Electronic components and manufacturing method thereof

Abstract

To provide an electronic component that allows easy determination of the product orientation.SOLUTION: A coil component 100 includes a magnetic body 10 and a coil portion 20 embedded in the magnetic body 10, with one end 21 having surfaces 31A to 33A exposed on a mounting surface 11 and surfaces 31B to 33B exposed on a side surface 12, and the other end 22 having surfaces 41A to 44A exposed on the mounting surface 11 and surfaces 41B to 44B exposed on a side surface 13. The planar shapes of the surfaces 31A to 33A and the surfaces 41A to 44A are asymmetric with respect to each other, and the planar shapes of the surfaces 31B to 33B and the surfaces 41B to 44B are asymmetric with respect to each other.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to electronic components and methods for manufacturing the same. [Background technology]

[0002] Patent Document 1 discloses a chip-type electronic component having an orientation mark on its upper surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7131711 Summary of the Invention [Problem to be solved by the invention]

[0004] The electronic component disclosed in Patent Document 1 has a symmetrical appearance, and therefore it is sometimes not easy to determine the position where the orientation mark should be formed during manufacturing.

[0005] The present disclosure describes an electronic component that allows easy determination of product orientation and a method for manufacturing the same. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present disclosure comprises a magnetic base body having a mounting surface, a first side surface perpendicular to the mounting surface, and a second side surface located opposite the first side surface; and a coil section embedded in the magnetic base body, the coil section having one end having a first surface exposed to the mounting surface and a third surface exposed to the first side surface, and the other end having a second surface exposed to the mounting surface and a fourth surface exposed to the second side surface, the mounting surface, the first side surface, and the second side surface are all parallel to the coil axis direction of the coil section, the planar shapes of the first surface and the second surface are asymmetrical with respect to each other, and the planar shapes of the third surface and the fourth surface are asymmetrical with respect to each other.

[0007] A method for manufacturing an electronic component according to one aspect of the present disclosure includes the steps of: preparing an electronic component comprising: a magnetic body having a mounting surface and an upper surface opposite the mounting surface; and a coil portion embedded in the magnetic body, the coil portion having a first surface with one end exposed to the mounting surface and a second surface with the other end exposed to the mounting surface, the planar shapes of the first surface and the second surface being asymmetrical with respect to each other; and passing the electronic component between a first roller and a second roller so that the mounting surface contacts the first roller and the upper surface contacts the second roller; applying first and second external connection terminals to the first and second surfaces, respectively, using the first roller, and applying a directionality mark to the upper surface using the second roller. [Effects of the Invention]

[0008] According to the present disclosure, an electronic component and a method for manufacturing the same that allow the orientation of the product to be easily determined are provided. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic perspective view showing the appearance of an electronic component (coil component) 100 according to an embodiment of the technology disclosed herein. [Figure 2] FIG. 2 is a schematic cross-sectional view of the coil device 100. [Figure 3] Figures 3(a), (c), (e), and (g) are schematic plan views showing the planar shapes of the conductor layers L1 to L4, respectively, and Figures 3(b), (d), (f), and (h) are schematic plan views showing the planar shapes of the insulating layers 51 to 54, respectively. [Figure 4] FIG. 4 is a schematic plan view showing the structure of the mounting surface 11 of the magnetic base body 10. As shown in FIG. [Figure 5] FIG. 5 is a schematic plan view showing the structure of the side surface 12 of the magnetic body 10. As shown in FIG. [Figure 6] FIG. 6 is a schematic plan view showing the structure of the side surface 13 of the magnetic body 10. As shown in FIG. [Figure 7] FIG. 7 is a schematic plan view showing the structure of the top surface 14 of the magnetic body 10. As shown in FIG. [Figure 8]FIG. 8 is a schematic plan view showing a state in which external connection terminals 61 and 62 are formed on the mounting surface 11 of the magnetic body 10. As shown in FIG. [Figure 9] FIG. 9 is a schematic perspective view of the carrier tape 110. As shown in FIG. [Figure 10] FIG. 10 is a YZ plan view showing a state in which the coil component 100 is held in the opening 111 of the carrier tape 110. As shown in FIG. [Figure 11] FIG. 11 is an XZ plan view showing a state in which the coil component 100 is held in the opening 111 of the carrier tape 110. As shown in FIG. [Figure 12] FIG. 12 is a schematic diagram for explaining the state in which the carrier tape 110 has passed between the roller 120 and the roller 130. As shown in FIG. [Figure 13] FIG. 13 is an XY plan view for explaining the structure of the rollers 120 and 130 in more detail. [Figure 14] FIG. 14 is a plan view showing the structure of the mounting surface 11 according to the first modified example. [Figure 15] FIG. 15 is a plan view showing the structure of the mounting surface 11 according to the second modified example. [Figure 16] FIG. 16 is a plan view showing the structure of the mounting surface 11 according to the third modified example. [Figure 17] FIG. 17 is a plan view showing the structure of the mounting surface 11 according to the fourth modified example. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0011] 1 is a schematic perspective view showing the appearance of an electronic component (coil component) 100 according to an embodiment of the technology disclosed herein. FIG. 2 is a schematic cross-sectional view of the coil component 100.

