Electronic apparatus, imaging apparatus, and movable body

Abstract

To improve heat dissipation properties with a configuration that is simple while having radiation noise blocking properties.SOLUTION: An electronic apparatus has a first substrate, a second substrate, a first sheet metal, and a second sheet metal. The first substrate and the second substrate have electronic components mounted thereon, and are located in a lamination direction such that principal surfaces are opposite to each other. The first sheet metal has: a plate part that is interposed between the first substrate and the second substrate and is in direct or indirect contact with the electronic components mounted respectively on the first substrate and the second substrate; and a first blocking part that covers part of a side face of the first substrate. The second sheet metal has a second blocking part that covers the entire periphery of a side face of the second substrate and a side face of the first substrate exposed from the first sheet metal. The first sheet metal and the second sheet metal are in direct or indirect contact with each other.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to an electronic device, an imaging device, and a mobile object. [Background technology]

[0002] Electronic devices such as vehicle-mounted cameras are required to be smaller and perform a variety of processes at high speed. As circuit boards become more multilayered and highly integrated to achieve miniaturization, the radiation noise and heat generated by electronic devices on the circuit boards increases. To address this issue, a configuration has been proposed in which the entire side of the circuit board is covered with a shielding material, and the circuit board and the heat transfer material are in contact with each other via a heat transfer material made of a soft material such as silicone gel (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-259101 Summary of the Invention [Problem to be solved by the invention]

[0004] However, there is a demand for electronic devices that have shielding properties against radiation noise while also improving heat dissipation properties with a simple configuration.

[0005] Therefore, an object of the present disclosure, made in consideration of the problems of the conventional technology described above, is to provide an electronic device, an imaging device, and a mobile object that have shielding properties against radiation noise while further improving heat dissipation properties with a simple configuration. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems, an electronic device according to a first aspect comprises: a first substrate and a second substrate mounted with electronic components and positioned in a stacking direction with their main surfaces facing each other; a first metal plate having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly contacting the electronic components mounted on the first substrate and the second substrate, and a first shielding portion covering a part of a side surface of the first substrate; a second metal plate having a second shielding portion that covers the entire periphery of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate; The first metal plate and the second metal plate are in direct or indirect contact with each other.

[0007] An imaging device according to a second aspect comprises: a first substrate and a second substrate mounted with electronic components and positioned in a stacking direction with their main surfaces facing each other; a first metal plate having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly contacting the electronic components mounted on the first substrate and the second substrate, and a first shielding portion covering a part of a side surface of the first substrate; a second metal plate having a second shielding portion that covers the entire periphery of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate; The first metal plate and the second metal plate are in direct or indirect contact with each other.

[0008] Furthermore, a moving body according to the third aspect is a first substrate and a second substrate mounted with electronic components and positioned in a stacking direction with their main surfaces facing each other; a first metal plate having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly contacting the electronic components mounted on the first substrate and the second substrate, and a first shielding portion covering a part of a side surface of the first substrate; a second metal plate having a second shielding portion that covers the entire periphery of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate; The first metal plate and the second metal plate are equipped with imaging devices that come into direct or indirect contact with each other. [Effects of the Invention]

