Manufacturing method of display panel and display panel

Abstract

To provide a manufacturing method of a display panel capable of suppressing display unevenness and displaced bonding of substrates in the vicinity of a frame area, and the display panel.SOLUTION: The manufacturing method of display panel includes: a photocurable monomer exposure step of emitting light to a panel precursor including a first substrate having conductor pattern with light shielding property and a first support substrate, photocurable monomer containing layer containing photocurable monomer, and a second substrate having a second support substrate without light shielding area, from the second substrate side toward the first substrate side; a photosensitive layer stacking step of stacking a second positive substrate-side photosensitive layer on a side of the second support substrate opposite the first substrate; a photosensitive layer exposure step of emitting light to the second positive substrate-side photosensitive layer from the first substrate side toward the second substrate side; and a developing step of developing the second substrate-side photosensitive layer to form a second substrate-side light shielding part.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a display panel manufacturing method and a display panel. [Background technology]

[0002] In recent years, display panels such as see-through panels that allow the back surface of the display panel to be seen have been attracting attention. For example, display panels using a polymer dispersed liquid crystal (PDLC) layer have been developed. The PDLC layer has a structure in which liquid crystal components are dispersed in a polymer network obtained by photopolymerizing a photocurable monomer. By changing the orientation state of the liquid crystal components through the application of voltage, the difference in refractive index between the liquid crystal components and the polymer network can be utilized to switch between a transparent state and a scattering state.

[0003] As a technology relating to display panels, for example, Patent Document 1 discloses a liquid crystal display device comprising a first substrate and a second substrate arranged opposite each other, a polymer dispersed liquid crystal layer provided between the first substrate and the second substrate, and a black matrix provided on the first substrate, and having a display area for displaying images and a frame area defined around the display area, in which the black matrix is ​​composed of a plurality of light-shielding portions spaced apart from each other.

[0004] Furthermore, Patent Document 2 discloses a black resist composition containing the following components (A) to (D) as essential components. Component (A): Black pigment that transmits near-infrared rays Component (B): a sensitizing dye that absorbs in the near-infrared region Component (C): Radical polymerization initiator or acid generator Component (D): Binder resin [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2010 / 103589 [Patent Document 2] Japanese Patent Publication No. 2022-173626 Summary of the Invention [Problem to be solved by the invention]

[0006] In the above Patent Documents 1 and 2, no consideration is given to a technique for suppressing display unevenness near the frame region and misalignment of the substrates.

[0007] The present invention has been made in consideration of the above-mentioned current situation, and aims to provide a display panel manufacturing method and a display panel that can suppress display unevenness and substrate misalignment near the frame area. [Means for solving the problem]

[0008] (1) One embodiment of the present invention is a display panel manufacturing method including: a photocurable monomer exposure step of irradiating light from the second substrate side toward the first substrate side to a panel precursor having, in order, a first substrate having a light-shielding conductor pattern and a first support substrate, a photocurable monomer-containing layer containing a photocurable monomer, and a second substrate having a second support substrate and no light-shielding region; a photosensitive layer lamination step of laminating a positive-type second-substrate-side photosensitive layer on the side of the second support substrate opposite the first substrate; a photosensitive layer exposure step of irradiating light from the first substrate side toward the second substrate side to the positive-type second-substrate-side photosensitive layer; and a development step of developing the second-substrate-side photosensitive layer to form a second-substrate-side light-shielding portion.

[0009] (2) Furthermore, in one embodiment of the present invention, in addition to the configuration (1), the positive second substrate-side photosensitive layer is a layer containing a black positive resist composition.

[0010] (3) Furthermore, in one embodiment of the present invention, in addition to the configuration (1), the positive second substrate-side photosensitive layer is a black positive photosensitive film.

[0011] (4) Furthermore, in one embodiment of the present invention, in addition to the configuration of (1), (2), or (3), a method for manufacturing a display panel further includes, after the developing step, a film lamination step of laminating a second substrate-side UV-cut film on the side of the second substrate opposite the first substrate.

[0012] (5) Furthermore, in one embodiment of the present invention, in addition to the configuration of (4) above, the second substrate and the second substrate side UV cut film are bonded together via a second substrate side adhesive layer arranged between the second substrate side light-shielding portion and the second substrate side UV cut film in the film lamination process.

[0013] (6) Furthermore, in one embodiment of the present invention, in addition to the configuration of (1), (2), (3), (4), or (5), the method for manufacturing a display panel further comprises: the photosensitive layer laminating step is a first photosensitive layer laminating step; the photosensitive layer exposing step is a first photosensitive layer exposing step; and the developing step is a first developing step, and after the first developing step, further comprises: a second photosensitive layer laminating step of laminating a positive first-substrate-side photosensitive layer on the side of the first support substrate and the conductor pattern opposite the second substrate; a second photosensitive layer exposing step of irradiating the positive first-substrate-side photosensitive layer with light from the second substrate side toward the first substrate side; and a second developing step of developing the positive first-substrate-side photosensitive layer to form a first-substrate-side light-shielding portion.

[0014] (7) Furthermore, in one embodiment of the present invention, in addition to the configuration (6), the positive first substrate-side photosensitive layer is a layer containing a black positive resist composition.

[0015] (8) Furthermore, in one embodiment of the present invention, in addition to the configuration (6), the positive first substrate-side photosensitive layer is a black positive photosensitive film.

[0016] (9) Furthermore, in one embodiment of the present invention, in addition to the configuration of (6), (7), or (8), a method for manufacturing a display panel further includes, after the second development step, a first and second substrate side film lamination step of laminating a first substrate side UV cut film on the side of the first substrate opposite the second substrate, and laminating a second substrate side UV cut film on the side of the second substrate opposite the first substrate.

[0017] (10) Furthermore, in one embodiment of the present invention, in addition to the configuration of (9), in the first and second substrate side film lamination process, the first substrate and the first substrate side UV cut film are bonded together via a first substrate side adhesive layer arranged between the first substrate side light-shielding portion and the first substrate side UV cut film, and the second substrate and the second substrate side UV cut film are bonded together via a second substrate side adhesive layer arranged between the second substrate side light-shielding portion and the second substrate side UV cut film.

[0018] (11) Another embodiment of the present invention is a display panel comprising, in order, a first substrate having a conductor pattern and a first support substrate with light-shielding properties, a polymer-containing layer containing a polymer of a photocurable monomer, a second support substrate, and a second substrate having a second substrate-side light-shielding portion arranged on the opposite side of the second support substrate from the polymer-containing layer, wherein the conductor pattern and the second substrate-side light-shielding portion have the same shape in a planar view across the entire area of ​​the first substrate and the second substrate.

[0019] (12) Furthermore, in one embodiment of the present invention, in addition to the configuration of (11), the first substrate further comprises a first substrate-side light-shielding portion arranged on the opposite side of the first support substrate from the polymer-containing layer, and the conductor pattern and the first substrate-side light-shielding portion have the same shape in a planar view across the entire area of ​​the first substrate.

[0020] (13) Furthermore, in one embodiment of the present invention, in addition to the configuration of (11) or (12), the display panel further comprises a second substrate-side UV-cut film on the side of the second substrate opposite the polymer-containing layer.

[0021] (14) Furthermore, in one embodiment of the present invention, in addition to the configuration of (13) above, the display panel further comprises a second substrate-side adhesive layer between the second substrate-side light-shielding portion and the second substrate-side UV-cut film. [Effects of the Invention]

[0022] According to the present invention, it is possible to provide a display panel manufacturing method and a display panel that can suppress display unevenness and misalignment of substrates in the vicinity of the frame region. [Brief explanation of the drawings]

[0023] [Figure 1] 3 is a plan view schematically illustrating a photocurable monomer exposure step included in the method for manufacturing a display panel according to Embodiment 1. FIG. [Figure 2] 3 is a cross-sectional view schematically illustrating a panel precursor used in a photocurable monomer exposure step included in the method for producing a display panel according to Embodiment 1. FIG. [Figure 3] 3 is a cross-sectional view schematically illustrating a photocurable monomer exposure step included in the method for manufacturing the display panel according to the first embodiment. FIG. [Figure 4] 3 is a cross-sectional view schematically illustrating a photosensitive layer laminating step included in the method for manufacturing the display panel according to the first embodiment. FIG. [Figure 5] 3A to 3C are cross-sectional views illustrating a photosensitive layer exposing step included in the method for manufacturing the display panel according to the first embodiment. [Figure 6] 3 is a cross-sectional view schematically illustrating a state after a photosensitive layer exposure step included in the method for manufacturing a display panel according to Embodiment 1. FIG. [Figure 7] 3A to 3C are cross-sectional views illustrating a developing step included in the method for manufacturing the display panel according to the first embodiment. [Figure 8]FIG. 10 is a schematic diagram illustrating the appearance of a display panel according to a comparative example. [Figure 9] FIG. 10 is a plan view schematically illustrating a TFT substrate of a display panel according to a comparative example. [Figure 10] 10 is a scanning electron microscope photograph of the TFT substrate in the area surrounded by the dashed line in FIG. 9. [Figure 11] 3 is a cross-sectional view schematically illustrating a film laminating step included in the method for manufacturing the display panel according to Embodiment 1. FIG. [Figure 12] 1 is a cross-sectional view of a display panel according to a first embodiment of the present invention; [Figure 13] 10A and 10B are cross-sectional views illustrating a second photosensitive layer laminating step and a second photosensitive layer exposing step included in the display panel manufacturing method according to the second embodiment. [Figure 14] 10 is a cross-sectional view schematically illustrating a display panel after a second photosensitive layer exposure step included in the display panel manufacturing method according to Embodiment 2. FIG. [Figure 15] 10 is a cross-sectional view schematically illustrating a second developing step included in the display panel manufacturing method according to Embodiment 2. FIG. [Figure 16] 10 is a cross-sectional view schematically illustrating a step of laminating first and second substrate-side films included in the method for manufacturing a display panel according to Embodiment 2. FIG. [Figure 17] 1A to 1C are schematic diagrams illustrating a method for manufacturing a display panel according to a first reference example. [Figure 18] 1 is a cross-sectional view of a display panel according to a first reference example. [Figure 19] 3A to 3C are schematic diagrams illustrating a method for manufacturing the display panel of the first embodiment. [Figure 20A] 1 is a cross-sectional view of a display panel according to a first embodiment of the present invention; [Figure 20B] 1 is a cross-sectional view of a display panel according to a first embodiment of the present invention; [Figure 20C] 10 is a cross-sectional view schematically illustrating a case where the second substrate side light-shielding portion of the display panel of Example 1 is disposed between the second substrate side UV-cut film and the second substrate side pressure-sensitive adhesive layer. FIG. [Figure 21] 5A to 5C are schematic diagrams illustrating a method for manufacturing a display panel according to a second embodiment. [Figure 22] 1 is a cross-sectional view of a display panel according to a first embodiment of the present invention; [Figure 23] FIG. 10 is a cross-sectional view of a display panel according to a second embodiment of the present invention. [Figure 24] 10 is a table comparing the appearances of the display panels of Examples 1 and 2. DETAILED DESCRIPTION OF THE INVENTION

