Power conversion device

The power conversion device insulates bus bars with an insulating substrate, enabling a compact and efficient design with enhanced heat dissipation and assembly.

JP2025122263APending Publication Date: 2025-08-21HONDA MOTOR CO LTD
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Patent Information

Application Number
JP2024017561
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-02-08
Publication Date
2025-08-21

AI Technical Summary

Technical Problem

Existing power conversion devices are large and inefficient, lacking effective insulation between bus bars, which hinders their miniaturization and performance.

Method used

A power conversion device with bus bars insulated by an insulating substrate, allowing for shorter distances between bus bars and integration on multiple layers, enhancing miniaturization and heat dissipation.

Benefits of technology

The device achieves a compact design with improved heat dissipation and assembly efficiency, maximizing switching performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide a better power conversion device.SOLUTION: A power conversion device 10 includes a power conversion unit 36 that converts three-phase AC power supplied from a three-phase AC power source into DC power, a first bus bar 54u connected to a first phase terminal 44u provided in the power conversion unit 36 and arranged on an insulating substrate, a second bus bar 54v connected to a second phase terminal 44v provided in the power conversion unit 36 and arranged on an insulating substrate, and a third bus bar 54w connected to a third phase terminal 44w provided in the power conversion unit 36 and arranged on the insulating substrate, a first insulating layer is formed on the second bus bar 54v, and the first bus bar 54u and the third bus bar 54w are formed on the first insulating layer.SELECTED DRAWING: Figure 3
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Description

[Technical Field]

[0001] The present disclosure relates to a power conversion device. [Background technology]

[0002] In recent years, efforts to realize a low-carbon or carbon-free society have become more active, and research and development into power conversion devices is being conducted to reduce CO2 emissions and improve energy efficiency in mobile vehicles such as aircraft.

[0003] Patent Document 1 discloses a power conversion device interposed between a battery and an AC motor. The power conversion device converts DC power supplied from a battery into three-phase AC power and outputs it to the three-phase AC motor. The power conversion device includes a plurality of power cards (switching elements), a plurality of output bus bars, and a plurality of external connection terminals. The U-phase power card is connected to the U-phase external connection terminal via the U-phase output bus bar. Similarly, the V-phase power card is connected to the V-phase external connection terminal via the V-phase output bus bar, and the W-phase power card is connected to the W-phase external connection terminal via the W-phase output bus bar. An insulating space is provided between two adjacent output bus bars. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-129406 Summary of the Invention [Problem to be solved by the invention]

[0005] A better power converter is desired.

[0006] The present invention aims to solve the above-mentioned problems. [Means for solving the problem]

[0007] An aspect of the present disclosure includes a power conversion unit that converts three-phase AC power supplied from a three-phase AC power source into DC power; an insulating substrate made of an insulating material; a first bus bar connected to a first phase terminal provided in the power conversion unit and disposed on the insulating substrate; a second bus bar connected to a second phase terminal provided in the power conversion unit and disposed on the insulating substrate; and a third bus bar connected to a third phase terminal provided in the power conversion unit and disposed on the insulating substrate, wherein the insulating substrate has a plurality of insulating layers, a first insulating layer of the plurality of insulating layers is formed on the second bus bar, the first bus bar and the third bus bar are formed on the first insulating layer, and the first bus bar, the second bus bar, and the third bus bar are insulated from each other by the insulating material that constitutes the insulating substrate. [Effects of the Invention]

[0008] According to the present invention, a good power conversion device can be provided. [Brief explanation of the drawings]

[0009] [Figure 1] Figure 1 is a schematic diagram of an aircraft. [Figure 2] FIG. 2 is a circuit diagram of the power supply device. [Figure 3] FIG. 3 is a perspective view of the PCU. [Figure 4] FIG. 4 is a perspective view of the power conversion unit. [Figure 5] FIG. 5 is a perspective view of the power converter and the cooler. [Figure 6] FIG. 6 is a perspective view of the five bus bars and the power conversion unit. [Figure 7] FIG. 7 is a side view of the five bus bars and the power conversion unit. [Figure 8] FIG. 8 is a plan view of the first conductive layer. [Figure 9] FIG. 9 is a plan view of the second conductive layer. DETAILED DESCRIPTION OF THE INVENTION

[0010] For example, it is desirable that a power conversion device provided in a mobile object be small. Therefore, it is preferable that the distance between two bus bars provided in the power conversion device be as short as possible. The power conversion device of the embodiment described below reliably insulates multiple bus bars from each other and enables the distance between the bus bars to be shortened.