[0009] According to the present disclosure configured as described above, the heat dissipation performance is further improved with a simple configuration while providing shielding against radiation noise. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a layout diagram showing a mounting position of an electronic device according to a first embodiment on a moving object. [Figure 2] 2 is a cross-sectional view showing a schematic configuration of the electronic device of FIG. 1, taken along the optical axis of an imaging optical system. [Figure 3] 3 is a cross-sectional view of the electronic device of FIG. 1 rotated 90° about the optical axis from the cross-section of FIG. 2. FIG. [Figure 4] FIG. 4 is a front perspective view showing the appearance of the first substrate and the second substrate of FIGS. [Figure 5] FIG. 4 is a rear perspective view showing the appearance of the first substrate and the second substrate of FIGS. [Figure 6] FIG. 4 is a perspective view showing the appearance of the first metal plate of FIGS. [Figure 7] FIG. 7 is a planar development view of the first metal plate in FIG. 6. [Figure 8] FIG. 4 is a perspective view showing the appearance of the second metal plate of FIGS. [Figure 9] FIG. 9 is a planar development view of the second metal plate of FIG. 8. [Figure 10] FIG. 4 is a perspective view showing the appearance of the first housing of FIGS. [Figure 11] FIG. 4 is a perspective view showing the appearance of the second housing of FIGS. [Figure 12] 4A and 4B are diagrams illustrating a method for manufacturing the electronic device of FIGS. 2 and 3, showing a step of assembling a third metal plate and an imaging element cover to an imaging optical system. [Figure 13] 4A and 4B are diagrams showing a method for manufacturing the electronic device of FIGS. 2 and 3, illustrating a step of assembling a first substrate to an imaging optical system. [Figure 14] 4A and 4B are diagrams illustrating a method for manufacturing the electronic device of FIGS. 2 and 3, showing another step of assembling the first substrate and the second substrate to the first metal plate. [Figure 15] 4 is a diagram showing a method for manufacturing the electronic device of FIGS. 2 and 3, illustrating yet another step of assembling the first substrate and the second substrate to the first metal plate. FIG. [Figure 16] 4 is a diagram showing a method for manufacturing the electronic device of FIGS. 2 and 3, illustrating a step of assembling a second metal plate to a first metal plate. FIG. [Figure 17] FIG. 4 is a perspective view showing the appearance of the internal structure of the electronic device of FIGS. [Figure 18] FIG. 10 is a perspective view showing the appearance of another internal structure of the electronic device according to the second embodiment. [Figure 19] FIG. 20 is a perspective view showing the appearance of a first metal plate included in the internal structure of FIG. 18. [Figure 20] 20 is a perspective view showing the appearance of the first metal plate of FIG. 19 from an angle different from that of FIG. 19. FIG. [Figure 21] FIG. 20 is a planar development view of the first metal plate of FIG. 19. [Figure 22] FIG. 20 is a perspective view showing the appearance of a second metal plate included in the internal structure of FIG. 18. [Figure 23] FIG. 23 is a planar development view of the second metal plate of FIG. 22. [Figure 24] 19 is a diagram showing a method for manufacturing the internal structure of FIG. 18, illustrating a step of assembling a first metal plate to a first substrate. FIG. [Figure 25] 25 is a diagram showing a state in which the first metal plate shown in FIG. 24 is attached to a first substrate. FIG. [Figure 26] 19 is a diagram showing a method for manufacturing the internal structure of FIG. 18, illustrating a step of assembling a second substrate to the imaging optical system. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, an electronic device, an imaging device, and a moving object according to a first embodiment of the present disclosure will be described with reference to the drawings.

[0012] The electronic device according to the first embodiment is, for example, an imaging device. As shown in FIG. 1, an electronic device 10 applied to the imaging device according to the first embodiment is mounted on a moving object 11, for example.

[0013] The mobile object 11 may include, for example, vehicles, ships, and aircraft. Vehicles may include, for example, automobiles, industrial vehicles, rail vehicles, residential vehicles, and fixed-wing aircraft that travel on runways. Automobiles may include, for example, passenger cars, trucks, buses, motorcycles, and trolleybuses. Industrial vehicles may include, for example, agricultural and construction vehicles. Industrial vehicles may include, for example, forklifts and golf carts. Agricultural industrial vehicles may include, for example, tractors, cultivators, transplanters, binders, combines, and lawn mowers. Construction industrial vehicles may include, for example, bulldozers, scrapers, excavators, cranes, dump trucks, and road rollers. Vehicles may include human-powered vehicles. Vehicle classifications are not limited to the above examples. For example, automobiles may include industrial vehicles that can travel on roads. The same vehicle may be included in multiple classifications. Marine vessels may include, for example, marine jets, boats, and tankers. Aircraft may include, for example, fixed-wing aircraft and rotary-wing aircraft.

[0014] 2 and 3 , the electronic device 10 includes a first substrate 12, a second substrate 13, a first metal plate 14, and a second metal plate 15. The electronic device 10 may further include an imaging optical system 16, a first housing 17, and a second housing 18.

[0015] As shown in FIGS. 4 and 5, the first substrate 12 is flat. The first substrate 12 may be substantially rectangular. As shown in FIGS. 2 and 3, the first substrate 12 has an imaging element 19 mounted thereon as an electronic component on the surface opposite to the surface facing the flat portion 23 (described later). The imaging element 19 is, for example, a charge-coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor, and generates an image signal by capturing an optical image formed on a light-receiving surface. The first substrate 12 has an electronic component 20 mounted thereon on at least one of its main surfaces. The electronic component 20 drives the imaging element 19 or processes the image signal generated by the imaging element 19.

[0016] As shown in FIGS. 4 and 5, the second substrate 13 is flat. The second substrate 13 may be substantially rectangular. The second substrate 13 has an electronic component 20 mounted on at least one of its main surfaces. The electronic component 20 drives the image sensor 19 or processes image signals generated by the image sensor 19. The second substrate 13 may have a first connector 21 mounted on one of its main surfaces for electrically connecting to the second housing 18.