[0012] The coil component 100 according to this embodiment is a surface-mount chip component that can be used as an inductor for a power supply circuit, and in the example shown in FIG. 1, comprises a magnetic base body 10 and a coil portion 20 embedded in the magnetic base body 10.

[0013] The magnetic element 10 may be made of a composite magnetic material in which magnetic particles made of a high-permeability material such as ferrite or permalloy are bound with a resin binder. The magnetic element 10 has a mounting surface 11 and a top surface 14 that form an XZ plane and are located opposite each other, side surfaces 12 and 13 that form a YZ plane and are located opposite each other, and side surfaces 15 and 16 that form an XY plane and are located opposite each other. The coil axis direction of the coil portion is the Z direction, and the mounting surface 11, side surfaces 12 and 13, and top surface 14 are all parallel to the coil axis direction. One end 21 of the coil portion is exposed from the mounting surface 11 and the side surface 12. The other end 22 of the coil portion is exposed from the mounting surface 11 and the side surface 13.

[0014] In the example shown in FIG. 2, the coil section 20 embedded in the magnetic base body 10 has a configuration in which insulating layers 50-54 and conductor layers L1-L4 are alternately stacked. The conductor layers L1-L4 are connected to each other via through holes formed in the insulating layers 51-53 to form a single coil. The conductor layers L1-L4 are made of a good conductor such as Cu. The insulating layers 50-54 are made of, for example, resin, and at least the insulating layers 51-53 are made of a non-magnetic material. The insulating layer 50 located at the bottom and the insulating layer 54 located at the top may be made of a magnetic material.

[0015] The conductor layer L1 is the first conductor layer formed on the insulating layer 50. The planar shape of the conductor layer L1 is shown in FIG. 3(a). Note that line AA in FIG. 3(a) indicates the cross-sectional position in FIG. 2, and symbol B indicates the product area that will ultimately become the coil component 100. The conductor layer L1 is provided with a coil conductor pattern C1 that is wound spirally for approximately two turns, and two electrode patterns 31 and 41. The electrode pattern 31 is connected to one end of the coil conductor pattern C1, while the electrode pattern 41 is provided independently of the coil conductor pattern C1. The electrode pattern 31 is exposed from the magnetic body 10, and its surface forms one end 21 of the coil section 20. The electrode pattern 41 is also exposed from the magnetic body 10, and its surface forms the other end 22 of the coil section 20.

[0016] The conductor layer L2 is a second conductor layer formed on the upper surface of the conductor layer L1 with an insulating layer 51 interposed between them. The planar shape of the insulating layer 51 is shown in FIG. 3(b), and the planar shape of the conductor layer L2 is shown in FIG. 3(c). The conductor layer L2 is provided with a coil conductor pattern C2 wound spirally for approximately two turns, and two electrode patterns 32 and 42. The electrode patterns 32 and 42 are both provided independently of the coil conductor pattern C2. The electrode pattern 32 is exposed from the magnetic body 10, and its surface forms one end 21 of the coil section 20. The electrode pattern 42 is exposed from the magnetic body 10, and its surface forms the other end 22 of the coil section 20.