[0011] A power conversion device 10 in one embodiment will be described with reference to the drawings. In this embodiment, the power conversion device 10 will be described as a power control unit, but is not limited to this. The power control unit 10 is mounted on a moving object. In this embodiment, the moving object will be described as an aircraft 12, but is not limited to this.

[0012] [1 Aircraft 12 configuration] FIG. 1 is a schematic diagram of an aircraft 12. The aircraft 12 of this embodiment is an electric vertical take-off and landing aircraft (eVTOL aircraft). The aircraft 12 has rotors driven by electric motors. The aircraft 12 generates vertical thrust and horizontal thrust by the rotors.

[0013] The aircraft 12 is equipped with an airframe 14. The aircraft 12 has eight VTOL rotors 16. The VTOL rotors 16 generate thrust in an upward direction relative to the airframe 14. The aircraft 12 has two cruise rotors 18. The cruise rotors 18 generate thrust in a forward direction relative to the airframe 14.

[0014] The VTOL rotor 16 and the cruise rotor 18 are driven by electric motors (not shown). The aircraft 12 has a generator 20 and a battery (not shown) as power sources for the electric motors. Electric power supplied by the generator 20 is supplied to the electric motors (electric motors). The electric power supplied by the generator 20 is also stored in a battery (electric storage device). When the electric power generated by the generator 20 is insufficient to meet the required electric power, the electric power stored in the battery is supplied to the electric motors.

[0015] [2. Configuration of power supply device 22] The aircraft 12 has a power supply device 22. The power supply device 22 has a generator 20, a power control unit 10, and a main junction box 24. Hereinafter, the power control unit 10 may be referred to as a PCU 10. Furthermore, the main junction box 24 may be referred to as an MJB 24.

[0016] The power supply device 22 has two generators 20. One of the two generators 20 is a first generator 20a, and the other of the two generators 20 is a second generator 20b. The first generator 20a is disposed on the right side of a center line L in the left-right direction of the fuselage 14 of the aircraft 12, and the second generator 20b is disposed on the left side of the center line L.

[0017] The power supply device 22 has two PCUs 10. One of the two PCUs 10 is a first PCU 10a, and the other is a second PCU 10b. The MJB 24 is disposed around the center line L of the fuselage 14. The first PCU 10a is attached to the right side of the MJB 24, and the second PCU 10b is attached to the left side of the MJB 24.

[0018] The three-phase AC power generated by the first generator 20a is supplied to the first PCU 10a. The first PCU 10a converts the three-phase AC power supplied from the first generator 20a into DC power. The converted DC power is supplied to the MJB 24.

[0019] The three-phase AC power generated by the second generator 20b is supplied to the second PCU 10b. The second PCU 10b converts the three-phase AC power supplied from the second generator 20b into DC power. The converted DC power is supplied to the MJB 24.

[0020] [3. Configuration of power supply device 22] Fig. 2 is a circuit diagram of the power supply device 22. Fig. 2 shows a circuit made up of the generator 20 arranged on one of the left and right sides, the PCU 10 arranged on one of the left and right sides, and the MJB 24. The circuit of the PCU 10 will be described below.

[0021] The PCU 10 includes three external connection terminals 26u, 26v, and 26w and two external connection terminals 28p and 28n. The three external connection terminals 26u, 26v, and 26w and the two external connection terminals 28p and 28n are attached to a casing (not shown).

[0022] The external connection terminal 26u is connected to the generator 20 via a U-phase wiring 32u. The external connection terminal 26v is connected to the generator 20 via a V-phase wiring 32v. The external connection terminal 26w is connected to the generator 20 via a W-phase wiring 32w. The external connection terminal 28p is connected to the MJB 24 via a positive wiring 34p. The external connection terminal 28n is connected to the MJB 24 via a negative wiring 34n.