[0017] The first substrate 12 may be electrically connected to the second substrate 13 by a flexible substrate 22. As shown in Fig. 4, with the entire flexible substrate 22 extended into a flat plate, the imaging element 19 of the first substrate 12 and the first connector 21 of the second substrate 13 may be mounted on the same main surface.

[0018] As shown in FIGS. 2 and 3, in electronic device 10, first substrate 12 and second substrate 13 are positioned in the stacking direction so that their respective main surfaces face each other.

[0019] As shown in FIG. 6, the first metal plate 14 has a flat plate portion 23 and a first shielding portion 24.

[0020] The flat plate portion 23 has a flat plate shape. The flat plate portion 23 may be generally rectangular and wider than the first substrate 12 and the second substrate 13. As shown in FIGS. 2 and 3 , in the electronic device 10, the flat plate portion 23 is interposed between the first substrate 12 and the second substrate 13 in the stacking direction. In the electronic device 10, the main surface of the flat plate portion 23 may be generally parallel to the main surfaces of the first substrate 12 and the second substrate 13.

[0021] 6, the flat plate portion 23 has an opening 25 near the side that connects to the first shielding portion 24. The opening 25 may be substantially rectangular. As shown in FIG. 2, in the electronic device 10, the opening 25 is hooked to two hook portions 33 of the second metal plate 15.

[0022] In the electronic device 10, the flat plate portion 23 directly or indirectly abuts against the electronic components 20 mounted on each of the first substrate 12 and the second substrate 13. In the electronic device 10, the flat plate portion 23 indirectly abuts against the image sensor 19, which is an electronic component, via, for example, a heat dissipation sheet 27 and the first substrate 12. In the electronic device 10, the flat plate portion 23 indirectly abuts against the electronic components 20 mounted on the second substrate 13 via, for example, the heat dissipation sheet 27. The heat dissipation sheet 27 may be formed from a soft, shape-conforming material with relatively high thermal conductivity, such as silicone rubber containing a filler.

[0023] 6, the first shielding portion 24 is provided upright along part of the outer edge of the flat plate portion 23 on the main surface side of the flat plate portion 23 facing the first substrate 12. For example, the first shielding portion 24 is provided upright along the entirety of any one side of the flat plate portion 23 and parts of two sides sandwiching the side. As shown in FIGS. 2 and 3, in the electronic device 10, the first shielding portion 24 covers part of the side surface of the first substrate 12.

[0024] As shown in Fig. 6, the first shielding portion 24 has a first fixing portion 26. In this embodiment, the first shielding portion 24 has the first fixing portion 26 in the approximate center of the side opposite the side connected to the flat plate portion 23. As shown in Figs. 2 and 3, the first metal plate 14 is fixed to the lens barrel 16A that houses the imaging optical system 16 by the first fixing portion 26. The first fixing portion 26 is fixed to the lens barrel 16A of the imaging optical system 16 by, for example, engagement, but is not limited to this, and welding, adhesion with an adhesive, fastening with screws, etc. may also be applied.

[0025] The first metal sheet 14 is formed by bending a predetermined portion of a metal sheet, in other words, a metal flat plate of a desired shape, as shown in FIG. 7. In FIG. 7, the straight line bending toward the front side is indicated by a dashed line, and the straight line bending toward the back side is indicated by a dashed line. Therefore, by extending the bent portion of the first metal sheet 14 to make it flat, any portion of the first metal sheet 14 is separated from each other without interference. The first metal sheet 14 may be formed of a metal with high thermal conductivity, such as copper.

[0026] As shown in FIG. 8, the second metal plate 15 has a second shielding portion .

[0027] The second shielding portion 28 has a generally rectangular, square-tube shape, with one side of the rectangle in its axial cross section and portions of the two sides sandwiching the first side protruding in the axial direction in a C-shape. That is, the second shielding portion 28 has a generally rectangular, square-tube-shaped full shielding portion 30 and a square-tube-shaped partial shielding portion 29 that is continuous with the full shielding portion 30 in the axial direction and has a partially cut-out portion in the circumferential direction. As shown in FIGS. 2 and 3 , in the electronic device 10, the second metal plate 15 covers the entire side surface of the second substrate 13 and the side surface of the first substrate 12 exposed from the first metal plate 14. In this configuration, the full shielding portion 30 covers the entire side surface of the second substrate 13. Furthermore, the partial shielding portion 29 covers the side surface of the first substrate 12 exposed from the first metal plate 14.