[0024] Hereinafter, embodiments of the present invention will be described. The present invention is not limited to the contents described in the following embodiments, and appropriate design changes can be made within the scope of the configuration of the present invention. In the following description, the same reference numerals will be used in different drawings as appropriate for the same parts or parts having similar functions, and repeated explanations will be omitted as appropriate. Each aspect of the present invention may be combined as appropriate within the scope of the gist of the present invention.

[0025] (Embodiment 1) FIG. 1 is a plan view schematic illustrating a photocurable monomer exposure step included in the method for manufacturing a display panel according to Embodiment 1. FIG. 2 is a cross-sectional view schematic illustrating a panel precursor used in the photocurable monomer exposure step included in the method for manufacturing a display panel according to Embodiment 1. FIG. 3 is a cross-sectional view schematic illustrating a photocurable monomer exposure step included in the method for manufacturing a display panel according to Embodiment 1. FIG. 4 is a cross-sectional view schematic illustrating a photosensitive layer lamination step included in the method for manufacturing a display panel according to Embodiment 1. FIG. 5 is a cross-sectional view schematic illustrating a photosensitive layer exposure step included in the method for manufacturing a display panel according to Embodiment 1. FIG. 6 is a cross-sectional view schematic illustrating a state after the photosensitive layer exposure step included in the method for manufacturing a display panel according to Embodiment 1. FIG. 7 is a cross-sectional view schematic illustrating a development step included in the method for manufacturing a display panel according to Embodiment 1.

[0026] The manufacturing method of the display panel of this embodiment includes, in order, a photocurable monomer exposure step shown in Figures 1 to 3, a photosensitive layer lamination step shown in Figure 4, a photosensitive layer exposure step shown in Figures 5 to 6, and a development step shown in Figure 7.

[0027] First, the photo-curable monomer exposure step will be described. In the photo-curable monomer exposure step shown in Figures 1 to 3, a panel precursor 11 is irradiated with light L from the second substrate 200 side toward the first substrate 100 side. The panel precursor 11 includes, in order, a first substrate 100 having a light-shielding conductive pattern 120 and a first support substrate 110, a photo-curable monomer-containing layer 300A containing a photo-curable monomer, and a second substrate 200 having a second support substrate 210 and no light-shielding region. While Figure 2 and other figures show the conductive pattern 120 and the first support substrate 110 arranged on the same layer, this is a simplified representation of the configuration of this embodiment in which the conductive pattern 120 is provided on the first support substrate 110, as shown in Figure 12, which will be described later.

[0028] In this specification, having light-blocking properties means that the transmittance of light at wavelengths (e.g., 300 nm or more and 1000 nm or less) used in the reaction of the positive-type second substrate-side photosensitive layer 220A (hereinafter simply referred to as photosensitive layer 220A) described below is 20% or less. Note that in this specification, the transmittance can be measured using a spectrophotometer. For example, the transmittance of ultraviolet, visible, and near-infrared light can be measured using a V-7000 series spectrophotometer manufactured by JASCO Corporation.

[0029] In this specification, the light-shielding region is a region in which the transmittance of light of a wavelength (for example, 300 nm or more and 1000 nm or less) used in the polymerization of the photocurable monomer is 20% or less.

[0030] As shown in Fig. 8, in a comparative display panel 1R having a PDLC layer, an area appears near the frame region 1NA (specifically, the frame region 1NA on the opposite side from the terminal side) where the transmittance differs from that of other areas at a certain temperature (for example, 45°C). Specifically, in the comparative display panel 1R, the transmittance near the frame region 1NA on the opposite side from the terminal side where the terminals are provided increases compared to other areas at a certain temperature (for example, 30 to 40°C, although this varies depending on the panel manufacturing conditions and materials), resulting in unevenness (display unevenness). Fig. 8 is a schematic diagram showing the appearance of a display panel according to the comparative embodiment.

[0031] This phenomenon occurs at the "anchoring transition" point, where the liquid crystal components that are vertically aligned on the polymer network surface in the PDLC layer change to horizontal alignment at a certain temperature. Because the anchoring is weak at the temperature of this transition point, it is thought that the display becomes transparent even at a voltage below the threshold (for example, a voltage of 0.5 V), resulting in display unevenness. Although anchoring transition also occurs in other areas, the temperature at which the anchoring transition occurs is higher, so it is thought that only the frame area 1NA on the opposite side of the terminal edge is perceived as uneven.

[0032] That is, the reason why the display unevenness is observed only in the vicinity of the frame region 1NA on the opposite side of the terminal edge is thought to be that the temperature at which the anchoring transition occurs (anchoring transition point) is lower in the frame region 1NA on the opposite side of the terminal edge than in other regions. The reason for this is thought to be as follows.

[0033] Fig. 9 is a schematic plan view of a TFT substrate of a display panel according to a comparative example. Fig. 10 is a scanning electron microscope photograph of the TFT substrate in the area surrounded by the dashed line in Fig. 9. As shown in Fig. 9, the display panel 1R according to the comparative example includes a first substrate 100R on which thin film transistors (TFTs) serving as switching elements are provided, a second substrate disposed opposite the first substrate 100R, and a PDLC layer sandwiched between the first substrate 100R and the second substrate. On the side of the first substrate 100R opposite the terminal side, a conductor pattern 120R outside the display area is disposed between the display region 1AA and the seal 500R. The conductor pattern 120R is, for example, a terminal pattern of a TFT.

[0034] 9 and 10, when a PDLC layer is formed by exposing a photocurable monomer-containing layer sandwiched between a first substrate 100R and a second substrate, the area not overlapping the conductive pattern 120R is sufficiently exposed, resulting in the formation of a polymer, but the area behind the conductive pattern 120R (the area overlapping the layer below the conductive pattern 120R) is not sufficiently exposed, resulting in the formation of no polymer. As a result, the unexposed photocurable monomer contained in the PDLC layer seeps into the display area 1AA, lowering the anchoring transition point and causing the anchoring transition to occur at a low temperature.

[0035] Furthermore, in the comparative display panel 1R, during high-temperature reliability testing, an irreversible transparent area appeared near the frame area 1NA on the opposite side from the terminal edge. The reason for this is thought to be as follows: As described above, the unexposed photocurable monomer contained in the PDLC layer seeps into the display area 1AA, and aging at high temperatures changes the surface state of the polymer, resulting in irreversible transparent area unevenness (irreversible display unevenness).

[0036] Like the comparative display panel 1R, the liquid crystal display device of Patent Document 1 also suffers from the problem of increased transmittance near the frame region compared to other areas, resulting in display unevenness. In the liquid crystal display device of Patent Document 1, the black matrix in the frame region is arranged in a striped pattern with spaced intervals. This reduces the area of ​​the light-shielding area caused by the black matrix in the frame region, thereby reducing the amount of residual monomer. However, in the liquid crystal display device of Patent Document 1, the light-shielding area still exists in the frame region, so when the PDLC layer is formed by exposure, part of the frame region is shaded by the light-shielding area. As a result, residual monomer remains in the light-shielding area. Therefore, the liquid crystal display device of Patent Document 1 cannot sufficiently reduce the effects of residual monomer seepage.

[0037] On the other hand, in this embodiment, by including the photocurable monomer exposure step, polymerization of the photocurable monomer is promoted throughout the entire photocurable monomer-containing layer 300A by light from the second substrate 200 side, which does not have a light-shielding region. In other words, there are no regions that are shaded during exposure, as in Patent Document 1. As a result, the amount of residual monomer (unreacted monomer) in the polymer-containing layer 300 formed by polymerization of the photocurable monomer can be reduced, thereby suppressing display unevenness. In this way, since residual monomer can be suppressed in this embodiment, there is no need to overincrease the exposure dose to suppress residual monomer, and a good display panel can be obtained. This also suppresses image sticking.

[0038] The first substrate 100 of the panel precursor 11 includes, for example, a first support substrate 110, on which are provided a plurality of gate lines 101G extending parallel to one another, a plurality of source lines 101S extending parallel to one another in a direction intersecting the plurality of gate lines 101G via an insulating layer, TFTs as switching elements, and pixel electrodes arranged in each region surrounded by two adjacent source lines 101S and two adjacent gate lines 101G. The plurality of gate lines 101G and the plurality of source lines 101S are formed in a lattice pattern as a whole to partition each pixel.

[0039] The first support substrate 110 is a transparent insulating substrate. Examples of the first support substrate 110 include insulating substrates such as a glass substrate and a plastic substrate.

[0040] The TFT is a three-terminal switch connected to a corresponding one of the plurality of source lines 101S and gate lines 101G and having a gate electrode (part of the gate line) protruding from the corresponding gate line 101G, a source electrode (part of the source line) protruding from the corresponding source line 101S, a drain electrode connected to the corresponding one of the plurality of pixel electrodes, and a thin-film semiconductor layer. The source electrode and drain electrode are electrodes provided in the same layer as the source line 101S, and the gate electrode is an electrode provided in the same layer as the gate line 101G.