[0023] The PCU 10 includes a U-phase power module 38u, a V-phase power module 38v, a W-phase power module 38w, and a smoothing capacitor 40. As shown in FIG. 4, the three power modules (38u, 38v, 38w) are also referred to as a power conversion unit 36. The U-phase power module 38u includes two power devices 42, a U-phase terminal (first phase terminal) 44u, a positive terminal (first DC terminal) 46u, and a negative terminal (second DC terminal) 48u. The V-phase power module 38v includes two power devices 42, a V-phase terminal (second phase terminal) 44v, a positive terminal (first DC terminal) 46v, and a negative terminal (second DC terminal) 48v. The W-phase power module 38w includes two power devices 42, a W-phase terminal (third phase terminal) 44w, a positive terminal (first DC terminal) 46w, and a negative terminal (second DC terminal) 48w. Each power device 42 includes a switching element such as a MOSFET and a diode. The smoothing capacitor 40 includes a positive terminal 50p and a negative terminal 52n.

[0024] In U-phase power module 38u, one of two power devices 42 is connected to positive terminal 46u and U-phase terminal 44u, and the other of two power devices 42 is connected to negative terminal 48u and U-phase terminal 44u.

[0025] In V-phase power module 38v, one of two power devices 42 is connected to positive terminal 46v and V-phase terminal 44v. In V-phase power module 38v, the other of two power devices 42 is connected to negative terminal 48v and V-phase terminal 44v.

[0026] In W-phase power module 38w, one of two power devices 42 is connected to positive terminal 46w and W-phase terminal 44w. In W-phase power module 38w, the other of two power devices 42 is connected to negative terminal 48w and W-phase terminal 44w.

[0027] A U-phase terminal 44u of the U-phase power module 38u is connected to an external connection terminal 26u of the PCU 10 via a U-phase bus bar (first bus bar) 54u. A V-phase terminal 44v of the V-phase power module 38v is connected to an external connection terminal 26v of the PCU 10 via a V-phase bus bar (second bus bar) 54v. A W-phase terminal 44w of the W-phase power module 38w is connected to an external connection terminal 26w of the PCU 10 via a W-phase bus bar (third bus bar) 54w.

[0028] The positive electrode terminal 46u of the U-phase power module 38u, the positive electrode terminal 46v of the V-phase power module 38v, and the positive electrode terminal 46w of the W-phase power module 38w are each connected to the external connection terminal 28p of the PCU 10 via a first positive electrode bus bar (fourth bus bar) 56p and a second positive electrode bus bar 58p. The positive electrode terminal 50p of the smoothing capacitor 40 is connected to the external connection terminal 28p of the PCU 10 via the second positive electrode bus bar 58p.

[0029] The negative electrode terminal 48u of the U-phase power module 38u, the negative electrode terminal 48v of the V-phase power module 38v, and the negative electrode terminal 48w of the W-phase power module 38w are each connected to the external connection terminal 28n of the PCU 10 via a first negative electrode bus bar (fifth bus bar) 56n and a second negative electrode bus bar 58n. The negative electrode terminal 52n of the smoothing capacitor 40 is connected to the external connection terminal 28n of the PCU 10 via the second negative electrode bus bar 58n.

[0030] [4 PCU10 configuration] Fig. 3 is a perspective view of the PCU 10. Fig. 3 shows the PCU 10 with the external connection terminals 26u, 26v, 26w, 28p, and 28n and the casing removed. Fig. 3 shows arrows indicating the X, Y, and Z directions. The X, Y, and Z directions are perpendicular to one another. One of the X directions is the +X direction, and the other is the -X direction. The same applies to the Y and Z directions.

[0031] As described above, the PCU 10 includes the power modules (38u, 38v, 38w), the smoothing capacitor 40, and the bus bars (54u, 54v, 54w, 56p, 56n, 58p, 58n). The PCU 10 further includes a cooler 64.

[0032] 4 is a perspective view of the power conversion unit 36. Each of the U-phase power module 38u, the V-phase power module 38v, and the W-phase power module 38w has a flat plate shape parallel to the X direction and the Z direction. The U-phase power module 38u, the V-phase power module 38v, and the W-phase power module 38w are arranged along the Y direction.

[0033] As described above, the U-phase power module 38u includes two power devices 42 (FIG. 2). The two power devices 42 are sealed with an insulating material such as resin, thereby integrating the two power devices 42. The U-phase power module 38u includes a U-phase terminal 44u, a positive terminal 46u, a negative terminal 48u, and a plurality of signal terminals 62. The U-phase terminal 44u, the positive terminal 46u, and the negative terminal 48u each extend from the U-phase power module 38u in the +Z direction. The plurality of signal terminals 62 extend from the U-phase power module 38u in the −Z direction. Each signal terminal 62 is connected to a drive circuit (not shown). The drive circuit amplifies a signal output from a controller (not shown). The drive circuit supplies the amplified drive signal to the signal terminal 62. The V-phase power module 38v and the W-phase power module 38w have the same configuration as the U-phase power module 38u. Therefore, the description thereof will be omitted here.

