RFID label and method of using the same

Abstract

To provide an RFID label formed by printing information on a body to be stuck, configured to allow the RFID label with updated information to be read while invalidating information before update.SOLUTION: An RFID label includes: a first substrate equipped with an RFID antenna and an IC chip connected to the RFID antenna; a second substrate stuck on one surface of the first substrate with a lamination adhesive layer; and an adhesive layer for a body to be stuck arranged on the other surface of the first substrate. The RFID label includes a non-adhesive section formed in at least a part of the adhesive layer for a body to be stuck, and a pair of cut lines formed from one side to the other side of the RFID label in positions overlapping the non-adhesive section. A part of the RFID antenna including the IC chip is located between the pair of cut lines.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to RFID labels and methods of using RFID labels. [Background technology]

[0002] Conventionally, a method of using labels has been proposed in which, when information relating to an object to be adhered is updated or added to a label that has information pre-printed on it, a label with the updated information printed on it is affixed over the label already affixed to the object to render the information printed on the label already affixed to the object unusable (see Patent Document 1).

[0003] In Patent Document 1, a label with a printed barcode containing updated information is attached to an already attached label so as to cover the printed barcode, making the barcode on the already attached label unreadable, thereby enabling information about the adherend to be updated. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-98494 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, RFID media such as RFID tags and RFID labels that support RFID (Radio Frequency Identification) technology, which sends and receives information via contactless communication from IC chips containing product-related and identification information, have become widespread in fields such as product manufacturing, management, and distribution.

[0006] RFID labels are read using non-contact communication. Therefore, when the label usage method described in Patent Document 1 is applied to RFID labels, multiple RFID labels will be present on the adherend, and it may be impossible to read any of the RFID labels, or information from an undesired RFID label may be read.

[0007] Therefore, an object of the present invention is to make it possible to read an RFID label containing updated information by making the information before the update unusable when the information on the RFID label is updated, for example, on an RFID label printed with information relating to the adherend. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided an RFID label comprising a first substrate having, on one surface thereof, an RFID antenna and an IC chip connected to the RFID antenna, and a second substrate attached to one surface of the first substrate via a laminating adhesive layer, wherein the RFID label has an adhesive portion consisting of an adhesive layer for an adherend provided on the other surface of the first substrate, a non-adhesive portion where the adhesive layer for an adherend is not located, and a pair of perforations formed from one side of the RFID label to the other side at a position overlapping the non-adhesive portion, and wherein a part of the RFID antenna including the IC chip is located between the pair of perforations. [Effects of the Invention]

[0009] According to the present invention, the RFID label is torn along a pair of perforations, progressing from one side of the RFID label to the other side, thereby breaking a portion of the RFID antenna including the IC chip located between the pair of perforations, and cutting off the non-adhesive portion. Therefore, when an RFID label has information about an adherend printed on it and the information is updated, the previous information can be made unusable. Furthermore, even when an RFID label containing updated information is affixed to an adherend, the updated information can be read. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a plan view of a continuous RFID label body in which RFID labels according to the present embodiment are temporarily attached in succession to a long strip-shaped separator, as viewed from the front side. [Figure 2] FIG. 2 is an enlarged plan view of one of the RFID labels shown in FIG. 1. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III shown in FIG. [Figure 4] FIG. 2 is a plan view of the RFID label after it has been peeled off the separator, viewed from the side where it is attached to the adherend. [Figure 5] 10A and 10B are schematic diagrams illustrating the operation of cutting off a separated portion of a first RFID label attached to a test tube. [Figure 6] FIG. 10 is a schematic diagram illustrating a state in which a detached portion of a first RFID label attached to a test tube has been cut off. [Figure 7] 10 is a schematic diagram illustrating the operation of attaching a second RFID label to a test tube to which a first RFID label with a separation portion cut off has been attached. FIG. [Figure 8] FIG. 10 is a schematic diagram illustrating a state in which a second RFID label is attached to and overlaps a first RFID label from which a separation portion has been cut off. [Figure 9] 1A to 1C are schematic diagrams illustrating application examples of an RFID label according to an embodiment of the present invention. [Figure 10] FIG. 10 is a plan view of an RFID label according to a first modified example, viewed from the front side. [Figure 11] FIG. 10 is a plan view of an RFID label according to a second modified example, viewed from the front side. [Figure 12] FIG. 11 is a plan view of an RFID label according to a third modified example, viewed from the front side. [Figure 13] FIG. 11 is a plan view of an RFID label according to a fourth modified example, viewed from the front side. [Figure 14] FIG. 11 is a plan view of an RFID label according to a fifth modified example, viewed from the front side. [Figure 15]FIG. 13 is a plan view of an RFID label according to a sixth modified example, viewed from the front side. [Figure 16] FIG. 10 is a cross-sectional view illustrating an RFID label according to another embodiment of the present invention. [Figure 17] FIG. 17 is a cross-sectional view illustrating a modified example of the RFID label shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] [RFID label] An RFID label 1 according to an embodiment of the present invention will be described.

