Pedestal for inserted and mounted component

Abstract

To provide a technique that holds the attitude of a component mounted on a substrate.SOLUTION: A pedestal 1 is formed into a substantially L-shape in a left side view by a support section 2 for supporting an element EL of a component and a protection section 3 erected perpendicularly to the support section 2 while being connected to the one end and is formed of an insulating material. The support section 2 is provided with a hole 4 penetrating in a vertical direction. The protection section 3 is provided with a slit 5 penetrating in the vertical direction. One lead wire LD 1 is passed through the hole 4, the other lead wire LD 2 is passed through the slit 5, and the element EL is landed on the support section 2. The height of the protection section 3 exceeds the height of the element EL landed on the support section 2. Most of a straight section of the U-shaped lead wire LD 2 is accommodated inside the slit 5. Therefore, the attitude of the component can be strongly held and falling can be prevented because the lead wire LD 2 hardly bends even if external force is applied thereto. A short-circuit with other components can be prevented because the straight section of the lead wire LD2 is not exposed.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a base for supporting components mounted on a board, particularly vertical components mounted upright on a board. [Background technology]

[0002] Vertical components have the advantage of allowing for high-density component mounting on a board. Patent Document 1 discloses a jig for mounting vertical components. Furthermore, to prevent elements of vertical components from getting stuck in through holes in a board, conventional methods have included applying a so-called kink process to the lead terminals connected to the underside of the element, as shown in Figure 5(A), or providing a flat base below the element, as shown in Figure 5(B). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 56-162826 Summary of the Invention [Problem to be solved by the invention]

[0004] The jig described above allows for accurate positioning of components on the board, and protects the lead wires until just before soldering, so it is believed that components can be mounted without bending or damaging the lead wires. However, this jig is designed for manual soldering and is not suitable for other methods, and on high-density boards, spatial constraints make it difficult to use such a jig every time an individual component is mounted.

[0005] Furthermore, the two conventional methods described above are believed to be able to prevent elements from entering through holes and securely hold them on the upper side of the board. However, even with these methods, if an external force is applied to the component, the component may tilt or tip over, or the lead wires may bend, which could cause the lead wires to approach areas with different potentials and short-circuit. To address this issue, preventative measures such as covering areas where short-circuiting is likely to occur with insulating tubes or gluing components to other components to prevent them from tipping over can be considered. However, these measures increase the amount of work required and reduce productivity, so a different solution is desired.

[0006] Therefore, an object of the present invention is to provide a technique for maintaining the posture of components mounted on a board. [Means for solving the problem]

[0007] In order to solve the above problems, the insert-mounted component base of the present invention is an insert-mounted component base used when mounting a component having an element and two lead wires connected to it on a substrate, and is made of a material that is at least insulating, and includes: a support part that has a first penetration part that penetrates part of itself in the vertical direction, and one of the lead wires is passed through the first penetration part to support the element of the component; and a protective part that is connected to one end of the support part and stands approximately perpendicular to the support part, and has a second penetration part that penetrates part of itself in the vertical direction, and the other lead wire is passed through the second penetration part. [Effects of the Invention]

[0008] According to the present invention, one lead wire is passed through the first penetrating portion and the element is supported by the supporting portion, while the other lead wire is passed through the second penetrating portion and its straight portion is protected by the protecting portion, so that the lead wire is less likely to bend even if the component is subjected to an external force, and the component can maintain its posture. Also, because the straight portion of the other lead wire is passed through a portion (protecting portion) of the insulating insertion-mount component base and is not exposed to the outside, this portion can be insulated from other components. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view of a base 1 according to an embodiment. [Figure 2] 1A and 1B are a plan view, a left side view, and a vertical cross-sectional view of a base 1. [Figure 3] FIG. 10 is a diagram showing a base 11 of a first modified example. [Figure 4] FIG. 10 is a diagram showing a base 21 of a second modified example. [Figure 5] FIG. 1 illustrates a conventional technique. DETAILED DESCRIPTION OF THE INVENTION

[0010] [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Figures 1 and 2 show a base 1 according to one embodiment. Figure 1(A) is a perspective view of the base alone, and Figure 1(B) is a perspective view showing the base 1 attached to an electronic component EC. Figure 2(A) is a plan view of the base 1, Figure 2(B) is a left side view of the base 1 attached to an electronic component EC, and Figure 2(C) is a vertical cross-sectional view (a cross-sectional view taken along line II-II in Figure 2).