[0034] FIG. 5 is a perspective view of the power conversion unit 36 ​​and the cooler 64. The cooler 64 includes two partial pipes 66 and four partial pipes 68. The two partial pipes 66 extend along the Y direction. The four partial pipes 68 extend along the X direction. The four partial pipes 68 are arranged between the two partial pipes 66. One end of each partial pipe 68 is connected to a partial pipe 66a of one of the two partial pipes 66. The other end of each partial pipe 68 is connected to a partial pipe 66b of the other of the two partial pipes 66. As a result, the two partial pipes 66 communicate with each other via the four partial pipes 68. Each of the two partial pipes 66 communicates with a pump (not shown).

[0035] Of the four partial pipes 68, partial pipe 68a contacts the outer wall surface of U-phase power module 38u facing the -Y direction. Of the four partial pipes 68, partial pipe 68b contacts the outer wall surface of U-phase power module 38u facing the +Y direction and the outer wall surface of V-phase power module 38v facing the -Y direction. Of the four partial pipes 68, partial pipe 68c contacts the outer wall surface of V-phase power module 38v facing the +Y direction and the outer wall surface of W-phase power module 38w facing the -Y direction. Of the four partial pipes 68, partial pipe 68d contacts the outer wall surface of W-phase power module 38w facing the +Y direction.

[0036] A refrigerant flows inside the cooler 64. For example, the refrigerant is discharged from the pump to the partial pipe 66a and then supplied from the partial pipe 66a to each of the four partial pipes 68. The refrigerant is then discharged from the four partial pipes 68 to the partial pipe 66b and cooled by a radiator (not shown) or the like. The cooled refrigerant returns to the pump. The refrigerant absorbs heat in the multiple power modules (38u, 38v, 38w) and releases heat in the radiator. This cools the multiple power modules (38u, 38v, 38w).

[0037] FIG. 6 is a perspective view of the five bus bars (54u, 54v, 54w, 56p, and 56n) and the power conversion unit 36. FIG. 7 is a side view of the five bus bars (54u, 54v, 54w, 56p, and 56n) and the power conversion unit 36. Note that in FIG. 7, the V-phase power module 38v and the W-phase power module 38w are hidden behind the U-phase power module 38u. For this reason, the reference symbols for the V-phase power module 38v and the W-phase power module 38w are shown in parentheses in FIG. 7. Similarly, in FIG. 7, the W-phase bus bar 54w is hidden behind the U-phase bus bar 54u. For this reason, the reference symbol for the W-phase bus bar 54w is shown in parentheses in FIG. 7.

[0038] 6, the U-phase bus bar 54u, the V-phase bus bar 54v, the W-phase bus bar 54w, the first positive bus bar 56p, and the first negative bus bar 56n are each disposed on a common insulating substrate 74. A portion of the U-phase bus bar 54u is sealed by the insulating material that constitutes the insulating substrate 74. Like the U-phase bus bar 54u, the V-phase bus bar 54v, the W-phase bus bar 54w, the first positive bus bar 56p, and the first negative bus bar 56n are also each partially sealed. The five bus bars (54u, 54v, 54w, 56p, 56n) and the insulating substrate 74 constitute an integrated bus bar substrate 72.

[0039] The bus bar substrate 72 has multiple insulating layers stacked along the Z direction. For example, as shown in FIG. 7 , a first insulating layer 76, a second insulating layer 78, and a third insulating layer 80 are formed on the bus bar substrate 72. The first insulating layer 76 is disposed between the second insulating layer 78 and the third insulating layer 80. A first conductive layer 82 and a second conductive layer 84 are also formed on the bus bar substrate 72. A V-phase bus bar 54v and a first negative bus bar 56n are disposed on the first conductive layer 82. A U-phase bus bar 54u, a W-phase bus bar 54w, a first positive bus bar 56p, and a partial negative bus bar 56na are disposed on the second conductive layer 84. The first negative bus bar 56n disposed on the first conductive layer 82 and the partial negative bus bar 56na disposed on the second conductive layer 84 are electrically connected via a through hole or the like (not shown).