[0012] Fig. 1 is a plan view, seen from the front side, of a continuous RFID label strip 10 in which RFID labels 1 according to this embodiment are successively temporarily attached to a long strip-shaped separator S. Fig. 2 is an enlarged plan view showing one RFID label 1. Fig. 2 shows a cutaway view of a label substrate 30.

[0013] Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2. Fig. 4 is a plan view of the RFID label 1 after it has been peeled off the separator S, seen from the side of the surface to be attached to an adherend.

[0014] As shown in Fig. 1, the RFID label continuum 10 has a plurality of RFID labels 1 arranged on a long strip-shaped separator S. The plurality of RFID labels 1 are arranged in the longitudinal direction of the separator S (the Y direction shown in Fig. 1).

[0015] The RFID label 1 is an RFID label comprising a first substrate having an RFID antenna and an IC chip connected to the RFID antenna, a second substrate attached to one surface of the first substrate via a laminating adhesive layer, and an adherend adhesive layer provided on the other surface of the first substrate. As shown in Fig. 3, the RFID label 1 is formed by bonding an RFID inlay 20 as the first substrate and a label substrate 30 as the second substrate together with a laminating adhesive layer A1. In the RFID label 1, an adherend adhesive layer A2 is provided on the side of the RFID inlay 20 opposite to the side to which the label substrate 30 is attached, and is temporarily attached to a separator S.

[0016] The RFID inlay 20 includes an inlay substrate 21, an antenna pattern 22 which is an RFID antenna formed on the inlay substrate 21, and an IC chip 23 connected to the antenna pattern 22. In this embodiment, the antenna pattern 22 is formed from metal foil. The antenna pattern 22 may also be formed by printing. FIG. 3 shows an example in which a label substrate 30 is disposed on the surface of the inlay substrate 21 on which the antenna pattern 22 is formed. The antenna pattern 22 may also be disposed on the surface opposite to the surface on which the label substrate 30 is disposed.

[0017] The inlay substrate 21 may be, for example, a single resin film such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, or polyethylene naphthalate, or a multilayer film formed by laminating a plurality of these resin films.

[0018] In this embodiment, the inlay substrate 21 may be the above-mentioned resin film substrate, or a paper substrate such as high-quality paper, medium-quality paper, or coated paper formed using these.

[0019] In this embodiment, the inlay substrate 21 may have a thickness of 10 μm to 200 μm.

[0020] As shown in Figures 1 and 2, the antenna pattern 22 includes a loop portion 210 on which an IC chip 23 is mounted, meanders 211 and 212 extending symmetrically from the loop portion 210 in the width direction of the RFID label 1 (X direction), and capacitor hats 213 and 214 connected to the ends of the meanders 211 and 212.