[0028] As shown in FIG. 8 , the second shielding portion 28 has a second fixing portion 31 at the end of the partial shielding portion 29 on the axial side. That is, the second shielding portion 28 has the second fixing portion 31 at the edge of the partial shielding portion 29 on the opposite side from the direction in which the partial shielding portion 29 continues to the full shielding portion 30. In this embodiment, the second fixing portion 31 is disposed on a surface sandwiched between two of the three surfaces of the partial shielding portion 29. As shown in FIG. 2 , the second metal plate 15 is fixed to the barrel 16A that houses the imaging optical system 16 by the second fixing portion 31. The second fixing portion 31 is fixed to the barrel 16A of the imaging optical system 16 by, for example, engagement, but is not limited to this, and welding, adhesion with an adhesive, fastening with screws, etc. may also be applied.

[0029] As shown in FIG. 8 , the entire shielding portion 30 of the second shielding portion 28 has a gap 32 in the circumferential direction. The gap 32 is a gap between the opposing ends of a flat metal plate when the second metal plate 15 is formed by bending the flat metal plate. The entire shielding portion 30 of the second shielding portion 28 has two hooking portions 33 adjacent to each other with the gap 32 in between, near the gap 32. The two hooking portions 33 are located at the ends of the entire shielding portion 30 in the axial direction. As shown in FIG. 2 , in the electronic device 10, the two hooking portions 33 are hooked to the openings 25 of the first metal plate 14.

[0030] 8, the second fixing portion 31 and the two hooking portions 33 are provided on opposing surfaces of the second shielding portion 28. As a result, when the first metal plate 14 and the second metal plate 15 are attached to the electronic device 10 as shown in FIG. 2, the first fixing portion 26 of the first metal plate 14 and the second fixing portion 31 of the second metal plate 15 sandwich the lens barrel 16A housing the imaging optical system 16 from two directions perpendicular to the optical axis.

[0031] The second metal sheet 15 is formed by bending a predetermined portion of a metal sheet, in other words, a metal flat plate of a desired shape, as shown in FIG. 9. In FIG. 9, the straight line bending toward the front side is indicated by a dashed line, and the straight line bending toward the back side is indicated by a dashed line. Therefore, by extending the bent portion of the second metal sheet 15 to make it flat, any portion of the second metal sheet 15 is separated from each other without interfering with each other. The second metal sheet 15 may be formed of a metal with high thermal conductivity, such as copper.

[0032] The imaging optical system 16 is composed of optical elements such as lenses. The imaging optical system 16 is designed and formed so that its optical characteristics, such as the angle of view and depth of field, are desired. The imaging optical system 16 forms an image of a subject on the light receiving surface of the imaging element 19.

[0033] As shown in Fig. 10, the first housing 17 may be cylindrical with a rectangular cross section. As shown in Figs. 2 and 3, the first housing 17 may house the imaging optical system 16 so that the optical axis of the imaging optical system 16 substantially coincides with the axis of the first housing 17 and the imaging optical system 16 is exposed from one opening. The first housing 17 may house the first substrate 12 so that the imaging element 19 is fixed at a predetermined position and in a predetermined orientation relative to the imaging optical system 16. The first housing 17 may house the second substrate 13, the first metal plate 14, and the second metal plate 15 so that the first substrate 12 has the above-described configuration.

[0034] 2 and 3, a third metal plate 34 and an image sensor cover 35 are provided between the imaging optical system 16 and the first substrate 12 to surround the side of the image sensor 19 in the stacking direction. The third metal plate 34 may be made of a metal with high thermal conductivity, such as copper. The third metal plate 34 and the image sensor cover 35 dissipate heat generated by the image sensor 19 to the outside. The image sensor cover 35 may be made of a soft material with shape-following properties and relatively high thermal conductivity, such as silicone rubber containing a filler.

[0035] As shown in Fig. 11, the second housing 18 may have a shape including a flat portion and a rectangular prism extending perpendicular to the main surface of the flat portion. The second housing 18 may have a second connector 36 that can be mated with the first connector 21. The second housing 18 may have a fourth metal plate 37. As shown in Figs. 2 and 3, in the electronic device 10, the fourth metal plate 37 abuts against the second metal plate 15. The flat portion of the second housing 18 may be sealed to the opening on the side of the first housing 17 opposite to the side that exposes the imaging optical system 16, i.e., on the image side in the optical axis direction of the imaging optical system 16.

[0036] Next, a method for manufacturing the electronic device 10 will be described below.

[0037] 12, a third metal plate 34 and an imaging element cover 35 are attached to a lens barrel 16A that houses the imaging optical system 16, on the image side in the optical axis direction of the imaging optical system 16. The third metal plate 34 is fixed to the lens barrel 16A of the imaging optical system 16 by a third fixing portion 38 that the third metal plate 34 has.