[0040] Each of the bus bars (54u, 54v, 54w, 56p, 56n, 56na) may be formed of metal foil (such as copper foil). In this case, the insulating substrate 74 may be a printed circuit board. Each of the bus bars (54u, 54v, 54w, 56p, 56n, 56na) may be formed of rolled metal (such as rolled copper). In this case, the metal is embedded in an insulating material.

[0041] The first conductive layer 82 is formed between the second insulating layer 78 and the first insulating layer 76. The second conductive layer 84 is formed between the first insulating layer 76 and the third insulating layer 80. In other words, the first insulating layer 76 is formed on the V-phase bus bar 54v and the first negative electrode bus bar 56n. Furthermore, the U-phase bus bar 54u, the W-phase bus bar 54w, the first positive electrode bus bar 56p, and the partial negative electrode bus bar 56na are formed on the first insulating layer 76. In other words, the first insulating layer 76 is interposed between the first conductive layer 82 and the second conductive layer 84.

[0042] Fig. 8 is a plan view of the first conductive layer 82. As shown in Fig. 8, in the first conductive layer 82, the V-phase bus bar 54v and the first negative electrode bus bar 56n are arranged along the X direction. The V-phase bus bar 54v and the first negative electrode bus bar 56n are spaced apart from each other. An insulating material that constitutes the insulating substrate 74 is interposed between the V-phase bus bar 54v and the first negative electrode bus bar 56n.

[0043] FIG. 9 is a plan view of the second conductive layer 84. As shown in FIG. 9, in the second conductive layer 84, the U-phase bus bar 54u and the W-phase bus bar 54w are arranged along the Y direction. The U-phase bus bar 54u, the partial negative electrode bus bar 56na, and the first positive electrode bus bar 56p are arranged along the X direction. The W-phase bus bar 54w, the partial negative electrode bus bar 56na, and the first positive electrode bus bar 56p are arranged along the X direction. The U-phase bus bar 54u, the W-phase bus bar 54w, the partial negative electrode bus bar 56na, and the first positive electrode bus bar 56p are spaced apart from each other. An insulating material that constitutes the insulating substrate 74 is interposed between the U-phase bus bar 54u, the W-phase bus bar 54w, the partial negative electrode bus bar 56na, and the first positive electrode bus bar 56p.

[0044] When viewed in the stacking direction, at least a portion of U-phase bus bar 54u and at least a portion of V-phase bus bar 54v overlap. In the present embodiment, as shown in Fig. 9, when viewed in the Z direction, a portion of U-phase bus bar 54u and a portion of V-phase bus bar 54v overlap.

[0045] When viewed in the stacking direction, at least a portion of W-phase bus bar 54w and at least a portion of V-phase bus bar 54v overlap. In the present embodiment, as shown in Fig. 9, when viewed in the Z direction, a portion of W-phase bus bar 54w and a portion of V-phase bus bar 54v overlap.

[0046] When viewed in the stacking direction, at least a portion of the first positive bus bar 56p and at least a portion of the first negative bus bar 56n overlap. In the present embodiment, when viewed in the Z direction, as shown in Fig. 9, a portion of the first positive bus bar 56p and a portion of the first negative bus bar 56n overlap.

[0047] 3, the U-phase terminal 44u, positive terminal 46u, and negative terminal 48u of the U-phase power module 38u each penetrate the bus bar substrate 72 and protrude in the +Z direction. The protruding portion of the U-phase terminal 44u is connected by solder or the like to a U-phase bus bar 54u that is partially exposed in the +Z direction. The protruding portion of the positive terminal 46u is connected by solder or the like to a first positive bus bar 56p that is partially exposed in the +Z direction. The protruding portion of the negative terminal 48u is connected by solder or the like to a partial negative bus bar 56na that is partially exposed in the +Z direction.

[0048] Similar to the U-phase power module 38u, the V-phase terminal 44v, positive terminal 46v, and negative terminal 48v of the V-phase power module 38v each penetrate the bus bar substrate 72 and protrude in the +Z direction. The protruding portion of the V-phase terminal 44v is connected by solder or the like to a V-phase bus bar 54v that is partially exposed in the +Z direction. The protruding portion of the positive terminal 46v is connected by solder or the like to a first positive bus bar 56p that is partially exposed in the +Z direction. The protruding portion of the negative terminal 48v is connected by solder or the like to a partial negative bus bar 56na that is partially exposed in the +Z direction.