[0021] In this embodiment, the antenna pattern 22 is, for example, a UHF band RFID antenna designed to have an antenna length and antenna wire width compatible with the UHF band (300 MHz to 3 GHz, particularly 860 MHz to 960 MHz).

[0022] In addition, although not shown, the antenna pattern 22 is adhered to the inlay substrate 21 by a laminating adhesive layer made of an adhesive or bonding agent such as an acrylic, urethane, silicone, or rubber-based adhesive.

[0023] The antenna pattern 22 is made of metal foil. Examples of metals that can be used for the antenna pattern 22 include copper and aluminum. In this embodiment, aluminum foil is used in order to reduce manufacturing costs.

[0024] The thickness of the metal foil is preferably 3 μm or more and 50 μm or less from the viewpoint of the overall thickness of the RFID inlay 20 or the thickness of the RFID label 1, manufacturing costs, etc. In this embodiment, as an example, an aluminum foil having a thickness of 20 μm is used.

[0025] The IC chip 23 is a semiconductor package that is compatible with the UHF band and is designed to be capable of communicating with a reader (not shown) that is a reading device for the IC chip 23.

[0026] Although not shown, the IC chip 23 is electrically and mechanically connected to a part of the loop portion 210 of the antenna pattern 22 by an anisotropic conductive material such as an anisotropic conductive adhesive or an anisotropic conductive film.

[0027] 2 and 3, in the RFID label 1, the label substrate 30 is attached to the surface of the inlay substrate 21 on the side of the antenna pattern 22 on which the IC chip 23 is mounted, using an adhesive layer A1 for lamination. The adhesive layer A1 for lamination serves to laminate the label substrate 30 to the RFID inlay 20.

[0028] 3, the surface of the inlay substrate 21 opposite to the surface on which the IC chip 23 is mounted is temporarily attached to a separator S by an adhesive layer A2 for an adherend. The RFID label 1 is peeled off from the separator S and attached to the adherend by the adhesive layer A2 for an adherend.

[0029] In this embodiment, the pressure-sensitive adhesive layer A2 for an adherend is a frozen adhesive that maintains its adhesive strength by maintaining its flexibility even in a low-temperature environment.

[0030] The RFID label 1 has a non-adhesive portion 44 formed in a portion of the adhesive layer A2 for an adherend, and a perforation line 41 formed from one side to the other side of the RFID label 1 at a position overlapping the non-adhesive portion 44. The perforation line 41 has a pair of perforation lines 41a, 41b, and is formed so that a portion of the RFID antenna (loop portion 210) including the IC chip 23 is located between the pair of perforation lines 41a, 41b. In this embodiment, the perforation line 41 further has a perforation line 41c on the other side of the RFID label 1 that connects the ends of the perforation lines 41a, 41b, and together with the perforation lines 41a, 41b, defines a portion of the RFID label 1 including the entire loop portion 210 (hereinafter referred to as the separated portion 40).

[0031] In this embodiment, the perforation line 41 is a so-called perforation having a cut portion (cut portion) of a predetermined length and a non-cut portion (uncut portion). Figures 1 to 3 illustrate the perforation line 41 for clarity and do not precisely illustrate the details, but the perforation line 41 is formed so that the cut portion does not overlap the antenna pattern 22 so as not to impair the function of the antenna pattern 22. Furthermore, as shown in Figure 3, the perforation line 41 is formed to penetrate the label substrate 30, the laminating adhesive layer A1, the inlay substrate 21, and the adherend adhesive layer A2, but does not penetrate the separator S.

[0032] In this embodiment, the cutoff line 41 is formed in a U-shape that opens on one of a pair of opposing sides in the Y direction that intersects with the width direction of the RFID label 1.

[0033] The straight portions of the cutoff line 41 are formed so as to pass between the loop portion 210 and the meander 211 and between the loop portion 210 and the meander 212 .