[0041] The first substrate 100 further includes a source driver electrically connected to the source lines 101S, a gate driver electrically connected to the gate lines 101G, and a controller. The gate driver sequentially supplies scanning signals to the gate lines under the control of the controller. The source driver supplies data signals to the source lines 101S under the control of the controller at the timing when the TFTs are placed in a voltage-applied state by the scanning signal. A TFT terminal pattern (frame pattern) 101T is provided in a frame region 1NA where the driver is arranged. The conductor pattern 120 includes, for example, the source lines 101S, the gate lines 101G, and the TFT terminal pattern 101T. Note that the terminal pattern 101T shown in a frame shape in FIG. 1 and other figures is a simplified representation of a wiring pattern provided in the frame region 1NA of the first substrate 100.

[0042] The conductive pattern 120 has electrical conductivity and includes, for example, copper.

[0043] The conductor pattern 120 has light-shielding properties. Specifically, the conductor pattern 120 has a transmittance of 20% or less for light of a wavelength used in the reaction of the photosensitive layer 220A. By adopting such an embodiment, light L can be irradiated to areas of the photosensitive layer 220A that do not overlap with the conductor pattern 120 in the photosensitive layer exposure step described below. That is, it is possible to expose the photosensitive layer 220A using the conductor pattern 120 as a mask, and it is possible to form a second-substrate-side light-shielding portion 220 (hereinafter also simply referred to as the light-shielding portion 220) that has the same shape as the conductor pattern 120 in a planar view. As a result, misalignment between the first substrate 100 and the second substrate 200 can be suppressed.

[0044] The conductive pattern 120 preferably has a transmittance of 0% to 10%, and more preferably 0% to 5%, for light of a wavelength used in the reaction of the photosensitive layer 220A. By adopting such an embodiment, misalignment between the first substrate 100 and the second substrate 200 can be more effectively suppressed.

[0045] The pixel electrodes are set to a potential corresponding to a data signal supplied via the corresponding TFTs. The pixel electrodes are made of a transparent conductive film.

[0046] The second substrate 200 of the panel precursor 11 does not have a light-shielding region. This configuration allows light of the wavelength used for polymerization of the photocurable monomer to pass through the entire second substrate 200, promoting polymerization of the photocurable monomer in the region overlapping the entire second substrate 200 and reducing the amount of residual monomer (unreacted monomer) in the polymer-containing layer 300. As a result, display unevenness can be effectively reduced across the entire display panel. The phrase "the second substrate 200 does not have a light-shielding region" means that no light-shielding region is disposed substantially across the entire second substrate 200.

[0047] The transmittance of the entire second substrate 200 of the panel precursor 11 to light of the wavelength used for polymerization of the photocurable monomer is preferably 50% or more and 100% or less, more preferably 70% or more and 100% or less, and even more preferably 80% or more and 100% or less.

[0048] The second substrate 200 of the panel precursor 11 includes a second support substrate 210. The second support substrate 210 is a transparent insulating substrate. Examples of the second support substrate 210 include insulating substrates such as a glass substrate and a plastic substrate. The second substrate 200 of the panel precursor 11 preferably includes only the second support substrate 210.

[0049] It is preferable that the second support substrate 210 does not have a light-shielding region. The fact that the second support substrate 210 does not have a light-shielding region means that the light-shielding region is not disposed substantially over the entire second support substrate 210.

[0050] The transmittance of the entire second support substrate 210 to light of the wavelength used for polymerization of the photocurable monomer is preferably 50% or more and 100% or less, more preferably 70% or more and 100% or less, and even more preferably 80% or more and 100% or less.

[0051] The second substrate 200 may include a counter electrode. A common signal maintained at a constant value is supplied to the counter electrode, and the counter electrode is maintained at a constant potential. The counter electrode is a transparent conductive film.

[0052] The photocurable monomer-containing layer 300A included in the panel precursor 11 is preferably in contact with the second substrate 200. By adopting such an embodiment, light of the wavelength used for polymerization of the photocurable monomer can be transmitted through the entire second substrate 200, promoting polymerization of the photocurable monomer throughout the entire second substrate 200 and effectively suppressing the amount of remaining monomer (unreacted monomer) in the polymer-containing layer 300. As a result, display unevenness can be effectively suppressed throughout the entire display panel.

[0053] The polymer-containing layer 300 contains a polymer of a photocurable monomer. The polymer of a photocurable monomer is a polymer obtained by irradiating the photocurable monomer with light to polymerize it. The polymer-containing layer 300 is, for example, a layer obtained by irradiating a composition containing the photocurable monomer with light to polymerize it. The composition may contain a liquid crystal component 320 in addition to the photocurable monomer. In this case, the polymer-containing layer 300 also contains the liquid crystal component 320.

[0054] The polymer-containing layer 300 contains a polymer network 310 formed of a polymer of the photocurable monomer, and a liquid crystal component 320. The polymer-containing layer 300 of this embodiment is also referred to as a polymer dispersed liquid crystal (PDLC) layer. In the polymer-containing layer 300, a fibrous matrix of the polymer of the photocurable monomer (a cured product of the photocurable monomer) aggregates to form a three-dimensionally continuous polymer network 310, and the liquid crystal component 320 exists within the polymer network 310.

[0055] The polymer-containing layer 300, which is a polymer-dispersed liquid crystal layer, is in a scattering state when no voltage is applied and in a transparent state when voltage is applied. This configuration allows for the realization of a display panel that does not require a polarizer. More specifically, the layer is in a scattering state when no voltage is applied, and the orientation of the liquid crystal component 320 changes to a transparent state when voltage is applied. The display panel functions as a see-through panel. In this specification, the voltage-applied state in which a voltage equal to or greater than a threshold is applied between the pixel electrode and the counter electrode is simply referred to as the "voltage-applied state" or "voltage-applied state," while the voltage-free state in which a voltage less than the threshold is applied between the pixel electrode and the counter electrode (including no voltage application) is simply referred to as the "voltage-free state" or "voltage-free state." More specifically, the voltage-free state refers to the 0-level (V0) state in a 256-level display.

[0056] For example, when liquid crystal component 320 is present in polymer network 310, in the absence of applied voltage, liquid crystal component 320 is oriented along polymer network 310. Due to the difference in refractive index between polymer network 310 and liquid crystal component 320, incident light cannot travel in a straight line and is scattered, resulting in a frosted glass-like appearance (scattered state).

[0057] On the other hand, when a voltage is applied, the liquid crystal component 320, which has positive dielectric anisotropy, aligns its long axis parallel to the electric field direction, so that the liquid crystal component 320 is aligned perpendicular to the electrodes (pixel electrode and counter electrode). If the ordinary light refractive index of the liquid crystal component is equal to the refractive index of the polymer, the refractive index difference between the liquid crystal component 320 and the polymer network 310 disappears, resulting in an optically non-interface state. As a result, incident light travels straight without being scattered, achieving a transparent state.

[0058] The scattering state is a state in which light is scattered. For example, the transmittance of a polymer-dispersed liquid crystal layer in the scattering state may be, for example, 20% or less. The lower limit of the transmittance of a polymer-dispersed liquid crystal layer in the scattering state is, for example, 0 to 1%. In this specification, the transmittance of a polymer-dispersed liquid crystal layer in the scattering state refers to the transmittance of parallel light through the polymer-dispersed liquid crystal layer in the scattering state.

[0059] If the average refractive index of the polymer is np, the refractive index of the liquid crystal in the long axis direction is ne, and the refractive index in the short axis direction is no, then ne >> no ≒ np holds. When no voltage is applied, there is a refractive index difference between np and the average value of ne and no ((ne + no) / 2), so light appears "scattered." On the other hand, when voltage is applied, np ≒ no holds when the panel is viewed from the front (parallel to the electric field direction), so the refractive index difference is small and the panel appears "transparent."

[0060] The transmittance of the polymer-dispersed liquid crystal layer in the scattering state can be determined, for example, as follows. The luminance when a display panel having a polymer-dispersed liquid crystal layer with no voltage applied is placed on a normal backlight (light source for liquid crystal display devices) with an LED as the light source, and the luminance when nothing is placed on the backlight, are measured using a Topcon luminance meter (SR-UL1) at a light acceptance angle of 2°. The measurement wavelength is the luminosity Y value, which is a wavelength of approximately 550 nm. The transmittance of the polymer-dispersed liquid crystal layer in the scattering state can be determined by dividing the luminance when a display panel with no voltage applied is placed on the backlight by the luminance when nothing is placed on the backlight.

[0061] The haze, which indicates the light scattering rate of the polymer-dispersed liquid crystal layer in the scattering state, may be, for example, 80% or more, or 90% or more. The upper limit of the haze, which indicates the light scattering rate of the polymer-dispersed liquid crystal layer in the scattering state, is, for example, 90 to 100%. In this embodiment, the polymer-dispersed liquid crystal layer in the scattering state scatters visible light. Therefore, the polymer-dispersed liquid crystal layer in the scattering state is in a state similar to frosted glass. In this specification, the haze is measured by a method conforming to JIS K 7136. The haze can be measured, for example, using a turbidity meter such as the HazeMeter NDH2000 manufactured by Nippon Denshoku Industries Co., Ltd., using a halogen lamp as a light source.

[0062] The transparent state refers to a state in which the polymer dispersed liquid crystal layer is transparent to light. For example, the transmittance of the polymer dispersed liquid crystal layer in the transparent state may be 25% or more, or may be 30% or more. If there is no influence from the wiring, the transmittance would be, for example, 60% or more. The upper limit of the transmittance of the polymer dispersed liquid crystal layer in the transparent state is, for example, 100%. In this embodiment, the polymer dispersed liquid crystal layer in the transparent state is transparent to visible light. In this specification, the transmittance of the polymer dispersed liquid crystal layer in the transparent state refers to the parallel light transmittance of the polymer dispersed liquid crystal layer in the transparent state.