[0017] The conductor layer L3 is a third conductor layer formed on the upper surface of the conductor layer L2 with an insulating layer 52 interposed therebetween. The planar shape of the insulating layer 52 is shown in FIG. 3(d), and the planar shape of the conductor layer L3 is shown in FIG. 3(e). The conductor layer L3 is provided with a coil conductor pattern C3 wound spirally for approximately two turns, and two electrode patterns 33 and 43. The electrode patterns 33 and 43 are both provided independently of the coil conductor pattern C3. The electrode pattern 33 is exposed from the magnetic body 10, and its surface forms one end 21 of the coil section 20. The electrode pattern 43 is exposed from the magnetic body 10, and its surface forms the other end 22 of the coil section 20.

[0018] The conductor layer L4 is a fourth conductor layer formed on the upper surface of the conductor layer L3 with an insulating layer 53 interposed therebetween. The planar shape of the insulating layer 53 is shown in FIG. 3(f), and the planar shape of the conductor layer L4 is shown in FIG. 3(g). The conductor layer L4 is provided with a coil conductor pattern C4 wound spirally for approximately two turns and one electrode pattern 44. The electrode pattern 44 is connected to one end of the coil conductor pattern C4. The electrode pattern 44 is exposed from the magnetic body 10, and its surface forms the other end 22 of the coil section 20. In the example shown in FIGS. 2 and 3(g), no electrode pattern is provided on the conductor layer L4 in a position overlapping with the electrode patterns 31 to 33, and the corresponding area is buried in the magnetic body 10. The conductor layer L4 is covered with the insulating layer 54. The planar shape of the insulating layer 54 is shown in FIG. 3(h).

[0019] The inner peripheral ends of the coil conductor patterns C1 and C2 are connected via via conductors embedded in vias 71 provided in the insulating layer 51. The outer peripheral ends of the coil conductor patterns C2 and C3 are connected via via conductors embedded in vias 81 provided in the insulating layer 52. The inner peripheral ends of the coil conductor patterns C3 and C4 are connected via via conductors embedded in vias 91 provided in the insulating layer 53. As a result, the coil conductor patterns C1 to C4 form a coil of approximately eight turns, one end 21 of which is exposed on the mounting surface 11 and side surface 12 of the magnetic body 10, and the other end 22 of which is exposed on the mounting surface 11 and side surface 13 of the magnetic body 10.

[0020] The electrode patterns 31 to 33 are connected to one another through via conductors embedded in vias 72 and 82 provided in the insulating layers 51 and 52, respectively. The electrode patterns 41 to 44 are connected to one another through via conductors embedded in vias 73, 83, and 93 provided in the insulating layers 51 to 53, respectively.

[0021] 4 to 7 are schematic plan views showing the structures of the mounting surface 11, side surface 12, side surface 13, and top surface 14 of the magnetic base body 10, respectively.

[0022] In the example shown in FIG. 4, surfaces 31A-33A of one end 21 of the coil section 20 and surfaces 41A-44A of the other end 22 of the coil section 20 are exposed on the mounting surface 11 of the magnetic element body 10. The surfaces 31A-33A are the XZ surfaces of the electrode patterns 31-33 included in the conductor layers L1-L3, respectively. The surfaces 41A-44A are the XZ surfaces of the electrode patterns 41-44 included in the conductor layers L1-L4, respectively. In this way, the other end 22 of the coil section 20 exposed on the mounting surface 11 of the magnetic element body 10 consists of the exposed surfaces of the four conductor layers L1-L4, whereas the one end 21 of the coil section 20 exposed on the mounting surface 11 of the magnetic element body 10 consists of the exposed surfaces of the three conductor layers L1-L3. Therefore, the planar shapes of the surfaces 31A-33A and the surfaces 41A-44A are asymmetrical with respect to each other. Furthermore, the total area of surfaces 31A to 33A is smaller than the total area of surfaces 41A to 44A. Surfaces 31A to 33A are surrounded by insulating layers 50 to 53 on mounting surface 11, thereby preventing contact with magnetic body 10. Similarly, surfaces 41A to 44A are surrounded by insulating layers 50 to 54 on mounting surface 11, thereby preventing contact with magnetic body 10.