[0034] In the separated portion 40 defined by the cut line 41, recesses 42 and 43 are formed in the portion that forms the outer edge of the RFID label 1 in the Y direction of the RFID label 1, recessed toward the inside of the RFID label 1. The recesses 42 and 43 are formed by curves that bulge outward from the RFID label 1.

[0035] 4, a non-adhesive portion 44 is formed in a part of the pressure-sensitive adhesive layer A2 for an adherend in a separated portion 40 defined by a cut line 41. In this embodiment, the non-adhesive portion 44 can be formed by printing or applying a medium, varnish, or the like to the surface of the pressure-sensitive adhesive layer A2 for an adherend, thereby causing the pressure-sensitive adhesive layer A2 for an adherend to lose its adhesiveness.

[0036] In this embodiment, the separated portion 40 is formed so that the adhesive layer A2 for the adherend is exposed in a part other than the region where the non-adhesive portion 44 is formed. As shown in Fig. 4, by leaving the adhesive region 45 in the separated portion 40, the separated portion 40 separated from the RFID label 1 can be attached to another adherend.

[0037] <Effects> The RFID label 1 having the above configuration has a non-adhesive portion 44 in part of the adhesive layer A2 for the adherend, and a separation portion 40 defined by a cut line 41 so as to include the entire loop portion 210 is formed in the non-adhesive portion 44. This makes it easy to separate the separation portion 40 from the RFID label 1 after it has been attached to the adherend.

[0038] Furthermore, since the separation portion 40 including the entire loop portion 210 is divided by the cut line 41, when the separation portion 40 is separated, the IC chip 23 connected to the loop portion 210 is also separated along with the loop portion 210.

[0039] Therefore, when the RFID label 1 is used with information about the adherend printed thereon, by separating the separation portion 40, it becomes impossible to read the information from the RFID label 1 that remains on the adherend via non-contact communication using RFID.

[0040] Furthermore, in the separated portion 40, recesses 42 and 43 that are recessed toward the inside of the RFID label 1 are formed in the portion that forms the outer edge of the RFID label 1. This makes it easier for the user to pick up the separated portion 40 and cut it off easily.

[0041] Furthermore, when a frozen adhesive is used as the adhesive layer for the adherend, as in the present embodiment, peeling off the RFID label is difficult and the peeling process is cumbersome. In contrast, with the RFID label 1 according to the present embodiment, part of the detachable portion 40 is not attached to the adherend, making it easy to peel off the detachable portion 40 from the RFID label 1.

[0042] Furthermore, in this embodiment, the adhesive region 45 remains in a portion of the separated portion 40 other than the region where the non-adhesive portion 44 is formed. Therefore, the separated portion 40 separated from the RFID label 1 can be attached to another adherend and used. The separated portion 40 includes the entire loop portion 210 to which the IC chip 23 is connected, enabling contactless communication using RFID. Therefore, for example, the separated portion 40 separated from the RFID label 1 can be attached to a management document or ledger for storage or use for management purposes, separate from the adherend to which the RFID label 1 is attached.

[0043] [How to use RFID labels] Next, a method of using the RFID label 1 will be described.

[0044] 5 to 8 are diagrams illustrating how to use the RFID label 1 when a test tube P is used as the adherend.

[0045] FIG. 5 is a schematic diagram illustrating the operation of cutting off the detached portion 40A of the first RFID label 1A attached to the test tube P, and FIG. 6 is a schematic diagram illustrating the state after the detached portion 40A of the first RFID label 1A attached to the test tube P has been cut off.

[0046] Fig. 7 is a schematic diagram illustrating the operation of attaching a second RFID label 1B to a test tube P to which a first RFID label 1A with its detachable portion 40A cut off has been attached. Fig. 8 is a schematic diagram illustrating the state in which the second RFID label 1B has been attached and superimposed on the first RFID label 1A with its detachable portion 40A cut off.

[0047] It should be noted that the first RFID label 1A and the second RFID label 1B are both labels having the same structure as the RFID label 1 described above.