[0049] Similar to the U-phase power module 38u, the W-phase terminal 44w, positive terminal 46w, and negative terminal 48w of the W-phase power module 38w each penetrate the bus bar substrate 72 and protrude in the +Z direction. The protruding portion of the W-phase terminal 44w is connected by solder or the like to a W-phase bus bar 54w that is partially exposed in the +Z direction. The protruding portion of the positive terminal 46w is connected by solder or the like to a first positive bus bar 56p that is partially exposed in the +Z direction. The protruding portion of the negative terminal 48w is connected by solder or the like to a partial negative bus bar 56na that is partially exposed in the +Z direction.

[0050] The +X-direction end of the U-phase bus bar 54u is connected to the external connection terminal 26u (FIG. 2). The +X-direction end of the V-phase bus bar 54v is connected to the external connection terminal 26v (FIG. 2). The +X-direction end of the W-phase bus bar 54w is connected to the external connection terminal 26w (FIG. 2). The −X-direction end of the first positive bus bar 56p is connected to the second positive bus bar 58p. The −X-direction end of the first negative bus bar 56n is connected to the second negative bus bar 58n.

[0051] 3, the PCU 10 includes a snubber capacitor 88. The snubber capacitor 88 is disposed on the outer wall surface on the +Z direction side of the bus bar substrate 72. One end of the snubber capacitor 88 is connected by solder or the like to the first positive bus bar 56p that is partially exposed in the +Z direction. The other end of the snubber capacitor 88 is connected by solder or the like to the partial negative bus bar 56na that is partially exposed in the +Z direction.

[0052] As shown in Fig. 3, the second positive bus bar 58p and the second negative bus bar 58n are stacked in the X direction. An insulator 90 is interposed between the second positive bus bar 58p and the second negative bus bar 58n. The second positive bus bar 58p is connected to the positive terminal 50p (Fig. 2) of the smoothing capacitor 40. The second positive bus bar 58p is connected to the external connection terminal 28p (Fig. 2). The second negative bus bar 58n is connected to the negative terminal 52n (Fig. 2) of the smoothing capacitor 40. The second negative bus bar 58n is connected to the external connection terminal 28n (Fig. 2).

[0053] In the present embodiment, a first insulating layer 76 is formed on V-phase busbar 54v, and U-phase busbar 54u and W-phase busbar 54w are formed on the first insulating layer 76. Alternatively, the first insulating layer 76 may be formed on U-phase busbar 54u, and V-phase busbar 54v and W-phase busbar 54w may be formed on the first insulating layer 76. Alternatively, the first insulating layer 76 may be formed on W-phase busbar 54w, and U-phase busbar 54u and V-phase busbar 54v may be formed on the first insulating layer 76. In these embodiments, two of the three busbars (U-phase busbar 54u, V-phase busbar 54v, and W-phase busbar 54w) are arranged in the +Z direction, and one busbar is arranged in the -Z direction. Alternatively, one of the three bus bars (U-phase bus bar 54u, V-phase bus bar 54v, and W-phase bus bar 54w) may be arranged in the +Z direction, and two of the bus bars may be arranged in the -Z direction.

[0054] In the present embodiment, the first insulating layer 76 is formed on the first negative electrode bus bar 56n, and the first positive electrode bus bar 56p is formed on the first insulating layer 76. Alternatively, the first insulating layer 76 may be formed on the first positive electrode bus bar 56p, and the first negative electrode bus bar 56n may be formed on the first insulating layer 76.

[0055] According to this embodiment, the bus bars (54u, 54v, 54w, 56p, 56n) are insulated from one another by the insulating material that constitutes the insulating substrate 74, and therefore the distance between the bus bars can be made shorter than if a space were provided between the bus bars. This allows the power conversion device 10 to be made smaller.

[0056] According to this embodiment, bus bars (54u, 54v, 54w, 56p, 56n) arranged on different layers overlap each other when viewed in the stacking direction. When two bus bars are arranged in the same region, an arrangement in which the two bus bars overlap each other allows each bus bar to be larger than an arrangement in which the two bus bars do not overlap each other. In other words, according to this embodiment, each bus bar can be larger, thereby improving the heat dissipation performance of the bus bars. On the other hand, when bus bars of the same size are arranged on a single substrate, an arrangement in which the two bus bars overlap each other allows the substrate to be smaller than an arrangement in which the two bus bars do not overlap each other. In other words, according to this embodiment, the substrate can be made smaller, allowing the space around the substrate to be used more effectively.