[0038] As shown in FIG. 13, the first substrate 12 is fixed on the image side of the imaging optical system 16 in the optical axis direction so that the imaging optical system 16 and the imaging element 19 face each other.

[0039] 14 , the flat portion 23 of the first metal plate 14 is attached to the first substrate 12. A heat dissipation sheet 27 may be used to attach the flat portion 23 of the first metal plate 14 to the first substrate 12. At this time, the first shielding portion 24 of the first metal plate 14 does not cover the portion of the first substrate 12 where the flexible substrate 22 is provided. In addition, the first metal plate 14 is fixed to the lens barrel 16A by a first fixing portion 26.

[0040] 15, the flexible substrate 22 is folded back, and the second substrate 13 is attached to the flat plate portion 23. A heat dissipation sheet 27 may be used to attach the flat plate portion 23 of the first metal plate 14 and the second substrate 13 together.

[0041] 16, the second metal plate 15 is attached so as to cover the periphery of the second substrate 13 from the first connector 21 side in the optical axis direction of the imaging optical system 16. Two latching portions 33 of the second metal plate 15 are latched to the openings 25 of the first metal plate 14. The second metal plate 15 is also fixed to the lens barrel 16A of the imaging optical system 16 by the second fixing portions 31. In this way, an internal structure 39 of the electronic device 10 is configured, as shown in FIG.

[0042] As shown in FIGS. 2 and 3 , the second substrate 13 is connected to the second housing 18 by fitting the first connector 21 into the second connector 36. This brings the fourth metal plate 37 into contact with the second metal plate 15. Thereafter, the first housing 17 is placed over the second housing 18 so as to cover the internal structure 39. That is, the first housing 17 is placed over the second housing 18 so as to cover the imaging optical system 16, the first substrate 12, the second substrate 13, the first metal plate 14, and the second metal plate 15. With the first housing 17 placed over the internal structure 39, the first housing 17 is fixed to the second housing 18, thereby manufacturing the electronic device 10. The first housing 17 and the second housing 18 can be fixed together by, for example, welding, bonding with an adhesive, or fastening with screws.

[0043] The electronic device 10 according to the first embodiment configured as described above has a flat plate portion 23 that is interposed between the first substrate 12 and the second substrate 13 and indirectly abuts against the image sensor 19 mounted on the first substrate 12 and the electronic components 20 mounted on the second substrate 13. With this configuration, the image sensor 19 mounted on the first substrate 12 and the electronic components 20 mounted on the second substrate 13, which are heat sources, are close to the flat plate portion 23, which generally has higher thermal conductivity than the heat dissipation sheet 27, and therefore the heat dissipation performance is improved compared to a configuration in which only the heat dissipation sheet 27 is interposed.

[0044] Furthermore, in the electronic device 10 according to the first embodiment, the first shielding portion 24 and the second shielding portion 28 cover the entire periphery of the side surface of the first substrate 12. With this configuration, the electronic device 10 can shield against radiated noise from the electronic components 20 mounted on the first substrate 12. Furthermore, in the electronic device 10 according to the first embodiment, the second shielding portion 28 covers the entire periphery of the side surface of the second substrate 13. With this configuration, the electronic device 10 can shield against radiated noise from the electronic components 20 mounted on the second substrate 13.

[0045] Furthermore, in the electronic device 10 according to the first embodiment, the first metal plate 14 has the flat plate portion 23 and the first shielding portion 24. Furthermore, in the electronic device 10, the second metal plate 15 has the second shielding portion 28. With this configuration, in the electronic device 10, the flat plate portion 23 and the first shielding portion 24 having the above-described configuration, and the second shielding portion 28 having the above-described configuration can be manufactured with a simple configuration without undergoing a process such as welding.

[0046] Therefore, as described above, the electronic device 10 according to the first embodiment can further improve heat dissipation performance with a simple configuration while having the ability to block radiation noise.

[0047] Furthermore, in the electronic device 10 according to the first embodiment, the first metal plate 14 and the second metal plate 15 are in direct or indirect contact with each other. This configuration improves heat transfer between the first metal plate 14 and the second metal plate 15 compared to a configuration in which the first metal plate 14 and the second metal plate 15 are isolated from each other. Therefore, the electronic device 10 can further improve heat dissipation by transferring heat generated by a component that is in direct or indirect contact with only one of the first metal plate 14 and the second metal plate 15 to the other metal plate. For example, in the above-described configuration, if either the first metal plate 14 or the second metal plate 15 is in contact with a heat transfer body, such as the fourth metal plate 37, for transferring heat from inside the electronic device 10 to the outside, the electronic device 10 can transfer heat from the other metal plate to the heat transfer body.