[0048] In a method of using the RFID label 1 according to this embodiment, as shown in FIGS. 5 and 6, the detached portion 40A of the first RFID label 1A attached to the test tube P is detached.

[0049] 7, a second RFID label 1B is affixed to the test tube P to which the first RFID label 1A has been affixed, from which the separation portion 40A has been separated. Here, as an example, updated information is written to the second RFID label 1B from the information recorded in the IC chip of the first RFID label 1A.

[0050] In this embodiment, as shown in FIG. 8, when the second RFID label 1B is attached to the test tube P, the outer edge of the second RFID label 1B and the outer edge of the first RFID label 1A are attached so as to overlap each other.

[0051] In this embodiment, as described above, the first RFID label 1A and the second RFID label 1B are attached in an overlapping manner, so that the visibility of the inside of the test tube P is not impaired.

[0052] Furthermore, since the positions of the meanders 211, 212 and the capacitor hats 213, 214 can be overlapped between the first RFID label 1A and the second RFID label 1B, a boost effect that amplifies the radio wave sensitivity of the second RFID label 1B can be obtained in some cases.

[0053] As another attachment method, the second RFID label 1B and the first RFID label 1A may be attached to the test tube P with the second RFID label 1B and the first RFID label 1A being shifted from each other in the longitudinal direction when the second RFID label 1B is attached to the test tube P. This may provide a boost effect.

[0054] The second RFID label 1B and the first RFID label 1A may be attached with a shift in the short-side direction, which may provide a boost effect.

[0055] Fig. 9 is a schematic diagram illustrating an application example of the RFID label 1 according to this embodiment. Fig. 9 shows RFID labels 1A and 1B on which information for identifying an adherend is printed.

[0056] A barcode 100A for identifying the RFID label 1A, a two-dimensional code 101A, and character information 102A corresponding to these codes are printed on the RFID label 1A. In addition, character information 103A linked to the character information 102A is printed on the separated portion 40A of the RFID label 1A.

[0057] Furthermore, a barcode 100B for identifying the RFID label 1B, a two-dimensional code 101B, and character information 102B corresponding to these codes are printed on the RFID label 1B. Furthermore, character information 103B linked to the character information 102B is printed on the separated portion 40B of the RFID label 1B.

[0058] As described with reference to Figures 5 to 8, such RFID labels 1A and 1B can be prepared by first attaching the RFID label 1A to a test tube P. Then, when it becomes necessary to change the information stored in the IC chip 23 of the RFID label 1A, the separation portion 40A is cut off to make the information stored in the IC chip 23 before the update unreadable, and then a second RFID label 1B storing the updated information is attached to the test tube P.

[0059] This prevents confusion with old information even when it becomes necessary to update the information for identifying the test tube P. It also prevents the IC chip 23 from becoming unreadable due to mutual interference caused by multiple RFID labels 1A, 1B being attached.

[0060] [RFID label variations] 10 is a plan view of the RFID label 2 according to the first modification, viewed from the front side. In the RFID label 2, the end 61 constituting the outer edge of the detachable portion 51 is formed in a triangular shape. This makes it easy for the user to grasp the detachable portion 51 and therefore to tear off the detachable portion 51.

[0061] 11 is a plan view of an RFID label 3 according to a second modification, viewed from the front side. In the RFID label 3, the end 62 that forms the outer edge of the detachable portion 52 is formed in a trapezoidal shape. This makes it easy for a user to grasp the detachable portion 52, and therefore, the detachable portion 52 can be easily cut off.

[0062] 12 is a plan view of an RFID label 4 according to a third modified example, viewed from the front side. In the RFID label 4, an end 63 that forms the outer edge of the RFID label 4 in the separation portion 53 is formed to protrude outward from the RFID label 4 beyond the side of the RFID label 4 that is adjacent to the separation portion 53. This makes the separation portion 53 even easier for the user to grasp, and therefore allows the user to easily tear off the separation portion 53.