[0057] According to this embodiment, the three bus bars (54u, 54v, 54w) and the two bus bars (56p, 56n) are integrated together, which improves the ease of assembly of the PCU 10.

[0058] According to this embodiment, the snubber capacitor 88 is disposed near the power conversion unit 36, so that the switching performance of the power conversion unit 36 ​​can be maximized.

[0059] [5 Notes] The following additional notes are further disclosed regarding the above embodiment.

[0060] (Appendix 1) a first bus bar (54u) connected to a first phase terminal (44u) provided in the power conversion unit and disposed on the insulating substrate; a second bus bar (54v) connected to a second phase terminal (44v) provided in the power conversion unit and disposed on the insulating substrate; and a third bus bar (54w) connected to a third phase terminal (44w) provided in the power conversion unit and disposed on the insulating substrate, wherein the insulating substrate has a plurality of insulating layers (76, 78, 80), a first insulating layer (76) of the plurality of insulating layers is formed on the second bus bar, and the first bus bar and the third bus bar are formed on the first insulating layer, and the first bus bar, the second bus bar, and the third bus bar are insulated from each other by the insulating material constituting the insulating substrate.

[0061] According to the configuration of Supplementary Note 1, the bus bars are insulated from each other by the insulating material that constitutes the insulating substrate, so the distance between the bus bars can be made shorter than if a space were provided between the bus bars, thereby enabling the power conversion device to be made smaller.

[0062] (Appendix 2) In the power converter according to Supplementary Note 1, at least a portion of the first bus bar and at least a portion of the second bus bar may overlap when viewed in the stacking direction of the insulating substrates.

[0063] (Appendix 3) In the power converter described in Supplementary Note 2, at least a portion of the third bus bar and at least a portion of the second bus bar may overlap when viewed in the stacking direction of the insulating substrates.

[0064] According to the configurations of Supplementary Notes 2 and 3, busbars arranged on different layers overlap each other when viewed in the stacking direction. When two busbars are arranged in the same region, an arrangement in which the two busbars overlap each other allows each busbar to be larger than an arrangement in which the two busbars do not overlap each other. In other words, according to the present embodiment, each busbar can be made larger, thereby improving the heat dissipation performance of the busbars. On the other hand, when busbars of the same size are arranged on a single substrate, an arrangement in which the two busbars overlap each other allows the substrate to be smaller than an arrangement in which the two busbars do not overlap each other. In other words, according to the present embodiment, the substrate can be made smaller, allowing the space around the substrate to be used more effectively.

[0065] (Appendix 4) In the power converter according to any one of Supplementary Notes 1 to 3, each of the first phase terminal, the second phase terminal, and the third phase terminal may extend in a stacking direction of the insulating substrate and penetrate the insulating substrate.

[0066] (Appendix 5) The power conversion device described in Supplementary Note 1 may further include a fourth bus bar (56p) connected to the first DC terminals (46u, 46v, 46w) provided in the power conversion unit and disposed on the insulating substrate, and a fifth bus bar (56n) connected to the second DC terminals (48u, 48v, 48w) provided in the power conversion unit and disposed on the insulating substrate, wherein the first insulating layer is formed on the second bus bar and the fifth bus bar, the first bus bar, the third bus bar, and the fourth bus bar are formed on the first insulating layer, and the first bus bar, the second bus bar, the third bus bar, the fourth bus bar, and the fifth bus bar are insulated from each other by the insulating material that constitutes the insulating substrate.

[0067] According to the configuration of Supplementary Note 5, the first to third bus bars and the fourth and fifth bus bars are integrated together, which improves the assembly efficiency of the power converter.

[0068] (Appendix 6) In the power conversion device described in Supplementary Note 5, each of the first phase terminal, the second phase terminal, the third phase terminal, the first DC terminal, and the second DC terminal may extend in a stacking direction of the insulating substrate and penetrate the insulating substrate.

[0069] (Appendix 7) The power converter according to Supplementary Note 5 or 6 may further include a snubber capacitor (88) having one end connected to the fourth bus bar and the other end connected to the fifth bus bar.