[0063] The transmittance of the polymer-dispersed liquid crystal layer in the transparent state can be determined, for example, as follows. The luminance when a display panel having a polymer-dispersed liquid crystal layer with a voltage applied is placed on a normal backlight (light source for liquid crystal display devices) with an LED as the light source, and the luminance when nothing is placed on the backlight, are measured using a Topcon luminance meter (SR-UL1) at a light acceptance angle of 2°. The measurement wavelength is the luminosity Y value, and is a wavelength of approximately 550 nm. The transmittance of the polymer-dispersed liquid crystal layer in the transparent state can be determined by dividing the luminance when a display panel with a voltage applied is placed on the backlight by the luminance when nothing is placed on the backlight.

[0064] In this way, the display panel adjusts the amount of light passing through the display panel by changing the refractive index difference between ne and no between the polymer network 310 and the liquid crystal component 320 in the polymer-dispersed liquid crystal layer, and therefore does not require a polarizing plate, which is required in general liquid crystal display panels.

[0065] The photocurable monomer contained in the photocurable monomer-containing layer 300A is preferably compatible with the liquid crystal component 320 at room temperature, and when cured by ultraviolet light to form a polymer, phase-separates from the liquid crystal component 320. The wavelength of the light used to polymerize the photocurable monomer is preferably 315 nm or more and 400 nm or less, more preferably 340 nm or more and 380 nm or less, and even more preferably 350 nm or more and 380 nm or less.

[0066] The photocurable monomer preferably has a reactive group represented by, for example, the following formulas (M1) to (M21).

[0067] [ka]

[0068] [ka]

[0069] [ka]

[0070] [ka]

[0071] [ka]

[0072] Specific examples of photocurable monomers having reactive groups represented by the above formulas (M1) to (M21) include acrylic monomers having reactive groups represented by (M1) to (M3), allyl ether monomers having reactive groups represented by (M4), such as diallyl ether, bisphenol A diallyl ether, bisphenol A diallyl ether, and polyallyl ether of novolac resins, epoxy compounds having reactive groups represented by (M7) to (M10), such as bisphenol A epoxy resins, bisphenol F epoxy resins, and novolac epoxy resins, and (M11). Preferred examples include 3,4-epoxycyclohexylmethyl methacrylate having a reactive group represented by (M12) or (M13), oxetane compounds having a reactive group represented by (M12) or (M13), such as ethyl-3-hydroxymethyloxetane (OXA) or 3-ethyl-3-chloromethyloxetane (OXC), and maleimide compounds having a reactive group represented by (M14), such as maleimide ethyl acetate or polyalkylene ether bismaleimide. In this embodiment, however, acrylic monomers having a reactive group represented by (M1) or (M2) are particularly preferred in terms of the effect of improving adhesion.

[0073] Specific examples of the acrylic monomer include trimethylolpropane tri(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, isocyanuric acid EO-modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate. Other examples include polyfunctional urethane oligomers, polyester acrylates, and epoxy acrylates.

[0074] Furthermore, among the photocurable monomers having the above-mentioned reactive groups, it is more preferable to contain a compound having three or more reactive groups, and it is even more preferable to contain a compound having four or more reactive groups, in terms of the effect of improving adhesion and excellent heat cycle resistance.

[0075] The photocurable monomer may be used alone or in combination of two or more. Furthermore, it is preferable that the photocurable monomer has a hydrophilic group such as a hydroxyl group in its molecular structure, since this significantly improves adhesion and heat cycle resistance. In particular, it is particularly preferable to use a mixture containing four or more reactive compounds, in which the compound having a hydrophilic group is contained in a proportion of 40 to 80 mass % of the mixture.

[0076] A polymerization initiator may be added as needed. Known and commonly used thermal polymerization initiators can be used, such as methyl acetoacetate peroxide, cumene hydroperoxide, benzoyl peroxide, bis(4-t-butylcyclohexyl)peroxydicarbonate, t-butyl peroxybenzoate, methyl ethyl ketone peroxide, 1,1-bis(t-hexylperoxy)3,3,5-trimethylcyclohexane, p-pentahydroperoxide, t-butyl hydroperoxide, dicumyl peroxide, isobutyl peroxide, and di(3-methyl-3-methoxybutyl)peroxydicarbonate. Organic peroxides such as nitrate and 1,1-bis(t-butylperoxy)cyclohexane, azonitrile compounds such as 2,2'-azobisisobutyronitrile and 2,2'-azobis(2,4-dimethylvaleronitrile), azoamide compounds such as 2,2'-azobis(2-methyl-N-phenylpropionamidin) dihydrochloride, azoamide compounds such as 2,2'azobis{2-methyl-N-[1,1-bis(hydroxymethyl)-2-hydroxyethyl]propionamide}, and alkyl azo compounds such as 2,2'azobis(2,4,4-trimethylpentane). Specific examples include "V-40" and "VF-096" manufactured by Wako Pure Chemical Industries, Ltd., and "Perhexyl D" and "Perhexyl I" manufactured by Nippon Oil & Fats Corporation (now NOF Corporation). Examples of photopolymerization initiators include "Irgacure 651", "Irgacure 184", "Darocur 1173", "Irgacure 907", "Irgacure 127", "Irgacure 369", "Irgacure 379", "Irgacure 819", "Irgacure 2959", "Irgacure 1800", "Irgacure 250", "Irgacure 754", "Irgacure 784", "Irgacure OXE01", "Irgacure OXE02", "Irgacure OXE04", "Lucirin TPO", "Darocur 1173", and "Darocur MBF" manufactured by BASF, and "Esacure 1001M", "Esacure KIP150", "Speedcure BEM", "Speedcure BMS", "Speedcure MBP", "Speedcure PBZ", "Speedcure ITX", and "Speedcure 1001M" manufactured by LAMBSON. DETX, Speedcure EBD, Speedcure MBB, Speedcure BP, Nippon Kayaku's Kayacure DMBI, Nippon SiberHegner (now DKSH)'s TAZ-A, ADEKA's ADEKA Optomer SP-152, ADEKA Optomer SP-170, ADEKA Optomer N-1414, ADEKA Optomer N-1606, ADEKA Optomer N-171 7," "ADEKAOPTOMER N-1919," UCC's "CYRACURE UVI-6990," "CYRACURE UVI-6974," and "CYRACURE UVI-6992," Asahi Denka Kogyo's "ADEKAOPTOMER SP-150, SP-152, SP-170, SP-172," Rhodia's "PHOTOINITIATOR2074," BASF's "IRGACURE 250," GE Silicones' "UV-9380C," and Midori Chemical's "DTS-102." In addition, when cationic polymerization is performed, examples of suitable polymers include sulfonium salts such as UVACURE 1590 (manufactured by Daicel-Cytec) and CPI-110P (manufactured by San-Apro), and iodonium salts such as IRGACURE 250 (manufactured by Chiba Specialty Chemicals), WPI-113 (manufactured by Wako Pure Chemical Industries), and Rp-2074 (manufactured by Rhodia Japan).

[0077] When electron beam curing is used, a polymerization initiator may or may not be used.

[0078] The amount of these polymerization initiators used is preferably 0.1 to 10 parts by mass, particularly preferably 0.5 to 5 parts by mass, based on the photocurable monomer. These can be used alone or in combination of two or more. If necessary, a sensitizer or the like can also be used.

[0079] The liquid crystal component 320 may not have a polymerizable group such as an acrylate, a methacrylate, a maleimide, an N-phenylmaleimide, or a siloxane.

[0080] In this embodiment, the liquid crystal component 320 may have a positive or negative dielectric anisotropy (Δε) defined by the following formula (L): Δε = (dielectric constant of the liquid crystal component in the long axis direction) - (dielectric constant of the liquid crystal component in the short axis direction) (L)

[0081] Liquid crystal components (liquid crystal molecules) with positive dielectric anisotropy are oriented parallel to the electric field, while liquid crystal components with negative dielectric anisotropy are oriented perpendicular to the electric field. Liquid crystal components with positive dielectric anisotropy are also called positive-type liquid crystals, and liquid crystal components with negative dielectric anisotropy are also called negative-type liquid crystals. The long axis direction of the liquid crystal component is the direction of the slow axis. The direction of the long axis of the liquid crystal component when no voltage is applied is also called the initial orientation direction of the liquid crystal component.

[0082] As the liquid crystal component 320, for example, a tolan-based liquid crystal material (a liquid crystal material having -C≡C- (carbon-carbon triple bond) as a linking group) can be used.

[0083] Preferably, the refractive index anisotropy Δn of the liquid crystal component 320 is 0.18 or more and 0.24 or less, the dielectric anisotropy Δε of the liquid crystal component 320 is 15 or more and 25 or less, and the rotational viscosity γ1 of the liquid crystal component 320 is 100 mPa·s or more and 300 mPa·s or less. This configuration makes it possible to achieve both strong scattering and low-voltage drive, and also to achieve a response speed equivalent to that of a typical liquid crystal display device that does not contain a polymer network. This effect can be achieved by having the refractive index anisotropy Δn, dielectric anisotropy Δε, and rotational viscosity γ1 of the liquid crystal component 320 all fall within the above ranges.

[0084] Specific examples of tolan-based liquid crystal materials include liquid crystal materials having a structure represented by the following general formula (L1).

[0085] [ka] (In the above formula, Q1 and Q2 each independently represent an aromatic ring group, X represents a fluorine group or a cyano group, and n1 and n2 each independently represent 0 or 1.)

[0086] In the above general formula (L1), n1 and n2 cannot simultaneously be 0. That is, the sum of n1 and n2 is 1 or 2.

[0087] The aromatic ring group in the above general formula (L1) may have a substituent.

[0088] In the above general formula (L1), Q1 and Q2 each preferably independently represent any one of the structures of the following general formulae (L2-1) to (L2-7).

[0089] [ka]

[0090] Specific examples of the liquid crystal material having the structure represented by the above general formula (L1) include the following structures.