[0063] 13 is a plan view of an RFID label 5 according to a fourth modified example, viewed from the front side. In the RFID label 5, a cut line 64 is formed across the RFID label 5 in the Y direction. In the RFID label 5, such a cut line 64 makes it easy to cut off the separation portion 54.

[0064] 14 is a plan view of an RFID label 6 according to a fifth modified example, viewed from the front side. The RFID label 6 has a pair of perforations 141, 142 extending from one side, where the recesses 42, 43 are formed, to the other side of the RFID label 6. In this modified example, the end points of the pair of perforations 141, 142 are located beyond a part of the antenna pattern 22 extending from the loop portion 210 to which the IC chip 23 is connected, and the loop portion 210 to which the IC chip 23 is connected is positioned between the pair of perforations 141, 142.

[0065] According to the RFID label 6 of the fifth modified example, even if the separation portion 40 is not defined by a cut line, the user can cut off the separation portion 40 by cutting the RFID label 6 from the end points of the pair of cut lines 141, 142 toward the other side, thereby cutting off the separation portion 40.

[0066] 15 is a plan view of an RFID label 7 according to a sixth modified example, viewed from the front side. The RFID label 7 has a pair of cut lines 241, 242 extending from one side, where the recesses 42, 43 are formed, to the other side of the RFID label 7. In this modified example, the end points of the pair of cut lines 241, 242 are located in front of a part of the antenna pattern 22 extending from the loop portion 210 to which the IC chip 23 is connected.

[0067] According to the RFID label 7 of the sixth modification, it is not necessary to take care to ensure that the cut portion of the perforation passing through the antenna pattern 22 does not overlap the antenna pattern 22. According to the RFID label 7, when the user cuts off the separation portion 40, the RFID label 7 breaks from the end points of the pair of cutting lines 241, 242 toward the other side, thereby dividing the antenna pattern 22 and cutting off the separation portion 40.

[0068] FIG. 16 is a cross-sectional view illustrating an RFID label 8 according to another embodiment of the present invention.

[0069] 16 has a layer structure different from that of the RFID label 1. That is, in the RFID label 8, the inlay substrate 21 of the RFID inlay 20 also serves as the label substrate 30 of the RFID label 1. In the RFID label 8, a separator S is temporarily attached to the surface on which the antenna pattern 22 is formed via an adhesive layer A2 for an adherend.

[0070] In this way, the layer structure that constitutes the RFID label can be changed as appropriate.

[0071] For example, when the RFID label 8 is applied to a printer using a thermal head and a platen roller, the IC chip 23 is configured to face the platen roller, thereby suppressing the impact on the IC chip 23 caused by the thermal head coming into contact with the RFID label 8.

[0072] Furthermore, since the RFID label 8 has the adhesive layer A2 for an adherend laminated on the surface on which the antenna pattern 22 is formed, the IC chip 23 portion of the second RFID label 1B fits within the thickness of the first RFID label 1A when used in the manner described with reference to Figures 5 to 8. Therefore, when the second RFID label 1B is attached in an overlapping state, protrusion of the second RFID label 1B can be suppressed.

[0073] [Other embodiments] Although the embodiments of the present invention have been described above, the above embodiments merely illustrate some of the application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above embodiments.

[0074] In this embodiment, the entire area of the separated portion 40 may be the non-adhesive portion 44. The non-adhesive portion 44 can also be realized by not applying the adhesive layer A2 for the adherend to the corresponding area on the back side of the inlay substrate 21, that is, by performing a so-called "glue-free processing."

[0075] In this embodiment, the first RFID label 1A and the second RFID label 1B are attached to the same position on the test tube P. However, if visibility of the inside of the test tube P is required, the two labels may be attached at positions offset from each other as long as this visibility is not impaired.