[0023] 5, surfaces 31B-33B of one end 21 of the coil section 20 are exposed on the side surface 12 of the magnetic body 10. The surfaces 31B-33B are the YZ surfaces of the electrode patterns 31-33 included in the conductor layers L1-L3, respectively. In this way, the one end 21 of the coil section 20 exposed from the side surface 12 of the magnetic body 10 consists of the exposed surfaces of the three conductor layers L1-L3. The surfaces 31B-33B are surrounded by insulating layers 50-53 on the side surface 12 of the magnetic body 10, which prevents them from coming into contact with the magnetic body 10.

[0024] 6, surfaces 41B to 44B of the other end 22 of the coil section 20 are exposed on the side surface 13 of the magnetic body 10. The surfaces 41B to 44B are the YZ surfaces of the electrode patterns 41 to 44 included in the conductor layers L1 to L4, respectively. In this way, the other end 22 of the coil section 20 exposed from the side surface 13 of the magnetic body 10 consists of the exposed surfaces of the four conductor layers L1 to L4. The surfaces 41B to 44B are surrounded by insulating layers 50 to 54 on the side surface 13 of the magnetic body 10, which prevents them from coming into contact with the magnetic body 10.

[0025] Thus, the other end 22 of the coil section 20 exposed from the side surface 13 of the magnetic body 10 consists of the exposed surfaces of four conductor layers L1 to L4, whereas the one end 21 of the coil section 20 exposed from the side surface 12 of the magnetic body 10 consists of the exposed surfaces of three conductor layers L1 to L3. Therefore, the planar shapes of the surfaces 31B to 33B and the planar shapes of the surfaces 41B to 44B are asymmetric with each other. Furthermore, the total area of the surfaces 31B to 33B is smaller than the total area of the surfaces 41B to 44B.

[0026] In the example shown in FIG. 7, a directionality mark 60 is provided on the top surface 14 of the magnetic element body 10. The directionality mark 60 is not provided at the center of the top surface 14 of the magnetic element body 10 in the X direction, but at a position offset in the −X direction (toward the side surface 13). The directionality mark 60 may also be provided at a position offset in the +X direction (toward the side surface 12). The directionality mark 60 is used to identify the orientations of one end 21 and the other end 22 of the coil unit 20 when mounted on a circuit board. For example, if one end 21 of the coil unit 20 is used as an input terminal and the other end 22 of the coil unit 20 is used as an output terminal, in the example shown in FIG. 7, the offset direction of the directionality mark 60 can be identified as the output terminal side when viewed from the top surface 14 of the magnetic element body 10. The directionality mark 60 can be made of an image-recognizable material, for example, a material obtained by adding fine particles such as titanium oxide to a resin.

[0027] As shown in FIG. 8 , the coil component 100 according to this embodiment may further include external connection terminals 61, 62. The external connection terminals 61, 62 are made of a conductive paste or the like and are provided on the mounting surface 11 of the magnetic body 10. The external connection terminal 61 contacts the surfaces 31A to 33A that constitute one end 21 of the coil section 20. The external connection terminal 62 contacts the surfaces 41A to 44A that constitute the other end 22 of the coil section 20. The surfaces of the external connection terminals 61, 62 may be subjected to a surface treatment to improve wettability with solder. The external connection terminal 61 may contact not only the surfaces 31A to 33A exposed on the mounting surface 11, but also the surfaces 31B to 33B exposed on the side surface 12 of the magnetic body 10. Similarly, the external connection terminals 62 may be in contact with not only the surfaces 41A to 44A exposed on the mounting surface 11, but also the surfaces 41B to 44B exposed on the side surfaces 13 of the magnetic body 10.