[0091] [ka]

[0092] The weight ratio of the liquid crystal component 320 to the polymer network 310 is preferably 7:3 to 9:1. That is, the weight ratio of the liquid crystal component 320 is preferably 7 or more and 9 or less. When the weight ratio of the liquid crystal component 320 is 7 or more, the weight ratio of the polymer network 310 is preferably 3 or less. When the weight ratio of the liquid crystal component 320 is 9 or less, the weight ratio of the polymer network 310 is preferably 1 or more. This configuration makes it possible to effectively achieve both strong scattering and low-voltage drive. When the weight ratio of the polymer network 310 exceeds 10, strong scattering is obtained but the drive voltage becomes high. When the weight ratio of the polymer network 310 is less than 3, the drive voltage is suppressed but strong scattering may not be obtained. Note that the scattering degree and drive voltage can be effectively controlled by adjusting the weight ratio of the liquid crystal component 320 to the polymer network 310, as well as the network size and the components forming the network.

[0093] The panel precursor 11 having a photocurable monomer-containing layer can be manufactured, for example, by applying a sealant to the first substrate 100 or the second substrate 200, forming a photocurable monomer-containing layer 300A in the area surrounded by the sealant using a composition containing a photocurable monomer, and then bonding the first substrate 100 and the second substrate 200 together with the sealant. Note that the composition can also be filled into the area surrounded by the sealant after bonding the first substrate 100 and the second substrate 200 together. Specifically, a vacuum injection method can be used in which an injection port is provided in the seal drawing pattern and liquid crystal is injected in a vacuum chamber.

[0094] 4, a positive second-substrate-side photosensitive layer 220A is laminated on the side of the second support substrate 210 opposite to the first substrate 100.

[0095] The photosensitive layer 220A is preferably a layer containing a black positive resist composition, and such an embodiment allows the second substrate-side light-shielding part 220 obtained by developing the second substrate-side photosensitive layer 220A to function as a black matrix.

[0096] The black positive resist composition preferably contains a black pigment that transmits near-infrared rays, a sensitizing dye that absorbs in the near-infrared region, a radical polymerization initiator or an acid generator, and a binder resin. The black positive resist composition can be designed in the same manner as, for example, Japanese Patent Application Laid-Open No. 2022-173626, which is a Japanese Laid-Open Publication. The entirety of Japanese Patent Application Laid-Open No. 2022-173626 is incorporated by reference into this embodiment.

[0097] The photosensitive layer 220A is also preferably a black positive photosensitive film. By adopting such an embodiment, the second substrate-side light-shielding portion 220 obtained by developing the second substrate-side photosensitive layer 220A can function as a black matrix.

[0098] Next, the photosensitive layer exposing step and the developing step will be described. In the photosensitive layer exposing step shown in FIGS. 5 and 6, light is irradiated onto the photosensitive layer 220A from the first substrate 100 side toward the second substrate 200 side. In the developing step shown in FIG. 7, the exposed photosensitive layer 220A is developed to form the second-substrate-side light-shielding portion 220. By adopting this embodiment, in the photosensitive layer exposing step, light L can be irradiated onto areas of the photosensitive layer 220A that do not overlap with the conductor pattern 120. That is, it is possible to expose the photosensitive layer 220A using the conductor pattern 120 as a mask, and as shown in FIG. 6, exposed portions 220P and unexposed portions 220Q can be formed in the photosensitive layer 220A, and the conductor pattern 120 is transferred to the photosensitive layer 220A. Furthermore, by developing the photosensitive layer 220A having the exposed portion 220P and the unexposed portion 220Q, the exposed portion (also called the photosensitive portion) 220P is removed and the unexposed portion 220Q becomes the light-shielding portion 220, as shown in FIG.

[0099] As a result, a light-shielding portion 220 having the same shape as the conductor pattern 120 in a planar view is provided on the second support substrate 210, and the light-shielding portion 220 can function as a pixel black matrix and a frame black matrix when observed from the second substrate 200 side, thereby obtaining a display panel 1 in which misalignment between the first substrate 100 having the first support substrate 110 and the conductor pattern 120 and the second substrate 200 having the second support substrate 210 and the light-shielding portion 220 is suppressed.

[0100] Here, the pixel black matrix is ​​a black matrix provided to separate each pixel in the display area 1AA. The frame black matrix is ​​a black matrix provided to overlap the frame area 1NA. For example, the pixel black matrix has the same shape as the gate lines 101G and the source lines 101S in a plan view, and the frame black matrix has the same shape as the TFT terminal pattern 101T in a plan view.

[0101] The transmittance of the entire first support substrate 110, excluding light-shielding portions due to wiring, to light of the wavelength used for the reaction of the photosensitive layer 220A is preferably 50% or more and 100% or less, more preferably 70% or more and 100% or less, and even more preferably 80% or more and 100% or less. By adopting such an embodiment, in the photosensitive layer exposure step, light of the wavelength used for the reaction of the photosensitive layer 220A can be transmitted through the first support substrate 110, thereby effectively forming a light-shielding portion 220 having the same shape as the conductor pattern 120 in a plan view. As a result, misalignment between the first substrate 100 and the second substrate 200 can be effectively suppressed.

[0102] The transmittance of the entire second support substrate 210, excluding light-shielding portions due to wiring, to light of the wavelength used for the reaction of the photosensitive layer 220A is preferably 50% or more and 100% or less, more preferably 70% or more and 100% or less, and even more preferably 80% or more and 100% or less. By adopting such an embodiment, in the photosensitive layer exposure step, light of the wavelength used for the reaction of the photosensitive layer 220A can be transmitted through the second support substrate 210, thereby effectively forming a light-shielding portion 220 having the same shape as the conductor pattern 120 in a plan view. As a result, misalignment between the first substrate 100 and the second substrate 200 can be effectively suppressed.

[0103] In a voltage-applied state (i.e., a transparent state), the transmittance of the entire polymer-containing layer 300, excluding light-shielding portions due to wiring, for light of the wavelength used for the reaction of the photosensitive layer 220A is preferably 50% or more and 100% or less, more preferably 70% or more and 100% or less, and even more preferably 80% or more and 100% or less. By adopting such an embodiment, light of the wavelength used for the reaction of the photosensitive layer 220A can be transmitted through the polymer-containing layer 300 in the photosensitive layer exposure step, thereby effectively forming a light-shielding portion 220 having the same shape as the conductor pattern 120 in a planar view. As a result, misalignment between the first substrate 100 and the second substrate 200 can be effectively suppressed.

[0104] 7 , the display panel 1 of this embodiment includes, in order, a first substrate 100 having a light-shielding conductor pattern 120 and a first support substrate 110, a polymer-containing layer 300 containing a polymer of a photocurable monomer, a second support substrate 210, and a second substrate 200 having a second-substrate-side light-shielding portion 220 arranged on the side of the second support substrate 210 opposite the polymer-containing layer 300, and the conductor pattern 120 and the second-substrate-side light-shielding portion 220 have the same shape in a plan view over the entire area of ​​the first substrate 100 and the second substrate 200. By adopting this configuration, misalignment between the first substrate 100 and the second substrate 200 can be suppressed.

[0105] The conductor pattern 120 and the second substrate side light-shielding portion 220 have the same shape in a planar view throughout the entire first substrate 100 and the entire second substrate 200, which means that the overall shape of the conductor pattern 120 throughout the entire first substrate 100 and the overall shape of the second substrate side light-shielding portion 220 throughout the entire second substrate 200 are the same.

[0106] The light-shielding portion 220 is disposed on the opposite side of the second support substrate 210 to the polymer-containing layer 300. That is, after the above-described development step, the second substrate 200 includes the second support substrate 210 and the light-shielding portion 220 in this order from the polymer-containing layer 300 side.

[0107] The light-shielding portion 220 is preferably, for example, a black matrix layer. The light-shielding portion 220 preferably has an OD value, which is an index of light absorbance, of 3 or more, more preferably 3.5 or more, and even more preferably 4 or more. There is no particular limitation on the upper limit of the OD value of the light-shielding portion 220, but it is, for example, 6 or less. The measurement wavelength λ of the OD value of the light-shielding portion 220 is, for example, 400 nm or more and 800 nm or less.

[0108] The OD value (OD(λ)) at a measurement wavelength λ can be determined by the following formula: The OD value can be measured by the Macbeth densitometry method using a TD-904 manufactured by Kollmorgen. OD(λ)=Log 10 [T(λ) / I(λ)]=Log 10 T(λ)-Log 10 I(λ) λ represents the measurement wavelength, T(λ) represents the amount of transmitted light at the measurement wavelength, and I(λ) represents the amount of incident light at the measurement wavelength.

[0109] Fig. 11 is a cross-sectional view schematically illustrating a film laminating step included in the method for manufacturing the display panel according to Embodiment 1. Fig. 12 is a cross-sectional view schematically illustrating the display panel according to Embodiment 1.

[0110] The manufacturing method for the display panel of this embodiment preferably further includes a film lamination step shown in FIG. 11 after the developing step. In the film lamination step, a second substrate-side UV-cut film 620 (hereinafter simply referred to as UV-cut film 620) is laminated on the side of the second substrate 200 opposite the first substrate 100. This configuration prevents small amounts of residual monomer present under the pixel wiring in the display area 1AA from being exposed to ultraviolet light contained in sunlight or fluorescent lamps, which can cause unevenness and reduce degradation of display quality. Examples of UV-cut films include protective films such as TAC films, whose base material itself absorbs ultraviolet light.

[0111] 12, in the film lamination step, the second substrate 200 and the second substrate-side UV-cut film 620 are preferably bonded together via a second substrate-side adhesive layer 720 (hereinafter also simply referred to as the adhesive layer 720) disposed between the second substrate-side light-shielding portion 220 and the second substrate-side UV-cut film 620. This configuration makes it possible to reduce the amount of conductive pattern (e.g., TFT terminal pattern) that is visible when observed from an oblique angle, compared to when the second substrate-side light-shielding portion 220 is disposed between the second substrate-side adhesive layer 720 and the second support substrate 210 and a color-added portion such as the light-shielding portion 220 is disposed between the adhesive layer and the UV-cut film.