[0076] In this embodiment, if visibility of the inside of the test tube P is not required, both may be attached to the same test tube P in positions that do not overlap.

[0077] In this embodiment, marks may be printed on the surfaces of the RFID labels 1 to 8 to guide the attachment positions when the RFID labels 1 to 8 are attached one on top of another.

[0078] In this embodiment, the case where the antenna pattern 22 is an RFID antenna for a UHF band inlet has been described, but it may also be an RFID antenna for a microwave band.

[0079] In this embodiment, the case where the adherend is a test tube P has been described, but the adherend is not limited to the test tube P. In addition to the test tube, the adherend may be a bag, a box, or the like.

[0080] The RFID label 1 may be a linerless label in which a release agent layer is provided on the surface of the label substrate 30. In this case, the separator S may be unnecessary.

[0081] An RFID label 9 shown in Fig. 17 is a cross-sectional view illustrating a further modification of the RFID label 8 shown in Fig. 16. In the modification shown in Fig. 17, an adhesive paper made of a label substrate 70 as a second substrate and a laminating adhesive layer A3 is laminated on the side opposite to the side on which the antenna pattern 22 of the RFID label 8 shown in Fig. 16 is formed. After the RFID label 9 is attached to an adherend, the separation portion 40 can be easily separated from the RFID label 9. [Explanation of symbols]

[0082] 1,1A,1B,2,3,4,5,6,7,8,9 RFID labels 10 RFID Label Continuum 20 RFID inlays 21 Inlay substrate 22 Antenna Pattern 23 IC chip 30,70 Label base material 40,40A,40B separation part 41,41a,41b,41c Cutting line 42,43 Recess 44 Non-adhesive part 45 Adhesive area 50 Separation part 51,52,53,54 Separated part 61, 62, 63 End 64 Cutting line 100A, 100B barcode 101A, 101B two-dimensional code 102A, 102B, 103A, 103B Text information 141,142 Cutting line 210 Loop section 211,212 Meander 213,214 Capacitor Hat 241,242 Cutting line A1, A3 adhesive layer for lamination A2 Adhesive layer for adherend

Claims

1. An RFID label comprising: a first substrate having an RFID antenna and an IC chip connected to the RFID antenna on one surface thereof; and a second substrate attached to one surface of the first substrate via a pressure-sensitive adhesive layer for lamination, The RFID label comprises: a pressure-sensitive adhesive portion comprising a pressure-sensitive adhesive layer for an adherend provided on the other surface of the first base material, and a non-adhesive portion not provided with the pressure-sensitive adhesive layer for an adherend; a pair of perforations formed from one side of the RFID label to the other side at positions overlapping the non-adhesive portion, a part of the RFID antenna including the IC chip is located between a pair of the perforation lines; RFID label.

2. 2. The RFID label of claim 1, the RFID antenna has a loop portion to which the IC chip is connected, the pair of perforations, together with a perforation line connecting the ends of each of the pair of perforations on the other side, define a part of the RFID label including the entire loop portion; RFID label.

3. 3. The RFID label according to claim 1, The cut line is a perforation having a cut portion of a predetermined length and a non-cut portion, and the cut portion is formed so as not to overlap the RFID antenna. RFID label.

4. 4. The RFID label according to claim 1, the pressure-sensitive adhesive layer for an adherend and a separator are laminated in this order on a surface of the first substrate on the RFID antenna side; RFID label.

5. 3. The RFID label according to claim 2, The RFID antenna is The capacitor includes the loop portion, a meander having one end connected to the loop portion and extending from the loop portion, and capacitor hats connected to the meanders, RFID label.

6. 6. The RFID label according to claim 5, The tear line is formed between the loop portion and the meander. RFID label.

7. 7. The RFID label according to claim 1, a recess recessed toward the inside of the RFID label is formed at the position of the cut line on the one side; RFID label.

8. 8. The RFID label according to claim 1, The pressure-sensitive adhesive layer for an adherend is formed from a frozen adhesive that is suitable for low-temperature environments. RFID label.