[0028] 1, in the coil component 100 according to this embodiment, surfaces 31A-33A and 41A-44A of one end 21 and the other end 22 of the coil section 20 exposed from the mounting surface 11 of the magnetic body 10 may be recessed relative to the surfaces of the insulating layers 50-54 exposed from the mounting surface 11 of the magnetic body 10. This improves adhesion of the external connection terminals 61 and 62. The surfaces of the insulating layers 50-54 exposed from the mounting surface 11 of the magnetic body 10 may be substantially flush with the mounting surface 11 of the magnetic body 10. The surfaces 31B-33B of one end 21 of the coil section 20 exposed from the side surface 12 of the magnetic body 10 may also be recessed relative to the surfaces of the insulating layers 50-53 exposed from the side surface 12 of the magnetic body 10. Similarly, the surfaces 41B to 44B of the other end 22 of the coil portion 20 exposed from the side surface 13 of the magnetic body 10 may also have recesses relative to the surfaces of the insulating layers 50 to 54 exposed from the side surface 13 of the magnetic body 10.

[0029] As described above, in the coil component 100 according to this embodiment, the planar shape of one end 21 of the coil portion 20 exposed on the mounting surface 11 is asymmetrical with the planar shape of the other end 22 of the coil portion 20 exposed on the mounting surface 11, so that even if the coil portion 20 has directionality, it is possible to visually recognize the directionality of the coil portion 20. Furthermore, the planar shape of one end 21 of the coil portion 20 exposed on the side surface 12 of the magnetic body 10 and the planar shape of the other end 22 of the coil portion 20 exposed on the side surface 13 of the magnetic body 10 are also asymmetrical with each other, so that it is possible to recognize the directionality of the coil portion 20 even if it is difficult to visually recognize the mounting surface 11.

[0030] Moreover, in this embodiment, one end 21 of the coil section 20 is made up of the exposed surfaces of the three conductor layers L1 to L3, and the magnetic element body 10 is provided at the position of the conductor layer L4 that overlaps with one end 21 of the coil section 20. This increases the volume of the magnetic element body 10, making it possible to increase inductance.

[0031] Next, a method for forming the orientation mark 60 and the external connection terminals 61, 62 on the coil component 100 according to this embodiment will be described.

[0032] First, a plurality of coil components 100 shown in FIG. 1 are fabricated, and then the coil components 100 are inserted into openings 111 of a carrier tape 110 shown in FIG. 9. The carrier tape 110 may be made of paper. FIGS. 10 and 11 are YZ and XZ plan views, respectively, showing the state in which the coil components 100 are held in the openings 111 of the carrier tape 110. As shown in FIGS. 10 and 11, the carrier tape 110 holds the coil components 100 so that the entire mounting surface 11 and the entire top surface 14 of the magnetic base body 10 are exposed.

[0033] As shown in FIG. 11 , the multiple coil components 100 held on the carrier tape 110 are all oriented such that one end 21 of the coil portion 20 is located on the +X direction side and the other end 22 of the coil portion 20 is located on the −X direction side. The orientation of the coil component 100 can be identified from the shape of one end 21 and the other end 22 of the coil portion 20 exposed on the mounting surface 11 using image recognition or the like. That is, in the coil component 100 according to this embodiment, the planar shapes of one end 21 and the other end 22 of the coil portion 20 exposed on the mounting surface 11 are asymmetric and have different areas. Therefore, for example, by performing image recognition by photographing the coil component 100 from the mounting surface 11 side, the orientation of the coil component 100 can be easily determined. Alternatively, the coil component 100 may be photographed from one or both of the side surfaces 12 and 13. In the coil component 100 of this embodiment, the planar shape of one end 21 of the coil portion 20 exposed on the side surface 12 is asymmetrical to the planar shape of the other end 22 of the coil portion 20 exposed on the side surface 13, and the areas of the two are also different, so that the orientation of the coil component 100 can be easily determined even when photographed from one or both of the side surfaces 12 and 13.

[0034] In this state, as shown in FIG. 12 , the carrier tape 110 is conveyed in the Z direction, causing the carrier tape 110 to pass between the rollers 120 and 130. The roller 120 rotates rightward (clockwise) around a rotation axis 120A extending in the X direction. The roller 130 rotates leftward (counterclockwise) around a rotation axis 130A extending in the X direction. The distance in the Y direction between the outer circumferential surfaces of the rollers 120 and 130 is approximately the same as the thickness of the coil component 100 in the Y direction. As a result, when the coil component 100 held by the carrier tape 110 passes between the rollers 120 and 130, the mounting surface 11 of the magnetic element 10 comes into contact with the outer circumferential surface of the roller 120, and the top surface 14 of the magnetic element 10 comes into contact with the outer circumferential surface of the roller 130.