[0112] As shown in FIG. 12, the display panel 1 of this embodiment includes a second substrate-side UV-cut film 620 on the side of the second substrate 200 opposite to the polymer-containing layer 300.

[0113] The display panel 1 also includes a second substrate-side adhesive layer 720 between the light-shielding portion 220 and the second substrate-side UV-cut film 620. That is, the light-shielding portion 220 is disposed between the second support substrate 210 and the second substrate-side adhesive layer 720. This configuration can reduce the amount of conductive pattern that is visible when viewed from an oblique angle, compared to when a color-added portion such as the light-shielding portion 220 is disposed between the adhesive layer and the UV-cut film.

[0114] Furthermore, the display panel 1 preferably includes an additive color printed section 800 on the rear side of the second substrate side UV cut film 620 in the frame region 1NA. This configuration can improve the appearance of the frame region. For example, the second substrate side UV cut film 620, which has decorative printing only in the frame region 1NA, can be laminated on the side of the second substrate 200 opposite the first substrate 100, so that the decorative printing faces the rear side. As a result, the additive color printed section 800 is disposed between the second substrate side UV cut film 620 and the second substrate side pressure-sensitive adhesive layer 720.

[0115] The display panel 1 may also include a first substrate-side UV-cut film 610 (hereinafter simply referred to as the UV-cut film 610) on the side of the first substrate 100 opposite the polymer-containing layer 300, with a first substrate-side adhesive layer 710 (hereinafter simply referred to as the adhesive layer 710) interposed therebetween. This configuration prevents small amounts of residual monomer present under pixel wiring in the display area 1AA from being exposed to ultraviolet light contained in sunlight or fluorescent lamps, which can cause unevenness and reduce degradation of display quality.

[0116] The thickness of adhesive layer 710 and adhesive layer 720 is not particularly limited, but is, for example, 15 μm or more and 50 μm or less, and preferably 15 μm or more and 25 μm or less.

[0117] The adhesive layer bonds the surfaces of adjacent members together and integrates them with sufficient adhesive strength and adhesion time for practical use. Examples of materials for forming the adhesive layer include acrylic, silicone, and urethane resin materials.

[0118] It is preferable that the adhesive layer 710 and the adhesive layer 720 contain a UV absorber. By adopting such an embodiment, it is possible to prevent the small amount of remaining monomer present under the pixel wiring in the display area 1AA from being exposed to ultraviolet light contained in sunlight or fluorescent lamps, and thereby prevent unevenness from occurring.

[0119] The UV absorber contains, for example, at least one of a benzotriazole-based UV absorber, a triazine-based UV absorber, and a benzophenone-based UV absorber.

[0120] (Modification 1 of Embodiment 1) The polymer-containing layer 300 of this modified example is composed of a polymer of the above-mentioned photocurable monomer, and contains a pair of polymer layers located on the surface facing the first support substrate 110 and the surface facing the second support substrate 210, and a liquid crystal component located between the pair of polymer layers.

[0121] The polymer layer controls the alignment of the liquid crystal component and is also called a polymer sustained alignment (PSA). The polymer layer can be formed, for example, by sealing a liquid crystal composition, in which a polymerizable component such as a monomer or oligomer is mixed with a liquid crystal material, between an array substrate and an opposing substrate, and polymerizing the monomer or the like by irradiating it with heat or light (e.g., ultraviolet light). In this modification, the weight ratio of the liquid crystal component to the polymer network is preferably liquid crystal component:polymer network=99.0:1.0 to 99.9:0.1. This configuration allows the polymer layer to effectively function as an alignment sustaining layer.

[0122] (Embodiment 2) In this embodiment, the features unique to this embodiment will be mainly described, and a description of the contents overlapping with the above-described embodiment 1 will be omitted. This embodiment is substantially the same as embodiment 1, except that a similar light-shielding portion is formed on the first substrate 100 side using the light-shielding portion 220 corresponding to the frame black matrix and pixel black matrix of the second substrate 200 as a mask.

[0123] Fig. 13 is a cross-sectional view schematically illustrating a second photosensitive layer laminating step and a second photosensitive layer exposing step included in the method for manufacturing a display panel according to Embodiment 2. Fig. 14 is a cross-sectional view schematically illustrating a state after the second photosensitive layer exposing step included in the method for manufacturing a display panel according to Embodiment 2. Fig. 15 is a cross-sectional view schematically illustrating a second developing step included in the method for manufacturing a display panel according to Embodiment 2.

[0124] The manufacturing method for the display panel of this embodiment includes the photocurable monomer exposure process, a first photosensitive layer lamination process as the photosensitive layer lamination process, a first photosensitive layer exposure process as the photosensitive layer exposure process, a first development process as the development process, a second photosensitive layer lamination process, a second photosensitive layer exposure process, and a second development process.

[0125] In the second photosensitive layer lamination process shown in Figure 13, a positive first substrate-side photosensitive layer 130A (hereinafter simply referred to as photosensitive layer 130A) is laminated on the side of the first support substrate 110 and the conductive pattern 120 opposite the second substrate 200.

[0126] The photosensitive layer 130A is preferably a layer containing a black positive resist composition. By adopting such an embodiment, the first substrate-side light-shielding portion 130 (hereinafter simply referred to as the light-shielding portion 130) obtained by developing the photosensitive layer 130A can function as a black matrix.

[0127] It is also preferable that the photosensitive layer 130A is a black positive photosensitive film. By adopting such an embodiment, the light-shielding portion 130 obtained by developing the photosensitive layer 130A can function as a black matrix.

[0128] In the second photosensitive layer exposing step shown in FIGS. 13 and 14, light is irradiated onto the photosensitive layer 130A from the second substrate 200 side toward the first substrate 100 side. In the second developing step shown in FIG. 15, the exposed photosensitive layer 130A is developed to form the first-substrate-side light-shielding portion 130. By adopting this configuration, in the second photosensitive layer exposing step, light L can be irradiated onto regions of the photosensitive layer 130A that do not overlap with the conductor pattern 120. That is, the photosensitive layer 130A can be exposed using the conductor pattern 120 as a mask. As shown in FIG. 14, exposed portions 130P and unexposed portions 130Q can be formed in the photosensitive layer 130A, and the pattern of the light-shielding portion 220 is transferred to the photosensitive layer 130A. Furthermore, by developing the photosensitive layer 130A having the exposed portion 130P and the unexposed portion 130Q, the exposed portion (also called the photosensitive portion) 130P is removed and the unexposed portion 130Q becomes the light-shielding portion 130, as shown in FIG.

[0129] As a result, a light-shielding portion 130 having the same shape as the conductor pattern 120 in a plan view is provided on the first support substrate 110, and the light-shielding portion 130 can function as a pixel black matrix and a frame black matrix when observed from the first support substrate 110 side. That is, the display panel 1 obtained by the manufacturing method of this embodiment includes the light-shielding portion 130 and the light-shielding portion 220 having the same shape on the first support substrate 110 and the second support substrate 210, respectively, and therefore can achieve the same appearance when viewed from the first substrate 100 side and the second substrate 200 side. Because a transparent display is viewed from both the first substrate 100 side and the second substrate 200 side, the display panel 1 obtained by the manufacturing method of this embodiment is particularly suitable for use in transparent displays.

[0130] The transmittance of the conductor pattern 120 for light of a wavelength used in the reaction of the photosensitive layer 130A (e.g., 300 nm or more and 1000 nm or less) is preferably 0% or more and 20% or less, more preferably 0% or more and 10% or less, and even more preferably 0% or more and 5% or less. By adopting this embodiment, in the second photosensitive layer exposure step, light of a wavelength used in the reaction of the photosensitive layer 130A does not pass through the conductor pattern 120, so that it is possible to form a light-shielding portion 130 having the same shape as the conductor pattern 120 in a planar view. As a result, the first substrate-side light-shielding portion 130 and the second substrate-side light-shielding portion 220 formed using the conductor pattern 120 as a mask can have the same shape in a planar view, and therefore the same appearance can be achieved whether viewed from the first substrate 100 side or the second substrate 200 side. Since a transparent display is viewed from both the first substrate 100 side and the second substrate 200 side, the display panel 1 obtained by the manufacturing method of this embodiment is particularly suitable for use in a transparent display.

[0131] The transmittance of the light-shielding portion 220 with respect to the wavelength used for the reaction of the photosensitive layer 130A is preferably 0% or more and 20% or less, more preferably 0% or more and 10% or less, and even more preferably 0% or more and 5% or less. By adopting this configuration, in the second photosensitive layer exposure step, light with the wavelength used for the reaction of the photosensitive layer 130A does not pass through the light-shielding portion 220, so it is possible to form a light-shielding portion 130 having the same shape as the light-shielding portion 220 in a planar view (i.e., the same shape as the conductor pattern 120). As a result, it is possible to achieve the same appearance whether viewed from the first substrate 100 side or the second substrate 200 side. Because a transparent display is viewed from both the first substrate 100 side and the second substrate 200 side, the display panel 1 obtained by the manufacturing method of this embodiment is particularly suitable for use in a transparent display.

[0132] The transmittance of the entire first support substrate 110, excluding light-shielding portions due to wiring, to light of the wavelength used for the reaction of the photosensitive layer 130A is preferably 50% or more and 100% or less, more preferably 70% or more and 100% or less, and even more preferably 80% or more and 100% or less. By adopting such an embodiment, in the second photosensitive layer exposure step, light of the wavelength used for the reaction of the photosensitive layer 130A can be transmitted through the first support substrate 110, thereby effectively forming a light-shielding portion 130 having the same shape as the conductor pattern 120 in a planar view. As a result, the first substrate-side light-shielding portion 130 and the second substrate-side light-shielding portion 220 formed using the conductor pattern 120 as a mask can have the same shape in a planar view, thereby achieving the same appearance when viewed from both the first substrate 100 side and the second substrate 200 side. Since a transparent display is viewed from both the first substrate 100 side and the second substrate 200 side, the display panel 1 obtained by the manufacturing method of this embodiment is particularly suitable for use in a transparent display.