9. 9. The RFID label according to claim 1, The RFID antenna is a UHF band RFID antenna. RFID label.

10. An RFID label comprising a first substrate having an RFID antenna and an IC chip connected to the RFID antenna, and a pressure-sensitive adhesive layer for an adherend on a surface of the first substrate facing the RFID antenna, The RFID label comprises: an adhesive portion formed of the adhesive layer for an adherend and provided on a surface of the first substrate on the RFID antenna side, and a non-adhesive portion not provided with the adhesive layer for an adherend; a pair of perforations formed from one side of the RFID label to the other side at positions overlapping the non-adhesive portion, a part of the RFID antenna including the IC chip is located between a pair of the perforation lines; RFID label.

11. 11. The RFID label of claim 10, the RFID antenna has a loop portion to which the IC chip is connected, the pair of perforations, together with a perforation line connecting the ends of each of the pair of perforations on the other side, define a part of the RFID label including the entire loop portion; RFID label.

12. 12. The RFID label according to claim 10 or 11, The cut line is a perforation having a cut portion of a predetermined length and a non-cut portion, and the cut portion is formed so as not to overlap the RFID antenna. RFID label.

13. 12. The RFID label of claim 11, The RFID antenna is The capacitor includes the loop portion, a meander having one end connected to the loop portion and extending from the loop portion, and capacitor hats connected to the meanders, RFID label.

14. 14. The RFID label of claim 13, The tear line is formed between the loop portion and the meander. RFID label.

15. 15. The RFID label according to claim 10, a recess recessed toward the inside of the RFID label is formed at the position of the cut line on the one side; RFID label.

16. 16. The RFID label according to any one of claims 10 to 15, The pressure-sensitive adhesive layer for an adherend is formed from a frozen adhesive that is suitable for low-temperature environments. RFID label.

17. 17. The RFID label according to any one of claims 10 to 16, The RFID antenna is a UHF band RFID antenna. RFID label.

18. 1. A method of using an RFID label, comprising: The RFID label comprises: An RFID label comprising: a first substrate having an RFID antenna and an IC chip connected to the RFID antenna; and a pressure-sensitive adhesive layer for an adherend provided on the first substrate, the pressure-sensitive adhesive layer for an adherend having a non-adhesive portion formed on at least a portion of the pressure-sensitive adhesive layer for an adherend; and a pair of perforations formed from one side of the RFID label toward the other side at a position overlapping the non-adhesive portion, wherein a portion of the RFID antenna including the IC chip is located between the pair of perforations, Separating the portion of the first RFID label that is cut along the pair of cutting lines from the first RFID label attached to the adherend; a second RFID label is attached to the first RFID label from which the part has been separated; How to use RFID labels.

19. 20. A method of using the RFID label of claim 18, comprising: When the second RFID label is attached to the adherend, the second RFID label is attached so that an outer edge of the second RFID label overlaps an outer edge of the first RFID label. How to use RFID labels.

20. 10. The RFID label according to claim 1, a separation portion defined by the pair of perforation lines and a perforation line connecting the ends of the pair of perforation lines, the pressure-sensitive adhesive layer for an adherend is disposed on a part of the separation portion on the side of the cut lines connecting the ends of the pair of cut lines; RFID label.

21. 21. The RFID label of claim 20, The non-adhesive portion is formed to extend outside the pair of cut lines in the separation portion. RFID label.

22. 18. The RFID label according to any one of claims 10 to 17, a separation portion defined by the pair of perforations and a perforation line connecting the ends of the pair of perforations, the pressure-sensitive adhesive layer for an adherend is disposed on a part of the separation portion on the side of the cut lines connecting the ends of the pair of cut lines; RFID label.

23. 23. The RFID label of claim 22, The non-adhesive portion is formed to extend outside the pair of cut lines in the separation portion. RFID label.

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