[0035] As shown in FIG. 13 , two grooves 121 and 122 extending in the circumferential direction are formed on the outer peripheral surface of roller 120. One groove 131 extending in the circumferential direction is formed on the outer peripheral surface of roller 130. A conductive paste that forms external connection terminals 61 and 62 is supplied to grooves 121 and 122 of roller 120. As a result, when an electronic component passes between roller 120 and roller 130, roller 120 comes into contact with mounting surface 11 of magnetic base body 10, and external connection terminals 61 and 62 made of conductive paste are applied at the positions shown in FIG. 8. Meanwhile, paint that forms directionality mark 60 is supplied to groove 131 of roller 130. As a result, when an electronic component passes between roller 120 and roller 130, roller 130 comes into contact with top surface 14 of magnetic base body 10, and directionality mark 60 is applied at the position shown in FIG. 7. The position in the X direction of groove 131 provided in roller 130 is offset from the center of coil device 100 in the X direction, so that directionality mark 60 is applied at a position offset in the X direction.

[0036] 12 and 13, the roller 120 and the roller 130 are positioned at approximately the same position in the Z direction, and as a result, when the carrier tape 110 is transported in the Z direction, it is possible to apply the external connection terminals 61, 62 and the directionality mark 60 at approximately the same time. Without being limited to this, the roller 120 that applies the external connection terminals 61, 62 and the roller 130 that applies the directionality mark 60 may be positioned offset in the transport direction (Z direction in the examples shown in FIGS. 12 and 13). In this case, one is applied first, and then the other is applied.

[0037] FIG. 14 is a plan view showing the structure of the mounting surface 11 according to the first modified example.

[0038] 14 , surfaces 31A and 32A of one end 21 of the coil section 20 and surfaces 41A to 44A of the other end 22 of the coil section 20 are exposed on the mounting surface 11 of the magnetic element body 10. That is, the other end 22 of the coil section 20 exposed on the mounting surface 11 of the magnetic element body 10 consists of the exposed surfaces of four conductor layers L1 to L4, whereas the one end 21 of the coil section 20 exposed on the mounting surface 11 of the magnetic element body 10 consists of the exposed surfaces of two conductor layers L1 and L2. This makes image recognition easier because the surface area of the one end 21 of the coil section 20 exposed on the mounting surface 11 is smaller than the surface area of the other end 22 of the coil section 20 exposed on the mounting surface 11. Furthermore, the increased volume of the magnetic element body 10 makes it possible to obtain a higher inductance.

[0039] FIG. 15 is a plan view showing the structure of the mounting surface 11 according to the second modified example.

[0040] 15 , a surface 31A of one end 21 of the coil portion 20 and surfaces 41A-44A of the other end 22 of the coil portion 20 are exposed on the mounting surface 11 of the magnetic element body 10. That is, the other end 22 of the coil portion 20 exposed on the mounting surface 11 of the magnetic element body 10 consists of the exposed surfaces of four conductor layers L1-L4, whereas the one end 21 of the coil portion 20 exposed on the mounting surface 11 of the magnetic element body 10 consists of the exposed surface of one conductor layer L1. This makes image recognition even easier because the surface area of the one end 21 of the coil portion 20 exposed on the mounting surface 11 is much smaller than the surface area of the other end 22 of the coil portion 20 exposed on the mounting surface 11. Moreover, the volume of the magnetic element body 10 is further increased, making it possible to obtain even higher inductance.

[0041] FIG. 16 is a plan view showing the structure of the mounting surface 11 according to the third modified example.

[0042] 16 , surfaces 31A and 32A of one end 21 of the coil section 20 and surfaces 42A to 44A of the other end 22 of the coil section 20 are exposed on the mounting surface 11 of the magnetic body 10. That is, the other end 22 of the coil section 20 exposed on the mounting surface 11 of the magnetic body 10 consists of the exposed surfaces of three conductor layers L2 to L4, whereas the one end 21 of the coil section 20 exposed on the mounting surface 11 of the magnetic body 10 consists of the exposed surfaces of two conductor layers L1 and L2. As exemplified in the third modified example shown in FIG. 16 , even if the number of conductor layers constituting the other end 22 of the coil section 20 (three layers) is greater than the number of conductor layers constituting the one end 21 of the coil section 20 (two layers), some of the conductor layers (conductor layer L1 in the example shown in FIG. 16 ) may be exposed only on the side of one end 21 of the coil section 20.