[0048] Furthermore, in the electronic device 10 according to the first embodiment, the first shielding portion 24 of the first metal sheet 14 covers a portion of the side surface of the first substrate 12, and the second shielding portion 28 of the second metal sheet 15 covers a portion of the side surface of the first substrate 12 exposed through the first shielding portion 24 and the entire periphery of the second substrate 13. With this configuration, even in a configuration in which the first substrate 12 and the second substrate 13 are connected by wiring such as the flexible substrate 22 extending from the side surface of the first substrate 12, the electronic device 10 can easily attach the first substrate 12 and the second substrate 13 to the first metal sheet 14 while still providing shielding against radiation noise from the electronic components 20 mounted on each of the first substrate 12 and the second substrate 13.

[0049] Furthermore, in the electronic device 10 according to the first embodiment, the second metal plate 15 has a latching portion 33, and the first metal plate 14 and the second metal plate 15 directly abut at the latching portion 33. With this configuration, the electronic device 10 can increase heat transfer between the first metal plate 14 and the second metal plate 15 and can stably connect the first metal plate 14 and the second metal plate 15.

[0050] Furthermore, in the electronic device 10 according to the first embodiment, the second metal plate 15 has two adjacent hooking portions 33 on the second shielding portion 28, with a gap 32 sandwiched therebetween. With this configuration, the electronic device 10 can impart springiness to the hooking portions 33, making it easier to insert and fix the hooking portions 33 of the second metal plate 15 into the opening 25 of the first metal plate 14. Furthermore, the electronic device 10 can reduce a decrease in shielding performance by sandwiching the two adjacent hooking portions 33 across the gap 32 between the opening 25, making it difficult for the gap 32 to widen.

[0051] Furthermore, in the electronic device 10 according to the first embodiment, the flexible substrate 22 connecting the first substrate 12 and the second substrate 13 is covered with the second shielding portion 28. With this configuration, the electronic device 10 can suppress a decrease in the shielding ability against radiation noise of the electronic components 20 mounted on each of the first substrate 12 and the second substrate 13, while using the flexible substrate 22 that contributes to facilitating manufacturing and reducing manufacturing costs.

[0052] Next, with reference to FIGS. 18 to 26, an electronic device 10 according to a second embodiment of the present disclosure will be described. In the second embodiment, the configuration of the internal structure of the electronic device 10 is different from that of the first embodiment. More specifically, as shown in FIG. 18, in an internal structure 39-2 according to the second embodiment, the shapes of the first metal plate 14-2 and the second metal plate 15-2 are different from the shapes of the first metal plate 14 and the second metal plate 15 of the internal structure 39 according to the first embodiment shown in FIG. 17. The second embodiment will be described below, focusing on the differences from the first embodiment. Note that parts having the same configuration as in the first embodiment are denoted by the same reference numerals.

[0053] The first metal plate 14-2 will be described with reference to Figures 19 and 20. As shown in Figure 19, the first metal plate 14-2 has a flat plate portion 23-2 and a first shielding portion 24-2.

[0054] The flat plate portion 23-2 differs from the flat plate portion 23 according to the first embodiment in that it does not have an opening 25 in its main surface. The structure of the flat plate portion 23-2 may be the same as that of the flat plate portion 23 according to the first embodiment, except for the fact that it does not have the opening 25. Furthermore, the relationship between the flat plate portion 23-2 and the first and second substrates 12 and 13 may be the same as that according to the first embodiment.

[0055] The first shielding portion 24-2 is provided upright along a portion of the outer edge of the flat plate portion 23-2. For example, the first shielding portion 24-2 is connected to the flat plate portion 23-2 along the entirety of any two opposing sides of the flat plate portion 23-2. The first shielding portion 24-2 is provided upright along those two sides and along portions of the other two sides that sandwich those two sides. On one of the two sides not connected to the first shielding portion 24-2, the first shielding portion 24-2 is provided upright at both ends of that side with a gap of distance D therebetween. The distance D may be longer than the width of the flexible substrate 22.

[0056] The flat plate portion 23-2 has an upright portion 40 that stands along part of the outer edge of the flat plate portion 23-2 in the opposite direction to the first shielding portion 24-2. The main surface of the upright portion 40 faces the surface of the first shielding portion 24-2 with a gap of distance D. The upright portion 40 connects the first shielding portion 24-2 to a side of the outer edge of the flat plate portion 23-2 that is different from the side to which the first shielding portion 24-2 is connected.

[0057] 20 is a view showing the first metal plate 14-2 from the opposite side in a direction perpendicular to the flat plate portion 23-2 compared to FIG. 19. As shown in FIG. 20, the first shielding portion 24-2 has a contact portion 41 extending to the opposite side from the standing portion 40 on the surface opposite to the surface on which the gap of distance D is provided. In the electronic device 10, the contact portion 41 comes into contact with the third metal plate 34.