[0133] The transmittance of the entire second support substrate 210, excluding light-shielding portions due to wiring, to light of the wavelength used for the reaction of the photosensitive layer 130A is preferably 50% or more and 100% or less, more preferably 70% or more and 100% or less, and even more preferably 80% or more and 100% or less. By adopting such an embodiment, in the second photosensitive layer exposure step, light of the wavelength used for the reaction of the photosensitive layer 130A can be transmitted through the second support substrate 210, thereby effectively forming a light-shielding portion 130 having the same shape as the conductor pattern 120 in a planar view. As a result, the first substrate-side light-shielding portion 130 and the second substrate-side light-shielding portion 220 formed using the conductor pattern 120 as a mask can have the same shape in a planar view, thereby achieving the same appearance when viewed from both the first substrate 100 side and the second substrate 200 side. Since a transparent display is viewed from both the first substrate 100 side and the second substrate 200 side, the display panel 1 obtained by the manufacturing method of this embodiment is particularly suitable for use in a transparent display.

[0134] In a voltage-applied state, the transmittance of the entire polymer-containing layer 300, excluding light-shielding portions due to wiring, to light of the wavelength used in the reaction of the photosensitive layer 130A is preferably 50% to 100%, more preferably 70% to 100%, and even more preferably 80% to 100%. This configuration allows light of the wavelength used in the reaction of the photosensitive layer 130A to be transmitted through the polymer-containing layer 300 in the second photosensitive layer exposure step, effectively forming a light-shielding portion 130 having the same shape as the conductive pattern 120 in a planar view. As a result, the first substrate-side light-shielding portion 130 and the second substrate-side light-shielding portion 220 formed using the conductive pattern 120 as a mask can have the same shape in a planar view, thereby achieving the same appearance when viewed from both the first substrate 100 side and the second substrate 200 side. Since a transparent display is viewed from both the first substrate 100 side and the second substrate 200 side, the display panel 1 obtained by the manufacturing method of this embodiment is particularly suitable for use in a transparent display.

[0135] 15 , in addition to the configuration of the display panel 1 of Embodiment 1, the display panel 1 of this embodiment further includes a first substrate 100 that includes a first substrate-side light-shielding portion 130 disposed on the side of the first support substrate 110 opposite the polymer-containing layer 300, and the conductor pattern 120 and the first substrate-side light-shielding portion 130 have the same shape in a planar view across the entire first substrate 100. This configuration makes it possible to achieve a similar appearance when viewed from both the first substrate 100 side and the second substrate 200 side. Because a transparent display is viewed from both the first substrate 100 side and the second substrate 200 side, the display panel 1 obtained by the manufacturing method of this embodiment is particularly suitable for use in transparent displays.

[0136] The phrase "the conductor pattern 120 and the first substrate side light-shielding portion 130 have the same shape in a planar view across the entire area of ​​the first substrate 100" means that the overall shape of the conductor pattern 120 across the entire area of ​​the first substrate 100 and the overall shape of the first substrate side light-shielding portion 130 across the entire area of ​​the first substrate 100 are the same.

[0137] The first substrate-side light-shielding portion 130 and the second substrate-side light-shielding portion 220 have the same shape in a plan view over the entire area of ​​the first substrate 100 and the second substrate 200. The first substrate-side light-shielding portion 130 and the second substrate-side light-shielding portion 220 have the same shape in a plan view over the entire area of ​​the first substrate 100 and the second substrate 200 means that the overall shape of the first substrate-side light-shielding portion 130 over the entire area of ​​the first substrate 100 is the same as the overall shape of the second substrate-side light-shielding portion 220 over the entire area of ​​the second substrate 200.

[0138] The first substrate 100 includes, in order from the polymer-containing layer 300 side, a conductive pattern 120, a first support substrate 110, and a light-shielding portion .

[0139] The light-shielding portion 130 is preferably, for example, a black matrix layer. The light-shielding portion 130 preferably has an OD value, which is an index of light absorbance, of 3 or more, more preferably 3.5 or more, and even more preferably 4 or more. The upper limit of the OD value of the light-shielding portion 130 is not particularly limited, but is, for example, 6 or less. The wavelength λ at which the OD value of the light-shielding portion 130 is measured is, for example, 400 nm or more and 800 nm or less.

[0140] Fig. 16 is a cross-sectional view schematically illustrating the steps of laminating first and second substrate-side films included in the method for manufacturing a display panel according to embodiment 2. The method for manufacturing a display panel according to this embodiment preferably further includes the steps of laminating first and second substrate-side films shown in Fig. 16 after the second developing step.

[0141] In the first and second substrate-side film lamination steps, the first substrate-side UV-cut film 610 is laminated on the side of the first substrate 100 opposite the second substrate 200, and the second substrate-side UV-cut film 620 is laminated on the side of the second substrate 200 opposite the first substrate 100. This configuration prevents small amounts of residual monomer present under the pixel wiring in the display area 1AA from being exposed to ultraviolet light contained in sunlight or fluorescent lamps, which can cause unevenness and reduce degradation of display quality.

[0142] In the first and second substrate-side film lamination steps, the first substrate 100 and the first substrate-side UV-cut film 610 are preferably bonded together via a first substrate-side adhesive layer 710 disposed between the first substrate-side light-shielding portion 130 and the first substrate-side UV-cut film 610. Furthermore, the second substrate 200 and the second substrate-side UV-cut film 620 are preferably bonded together via a second substrate-side adhesive layer 720 disposed between the second substrate-side light-shielding portion 220 and the second substrate-side UV-cut film 620. This configuration reduces the amount of a conductor pattern (e.g., a TFT terminal pattern) that is visible when viewed from an oblique angle, compared to when the second substrate-side light-shielding portion 220 is disposed between the second substrate-side adhesive layer 720 and the second support substrate 210, and a color-added portion such as the light-shielding portion 220 is disposed between the adhesive layer and the UV-cut film. [Example]

[0143] The effects of the present invention will be explained below with reference to examples and reference examples, but the present invention is not limited to these examples.

[0144] (Reference example 1) 17 is a schematic diagram showing a manufacturing method of a display panel of Reference Example 1. The manufacturing method of the display panel 1R of Reference Example 1 shown in FIG. 17 is as follows. First, a panel precursor 11R is prepared in which a composition containing a photocurable monomer is filled (including a photocurable monomer-containing layer 300AR) between a first substrate 100R having TFTs as switching elements and a second substrate 200R facing the first substrate 100R. The second substrate 200R included in the panel precursor 11R does not have a light-shielding area in the display area 1AA or the frame area 1NA. In other words, it does not have a pixel black matrix or a frame black matrix.

[0145] An exposure process is performed on the panel precursor 11R, in which light L is irradiated from the second substrate 200R side, to form a polymer-containing layer 300R between the first substrate 100R and the second substrate 200R. Because the panel precursor 11R is transparent between the pixels and in the frame region, the photocurable monomer is sufficiently irradiated with light, and no or very little residual monomer remains in the polymer-containing layer 300R. A second substrate-side UV-cut film 620R, which has been additively printed in positions corresponding to the interpixel and frame regions, is then attached to the panel precursor 11R obtained in this manner, thereby obtaining the display panel 1R of Reference Example 1.

[0146] To prevent unpolymerized photocurable monomer from seeping into the display area 1AA due to lack of light exposure, this reference example leaves the frame area 1NA transparent during exposure to prevent unreacted monomer from remaining. After exposure, a second-substrate-side UV-cut film 620R, which has been subjected to additive color printing in the frame area 1NA and between pixels, is attached to the side of the second substrate 200R opposite the polymer-containing layer 300R, thereby obtaining the display panel 1R of Reference Example 1. However, in the display panel 1R of Reference Example 1, the attachment precision of the second-substrate-side UV-cut film 620R is low relative to the pixel size, resulting in film misalignment and a degradation of display quality.

[0147] For example, a 32-inch panel measures approximately 400mm x 700mm. FHD resolution has 1080 x 1920 pixels. Therefore, if we calculate the horizontal length of one pixel, ignoring areas such as the frame, we get 700mm ÷ 1920 pixels = 365μm per pixel. With current UV-blocking film lamination accuracy, there can be a misalignment of up to 400μm, which can result in the black matrix getting inside the pixel, obscuring an area of ​​up to one pixel or more, or revealing the TFT pattern, resulting in reduced display quality.

[0148] Fig. 18 is a cross-sectional schematic diagram of a display panel of Reference Example 1. More specifically, as shown in Fig. 18, the display panel 1R of Reference Example 1 includes, in order from the rear side to the observation side, a first substrate-side UV-cut film 610R, a first substrate-side pressure-sensitive adhesive layer 710R, a first support substrate 110R and a first substrate 100R including a light-shielding conductor pattern (e.g., a TFT terminal pattern) 120R, a polymer-containing layer 300R, a second substrate 200R including a second support substrate 210R, a second substrate-side pressure-sensitive adhesive layer 720R, an additive color printed portion 800R, and a second substrate-side UV-cut film 620R. As shown in Fig. 18, when the display panel 1R of Reference Example 1 is observed from directly above, the conductor pattern is visible due to low accuracy in bonding the components.

[0149] Example 1 FIG. 19 is a schematic diagram showing a manufacturing method of a display panel of Example 1. FIGS. 20A and 20B are cross-sectional schematic views of the display panel of Example 1. FIG. 20C is a cross-sectional schematic view showing a case where the second substrate-side light-shielding portion of the display panel of Example 1 is disposed between the second substrate-side UV-cut film and the second substrate-side adhesive layer. The display panel 1 of Example 1 shown in FIGS. 19, 20A, and 20B is manufactured by the manufacturing method of a display panel of Embodiment 1. In Example 1, to eliminate misalignment during lamination, a photocurable monomer is exposed from the opposing substrate (second substrate 200) side, which does not have a light-shielding body (light-shielding region), to form a polymer-containing layer 300 (PDLC layer). Thereafter, a black positive resist or photosensitive film is laminated on the opposing substrate side. Next, after turning the panel over, the resist or photosensitive film is exposed using the TFT pattern as a mask. In this manner, pattern transfer and development are performed, and the black body itself becomes the black matrix arranged in the frame region and the black matrix arranged between pixels. Thereafter, the second substrate-side UV cut film 620 is attached to the second substrate 200 on the side opposite to the polymer-containing layer 300 .