[0043] FIG. 17 is a plan view showing the structure of the mounting surface 11 according to the fourth modified example.

[0044] 17, surfaces 31A to 34A of one end 21 of the coil section 20 and surfaces 41A to 44A of the other end 22 of the coil section 20 are exposed on the mounting surface 11 of the magnetic body 10. That is, both the one end 21 and the other end 22 of the coil section 20 exposed on the mounting surface 11 of the magnetic body 10 are made up of exposed surfaces of four conductor layers L1 to L4. Surface 34A is located on conductor layer L4 and is made up of a conductor pattern that overlaps with conductor pattern 33. In the example shown in FIG. 17, the planar shapes of surfaces 31A to 33A and surfaces 41A to 43A are symmetrical, but the size of surface 34A in the X direction is shorter than the size of surface 44A in the X direction, which results in an asymmetrical planar shape of surfaces 31A to 34A and surfaces 41A to 44A overall. As illustrated in a fourth modified example shown in FIG. 17, the number of conductor layers exposed from the mounting surface 11 may be the same at one end 21 and the other end 22 of the coil portion 20.

[0045] The above describes embodiments of the technology according to the present disclosure, but the technology according to the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the gist of the technology, and it goes without saying that these modifications are also included within the scope of the technology according to the present disclosure.

[0046] For example, in the above embodiment, the coil portion 20 embedded in the magnetic base body 10 has a four-layer structure consisting of conductor layers L1 to L4, and each conductor layer includes a coil conductor pattern of approximately two turns, but in the technology disclosed herein, the shape and structure of the coil portion included in the electronic component (coil component) are not particularly limited.

[0047] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0048] An electronic component according to one aspect of the present disclosure includes a magnetic body having a mounting surface, a first side surface perpendicular to the mounting surface, and a second side surface opposite the first side surface, and a coil unit embedded in the magnetic body, the coil unit having a first surface exposed on the mounting surface and a third surface exposed on the first side surface, and a second surface exposed on the mounting surface and a fourth surface exposed on the second side surface, the mounting surface, the first side surface, and the second side surface are all parallel to a coil axis direction of the coil unit, and the planar shapes of the first surface and the second surface are asymmetrical with respect to each other, and the planar shapes of the third surface and the fourth surface are asymmetrical with respect to each other. This allows the directionality of the coil unit to be visually recognized even if the coil unit has directionality.

[0049] In the above electronic component, the area of the first surface and the area of the second surface may be different from each other. This makes it possible to more easily determine the directionality of the coil portion. In this case, the area of the third surface and the area of the fourth surface may be different from each other. This makes it even more easy to determine the directionality of the coil portion.

[0050] In the electronic component described above, the coil portion may include multiple insulating layers and multiple conductor layers alternately stacked in the coil axis direction. This allows the number of turns of the coil conductor pattern constituting the coil portion to be increased. In this case, the number of conductor layers constituting the first or third surface among the multiple conductor layers may be different from the number of conductor layers constituting the second or fourth surface among the multiple conductor layers. This allows the directionality of the coil portion to be more easily determined. Furthermore, the first and second surfaces may have recesses relative to the surfaces of the multiple insulating layers exposed from the mounting surface of the magnetic base body. This allows for improved adhesion of the external connection terminals when the mounting surface is covered with them.

[0051] In the above electronic component, the magnetic base body may further have an upper surface located opposite the mounting surface, and a directionality mark may be provided on the upper surface at a position offset toward the first or second surface. This makes it possible to recognize the directionality of the electronic component when mounted. In this case, the above electronic component may further include a first external connection terminal provided at least on the mounting surface and in contact with the first surface, and a second external connection terminal provided at least on the mounting surface and in contact with the second surface. This makes it possible to recognize the directionality of the electronic component by visually recognizing the directionality mark when mounted, even if one end and the other end of the coil portion are hidden by the first and second external connection terminals.