[0011] The base 1 is used to maintain the posture of the vertical electronic component EC mounted on the board, and is composed of a support portion 2 that supports the element EL of the electronic component EC, and a protective portion 3 that is connected to one end of the support portion 2 and stands perpendicular (at a right angle) to the support portion 2, forming a generally L-shaped configuration when viewed from the left side. The base 1 is made of at least an insulating material (e.g., resin), but it is desirable that the protective portion 3 has heat resistance so that it can withstand the heat that occurs during flow soldering. In the illustrated example, the protective portion 3 stands perpendicular to the support portion 2, but it does not need to be perfectly perpendicular and may be slightly inclined.

[0012] In the electronic component EC, two lead wires are connected, one to each end of the element EL, and in the initial state, both lead wires extend straight and are arranged in a straight line, but before the base 1 is attached, one of the lead wires is bent into a U-shape so that the straight part becomes approximately parallel to the other lead wire.

[0013] The support part 2 has a hole 4 (first through-hole) that penetrates in its thickness direction (vertical direction). The protection part 3 has a slit 5 (second through-hole) that penetrates in its height direction (vertical direction). The diameter of the hole 4 and the width of the slit 5 are designed to be slightly larger than the outer diameter of the lead wire connected to the element EL so that the lead wire can be passed through smoothly. The lead wire LD1 connected to the lower end of the element EL is passed through the hole 4, and the straight portion of the U-shaped lead wire LD2 connected to the upper end of the element EL is passed through the slit 5.

[0014] When the lead wires LD1 and LD2 are passed through the hole 4 and the slit 5, respectively, and the base 1 is moved along the lead wires, the element EL eventually restricts the movement of the base 1 and lands on the support part 2. In the example shown, the size of the support part 2 in the horizontal direction exceeds the size of the element EL; in other words, the entire outer shape of the element EL that has landed on the support part 2 is contained within the space above the support part 2, but the support part 2 may be of any size as long as it can stably support the element EL. For example, the size may be such that part of the outer shape of the landed element EL protrudes from the space above the support part 2.

[0015] The height of the protective portion 3 exceeds the height of the element EL when it is seated on the support portion 2. More precisely, when the element EL is seated on the support portion 2, the upper end of the protective portion 3 is higher than the upper end of the element EL. By setting the protective portion 3 at this height, most of the straight portions of the U-shaped lead wires LD2 are housed inside the slits 5 and protected by the protective portion 3, making it difficult for the lead wires LD2 to bend even when subjected to external force, and thus the posture of the electronic component EC can be firmly maintained. Furthermore, because the protective portion 3 (base 1) has insulating properties and the straight portions of the lead wires LD2 are housed inside the slits 5 and not exposed, this portion can be reliably insulated from other components to prevent short circuits and ensure safety.

[0016] Furthermore, since the base 1 can be used by simply bending one of the two lead wires of the electronic component into a U-shape, the labor required to mount the electronic component can be minimized.

[0017] The present invention is not limited to the above-described embodiment and can be practiced in various modified forms. Each modified form will be described below, with different reference numerals assigned to parts that differ from the base 1 of the embodiment.

[0018] [First Modified Example] Fig. 3 shows the base 11 of the first modified example. Fig. 3(A) is a perspective view thereof, Fig. 3(B) is a plan view thereof, and Fig. 3(C) is a vertical cross-sectional view thereof (a cross-sectional view taken along line III-III in Fig. 3).

[0019] In the base 11 of the first modification, a hole 15 having approximately the same diameter as the hole 4 is provided instead of the slit 5 in the base 1 of the embodiment. That is, in the base 11, both of the two lead wires LD1 and LD2 of the electronic component EC are passed through the holes.

[0020] In the embodiment of the base 1, in consideration of ease of manufacturing, the space through which the lead wire LD1 passes is formed as a hole, and the space through which the lead wire LD2 passes is formed as a slit, but even if both spaces are formed as holes as in the case of the base 11, the same effect as the base 1 can be achieved.

