the at least one characteristic.

7. The substrate handling system of any preceding claim, wherein at least one 3D image comprises at least a portion of a substrate, and wherein said characteristics comprise warpage of said substrate.

8. A substrate handling system according to any preceding claim, wherein at least one 3D image comprises at least a portion of the substrate, and wherein said characteristics comprise parameters indicative of damage to the substrate.

9. A substrate handling system according to any preceding claim, wherein at least one 3D image comprises at least a portion of the substrate, and wherein said characteristics comprise a substrate identification code.

10. A substrate handling system according to any preceding claim, wherein at least one 3D image comprises at least a portion of a substrate, and wherein said characteristics comprise a location of a centre of said substrate.

11. A substrate handling system according to any preceding claim, wherein at least one 3D image comprises at least a portion of a boat, and wherein said characteristics comprise parameters indicative of a location of a substrate on said boat.

12. 12. A substrate handling system as described in any one of claims 1 to 11, wherein at least one 3D image includes at least a portion of a boat, and the characteristics include parameters indicative of cross slots occurring in one or more substrates in the boat.

13. A substrate handling system according to any preceding claim, wherein at least one 3D image comprises at least a portion of a boat, and wherein said characteristics comprise a parameter indicative of an orientation of said boat relative to a horizontal plane.

14. A substrate handling system according to any preceding claim, wherein at least one 3D image comprises at least a portion of the boat, and wherein said characteristics comprise parameters indicative of damage to the boat.

15. A substrate handling system according to any preceding claim, wherein at least one 3D image includes at least a portion of a cassette for storing substrates, and wherein the characteristics include parameters indicative of the location of the substrates in the cassette.

16. 16. A substrate handling system according to any preceding claim, wherein at least one 3D image includes at least a portion of a cassette for storing substrates, the cassette having a door, and the characteristics include a parameter indicative of an open or closed state of the door.

17. 17. A substrate handling system according to any preceding claim, wherein at least one 3D image includes at least a portion of a cassette for storing substrates, and wherein the characteristics include parameters indicative of a cross slot occurring in one or more substrates in the cassette.

18. 1. A method of operating a substrate handling system comprising a substrate handling robot and a LIDAR imaging system including a LIDAR image acquisition module located on the substrate handling robot, the method being executable by a control module for controlling the LIDAR imaging system, the control module comprising: a processor; and instructions that, when executed by the processor, cause the control module to execute a method comprising: causing the LIDAR image acquisition module to acquire 3D images of a substrate and / or a substrate station; and determining one or more characteristics of the substrate and / or the substrate station based on the at least one 3D image.

19. The control module is or further comprises a control module for controlling a substrate handling robot, and the instructions stored in memory include: when executed by the processor, controlling the substrate handling robot to adopt a first robot position such that the LIDAR image acquisition module has a first position relative to a substrate and / or substrate station; causing the LIDAR image acquisition module to acquire at least one first 3D image; and controlling the substrate handling robot to adopt a second robot position such that the LIDAR image acquisition module has a second position relative to the same substrate and / or substrate station; causing the LIDAR image acquisition module to acquire at least one second 3D image; and determining one or more characteristics of the substrate and / or the substrate station based on the at least one first 3D image and the at least one second 3D image; The method of claim 18 , wherein the control module performs a method comprising:

Images