[0058] The first metal plate 14-2 is formed by bending a predetermined portion of a metal plate, in other words, a metal flat plate of a desired shape, as shown in FIG. 21. In FIG. 21, the straight lines bending toward the front side are indicated by dashed lines, and the straight lines bending toward the back side are indicated by dashed lines. Therefore, by extending the bent portions of the first metal plate 14-2 into a flat shape, any portions of the first metal plate 14-2 are separated from each other without interfering with each other. The first metal plate 14-2 may be formed from a metal with high thermal conductivity, such as copper.

[0059] As shown in FIG. 22, the second metal plate 15-2 has a second shielding portion 28-2.

[0060] The second shielding portion 28-2 has a generally rectangular tubular shape, with portions of any two opposing sides of the rectangle in its axial cross section protruding in the axial direction. Specifically, the second shielding portion 28-2 includes a generally rectangular tubular full shielding portion 30-2 and two partial shielding portions 29-2 that are axially continuous with the full shielding portion 30-2 and protrude from portions of any two opposing sides of the rectangle in its axial cross section. The main surfaces of the two partial shielding portions 29-2 face each other. The widths of the main surfaces of the two partial shielding portions 29-2, i.e., the lengths perpendicular to the axial direction, may be different. In the electronic device 10, the second metal plate 15-2 covers the entire periphery of the side surface of the second substrate 13 and a portion of the side surface of the first substrate 12 exposed from the first metal plate 14-2. In this configuration, the full shielding portion 30-2 covers the entire periphery of the side surface of the second substrate 13, and the partial shielding portion 29-2 covers a part of the side surface of the first substrate 12 exposed from the first metal plate .

[0061] Each of the two partial shielding portions 29-2 of the second shielding portion 28-2 has a second fixing portion 31 at the end on the side where the full shielding portion 30-2 is not continuous. As a result, when the second metal plate 15-2 is attached to the electronic device 10, the two second fixing portions 31 sandwich the lens barrel 16A that houses the imaging optical system 16 from two directions perpendicular to the optical axis.

[0062] The second shielding portion 28-2 has a gap 32 in the circumferential direction across one side of the partial shielding portion 29-2 and the full shielding portion 30-2. The gap 32 is provided approximately parallel to the axial direction. The gap 32 is a gap between the opposing ends of a flat metal plate when the second metal plate 15-2 is formed by bending the flat metal plate. On one side of the partial shielding portion 29-2, the second fixing portion 31 is located near the gap 32. Furthermore, on that side of the partial shielding portion 29-2, a contact portion 42 adjacent to the second fixing portion 31 across the gap 32 comes into contact with the third metal plate 34 in the electronic device 10.

[0063] The second metal plate 15-2 is formed by bending a predetermined portion of a metal plate, in other words, a metal flat plate of a desired shape, as shown in FIG. 23. In FIG. 23, the lines bending toward the front side are indicated by dashed lines, and the lines bending toward the back side are indicated by dashed lines. Therefore, by extending the bent portions of the second metal plate 15-2 into a flat shape, any portions of the second metal plate 15-2 are separated from each other without interfering with each other. The second metal plate 15-2 may be formed from a metal with high thermal conductivity, such as copper.

[0064] Next, a method for manufacturing the inner structure 39-2 will be described below.

[0065] As described above with reference to FIGS. 12 and 13, the first substrate 12 is attached to the lens barrel 16A housing the imaging optical system 16 via the third metal plate 34 and the imaging element cover 35.

[0066] As shown in FIG. 24 , the flat portion 23-2 of the first metal plate 14-2 is attached to the first substrate 12. A heat dissipation sheet 27 may be used to attach the flat portion 23-2 of the first metal plate 14-2 to the first substrate 12. The first metal plate 14-2 is attached to the first substrate 12 so that the flexible substrate 22 of the first substrate 12 can pass through a gap of distance D defined by the first shielding portion 24-2. As a result, as shown in FIG. 25 , the contact portion 41 of the first metal plate 14-2 comes into contact with the third metal plate 34. Note that FIG. 25 is a view showing the state in which the first metal plate 14-2 is attached to the first substrate 12, rotated 180 degrees around the axial direction of the lens barrel 16A from FIG. 19 . In FIG. 25 , a portion of the flexible substrate 22 and the second substrate 13 are omitted.

[0067] 26, the flexible substrate 22 is folded back, and the second substrate 13 is attached to the flat plate portion 23-2. A heat dissipation sheet 27 may be used to attach the flat plate portion 23-2 of the first metal plate 14-2 and the second substrate 13 together.