[0021] Furthermore, although not shown in the drawings, instead of forming both spaces through which the two lead wires LD1 and LD2 pass as holes, both may be formed as slits. Alternatively, contrary to the base 1 of the embodiment, the space through which the lead wire LD1 passes may be formed as a slit (a slit provided in the support portion 2) while the space through which the lead wire LD2 passes may be formed as a hole (a hole provided in the protective portion 3). In these cases, the slit provided in the support portion 2 may be cut from any position on the outer periphery of the support portion 2. These configurations also make it possible to maintain the posture of the electronic component EC and ensure insulation. However, if both are slits, there is a risk that the base will fall off before the electronic component EC is mounted on the board, so it is desirable to make at least one of them a hole.

[0022] [Second Modification] Fig. 4 shows the base 21 of the second modified example. Fig. 4(A) is a perspective view of the base alone, Fig. 4(B) is a left side view showing the base 21 attached to the electronic component EC, and Fig. 4(C) is a vertical cross-sectional view of the base 21 cut at a position passing through the centers of the hole 4 and the slit 5.

[0023] In base 21 of the second modified example, an additional slit 26 is provided in the bottom. Bottom slit 26 has a shape of a notch that penetrates through a portion of the bottom of base 21 that includes the positions where hole 4 and slit 5 are provided, from one side surface (for example, the left side surface) of base 21 to the opposite side surface (for example, the right side surface).

[0024] When the electronic component EC is mounted on a double-sided board, it is necessary to ensure that the solder is sufficiently spread throughout the through-holes through which the lead wires LD1 and LD2 pass. However, if the base blocks the through-holes, it may be difficult for the solder to rise.

[0025] 4(B), base 21 having bottom slits 26 lands on double-sided board DB at a front portion 27 and a rear portion 28 of the bottom of base 21, and a space SP surrounded by bottom slits 26 and double-sided board DB is formed below holes 4 and slits 5, making it easier for solder to rise and improving solderability. Furthermore, after mounting electronic components EC on double-sided board DB, the state of solder ripening can be visually checked from bottom slits 26, making it possible to visually check whether soldering has been performed properly.

[0026] Furthermore, although not shown, when the electronic component EC is mounted on a double-sided board, instead of providing a bottom slit in the base, the lower part of the first penetration portion (e.g., hole 4) that penetrates the support portion 2 in the vertical direction may be carved out larger than the upper part of the first penetration portion (making the diameter of the lower part larger than the diameter of the upper part), and the lower part of the second penetration portion (e.g., slit 5) that penetrates the protective portion 3 in the vertical direction may be carved out larger than the upper part of the second penetration portion (making the width of the lower part larger than the width of the upper part).In other words, the horizontal cross-section at each lower part of the two penetration portions (e.g., hole 4 and slit 5) that penetrate in the vertical direction may be made larger than the horizontal cross-section at each upper part, thereby preventing the base from blocking the through-holes.

[0027] When using a base of this shape, since there is no bottom slit, it is not possible to visually check the state of the soldering, but since the lower parts of the two through-holes are hollowed out more than the upper parts, a space is formed around the upper part of the through-holes through which the lead wires LD1 and LD2 are passed (the through-holes are not blocked by the base), which improves solderability. [Explanation of symbols]

[0028] 1 pedestal 2 Support part 3 Protective part 4 holes (1st penetration part) 5 Slit (second penetration part)

Claims

1. An insertion mount component base used when mounting a component having an element and two lead wires connected to the element on a substrate, a support portion having a first penetration portion penetrating a part of itself in the vertical direction, one lead wire being passed through the first penetration portion to support an element of the component; a protective portion connected to one end of the support portion, standing substantially perpendicular to the support portion, and having a second penetration portion penetrating a part of the protective portion in the up-down direction, and the other lead wire being passed through the second penetration portion; An insertion-mount component base formed of a material having at least insulating properties.

2. 2. The insertion-mount component base according to claim 1, The first penetration portion and the second penetration portion are A base for an insertion-mounted component, at least one of which is a hole.

3. 2. The insertion-mount component base according to claim 1, The material is An insertion-mount component base further having heat resistance.

4. 4. The insertion-mounted component base according to claim 1, The base for an insertion-mounted component further includes a bottom slit formed by cutting out a portion of the bottom of the base for an insertion-mounted component that includes the formation positions of the first penetration portion and the second penetration portion from one side to another side opposite thereto.

5. 4. The insertion-mounted component base according to claim 1, The first penetration portion and the second penetration portion are The base for an insertion-mounted component is characterized in that the lower portions of the base are hollowed out to a larger extent than the upper portions of the base.

Images