[0052] A method for manufacturing an electronic component according to one aspect of the present disclosure includes the steps of: preparing an electronic component comprising: a magnetic body having a mounting surface and an upper surface opposite the mounting surface; and a coil portion embedded in the magnetic body, the coil portion having a first surface with one end exposed on the mounting surface and a second surface with the other end exposed on the mounting surface, the planar shapes of the first surface and the second surface being asymmetric with respect to each other; and passing the electronic component between the first roller and the second roller so that the mounting surface contacts the first roller and the upper surface contacts the second roller, wherein the first roller applies first and second external connection terminals to the first and second surfaces, respectively, and the second roller applies a directionality mark to the upper surface. This allows the first and second external connection terminals and the directionality mark to be applied to the electronic component.

[0053] In the method for manufacturing an electronic component, the first roller and the second roller may be disposed facing each other at approximately the same position in the direction in which the electronic component is transported, thereby enabling the first and second external connection terminals and the directional mark to be applied simultaneously. [Explanation of symbols]

[0054] 10 Magnetic element 11 Mounting surface 12~16 Side 20 Coil section 21 One end of the coil 22 Other end of coil part 31 Electrode Pattern 31~33, 41~44 Electrode patterns 31A~34A, 31B~33B, 41A~44A, 41B~44B surface 50~54 Insulation layer 60 Directional Mark 61,62 External connection terminal 62 External connection terminal 71~73,81~83,91,93 via 100 Electronic components (coil components) 110 Carrier Tape 111 Opening 120,130 Roller 120A, 130A Rotating shaft 121,122,131 Groove C1~C4 Coil conductor patterns L1~L4 conductor layers

Claims

1. a magnetic body having a mounting surface, a first side surface perpendicular to the mounting surface, and a second side surface opposite to the first side surface; a coil section embedded in the magnetic body, one end of which has a first surface exposed on the mounting surface and a third surface exposed on the first side surface, and the other end of which has a second surface exposed on the mounting surface and a fourth surface exposed on the second side surface; Equipped with the mounting surface, the first side surface, and the second side surface are all parallel to a coil axis direction of the coil portion, the planar shapes of the first surface and the second surface are asymmetric with each other; the planar shape of the third surface and the planar shape of the fourth surface are asymmetric with each other; Electronic components.

2. The area of the first surface and the area of the second surface are different from each other. The electronic component according to claim 1 .

3. The area of the third surface and the area of the fourth surface are different from each other. The electronic component according to claim 2 .

4. The coil portion includes a plurality of insulating layers and a plurality of conductor layers alternately stacked in the coil axis direction. The electronic component according to claim 2 .

5. the number of conductor layers constituting the first or third surface among the plurality of conductor layers is different from the number of conductor layers constituting the second or fourth surface among the plurality of conductor layers; The electronic component according to claim 4.

6. the first and second surfaces have recesses relative to the surfaces of the insulating layers exposed from the mounting surface of the magnetic base body; The electronic component according to claim 4.

7. the magnetic body further has an upper surface located opposite the mounting surface, a directional mark is provided on the upper surface at a position offset toward the first or second surface; The electronic component according to any one of claims 1 to 6.

8. a first external connection terminal provided on at least the mounting surface and in contact with the first surface; a second external connection terminal provided on at least the mounting surface and in contact with the second surface; Further provided with The electronic component according to claim 7.

9. preparing an electronic component comprising: a magnetic body having a mounting surface and an upper surface located opposite to the mounting surface; and a coil portion embedded in the magnetic body, the coil portion having a first surface one end exposed to the mounting surface and a second surface the other end exposed to the mounting surface, wherein the planar shapes of the first surface and the second surface are asymmetric with each other; passing the electronic component between the first roller and the second roller so that the mounting surface contacts the first roller and the top surface contacts the second roller; Equipped with applying the first and second external connection terminals to the first and second surfaces, respectively, by the first roller; applying an orientation mark to the upper surface by the second roller; Manufacturing methods for electronic components.

10. The first roller and the second roller are disposed opposite to each other at substantially the same position in the direction in which the electronic components are transported. The method of claim 9.

Images