[0070] According to the configuration of Supplementary Note 7, the snubber capacitor is disposed near the power conversion unit, so that the switching performance of the power conversion unit can be enhanced.

[0071] (Appendix 8) In the power converter according to any one of Supplementary Notes 1 to 7, the insulating substrate may be a printed circuit board.

[0072] According to the configuration of Supplementary Note 8, the bus bar is made thinner, which enables further miniaturization of the power conversion device.

[0073] Although the present disclosure has been described in detail, the present disclosure is not limited to the individual embodiments described above. Various additions, substitutions, modifications, partial deletions, etc. are possible in these embodiments without departing from the gist of the present disclosure or the spirit of the present disclosure derived from the content of the claims and their equivalents. These embodiments can also be implemented in combination. For example, in the above-described embodiments, the order of each operation and the order of each process are shown as examples and are not limited to these. The same applies when numerical values ​​or mathematical expressions are used in the description of the above-described embodiments. [Explanation of symbols]

[0074] 10...Power conversion device, power control unit, PCU 20... Generator (three-phase AC power supply) 36... Power conversion section 44u...U phase terminal (1st phase terminal) 44v...V phase terminal (2nd phase terminal) 44w…W phase terminal (3rd phase terminal) 46u, 46v, 46w...Positive terminal (1st DC terminal) 48u, 48v, 48w...Negative terminal (second DC terminal) 54u...U-phase busbar (first busbar) 54v...V-phase busbar (second busbar) 54w...W-phase busbar (third busbar) 56n...First negative bus bar (fifth bus bar) 56p...1st positive bus bar (4th bus bar) 74...insulating substrate 76...first insulating layer (insulating layer) 78... Second insulating layer (insulating layer) 80... Third insulating layer (insulating layer) 88...Snubber capacitor

Claims

1. a power conversion unit that converts three-phase AC power supplied from a three-phase AC power source into DC power; an insulating substrate made of an insulating material; a first bus bar connected to a first phase terminal provided in the power conversion unit and disposed on the insulating substrate; a second bus bar connected to a second phase terminal provided in the power conversion unit and disposed on the insulating substrate; a third bus bar connected to a third phase terminal provided in the power conversion unit and disposed on the insulating substrate; Equipped with the insulating substrate comprises a plurality of insulating layers; a first insulating layer of the plurality of insulating layers is formed on the second bus bar; the first bus bar and the third bus bar are formed on the first insulating layer; the first bus bar, the second bus bar, and the third bus bar are insulated from one another by the insulating material that constitutes the insulating substrate.

2. The power conversion device according to claim 1, a power conversion device in which, when viewed in a stacking direction of the insulating substrates, at least a portion of the first bus bar and at least a portion of the second bus bar overlap with each other.

3. The power conversion device according to claim 2, a third bus bar and a second bus bar, the third bus bar and the second bus bar being electrically connected to each other, the third bus bar and the second bus bar being electrically connected to each other, the second bus bar and the third bus bar being electrically connected to each other.

4. The power conversion device according to any one of claims 1 to 3, the first phase terminal, the second phase terminal, and the third phase terminal each extend in a stacking direction of the insulating substrate and penetrate the insulating substrate.

5. The power conversion device according to claim 1, a fourth bus bar connected to a first DC terminal provided in the power conversion unit and disposed on the insulating substrate; a fifth bus bar connected to a second DC terminal provided in the power conversion unit and disposed on the insulating substrate; Further provided with the first insulating layer is formed on the second bus bar and the fifth bus bar; the first bus bar, the third bus bar, and the fourth bus bar are formed on the first insulating layer; the first bus bar, the second bus bar, the third bus bar, the fourth bus bar, and the fifth bus bar are insulated from one another by the insulating material that constitutes the insulating substrate.

6. The power conversion device according to claim 5, the first phase terminal, the second phase terminal, the third phase terminal, the first DC terminal, and the second DC terminal each extend in a stacking direction of the insulating substrate and penetrate the insulating substrate.

7. The power conversion device according to claim 5, a snubber capacitor having one end connected to the fourth bus bar and the other end connected to the fifth bus bar.

8. The power conversion device according to claim 1, The power conversion device, wherein the insulating substrate is a printed circuit board.

Citation Information

Patent Citations

  • Power conversion device

    JP2021129406A