[0068] The second metal plate 15-2 is attached so as to cover the periphery of the second substrate 13 from the first connector 21 side in the optical axis direction of the imaging optical system 16. The second metal plate 15-2 is fixed to the lens barrel 16A accommodating the imaging optical system 16 by two second fixing portions 31. This causes the contact portion 42 of the second metal plate 15-2 to come into contact with the third metal plate 34. Therefore, the first metal plate 14-2 and the second metal plate 15-2 are indirectly abutted against each other via the third metal plate 34. In this way, an internal structure 39-2 of the electronic device 10 is configured, as shown in FIG. 18 .

[0069] In the electronic device 10 according to the second embodiment configured as described above, the flat plate portion 23-2 of the first metal plate 14-2 does not have an opening for engaging the first metal plate 14-2 and the second metal plate 15-2, as in the first embodiment. With this configuration, the electronic device 10 can increase the area of ​​the flat plate portion 23 that can come into direct or indirect contact with the image sensor 19 mounted on the first board 12 and the electronic components 20 mounted on the second board 13, which are heat sources, thereby improving heat dissipation.

[0070] Furthermore, in the electronic device 10 according to this embodiment, the first metal plate 14-2 and the second metal plate 15-2 are indirectly in contact with each other via the third metal plate 34. With this configuration, the electronic device 10 can reduce heat transfer between the first metal plate 14-2 and the second metal plate 15-2 compared to a configuration in which the first metal plate 14-2 and the second metal plate 15-2 are in contact with each other. Therefore, in a configuration in which one of the first metal plate 14-2 and the second metal plate 15-2 is close to a component that is significantly affected by high temperatures, even if the other becomes hot, the electronic device 10 can reduce heat transfer from the other to the other.

[0071] Although the present disclosure has been described based on the drawings and examples, it should be noted that those skilled in the art can easily make various modifications and alterations based on the present disclosure, and therefore, it should be noted that these modifications and alterations are included in the scope of the present disclosure. [Explanation of symbols]

[0072] 10 Electronic equipment 11 Mobile 12 First substrate 13 Second board 14, 14-2 First sheet metal 15, 15-2 Second sheet metal 16 Imaging optical system 16A Telescope 17 First enclosure 18 Second enclosure 19 Image sensor 20 Electronic Components 21 First Connector 22 Flexible PCB 23, 23-2 Flat plate part 24, 24-2 First shielding part 25 Opening 26 First fixed part 27 Heat dissipation sheet 28, 28-2 Second shielding section 29, 29-2 Partial shielding part 30, 30-2 Full shielding part 31 Second fixing part 32 void 33 Latch part 34 Third Sheet Metal 35 Image sensor cover 36 Second Connector 37 Fourth Sheet Metal 38 Third fixed part 39, 39-2 Internal structure 40 Standing section 41, 42 Contact parts D distance

Claims

1. a first substrate and a second substrate mounted with electronic components and positioned in a stacking direction with their main surfaces facing each other; a first metal plate having a flat plate portion interposed between the first substrate and the second substrate and abutting directly or indirectly against the electronic components mounted on the first substrate and the second substrate, and a first shielding portion covering a part of a side surface of the first substrate; a second metal plate having a second shielding portion that covers the entire periphery of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate; The electronic device, wherein the first metal plate and the second metal plate are in direct or indirect contact with each other.

2. the second metal plate has at least one hook portion, The electronic device according to claim 1 , wherein the first metal plate and the second metal plate directly contact each other at the latch portion.

3. the second metal plate has a gap in the circumferential direction of the second substrate, The electronic device according to claim 2 , wherein the two hook portions are adjacent to each other with the gap therebetween.

4. the first substrate and the second substrate are connected by a flexible substrate; The electronic device according to claim 1 , wherein the flexible substrate is covered by the second shielding portion when viewed from a direction perpendicular to the stacking direction.

5. The electronic device according to claim 1 , wherein the first substrate has an image pickup element as the electronic component on a surface opposite to the surface facing the flat plate portion.

6. a first substrate and a second substrate mounted with electronic components and positioned in a stacking direction with their main surfaces facing each other; a first metal plate having a flat plate portion interposed between the first substrate and the second substrate and abutting directly or indirectly against the electronic components mounted on the first substrate and the second substrate, and a first shielding portion covering a part of a side surface of the first substrate; a second metal plate having a second shielding portion that covers the entire periphery of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate; The imaging device, wherein the first metal plate and the second metal plate are in direct or indirect contact with each other.

7. A moving body having the imaging device according to claim 6 mounted thereon.

Images