[0150] In this example, by forming a pixel black matrix and a frame black matrix on the opposing substrate (second substrate 200) using the TFT as a pattern, misalignment of the bonding position does not occur, and as shown in Figure 20A, it is possible to prevent the conductor pattern from being visible when viewing the display panel 1 from directly above, making it possible to produce a PDLC panel that maintains display quality.

[0151] Furthermore, the source lines 101S and gate lines 101G on the TFT substrate (first substrate 100) must be hidden by the black matrix on the opposing second substrate 200. Therefore, it is generally necessary to redundantly design the black matrix to accommodate a bonding margin. However, by providing the pixel black matrix and the frame black matrix using the method of this example, misalignment due to bonding does not occur, eliminating the need for redundant design of the black matrix. Furthermore, the design of the TFT substrate generally requires strict constraints, such as making the metal wiring narrower and thinner in order to obtain a sufficient aperture ratio. However, in this example, when the black matrix is ​​fabricated in a conventional size, the wiring on the TFT substrate can be laid out to a width with an equivalent margin, thereby suppressing the occurrence of line defects and the like.

[0152] As shown in Figures 12, 20A, and 20B, the display panel 1 of Example 1 comprises, in order from the back side to the observation side, a first substrate side UV cut film 610, a first substrate side adhesive layer 710, a first support substrate 110, a conductor pattern 120, a polymer-containing layer 300, a second support substrate 210, a light-shielding portion (black colored portion) 220 formed using the conductor pattern 120 as a mask, a second substrate side adhesive layer 720, an additive color printed portion 800, and a second substrate side UV cut film 620.

[0153] 20B, in Example 1 in which the light-shielding portion (black-colored portion) 220 is arranged between the second support substrate 210 and the second substrate-side adhesive layer 720, the amount of the conductive pattern 120 that is visible when viewed from an oblique angle can be reduced more than in the configuration shown in Fig. 20C. That is, compared to the configuration shown in Fig. 20C in which the second substrate-side light-shielding portion 220 is arranged between the second substrate-side UV-cut film 620 and the second substrate-side adhesive layer 720, Example 1 in which the second substrate-side light-shielding portion 220 is arranged between the second support substrate 210 and the second substrate-side adhesive layer 720 can reduce the influence of parallax by the thickness of the adhesive layer.

[0154] Since the thickness of the adhesive layer is approximately 20 μm to 50 μm, the frame black matrix and pixel black matrix are formed closer to the polymer-containing layer 300, thereby suppressing the phenomenon in which areas outside the display are visible due to parallax.

[0155] Example 2 Example 2 is the same as Example 1, except that a similar light-shielding portion is formed on the first substrate 100 side using the light-shielding portion 220 corresponding to the frame black matrix and pixel black matrix of the second substrate 200 as a mask.

[0156] FIG. 21 is a schematic diagram showing a manufacturing method of a display panel of Example 2. The display panel 1 of Example 2 shown in FIG. 21 is manufactured by the manufacturing method of a display panel of Embodiment 2. In Example 2, after forming a polymer-containing layer 300 (PDLC layer) by exposure from the side of the second substrate 200 that does not have a light-shielding region, a light-shielding portion 220 corresponding to a frame black matrix and a pixel black matrix is ​​formed using the conductor pattern 120 as a mask. Furthermore, a light-shielding portion 130 is also formed on the first substrate 100 side using the formed light-shielding portion 220 as a mask. That is, a similar light-shielding portion 130 is also formed on the TFT substrate (first substrate 100) side using the light-shielding portion 220 corresponding to the pixel black matrix and the frame black matrix on the counter substrate (second substrate 200) side formed in Example 1 as a mask.

[0157] As in this embodiment, by forming black bodies (light-shielding portion 130 and light-shielding portion 220) on both the TFT substrate side and the counter substrate side, the TFT substrate side and the counter substrate side have the same appearance. This effect is important because a transparent display is viewed from both the TFT substrate side and the counter substrate side.

[0158] (Comparison of Example 1 and Example 2) Fig. 22 is a cross-sectional view of the display panel of Example 1. Fig. 23 is a cross-sectional view of the display panel of Example 2. Fig. 24 is a table comparing the appearances of the display panels of Examples 1 and 2. When the display panel 1 of Example 1 is applied to a see-through panel that is viewed from both the TFT substrate (first substrate 100) side and the counter substrate (second substrate 200) side, as shown in Figs. 22 and 24, the metallic reflection of the conductor pattern 120 becomes noticeable when viewed from the TFT substrate side.

[0159] On the other hand, when the display panel 2 of Example 2 is applied to a see-through panel, as shown in Figures 23 and 24, reflection is reduced not only on the opposing substrate side but also on the TFT substrate side by blackening with a positive black resist or photosensitive film (i.e., reflection is reduced by arranging the light-shielding portion 130), and a display panel 1 can be realized that looks equally good from both the opposing substrate side and the TFT substrate side. [Explanation of symbols]

[0160] 1, 1R: Display panel 1AA:Display area 1NA: Frame area 11, 11R: Panel precursor 100, 100R, 200, 200R: Substrate 101G: Gate line 101S: Source line 101T: Terminal pattern (frame pattern) 110, 110R, 210, 210R: Support board 120, 120R: Conductor pattern 130: First substrate-side light-shielding portion 220: Second substrate-side light-shielding portion 130A: First substrate-side photosensitive layer 220A: Second substrate-side photosensitive layer 130P, 220P: Exposure section 130Q, 220Q: Unexposed area 300, 300R: polymer-containing layer 300A, 300AR: Photocurable monomer-containing layer 310: Polymer network 320: Liquid crystal component 500R: Seal 610, 610R: UV cut film on the first substrate side 620, 620R: Second substrate side UV cut film 710, 710R: First substrate side adhesive layer 720, 720R: Second substrate side adhesive layer 800, 800R: Additive printing department L:Light

Claims

1. a photocurable monomer exposure step of irradiating a panel precursor, which sequentially includes a first substrate having a light-shielding conductor pattern and a first support substrate, a photocurable monomer-containing layer containing a photocurable monomer, and a second substrate having a second support substrate and no light-shielding region, with light from the second substrate side toward the first substrate side; a photosensitive layer laminating step of laminating a positive second substrate-side photosensitive layer on the second support substrate opposite to the first substrate; a photosensitive layer exposing step of irradiating the positive second substrate side photosensitive layer with light from the first substrate side toward the second substrate side; a developing step of developing the second substrate-side photosensitive layer to form a second substrate-side light-shielding portion.

2. 2. The method for manufacturing a display panel according to claim 1, wherein the positive second substrate-side photosensitive layer is a layer containing a black positive resist composition.

3. 2. The method for manufacturing a display panel according to claim 1, wherein the positive second substrate-side photosensitive layer is a black positive photosensitive film.

4. 2. The method for manufacturing a display panel according to claim 1, further comprising, after the developing step, a film laminating step of laminating a second substrate-side UV cut film on the side of the second substrate opposite to the first substrate.

5. 5. The display panel manufacturing method of claim 4, wherein in the film lamination process, the second substrate and the second substrate side UV cut film are bonded together via a second substrate side adhesive layer arranged between the second substrate side light-shielding portion and the second substrate side UV cut film.

6. the photosensitive layer laminating step is a first photosensitive layer laminating step, the photosensitive layer exposing step is a first photosensitive layer exposing step, the developing step is a first developing step, After the first development step, a second photosensitive layer lamination step of laminating a positive first-substrate-side photosensitive layer on the side of the first support substrate and the conductive pattern opposite to the second substrate; a second photosensitive layer exposing step of irradiating the positive first substrate-side photosensitive layer with light from the second substrate side toward the first substrate side; 2. The method for manufacturing a display panel according to claim 1, further comprising: a second developing step of developing the positive first substrate side photosensitive layer to form a first substrate side light-shielding portion.

7. 7. The method for manufacturing a display panel according to claim 6, wherein the positive first substrate-side photosensitive layer is a layer containing a black positive resist composition.

8. 7. The method for manufacturing a display panel according to claim 6, wherein the positive-type first substrate-side photosensitive layer is a black positive-type photosensitive film.

9. 7. The display panel manufacturing method according to claim 6, further comprising, after the second developing step, a first and second substrate side film laminating step of laminating a first substrate side UV cut film on the side of the first substrate opposite the second substrate, and laminating a second substrate side UV cut film on the side of the second substrate opposite the first substrate.

10. 10. The display panel manufacturing method of claim 9, wherein in the first and second substrate side film lamination processes, the first substrate and the first substrate side UV cut film are bonded together via a first substrate side adhesive layer arranged between the first substrate side light shielding portion and the first substrate side UV cut film, and the second substrate and the second substrate side UV cut film are bonded together via a second substrate side adhesive layer arranged between the second substrate side light shielding portion and the second substrate side UV cut film.

11. a first substrate having a conductor pattern and a first support substrate having a light-shielding property; a polymer-containing layer containing a polymer of a photocurable monomer; a second support substrate; and a second substrate having a second substrate-side light-shielding portion disposed on the opposite side of the second support substrate from the polymer-containing layer, in that order; A display panel in which the conductor pattern and the second substrate side light-shielding portion have the same shape in a plan view over the entire area of ​​the first substrate and the second substrate.

12. The first substrate further includes a first substrate-side light-shielding portion disposed on the opposite side of the first support substrate from the polymer-containing layer, 12. The display panel according to claim 11, wherein the conductor pattern and the first substrate side light-shielding portion have the same shape in a plan view over the entire area of ​​the first substrate.

13. The display panel according to claim 11 , further comprising a second substrate-side UV cut film on the side of the second substrate opposite to the polymer-containing layer.

14. The display panel according to claim 13 , further comprising a second substrate-side adhesive layer between the second substrate-side light-shielding portion and the second substrate-side UV-cut film.

Images